Intelligent defect detection method in shock absorbing adhesive tape winding process

Abstract

The application discloses a shock-absorbing adhesive tape winding process intelligent defect detection method and relates to the technical field of visual inspection. The method adopts a defect detection system to work. The system comprises a supporting material pressing module, an infrared detection module, an information analysis module and an arrangement adjustment module. The supporting material pressing module is used for pressing flexible supporting material into the base material of the shock-absorbing adhesive tape. The infrared detection module adopts infrared spectrum propagation to meet polyurethane and polyethylene, generates an image for the characteristic absorption peak reflected back, the information analysis module is used for comprehensively analyzing the processed infrared spectrum image, the arrangement adjustment module is used for adjusting the arrangement density of the strip-shaped supporting material in the shock-absorbing adhesive tape in real time according to the characteristic absorption peak analysis result, and the material releasing unit is used for controlling the strip-shaped flexible supporting material to be put on the shock-absorbing adhesive tape. The application has the characteristics of real-time adjustment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of visual inspection, in particular to an intelligent defect detection method in the winding process of shock-absorbing adhesive tape. BACKGROUND

[0002] Shock-absorbing adhesive tape is widely used in many industries and scenarios due to its excellent shock-absorbing and sound-insulating performance. The base material of the shock-absorbing adhesive tape is generally a mixture of flexible foam materials of polyurethane and polyethylene, and a strip-shaped flexible support material is pressed into the bottom layer, and the two materials are bonded together with an adhesive. Through the winding process, the shock-absorbing adhesive tape is stored while the bonding of the two materials is made more compact.

[0003] If the arrangement density of the strip-shaped flexible support material on the shock-absorbing adhesive tape is too low, the strength of the adhesive tape will not be enough to adapt to a high-frequency vibration environment, and if the arrangement density is too high, the shock-absorbing adhesive tape base material may be prone to cracking defects when it is wound due to tightness. Polyurethane is superior to polyethylene in terms of flexibility in resisting cracking as both are base material components. Due to the poor compatibility of polyurethane and polyethylene, it is difficult to form a completely uniform arrangement state at the base material.

[0004] The arrangement of the strip-shaped flexible support material in the prior art does not consider the arrangement state of the two base materials, but only uses a uniform density arrangement method, ignoring the possibility of cracking defects at places where polyurethane is arranged more. Therefore, it is necessary to design a real-time adjustment intelligent defect detection method in the winding process of shock-absorbing adhesive tape. SUMMARY

[0005] The present application aims to provide an intelligent defect detection method in the winding process of shock-absorbing adhesive tape to solve the problems raised in the background.

[0006] To solve the above technical problems, the present application provides the following technical solution: an intelligent defect detection method in the winding process of shock-absorbing adhesive tape, which uses a defect detection system for work, the system including a support material pressing module, an infrared detection module, an information analysis module, and an arrangement adjustment module. The support material pressing module is used to press flexible support material into the base material of the shock-absorbing adhesive tape. The infrared detection module uses infrared spectrum propagation to encounter polyurethane and polyethylene, and generates an image of the characteristic absorption peak of the sample. The information analysis module is used to comprehensively analyze the processed infrared spectrum image. The arrangement adjustment module is used to adjust the arrangement density of the strip-shaped support material in the shock-absorbing adhesive tape in real time according to the analysis result of the characteristic absorption peak.

[0007] According to the technical scheme, the supporting material pressing module comprises a material releasing unit, a pressing unit and a gluing unit, the material releasing unit is used for controlling the strip-shaped flexible supporting material to be put on the damping adhesive tape, the pressing unit is used for pressing the strip-shaped flexible supporting material on the bottom layer of the damping adhesive tape, and the gluing unit is used for gluing the pressing positions of the two before pressing;

[0008] The infrared detection module comprises an infrared emitter, an infrared detector, an infrared signal processing module and an infrared spectrum image integration module, the infrared detector is electrically connected with the infrared signal processing module, and the infrared signal processing module is electrically connected with the infrared spectrum image integration module; the infrared emitter emits outward by using an infrared light source, the infrared detector is used for detecting the infrared light transmitted from the sample and converting the infrared light into an electric signal, the infrared signal processing module is used for amplifying, filtering and processing the signal transmitted by the detector to generate spectrum information, and the infrared spectrum image integration module is used for integrating the spectrum information into an infrared spectrum image;

[0009] The information analysis module comprises an image analysis module, a characteristic absorption peak comparison module and a base material distribution defining module, the image analysis module is electrically connected with the image analysis module and the infrared spectrum image integration module, the characteristic absorption peak comparison module is electrically connected with the image analysis module, and the base material distribution defining module is electrically connected with the characteristic absorption peak comparison module; the image analysis module analyzes the infrared spectrum image, the characteristic absorption peak comparison module compares the characteristic absorption peak intensity and wave number of the polyurethane and the characteristic absorption peak intensity and wave number of the polyethylene by analyzing the infrared spectrum image, and the base material distribution defining module is used for judging the proportion and distribution position of the polyurethane and the polyethylene;

[0010] The arrangement adjustment module comprises an arrangement interval calculation module, a database and a defect visual monitoring module, the database is electrically connected with the image analysis module and the infrared spectrum image integration module, the arrangement interval calculation module is electrically connected with the characteristic absorption peak comparison module and the base material distribution defining module; the arrangement interval calculation module reads the judgment result of the polyurethane and the polyethylene, automatically adjusts the arrangement density technical parameter of the strip-shaped supporting material, changes the arrangement density of the strip-shaped supporting material on the damping adhesive tape base material, the database is used for recording the arrangement density data of the infrared spectrum image and the strip-shaped supporting material, and the arrangement density data is stored in the database for subsequent analysis and comparison, and the defect visual monitoring module is used for monitoring the cracking defect in the winding process of the damping adhesive tape by using a camera.

[0011] According to the technical scheme, the following steps are included:

[0012] S1, before the winding process of the damping adhesive tape, an infrared scanning signal is emitted from top to bottom of the damping adhesive tape to ensure that the infrared light effectively passes through the damping adhesive tape, the infrared light is received by the infrared detector from below, the received position coordinate signal is processed to generate an infrared spectrum image, and the edge of the damping adhesive tape in the winding process is monitored in real time by vision to determine whether there is a cracking defect;

[0013] S2, the absorption peak intensity and wave number data in the infrared spectrum image are compared with the damping adhesive tape substrate pattern to determine whether there is polyurethane or polyethylene, the information of the infrared spectrum image is used to draw a damping adhesive tape substrate distribution map of polyurethane and polyethylene, and the content ratio of polyurethane and polyethylene in each part of the damping adhesive tape substrate is evaluated;

[0014] S3, according to the judgment result of polyurethane and polyethylene, the arrangement density of the strip-shaped support material arranged below the damping adhesive tape substrate is automatically adjusted, the processed infrared spectrum image, the substrate distribution map, the absorption peak intensity and wave number data and the related data of the arrangement density of the strip-shaped support material are stored in the database;

[0015] S4, the production personnel check the infrared spectrum image and the cracking defect monitoring result, evaluate the arrangement density accuracy of the strip-shaped support material, and check and optimize the arrangement density parameters of the strip-shaped support material.

[0016] According to the above technical scheme, in S1, the generation process of the infrared spectrum image is as follows:

[0017] S2-1, the detection area of the infrared detector is divided into an array of detection points, and the array has a plurality of detection points, and the coordinates of each detection point of each infrared detector are recorded in real time when the damping adhesive tape is translated before winding;

[0018] S2-2, the infrared emitter emits infrared light, the infrared detector receives the infrared light transmitted through the sample, the infrared detector obtains the light intensity change of the received wave, calculates the absorption peak intensity and wave number, the light intensity of each wave band emitted by the infrared emitter is j0, the light intensity of the received wave received by a certain detection point is j1, the light intensity attenuation value is Δj=j0-j1, the wave number is related to the number of absorption peaks F, and if the light intensity attenuation value of a certain wave band reaches the peak value within the receiving time of the received wave, it is defined as an absorption peak, the number of absorption peaks detected by different detection points in the same position will be different, and the average value ΔF is taken;

[0019] S2-3, the detection area has i detection points, and the received wave light intensity of each detection point is j i , the size of each j i is compared to determine the light intensity change characteristics of each detection point, and the infrared spectrum image is generated according to the absorption peak intensity and wave number data.

[0020] According to the above technical solution, the working method in S2, which combines the infrared spectrum of the shock-absorbing tape substrate pattern, is as follows:

[0021] S2-4. Extract the marker points from the infrared spectrum and the shock-absorbing tape substrate pattern respectively, make the marker points of the two images coincide, and scale the images with the marker points as the center.

[0022] S2-5. Align the infrared spectrum with the outline of the shock-absorbing tape substrate pattern, and overlay the fitted infrared spectrum onto the substrate distribution map to generate the final fitted image.

[0023] According to the above technical solution, the specific method for determining the presence of polyurethane and polyethylene is as follows:

[0024] S3-1. Analyze the light intensity and wavenumber of the received waves at each detection point. When the light intensity attenuation value Δj of the selected band is less than the low critical value j... min When this occurs, the region is defined as a potential polyurethane region, and the variance of the number of absorption peaks F is calculated. If the variance of the number of absorption peaks F... If the value is less than the set value X, meaning the stability requirement is met, then this area is determined to be polyurethane.

[0025] S3-2, When the light intensity attenuation value Δj of a selected wavelength band at a certain detection point is greater than the high critical value j max When this occurs, this region is defined as a potential polyethylene region, if the variance of the number of absorption peaks F is... If the value is less than the set value X, meaning the stability requirement is met, then this area is determined to be polyethylene.

[0026] According to the above technical solution, the working method of the arrangement interval calculation module in S4 is as follows:

[0027] S4-1. Locate the region in the infrared spectral image corresponding to the polyurethane region in the substrate distribution map. Increase the density F of the strip support material in this region. The increase is positively correlated with the ratio of Δj. Specifically: Where F0 is the default layout density.

[0028] k is the weighting coefficient for light intensity;

[0029] S4-2. Locate the region in the infrared spectral image corresponding to the polyethylene distribution in the substrate map. Reduce the density F of the strip support material in this region. The reduction is positively correlated with the ratio of Δj to A. Specifically: F0 represents the default layout density.

[0030] According to the above technical solution, step S4, verifying and optimizing the arrangement density parameters of the strip support material, includes:

[0031] When verifying the density of the strip support material, if cracking is detected at the edge of the damping tape substrate during subsequent winding, the density F of the strip support material should be reduced first. If the normal monitoring effect is achieved later, the density F of the strip support material does not need to be adjusted. If the monitoring effect is still not achieved, the light intensity change of the received wave should be obtained again using an infrared detector, and the density F of the strip support material should be determined again.

[0032] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: The present invention uses the characteristic absorption peaks of infrared spectroscopy to determine the distribution of polyurethane and polyethylene in the substrate of the shock-absorbing tape. Then, based on the proportion of polyurethane in the substrate of the shock-absorbing tape at a certain position, the spacing of the strip flexible support material is adjusted so that the substrate part with a high proportion of polyurethane, that is, the part with greater toughness, has a higher density of strip flexible support material, and vice versa. This allows the shock-absorbing tape to minimize cracking while ensuring strength. Attached Figure Description

[0033] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0034] Figure 1 This is a schematic diagram of the overall modular structure of the present invention. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Please see Figure 1 This invention provides a technical solution: an intelligent defect detection method during the winding process of shock-absorbing tape. The method uses a defect detection system, which includes a support material pressing module, an infrared detection module, an information analysis module, and a layout adjustment module. The support material pressing module is used to press flexible support material into the substrate of the shock-absorbing tape. The infrared detection module uses infrared spectral propagation to encounter polyurethane and polyethylene, and generates images of the characteristic absorption peaks transmitted through the samples. The information analysis module is used to comprehensively analyze the processed infrared spectral images. The layout adjustment module is used to adjust the layout density of the strip support material in the shock-absorbing tape in real time based on the characteristic absorption peak analysis results.

[0037] The support material pressing module includes a material release unit, a pressing unit, and an adhesive application unit. The material release unit is used to control the delivery of strip-shaped flexible support material onto the shock-absorbing tape. The pressing unit is used to press the strip-shaped flexible support material into the bottom layer of the shock-absorbing tape. The adhesive application unit is used to apply adhesive to the pressing area of ​​the two before pressing.

[0038] The infrared detection module includes an infrared emitter, an infrared detector, an infrared signal processing module, and an infrared spectrum integration module. The infrared detector is electrically connected to the infrared signal processing module, and the infrared signal processing module is electrically connected to the infrared spectrum integration module. The infrared emitter emits infrared light outward using an infrared light source. The infrared detector detects the infrared light transmitted from the sample and converts it into an electrical signal. The infrared signal processing module amplifies, filters, and processes the signal transmitted by the detector to generate spectral information. The infrared spectrum integration module integrates the spectral information into an infrared spectral image.

[0039] The information analysis module includes an image analysis module, a characteristic absorption peak comparison module, and a substrate distribution definition module. The image analysis module is electrically connected to the image analysis module and the infrared spectrum integration module. The characteristic absorption peak comparison module is electrically connected to the image analysis module, and the substrate distribution definition module is electrically connected to the characteristic absorption peak comparison module. The image analysis module analyzes the infrared spectrum image. The characteristic absorption peak comparison module compares the characteristic absorption peak intensity and wavenumber of polyurethane and polyethylene by analyzing the infrared spectrum. The substrate distribution definition module is used to determine the ratio and distribution position of polyurethane and polyethylene.

[0040] The layout adjustment module includes a layout interval calculation module, a database, and a defect visual monitoring module. The database is electrically connected to the image analysis module and the infrared spectrum integration module. The layout interval calculation module is electrically connected to the characteristic absorption peak comparison module and the substrate distribution definition module. The layout interval calculation module reads the judgment results of polyurethane and polyethylene, automatically adjusts the layout density technical parameters of the strip support material, and changes the layout density of the strip support material on the shock-absorbing tape substrate. The database is used to record infrared spectrum images and the layout density data of the strip support material, and stores them in the database for subsequent analysis and comparison. The defect visual monitoring module is used to use a camera to visually monitor cracking defects during the winding process of the shock-absorbing tape.

[0041] Includes the following steps:

[0042] S1. Before the winding process of the shock-absorbing tape, an infrared scanning signal is emitted from top to bottom to the shock-absorbing tape to ensure that the infrared light passes through the shock-absorbing tape effectively. The infrared light is received by the infrared detector below, the received position coordinate signal is processed, and an infrared spectrum image is generated. At the same time, visual monitoring is used in real time to check whether there are cracks or defects on the edge of the shock-absorbing tape during the winding process.

[0043] S2. By comparing the absorption peak intensity and wavenumber data in the infrared spectrum with the pattern of the shock-absorbing tape substrate, determine whether polyurethane or polyethylene is present. Based on the information in the infrared spectrum image, draw a distribution map of polyurethane and polyethylene in the shock-absorbing tape substrate and evaluate the content ratio of polyurethane and polyethylene in each part of the shock-absorbing tape substrate.

[0044] S3. Based on the judgment results of polyurethane and polyethylene, automatically adjust the arrangement density of the strip support material arranged below the shock-absorbing tape substrate, and store the processed infrared spectrum image, substrate distribution map, absorption peak intensity and wavenumber data, and related data of the arrangement density of the strip support material in the database.

[0045] S4. Production personnel review infrared spectral images and crack defect monitoring results, assess the accuracy of the strip support material's arrangement density, and verify and optimize the strip support material's arrangement density parameters.

[0046] In S1, the process of generating the infrared spectrum is as follows:

[0047] S2-1. Divide the detection area of ​​the infrared detector into a detection point array. The array has multiple detection points. When the shock-absorbing tape is translated before winding, record the coordinates of each detection point of each infrared detector in real time.

[0048] S2-2. Use an infrared emitter to emit infrared light and use an infrared detector to receive the infrared light transmitted through the sample. Use the infrared detector to obtain the light intensity change of the received wave and calculate the absorption peak intensity and wave number. The light intensity of the infrared light emitted by the infrared emitter in each band is j0, and the light intensity of the received wave at a certain detection point is j1. Then the light intensity attenuation value is Δj=j0-j1. The wave number is related to the number of absorption peaks F. If the light intensity attenuation value of a certain band reaches the peak value within the receiving time of the received wave, it is defined as an absorption peak. The number of absorption peaks detected at the same location by different detection points will be different. Take the average value ΔF.

[0049] S2-3. Let the detection area have i detection points, and the received light intensity at each detection point be j. i For each j i By comparing the magnitudes, the characteristics of light intensity changes at each detection point are determined, and an infrared spectrum is generated based on the absorption peak intensity and wavenumber data.

[0050] In S2, the working method of combining the infrared spectrum of the shock-absorbing tape substrate pattern is as follows:

[0051] S2-4. Extract the marker points from the infrared spectrum and the shock-absorbing tape substrate pattern respectively, make the marker points of the two images coincide, and scale the images with the marker points as the center.

[0052] S2-5. Align the infrared spectrum with the outline of the shock-absorbing tape substrate graphic, and overlay the fitted infrared spectrum onto the substrate distribution map to generate the final fitted image.

[0053] The specific method for determining the presence of polyurethane and polyethylene is as follows:

[0054] S3-1. Analyze the light intensity and wavenumber of the received waves at each detection point. When the light intensity attenuation value Δj of the selected band is less than the low critical value j... min When this occurs, the region is defined as a potential polyurethane region, and the variance of the number of absorption peaks F is calculated. If the variance of the number of absorption peaks F... If the value is less than the set value X, meaning the stability requirement is met, then this area is determined to be polyurethane.

[0055] S3-2, When the light intensity attenuation value Δj of a selected wavelength band at a certain detection point is greater than the high critical value j max When this occurs, this region is defined as a potential polyethylene region, if the variance of the number of absorption peaks F is... If the value is less than the set value X, meaning the stability requirement is met, then this area is determined to be polyethylene.

[0056] In S4, the operation method of the layout interval calculation module is as follows:

[0057] S4-1. Locate the region in the infrared spectral image corresponding to the polyurethane region in the substrate distribution map. Increase the density F of the strip support material in this region. The increase is positively correlated with the ratio of Δj. Specifically: Where F0 is the default arrangement density and k is the weighting coefficient of light intensity;

[0058] S4-2. Locate the region in the infrared spectral image corresponding to the polyethylene distribution in the substrate map. Reduce the density F of the strip support material in this region. The reduction is positively correlated with the ratio of Δj to A. Specifically: Where F0 is the default layout density;

[0059] In S4, the verification and optimization of the arrangement density parameters of the strip support material includes:

[0060] When verifying the density of the strip support material, if cracking is detected at the edge of the damping tape substrate during subsequent winding, the density F of the strip support material should be reduced first. If the normal monitoring effect is achieved later, the density F of the strip support material does not need to be adjusted. If the monitoring effect is still not achieved, the light intensity change of the received wave should be obtained again using an infrared detector, and the density F of the strip support material should be determined again.

[0061] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0062] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An intelligent defect detection method during the winding process of shock-absorbing tape, characterized in that: This method employs a defect detection system, which includes a support material pressing module, an infrared detection module, an information analysis module, and a layout adjustment module. The support material pressing module is used to press strip-shaped support material into the substrate of the shock-absorbing tape. The infrared detection module uses infrared spectral propagation to encounter polyurethane and polyethylene, and generates images of the characteristic absorption peaks transmitted through the samples. The information analysis module is used to comprehensively analyze the processed infrared spectral images. The layout adjustment module is used to adjust the layout density of the strip-shaped support material in the shock-absorbing tape in real time based on the characteristic absorption peak analysis results.

2. The intelligent defect detection method during the winding process of shock-absorbing tape according to claim 1, characterized in that: The support material pressing module includes a material release unit, a pressing unit, and an adhesive application unit. The material release unit is used to control the delivery of strip-shaped support material onto the shock-absorbing tape. The pressing unit is used to press the strip-shaped support material into the bottom layer of the shock-absorbing tape. The adhesive application unit is used to apply adhesive to the pressing area of ​​the two before pressing. The infrared detection module includes an infrared emitter, an infrared detector, an infrared signal processing module, and an infrared spectrum integration module. The infrared detector is electrically connected to the infrared signal processing module, and the infrared signal processing module is electrically connected to the infrared spectrum integration module. The infrared emitter emits infrared light outward using an infrared light source. The infrared detector detects the infrared light transmitted from the sample and converts it into an electrical signal. The infrared signal processing module amplifies, filters, and processes the signal transmitted by the detector to generate spectral information. The infrared spectrum integration module integrates the spectral information into an infrared spectral image. The information analysis module includes an image analysis module, a characteristic absorption peak comparison module, and a substrate distribution definition module. The image analysis module is electrically connected to the infrared spectrum integration module, the characteristic absorption peak comparison module is electrically connected to the image analysis module, and the substrate distribution definition module is electrically connected to the characteristic absorption peak comparison module. The image analysis module analyzes the infrared spectrum image. The characteristic absorption peak comparison module compares the characteristic absorption peak intensity and wavenumber of polyurethane and polyethylene by analyzing the infrared spectrum. The substrate distribution definition module is used to determine the ratio and distribution position of polyurethane and polyethylene. The arrangement adjustment module includes an arrangement interval calculation module, a database, and a defect visual monitoring module. The database is electrically connected to the image analysis module and the infrared spectrum integration module. The arrangement interval calculation module is electrically connected to the characteristic absorption peak comparison module and the substrate distribution definition module. The arrangement interval calculation module reads the judgment results of polyurethane and polyethylene, automatically adjusts the arrangement density technical parameters of the strip support material, and changes the arrangement density of the strip support material on the shock-absorbing tape substrate. The database is used to record infrared spectrum images and strip support material arrangement density data, and stores them in the database for subsequent analysis and comparison. The defect visual monitoring module is used to use a camera to visually monitor cracking defects during the winding process of the shock-absorbing tape.

3. The intelligent defect detection method during the winding process of shock-absorbing tape according to claim 2, characterized in that: Includes the following steps: S1. Before the winding process of the shock-absorbing tape, an infrared scanning signal is emitted from top to bottom to the shock-absorbing tape to ensure that the infrared light passes through the shock-absorbing tape effectively. The infrared light is received by the infrared detector below, the received position coordinate signal is processed, and an infrared spectrum image is generated. At the same time, visual monitoring is used in real time to check whether there are cracks or defects on the edge of the shock-absorbing tape during the winding process. S2. By comparing the absorption peak intensity and wavenumber data in the infrared spectrum with the pattern of the shock-absorbing tape substrate, determine whether polyurethane or polyethylene is present. Based on the information in the infrared spectrum image, draw a distribution map of polyurethane and polyethylene in the shock-absorbing tape substrate and evaluate the content ratio of polyurethane and polyethylene in each part of the shock-absorbing tape substrate. S3. Based on the judgment results of polyurethane and polyethylene, automatically adjust the arrangement density of the strip support material arranged below the shock-absorbing tape substrate, and store the processed infrared spectrum image, substrate distribution map, absorption peak intensity and wavenumber data, and related data of the arrangement density of the strip support material in the database. S4. Production personnel review infrared spectral images and crack defect monitoring results, assess the accuracy of the strip support material's arrangement density, and verify and optimize the strip support material's arrangement density parameters.

4. The intelligent defect detection method during the winding process of shock-absorbing tape according to claim 3, characterized in that: In step S1, the process of generating the infrared spectrum is as follows: S2-1. Divide the detection area of ​​the infrared detector into a detection point array. The array has multiple detection points. When the shock-absorbing tape is translated before winding, record the coordinates of each detection point of each infrared detector in real time. S2-2. Infrared light is emitted using an infrared emitter, and the infrared light transmitted through the sample is received using an infrared detector. The intensity changes of the received wave are obtained using the infrared detector, and the absorption peak intensity and wavenumber are calculated. The intensity of the infrared light emitted by the infrared emitter in each band is... The intensity of the received light wave at a certain detection point is The light intensity attenuation value is... wavenumber and number of absorption peaks Regarding absorption peaks, if the light intensity attenuation of a certain wavelength band reaches its peak value during the reception time, it is defined as an absorption peak. The number of absorption peaks detected at the same location by different detection points will vary, and the average value is taken. ; S2-3, Make the detection area have There are 1 detection point, and the received light intensity at each detection point is 1. For each The magnitudes are compared to determine the light intensity variation characteristics at each detection point, and an infrared spectrum is generated based on the absorption peak intensity and wavenumber data.

5. The intelligent defect detection method during the winding process of shock-absorbing tape according to claim 4, characterized in that: In step S2, the working method of comparing the infrared spectrum of the shock-absorbing tape substrate pattern is as follows: S2-4. Extract the marker points from the infrared spectrum and the shock-absorbing tape substrate pattern respectively, make the marker points of the two images coincide, and scale the images with the marker points as the center. S2-5. Align the infrared spectrum with the outline of the shock-absorbing tape substrate pattern, and overlay the fitted infrared spectrum onto the substrate distribution map to generate the final fitted image.

6. The intelligent defect detection method during the winding process of shock-absorbing tape according to claim 5, characterized in that: The specific method for determining the presence of polyurethane and polyethylene is as follows: S3-1. Analyze the light intensity and wavenumber of the received waves at each detection point, and determine the light intensity attenuation value for the selected band. Less than the lower critical value When this occurs, the region is defined as a potential polyurethane region, and the number of absorption peaks is collected. The variance is calculated if the number of absorption peaks variance Less than the set value If the stability requirement is met, then this area is judged to be polyurethane. S3-2, When the light intensity attenuation value of a selected wavelength band at a certain detection point Greater than the high critical value When this occurs, the region is defined as a potential polyethylene region if the number of absorption peaks is [not specified]. variance Less than the set value If the stability requirement is met, then this area is judged to be polyethylene.

7. The intelligent defect detection method during the winding process of shock-absorbing tape according to claim 6, characterized in that: In step S4, the operation method of the layout interval calculation module is as follows: S4-1. Locate the region in the infrared spectral image that corresponds to the polyurethane region in the substrate distribution map, and increase the density of the strip support material in this region. The magnitude of the increase and The ratios are positively correlated, specifically: ,in This is the default layout density. This is the weighting coefficient for light intensity; S4-2. Locate the region in the infrared spectral image that corresponds to the polyethylene distribution in the substrate distribution map, and reduce the density of the strip support material in this region. The magnitude of the reduction and and The ratios are positively correlated, specifically: ,in This is the default layout density.

8. The intelligent defect detection method during the winding process of shock-absorbing tape according to claim 7, characterized in that: In step S4, the verification and optimization of the arrangement density parameters of the strip support material includes: When verifying the density of the strip support material, if cracking is detected at the edge of the shock-absorbing tape substrate during subsequent winding, the density of the strip support material should be reduced first. If normal monitoring results are achieved subsequently, there is no need to adjust the density of the strip support material. If the monitoring effect is still not achieved, the infrared detector is used again to obtain the change in light intensity of the received wave, and then the density of the strip support material is determined. .

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