Test circuit of intelligent power module

Abstract

The embodiment of the invention provides a test circuit of an intelligent power module, the intelligent power module comprises a driving chip and a power device, and the test circuit comprises a signal generation module, a power supply module, an adjustable load module and a data acquisition module. The driving chip is used for controlling the working state of the power device; the signal generation module is used for controlling the output state of the driving chip according to the preset working condition demand information; the power supply module is used for providing bus voltage for the power device according to preset voltage demand information; the adjustable load module is used for providing a load for the power device according to preset load demand information; and the data acquisition module is used for acquiring voltage and current of the power device. The power device is controlled through the signal generation module, the power supply module and the adjustable load module, and the intelligent power module is tested by collecting the voltage and current of the power device, so that the test efficiency is improved, and the development period is shortened.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit testing, and in particular to a testing circuit for an intelligent power module. Background Art

[0002] Intelligent Power Module (IPM), as a core device in the field of power electronics, integrates driver chips and switch tubes, and plays a key role in energy conversion and switch control in electronic circuit devices. With its high voltage resistance and high current bearing characteristics, IPM is widely used in various power equipment such as frequency conversion circuits and inverter circuits, such as PFC (Power Factor Correction), DC-DC (Direct Current to Direct Current), AC-DC (Alternating Current to Direct Current) and other functional circuits. In recent years, with the rapid development of motor drive, new energy vehicles, transportation rails and other fields, IPM has played an important role in achieving efficient use of electric energy and energy conservation and emission reduction, and has become an important driving force for green and low-carbon social economy.

[0003] As electronic devices continue to evolve toward higher frequencies, smaller sizes, and lower power consumption, the electrical and functional requirements for power semiconductor devices are becoming increasingly stringent. In particular, in the face of rapid iterations of complete equipment, IPM research and development needs to accelerate matching efficiency and attach great importance to performance quality assessment to ensure that its failure rate meets strict requirements. However, in the traditional power module development process, module development and testing are usually carried out only after the module is fully developed and sealed (i.e., packaged) before it can be integrated into the complete equipment for actual application and testing. This testing method has a long development cycle and low efficiency. Summary of the invention

[0004] In view of the above problems, embodiments of the present invention are proposed to provide a test circuit for an intelligent power module that overcomes the above problems or at least partially solves the above problems.

[0005] In order to solve the above problems, an embodiment of the present invention discloses a test circuit of an intelligent power module, wherein the intelligent power module includes a driving chip and a power device, and the test circuit includes a signal generating module, a power module, an adjustable load module and a data acquisition module;

[0006] The driving chip is used to control the working state of the power device;

[0007] The signal generating module is used to control the output state of the driving chip according to the preset working condition requirement information;

[0008] The power supply module is used to provide bus voltage to the power device according to preset voltage requirement information;

[0009] The adjustable load module is used to provide a load to the power device according to preset load demand information;

[0010] The data acquisition module is used to collect the voltage and current of the power device.

[0011] Optionally, the test circuit further includes a heating module;

[0012] The heating module is used to heat the driver chip and the power device according to preset temperature requirement information;

[0013] The data acquisition module is also used to collect the temperatures of the driver chip and the power device.

[0014] Optionally, the driver chip includes an upper bridge driver chip and a lower bridge driver chip, and the power device includes a first power device, a second power device, a third power device and a fourth power device; the upper bridge driver chip is used to control the first power device and the second power device; the lower bridge driver chip is used to control the third power device and the fourth power device;

[0015] The signal generating module is connected to the upper bridge driving chip and the lower bridge driving chip respectively, and is used to control the input states of the upper bridge driving chip and the lower bridge driving chip respectively.

[0016] Optionally, the power module is connected to the second pole of the first power device via a high voltage end of the bus voltage, so as to provide the bus voltage to the first power device;

[0017] The power module is connected to the second pole of the fourth power device via the low voltage end of the bus voltage, and is used to provide the bus voltage to the fourth power device.

[0018] Optionally, the adjustable load module is connected to the third pole of the first power device and the second pole of the second power device respectively, so as to provide a load to the first power device and the second power device.

[0019] Optionally, the heating module is respectively connected to the upper bridge driver chip, the lower bridge driver chip, the first power device, the second power device, the third power device and the fourth power device, and is used to heat the upper bridge driver chip, the lower bridge driver chip, the first power device, the second power device, the third power device and the fourth power device.

[0020] Optionally, the data acquisition module is respectively connected to the upper bridge driver chip, the lower bridge driver chip, the first power device, the second power device, the third power device and the fourth power device, and is used to collect the voltage and current of the first power device, the second power device, the third power device and the fourth power device, the bus voltage and bus current of the bus corresponding to the high-voltage end of the bus voltage, and the temperatures of the upper bridge driver chip, the lower bridge driver chip, the first power device, the second power device, the third power device and the fourth power device.

[0021] Optionally, the upper bridge driver chip is connected to the first electrode of the first power device; the power device is an insulated gate bipolar transistor; the first electrode is the gate, the second electrode is the collector, and the third electrode is the emitter.

[0022] Optionally, the data acquisition module is used to respectively acquire the voltage and current of the first pole, the second pole and the third pole of the first power device, the second power device, the third power device and the fourth power device.

[0023] Optionally, the signal generating module is used to control the output state of the driving chip according to the frequency, duty cycle and phase corresponding to the preset working condition requirement information.

[0024] The embodiments of the present invention include the following advantages:

[0025] The test circuit of the intelligent power module of the embodiment of the present invention comprises a driving chip and a power device, and the test circuit comprises a signal generating module, a power module, an adjustable load module and a data acquisition module; the driving chip is used to control the working state of the power device; the signal generating module is used to control the output state of the driving chip according to the preset working condition requirement information; the power module is used to provide the bus voltage to the power device according to the preset voltage requirement information; the adjustable load module is used to provide the load to the power device according to the preset load requirement information; the data acquisition module is used to collect the voltage and current of the power device. The intelligent power module is tested by controlling the power device through the signal generating module, the power module and the adjustable load module, and collecting the voltage and current of the power device, thereby avoiding the long development cycle and low efficiency caused by integrating the intelligent power module into the complete equipment for actual application and testing after the intelligent power module is fully developed and sealed (i.e. packaged), and by testing the intelligent power module in advance, the test efficiency is improved and the development cycle is saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1is a structural schematic diagram of a test circuit of an intelligent power module according to an embodiment of the present invention;

[0027] Figure 2 This is another structural schematic diagram of a test circuit of an intelligent power module according to an embodiment of the present invention.

[0028] Figure numerals: intelligent power module 10, driver chip 11, upper bridge driver chip 111, lower bridge driver chip 112, power device 12, first power device 121, second power device 122, third power device 123, fourth power device 124, test circuit 20, signal generating module 21, power module 22, adjustable load module 23, data acquisition module 24, heating module 25. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] As a core device in the field of power electronics, power modules integrate driver chips and switch tubes, and play a key role in energy conversion and switch control in electronic circuit devices. With its high voltage resistance and high current bearing characteristics, IPM is widely used in various power equipment such as frequency conversion circuits and inverter circuits, such as PFC, DC-DC, AC-DC and other functional circuits. In recent years, with the rapid development of motor drives, new energy vehicles, transportation rails and other fields, IPM has played an important role in achieving efficient use of electric energy and energy conservation and emission reduction, and has become an important driving force for green and low-carbon social economy.

[0031] As electronic devices continue to evolve toward higher frequencies, smaller sizes, and lower power consumption, the electrical and functional requirements for power semiconductor devices are becoming increasingly stringent. In particular, in the face of rapid iterations of complete equipment, IPM research and development needs to accelerate matching efficiency and attach great importance to performance quality assessment to ensure that its failure rate meets strict requirements. However, in the traditional power module development process, module development and testing are usually carried out only after the module is fully developed and sealed (i.e., packaged) before it can be integrated into the complete equipment for actual application and testing. This testing method has a long development cycle and low efficiency.

[0032] One of the core concepts of the embodiments of the present invention is to test the intelligent power module by controlling the power device through a signal generating module, a power supply module and an adjustable load module, and collecting the voltage and current of the power device, thereby avoiding the long development cycle and low efficiency caused by integrating the intelligent power module into the whole equipment for actual application and testing after the intelligent power module is fully developed and sealed (i.e., packaged). By testing the intelligent power module in advance, the test efficiency is improved and the development cycle is saved.

[0033] Reference Figure 1 , a schematic diagram of a test circuit of an intelligent power module according to an embodiment of the present invention, which may specifically include the following structure:

[0034] The intelligent power module 10 includes a driving chip 11 and a power device 12 , and the test circuit 20 includes a signal generating module 21 , a power module 22 , an adjustable load module 23 and a data acquisition module 24 .

[0035] Intelligent power module is a modular solution that integrates power semiconductor devices (such as IGBT, MOSFET) and multiple functions such as drive circuit, protection circuit, control circuit, etc. The design of IPM is to simplify the design and implementation of power electronic systems and improve the reliability, efficiency and performance of the system. The composition of intelligent power module includes: power semiconductor devices, usually IGBT or MOSFET, used to achieve power conversion and control; drive circuit, used to drive power semiconductor devices to ensure their normal operation. The drive circuit usually includes gate driver, level converter, etc.; protection circuit, used to monitor and protect power semiconductor devices to prevent overcurrent, overvoltage, overtemperature and other faults. The protection circuit usually includes current detection, voltage detection, temperature detection, etc.; control circuit: used to implement PWM control, fault diagnosis, communication interface and other functions. The control circuit usually includes microcontroller, logic circuit, etc. The advantages of intelligent power modules are that IPM integrates multiple functions, reduces the number of external components, and simplifies system design; IPM integrates multiple protection functions internally, which improves the reliability and safety of the system; IPM usually adopts optimized drive circuits and heat dissipation design to improve power conversion efficiency; due to the integration of multiple functions, IPM can reduce the overall cost of the system; IPM has a simple interface and control logic and is easy to integrate into various power electronic systems.

[0036] The driving chip 11 is used to control the working state of the power device 12 .

[0037] The driving chip 11 (such as a gate driver) is responsible for generating appropriate signals to control the on and off of the power device 12 (such as an IGBT, a MOSFET), thereby achieving control over the working state of the power device 12 .

[0038] The main functions of the driver chip include: amplifying the control signal, such as PWM (Pulse Width Modulation) signal, to sufficient voltage and current to drive the gate or base of the power device; converting the level of the control signal to a level suitable for the power device. For example, converting a low-voltage control signal into a high-voltage gate drive signal; providing over-current, over-voltage, over-temperature and other protection functions to prevent the power device from being damaged under abnormal conditions; in some applications, the driver chip may need to provide electrical isolation to prevent the influence of high voltage on the control circuit; providing fault diagnosis function, monitoring the working status of the power device, and taking corresponding protection measures when a fault occurs.

[0039] The working states of power devices mainly include: on-state, when the power device is on, current can pass through the device to realize power conversion; off-state, when the power device is off, the current is blocked and power conversion stops; switching state, in PWM control, the power device quickly switches between on and off to achieve output power regulation.

[0040] The signal generating module 21 is used to control the output state of the driving chip 11 according to preset working condition requirement information.

[0041] Exemplarily, the preset operating condition requirement information can be an operating state of different operating conditions such as cooling, heating, and extreme operation on the whole machine. The signal generating module 21 can be implemented using a multifunctional signal generator to generate different PWM signals. Different PWM signals correspond to the operating states of different operating conditions such as cooling, heating, and extreme operation on the whole machine, and send different PWM signals to the driver chip 11, thereby controlling the output state of the driver chip 11 to simulate the operating states of different operating conditions such as cooling, heating, and extreme operation on the whole machine. The whole machine refers to the integration of the intelligent power module into the whole machine equipment, so as to test the data of the intelligent power module 10 when it is in the operating state of different operating conditions such as cooling, heating, and extreme operation on the whole machine.

[0042] A multifunctional signal generator is an instrument that can generate various types of signals and is widely used in electronic testing, measurement, debugging, and R&D. It can generate various waveform signals, such as sine waves, square waves, triangle waves, pulse waves, noise waves, etc., and can adjust the signal's frequency, amplitude, phase, duty cycle and other parameters.

[0043] The power module 22 is used to provide a bus voltage to the power device 12 according to preset voltage requirement information.

[0044] Exemplarily, the preset voltage requirement information may be voltage information in overvoltage, undervoltage and other states. The power module 22 provides bus voltage to the power device 12 based on the voltage information in overvoltage, undervoltage and other states. The provided bus voltage includes voltage in overvoltage, undervoltage and other states, thereby testing the data of the intelligent power module 10 when it is in overvoltage, undervoltage and other states.

[0045] The power module 22 uses a high-precision DC power supply, which can provide a wide range of voltage outputs and meet the bus voltage requirements of IPMs of different specifications. This power supply has a high-precision voltage regulation function with a regulation resolution of up to 0.1V to accurately simulate the normal working voltage and voltage conditions in failure scenarios such as overvoltage and undervoltage.

[0046] Equipped with over-current protection and short-circuit protection circuits, when abnormal current occurs during the test, the power supply can be quickly cut off to protect the test system and the IPM under test.

[0047] The adjustable load module 23 is used to provide a load to the power device 12 according to preset load demand information.

[0048] Exemplarily, the preset load demand information can be the load when simulating failure scenario modes such as motor jamming, overclocking, overload, light or heavy load, short circuit and so on. The adjustable load module 23 provides a load to the power device 12 according to the load when simulating failure scenario modes such as motor jamming, overclocking, overload, light or heavy load, short circuit and so on. Different failure scenario modes correspond to different loads, thereby testing the data of the intelligent power module 10 when it is in failure scenario modes such as simulated motor jamming, overclocking, overload, light or heavy load, short circuit and so on.

[0049] The adjustable load module 23 may be an adjustable load simulator capable of simulating multiple types of loads, including but not limited to pure resistive, inductive and capacitive loads, and combinations thereof. The load parameters may be continuously adjusted within a wide range, such as a resistance range of 0Ω–10kΩ, an inductance range of 0mH-200mH, and a capacitance range of 0μF-200μF.

[0050] By changing the load conditions, the IPM failure scenarios caused by load mutation or mismatch can be simulated, such as power device damage caused by overload and overcurrent.

[0051] The data acquisition module 24 is used to collect the voltage and current of the power device 12 .

[0052] Exemplarily, the data acquisition module 24 may include an oscilloscope, and the voltage and current of the power device 12 are acquired through the oscilloscope.

[0053] An oscilloscope is an electronic measuring instrument used to display and analyze the waveform of electrical signals. It helps engineers and technicians observe, measure and analyze the characteristics of signals, such as voltage, frequency, phase, amplitude, waveform shape, etc., by converting electrical signals into visual waveform graphs. The main functions of an oscilloscope include: waveform display, real-time display of the waveform graph of electrical signals, storage and playback of waveform graphs for subsequent analysis; measurement of the voltage amplitude of the signal, usually in volts (V); measurement of the frequency of the signal, usually in Hertz (Hz); measurement of the time parameters of the signal, such as period, rise time, fall time, etc.; measurement of the phase difference between two signals, usually in degrees (°); measurement of the duty cycle of the pulse signal, usually in percentage (%).

[0054] The signal generating module 21 is used to simulate the operating states of different working conditions such as cooling, heating, and extreme operation on the whole machine, the power module 22 is used to simulate overvoltage, undervoltage and other states, the adjustable load module 23 is used to simulate motor jamming, overclocking, overload, light load, heavy load, short circuit and other failure scenario modes, and the data acquisition module 24 is used to collect the voltage and current of the power device 12 and analyze the abnormal points. It can comprehensively simulate and evaluate various failure modes of the intelligent power module 10 in the whole machine, has high operability and feasibility, and has extremely high reference significance for new product development and after-sales failure analysis, thereby avoiding the long development cycle and low efficiency caused by integrating the intelligent power module into the whole machine equipment for actual application and testing after the intelligent power module is fully developed and sealed (i.e., packaged), and the intelligent power module is tested in advance, thereby improving the test efficiency and saving the development cycle.

[0055] The test circuit of the intelligent power module of the embodiment of the present invention comprises a driving chip and a power device, and the test circuit comprises a signal generating module, a power module, an adjustable load module and a data acquisition module; the driving chip is used to control the working state of the power device; the signal generating module is used to control the output state of the driving chip according to the preset working condition requirement information; the power module is used to provide the bus voltage to the power device according to the preset voltage requirement information; the adjustable load module is used to provide the load to the power device according to the preset load requirement information; the data acquisition module is used to collect the voltage and current of the power device. The intelligent power module is tested by controlling the power device through the signal generating module, the power module and the adjustable load module, and collecting the voltage and current of the power device, thereby avoiding the long development cycle and low efficiency caused by integrating the intelligent power module into the complete equipment for actual application and testing after the intelligent power module is fully developed and sealed (i.e. packaged), and by testing the intelligent power module in advance, the test efficiency is improved and the development cycle is saved.

[0056] Reference Figure 2 , shows another structural schematic diagram of a test circuit of an intelligent power module according to an embodiment of the present invention. In the embodiment of the present invention, the test circuit 20 also includes a heating module 25.

[0057] The heating module 25 is used to heat the driving chip 11 and the power device 12 according to preset temperature requirement information.

[0058] Exemplarily, the preset temperature requirement information may be temperature information under an overheating failure scenario. The heating module 25 may include multiple heating probes. By clamping the multiple heating probes on the plastic package of the driver chip 11 and the power device 12, the temperature of the driver chip 11 and the power device 12 is controlled according to the temperature information under the overheating failure scenario, thereby testing the data of the intelligent power module 10 in the overheating failure scenario of the simulated module.

[0059] The heating module 25 uses high-precision heating elements and temperature control circuits to heat the IPM module to a preset over-temperature state. The temperature control accuracy is as high as 0.5°C, and it is equipped with multiple temperature sensors, which can monitor the temperature changes at different positions of the IPM in real time and accurately, simulating failures caused by poor heat dissipation or excessive ambient temperature.

[0060] The data acquisition module 24 is also used to collect the temperatures of the driver chip 11 and the power device 12 .

[0061] The data acquisition module 24 may also include a temperature sensor, which collects the real-time temperature of the driver chip 11 and the power device 12 by contacting the temperature sensor with the surface of the driver chip 11 and the power device 12. Exemplarily, the temperature sensor may be a plurality of thermocouples, which are arranged at the center point of the plastic cover of the driver chip 11 and the power device 12 to monitor the real-time temperature rise of the driver chip 11 and the power device 12, so as to capture the abnormal temperature on the driver chip 11 and the power device 12 at the moment of failure.

[0062] In an embodiment of the present invention, the driver chip 11 includes an upper bridge driver chip 111 and a lower bridge driver chip 112, and the power device 12 includes a first power device 121, a second power device 122, a third power device 123 and a fourth power device 124; the upper bridge driver chip 111 is used to control the first power device 121 and the second power device 122; the lower bridge driver chip 112 is used to control the third power device 123 and the fourth power device 123.

[0063] Exemplarily, the VCC port of the upper bridge driver chip 111 is connected to the positive pole of the DC power supply DC, and the negative pole of the DC power supply is grounded. The upper bridge driver chip 111 is connected to the first pole of the first power device 121 through the output terminals H01, H02 and H03, the third pole of the first power device 121 is connected to the second pole of the second power device 122, the first pole of the second power device 122 is connected to its own third pole, and its own third pole is grounded. The upper bridge driver chip 111 is used to control the working states of the first power device 121 and the second power device 122.

[0064] Exemplarily, the VCC port of the upper bridge driver chip 111 is connected to the lower bridge driver chip 112, and the lower bridge driver chip 112 is connected to the first pole of the third power device 123 through the output terminals L01, L02 and L03. The third pole of the third power device 123 is grounded as the COM terminal, and the second pole of the third power device 123 is connected to the connecting line of the third pole and the second pole of the fourth power device 124. The lower bridge driver chip 112 is used to control the working states of the third power device 123 and the fourth power device 123.

[0065] The diode D1, one end of which is connected to the positive electrode of the DC power supply and the other end of which is connected to the upper bridge driver chip 111, is a bootstrap diode. The diode D3, one end of which is connected to the positive electrode of the DC power supply and the other end of which is connected to the lower bridge driver chip 112, is a bootstrap diode. The bootstrap diode plays a reverse cutoff role to prevent the impact of the reverse current on the power supply end. The diode D2 connected to the upper bridge driver chip 111 and the diode D4 connected to the lower bridge driver chip 112 are voltage-stabilizing diodes to ensure that the VB terminal voltage is stable at 15V. Diodes D5, D6, D7, and D8 are gate-guided diodes of the power device 12. The power device 12 can conduct current when it is turned on and off, respectively. Resistors R1 to R14 play a role in limiting current, and the current size can be changed by adjusting the resistance value.

[0066] The signal generating module 21 is connected to the upper bridge driving chip 111 and the lower bridge driving chip 112 respectively, and is used to control the input states of the upper bridge driving chip 111 and the lower bridge driving chip 112 respectively.

[0067] Exemplarily, the signal generating module 21 is connected to the upper bridge driver chip 111 through the input terminals HIN1, HIN2 and HIN3 of the upper bridge driver chip 111. The signal generating module 21 controls the high and low level combinations of the input states of the input terminals HIN1, HIN2 and HIN3 of the upper bridge driver chip 111, which are then processed by the upper bridge driver chip 111 and output through the output terminals H01, H02 and H03 of the upper bridge driver chip 111 to connect the first power device 121 and the second power device 122, thereby controlling the working states of the first power device 121 and the second power device 122 of the upper bridge.

[0068] Exemplarily, the signal generating module 21 is connected to the lower bridge driver chip 112 through the input terminals LIN1, LIN2 and LIN3 of the lower bridge driver chip 112. The signal generating module 21 controls the high and low level combinations of the input states of the input terminals LIN1, LIN2 and LIN3 of the lower bridge driver chip 112, which are then processed by the lower bridge driver chip 112 and output through the output terminals L01, L02 and L03 of the lower bridge driver chip 112 to connect the third power device 123 and the fourth power device 124, thereby controlling the working states of the third power device 123 and the fourth power device 124 of the lower bridge.

[0069] In the embodiment of the present invention, the power module 22 is connected to the second pole of the first power device 121 via the high voltage end of the bus voltage, and is used to provide the bus voltage to the first power device 121 .

[0070] For example, the second electrode of the first power device 121, namely Figure 2 Port 2 of the first power device 121.

[0071] The power module 22 is connected to the second pole of the fourth power device 124 via the low voltage end of the bus voltage, and is used to provide the bus voltage to the fourth power device 124 .

[0072] Exemplarily, the second electrode of the fourth power device 124, namely Figure 2 Port 2 of the fourth power device 124.

[0073] In the embodiment of the present invention, the adjustable load module 23 is respectively connected to the third pole of the first power device 121 and the second pole of the second power device 122 to provide load to the first power device 121 and the second power device 122 .

[0074] Exemplarily, the third pole of the first power device 121, namely Figure 2 The port 3 of the first power device 121 and the second pole of the second power device 122, that is, Figure 2 At port 2 of the second power device 122, the adjustable load module 23 is respectively connected to the third pole of the first power device 121 and the second pole of the second power device 122, and is used to simulate failure scenario modes such as motor jamming, overclocking, overload, light load, heavy load, short circuit and so on, and provide load to the first power device 121 and the second power device 122. Abnormal voltage and current can be transmitted to the first power device 121 and the second power device 122 through the third pole of the first power device 121 and the second pole of the second power device 122.

[0075] In an embodiment of the present invention, the heating module 25 is respectively connected to the upper bridge driver chip 444, the lower bridge driver chip 112, the first power device 121, the second power device 122, the third power device 123 and the fourth power device 124, and is used to heat 124 the upper bridge driver chip 111, the lower bridge driver chip 112, the first power device 121, the second power device 122, the third power device 123 and the fourth power device to simulate the overheating failure scenario of heating 124 the upper bridge driver chip 111, the lower bridge driver chip 112, the first power device 121, the second power device 122, the third power device 123 and the fourth power device.

[0076] In an embodiment of the present invention, the data acquisition module 24 is respectively connected to the upper bridge driver chip 111, the lower bridge driver chip 112, the first power device 121, the second power device 122, the third power device 123 and the fourth power device 124, and is used to collect the real-time voltage and real-time current values ​​of the first power device 121, the second power device 122, the third power device 123 and the fourth power device 124, and monitor the abnormal points in failure abnormalities such as over / under voltage, overcurrent, and direct short circuit.

[0077] The bus voltage and bus current of the bus corresponding to the high-voltage end of the bus voltage as well as the voltage and current on VCC are collected to capture overvoltage and undervoltage signals.

[0078] And collect the real-time temperatures of the upper bridge driver chip 111 , the lower bridge driver chip 112 , the first power device 121 , the second power device 122 , the third power device 123 and the fourth power device 124 .

[0079] These data can be transmitted to the control system and software interface to visualize the voltage and current status on the IPM, instantly capture abnormal points, and process the collected data in real time, including data filtering, feature extraction, etc. Through the built-in algorithm, it can automatically identify the time and type of failure, and analyze the parameter change trend during the failure process, providing strong support for the diagnosis of the cause of failure.

[0080] Control system and software interface A centralized control system is designed to coordinate the work of each module and realize an automated test process. Operators can set test parameters, select failure scenario modes, and start and stop the test process through a friendly software interface.

[0081] The software has a test plan management function, which can save and call different test plans to facilitate repetitive testing and comparative analysis. At the same time, it can automatically generate a detailed test report, which includes test conditions, failure scenario simulation process, collected data, and analysis results.

[0082] In the embodiment of the present invention, the upper bridge driver chip 111 is connected to the first electrode of the first power device 121; the power device 12 is an insulated gate bipolar transistor; the first electrode is the gate, the second electrode is the collector, and the third electrode is the emitter.

[0083] In the embodiment of the present invention, the data acquisition module 24 is used to respectively acquire the voltage and current of the first pole, the second pole and the third pole of the first power device 121 , the second power device 122 , the third power device 123 and the fourth power device 124 .

[0084] Exemplarily, the data acquisition module 24 may include an oscilloscope, one power device corresponds to one test channel of the oscilloscope, and the real-time voltage and current values ​​of the gate, collector and emitter of each power device are respectively collected to monitor abnormal points in failure abnormalities such as over / under voltage, overcurrent, and direct short circuit. The data acquisition module 24 simultaneously monitors the software control to automatically capture the voltage and current on the bus and VCC, and captures overvoltage and undervoltage signals. In addition, the real-time temperature of the driver chip 11 and the power device 12 is monitored by contacting the device surface with a temperature sensor. These data are transmitted to the control system and software interface to visualize the voltage and current status on the IPM, instantly capture abnormal points, and monitor their real-time temperature rise through the arrangement of thermocouple points to capture the abnormal temperature on the device at the moment of failure.

[0085] The data acquisition module 24 can be equipped with high-precision data acquisition equipment, which can simultaneously collect parameters such as voltage, current, temperature, signal waveform, etc. of multiple channels. The voltage acquisition accuracy can reach 0.1V, the current acquisition accuracy can reach 0.1A, and the temperature acquisition accuracy can reach 0.1℃. In addition, it can have powerful data processing and analysis functions, and can process the collected data in real time, including data filtering, feature extraction, etc. Through the built-in algorithm, it can automatically identify the time and type of failure, and analyze the parameter change trend during the failure process, providing strong support for the diagnosis of the cause of failure.

[0086] In the embodiment of the present invention, the signal generating module 21 is used to control the output state of the driving chip 11 according to the frequency, duty cycle and phase corresponding to the preset working condition requirement information.

[0087] For example, the signal generating module 21 may be a multifunctional signal generator that can generate PWM signals with different frequencies, duty cycles and phases for driving the power devices in the IPM. The signal parameters can be precisely set through the software interface with a setting accuracy of 0.1 Hz for frequency, 0.1% for duty cycle and 1.0 degree for phase.

[0088] The multifunctional signal generator has the function of simulating fault signals and can generate abnormal PWM signals at specific times, such as frequency mutations, duty cycle jumps, etc., to trigger IPM failure scenarios, such as failure caused by switch abnormalities.

[0089] Specifically, the test personnel can adjust the frequency, duty cycle and phase of the signal generating module 21 to simulate the operating states of different working conditions such as cooling, heating and extreme operation on the whole machine.

[0090] The embodiment of the present invention may also include a short circuit simulation submodule: using advanced electronic switch technology, it can accurately short-circuit specific power device pins inside the IPM during the test to simulate the short circuit failure of the device. The short circuit resistance is extremely low and can be controlled below 50mΩ to ensure the authenticity of the short circuit simulation.

[0091] Open circuit simulation submodule: Through a specially designed circuit, it can reliably disconnect the key connection lines inside the IPM when needed to simulate an open circuit fault. This circuit has high isolation and low leakage current characteristics to ensure the accuracy of open circuit simulation.

[0092] The test circuit of the intelligent power module of the embodiment of the present invention comprises a driving chip and a power device, and the test circuit comprises a signal generating module, a power module, an adjustable load module and a data acquisition module; the driving chip is used to control the working state of the power device; the signal generating module is used to control the output state of the driving chip according to the preset working condition requirement information; the power module is used to provide the bus voltage to the power device according to the preset voltage requirement information; the adjustable load module is used to provide the load to the power device according to the preset load requirement information; the data acquisition module is used to collect the voltage and current of the power device. The intelligent power module is tested by controlling the power device through the signal generating module, the power module and the adjustable load module, and collecting the voltage and current of the power device, thereby avoiding the long development cycle and low efficiency caused by integrating the intelligent power module into the complete equipment for actual application and testing after the intelligent power module is fully developed and sealed (i.e. packaged), and by testing the intelligent power module in advance, the test efficiency is improved and the development cycle is saved.

[0093] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0094] It will be appreciated by those skilled in the art that the embodiments of the present invention may be provided as methods, devices, or computer program products. Therefore, the embodiments of the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the embodiments of the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0095] The embodiments of the present invention are described with reference to the flowcharts and / or block diagrams of the methods, terminal devices (systems), and computer program products according to the embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of the processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0096] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing terminal device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0097] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device so that a series of operating steps are executed on the computer or other programmable terminal device to produce a computer-implemented process, thereby providing instructions for executing on the computer or other programmable terminal device to implement the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0098] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0099] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0100] The above is a detailed introduction to a test circuit of an intelligent power module provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A test circuit for an intelligent power module, characterized in that: The intelligent power module includes a driving chip and a power device, and the test circuit includes a signal generation module, a power module, an adjustable load module and a data acquisition module; The driving chip is used to control the working state of the power device; The signal generating module is used to control the output state of the driving chip according to the preset working condition requirement information; The power supply module is used to provide bus voltage to the power device according to preset voltage requirement information; The adjustable load module is used to provide a load to the power device according to preset load demand information; The data acquisition module is used to collect the voltage and current of the power device.

2. The test circuit according to claim 1, characterized in that: The test circuit also includes a heating module; The heating module is used to heat the driver chip and the power device according to preset temperature requirement information; The data acquisition module is also used to collect the temperatures of the driver chip and the power device.

3. The test circuit according to claim 2, characterized in that: The driver chip includes an upper bridge driver chip and a lower bridge driver chip, and the power devices include a first power device, a second power device, a third power device and a fourth power device; the upper bridge driver chip is used to control the first power device and the second power device; the lower bridge driver chip is used to control the third power device and the fourth power device; The signal generating module is connected to the upper bridge driving chip and the lower bridge driving chip respectively, and is used to control the input states of the upper bridge driving chip and the lower bridge driving chip respectively.

4. The test circuit according to claim 3, characterized in that: The power module is connected to the second pole of the first power device via the high voltage end of the bus voltage, and is used to provide the bus voltage to the first power device; The power module is connected to the second pole of the fourth power device via the low voltage end of the bus voltage, and is used to provide the bus voltage to the fourth power device.

5. The test circuit according to claim 3, characterized in that: The adjustable load module is connected to the third pole of the first power device and the second pole of the second power device respectively, and is used to provide a load to the first power device and the second power device.

6. The test circuit according to claim 3, characterized in that: The heating module is respectively connected to the upper bridge driver chip, the lower bridge driver chip, the first power device, the second power device, the third power device and the fourth power device, and is used to heat the upper bridge driver chip, the lower bridge driver chip, the first power device, the second power device, the third power device and the fourth power device.

7. The test circuit according to claim 4, characterized in that: The data acquisition module is respectively connected to the upper bridge driver chip, the lower bridge driver chip, the first power device, the second power device, the third power device and the fourth power device, and is used to collect the voltage and current of the first power device, the second power device, the third power device and the fourth power device, the bus voltage and bus current of the bus corresponding to the high-voltage end of the bus voltage, and the temperature of the upper bridge driver chip, the lower bridge driver chip, the first power device, the second power device, the third power device and the fourth power device.

8. The test circuit according to claim 5, characterized in that: The upper bridge driving chip is connected to the first electrode of the first power device; the power device is an insulated gate bipolar transistor; the first electrode is a gate, the second electrode is a collector, and the third electrode is an emitter.

9. The test circuit according to claim 8, characterized in that: The data acquisition module is used to respectively acquire the voltage and current of the first pole, the second pole and the third pole of the first power device, the second power device, the third power device and the fourth power device.

10. The test circuit according to claim 1, characterized in that: The signal generating module is used to control the output state of the driving chip according to the frequency, duty cycle and phase corresponding to the preset working condition requirement information.

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