Transfer apparatus for display device manufacturing and transfer method using the same

Abstract

The invention provides a transfer apparatus for manufacturing a display device and a transfer method using the same. A transfer apparatus for manufacturing a display device according to one embodiment includes: a stamper including a pressing member that provides a pressing force in a first direction; the pressing die aligning part is connected with the pressing die and is aligned with the pressing die; and film fixing parts which are arranged on two side surfaces of the pressing die and are used for fixing the pressing film.

Description

Technical Field

[0001] The present disclosure relates to a transfer device for manufacturing a display device and a transfer method using the same. Background Art

[0002] Currently, various display devices are used as display devices, and representative ones include liquid crystal display devices (LCD) and organic light emitting diodes (OLED).

[0003] In recent years, LED display devices (especially micro LED display devices) including light emitting diodes (LEDs) have attracted much attention as next-generation display devices. LEDs are made of inorganic substances rather than organic substances, so they are highly reliable, and thus LED display devices have a longer life than liquid crystal display devices or organic light-emitting display devices. In addition, LED display devices not only have a fast lighting speed but also have excellent luminous efficiency and strong impact resistance, so they are highly stable and can display high-brightness images.

[0004] A plurality of LED chips patterned on a wafer are transferred to a display device substrate using a transfer apparatus. Summary of the invention

[0005] The embodiment is to provide a transfer device for display device manufacturing, which can improve the accuracy of the transfer position of the LED chip and improve the placement success rate of the stamping film in the transfer process, and a transfer method using the same.

[0006] A transfer device for manufacturing a display device according to one embodiment includes: a stamper including a pressurizing component for providing pressure in a first direction; a stamper alignment portion connected to and aligning the stamper; and a film fixing portion located on both sides of the stamper and fixing the stamping film.

[0007] The die may further include: a die main body provided with the pressurizing component, and the pressurizing component includes: a pressurizing head located at the lower end of the die main body and including an elastic component in contact with the stamping film.

[0008] It may be that the film fixing portion includes: a pair of fixing bodies, located on the two side surfaces of the die; a first film fixing portion, arranged on the pair of fixing bodies, in contact with the upper surface of the stamping film, pressing the upper surface of the stamping film to fix it; and a second film fixing portion, arranged on the pair of fixing bodies, clamping the two end portions of the stamping film to fix the stamping film.

[0009] It may be that the first film fixing portion includes: a first film contact portion, located at the lower end of the pair of fixed bodies, capable of moving along the first direction and contacting the upper surface of the stamping film; and a first restoring force providing portion, providing a first restoring force to the first film contact portion.

[0010] The first film contact portion may include a side push rod and another side push rod respectively located on both sides of the pressurizing head portion.

[0011] It may be that the second film fixing portion includes: a second film contact portion, which is arranged on the pair of fixed bodies and can be rotated by a predetermined angle to contact the two end portions of the stamping film; and a second restoring force providing portion, which is arranged on the pair of fixed bodies and provides a second restoring force to the second film contact portion.

[0012] The second film fixing portion may further include: a driving force providing portion connected to the second film contact portion and providing a driving force for driving the second film contact portion.

[0013] The second film contact portion may include a one side clamp and an other side clamp respectively provided on the pair of fixing bodies.

[0014] The stamper alignment portion may include: a first alignment body, which surrounds the stamper, is connected to the stamper and has a hemispherical shape; a second alignment body, which includes an inner curved surface having a shape corresponding to the outer curved surface of the first alignment body; and a posture control portion, which is connected to the first alignment body and the second alignment body and controls the postures of the first alignment body and the second alignment body to align the stamper.

[0015] The posture control unit may include: a plurality of ball bearings provided on the inner curved surface of the second alignment body and in contact with the outer curved surface of the first alignment body; and a plurality of tension springs providing tension force between the first alignment body and the second alignment body.

[0016] The transfer device for manufacturing a display device may further include: a stamper elevating unit connected to the stamper and configured to elevate the stamper to provide the pressing force to the pressing head.

[0017] In addition, a transfer method involved in one embodiment includes: a step of picking up the stamping film using a film fixing portion that is connected to a stamping die that pressurizes the stamping film and fixes the stamping film; a step of aligning the stamping die using a stamping die alignment portion in a first transfer process of transferring an LED chip to the stamping film; and a step of placing the stamping film on a substrate for a display device using the film fixing portion in a second transfer process of transferring the LED chip and the stamping film to a substrate for a display device.

[0018] It can be that the step of picking up the stamping film includes: the step of fixing the stamping film on the workbench by pressing the upper surface of the stamping film using the first film fixing part of the film fixing part; and the step of fixing the stamping film by clamping the two end parts of the stamping film using the second film fixing part of the film fixing part.

[0019] It may be that the step of aligning the stamper includes: a step of making the stamping film attached to the stamper contact with the upper surface of the LED chip mounted on the chip mounting substrate; a step of using a second alignment body located on the first alignment body of the stamper alignment part to make the virtual rotation center of the first alignment body located on the lower surface of the stamping film in contact with the LED chip; and a step of controlling the posture of the stamper connected to the first alignment body using a posture control part of the stamper alignment part.

[0020] It may be that the step of placing the stamping film on the substrate for the display device includes: a step of separating the two end portions of the stamping film from the second film fixing portion; and a step of separating the elastic component of the mold from the stamping film while fixing the portions adjacent to the two end portions of the stamping film using the first film fixing portion.

[0021] (Effects of the Invention)

[0022] According to the embodiment, the stamper is automatically aligned in the first transfer process of transferring the LED chip to the stamping film, so that the LED chip can be accurately transferred to the display device substrate in the second transfer process, thereby improving the accuracy of the transfer position.

[0023] Furthermore, the stamping film is completely placed on the display device substrate in the second transfer process, so that defects in the display device can be minimized. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic perspective view of a transfer device for manufacturing a display device according to an embodiment.

[0025] Figure 2 yes Figure 1 A cross-sectional view of a stamper, a first alignment body, and a film fixing portion of a transfer device for manufacturing a display device.

[0026] Figure 3 yes Figure 1 A perspective view of a portion of a second alignment body and a posture control unit of a transfer device for manufacturing a display device.

[0027] Figure 4 yes Figure 1 A partially exploded perspective view of a transfer device for manufacturing a display device.

[0028] Figure 5 is Figure 1 A partially enlarged stereoscopic view of a state in which a second alignment body is removed in a transfer device for manufacturing a display device.

[0029] Figure 6 yes Figure 2 FIG. 1 is an enlarged cross-sectional view of a first film fixing portion of portion A.

[0030] Figure 7 yes Figure 2 An enlarged stereoscopic view of the second film fixing portion.

[0031] Figure 8 It is a schematic sequence diagram of a transfer method using a transfer device for manufacturing a display device according to an embodiment.

[0032] Figures 9 to 14 The diagram sequentially shows a method of picking up a punching film by a film fixing unit in a transfer method according to an embodiment.

[0033] Figures 15 to 17 The diagram sequentially shows a method of aligning a stamper using a stamper aligning section in a transfer method according to an embodiment.

[0034] Figures 18 to 22 The figures sequentially show the second transfer of the stamping film to which the LED chip has been first transferred to the display device substrate by the film fixing unit in the transfer method according to one embodiment.

[0035] Explanation of symbols:

[0036] 100: die; 110: die body; 120: pressurizing member; 200: die lifting unit; 300: die alignment unit; 310: first alignment unit; 320: second alignment unit; 330: posture control unit; 400: film fixing unit; 410: first film fixing unit; 420: second film fixing unit; 430: a pair of fixing units. DETAILED DESCRIPTION

[0037] Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention. The present invention can be implemented in various forms and is not limited to the embodiments described herein.

[0038] In order to clearly describe the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

[0039] In addition, in the drawings, the size and thickness of each component are arbitrarily shown for the convenience of explanation, and the present invention is not necessarily limited to the illustrated case. In the drawings, the thickness is enlarged to clearly show each layer and region. In addition, in the drawings, the thickness of some layers and regions is exaggerated for the convenience of explanation.

[0040] In addition, when a layer, film, region or other part is located on or above another part, it includes not only the case where it is directly located on the other part, but also the case where there is another part in between. On the contrary, when a part is directly located on another part, it means that there is no other part in between. In addition, being located on or above a part that becomes a reference means being located above or below the part that becomes a reference, and does not necessarily mean being located above or above in the opposite direction of gravity.

[0041] Furthermore, in the entire specification, when a certain part includes a certain constituent element, unless otherwise stated, it does not exclude other constituent elements but indicates that other constituent elements may be included.

[0042] In addition, throughout the specification, “in plan view” refers to a case where a target portion is viewed from above, and “in cross section” refers to a case where a cross section of the target portion is viewed from the side.

[0043] Figure 1 is a schematic three-dimensional diagram of a transfer device for manufacturing a display device according to an embodiment of the present invention. Figure 2 yes Figure 1 A cross-sectional view of a stamper, a first alignment body, and a film fixing portion of a transfer device for manufacturing a display device, Figure 3 yes Figure 1 A perspective view of a portion of a second alignment body and a posture control unit of a transfer device for manufacturing a display device. Figure 4 yes Figure 1 A partially exploded perspective view of a transfer device for manufacturing a display device. Figure 5 is Figure 1 A partially enlarged stereoscopic view of a state in which a second alignment body is removed in a transfer device for manufacturing a display device. Figure 6 yes Figure 2 FIG. 1 is an enlarged cross-sectional view of a first film fixing portion of portion A. Figure 7 yes Figure 2 An enlarged stereoscopic view of the second film fixing portion.

[0044] like Figures 1 to 3As shown, a transfer device for manufacturing a display device according to an embodiment includes a stamper 100 , a stamper lifting unit 200 , a stamper aligning unit 300 , and a film fixing unit 400 .

[0045] The stamper 100 may include a stamper body 110 and a pressurizing member 120 .

[0046] The die body 110 may be in a substantially columnar shape having an opening OH. A portion of the driving force providing portion 423 of the driving pressurizing member 120 may be provided through the opening OH of the die body 110 .

[0047] The pressing member 120 may move in a direction -Z opposite to the first direction Z and apply a pressing force to the object. The object may include a stamping film SF (see Fig.10 ) etc. The press member 120 may include a press head 121 and a load sensor 122. Here, the first direction Z may be a direction perpendicular to a plane defined by the X-axis and the Y-axis.

[0048] The press head 121 may be disposed at the lower end of the die body 110. The press head 121 may include a vacuum chuck, etc., and may grab the stamping film SF to lift it.

[0049] The elastic member 12 may be attached to the lower end of the pressurizing head 121, so that the elastic member 12 may directly contact the stamping film SF. The elastic member 12 may include an elastomer, rubber, or the like, which is a high molecular weight substance having elasticity. The stamping film SF may be formed of a material such as polyimide, so that the LED chip CH (see Fig.15 ) is bent and has a curved surface, but the elastic component 12 in contact with the stamping film SF as in the present embodiment has elasticity, so the adhesion to the stamping film SF having a curved surface can be maintained as it is.

[0050] The load sensor 122 may be disposed between the die body 110 and the press head 121, and measures a load applied to the press head 121. The load sensor 122 may include a load cell or the like.

[0051] The die lifting unit 200 may be connected to the upper end of the die 100 to enable the die 100 to be lifted and lowered in the first direction Z.

[0052] The die alignment part 300 may be provided in the die 100 and align the die 100. Specifically, the die alignment part 300 may align the die 100 in a first transfer process of transferring the LED chip CH to the stamping film SF attached to the pressurizing member 120.

[0053] The stamper alignment part 300 may include a first alignment body 310 , a second alignment body 320 , and a posture control part 330 .

[0054] The first alignment body 310 may be connected to the die 100 and surround the die 100. The first alignment body 310 may have a substantially hemispherical shape, and may have an inner space IS in which a portion of the die 100 is disposed and an opening OP connected to the inner space IS. The outer side surface of the first alignment body 310 may be an outer curved surface 310a disposed as a curved surface. The first alignment body 310 may be aligned with the chip mounting substrate WA (refer to FIG. 1 ) on which the LED chip CH is disposed. Fig.15 )’s upper surface is in contact.

[0055] The second alignment body 320 may have an inner curved surface 320a having a shape corresponding to the outer curved surface 310a of the first alignment body 310. The outer curved surface 310a of the first alignment body 310 may be convex, and the inner curved surface 320a of the second alignment body 320 may be concave. Therefore, the weight of the second alignment body 320 placed on the first alignment body 310 may automatically adjust the posture of the first alignment body 310 for alignment. This will be referred to in the corresponding section below. Figures 15 to 17 Let me explain in detail.

[0056] The posture control part 330 may be provided at the second alignment body 320 and control the posture of the second alignment body 320. The posture control part 330 may include a plurality of ball bearings 331 and a plurality of tension springs 332.

[0057] A plurality of ball bearings 331 may be provided on the inner curved surface 320a of the second alignment body 320, and may be provided to be spaced apart from each other at the same interval. The plurality of ball bearings 331 may be in point contact with the outer curved surface 310a of the first alignment body 310, thereby automatically aligning the second alignment body 320. By rolling of such ball bearings 331, the first alignment body 310 and the second alignment body 320 may be aligned with each other with minimal friction. Therefore, the uniformity of pressurization of the die 100 connected to the die aligning part 300 may be improved.

[0058] The plurality of tension springs 332 can connect the first alignment body 310 and the second alignment body 320 to each other and provide a tension force between the first alignment body 310 and the second alignment body 320. Therefore, when the positions of the first alignment body 310 and the second alignment body 320 are temporarily offset from each other, a restoring force works, thereby maintaining the positions of the first alignment body 310 and the second alignment body 320 in the original state. That is, the plurality of tension springs 332 can prevent the positions of the first alignment body 310 and the second alignment body 320 from being offset in the first direction Z and the rotation direction R.

[0059] In the present embodiment, the plurality of tension springs 332 may be arranged to have an inclination angle of 45 degrees with respect to the first direction Z, but the present invention is not necessarily limited thereto and may be arranged to have various inclination angles.

[0060] As described above, the transfer device for manufacturing a display device according to an embodiment may include a die alignment unit 300, so that the die 100 can be automatically aligned in the first transfer process of transferring the LED chip CH to the stamping film SF. Therefore, in the second transfer process, the LED chip CH can be accurately transferred to the display device substrate BP (refer to Fig. 22 ) to improve the precision of the transfer position.

[0061] The film fixing part 400 may be provided in the die 100 and fix the stamping film SF. More specifically, the film fixing part 400 may fix the stamping film SF in the second transfer process of transferring the stamping film SF that has been first transferred to the LED chip CH to the display device substrate BP. In addition, the film fixing part 400 may fix the stamping film SF in the process of picking up the stamping film SF.

[0062] The film fixing part 400 may include a pair of fixing bodies 430 , a first film fixing part 410 , and a second film fixing part 420 .

[0063] The pair of fixing bodies 430 may be located at both sides of the die 100. The pair of fixing bodies 430 may include a side body 430L disposed at one side of the die 100 and another side body 430R disposed at another side of the die 100.

[0064] The first film fixing part 410 can contact with the upper surface of the stamping film SF and press the upper surface of the stamping film SF to fix the stamping film SF. The die 100 can be vertically lowered by the die lifting part 200, so that the pressure head 121 can pressurize the stamping film SF, and the first film fixing part 410 can also press the upper surface of the stamping film SF to fix the stamping film SF. In addition, when the die 100 is vertically raised by the die lifting part 200, the first film fixing part 410 can press the upper surface of the stamping film SF to fix the stamping film SF until the elastic part 12 attached to the pressure head 121 is completely separated from the stamping film SF.

[0065] The first film fixing portion 410 may include a first film contact portion 411 and a first restoring force providing portion 412 .

[0066] The first film contact part 411 may be located at both sides of the press head 121 and move along the first direction Z. The first film contact part 411 may contact the upper surface of the punching film SF. The first film contact part 411 may include a one side pusher 411L and another side pusher 411R located at both sides of the press head 121, respectively.

[0067] The first restoring force providing part 412 may provide a first restoring force so that the first film contact part 411 maintains a pressing force for pressing a portion of the upper surface of the punching film SF. The first restoring force providing part 412 may include a pair of coil springs.

[0068] The second film fixing part 420 may clamp both ends of the punching film SF to fix the punching film SF.

[0069] The second film fixing portion 420 may include a second film contact portion 421 , a second restoring force providing portion 422 , and a driving force providing portion 423 .

[0070] The second film contact part 421 may be provided on the pair of fixing bodies 430 and may be rotatable at a predetermined angle to contact both ends of the punching film SF. The second film contact part 421 may include one side clamp 421L and another side clamp 421R provided on the pair of fixing bodies 430, respectively.

[0071] The second restoring force providing part 422 may provide a second restoring force so that the second film contact part 421 maintains the pressing force of sandwiching both ends of the punching film SF. The second restoring force providing part 422 may include a pair of torsion springs.

[0072] The driving force providing part 423 may be connected to the second film contact part 421 and provide a driving force for driving the second film contact part 421. That is, the driving force providing part 423 may provide a driving force for rotating the second film contact part 421 by a predetermined angle.

[0073] The upper end of the driving force providing part 423 may be disposed at the upper end of the die body 110, and the lower end of the driving force providing part 423 may be disposed to pass through the opening OH of the die body 110 and to be able to contact a portion of the second film contact part 421. The driving force providing part 423 may include an air cylinder that uses compressed air to perform linear motion.

[0074] As described above, the transfer device for manufacturing a display device according to an embodiment includes a film fixing unit 400 for fixing the stamping film SF, so that the stamping film SF can be completely placed on the display device substrate BP (see FIG. 1 ) in the second transfer process. Fig. 22 ). Therefore, defects of the display device can be minimized.

[0075] Hereinafter, a transfer method using the transfer device for manufacturing a display device according to one embodiment described above will be described in detail with reference to the accompanying drawings.

[0076] Figure 8 It is a schematic sequence diagram of a transfer method using a transfer device for manufacturing a display device according to an embodiment.

[0077] like Figure 8 As shown, the transfer method according to one embodiment first picks up the stamping film SF using the film fixing unit 400 that fixes the stamping film SF ( S100 ).

[0078] Below, refer to Figures 9 to 14 , the steps of picking up the stamping film SF are described in detail.

[0079] Figures 9 to 14 The diagram sequentially shows a method of picking up a punching film by a film fixing unit in a transfer method according to an embodiment.

[0080] like Fig. 9 As shown, a stamping film SF is set on the workbench ST, and a transfer device 10 for manufacturing a display device according to an embodiment is set on the stamping film SF. The size of the stamping film SF can correspond to a plurality of LED chips CH (refer to Fig.15) in size. The stamping film SF may include a base film 1, an adhesive layer 2 formed on the base film 1, and a protective film 3 covering the adhesive layer 2 to protect it. The base film 1 may include a polymer film, an ultra-thin glass substrate, etc. The adhesive layer 2 may be formed of an organic material and attached to the LED chip CH in a subsequent first transfer process. The stamping film SF may be formed of a material that allows infrared laser to pass in order to perform a laser lift off (LLO) process.

[0081] At this time, the stamping film SF can be located at a position corresponding to the groove GR of the workbench ST. The width W1 of the stamping film SF is greater than the width W2 of the groove GR, so the stamping film SF can cover the groove GR, and the two ends SF2 of the stamping film SF can contact the upper surface of the workbench ST.

[0082] Then, if Fig.10 As shown, the die lifting part 200 of the transfer device 10 for manufacturing the display device is used to make the die 100 vertically descend in the direction -Z opposite to the first direction Z, so that the pressurizing component 120 pressurizes the stamping film SF. At this time, the elastic component 12 attached to the pressurizing head 121 of the pressurizing component 120 contacts the central part SF1 of the stamping film SF. Therefore, the central part SF1 of the stamping film SF descends and contacts the bottom surface of the groove GR. In addition, since the width W1 of the stamping film SF is greater than the width W3 of the elastic component 12, the two end parts SF2 of the stamping film SF may not contact the elastic component 12 but be located at a position separated from the upper surface of the workbench ST. Here, a part SF3 of the stamping film SF, which is a part adjacent to the two end parts SF2 of the stamping film SF, may be located in the groove GR of the workbench ST in the stamping film SF, separated from the bottom surface of the groove GR.

[0083] Then, if Fig.11 As shown, the first film fixing unit 410 of the transfer device 10 for display device manufacturing presses a portion SF3 of the stamping film SF so that the portion SF3 of the stamping film SF contacts the bottom surface of the groove GR. Thus, the stamping film SF is fixed on the stage ST.

[0084] Then, if Fig.12 and Fig.13 As shown, the second film fixing portion 420 is used to clamp the two end portions SF2 of the punching film SF. Fig.12As shown, the lower end of the driving force providing part 423 is lowered to rotate the second film contact part 421 in the tilt direction T by a predetermined angle, so that the second film contact part 421 is away from the pair of fixed bodies 430. At this time, the two ends SF2 of the stamping film SF are bent and attached to the exposed portion of the second film contact part 421. In addition, as shown in FIG. Fig.13 As shown, the lower end of the driving force providing portion 423 is raised, thereby the second film contact portion 421 is rotated by a predetermined angle in the opposite direction -T of the tilting direction T through the second restoring force providing portion 422, thereby returning to the original position. At this time, the second film contact portion 421 clamps the two end portions SF2 of the stamping film SF. Therefore, the two end portions SF2 of the stamping film SF are fixed to the second film fixing portion 420.

[0085] Then, if Fig.14 As shown, when the stamping film SF is fixed to the second film fixing part 420 of the transfer device 10 for manufacturing the display device, the stamping die lifting part 200 is used to vertically raise the stamping die 100 attached with the stamping film SF in the first direction Z, so that the stamping film SF is moved away from the workbench ST.

[0086] As described above, the transfer method according to one embodiment can easily transfer the punching film SF by clamping it from the stage ST using the film fixing unit 400 of the transfer apparatus 10 for manufacturing a display device.

[0087] Then, if Figure 8 As shown, when the LED chip CH (refer to Fig.15 ) is transferred to the stamping film SF in the first transfer step, and the stamper 100 is aligned using the stamper alignment unit 300 (S200).

[0088] Below, refer to Figures 15 to 17 The steps of aligning the stamper 100 will be described in detail.

[0089] Figures 15 to 17 The diagram sequentially shows a method of aligning a stamper using a stamper aligning section in a transfer method according to an embodiment.

[0090] like Fig.15As shown, the transfer device 10 for manufacturing a display device including a stamper 100 attached with a stamping film SF can be placed on a chip mounting substrate WA carrying a plurality of LED chips CH. At this time, the LED chip CH can be fixed to the chip mounting substrate WA by an adhesive member AD. Such a chip mounting substrate WA may include a wafer or a donor substrate, etc. At this time, a stamper alignment unit 300 including a first alignment body 310, a second alignment body 320, and a posture control unit 330 can be connected to the stamper 100. For ease of explanation, a state in which the stamper 100 and the stamper alignment unit 300 are not parallel to the surface of the chip mounting substrate WA but are tilted at a predetermined angle is shown. Therefore, the stamping film SF may also be in a state in which it is not parallel to the surface of the chip mounting substrate WA but is tilted at a predetermined angle.

[0091] Then, if Fig.16 As shown, in order to perform the first transfer process, the lower surface of the stamping film SF attached to the stamper 100 is brought into contact with the plurality of LED chips CH mounted on the chip mounting substrate WA. At this time, the lower surface of the stamping film SF is not parallel to the surface of the chip mounting substrate WA but is tilted at a predetermined angle, so the virtual rotation center RC of the first alignment body 310 having a substantially hemispherical shape may not be in contact with the plurality of LED chips CH. Here, for the sake of convenience, the lower surface of the stamping film SF in contact with the LED chips CH is defined as the transfer surface TS.

[0092] Then, if Fig.17 As shown, the virtual rotation center RC of the first alignment body 310 is located on the transfer surface TS by utilizing the shape and weight of the second alignment body 320 located on the first alignment body 310 .

[0093] Next, the posture control unit 330 of the die alignment unit 300 controls the posture of the die 100 connected to the first alignment body 310. That is, the posture of the die 100 is automatically controlled by the plurality of ball bearings 331 and the plurality of tension springs 332 to align the die 100.

[0094] As described above, the transfer method according to one embodiment utilizes the die alignment unit 300 of the transfer device 10 for manufacturing a display device, so that the die 100 can be automatically aligned in the first transfer process of transferring the LED chip CH to the stamping film SF. Therefore, in the second transfer process, the LED chip CH can be accurately transferred to the display device substrate BP, thereby improving the precision of the transfer position.

[0095] Then, if Figure 8As shown, in the second transfer process of transferring the LED chip CH and the punching film SF to the display device substrate BP, the punching film SF is set on the display device substrate BP by using the film fixing unit 400 (S300).

[0096] Below, refer to Figures 18 to 22 , the steps of placing the stamping film SF on the display device substrate BP are described in detail.

[0097] Figures 18 to 22 The figures sequentially show a method of secondarily transferring a stamping film to which an LED chip has been primarily transferred to a display device substrate by a film fixing unit in a transfer method according to an embodiment.

[0098] like Fig.18 As shown, the stamper 100 is vertically lowered in the direction -Z opposite to the first direction Z by using the stamper lifting unit 200 of the transfer device 10 for manufacturing a display device, so that the stamping film SF and the LED chip CH attached to the press member 120 are in contact with the upper surface of the display device substrate BP. At this time, the stamping film SF is in a state of being fixed by the first film fixing unit 410 and the second film fixing unit 420.

[0099] Then, if Fig.19 As shown, the lower end of the driving force providing part 423 is lowered to rotate the second film contact part 421 by a predetermined angle in the tilt direction T, thereby moving the second film contact part 421 away from the pair of fixed bodies 430. Therefore, both ends SF2 of the punching film SF can be separated from the pair of fixed bodies 430.

[0100] Then, if Fig. 20 As shown, the die lifting unit 200 is used to make the die 100 rise vertically little by little in the first direction Z, thereby separating the elastic component 12 from the display device substrate BP. At this time, the central portion SF1 of the stamping film SF maintains a state of contact with the elastic component 12 by the vacuum adsorption force brought about by the close contact with the elastic component 12, so the central portion SF1 of the stamping film SF is away from the upper surface of the display device substrate BP. At this time, the first film contact portion 411 does not rise vertically, and the position of the first film contact portion 411 is maintained as it is by the first restoring force providing portion 412, so a portion SF3 adjacent to the two end portions SF2 of the stamping film SF maintains a state of being fixed to the display device substrate BP by the first film fixing portion 410. Therefore, a portion SF3 adjacent to the two end portions SF2 of the stamping film SF maintains a state of contact with the upper surface of the display device substrate BP.

[0101] Then, if Fig.21As shown, if the die 100 is further vertically raised by the die lifting unit 200, the central portion SF1 of the stamping film SF is also separated from the elastic member 12 by the first film fixing unit 410, so that the area in the central portion SF1 of the stamping film SF that contacts the upper surface of the display device substrate BP is gradually increased. At this time, the first film contact portion 411 still does not rise vertically, and the position of the first film contact portion 411 is maintained as it is by the first restoring force providing unit 412, so that a portion SF3 adjacent to the two end portions SF2 of the stamping film SF is maintained in a state of being fixed to the display device substrate BP by the first film fixing unit 410.

[0102] Then, if Fig. 22 As shown, if the die 100 is further vertically raised by the die lifting unit 200, all areas of the central portion SF1 of the stamping film SF are away from the elastic member 12, so as to contact the upper surface of the display device substrate BP. When the distance D between the elastic member 12 and the display device substrate BP exceeds the predetermined interval, the first film contact portion 411 of the first film fixing portion 410 is also separated from a portion SF3 adjacent to the two end portions SF2 of the stamping film SF. Therefore, the stamping film SF can be completely placed on the display device substrate BP without the presence of a warped portion.

[0103] The stamping film SF placed on the display device substrate BP together with the LED chip CH can be separated and removed from the display device substrate BP by using a separation member such as a vacuum chuck and adhesive tape after the bonding process between the LED chip CH and the display device substrate BP.

[0104] As described above, the transfer method according to one embodiment uses the film fixing unit 400 of the transfer device 10 for manufacturing a display device, so that the punching film SF can be completely placed on the display device substrate BP in the second transfer process. Therefore, the defect of the display device can be minimized.

[0105] Furthermore, the stamping film SF is not removed from the stamping die 100 by an air purging method, but is removed from the stamping die 100 in a state where the stamping film SF is fixed by the first film fixing part 410 and the second film fixing part 420 as in the transfer method according to one embodiment, so that the flux formed in the display device substrate BP as a byproduct of the bonding of the LED chip CH is not scattered by air, thereby preventing the contamination of the display device. Therefore, the defect of the display device caused by particles can be minimized.

[0106] Furthermore, by completely placing the stamping film SF on the display device substrate BP, it is easy to increase the size of the stamping film SF, thereby improving the productivity of the transfer process.

[0107] The embodiments of the present invention are described in detail above, but the scope of the present invention is not limited thereto. Various modifications and improvements of the basic concept of the present invention defined in the claims by those skilled in the art also fall within the scope of the present invention.

Claims

1. A transfer device for manufacturing a display device, comprising: A press mold including a press member for applying a press force in a first direction; A die alignment portion connected to the die and aligned with the die; as well as The film fixing part is located on two sides of the die and fixes the stamping film.

2. The transfer device for manufacturing a display device according to claim 1, wherein: The die further comprises: a die main body, provided with the pressurizing component, The pressurizing component includes: a pressurizing head portion located at the lower end portion of the die body and including an elastic component in contact with the stamping film.

3. The transfer device for manufacturing a display device according to claim 2, wherein: The film fixing portion comprises: A pair of fixed bodies, located on the two side surfaces of the die; a first film fixing portion, provided on the pair of fixing bodies, in contact with the upper surface of the stamping film, pressing the upper surface of the stamping film to fix the stamping film; and The second film fixing part is provided on the pair of fixing bodies and clamps both ends of the punching film to fix the punching film.

4. The transfer device for manufacturing a display device according to claim 3, wherein: The first film fixing portion comprises: a first film contact portion, located at the lower end portions of the pair of fixed bodies, movable along the first direction and contacting the upper surface of the stamping film; and The first restoring force providing portion provides a first restoring force to the first film contact portion.

5. The transfer device for manufacturing a display device according to claim 4, wherein: The first film contact portion includes a one side push rod and another side push rod respectively located on both sides of the pressurizing head portion.

6. The transfer device for manufacturing a display device according to claim 4, wherein: The second film fixing portion comprises: a second film contact portion, provided on the pair of fixed bodies, capable of rotating at a predetermined angle to contact the two end portions of the stamping film; and The second restoring force providing portion is provided on the pair of fixed bodies and provides a second restoring force to the second film contact portion.

7. The transfer device for manufacturing a display device according to claim 2, wherein: The die alignment portion comprises: a first alignment body, surrounding the die, connected to the die and having a hemispherical shape; a second alignment body including an inner curved surface having a shape corresponding to the outer curved surface of the first alignment body; and The posture control unit is connected to the first alignment body and the second alignment body, and controls the postures of the first alignment body and the second alignment body to align the stamper.

8. The transfer device for manufacturing a display device according to claim 7, wherein: The posture control unit includes: a plurality of ball bearings, which are provided on the inner curved surface of the second alignment body and contact the outer curved surface of the first alignment body; and A plurality of tension springs provide a tension force between the first alignment body and the second alignment body.

9. A transfer method comprising: The step of picking up the stamped film by using a film fixing part connected to a stamping die that pressurizes the stamped film and fixes the stamped film; A step of aligning the stamping die using a stamping die aligning portion in a first transfer process of transferring the LED chip to the stamping film; as well as In a second transfer step of transferring the LED chip and the stamping film to a display device substrate, the stamping film is set on the display device substrate using the film fixing portion.

10. The transfer method according to claim 9, wherein: The step of picking up the stamping film comprises: The step of fixing the stamping film on a workbench by pressing the upper surface of the stamping film with the first film fixing portion of the film fixing portion; and A step of fixing the punching film by sandwiching both ends of the punching film with the second film fixing portion of the film fixing portion.

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