Plugging test system for memory bank of server mainboard

Abstract

The invention relates to the technical field of memory bank testing, and discloses a server mainboard memory bank plugging and unplugging test system which comprises a mechanical plugging and unplugging module, a sensor module, a pre-detection module, a test analysis module and a result display module.According to the server mainboard memory bank plugging and unplugging test system, automatic operation is achieved through the mechanical plugging and unplugging module, and accuracy and efficiency are improved; the sensor module adopts a four-wire system resistance measurement sensor, the contact resistance is accurately measured, and the contact detection precision is guaranteed; the pre-detection module can screen out memory banks with appearance scratches in advance from multi-angle image acquisition and equal-interval grid division to accurate pixel value analysis by utilizing a scientific appearance detection process; the test analysis module comprehensively evaluates the performance, the contact state judgment is clear, and the memory read-write and stability test is rigorous and scientific; a test report generated by the result display module visually shows results of scratch, contact, read-write, stability and the like, comprehensive information is provided for operators, and efficient judgment of the performance of the memory bank is assisted.

Description

Technical Field

[0001] The invention relates to the technical field of memory bar testing, and in particular to a server mainboard memory bar plugging and unplugging testing system. Background Art

[0002] In today's digital age, servers are core devices for data storage, processing and transmission, and their performance stability and reliability are crucial. Memory sticks, as one of the key components of server motherboards, directly affect the server's operating speed and data processing capabilities.

[0003] With the rapid development of information technology, servers are facing an increasing demand for data processing, which also puts higher requirements on the performance and quality of memory sticks. In the server manufacturing process, as well as in subsequent maintenance and upgrade work, memory sticks need to be plugged in and out. However, various problems may occur in the actual plugging and unplugging operation, which seriously affects the normal operation and service life of the server.

[0004] On the one hand, the contact condition between the memory stick and the slot will greatly affect the stability and reliability of data transmission. If the contact resistance is too large, it may cause unstable signal transmission, data loss or errors, and then cause server failure. The traditional contact resistance measurement method has the problem of insufficient accuracy, and it is difficult to accurately detect subtle poor contact conditions, and it is impossible to effectively ensure good contact between the memory stick and the slot. On the other hand, the appearance of the memory stick cannot be ignored. During the production, transportation, storage, and plugging and unplugging process, physical damage such as scratches may appear on the surface of the memory stick. Although these scratches seem small, they may affect the electrical performance of the memory stick, such as causing short circuits, open circuits, or signal interference. The existing appearance inspection methods often rely on manual visual observation, which is not only inefficient, but also easily affected by subjective factors. It is difficult to accurately judge whether there are scratches on the surface of the memory stick and the location and extent of the scratches.

[0005] In addition, comprehensive testing of memory bar performance is also crucial. Memory read and write performance and stability are key indicators for measuring memory bar quality. Currently, some testing methods are not comprehensive and rigorous enough to accurately evaluate the performance of memory bars under long-term, high-load operation, which makes it difficult to detect some potential performance issues during the testing phase, increasing the risk of server failure during actual use. Summary of the invention

[0006] The purpose of the present invention is to provide a server mainboard memory bar plug-in test system, which solves the technical problems raised in the background technology.

[0007] The purpose of the present invention can be achieved through the following technical solutions: A server motherboard memory bar plug-in and pull-out test system, comprising: A mechanical plug-in module, used to perform the plug-in and pull-out operations of the memory stick; A sensor module is used to monitor the contact resistance between the memory module and the slot; A pre-detection module is used to perform an appearance inspection on the memory bar before inserting the memory bar into the slot array, and determine whether the appearance of the memory bar has scratches through the appearance inspection; A test analysis module, used to perform test analysis and processing according to the results obtained by the sensor module after the mechanical plug-in module inserts the memory stick into the slot; The result display module is used to generate test reports based on the results obtained by the pre-detection module and the test analysis module and display them to relevant personnel.

[0008] As a further solution of the present invention: wherein, the sensor module adopts a four-wire resistance measurement sensor, which adopts a four-wire measurement method, wherein two wires are used to provide excitation current, and the other two wires are used to measure the voltage across the object being measured; by measuring the voltage and current, the contact resistance value is calculated using Ohm's law.

[0009] As a further solution of the present invention: the appearance detection method is as follows: StepH.1, Image acquisition: Use a high-resolution camera to shoot the qualified memory bar and the memory bar to be tested at multiple angles, and obtain the front image sample, back image sample and pin detail image sample of the qualified memory bar, and obtain the front analysis image, back analysis image and pin detail analysis image of the memory bar to be tested, and then convert them into grayscale images; When shooting at multiple angles, you need to ensure uniform lighting to avoid shadows and reflections that affect image quality; StepH.2, Regional Division: Divide the area between the front image sample and the front analysis image, the area between the back image sample and the back analysis image, and the area between the detail image sample and the detail analysis image into sub-areas of the same size respectively; StepH.3, pixel value calculation: In each sub-region, the pixel value of each pixel point in each sub-region is obtained, and then the average pixel value of all the pixel points corresponding to each sub-region is calculated respectively; The method is as follows: Select a sub-region and mark multiple pixels in the sub-region as Pi, i=1, 2, ..., u, and u represents the number of pixels in the sub-region; Then through: ; Calculate the average pixel value Pu of all pixels corresponding to the sub-region; By analogy, the average pixel value of all pixels corresponding to each sub-region is calculated; StepH.4, Difference calculation: Taking the front image sample and the front analysis image as examples, the sub-regions corresponding to the same position are selected therefrom, and the average pixel values ​​of the two sub-regions are marked as Pu1 and Pu2 respectively; Then pass: PC=|Pu1-Pu2|; Calculate the difference value PC of the average pixel values ​​corresponding to the two sub-areas; Similarly, the difference values ​​of the average pixel values ​​in the corresponding sub-regions at the same position are calculated between the front image sample and the front analysis image, between the back image sample and the back analysis image, and between the detail image sample and the detail analysis image. Step H.5, Scratch judgment: Compare each difference value with the preset pixel value difference threshold Cy: If PC>Cy, it is considered that there is a scratch in the sub-region; If PC≤Cy, it is considered that there is no scratch in the sub-region.

[0010] As a further solution of the present invention: the pixel value difference threshold Cy is determined by performing multiple appearance inspection experiments on different batches of non-scratched memory bars and scratched memory bars, and statistically analyzing the distribution of pixel value differences, thereby determining a reasonable threshold.

[0011] As a further solution of the present invention: the sub-area division method in Step H.2 is as follows: Take the front image sample and the front analysis image as an example; The front image sample and the front analysis image are divided into m×n sub-regions of equal size using an equally spaced grid division method, and the size of each sub-region is W / m×H / n; Wherein, m represents the number of sub-regions divided in the horizontal direction of the image, n represents the number of sub-regions divided in the vertical direction of the image, and W and H represent the width and height of the image respectively.

[0012] As a further solution of the present invention, the test analysis processing method is as follows: Step F1, contact status judgment: The contact resistance value is marked as R, and then the preset contact resistance threshold Ry is extracted; When R<Ry, the contact state between the memory module and the slot is determined to be successfully inserted; Otherwise, the contact state between the memory module and the slot is determined to be insertion failure; Step F2, performance test: When the memory stick is successfully inserted into the slot, the memory read and write test and stability test of the memory stick are started.

[0013] As a further solution of the present invention: the memory read and write test method is as follows: Step F2.1.1, write a preset read / write test data template into the memory stick that has been successfully inserted into the slot, and then read the read / write test data template written into the memory stick; Step F2.1.2, at the same time, in the read-write test data template before writing, count the total number of data bits corresponding to all bytes and mark them as the total data bits; StepF2.1.3, then compare the read and write test data templates before and after writing. The data comparison method is as follows: In the two read-write test data templates before and after writing, the data bits in each byte are compared one by one: If the data bit position at the same position is different in the read-write test data template before and after writing, the data bit is marked as an error data bit; If the data bit position at the same position is the same in the read-write test data template before and after writing, then the data bit is marked as the correct data bit; Step F2.1.4, then count the number of erroneous data bits according to the data comparison result, and mark them as the number of erroneous data bits; StepF2.1.5, then calculate the error rate of the read-write test data template after writing through the error rate calculation formula: error rate = (number of error data bits / total number of data bits) × 100%; Step F2.1.6, extract the preset error rate threshold, and compare its error rate with the error rate threshold: If the error rate is greater than the error rate threshold, it means that the memory read and write test of the memory module is abnormal; If the error rate is equal to the error rate threshold, it means that the memory read and write test of the memory module is normal.

[0014] As a further solution of the present invention: the stability test method is as follows: During the scheduled test cycle, multiple memory read and write tests are performed, and stability assessment is performed based on the results of multiple memory read and write tests, as follows: StepF2.2.1, first obtain the number of memory read and write tests in the test cycle, and mark it as the total number of operations; Step F2.2.2, then count the number of errors that occur in the test, where the number of errors is determined based on the error rate obtained from the memory read and write test; Select a memory read and write test result; When the error rate obtained from the memory read / write test is 0, the number of errors in the test cycle remains unchanged; When the error rate obtained by the memory read and write test is greater than 0, the number of errors in the test cycle is accumulated and increased by 1; Step F2.2.3, then calculate the stability index of the memory stick during the test cycle by: stability index = [1-(number of errors / total number of operations)]; Step F2.2.4, extract the preset stability index threshold, and compare its stability index with the stability index threshold: If the stability index is greater than the stability index threshold, it means that the stability of the memory module is qualified; If the stability index is equal to the stability index threshold, it means that the stability of the memory module is unqualified.

[0015] As a further solution of the present invention: the test report content includes: The front analysis image, the back analysis image and the detail analysis image of the pin part of the memory bar to be inspected correspond to the sub-area where the scratches exist; The scratched sub-area is marked by drawing a red rectangular frame or line, so that the operator can intuitively understand the scratch condition on the surface of the memory bar; The contact status judgment result, specifically, the result of successful insertion or failed insertion; Memory read / write test results, specifically the error rate of the read / write test data template after writing, and the results of abnormal or normal memory read / write test of the memory stick; The stability test results include the stability index of the memory module during the test period, and whether the stability of the memory module is qualified or unqualified.

[0016] Beneficial effects of the present invention: Mechanical plug-in module realizes automated operation: The mechanical plug-in module adopts a specific structure to realize automatic plug-in and pull-out of memory sticks, which improves the accuracy and consistency of plug-in operations, reduces the interference of human factors on test results, ensures the stability and repeatability of tests, and improves test efficiency while reducing labor costs.

[0017] High-precision measurement of contact resistance: The sensor module adopts a four-wire resistance measurement sensor. It uses a four-wire measurement method to provide excitation current through two wires and measure voltage through the other two wires. The contact resistance value is calculated in combination with Ohm's law, which effectively eliminates the influence of wire resistance and contact resistance on the measurement results. It is suitable for high-precision measurement occasions and can accurately obtain the contact resistance between the memory stick and the slot, providing an accurate basis for subsequent judgment.

[0018] Screen out memory sticks with appearance problems in advance: The pre-detection module performs appearance inspection before the memory stick is inserted. It can detect appearance scratches in advance, prevent memory sticks with performance affected by appearance problems from entering the subsequent complex testing process, and improve overall testing efficiency and accuracy.

[0019] Comprehensive image acquisition: Use a high-resolution camera to capture memory bar images from multiple angles and convert them into grayscale images, while ensuring uniform lighting and reducing the impact of shadows and reflections, so as to obtain comprehensive and high-quality information on the appearance of the memory bar.

[0020] Reasonable area division: The image is divided into multiple sub-areas of equal size using an equidistant grid division method, laying the foundation for subsequent precise analysis of pixel differences in each part.

[0021] Accurate pixel value analysis: By calculating the average pixel value of each sub-region pixel point and comparing the difference in the average pixel values ​​of sub-regions at the same position, and combining the reasonable pixel value difference threshold determined by the experiment to judge scratches, it is possible to scientifically and accurately determine whether there are scratches on the surface of the memory bar and the location of the scratches.

[0022] Comprehensive test and analysis process: After the memory stick is inserted, the test and analysis module performs contact status judgment, memory read and write tests, and stability tests to comprehensively evaluate the performance of the memory stick.

[0023] Clear contact status judgment: By setting the contact resistance threshold and comparing it with the measured contact resistance value, the contact status between the memory module and the slot can be clearly judged, providing a basic judgment for subsequent tests.

[0024] Rigorous memory read and write test: The memory read and write test comprehensively and rigorously detects the memory read and write performance of the memory stick, from writing preset data templates, counting statistical bits, comparing data to calculating error rates, and comparing them with preset error rate thresholds, accurately determining whether the memory read and write test is abnormal.

[0025] Scientific stability test: Perform memory read and write tests multiple times within a predetermined test cycle, count the number of errors based on the error rate of each test, and then calculate the stability index. This is compared with the preset stability index threshold to scientifically evaluate the stability of the memory stick.

[0026] Intuitive test report display: The test report generated by the result display module is rich in content, including the sub-areas with scratches in the images of each part of the memory bar, contact status judgment results, memory read and write test results, and stability test results, providing operators with intuitive and comprehensive detection information, allowing them to quickly understand the performance status of the memory bar and make corresponding decisions. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present invention will be further described below in conjunction with the accompanying drawings.

[0028] Figure 1 The invention discloses a system block diagram of a server mainboard memory bar plug-in and pull-out test system.

[0029] Figure 2 The present invention is a schematic flow chart of a pre-detection module in a server mainboard memory bar plug-in and pull-out test system.

[0030] Figure 3 The present invention is a flow chart of a test analysis module in a server mainboard memory bar plugging and unplugging test system. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] Embodiment 1

[0033] See also Figure 1 , Figure 2 and Figure 3 As shown, the present invention is a server motherboard memory bar plug-in test system, comprising: The sensor module is used to monitor the contact resistance value between the memory module and the slot after the memory module is inserted into the slot; In this embodiment, the sensor module adopts a four-wire resistance measurement sensor, which adopts a four-wire measurement method, wherein two wires are used to provide an excitation current and the other two wires are used to measure the voltage across the measured object; By measuring voltage and current and using Ohm's law to calculate the contact resistance value, the influence of wire resistance and contact resistance on the measurement results can be effectively eliminated, and the measurement accuracy can be improved. It is suitable for high-precision measurement occasions. A test analysis module is used to perform test analysis based on the results obtained by the sensor module; The test analysis process is as follows: Step F1, contact status judgment: The contact resistance value is marked as R, and then the preset contact resistance threshold Ry is extracted; When R<Ry, the contact state between the memory module and the slot is determined to be successfully inserted; Otherwise, the contact state between the memory module and the slot is determined to be insertion failure; Step F2, performance test: When the memory stick is successfully inserted into the slot, the memory read and write test and stability test of the memory stick are started; StepF2.1, memory read and write test: Step F2.1.1, write a preset read / write test data template into the memory stick that has been successfully inserted into the slot, and then read the read / write test data template written into the memory stick; Step F2.1.2, at the same time, in the read-write test data template before writing, count the total number of data bits corresponding to all bytes and mark them as the total data bits; StepF2.1.3, then compare the read and write test data templates before and after writing. The data comparison method is as follows: In the two read-write test data templates before and after writing, the data bits in each byte are compared one by one: If the data bit position at the same position is different in the read-write test data template before and after writing, the data bit is marked as an error data bit; If the data bit position at the same position is the same in the read-write test data template before and after writing, then the data bit is marked as the correct data bit; Step F2.1.4, then count the number of erroneous data bits according to the data comparison result, and mark them as the number of erroneous data bits; StepF2.1.5, then calculate the error rate of the read-write test data template after writing through the error rate calculation formula: error rate = (number of error data bits / total number of data bits) × 100%; Step F2.1.6, extract the preset error rate threshold, and compare its error rate with the error rate threshold: If the error rate is greater than the error rate threshold, it means that the memory read and write test of the memory module is abnormal; If the error rate is equal to the error rate threshold, it means that the memory read and write test of the memory module is normal; In this embodiment, the error rate threshold is set to 0; For example: Assume that the read / write test data template is 1024 bytes of data. After writing into the memory stick, the read / write test data template read from the memory stick is found to have byte errors corresponding to 10 data bits. Then the error rate = [10 / (1024×8)]×100%; The 8 in 1024×8 represents the conversion relationship between bytes and bits. Bytes and bits are both units of measurement used in computer information technology to measure storage capacity. The conversion relationship between them is: 1 byte equals 8 bits; In computer storage and data transmission, bit is the smallest storage unit, and byte is the commonly used basic storage unit. In the above example, 1024 bytes of data are written. Only by converting bytes into bits can we calculate the number of erroneous data bits in units of "bits", so we need to multiply by 8 to get the total number of data bits, and then calculate the error rate according to the formula; Step F2.2, stability test: During the scheduled test cycle, multiple memory read and write tests are performed, and stability assessment is performed based on the results of multiple memory read and write tests, as follows: StepF2.2.1, first obtain the number of memory read and write tests in the test cycle, and mark it as the total number of operations; Step F2.2.2, then count the number of errors that occur in the test, where the number of errors is determined based on the error rate obtained from the memory read and write test; Select a memory read and write test result; When the error rate obtained from the memory read / write test is 0, the number of errors in the test cycle remains unchanged; When the error rate obtained by the memory read and write test is greater than 0, the number of errors in the test cycle is accumulated and increased by 1; For example: First test: 8192 bits of data were written, and after reading, it was found that the number of error data bits was 0; According to the error rate calculation formula, the error rate is 0%; According to the rules, when the error rate is 0, the number of errors in the test cycle remains unchanged, so the cumulative number of errors is still 0; Second test: The same 8192 bits of data are written, and there are 16 bits of data errors after reading; The calculated error rate is about 0.195%, which is greater than 0; Therefore, the number of errors in the test cycle is accumulated and added by 1, becoming 1.

[0034] Third test: The number of error data bits is 0, the error rate is 0%, and the number of errors remains unchanged at 1; Fourth test: 8 bits of erroneous data appear, the error rate is about 0.098%, which is greater than 0, and the number of errors is accumulated by 1, becoming 2 times; Subsequent tests are similar: After each test, whether to increase the cumulative number of errors is determined based on whether the error rate is 0; When the error rate is 0, the cumulative number of errors remains unchanged; when the error rate is greater than 0, the cumulative number of errors increases by 1; Step F2.2.3, then calculate the stability index of the memory stick during the test cycle by: stability index = [1-(number of errors / total number of operations)]; For example: Assume that within 30 minutes, a memory read and write test is performed every 10 seconds, and a total of 180 memory read and write tests are performed, among which the error rate of 9 memory read and write tests is not 0, then the stability index = (1-(9 / 180)) × 100% = 5%; Step F2.2.4, extract the preset stability index threshold, and compare its stability index with the stability index threshold: If the stability index is greater than the stability index threshold, it means that the stability of the memory module is qualified; If the stability index is equal to the stability index threshold, it means that the stability of the memory module is unqualified; This embodiment adopts a four-wire resistance measurement sensor. Through the four-wire measurement method, two wires provide excitation current, two wires measure voltage, and Ohm's law is used to calculate the contact resistance value. It can effectively eliminate the influence of wire resistance and contact resistance on the measurement result, improve the measurement accuracy, and is suitable for high-precision measurement occasions to ensure the accurate measurement of the contact resistance between the memory stick and the slot. By setting the contact resistance threshold and comparing the measured contact resistance value with it, it can clearly determine whether the contact state between the memory stick and the slot is successfully inserted or failed to be inserted, providing a basic judgment for subsequent tests. The memory read and write test is performed on the successfully inserted memory stick, from writing the preset data template, counting the statistical bits, comparing the data to calculating the error rate, and comparing it with the preset error rate threshold, the memory read and write performance of the memory stick is comprehensively and rigorously detected, and the memory read and write test is accurately determined whether the memory read and write test is abnormal. The memory read and write test is performed multiple times within the predetermined test cycle, and the number of errors is counted according to the error rate of each test, and then the stability index is calculated, and compared with the preset stability index threshold, and the stability of the memory stick is scientifically evaluated.

[0035] Embodiment 2

[0036] See also Figure 1 , Figure 2 and Figure 3 As shown, as the second embodiment of the present invention, when the present application is implemented, compared with the first embodiment, the technical solution of this embodiment is different from that of the first embodiment only in that the present embodiment further includes: A pre-detection module is used to perform an appearance inspection on the memory bar before inserting the memory bar into the slot array, and determine whether the appearance of the memory bar has scratches through the appearance inspection; The appearance inspection method is as follows: StepH.1, Image acquisition: Use a high-resolution camera to shoot the qualified memory bar and the memory bar to be tested at multiple angles, and obtain the front image sample, back image sample and pin detail image sample of the qualified memory bar, and obtain the front analysis image, back analysis image and pin detail analysis image of the memory bar to be tested, and then convert them into grayscale images; Grayscale images are converted as follows: H=0.299×R+0.587×G+0.114×B; Where H is the gray value of the corresponding pixel after conversion to the grayscale image, R is the red channel value of the corresponding pixel before conversion to the grayscale image, G is the green channel value of the corresponding pixel before conversion to the grayscale image, and B is the blue channel value of the corresponding pixel before conversion to the grayscale image; When shooting at multiple angles, you need to ensure uniform lighting to avoid shadows and reflections that affect image quality; StepH.2, Regional Division: Divide the area between the front image sample and the front analysis image, the area between the back image sample and the back analysis image, and the area between the detail image sample and the detail analysis image into sub-areas of the same size respectively; The division is as follows: Take the front image sample and the front analysis image as an example; The front image sample and the front analysis image are divided into m×n sub-regions of equal size using an equally spaced grid division method, and the size of each sub-region is W / m×H / n; Wherein, m represents the number of sub-regions divided in the horizontal direction of the image, n represents the number of sub-regions divided in the vertical direction of the image, and W and H represent the width and height of the image respectively; StepH.3, pixel value calculation: In each sub-region, the pixel value of each pixel point in each sub-region is obtained, and then the average pixel value of all the pixel points corresponding to each sub-region is calculated respectively; The method is as follows: Select a sub-region and mark multiple pixels in the sub-region as Pi, i=1, 2, ..., u, and u represents the number of pixels in the sub-region; Then through: ; Calculate the average pixel value Pu of all pixels corresponding to the sub-region; By analogy, the average pixel value of all pixels corresponding to each sub-region is calculated; StepH.4, Difference calculation: Taking the front image sample and the front analysis image as examples, the sub-regions corresponding to the same position are selected therefrom, and the average pixel values ​​of the two sub-regions are marked as Pu1 and Pu2 respectively; Then pass: PC=|Pu1-Pu2|; Calculate the difference value PC of the average pixel values ​​corresponding to the two sub-areas; Similarly, the difference values ​​of the average pixel values ​​in the corresponding sub-regions at the same position are calculated between the front image sample and the front analysis image, between the back image sample and the back analysis image, and between the detail image sample and the detail analysis image. Step H.5, Scratch judgment: Compare each difference value with the preset pixel value difference threshold Cy: If PC>Cy, it is considered that there is a scratch in the sub-region; If PC≤Cy, it is considered that there is no scratch in the sub-region; In this embodiment, by judging all sub-areas, it can be determined whether there are scratches on the entire memory bar surface and the location of the scratches; The pixel value difference threshold Cy is determined by performing multiple appearance inspection experiments on scratch-free memory bars and scratched memory bars from different batches and statistically analyzing the distribution of pixel value differences, thereby determining a reasonable threshold.

[0037] Before the memory stick is inserted into the slot array, this embodiment first performs an appearance inspection on the memory stick, obtains images through multi-angle shooting with a high-resolution camera, and after steps such as image acquisition, area division, pixel value calculation, difference calculation, and scratch judgment, it is possible to detect in advance whether there are scratches on the appearance of the memory stick and the location of the scratches. This helps to screen out memory sticks that may affect performance due to appearance problems before conducting subsequent complex tests, avoid invalid tests, and improve overall test efficiency and accuracy. Multi-angle shooting is used to ensure the comprehensiveness of the image, and the image sub-areas are divided by an equidistant grid division method. The pixel values ​​and difference values ​​of the sub-areas are calculated, and compared with the reasonable pixel value difference threshold determined by experiments, the scratch condition of the memory stick surface can be scientifically and effectively judged.

[0038] Embodiment 3

[0039] See also Figure 1 , Figure 2 and Figure 3 As shown, as the third embodiment of the present invention, when the present application is implemented, compared with the first and second embodiments, the technical solution of this embodiment is to combine the solutions of the first and second embodiments, and the difference between the technical solution of this embodiment and the first and second embodiments is only in this embodiment; A mechanical plug-in module, used to perform the plug-in and pull-out operations of the memory stick; In this embodiment, the mechanical plug-in module adopts a structure of a lead screw and a nut driven by a motor. The rotation of the motor drives the lead screw to rotate, and the lead screw pushes the nut and the slider connected to the nut to make a linear motion along the guide rail. A memory stick clamping device is installed at the front end of the slider. The clamping device consists of two elastic metal clips. There are anti-slip rubber pads on the inside of the clips to increase friction and prevent the memory stick from slipping during clamping.

[0040] This implementation introduces a mechanical plug-in module, which uses a motor-driven screw and nut structure, and cooperates with a memory stick clamping device, which consists of two elastic metal clips with anti-slip rubber pads, to automatically perform the plug-in and pull-out operations of the memory stick. Compared with manual plug-in and pull-out, it improves the accuracy and consistency of the plug-in and pull-out operations, reduces the impact of human factors on the test results, and also improves the efficiency and repeatability of the test.

[0041] Embodiment 4

[0042] See also Figure 1 , Figure 2 and Figure 3 As shown, as the fourth embodiment of the present invention, when the present application is implemented, compared with the first embodiment, the second embodiment and the third embodiment, the difference between the present embodiment and the first embodiment, the second embodiment and the third embodiment is that the present embodiment further includes: The result display module is used to generate test reports based on the results obtained by the pre-detection module and the test analysis module and display them to relevant personnel; The test report includes: The front analysis image, the back analysis image and the detail analysis image of the pin part of the memory bar to be inspected correspond to the sub-area where the scratches exist; The scratched sub-area is marked by drawing a red rectangular frame or line, so that the operator can intuitively understand the scratch condition on the surface of the memory bar; The contact status judgment result, specifically, the result of successful insertion or failed insertion; Memory read / write test results, specifically the error rate of the read / write test data template after writing, and the results of abnormal or normal memory read / write test of the memory stick; The stability test results include the stability index of the memory module during the test period, and whether the stability of the memory module is qualified or unqualified.

[0043] In this embodiment, the test report generated by the result display module includes the sub-areas where scratches exist in the images of each part of the memory stick to be tested, the contact status judgment results, the memory read and write test results, and the stability test results, providing relevant personnel with intuitive and comprehensive detection information, making it easy to understand the various performance conditions of the memory stick.

[0044] Embodiment 5

[0045] See also Figure 1 , Figure 2 and Figure 3 As shown, as the fifth embodiment of the present invention, when the present application is implemented specifically, compared with the first, second, third and fourth embodiments, the technical solution of this embodiment is to combine the solutions of the above-mentioned first, second, third and fourth embodiments for implementation.

[0046] This embodiment combines the technical solutions of embodiments one, two, three and four, and has high-precision contact resistance measurement, comprehensive test analysis and intuitive result display, and can perform appearance inspection and screening of memory sticks before testing. It also realizes the automation of memory stick plugging and unplugging operations, and comprehensively improves the functional integrity, test accuracy, efficiency and reliability of the server motherboard memory stick plugging and unplugging test system.

[0047] The above formulas are all dimensionless and numerical calculations. The formula is a formula for the most recent real situation obtained by collecting a large amount of data and performing software simulation. The preset parameters and thresholds in the formula are set by technicians in this field according to actual conditions.

[0048] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A server motherboard memory bar plug-in test system, characterized in that: include: A pre-detection module is used to perform appearance detection on the memory stick before inserting the memory stick into the slot array; The method is: Firstly, the qualified memory bars and the memory bars to be tested are photographed at multiple angles using a high-resolution camera, and the photographed images are converted into grayscale images; Next, the front, back and pin detail images corresponding to the qualified memory bar and the memory bar to be tested are respectively divided into sub-areas of the same size; Then, in each sub-region, the pixel values ​​of each pixel are obtained one by one, and then the average pixel value of all the pixels in each sub-region is calculated; Then, in the sub-region at the same position of the corresponding image, the difference value of the average pixel value is calculated, wherein the corresponding image refers to the corresponding front image between the qualified memory bar and the memory bar to be tested, or the corresponding back image between them, or the corresponding pin detail image between them; Finally, the difference value obtained from the sub-region at the same position of the corresponding image is compared with the preset pixel value difference threshold to determine whether there is a scratch in the sub-region.

2. A server motherboard memory bar plug-in and pull-out test system according to claim 1, characterized in that: The specific methods of appearance inspection are as follows: Step H.

1. Use a high-resolution camera to shoot the qualified memory bar and the memory bar to be tested at multiple angles, and obtain the front image sample, back image sample and pin detail image sample of the qualified memory bar, and obtain the front analysis image, back analysis image and pin detail analysis image of the memory bar to be tested, and then convert them into grayscale images; Step H.2, divide the area between the front image sample and the front analysis image, the area between the back image sample and the back analysis image, and the area between the detail image sample and the detail analysis image into sub-areas of the same size; Step H.3, in each sub-region, obtain the pixel value of each pixel point in each sub-region, and then calculate the average pixel value of all pixel points corresponding to each sub-region; Step H.4, select the front image sample and the front analysis image, then select the sub-regions corresponding to the same position, and mark the average pixel values ​​of the two sub-regions as Pu1 and Pu2 respectively; Then pass: PC=|Pu1-Pu2|; Calculate the difference value PC of the average pixel values ​​corresponding to the two sub-areas; Similarly, the difference values ​​of the average pixel values ​​in the corresponding sub-regions at the same position are calculated between the front image sample and the front analysis image, between the back image sample and the back analysis image, and between the detail image sample and the detail analysis image. Step H.5, compare each difference value with the preset pixel value difference threshold Cy: If PC>Cy, it is considered that there is a scratch in the sub-region; If PC≤Cy, it is considered that there is no scratch in the sub-region.

3. A server motherboard memory bar plug-in and pull-out test system according to claim 2, characterized in that: The sub-areas in Step H.2 are divided as follows: Selecting front image samples and front analysis images; The front image sample and the front analysis image are divided into m×n sub-regions of equal size using an equally spaced grid division method, and the size of each sub-region is W / m×H / n; Wherein, m represents the number of sub-regions divided in the horizontal direction of the image, n represents the number of sub-regions divided in the vertical direction of the image, and W and H represent the width and height of the image respectively.

4. A server motherboard memory bar plug-in and pull-out test system according to claim 1, characterized in that: Also includes: The test analysis module is used to obtain the contact resistance value between the memory stick and the slot after the mechanical plug-in module inserts the memory stick into the slot, and then perform contact status judgment based on the contact resistance value, wherein the contact status judgment is to compare the contact resistance value with a preset contact resistance threshold value to determine whether the memory stick is successfully inserted into the slot; after the memory stick is successfully inserted into the slot, a memory read and write test and a stability test of the memory stick are started; The memory read and write test is as follows: first write and read the preset read and write test data template, count the data bits before and after writing, compare them bit by bit to determine the error and correct data bits, calculate the error rate, and then compare it with the preset error rate threshold to determine whether the test result is abnormal; The stability test is as follows: obtain the total number of memory read and write test operations within the test cycle, count the number of errors based on the error rate of each memory read and write test, calculate the stability index, compare it with the preset stability index threshold, and determine whether the stability of the memory stick is qualified.

5. A server motherboard memory bar plug-in and pull-out test system according to claim 4, characterized in that: The contact status is determined as follows: The contact resistance value is marked as R, and then the preset contact resistance threshold Ry is extracted; When R<Ry, the contact state between the memory module and the slot is determined to be successfully inserted; Otherwise, the contact state between the memory module and the slot is determined to be insertion failure.

6. A server motherboard memory bar plug-in and pull-out test system according to claim 4, characterized in that: The memory read and write test method is as follows: Step F2.1.1, write a preset read / write test data template into the memory stick that has been successfully inserted into the slot, and then read the read / write test data template written into the memory stick; Step F2.1.2, at the same time, in the read-write test data template before writing, count the total number of data bits corresponding to all bytes and mark them as the total data bits; Step F2.1.3, then compare the read and write test data templates before and after writing, and determine the error data bit or the correct data bit based on the data comparison result; Step F2.1.4, then count the number of erroneous data bits according to the data comparison result, and mark them as the number of erroneous data bits; StepF2.1.5, then calculate the error rate of the read-write test data template after writing through the error rate calculation formula: error rate = (number of error data bits / total number of data bits) × 100%; Step F2.1.6, extract the preset error rate threshold, and compare its error rate with the error rate threshold, and determine whether the memory read and write test result of the memory stick is abnormal based on the comparison result.

7. A server motherboard memory bar plug-in and pull-out test system according to claim 6, characterized in that: In StepF2.1.3, the data comparison method is as follows: In the two read-write test data templates before and after writing, the data bits in each byte are compared one by one: If the data bit position at the same position is different in the read-write test data template before and after writing, the data bit is marked as an error data bit; If the data bit position at the same position is the same in the read-write test data template before and after writing, the data bit is marked as the correct data bit.

8. A server motherboard memory bar plug-in and pull-out test system according to claim 6, characterized in that: In StepF2.1.6: If the error rate is greater than the error rate threshold, it means that the memory read and write test of the memory module is abnormal; If the error rate is equal to the error rate threshold, it means that the memory read and write test of the memory module is normal.

9. A server motherboard memory bar plug-in and pull-out test system according to claim 4, characterized in that: The stability test method is as follows: StepF2.2.1, first obtain the number of memory read and write tests in the test cycle, and mark it as the total number of operations; Step F2.2.2, then count the number of errors that occur in the test, where the number of errors is determined based on the error rate obtained from the memory read and write test; Select a memory read and write test result; When the error rate obtained from the memory read / write test is 0, the number of errors in the test cycle remains unchanged; When the error rate obtained by the memory read and write test is greater than 0, the number of errors in the test cycle is accumulated and increased by 1; Step F2.2.3, then calculate the stability index of the memory stick during the test cycle by: stability index = [1-(number of errors / total number of operations)]; Step F2.2.4, extract the preset stability index threshold, and compare its stability index with the stability index threshold: If the stability index is greater than the stability index threshold, it means that the stability of the memory module is qualified; If the stability index is equal to the stability index threshold, it means that the stability of the memory module is unqualified.

10. A server motherboard memory bar plug-in and pull-out test system according to claim 4, characterized in that: Also includes: A mechanical plug-in module, used to perform the plug-in and pull-out operations of the memory stick; A sensor module is used to monitor the contact resistance between the memory module and the slot; The result display module is used to generate test reports based on the results obtained by the pre-detection module and the test analysis module and display them to relevant personnel.

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