FCT test fixture strain simulation method, device, electronic device and storage medium

Abstract

The present application relates to the field of fixture design technology and discloses a strain simulation method, apparatus, electronic device, and storage medium for an FCT test fixture. The method comprises obtaining an FCT test fixture model and a board model; wherein, in the FCT test fixture model, a plurality of elastic pressure bars are slidably arranged on an upper die along a first direction, and the upper die and the lower die are capable of relative movement along the first direction; configuring boundary settings and load settings; starting the simulation, and obtaining microstrain values ​​of the board during the relative movement of the upper die and the lower die along the first direction; determining that the FCT test fixture model fails the test if at least one microstrain value is greater than a set value; determining structural parameters of the FCT test fixture model that fails the test, adjusting the structural parameters, and simulating the adjusted FCT test fixture model again until the microstrain values ​​output after the simulation are all less than or equal to the set value; and improving the design cost and long design cycle of the board FCT test fixture.

Description

Technical Field

[0001] The present application relates to the field of fixture design technology, and in particular to a strain simulation method, device, electronic device, and storage medium for an FCT test fixture. Background Art

[0002] Server boards undergo various tests before leaving the factory. Functionality Compliance Testing (FCT) is a key test item before boards leave the factory. FCT testing is typically performed using an FCT fixture. The design of the FCT fixture is based on ensuring that the strain values ​​at the processing units on the board meet design requirements during testing.

[0003] In related technologies, during FCT testing, the board needs to be placed in an FCT test fixture, and various test connectors that are plugged into the connectors on the board are set in the FCT test fixture. Through mold opening and closing actions, the test connectors and the connectors on the board are plugged in and out to verify the functionality of the board. During the test, the board will receive the plugging and unplugging force of the test connectors and the supporting force and fixing force of the FCT test fixture, etc., which will cause strain on the board. The micro-strain around the processing unit on the board needs to be less than the design value. If the strain value in the area where the processing unit is located is greater than the design value, it will damage the processing unit, resulting in loss of function of the processing unit.

[0004] To prevent damage to the processing unit or loss of function, the FCT test fixture is usually manufactured and then a strain gauge is attached to the board for testing. The test fixture structure is then adjusted to ensure that the strain value around the processing unit is less than the set value during the board test. However, this process requires repeated mold opening and verification of the test fixture, resulting in high design costs and long design cycles for FCT test fixtures. Summary of the Invention

[0005] The present application provides a strain simulation method, device, electronic device and storage medium for an FCT test fixture to improve the problems of high design cost and long design cycle of board FCT test fixtures.

[0006] On the one hand, the present application provides a FCT test fixture strain simulation method, which is applied to simulation software, and the method includes:

[0007] Obtain the FCT test fixture model and board model;

[0008] The board model includes a plurality of connectors, and the FCT test fixture model includes: a lower mold, an upper mold, a plurality of elastic pressure rods and a plurality of test connectors. The board model is fixed on the lower mold, and the plurality of test connectors are arranged on the upper mold and plugged in one by one with the plurality of connectors. The plurality of elastic pressure rods are slidably arranged on the upper mold along a first direction, and the upper mold and the lower mold can move relative to each other along the first direction.

[0009] Configure the boundary settings and load settings of the FCT test fixture model and board model;

[0010] Starting a simulation, and obtaining microstrain values ​​generated at various parts of the board model during the relative movement of the upper die and the lower die along the first direction;

[0011] If at least one of the microstrain values ​​is greater than a set value, determining that the FCT test fixture model test fails;

[0012] Determining structural parameters of the FCT test fixture model that failed the test, adjusting the structural parameters, and simulating the adjusted FCT test fixture model again until the microstrain values ​​output after simulation are all less than or equal to the set value;

[0013] Wherein, the structural parameters include: the position and / or quantity of elastic pressure rods in the corresponding area on the board model for each micro-strain value greater than the set value.

[0014] In this embodiment, the stress conditions of the board in the FCT test fixture are simulated in simulation software, thereby simulating the strain distribution generated by the stress of the board in the FCT test fixture, so as to determine whether the FCT test fixture model test passes. For the FCT test fixture model that fails the test, its structural parameters are adjusted according to the microstrain value output by the simulation output, and the stress conditions of the board during the FCT test are changed. The simulation is re-performed until the microstrain values ​​meet the set values, thereby eliminating the risk of damage to the board by the FCT test fixture. The FCT test fixture can then be manufactured, which can greatly reduce the mold opening verification test of the FCT test fixture, reduce the design cost of the FCT test fixture, and shorten the design cycle.

[0015] In an optional embodiment, in the FCT test fixture model, a plurality of elastic gaskets are provided between the board model and the lower mold;

[0016] In the method, the structural parameters also include: the position and / or number of the elastic gaskets in the corresponding area on the board model for each microstrain value greater than the set value.

[0017] In an optional embodiment, the boundary setting configuration includes: an upward mold-closing displacement of the lower mold during the mold-closing process and a downward mold-opening displacement of the lower mold during the mold-opening process;

[0018] The load setting configuration includes: a compressive load applied by each elastic pressure rod to the board model during the mold closing process, a plugging load applied by each test connector to the connector on the board model during the mold closing process, a decompression load applied by each elastic pressure rod to the board model during the mold opening process, and a pull-out load applied by each test connector to the connector on the board model during the mold opening process;

[0019] During the mold closing process and the mold opening process of the upper mold and the lower mold, respectively obtaining microstrain values ​​generated at various parts of the board model;

[0020] The pressurizing load is a linear load that increases with the increase of the upward mold closing displacement, and the unloading load is a linear load that decreases with the increase of the downward mold opening displacement;

[0021] During the mold closing process, after the test connector contacts the connector, the insertion load is applied;

[0022] During the mold opening process, the pull-out load is applied when the test connector is plugged into the connector.

[0023] In an optional embodiment, the configuration process of the linear load is: establish a rigid as a main node at the position where the elastic pressure rod acts on the board model, establish a first beam unit on the main node, establish a second beam unit on the axis of the elastic pressure rod, establish a spring unit between the first beam unit and the second beam unit, the first beam unit is connected to the board model, and the second beam unit performs six degrees of freedom constraints.

[0024] In an optional embodiment, before configuring the boundary settings and load settings of the FCT test fixture model and the board model, the board is geometrically cleaned to remove components other than the processing unit and the connector;

[0025] And / or, before configuring the boundary settings and load settings of the FCT test fixture model and the board model, performing corner chamfering on the processing units on the board model.

[0026] In an optional embodiment, the method further includes:

[0027] Obtain the measured microstrain values ​​of each part of the board;

[0028] If at least one of the measured microstrain values ​​is greater than a set value, determining that the FCT test fixture model test of the sample fixture fails;

[0029] The sample fixture is a sample mold made using an FCT test fixture model that has passed simulation testing. The measured microstrain value is the microstrain value read by attaching a strain gauge to a plate, placing the plate in the sample fixture, and performing mold closing and opening actions.

[0030] Determine the structural parameters of the FCT test fixture model corresponding to the sample fixture that failed the test, adjust the structural parameters, and simulate the adjusted FCT test fixture model again until the measured microstrain values ​​are less than or equal to the set value.

[0031] In an optional embodiment, before the strain gauge is attached to the board, the processing unit on the board is chamfered, and the portion of the board from which the chamfers are removed is smoothed.

[0032] The present application also provides a board FCT test fixture simulation test device, the device comprising:

[0033] Acquisition module, used to obtain FCT test fixture model and board model;

[0034] The board model includes a plurality of connectors, and the FCT test fixture model includes: a lower mold, an upper mold, a plurality of elastic pressure rods and a plurality of test connectors. The board model is fixed on the lower mold, and the plurality of test connectors are arranged on the upper mold and plugged in one by one with the plurality of connectors. The plurality of elastic pressure rods are slidably arranged on the upper mold along a first direction, and the upper mold and the lower mold can move relative to each other along the first direction.

[0035] Configuration module, used to configure the boundary settings and load settings of the FCT test fixture model and board model;

[0036] A simulation module, configured to obtain microstrain values ​​generated at various parts of the board model during the relative movement of the upper die and the lower die along the first direction;

[0037] A judgment module, configured to judge whether the microstrain value is greater than a set value, so as to determine whether the FCT test fixture model test has passed;

[0038] an adjustment module, configured to determine structural parameters of the FCT test fixture model that failed the test, adjust the structural parameters, and simulate the adjusted FCT test fixture model again until the microstrain values ​​output after the simulation are all less than or equal to the set value;

[0039] Wherein, the structural parameters include: the position and / or quantity of elastic pressure rods in the corresponding area on the board model for each micro-strain value greater than the set value.

[0040] The present application also provides an electronic device, including a memory and a processor, wherein the memory and the processor are connected; the memory stores computer instructions, and the processor executes the FCT test fixture strain simulation method in any of the above-mentioned embodiments by executing the computer instructions.

[0041] The present application also provides a computer-readable storage medium having computer instructions stored thereon, wherein the computer instructions are used to enable a computer to execute the FCT test fixture strain simulation method in any one of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the specific implementation methods of this application or the technical solutions in related technologies, the following is a brief introduction to the drawings required for use in the specific implementation methods or related technical descriptions. Obviously, the drawings described below are some implementation methods of this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0043] Figure 1 This is a flow chart of a strain simulation method for an FCT test fixture according to an embodiment of the present application;

[0044] Figure 2 This is a schematic structural diagram of an FCT test fixture according to an embodiment of the present application;

[0045] Figure 3 A schematic diagram of a finite element model in a strain simulation method for an FCT test fixture according to an embodiment of the present application;

[0046] Figure 4 Schematic diagram of a linear load in a strain simulation method of an FCT test fixture according to an embodiment of the present application;

[0047] Figure 5 Schematic diagram of a finite element model after corner cutting in a strain simulation method of an FCT test fixture according to an embodiment of the present application;

[0048] Figure 6 Schematic diagram of the distribution of elastic gaskets in a strain simulation method for an FCT test fixture according to an embodiment of the present application;

[0049] Figure 7 This is a strain nephogram before optimization of a composite simulation in an embodiment of the present application;

[0050] Figure 8This is a schematic diagram of an optimized elastic pressure rod after a mold simulation according to an embodiment of the present application;

[0051] Figure 9 This is a schematic diagram of an optimized elastic gasket after a composite simulation according to an embodiment of the present application;

[0052] Figure 10 This is an optimized strain contour diagram of a composite simulation according to an embodiment of the present application;

[0053] Figure 11 This is a strain nephogram of an open-mold simulation in an embodiment of the present application;

[0054] Figure 12 The position of a strain gauge in a sample fixture according to an embodiment of the present application;

[0055] Figure 13 This is a schematic diagram of a strain simulation device for an FCT test fixture according to an embodiment of the present application;

[0056] Figure 14 A schematic diagram of an electronic device according to an embodiment of the present application;

[0057] Among them, 1. Board; 2. Upper mold; 3. Lower mold; 4. Elastic pressure rod; 5. Test connector; 6. Connector; 7. Elastic gasket; 8. Processing unit; 401. Elastic pointed pressure rod; 402. Elastic flat pressure rod;

[0058] 10. Processor; 20. Memory; 30. Input device; 40. Output device; 60. First beam unit; 70. Second beam unit; 80. Spring unit; 100. Acquisition module; 200. Configuration module; 300. Simulation module; 400. Judgment module; 500. Adjustment module. DETAILED DESCRIPTION

[0059] To make the purpose, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of this application.

[0060] In related technologies, during FCT testing, the board needs to be placed in an FCT test fixture, and various test connectors that are plugged into the connectors on the board are set in the FCT test fixture. Through mold opening and closing actions, the test connectors and the connectors on the board are plugged in and out to verify the functionality of the board. During the test, the board will receive the plugging and unplugging force of the test connectors and the supporting force and fixing force of the FCT test fixture, etc., which will cause strain on the board. The micro-strain around the processing unit on the board needs to be less than the design value. If the strain value in the area where the processing unit is located is greater than the design value, it will damage the processing unit, resulting in loss of function of the processing unit.

[0061] To prevent damage to the processing unit or loss of function, the FCT test fixture is usually manufactured and then a strain gauge is attached to the board for testing. The test fixture structure is then adjusted to ensure that the strain value around the processing unit is less than the set value during the board test. However, this process requires repeated mold opening and verification of the test fixture, resulting in high design costs and long design cycles for FCT test fixtures.

[0062] The present application provides a strain simulation method, device, electronic device and storage medium for an FCT test fixture to improve the problems of high design cost and long design cycle of board FCT test fixtures.

[0063] The following combination Figures 1 to 14 , describing the embodiments of the present application.

[0064] According to an embodiment of the present application, on the one hand, a FCT test fixture strain simulation method is provided, which is applied to simulation software, specifically, the simulation software is finite element software; Figure 1 As shown, the method includes:

[0065] Step S101: Obtain the FCT test fixture model and the board 1 model.

[0066] The board 1 model includes multiple connectors 6, such as Figure 2 As shown, the FCT test fixture model includes: a lower mold 3, an upper mold 2, multiple elastic pressure rods 4 and multiple test connectors 5. The board 1 model is fixed on the lower mold 3, and the multiple test connectors 5 are arranged on the upper mold 2, and are plugged in one by one with the multiple connectors 6. The multiple elastic pressure rods 4 are slidably arranged on the upper mold 2 along the first direction, and the upper mold 2 and the lower mold 3 can move relative to each other along the first direction. Specifically, the telescopic stroke of the elastic pressure rods 4 is greater than the plugging stroke of the test connector 5 and the connector 6.

[0067] Specifically, the board 1 model and the FCT test fixture model can be directly imported into the finite element software, or the board 1 and the FCT test fixture model can be directly modeled in the finite element software. The former is usually used.

[0068] Step S104: configuring the boundary settings and load settings of the FCT test fixture model and the board 1 model.

[0069] It should be noted that in this embodiment, finite element software is used for simulation, and the board 1 model needs to be divided into shell unit grids. The number of shell unit grids can be selected and set according to the size and type of the board 1. Specifically, the unit type can be set to C3D8I.

[0070] Specifically, the connector 6 and the processing unit 8 on the board 1 model are connected to the board 1 at a common node; the board 1 is connected to the lower mold 3 by bolts, and the material properties of the board 1 model, the elastic pressure rod 4 and the lower mold 3 are set so that the board 1 model, the elastic pressure rod 4 and the lower mold 3 are consistent with their actual weight to ensure the accuracy of the simulation; the processing unit 8 is a module with data calculation and processing such as a central processing unit and a microprocessor.

[0071] Step S105: starting the simulation, and obtaining microstrain values ​​generated at various parts of the board 1 model during the relative movement of the upper die 2 and the lower die 3 along the first direction.

[0072] Specifically, the upper mold 2 and the lower mold 3 move relative to each other along the first direction. The upper mold 2 can remain stationary and the lower mold 3 moves up and down to close and open the mold with the upper mold 2; or the lower mold 3 can remain stationary and the upper mold 2 moves up and down to close and open the mold with the lower mold 3. This embodiment adopts the former movement mode.

[0073] Specifically, the microstrain value may be expressed as a strain cloud diagram, or by dividing the board 1 model into regions and outputting corresponding microstrain values ​​according to the divided regions, or other methods may be used.

[0074] Step S106: If there is at least one microstrain value greater than the set value, it is determined that the FCT test fixture model test fails.

[0075] Specifically, the set value is 450 microstrain. If the strain in the area where the processing unit 8 on the board 1 is located is higher than 450 microstrain, there is a risk of damaging the processing unit 8.

[0076] Step S107: determining the structural parameters of the FCT test fixture model that failed the test, adjusting the structural parameters, and simulating the adjusted FCT test fixture model again until the microstrain values ​​output after simulation are all less than or equal to the set value.

[0077] The structural parameters include: the position and / or quantity of the elastic pressure rods 4 in the corresponding area on the board 1 model for each micro-strain value greater than a set value.

[0078] Specifically, the position and / or number of the elastic pressure bars 4 can be adjusted by simply removing or increasing the number of the elastic pressure bars 4, or by moving the positions of the elastic pressure bars 4. Of course, both can also be combined and adjusted simultaneously.

[0079] In this embodiment, if Figure 1 As shown, by simulating the stress conditions of the board 1 in the FCT test fixture in the simulation software, the strain distribution generated by the stress of the board 1 in the FCT test fixture is simulated to determine whether the FCT test fixture model test passes. For the FCT test fixture model that fails the test, its structural parameters are adjusted according to the microstrain value output by the simulation output, and the stress conditions of the board 1 during the FCT test process are changed. The simulation is re-performed until the microstrain values ​​meet the set values, thereby eliminating the risk of damage to the board 1 by the FCT test fixture. The FCT test fixture can then be manufactured, which can greatly reduce the mold opening verification test of the FCT test fixture, reduce the design cost of the FCT test fixture, and shorten the design cycle.

[0080] In one embodiment, Figure 2 As shown, in the FCT test fixture model, multiple elastic gaskets 7 are arranged between the board card 1 model and the lower mold 3; in the FCT test fixture strain simulation method, the structural parameters also include: the position and / or number of the elastic gasket 7 in the corresponding area on the board card 1 model for each microstrain value greater than the set value.

[0081] Specifically, such as Figure 6 As shown, multiple elastic gaskets 7 are dispersedly arranged between the board card 1 model and the lower mold 3, and are not overlapped along the first direction. The elastic pads are specifically rubber pads; the thickness of the elastic gasket 7 is slightly smaller than the distance between the board card 1 model and the lower mold 3.

[0082] It is worth noting that the position and / or number of the elastic gaskets 7 can be adjusted by simply removing or increasing the number of the elastic gaskets 7, or by moving the position of the elastic gaskets 7. Of course, both can also be combined and adjusted simultaneously.

[0083] In this embodiment, if Figure 2 As shown, by setting an elastic gasket 7 between the board 1 model and the lower mold 3, the force between the board 1 and the lower mold 3 can be changed, which increases the influencing factors for improving the strain adjustment of the board 1. By changing the material, thickness, position and number of the gasket, the strain of the board 1 during the FCT test can be improved to meet the design requirements.

[0084] In one embodiment, in step S104 , the boundary setting configuration includes: an upward mold-closing displacement of the lower mold 3 during the mold-closing process and a downward mold-opening displacement of the lower mold 3 during the mold-opening process.

[0085] Specifically, the distance of the upward mold clamping displacement is 9-15 mm, which can be any one of 9 mm, 10 mm, 11 mm, 12 mm, 13 mm, 14 mm and 15 mm, and is preferably 9 mm.

[0086] The distance of the downward mold opening displacement is 9~15mm, which can be any one of 9mm, 10mm, 11mm, 12mm, 13mm, 14mm and 15mm, and is preferably 9mm.

[0087] The load setting configuration includes: a compressive load applied by each elastic pressure rod 4 to the board card 1 model during the mold closing process, a plugging load applied by each test connector 5 to the connector 6 on the board card 1 model during the mold closing process, a decompression load applied by each elastic pressure rod 4 to the board card 1 model during the mold opening process, and a pull-out load applied by each test connector 5 to the connector 6 on the board card 1 model during the mold opening process.

[0088] Among them, the pressurizing load is a linear load that increases with the increase of the upward mold closing displacement. The pressurizing load is a linear load, which is consistent with the actual situation that the elastic pressure rod 4 gradually increases the pressure applied to the board 1 during the mold closing process; the unloading load is a linear load that decreases with the increase of the downward mold opening displacement. The unloading load is a linear load, which is consistent with the actual situation that the elastic pressure rod 4 gradually decreases the pressure applied to the board 1 during the mold opening process.

[0089] During the mold closing process, after the test connector 5 and the connector 6 come into contact, an insertion load is applied; during the mold opening process, when the test connector 5 and the connector 6 are in the plugged state, an extraction load is applied, that is, after the test connector 5 and the connector 6 are separated, the extraction load is stopped.

[0090] It should be noted that the plug-in load refers to the load applied by the measuring plug connector on the upper mold 2 to the connector 6 on the board 1 during the mold closing process of the upper mold 2; the pull-out load refers to the load applied by the measuring plug connector on the upper mold 2 to the connector 6 on the board 1 during the mold opening process of the upper mold 2.

[0091] The specific configuration process of the above load application method in the finite element software is as follows:

[0092] The upward mold closing displacement includes a continuous first displacement step and a second displacement step, and the pressurized load includes a first load and a second load; wherein, in the first displacement step, as the lower mold 3 moves upward, a first load is applied to the board 1; in the second displacement step, as the lower mold 3 moves upward, a second load is applied to the board 1, and at the same time, a plug-in load is applied to the connector 6 on the board 1.

[0093] The downward mold opening displacement includes a third displacement step and a fourth displacement step, and the pressure relief load includes a third load and a fourth load; wherein, in the third displacement step, as the lower mold 3 moves downward, the third load is applied to the board 1, and at the same time, a pull-out load is applied to the connector 6 on the board 1; in the fourth displacement step, as the lower mold 3 moves downward, the fourth load is applied to the board 1.

[0094] It should be noted that the plug-in load refers to the load applied by the measuring plug connector on the upper mold 2 to the connector 6 on the board 1 during the mold closing process of the upper mold 2; the pull-out load refers to the load applied by the measuring plug connector on the upper mold 2 to the connector 6 on the board 1 during the mold opening process of the upper mold 2.

[0095] It should be explained that the first load and the second load are respectively part of the pressurization load, and the load values ​​therebetween are linearly continuous; similarly, the third load and the fourth load are respectively part of the decompression load, and the load values ​​therebetween are linearly continuous.

[0096] Specifically, if the pressure load gradually increases from 0 to 20N during the mold closing process, the first load is 0 to 12N, and the second load is 12N to 20N; if the pressure relief load gradually decreases from 20N to 0 during the mold closing process, the first load is 20N to 12N, and the second load is 12N to 0.

[0097] In step S105 , during the mold closing process and the mold opening process of the upper mold 2 and the lower mold 3 , microstrain values ​​generated at various parts of the board 1 model are respectively obtained.

[0098] In this embodiment, during the mold closing process, an upward mold closing displacement is set for the lower mold 3, and a pressure load is applied at the action position of the elastic pressure rod 4 on the board 1, and the pressure load increases linearly with the increase of the upward mold closing displacement. This can more realistically simulate the board 1 during the mold closing process, and the pressure applied by the elastic pressure rod 4 to it gradually increases with the change of the upward mold closing displacement, thereby improving the accuracy of the strain measurement value of the board 1.

[0099] By setting a downward mold opening displacement for the lower mold 3 of the fixture during the mold opening process, and applying a pressure relief load at the action position of the elastic pressure rod 4 on the board 1, and the pressure relief load decreases linearly with the downward mold opening displacement, it can more realistically simulate the board 1 during the mold opening process, and the pressure applied by the elastic pressure rod 4 on it gradually decreases with the change of the downward mold opening displacement, thereby further improving the accuracy of the strain measurement value of the board 1.

[0100] At the same time, by outputting the microstrain values ​​of various parts of the board 1 during the mold closing process and the mold opening process of the FCT test fixture, the microstrain values ​​of various parts of the board 1 are compared with the set values. Since the factors affecting the strain of the board 1 during the mold closing process and the mold opening process are different, the microstrain values ​​of various parts of the board 1 are output during the mold closing process and the mold opening process of the FCT test fixture. It can be directly judged whether the microstrain value of the board 1 is greater than the set value during the mold closing process or the mold opening process. Therefore, according to the corresponding area of ​​the microstrain value greater than the set value on the board 1, combined with the influencing factors during the mold closing process or the mold opening process, analysis can be performed. The reason why the microstrain value is greater than the set value can be found faster and more accurately, the number of strain simulation cycles can be reduced, and the simulation time can be reduced.

[0101] In some implementations not shown, the insertion load is applied throughout the first and second displacement steps, and the extraction load is applied throughout the third and fourth displacement steps. The simulation results of this simulation setting have large deviations.

[0102] In a specific embodiment, Figure 4 As shown, the configuration process of the linear load is as follows: a rigid is established as a main node at the position where the elastic pressure rod 4 acts on the board 1 model, and a first beam unit 60 is established on the main node, wherein the beam unit is a finite element unit for simulating beam structures; a second beam unit 70 is established on the axis of the elastic pressure rod 4, and a spring unit 80 is established between the first beam unit 60 and the second beam unit 70, wherein spring is an open source application framework; the first beam unit 60 is connected to the board 1 model, and the second beam unit 70 performs six degrees of freedom constraints.

[0103] Specifically, the type of the first beam unit 60 and the second beam unit 70 is B31 (a type of beam unit in abaqus software), and the type of the spring unit 80 is SPRINGA (a type of spring unit 80 in abaqus software); the stiffness properties of the spring unit 80 can be set according to the actual situation of the elastic pressure rod 4.

[0104] In this embodiment, if Figure 4 As shown, by setting the first beam unit 60, the spring unit 80 and the second beam unit 70 at the position where the elastic pressure rod 4 acts on the board 1 model along the axial direction of the elastic pressure rod 4, and connecting the first beam unit 60 to the board 1, and the second beam unit 70 performing six degrees of freedom constraints, the linear load of the elastic pressure rod 4 on the board 1 model is simulated. This method is simple and has a high degree of simulation, which can improve the accuracy of the simulation results.

[0105] In one embodiment, the pull-out load is configured as a fifth load and a sixth load that are applied continuously, wherein the fifth load is the load on the test connector 5 and the connector 6 in a static friction state, and the sixth load is the load on the test connector 5 and the connector 6 in a dynamic friction state. The fifth load and the sixth load can be set according to the actual measurement results of the test connector 5 and the connector 6. The displacement of the fifth load can be set to 0.1mm~0.5mm, specifically any one of 0.1mm, 0.2mm, 0.3mm, 0.4mm and 0.5mm, preferably 0.1mm or 0.2mm.

[0106] In this embodiment, the pull-out load is divided into a fifth load and a sixth load to represent the loads of the test connector 5 and the connector 6 in the static friction state and the dynamic friction state, respectively, so that the force exerted by the test connector 5 on the connector 6 during the mold opening process can be truly simulated, thereby further improving the simulation results.

[0107] In one embodiment, step S102 : before configuring the boundary settings and load settings of the FCT test fixture model and the board 1 model, perform geometric cleaning on the board 1 to remove components other than the processing unit 8 and the connector 6 .

[0108] By removing geometric cleanup and other components, the simulation process can be simplified and simulation efficiency can be improved without affecting the accuracy of the simulation results.

[0109] And / or, step S103: before configuring the boundary setting and load setting of the FCT test fixture model and the board 1 model, performing corner chamfering on the processing unit 8 on the board 1 model.

[0110] Specifically, the corner chamfering treatment is to chamfer the sharp corners on the side of the processing unit 8, so as to reduce the strain influence of the corners of the processing unit 8 on the board 1, expand the strain of the board 1 at the corners of the processing unit 8, and make better requirements on the strain of the corners of the processing unit 8, so as to eliminate the risk of damage at the corners of the processing unit 8 as much as possible.

[0111] It is worth noting that the execution order of step S102 and step S103 can be replaced, that is, step S103 can be performed first, and then step S102; steps S101~S103 can be performed in the finite element software hypermesh, and the file format of the output finite element model can be an inp file. Of course, depending on the type of processing software, it can also be stored as other types of files; steps S104~S107 can be performed in the strain simulation software abaqus.

[0112] In one embodiment, the method further comprises:

[0113] Step S108: obtaining the measured microstrain values ​​of various parts of the board 1.

[0114] Step S109: If at least one measured microstrain value is greater than the set value, it is determined that the FCT test fixture model test of the sample fixture fails.

[0115] Among them, the sample fixture is a sample mold made using the FCT test fixture model that has passed the simulation test. The measured microstrain value is the microstrain value read after a strain gauge is attached to the board 1 and the board 1 is placed in the sample fixture to perform mold closing and mold opening actions.

[0116] Specifically, the sample fixture is a sample of the FCT test fixture that is 3D printed or simply fixed. It is not a finished test mold and does not have any testing function. It can only be used to test the stress conditions of the board 1 during the test process. The sample fixture also includes an elastic gasket, which is part of the FCT test fixture.

[0117] Step S110: determining the structural parameters of the FCT test fixture model corresponding to the sample fixture that failed the test, adjusting the structural parameters, and simulating the adjusted FCT test fixture model again until the measured microstrain values ​​are all less than or equal to the set values.

[0118] In this embodiment, the measured microstrain value is obtained and compared with the set value to determine whether the FCT test fixture model for making the sample fixture has passed the test. The structural parameters of the FCT test fixture model corresponding to the sample fixture that failed the test are adjusted, and the simulation is performed again until the measured microstrain values ​​are less than or equal to the set value. This not only verifies the accuracy of the simulation results, but also avoids the risk of damage to the processing unit 8 as much as possible, thereby reducing the development cycle of the FCT test fixture.

[0119] In a specific embodiment, Figure 5 As shown, before the strain gauge is pasted on the board 1, the processing unit 8 on the board 1 is chamfered, and the part of the board 1 where the chamfer is removed is smoothed; in this embodiment, by performing the chamfering process, the strain gauge pasted on the board 1 can be closer to the deformation position of the processing unit 8, making the measured microstrain value more accurate.

[0120] The solution in this application is described in detail below in conjunction with a specific simulation process.

[0121] In one embodiment, a strain simulation method for an FCT test fixture is provided, which is applied to simulation software. Specifically, the simulation software is finite element software HyperMesh and strain simulation software Abaqus. The method includes:

[0122] Step 1: Obtain the FCT test fixture model and the board 1 model and import them into the finite element software hypermesh; corresponding to step S101 in the above method.

[0123] Among them, such as Figure 2 As shown, the board 1 model includes multiple connectors 6, and the FCT test fixture model includes: a lower mold 3, an upper mold 2, multiple elastic gaskets 7, multiple elastic pressure rods 4 and multiple test connectors 5. The board 1 model is fixed on the lower mold 3, and multiple test connectors 5 are arranged on the upper mold 2, and are plugged in one by one with multiple connectors 6. Multiple elastic pressure rods 4 are slidably arranged on the upper mold 2 along a first direction, and the upper mold 2 and the lower mold 3 can move relative to each other along the first direction. Multiple elastic gaskets 7 are arranged between the board 1 model and the lower mold 3. Specifically, the telescopic stroke of the elastic pressure rod 4 is greater than the plug-in stroke of the test connector 5 and the connector 6.

[0124] Specifically, such as Figure 3 As shown, the lower mold 3 is a tray; the number of elastic pressure rods 4 is 52, wherein the elastic pressure rods 4 include elastic flat pressure rods 402 (solid circles in the figure) and elastic pointed pressure rods 401 (hollow circles in the figure). The difference between the two is that the contact area between the elastic flat pressure rods 402 and the board 1 is larger than the contact area between the elastic pointed pressure rods 401 and the board 1; Figure 6 As shown, the number of the elastic gaskets 7 is 28, and the elastic gaskets 7 are specifically rubber sheets.

[0125] like Figure 3 As shown, the adopted board 1 is provided with 4 processing units 8 and 21 connectors 6 .

[0126] Step 2: Perform geometric cleaning on the board 1 to remove components other than the processing unit 8 and the connector 6; this corresponds to step S102 in the above method.

[0127] Step 3: performing corner chamfering on the processing unit 8 on the board 1 model; corresponding to step S103 in the above method.

[0128] The four corners of the four processing units 8 on the board 1 are chamfered. Since two processing units 8 are too close to each other, only one corner of each is chamfered.

[0129] Step 4: Configure the boundary settings and load settings of the FCT test fixture model and the board 1 model; corresponding to step S104 in the above method.

[0130] The specific configuration process is as follows: Select Static General, connect the lower surface of elastic gasket 7 to the tray tie, and establish surface-to-surface contact between the upper surface of elastic gasket 7 and the board 1 model.

[0131] Perform shell element meshing on the board 1 model, set the element type to C3D8I, set the material properties of the board 1 model, elastic gasket 7 and lower mold 3, and output the file format to inp file.

[0132] like Figure 4 As shown in the figure, the configuration process of the linear load is as follows: a rigid is established as the main node at the position where the elastic pressure rod 4 acts on the board 1 model, a first beam unit 60 is established on the main node, a second beam unit 70 is established on the axis of the elastic pressure rod 4, a spring unit 80 is established between the first beam unit 60 and the second beam unit 70, the first beam unit 60 is connected to the board 1, and the second beam unit 70 performs six degrees of freedom constraints.

[0133] The following is the simulation process during mold closing:

[0134] The upward mold closing displacement of the lower mold 3 is set to 9mm; the pressure load applied to the action position of the elastic pressure rod 4 on the board 1 model is increased from 0 to 20N, and the stiffness property of the spring unit 80 is 2.22N / mm; and a plug-in load is applied to the position of the connector 6 on the board 1 model.

[0135] Specifically, the upward mold clamping displacement includes a continuous first displacement step (specifically 0 to 5 mm) and a second displacement step (specifically 5 mm to 9 mm), and the pressurizing load includes a first load (specifically 0 to 11.1 N) and a second load (specifically 11.1 N to 20 N).

[0136] Step 5: Start the simulation. During the mold closing process between the upper mold 2 and the lower mold 3, obtain the microstrain values ​​generated in each part of the board 1 model, specifically the mold closing strain cloud diagram, such as Figure 7 As shown; corresponding to step S105 in the above method.

[0137] Step 6: Analyze the mold strain cloud diagram, such as Figure 7 As shown, it can be seen that the strain of the processing unit 8 indicated by the arrow in the figure exceeds 450 microstrain (the design requirement is not more than 450 microstrain), and the FCT test fixture model fails; this corresponds to step S106 in the above method.

[0138] Step 7: Remove the elastic pressure rod 4 in the box, as shown in Figure 8 As shown, two rubber pads are added below the corresponding connector 6, as shown Figure 9 Then perform simulation again to get the simulation cloud diagram, as shown in Figure 10 As shown, it can be seen that the microstrain around the four processing units 8 is less than 450, and the FCT test fixture model passes; this corresponds to step S107 in the above method.

[0139] The following is the simulation process during mold opening:

[0140] The downward mold opening displacement of the lower mold 3 is set to a compression of 9mm; a pressure relief load is applied to the action position of the elastic pressure rod 4 on the board 1 model from 20N to 0, and the stiffness property of the spring unit 80 is 2.22N / mm; a pull-out load is applied to the position of the connector 6 on the board 1 model.

[0141] Specifically, the downward mold opening displacement includes a continuous third displacement step (specifically, compression 9mm to compression 5mm) and a fourth displacement step (specifically, compression 5mm to 0), and the pressure relief load includes a third load (specifically, 20N to 11.1N) and a fourth load (specifically, 11.1N to 0).

[0142] Step 8: Start the simulation. During the mold opening process of upper mold 2 and lower mold 3, obtain the microstrain values ​​generated in various parts of the board 1 model, specifically the mold closing strain cloud diagram, such as Figure 11 As shown; corresponding to step 5 in the above method.

[0143] Step 9: Analyze the mold opening strain cloud diagram, such as Figure 11 As shown, it can be seen that the microstrains around the four processing units 8 are all less than 450, so the FCT test fixture model passes and there is no need to perform S107.

[0144] Step S108: obtaining the measured microstrain values ​​of various parts of the board 1; corresponding to step S106 in the above method.

[0145] Specifically, a sample jig is made for the FCT test jig model whose strain values ​​after the above-mentioned closed-mold simulation and open-mold simulation are both less than the set value; the processing unit 8 on the board 1 is chamfered; and the part of the board 1 where the chamfer is removed is smoothed and then a strain gauge is attached, such as Figure 12 As shown, strain gauges are pasted on 14 corner cuts in the four processing units 8; mold closing and mold opening actions are performed, and strain values ​​are read respectively, as shown in the following table.

[0146]

[0147] Step 10: By comparing the microstrain values ​​output by the simulation with the measured microstrain values, it can be seen that the measured microstrain values ​​are all less than the set values, and the FCT test fixture model corresponding to the sample fixture passes; this corresponds to step S101 in the above method; therefore, there is no need to perform steps S109 and S110 in the above method.

[0148] The benchmarking accuracy is above 80%, with an average benchmarking accuracy of up to 85%. The simulation data is consistent with the measured data, indicating that the simulation in this application scheme can accurately simulate the strain value during the FCT test.

[0149] The embodiment of the present invention also provides a board FCT test fixture simulation test device, such as Figure 13 As shown, including:

[0150] The acquisition module 100 is used to acquire an FCT test fixture model and a board card 1 model; wherein the board card 1 model includes multiple connectors 6, and the FCT test fixture model includes: a lower mold 3, an upper mold 2, multiple elastic pressure rods 4 and multiple test connectors 5. The board card 1 model is fixed on the lower mold 3, and the multiple test connectors 5 are arranged on the upper mold 2 and are plugged into and correspond to the multiple connectors 6 one by one. The multiple elastic pressure rods 4 are slidably arranged on the upper mold 2 along a first direction, and the upper mold 2 and the lower mold 3 can move relative to each other along the first direction.

[0151] The configuration module 200 is used to configure the boundary settings and load settings of the FCT test fixture model and the board 1 model.

[0152] The simulation module 300 is used to obtain microstrain values ​​generated at various parts of the board 1 model during the relative movement of the upper die 2 and the lower die 3 along the first direction.

[0153] The judgment module 400 is used to judge whether the microstrain value is greater than a set value to determine whether the FCT test fixture model test has passed.

[0154] An adjustment module 500 is configured to determine the structural parameters of the FCT test fixture model that failed the test, adjust the structural parameters, and simulate the adjusted FCT test fixture model again until the microstrain values ​​output after simulation are all less than or equal to the set value. The structural parameters include the position and / or number of elastic pressure rods in the corresponding area on the board model for each microstrain value greater than the set value.

[0155] In one embodiment, the acquisition module 100 is further configured to acquire measured microstrain values ​​of various parts of the board 1 .

[0156] In one embodiment, the judgment module 400 is further configured to judge whether the measured microstrain value is greater than a set value, and determine whether the FCT test fixture model test of the sample fixture has passed.

[0157] In one embodiment, the adjustment module 500 is further used to determine the structural parameters of the FCT test fixture model corresponding to the sample fixture that failed the test, adjust the structural parameters, and simulate the adjusted FCT test fixture model again until the measured microstrain values ​​are less than or equal to the set values.

[0158] The further functional description of each of the above modules and units is the same as that of the above corresponding embodiments and will not be repeated here.

[0159] An embodiment of the present invention further provides an electronic device having the above Figure 13 The FCT test fixture strain simulation device shown.

[0160] See also Figure 14 , is a schematic diagram of the structure of an electronic device provided by an optional embodiment of the present invention, the electronic device comprising: one or more processors 10, a memory 20, and interfaces for connecting the various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other by means of different buses for communication, and can be installed on a common mainboard or in other ways as needed. The processor can process instructions executed within the electronic device, including instructions stored in or on the memory to display graphical information of a GUI on an external input / output device (such as a display device coupled to the interface).

[0161] In some optional embodiments, multiple processors and / or multiple buses can be used with multiple memories and multiple storages if desired. Similarly, multiple electronic devices can be connected, with each device providing part of the necessary operations (e.g., as a server array, a group of blade servers, or a multi-processor system). Figure 14 A processor 10 is taken as an example.

[0162] The processor 10 may be a central processing unit, a network processor, or a combination thereof. The processor 10 may further include a hardware chip. The hardware chip may be an application-specific integrated circuit, a programmable logic device, or a combination thereof. The programmable logic device may be a complex programmable logic device, a field programmable gate array, a general purpose array logic, or any combination thereof.

[0163] The memory 20 stores instructions that can be executed by at least one processor 10, so that the at least one processor 10 executes the FCT test fixture strain simulation method shown in the above embodiment.

[0164] The memory 20 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and applications required for at least one function; the data storage area may store data created based on the use of the electronic device, etc. In addition, the memory 20 may include a high-speed random access memory and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some optional embodiments, the memory 20 may include a memory remotely located relative to the processor 10, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0165] The memory 20 may include a volatile memory, such as a random access memory; the memory may also include a non-volatile memory, such as a flash memory, a hard disk or a solid-state drive; the memory 20 may also include a combination of the above types of memory.

[0166] The electronic device further includes an input device 30 and an output device 40. The processor 10, the memory 20, the input device 30 and the output device 40 may be connected via a bus or other means. Figure 14 The bus connection is taken as an example.

[0167] The input device 30 can receive input digital or character information and generate key signal input related to user settings and function control of the electronic device. Examples include a touch screen, keypad, mouse, trackpad, touchpad, pointer, one or more mouse buttons, trackball, joystick, etc. The output device 40 may include a display device, auxiliary lighting devices (e.g., LEDs), and tactile feedback devices (e.g., vibration motors). Such display devices include, but are not limited to, liquid crystal displays, light emitting diodes, monitors, and plasma displays. In some optional embodiments, the display device may be a touch screen.

[0168] An embodiment of the present invention also provides a computer-readable storage medium, and the above-mentioned method according to the embodiment of the present invention can be implemented in hardware, firmware, or implemented as a computer code that can be recorded on a storage medium, or downloaded via a network and originally stored in a remote storage medium or a non-temporary machine-readable storage medium and will be stored in a local storage medium, so that the method described herein can be stored in such software processing on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware.

[0169] The storage medium may be a magnetic disk, an optical disk, a read-only memory, a random access memory, a flash memory, a hard disk, or a solid-state drive, etc.; further, the storage medium may include a combination of the aforementioned types of memory. It is understood that a computer, a processor, a microprocessor controller, or programmable hardware includes a storage component that can store or receive software or computer code. When the software or computer code is accessed and executed by the computer, processor, or hardware, the methods shown in the above embodiments are implemented.

[0170] Although the embodiments of the present application have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations shall fall within the scope defined by the appended claims.

Claims

1. A strain simulation method for an FCT test fixture, characterized in that: Applied to simulation software, the method includes: Obtain the FCT test fixture model and board model; The board model includes a plurality of connectors, and the FCT test fixture model includes: a lower mold, an upper mold, a plurality of elastic pressure rods and a plurality of test connectors. The board model is fixed on the lower mold, and the plurality of test connectors are arranged on the upper mold and plugged in one by one with the plurality of connectors. The plurality of elastic pressure rods are slidably arranged on the upper mold along a first direction, and the upper mold and the lower mold can move relative to each other along the first direction. Configure the boundary settings and load settings of the FCT test fixture model and board model; Starting a simulation, and obtaining microstrain values ​​generated at various parts of the board model during the relative movement of the upper die and the lower die along the first direction; If at least one of the microstrain values ​​is greater than a set value, determining that the FCT test fixture model test fails; Determine the structural parameters of the FCT test fixture model that failed the test, adjust the structural parameters, and simulate the adjusted FCT test fixture model again until the microstrain values ​​output after simulation are all less than or equal to the set value; wherein the structural parameters include: the position and / or number of elastic pressure rods in the corresponding area on the board model for each microstrain value greater than the set value.

2. The FCT test fixture strain simulation method according to claim 1, characterized in that: In the FCT test fixture model, a plurality of elastic gaskets are provided between the board model and the lower mold; In the method, the structural parameters also include: the position and / or number of the elastic gaskets in the corresponding area on the board model for each microstrain value greater than the set value.

3. The FCT test fixture strain simulation method according to claim 1, characterized in that: The boundary setting configuration includes: an upward mold-closing displacement of the lower mold during the mold-closing process and a downward mold-opening displacement of the lower mold during the mold-opening process; The load setting configuration includes: a compressive load applied by each elastic pressure rod to the board model during the mold closing process, a plugging load applied by each test connector to the connector on the board model during the mold closing process, a decompression load applied by each elastic pressure rod to the board model during the mold opening process, and a pull-out load applied by each test connector to the connector on the board model during the mold opening process; During the mold closing process and the mold opening process of the upper mold and the lower mold, respectively obtaining microstrain values ​​generated at various parts of the board model; The pressurizing load is a linear load that increases with the increase of the upward mold closing displacement, and the unloading load is a linear load that decreases with the increase of the downward mold opening displacement; During the mold closing process, after the test connector contacts the connector, the insertion load is applied; During the mold opening process, the pull-out load is applied when the test connector is plugged into the connector.

4. The FCT test fixture strain simulation method according to claim 3, characterized in that: The configuration process of the linear load is as follows: a rigid is established as a main node at the position where the elastic pressure rod acts on the board model, a first beam unit is established on the main node, a second beam unit is established on the axis of the elastic pressure rod, a spring unit is established between the first beam unit and the second beam unit, the first beam unit is connected to the board model, and the second beam unit performs six degrees of freedom constraints.

5. The FCT test fixture strain simulation method according to any one of claims 1 to 4, characterized in that: Before configuring the boundary settings and load settings of the FCT test fixture model and the board model, perform geometric cleaning on the board to remove components other than the processing unit and connectors; And / or, before configuring the boundary settings and load settings of the FCT test fixture model and the board model, performing corner chamfering on the processing units on the board model.

6. The FCT test fixture strain simulation method according to any one of claims 1 to 4, characterized in that: The method further comprises: Obtain the measured microstrain values ​​of each part of the board; If at least one of the measured microstrain values ​​is greater than a set value, determining that the FCT test fixture model test of the sample fixture fails; The sample fixture is a sample mold made using an FCT test fixture model that has passed simulation testing. The measured microstrain value is the microstrain value read by attaching a strain gauge to a plate, placing the plate in the sample fixture, and performing mold closing and opening actions. Determine the structural parameters of the FCT test fixture model corresponding to the sample fixture that failed the test, adjust the structural parameters, and simulate the adjusted FCT test fixture model again until the measured microstrain values ​​are less than or equal to the set value.

7. The FCT test fixture strain simulation method according to claim 6, characterized in that: Before the strain gauge is attached to the board, the processing unit on the board is chamfered and the part where the chamfer is removed is smoothed.

8. A board FCT test fixture simulation test device, characterized in that: The device comprises: An acquisition module is configured to acquire an FCT test fixture model and a board model; wherein the board model includes a plurality of connectors, and the FCT test fixture model includes: a lower mold, an upper mold, a plurality of elastic pressure rods, and a plurality of test connectors; the board model is fixed to the lower mold, the plurality of test connectors are disposed on the upper mold and are plugged in one-to-one with the plurality of connectors; the plurality of elastic pressure rods are slidably disposed on the upper mold along a first direction, and the upper mold and the lower mold are capable of relative movement along the first direction; Configuration module, used to configure the boundary settings and load settings of the FCT test fixture model and board model; A simulation module, configured to obtain microstrain values ​​generated at various parts of the board model during the relative movement of the upper die and the lower die along the first direction; A judgment module, configured to judge whether the microstrain value is greater than a set value, so as to determine whether the FCT test fixture model test has passed; an adjustment module, configured to determine structural parameters of the FCT test fixture model that failed the test, adjust the structural parameters, and simulate the adjusted FCT test fixture model again until the microstrain values ​​output after the simulation are all less than or equal to the set value; Wherein, the structural parameters include: the position and / or quantity of elastic pressure rods in the corresponding area on the board model for each micro-strain value greater than the set value.

9. An electronic device, characterized in that: comprising a memory and a processor, wherein the memory and the processor are connected; The memory stores computer instructions, and the processor executes the FCT test fixture strain simulation method according to any one of claims 1 to 7 by executing the computer instructions.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a computer to execute the FCT test fixture strain simulation method according to any one of claims 1 to 7.

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