Vibration-driven integrated driver for flexible electrode implantation and its driving method

Abstract

The present invention provides a vibration-driven integrated driver for flexible electrode implantation and its driving method, belonging to the field of piezoelectric drive technology. It includes a driving block, the driving block includes a first clamping part and a second clamping part, a piezoelectric stack part is arranged between the first clamping part and the second clamping part, a position-fixed clamping mechanism and a position-movable clamping mechanism are respectively arranged on the first clamping part and the second clamping part, the position of the first clamping part is fixed to the driving block, and the second clamping part is driven by the piezoelectric stack part in the driving block to move in the direction away from or close to the first clamping part. Compared with the method of implanting flexible electrodes using auxiliary tools, the implantation volume is greatly reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of piezoelectric drive, and relates to a driver, in particular to a vibration-driving integrated driver for implanting flexible electrodes. Background Art

[0002] Brain-computer interface, the core technology of brain science research, refers to the technology of establishing a connection channel between the brain and external devices to achieve information interaction. In recent years, breakthrough research progress in this technology has been made in various fields at home and abroad. Based on the location and method of collecting bioelectrical signals, brain-computer interfaces can be divided into two categories: implantable and non-implantable. Implantable flexible electrodes have the following characteristics:

[0003] Low invasiveness: Flexible electrodes usually have the characteristics of being ultra-thin and highly flexible, which can reduce damage to brain tissue and lower the surgical risk;

[0004] High signal quality: Flexible electrodes can stably collect high-throughput neuron signals in deep brain regions, providing a more accurate basis for diagnosis and treatment;

[0005] Versatility: Some flexible electrodes are not only used for signal acquisition but also can perform stimulation functions, further expanding their applications in medicine.

[0006] Due to the ultra-thin and highly flexible characteristics of flexible electrodes, flexible electrodes do not have the implant stiffness, and are at risk of buckling and rupture during the implantation process, which is likely to cause secondary implantation damage. Therefore, other means are urgently needed to help the flexible electrodes be implanted smoothly. Currently, the implantation of flexible electrodes usually adopts the tool-assisted method, using the stiffness of the auxiliary tool for the effective implantation of the flexible electrode to ensure that the path of the flexible electrode during implantation meets the implantation expectation. For example, a Chinese patent discloses a flexible filament electrode implantation device [CN116898541A], including a base, a placement module, a motion module, an observation module, and an implantation needle. The base can be fixedly connected to an external motion mechanism; the placement module includes a placement adjustment platform and an electrode wire placement table. The placement adjustment platform is fixedly connected to the base, and the placement adjustment platform can drive the electrode wire placement table to move; the motion module includes a two-dimensional moving platform and a linear driving member. The two-dimensional moving platform is fixedly connected to the base, and the two-dimensional moving platform can drive the linear driving member to move in a predetermined plane. The implantation needle is connected to the linear driving member, and the linear driving member can drive the implantation needle to move in a direction perpendicular to the predetermined plane.

[0007] However, in the above technical solution, implanting the flexible electrode through the auxiliary tool implantation needle greatly increases the implantation volume and reduces the advantage of low invasiveness of the implanted flexible electrode. Therefore, a new driving mechanism and driving method are needed to solve the technical problem that the flexible electrode has implant stiffness without the aid of auxiliary tools during implantation. Summary of the Invention

[0008] The object of the present invention is to address the above problems and provide a vibration-driven integrated driver for flexible electrode implantation that has implantation stiffness without the aid of auxiliary tools during flexible electrode implantation.

[0009] Another object of the present invention is to provide a control method for the vibration-driven integrated driver for the above-mentioned driver.

[0010] To achieve the above object, the present invention adopts the following technical solutions: A vibration-driven integrated driver for flexible electrode implantation, comprising a driving block, the driving block includes a first clamping portion and a second clamping portion, a piezoelectric stack portion is arranged between the first clamping portion and the second clamping portion, a position-fixed clamping mechanism and a position-movable clamping mechanism are respectively arranged on the first clamping portion and the second clamping portion, the position of the first clamping portion is fixed to the driving block, and the second clamping portion is driven by the piezoelectric stack portion in the driving block to move in a direction away from or close to the first clamping portion.

[0011] In the above-mentioned vibration-driven integrated driver for flexible electrode implantation, the position of the first clamping portion is fixed to the driving block, and the second clamping portion is driven by the piezoelectric stack portion in the driving block to move in a direction away from or close to the first clamping portion.

[0012] In the above-mentioned vibration-driven integrated driver for flexible electrode implantation, the driving block further includes a fixing block, one end of the piezoelectric stack portion is fixedly arranged on the fixing block, and the other end is directly or indirectly connected to the second clamping portion.

[0013] In the above-mentioned vibration-driven integrated driver for flexible electrode implantation, a displacement amplification structure is arranged between the piezoelectric stack portion and the second clamping portion. The displacement amplification structure includes a driving plate, at least one displacement amplification plate is arranged on the side of the driving plate away from the piezoelectric stack portion, one end of the displacement amplification plate, the driving plate and the fixing block are connected through a limit connection point, the limit ends of the displacement amplification plate and the driving plate are not on the same side, and the displacement amplification plate is connected to the piezoelectric stack portion through a driving fulcrum.

[0014] In the above-mentioned vibration-driven integrated driver for flexible electrode implantation, a primary amplification plate and a secondary amplification plate are arranged in sequence on the side of the driving plate away from the piezoelectric stack portion. The driving plate, the primary amplification plate and the secondary amplification plate are connected through driving fulcrums. One ends of the driving plate, the primary amplification plate and the secondary amplification plate are fixedly connected to the fixing block through limit connection points. The driving fulcrums are staggered on one side of the midpoints of the primary amplification plate and the secondary amplification plate close to their upper limit connection points. The driving fulcrums are staggered at one ends of the primary amplification plate and the secondary amplification plate.

[0015] In the above-mentioned vibration-driven integrated driver for flexible electrode implantation, a limiting plate is provided at one end of the driving plate, the first-stage amplification plate, and the second-stage amplification plate close to the driving fulcrum. A limiting connection point is provided between the limiting plate and the driving plate, the first-stage amplification plate, and the second-stage amplification plate. The limiting connection point is arranged outside the driving fulcrum. One end of the limiting plate away from the driving plate, the first-stage amplification plate, and the second-stage amplification plate is fixedly connected to a fixed block. The second clamping portion is arranged at one end of the second-stage amplification plate away from the limiting connection point.

[0016] In the above-mentioned vibration-driven integrated driver for flexible electrode implantation, a first piezoelectric sheet and a second piezoelectric sheet are respectively arranged on one side of the position-fixed clamping mechanism and the position-movable clamping mechanism close to the piezoelectric stack portion. A second clamping block is arranged at the end of the displacement amplification structure. A first clamping block is arranged above or below the second clamping block. The first clamping block is fixedly connected to the fixed block. The first clamping block and the second clamping block respectively correspond to the first piezoelectric sheet and the second piezoelectric sheet.

[0017] In the vibration-driven integrated driver for flexible electrode implantation, a first support plate and a second support plate are respectively arranged outside the first clamping block and the second clamping block. The first support plate and the second support plate extend in a direction away from the driving block. One end of the first piezoelectric sheet and the second piezoelectric sheet is respectively fixed at one end of the first support plate and the second support plate away from the driving block, and the other end is respectively close to the first clamping block and the second clamping block and bends towards the first clamping block and the second clamping block through electrical signals to clamp the flexible electrode. Clamping grooves are respectively formed between the first clamping block, the second clamping block and the first piezoelectric sheet and the second piezoelectric sheet.

[0018] A driving method for the above-mentioned vibration-driven integrated driver for flexible electrode implantation

[0019] S1: At the initial state t0, the second piezoelectric sheet bends, the second clamping portion of the position-movable clamping mechanism clamps and holds, the first clamping portion of the position-fixed clamping mechanism releases the clamping, and the piezoelectric stack portion and the displacement amplification structure are in the initial state;

[0020] S2: From t0 to t1 of the signal, a linear signal is superimposed on a sine signal. The piezoelectric stack portion vibrates and elongates while driving the driving block through the first-stage amplification plate and the second-stage amplification plate to amplify the displacement and vibration, causing the second clamping portion to move, and the second clamping portion drives the flexible electrode a to vibrate and displace by x in the implantation direction;

[0021] S3: From t1 to t2 of the signal, the first piezoelectric sheet bends and the first clamping portion clamps and holds;

[0022] S4: From t2 to t3 of the signal, the second piezoelectric sheet recovers and the second clamping portion releases the clamping;

[0023] S5: From t3 to t4 of the signal, the piezoelectric stack part shortens, the driving plate, the first-stage amplification plate, and the second-stage amplification plate reset, the second clamping part displaces away from the implantation direction to the initial state, the flexible electrode is clamped and fixed at a constant position by the first clamping part, and the second clamping part exposes the force-bearing implantation section of the flexible electrode;

[0024] S6: From t4 to t5 of the signal, the second piezoelectric sheet bends and the second clamping part clamps and holds in place;

[0025] S7: From t5 to t6 of the signal, the first piezoelectric sheet recovers, the second clamping part releases the clamping, and the driver returns to the initial state, preparing to implant the flexible electrode in the second gear.

[0026] Compared with the existing technology, the advantages of the present invention are as follows:

[0027] 1. Compared with the method of implanting a flexible electrode using auxiliary tools, the implantation volume is greatly reduced. At the same time, during the implantation and propulsion process of the flexible electrode, vibration is assisted, effectively preventing the flexible electrode from buckling during implantation, maintaining a straight implantation, and avoiding the instability of the implantation position, direction, and depth caused by buckling; 2. During the implantation process, the first clamping part and the second clamping part alternately clamp. When the second clamping part clamps, the flexible electrode is advanced, reducing the force-bearing section of the flexible electrode, ensuring the stiffness of the force-bearing section of the flexible electrode, ensuring the direction of propulsion of the flexible and thin electrode, further preventing it from bending during implantation, and being able to precisely control the implantation length and speed of the flexible electrode, improving the controllability and accuracy of the implantation operation; 3. Utilizing the controllable elongation and vibration performance in the elongation direction of the piezoelectric stack, different from the combination of a linear motor and a vibrator, it is difficult to ensure the vibration direction and vibration amount with the self-vibration of the motor and the vibration of the vibrator and their combination. The present invention greatly improves the precision of flexible electrode implantation. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a schematic structural diagram provided by the present invention.

[0029] Figure 2 is a schematic structural diagram of another angle provided by the present invention.

[0030] Figure 3 is a schematic structural diagram of the displacement amplification structure provided by the present invention.

[0031] Figure 4 is a schematic driving principle diagram provided by the present invention.

[0032] Figure 5 is a schematic driving effect diagram provided by the present invention.

[0033] In the figure, there are a driving block 2, a fixed block 21, a first clamping part 3, a position-fixed clamping mechanism 31, a first piezoelectric sheet 32, a first clamping block 33, a first support plate 34, a second clamping part 4, a position-movable clamping mechanism 41, a second piezoelectric sheet 42, a second clamping block 43, a second support plate 44, a piezoelectric stack part 5, a displacement amplification structure 6, a driving plate 61, a first-stage amplification plate 62, a second-stage amplification plate 63, a limiting plate 64, a limiting connection point 65, and a driving fulcrum 66. Detailed implementation mode

[0034] The following further elaborates on the present invention in conjunction with the accompanying drawings and detailed implementation modes.

[0035] As Figures 1-3 shown, a vibration-driven integrated driver for flexible electrode implantation includes a driving block 2. The driving block 2 includes a first clamping part 3 and a second clamping part 4. A piezoelectric stack part 5 is arranged between the first clamping part 3 and the second clamping part 4. A position-fixed clamping mechanism 31 and a position-movable clamping mechanism 41 are respectively arranged on the first clamping part 3 and the second clamping part 4.

[0036] In this embodiment, the position-fixed clamping mechanism 31 and the position-movable clamping mechanism 41 can respectively clamp or release the flexible electrode. When the flexible electrode is implanted and advanced, the position-movable clamping mechanism 41 clamps, and the position-fixed clamping mechanism 31 releases. After receiving a signal, the piezoelectric stack part 5 elongates, driving the position-movable clamping mechanism 41 to move in the direction of flexible electrode implantation. At the same time, the piezoelectric stack part 5 vibrates. This design of integrating vibration driving effectively prevents the flexible electrode from buckling during implantation, maintains linear implantation, avoids the uncertainty of implantation position, direction, and depth caused by buckling, and greatly improves the implantation accuracy. Moreover, vibration can reduce the friction between the flexible electrode and surrounding tissues, making the implantation process smoother and reducing the risk of damage to surrounding tissues.

[0037] Among them, after the piezoelectric stack part 5 is powered on, due to the voltage effect, through the stacking combination of multiple piezoelectric sheets, elongation deformation is achieved. Those skilled in the art should be aware of the technical principle of piezoelectric stack deformation, and thus it will not be elaborated in detail here. When the piezoelectric stack part 5 is powered on, a linear signal is sent to the power supply module and a sine signal is superimposed simultaneously. While the piezoelectric stack part 5 elongates, vibration is superimposed in the elongation direction, as Figure 4 shown.

[0038] Compared with linear motors, even when signals are given to linear motors, it is difficult to achieve vibration output. A vibration device needs to be added to achieve the purpose of vibrating while feeding. However, for external vibration devices, it is difficult to control the vibration direction. After being superimposed with the linear motor, it will cause the vibration of the linear motor, resulting in uncertainty in implantation due to the vibration in the implantation direction. The structure of this embodiment is simpler, and the integrated architecture is more compact. It reduces the volume and complexity of the device, lowers the cost, and improves the stability and reliability of the device at the same time.

[0039] Further, the position of the first clamping portion 3 is fixed to the driving block 2, and the second clamping portion 4 is driven by the piezoelectric stack portion 5 in the driving block 2 to move away from or close to the first clamping portion 3. During the implantation process, the first clamping portion 3 and the second clamping portion 4 alternately clamp.

[0040] When the second clamping portion 4 clamps the flexible electrode a, the piezoelectric stack portion 5 is powered on and elongates, and the second clamping portion 4 moves in the implantation direction along with the piezoelectric stack portion 5, driving the flexible electrode a to advance towards the implantation site while vibrating. When the second clamping portion 4 brings the flexible electrode a close to the implantation area and is about to contact it, the first clamping portion 3 clamps the flexible electrode a, and the second clamping portion 4 releases the flexible electrode a. Then, the electric field of the piezoelectric stack portion 5 changes and shortens, driving the second clamping portion 4 to move towards the direction close to the first clamping portion 3. At this time, the position of the flexible electrode a remains unchanged, and the length of the flexible electrode a exposed between the second clamping portion 4 and the implantation area is the length for the next implantation. Immediately afterwards, the second clamping portion 4 clamps, the first clamping portion 3 releases the flexible electrode a, and the piezoelectric stack portion 5 elongates again to drive the second clamping portion 4 to push the exposed flexible electrode a into the implantation area.

[0041] In this embodiment, the force-bearing section of the second clamping portion 4 for clamping and pushing the flexible electrode a is only the exposed section between the second clamping portion 4 and the implantation area, and its length is controlled. After the exposed section is implanted, another exposed section is released. Compared with the method of clamping the tail end of the flexible electrode a and implanting it in one go, the length of the force-bearing section of the flexible electrode a is reduced, the stiffness of the force-bearing section of the flexible electrode a is ensured, the advancing direction of the flexible and thin electrode is ensured, further preventing it from bending during the implantation process, and improving the success rate and stability of the implantation.

[0042] Further, the driving block 2 further includes a fixing block 21. One section of the piezoelectric stack portion 5 is fixedly arranged on the fixing block 21, and the other end is directly or indirectly connected to the second clamping portion 4. One end of the piezoelectric stack portion 5 is fixed, and the other end drives the second clamping portion 4 to move as the piezoelectric stack portion 5 elongates or shortens, so as to realize the advancement of the flexible electrode implantation.

[0043] Preferably, a displacement amplification structure 6 is provided between the piezoelectric stack portion 5 and the second clamping portion 4. The displacement amplification structure 6 includes a driving plate 61. At least one displacement amplification plate is provided on the side of the driving plate 61 away from the piezoelectric stack portion 5. One end of the displacement amplification plate is fixedly connected to the fixing block 21. The limiting ends of the displacement amplification plate and the driving plate 61 are not on the same side. The displacement amplification plate is connected to the piezoelectric stack portion 5 through a driving fulcrum 66.

[0044] Since the piezoelectric stack portion 5 is formed by laminating a plurality of piezoelectric sheets, the displacement of a single piezoelectric sheet is in the micron level, and the piezoelectric stack portion 5 needs to be amplified in displacement through the displacement amplification structure 6. In this embodiment, after the piezoelectric stack portion 5 undergoes an elongation, it pushes the driving plate 61 to move in the implantation direction. Since one end is limited by being connected to the fixing block through a limiting connection point, the driving plate 61 rotates, and a large displacement occurs at the end of the driving plate 61 away from the limiting connection point when it is pushed by the piezoelectric stack portion 5. Further, the larger-displacement end of the driving plate 61 pushes the displacement amplification plate, and similarly, a large displacement occurs at the end of the displacement amplification plate away from the limiting connection point, realizing the amplification of the elongation of the piezoelectric stack portion 5. Preferably, the driving fulcrum 66 is located in the middle of the displacement amplification plate. Those skilled in the art can also adopt a lever-type displacement amplification structure, with one end of the lever connected to the piezoelectric stack portion 5 and the other end connected to the second clamping portion 4. By reasonably setting the fulcrum position and length ratio of the lever, the amplification of the displacement of the piezoelectric stack portion 5 is realized.

[0045] In this embodiment, the displacement amplification structure 6 adopts a three-stage amplification form. An first-stage amplification plate 62 and a second-stage amplification plate 63 are sequentially provided on the side of the driving plate 61 away from the piezoelectric stack portion 5. The driving plate 61, the first-stage amplification plate 62, and the second-stage amplification plate 63 are connected through driving fulcrums 66. One ends of the driving plate 61, the first-stage amplification plate 62, and the second-stage amplification plate 63 are fixedly connected to the fixing block 21 through limiting connection points. The driving fulcrums 66 are staggeredly arranged on the side of the midpoints of the first-stage amplification plate 62 and the second-stage amplification plate 63 close to their upper limiting connection points.

[0046] Further, a limiting plate 64 is provided at one end of the driving plate 61, the first-stage amplification plate 62, and the second-stage amplification plate 63 close to the driving fulcrum 66. A limiting connection point 65 is provided between the limiting plate 64 and the driving plate 61, the first-stage amplification plate 62, and the second-stage amplification plate 63. The limiting connection point 65 is arranged outside the driving fulcrum. One end of the limiting plate 64 away from the driving plate 61, the first-stage amplification plate 62, and the second-stage amplification plate 63 is fixedly connected to the fixed block 21. The second clamping portion 4 is arranged at one end of the second-stage amplification plate 63 away from the limiting connection point. When the driving plate 61 is driven by the piezoelectric stack portion 5, one end thereof generates a large displacement, amplifying the elongation amount of the piezoelectric stack portion 5. Similarly, the first-stage amplification plate 62 and the second-stage amplification plate 63 obtain large displacements, thereby further amplifying the elongation amount of the piezoelectric stack portion 5. In this embodiment, the limiting connection point, the driving fulcrum 66, and the driving plate 61, the first-stage amplification plate 62, and the second-stage amplification plate 63 are integrally formed.

[0047] Those skilled in the art can also increase the number of displacement amplification plates according to actual calculation requirements to meet the requirements for the implantation length of the flexible electrode a.

[0048] Preferably, a movable plate is provided between the second clamping portion 4 and the second-stage amplification plate 63. The movable plate is slidably connected to the driving block. One end of the second-stage amplification plate 63 away from the limiting connection point is slidably connected to the movable plate. A positioning guide groove is provided between the movable plate and the driving block. This enables the movable plate and the second clamping portion 4 to only generate displacements in the implantation direction.

[0049] Preferably, a first piezoelectric sheet 32 and a second piezoelectric sheet 42 are respectively provided on one side of the position-fixed clamping mechanism 31 and the position-movable clamping mechanism 41 close to the piezoelectric stack portion 5. A second clamping block 43 is provided at the end of the displacement amplification structure 6. A first clamping block 33 is provided above or below the second clamping block 43. The first clamping block 33 is fixedly connected to the fixed block 21. The first clamping block 33 and the second clamping block 43 respectively correspond to the first piezoelectric sheet 32 and the second piezoelectric sheet 42.

[0050] When the position-fixed clamping mechanism 31 and the position-movable clamping mechanism 41 need to clamp the flexible electrode, the first piezoelectric sheet 32 and the second piezoelectric sheet 42 receive signals and bend towards the first clamping block 33 and the second clamping block 43 to reduce the distance, so as to achieve the purpose of clamping the flexible electrode a.

[0051] Furthermore, first support plates 34 and second support plates 44 are respectively arranged on the outer sides of the first clamping blocks 33 and the second clamping blocks 43. The first support plates 34 and the second support plates 44 extend away from the driving block 2. One ends of the first piezoelectric sheets 32 and the second piezoelectric sheets 42 are respectively fixed to the ends of the first support plates 34 and the second support plates 44 away from the substrate, and the other ends are respectively close to the first clamping blocks 33 and the second clamping blocks 43 and bend towards the first clamping blocks 33 and the second clamping blocks 43 through electrical signals to clamp the flexible electrode a. Clamping grooves 35 are respectively formed between the first clamping blocks 33, the second clamping blocks 43 and the first piezoelectric sheets 32 and the second piezoelectric sheets 42. The flexible electrode a is clamped in the clamping grooves 35 and obtains an implantation displacement as the piezoelectric stack portion 5 elongates after being clamped by the position-activating clamping mechanism 41. The piezoelectric sheet has a fast response time and high stability.

[0052] Those skilled in the art can also adopt other clamping mechanisms, such as relays and electromagnetic grippers.

[0053] The driving method of the vibration-driving integrated driver for implanting flexible electrodes is as Figure 4 , 5 shown, and includes the following steps:

[0054] S1: At the initial state t0, the second piezoelectric sheet 42 bends, the position-activating clamping mechanism 41 of the second clamping portion 4 clamps in a clamped state, the fixed clamping mechanism 31 of the first clamping portion 3 releases the clamp, and the piezoelectric stack portion 5 and the displacement amplification structure 6 are in the initial state;

[0055] S2: From t0 to t1 for the signal, a linear signal is superimposed on a sine signal. The piezoelectric stack portion 5 vibrates and elongates while driving the driving block 2 to amplify the displacement and vibration through the first-stage amplifier plate 62 and the second-stage amplifier plate 63 to move the second clamping portion, and the second clamping portion drives the flexible electrode a to vibrate and displace in the implantation direction by x;

[0056] S3: From t1 to t2 for the signal, the first piezoelectric sheet 32 bends, and the first clamping portion 3 clamps in a clamped state;

[0057] S4: From t2 to t3 for the signal, the second piezoelectric sheet 42 recovers, and the second clamping portion 4 releases the clamp;

[0058] S5: From t3 to t4 for the signal, the piezoelectric stack portion 5 shortens, the driving plate 61, the first-stage amplifier plate 62, and the second-stage amplifier plate 63 reset. The second clamping portion 4 displaces away from the implantation direction to the initial state. The flexible electrode a is clamped and fixed in position by the first clamping portion 3, and the force-bearing implantation section of the flexible electrode is exposed by the second clamping portion 4;

[0059] S6: From t4 to t5 for the signal, the second piezoelectric sheet 42 bends, and the second clamping portion 4 clamps in a clamped state;

[0060] S7: From t5 to t6, the signal causes the first piezoelectric sheet 32 to recover, the clamping of the second clamping portion 4 is released, and the driver returns to the initial state, preparing to implant the flexible electrode a of the second gear.

[0061] The specific embodiments described herein are merely illustrative of the spirit of the present invention. Those skilled in the art to which the present invention pertains can make various modifications or supplements to the described specific embodiments or use similar ways to replace them, but will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

[0062] Although terms such as driving block 2, fixed block 21, first clamping portion 3, position - fixing clamping mechanism 31, first piezoelectric sheet 32, first clamping block 33, first support plate 34, second clamping portion 4, position - movable clamping mechanism 41, second piezoelectric sheet 42, second clamping block 43, second support plate 44, piezoelectric stack portion 5, displacement amplification structure 6, driving plate 61, primary amplification plate 62, secondary amplification plate 63, limiting plate 64, limiting connection point 65, driving fulcrum 66, etc. are used more frequently in this article, the possibility of using other terms is not excluded. The use of these terms is only to more conveniently describe and explain the essence of the present invention; interpreting them as any additional limitation is contrary to the spirit of the present invention.

Claims

1. An integrated vibration-driven actuator for flexible electrode implantation, comprising a driving block (2), characterized in that, The described driving block (2) includes a first clamping portion (3) and a second clamping portion (4). A piezoelectric stack portion (5) is provided between the first clamping portion (3) and the second clamping portion (4). The first clamping portion (3) and the second clamping portion (4) are respectively provided with a position-fixed clamping mechanism (31) and a position-movable clamping mechanism (41). The position of the first clamping portion (3) is fixed to the driving block (2), and the second clamping portion (4) is driven by the piezoelectric stack portion (5) in the driving block (2) to move away from or close to the first clamping portion (3). The driving block (2) further includes a fixing block (21). One end of the piezoelectric stack portion (5) is fixedly provided on the fixing block (21), and the other end is directly or indirectly connected to the second clamping portion (4). A displacement amplification structure (6) is provided between the piezoelectric stack portion (5) and the second clamping portion (4). The displacement amplification structure (6) includes a driving plate (61). At least one displacement amplification plate is provided on the side of the driving plate (61) away from the piezoelectric stack portion (5). One end of the displacement amplification plate, one end of the driving plate (61) and the fixing block (21) are connected through a limiting fulcrum. The limiting ends of the displacement amplification plate and the driving plate (61) are not on the same side. The displacement amplification plate is connected to the piezoelectric stack portion (5) through a driving fulcrum (66). When power is applied to the piezoelectric stack portion (5), a linear signal is sent to the power module and a sine signal is superimposed at the same time. While the piezoelectric stack portion (5) elongates, vibrations in the elongation direction are superimposed.

2. The vibration-driven integrated driver for flexible electrode implantation according to claim 1, characterized in that On the side of the driving plate (61) away from the piezoelectric stack portion (5), a first-stage amplification plate (62) and a second-stage amplification plate (63) are sequentially arranged. The driving plate (61), the first-stage amplification plate (62) and the second-stage amplification plate (63) are connected through driving fulcrums (66). One end of the driving plate (61), the first-stage amplification plate (62) and the second-stage amplification plate (63) is fixedly connected to the fixing block (21) through a limiting fulcrum. The driving fulcrums (66) are staggered on the side of the midpoints of the first-stage amplification plate (62) and the second-stage amplification plate (63) close to their upper limiting fulcrums.

3. The vibration driving integrated driver for flexible electrode implantation according to claim 2, characterized in that Limiting plates (64) are provided at the ends of the driving plate (61), the first-stage amplification plate (62) and the second-stage amplification plate (63) close to the driving fulcrums (66). Limiting connection points (65) are provided between the limiting plates (64) and the driving plate (61), the first-stage amplification plate (62) and the second-stage amplification plate (63). The limiting connection points (65) are provided outside the driving fulcrums (66). One end of the limiting plates (64) away from the driving plate (61), the first-stage amplification plate (62) and the second-stage amplification plate (63) is fixedly connected to the fixing block (21). The second clamping portion (4) is provided at the end of the second-stage amplification plate (63) away from the limiting fulcrum.

4. The vibration-driven integrated driver for flexible electrode implantation according to claim 3, wherein On one side of the described position-fixed clamping mechanism (31) and the position-movable clamping mechanism (41) close to the piezoelectric stack portion (5), a first piezoelectric sheet (32) and a second piezoelectric sheet (42) are respectively arranged. At the end of the displacement amplification structure (6), a second clamping block (43) is provided. Above or below the second clamping block (43), a first clamping block (33) is provided. The first clamping block (33) is fixedly connected to the fixed block (21). The first clamping block (33) and the second clamping block (43) respectively correspond to the first piezoelectric sheet (32) and the second piezoelectric sheet (42).

5. The vibration driving integrated driver for flexible electrode implantation according to claim 4, wherein, On the outer sides of the described first clamping block (33) and the second clamping block (43), a first support plate (34) and a second support plate (44) are respectively arranged. The first support plate (34) and the second support plate (44) extend in a direction away from the driving block (2).

6. The vibration driving integrated driver for flexible electrode implantation according to claim 5, wherein, One ends of the first piezoelectric sheet (32) and the second piezoelectric sheet (42) are respectively fixed to one ends of the first support plate (34) and the second support plate (44) away from the driving block (2), and the other ends are respectively close to the first clamping block (33) and the second clamping block (43) and bend towards the first clamping block (33) and the second clamping block (43) through electrical signals respectively to clamp the flexible electrode (a). Clamping grooves (35) are respectively formed between the first clamping block (33), the second clamping block (43) and the first piezoelectric sheet (32) and the second piezoelectric sheet (42).

7. A driving method for a vibration-driven integrated driver for flexible electrode implantation according to any one of claims 4-6, characterized in that, It includes the following steps: S1: At the initial state t0, the second piezoelectric sheet (42) bends, the position-movable clamping mechanism (41) of the second clamping portion (4) clamps in place, the position-fixed clamping mechanism (31) of the first clamping portion (3) releases the clamp, and the piezoelectric stack portion (5) and the displacement amplification structure (6) are in the initial state; S2: From t0 to t1 for the signal, a linear signal is superimposed on a sine signal. The piezoelectric stack portion (5) vibrates and elongates. The piezoelectric stack portion (5) drives the driving block (2) to amplify the displacement and vibration through the first-stage amplification plate (62) and the second-stage amplification plate (63) to move the second clamping portion. The second clamping portion (4) drives the flexible electrode (a) to vibrate and displace by x in the implantation direction; S3: From t1 to t2 for the signal, the first piezoelectric sheet (32) bends, and the first clamping portion (3) clamps in place; S4: From t2 to t3 for the signal, the second piezoelectric sheet (42) recovers, and the second clamping portion (4) releases the clamp; S5: From t3 to t4 for the signal, the piezoelectric stack portion (5) shortens, the driving plate (61), the first-stage amplification plate (62), and the second-stage amplification plate (63) reset. The second clamping portion (4) displaces away from the implantation direction to the initial state. The flexible electrode (a) is clamped by the first clamping portion (3) and the fixed position remains unchanged. The second clamping portion (4) exposes the force-bearing implantation section of the flexible electrode; S6: From t4 to t5 for the signal, the second piezoelectric sheet (42) bends, and the second clamping portion (4) clamps in place; S7: From t5 to t6 for the signal, the first piezoelectric sheet (32) recovers, the second clamping portion (4) releases the clamp, and the driver returns to the initial state, ready to enter the implantation of the second-stage flexible electrode (a).

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