Array substrate, preparation method thereof and display device

Abstract

The invention provides an array substrate, a preparation method thereof and a display device. The preparation method comprises the following steps: coating a first inorganic layer of a substrate with a first organic solution; the first organic solution comprises a fluorine element, the substrate comprises a rigid substrate and a first inorganic layer, and the first inorganic layer is located on the first surface of the rigid substrate. And curing the first organic solution to form a first organic film. And stripping the first organic film from the substrate. Wherein the first surface comprises first particles, and the concentration of the first particles on the surface, away from the rigid substrate, of the first inorganic layer is smaller than that on the first surface; the first particles include an alkali metal element or an alkaline earth metal element. According to the scheme, the number of the first particles entering the first organic solution can be reduced, the combination proportion of fluorine-containing particle groups and the first particles in the first organic solution is controlled to be at a low level, the number of carrier channels in the first organic layer can be controlled to be small, and the yellowing phenomenon can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an array substrate and a preparation method thereof, and a display device. Background Art

[0002] In the existing process, it is usually selected to prepare part of the film structure in the display panel on a rigid base to improve the finished product yield of the display panel. Among them, the above-mentioned part of the film is often a polyimide film in a flexible display panel. It should be noted that the above-mentioned polyimide film usually includes fluorine-containing particle groups, and the presence of the fluorine-containing particle groups can reduce the probability of charge transfer in the polyimide film, thereby reducing the possibility of yellowing of the polyimide film.

[0003] The existing preparation process of the polyimide film layer usually needs to be completed on a rigid base, that is, the polyimide film layer often contacts the rigid base. However, due to process technology limitations, the surface of the rigid base usually contains a large number of particles with volatile electron properties (such as alkali metal ions, alkaline earth metal ions, etc.), and the above particles are easily diffused into the polyimide film layer. The above particles can react with the fluorine-containing particle groups and cause the fluorine-containing particle groups in the polyimide film layer to decrease, making it difficult to suppress the charge transfer phenomenon in the polyimide film layer, and ultimately leading to an increase in the yellowing degree of the polyimide film layer, affecting the visual effect. Summary of the invention

[0004] In view of this, the present application provides an array substrate and a method for manufacturing the same, and a display device, so as to solve the problem of severe yellowing of a part of the film layer of the above-mentioned display panel.

[0005] In a first aspect, an embodiment of the present application provides a method for preparing an array substrate, comprising: A first organic solution is coated on the first inorganic layer of the substrate; the first organic solution includes fluorine element, the substrate includes a rigid substrate and a first inorganic layer, and the first inorganic layer is located on a first surface of the rigid substrate; solidifying the first organic solution to form a first organic film; peeling the first organic film from the substrate; The first surface contains first particles, and the concentration of the first particles on the surface of the first inorganic layer away from the rigid substrate is lower than the concentration on the first surface; the first particles include alkali metal elements or alkaline earth metal elements.

[0006] In a second aspect, the present application provides an array substrate, which is prepared using the preparation method provided in the first aspect.

[0007] In a third aspect, the present application provides a display device, comprising the array substrate provided in the second aspect.

[0008] In the embodiment of the present application, compared with coating the first organic solution on the first surface of the rigid substrate, the scheme of coating the first organic solution on the first inorganic layer can reduce the number of first particles entering the first organic solution, and control the ratio of the fluorine-containing particle groups in the first organic solution to be combined with the first particles at a lower level. The above scheme is conducive to controlling the number of carrier channels in the first organic layer to be small, keeping the charge transfer phenomenon in the first organic layer weak, and helping to improve the yellowing phenomenon. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0010] Figure 1 A schematic diagram of a preparation process of a partial structure of a display panel related to the present application; Figure 2 A schematic diagram of a method for preparing an array substrate provided in the present application; Figure 3 for Figure 2 A schematic diagram of some steps of the preparation method shown; Figure 4 is a schematic diagram of the distribution of first particles in a partial area on the substrate; Figure 5 for Figure 2 A schematic diagram of some steps of the preparation method shown; Figure 6 A schematic diagram of some steps of a preparation method provided in the present application; Figure 7 for Figure 6 A structural flow chart corresponding to some steps of the preparation method shown; Figure 8 for Figure 7 Schematic diagram of a portion of the film layer structure corresponding to some of the steps shown; Fig. 9 for Figure 7 Another schematic diagram of a partial film layer structure corresponding to some steps shown; Fig.10 for Figure 2 A schematic diagram of some steps of the preparation method shown; Fig.11 A schematic diagram of some steps of a preparation method provided in the present application; Fig.12 for Fig.11The structural flow chart corresponding to the preparation method shown; Fig.13 for Fig.12 A schematic top view of a partial structure of an array substrate corresponding to a partial process shown; Fig.14 A schematic diagram of a display device provided in the present application. DETAILED DESCRIPTION

[0011] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0012] It should be clear that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0013] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0014] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0015] In the prior art, the preparation process of the display panel usually requires the participation of a base. For example, the base can be used as a carrier to prepare part of the film layer of the display panel on the surface of the base. In order to reduce the difficulty of preparing the display panel, a rigid base is often used to participate in the preparation process of the display panel. This is because the rigidity of part of the film layer structure of the display panel is insufficient, and it is difficult to ensure the setting accuracy of the film layer structure during preparation; in particular, when preparing a flexible display panel, it is particularly necessary to prepare it on a rigid base.

[0016] Figure 1 The figure is a schematic diagram of a preparation process of a partial structure of a display panel related to the present application.

[0017] like Figure 1As shown, in the process of preparing the existing display panel 10', the organic layer 02' in the existing display panel 10' can be prepared on the rigid base 01'. The organic layer 02' can include fluorinated polyimide molecules, and the fluorine elements in the fluorinated polyimide molecules are mainly concentrated in the fluorinated particle groups in the molecules. The fluorinated particle groups can have the characteristics of large volume and low polarity. The presence of the above-mentioned fluorinated particle groups is conducive to increasing the molecular gap, thereby reducing the number of channels available for carrier movement in the fluorinated polyimide molecules, inhibiting the phenomenon of carrier combination (charge transfer) in the fluorinated polyimide molecules, and helping to improve the light transmittance of the organic layer 02'. Among them, the reason why the above-mentioned charge transfer phenomenon can reduce the light transmittance of the organic layer 02' is that: under the condition of light, some bonds of the polyimide molecules in the organic layer 02' easily absorb light energy to generate carriers, and these partial carriers can be transferred from the original area to other areas through the carrier channel (the above-mentioned charge transfer phenomenon), and energy level transition occurs. However, carriers tend to absorb photons while passing through the carrier channel, reducing the number of photons emitted from the organic layer 02'; that is, the stronger the charge transfer phenomenon is, the fewer photons are emitted from the organic layer 02', and the lower the light transmittance of the organic layer 02' is. It should be noted that among all the colors of light included in the visible light, the energy of blue light is higher, and the photons corresponding to the blue light in the visible light irradiated into the organic layer 02' are often preferentially absorbed by the carriers. Therefore, the presence of the fluorine-containing particle group helps to ensure that a sufficient proportion of blue light is included in the visible light emitted from the organic layer 02'.

[0018] like Figure 1 As shown, due to the limitation of the process level, the rigid base 01' usually contains more active metal particles 03', and the active metal particles 03' may have the characteristic of easily losing electrons, and are easy to combine with some particles that are easy to obtain electrons (such as the above-mentioned fluorine-containing particle groups). When preparing the organic layer 02', the active metal particles 03' in the rigid base 01' tend to diffuse into the organic layer 02' and combine with the fluorine-containing particle groups, thereby reducing the number of fluorine-containing particle groups in the fluorine-containing polyimide molecules, causing the number of carrier channels to increase, and weakening the inhibitory effect on the charge transfer phenomenon in the organic layer 02'. Among them, the more obvious changes caused by the active metal particles 03' diffusing into the organic layer 02' include: in the visible light passing through the organic layer 02', the proportion of blue light decreases, the proportion of yellow light increases, and the color of the organic layer 02' tends to be yellow (yellowing phenomenon).

[0019] Figure 2 A schematic diagram of a method for preparing an array substrate provided in the present application is shown in FIG. Figure 3 for Figure 2 The schematic diagram of some steps of the preparation method shown is for easy understanding. Figure 3Only the structure of the substrate and the positional relationship between the first organic solution and the substrate corresponding to the step of preparing the first organic film on the first inorganic layer are shown.

[0020] In view of the above problems, the present application provides a method for preparing an array substrate, such as Figure 2 The preparation method comprises: S1: coating a first organic solution on the first inorganic layer of the substrate.

[0021] The first organic solution 02a includes fluorine element, such as Figure 3 As shown, the base 01 includes a rigid substrate 11 and a first inorganic layer 12 , and the first inorganic layer 12 is located on a first surface S1 of the rigid substrate 11 .

[0022] The first organic solution 02a may include fluorine-containing polyimide molecules, and the fluorine-containing polyimide molecules may include fluorine-containing particle groups, and the fluorine-containing particle groups may be trifluoromethyl groups.

[0023] The rigid substrate 11 may include SiO 2 . The surface of the rigid substrate 11 facing the first organic solution 02 a is a first surface S1 . The first surface S1 may include active metal ions.

[0024] A first inorganic layer 12 may be provided between the rigid substrate 11 and the first organic solution 02 a , and the first inorganic layer 12 may play a role in isolating the rigid substrate 11 from the first organic solution 02 a .

[0025] The first inorganic layer 12 may be in contact with the first surface S1 of the rigid substrate 11 ; the first inorganic layer 12 may include at least one of SiNx, SiOx, indium tin oxide, indium zinc oxide, SiC, AlN, diamond, and the like.

[0026] S2: solidifying the first organic solution to form a first organic film.

[0027] The first organic solution on the first inorganic layer 12 is solidified to obtain a first organic film in the array substrate, and the first organic film can play a role in isolating external water and oxygen.

[0028] S3: peeling off the first organic film from the substrate.

[0029] Other film layer structures in the array substrate (such as an array layer, etc.) can be set on the side of the first organic film away from the substrate 01. Peeling the first organic film off the substrate 01 means that most of the film layer structures on the array substrate, including the first organic film, the array layer, etc., have been prepared.

[0030] The first surface S1 includes first particles, and the first particles include alkali metal elements or alkaline earth metal elements. The first particles can be active metal particles, for example, the first particles can be calcium ions, magnesium ions, sodium ions, etc. When the first particles meet the fluorinated polyimide molecules, the first particles can combine with the fluorinated particle groups in the fluorinated polyimide molecules, resulting in a reduction in the number of fluorinated particle groups.

[0031] It should be noted that, since the first inorganic layer 12 may be in contact with the first surface S1 of the rigid substrate 11 , a portion of the first particles on the first surface S1 may be transferred to the first inorganic layer 12 in consideration of the diffusion effect.

[0032] The concentration of the first particles on the surface of the first inorganic layer 12 away from the rigid substrate 11 is lower than the concentration on the first surface S1. After part of the first particles are transferred from the first surface S1 to the first inorganic layer 12, the first particles diffused into the first inorganic layer 12 may have a tendency to continue to transfer to the surface of the first inorganic layer 12 away from the rigid substrate 11, thereby causing the first particles to also exist on the surface of the first inorganic layer 12 away from the rigid substrate 11. The first particles on the surface of the first inorganic layer 12 away from the rigid substrate 11 may further diffuse into the first organic solution 02a and combine with the fluorine-containing particle groups in the first organic solution 02a. It is worth noting that the concentration of the first particles on the surface of the first inorganic layer 12 away from the rigid substrate 11 is smaller than that on the first surface S1.

[0033] In the embodiment of the present application, compared with coating the first organic solution 02a on the first surface S1 of the rigid substrate 11, the scheme of coating the first organic solution 02a on the first inorganic layer can reduce the number of first particles entering the first organic solution 02a, and control the ratio of the fluorine-containing particle groups in the first organic solution 02a to be combined with the first particles at a lower level. The above scheme is conducive to controlling the number of carrier channels in the first organic layer to be small, keeping the charge transfer phenomenon in the first organic layer weak, and helping to improve the yellowing phenomenon.

[0034] In a possible embodiment, the first inorganic layer does not contain the first particles.

[0035] Figure 4 Schematic diagram of the distribution of first particles in a partial area on the substrate.

[0036] In one embodiment of the present application, Figure 4As shown, the initial concentration of the first particles a on the first surface S1 is ρ, and the concentration of the first particles a at the first position 121 in the first inorganic layer 12 is ρ / e, where e is an exponential constant. Before other film layers (such as the first inorganic layer 12) are provided on the first surface S1, the concentration of the first particles a on the first surface S1 is the initial concentration ρ. After the first inorganic layer 12 is provided on the first surface S1, part of the first particles a on the first surface S1 may be transferred to the first inorganic layer 12. Based on the particle diffusion principle and other contents, the first particles a may have a tendency to diffuse in the first inorganic layer 12 in a direction away from the first surface S1, and the farther from the first surface S1, the smaller the concentration of the first particles a in the corresponding part of the first inorganic layer 12.

[0037] When the concentration of the first particle a corresponding to the first position 121 in the first inorganic layer 12 is ρ / e, the concentration of the first particle a in each region of the first inorganic layer 12 reaches an equilibrium state. At this time, it is difficult for the first particle a to continue to diffuse from the first position 121 to a direction away from the first surface S1.

[0038] Wherein, the thickness of the first inorganic layer 12 is H, H>1.5 h, h is the distance between the first position 121 and the surface of the first inorganic layer 12 close to the rigid substrate 11, and h can be called the diffusion depth.

[0039] In the embodiment of the present application, by setting H>1.5 h, helps to reduce the amount of first particles a diffused onto the surface of the first inorganic layer 12 away from the rigid substrate 11, helps to ensure that the surface of the first inorganic layer 12 away from the rigid substrate 11 does not contain first particles a, thereby greatly weakening the phenomenon of fluorine-containing particle groups combining with the first particles a, and helps to further improve the yellowing phenomenon.

[0040] Figure 5 for Figure 2 Schematic diagram of some steps of the preparation method shown.

[0041] In one embodiment of the present application, Figure 5 As shown, S2: solidifying the first organic solution to form a first organic film, including: S21: When the oxygen content T is within a threshold range, the first organic solution is heated to solidify the solution, thereby forming a first organic film.

[0042] In the present application, the first organic film can be prepared by heating and curing. During the heating and curing process, the ambient temperature of the first organic solution can be greater than or equal to 250° C. In addition, the oxygen in the heating environment also has the risk of participating in the curing process and causing the first organic solution to oxidize and turn yellow. Therefore, it is necessary to control the oxygen content T in the heating environment within a threshold range to reduce the probability of oxygen participating in the heating and curing process.

[0043] In one embodiment of the present application, the threshold range is 0≤T≤10 ppm.

[0044] In the embodiment of the present application, when the oxygen content T in the heating environment satisfies 0≤T≤10ppm, the risk of oxygen participating in the curing process of the first organic solution is low, and the first organic film obtained after curing is less yellow.

[0045] Figure 6 A schematic diagram of some steps of a preparation method provided in this application, Figure 7 for Figure 6 The structural flow chart corresponding to some steps of the preparation method shown.

[0046] In one embodiment of the present application, Figure 6 and Figure 7 , after S2: solidifying the first organic solution to form the first organic film and before S3: peeling the first organic film 03 from the substrate 01, it also includes: S201 : Disposing a second inorganic layer 22 on a side of the first organic film 03 away from the substrate 01 .

[0047] The components included in the second inorganic layer 22 may be the same as those included in the first inorganic layer 22 , and the second inorganic layer 22 may have the function of preventing the first particles from continuing to diffuse toward the film structure located on the side of the second inorganic layer 22 away from the first organic layer 03 .

[0048] S202 : coating a second organic solution 02 b on a side of the second inorganic layer 22 away from the first organic film 03 .

[0049] The second organic solution 02b may also include fluorinated polyimide molecules. The second organic solution 02b is coated on the side of the second inorganic layer 22 away from the first organic film 03, which can prevent the second organic solution 02b from being integrated with the first organic film 03, and can also prevent the first particles from diffusing from the first organic film 03 to the second organic solution 02b.

[0050] S203 : curing the second organic solution 02 b coated on the second inorganic layer 22 to form a second organic film 04 .

[0051] Both the first organic film 03 and the second organic film 04 can be attached to the second inorganic layer 22 . When the first organic film 03 and the substrate 01 are peeled off, a two-layer organic film structure attached to the same inorganic layer can be obtained.

[0052] In the embodiment of the present application, the second inorganic layer 22 can serve to isolate the first organic film 03 and the second organic film 04. Even if the first particles can diffuse to the first organic film 03 through the first inorganic layer 12, the presence of the second inorganic layer 22 can further hinder the diffusion of the first particles, thereby helping to eliminate the yellowing phenomenon of the second organic film 04.

[0053] Figure 8 for Figure 7 The schematic diagram of the corresponding partial membrane structure under some steps is shown for easy understanding. Figure 8 FIG. 1 only shows the size difference between the thickness of the first organic film and the thickness of the second organic film after the second organic solution is solidified into the second organic film.

[0054] In one embodiment of the present application, Figure 8 As shown, the thickness H1 of the first organic film 03 is greater than the thickness H2 of the second organic film 04 .

[0055] In the embodiment of the present application, the thickness of the first organic film 03 is greater than that of the second organic film 04. When there are first particles diffusing into the first organic film 03, the greater thickness of the first organic film 03 helps to hinder the further diffusion of the first particles, which is beneficial to reduce or eliminate the first particles diffusing into the second organic film 04 and improve the yellowing phenomenon. In addition, when the first organic film 03 is peeled off from the first inorganic layer 12, it is necessary to use a laser to irradiate the first organic film 03 from the side of the rigid substrate 11. However, the laser required to peel off the first organic film 03 easily passes through the first organic film layer 03 and the second inorganic layer 22 to irradiate the second organic film 04. In order to prevent the above-mentioned laser from peeling off the second organic film 04 from the second inorganic layer 22, the thickness of the first organic film 03 can be set to be greater than the thickness of the second organic film 04, so that the first organic film 03 can prevent the continued propagation of the laser and reduce the risk of the second organic film 04 being peeled off.

[0056] Fig. 9 for Figure 7 Another schematic diagram of a partial film layer structure corresponding to some of the steps shown.

[0057] In one possible implementation, Fig. 9 As shown, the thickness H3 of the first inorganic layer 12 is smaller than the thickness H4 of the second inorganic layer 22 .

[0058] In this implementation, since the thickness of the first inorganic layer 12 is relatively small, the first inorganic layer 12 has a relatively small obstruction effect on the laser during the peeling process of the first organic film 03, which is beneficial to improving the peeling effect of the first organic film 03. Compared with the first inorganic layer 12, the thickness H4 of the second inorganic layer 22 is relatively large, which helps to achieve the second inorganic layer 22 to block the continued propagation of the laser and reduce the risk of the second organic film 04 being peeled off.

[0059] Fig.10 for Figure 2 Schematic diagram of some steps of the preparation method shown.

[0060] In one embodiment of the present application, Fig.10 As shown, S3: peeling off the first organic film 03 from the substrate 01, including: S31 : irradiating the interface between the first inorganic layer 12 and the first organic film 03 from the rigid substrate 11 side with a laser to peel off the first organic film 03 and the first inorganic layer 12 .

[0061] In the embodiment of the present application, the laser can be irradiated to the first organic film 03 from the side of the rigid substrate 11 away from the first inorganic layer 12. After passing through the first inorganic layer 12, the laser can be irradiated to the interface between the first inorganic layer 12 and the first organic layer 03. The light energy of the laser can then be converted into heat energy to heat the first organic film 03. The components such as water and oxygen in the first organic film 03 expand at the interface between the first organic film 03 and the first inorganic layer 12 to form a bulge-like structure. The portion of the first organic film 03 corresponding to the bulge-like structure can be peeled off from the first inorganic layer 12. In the embodiment of the present application, irradiating the laser on the side of the rigid substrate 11 away from the first inorganic layer 12 helps the first organic film 03 to block the continued propagation of the laser, and can reduce the effect of laser irradiation on the film structure located on the side of the first organic film 03 away from the rigid substrate 11.

[0062] In one embodiment of the present application, the transmittance of the first inorganic layer 12 to laser light is c, where c≥40%.

[0063] In the embodiment of the present application, the transmittance of the first inorganic layer 12 to the laser can affect the peeling effect of the first organic film 03. The greater the transmittance of the first inorganic layer 12 to the laser, the better the peeling effect of the first organic film 03 and the first inorganic layer 12. In this embodiment, by setting c≥40%, the film structure adhering to the first inorganic layer 12 due to incomplete peeling of the first organic film 03 can be reduced, which helps to improve the surface flatness of the first organic film 03 after peeling.

[0064] In one embodiment of the present application, the wavelength L of the laser is ≤400 nm.

[0065] The shorter the wavelength of the laser, the higher its frequency and the greater the corresponding energy density. By limiting L≤400nm in this embodiment, it is helpful to ensure that the energy density of the laser is relatively large, which is conducive to ensuring that the peeling effect of the first organic layer 03 can reach the expected level.

[0066] Fig.11 A schematic diagram of some steps of a preparation method provided in this application, Fig.12 for Fig.11 The structural flow chart corresponding to the preparation method shown.

[0067] In one embodiment of the present application, Fig.11 and Fig.12 , before S3: peeling the first organic film 03 from the substrate 01, the method at least further comprises: S204 : preparing an array layer 05 on a side of the first organic film 03 away from the substrate 01 , wherein the array layer 05 includes a thin film transistor.

[0068] The array layer 05 may be located on a side of the second organic film 04 away from the first organic film 03, and the thin film transistor in the array layer 05 may be used as a component of a pixel circuit, which may be used to drive a light-emitting device located on a side of the array layer 05 away from the second organic film 04. In this embodiment, the first organic film 03 may prevent external water and oxygen from invading the array layer 05, and help maintain the normal working state of the array substrate.

[0069] Fig.13 for Fig.12 The schematic top view of the partial structure of the array substrate corresponding to the partial process shown.

[0070] In addition, if Fig.12 As shown in FIG. 1 , after the array layer 05 is prepared, a device layer 06 (which may include a light-emitting material, etc.), a packaging layer 07, a touch layer 08 and other film structures may be further prepared on the side of the array layer 05 away from the first organic film 03. Subsequently, the device layer 06, the packaging layer 07, the touch layer 08 and other film structures may be cut in the first round according to actual needs, as shown in FIG. Fig.13 As shown, the device layer 06, packaging layer 07, touch layer 08 and other film layer structures are divided into multiple sub-areas A1, and the corresponding device layer 06, packaging layer 07, touch layer 08 and other film layer structures in a single sub-area A1 all belong to the film layer structures in the same array substrate.

[0071] After the first round of cutting, the first organic film 03 and the first inorganic layer 12 can be peeled off, and then the first organic film 03, the second inorganic layer 22 and the second organic film 04 can be cut for the second time. After that, a polarizer and a protective film can be attached to the side of the touch layer 08 away from the first organic film 03 to obtain the desired array substrate.

[0072] The present application provides an array substrate, which is prepared using the above-mentioned preparation method.

[0073] The yellowing phenomenon of the array substrate provided in the present application is greatly improved.

[0074] Fig.14 A schematic diagram of a display device provided in the present application.

[0075] The present application provides a display device 20, such as Fig.14 As shown, the display device 20 includes the array substrate 10 provided in the above embodiment. The display device 20 may be a mobile phone, or may be an electronic device such as a computer or a television.

[0076] The yellowing phenomenon of the screen of the display device 20 provided in the present application is greatly improved.

Claims

1. A method for preparing an array substrate, characterized in that: include: coating a first organic solution on the first inorganic layer of the substrate; The first organic solution includes fluorine element, the base includes a rigid substrate and the first inorganic layer, and the first inorganic layer is located on a first surface of the rigid substrate; solidifying the first organic solution to form a first organic film; peeling the first organic film from the substrate; The first surface contains first particles, and the concentration of the first particles on the surface of the first inorganic layer away from the rigid substrate is lower than the concentration on the first surface; the first particles include alkali metal elements or alkaline earth metal elements.

2. The preparation method according to claim 1, characterized in that: The initial concentration of the first particles on the first surface is ρ, and the concentration of the first particles at the first position in the first inorganic layer is ρ / e, where e is an exponential constant; Wherein, the thickness of the first inorganic layer is H, H>1.5 h, h is the distance between the first position and the surface of the first inorganic layer close to the rigid substrate.

3. The preparation method according to claim 1, characterized in that: The step of curing the first organic solution to form a first organic film includes: Under the condition that the oxygen content T is within a threshold range, the first organic solution is heated to be solidified to form the first organic film.

4. The preparation method according to claim 3, characterized in that: The threshold range is 0≤T≤10ppm.

5. The preparation method according to claim 1, characterized in that: After the first organic solution is solidified to form the first organic film and before the first organic film is peeled off from the substrate, the method further includes: Disposing a second inorganic layer on a side of the first organic film away from the substrate; Applying a second organic solution on a side of the second inorganic layer away from the first organic film; The second organic solution coated on the second inorganic layer is cured to form a second organic film.

6. The preparation method according to claim 5, characterized in that: The thickness of the first organic film is greater than the thickness of the second organic film.

7. The preparation method according to claim 1, characterized in that: The step of peeling the first organic film from the substrate comprises: The laser is irradiated from the rigid substrate side to the interface between the first inorganic layer and the first organic film to peel off the first organic film from the first inorganic layer.

8. The preparation method according to claim 7, characterized in that: The transmittance of the first inorganic layer to the laser is c, and c≥40%.

9. The preparation method according to claim 7, characterized in that: The wavelength L of the laser is ≤400nm.

10. The preparation method according to claim 1, characterized in that: Before peeling the first organic film from the substrate, the method further comprises: An array layer is prepared on a side of the first organic film away from the substrate, wherein the array layer includes a thin film transistor.

11. An array substrate, characterized in that: The preparation is carried out by the preparation method according to any one of claims 1 to 10.

12. A display device, characterized in that: Comprising the array substrate as claimed in claim 11.

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