Loudspeaker module

Abstract

A speaker module (100) is presented. The loudspeaker module (100) comprises a loudspeaker element (110), an interface (120) for receiving audio, a configurable driver circuit (130) configured to drive the loudspeaker element (110) based on audio provided from the interface (120), and a configuration circuit (140) operatively connected to the configurable driver circuit (130). The configurable driver circuit (130) is configured to operate in a first configuration in response to the configuration circuit (140) indicating a first state of the speaker module (100) and in a second configuration in response to the configuration circuit (140) detecting a second state of the speaker module (100). The first state is an earplug state and the second state is an in-ear state.

Description

Technical Field

[0001] The present disclosure relates to speaker modules, and more particularly, to speaker modules that are reconfigurable between a first state and a second state. Background Art

[0002] With the advent of mobile electronics and streaming media, accessing music, videos and interacting with others has become easy. No matter where you are, you can listen to your favorite music, talk to relatives, enjoy podcasts or audiobooks from, for example, your mobile phone. In order not to disturb others or allow others to eavesdrop on private conversations, it is common to enjoy streaming media through a listening device such as a pair of headphones or earphones.

[0003] Headphones can come in many different sizes and shapes, and there is no one perfect design that works for everyone and everywhere. The most practical and comfortable headphones for working out may be quite different from the most comfortable headphones for listening to an audiobook on the couch.

[0004] A common solution is to have a plurality of different headsets, and to use different headsets depending on the situation. This is not only expensive for the user, because several headsets must be obtained, but it is also inconvenient to store, carry and track a plurality of different headsets. In addition, the more headsets there are, the greater the negative environmental impact. For example, headsets are usually wireless devices, which means that they include batteries or other energy sources, which are not environmentally friendly. Any battery, semiconductor or other component of the headset may include rare materials (metals) or other components, which will have a negative impact on the environment when obtained, discarded or even recycled. As known, the production of any device (whether it is a headset or a car) generally generates a large amount of carbon footprint. Summary of the invention

[0005] In view of the above and other considerations, various embodiments of the present disclosure have been made. Accordingly, the present disclosure recognizes the fact that there is a need for alternatives (eg, improvements) to the prior art described above.

[0006] It is an aim of some embodiments to address, mitigate, alleviate or eliminate at least some of the above mentioned or other disadvantages.

[0007] An object of the present disclosure is to provide a novel loudspeaker module which is an improvement over the prior art and which obviates or at least mitigates one or more of the disadvantages discussed above. More specifically, an object of the present invention is to provide a loudspeaker module which is reconfigurable and which can be used in more than one configuration. These objects are achieved by the technology set out in the attached independent claims and the preferred embodiments defined in the associated dependent claims.

[0008] In a first aspect, a speaker module is provided. The speaker module includes a speaker element, an interface for receiving audio, a configurable driver circuit configured to drive the speaker element based on audio provided from the interface, and a configuration circuit operatively connected to the configurable driver circuit. The configurable driver circuit is configured to operate in a first configuration in response to the configuration circuit indicating a first state of the speaker module, and to operate in a second configuration in response to the configuration circuit detecting a second state of the speaker module. The first state is an earplug state, and the second state is an in-ear state.

[0009] In one variant, the configuration circuit comprises a sensor circuit configured to sense or otherwise detect a state of the speaker module. This is beneficial because automation of the state detection is simplified.

[0010] For example, the configuration circuit may be configured to determine the state of the speaker module by one or more of electromechanical detection, electroacoustic detection, or proximity sensing. In one variation, the sensor circuit may therefore include one or more of an electromechanical element, an electroacoustic element, or a proximity sensing element configured to detect the state of the speaker module. This is beneficial because automation of state detection is simplified.

[0011] In one variant, the configuration circuit comprises a user operable switch element operable in at least one of a first setting and a second setting, wherein the configuration circuit is configured to indicate the first state in response to the user operable switch element being set to the first setting, and to indicate the second state in response to the user operable switch element being set to the second setting. This is beneficial because the state detection can be controlled by the user, for example at the speaker module if it is a physical switch element, or remotely via, for example, a mobile phone if it is a switch element provided in software.

[0012] In a variant, the interface is configured for communication across a wireless interface, advantageously the wireless interface being a Bluetooth interface.

[0013] In one variation, the speaker module is further configured to communicate with the remote speaker module across a wireless interface. This is beneficial as it enables the speaker module to form part of a true wireless stereo system.

[0014] In one variation, the speaker module further comprises one or more microphones.The speaker module is configured to provide active noise cancellation (ANC) via a configurable driver circuit further configured to drive the speaker element based on audio obtained from the one or more microphones.

[0015] In a variant, the speaker module further comprises a housing arranged to at least partially surround the speaker element.

[0016] In a variant, the housing of the speaker module is formed as an earplug. This is advantageous because no additional elements are required when operating the speaker module in the earplug state.

[0017] In a second aspect, a reconfigurable earbud headset is presented. The reconfigurable earbud headset includes a speaker module and a removable earbud attachment element. The speaker module includes a speaker element, an interface for receiving audio, a configurable driver circuit configured to drive the speaker element based on the audio provided from the interface, and a configuration circuit operatively connected to the configurable driver circuit. The configurable driver circuit is configured to operate in a first configuration in response to the configuration circuit indicating a first state of the speaker module, and to operate in a second configuration in response to the configuration circuit indicating a second state of the speaker module, wherein the first state is an earbud state and the second state is an in-ear state. In addition, the removable earbud attachment element is configured to engage the configuration circuit when in use, and the configuration circuit is configured to indicate that the speaker module is in the first state in response to the engagement of the earbud attachment element.

[0018] For example, the configuration circuitry may be configured to determine the state of the speaker module by one or more of electromechanical detection, electroacoustic detection, or proximity sensing.

[0019] In one variation, the speaker module further comprises a housing arranged to at least partially surround the speaker element. The housing is provided with one or more openings configured to provide an audio path from the speaker element through the housing outwardly. The removable earbud attachment element is configured to further engage the audio path when in use, thereby providing an acoustically open resonance cavity between the speaker element and an eardrum of a user of the reconfigurable earbud headset.

[0020] In one variation, the removable earbud attachment element may be replaced by a removable in-ear attachment element configured to engage the configuration circuit in use. The configuration circuit is further configured to indicate that the speaker module is in the second state in response to engagement of the removable in-ear attachment element.

[0021] In a variant, the loudspeaker module is a loudspeaker module according to the first aspect.

[0022] In a third aspect, a reconfigurable in-ear headset is presented. The reconfigurable in-ear headset includes a speaker module and a removable in-ear attachment element. The speaker module includes a speaker element, an interface for receiving audio, a configurable driver circuit configured to drive the speaker element based on the audio provided from the interface, and a configuration circuit operatively connected to the configurable driver circuit. The configurable driver circuit is configured to operate in a first configuration in response to the configuration circuit indicating a first state of the speaker module, and to operate in a second configuration in response to the configuration circuit indicating a second state of the speaker module, wherein the first state is an earplug state and the second state is an in-ear state. The removable in-ear attachment element is configured to engage the configuration circuit when in use, and the configuration circuit is configured to indicate that the speaker module is in the second state in response to the engagement of the in-ear attachment element.

[0023] For example, the configuration circuitry may be configured to determine the state of the speaker module by one or more of electromechanical detection, electroacoustic detection, or proximity sensing.

[0024] In one variation, the speaker module further comprises a housing arranged to at least partially surround the speaker element. The housing is provided with one or more openings configured to provide an audio path from the speaker element through the opening of the housing to the outside. The removable in-ear attachment element is configured to further engage the audio path when in use, thereby providing a substantially closed resonance chamber between the speaker element and an eardrum of a user of the reconfigurable in-ear headphone.

[0025] In one variant, the reconfigurable in-ear headphone further comprises a housing. The housing is formed as an earplug and is arranged to at least partially surround the speaker element. This is beneficial because no additional elements are required when operating the speaker module in the earplug state.

[0026] In one variation, the configuration circuit is further configured to indicate that the speaker module is in the first state in response to removal of the in-ear attachment element.

[0027] In one variation, the removable in-ear attachment element may be replaced by a removable earbud attachment element configured to engage the configuration circuit in use. The configuration circuit is further configured to indicate that the speaker module is in the first state in response to engagement of the removable earbud attachment element.

[0028] In a variant, the loudspeaker module is a loudspeaker module according to the first aspect.

[0029] In a fourth aspect, a modular speaker system is presented. The modular speaker system comprises a speaker module according to the first aspect and a removable in-ear attachment element. The removable in-ear attachment element is configured to engage a configuration circuit when in use, and the configuration circuit is configured to indicate that the speaker module is in a second state in response to engagement of the removable in-ear attachment element.

[0030] In one variation, the modular speaker system further comprises a removable earbud attachment element. The removable earbud attachment element is configured to engage the configuration circuit in use, and the configuration circuit is configured to indicate that the speaker module is in the first state in response to engagement of the removable earbud attachment element.

[0031] In a variant, the modular loudspeaker system is a stereo system comprising at least two loudspeaker modules according to the first aspect, and at least two removable in-ear attachment elements.

[0032] In one variation, the modular speaker system is configured as a true wireless stereo system, a TWS system.

[0033] In a fifth aspect, a method for reconfiguring a speaker module is proposed. The speaker module includes a speaker element, an interface for receiving audio, a configurable driver circuit configured to drive the speaker element based on audio provided from the interface, and a configuration circuit operatively connected to the configurable driver circuit. The method includes determining the state of the speaker module by means of a sensor circuit of the configuration circuit (e.g., by one or more of electromechanical detection, electroacoustic detection, or proximity sensing), and in response to the determined state being a first state, configuring the speaker module in a first configuration. The method also includes configuring the speaker module in a second configuration in response to the determined state being a second state. The first state is an earplug state, and the second state is an in-ear state.

[0034] In one variation, the speaker module includes a sensor circuit. The method further includes fine-tuning the configurable driver circuit based on data obtained from the sensor circuit.

[0035] In a sixth aspect, a data processing circuit is provided. The data processing circuit is operatively connected to the speaker module according to the first aspect and is configured such that the method according to the fifth aspect is performed.

[0036] In a seventh aspect, a computer program product is provided comprising a non-transitory computer readable medium. The non-transitory computer readable medium has thereon a computer program comprising program instructions. The computer program is loadable into a data processing circuit and is configured such that when the computer program is executed by the data processing circuit, the method according to the fifth aspect is performed. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Embodiments of the invention will be described below; reference is made to the accompanying drawings which illustrate non-limiting examples of how the inventive concepts may be put into practice.

[0038] Figure 1a is the view of the ear,

[0039] Figure 1b This is a cross-section of the ear.

[0040] Figure 1c is a simplified cross-sectional view of an ear with an earbud headset according to some embodiments of the present disclosure,

[0041] Figure 1d is a simplified cross-sectional view of an ear with an in-ear earphone according to some embodiments of the present disclosure,

[0042] Figure 2a is a block diagram of a speaker module according to some embodiments of the present disclosure,

[0043] Figure 2b is a simplified perspective view of a speaker module according to some embodiments of the present disclosure,

[0044] Figure 3a -c is a perspective view of a speaker module and an in-ear attachment element according to some embodiments of the present disclosure,

[0045] Figure 4a -b is a perspective view of a speaker module and an earbud attachment element according to some embodiments of the present disclosure,

[0046] Figure 4c is a perspective view of a speaker module in the shape of an earbud headset according to some embodiments of the present disclosure,

[0047] Figure 5 is a block diagram of a configuration circuit according to some embodiments of the present disclosure,

[0048] Figure 6a is a diagram of a reconfigurable earbud headset according to some embodiments of the present disclosure,

[0049] Figure 6b is a diagram of a reconfigurable in-ear headset according to some embodiments of the present disclosure,

[0050] Figure 7a is a diagram of a reconfigurable earbud headset according to some embodiments of the present disclosure,

[0051] Figure 7b is a diagram of a reconfigurable in-ear headset according to some embodiments of the present disclosure,

[0052] Figure 8is a diagram of a true wireless speaker module according to some embodiments of the present disclosure,

[0053] Figure 9a -d is a diagram of a modular speaker system according to some embodiments of the present disclosure,

[0054] Fig.10 is a diagram of a modular speaker system according to some embodiments of the present disclosure,

[0055] Fig.11 is a block diagram of a method for reconfiguring a speaker module according to some embodiments of the present disclosure,

[0056] Fig.12 is a block diagram of a data processing circuit according to some embodiments of the present disclosure,

[0057] Fig.13 is a diagram of a computer program product according to some embodiments of the present disclosure, and

[0058] Fig.14 is a block diagram of the launchability of a computer program product according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0059] Hereinafter, certain embodiments will be described more fully with reference to the accompanying drawings. However, the invention described throughout this disclosure may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; on the contrary, these embodiments are provided by way of example so that this disclosure will be thorough and complete and will fully convey the scope of the invention to those skilled in the art, such as the scope defined in the appended claims.

[0060] The term "coupled" is defined as connected, although not necessarily directly connected, and not necessarily mechanically connected. Two or more items of "coupled" can be integral with each other. The terms "one" and "an" are defined as one or more, unless otherwise explicitly required by the present disclosure. As understood by those of ordinary skill in the art, the terms "substantially", "approximately" and "about" are defined as being largely but not necessarily completely specified. The terms "include" (and any form of including, such as "comprises" and "comprising"), "have" (and any form of having, such as "has" and "having"), "include" (and any form of including, such as "includes" and "including") and "contain" (and any form of containing, such as "contains" and "containing") are open linking verbs. Therefore, the method of "including", "having", "including" or "containing" one or more steps has those one or more steps, but is not limited to having only those one or more steps.

[0061] In this disclosure, the terms in-ear and earbuds will be used with reference to audio listening devices, such as headphones, earphones, etc. Throughout this disclosure, earphones are defined as any kind of headphone that engages primarily inside the outer ear 10 of the listener and is attached to the listener, see Figure 1a -b. This is different from, for example, earhook style headphones and / or over-ear style headphones, which are generally held in place by an arch member or the like that connects the left and right speakers of the headset and engages the user's head (e.g., rests on top of the head, biases the elements toward the ears, etc.) to ensure that the speakers remain in place. For consistency in terminology, Figure 1a A view of the ear 10 is shown, and Figure 1b The same ear 10 is shown in cross section. The ear 10 comprises a tragus 11 which partially blocks an ear canal 14 of the ear 10. The ear canal 14 opens into the concha 12 at one end facing outwards of the ear 10. Figure 1a and 1b In the embodiment, the concha 12 is located at a vertical upper end defined by the antihelix 13, and at a vertical lower end defined by the antitragus 15 and the intertragic notch 17. The intertragic notch 17 is located between the tragus 11 and the antitragus 15. Figure 1a and 1bThe presented ear 10 can be described as comprising three earphone fastening locations 1, 2, 3. The first earphone fastening location 1 is located in the ear canal 16. The second earphone fastening location 2 is located at or below the antitragus 15, i.e. behind the antitragus 15 between the antitragus 15 and the concha 12 or at a pocket at the bottom of the concha 12. The third earphone fastening location 3 is located at or below the antihelix 13, i.e. between the antihelix 13 and the concha 12.

[0062] Reference Figure 1c and Figure 1d The definitions followed when referring to earbud headphones (referred to as earbuds) and in-ear headphones (referred to as in-ear) throughout this disclosure are further explained. Figure 1c -d shows a simplified cross-sectional view of an ear 10 including an exemplary speaker module 100 according to the present disclosure. Figure 1c In FIG. 1 , the speaker module 100 is shown as being in an earplug configuration, that is, the speaker module 100 is configured as an earplug. Figure 1d , the same speaker module 100 is shown in an in-ear configuration, ie, the speaker module 100 is configured to be in-ear.

[0063] like Figure 1c As shown in FIG. 1 , an earbud earphone is an earphone that generally does not extend into the ear canal 14. The earbud is generally attached to the outside of the ear 10, for example at the second and third earphone fastening locations 2, 3. The earbud is characterized in that the earbud does not form a tight seal between the eardrum 16 and the earbud (or more precisely, the speaker element of the earbud). This means that there is no tight seal between the eardrum 16 and the speaker element 110 of the speaker module 100 (see FIG. 1 ). Figure 2a and 2b ) forms an open resonant cavity R (in Figure 1c That is, when the earplug is used (when the speaker module 100 is configured as an earplug), the ear canal 14 is in fluid communication with the outside O of the ear 10. In other words, the resonance chamber R is in acoustic fluid communication with the outside O of the ear 10.

[0064] Correspondingly, if Figure 1d As shown in FIG. 1 , an in-ear earphone is an earphone that generally extends into the ear canal 14. The in-ear earphone is generally attached to the inside of the ear 10, mainly at a first earphone fastening location 1. The in-ear is an earphone that forms a substantially airtight seal (generally containing small holes to avoid discomfort from, for example, a vacuum) around the ear canal 14. This means that a closed resonance chamber R (at the Figure 1dThat is, the in-ear (or the speaker module 100 when configured as an in-ear) is generally arranged to at least partially pass through the outer ear 12 and extend into the ear canal 14. The in-ear generally has a flexible tip that is configured to be arranged in the ear canal 14 so as to keep the in-ear attached to the ear 10. It should be mentioned that for the present disclosure, non-flexible tips are also considered, such as tips made of acrylic resin, especially for custom molds.

[0065] In-ear headphones or earbud headphones have advantages and disadvantages. For example, in-ear headphones generally provide a secure fit and a relatively good acoustic seal. In addition, functionality such as active noise cancellation ANC is relatively easy to implement and apply, with precise performance. However, in-ear headphones may be considered to convey a sense of isolation, because it may be difficult to hear the surroundings in a natural way. This is because the closed resonance chamber R effectively provides isolation from sounds outside the in-ear. Generally, the in-ear may be provided with a microphone 150 (see Figure 2a ) to provide hearing penetration functionality of surrounding sounds. Hearing penetration may cause discoloration, resonance, directionality issues, etc. On the other hand, earplugs are generally considered to be comfortable to wear for a long time, and due to their open resonance chamber R, earplugs provide better passive hearing penetration than in-ear. However, earplugs are generally more likely to allow sound to leak out of the ear 10 and noise to leak into the ear 10. Due to the open resonance chamber R and the general dynamic fit of the earplug, ANC is more challenging and may be insufficient in some cases.

[0066] refer to Figure 2a and 2b , the speaker module 100 will be further explained. Figure 2a The features of the speaker module 100 are schematically shown, and Figure 2b A schematic perspective view of a speaker module 100 is presented. The speaker module 100 comprises a speaker element 110, an interface 120 for receiving audio, and a configurable driver circuit 130. The configurable driver circuit 130 is configured to drive the speaker element 110 based on provided audio obtained by the interface 120. Preferably, the speaker module 100 comprises a housing 160. The housing 160 may be configured to at least partially surround the speaker element 110. In some embodiments, depending on how many speaker elements 110 are surrounded by the housing 160, it may be beneficial to provide the housing 160 with one or more openings 165 for audio emission. Figure 1c and 1d As indicated in FIG. 1 , the speaker module 100 may be configured in a first state (i) (eg, Figure 1c The speaker module 100 can also be configured to operate in the second state (ii) (as shown in FIG. Figure 1d) is operated in the in-ear state (ii) shown in . To this end, the speaker element 110 can be any suitable speaker element 110 suitable for providing sufficient sound pressure when the speaker module is configured to operate in the earplug state (i). Due to the open resonance cavity R, the earplug state (i) will generally require more power in order to achieve the desired sound pressure level (SPL). This additional power can be provided by a configurable driver circuit 130 that can increase its gain, and thereby increase the drive provided to the speaker element 110. Therefore, compared to when the speaker module 100 is configured to operate in the in-ear state (ii), when the speaker module 100 is configured to operate in the earplug state (i), the configurable driver circuit 130 is generally configured to increase the sound pressure provided by the speaker element 110. It should be mentioned that in order to ensure linear sound reproduction with limited undesirable distortion, both the speaker element 110 and the configurable driver circuit 130 are preferably sized to manage the higher SPL required in the earplug state (ii). Correspondingly, this can be described in the opposite way, that is, when the speaker module 100 is configured to operate in the in-ear state (ii), the configurable driver circuit 130 is generally configured to reduce the sound pressure provided by the speaker element 110 compared to when the speaker module 100 is configured to operate in the earplug state (i). In order to determine in which state (i), (ii) the configurable driver circuit 130 should operate, the speaker module 100 may further include a configuration circuit 140, which is configured to at least indicate whether the speaker module 100 is in the first state (i), the earplug state (i), or in the second state (ii), the in-ear state (ii). In response to the configuration circuit 140 indicating the first state (i), the configurable driver circuit 130 will be configured to operate in the first configuration, and in response to the configuration circuit 140 indicating the second state (ii), the configurable driver circuit 130 will be configured to operate in the second configuration. The first configuration is the earplug configuration, and the second configuration is the in-ear configuration.

[0067] As indicated above, the first configuration (earplug configuration) will generally include a higher gain than the second configuration (in-ear configuration). To reduce the risk of damaging the user's hearing, the speaker module 100 can be configured to the in-ear configuration (lower gain configuration) as the default configuration. In some embodiments, the configurable driver circuit 130 is configured to apply the in-ear configuration unless the earplug state (ii) is indicated by the configuration circuit 140.

[0068] like Figure 1c As seen in FIG. 1 , in the earplug state (i), an audio path A is provided to the user's eardrum 16 through the opening 165 of the housing 160. As indicated previously, this provides an acoustically open resonant cavity R, which is formed by Figure 1c. That is, the ear canal 14 is not sealed by the speaker module 100 in the earplug state (i), but is connected to the external fluid O of the ear 10. The resonance chamber R is preferably connected to the external fluid O in a path outside the speaker module 100 through, for example, a gap formed between the external ear 12 and the housing 160. Alternatively or additionally, a gap may be provided between the side of the speaker module 100 and the ear 10. That is, a gap may be formed between the housing 160 and, for example, the antihelix 13, the tragus 11, the intertragic notch 17 or the sinus ostium 15. In order to ensure controlled leakage, that is, the open nature of the resonance chamber R, the housing 160 may be provided with one or more controlled leakage holes 167. The controlled leakage holes 167 are preferably arranged to face one or more of the intentional gaps between the speaker module 100 and the ear 10. Additionally or alternatively, the resonance chamber R may be in fluid communication with the exterior O of the ear 10 in a path through the speaker module 100, for example through a gap between the speaker element 110 and the housing 160, which is a pair of openings at the back side (the side facing the exterior O of the ear 10) of the speaker module 100. It should be mentioned that if the speaker module 100 is provided with controlled leakage holes 167, it may be preferred, but not mandatory, to reduce the size of the controlled leakage holes 167 or to fluidly isolate them from the audio path A when the speaker module 100 is operated in the in-ear state (ii).

[0069] Correspondingly, if Figure 1d As can be seen in FIG. 1 , in the in-ear state (ii), a corresponding audio path A is provided to the user's eardrum 16 through the opening 165 of the housing 160. Due to the tight fit of the speaker module 100 in the first earphone fastening position 1, the second configuration (ii) provides an acoustically closed resonance chamber R, Figure 1d That is, in the in-ear state (ii), the ear canal 14 is substantially fluid-sealed with the exterior O of the ear 10 through the speaker module 100. As mentioned above, in order to reduce discomfort caused by, for example, a vacuum, the seal is preferably not airtight.

[0070] It should be mentioned that although only Figure 1c The controlled leak hole 167 is shown in the earplug of Figure 1d For in-ear, the controlled leakage hole 167 is beneficial to provide controlled leakage due to the inherent blocking effect of the in-ear earplug.

[0071] In addition, regardless of the configuration, it may be beneficial to provide a rear opening in the housing 160 as a rear vent (not shown). The rear vent is configured to allow the speaker membrane of the speaker element 110 to move freely (when generating sound waves) without air pressure forming on the back of the speaker element 110. That is, when the speaker membrane is pushed in a direction along the audio path A, air can be drawn into the housing 160 through the rear vent. Correspondingly, when the speaker membrane is pushed in the opposite direction of the audio path A, air can be pushed out of the housing 160 through the rear vent.

[0072] In some embodiments, the configurable driver circuit 130 may provide different equalization settings depending on which state (i), (ii) the configuration circuit 140 indicates. The equalization settings may include, for example, frequency-dependent gain, so that the gain curve may be different between configurations. For example, due to the open resonance cavity R of the earplug state (i), the configurable driver circuit 130 may be configured to apply a gain curve with a larger gain at a lower frequency in the first configuration compared to the gain curve applied in the second configuration. In other words, the configurable driver circuit 130 may be configured to provide more bass in the earplug state (i) compared to the in-ear state (ii). It should be said that the lower frequencies mentioned are for explanation reasons, as those skilled in the art will appreciate, due to changes in the resonance provided by the resonance cavity R, that is, changes in the acoustic environment, there are also very likely differences in other frequencies (e.g., mid-frequency and / or high-frequency regions). Depending on which state (i), (ii) the speaker module 100 is in, the configuration may be additionally or alternatively configured to provide different sound characteristics, such as different sound coloring.

[0073] It should be mentioned that, in addition to gain, there may be further differences between the first configuration and the second configuration. These may include different configurations for, for example, ANC (if used). To this end, the speaker module 100 may further include one or more microphones 150, Figure 2a -b. It should be noted that although Figure 2a -b each show only one microphone 150, but the speaker module 100 may include any number of microphones 150. Figure 2b, the placement of the microphone 150 at the opposite end of the opening 165 of the housing 160 (i.e., behind the speaker element 110) is an exemplary placement. In some embodiments, it is beneficial to arrange one or more microphones 150 in front of the speaker element 110, or to have microphones 150 both in front of and behind the speaker element 110. Some microphones 150 may be configured to obtain / detect / sense ambient sound (e.g., audio, noise, etc.) of the speaker module 100 and / or the ear canal 14. The speaker module 100 may be configured to provide ANC based on the ambient sound obtained by the microphone 150. The ambient sound is preferably obtained by one or more microphones 150, which are arranged to sense audio outside the ear 10 when in use. In some embodiments, to improve ANC, one or more microphones 150 may be configured as a reference microphone 150, which is arranged to sense audio in and / or at the ear canal 14. By removing the audio provided from the interface 120 from the ambient sound obtained from the reference microphone, the residual noise of the ear canal 14 can be estimated. Based on the residual noise, the efficiency of the ANC can be determined and controlled. Implementing ANC in earplugs or in-ear headphones is known to the skilled person. However, due to differences in, for example, sound leakage and resonance cavity size, the configuration of the ANC is very different between the ANC of earplugs and in-ear headphones. Therefore, the first configuration of the configurable driver circuit 130 may include an ANC setting configured for earplugs, and the second configuration of the configurable driver circuit 130 may include an ANC setting configured for in-ear. In addition, the configurable driver circuit 130 can be configured to (continuously / repeatedly) control (e.g., fine-tune) the ANC setting based on the residual noise of the ear canal 14.

[0074] In some embodiments, the speaker module 100 can be configured for use with a removable in-ear attachment element 210, or simply in-ear attachment element 210. Figure 3a -c. The in-ear attachment element 210 is preferably configured to fit comfortably and tightly in the ear canal 14 at the first earphone fastening location 1. Depending on the size of the speaker module 100 and the ear canal 14, the in-ear attachment element 210 may be formed differently. Figure 3a In FIG. 1-c, the speaker module 100 is illustrated as having a substantially cylindrical shape for reasons of explanation, and the speaker module 100 may be of any suitable regular or irregular shape, size or form. Figure 3aIn the embodiment, the speaker module 100 is a small speaker module 100 compared to the ear canal 14, and the speaker module 100 is configured to be at least partially arranged inside the in-ear attachment element 210. Additionally or alternatively, a protrusion or the like of the in-ear attachment element 210 can extend into the speaker module 100 and attach the in-ear attachment element 210 to the speaker module 100. Figure 3b In the embodiment, the speaker module 100 is larger than the ear canal 14, and the in-ear attachment element 210 is configured to be at least partially arranged inside the speaker module 100. Additionally or alternatively, a protrusion or the like of the speaker module 100 can extend into the in-ear attachment element 210 and attach the speaker module 100 to the in-ear attachment element 210. Figure 3c In the Figure 3b In another embodiment, the speaker module 100 is formed as an earplug. The in-ear attachment element 210 can be attached to the earplug-shaped speaker module 100 by, for example, engaging a protrusion of the speaker module 100 and / or be provided with a protrusion or other component configured to attach the in-ear attachment element 210 to the earplug-shaped speaker module 100.

[0075] In some embodiments, the speaker module 100 can be configured for use with a removable earbud attachment element 310, or simply earbud attachment element 310. Figure 4a and 4b The earplug attachment element 310 is preferably configured to fit comfortably in the concha 12 of the ear 10, or to attach to the outer contour of the ear 10 at, for example, the second and / or third earphone fastening locations 2, 3. As will be explained elsewhere, in some embodiments, the earplug attachment element 310 can be configured to engage and attach to the first earphone fastening location 1. The earplug attachment element 310 can be formed differently depending on the size of the speaker module 100 and the concha 12. As will be explained elsewhere, in some embodiments, the earplug attachment element 310 can be configured to engage and attach to the first earphone fastening location 1. Figure 3a -c, as shown in Figure 4a In FIGS. 1 and 2 , the speaker module 100 is illustrated as having a substantially cylindrical shape for reasons of explanation, and the speaker module 100 may be of any suitable regular or irregular shape, size or form. Figure 4a In the embodiment, the speaker module 100 is a small speaker module 100 compared to the outer ear 12, and the speaker module 100 is configured to be at least partially arranged inside the earplug attachment element 310. Additionally or alternatively, a protrusion or the like of the earplug attachment element 310 can extend into the speaker module 100 and attach the earplug attachment element 310 to the speaker module 100. Figure 4bIn the embodiment, the speaker module 100 is larger than the outer ear 12, and the earplug attachment element 310 is configured to be at least partially arranged inside the speaker module 100. Additionally or alternatively, a protrusion or the like of the speaker module 100 can extend into the earplug attachment element 310 and attach the speaker module 100 to the earplug attachment element 310. In both embodiments, Figure 4a The embodiment of is a preferred embodiment. Figure 3c As shown in , in some embodiments, the speaker module 100 can be formed as an earplug.

[0076] As explained, the configuration circuit 140 indicates at least whether the speaker module 100 is in the first state (i) or in the second state (ii). Figure 5 , the configuration circuit 140 may include a sensor circuit 145. The sensor circuit 145 may be configured to sense or otherwise detect the state (i), (ii) of the speaker module 100. As will be explained herein, the sensor circuit 145 may be configured to obtain the state (i), (ii) of the speaker module 100 in a variety of different ways. It should be mentioned that these different ways are not exclusive, but can be well combined. It should also be mentioned that the sensor circuit 145 is not necessarily included in the configuration circuit 140. The sensor circuit 145 may well be included in the speaker module 100 itself and operatively or directly connected to the configurable driver circuit 130 and / or the configuration circuit 140.

[0077] In some embodiments, the sensor circuit 145 may include an electromechanical element. The electromechanical element may be a mechanical switch that is arranged so that it changes state (open / closed) when the speaker module switches between a first state (i) and a second state (ii). Such an arrangement may be illustrated by the switch being arranged so that it is engaged when the speaker module 100 is inserted into the ear canal 14. In this configuration, insertion into the ear canal 14 triggers the switch so that the second state (ii) can be accurately indicated by the configuration circuit 140. Alternatively or additionally, the switch or additional switch may be arranged so that it is triggered when the speaker module 100 is engaged by the in-ear attachment component 210. This can be achieved by, for example, a protrusion of the speaker module 100 engaging the in-ear attachment element 210 and / or the earplug attachment element 310, and the protrusion activates (triggers) the switch. The opposite scenario may also be considered, where the in-ear attachment component 210 and / or the earplug attachment element 310 may be provided with a protrusion that triggers the switch. In such an embodiment, the configuration circuit 140 will instruct the speaker module 100 to be in the second state (ii) in response to the in-ear attachment element 210 being attached to (i.e., engaged) the speaker module 100, and / or instruct the speaker module 100 to be in the first state (i) in response to the earbud attachment element 310 being attached to (i.e., engaged) the speaker module 100. In some embodiments, one electromechanical element is arranged to be engaged by the in-ear attachment element 210, and one electromechanical element is arranged to be engaged by the earbud attachment element 310.

[0078] In some embodiments, the sensor circuit 145 may include an optical sensor. The optical sensor may be arranged to detect light entering the speaker module 100 through one or more status indication openings. In some embodiments, the status indication opening is different from the opening 165 and / or the controlled leakage hole 167 of the housing 160 of the speaker module 100. In some embodiments, more than one optical sensor is provided, one of which is arranged to detect light from the controlled leakage hole 167 and / or the opening 165, and one is arranged to detect light from one or more indication openings. The state (i), (ii) of the speaker module 100 can be determined by comparing the light detected from different openings. When the indication opening is covered, shielded or otherwise engaged by, for example, the in-ear attachment element 210 or the earplug attachment element 310, the sensor circuit 145 may be configured to detect the corresponding state (i), (ii), and the configuration circuit may indicate the state (i), (ii) accordingly. In some embodiments, one optical sensor is arranged to be engaged by the in-ear attachment element 210, and / or one optical sensor is arranged to be engaged by the earplug attachment element 310.

[0079] In some embodiments, one or more optical sensors may be configured to detect the proximity of an object by time of flight. This may be accomplished by providing a light source and detecting the time of flight of light generated by the light source traveling from the light source to the object and back to the optical sensor. The object may be a segment or portion of an earplug and / or in-ear attachment element 210, 310.

[0080] In some embodiments, the sensor circuit 145 may include an electroacoustic element, such as a microphone or an ultrasonic transducer. If implemented as a microphone, the microphone may be a dedicated microphone or one or more microphones 150 configured to provide feedback, for example, for ANC. The electroacoustic element may be configured to determine the sound leakage from the resonance chamber R, for example, by comparing the sound provided by the speaker element 110 and / or the ultrasonic transducer with the sound detected by the microphone 150 (or the ultrasonic transducer, if applicable) (preferably the sound at the ear canal 14). Sound leakage or an indicator of sound leakage may be provided to the configuration circuit 140. The configuration circuit 140 may be configured to compare the leakage with a state leakage threshold. In response to the leakage being lower than the state leakage threshold, the configuration circuit 140 may be configured to indicate that the speaker module 100 is in the second state (ii). In response to the leakage being higher than the state leakage threshold, the speaker module 100 may be configured to indicate that the speaker module 100 is in the first state (i). In some embodiments, the state leakage threshold is defined as a range so as to provide a hysteresis in the indication of the states (i) and (ii) of the speaker module 100.

[0081] In some embodiments, the sensor unit 145 may include a proximity sensing element. The proximity sensing element may be a capacitive sensor, an optical sensor, an ultrasonic transducer, etc. The proximity sensing element may be arranged to sense the distance to the eardrum 16, the distance to the wall of the ear canal 14, the distance to the outer ear 12, etc. In some embodiments, the proximity sensing element is arranged to be engaged by the in-ear attachment element 210. In some embodiments, the proximity sensing element is arranged to be engaged by the earplug attachment element 310. In some embodiments, one proximity sensing element is arranged to be engaged by the in-ear attachment element 210, and one proximity sensing element is arranged to be engaged by the earplug attachment element 310.

[0082] In some embodiments, the configuration circuit 140 includes a user-operable switch element. The user-operable switch element is preferably operable between at least two settings, the first setting corresponding to a first state (i), i.e., an earplug state (i), and the second setting corresponding to a second state (ii), i.e., an in-ear state (ii). The configuration circuit 140 is preferably configured to indicate the states (i), (ii) of the speaker module 100 according to the settings of the user-operable switch element. The user-operable switch element may be a physical switch or button, preferably included in the speaker module, and configurable by a user of the speaker module 100. In some embodiments, the user-operable switch element is a software setting, which may be controlled by a user via a wireless interface such as Bluetooth, for example. In some embodiments, the user-operable switch element may be controlled by an application running on a mobile phone wirelessly connected to the speaker module 100.

[0083] It should be noted that the presented embodiments of configuration circuit 140 and sensing circuit 145 are for illustrative purposes. It should be noted that these various embodiments may well be combined, duplicated, or otherwise improved to improve the speed and / or accuracy of the indication provided by configuration circuit 140.

[0084] Preferably, the in-ear attachment element 210 is formed as a passive device, such as a silicone sleeve, which is removably attached to the speaker module 100. However, in some embodiments, the in-ear attachment element 210 may be provided with a suitable identification token, such as an RFID chipset, an ID resistor, etc., which allows the sensing circuit 145 to sense not only that the in-ear attachment element 210 is attached, but also the type of the in-ear attachment element 210. The sensing circuit 145 may optionally be configured to associate the in-ear attachment element 210 with a specific user, and configure the configurable driver circuit 130 to control the speaker element 110 according to the settings associated with the specific user. In some embodiments, the earplug attachment element 310 may be provided with a suitable identification token, such as an RFID chipset, an ID resistor, etc., which allows the sensing circuit 145 to sense not only that the earplug attachment element 210 is attached, but also the type of the earplug attachment element 210. The sensing circuit 145 may optionally be configured to associate the earbud attachment element 210 with a particular user and configure the configurable driver circuit 130 to control the speaker element 110 according to settings associated with the particular user. This correspondence may be achieved with the earbud attachment element 310 including an identification token.

[0085] It has been shown that the configurable driver circuit 130 can provide different ANC settings and / or frequency-dependent gains depending on the state (i), (ii) of the speaker module 100. However, the configurable driver circuit 130 can also be configured to control (i.e., fine-tune) the frequency-dependent gain depending on changes in the acoustic environment. These changes may occur due to changes in the fit of the speaker module 100 at the ear 10, causing the shape / size / form of the resonance cavity R to change. Fine-tuning of the frequency-dependent gain can be based on data, indications, measurements, etc. obtained from any suitable embodiment of the sensing circuit 145. In a preferred embodiment, one or more microphones 150 are configured to estimate the sound at the ear canal 14. The configuration circuit 130 can be configured to detect changes in sound leakage (due to, for example, changes in the fit of the speaker module 100) based on the estimated sound at the ear canal 14 and control the frequency-dependent gain accordingly. Additionally or alternatively, one or more microphones 150 can be configured to estimate the ambient sound of the speaker module. The configuration circuit 130 can be configured to detect changes in ambient noise (due to, for example, the presence of loud vehicles or noisy people) based on the estimated ambient sound and control the frequency-dependent gain accordingly, such as increasing the SPL of the played audio, so that the signal-to-noise ratio at the ear canal 14 is substantially constant.

[0086] refer to Figure 6a and Figure 6b , an exemplary embodiment of a speaker module 100 and earphones 200 , 300 will be presented. Figure 6aThe speaker module 100 is shown in a first state (i) (earplug state (i)). The speaker module 100 is provided with an earplug attachment element 310, which is arranged as a member surrounding the speaker module 100 (not necessarily radially surrounding). The earplug attachment element 310 can be formed with an external member 312 and an internal member 314, the external member 312 is preferably shaped to fit the user's ear 10, and the internal member 314 is arranged between the external member 312 and the speaker module 100. The internal member 314 can be provided with an opening, and the speaker module 100 can be inserted into the opening. The external member 312 is arranged radially around the speaker module 100 and is configured to engage, for example, the outer ear 12, the anti-helix 13, the tragus 11, the intertragus notch 17 and / or the anti-tragus 15 to attach the earplug attachment element 310 to the ear 10. The inner member 314 is attached to the outer member 312 at one end and is configured to engage the speaker module 100 at the other end. The inner member 314 is configured to face the ear canal 14 and may be provided with one or more earplug attachment element openings 317. The earplug attachment element openings 317 are through-hole openings configured to provide an acoustically open resonance cavity R between the eardrum 16 and the exterior O of the speaker module 100. If the open resonance cavity R is provided by other components, such as an air gap and / or a controlled leakage hole 167 between the earplug attachment element 310 and the ear 10, the earplug attachment element openings 317 may be omitted. In this embodiment, the speaker module 100 is provided with an electromechanical sensor circuit 145, which is arranged on a side of the speaker module at one end of the speaker module 100 including the opening 165, i.e., towards the audio path A, but facing the direction of the outer ear 12 / ear canal 14. The speaker module 100 may be inserted into the earbud attachment element 310 in a direction opposite to the audio path A so that the earbud attachment element 310 may be attached to the speaker module 100 without triggering the electromechanical sensor circuit.

[0087] exist Figure 6b , the same speaker module 100 is shown, but with an in-ear attachment element 210 arranged around the speaker module 100. That is, Figure 6bThe speaker module 100 is in the second state (ii) (in-ear state (ii)). The in-ear attachment element 210 includes an internal member 214, which is configured to engage and attach to the speaker module 100 at one end and extend toward the eardrum 16 at the other end when in use. In other words, the internal member 214 is open at both ends so as to provide an audio path A from the opening 165 of the speaker module to the eardrum 16. The internal member 214 can be configured to directly engage the inner surface of the ear canal 14 and form a seal along the inner surface of the ear canal 14. However, in order to increase comfort and allow greater flexibility, the in-ear attachment element 210 is preferably provided with an external member 212, which is radially arranged on the outside of the internal member 214 and connected to the internal member 214, preferably at an end configured to face the eardrum 16. In such an embodiment, the external member 214 is configured to directly engage the inner surface of the ear canal 14 and form a seal along the inner surface of the ear canal 14. The outer member 212 may be arranged such that an air gap is formed between the inner member 214 and the outer member 212, thereby allowing for increased flexibility and comfort of the in-ear attachment element 210. Preferably, the in-ear attachment element 210 is attached to the speaker module 100 by inserting the speaker module 100 into the in-ear attachment element 210 in a direction along the audio path A. When inserted, the sensor circuit 145 (in this embodiment, in the form of an electromechanical sensor circuit) is triggered when the in-ear attachment element 210 is attached to the speaker module 100.

[0088] Go to Figure 7a , showing the Figure 6a 1, but the speaker module 100 is shown in an embodiment including a controlled leakage hole 167. The controlled leakage hole 167 provides an open acoustic path from the eardrum 16 to the exterior O of the speaker module 100. In such an embodiment, the earplug attachment element opening 317 is optional, but can be provided, for example, to increase the acoustic opening effect.

[0089] However, if the speaker module 100 includes controlled leakage holes 167, these holes are preferably covered when the speaker module 100 is configured to operate in the in-ear state (ii). Figure 7b , where the in-ear attachment element 210 is configured to cover the controlled leakage hole 167 of the speaker module 100. To this end, the in-ear attachment element 210 is provided with a cylindrical portion 216. The cylindrical portion 216 is closed at one end and is open at the opposite end attached to the inner sleeve 214. When used as an in-ear headphone, the speaker module 100 can be inserted into the open end of the cylindrical portion 216. The sensor circuit 145 can preferably be arranged on the back side of the speaker module 100, i.e. on the same side of the speaker module 100 as the controlled leakage hole 167, but can correspond to Figure 6a -b is arranged. In this way, the speaker module 100 is correctly (e.g., sufficiently) interested in the open end of the cylindrical portion 216 of the in-ear attachment element 210, and the in-ear attachment element 210 triggers the sensor circuit 145. In some embodiments not shown, the cylindrical portion 216 may be provided with an opening that is smaller in size than the controlled leakage hole 167 and is configured to be radially arranged outside the controlled leakage hole 167. This is to reduce the blocking effect inherent in the closed resonance cavity R.

[0090] refer to Figure 6a-7b The illustrated attachment elements 210, 310 may be explained as being circular or substantially circular in their engagement with the speaker module 100, ear 10, concha 12, antihelix 13, tragus 11, intertragic notch 17, antitragus 15, and / or ear canal 16. However, this is for reasons of explanation only, and any or all of these engagements may be of any suitable shape, size, or form.

[0091] The speaker module 100 (according to any embodiment or example disclosed herein) including the removable earbud attachment element 310 (according to any embodiment or example disclosed herein) may be referred to as a reconfigurable earbud headset 300, such as, for example Figure 6a or Figure 7a as shown in .

[0092] The speaker module 100 (according to any embodiment or example disclosed herein) including the removable in-ear attachment element 210 (according to any embodiment or example disclosed herein) may be referred to as a reconfigurable in-ear headphone 200, such as, for example Figure 6b or Figure 7b as shown in .

[0093] In some embodiments, the attachment element 210, 310 is a custom attachment element 210, 310 adapted for a specific user. This means that the attachment element 210, 310 can be sized for the specific shape of the user's ear 10, concha 12, antihelix 13, tragus 11, intertragic notch 17, antitragus 15, and / or ear canal 14.

[0094] exist Figure 8, two speaker modules 100 according to the present disclosure are shown. The speaker module 100 can be any of the speaker modules 100 presented herein, but is configured with a wireless interface 10 and is configured to communicate with another (remote) speaker module 100 across the wireless interface. In this configuration, the speaker module 100 can be referred to as true wireless stereo (TWS). TWS100 will wirelessly transmit the required information, control data, and synchronization to provide a true stereo (or more channel) experience to the user without any cables between the speaker modules 100. It should be mentioned that the teachings of the present disclosure also apply to embodiments in which two or more speaker modules are connected via a wired interface 10.

[0095] As indicated previously, the configurable driver circuit 130 is configured to drive the speaker element 110 based on the audio provided from the interface 120 and the indication provided by the configuration circuit 140. However, in some embodiments, the configuration circuit 140 and / or the sensor circuit 145 can be further configured to provide detailed control data, thereby allowing the configurable driver circuit 130 to compensate for, for example, the changed fit of the speaker module 100, as presented by the reference frequency-dependent gain. In addition, in TWS and / or ANC-enabled embodiments, the configuration circuit 140 can be configured to provide detailed control data related to, for example, the sound pressure difference detected between the speaker modules 100 in TWS embodiments, the leakage changes or differences between the speaker modules 100 in ANC embodiments, etc. Such changes may occur due to differences or changes in how the speaker module 100 fits the user's ear 10. The control can be viewed as a relatively slow external control loop that determines the states (i), (ii) of the speaker module 100, and a relatively fast internal control loop that is configured to fine-tune the performance of the configurable driver circuit 130 (e.g., fine-tune the TWS configuration, gain, frequency-dependent gain and / or ANC configuration) based on changes in the fit of the speaker module 100, the acoustic environment, etc.

[0096] For example, assume that the internal control loop of the speaker module 100 detects increased leakage. The gain (and optionally its frequency characteristics) can be controlled to compensate for the increase in sound leakage. It is further assumed that the speaker module 100 forms part of a TWS, and the sound leakage requires an increase in gain (and optionally its frequency characteristics) that saturates or at least maximizes the gain available from the configurable driver circuit 130 and / or the speaker element 110. In order to avoid an SPL imbalance between the speaker modules 100 forming a TWS system, the configurable driver circuit 130 of another speaker module 100 can be configured to reduce the gain (and optionally its frequency characteristics) to match the perceived SPL of the other speaker module 100. This provides a more balanced and comfortable listening experience.

[0097] refer to Figures 9a to 9d , shows some examples of illustrative implementations of a modular speaker system 500. The modular speaker system 500 includes a speaker module 100, an in-ear attachment element 210, and an optional earbud attachment element 310. Figure 9a In the embodiment, the modular speaker system 500 is shown to include a speaker module 100 having a general earplug shape and configured to be provided with an in-ear attachment element 210 or an earplug attachment element 310. Figure 9a As seen in FIG. 1 , both the in-ear attachment element 210 and the earplug attachment element 310 are shaped as tip elements, wherein the in-ear attachment element 210 is configured to enter the ear canal 14 as previously explained. In this embodiment, the earplug attachment element 310 is optional, but may be attached to the speaker module 100 to provide a more comfortable fit of the speaker module 100 in the ear 10 and a more controlled leakage of the open resonance chamber R provided in the earplug state (i). Figure 9b In, with Figure 9a The same speaker module 100 and in-ear attachment element 210 are shown, but rotated so that the opening 165 of the housing 160 of the speaker module 100 is visible. Figure 9b In FIG. 1 , the ridge 169 of the housing 160 is visible. Figure 9a -b attachment elements 210, 310 can be configured to be arranged around the periphery of the ridge 169 when attached to the speaker module 100. Both attachment elements 210, 310 can be configured in this manner, but in some embodiments, one or both of the attachment elements 210, 310 are configured to be arranged inside the ridge 169 so that the protrusions of the attachment elements 210, 310 engage the inner periphery of the ridge 169. In a preferred embodiment, the in-ear attachment device 210 is configured to engage the outer periphery of the ridge 169, and the earbud attachment element 310 is configured to engage the inner periphery of the ridge 169.

[0098] exist Fig.9c middle, Figure 9a The speaker module 100 and the in-ear attachment element 210 are shown connected to form the in-ear earphone 200. As indicated previously, this configuration may be referred to as a reconfigurable in-ear earphone 200. The in-ear attachment element 210 will form a tight seal with the ear canal 14 and attach the in-ear earphone 200 at the first earphone fastening location 1. Since the housing 160 of the speaker module 100 is formed as an earplug in this embodiment, the in-ear earphone 200 may be further attached at the second earphone fastening location 2 and / or optionally, depending on the design of the housing 160 of the speaker module 100, at the third earphone fastening location 3.

[0099] Correspondingly, Figure 9d The earphone 300 is shown connected to form an earbud Figure 9a The speaker module 100 and the earplug attachment element 310. As indicated previously, this configuration may be referred to as a reconfigurable earplug earphone 300. The earplug attachment element 310 may be configured to partially extend into the ear canal 14, but will not form a tight seal between the eardrum 16 and the speaker element 110. As a result, the earplug earphone 300 will be attached at the first earphone fastening location 1. Preferably, the earplug earphone 300 will not only be attached to the ear at the ear canal 14 (i.e., the first earphone fastening location 1), but may form a softer locking point than in-ear, which partially helps to fix or retain the earplug with the help from other fastening locations 2, 3. Preferably, the earplug earphone 300 will rely most on the fastening at the second fastening location 2, more preferably having an additional third fastening location 3 (i.e., at the anti-helix or at the intertragus notch 17) to create a more secure fit. Since the housing 160 of the speaker module 100 is formed as an earplug in this embodiment, the earplug earphone 300 can be further attached at the second earphone fastening position 2 and / or optionally, depending on the design of the housing 160 of the speaker module 100, at the third earphone fastening position 3.

[0100] exist Fig.10 , an overview of a plurality of different attachment elements 210, 310 is shown together with a speaker module 100 according to the present disclosure. This overview may be referred to as one embodiment of a modular speaker system 500, although other embodiments of the modular speaker system 500 may well be comprised of the speaker module 100 and Fig.10 Any subset of the attachment elements 210, 310 is formed. Fig.10 , two types of attachment elements 210, 310 are shown, horizontally aligned with the speaker module 100. On the left side of the speaker module, a tip-type attachment element 210, 310 is shown, while on the right side, a sleeve-type attachment element 310 is shown.

[0101] The tip-type attachment elements 210, 310 are characterized in that they generally engage the ear canal 14 and are adapted to be attached at the first earphone fastening location 1. The leftmost tip-type attachment element 210 is a tip-type in-ear attachment element 210 configured with a custom tip. The custom tip may be molded, configured, or otherwise adapted to fit comfortably in the ear canal 14 of a particular ear 10. The second tip-type attachment element 210 from the left is a tip-type in-ear attachment element 210 with a universal tip, e.g., Fig.9c The tip-type in-ear attachment element 210 is configured to form a closed resonance chamber R between the eardrum 16 and the speaker element 110 when in use. The tip-type attachment element 310 closest to the left side of the speaker module 100 is a tip-type earplug attachment element 310, see for example Figure 9d The tip-type earplug attachment element 310 is configured to extend partially into the ear canal 14 when in use and form an open resonance chamber R between the eardrum 16 and the speaker element 110 .

[0102] The sleeve-type attachment elements 310 are characterized in that they generally engage the ear 10 outside the ear canal 14 and are suitable for attachment at the second earphone fastening location 2 and / or the third earphone fastening location 3. The two sleeve-type attachment elements 310 on the right side of the speaker module 100 are both sleeve-type earplug attachment elements 310. The sleeve-type attachment elements 310 are characterized in that a sleeve is formed around the speaker module 100. Some sleeve-type attachment elements 310 may be customized sleeve-type attachment elements 310 (not shown) configured or otherwise adapted to fit comfortably in a specific ear 10 at the second earphone fastening location 2 and / or the third earphone fastening location 3. The rightmost sleeve-type earplug attachment element 310 includes a wing member 312. The wing member 312 is configured to engage the third earphone fastening location 3 and securely attach the sleeve-type earplug attachment element 310 at the third earphone fastening location 3. The wing member 312 may be a flexible or rigid wing member 312.

[0103] exist Fig.10 , an earbud attachment element 310 is shown directly below the speaker module 100. The earbud attachment element 310 includes a sleeve member 317 and a tip member 315. The sleeve member 317 may be Fig.10 The sleeve-type earplug attachment element 310 is shown closest to the right side of the speaker module 100, and the tip member 315 can be Figure 9d In combination, they form the earplug attachment element 310 because the tip member provides an open resonance cavity R. The tip member 315 and the sleeve member 317 can be fixedly attached to each other, formed as a single piece or as separate members that are separately attached to the speaker module 100. Fig.10, below which, a corresponding in-ear attachment element 210 is shown. The in-ear attachment element 210 includes a sleeve member 217 and a tip member 215. The sleeve member 217 may be Fig.10 The sleeve-type earplug attachment element 310 is shown closest to the right side of the speaker module 100, and the tip member 215 can be Fig.9c In combination, they form the in-ear attachment element 210 because the tip member provides a closed resonance chamber R. The tip member 215 and the sleeve member 217 can be fixedly attached to each other, formed as a single piece or as separate members that are separately attached to the speaker module 100.

[0104] For completeness, in Fig.10 The earplug attachment element 310 includes a tip member 315, which may be a custom tip member 315 that provides an open resonance cavity R. The corresponding in-ear attachment element 210 is shown as including a tip member 215, which may be a Fig.10 Custom tip member 215 is shown in the upper left corner of FIG.

[0105] exist Fig.11 In FIG. 4 , a method 400 for reconfiguring a speaker module 100 is shown. The speaker module 100 may be any speaker module 100 as presented herein (e.g., with reference to FIG. 2 ), with or without the speaker module 100 as presented in reference to FIG. Figure 5 Optional features presented. Method 400 includes determining 410 states (i), (ii) of the speaker module 100. States (i), (ii) may be determined according to any suitable example, embodiment or feature presented herein. Preferably, states (i), (ii) are determined by means of sensor circuit 145, as described in detail herein. Method 400 also includes, if it is determined that the speaker module 100 is in a first state (i), configuring 420 the speaker module 100 to a first configuration, i.e., an earplug configuration. Method 400 also includes, if it is determined that the speaker module 100 is in a second state (ii), configuring 430 the speaker module 100 to a second configuration, i.e., an in-ear configuration. Method 400 may also include performing ANC using a configuration based on the detected states (i), (ii). In some embodiments, the method includes 400 fine-tuning 450 the performance of the configurable driver circuit 130. Fine-tuning and / or ANC may be performed according to any embodiment described in detail herein. The method 400 may also include performing, based on the detected states (i), (ii), controlling the TWS functionality of the speaker module 100. In some embodiments, the method includes 400, fine-tuning 450 the TWS performance of the configurable driver circuit 130 according to any embodiment described in detail herein.

[0106] exist Fig.12 , a data processing circuit 600 is shown. The data processing circuit 600 is operatively connected to the speaker module 100 as presented herein. In some embodiments, the data processing circuit 600 is included in the speaker module 100. The data processing circuit 600 is configured to perform the operations described in reference to Fig.11 Method of presentation.

[0107] exist Fig.13 In FIG. 8 , a computer program 800 is shown. The computer program 800 includes program instructions 810. These program instructions 810 are configured to execute as described in reference to FIG. Fig.11 The method 400 described herein. The computer program 800 may be stored on a non-transitory computer readable medium 710 forming part of the computer program product 700 (in Fig.13 The figure shows an old-fashioned floppy drive. Fig.14 As seen in FIG. 8 , the computer program 800 may be loaded into the data processing circuit 600 so that when executed by the data processing circuit 600, the data processing circuit 600 causes the data processing circuit 600 to perform the processing as described in reference to FIG. Fig.11 Execution of method 400 is described.

[0108] Those skilled in the art who have benefited from the teachings presented in the foregoing description and the associated drawings will appreciate modifications and other variations of the described embodiments. Therefore, it is to be understood that the embodiments are not limited to the specific example embodiments described in the present disclosure, and modifications and other variations are intended to be included within the scope of the present disclosure. For example, although embodiments of the present invention have been described with reference to in-ear and earbud headphones, those skilled in the art will appreciate that embodiments of the present invention can be equally applied to any other configuration of headphones. In addition, although specific terms may be used herein, they are used only in a general and descriptive sense, and not for the purpose of limitation. Therefore, those skilled in the art will recognize a variety of variations of the described embodiments, which will still fall within the scope of the appended claims. In addition, although individual features may be included in different claims (or embodiments), these features may be advantageously combined, and the inclusion of different claims (or embodiments) does not imply that the combination of features is not feasible and / or disadvantageous. In addition, singular references do not exclude pluralities. Finally, the figure numerals in the claims are provided merely as illustrative examples and should not be interpreted as limiting the scope of the claims in any way.

Claims

1. A speaker module (100), comprising a speaker element (110), an interface (120) for receiving audio, a configurable driver circuit (130) configured to drive the speaker element (110) based on audio provided from the interface (120), and a configuration circuit (140) operatively connected to the configurable driver circuit (130); wherein The configurable driver circuit (130) is configured to operate in a first configuration in response to the configuration circuit (140) indicating a first state (i) of the speaker module (100), and to operate in a second configuration in response to the configuration circuit (140) detecting a second state (ii) of the speaker module (100), wherein the first state (i) is an earplug state (i) and the second state (ii) is an in-ear state (ii).

2. The loudspeaker module (100) according to claim 1, wherein: The configuration circuit (140) includes a sensor circuit (145) configured to sense or otherwise detect the state (i, ii) of the speaker module (100).

3. The speaker module (100) according to claim 2, wherein: The sensor circuit (140) comprises an electromechanical element configured to detect the state (i, ii) of the speaker module (100).

4. The loudspeaker module (100) according to claim 2 or 3, wherein: The sensor circuit (140) includes an electroacoustic element configured to detect the state (i, ii) of the speaker module (100).

5. The loudspeaker module (100) according to claim 2, 3 or 4, wherein: The sensor circuit (140) includes a proximity sensing element configured to detect the state (i, ii) of the speaker module (100).

6. The loudspeaker module (100) according to any one of the preceding claims, wherein The configuration circuit (140) includes a user-operable switch element capable of operating in at least one of a first setting and a second setting, wherein the configuration circuit (140) is configured to indicate the first state (i) in response to the user-operable switch element being set to the first setting, and to indicate the second state (ii) in response to the user-operable switch element being set to the second setting.

7. The loudspeaker module (100) according to any one of the preceding claims, wherein The interface (120) is configured for communication across a wireless interface (10), advantageously a Bluetooth interface.

8. The speaker module (100) of claim 7, further configured to communicate with a remote speaker module (100) across the wireless interface (10).

9. The speaker module (100) according to any one of the preceding claims, further comprising one or more microphones (150), wherein: The speaker module (100) is configured to provide active noise cancellation (ANC) via the configurable driver circuit (130), which is further configured to drive the speaker element (110) based on audio obtained from the one or more microphones (150).

10. The loudspeaker module (100) according to any of the preceding claims, further comprising a housing (160) arranged to at least partially surround the loudspeaker element (110).

11. The loudspeaker module (100) according to claim 10, wherein: The housing (160) of the speaker module (100) is formed as an earplug.

12. A reconfigurable earbud headset (300), comprising a speaker module (100) and a removable earbud attachment element (310), wherein the speaker module (100) comprises a speaker element (110), an interface (120) for receiving audio, a configurable driver circuit (130) configured to drive the speaker element (110) based on audio provided from the interface (120), and a configuration circuit (140) operatively connected to the configurable driver circuit (130); wherein The configurable driver circuit (130) is configured to operate in a first configuration in response to the configuration circuit (140) indicating a first state (i) of the speaker module (100), and to operate in a second configuration in response to the configuration circuit (140) indicating a second state (ii) of the speaker module (100), wherein the first state is an earplug state (i) and the second state (ii) is an in-ear state (ii); and The removable earbud attachment element (310) is configured to engage the configuration circuit (140) when in use, and the configuration circuit (140) is configured to indicate that the speaker module (100) is in the first state (i) in response to the engagement of the earbud attachment element (310).

13. The reconfigurable earbud headset (300) of claim 12, wherein: The speaker module (100) further comprises a housing (160) arranged to at least partially surround the speaker element (110), wherein The housing (160) is provided with one or more openings (165) configured to provide an audio path (A) from the speaker element (110) through the housing (160) outwardly, and The removable earbud attachment element (310) is configured to further engage the audio path (A) when in use, thereby providing an acoustically open resonance chamber (R) between the speaker element (110) and the eardrum (16) of a user of the reconfigurable earbud headset (300).

14. The reconfigurable earbud headset (300) of claim 12 or 13, wherein: The removable earbud attachment element (310) is replaceable by a removable in-ear attachment element (210), the removable in-ear attachment element (210) being configured to engage the configuration circuit (140) when in use, and the configuration circuit (140) being further configured to indicate that the speaker module (100) is in the second state (ii) in response to the engagement of the removable in-ear attachment element (210).

15. The reconfigurable earbud headset (300) of any one of claims 12 to 14, wherein: The loudspeaker module (100) is the loudspeaker module (100) according to any one of claims 1 to 10.

16. A reconfigurable in-ear headphone (200), comprising a speaker module (100) and a removable in-ear attachment element (210), the speaker module (100) comprising a speaker element (110), an interface (120) for receiving audio, a configurable driver circuit (130) configured to drive the speaker element (110) based on audio provided from the interface (120), and a configuration circuit (140) operatively connected to the configurable driver circuit (130); wherein The configurable driver circuit (130) is configured to operate in a first configuration in response to the configuration circuit (140) indicating a first state (i) of the speaker module (100), and to operate in a second configuration in response to the configuration circuit (140) indicating a second state (ii) of the speaker module (100), wherein the first state (i) is an earplug state (i) and the second state (ii) is an in-ear state (ii); and The removable in-ear attachment element (210) is configured to engage the configuration circuit (140) in use, and the configuration circuit (140) is configured to indicate that the speaker module (100) is in the second state (ii) in response to engagement of the in-ear attachment element (210).

17. The reconfigurable in-ear headphone (200) of claim 16, wherein: The speaker module (100) further comprises a housing (160) arranged to at least partially surround the speaker element (110), wherein The housing (160) is provided with one or more openings (165) configured to provide an audio path (A) from the speaker element (110) outwardly through the openings (165) of the housing (160), and The removable in-ear attachment element (210) is configured to further engage the audio path (A) when in use, thereby providing a substantially closed resonance chamber (R) between the speaker element (110) and an eardrum (16) of a user of the reconfigurable in-ear headphone (200).

18. The reconfigurable in-ear earphone (200) of claim 16 or 17, further comprising a housing (160), wherein the housing (160) is formed as an earplug and is arranged to at least partially surround the speaker element (110).

19. The reconfigurable in-ear headphone (200) of claim 18, wherein: The configuration circuit (140) is further configured to indicate that the speaker module (100) is in the first state (i) in response to removal of the in-ear attachment element (200).

20. The reconfigurable in-ear headphone (200) of claim 16 or 17, wherein: The removable in-ear attachment element (210) is replaceable by a removable earbud attachment element (310), the removable earbud attachment element (310) being configured to engage the configuration circuit (140) when in use, and the configuration circuit (140) being further configured to indicate that the speaker module (100) is in the first state (i) in response to the engagement of the removable earbud attachment element (310).

21. The reconfigurable in-ear earphone (200) of any one of claims 16 to 20, wherein: The loudspeaker module (100) is the loudspeaker module (100) according to any one of claims 1 to 10.

22. A modular speaker system (500) comprising the speaker module (100) of any one of claims 1 to 11 and a removable in-ear attachment element (210), wherein the removable in-ear attachment element (210) is configured to engage the configuration circuit (140) when in use, and the configuration circuit (140) is configured to indicate that the speaker module (100) is in the second state (ii) in response to the engagement of the removable in-ear attachment element (210).

23. The modular speaker system (500) of claim 22, further comprising a removable earbud attachment element (310), wherein: The removable earbud attachment element (310) is configured to engage the configuration circuit (140) when in use, and the configuration circuit (140) is configured to indicate that the speaker module (100) is in the first state (i) in response to the engagement of the removable earbud attachment element (310).

24. The modular loudspeaker system (500) of claim 22 or 23, wherein: The modular loudspeaker system (500) is a stereo system comprising at least two loudspeaker modules (100) according to any one of claims 1 to 11 and at least two removable in-ear attachment elements (210).

25. The modular loudspeaker system (500) of any one of claims 22 to 24, wherein: The modular speaker system (500) is configured as a true wireless stereo system, a TWS system.

26. A method (400) for reconfiguring a speaker module (100), the speaker module (100) comprising a speaker element (110), an interface (120) for receiving audio, a configurable driver circuit (130) configured to drive the speaker element (110) based on audio provided from the interface (120), and a configuration circuit (140) operatively connected to the configurable driver circuit (130), the method (400) comprising: determining (410) the state of the loudspeaker module (100) by means of a sensor circuit (145) of the configuration circuit (140); In response to the determined state being the first state (i), configuring (420) the speaker module (100) in a first configuration; as well as In response to the determined state being the second state (ii), configuring (430) the speaker module (100) in a second configuration; wherein The first state (i) is an earplug state (i), and the second state (ii) is an in-ear state (ii).

27. The method (400) of claim 26, wherein: The speaker module (145) includes a sensor circuit (145), and the method (400) further includes: The configurable driver circuit (130) is fine-tuned (450) based on data obtained from the sensor circuit (145).

28. A data processing circuit (600) operatively connected to the loudspeaker module (100) of any one of claims 1 to 11 and configured such that the method of claim 26 or 27 is performed.

29. A computer program product (700) comprising a non-transitory computer readable medium (710) having a computer program (800) comprising program instructions (810) thereon, the computer program (800) being loadable into a data processing circuit (600) and being configured to cause the method (400) according to claim 26 or 27 to be performed when the computer program is executed by the data processing circuit (600).

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