LED and preparation method thereof

Abstract

The invention relates to the technical field of photoelectricity, and discloses a dispensing head of an LED die bonder, the dispensing head comprises a glue containing cavity and a glue nozzle which are communicated with each other, the glue nozzle comprises a flow guide cavity and a flow guide pipe which are communicated with each other, the flow guide pipe is provided with a glue outlet, a sealing part is arranged in the glue nozzle, a gap is arranged between the sealing part and the inner wall of the glue nozzle, and the glue containing cavity and the glue nozzle are communicated with each other. And the sealing part is elastically connected to the interior of the glue nozzle through a spring, so that the sealing part reciprocates in the flow guide cavity and the flow guide pipe. According to the dispensing head of the LED die bonder provided by the invention, the online duration of glue can be prolonged, spin coating is eliminated, and glue waste is reduced.

Description

Technical Field

[0001] The present invention relates to the field of optoelectronic technology, and in particular to an LED and a preparation method thereof. Background Art

[0002] The LED chip and the bracket are fixed by adhesive. The adhesive is loaded on the adhesive tray. The dispensing head on the die bonder consists of a dispensing head and a dispensing arm. The dispensing arm can rotate and swing back and forth between the adhesive tray and the LED bracket. During the die bond operation, the dispensing head is used to dip the adhesive from the adhesive tray, and then the dispensing arm is rotated to transfer the adhesive to the LED bracket.

[0003] In order to avoid the occurrence of insufficient or insufficient adhesive during the crystal bonding operation, a large amount of adhesive needs to be added to the adhesive tray so that the dispensing head can dip into a sufficient amount of adhesive. Due to the small size of LED chips, the actual amount of adhesive required is small, and the adhesive has a limit on the online time. Most of the adhesive in the adhesive tray must be cleaned after the online time is reached, and the adhesive tray must be cleaned and new adhesive is added again. This process will cause a waste of adhesive, with a waste ratio of about 40% to 60%.

[0004] In addition, the adhesive is transferred by the back-and-forth rotation and swing of the dispensing arm, which has a slow movement speed and low efficiency in the bonding process. When the dispensing arm rotates too fast during the movement of the dispensing head, the adhesive adhering to the tip of the dispensing head will separate from the dispensing head, i.e., the adhesive will be thrown off. When the amount of adhesive in the adhesive tray is lower than the specified amount, it is necessary to manually squeeze the adhesive from the syringe into the adhesive tray, which consumes a lot of human resources. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a glue dispensing head for an LED die-bonding machine, which increases the online time of glue, eliminates glue throwing, and reduces glue waste.

[0006] In order to solve the above-mentioned technical problems, the present invention provides a dispensing head for an LED crystal bonding machine, comprising a glue containing cavity and a glue nozzle that are interconnected, the glue nozzle comprising a flow guide cavity that is interconnected and a flow guide tube that is provided with a glue outlet, a sealing component is provided in the glue nozzle, a gap is provided between the sealing component and the inner wall of the glue nozzle, the sealing component is elastically connected to the inside of the glue nozzle by a spring to realize reciprocating motion of the sealing component in the flow guide cavity and the flow guide tube.

[0007] In some embodiments, a fixing strip is provided inside the nozzle, the fixing strip is fixedly connected to the inner wall of the nozzle, and a spring is provided between the fixing strip and the sealing component so that the spring is elastically connected to the inside of the nozzle through the fixing strip.

[0008] In some embodiments, the shape of the colloid-containing cavity is cylindrical or rectangular; the shape of the flow-guiding cavity is conical; and the shape of the flow-guiding tube is cylindrical or rectangular.

[0009] In some embodiments, the shape of the sealing member matches the shape of the nozzle.

[0010] In some embodiments, the sealing component includes a body, and a guide rod is provided on one side of the body close to the glue outlet.

[0011] In some embodiments, a side of the guide rod close to the glue outlet is provided with a fork.

[0012] In some embodiments, the glue containing cavity includes a glue inlet and a glue outlet, and the glue outlet is connected to the flow guiding cavity of the glue nozzle.

[0013] In some embodiments, the glue inlet is provided on a side of the glue containing cavity.

[0014] In some embodiments, the glue inlet is provided on the top surface of the glue containing cavity.

[0015] In some embodiments, a clamping portion is provided on the glue-containing cavity.

[0016] The implementation of the present invention has the following beneficial effects:

[0017] The glue dispensing head of the LED crystal bonding machine provided by the present invention comprises a glue containing cavity and a glue nozzle which are interconnected, the glue nozzle comprises a flow guiding cavity which is interconnected and a flow guiding tube which is provided with a glue outlet, a sealing component is provided in the glue nozzle, a gap is provided between the sealing component and the inner wall of the glue nozzle, and the sealing component is elastically connected to the inside of the glue nozzle by a spring to realize the reciprocating movement of the sealing component in the flow guiding cavity and the flow guiding tube.

[0018] When the dispensing head provided by the present invention is pressed down to the bottom of the LED bracket, the sealing component is subjected to external pressure, which can overcome the elastic force of the spring so that the spring is compressed and opened, and the flow channel is opened, allowing the adhesive glue to flow out through the gap; when the dispensing head is lifted, the spring pushes the sealing component down, the flow channel is closed, and the adhesive stops flowing out. After the adhesive glue of the dispensing head provided by the present invention is used up, the adhesive glue syringe is directly replaced without the action of washing the glue tray. The loss rate of the adhesive glue is reduced, the efficiency of dispensing glue is improved, the number of people adding glue is reduced, and labor costs are saved. The dispensing head of the present invention only moves in the vertical direction and is fixed in the left and right or front and back directions, so there is no problem of glue throwing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of a dispensing head of an LED die-bonding machine provided in one embodiment of the present invention;

[0020] Figure 2 A structural schematic diagram of a glue dispensing head of an LED die bonding machine provided by another embodiment of the present invention;

[0021] Figure 3 A schematic diagram of the structure of a dispensing head of an LED die-bonding machine provided by an embodiment of the present invention when the flow channel is opened;

[0022] Figure 4 A schematic diagram of the structure of a dispensing head of an LED die-bonding machine provided by an embodiment of the present invention when the flow channel is closed;

[0023] Figure 5 A schematic diagram of the structure of a dispensing head and a syringe of an LED die bonding machine provided by an embodiment of the present invention when being fixed;

[0024] Figure 6 A schematic structural diagram of a dispensing head and a syringe of an LED die bonding machine provided by another embodiment of the present invention when being fixed. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. In addition, it should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0026] In the description of the present invention, it is necessary to understand that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0028] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0030] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the examples of various specific processes and materials provided by the present invention, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0031] In the present invention, "preferred" and "better" are only used to describe implementation methods or embodiments with better effects, and it should be understood that they do not constitute a limitation on the scope of protection of the present invention. In the present invention, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features. In the present invention, when involving numerical ranges, unless otherwise specified, the two endpoints of the numerical range are included.

[0032] To solve the above problems, Figure 1 and Figure 2As shown, the present invention provides a glue dispensing head for an LED crystal bonding machine, comprising a glue containing cavity 1 and a glue nozzle 2 which are interconnected, the glue nozzle 2 comprising a flow guiding cavity 21 which are interconnected and a flow guiding tube 22 which is provided with a glue outlet, a sealing component 3 is provided in the glue nozzle 2, a gap is provided between the sealing component 3 and the inner wall of the glue nozzle 2, the sealing component 3 is elastically connected to the inside of the glue nozzle 2 by a spring 4, so as to realize the reciprocating motion of the sealing component 3 in the flow guiding cavity 21 and the flow guiding tube 22.

[0033] like Figure 3 and Figure 4 As shown, when the dispensing head provided by the present invention is pressed down to the bottom of the LED bracket, the sealing component 3 is subjected to external pressure, which can overcome the elastic force of the spring 4 so that the spring 4 is compressed and opened, and the flow channel is opened, allowing the adhesive glue to flow out through the gap; when the dispensing head is lifted, the spring 4 pushes the sealing component 3 down, the flow channel is closed, and the adhesive stops flowing out. After the adhesive is used up by the dispensing head provided by the present invention, the adhesive syringe 200 is directly replaced without the action of washing the glue tray. The loss rate of the adhesive is reduced, the efficiency of dispensing is improved, the number of people adding glue is reduced, and the labor cost is saved. The dispensing head of the present invention only moves in the vertical direction and is fixed in the left and right or front and back directions, so there is no problem of glue throwing.

[0034] The structure of the dispensing head is described in detail below.

[0035] The glue containing cavity 1 is used to store glue and is the glue supply source for the glue dispensing head.

[0036] In some embodiments, the shape of the colloid-containing cavity 1 is cylindrical or rectangular.

[0037] In some embodiments, the glue containing cavity 1 includes a glue inlet 11 and a glue outlet, and the glue outlet is connected to the flow guiding cavity 21 of the glue nozzle 2 .

[0038] like Figure 6 As shown, in some embodiments, the glue inlet 11 is provided on the side of the glue holding cavity 1. In these embodiments, the glue inlet 11 of the glue dispensing head 100 is connected to a soft conduit, which is then connected to the adhesive syringe 200, and then the glue dispensing head 100 applies glue to the LED bracket 300.

[0039] like Figure 5 As shown, in some embodiments, the glue inlet 11 is provided with the top surface of the glue containing cavity 1. Preferably, the glue inlet 11 is provided with an internal thread. In these embodiments, the glue dispensing head 100 can be docked on the syringe 200 of the adhesive glue; and a positive pressure air pipe is installed on the syringe 200 of the adhesive glue to push the adhesive plug downward, push the adhesive glue to be continuously input into the glue dispensing head, and then the glue dispensing head 100 applies glue to the LED bracket 300.

[0040] In some embodiments, the adhesive holding cavity 1 is provided with a clamping portion 12. The clamping portion 12 is used to be connected to a die bonding machine.

[0041] The glue nozzle 2 is used for discharging glue. The glue nozzle 2 includes a flow guiding cavity 21 and a flow guiding tube 22, wherein the flow guiding cavity 21 is connected with the glue containing cavity 1, and is used to guide the glue to flow from the glue containing cavity 1 to the flow guiding tube 22. The flow guiding tube 22 is provided with a glue outlet, which is the channel for the glue to finally flow out. The flow guiding tube 22 is connected with the flow guiding cavity 21 to ensure that the glue can flow smoothly from the flow guiding cavity 21 to the flow guiding tube 22.

[0042] In some embodiments, the shape of the flow guide cavity 21 is conical. The design of the conical flow guide cavity 21 means that its cross-sectional area gradually decreases from the end away from the glue outlet to the end close to the glue outlet. The conical design helps to better control the flow of glue. In addition, in the conical structure, the pressure loss during the flow of glue may be more uniform, reducing the problem of uneven glue dispensing caused by uneven pressure. The conical design also helps to reduce the risk of glue clogging in the flow guide cavity 21. Due to the change in cross-sectional area, impurities or bubbles in the glue are more easily squeezed out or dispersed during the flow process, thereby reducing the possibility of clogging.

[0043] In some embodiments, the shape of the guide tube 22 is cylindrical or rectangular. Due to the constant cross-sectional area, the resistance encountered by the glue during the flow process is relatively uniform, thereby reducing flow fluctuations. Both shapes of the guide tube 22 help to achieve precise positioning of glue dispensing. When the glue flows out of the guide tube 22, its flow direction is clear and stable, which helps to accurately transport the glue to the target location.

[0044] Preferably, the guide tube 22 is cylindrical in shape, and the diameter of the guide tube 22 can be designed according to the shape of the chip and the length and width of the chip. In some embodiments, the diameter of the guide tube 22 is 0.5 mm to 2 mm. This range is conducive to saving rubber.

[0045] The sealing component 3 is arranged inside the glue nozzle 2. In the non-glue dispensing state, the sealing component 3 is used to prevent glue leakage; when dispensing glue, glue is allowed to pass through. A gap is provided between the sealing component 3 and the inner wall of the glue nozzle 2. This design helps to reduce the resistance to the flow of glue during glue dispensing and ensures that the sealing component 3 can smoothly reciprocate in the flow guide cavity 21 and the flow guide tube 22. The sealing component 3 is elastically connected to the inside of the glue nozzle 2 by a spring 4. The elastic force of the spring 4 enables the sealing component 3 to remain in a closed state when not subjected to external force, thereby preventing glue leakage. When subjected to external pressure, the sealing component 3 can overcome the elastic force of the spring 4 and open, allowing glue to flow out.

[0046] In some embodiments, a fixing strip 5 is provided inside the nozzle 2, and the fixing strip 5 is fixedly connected to the inner wall of the nozzle 2. A spring 4 is provided between the fixing strip 5 and the sealing component 3 so that the spring 4 is elastically connected to the inside of the nozzle 2 through the fixing strip 5.

[0047] In some embodiments, the shape of the sealing component 3 matches the shape of the nozzle 2 .

[0048] In some embodiments, the sealing component 3 includes a body, and a guide rod 31 is provided on one side of the body close to the glue outlet. The shape of the guide rod 31 matches the shape of the guide tube 22; the shape of the guide rod 31 can be cylindrical or rectangular.

[0049] In some embodiments, the length of the guide rod 31 exceeds the length of the guide tube 22, and the guide rod 31 extends out of the glue outlet when in a non-dispensing state. Preferably, the shape of the guide rod 31 is cylindrical. In some embodiments, the diameter of the guide rod 31 is 0.4mm to 1.6mm. In some embodiments, the length of the guide rod 31 exceeding the glue outlet is 0.5mm to 2mm. The dimensions of the guide rod 31 and the guide tube 22 can be designed according to the chip shape and the length and width of the chip, and are not limited to the above range, but the above range is conducive to saving glue.

[0050] In some embodiments, a fork is provided on one side of the guide rod 31 near the glue outlet. The fork at the bottom allows the adhesive to flow to the middle to avoid insufficient or lack of adhesive in the middle.

[0051] The working principle of the sealing component 3 is as follows:

[0052] In the non-glue dispensing state, the sealing component 3 remains in a closed state under the elastic force of the spring 4, and fits tightly against the inner wall of the flow guide tube 22 or the flow guide cavity 21, effectively preventing glue leakage.

[0053] In the glue dispensing state, external pressure acts on the sealing component 3, causing it to open by overcoming the elastic force of the spring 4. The glue flows from the glue containing cavity 1 through the flow guiding cavity 21 into the flow guiding tube 22 and flows out from the glue outlet. The glue is finally applied to the LED bracket via the flow guiding rod.

[0054] After the dispensing is completed, the external pressure disappears, and the sealing component 3 is closed again under the elastic force of the spring 4 and returns to the initial position to prepare for the next dispensing.

[0055] The present invention is further described below with specific embodiments:

[0056] Example 1

[0057] The present embodiment provides a glue dispensing head of an LED crystal bonding machine, comprising a glue containing cavity and a glue nozzle that are interconnected, the glue nozzle comprising a flow guide cavity that is interconnected and a flow guide tube that is provided with a glue outlet, a sealing component is provided in the glue nozzle, a gap is provided between the sealing component and the inner wall of the glue nozzle, the sealing component is elastically connected to the inside of the glue nozzle by a spring, so as to realize the reciprocating movement of the sealing component in the flow guide cavity and the flow guide tube.

[0058] Example 2

[0059] The present embodiment provides a glue dispensing head of an LED crystal bonding machine, comprising a glue containing cavity and a glue nozzle that are interconnected, the glue nozzle comprising a flow guide cavity that is interconnected and a flow guide tube that is provided with a glue outlet, a sealing component is provided in the glue nozzle, a gap is provided between the sealing component and the inner wall of the glue nozzle, the sealing component is elastically connected to the inside of the glue nozzle by a spring, so as to realize the reciprocating movement of the sealing component in the flow guide cavity and the flow guide tube.

[0060] The guide tube is cylindrical in shape, and its diameter is 0.5 mm. The sealing component comprises a body, and a guide rod is provided on one side of the body close to the glue outlet. The guide rod is cylindrical in shape. The diameter of the guide rod is 0.4 mm, and the length of the guide rod beyond the glue outlet is 0.5 mm.

[0061] Example 3

[0062] The present embodiment provides a glue dispensing head of an LED crystal bonding machine, comprising a glue containing cavity and a glue nozzle that are interconnected, the glue nozzle comprising a flow guide cavity that is interconnected and a flow guide tube that is provided with a glue outlet, a sealing component is provided in the glue nozzle, a gap is provided between the sealing component and the inner wall of the glue nozzle, the sealing component is elastically connected to the inside of the glue nozzle by a spring, so as to realize the reciprocating movement of the sealing component in the flow guide cavity and the flow guide tube.

[0063] The guide tube is cylindrical in shape, and its diameter is 1 mm. The sealing component comprises a body, and a guide rod is provided on one side of the body close to the glue outlet. The guide rod is cylindrical in shape. The diameter of the guide rod is 0.8 mm, and the length of the guide rod beyond the glue outlet is 1 mm.

[0064] Example 4

[0065] The present embodiment provides a glue dispensing head of an LED crystal bonding machine, comprising a glue containing cavity and a glue nozzle that are interconnected, the glue nozzle comprising a flow guide cavity that is interconnected and a flow guide tube that is provided with a glue outlet, a sealing component is provided in the glue nozzle, a gap is provided between the sealing component and the inner wall of the glue nozzle, the sealing component is elastically connected to the inside of the glue nozzle by a spring, so as to realize the reciprocating movement of the sealing component in the flow guide cavity and the flow guide tube.

[0066] The guide tube is cylindrical in shape, and its diameter is 2 mm. The sealing component comprises a body, and a guide rod is provided on one side of the body close to the glue outlet. The guide rod is cylindrical in shape. The diameter of the guide rod is 1.6 mm, and the length of the guide rod beyond the glue outlet is 2 mm.

[0067] Comparative Example 1

[0068] This comparative example provides a dispensing head for an LED crystal bonding machine, including a dispensing head body. That is, a conventional dispensing head in the prior art. In the prior art, the adhesive is loaded on a glue tray, and the dispensing device on the crystal bonding machine is composed of a dispensing head and a dispensing arm, and the dispensing arm can rotate and swing back and forth between the glue tray and the LED bracket. During the crystal bonding operation, the dispensing head is used to dip the adhesive from the glue tray, and then the adhesive is transferred to the LED bracket through the rotation of the dispensing arm.

[0069] The actual effects of dispensing glue using the dispensing heads of Example 1 and Comparative Example 1 are compared, and the specific results are shown in Table 1.

[0070] Table 1 Effect of dispensing by dispensing head of Example 1 and Comparative Example 1

[0071]

[0072] The amounts of glue used in glue dispensing using the glue dispensing heads provided in Examples 2 to 4 are compared, and the specific results are shown in Table 2.

[0073] Table 2 Glue amount used by the glue dispensing head provided in Examples 2 to 4

[0074]

[0075] In the description of this specification, the description with reference to the terms "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0076] The above is a preferred embodiment of the invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the invention. These improvements and modifications are also considered to be within the scope of protection of the invention.

Claims

1. A dispensing head for an LED die-bonding machine, characterized in that: The invention comprises a glue containing cavity and a glue nozzle which are interconnected, wherein the glue nozzle comprises a flow guiding cavity which is interconnected and a flow guiding tube which is provided with a glue outlet, a sealing component is provided in the glue nozzle, a gap is provided between the sealing component and the inner wall of the glue nozzle, and the sealing component is elastically connected to the inside of the glue nozzle by a spring to realize the reciprocating movement of the sealing component in the flow guiding cavity and the flow guiding tube.

2. The dispensing head of the LED die bonding machine according to claim 1, characterized in that: A fixing strip is arranged inside the nozzle, and the fixing strip is fixedly connected to the inner wall of the nozzle. A spring is arranged between the fixing strip and the sealing component, so that the spring is elastically connected to the inside of the nozzle through the fixing strip.

3. The dispensing head of the LED die bonding machine according to claim 1, characterized in that: The shape of the colloid-containing cavity is cylindrical or rectangular; the shape of the flow-guiding cavity is conical; the shape of the flow-guiding tube is cylindrical or rectangular.

4. The dispensing head of the LED die bonding machine according to claim 1, characterized in that: The shape of the sealing component matches the shape of the nozzle.

5. The dispensing head of the LED die bonding machine according to claim 1, characterized in that: The sealing component comprises a body, and a flow guide rod is arranged on one side of the body close to the glue outlet.

6. The dispensing head of the LED die bonding machine as claimed in claim 5, characterized in that: A fork is provided on one side of the guide rod close to the glue outlet.

7. The dispensing head of the LED die bonding machine according to claim 1, characterized in that: The glue containing cavity comprises a glue inlet and a glue outlet, and the glue outlet is connected to the flow guiding cavity of the glue nozzle.

8. The dispensing head of the LED die bonding machine according to claim 1, characterized in that: The glue inlet is provided on the side of the glue containing cavity.

9. The dispensing head of the LED die bonding machine according to claim 1, characterized in that: The glue inlet is provided with a top surface of the glue containing cavity.

10. The dispensing head of the LED die bonding machine according to claim 1, characterized in that: A clamping portion is provided on the glue containing cavity.

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