An electromagnetic radiation intensity prediction method and system integrated with an isolation chip

Abstract

The present disclosure relates to the technical field of electromagnetic compatibility test and evaluation, and particularly relates to a method and system for predicting electromagnetic radiation intensity of an integrated isolation chip. The method comprises: converting a first electromagnetic field model of a transformer into an equivalent circuit model, and obtaining simulated parasitic electrical parameters; comparing the measured parasitic electrical parameters with the simulated parasitic electrical parameters to adjust the equivalent circuit model; inputting the common-mode current of the adjusted equivalent circuit model as an excitation signal into a second electromagnetic field model of a PCB evaluation board to obtain an electromagnetic radiation intensity simulation result of the integrated isolation chip, wherein the common-mode current is determined as the main radiation source of the integrated isolation chip; comparing the electromagnetic radiation intensity simulation result with an electromagnetic radiation intensity measurement result to adjust the second electromagnetic field model, and obtaining an electromagnetic radiation intensity prediction model of the integrated isolation chip. The present disclosure can accurately predict the radiation intensity of the isolation chip, reduce the necessity of multiple rounds of sampling and testing, and improve the reliability and stability of chip design.

Description

A method and system for predicting electromagnetic radiation intensity using an integrated isolation chip. Technical Field

[0001] This disclosure relates to the field of electromagnetic compatibility testing and evaluation technology, specifically to a method and system for predicting electromagnetic radiation intensity using an integrated isolation chip. Background Technology

[0002] With the accelerating trend towards miniaturization and integration of electronic devices, integrated isolation chips are increasingly being used in power management, signal processing, and data transmission. However, this trend also presents greater challenges to electromagnetic compatibility (EMI) design. Specifically, miniaturization and integration lead to more compact circuit layouts, smaller spacing between components, and more complex wiring, introducing more parasitic parameters and coupling paths. These factors make electromagnetic interference (EMI) problems more prominent. Furthermore, the trend towards higher frequencies results in continuously increasing operating frequencies of power switching devices and faster voltage changes, leading to higher-frequency electromagnetic noise and increasing system EMI noise.

[0003] Current electromagnetic compatibility (EMC) design for integrated isolation chips primarily relies on empirical prototyping and testing methods, optimizing the design through multiple rounds of experimentation and adjustments. This approach has significant drawbacks, including high time consumption, high costs, and uncertain results. The lengthy prototyping and testing cycles significantly delay overall development time, increasing time to market. Furthermore, frequent sample production and testing involve high manufacturing and experimental costs, especially in the development of high-frequency transformers, where material and human resource inputs increase substantially. In addition, existing methods heavily depend on the designer's experience for adjustments, making accurate radiation prediction during the design phase impossible. Summary of the Invention

[0004] To address the problems in related technologies, this disclosure provides a method and system for predicting electromagnetic radiation intensity using an integrated isolation chip.

[0005] In a first aspect, this disclosure provides a method for predicting electromagnetic radiation intensity using an integrated isolation chip, the integrated isolation chip including a transformer, the method comprising:

[0006] Establish the first electromagnetic field model of the transformer;

[0007] The first electromagnetic field model is converted into an equivalent circuit model;

[0008] The simulated parasitic electrical parameters of the transformer are obtained based on the equivalent circuit model.

[0009] Obtain the measured parasitic electrical parameters of the transformer, compare the measured parasitic electrical parameters with the simulated parasitic electrical parameters to obtain a first comparison result, and adjust the equivalent circuit model based on the adjustment scheme determined according to the first comparison result and the preset simulation error threshold to obtain the adjusted equivalent circuit model.

[0010] A second electromagnetic field model of the integrated isolation chip PCB evaluation board is established. The common-mode current generated by the parasitic capacitance coupling between the primary and secondary coils of the transformer in the adjusted equivalent circuit model is used as the excitation signal and input into the second electromagnetic field model. Multiple detection points are set in the second electromagnetic field model to obtain the simulation results of the electromagnetic radiation intensity of the integrated isolation chip. The common-mode current is determined to be the main radiation source of the integrated isolation chip.

[0011] Obtain the electromagnetic radiation intensity measurement results of the integrated isolation chip, compare the electromagnetic radiation intensity simulation results and the electromagnetic radiation intensity measurement results to obtain a second comparison result, adjust the second electromagnetic field model based on the adjustment scheme determined according to the second comparison result and the preset simulation error threshold, and use the adjusted second electromagnetic field model as the electromagnetic radiation intensity prediction model of the integrated isolation chip.

[0012] According to an embodiment of this disclosure, establishing the first electromagnetic field model of the transformer includes: obtaining the size parameters and material parameters of the transformer, and establishing the first electromagnetic field model of the transformer based on the size parameters and material parameters of the transformer;

[0013] The establishment of the second electromagnetic field model of the integrated isolation chip PCB evaluation board includes: obtaining the dimensional parameters of the peripheral circuit of the integrated isolation chip and the material parameters of the transformer, and establishing the second electromagnetic field model of the integrated isolation chip PCB evaluation board based on the dimensional parameters of the peripheral circuit of the integrated isolation chip and the material parameters of the transformer.

[0014] According to embodiments of this disclosure, the simulated parasitic electrical parameters include any one or more of the following: simulated parasitic inductance, simulated parasitic resistance, and simulated parasitic capacitance;

[0015] The measured parasitic electrical parameters include any one or more of the following: measuring parasitic inductance, measuring parasitic resistance, and measuring parasitic capacitance.

[0016] According to an embodiment of this disclosure, the parasitic electrical parameters are measured by measuring the transformer using a test circuit board assembly; wherein the test circuit board assembly includes: a short-circuit test board, an open-circuit test board, a load test board, and a through-circuit test board;

[0017] The short-circuit test board is used to perform short-circuit tests on the transformer;

[0018] The open-circuit test board is used to perform open-circuit tests on the transformer;

[0019] The load test board is used to perform load tests on the transformer;

[0020] The through-through test board is used to perform through-through testing on the transformer.

[0021] According to embodiments of this disclosure, the electromagnetic radiation intensity measurement results are obtained using an electromagnetic interference testing platform set up in a dark room;

[0022] The electromagnetic interference testing platform includes: a signal generator, a test cable, a receiving antenna, and an electromagnetic interference receiver; the signal generator is connected to the integrated isolation chip PCB evaluation board through the test cable, and the electromagnetic interference receiver is connected to the receiving antenna through the test cable, with a set distance between the receiving antenna and the integrated isolation chip PCB evaluation board;

[0023] The signal generator emits the excitation signal, and the integrated isolation chip PCB evaluation board generates electromagnetic radiation under the action of the excitation signal.

[0024] The electromagnetic interference receiver obtains the radiation value of the integrated isolation chip PCB evaluation board through the receiving antenna, and obtains the electromagnetic radiation intensity measurement result of the integrated isolation chip based on the radiation value of the integrated isolation chip PCB evaluation board, the loss value of the test cable, and the array factor of the receiving antenna.

[0025] According to embodiments of this disclosure, obtaining the electromagnetic radiation intensity measurement result of the integrated isolation chip based on the radiation value of the integrated isolation chip PCB evaluation board, the loss value of the test cable, and the array factor of the receiving antenna includes obtaining the electromagnetic radiation intensity measurement result according to the following formula:

[0026] Emeas = Eread + L + AF;

[0027] Wherein, Emeas is the electromagnetic radiation intensity measurement result, Eread is the radiation value of the integrated isolation chip PCB evaluation board, L is the loss value of the test cable, and AF is the array factor of the receiving antenna.

[0028] According to an embodiment of this disclosure, the electromagnetic interference testing platform further includes a rotating platform for placing the integrated isolation chip PCB evaluation board.

[0029] According to embodiments of this disclosure, the step of inputting the common-mode current generated by the parasitic capacitive coupling between the primary and secondary coils of the transformer in the adjusted equivalent circuit model as an excitation signal into the second electromagnetic field model includes:

[0030] Extract the common-mode current curve of the adjusted equivalent circuit model, and fit the common-mode current curve using a fitting function to obtain the common-mode current expression;

[0031] The common-mode current expression is used as an excitation signal input to the power supply terminal of the second electromagnetic field model to power the second electromagnetic field model.

[0032] According to embodiments of this disclosure, the fitting function is a multi-segment sine function.

[0033] According to embodiments of this disclosure, the equivalent circuit model includes: the resistance R of the primary coil. ac1 The resistance R of the secondary coil ac2 The leakage inductance L of the primary coil l1 The leakage inductance L of the secondary coil l2 The equivalent loss resistance R of the transformer core c The magnetizing inductance L of the primary coil MAG The parasitic capacitance C1 of the primary coil, the parasitic capacitance C2 of the secondary coil, and the parasitic capacitance C between the primary coil and the secondary coil. 12 ;

[0034] Wherein, the leakage inductance L l1 One end is connected to the resistor R ac1 One end of the resistor R ac1 The other end is connected to one end of the primary coil, and the resistor R ac2 One end of the resistor R is connected to one end of the secondary coil. ac2 The other end is connected to the leakage inductor L l2 At one end, the equivalent loss resistance R c With the excitation inductor L MAG The parasitic capacitance C1 is connected in parallel across the primary coil after being connected in series. 12 One end is connected to the leakage inductance L l1 The other end is connected to the parasitic capacitance C. 12 The other end is connected to the leakage inductance L l2 The other end is connected, and the parasitic capacitance C2 is connected in parallel across the two ends of the secondary coil.

[0035] Secondly, this disclosure provides an electromagnetic radiation intensity prediction system with an integrated isolation chip, including electromagnetic field simulation software, a test circuit board assembly, and an electromagnetic interference test platform set up in an anechoic chamber.

[0036] The test circuit board assembly is configured to measure the parasitic electrical parameters of the transformer;

[0037] The electromagnetic interference testing platform is configured to acquire the electromagnetic radiation intensity measurement results of the integrated isolation chip;

[0038] The electromagnetic field simulation software is configured to establish a first electromagnetic field model of the transformer.

[0039] The first electromagnetic field model is converted into an equivalent circuit model;

[0040] The simulated parasitic electrical parameters of the transformer are obtained based on the equivalent circuit model.

[0041] The measured parasitic electrical parameters are obtained, and the measured parasitic electrical parameters and the simulated parasitic electrical parameters are compared to obtain a first comparison result. Based on the adjustment scheme determined according to the first comparison result and the preset simulation error threshold, the equivalent circuit model is adjusted to obtain the adjusted equivalent circuit model.

[0042] A second electromagnetic field model of the integrated isolation chip PCB evaluation board is established. The common-mode current generated by the parasitic capacitance coupling between the primary and secondary coils of the transformer in the adjusted equivalent circuit model is used as the excitation signal and input into the second electromagnetic field model. Multiple detection points are set in the second electromagnetic field model to obtain the simulation results of the electromagnetic radiation intensity of the integrated isolation chip. The common-mode current is determined to be the main radiation source of the integrated isolation chip.

[0043] The electromagnetic radiation intensity measurement results are obtained, and the electromagnetic radiation intensity simulation results and the electromagnetic radiation intensity measurement results are compared to obtain a second comparison result. The second electromagnetic field model is adjusted based on the adjustment scheme determined according to the second comparison result and the preset simulation error threshold. The adjusted second electromagnetic field model is used as the electromagnetic radiation intensity prediction model of the integrated isolation chip.

[0044] According to embodiments of this disclosure, the test circuit board assembly includes: a short-circuit test board, an open-circuit test board, a load test board, and a through-circuit test board;

[0045] The short-circuit test board is used to perform short-circuit tests on the transformer;

[0046] The open-circuit test board is used to perform open-circuit tests on the transformer;

[0047] The load test board is used to perform load tests on the transformer;

[0048] The through-through test board is used to perform through-through testing on the transformer.

[0049] According to an embodiment of this disclosure, the electromagnetic interference testing platform includes: a signal generator, test cables, a receiving antenna, an electromagnetic interference receiver, and a rotating platform;

[0050] The integrated isolation chip is placed on the rotating platform, the signal generator is connected to the integrated isolation chip PCB evaluation board through the test cable, and the electromagnetic interference receiver is connected to the receiving antenna through the test cable. The receiving antenna and the integrated isolation chip are at a set distance.

[0051] The signal generator emits the excitation signal, and the integrated isolation chip PCB evaluation board generates electromagnetic radiation under the action of the excitation signal.

[0052] The electromagnetic interference receiver obtains the radiation value of the integrated isolation chip PCB evaluation board through the receiving antenna, and obtains the electromagnetic radiation intensity measurement result of the integrated isolation chip based on the radiation value of the integrated isolation chip PCB evaluation board, the loss value of the test cable, and the array factor of the receiving antenna.

[0053] Thirdly, embodiments of this disclosure provide an electronic device including a memory and a processor, wherein the memory is used to store computer instructions, wherein the computer instructions are executed by the processor to implement the method as described in any of the first aspects.

[0054] Fourthly, this disclosure provides a computer-readable storage medium having computer instructions stored thereon, which, when executed by a processor, implement the method as described in any of the first aspects.

[0055] Fifthly, this disclosure provides a computer program product including computer instructions that, when executed by a processor, implement the method as described in any of the first aspects.

[0056] According to the technical solution provided in this disclosure, the first electromagnetic field model of the transformer of the integrated isolation chip is converted into an equivalent circuit model to obtain the simulated parasitic electrical parameters of the transformer; the equivalent circuit model is adjusted by comparing the measured parasitic electrical parameters and the simulated parasitic electrical parameters; the common-mode current of the adjusted equivalent circuit model is used as an excitation signal input to the second electromagnetic field model of the integrated isolation chip PCB evaluation board to obtain the simulation results of the electromagnetic radiation intensity of the integrated isolation chip, wherein the common-mode current is determined as the main radiation source of the integrated isolation chip; the second electromagnetic field model is adjusted by comparing the electromagnetic radiation intensity simulation results and the electromagnetic radiation intensity measurement results to obtain the electromagnetic radiation intensity prediction model of the integrated isolation chip.

[0057] This disclosure simplifies the simulation and modeling requirements of the integrated isolation chip by establishing an electromagnetic radiation model of the integrated isolation chip PCB evaluation board and combining simulation technology to simulate the common-mode current of its transformer and input it as an excitation signal into the electromagnetic radiation model of the PCB evaluation board. This eliminates the need to model the complex internal circuitry of the integrated isolation chip and accurately predicts the radiation intensity of the integrated isolation chip, thereby optimizing the design of the integrated isolation chip. Specifically, it allows for accurate prediction of the electromagnetic radiation intensity of the integrated isolation chip during the design phase, assessing whether the designed chip meets electromagnetic compatibility standards. This provides scientific design guidance and optimization solutions to reduce electromagnetic interference and improve the reliability of electronic systems. This disclosure reduces the need for multiple rounds of prototyping and testing, shortens development time, lowers development costs, reduces reliance on design experience, and improves design reliability and stability, providing an innovative solution for efficient and reliable integrated isolation chip design.

[0058] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0059] Other features, objects, and advantages of this disclosure will become more apparent from the following detailed description of non-limiting embodiments, taken in conjunction with the accompanying drawings. In the drawings:

[0060] Figure 1 shows a flowchart of an electromagnetic radiation intensity prediction method for an integrated isolation chip according to an embodiment of the present disclosure;

[0061] Figure 2 shows an X-ray scan of a transformer in an integrated isolation chip according to an embodiment of the present disclosure;

[0062] Figure 3 shows a schematic diagram of the circuit structure of an equivalent circuit model of a transformer according to an embodiment of the present disclosure;

[0063] Figure 4 shows a schematic diagram of the common-mode current transmission path of a transformer in an integrated isolation chip PCB evaluation board according to an embodiment of the present disclosure;

[0064] Figure 5 shows a schematic diagram of an electromagnetic interference testing platform according to an embodiment of the present disclosure;

[0065] Figure 6 shows a schematic diagram of an electromagnetic radiation intensity prediction system with an integrated isolation chip according to an embodiment of the present disclosure;

[0066] Figure 7 shows a structural block diagram of an electronic device according to an embodiment of the present disclosure;

[0067] Figure 8 shows a schematic diagram of the structure of a computer system suitable for implementing the method according to an embodiment of the present disclosure. Detailed Implementation

[0068] In the following, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings to enable those skilled in the art to readily implement them. Furthermore, for clarity, portions unrelated to the description of exemplary embodiments have been omitted from the drawings.

[0069] In this disclosure, it should be understood that terms such as “comprising” or “having” are intended to indicate the presence of features, figures, steps, behaviors, components, parts or combinations thereof disclosed in this specification, and are not intended to exclude the possibility of the presence or addition of one or more other features, figures, steps, behaviors, components, parts or combinations thereof.

[0070] It should also be noted that, unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other. This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0071] In this disclosure, any operation involving the acquisition of user information or user data, or the display of user information or user data to others, is an operation authorized or confirmed by the user, or actively selected by the user.

[0072] As mentioned earlier, current electromagnetic compatibility (EMC) design of integrated isolation chips primarily relies on empirical prototyping and testing methods. This approach typically requires multiple rounds of experimentation and adjustments to optimize the design. However, due to the complex internal circuitry of integrated isolation chips, this undoubtedly leads to numerous disadvantages, including high costs, uncertain results, heavy reliance on designer experience for adjustments, and the inability to achieve accurate radiation prediction during the design phase. Furthermore, empirical adjustments may not achieve optimal EMC suppression.

[0073] The inventors discovered that in existing integrated isolation chips, transformers, due to their compact structure but tendency to generate high-frequency common-mode currents, exhibit significant common-mode interference problems, making them the primary source of electromagnetic radiation within the integrated isolation chip. This not only limits the improvement of power density and efficiency of the circuitry within the chip but also poses potential interference to surrounding electronic devices, affecting the reliability of the entire electronic system.

[0074] This disclosure provides a method for predicting electromagnetic radiation intensity of an integrated isolation chip, the integrated isolation chip including a transformer. The method includes: establishing a first electromagnetic field model of the transformer; converting the first electromagnetic field model into an equivalent circuit model; obtaining simulated parasitic electrical parameters of the transformer based on the equivalent circuit model; obtaining measured parasitic electrical parameters of the transformer, comparing the measured parasitic electrical parameters and the simulated parasitic electrical parameters to obtain a first comparison result, adjusting the equivalent circuit model based on an adjustment scheme determined according to the first comparison result and a preset simulation error threshold, to obtain an adjusted equivalent circuit model; establishing a second electromagnetic field model of the integrated isolation chip PCB evaluation board, and converting the transformer into an equivalent circuit model. The common-mode current generated by the parasitic capacitance coupling between the primary and secondary coils of the transformer is used as an excitation signal input to the second electromagnetic field model. Multiple detection points are set in the second electromagnetic field model to obtain the simulation results of the electromagnetic radiation intensity of the integrated isolation chip. The common-mode current is determined as the main radiation source of the integrated isolation chip. The electromagnetic radiation intensity measurement results of the integrated isolation chip are obtained, and the electromagnetic radiation intensity simulation results and the electromagnetic radiation intensity measurement results are compared to obtain a second comparison result. Based on the adjustment scheme determined according to the second comparison result and the preset simulation error threshold, the second electromagnetic field model is adjusted, and the adjusted second electromagnetic field model is used as the electromagnetic radiation intensity prediction model of the integrated isolation chip.

[0075] This disclosure utilizes electromagnetic interference modeling and simulation design based on the common-mode current induced by the transformer in the integrated isolation chip. This model is then used as an excitation signal input into the electromagnetic field model of the integrated isolation chip PCB evaluation board. This allows for accurate prediction of the electromagnetic radiation intensity of the integrated isolation chip during the design phase, without the need to build a complex electromagnetic field model based on the complex circuit structure of the integrated isolation chip. This provides guidance for the subsequent optimization design of circuits or systems, thereby effectively reducing R&D time and costs, and improving product design efficiency and electromagnetic compatibility performance.

[0076] Figure 1 shows a flowchart of an electromagnetic radiation intensity prediction method for an integrated isolation chip according to an embodiment of the present disclosure. As shown in Figure 1, the electromagnetic radiation intensity prediction method includes the following steps S101 to S106:

[0077] In this disclosure, the integrated isolation chip includes a transformer, which may be a planar transformer, a high-frequency transformer, an on-chip isolation transformer, etc.

[0078] In step S101, a first electromagnetic field model of the transformer is established.

[0079] According to an embodiment of this disclosure, the size parameters and material parameters of the transformer are obtained, and a first electromagnetic field model of the transformer is established based on the size parameters and material parameters of the transformer.

[0080] The dimensions of the transformer may include the inner diameter, outer diameter, thickness, and number of turns of the primary and secondary coils. The material parameters may include the conductivity, permeability, and dielectric constant of the conductor.

[0081] Figure 2 shows an X-ray scan of a transformer in an integrated isolation chip according to an embodiment of the present disclosure.

[0082] In one specific embodiment, for example, the transformer in the integrated isolation chip can be monitored using non-destructive testing methods such as X-ray detectors to obtain an X-ray scan image of the transformer.

[0083] As shown in Figure 2, the transformer includes four PCB layers. The first PCB layer has metal traces, which form the transformer's conductors. The second PCB layer has a primary winding, which includes two auxiliary windings (left and right). The third PCB layer has a secondary winding, which also includes two auxiliary windings (left and right). The transformer's core (not shown in the figure) is sandwiched between the second and third PCB layers. The transformer structure also includes some bonding wires for connecting to other electrical components outside the transformer.

[0084] In step S102, the first electromagnetic field model is converted into an equivalent circuit model.

[0085] In step S103, the simulated parasitic electrical parameters of the transformer are obtained according to the equivalent circuit model.

[0086] The simulated parasitic electrical parameters include any one or more of the following: simulated parasitic inductance, simulated parasitic resistance, and simulated parasitic capacitance.

[0087] The inventors developed an electromagnetic field model to more accurately simulate the electromagnetic field distribution inside a transformer. This simulation model allows for the comprehensive consideration of various complex factors, such as winding layout and the dielectric constant of the insulating material, thus enabling more accurate extraction of parasitic electrical parameters.

[0088] Figure 3 shows a schematic diagram of the circuit structure of an equivalent circuit model of a transformer according to an embodiment of the present disclosure.

[0089] As shown in Figure 3, the equivalent circuit model includes: the resistance R of the primary coil. ac1 The resistance R of the secondary coil ac2 The leakage inductance L of the primary coil l1 The leakage inductance L of the secondary coil l2 The equivalent loss resistance R of the transformer core c The magnetizing inductance L of the primary coil MAG The parasitic capacitance C1 of the primary coil, the parasitic capacitance C2 of the secondary coil, and the parasitic capacitance C between the primary coil and the secondary coil. 12 .

[0090] The leakage inductance L l1 One end is connected to the resistor R ac1 One end of the resistor R ac1 The other end is connected to one end of the primary coil, and the resistor R ac2 One end of the resistor R is connected to one end of the secondary coil. ac2 The other end is connected to the leakage inductor L l2 At one end, the equivalent loss resistance R c With the excitation inductor L MAG The parasitic capacitance C1 is connected in parallel across the primary coil after being connected in series. 12 One end is connected to the leakage inductance L l1 The other end is connected to the parasitic capacitance C. 12 The other end is connected to the leakage inductance L l2 The other end is connected, and the parasitic capacitance C2 is connected in parallel across the two ends of the secondary coil.

[0091] Wherein, resistance R ac1 and resistance R ac2 This affects the power loss and efficiency of the transformer; leakage inductance L l1 and leakage L l2 This is caused by imperfect coupling between transformer coils, which affects the high-frequency performance of the transformer; equivalent loss resistance R c , is a key parameter to focus on in high-frequency circuit design; parasitic capacitance C 12 This provides a coupling path for the common-mode current and is a key parameter for electromagnetic interference analysis.

[0092] Parasitic capacitance C1, parasitic capacitance C2, parasitic capacitance C 12 Together, they constitute the simulated parasitic capacitance and resistance R of the equivalent circuit model. ac1 Resistance R ac2 Equivalent loss resistance R cTogether, they constitute the simulated parasitic resistance and leakage inductance L of the equivalent circuit model. l1 Leakage inductance L l2 Magnetizing inductance L MAG Together, they constitute the simulated parasitic inductance of the equivalent circuit model.

[0093] In step S104, the measured parasitic electrical parameters of the transformer are obtained, the measured parasitic electrical parameters and the simulated parasitic electrical parameters are compared to obtain a first comparison result, and the equivalent circuit model is adjusted based on the adjustment scheme determined according to the first comparison result and the preset simulation error threshold to obtain the adjusted equivalent circuit model.

[0094] The measured parasitic electrical parameters include any one or more of the following: measuring parasitic inductance, measuring parasitic resistance, and measuring parasitic capacitance. These parasitic electrical parameters are obtained by measuring the transformer using a test circuit board assembly.

[0095] Specifically, the test circuit board assembly includes: a short-circuit test board, an open-circuit test board, a load test board, and a shoot-through test board; wherein, the short-circuit test board is used to perform a short-circuit test on the transformer; the open-circuit test board is used to perform an open-circuit test on the transformer; the load test board is used to perform a load test on the transformer; and the shoot-through test board is used to perform a shoot-through test on the transformer.

[0096] This disclosure utilizes a test circuit board assembly and employs the SOLT (Short-Open-Load-Through) de-embedding method to eliminate the influence of traces on the circuit board and test cables, thereby accurately measuring parasitic electrical parameters on the transformer.

[0097] In the above measurement process, multiple measurements can be taken and the average value can be calculated to ensure the accuracy of the final measurement data.

[0098] When adjusting the equivalent circuit model based on the adjustment scheme determined according to the first comparison result and the preset simulation error threshold (generally set to 30%), if the first comparison result exceeds the predicted simulation error threshold, the equivalent circuit model needs to be adjusted. For example, if the material parameters or size parameters are not very accurate during modeling, the material parameters or size parameters need to be readjusted. Or, if some avoidable errors occur in the conversion method used to convert the first electromagnetic field model into the equivalent circuit model, the preset simulation error threshold should be reduced as much as possible so that the final adjusted equivalent circuit model can reflect the performance under actual working conditions as accurately as possible.

[0099] In step S105, a second electromagnetic field model of the integrated isolation chip PCB evaluation board is established. The common-mode current generated by the parasitic capacitance coupling between the primary and secondary coils of the transformer in the adjusted equivalent circuit model is used as an excitation signal and input into the second electromagnetic field model. Multiple detection points are set in the second electromagnetic field model to obtain the simulation results of the electromagnetic radiation intensity of the integrated isolation chip. The common-mode current is determined to be the main radiation source of the integrated isolation chip.

[0100] The inventors noted that integrated isolation chips also contain other structures, such as packages and wiring. The radiation intensity generated by these structures is much smaller than that generated by the common-mode current of a transformer. Therefore, by reasonably simplifying and equipping the radiation sources inside the chip based on the common-mode current of the transformer, it is possible to avoid the need to build models of the complex internal circuit structures of the chip and then set up corresponding transmission ports for input excitation signals according to the required signal types, thus avoiding the high complexity of modeling and simulation caused by directly simulating the integrated isolation chip.

[0101] As shown in Figure 4, Figure 4 is a schematic diagram of the transmission path of the common-mode current of the transformer in an integrated isolation chip PCB evaluation board according to an embodiment of the present disclosure.

[0102] In Figure 4, PCB1 and PCB2 represent two PCB boards used for connecting the integrated isolation chip, and Chip1 and Chip2 represent circuits used to convert the power supply on the PCB boards into transformer input signals. The parasitic capacitance between the primary and secondary coils of the transformer provides a coupling interference path for common-mode interference, making the induced common-mode current the main source of radiation as it has no return path.

[0103] According to embodiments of this disclosure, the dimensional and material parameters of the peripheral circuit of the integrated isolation chip are obtained, and a second electromagnetic field model of the PCB evaluation board of the integrated isolation chip is established based on the dimensional and material parameters of the peripheral circuit of the integrated isolation chip.

[0104] The peripheral circuit of the integrated isolation chip is an external circuit connected to the integrated isolation chip, such as a power supply circuit, a grounding circuit, etc.

[0105] In detail, the common-mode current curve of the adjusted equivalent circuit model is extracted, and the common-mode current curve is fitted using a fitting function to obtain the common-mode current expression; the common-mode current expression is used as an excitation signal input to the power supply terminal of the second electromagnetic field model to feed the second electromagnetic field model.

[0106] According to embodiments of this disclosure, a common-mode current curve is fitted using a fitting function to obtain a function that can optimally describe and predict the common-mode current behavior, i.e., the common-mode current expression; the fitting function can be a multi-segment sine function.

[0107] In step S106, the electromagnetic radiation intensity measurement result of the integrated isolation chip is obtained, the electromagnetic radiation intensity simulation result and the electromagnetic radiation intensity measurement result are compared to obtain a second comparison result, and the second electromagnetic field model is adjusted based on the adjustment scheme determined according to the second comparison result and the preset simulation error threshold. The adjusted second electromagnetic field model is used as the electromagnetic radiation intensity prediction model of the integrated isolation chip.

[0108] In this disclosure, the electromagnetic radiation intensity measurement results are obtained using an electromagnetic interference testing platform set up in an anechoic chamber. The anechoic chamber is an electromagnetic compatibility anechoic chamber, also known as a semi-anechoic chamber, or simply an EMC anechoic chamber. It is constructed by attaching electromagnetic wave absorbing materials to the four inner walls and ceiling of an electromagnetic shielding room, with the floor serving as an ideal reflective surface. This simulates the testing conditions of an open area.

[0109] Figure 5 shows a schematic diagram of an electromagnetic interference testing platform according to an embodiment of the present disclosure.

[0110] As shown in Figure 5, the electromagnetic interference test platform includes: a signal generator, a test cable, a receiving antenna, and an electromagnetic interference receiver; the signal generator is connected to the integrated isolation chip PCB evaluation board through the test cable, and the electromagnetic interference receiver is connected to the receiving antenna through the test cable, with a set distance between the receiving antenna and the integrated isolation chip.

[0111] The signal generator transmits the excitation signal, and the integrated isolation chip PCB evaluation board generates electromagnetic radiation under the action of the excitation signal; the electromagnetic interference receiver obtains the radiation value of the integrated isolation chip PCB evaluation board through the receiving antenna, and obtains the electromagnetic radiation intensity measurement result of the integrated isolation chip based on the radiation value of the integrated isolation chip PCB evaluation board, the loss value of the test cable and the array factor of the receiving antenna.

[0112] Furthermore, the electromagnetic radiation intensity measurement result is obtained according to the following formula:

[0113] Emeas = Eread + L + AF;

[0114] Wherein, Emeas is the electromagnetic radiation intensity measurement result, Eread is the radiation value of the integrated isolation chip PCB evaluation board, L is the loss value of the test cable, and AF is the array factor of the receiving antenna.

[0115] According to an embodiment of this disclosure, the electromagnetic interference testing platform further includes a rotating platform for placing the integrated isolation chip PCB evaluation board.

[0116] This disclosure establishes an electromagnetic radiation model of an integrated isolation chip PCB evaluation board and combines simulation technology to simulate the common-mode current of its transformer and input it as an excitation signal into the electromagnetic radiation model. This simplifies the simulation and modeling requirements of the chip, eliminating the need to model the complex internal circuitry of the integrated isolation chip. The electromagnetic radiation intensity of the integrated isolation chip can be accurately predicted during the design phase to assess whether the designed chip can meet electromagnetic compatibility standards, thereby providing scientific design guidance and optimization solutions.

[0117] Figure 6 illustrates an electromagnetic radiation intensity prediction system with an integrated isolation chip according to an embodiment of the present disclosure.

[0118] As shown in Figure 6, the electromagnetic radiation intensity prediction system 600 includes electromagnetic field simulation software 610, test circuit board assembly 620, and electromagnetic interference test platform 630 set in a dark room.

[0119] The test circuit board assembly 620 is configured to measure the parasitic electrical parameters of the transformer.

[0120] The electromagnetic interference testing platform 630 is configured to acquire the electromagnetic radiation intensity measurement results of the integrated isolation chip;

[0121] The electromagnetic field simulation software 610 is configured to establish a first electromagnetic field model of the transformer.

[0122] The first electromagnetic field model is converted into an equivalent circuit model;

[0123] The simulated parasitic electrical parameters of the transformer are obtained based on the equivalent circuit model.

[0124] The measured parasitic electrical parameters are obtained, and the measured parasitic electrical parameters and the simulated parasitic electrical parameters are compared to obtain a first comparison result. Based on the adjustment scheme determined according to the first comparison result and the preset simulation error threshold, the equivalent circuit model is adjusted to obtain the adjusted equivalent circuit model.

[0125] A second electromagnetic field model of the integrated isolation chip PCB evaluation board is established. The common-mode current generated by the parasitic capacitance coupling between the primary and secondary coils of the transformer in the adjusted equivalent circuit model is used as the excitation signal and input into the second electromagnetic field model. Multiple detection points are set in the second electromagnetic field model to obtain the simulation results of the electromagnetic radiation intensity of the integrated isolation chip. The common-mode current is determined to be the main radiation source of the integrated isolation chip.

[0126] The electromagnetic radiation intensity measurement results are obtained, and the electromagnetic radiation intensity simulation results and the electromagnetic radiation intensity measurement results are compared to obtain a second comparison result. The second electromagnetic field model is adjusted based on the adjustment scheme determined according to the second comparison result and the preset simulation error threshold. The adjusted second electromagnetic field model is used as the electromagnetic radiation intensity prediction model of the integrated isolation chip.

[0127] According to an embodiment of this disclosure, the test circuit board assembly 620 includes: a short-circuit test board, an open-circuit test board, a load test board, and a through-circuit test board; the short-circuit test board is used to perform a short-circuit test on the transformer; the open-circuit test board is used to perform an open-circuit test on the transformer; the load test board is used to perform a load test on the transformer; and the through-circuit test board is used to perform a through-circuit test on the transformer.

[0128] According to an embodiment of this disclosure, the electromagnetic interference testing platform 630 includes: a signal generator, test cables, a receiving antenna, an electromagnetic interference receiver, and a rotating platform;

[0129] The integrated isolation chip PCB evaluation board is placed on the rotating platform. The signal generator is connected to the integrated isolation chip PCB evaluation board through the test cable. The electromagnetic interference receiver is connected to the receiving antenna through the test cable. There is a set distance between the receiving antenna and the integrated isolation chip PCB evaluation board.

[0130] The signal generator emits the excitation signal, and the integrated isolation chip PCB evaluation board generates electromagnetic radiation under the action of the excitation signal.

[0131] The electromagnetic interference receiver obtains the radiation value of the integrated isolation chip PCB evaluation board through the receiving antenna, and obtains the electromagnetic radiation intensity measurement result of the integrated isolation chip based on the radiation value of the integrated isolation chip PCB evaluation board, the loss value of the test cable, and the array factor of the receiving antenna.

[0132] This disclosure also discloses an electronic device, and FIG7 shows a structural block diagram of the electronic device according to an embodiment of the present disclosure.

[0133] As shown in FIG7, the electronic device includes a memory and a processor, wherein the memory is used to store one or more computer instructions, wherein the one or more computer instructions are executed by the processor to implement the method according to embodiments of the present disclosure.

[0134] Figure 8 shows a schematic diagram of the structure of a computer system suitable for implementing the method according to an embodiment of the present disclosure.

[0135] As shown in Figure 8, the computer system includes a processing unit that can execute various methods described above based on a program stored in a read-only memory (ROM) or a program loaded from a storage portion into a random access memory (RAM). The RAM also stores various programs and data required for the operation of the computer system. The processing unit, ROM, and RAM are interconnected via a bus. Input / output (I / O) interfaces are also connected to the bus.

[0136] The following components are connected to the I / O interface: input sections including keyboards, mice, etc.; output sections including cathode ray tubes (CRTs), liquid crystal displays (LCDs), and speakers; storage sections including hard disks, etc.; and communication sections including network interface cards such as LAN cards and modems. The communication section performs communication processes via a network such as the Internet. Drives are also connected to the I / O interface as needed. Removable media, such as disks, optical disks, magneto-optical disks, semiconductor memories, etc., are installed on the drive as needed so that computer programs read from them can be installed into the storage section as needed. The processing unit can be implemented as a CPU, GPU, TPU, FPGA, NPU, etc.

[0137] In particular, according to embodiments of this disclosure, the methods described above can be implemented as computer software programs. For example, embodiments of this disclosure include a computer program product comprising a computer program tangibly embodied on a machine-readable medium, the computer program containing program code for performing the methods described above. In such embodiments, the computer program can be downloaded and installed from a network via a communication component, and / or installed from a removable medium.

[0138] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0139] The units or modules described in the embodiments of this disclosure can be implemented in software or programmable hardware. The described units or modules can also be located in a processor, and the names of these units or modules do not necessarily constitute a limitation on the unit or module itself.

[0140] In another aspect, this disclosure also provides a computer-readable storage medium, which may be a computer-readable storage medium included in the electronic device or computer system described above; or it may be a standalone computer-readable storage medium not assembled into a device. The computer-readable storage medium stores one or more programs, which are used by one or more processors to perform the methods described in this disclosure.

[0141] The above description is merely a preferred embodiment of this disclosure and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features disclosed in this disclosure that have similar functions.

Claims

1. A method for predicting electromagnetic radiation intensity using an integrated isolation chip, characterized in that, The integrated isolation chip includes a transformer, which is a high-frequency transformer. The method includes: establishing a first electromagnetic field model of the transformer; converting the first electromagnetic field model into an equivalent circuit model, including: obtaining the size parameters and material parameters of the transformer, and establishing the first electromagnetic field model of the transformer based on the size parameters and material parameters of the transformer; obtaining the simulated parasitic electrical parameters of the transformer based on the equivalent circuit model; obtaining the measured parasitic electrical parameters of the transformer, comparing the measured parasitic electrical parameters and the simulated parasitic electrical parameters to obtain a first comparison result, and adjusting the equivalent circuit model based on an adjustment scheme determined according to the first comparison result and a preset simulation error threshold to obtain an adjusted equivalent circuit model; establishing a second electromagnetic field model of the integrated isolation chip PCB evaluation board, including: based on the size parameters and material parameters of the peripheral circuit of the integrated isolation chip... The second electromagnetic field model of the integrated isolation chip PCB evaluation board is established using material parameters. The common-mode current generated by the parasitic capacitance coupling between the primary and secondary coils of the transformer in the adjusted equivalent circuit model is used as an excitation signal and input into the second electromagnetic field model. Multiple detection points are set in the second electromagnetic field model to obtain the simulation results of the electromagnetic radiation intensity of the integrated isolation chip. The common-mode current is determined as the main radiation source of the integrated isolation chip. The electromagnetic radiation intensity measurement results of the integrated isolation chip are obtained. The electromagnetic radiation intensity simulation results and the electromagnetic radiation intensity measurement results are compared to obtain a second comparison result. The second electromagnetic field model is adjusted based on the adjustment scheme determined according to the second comparison result and the preset simulation error threshold. The adjusted second electromagnetic field model is used as the electromagnetic radiation intensity prediction model of the integrated isolation chip.

2. The method according to claim 1, characterized in that: The simulated parasitic electrical parameters include any one or more of the following: simulated parasitic inductance, simulated parasitic resistance, and simulated parasitic capacitance; the measured parasitic electrical parameters include any one or more of the following: measured parasitic inductance, measured parasitic resistance, and measured parasitic capacitance.

3. The method according to claim 1, characterized in that, The parasitic electrical parameters are measured using a test circuit board assembly on the transformer. The test circuit board assembly includes a short-circuit test board, an open-circuit test board, a load test board, and a shoot-through test board. The short-circuit test board is used to perform short-circuit tests on the transformer. The open-circuit test board is used to perform open-circuit tests on the transformer. The load test board is used to perform load tests on the transformer. The shoot-through test board is used to perform shoot-through tests on the transformer.

4. The method according to claim 1, characterized in that, The electromagnetic radiation intensity measurement results are obtained using an electromagnetic interference testing platform set up in an anechoic chamber. The electromagnetic interference testing platform includes a signal generator, test cables, a receiving antenna, and an electromagnetic interference receiver. The signal generator is connected to the integrated isolation chip PCB evaluation board via the test cables, and the electromagnetic interference receiver is connected to the receiving antenna via the test cables. A predetermined distance exists between the receiving antenna and the integrated isolation chip PCB evaluation board. The signal generator emits an excitation signal, and the integrated isolation chip PCB evaluation board generates electromagnetic radiation under the influence of the excitation signal. The electromagnetic interference receiver acquires the radiation value of the integrated isolation chip PCB evaluation board via the receiving antenna and obtains the electromagnetic radiation intensity measurement result of the integrated isolation chip based on the radiation value of the integrated isolation chip PCB evaluation board, the loss value of the test cables, and the array factor of the receiving antenna.

5. The method according to claim 4, characterized in that, The step of obtaining the electromagnetic radiation intensity measurement result of the integrated isolation chip based on the radiation value of the integrated isolation chip PCB evaluation board, the loss value of the test cable, and the array factor of the receiving antenna includes obtaining the electromagnetic radiation intensity measurement result according to the following formula: F; where Emeas is the electromagnetic radiation intensity measurement result, Eread is the radiation value of the integrated isolation chip PCB evaluation board, L is the loss value of the test cable, and AF is the array factor of the receiving antenna.

6. The method according to claim 5, characterized in that, The electromagnetic interference testing platform also includes a rotating platform; the rotating platform is used to place the integrated isolation chip PCB evaluation board.

7. The method according to claim 1, characterized in that, The step of using the common-mode current generated by the parasitic capacitance coupling between the primary and secondary coils of the transformer in the adjusted equivalent circuit model as an excitation signal to input into the second electromagnetic field model includes: extracting the common-mode current curve of the adjusted equivalent circuit model, fitting the common-mode current curve using a fitting function to obtain a common-mode current expression; and inputting the common-mode current expression as an excitation signal into the power supply terminal of the second electromagnetic field model to feed power to the second electromagnetic field model.

8. The method according to claim 7, characterized in that, The fitting function is a multi-segment sine function.

9. The method according to claim 1, characterized in that, The equivalent circuit model includes: the resistance R of the primary coil. ac1 The resistance R of the secondary coil ac2 The leakage inductance L of the primary coil l1 The leakage inductance L of the secondary coil l2 The equivalent loss resistance R of the transformer core c The excitation inductance L of the primary coil MAG The parasitic capacitance C1 of the primary coil, the parasitic capacitance C2 of the secondary coil, and the parasitic capacitance C between the primary coil and the secondary coil. 12 ; wherein, the leakage inductance L l1 One end is connected to the resistor R ac1 One end of the resistor R ac1 The other end is connected to one end of the primary coil, and the resistor R ac2 One end of the resistor R is connected to one end of the secondary coil. ac2 The other end is connected to the leakage inductor L l2 At one end, the equivalent loss resistance R c With the excitation inductor L MAG The parasitic capacitance C1 is connected in parallel across the primary coil after being connected in series. 12 One end is connected to the leakage inductance L l1 The other end is connected to the parasitic capacitance C. 12 The other end is connected to the leakage inductance L l2 The other end is connected, and the parasitic capacitance C2 is connected in parallel across the two ends of the secondary coil.

10. An electromagnetic radiation intensity prediction system with an integrated isolation chip, characterized in that, include: Electromagnetic field simulation software, a test circuit board assembly, and an electromagnetic interference test platform set up in an anechoic chamber; the test circuit board assembly is configured to measure the parasitic electrical parameters of the transformer of the integrated isolation chip, the transformer being a high-frequency transformer; the electromagnetic interference test platform is configured to acquire the electromagnetic radiation intensity measurement results of the integrated isolation chip. The electromagnetic field simulation software is configured to establish a first electromagnetic field model of the transformer, including: acquiring the transformer's size parameters and material parameters; establishing a first electromagnetic field model of the transformer based on the transformer's size parameters and material parameters; converting the first electromagnetic field model into an equivalent circuit model; acquiring the transformer's simulated parasitic electrical parameters based on the equivalent circuit model; acquiring the measured parasitic electrical parameters; comparing the measured parasitic electrical parameters and the simulated parasitic electrical parameters to obtain a first comparison result; adjusting the equivalent circuit model based on an adjustment scheme determined according to the first comparison result and a preset simulation error threshold to obtain an adjusted equivalent circuit model; and establishing a second electromagnetic field model of the integrated isolation chip PCB evaluation board, including: establishing the integrated isolation chip's PCB evaluation board based on the size parameters and material parameters of the peripheral circuit of the integrated isolation chip. A second electromagnetic field model is constructed for the PCB evaluation board of the integrated isolation chip. The common-mode current generated by the parasitic capacitance coupling between the primary and secondary coils of the transformer in the adjusted equivalent circuit model is used as an excitation signal and input into the second electromagnetic field model. Multiple detection points are set in the second electromagnetic field model to obtain the simulation results of the electromagnetic radiation intensity of the integrated isolation chip. The common-mode current is determined as the main radiation source of the integrated isolation chip. The electromagnetic radiation intensity measurement results are obtained, and the electromagnetic radiation intensity simulation results and the electromagnetic radiation intensity measurement results are compared to obtain a second comparison result. The second electromagnetic field model is adjusted based on the adjustment scheme determined according to the second comparison result and the preset simulation error threshold. The adjusted second electromagnetic field model is used as the electromagnetic radiation intensity prediction model of the integrated isolation chip.

11. The system according to claim 10, characterized in that, The test circuit board assembly includes: a short-circuit test board, an open-circuit test board, a load test board, and a shoot-through test board; the short-circuit test board is used to perform short-circuit tests on the transformer; the open-circuit test board is used to perform open-circuit tests on the transformer; the load test board is used to perform load tests on the transformer; and the shoot-through test board is used to perform shoot-through tests on the transformer.

12. The system according to claim 10, characterized in that, The electromagnetic interference testing platform includes a signal generator, test cables, a receiving antenna, an electromagnetic interference receiver, and a rotating platform. The integrated isolation chip PCB evaluation board is placed on the rotating platform. The signal generator is connected to the integrated isolation chip PCB evaluation board via the test cables, and the electromagnetic interference receiver is connected to the receiving antenna via the test cables. A predetermined distance exists between the receiving antenna and the integrated isolation chip PCB evaluation board. The signal generator emits an excitation signal, and the integrated isolation chip PCB evaluation board generates electromagnetic radiation under the influence of the excitation signal. The electromagnetic interference receiver acquires the radiation value of the integrated isolation chip PCB evaluation board through the receiving antenna and obtains the electromagnetic radiation intensity measurement result of the integrated isolation chip based on the radiation value of the integrated isolation chip PCB evaluation board, the loss value of the test cables, and the array factor of the receiving antenna.

13. An electronic device, characterized in that, It includes a memory and a processor; wherein the memory is used to store computer instructions, wherein the computer instructions are executed by the processor to implement the method according to any one of claims 1 to 9.

14. A computer-readable storage medium storing computer instructions thereon, characterized in that, When executed by a processor, the computer instructions implement the method described in any one of claims 1 to 9.

15. A computer program product, characterized in that, Includes computer instructions that, when executed by a processor, implement the method described in any one of claims 1 to 9.

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