Time-period heat dissipation collaboration assembly for computer mainframe box

Abstract

The invention relates to the technical field of computers, in particular to a time-interval heat dissipation cooperation assembly for a computer mainframe box, which comprises a mainframe box side plate, a fan group is mounted on the front surface of the mainframe box side plate, a cooling frame is mounted on the back surface of the mainframe box side plate, and a cooling fan is mounted on the cooling frame. A flow guide plate is installed on the side, away from the fan set, of the inner wall of the cooling frame, vent holes are formed in the side, close to the fan set, of the inner wall of the cooling frame, and cooperation assemblies are installed at the top and the bottom of the cooling frame. The main board is electrically connected, the starting temperature is set in combination with a fan curve, cooling liquid is continuously conveyed in cooperation with pushing of the electric cylinder when the pressing plate moves, the cooling liquid absorbs heat to take away heat in the case, cooling of the interior of the mainframe case is achieved, and the synergistic heat dissipation effect is achieved; and the cooling liquid harmless to the electronic element is combined with the actions of the mechanisms, so that the heat dissipation effect is further improved.

Description

Technical Field

[0001] The invention belongs to the field of computer technology, and in particular relates to a periodic heat dissipation coordination component for a computer mainframe case. Background Art

[0002] Computer, commonly known as computer, is a modern electronic computing machine used for high-speed calculations. It can perform numerical calculations, logical calculations, and has storage and memory functions. It is a modern intelligent electronic device that can run according to programs and automatically and quickly process massive amounts of data. The electronic components used to achieve the above functions are installed in the main chassis, and among the electronic components used, the CPU needs to be equipped with a fan group for heat dissipation.

[0003] Since the long-term operation of the CPU will generate a large amount of heat, the performance of the CPU will be greatly reduced, especially when the CPU is working at a continuous high load. At present, some host cases use cooling fans to dissipate heat. The cooling fans speed up the replacement rate of air in the host case with the outside air. The position of the cooling fan is fixed, so that the air circulation inside the device is fixed within a certain space, resulting in its limited heat dissipation range, which in turn causes continuous heat accumulation inside the host case, thereby reducing the performance of the CPU and other electronic components. In severe cases, it may even cause the components to burn out. Therefore, when electronic components such as the CPU are working at a high load, a heat dissipation component is needed to cooperate with the cooling fan in the host case to dissipate heat. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the disadvantages of the above-mentioned prior art and provide a periodic heat dissipation coordination component for a computer mainframe case.

[0005] The technical solution adopted to solve the above technical problems is: a periodic heat dissipation cooperative component for a computer main chassis, including a chassis side panel, a fan group is installed on the front of the chassis side panel, a cooling frame is installed on the back of the chassis side panel, a guide plate is installed on the side of the inner wall of the cooling frame away from the fan group, and a vent is opened on the side of the inner wall of the cooling frame close to the fan group, cooperative components are installed on the top and bottom of the cooling frame, and fixed components are installed at the four top corners of the back of the chassis side panel.

[0006] Furthermore, the collaborative component includes a current collecting bin and a return bin, the current collecting bin is installed on the top of the cooling frame, the return bin is installed on the bottom of the cooling frame, the side of the current collecting bin is connected to a cooling pipe, one end of the cooling pipe is connected to a cooling block through a bellows, a partition is installed inside the current collecting bin, a base is installed inside the return bin, a linear guide module is installed on the top of the base, a bracket is installed on the moving end of the linear guide module, an electric cylinder is installed on the side of the bracket, a pressure plate is installed on the output end of the electric cylinder, a coolant bag is installed inside the return bin, and the coolant A water outlet pipe is connected to the bottom side of the cooling liquid bag, a control box and a power supply device are installed on the back of the reflux bin, a control mainboard is installed inside the control box and the control mainboard is electrically connected to the power supply device, the electric cylinder, the linear guide module and the fan group, the power supply device is provided with a power connection compatible with the hardware socket on the mainboard UEFI, a water cavity connected to the bellows is provided inside the cooling block, a plurality of slots are provided in an array on the front of the cooling block, a heat transfer plate is plugged into the slot, a filling groove is provided on the side of the heat transfer plate, and a plurality of heat transfer fins are installed in an array inside the filling groove.

[0007] Furthermore, the fixing assembly includes a fixed frame and a sliding frame, the sliding frame is installed at the four top corners of the back side panel of the chassis, the fixed frame is slidably installed on the sliding frame, a scissors fork is installed on the internal fixed axis rotation of the sliding frame, one end of the scissors fork is hinged with a card plate, a card block is installed on the outer side of the card plate, a spring is installed on the inner side of the card plate, a rubber block is installed on the other end of the scissors fork, and two groups of limit blocks are symmetrically installed on the inner side of the fixed frame.

[0008] Furthermore, a filter screen is arranged inside the vent hole, and a slope facing the fan group is arranged on the side of the cooling frame near the vent hole.

[0009] Furthermore, the reflux bin is connected to the collecting bin through a water outlet pipe, the partition is arranged inside the collecting bin close to the connection between the water outlet pipe and the collecting bin, the height of the partition is lower than the inner cavity height of the collecting bin, the top of the reflux bin is provided with an opening connected to the coolant bag and the bottom of the cooling frame, the top of the collecting bin away from one end of the water outlet pipe is connected to a valve and the bottom is provided with an opening connected to the cooling frame.

[0010] Furthermore, the linear guide rail module is arranged on the top of the base in an inclined manner, and the width of the pressure plate is greater than the width of the coolant bag.

[0011] Furthermore, the clamping block and the limiting block are provided with mutually parallel inclined surfaces on the mating surfaces in the advancing direction of the clamping plate, and the side panel of the chassis is provided with a rectangular opening matched with the rubber block.

[0012] Furthermore, the two groups of limit blocks are multiple in number and are arranged on the inner side of the fixing frame at intervals with a length of the clamping block as a spacing.

[0013] Furthermore, an opening having a size matching that of the limiting block is formed on the side surface of the sliding frame.

[0014] Furthermore, the cooling bag liquid is filled with hydrofluoroether coolant, the slot is filled with a composite phase change material composed of metal particles and paraffin, and the heat transfer plate and the heat transfer fins are both made of carbonaceous materials.

[0015] The beneficial effects of the present invention are as follows: (1) The present invention is electrically connected through the mainboard, the starting temperature is set in combination with the fan curve, and a combination of a pressure plate and an electric cylinder is provided, as well as the use of a linear guide module. When the pressure plate moves, it cooperates with the push of the electric cylinder to squeeze the coolant bag to continuously deliver the coolant, and the flowing coolant absorbs the heat in the chassis and is sent out by the fan group to achieve the cooling of the inside of the main chassis, achieving the effect of synergistic heat dissipation, and the composite phase change material used absorbs and stores heat, and through the coolant that is harmless to electronic components, combined with The action of the above mechanism further improves the heat dissipation effect; (2) The present invention adopts a scissor fork with a clamping block and a rubber block at both ends. When disassembling and assembling the side panel, the fixing frame can slide and clamp in the sliding frame by rotating the clamping block, which is convenient for disassembling and assembling the side panel and ensures the stability of the side panel on the main chassis. At the same time, the side panel can be moved and fixed to the required distance according to needs, and combined with the valve set on the collecting bin, it is convenient to replenish water in the coolant bag. In addition, the adjustable bellows allows the heat transfer block to flexibly fit the heat sink on the CPU fan to improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a front structural schematic diagram of the present invention.

[0017] Figure 2 It is a schematic diagram of the back structure of the present invention.

[0018] Figure 3 It is a schematic diagram of the inner structure of the cooling frame of the present invention.

[0019] Figure 4 yes Figure 3 A schematic diagram of the enlarged structure in the middle.

[0020] Figure 5 It is a schematic diagram of the internal structure of the current collecting bin of the present invention.

[0021] Figure 6 It is a side view of the internal structure of the reflux bin of the present invention.

[0022] Figure 7 It is a schematic diagram of the internal components of the fixed frame and the sliding frame structure of the present invention.

[0023] Figure 8 It is a cross-sectional view of the internal structure of the cooling block of the present invention.

[0024] Fig. 9 It is a schematic diagram of the structure of the heat transfer plate used in the present invention.

[0025] Figure numerals: 1. chassis side panel; 2. fan assembly; 3. cooling frame; 4. guide plate; 5. vent; 6. control box; 7. collecting bin; 8. reflux bin; 9. cooling pipe; 10. cooling block; 11. partition; 12. base; 13. linear guide module; 14. bracket; 15. electric cylinder; 16. pressure plate; 17. coolant bag; 18. water outlet pipe; 19. fixed frame; 20. sliding frame; 21. scissors; 22. card plate; 23. card block; 24. spring; 25. rubber block; 26. limit block; 27. power supply equipment; 28. water cavity; 29. ​​slot; 30. heat transfer plate; 31. filling groove; 32. heat transfer wing; 33. bellows. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0027] like Figures 1 to 9 As shown, a periodic heat dissipation cooperative component for a computer main case of the present embodiment includes a case side panel 1, a fan group 2 is installed on the front of the case side panel 1, a cooling frame 3 is installed on the back of the case side panel 1, a guide plate 4 is installed on the inner wall of the cooling frame 3 away from the fan group 2, and a vent 5 is opened on the inner wall of the cooling frame 3 close to the fan group 2. A filter is arranged inside the vent 5. When the cooperative component is working, the filter is used to prevent the coolant on the guide plate 4 from splashing into the case. A slope facing the fan group 2 is arranged on the side of the cooling frame 3 near the vent 5. The setting of the slope is to better guide the airflow discharge. At the same time, combined with the direction of the setting of the slope, it also plays an anti-splashing and dust-proof effect. The top and bottom of the cooling frame 3 are installed with cooperative components, and the four top corners of the back of the case side panel 1 are installed with fixed components.

[0028] like Figures 3 to 5As shown, the collaborative components include a collecting bin 7 and a reflux bin 8. The collecting bin 7 is installed on the top of the cooling frame 3, and the reflux bin 8 is installed on the bottom of the cooling frame 3. The side of the collecting bin 7 is connected to a cooling pipe 9, and one end of the cooling pipe 9 is connected to a cooling block 10 through a bellows 33. The bellows 33 is made of stainless steel. The bellows 33 is connected to the cooling pipe 9 and the cooling block 10 by welding. The corrosion resistance of stainless steel is utilized to improve the service life. The bellows 33 has flexibility due to its own shape, so that the bellows 33 can be bent and the bending angle is protected, so that the cooling block 10 can adjust the angle to better fit the heat sink on the CPU cooling fan to conduct heat again, and the coolant filled in the cooling block 10 absorbs heat again to increase the cooling effect. A partition 11 is installed inside the collecting bin 7.

[0029] like Figure 5 As shown, the reflux bin 8 is connected to the collecting bin 7 through the water outlet pipe 18, and the partition 11 is arranged inside the collecting bin 7 near the connection between the water outlet pipe 18 and the collecting bin 7. Combined with the figure, since the reflux bin 8 is connected to the collecting bin 7, when the coolant in the coolant bag 17 is transported to the inside of the collecting bin 7, the partition 11 separates the internal space of the collecting bin 7 into two parts, and the coolant will first fill the space near the water outlet pipe 18, and ensure that the internal space of the cooling pipe 9 and the cooling block 10 is also filled, and since the height of the partition 11 is lower than the inner cavity height of the collecting bin 7, the reflux bin 8 An opening is provided at the top which is connected to the cooling liquid bag 17 and the bottom of the cooling frame 3, so that the cooling liquid in the cooling liquid bag 17 can fill the space in the water cavity 28 in the cooling pipe 9 and the cooling block 10, and can also flow to the guide plate 4, and after flowing through the guide plate 4, it can flow back to the cooling liquid bag 17 through the opening at the top of the reflux bin 8. The top of the collecting bin 7 away from the end of the water outlet pipe 18 is connected to a valve, and an opening connected to the cooling frame 3 is provided at the bottom. Combined with the setting position of the valve and the opening at the bottom, it is convenient to replenish the cooling liquid, and the opening at the bottom also allows the cooling liquid to flow smoothly to the guide plate 4.

[0030] like Figure 6As shown, a base 12 is installed inside the reflow bin 8, a linear guide module 13 is installed on the top of the base 12, a bracket 14 is installed on the moving end of the linear guide module 13, an electric cylinder 15 is installed on the side of the bracket 14, and a pressing plate 16 is installed on the output end of the electric cylinder 15. The linear guide module 13 is arranged on the top of the base 12 in an inclined form, and the width of the pressing plate 16 is greater than the width of the coolant bag 17. Combined with the figure, it can be seen from the direction in which the linear guide module 13 is inclined that when the pressing plate 16 slides on the linear guide module 13, the distance between the pressing plate 16 and the coolant bag 17 is gradually getting smaller , and the pressing plate 16 is installed with the electric cylinder 15, the movement of the pressing plate 16 cooperates with the push of the electric cylinder 15 to ensure sufficient pressure to pressurize the coolant in the coolant bag 17 out, the coolant bag 17 is installed inside the reflux bin 8, and the bottom side of the coolant bag 17 is connected to the water outlet pipe 18, the back of the reflux bin 8 is installed with a control box 6 and a power supply device 27, the control box 6 is installed inside the control mainboard and the control mainboard is electrically connected with the power supply device 27, the electric cylinder 15, the linear guide module 13 and the fan group 2, the power supply device 27 is provided with a power connection that is compatible with the hardware socket on the mainboard UEFI, A control circuit board is provided inside the control box 6 to control the fan group 2, the electric cylinder 15 and the linear guide module 13 to perform actions, and the linear guide module 13, the electric cylinder 15 and the fan group 2 are powered by the power supply device 27. The power supply wiring of the power supply device 27 can be plugged into the mainboard BIOS, so as to connect the mainboard with the control mainboard provided in the control box 6 through an electrical signal, and set the fan control option provided by the mainboard BIOS to set the start temperature and speed of the fan group 2 in combination with the fan curve, so as to achieve periodic startup and assist the cooling fan on the CPU. Collaborative heat dissipation, a water cavity 28 connected to the bellows 33 is provided inside the cooling block 10, a plurality of slots 29 are provided in an array on the front of the cooling block 10, a heat transfer plate 30 is inserted into the slots 29, a filling slot 31 is provided on the side of the heat transfer plate 30, a plurality of heat transfer wings 32 are installed in an array inside the filling slot 31, a hydrofluoroether coolant is filled inside the coolant bag 17, a composite phase change material composed of metal particles and paraffin is filled inside the slots 29, the heat transfer plate 30 and the heat transfer wing 32 are both made of carbonaceous materials, combined with the above content, due to the structural characteristics of the bellows 33, and combined with Figure 8 and Fig. 9As shown in the content, the structure and arrangement of the heat transfer plate 30 can adjust the angle of the cooling block 10 by bending the bellows 33, and make the heat transfer plate 30 effectively fit the heat sink on the CPU cooling fan, so that the heat transfer performance of the carbon material can be used for heat conduction. At the same time, the composite phase change material filled in the slot 29 is in direct contact with the heat transfer plate 30 to absorb the heat conducted by the heat transfer plate 30. The composite phase change material composed of paraffin and metal particles used, the added metal particles further improve the heat absorption efficiency, and the physical properties of paraffin can absorb and store heat, and the heat absorbed by the paraffin is absorbed and taken away by the flowing coolant. Because the coolant used is hydrofluoroether, the coolant has the characteristics of high stability, high fluidity and high thermal conductivity, and is harmless to electronic components. Combined with the above content, when the coolant flows through the guide plate 4 under pressure, the heat carried is sent to the outside through the airflow generated by the fan group 2.

[0031] like Figure 7 As shown, the fixing assembly includes a fixing frame 19 and a sliding frame 20. The sliding frame 20 is installed at the four top corners of the back side of the chassis side panel 1. The fixing frame 19 is slidably installed on the sliding frame 20. A scissor fork 21 is rotatably installed inside the sliding frame 20. A card plate 22 is hinged at one end of the scissor fork 21. A card block 23 is installed on the outer side of the card plate 22. A spring 24 is installed on the inner side of the card plate 22. A rubber block 25 is installed on the other end of the scissor fork 21. The card block 23 and the limit block 26 are provided with mutually parallel inclined surfaces on the fitting surface of the card plate 22 in the forward direction. It can be seen from the figure that when the fixing frame 19 slides into the interior of the sliding frame 20, when the card plate 22 moves forward, due to the existence of the inclined surface and the installation method of the card plate 22 on the scissor fork 21, the card plate 22 can rotate, allowing the fixing The frame 19 can move forward normally, and a rectangular opening adapted to the rubber block 25 is provided on the side panel 1 of the chassis. It can be seen from the figure that when the fixed frame 19 wants to exit the sliding frame 20, the rubber block 25 is moved through the provided rectangular opening to achieve the smooth exit of the fixed frame 19. Two groups of limit blocks 26 are symmetrically installed on the inner side of the fixed frame 19. The number of the two groups of limit blocks 26 is multiple and they are arranged on the inner side of the fixed frame 19 at a spacing distance with the length of the card block 23. An opening whose size matches the size of the limit block 26 is provided on the side of the sliding frame 20. By setting the number of limit blocks 26, the sliding distance of the fixed frame 19 can be adjusted according to the needs, and the opening on the sliding frame 20 prevents the fixed frame 19 from vertically detaching from the sliding frame 20 when it is restricted on the sliding frame 20.

[0032] The working principle of this embodiment is as follows. During installation, the sliding frame 20 is installed to the top and bottom of the chassis. When the fixed frame 19 is slid into the sliding frame 20, as the fixed frame 19 slides in, when the card block 23 moves forward with the card plate 22, when the inclined surface set on the card block 23 contacts the inclined surface on the limit block 26, the card plate 22 will swing inward, so that the card plate 22 can smoothly pass through the limit block 26. As the card plate 22 enters, the side plate moves to a suitable position, so that the side plate can close the main On the side of the chassis, when the side panel needs to be removed, the rubber block 25 is slid outward. After the scissors 21 on the side of the rubber block 25 are expanded, the scissors 21 on the side of the card plate 22 are retracted, so that the card block 23 is no longer in contact with the limit block 26, so that the fixed frame 19 can be withdrawn from the sliding frame 20, and then according to the position of the radiator used by the CPU, the angle of the cooling block 10 is adjusted by bending the corrugated tube, so that the heat transfer plate 30 can be attached to the heat sink of the CPU cooling fan to complete the installation.

[0033] When the heat dissipation coordination component is working, after the power connection of the power supply device 27 is plugged into the hardware interface of the motherboard, enter the BIOS for setting, and combine the fan curve to set the starting temperature of the fan group 2 to 80°C. Before the CPU temperature reaches the set temperature, the heat is stored through the composite phase change material used with the help of the heat transfer block. When the CPU temperature reaches above 80°C, the electrical signal is transmitted to the control motherboard in the control box 6, and the control motherboard controls the start-up of the fan group 2, the linear guide module 13 and the electric cylinder 15 to execute the action. While the hot air in the main box is extracted by the rotating fan group 2, the pressure plate 16 and the electric cylinder 15 are gradually moved downward under the drive of the linear guide module 13, and the movement During the movement, the electric cylinder 15 drives the pressure plate 16 to press on the coolant bag 17, and the pressure plate 16 continuously presses the coolant in the coolant bag 17 to the water outlet pipe 18, and then flows into the collecting bin 7. Due to the obstruction of the partition 11 set in the collecting bin 7, the coolant entering the collecting bin 7 gradually fills the space of the cooling pipe 9 and the cooling block 10. At the same time, a part of the coolant flows to the other side of the partition 11, flows out of the collecting bin 7 and flows to the inner side of the guide plate 4 set on the cooling frame 3. When the coolant flows through the guide plate 4, since one side of the guide plate 4 is in contact with the internal environment of the main chassis, the heat in the main chassis is conducted to the guide plate 4, absorbed by the coolant, and sent to the external space by the airflow through the action of the fan group 2, which plays a cooling effect.

[0034] And with the movement of the pressure plate 16, in cooperation with the action of the electric cylinder 15, the coolant bag 17 is divided into two parts by the moving pressure plate 16. With the reduction of liquid in the lower part, the flow to the collecting bin 7 is weakened. With the gradual weakening of the water pressure, the coolant in the cooling tube 9 and the cooling block 10 will flow to the guide plate 4, and when flowing through the guide plate 4, the heat carried by the coolant is sent away under the action of the airflow generated by the fan group 2. When the pressure plate 16 moves to the lowest point and then returns to the top of the linear guide module 13, the coolant accumulated in the upper part of the coolant bag 17 refills the coolant bag 17, and with the pressure plate 16 moving from the top to the bottom of the linear guide module 13 again, the continuous reciprocating movement of the pressure plate 16 is used to realize the circulation of the coolant, and the coolant in the cooling tube 9 and the cooling block 10 is also realized to flow, completing the function of coordinated heat dissipation.

[0035] The above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention.

Claims

1. A periodic heat dissipation coordination component for a computer mainframe case, comprising a case side panel (1), characterized in that: A fan group (2) is installed on the front of the chassis side panel (1), a cooling frame (3) is installed on the back of the chassis side panel (1), a guide plate (4) is installed on the inner wall of the cooling frame (3) away from the fan group (2), and a ventilation hole (5) is opened on the inner wall of the cooling frame (3) close to the fan group (2). Cooperative components are installed on the top and bottom of the cooling frame (3), and fixed components are installed at the four top corners of the back of the chassis side panel (1).

2. The periodic heat dissipation coordination component for a computer mainframe case according to claim 1, characterized in that: The collaborative component comprises a current collecting bin (7) and a return bin (8), wherein the current collecting bin (7) is mounted on the top of the cooling frame (3), and the return bin (8) is mounted on the bottom of the cooling frame (3). A cooling pipe (9) is connected to the side of the current collecting bin (7), and one end of the cooling pipe (9) is connected to a cooling block (10) via a bellows 33. A partition (11) is mounted inside the current collecting bin (7), and a base (12) is mounted inside the return bin (8). A linear guide rail module (13) is mounted on the top of the base (12), and a bracket (14) is mounted on the movable end of the linear guide rail module (13). An electric cylinder (15) is mounted on the side of the bracket (14), and a pressure plate (16) is mounted on the output end of the electric cylinder (15). A coolant bag (17) is mounted inside the return bin (8), and the coolant The bottom side of the bag (17) is connected to a water outlet pipe (18); a control box (6) and a power supply device (27) are installed on the back of the reflux bin (8); a control mainboard is installed inside the control box (6) and the control mainboard is electrically connected to the power supply device (27), the electric cylinder (15), the linear guide module (13) and the fan group (2); the power supply device (27) is provided with a power supply wiring that is compatible with the hardware socket on the mainboard UEFI; a water cavity (28) connected to the bellows (33) is provided inside the cooling block (10); a plurality of slots (29) are provided in an array on the front of the cooling block (10); a heat transfer plate (30) is inserted inside the slot (29); a filling slot (31) is provided on the side of the heat transfer plate (30); a plurality of heat transfer wings (32) are installed in an array inside the filling slot (31).

3. The periodic heat dissipation coordination component for a computer mainframe case according to claim 1, characterized in that: The fixing assembly comprises a fixing frame (19) and a sliding frame (20), wherein the sliding frame (20) is mounted at four top corners of the back side of the chassis side panel (1), and the fixing frame (19) is slidably mounted on the sliding frame (20), a scissor fork (21) is rotatably mounted inside the sliding frame (20), one end of the scissor fork (21) is hingedly connected to a card plate (22), a card block (23) is mounted on the outer side surface of the card plate (22), a spring (24) is mounted on the inner side surface of the card plate (22), a rubber block (25) is mounted on the other end of the scissor fork (21), and two groups of limit blocks (26) are symmetrically mounted on the inner side of the fixing frame (19).

4. The periodic heat dissipation coordination component for a computer mainframe case according to claim 1, characterized in that: A filter screen is arranged inside the ventilation hole (5), and a slope facing the fan group (2) is arranged on the side of the cooling frame (3) near the ventilation hole (5).

5. The periodic heat dissipation coordination component for a computer mainframe case according to claim 2, characterized in that: The reflux bin (8) is connected to the collecting bin (7) via a water outlet pipe (18); the partition (11) is arranged inside the collecting bin (7) close to the connection between the water outlet pipe (18) and the collecting bin (7); the height of the partition (11) is lower than the height of the inner cavity of the collecting bin (7); the top of the reflux bin (8) is provided with an opening connected to the coolant bag (17) and the bottom of the cooling frame (3); the top of the collecting bin (7) away from the water outlet pipe (18) is connected to a valve and the bottom is provided with an opening connected to the cooling frame (3).

6. The periodic heat dissipation coordination component for a computer mainframe case according to claim 2, characterized in that: The linear guide rail module (13) is arranged on the top of the base (12) in an inclined manner, and the width of the pressing plate (16) is greater than the width of the cooling liquid bag (17).

7. The periodic heat dissipation coordination component for a computer mainframe case according to claim 2, characterized in that: The clamping block (23) and the limiting block (26) are provided with mutually parallel inclined surfaces on the surfaces that fit in the advancing direction of the clamping plate (22), and the chassis side plate (1) is provided with a rectangular opening that matches the rubber block (25).

8. The periodic heat dissipation coordination component for a computer mainframe case according to claim 3, characterized in that: The two groups of limit blocks (26) are multiple in number and are arranged on the inner side of the fixed frame (19) at intervals with a length of the clamping block (23).

9. The periodic heat dissipation coordination component for a computer mainframe case according to claim 3, characterized in that: The side surface of the sliding frame (20) is provided with an opening whose size matches the size of the limiting block (26).

10. The periodic heat dissipation coordination component for a computer mainframe case according to claim 2, characterized in that: The cooling bag (17) is filled with hydrofluoroether coolant, the slot (29) is filled with a composite phase change material composed of metal particles and paraffin, and the heat transfer plate (30) and the heat transfer fins (32) are both made of carbonaceous materials.

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