A time-limited heat dissipation co-processing component for computer chassis

Abstract

This invention relates to a time-limited heat dissipation co-processing component for a computer chassis, specifically a time-limited heat dissipation co-processing component for a computer chassis. The component includes a side panel of the chassis, a fan assembly mounted on the front of the side panel, and a cooling frame mounted on the back of the side panel. A guide plate is mounted on the inner wall of the cooling frame away from the fan assembly, and ventilation holes are provided on the inner wall of the cooling frame near the fan assembly. Co-processing components are mounted on the top and bottom of the cooling frame. This invention uses electrical connections via the motherboard and sets the start-up temperature based on the fan curve. When the pressure plate moves, it continuously delivers coolant in conjunction with the push of an electric cylinder. The coolant absorbs heat and dissipates heat from the chassis, achieving a cooling effect inside the chassis and a synergistic heat dissipation effect. A composite phase change material is used for heat absorption and storage, and the use of a coolant harmless to electronic components, combined with the actions of the aforementioned mechanism, further enhances the heat dissipation effect.

Description

Technical Field

[0001] This invention belongs to the field of computer technology, and specifically relates to a time-limited heat dissipation coordinating component for a computer host chassis. Background Technology

[0002] A computer, commonly known as a PC, is a modern electronic computing machine used for high-speed calculations. It can perform numerical calculations, logical calculations, and has storage and memory functions. It is a modern intelligent electronic device that can run according to a program and automatically and quickly process massive amounts of data. The electronic components used to achieve the above functions are installed in the host case. Among the electronic components used, the CPU needs to be equipped with a fan group for heat dissipation.

[0003] Because CPUs generate a lot of heat during prolonged operation, their performance can degrade significantly, especially under sustained high loads. Currently, some computer cases rely on cooling fans for heat dissipation. These fans accelerate the exchange of air between the inside and outside of the case, but their fixed position limits airflow within a specific space, resulting in limited heat dissipation. This leads to continuous heat buildup inside the case, reducing the performance of the CPU and other electronic components, and in severe cases, even causing components to burn out. Therefore, when CPUs and other electronic components are operating under high loads, a heat dissipation component is needed to work in conjunction with the cooling fans in the case. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a time-limited heat dissipation collaborative component for computer host chassis.

[0005] The technical solution adopted to solve the above technical problems is: a time-limited heat dissipation coordination component for a computer host chassis, including a chassis side panel, a fan assembly installed on the front of the chassis side panel, a cooling frame installed on the back of the chassis side panel, a guide plate installed on the inner wall of the cooling frame away from the fan assembly, a vent hole opened on the inner wall of the cooling frame near the fan assembly, coordination components installed on the top and bottom of the cooling frame, and fixing components installed at the four top corners of the back of the chassis side panel.

[0006] Furthermore, the collaborative component includes a collection chamber and a return chamber. The collection chamber is installed at the top of the cooling frame, and the return chamber is installed at the bottom of the cooling frame. A cooling pipe is connected to the side of the collection chamber, and one end of the cooling pipe is connected to a cooling block via a corrugated pipe. A partition is installed inside the collection chamber, and a base is installed inside the return chamber. A linear guide module is installed on the top of the base, and a bracket is installed at the moving end of the linear guide module. An electric cylinder is installed on the side of the bracket, and a pressure plate is installed at the output end of the electric cylinder. A coolant bag is installed inside the return chamber. The bottom side of the coolant bag is connected to a water outlet pipe. The back of the return chamber is equipped with a control box and a power supply device. The control box contains a control motherboard, which is electrically connected to the power supply device, electric cylinder, linear guide module, and fan assembly. The power supply device is equipped with power wiring that is compatible with the hardware interface on the motherboard's UEFI. The cooling block has a water cavity connected to a corrugated pipe inside. The front of the cooling block has multiple slots arranged in an array. Heat transfer plates are inserted into the slots. The side of the heat transfer plate has a filling groove. Multiple heat transfer fins are arranged in an array inside the filling groove.

[0007] Furthermore, the fixing component includes a fixing frame and a sliding frame. The sliding frame is installed at the four top corners of the back of the chassis side panel. The fixing frame is slidably installed on the sliding frame. A scissor fork is rotatably mounted on the inside of the sliding frame. A locking plate is hinged to one end of the scissor fork. A locking block is installed on the outer side of the locking plate. A spring is installed on the inner side of the locking plate. A rubber block is installed on the other end of the scissor fork. Two sets of limit blocks are symmetrically installed on the inner side of the fixing frame.

[0008] Furthermore, a filter screen is provided inside the vent, and an inclined surface facing the fan assembly is provided on the side of the cooling frame near the vent.

[0009] Furthermore, the return chamber is connected to the collection chamber via an outlet pipe. The partition is positioned inside the collection chamber near the connection point between the outlet pipe and the collection chamber. The height of the partition is lower than the inner cavity height of the collection chamber. The top of the return chamber has an opening that connects to the coolant bag and the bottom of the cooling frame. The top of the collection chamber, away from the outlet pipe, is connected to a valve, and the bottom has an opening that connects to the cooling frame.

[0010] Furthermore, the linear guide module is disposed at the top of the base in an inclined manner, and the width of the pressure plate is greater than the width of the coolant bag.

[0011] Furthermore, the card block and the limiting block have parallel inclined surfaces on their mating surfaces in the forward direction of the card plate, and the side plate of the chassis has a rectangular opening adapted to the rubber block.

[0012] Furthermore, the two sets of limiting blocks are multiple in number and are spaced apart on the inner side of the fixed frame with the length of the card block as the spacing.

[0013] Furthermore, the side of the sliding frame has an opening whose size matches that of the limiting block.

[0014] Furthermore, the coolant bag is filled with hydrofluoroether coolant, the slot is filled with a composite phase change material composed of metal particles and paraffin, and the heat transfer plate and heat transfer fins are both made of carbonaceous material.

[0015] The beneficial effects of the present invention are as follows: (1) The present invention is electrically connected through the motherboard, combined with the fan curve setting to set the start temperature, and is equipped with a combination of pressure plate and electric cylinder, as well as the use of linear guide rail module. When the pressure plate moves, it works in conjunction with the push of the electric cylinder to squeeze the coolant bag to continuously deliver coolant. And through the flowing coolant, the heat in the chassis is carried away by heat absorption and sent out by the fan assembly, thereby achieving the cooling of the inside of the main chassis and achieving the effect of synergistic heat dissipation. In addition, the composite phase change material used absorbs and stores heat, and through the coolant which is harmless to electronic components, combined with The above mechanism further improves the heat dissipation effect; (2) The present invention uses a scissor with a locking block and a rubber block at both ends. When disassembling and assembling the side panel, the fixed frame can slide and lock in the sliding frame by rotating the locking block, which facilitates the disassembly and assembly of the side panel and ensures the stability of the side panel on the main chassis. At the same time, the side panel can be moved and fixed to the required distance as needed, and the valve set on the collection chamber can facilitate the replenishment of water in the coolant bag. In addition, the adjustable corrugated pipe allows the heat transfer block to flexibly fit the heat sink on the CPU fan, improving the heat dissipation effect. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the front structure of the present invention.

[0017] Figure 2 This is a schematic diagram of the rear structure of the present invention.

[0018] Figure 3 This is a schematic diagram of the inner structure of the cooling frame of the present invention.

[0019] Figure 4 yes Figure 3 Enlarged schematic diagram of the structure at point A in the middle.

[0020] Figure 5 This is a schematic diagram of the internal structure of the flow collection chamber of this invention.

[0021] Figure 6 This is a side view of the internal structure of the reflux chamber of the present invention.

[0022] Figure 7 This is a schematic diagram of the internal components of the fixed frame and the sliding frame structure of the present invention.

[0023] Figure 8 This is a cross-sectional view of the internal structure of the cooling block of the present invention.

[0024] Figure 9 This is a schematic diagram of the heat transfer plate structure used in this invention.

[0025] Reference numerals: 1. Chassis side panel; 2. Fan assembly; 3. Cooling frame; 4. Guide plate; 5. Vent hole; 6. Control box; 7. Collector compartment; 8. Return compartment; 9. Cooling pipe; 10. Cooling block; 11. Partition plate; 12. Base; 13. Linear guide module; 14. Bracket; 15. Electric cylinder; 16. Pressure plate; 17. Coolant bag; 18. Water outlet pipe; 19. Fixing frame; 20. Sliding frame; 21. Scissor lift; 22. Clamping plate; 23. Clamping block; 24. Spring; 25. Rubber block; 26. Limiting block; 27. Power supply equipment; 28. Water chamber; 29. ​​Slot; 30. Heat transfer plate; 31. Filling groove; 32. Heat transfer fins; 33. Corrugated pipe. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0027] like Figures 1 to 9 As shown, this embodiment of a time-limited heat dissipation co-processing component for a computer chassis includes a chassis side panel 1, a fan assembly 2 mounted on the front of the chassis side panel 1, a cooling frame 3 mounted on the back of the chassis side panel 1, a guide plate 4 mounted on the inner wall of the cooling frame 3 away from the fan assembly 2, and a vent 5 opened on the inner wall of the cooling frame 3 near the fan assembly 2. A filter screen is installed inside the vent 5. When the co-processing component is working, the use of the filter screen prevents the coolant on the guide plate 4 from splashing into the chassis. The side of the cooling frame 3 near the vent 5 has an inclined surface facing the fan assembly 2. The inclined surface is designed to better guide the airflow out. At the same time, the orientation of the inclined surface also plays a role in preventing splashing and dust. Co-processing components are installed on the top and bottom of the cooling frame 3, and fixing components are installed at the four top corners of the back of the chassis side panel 1.

[0028] like Figures 3 to 5As shown, the co-working components include a current collection chamber 7 and a return chamber 8. The current collection chamber 7 is installed on the top of the cooling frame 3, and the return chamber 8 is installed on the bottom of the cooling frame 3. A cooling pipe 9 is connected to the side of the current collection chamber 7. One end of the cooling pipe 9 is connected to a cooling block 10 through a corrugated pipe 33. The corrugated pipe 33 is made of stainless steel and is connected to the cooling pipe 9 and the cooling block 10 by welding. The corrosion resistance of stainless steel is utilized to improve service life. Furthermore, the corrugated pipe 33 is flexible due to its shape, allowing it to bend and protecting the bending angle. This allows the cooling block 10 to be better fitted to the heatsink on the CPU cooling fan by adjusting the angle, and the heat is then conducted back to the coolant filled inside the cooling block 10, which absorbs the heat again, thus improving the cooling effect. A partition 11 is installed inside the current collection chamber 7.

[0029] like Figure 5 As shown, the return chamber 8 is connected to the collection chamber 7 via the outlet pipe 18. The baffle 11 is positioned inside the collection chamber 7 near the connection point between the outlet pipe 18 and the collection chamber 7. Referring to the diagram, since the return chamber 8 is connected to the collection chamber 7, when the coolant in the coolant bag 17 is delivered to the collection chamber 7, the baffle 11 divides the internal space of the collection chamber 7 into two parts. The coolant will first fill the space near the outlet pipe 18, ensuring that the internal space of the cooling pipe 9 and the cooling block 10 is also filled. Furthermore, since the height of the baffle 11 is lower than the internal height of the collection chamber 7, the return chamber 8... The top has an opening that connects to the bottom of the coolant bag 17 and the cooling frame 3, allowing the coolant in the coolant bag 17 to fill the space in the cooling pipe 9 and the water cavity 28 inside the cooling block 10, while also flowing to the guide plate 4. After flowing through the guide plate 4, it flows back to the coolant bag 17 through the opening at the top of the return chamber 8. The top of the collection chamber 7, which is away from the outlet pipe 18, is connected to a valve, and the bottom has an opening that connects to the cooling frame 3. The combination of the valve's position and the bottom opening facilitates the replenishment of coolant, while the bottom opening also allows the coolant to flow smoothly to the guide plate 4.

[0030] like Figure 6As shown, a base 12 is installed inside the reflux chamber 8. A linear guide module 13 is installed on the top of the base 12. A bracket 14 is installed at the moving end of the linear guide module 13. An electric cylinder 15 is installed on the side of the bracket 14. A pressure plate 16 is installed at the output end of the electric cylinder 15. The linear guide module 13 is set at an angle on the top of the base 12. The width of the pressure plate 16 is greater than the width of the coolant bag 17. As can be seen from the angle of the linear guide module 13, when the pressure plate 16 slides on the linear guide module 13, the distance between the pressure plate 16 and the coolant bag 17 gradually decreases. Furthermore, the pressure plate 16 is installed in conjunction with the electric cylinder 15. The movement of the pressure plate 16 is coordinated with the pushing of the electric cylinder 15 to ensure sufficient pressure to expel the coolant from the coolant bag 17. The coolant bag 17 is installed inside the return chamber 8, and the bottom side of the coolant bag 17 is connected to the outlet pipe 18. The control box 6 and the power supply device 27 are installed on the back of the return chamber 8. The control box 6 contains the control motherboard, which is electrically connected to the power supply device 27, the electric cylinder 15, the linear guide module 13, and the fan assembly 2. The power supply device 27 is equipped with power wiring that is compatible with the hardware interface on the motherboard UEFI. The control box 6 contains a control circuit board to control the fan assembly 2, electric cylinder 15, and linear guide module 13. Power is supplied to the linear guide module 13, electric cylinder 15, and fan assembly 2 via a power supply device 27. The power supply device 27's power connector can be plugged into the motherboard BIOS, thus connecting the motherboard to the control board in the control box 6 via electrical signals. Fan control options provided by the motherboard BIOS are used to set the starting temperature and speed of fan assembly 2 based on fan speed curves, enabling periodic startup to assist the CPU cooling fan. For coordinated heat dissipation, the cooling block 10 has a water cavity 28 connected to the corrugated pipe 33 inside. Multiple slots 29 are arrayed on the front of the cooling block 10, and heat transfer plates 30 are inserted into the slots 29. A filling groove 31 is formed on the side of the heat transfer plate 30, and multiple heat transfer fins 32 are arrayed inside the filling groove 31. The coolant bag 17 is filled with hydrofluoroether coolant, and the slots 29 are filled with a composite phase change material composed of metal particles and paraffin. Both the heat transfer plate 30 and the heat transfer fins 32 are made of carbonaceous material. Based on the above, due to the structural characteristics of the corrugated pipe 33, and combined with... Figure 8 and Figure 9As shown, the structure and arrangement of the heat transfer plate 30 allow the angle of the cooling block 10 to be adjusted by bending the corrugated pipe 33, enabling the heat transfer plate 30 to effectively adhere to the heat sink on the CPU cooling fan. This allows for heat conduction using the heat transfer properties of the carbon material. Simultaneously, the composite phase change material filled in the slot 29 directly contacts the heat transfer plate 30, absorbing the heat conducted by the heat transfer plate 30. The composite phase change material, composed of paraffin wax and metal particles, further enhances heat absorption efficiency with the added metal particles. The physical properties of paraffin wax allow for heat absorption and storage, while the heat absorbed by the paraffin wax is absorbed and carried away by the flowing coolant. The coolant used is hydrofluoroether, which possesses high stability, high fluidity, and high thermal conductivity, and is harmless to electronic components. Combined with the above, when the coolant flows through the guide plate 4 under pressure, the heat it carries is sent to the outside by the airflow generated by the fan assembly 2.

[0031] like Figure 7 As shown, the fixing assembly includes a fixing frame 19 and a sliding frame 20. The sliding frame 20 is installed at the four top corners of the back of the side panel 1 of the chassis. The fixing frame 19 is slidably installed on the sliding frame 20. A scissor fork 21 is rotatably mounted on the inside of the sliding frame 20. A locking plate 22 is hinged to one end of the scissor fork 21. A locking block 23 is installed on the outer side of the locking plate 22, and a spring 24 is installed on the inner side of the locking plate 22. A rubber block 25 is installed on the other end of the scissor fork 21. The locking block 23 and the limiting block 26 have parallel inclined surfaces on their contact surfaces in the forward direction of the locking plate 22. As can be seen from the figure, when the fixing frame 19 slides into the sliding frame 20, when the locking plate 22 moves forward, due to the presence of the inclined surfaces and the mounting method of the locking plate 22 on the scissor fork 21, the locking plate 22 can rotate, allowing the fixing frame 19 to move forward. The frame 19 can move forward normally. The side panel 1 of the chassis has a rectangular opening that matches the rubber block 25. As shown in the figure, when the fixed frame 19 wants to exit the sliding frame 20, the fixed frame 19 can be smoothly exited by moving the rubber block 25 through the rectangular opening. Two sets of limit blocks 26 are symmetrically installed on the inner side of the fixed frame 19. There are multiple limit blocks 26, and they are spaced apart on the inner side of the fixed frame 19 with the length of the locking block 23 as the distance. The side of the sliding frame 20 has an opening with a size that matches the size of the limit blocks 26. By setting the number of limit blocks 26, the sliding distance of the fixed frame 19 can be adjusted according to the needs. The opening on the sliding frame 20 ensures that when the fixed frame 19 is restricted on the sliding frame 20, it will not detach from the sliding frame 20 in the vertical direction.

[0032] The working principle of this embodiment is as follows: During installation, the sliding frame 20 is installed at the top and bottom of the chassis. When the fixing frame 19 is slid into the sliding frame 20, as the fixing frame 19 slides in, when the locking block 23 moves forward with the locking plate 22, after the inclined surface on the locking block 23 contacts the inclined surface on the limiting block 26, the locking plate 22 will swing inward, allowing the locking plate 22 to pass smoothly through the limiting block 26. As the locking plate 22 enters, the side plate moves to a suitable position, allowing the side plate to close the main body. On the side of the chassis, when it is necessary to remove the side panel, slide the rubber block 25 outward. After the scissor 21 on the side of the rubber block 25 expands, the scissor 21 on the side of the card plate 22 retracts, so that the card block 23 no longer contacts the limiting block 26, allowing the fixing frame 19 to be removed from the sliding frame 20. Then, according to the position of the CPU heatsink, adjust the angle of the cooling block 10 by bending the waveform tube so that the heat transfer plate 30 can be attached to the heatsink of the CPU cooling fan, completing the installation.

[0033] When the heat dissipation co-processor is working, after plugging the power supply cable of the power supply device 27 into the hardware interface of the motherboard, enter the BIOS to make settings. Based on the fan curve, set the start-up temperature of the fan assembly 2 to 80℃. Before the CPU temperature reaches the set temperature, the heat is stored through the composite phase change material and the heat transfer block. Then, when the CPU temperature reaches above 80℃, an electrical signal is transmitted to the control motherboard in the control box 6. The control motherboard controls the start-up of the fan assembly 2, the linear guide module 13, and the electric cylinder 15 to perform actions. While the rotating fan assembly 2 draws hot air out of the chassis, the pressure plate 16 and the electric cylinder 15 gradually move downward under the drive of the linear guide module 13. During operation, the electric cylinder 15 drives the pressure plate 16 to press against the coolant bag 17. The pressure plate 16 continuously presses the coolant in the coolant bag 17 into the outlet pipe 18, and then flows into the manifold 7. Due to the obstruction of the baffle 11 in the manifold 7, the coolant entering the manifold 7 gradually fills the space of the cooling pipe 9 and the cooling block 10. At the same time, a part of the coolant flows to the other side of the baffle 11, flows out of the manifold 7 and flows to the inside of the guide plate 4 on the cooling frame 3. When the coolant flows through the guide plate 4, since one side of the guide plate 4 is in contact with the internal environment of the main unit case, the heat in the main unit case is conducted to the guide plate 4, absorbed by the coolant, and sent to the external space by the airflow through the fan assembly 2, thus achieving the cooling effect.

[0034] As the pressure plate 16 moves, in conjunction with the action of the electric cylinder 15, the coolant bag 17 is divided into two parts by the moving pressure plate 16. As the liquid in the lower part decreases, the flow rate into the collection chamber 7 weakens. As the water pressure gradually weakens, the coolant in the cooling pipe 9 and the cooling block 10 flows to the guide plate 4. When it flows through the guide plate 4, the airflow generated by the fan assembly 2 removes the heat carried by the coolant. When the pressure plate 16 moves to the lowest point and then returns to the top of the linear guide module 13, the coolant accumulated in the upper part of the coolant bag 17 refills the coolant bag 17. As the pressure plate 16 moves from the top to the bottom of the linear guide module 13 again, the continuous reciprocating movement of the pressure plate 16 realizes the circulation of the coolant, and also allows the coolant in the cooling pipe 9 and the cooling block 10 to flow, thus completing the function of coordinated heat dissipation.

[0035] The above are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention.

Claims

1. A time-periodic heat dissipation synergic assembly for computer mainframe, comprising a mainframe side plate (1), characterized in that: The front of the cabinet side plate (1) is provided with a fan group (2), the back of the cabinet side plate (1) is provided with a cooling frame (3), the inner wall of the cooling frame (3) is provided with a guide plate (4) away from the fan group (2), the inner wall of the cooling frame (3) is provided with a ventilation hole (5) close to the fan group (2), the top and bottom of the cooling frame (3) are provided with a cooperative assembly, and the four top corners of the back of the cabinet side plate (1) are provided with a fixing assembly; The cooperative assembly comprises a flow collecting bin (7) and a backflow bin (8), the flow collecting bin (7) is installed at the top of the cooling frame (3), the backflow bin (8) is installed at the bottom of the cooling frame (3), the side of the flow collecting bin (7) is communicated with a cooling pipe (9), one end of the cooling pipe (9) is communicated with a cooling block (10) through a corrugated pipe (33), the inside of the flow collecting bin (7) is provided with a partition plate (11), the inside of the backflow bin (8) is provided with a base (12), the top of the base (12) is provided with a linear guide rail module (13), the moving end of the linear guide rail module (13) is provided with a support (14), the side of the support (14) is provided with an electric cylinder (15), the output end of the electric cylinder (15) is provided with a pressing plate (16), the inside of the backflow bin (8) is provided with a cooling liquid bag (17), the bottom side of the cooling liquid bag (17) is communicated with a water outlet pipe (18), the back of the backflow bin (8) is provided with a control box (6) and a power supply device (27), the inside of the control box (6) is provided with a control mainboard, and the control mainboard is electrically connected with the power supply device (27), the electric cylinder (15), the linear guide rail module (13) and the fan group (2), the power supply device (27) is provided with a power supply line matched with a hardware socket on a UEFI mainboard, the inside of the cooling block (10) is provided with a water cavity (28) communicated with the corrugated pipe (33), the front of the cooling block (10) is provided with a plurality of slot (29), the inside of the slot (29) is inserted with a heat transfer plate (30), the side of the heat transfer plate (30) is provided with a filling groove (31), and a plurality of heat transfer fins (32) are arranged in the filling groove (31); The backflow bin (8) is communicated with the flow collecting bin (7) through the water outlet pipe (18), the partition plate (11) is arranged close to the communication position of the water outlet pipe (18) and the flow collecting bin (7) in the flow collecting bin (7), the height of the partition plate (11) is lower than the height of the inner cavity of the flow collecting bin (7), the top of the backflow bin (8) is provided with an opening communicated with the cooling liquid bag (17) and the bottom of the cooling frame (3), and the top of the flow collecting bin (7) away from the water outlet pipe (18) is communicated with a valve, and the bottom of the flow collecting bin (7) is provided with an opening communicated with the cooling frame (3); The inside of the cooling liquid bag (17) is filled with hydrofluoroether cooling liquid, the inside of the slot (29) is filled with a composite phase change material composed of metal particles and paraffin, and the heat transfer plate (30) and the heat transfer fin (32) are both carbon materials.

2. A time-of-flight thermal dissipation cooperative assembly for a computer mainframe case according to claim 1, wherein: The fixing assembly comprises a fixing frame (19) and a sliding frame (20), the sliding frame (20) is installed at the four top corners of the back of the cabinet side plate (1), the fixing frame (19) is slidingly installed on the sliding frame (20), the inside of the sliding frame (20) is rotationally installed with a scissor (21), one end of the scissor (21) is hingedly installed with a clamping plate (22), the outer side of the clamping plate (22) is installed with a clamping block (23), the inner side of the clamping plate (22) is installed with a spring (24), the other end of the scissor (21) is installed with a rubber block (25), and the inner side of the fixing frame (19) is symmetrically installed with two groups of limiting blocks (26).

3. A time-of-flight thermal dissipation cooperative assembly for a computer mainframe case according to claim 1, wherein: The inside of the ventilation hole (5) is provided with a filter screen, and the side of the cooling frame (3) close to the ventilation hole (5) is provided with an inclined surface facing the fan group (2).

4. A time-of-flight thermal management cooperative assembly for a computer mainframe enclosure as defined in claim 1, wherein: The linear guide rail module (13) is arranged in an inclined form on the top of the base (12), and the width of the pressing plate (16) is greater than the width of the cooling liquid bag (17).

5. A time-of-flight thermal dissipation cooperative assembly for a computer mainframe case according to claim 2, wherein: The clamping block (23) and the limiting block (26) are provided with mutually parallel inclined surfaces on the abutting surface in the advancing direction of the clamping plate (22), and the cabinet side plate (1) is provided with a rectangular opening matched with the rubber block (25).

6. A time-of-flight thermal dissipation cooperative assembly for a computer mainframe case according to claim 2, wherein: The number of the two groups of limiting blocks (26) is multiple, and the limiting blocks (26) are arranged on the inner side of the fixing frame (19) at a spacing distance of the length of the clamping block (23).

7. A time-of-flight thermal dissipation cooperative assembly for a computer mainframe case according to claim 2, wherein: The side of the sliding frame (20) is provided with an opening with a size matched with the size of the limiting block (26).

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