Force feedback system

Abstract

The embodiment of the invention provides a force feedback system. The force feedback system comprises a glove body. A microprocessor coupled to the glove body, the microprocessor communicatively coupled to an external computing device; the microprocessor is arranged on the glove body, each finger force feedback piece is mechanically coupled to the glove body and is in communication coupling with the microprocessor, and the finger force feedback pieces are configured to provide force feedback for fingers corresponding to the finger force feedback pieces according to instructions of the microprocessor. Each finger force feedback piece comprises a pull rope for tracking the movement of the fingers, a transmission part for moving along with the pull rope and a stop part, and a plurality of stop structures are sequentially arranged on the transmission part; and the stop component is configured to be matched with any one of the plurality of stop structures so as to brake the finger.

Description

Cross-references

[0001] This specification claims the priority of the international application with application number PCT / CN2023 / 124295 filed on October 12, 2023, and the entire contents are incorporated herein by reference. Technical Field

[0002] The present invention relates to the technical field of electronic components, and in particular to a force feedback system. Background Art

[0003] With the gradual maturity of AR / VR technology and the rise of the concept of the metaverse, in order to allow users to obtain more realistic feedback, intelligent electronic devices used for human-computer interaction further require mechanical perception and simulation. Among them, fingers are the most important part that determines mechanical perception and feedback. However, in order to restore finger force feedback, the components of the finger force feedback parts are complex and the number is large, resulting in large power consumption and size of the finger force feedback parts.

[0004] Therefore, it is necessary to create a force feedback system that can improve the efficiency of finger force feedback while reducing the power consumption and size of the finger force feedback member. Summary of the invention

[0005] One of the embodiments of the present specification provides a force feedback system. The force feedback system includes a glove body; a microprocessor coupled to the glove body, the microprocessor being communicatively coupled to an external computing device; and a plurality of finger force feedback members, each of the plurality of finger force feedback members being mechanically coupled to the glove body and communicatively coupled to the microprocessor, and being configured to provide force feedback to the corresponding finger according to the instruction of the microprocessor, wherein each of the finger force feedback members includes a drawstring that tracks the movement of the finger, a transmission component that moves following the drawstring, and a stop component, wherein a plurality of stop structures are sequentially arranged on the transmission component, and the stop component is configured to cooperate with any of the plurality of stop structures to achieve braking of the finger.

[0006] In some embodiments, each finger force feedback member includes a shell located on the back of the palm, and the transmission component and the stop component are located in the shell, wherein the force feedback system also includes a fingertip cover, and the pull rope mechanically connects the fingertip cover and the transmission component.

[0007] In some embodiments, each of the finger force feedback components further includes a wire groove arranged between the finger joints of the glove body, and the drawstring passes through the wire groove to connect the fingertip cover and the transmission component.

[0008] In some embodiments, the transmission component includes a spool, the pull rope is wound around the spool, a stop structure is arranged on the surface of the spool, and the stop component includes a stop sheet that can be inserted into a groove between the stop structures.

[0009] In some embodiments, the gradient of one side of the stopping structure abutting against the stopping plate is greater than the gradient of the other side.

[0010] In some embodiments, a limiting protrusion is arranged on the inner side surface of the shell opposite to the stopping structure.

[0011] In some embodiments, the height of the limiting protrusion is greater than the height of the stop structure. Such a configuration can prevent friction between the stop structure and the upper surface of the spool, thereby ensuring the accuracy of force feedback.

[0012] In some embodiments, the stop member includes a transmission rod configured to press or release the stop plate according to instructions, wherein when the transmission rod presses the stop plate, the stop plate is inserted into the groove between the stop structures.

[0013] In some embodiments, the stop member includes a piezoelectric structure configured to drive the stop plate to be inserted into the inter-stop structure groove.

[0014] In some embodiments, the retaining plate may be inserted into the groove between the retaining structures to correspond to multiple depths, thereby providing feedback forces of different magnitudes.

[0015] In some embodiments, each of the finger force feedback members further comprises a sensing component configured to detect the moving distance of the pull rope and transmit data related to the moving distance of the pull rope to a microprocessor.

[0016] In some embodiments, the transmission component includes a spool, the pull rope is wound around the spool, and the sensing component includes a magnet mechanically connected to the spool and a magnetic field sensor that measures rotation information of the magnet as the spool rotates.

[0017] In some embodiments, each of the finger force feedback members further comprises a strain sensor, which is arranged at a finger joint of the glove body and is configured to read posture data of the finger.

[0018] In some embodiments, the transmission component includes a spool and a scroll spring mechanically connected to the spool, the pull rope is wound around the spool, and the scroll spring is configured to drive the spool to rotate in the opposite direction to reset the pull rope after the finger releases the external tension. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present application will be further described in the form of exemplary embodiments, which will be described in detail by way of the accompanying drawings. These embodiments are not restrictive, and in these embodiments, the same number represents the same structure, wherein:

[0020] Figure 1 is a schematic diagram of a framework of an exemplary force feedback system according to some embodiments of this specification;

[0021] Figure 2 is a schematic diagram of an exemplary microprocessor according to some embodiments of the present specification;

[0022] Figure 3 is a schematic diagram of an exemplary microprocessor communicatively coupled to an external computing device according to some embodiments of the present specification;

[0023] Figure 4A is a schematic diagram of an exemplary force feedback system according to some embodiments of the present specification;

[0024] Figure 4B yes Figure 4A A side view frame diagram of a force feedback system shown;

[0025] Figure 5A is a partial structural schematic diagram of an exemplary finger force feedback member according to some embodiments of this specification;

[0026] Figure 5B is a schematic diagram of a partial structural side view of an exemplary stop component according to some embodiments of the present specification;

[0027] Fig. 6A is a partial structural schematic diagram of another exemplary finger force feedback component according to some embodiments of this specification;

[0028] Figure 6B is a schematic diagram of a partial structural side view of another exemplary stop component according to some embodiments of the present specification;

[0029] Fig. 7A is a partial structural schematic diagram of another exemplary finger force feedback component according to some embodiments of this specification;

[0030] Figure 7B is a schematic diagram of a partial structural side view of another exemplary stop component according to some embodiments of the present specification;

[0031] Figure 8 A schematic diagram of a partial structural side view of another exemplary stop member according to some embodiments of the present specification;

[0032] Fig. 9is a schematic diagram of the joint positions of a user's hand according to some embodiments of this specification;

[0033] Fig.10 is an exemplary schematic diagram of a hand motion coordinate system according to some embodiments of this specification;

[0034] Fig.11 is a schematic diagram of a second strain sensor according to some embodiments of this specification;

[0035] Fig.12 is a schematic diagram of a second strain sensor according to some other embodiments of the present specification;

[0036] Fig.13A is a schematic diagram of the distribution of four capacitor structures on a flexible substrate according to some embodiments of this specification;

[0037] Fig. 13B yes Fig.13A The schematic diagram of the cross-sectional structure of the four capacitor structures shown along the Y-axis direction;

[0038] Fig.14A is a schematic diagram of a second sensor without deformation according to some embodiments of this specification;

[0039] Fig. 14B yes Fig.14A The deformation diagram of the second sensor after being stretched or compressed along the long axis direction is shown;

[0040] Fig.15 yes Fig.14A A side view schematic diagram of the second sensor after bending and deformation around an axis parallel to the short axis direction;

[0041] Fig.16 yes Fig.14A The schematic top view of the second sensor after bending and deformation around an axis parallel to the thickness direction is shown;

[0042] Fig.17 is a schematic cross-sectional view of a second strain sensor according to some embodiments of the present specification. DETAILED DESCRIPTION

[0043] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, the present application can also be applied to other similar scenarios based on these drawings without creative work. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

[0044] It should be understood that the "system", "device", "unit" and / or "module" used herein are a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

[0045] As shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not refer to the singular and may also include the plural. Generally speaking, the terms "comprises" and "includes" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0046] Flowcharts are used in the present application to illustrate the operations performed by the system according to the embodiments of the present application. It should be understood that the preceding or following operations are not necessarily performed accurately in order. On the contrary, the various steps may be processed in reverse order or simultaneously. At the same time, other operations may also be added to these processes, or one or more operations may be removed from these processes.

[0047] Figure 1 is a schematic diagram of a framework of an exemplary force feedback system according to some embodiments of this specification. Figure 1 As shown, the force feedback system 100 may include a glove body 110 , a microprocessor 120 and a finger force feedback member 130 .

[0048] The force feedback system 100 is a system that feeds back the reaction force of a target object in a virtual environment to the user. The force feedback system 100 can sense the user's hand behavior on the target object (e.g., grabbing, stroking, touching, slapping, etc.), and simulate the reaction force corresponding to the behavior and feed it back to the user, helping the user to feel the target object in the virtual environment from the sense of force and / or touch. The force feedback system 100 can feed back the reaction force corresponding to the behavior to the user through one or more devices, such as motion capture gloves, VR gloves, force feedback gloves, tactile feedback gloves, etc.

[0049] The glove body 110 refers to a wearable item for fitting with the hand. In some embodiments, in order to facilitate the glove body 110 to fit with the hand joints (for example, including the interphalangeal joints, metacarpophalangeal joints, wrist joints, etc.), the glove body 110 has a structure that adapts to the shape of the hand and extends along the hand joints. In some embodiments, the glove body 110 can be a flexible fabric that is easy to deform (such as bending deformation, etc.) along with the fingers when subjected to external forces. In some embodiments, the glove body 110 can provide support for the finger force feedback piece 130 to facilitate the arrangement of the finger force feedback piece 130. For example, the glove body 110 can include one or more layers of flexible structure (for example, flexible fabric). The finger force feedback piece 130 can be fixed to the surface of a layer of flexible structure by means of gluing, pressing or sewing.

[0050] The finger force feedback member 130 is a component that feeds back the reaction force of the target object in the virtual environment to the finger of the user.

[0051] In some embodiments, the force feedback system 100 may include a plurality of finger force feedback members 130. For example, each finger may correspond to a finger force feedback member 130. In some embodiments, the finger force feedback member 130 may be mechanically coupled to the glove body 110. For example, each finger force feedback member 130 may be mechanically coupled to a position on the back of the palm of the glove body 110 near the base of the corresponding finger. As an example only, each finger force feedback member 130 may be fixed to the back of the palm of the glove body 110 near the base of the finger by means of gluing, pressing or sewing.

[0052] In some embodiments, the finger force feedback member 130 may be communicatively coupled with the microprocessor 120, and provide force feedback to the corresponding finger according to the instruction of the microprocessor 120. In some embodiments, the finger force feedback member 130 may generate a sensing signal and send it to the microprocessor 120, and the microprocessor 120 may further generate an instruction for controlling the finger force feedback member 130 based on the sensing signal, thereby realizing interaction with the finger force feedback member 130.

[0053] In some embodiments, each finger force feedback member 130 may include a pull cord that tracks the movement of the finger, a transmission component that moves with the pull cord, and a stop component. In some embodiments, a plurality of stop structures may be arranged in sequence on the transmission component. The stop component may be configured to cooperate with any of the plurality of stop structures to brake the finger. For example, the transmission component may include a bobbin, the pull cord is wound around the bobbin and can drive the bobbin to rotate under the action of an external tension. The plurality of stop structures may include ratchets arranged on the bobbin, and the stop component includes a stop plate that can be inserted into the grooves between the ratchets. When the stop plate is inserted into the grooves between the ratchets, the rotation of the bobbin can be hindered to achieve a braking effect. The pull cord is connected to the fingertip cover, so that the braking force generated by the stop plate on the bobbin can be transmitted to the fingertip cover, allowing the user's fingers to feel the feedback force generated by the brake.

[0054] In some embodiments, the finger force feedback member 130 may include a sensing component. The sensing component may detect the movement state of the pull rope (e.g., movement direction, movement speed, movement distance, etc.), and transmit data related to the movement state of the pull rope to the microprocessor 120. The microprocessor 120 may send the data related to the movement state of the pull rope to an external computing device coupled to it in communication, and the external computing device may determine the movement of the finger based on the data related to the movement state of the pull rope, and generate corresponding information and / or control signals based on the determination result. The information and / or control signals may be further sent to the microprocessor 120 to control the operation of the finger force feedback member 130.

[0055] In some embodiments, the finger force feedback member 130 may include a strain sensor. The strain sensor may be arranged at the finger joint of the glove body 110 and configured to read the posture data of the finger.

[0056] For the specific structure of the finger force feedback member 130, please refer to Figure 5A-Figure 8 and its related description.

[0057] The microprocessor 120 can be coupled to the external computing device and each finger force feedback member 130 for communication, and process the data and / or information obtained from each finger force feedback member 130 and / or the external computing device, so as to realize the interaction between the external computing device and the finger force feedback member 130. The external computing device includes a computer, a mobile phone, an AR / VR device, a robot, etc. The interaction may include, for example, force feedback, controlling the switch of the external computing device, volume adjustment, the program process of the external computing device (such as controlling the movement of the game character), fitness feedback, etc. In some embodiments, the microprocessor 120 can be coupled to the glove body 110. For example, the microprocessor 120 can be fixed on the surface of a layer of the flexible structure of the glove body 110 (for example, fixed on the back of the palm of the glove body 110) by means of pasting, pressing or sewing. In some embodiments, the data related to the finger force feedback member 130 can be transmitted to the microprocessor 120 through a wire. In some embodiments, the microprocessor 120 may include one or more processing chips, and the processing chip analyzes and processes the received data. In some embodiments, the microprocessor 120 is an independent processing device. In some embodiments, the microprocessor 120 may be an external device or a part of the glove body 110. For example, the microprocessor 120 may be integrated into an external computing device or the glove body 110.

[0058] Figure 2 is a schematic diagram of an exemplary microprocessor according to some embodiments of the present specification.

[0059] like Figure 2 As shown, the microprocessor 120 may include a data processing module 220 , a wireless transmission module 210 , a power module 230 and an inertial sensing module 240 .

[0060] The wireless transmission module 210 can be used to communicate with an external computing device (e.g., a computer, an AR / VR host, a robot, etc.). For example, the wireless transmission module 210 can send data related to the finger force feedback member 130 (e.g., data related to the moving distance of the pull rope, finger posture data, etc.) to the external computing device through the network. For another example, the wireless transmission module 210 can also send data related to the inertial sensor module 240 (e.g., data related to the overall spatial movement of the user's hand) to the external computing device through the network. For another example, the wireless transmission module 210 can obtain a control signal for controlling the finger force feedback member 130 from the external computing device through the network. In some embodiments, the network includes a public network (e.g., the Internet), a private network (e.g., a local area network (LAN), a wide area network (WAN), etc.), a wired network (e.g., an Ethernet network), a wireless network (e.g., a Wi-Fi network, etc.), a cellular network (e.g., a long-term evolution (LTE) network), a virtual private network ("VPN"), a satellite network, a telephone network, a router, a hub, a switch, a server computer, and / or any combination thereof.

[0061] The data processing module 220 can be used to process data and / or information obtained from an external computing device and / or the finger force feedback member 130. For example, the data processing module 220 can receive and process the signal sent by the sensing component of the finger force feedback member 130, and send it to the external computing device through the wireless transmission module 210. For another example, the data processing module 220 can generate an instruction based on the signal received by the wireless transmission module 210 and send it to the finger force feedback member 130, so as to control the operation of the stopper component in the finger force feedback member 130 and realize the braking of the finger.

[0062] The power module 230 can be used to power the microprocessor 120 and / or the finger force feedback member 130. For example, the power module 230 can power components such as the stopper and the sensor in the finger force feedback member 130. In some embodiments, the power module 230 can include at least one battery or battery pack.

[0063] The inertial sensing module 240 can be used to capture the spatial movement of the user's hand as a whole. In some embodiments, the spatial movement of the hand as a whole can be expressed as the movement of the wrist joint of the user's hand, and the movement of the wrist joint can include three degrees of freedom: bending, swinging, and rotation. Among them, the bending and swinging of the wrist joint are controlled by the wrist joint, which can cause deformation of the wrist joint. The rotation of the wrist joint is controlled by the rotation of the user's forearm, causing the overall rotation of the wrist joint. In some embodiments, in order to capture the movement of the wrist joint in three degrees of freedom, the inertial sensing module 240 may include two inertial sensors, and the two inertial sensors may be arranged on the glove body 110, corresponding to the areas on both sides of the wrist joint (for example, Fig. 9The two sides of the wrist joint refer to the two sides of the wrist joint in the direction of arm extension, that is, the front and back sides of the wrist joint, the front side of the wrist joint refers to the side facing the back of the hand, and the back side of the wrist joint refers to the side facing the forearm. For ease of understanding, the two sides of the wrist joint can be understood as the hand area or forearm area close to the wrist joint in two directions but basically not deformed with the deformation of the wrist joint. The two inertial sensors can respectively collect the position information of the two sides of the wrist joint, and cooperate with each other to identify the movement of the three degrees of freedom of the rotation, bending and swinging of the wrist joint as a whole. In some embodiments, in order to collect the movement of the wrist joint in three degrees of freedom, the inertial sensing module 240 may include an inertial sensor and a strain sensor. The inertial sensor and the strain sensor cooperate to realize the collection of wrist joint movement. In some embodiments, the strain sensor may include a multi-degree-of-freedom sensor, which can be used to collect the deformation of the wrist joint in multiple degrees of freedom. As an example only, the inertial sensor and the strain sensor can be arranged on the glove body 110, the strain sensor is located at the wrist joint, and the inertial sensor is located in an area outside the wrist joint, such as the front or back side of the wrist joint. In some embodiments, the inertial sensor can be located on either side of the wrist joint in the direction of arm extension. By using two inertial sensors or combining an inertial sensor with a strain sensor, multiple degrees of freedom motion acquisition of the wrist joint can be achieved. Users can flexibly select a combination of different sensor types according to different application scenarios to achieve multiple degrees of freedom motion acquisition. For more information about multi-degree-of-freedom strain sensors, see Figure 11-17 and its related description.

[0064] Figure 3 is a schematic diagram of an exemplary microprocessor communicatively coupled to an external computing device according to some embodiments of the present specification.

[0065] like Figure 3 As shown, the microprocessor 120 can be communicatively coupled to the external computing device 140 and each finger force feedback member 130, so as to realize the interaction between the external computing device 140 and the finger force feedback member 130. The interaction between the external computing device 140 and the finger force feedback member 130 can include sensing and force feedback.

[0066] During the sensing process between the external computing device 140 and the finger force feedback member 130, the sensor component 131 in the finger force feedback member 130 can generate a sensing signal based on the state of the finger force feedback member 130 and send it to the microprocessor 120. For example, the state of the finger force feedback member 130 can include the movement state of the pull rope (for example, the movement direction, the movement speed, the movement distance, etc.). The movement state of the pull rope can reflect the movement of the corresponding finger. For example, when the finger is bent, the pull rope moves, the pull rope is pulled out and the movement distance gradually increases, and when the finger is straightened or tilted upward, the pull rope is reset, and the movement distance gradually decreases. The sensor component 131 can detect the movement state of the pull rope (for example, through a magnetic field) and generate data related to the movement state of the pull rope (i.e., a sensing signal) and transmit it to the microprocessor 120. For another example, the state of the finger force feedback member 130 can also include the posture of the finger, such as the deformation of one or more degrees of freedom of the finger (bending, swinging, rotation, etc.). As an example only, each finger force feedback member 130 may include a strain sensor, which is arranged at a finger joint of the glove body 110 and is configured to read the posture data of the finger and send it to the microprocessor 120 .

[0067] During the force feedback process between the external computing device 140 and the finger force feedback member 130, the external computing device 140 can determine the movement of the finger (e.g., whether deformation occurs, the type of deformation, the degree of deformation, etc.) based on the sensing signal and / or the finger posture data, and generate corresponding information and / or control signals based on the judgment result. The information and / or control signal can be further sent to the microprocessor 120 to control the operation of the finger force feedback member 130. For example, the external computing device 140 can simulate the current hand posture based on the judgment result of the finger movement and display it on the display device. For another example, the external computing device 140 can determine whether to brake the finger based on the judgment result of the finger movement and the current scene information and generate a corresponding control signal, and the microprocessor 120 can generate a corresponding control instruction based on the control signal. The stopper 132 and the transmission component (not shown) in the finger force feedback member 130 can cooperate to control the braking or release of the pull rope based on the control instruction, so that the finger associated with the pull rope through the fingertip cover can feel the force feedback.

[0068] Figure 4A is a schematic diagram of an exemplary force feedback system according to some embodiments of the present specification. Figure 4B yes Figure 4A A side view frame diagram of the force feedback system shown.

[0069] Combination Figure 4A and 4BAs shown, the force feedback system 400 may include a glove body 110, a microprocessor 120, a finger force feedback piece 130, and a fingertip cover 140. The microprocessor 120 and the finger force feedback piece 130 may be coupled to the glove body 110. For example, the microprocessor 120 and the finger force feedback piece 130 may be fixed to the back of the palm of the glove body 110 through a base 150. The microprocessor 120 may be connected to the finger force feedback piece 130 (for example, to a circuit board (not shown) in the finger force feedback piece 130) in a wired or wireless manner to send control instructions to the finger force feedback piece 130 or read the sensor signal and / or posture data generated by the finger force feedback piece 130.

[0070] There may be multiple (e.g., 5) finger force feedback members 130, which are used to provide force feedback to corresponding fingers. Each finger force feedback member 130 may include a pull cord 136 that tracks finger movement, a transmission component (not shown) that moves with the pull cord, and a stop component (not shown). The finger force feedback member 130 may include a housing 134 located on the back of the palm, and the transmission component and the stop component may be located in the housing 134. The pull cord 136 may mechanically connect the fingertip cover 140 and the transmission component in the housing 134. Figure 4A and Figure 4B As shown, the finger force feedback member 130 may include a wire groove arranged between the finger joints of the glove body 110 (for example, a wire groove 135-a arranged between the metacarpophalangeal joint 111-a and the interphalangeal joint 111-b, a wire groove 135-b arranged between the interphalangeal joint 111-b and the interphalangeal joint 111-c, etc.), and the pull rope 136 may pass through the wire groove to connect the fingertip cover 140 and the transmission component.

[0071] In some embodiments, a plurality of stop structures may be sequentially arranged on the transmission component. The stop component may be configured to cooperate with any of the plurality of stop structures according to the instruction of the microprocessor 120 to achieve braking or releasing of the pull rope 136. The pull rope 136 may further transmit the braking force of the finger force feedback component 130 to the fingertip cover 140, so that the user's finger can feel the feedback force generated by the braking, thereby achieving force feedback of the force feedback system 100. The microprocessor 120 may also read the sensing signal and / or posture data generated by the finger force feedback component 130, so as to determine the motion state or posture of the user's finger.

[0072] Figure 5A FIG. 1 is a partial structural diagram of an exemplary finger force feedback member according to some embodiments of this specification. Figure 5AAs shown, the finger force feedback member 130 may include a sensing member 131, a stop member 132, a transmission member 133, a pull rope 136, and a rotating shaft frame 137. The transmission member 133 may be located inside the rotating shaft frame 137, the stop member 132 may be located outside the rotating shaft frame 137, and the transmission member 133 and the stop member 132 may be both enclosed by a housing (e.g., Figure 4B In some embodiments, the stop member 132 may also be disposed inside the shaft frame 137, in which case the shaft frame 137 may serve as a housing.

[0073] The transmission component 133 may include a bobbin 531 and a spiral spring 532 mechanically connected to the bobbin 531. Figure 5A As shown, the shaft frame 137 can be connected to the housing (eg, Figure 4B The housing 134 shown in the figure is fixedly connected, or the rotating shaft frame 137 itself can be used as the housing of the finger force feedback member 130. The bobbin 531 is arranged in the rotating shaft frame 137, and the upper side wall 531-1 of the bobbin 531 has an opening. The inner wall of the rotating shaft frame 137 corresponding to the upper side wall 531-1 may include a bobbin column 137-1 extending toward the rotating shaft frame 137. The bobbin column 137-1 passes through the opening of the upper side wall 531-1 and extends into the inside of the bobbin 531, and is rotatably connected to the lower side wall 531-2 of the bobbin 531, so that the bobbin 531 is suspended inside the rotating shaft frame 137. The pull rope 136 is wound around the bobbin 531. When the pull rope 136 is pulled out with external tension, the bobbin 531 can be driven by the pull rope 136 to rotate relative to the bobbin column 137-1, and its rotation axis can be shown as the dotted line aa' in the figure. When the finger force feedback member 130 is coupled to the glove body 110, the upper side wall 531-1 and the lower side wall 531-2 of the spool 531 are parallel or approximately parallel to the back of the palm, the upper side wall 531-1 refers to the side wall on the spool 531 that is relatively far away from the base, and the lower side wall 531-2 refers to the side wall on the spool 531 that is relatively close to the base. The rotation axis aa' can be perpendicular or approximately perpendicular to the back of the palm. In some embodiments, in order to maintain the stability of the spool 531 during rotation, the spool 531 can be a cylindrical structure with the rotation axis aa' as the central axis, and the opening of the upper side wall 531-1 is located at the center of the upper side wall 531-1. The central axis of the spool column 137-1 can coincide with the central axis of the spool 531.

[0074] The spiral spring 532 can be mechanically connected to the spool 531 and configured to drive the spool 531 to rotate in the opposite direction to reset the pull cord 136 after the finger releases the external tension. Figure 5AAs shown, the volute spring 532 can be arranged inside the bobbin 531, one end of which is connected to the bobbin column 137-1, and the other end is connected to the inner wall of the bobbin 531. When the finger applies external tension, the pull rope 136 is pulled out, driving the bobbin 531 to rotate, and the bobbin 531 further drives the volute spring 532 to rotate and tighten. After the finger releases the external tension, the volute spring 532 can drive the bobbin 531 to rotate in the opposite direction to reset the pull rope 136.

[0075] In some embodiments, the stiffness coefficient of the spiral spring 532 can be set to adjust the restoring force of the spiral spring 532. If the stiffness coefficient of the spiral spring 532 is too small, the restoring force will be too small, which may be unfavorable for resetting the pull rope 136 and affect the subsequent braking effect of the pull rope. If the stiffness coefficient of the spiral spring 532 is too large, it will significantly increase the sense of resistance when the finger is bent, affecting the user experience. In addition, an excessively large stiffness coefficient may also cause problems such as the spool 531 rotating too fast and unstable rotation after the external force of the finger is released, thereby affecting the sensing process of the sensing component. Therefore, in some embodiments, the stiffness coefficient of the spiral spring 532 can be less than 100N / m, so that the user experience can be improved while effectively resetting the pull rope 136.

[0076] In some alternative embodiments, an elastic pull cord may be used to achieve the aforementioned reset. Exemplary elastic pull cords include ropes made of rubber or elastic fibers. The elastic pull cord's own resilience is similar to the restoring force provided by the aforementioned volute spring 532. Specifically, when the finger applies an external tension, the elastic pull cord is stretched, driving the spool 531 to rotate; after the finger releases the external tension, the elastic pull cord uses its own resilience to restore to its original length. The stiffness coefficient of the elastic pull cord can be set to adjust the restoring force of the elastic pull cord, to avoid the elastic pull cord increasing the sense of resistance when the finger is bent due to an excessively large stiffness coefficient, and to avoid the situation where the elastic pull cord cannot be restored to its original length due to a too small stiffness decimal. In some embodiments, the stiffness coefficient of the elastic pull cord may be less than 60 N / m.

[0077] Figure 5B is based on Figure 5A The schematic diagram of the structure of the stopper component is shown. Figure 5A and Figure 5B As shown, a plurality of stop structures 533 (e.g., ratchets, etc.) are sequentially arranged on the surface (or upper surface) of the spool 531. When the pull rope 136 drives the spool 531 to rotate, the stop structures 533 rotate along with the spool 531. As an example only, the rotation direction of the stop structure 533 may be direction A. The stop component 132 may cooperate with the stop structure 533 to brake the finger (or the pull rope 136). Specifically, the stop component 132 may include an actuator 521, a stop plate 522, and a transmission rod 523.

[0078] The actuator 521 can execute movement based on the control instruction and drive the transmission rod 523 to move. Figure 5A As shown, the actuator 521 can be arranged on the rotating shaft frame 137, for example, fixedly connected to the upper surface of the rotating shaft frame 137. One end of the transmission rod 523 is connected to the actuator 521, and the other end (or free end) can be suspended. When the actuator 521 receives the control instruction of the microprocessor 120, it can move based on the instruction and transmit the movement to the transmission rod 523. The transmission rod 523 can further convert the movement of the actuator 521 into up and down movement, so that the free end of the transmission rod 523 is lifted up or dropped. The free end of the transmission rod 523 can be suspended above the stopper 522. When the free end of the transmission rod 523 falls, the movement of the actuator 521 can be transmitted to the stopper 522, so that the stopper 522 is inserted into the groove between the stopper structure 533, so that the stopper 522 can be pressed according to the instruction. In some embodiments, the actuator 521 can be a micro-servo, or an electric component such as a piezoelectric sheet, a telescopic motor, or an electromagnet.

[0079] The stopper 522 is a structure that can be inserted into the groove between the stopper structures 533. In some embodiments, the stopper 522 can be a component with elasticity. For example, the stopper 522 can be an elastic spring or a rigid component with a spring structure. One end of the stopper 522 can be connected to the rotating shaft frame 137 (for example, fixedly connected or rotatably connected), and the other end (or referred to as the free end) can be bent and extended toward the stopper structure 533 and suspended above the stopper structure 533. The position of the stopper 522 when it is not subjected to the force of the transmission rod 523 can be referred to as a static position. When the stopper 522 is in the static position, the spool 531 can move along the direction A under the action of the pull rope 136. When the transmission rod 523 (for example, the free end) moves downward under the action of the actuator 521, the stopper 522 moves downward under the pressure of the transmission rod 523, and the free end of the stopper 522 is inserted into the groove between the stopper structures 533, thereby playing the effect of limiting the movement of the stopper structure 533 (i.e., the braking effect). When the transmission rod 523 moves upward, the pressure on the stopper 522 is released, and the stopper 522 returns to the static position under the action of its own elasticity, and the stopper structure 533 is loosened, so that the spool 531 can rotate normally.

[0080] Fig. 6A It is a partial structural diagram of another exemplary finger force feedback component shown in some embodiments of this specification. Fig. 6A The finger force feedback shown is Figure 5A The finger force feedback components shown are basically the same, except that Fig. 6A The finger force feedback element shown can achieve braking through a piezoelectric structure. Fig. 6A As shown, the stop member 132 may include a piezoelectric structure 621 .

[0081] The piezoelectric structure 621 may be a component that moves under the action of a driving voltage. Specifically, the driving voltage acts on the piezoelectric layer of the piezoelectric structure 621, causing the piezoelectric layer to deform, thereby causing the piezoelectric structure 621 to move. In some embodiments, the piezoelectric layer may be made of a piezoelectric material, and exemplary piezoelectric materials may include piezoelectric ceramics, piezoelectric crystals (e.g., barium titanate, lead zirconate titanate, etc.), piezoelectric polymers (e.g., polyvinylidene fluoride), etc., or any combination thereof. In some embodiments, the piezoelectric structure 621 may be in any shape, such as a sheet, block, columnar, annular structure, etc., or any combination thereof.

[0082] Figure 6B yes Fig. 6A The schematic diagram of the structure of the stopper component is shown. Fig. 6A and Figure 6B As shown, the piezoelectric structure 621 can be a cantilever beam fixed on one side, wherein one end (or fixed end) is fixed on the rotating shaft frame 137, and the other end (or free end) is suspended above the stopper 622 or connected to the stopper 622. One end of the stopper 622 can be connected to the rotating shaft frame 137 (for example, fixedly connected or rotatably connected), and the other end (or free end) can be bent and extended toward the stopper structure 633 and suspended above the stopper structure 633. When the finger force feedback member 130 generates a driving voltage based on a control instruction to control the piezoelectric structure 621 to produce a downward deformation, the stopper 622 can be driven to move downward, so that the free end of the stopper 622 is inserted into the groove between the stopper structures 633, thereby having the effect of limiting the movement of the bobbin 631. When the finger force feedback member 130 stops generating the driving voltage based on the control instruction, the piezoelectric structure 621 restores its shape and releases the stop plate 622, and the stop plate 622 returns to the static position upward (for example, one end of the stop plate 622 is fixedly connected to the rotating shaft frame 137, and the free end of the piezoelectric structure 621 is suspended above the stop plate 622. At this time, the stop plate 622 can return to the static position upward under the action of its own elasticity; for another example, one end of the stop plate 622 is rotatably connected to the rotating shaft frame 137, and the free end of the piezoelectric structure 621 is connected to the stop plate 622. At this time, the stop plate 622 can return to the static position upward under the drive of the piezoelectric structure 621), thereby releasing the stop structure 633 and allowing the spool 631 to rotate normally.

[0083] Fig. 7A FIG. 1 is a partial structural diagram of another exemplary finger force feedback member according to some embodiments of this specification. Fig. 7A As shown, the stop member 132 may include a piezoelectric structure 721 . Figure 7B yes Fig. 7A The schematic diagram of the structure of the stopper component is shown. Fig. 7A and Figure 7BAs shown, the piezoelectric structure 721 can be a piezoelectric sheet directly disposed on the surface of the stopper 722. When the finger force feedback member 130 generates a driving voltage based on a control instruction to control the piezoelectric sheet to produce a downward deformation, the deformation of the piezoelectric sheet can drive the free end of the stopper 722 to bend downward, so that the free end of the stopper 722 is inserted into the groove between the stopper structures 733, thereby limiting the movement of the bobbin 731. When the force feedback system 100 stops generating a driving voltage based on a control instruction, the piezoelectric sheet can restore its shape and drive the stopper 722 to move upward, thereby releasing the stopper 722, and the bobbin 731 can rotate normally.

[0084] In some embodiments of the present specification, a piezoelectric structure is used to achieve a coordinated braking with a stop structure, which has a simple structure and can simplify the overall structure of the stop component, making it easier to produce and assemble. In addition, the piezoelectric structure can be a sheet-like structure with a small size, which can reduce the overall size of the stop component and the finger force feedback component, and is conducive to the miniaturization design of the finger force feedback component.

[0085] In some embodiments, the gradient of the side of the stop structure that contacts the stop plate may be greater than the gradient of the other side. In the embodiments of this specification, the gradient of a side of the stop structure may refer to the slope of the side. When the side is a plane, the slope may be represented by the angle between the side and the upper side of the bobbin 531; when the side is a curved surface, the slope may be represented by the angle between the tangent of the side (for example, the tangent at the contact point of the side that contacts the stop plate) and the upper side of the bobbin 531. For example, in combination with Figure 5B As shown, the stop structure may include a ratchet, and the gradient of one side 533-1 of the ratchet teeth of the ratchet that abuts the stop plate 522 may be a right angle of 90°, and the gradient of the other side 533-2 may be an acute angle less than 90°. In some embodiments, the shape of the free end of the stop plate 522 may match the gradient of the stop structure 522. For example, the gradient of the free end of the stop plate 522 may also be a right angle of 90°. When the stop plate 522 is inserted into the groove between the ratchets, the free end of the stop plate 522 abuts against the side 533-1 of the stop structure 522. At this time, since the gradient of the side 533-1 of the stop structure 522 is relatively large, the stop plate 522 abuts against the side 533-1 of the stop structure 522 to prevent the spool 531 from continuing to move along the direction A, thereby achieving rapid braking.

[0086] As can be seen from the foregoing, the use of ratchet teeth can quickly achieve the switching between the braking / relaxing states. However, the ratchet teeth cannot achieve the transition between the braking and releasing states, cannot simulate braking forces of different magnitudes, and accordingly cannot provide feedback forces of different magnitudes. In some embodiments, a stopper and a stopper structure can be provided so that the stopper can correspond to multiple depths when inserted into the groove between the gear teeth of the stopper structure, thereby providing feedback forces of different magnitudes.

[0087] Figure 8 FIG. 1 is a schematic diagram of another exemplary structure of a stopper component according to some embodiments of the present specification. Figure 8 As shown, the stop structure 833 may include a ratchet, and the shape of the end 822-a of the stopper 822 matches the shape of the ratchet. By controlling the downward pressure of the stopper 822, the simulation of feedback forces of different sizes can be achieved. For example, in order to provide feedback forces of different sizes, the stopper 822 may be an elastic structure. When the stopper 822 abuts against one side 833-1 of the stopper structure 833 to achieve braking, the stopper 822 may be deformed due to its own elasticity by controlling the transmission rod 823 to continue to press down the stopper 822, and the larger the deformation amount, the larger the corresponding feedback force. For another example, the stopper 822 may correspond to multiple depths when inserted into the groove between the ratchets. Among them, multiple depths may correspond to multiple different feedback forces, thereby achieving simulations of different feedback forces. As an example only, when the stopper 822 is in a stationary position, the stopper structure 833 may move along direction B with the spool 831. When the stopper 822 moves downward and is inserted into the groove between the ratchets, the end 822-a of the stopper 822 abuts against the side 833-1 of the stop structure 833, and the resistance generated by the abutment can provide feedback force to the user's finger. When the depth of the stopper 822 inserted into the groove between the ratchets is different, the abutment angle between the stopper 822 and the spool 831 is different, and the corresponding feedback force provided to the user's finger is also different. Therefore, different magnitudes of force feedback can be achieved by controlling the different depths of the stopper 822 inserted into the groove between the ratchets.

[0088] By setting an intermediate transition between braking and relaxation, the force feedback received by the fingers when grasping or touching some objects can be better simulated. For example, when the fingers grasp an elastic object, from the beginning of touching to the final grasping, the fingers will be subjected to a gradually increasing feedback force, and the transition of the intermediate state between braking and relaxation can reflect this process. In some embodiments, in order to make the force feedback more in line with the expectations of the real scene, multiple stop components as described above can be set. Multiple stop components can be made of different materials or have different structures, thereby presenting different braking effects. For example, two stop components with different stiffness can be made of materials with different hardnesses. The stop component with greater stiffness can achieve braking faster when it cooperates with the stop structure, while the stop component with less stiffness can achieve braking relatively "slower" when it cooperates with the stop structure. Compared with the stop component with greater stiffness, it can better reflect the intermediate state of gradually increasing feedback force. Similarly, stop components with different structures (for example, Figure 7B and Figure 8 The stopper shown in FIG. 1 can also embody different braking effects. In practical applications, the stopper required can be flexibly selected for braking according to the desired simulated scene.

[0089] The tooth spacing may refer to the distance between two adjacent stop structures. For example, the stop structure may include a ratchet, and the tooth spacing may be the distance between the tips of two adjacent teeth in the ratchet. In some embodiments, the tooth spacing may affect the control accuracy of the stop component 132. For example, when the tooth spacing is small, the stop plate may quickly abut against the stop structure when moving downward, thereby achieving instant braking and improving the control accuracy of the stop component 132. In some embodiments, the tooth spacing of the stop structure may be less than 2 mm, thereby ensuring the control accuracy of the stop component 132. In some embodiments, in order to further improve the control accuracy of the stop component 132, the tooth spacing of the stop structure may be less than 1 mm.

[0090] In some embodiments, Figure 5AAs shown, a limiting protrusion 139-1 may be arranged on the inner side surface of the rotating shaft frame 137 opposite to the stop structure 533. The limiting protrusion 139-1 may be a protrusion structure that limits the position of a component. For example, the limiting protrusion 139-1 may be used to limit the distance between the inner side surface of the rotating shaft frame 137 and the stop structure 533, thereby preventing friction between the stop structure 533 and the rotating shaft frame 137 from affecting the accuracy of force feedback. In some embodiments, the limiting protrusion 139-1 may be staggered with the stop structure 533, for example, on the projection plane along the central axis aa' of the spool 531, the limiting protrusion 139-1 does not overlap with the stop structure 533. In some embodiments, the limiting protrusion 139-1 may be distributed around the inner surface of the rotating shaft frame 137. For example, a plurality of limiting protrusions 139-1 may be provided on the inner surface of the shaft frame 137, and the plurality of limiting protrusions 139-1 may be distributed around the central axis aa' of the spool 531. In some embodiments, the plurality of limiting protrusions 139-1 may be evenly distributed on the inner side surface of the shaft frame 137 along a circle with the central axis aa' as the center, so as to evenly limit the distance between the inner side surface of the shaft frame 137 and the stop structure 533, and prevent the spool 531 from tilting when rotating, causing friction between the stop structure 533 and the shaft frame 137. It should be noted that Figure 5A The position of the limiting protrusion 139-1 shown is only for illustrative purposes, and in some embodiments, the limiting protrusion 139-1 can be set at any position that can limit the distance between the inner side of the rotating shaft frame 137 and the stop structure 533. For example, the limiting protrusion 139-1 can be set on the upper surface of the spool 531, that is, the plane where the stop structure 533 is located.

[0091] In some embodiments, the height of the limiting protrusion 139-1 may be greater than the stop structure 533, wherein the height of the limiting protrusion 139-1 refers to the length dimension of the limiting protrusion 139-1 along the direction of the central axis aa' of the spool 531. By setting the height of the limiting protrusion 139-1 to be greater than the height of the stop structure 533, the relative position between the spool 531 and the rotating shaft frame 137 can be limited. For example, when the spool 531 rotates and generates an upward offset and is about to contact the rotating shaft frame 137, since the height of the limiting protrusion 139-1 is greater than the height of the stop structure 533, the limiting protrusion 139-1 can first contact the upper surface of the spool 531 where the stop structure 533 is located, thereby preventing friction between the stop structure 533 and the rotating shaft frame 137 and ensuring the accuracy of force feedback. In some embodiments, the height of the limiting protrusion 139-1 may be less than the distance between the upper surface of the spool 531 and the inner side surface of the rotating shaft frame 137, thereby reducing the friction between the limiting protrusion 139-1 and the upper surface of the spool 531. In some embodiments, in order to prevent the friction between the limiting protrusion 139-1 and the upper surface of the spool 531 from affecting the accuracy of force feedback, the limiting protrusion 139-1 may be a smooth surface structure.

[0092] The embodiment of this specification takes the example of setting the limiting protrusion 139-1 on the inner side of the rotating shaft frame as an example for illustrative description. In some embodiments, the limiting protrusion 139-1 can be set at other positions. For example, the limiting protrusion 139-1 can be set on the upper surface of the spool 531. For another example, the housing (for example, Figure 2 The housing 134 shown can be used interchangeably with the shaft frame. As an example only, the stop member 132 can be located inside the shaft frame 137, in which case the shaft frame 137 can serve as a housing, and the limiting protrusion 139-1 can be disposed on the inner side of the housing opposite to the stop structure.

[0093] like Figure 5A As shown, each finger force feedback member further includes a sensor component 131. The sensor component 131 may be configured to detect the moving distance of the pull rope 136 and transmit data related to the moving distance of the pull rope 136 to the microprocessor 120. The microprocessor 120 or the external computing device 140 may determine whether to brake the finger based on the data related to the moving distance of the pull rope 136 and the current scene information and generate a corresponding control signal.

[0094] The sensing component 131 may include a magnet 511 and a magnetic field sensor 512. The magnet 511 is mechanically connected to the bobbin 531 so that it can rotate with the bobbin. For example, the magnet 511 may be mechanically connected to the outer side of the lower side wall 531-2 of the bobbin 531 (or referred to as the lower surface of the bobbin 531). The magnetic field sensor 512 may be arranged relative to the magnet 511. For example, the magnetic field sensor 512 may be arranged on the inner side of the rotating shaft frame opposite to the magnet 511. Alternatively, the magnetic field sensor 512 may be embedded in the inner side of the rotating shaft frame opposite to the magnet 511 so that the upper surface of the magnetic field sensor 512 is coplanar with the inner side of the shaft frame. The magnetic field sensor 512 may be used to measure the rotation information of the magnet 511 as the bobbin 531 rotates. As an example only, the magnetic field sensor 512 and the magnet 511 may be cylindrical and coaxially arranged. When the pull cord 136 is pulled out or rotated and reset with external tension, the spool 531 can rotate around the central axis aa', and the magnet 511 can rotate together with the spool 531, causing a change in the direction of the magnetic field. The magnetic field sensor 512 can detect the change in the magnetic field and generate a sensing signal, which can reflect the rotation information of the rotation of the spool 531, thereby reflecting the motion state of the pull cord 136. For example, the direction of the change in the magnetic field can reflect the direction of rotation of the spool 531, that is, the moving direction of the pull cord 136 (pulling out or resetting). For another example, the rate of change in the magnetic field can reflect the rate of rotation of the spool 531, that is, the moving speed of the pull cord 136. For another example, the total amount of change in the magnetic field can reflect the degree of rotation of the spool 531, that is, the moving distance of the pull cord 136. The motion state of the pull cord 136 can further reflect the motion state of the user's finger. For example, it can be determined based on the motion state of the pull cord 136 whether the user's finger is bent and the degree of bending.

[0095] In some embodiments, the finger force feedback member 130 may further include a printed circuit board (PCB) 160. The PCB 160 may be a member for reading data generated by the finger force feedback member 130 (e.g., a sensing signal from the sensing member 131, finger posture data generated by a strain sensor, etc.) and / or inputting control instructions to the finger force feedback member 130. Figure 5A As shown, the PCB 160 can be disposed at the bottom of the finger force feedback member 130 , and the PCB 160 can read the data generated by the finger force feedback member 130 and transmit it to the microprocessor 120 , or receive a control instruction from the microprocessor 120 to control the stop member 132 to achieve braking.

[0096] Combination Figure 5AAs shown, in some embodiments, the magnet 511 can be coaxially arranged with the magnetic field sensor 512 along the central axis aa' when the bobbin 531 rotates. Such an arrangement can make the magnet 511 and the bobbin 531 rotate synchronously around the central axis, and the magnetic field sensor 512 can accurately sense the magnetic field change, so as to accurately and timely detect the movement state of the pull rope 136.

[0097] Combination Figure 5A As shown, the magnet 511 is connected to the lower surface of the bobbin 531, and a limiting protrusion 139-2 can be arranged on the lower surface of the bobbin 531. The limiting protrusion 139-2 can be used to limit the distance between the lower surface of the bobbin 531 and the inner side of the rotating shaft frame 531, thereby reducing or preventing the friction between the lower surface of the bobbin 531 and the rotating shaft frame. The limiting protrusion 139-2 can also be used to limit the position of the magnet 511 relative to the magnetic field sensor 512, so that a distance can be spaced between the magnet 511 and the magnetic field sensor 512, thereby preventing the magnet 511 from contacting the magnetic field sensor 512 and affecting the change and sensing of the magnetic field. In some embodiments, the limiting protrusion 139-2 can be staggered with the magnetic field sensor 512, for example, on the projection plane along the central axis aa' of the bobbin 531, the limiting protrusion 139-2 and the magnetic field sensor 512 do not overlap. In some embodiments, the limiting protrusion 139-2 can be distributed around the lower surface of the bobbin 531. For example, a plurality of limiting protrusions 139-2 may be provided on the lower surface of the bobbin 531, and the plurality of limiting protrusions 139-2 may be distributed around the central axis aa' of the bobbin 531. In some embodiments, the plurality of limiting protrusions 139-2 may be evenly distributed on the lower surface of the bobbin 531 along a circle with the central axis aa' as the center, so as to evenly limit the position of the lower surface of the bobbin 531 relative to the magnetic field sensor 512, and prevent the bobbin 531 from tilting when rotating, resulting in contact between the magnet 511 and the magnetic field sensor 512. It should be noted that Figure 5A The setting position of the limiting protrusion 139 - 2 shown is only for illustrative purposes. In some embodiments, the limiting protrusion 139 - 2 may also be set on the inner side surface of the rotating shaft frame 137 opposite to the magnet 511 .

[0098] In some embodiments, the height of the limiting protrusion 139-2 may be greater than the height of the magnet 511. The height of the limiting protrusion 139-2 and the height of the magnet 511 refer to the length dimension of the limiting protrusion 139-2 and the magnet 511 along the direction of the central axis aa' of the bobbin 531. In some embodiments of the present specification, by setting the height of the limiting protrusion 139-2 to be greater than the height of the magnet 511, the position of the lower surface of the bobbin 531 relative to the magnetic field sensor 512 can be limited, so that a distance can be spaced between the magnet 511 and the magnetic field sensor 512, thereby preventing the magnet 511 from contacting the magnetic field sensor 512 and affecting the change and sensing of the magnetic field. For example, Figure 5A As shown, the magnetic field sensor 512 can be embedded in the inner side surface of the rotating shaft frame opposite to the magnet 511, so that the upper surface of the magnetic field sensor 512 is coplanar with the inner side surface of the rotating shaft frame 137 opposite to the magnet 511. When the bobbin 531 rotates and generates a downward deviation, causing the magnet 511 to contact the magnetic field sensor 512 (or the inner side surface of the rotating shaft frame 137), since the height of the limiting protrusion 139-2 is greater than the height of the magnet 511, the limiting protrusion 139-2 can first contact the inner side surface of the rotating shaft frame 137, so that the magnet 511 and the magnetic field sensor 512 can be spaced apart by a distance, thereby preventing the magnet 511 from contacting the magnetic field sensor 512 and affecting the change and sensing of the magnetic field. In some embodiments, the height of the limiting protrusion 139-2 can be less than the distance between the lower surface of the bobbin 531 and the inner side surface of the rotating shaft frame 137, thereby reducing the friction between the limiting protrusion 139-2 and the inner side surface of the rotating shaft frame 137. In some embodiments, in order to prevent the friction between the limiting protrusion 139 - 2 and the inner side surface of the rotating shaft frame 137 from affecting the accuracy of force feedback, the limiting protrusion 139 - 1 may have a smooth surface.

[0099] The embodiment of this specification takes the example of the limiting protrusion 139-2 being set on the lower surface of the bobbin as an example for illustrative description. In some embodiments, the limiting protrusion 139-2 can be set at other positions. For example, the limiting protrusion 139-2 can be set on the inner side of the rotating shaft frame (i.e., the inner side opposite to the magnet 511). For another example, the housing of the finger force feedback member (e.g., Figure 2 The housing 134 shown can be used interchangeably with the shaft frame. As an example only, the stop member 132 can be located inside the shaft frame 137, and the shaft frame 137 can be used as a housing, and the limiting protrusion 193-2 can be arranged on the inner side of the housing opposite to the magnet 511.

[0100] In some embodiments, the finger force feedback member 130 may include a strain sensor. In some embodiments, the strain sensor may be configured to read the posture data of the finger. When the user wears the glove body 110 to generate finger movement, the finger area of ​​the glove body 110 is deformed by the external force, and the strain sensor can convert the deformation information at the finger joint (for example, deformation direction, deformation size, etc.) into an electrical signal, and the electrical signal generated by the strain sensor can reflect the posture data at the corresponding area of ​​the finger. The microprocessor 120 or the external computing device 140 can determine whether to brake the finger and generate a corresponding control signal based on the electrical signal generated by the strain sensor and the current scene information. In some embodiments, the strain sensor may include but is not limited to a capacitive strain sensor, an inductive sensor, a resistive sensor, an optical fiber sensor, and the like.

[0101] In some embodiments, the strain sensor can be arranged at the finger joints of the glove body 110. For example, in combination with Figure 4A and Figure 4B As shown, the strain sensors can be arranged at the metacarpophalangeal joints 111-a, the interphalangeal joints 111-b and the interphalangeal joints 111-c. Fig. 9 , Fig. 9 It is a schematic diagram of the joint position of the user's hand according to some embodiments of this specification. The finger joints of the hand may include the metacarpophalangeal joints at positions 0, 2, 5, 8, and 11 and the interphalangeal joints at positions 1, 3, 6, 9, 12, 4, 7, 10, and 13. In some embodiments, the finger force feedback member 130 may include a plurality of strain sensors arranged at the finger joints on the glove body 110. For example, the plurality of strain sensors may include a first strain sensor arranged at the interphalangeal joints 1, 3, 6, 9, 12, 4, 7, 10, and 13, and the first strain sensor is configured to measure the deformation of the interphalangeal joint in a single degree of freedom. For another example, the plurality of strain sensors may also include a second strain sensor arranged at the metacarpophalangeal joints 0, 2, 5, 8, and 11, and the second strain sensor is configured to measure the deformation of the metacarpophalangeal joint in two degrees of freedom. In some embodiments, the first strain sensor includes a single degree of freedom sensor, such as a single-axis sensor (such as an inductive, resistive bending sensor or a capacitive stretching sensor). The second strain sensor includes a multi-degree-of-freedom sensor, such as a multi-axis sensor (such as a capacitive multi-axis motion sensor).

[0102] The degrees of freedom described in this specification refer to the dimensions in which an object can move. To facilitate the description of the degrees of freedom of the hand's movement, a three-dimensional coordinate system is established for the hand's movement, for example, Fig.10The three-dimensional coordinate system shown in FIG. In this coordinate system, the origin is the metacarpophalangeal joint, the finger extension direction is the Y axis, and the direction perpendicular to the hand plane is the Z axis. The hand plane can refer to the fitting plane of the palm part. For example, when the palm of the hand is placed on the table, the table or the plane passing through the hand and parallel to the table can be used as the hand plane. This three-dimensional coordinate system can be used to describe the degrees of freedom of hand movement. Specifically, in Fig.10 In the three-dimensional coordinate system shown, the rotation of the hand around the X-axis is defined as bending, the rotation of the hand around the Z-axis is defined as swinging, and the rotation of the hand around the Y-axis is defined as rotation. The interphalangeal joints can only bend and rotate. In other words, the deformation of the interphalangeal joints only corresponds to the one degree of freedom of bending. The metacarpophalangeal joints can bend, swing, and rotate. In other words, the deformation of the metacarpophalangeal joints corresponds to the two degrees of freedom of bending and swinging. Therefore, when any interphalangeal joint performs bending movement, the first strain sensor can measure the deformation of the glove body 110 at the corresponding interphalangeal joint. When any metacarpophalangeal joint performs bending or swinging movement, the second strain sensor can measure the deformation of the glove body 110 at the corresponding metacarpophalangeal joint.

[0103] Continue to see Fig. 9 , interphalangeal joints 4, 7, 10, and 13 are distal interphalangeal joints relatively far from the palm, and interphalangeal joints 1, 3, 6, 9, and 12 are proximal interphalangeal joints relatively close to the palm. In some embodiments, the movement of the distal interphalangeal joint is manifested as the following movement of the previous joint (proximal interphalangeal joint). Under normal circumstances, it does not bend independently, but bends together with the proximal interphalangeal joint. Therefore, the first strain sensor may not be arranged separately at the distal interphalangeal joint, and the first strain sensor is arranged only at the proximal interphalangeal joint. In some embodiments, the deformation data at the distal interphalangeal joint can be generated by mapping the deformation data of the corresponding proximal interphalangeal joint. Therefore, the force feedback system 100 can collect deformation data of at least five proximal interphalangeal joints in a single degree of freedom through multiple first strain sensors, and collect deformation data of five metacarpophalangeal joints in two degrees of freedom through multiple second strain sensors. In total, the multiple first strain sensors and the multiple second strain sensors jointly provide deformation data of at least 15 degrees of freedom on at least the user's fingers, thereby determining the posture data of the fingers.

[0104] In some embodiments, the finger posture data acquired by the multiple strain sensors may also be combined with the motion data of the user's wrist joint acquired by the inertial sensing module 240 to jointly determine the user's hand posture.

[0105] In some embodiments, the first strain sensor is a uniaxial sensor, which collects the deformation of the interphalangeal joint in a single degree of freedom (i.e., bending). In some embodiments, the first strain sensor includes various flexible bending sensors, such as inductive sensors, resistive sensors, capacitive sensors, optical fiber sensors, etc. As an example only, the first strain sensor includes an inductive sensor, and the inductance of the inductive sensor can change with the deformation of the interphalangeal joint. Specifically, the inductive sensor deforms with the movement of the interphalangeal joint, and its inductance responds to the deformation of the inductive sensor. By collecting the parameters related to the inductance of the inductive sensor and analyzing its changes, the bending condition of the inductive sensor (such as bending angle, bending direction, etc.) can be calculated more accurately. For example, the electrical quantity of the inductance of the inductive sensor is proportional to the deformation of the inductive sensor, and thus, the change in the electrical quantity of the inductance of the inductive sensor can characterize the deformation or bending degree of the interphalangeal joint. Since the interphalangeal joint corresponds to only one bending degree of freedom, the use of a uniaxial sensor (such as an inductive sensor) to measure the movement of the interphalangeal joint has a simple structure and low product cost. In addition, the first strain sensor can be arranged only at the interphalangeal joint closest to the metacarpophalangeal joint of each finger of the user, thereby simplifying the structure of the finger force feedback component, reducing product costs, and ensuring the accuracy of deformation data collection.

[0106] In some embodiments, the second strain sensor is a multi-axis sensor for collecting deformation of the metacarpophalangeal joint in two degrees of freedom (i.e., bending and swinging). In some embodiments, the second strain sensor includes various flexible bending sensors, such as inductive sensors, resistive sensors, capacitive sensors, optical fiber sensors, etc. As an example only, the second strain sensor includes multiple capacitor structures, and the capacitance of the multiple capacitor structures can change respectively with the change of the metacarpophalangeal joint in each degree of freedom.

[0107] See also Fig.11 and Fig.12 , the second strain sensor 1100 includes a flexible substrate 1110, a first capacitor structure 1120 and a second capacitor structure 1130. Fig.11 As shown, the first capacitor structure 1120 and the second capacitor structure 1130 are distributed on both sides of the flexible substrate 1110 along the thickness direction, and the projection of the first capacitor structure 1120 on the flexible substrate 1110 at least partially overlaps with the projection of the second capacitor structure 1130 on the flexible substrate 1110. In some embodiments, as Fig.12 As shown, the first capacitor structure 1120 and the second capacitor structure 1130 are distributed on the same side of the hand-flexible substrate 1110 along the thickness direction.

[0108] The flexible substrate 1110 has a flexible property and is easily deformed (such as bending) when subjected to an external force. In some embodiments, in order to facilitate fitting with human joints, the flexible substrate 1110 may have a flat structure. In this case, the flexible substrate 1110 has a thickness direction, which may be as follows: Fig.11 The Z-axis direction is shown.

[0109] The capacitor structure (including the first capacitor structure 1120 and the second capacitor structure 1130) is used to measure the bending deformation structure of the flexible substrate 1110. Specifically, the capacitor structure has a corresponding area, and the electrical quantity of the capacitor structure (for example, capacitance) is proportional to its area (or a dimensional parameter related to the area, such as the length and width of the capacitor structure or the bending angle of the second strain sensor, etc.), that is, the electrical quantity of the capacitor structure in different directions is proportional to the deformation of the second strain sensor in different degrees of freedom, thereby reflecting the deformation (such as bending angle, bending direction). It should be understood that the second strain sensor may not be limited to a capacitor structure, for example, it may also be a resistor structure or a capacitor-resistor composite structure. In some embodiments, the first capacitor structure 1120 and the second capacitor structure 1130 may include a structure arranged in the thickness direction of the flexible substrate 1110 (such as Fig.11 or Fig.12 The multilayer structure on the same side surface of the flexible substrate 1110 (Z-axis direction shown in the figure), each layer of each multilayer structure is stacked along the thickness direction. Wherein, the multilayer structure is a structure formed by stacking layer structures. The layers of each multilayer structure stacked along the thickness direction can be understood as: each layer in the multiple layer structures of the first capacitor structure 1120 and the second capacitor structure 1130 is arranged along the thickness direction of the flexible substrate 1110 and stacked together. In some embodiments, the multilayer structure includes a second conductive layer, an intermediate layer and a first conductive layer. In some embodiments, the multilayer structure includes a second conductive layer, a second intermediate layer, a third conductive layer, a first intermediate layer and a first conductive layer. The specific layered structure included in the multilayer structure can be found below.

[0110] When different capacitive structures are arranged at different positions of the second strain sensor 1100, these capacitive structures will produce differentiated responses to the deformation of different dimensions of the flexible substrate 1110. When the flexible substrate 1110 is deformed in a certain dimension, the detection parameters generated by these capacitive structures have characteristics corresponding to the deformation of this dimension; and when the flexible substrate 1110 is deformed in another dimension, the detection parameters generated by these capacitive structures will have characteristics corresponding thereto. It can be understood that the characteristics of the detection parameters generated by these capacitive structures will correspond to the deformation dimensions of the flexible substrate 1110 one by one, and on this basis, the deformation of the flexible substrate 1110 can be identified according to the detection parameters of each capacitive structure. In some embodiments, the processor (e.g., microprocessor 120 or external computing device) can determine the deformation of the flexible substrate 1110 in at least two dimensions through a specific algorithm based on the parameters related to capacitance of each capacitive structure (e.g., first capacitive structure 1120, second capacitive structure 1130). For example, the deformation of the flexible substrate 1110 in at least two dimensions is determined by a machine learning model, a mapping relationship, or a functional relationship. The description of deformation in at least two dimensions can be found in the following.

[0111] When the second strain sensor 1100 (flexible substrate 1110) is bent and deformed, the physical shape of at least part of the capacitor structure (e.g., the first capacitor structure 1120 and the second capacitor structure 1130) located on the flexible substrate 1110 will change accordingly, thereby causing the corresponding capacitance to change. For example, the bending of the second strain sensor 1100 will cause the area of ​​the capacitor structure to change, thereby changing the capacitance of the capacitor structure. By collecting the capacitance of the capacitor structure or parameters related to the capacitance, and analyzing the changes in the capacitance of the capacitor structure or parameters related to the capacitance, the bending condition (such as bending angle, bending direction) of the second strain sensor 1100 can be sensed more accurately.

[0112] like Fig.11As shown, in some embodiments, the first capacitor structure 1120 and the second capacitor structure 1130 are respectively distributed on both sides of the flexible substrate 1110 in the thickness direction. In some embodiments, the first capacitor structure 1120 and the second capacitor structure 1130 are symmetrically arranged along the flexible substrate 1110 in the thickness direction, and the projection of the first capacitor structure 1120 on the flexible substrate 1110 and the projection of the second capacitor structure 1130 on the flexible substrate 1110 completely overlap. When the first capacitor structure 1120 and the second capacitor structure 1130 are symmetrically arranged about the flexible substrate 1110 in the thickness direction, the two capacitor structures have the same response to some external interference (for example, the second strain sensor is stretched or compressed as a whole along a certain direction). At this time, according to the parameters related to the capacitance of the capacitor structure, the influence of the external interference on the second strain sensor 1100 can be eliminated through the differential processing algorithm, thereby improving the sensitivity of determining the deformation of the flexible substrate 1110 in at least two degrees of freedom.

[0113] In some embodiments, the flexible substrate 1110 includes a short axis direction and a long axis direction perpendicular to the thickness direction. Fig.11 The deformations in multiple degrees of freedom generated by the second strain sensor 1100 (flexible substrate 1110) shown in the figure include at least bending deformation around an axis parallel to the short axis direction and stretching or compressing deformation along the long axis direction. Fig.11 The X-axis direction is shown; the long axis direction can be Fig.11 The Y-axis direction is shown.

[0114] like Fig.11 As shown, when the second strain sensor 1100 is bent and deformed around an axis parallel to the short axis direction (i.e., the X-axis direction), the first capacitor structure 1120 and the second capacitor structure 1130 will undergo tensile deformation and compressive deformation respectively. For example, the first capacitor structure 1120 will be bent and elongated, and the second capacitor structure 1130 will be bent and compressed. At this time, the capacitances of the first capacitor structure 1120 and the second capacitor structure 1130 will undergo opposite changes. In this case, the difference in capacitance between the first capacitor structure 1120 and the second capacitor structure 1130 can reflect the bending direction and degree of bending of the second strain sensor 1100 around the axis parallel to the X-axis direction, and since the first capacitor structure 1120 and the second capacitor structure 1130 are stretched and compressed to substantially the same extent, the sum of their capacitances can remain substantially unchanged.

[0115] When the second strain sensor 1100 is stretched or compressed along the long axis direction, the first capacitor structure 1120 and the second capacitor structure 1130 are stretched or compressed synchronously, and the capacitance of the first capacitor structure 1120 and the second capacitor structure 1130 changes synchronously. In this case, the difference between the capacitance of the first capacitor structure 1120 and the second capacitor structure 1130 remains substantially unchanged (or close to 0), and the sum of the two can reflect the degree of stretching or compression of the second strain sensor 1100 along the long axis direction.

[0116] In some embodiments, by comparing the characteristics of the capacitance of the first capacitor structure 1120 and the second capacitor structure 1130 under the above two degrees of freedom, for example, the relationship between the sum (difference) of the capacitance and the deformation of the flexible substrate 1110, the mutual interference between the deformations of the two degrees of freedom can be avoided, and the deformation of the flexible substrate 1110 in the two degrees of freedom can be effectively distinguished. For example, when the second strain sensor 1100 is stretched or compressed as a whole, the first capacitor structure 1120 and the second capacitor structure 1130 will be stretched or compressed synchronously, and the synchronous stretching or compression of the first capacitor structure 1120 and the second capacitor structure 1130 is regarded as common mode interference. At this time, differential processing of the signal (such as capacitance) can eliminate this common mode interference, so that the second strain sensor 1100 is insensitive to its own stretching or compression deformation, and is only sensitive to the bending deformation around the axis parallel to the short axis direction (i.e., the X-axis direction), so that the second strain sensor 1100 can accurately detect the bending deformation of this degree of freedom. That is, the difference between the capacitance of the first capacitor structure 1120 and the second capacitor structure 1130 mainly reflects the bending deformation of the flexible substrate 1110 around an axis parallel to the short axis direction (i.e., the X-axis direction). Similarly, the sum of the capacitances of the first capacitor structure 1120 and the second capacitor structure 1130 mainly reflects the tensile or compressive deformation of the flexible substrate 1110 along the long axis direction. The detection principle of the tensile or compressive deformation in the long axis direction is similar to the detection principle of the second strain sensor 1100 having four capacitor structures. For details, please refer to FIG. 14A to FIG. 16 and its related description.

[0117] like Fig.12 As shown, in some embodiments, the flexible substrate 1110 includes a long axis direction perpendicular to the thickness direction, the first capacitor structure 1120 and the second capacitor structure 1130 are distributed on the same side of the flexible substrate 1110 in the thickness direction, the first capacitor structure 1120 and the second capacitor structure 1130 are arranged side by side and both extend along the long axis direction of the flexible substrate 1110.

[0118] In some embodiments, the first capacitor structure 1120 and the second capacitor structure 1130 are symmetrically arranged along a mid-section parallel to a plane formed by the thickness direction and the long axis direction, and the mid-section is located on the flexible substrate 1110. When the first capacitor structure 1120 and the second capacitor structure 1130 are symmetrically arranged about the flexible substrate 1110 on the mid-section, the two capacitor structures have the same response to partial external interference (for example, the second strain sensor 1100 is stretched or compressed as a whole along a certain direction). At this time, the processing circuit 16 can eliminate the influence of external interference on the second strain sensor 1100 through a differential processing algorithm based on the parameters related to the capacitance of the capacitor structure (for example, the first capacitor structure 1120 and the second capacitor structure 1130), thereby improving the sensitivity of determining the deformation of at least two degrees of freedom of the flexible substrate 1110. For more information about the mid-section, please refer to Fig.13A and Fig. 13B and its related description.

[0119] In some embodiments, Fig.12 The degree of freedom deformation generated by the second strain sensor 1100 (flexible substrate 1110 ) shown includes at least bending deformation around an axis parallel to the thickness direction and tensile or compressive deformation along the long axis direction.

[0120] like Fig.12 As shown, when the second strain sensor 1100 is bent and deformed around an axis parallel to the thickness direction (i.e., the Z-axis direction), the first capacitor structure 1120 and the second capacitor structure 1130 will undergo tensile deformation and compressive deformation respectively. For example, the first capacitor structure 1120 will be bent and elongated, and the second capacitor structure 1130 will be bent and compressed. At this time, the capacitances of the first capacitor structure 1120 and the second capacitor structure 1130 will undergo opposite changes. In this case, the difference in capacitance between the first capacitor structure 1120 and the second capacitor structure 1130 can reflect the bending direction and degree of bending of the second strain sensor 1100 around an axis parallel to the Z-axis direction, and since the first capacitor structure 1120 and the second capacitor structure 1130 are stretched and compressed to substantially the same extent, the sum of their capacitances can remain substantially unchanged.

[0121] when Fig.12 When the second strain sensor 1100 is stretched or compressed along the long axis direction, the first capacitor structure 1120 and the second capacitor structure 1130 are stretched or compressed synchronously, and the capacitance of the first capacitor structure 1120 and the second capacitor structure 1130 changes synchronously. In this case, the difference between the capacitance of the first capacitor structure 1120 and the second capacitor structure 1130 remains substantially unchanged (or close to 0), and the sum of the two can reflect the degree of stretching or compression of the second strain sensor 1100 along the long axis direction.

[0122] In some embodiments, by comparing the characteristics of the capacitance of the first capacitor structure 1120 and the second capacitor structure 1130 under the above two degrees of freedom, for example, the relationship between the sum (difference) of the capacitance and the deformation of the flexible substrate 1110, the mutual interference between the deformations of the two degrees of freedom can be avoided, and the deformation of the flexible substrate 1110 in the two degrees of freedom can be effectively distinguished. For example, when the second strain sensor 1100 is stretched or compressed as a whole, the first capacitor structure 1120 and the second capacitor structure 1130 will be stretched or compressed synchronously, and the synchronous stretching or compression of the first capacitor structure 1120 and the second capacitor structure 1130 is regarded as common mode interference. At this time, differential processing of the signal (such as capacitance) can eliminate this common mode interference, so that the second strain sensor 1100 is insensitive to its own stretching or compression deformation, and is only sensitive to the bending deformation around the axis parallel to the thickness direction (i.e., the Z-axis direction), so that the second strain sensor 1100 can accurately detect the bending deformation of this degree of freedom. That is, the difference between the capacitance of the first capacitor structure 1120 and the second capacitor structure 1130 mainly reflects the bending deformation of the flexible substrate 1110 around an axis parallel to the thickness direction (i.e., the Z-axis direction). Similarly, the sum of the capacitances of the first capacitor structure 1120 and the second capacitor structure 1130 mainly reflects the tensile or compressive deformation of the flexible substrate 1110 along the long axis direction. The detection principle of the tensile or compressive deformation in the long axis direction is similar to the detection principle of the second strain sensor 1100 having four capacitor structures. For details, please refer to FIG. 14A to FIG. 16 and its related description.

[0123] Fig.13A is a schematic diagram of the distribution of four capacitor structures on a flexible substrate according to some embodiments of this specification; Fig. 13B yes Fig.13A The cross-sectional structure diagram of the four capacitor structures shown is along the Y-axis direction.

[0124] like Fig.13A and Fig. 13B As shown, in some embodiments, compared to Fig.12 The second strain sensor 1100 further includes a third capacitor structure 1140 and a fourth capacitor structure 1150. The first capacitor structure 1120 and the second capacitor structure 1130 are arranged side by side on one side surface of the flexible substrate 1110 along the thickness direction, and both extend along the long axis direction; the third capacitor structure 1140 and the fourth capacitor structure 1150 are arranged side by side on the other side surface of the flexible substrate 1110 along the thickness direction, and both extend along the long axis direction.

[0125] In some embodiments, the processor reads capacitance-related parameters of the first capacitor structure 1120 , the second capacitor structure 1130 , the third capacitor structure 1140 , and the fourth capacitor structure 1150 , respectively, and determines deformation of the flexible substrate 1110 in at least two degrees of freedom based on the parameters.

[0126] In some embodiments, Fig.13A The degree of freedom deformation generated by the second strain sensor 1100 (flexible substrate 1110) shown includes at least bending deformation around an axis parallel to the thickness direction, bending deformation around an axis parallel to the short axis direction, and tensile or compressive deformation along the long axis direction of the flexible substrate 1110. For the purpose of illustration, the following is combined with Fig.14A , Fig. 14B , Fig.15 and Fig.16 The capacitance-related parameters of each capacitor structure under deformation with different degrees of freedom are described respectively.

[0127] In some embodiments, parameters related to capacitance include: C1, C2, C3, C4, Ctotal, dCx, dCz; and Ctotal = C1 + C2 + C3 + C4, dCx after composite differential operation = (C1 + C2) - (C3 + C4), dCz after composite differential operation = (C1 + C3) - (C2 + C4). Wherein, C1, C2, C3, C4 represent the capacitance of the first capacitor structure 1120, the second capacitor structure 1130, the third capacitor structure 1140 and the fourth capacitor structure 1150 respectively.

[0128] In some embodiments, the first capacitor structure 1120 and the second capacitor structure 1130 are symmetrically arranged about the first middle section S1, and the third capacitor structure 1140 and the fourth capacitor structure 1150 are symmetrically arranged about the first middle section S1. The first middle section S1 represents: a section parallel to the plane formed by the thickness direction and the long axis direction in the flexible substrate 1110; the first capacitor structure 1120 and the third capacitor structure 1140 are symmetrically arranged about the second middle section S2 of the flexible substrate 1110, and the second capacitor structure 1130 and the fourth capacitor structure 1150 are symmetrically arranged about the second middle section S2. The second middle section S2 represents: a mid-plane parallel to the plane formed by the long axis direction and the short axis direction in the flexible substrate 1110.

[0129] By setting four symmetrical capacitor structures on the second strain sensor 1100 and performing a composite differential operation, common mode interference can be effectively eliminated in the process of identifying the bending deformation of the sensor. As an example only, when the second strain sensor 1100 is stretched or compressed as a whole, the first capacitor structure 1120, the second capacitor structure 1130, the third capacitor structure 1140 and the fourth capacitor structure 1150 will be stretched or compressed synchronously, and the stretching or compression of the four capacitor structures is regarded as common mode interference. The dCx and dCz obtained by setting four capacitor structures and performing composite differential processing on the signal remain unchanged, effectively eliminating this common mode interference, so that the flexible second strain sensor 1100 is insensitive to its own stretching or compression deformation, and is only sensitive to its own bending deformation, thereby increasing the accuracy of the second strain sensor 1100.

[0130] Fig.14A is a schematic diagram of a second sensor without deformation according to some embodiments of this specification; Fig. 14B yes Fig.14A The diagram shows the deformation of the second sensor after being stretched or compressed along the long axis direction.

[0131] In some embodiments, when the first capacitor structure 1120 , the second capacitor structure 1130 , the third capacitor structure 1140 and the fourth capacitor structure 1150 are all capacitor structures, the second strain sensor 1100 can identify tensile or compressive deformation along the long axis direction of the flexible substrate 11 according to parameters related to capacitance.

[0132] In some embodiments, Fig.14A When the second strain sensor 1100 shown is not deformed, the capacitance of the four capacitor structures can be obtained by the following formula (1). For the purpose of illustration only, the four capacitor structures of the second strain sensor 1100 are considered to be completely consistent and symmetrical about the flexible substrate 1110 (i.e., the first middle section S1 and the second middle section S2). Among them, ε0 represents the dielectric constant of vacuum; ε represents the relative dielectric constant of each of the four capacitor structures (i.e., the middle layer, see below); d represents the thickness of the dielectric layer of each of the four capacitor structures; A represents the area of ​​each of the four capacitor structures on the plane formed by the long axis direction and the short axis direction; L0 represents the initial length of each of the four capacitor structures in the long axis direction of the flexible substrate 1110; w represents the width of each of the four capacitor structures in the short axis direction of the flexible substrate 1110.

[0133] In some embodiments, Fig. 14BAs shown, when the second strain sensor 1100 is stretched or compressed along the long axis direction (i.e., the Y axis direction), the initial length L0 of each of the four capacitor structures is stretched or compressed to Lx. Considering that the thickness of each of the four capacitor structures changes very little, for the convenience of explanation, it is approximately assumed that the thickness of each of the four capacitor structures remains unchanged. According to formula (1), the capacitance change of the four capacitor structures can be obtained as follows: formula (2).

[0134] At this time, Ctotal, dCx, and dCz are determined by the following formulas (3), (4), and (5), respectively. dCx=(C1+C2)-(C3+C4)=0 (4) dCz=(C1+C3)-(C2+C4)=0 (5)

[0135] When the second strain sensor 1100 is stretched or compressed along the long axis, the four capacitor structures will be stretched or compressed synchronously, and the capacitance of the four capacitor structures will change synchronously. In this case, the sum of the capacitances of the four capacitor structures can reflect the degree of stretching or compression of the second strain sensor 1100 (flexible substrate 1110) along the long axis. According to formulas (2) and (3), Ctotal is only related to the length Lx after the capacitor structure changes, and Lx can be used to represent the stretching or compression deformation of the second strain sensor 1100 along the long axis, so Ctotal can be used to reflect the stretching or compression deformation of the second strain sensor 1100 (flexible substrate 1110) along the long axis.

[0136] According to formula (4), dCx reflects the difference between the sum of the capacitance C1 of the first capacitance structure 1120 and the capacitance C2 of the second capacitance structure 1130 and the sum of the capacitance C3 of the third capacitance structure 1140 and the capacitance C4 of the fourth capacitance structure 1150. Fig. 14BFrom the structural distribution of the four capacitor structures, it can be seen that the sum of the capacitance C1 of the first capacitor structure 1120 and the capacitance C2 of the second capacitor structure 1130, that is, C1+C2, can reflect the bending deformation of the upper side of the flexible substrate 1110 in the thickness direction; the sum of the capacitance C3 of the third capacitor structure 1140 and the capacitance C4 of the fourth capacitor structure 1150, that is, C3+C4, can reflect the bending deformation of the lower side of the flexible substrate 1110 in the thickness direction. Therefore, dCx is used to reflect the difference in bending deformation generated by the upper and lower sides (i.e., the upper and lower sides along the thickness direction) of the flexible substrate 1110 when it is deformed, which is related to the bending deformation around the axis parallel to the short axis direction (i.e., the X-axis direction), while the deformation of stretching or compression along the long axis direction (i.e., the Y-axis direction) does not cause the deformation difference between the upper and lower sides of the flexible substrate 1110, so dCx is a constant of 0.

[0137] Similarly, according to formula (5), dCz is used to reflect the difference in bending deformation produced on the two side surfaces along the short axis direction when the flexible substrate 1110 is deformed. dCz is only related to the bending deformation around the axis parallel to the thickness direction (i.e., the Z-axis direction), and the deformation caused by stretching or compressing along the long axis direction (i.e., the Y-axis direction) will not cause the deformation difference between the two side surfaces of the flexible substrate 1110 along the short axis direction, so dCz is also a constant 0.

[0138] In some embodiments, the output parameter Ctotal of the second strain sensor 1100 stretched or compressed along the Y axis changes linearly in proportion to the stretched length or compressed length Lx, and has extremely high linearity, while dCz and dCx are both 0, and are not affected by the stretched length or compressed length Lx. Therefore, the second strain sensor 1100 can identify the tensile or compressive deformation along the long axis direction of the flexible substrate 1110 according to the parameter Ctotal related to the capacitance.

[0139] Fig.15 yes Fig.14A The second sensor shown is a side view schematic diagram after being bent and deformed around an axis parallel to the short axis direction.

[0140] In some embodiments, when the first capacitor structure 1120, the second capacitor structure 1130, the third capacitor structure 1140 and the fourth capacitor structure 1150 are all capacitor structures, the second strain sensor 1100 can identify the bending deformation along the flexible substrate 1110 around an axis parallel to the short axis direction according to the parameter dCx related to the capacitance.

[0141] like Fig.14A and Fig.15As shown, when the second strain sensor 1100 is bent and deformed around an axis parallel to the short axis direction (i.e., the X-axis direction), for the convenience of explanation, it is approximately considered that the second strain sensor 1100 after bending and deformation is a circular arc, the first capacitor structure 1120 and the second capacitor structure 1130 are bent and elongated to L1, and the third capacitor structure 1140 and the fourth capacitor structure 1150 are bent and compressed to L3. Considering that the thickness of each of the four capacitor structures changes very little, for the convenience of explanation, it is approximately considered that the thickness of each of the four capacitor structures remains unchanged. According to formula (1), it can be known that the capacitance C1 of the first capacitor structure 1120 and the capacitance C2 of the second capacitor structure 1130 change to the following formula (6), and the capacitance C3 of the third capacitor structure 1140 and the capacitance C4 of the fourth capacitor structure 1150 change to the following formula (7).

[0142] At this time, Ctotal, dCx, and dCz are determined by the following formulas (8), (9), and (10), respectively. dCz=(C1+C3)-(C2+C4)=0 (10) Wherein, R0 represents the radius of the arc of the bending deformation of the flexible substrate 1110; R1 represents the radius of the arc of the bending deformation of the first capacitor structure 1120 and the second capacitor structure 1130; R2 represents the radius of the arc of the bending deformation of the third capacitor structure 1140 and the fourth capacitor structure 1150; t represents Fig.14A The thickness of the second strain sensor 1100 is shown; L1 represents the length of the arc of the first capacitor structure 1120 and the second capacitor structure 1130 bending and deforming; L3 represents the length of the arc of the third capacitor structure 1140 and the fourth capacitor structure 1150 bending and deforming.

[0143] When the second strain sensor 1100 is bent and deformed along an axis parallel to the short axis direction, for example, the first capacitor structure 1120 and the second capacitor structure 1130 are bent and stretched, and the third capacitor structure 1140 and the fourth capacitor structure 1150 are bent and compressed. At this time, the sum of the capacitance C1 of the first capacitor structure 1120 and the capacitance C2 of the second capacitor structure 1130, i.e., C1+C2, and the sum of the capacitance C3 of the third capacitor structure 1140 and the capacitance C4 of the fourth capacitor structure 1150, i.e., C3+C4, have an opposite change relationship. At this time, Ctotal obtained by adding the capacitances of the four capacitor structures can offset the change trends of C1+C2 and C3+C4, that is, Ctotal is the constant shown in formula (8) at this time, and Ctotal cannot be used to reflect the bending deformation of the second strain sensor 1100 along the axis parallel to the short axis direction.

[0144] In some embodiments, the output parameter dCx of the second strain sensor 1100 after bending deformation around an axis parallel to the short axis direction (i.e., the X-axis direction) varies linearly in direct proportion to the bending angle β, and has extremely high linearity, while dCz and Ctotal are both constants and are not affected by the bending angle β. Therefore, the second strain sensor 1100 can identify the bending deformation around an axis parallel to the short axis direction based on the parameter dCx related to the capacitance.

[0145] It should be noted that, in addition to the case of the four capacitor structures described above, the second strain sensor 1100 may have three or more capacitor structures distributed on the two side surfaces of the flexible substrate 1110 along the thickness direction, and all extend along the long axis direction. As long as the deformations of different dimensions can be characterized by the capacitance-related parameters of these capacitor structures, deformations of multiple dimensions can be identified. As an example only, there are three capacitor structures on the second strain sensor 1100, two of which are distributed on the upper side of the flexible substrate, and the other is distributed on the lower side of the flexible substrate. At this time, the capacitance-related parameters of the three capacitor structures are also related to the bending deformation around the X-axis (or Z-axis). At this time, the bending deformation of the second strain sensor 1100 around the X-axis (or Z-axis) can also be calculated by combining the capacitance-related parameters generated by the three sensor structures.

[0146] Fig.16 yes Fig.14A The second sensor shown is a top view schematic diagram after being bent and deformed around an axis parallel to the thickness direction.

[0147] In some embodiments, when the first capacitor structure 1120, the second capacitor structure 1130, the third capacitor structure 1140 and the fourth capacitor structure 1150 are all capacitor structures, the second strain sensor 1100 can identify the bending deformation along the flexible substrate 1110 around an axis parallel to the thickness direction according to the parameter dCz related to the capacitance.

[0148] like Fig.14A and Fig.16 As shown, when the second strain sensor 1100 is bent around an axis parallel to the thickness direction (i.e., the Z-axis direction), for the convenience of description, it is approximately considered that the second strain sensor 1100 after bending deformation can be an arc, and the first capacitor structure 1120 and the third capacitor structure 1140 ( Fig.16 ) is bent and elongated to L4, the second capacitor structure 1130 and the fourth capacitor structure 1150 ( Fig.16(not shown) is bent and compressed to L2. Considering that the thickness of each of the four capacitor structures changes very little, for the convenience of explanation, it is approximately assumed that the thickness of each of the four capacitor structures remains unchanged. According to formula (1), the capacitance C1 of the first capacitor structure 1120 and the capacitance C3 of the third capacitor structure 1140 are expressed by the following formula (11), and the capacitance C2 of the second capacitor structure 1130 and the capacitance C4 of the fourth capacitor structure 1150 change to the following formula (12).

[0149] At this time, Ctotal, dCx, and dCz are determined by the following formulas (13), (14), and (15), respectively. dCx=(C1+C2)-(C3+C4)=0 (14) Among them, r0 represents the radius of the arc of the bending deformation of the flexible substrate 1110; r1 represents the radius of the arc of the bending deformation of the first capacitor structure 1120 and the third capacitor structure 1140; r2 represents the radius of the arc of the bending deformation of the second capacitor structure 1130 and the fourth capacitor structure 1150; L2 represents the length of the arc of the bending deformation of the first capacitor structure 1120 and the third capacitor structure 1140; L4 represents the length of the arc of the bending deformation of the second capacitor structure 1130 and the fourth capacitor structure 1150.

[0150] In some embodiments, the output parameter dCz of the second strain sensor 1100 after bending deformation around an axis parallel to the thickness direction (i.e., the Z-axis direction) varies linearly in direct proportion to the bending angle α, and has extremely high linearity, while dCx and Ctotal are both constants and are not affected by the bending angle α. Therefore, the second strain sensor 1100 can identify bending deformation around an axis parallel to the thickness direction based on the parameter dCz related to capacitance.

[0151] In some embodiments, when the first capacitor structure 1120, the second capacitor structure 1130, the third capacitor structure 1140 and the fourth capacitor structure 1150 are all resistor structures, the processor can determine the deformation of the flexible substrate 1110 in at least two dimensions according to the parameter resistance related to the four capacitor structures. For example, the resistances of the four capacitor structures are: Substituting the area of ​​each capacitor structure after the deformation of the second strain sensor 1100 into it and performing a differential operation, a result similar to the parameters related to the capacitance can be obtained, so that the processor can determine the bending deformation of the second strain sensor 1100 around an axis parallel to the thickness direction, the bending deformation around an axis parallel to the short axis direction, and the tensile or compressive deformation along the long axis direction of the flexible substrate. Wherein, p represents the resistivity of each of the four capacitor structures (i.e., the middle layer, see below).

[0152] In some embodiments, the processor can identify a composite deformation of the second strain sensor 1100 in which deformations of any dimension coexist among the bending deformation of the second strain sensor 1100 about an axis parallel to the thickness direction, the bending deformation of the second strain sensor 1100 about an axis parallel to the short axis direction, and the tensile or compressive deformation along the long axis direction of the flexible substrate 1110. For example, the processor can simultaneously calculate the changes in the parameters Ctotal, dCx, and dCz related to the capacitance, thereby simultaneously restoring the components of the deformations of different dimensions to restore the actual bending deformation of the second strain sensor 1100.

[0153] Therefore, the embodiments of the present specification can measure deformations in multiple degrees of freedom (for example, including bending around the X-axis, bending around the Z-axis, and stretching along the Y-axis) through a single sensor, thereby realizing detection of posture data of fingers in multiple dimensions, which is beneficial for simplifying the preparation process and miniaturization design while improving detection accuracy.

[0154] Fig.17 is a schematic cross-sectional view of a second strain sensor according to some embodiments of the present specification.

[0155] like Fig.17 As shown, in some embodiments, each capacitor structure includes a second conductive layer, an intermediate layer, and a first conductive layer stacked sequentially away from the flexible substrate 1110 in the thickness direction. For example, the first capacitor structure 1120 includes a second conductive layer 1122, an intermediate layer 112-53, and a first conductive layer 1121 stacked sequentially away from the flexible substrate 1110; the second capacitor structure 1130 includes a second conductive layer 1132, an intermediate layer 112-53, and a first conductive layer 1131 stacked sequentially away from the flexible substrate 1110; the third capacitor structure 1140 includes a second conductive layer 1142, an intermediate layer 114-55, and a first conductive layer 1141 stacked sequentially away from the flexible substrate 1110; and the fourth capacitor structure 1150 includes a second conductive layer 1152, an intermediate layer 114-55, and a first conductive layer 1151 stacked sequentially away from the flexible substrate 1110. In some embodiments, the intermediate layer is between the first conductive layer and the second conductive layer.

[0156] In some embodiments, the first conductive layer and the second conductive layer of each capacitor structure include an elastic conductive material, which can make the first conductive layer and the second conductive layer conductive and can return to their original shape when the external force disappears. In some embodiments, the elastic conductive material includes but is not limited to conductive film, conductive ink, conductive polymer material, conductive gel, liquid metal, etc. In some embodiments, the first conductive layer and the second conductive layer include conductive film, which is made by mixing conductive particles with polymer materials. In some embodiments, polymer materials include but are not limited to silicone, rubber or resin, etc. In some embodiments, the first conductive layer and the second conductive layer include conductive ink, which is made by mixing conductive particles with ink materials, and the conductive ink can be prepared by printing to obtain a conductive pattern. In some embodiments, the first conductive layer and the second conductive layer include conductive polymer materials, conductive gel, liquid metal, etc. In some embodiments, conductive polymer materials include but are not limited to polypyrrole, poly (3,4-ethylenedioxythiophene) - polystyrene sulfonate (PEDOT:PSS, Poly (3,4-ethylenedioxythiophene) polystyrene sulfonate), etc.

[0157] In some embodiments, the elastic conductive material includes an elastic material filled with conductive particles, and the conductivity of the first conductive layer and the second conductive layer can be adjusted by filling the conductive particles in the elastic material. In some embodiments, the elastic material includes silicone, rubber, resin, polydimethylsiloxane (PDMS), polyurethane, styrene-butadiene-styrene (SBS), etc. In some embodiments, the conductive particles include metal powder and carbon powder, carbon nanotubes, silver nanowires, carbon black, graphite powder, graphene, etc.

[0158] In some embodiments, the middle layer includes an elastic insulating material, and each capacitor structure is a capacitor structure. For example, the elastic insulating material includes silicone, rubber, polydimethylsiloxane (PDMS), thermoplastic polyurethane (TPU), etc. In some embodiments, the middle layer includes a high-resistance elastic material, and the resistivity of the middle layer is more than 1000 times greater than the resistivity of the first conductive layer and the second conductive layer. In this case, each capacitor structure is a capacitor-resistor composite capacitor structure.

[0159] In some embodiments, the thickness of the first conductive layer and the second conductive layer of each capacitor structure is in the range of 1 to 100 um. In some embodiments, the width of the first conductive layer and the second conductive layer of each capacitor structure is in the range of 0.5 to 10 mm. In some embodiments, the interval between the first conductive layer 1121 of the first capacitor structure 1120 and the first conductive layer 1131 of the second capacitor structure 1130 is in the range of 0.02 to 2 mm. In some embodiments, the interval between the second conductive layer 1122 of the first capacitor structure 1120 and the second conductive layer 1132 of the second capacitor structure 1130 is in the range of 0.02 to 2 mm. In some embodiments, the interval between the first conductive layer 1141 of the third capacitor structure 1140 and the first conductive layer 1151 of the fourth capacitor structure 1150 is in the range of 0.02 to 2 mm. In some embodiments, the interval between the second conductive layer 1142 of the third capacitor structure 1140 and the second conductive layer 1152 of the fourth capacitor structure 1150 is in the range of 0.02 to 2 mm.

[0160] In some embodiments, the conductivity of the first conductive layer is greater than the conductivity of the intermediate layer.

[0161] Conductivity is a parameter used to describe the ease of charge flow in a substance. Since the conductivity of the first conductive layer is greater than that of the second conductive layer, the first conductive layer has better conductivity. Therefore, the resistance of the first conductive layer is less than that of the second conductive layer. It should be noted that in this specification, the resistance of a certain component refers to the resistance between two surfaces of the component spaced apart along the thickness direction of the flexible substrate 1110. The resistance of the first conductive layer refers to the resistance between two surfaces of the first conductive layer spaced apart along the thickness direction of the flexible substrate 1110, and the resistance of the second conductive layer may refer to the resistance between two surfaces of the second conductive layer spaced apart along the thickness direction of the flexible substrate 1110. In some embodiments, the conductivity of the first conductive layer may be more than 100 times that of the second conductive layer. In some embodiments, by setting the density of the conductive particles filled in the elastic material of the first conductive layer to be greater than the density of the conductive particles filled in the elastic material of the second conductive layer, the conductivity of the first conductive layer can be greater than that of the second conductive layer.

[0162] When the capacitor structure (e.g., the first capacitor structure 1120, the second capacitor structure 1130, the third capacitor structure 1140, and the fourth capacitor structure 1150) is a capacitor-resistance composite capacitor structure or a single capacitor structure, the resistance between the two surfaces of the intermediate layer spaced along the thickness direction of the flexible substrate 1110 should not be too small, so as to facilitate the subsequent measurement of the resistance and the analysis of the change in resistance. In some embodiments, the resistance between the two surfaces of the intermediate layer spaced along the thickness direction of the flexible substrate 1110 is greater than 0.8 MΩ. For example, when the capacitor structure (e.g., the first capacitor structure 1120, the second capacitor structure 1130, the third capacitor structure 1140, and the fourth capacitor structure 1150) is a capacitor-resistance composite capacitor structure, the resistance between the two surfaces of the intermediate layer spaced along the thickness direction of the flexible substrate 1110 may also be 0.8 MΩ to 1150 GΩ. For another example, when the capacitor structure (e.g., the first capacitor structure 1120, the second capacitor structure 1130, the third capacitor structure 1140, and the fourth capacitor structure 1150) is a single capacitor structure, the resistance between the two surfaces of the intermediate layer spaced apart along the thickness direction of the flexible substrate 1110 can be larger, for example, the resistance can be greater than 1150 GΩ.

[0163] By setting the resistance between the two surfaces of the intermediate layer along the thickness direction of the flexible substrate 1110 to be greater than 0.8 MΩ, the intermediate layer can be conductive and have a sufficiently large resistance, thereby ensuring the measurement of the resistance of the intermediate layer and the analysis of the change in resistance, which can accurately reflect the bending condition of the second strain sensor 1100.

[0164] In some embodiments, the relative dielectric constant of the intermediate layer is greater than 2. The relative dielectric constant is a physical parameter that characterizes the dielectric properties or polarization properties of a dielectric material, and its value is equal to the ratio of the capacitance of a capacitor of the same size made with the corresponding material as the medium to the capacitance of a capacitor of the same size made with a vacuum as the medium. The value of the relative dielectric constant is also a characterization of the material's ability to store electricity, also known as relative permittivity. A substance with a relative dielectric constant greater than 2 is a polar substance, that is, an intermediate layer with a relative dielectric constant greater than 2 has a certain ability to store electricity. Therefore, the intermediate layer can be equivalent to a parallel combination of a resistor element and a capacitor element.

[0165] In some embodiments, the relative dielectric constant of the intermediate layer may also be greater than or equal to 4. Preferably, the relative dielectric constant of the intermediate layer is greater than 5. In some embodiments, the relative dielectric constant of the intermediate layer is greater than 10.

[0166] The relative dielectric constant of the middle layer is set to be greater than 2, so that the middle layer can be both a resistor and a capacitor. During the bending process of the second strain sensor 1100, the capacitance and resistance of the middle layer will change with the deformation of the flexible substrate 1110, so the parameters related to the capacitance and resistance of the middle layer can reflect the bending of the second strain sensor 1100. In this embodiment, the capacitance and resistance exist at the same time to reflect the bending of the second strain sensor 1100, which can significantly improve the sensitivity and accuracy of the second strain sensor 1100.

[0167] In addition, by setting the resistance between the two surfaces of the intermediate layer along the thickness direction of the flexible substrate 1110 to be greater than 0.8 MΩ, it can also be ensured that the intermediate layer can exhibit both better resistance performance and better capacitance performance, thereby ensuring the sensitivity and accuracy of the second strain sensor 1100.

[0168] In some embodiments, two capacitor structures on the same side surface of the flexible substrate 1110 may share a first conductive layer, and the second conductive layers of the two capacitor structures are spaced apart along the short axis direction of the flexible substrate 1110. In some embodiments, more conductive layers (such as a third conductive layer, etc.) may be provided in a stacked manner along the thickness direction of each inductive structure, which can effectively improve the sensitivity of the sensor 1100 to detect deformations in each degree of freedom. For example, each capacitor structure includes a second conductive layer, a second intermediate layer, a third conductive layer, a first intermediate layer, and a first conductive layer stacked sequentially away from the flexible substrate 1110 along the thickness direction. Among them, the parameters of the third conductive layer, the first conductive layer, and the second conductive layer are consistent; the parameters of the second intermediate layer, the first intermediate layer, and the intermediate layer described above are consistent.

[0169] In some embodiments of the present specification, by applying a stopping structure (for example, a ratchet, etc.) in conjunction with a stopping component on a finger force feedback piece for force feedback, the structure of the finger force feedback piece can be simplified and the size of the finger force feedback piece can be reduced, thereby reducing power consumption while miniaturizing the size of the force feedback glove.

[0170] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of this specification. Although not explicitly stated here, those skilled in the art may make various modifications, improvements and corrections to this specification. Such modifications, improvements and corrections are suggested in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this specification.

[0171] At the same time, this specification uses specific words to describe the embodiments of this specification. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of this specification. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures or characteristics in one or more embodiments of this specification can be appropriately combined.

[0172] In addition, unless explicitly stated in the claims, the order of the processing elements and sequences described in this specification, the use of alphanumeric characters, or the use of other names are not intended to limit the order of the processes and methods of this specification. Although the above disclosure discusses some invention embodiments that are currently considered useful through various examples, it should be understood that such details are only for illustrative purposes, and the attached claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that are consistent with the essence and scope of the embodiments of this specification. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only by software solutions, such as installing the described system on an existing server or mobile device.

[0173] Similarly, it should be noted that in order to simplify the description disclosed in this specification and thus help understand one or more embodiments of the invention, in the above description of the embodiments of this specification, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the subject matter of this specification are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

[0174] In some embodiments, numbers describing the number of components and attributes are used. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise specified, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of this specification are approximate values, in specific embodiments, the setting of such numerical values ​​is as accurate as possible within the feasible range.

[0175] Each patent, patent application, patent application publication, and other materials, such as articles, books, specifications, publications, documents, etc., cited in this specification are hereby incorporated by reference in their entirety. Except for application history documents that are inconsistent with or conflicting with the contents of this specification, documents that limit the broadest scope of the claims of this specification (currently or later attached to this specification) are also excluded. It should be noted that if the descriptions, definitions, and / or use of terms in the materials attached to this specification are inconsistent or conflicting with the contents described in this specification, the descriptions, definitions, and / or use of terms in this specification shall prevail.

[0176] Finally, it should be understood that the embodiments described in this specification are only used to illustrate the principles of the embodiments of this specification. Other variations may also fall within the scope of this specification. Therefore, as an example and not a limitation, alternative configurations of the embodiments of this specification may be considered consistent with the teachings of this specification. Accordingly, the embodiments of this specification are not limited to the embodiments explicitly introduced and described in this specification.

Claims

1. A force feedback system, comprising: Glove body; a microprocessor coupled to the glove body, the microprocessor being communicatively coupled to an external computing device; as well as A plurality of finger force feedback members, each of which is mechanically coupled to the glove body and communicatively coupled to the microprocessor, and is configured to provide force feedback to the corresponding finger according to the instruction of the microprocessor, wherein: Each of the finger force feedback components includes a pull rope that tracks the movement of the finger, a transmission component that moves following the pull rope, and a stop component. A plurality of stop structures are sequentially arranged on the transmission component, and the stop component is configured to cooperate with any one of the plurality of stop structures to achieve braking of the finger.

2. The force feedback system according to claim 1, wherein each finger force feedback member comprises a shell located on the back of the palm, the transmission member and the stop member are located in the shell, wherein: The force feedback system further comprises a fingertip cover, and the pull rope mechanically connects the fingertip cover and the transmission component.

3. The force feedback system according to claim 2, wherein each finger force feedback member further comprises a wire groove arranged between the finger joints of the glove body, and the drawstring passes through the wire groove to connect the fingertip cover and the transmission component.

4. The force feedback system according to claim 2, wherein the transmission component comprises a spool, the pull rope is wound around the spool, a stop structure is arranged on the surface of the spool, and the stop component comprises a stop plate that can be inserted into a groove between the stop structures. 5 . The force feedback system according to claim 4 , wherein the gradient of one side of the stop structure abutting against the stop plate is greater than the gradient of the other side. 6 . The force feedback system according to claim 4 , wherein a limiting protrusion is arranged on an inner side surface of the housing opposite to the stop structure. 7 . The force feedback system according to claim 6 , wherein the height of the limiting protrusion is greater than the height of the stopping structure.

8. The force feedback system according to claim 4, wherein the stop member comprises a transmission rod, and the transmission rod is configured to press or release the stop plate according to instructions, wherein: When the transmission rod applies pressure to the stopper, the stopper is inserted into the groove between the stopper structures. 9 . The force feedback system according to claim 4 , wherein the stop member comprises a piezoelectric structure, and the piezoelectric structure is configured to drive the stop plate to be inserted into the groove between the stop structures. 10 . The force feedback system according to claim 8 , wherein the stop plate corresponds to a plurality of depths when inserted into the groove between the stop structures.

11. The force feedback system according to claim 1, wherein each finger force feedback member further comprises a sensing component configured to detect a moving distance of the pull cable and transmit data related to the moving distance of the pull cable to a microprocessor.

12. The force feedback system according to claim 11, wherein the transmission component comprises a spool, the pull rope is wound around the spool, and the sensing component comprises a magnet mechanically connected to the spool and a magnetic field sensor for measuring rotation information of the magnet as the spool rotates.

13. The force feedback system according to claim 1, wherein each finger force feedback member further comprises a strain sensor, wherein the strain sensor is arranged at a finger joint of the glove body and is configured to read posture data of the finger.

14. The force feedback system according to claim 1, wherein the transmission component comprises a spool and a scroll spring mechanically connected to the spool, the pull rope is wound around the spool, and the scroll spring is configured to drive the spool to rotate in the opposite direction to reset the pull rope after the finger releases the external tension.

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