Glove system

Abstract

Embodiments of the present specification provide a glove system including a glove body, and a plurality of first strain sensors and a plurality of second strain sensors arranged on the glove body, each of the plurality of first strain sensors is located at an interphalangeal joint of the user and configured to measure deformation of the interphalangeal joint in a single degree of freedom, and each of the plurality of second strain sensors is located at a metacarpophalangeal joint and configured to measure deformation of the interphalangeal joint in a single degree of freedom. The metacarpophalangeal joint has a single degree of freedom and is configured to measure deformation of the metacarpophalangeal joint in two degrees of freedom, the single degree of freedom and the two degrees of freedom each including a degree of freedom corresponding to finger bending.

Description

Cross-references

[0001] This specification claims the priority of the international application with application number PCT / CN2023 / 124295 filed on October 12, 2023, and the entire contents are incorporated herein by reference. Technical Field

[0002] The present invention relates to the field of sensor technology, and more particularly to a glove system in which multiple sensors are arranged and a method for recognizing gestures based on the glove system. Background Art

[0003] With the gradual maturity of AR / VR technology and the rise of the concept of the metaverse, smart electronic devices have put forward higher requirements for human-computer interaction technology. Flexible angle sensors can be easily integrated into wearable devices such as smart clothing and smart gloves to achieve accurate recognition and restoration of human movements. They are one of the important underlying technologies of the metaverse and have received extensive attention and research. In order to achieve accurate recognition and restoration of hand movements, it is necessary to collect the movements of the hands, especially the fingers, in multiple degrees of freedom.

[0004] Therefore, it is hoped to propose an electronic device that can improve the accuracy of hand motion acquisition while controlling the cost. Summary of the invention

[0005] One of the embodiments of the present specification provides a glove system, comprising: a glove body and a plurality of first strain sensors and a plurality of second strain sensors arranged on the glove body, wherein when a user wears the glove body, each of the plurality of first strain sensors is located at an interphalangeal joint of the user and is configured to measure the deformation of the interphalangeal joint in a single degree of freedom, and each of the plurality of second strain sensors is located at a metacarpophalangeal joint and is configured to measure the deformation of the metacarpophalangeal joint in two degrees of freedom, wherein the single degree of freedom and the two degrees of freedom both include degrees of freedom corresponding to finger bending. By combining a dual-degree-of-freedom strain sensor (e.g., a second strain sensor) with a single-degree-of-freedom strain sensor, the cost of the product can be controlled, the cost of subsequent data processing can be reduced, and the accuracy of the measurement can be ensured.

[0006] In some embodiments, the plurality of first strain sensors and the plurality of second strain sensors together provide data reflecting deformation of no less than 15 degrees of freedom on the user's fingers.

[0007] In some embodiments, the glove system further includes two inertial sensors, wherein when the user wears the glove body, the two inertial sensors are respectively located on both sides of the user's wrist joint and are configured to jointly measure the movement of the wrist joint in three degrees of freedom.

[0008] In some embodiments, the glove system further includes a third strain sensor located at the wrist joint of the user and an inertial sensor located outside the wrist joint. By using two inertial sensors or combining an inertial sensor with a strain sensor, multiple degrees of freedom motion acquisition of the wrist joint can be achieved. Users can flexibly select a combination of different sensor types according to different application scenarios to achieve multiple degrees of freedom motion acquisition.

[0009] In some embodiments, the first strain sensor comprises an inductive sensor, and the inductance of the inductive sensor changes with the deformation of the interphalangeal joint.

[0010] In some embodiments, the second strain sensor includes a plurality of capacitive structures, and the capacitance of the plurality of capacitive structures changes respectively with the change of the metacarpophalangeal joint in each degree of freedom. A single sensor can be used to measure the deformation of multiple degrees of freedom, thereby realizing the detection of motion information in multiple dimensions, which is conducive to simplifying the preparation process and miniaturization design while improving the detection accuracy.

[0011] In some embodiments, the second strain sensor includes: a flexible substrate and a first capacitor structure and a second capacitor structure, wherein the first capacitor structure and the second capacitor structure both include a multilayer structure arranged on the same side surface in the thickness direction of the flexible substrate, and each layer of each multilayer structure is stacked along the thickness direction.

[0012] In some embodiments, the glove body includes a cloth wrapped around each finger of the user and a cloth located between adjacent fingers, wherein the elastic modulus of the cloth between adjacent fingers is smaller than the elastic modulus of the cloth on each finger. Such a setting can reduce the mutual interference between the second strain sensors on different fingers, ensuring that the data collected by each second strain sensor can accurately reflect the joint deformation at the corresponding position.

[0013] In some embodiments, the plurality of first strain sensors are only arranged at the interphalangeal joints closest to the metacarpophalangeal joints of the user's fingers. Such an arrangement can simplify the structure of the glove system, reduce product costs, and ensure the accuracy of deformation data collection.

[0014] In some embodiments, the glove system further includes a processor configured to: read data associated with the plurality of first strain sensors and the plurality of second strain sensors; and determine a gesture of the user based on the data.

[0015] In some embodiments, the processor is configured to: output a gesture representation corresponding to the user's gesture on a display interface; and output feedback information according to a distance between the gesture representation and a preset gesture.

[0016] In some embodiments, the processor is configured to: read a mapping relationship between a gesture and a voice data packet; and play voice information based on the user's gesture and the mapping relationship.

[0017] In some embodiments, the processor is configured to: read a mapping relationship between a gesture and an execution instruction; and execute the instruction based on the user's gesture and the mapping relationship.

[0018] One of the embodiments of the present specification provides a gesture reproduction method, comprising: acquiring sensor data of a user's hand based on a glove system, wherein the glove system comprises a glove body and a plurality of first strain sensors and a plurality of second strain sensors arranged on the glove body, when the user wears the glove body, each of the plurality of first strain sensors is located at an interphalangeal joint of the user and is configured to measure the deformation of the interphalangeal joint in a single degree of freedom, each of the plurality of second strain sensors is located at a metacarpophalangeal joint and is configured to measure the deformation of the metacarpophalangeal joint in two degrees of freedom, the single degree of freedom and the two degrees of freedom both include degrees of freedom corresponding to finger bending; determining the user's gesture based on the sensor data; outputting a gesture representation corresponding to the gesture on a display interface; and outputting feedback information according to the distance between the gesture representation and a preset gesture.

[0019] One of the embodiments of the present specification provides a voice playback method, comprising: acquiring sensor data of a user's hand based on a glove system, wherein the glove system comprises a glove body and a plurality of first strain sensors and a plurality of second strain sensors arranged on the glove body, when the user wears the glove body, each of the plurality of first strain sensors is located at an interphalangeal joint of the user and is configured to measure the deformation of the interphalangeal joint in a single degree of freedom, each of the plurality of second strain sensors is located at a metacarpophalangeal joint and is configured to measure the deformation of the metacarpophalangeal joint in two degrees of freedom, the single degree of freedom and the two degrees of freedom both include degrees of freedom corresponding to finger bending; determining the user's gesture based on the sensor data; reading a mapping relationship between a gesture and a voice data packet; and playing voice information based on the user's gesture and the mapping relationship.

[0020] One of the embodiments of the present specification provides a gesture control method, comprising: acquiring sensor data of a user's hand based on a glove system, wherein the glove system comprises a glove body and a plurality of first strain sensors and a plurality of second strain sensors arranged on the glove body, when the user wears the glove body, each of the plurality of first strain sensors is located at an interphalangeal joint of the user and is configured to measure the deformation of the interphalangeal joint in a single degree of freedom, each of the plurality of second strain sensors is located at a metacarpophalangeal joint and is configured to measure the deformation of the metacarpophalangeal joint in two degrees of freedom, the single degree of freedom and the two degrees of freedom both include degrees of freedom corresponding to finger bending; determining the user's gesture based on the sensor data; reading a mapping relationship between a gesture and an execution instruction; and executing an instruction based on the user's gesture and the mapping relationship. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] This specification will be further described in the form of exemplary embodiments, which will be described in detail by the accompanying drawings. These embodiments are not restrictive, and in these embodiments, the same number represents the same structure, wherein:

[0022] Figure 1 is a schematic diagram of a framework of an exemplary glove system according to some embodiments of this specification;

[0023] Figure 2A is a schematic diagram of joints of a user's hand according to some embodiments of this specification;

[0024] Figure 2B is a schematic diagram of the joint positions of a user's hand according to some embodiments of this specification;

[0025] Figure 3 is an exemplary schematic diagram of a hand motion coordinate system according to some embodiments of this specification;

[0026] Figure 4 is a schematic structural diagram of an exemplary glove system according to some embodiments of this specification;

[0027] Figure 5 is a schematic diagram of a second strain sensor according to some embodiments of this specification;

[0028] Figure 6 is a schematic diagram of a second strain sensor according to some other embodiments of the present specification;

[0029] Fig. 7A is a schematic diagram of the distribution of four sensing structures on a flexible substrate according to some embodiments of this specification;

[0030] Figure 7B is based on Fig. 7A A schematic diagram of the cross-sectional structure along the Y-axis direction is shown;

[0031] Fig. 8A is a schematic diagram of a structure in which a sensor according to some embodiments of this specification does not undergo deformation;

[0032] Figure 8B is based on Fig. 8A The schematic diagram of the deformation of the sensor after being stretched or compressed along the long axis direction is shown;

[0033] Fig. 9 is based on Fig. 8A The sensor shown is a side view schematic diagram after bending and deformation around an axis parallel to the short axis direction;

[0034] Fig.10 is based on Fig. 8A The schematic top view of the sensor shown is a diagram of a sensor bent and deformed around an axis parallel to the thickness direction;

[0035] Fig.11 is a cross-sectional schematic diagram of a second strain sensor according to some embodiments of this specification;

[0036] Fig.12 is a processing flow chart of a processor according to some embodiments of this specification;

[0037] Fig.13 is a processing flow chart of a processor according to some other embodiments of this specification;

[0038] Fig.14 is a processing flow chart of a processor according to some embodiments of this specification;

[0039] Fig.15 is a processing flow chart of a processor according to some embodiments of this specification;

[0040] Fig.16 is a flow chart of a method for gesture reproduction according to some embodiments of this specification;

[0041] Fig.17 is a flow chart of a method for voice playback according to some embodiments of this specification;

[0042] Fig.18 It is a flow chart of the gesture control method shown in some embodiments of this specification. DETAILED DESCRIPTION

[0043] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, the present application can also be applied to other similar scenarios based on these drawings without creative work. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

[0044] It should be understood that the "system", "device", "unit" and / or "module" used herein are a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

[0045] As shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not refer to the singular and may also include the plural. Generally speaking, the terms "comprises" and "includes" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0046] Flowcharts are used in the present application to illustrate the operations performed by the system according to the embodiments of the present application. It should be understood that the preceding or following operations are not necessarily performed accurately in order. On the contrary, the various steps may be processed in reverse order or simultaneously. At the same time, other operations may also be added to these processes, or one or more operations may be removed from these processes.

[0047] Figure 1 is a schematic diagram of a frame of an exemplary glove system according to some embodiments of this specification. Figure 1 As shown, the glove system 100 may include a glove body 110, a plurality of strain sensors (including a first strain sensor 120 and a second strain sensor 130), and a processor 140. The plurality of strain sensors may be distributed at different locations on the glove body 110.

[0048] The glove system 100 refers to a system for capturing the user's hand movements (including finger movements). The glove system 100 can recognize hand movements through one or more devices, such as motion capture gloves, sign language gloves, VR gloves, force feedback gloves, tactile feedback gloves, etc.

[0049] The glove body 110 refers to a wearable item for fitting with the hand. In some embodiments, in order to facilitate the glove body 110 to fit with the hand joints (for example, including the interphalangeal joints, metacarpophalangeal joints, wrist joints, etc.), the glove body 110 has a structure that adapts to the shape of the hand and extends along the hand joints. In some embodiments, the glove body 110 can be a flexible fabric that is easy to deform (such as bending deformation) along with the fingers when subjected to external forces. In some embodiments, the glove body 110 can provide support for the strain sensor to facilitate the arrangement of the strain sensor. For example, the glove body 110 can include one or more layers of flexible structure (for example, flexible fabric). The strain sensor can be fixed to the surface of a layer of flexible structure by means of gluing, pressing or sewing.

[0050] The strain sensor refers to an electronic device that can convert the deformation of the corresponding area of ​​the glove body 110 into an electrical signal. In some embodiments, the strain sensor (for example, the first strain sensor 120 and the second strain sensor 130) is arranged in one or more areas corresponding to the user's hand joints of the glove body 110. When the user wears the glove body 110 and makes hand movements, the glove body 110 is deformed by external force, and the strain sensor can convert the deformation at the hand joint into an electrical signal. The electrical signal generated by the strain sensor can reflect the deformation direction and deformation size at the corresponding area.

[0051] In some embodiments, the strain sensor includes a plurality of first strain sensors 120 and a plurality of second strain sensors 130 .

[0052] Each of the plurality of first strain sensors 120 may be configured to measure deformation in a single degree of freedom. In some embodiments, the first strain sensor 120 may be located at a position of the user's hand where the degree of freedom of deformation is small, such as an interphalangeal joint, and is configured to measure the deformation of the interphalangeal joint in a single degree of freedom. In some embodiments, the first strain sensor 120 includes a single degree of freedom sensor, such as a single-axis sensor (such as an inductive, resistive bending sensor, or a capacitive stretching sensor).

[0053] Each of the plurality of second strain sensors 130 may be configured to measure deformation in more than one degree of freedom. In some embodiments, the second strain sensor 130 may be located at a position where the user's hand has more degrees of freedom for deformation, such as a metacarpophalangeal joint, and may be configured to measure deformation of the metacarpophalangeal joint in two degrees of freedom. In some embodiments, the second strain sensor 130 includes a multi-degree-of-freedom sensor, such as a multi-axis sensor (e.g., a capacitive multi-axis motion sensor).

[0054] For more information about the first strain sensor and the second strain sensor, see Figure 4For the description of the above interphalangeal joints and metacarpophalangeal joints, please refer to Figure 2A-2B Related description.

[0055] Figure 2A It is a schematic diagram of the joints of a user's hand according to some embodiments of the present specification. Figure 2B It is a schematic diagram of the joint positions of a user's hand according to some embodiments of this specification.

[0056] like Figure 2A As shown, the metacarpophalangeal joints 211, 212, 213, 214, 215 are the joints between the metacarpal heads and the proximal phalanges (the first phalanges close to the metacarpal bones). The interphalangeal joints 221, 222, 223, 224, 225, 226, 227, 228, 229 are the joints between the phalanges.

[0057] Combination Figure 2A and Figure 2B As shown, positions 0, 2, 5, 8, 11 on the back of the hand (dorsum of the hand) correspond one-to-one to the metacarpophalangeal joints 215, 214, 213, 212, 211. Positions 1, 3, 6, 9, 12, 4, 7, 10, 13 on the back of the hand correspond one-to-one to the interphalangeal joints 229, 227, 225, 223, 221, 228, 226, 224, 222, respectively.

[0058] In some embodiments, the first strain sensors 120 are arranged at positions corresponding to positions 1, 3, 6, 9, 12, 4, 7, 10, and 13 on the back of the hand on the glove body 110. In some embodiments, the first strain sensors 120 can be arranged at positions corresponding to interphalangeal joints 229, 227, 225, 223, 221, 228, 226, 224, and 222 on the front (palm side) or side of the hand of the glove body 110. In some embodiments, the second strain sensors 130 are arranged at positions 0, 2, 5, 8, and 11 on the back of the hand on the glove body 110.

[0059] Each first strain sensor 120 can measure the deformation of one interphalangeal joint in one degree of freedom among the interphalangeal joints 229, 227, 225, 223, 221, 228, 226, 224, 222. Each second strain sensor 130 can measure the deformation of one metacarpophalangeal joint in two degrees of freedom among the metacarpophalangeal joints 215, 214, 213, 212, 211.

[0060] The degrees of freedom described in this specification refer to the dimensions in which an object can move. To facilitate the description of the degrees of freedom of the hand's movement, a three-dimensional coordinate system is established for the hand's movement, for example, Figure 3The three-dimensional coordinate system shown in FIG. In this coordinate system, the origin is the metacarpophalangeal joint, the finger extension direction is the Y axis, and the direction perpendicular to the hand plane is the Z axis. The hand plane can refer to the fitting plane of the palm part. For example, when the palm of the hand is placed on the table, the table or the plane passing through the hand and parallel to the table can be used as the hand plane. This three-dimensional coordinate system can be used to describe the degrees of freedom of hand movement. Specifically, in Figure 3 In the three-dimensional coordinate system shown, the rotation of the hand around the X-axis is defined as bending, the rotation of the hand around the Z-axis is defined as swinging, and the rotation of the hand around the Y-axis is defined as rotation. The interphalangeal joints (e.g., interphalangeal joints 229, 227, 225, 223, 221, 228, 226, 224, 222) can only bend and rotate. In other words, the deformation of the interphalangeal joints only corresponds to the one degree of freedom of bending. The metacarpophalangeal joints (e.g., metacarpophalangeal joints 215, 214, 213, 212, 211) can bend, swing, and rotate. In other words, the deformation of the metacarpophalangeal joints corresponds to the two degrees of freedom of bending and swinging. Thus, each first strain sensor 120 can measure the deformation of one interphalangeal joint among the interphalangeal joints 229, 227, 225, 223, 221, 228, 226, 224, and 222 in the bending freedom, that is, when any interphalangeal joint is bent, the first strain sensor 120 can measure the deformation of the glove body 110 at the corresponding interphalangeal joint. Each second strain sensor 130 can measure the deformation of one metacarpophalangeal joint among the metacarpophalangeal joints 215, 214, 213, 212, and 211 in the bending and swinging freedoms, that is, when any metacarpophalangeal joint is bent or swung, the second strain sensor 130 can measure the deformation of the glove body 110 at the corresponding metacarpophalangeal joint.

[0061] Continue to see Figure 2A and Figure 2B, a hand has a total of 9 interphalangeal joints, among which interphalangeal joints 228, 226, 224, and 222 are distal interphalangeal joints relatively far from the palm, and interphalangeal joints 229, 227, 225, 223, and 221 are proximal interphalangeal joints relatively close to the palm. In some embodiments, the movement of the distal interphalangeal joints is manifested as the following movement of the previous joint (proximal interphalangeal joint), and usually does not bend independently, but bends together with the proximal interphalangeal joint. Therefore, the first strain sensor may not be arranged separately at the distal interphalangeal joint, and the first strain sensor may be arranged only at the proximal interphalangeal joint. In some embodiments, the deformation data at the distal interphalangeal joints may be generated by mapping the deformation data of the corresponding proximal interphalangeal joints. Therefore, the glove system 100 collects deformation data of at least five proximal interphalangeal joints 229, 227, 225, 223, and 221 in a single degree of freedom through the multiple first strain sensors 120, and the glove system 100 collects deformation data of five metacarpophalangeal joints 215, 214, 213, 212, and 211 in two degrees of freedom through the multiple second strain sensors 130. In total, the multiple first strain sensors 120 and the multiple second strain sensors 130 jointly provide deformation data of at least 15 degrees of freedom on at least the user's fingers.

[0062] By inferring or mapping the deformation data at the distal interphalangeal joints using the deformation data at the proximal interphalangeal joints, it is not necessary to set the first strain sensor at the distal interphalangeal joints, thereby reducing the number of strain sensors set on the glove body to simplify the structure of the glove system, which is beneficial to controlling product costs while ensuring the accuracy of deformation data collection.

[0063] In some embodiments, the glove system 100 may further include a processor 140, which is configured to receive and process data collected by multiple strain sensors (including multiple first strain sensors 120 and multiple second strain sensors 130). For example, the processor 140 can obtain deformation data from the strain sensor and analyze and process it, for example, by calculating the deformation size and deformation angle of each joint of the finger through a mapping relationship (for example, a mapping function or a trained machine learning model). In some embodiments, the processor 140 can directly process the data collected by multiple strain sensors, or receive the data collected by multiple strain sensors, and transmit the data to an external device for data processing. In some embodiments, the processor 140 can perform corresponding functions based on the processing results of the data, such as the following gesture reproduction, voice broadcast, gesture control, etc. In some embodiments, the processor 140 can interact with an external processing device based on the processing results of the data. Among them, the external device includes a host computer such as a computer, a mobile phone, and a VR device. The interaction may include, for example, controlling the switch of the external device, adjusting the volume, the program process of the external device (such as controlling the movement of the game character), fitness feedback, etc.

[0064] In some embodiments, the processor 140 may be a single server or a server group, and the server group may be centralized or distributed. In some embodiments, the processor 140 may be local or remote. In some embodiments, the data collected by the strain sensor is transmitted to the processor 140 via a wire. In some embodiments, the processor 140 may be implemented on a cloud platform. For example, a cloud platform may include a private cloud, a public cloud, a hybrid cloud, a community cloud, a distributed cloud, an inter-cloud cloud, a multi-cloud, etc., or any combination thereof. In some embodiments, the processor 140 may include one or more processing chips, and the processing chip analyzes and processes the received data. In some embodiments, the processor 140 is an independent processing device. In some embodiments, the processor 140 may be a part of an external device or the glove body 110. For example, the processor 140 may be integrated in an external device or the glove body 110.

[0065] Generally, in order to collect the multi-degree-of-freedom motion of a finger, a gyroscope needs to be arranged at a non-joint position on the finger, and the bending of the finger is inferred by measuring the shape of each part of the finger, or a single-degree-of-freedom strain sensor (such as a first strain sensor) is arranged at the finger joint, and a gyroscope is arranged at a non-joint position on the finger, and the measurement results of the two are combined to calculate the bending of the finger. However, some embodiments in this specification control the cost of the product, reduce the processing cost of subsequent data, and ensure the accuracy of the measurement by combining a dual-degree-of-freedom strain sensor (such as a second strain sensor) with a single-degree-of-freedom strain sensor.

[0066] In some embodiments, in order to more completely identify the movement of the hand, the glove system 100 can also collect the movement of the wrist joint. For example, the glove system 100 measures the movement of the wrist joint by using multiple inertial sensors, or by using a combination of strain sensors and inertial sensors. For more information on collecting the movement of the wrist joint, please refer to other parts of this specification, for example, Figure 4 and its related description.

[0067] Figure 4 It is a schematic diagram of the structure of an exemplary glove system according to some embodiments of this specification.

[0068] like Figure 4 As shown, in some embodiments, the glove system 400 includes a glove body 410, a plurality of first strain sensors (including a first strain sensor 421, a first strain sensor 422, a first strain sensor 423, a first strain sensor 424, and a first strain sensor 425), a plurality of second strain sensors (including a second strain sensor 431, a second strain sensor 432, a second strain sensor 433, a second strain sensor 434, and a second strain sensor 435), and a processor 440. The first strain sensor is located in any one or more regions of the glove body 410 corresponding to the interphalangeal joints of the user (e.g., interphalangeal joints 229, 227, 225, 223, and 221). The second strain sensor is located in any one or more regions of the glove body 410 corresponding to the metacarpophalangeal joints of the user (e.g., metacarpophalangeal joints 211, 212, 213, 214, and 215). The processor 440 is configured to receive and process data collected by the strain sensor.

[0069] In some embodiments, the first strain sensor is a uniaxial sensor that collects the deformation of the interphalangeal joint in a single degree of freedom (i.e., bending). In some embodiments, the first strain sensor includes various flexible bending sensors, such as inductive sensors, resistive sensors, capacitive sensors, optical fiber sensors, etc. As an example only, the first strain sensor includes an inductive sensor, and the inductance of the inductive sensor can change with the deformation of the interphalangeal joint. Specifically, the inductive sensor deforms with the movement of the interphalangeal joint, and its inductance changes in response to the deformation of the inductive sensor. By collecting the parameters related to the inductance of the inductive sensor and analyzing its changes, the bending condition of the inductive sensor (such as bending angle, bending direction, etc.) can be calculated more accurately. For example, the electrical quantity of the inductance of the inductive sensor is proportional to the deformation of the inductive sensor, and thus, the change in the electrical quantity of the inductance of the inductive sensor can characterize the deformation or bending degree of the interphalangeal joint.

[0070] Since the interphalangeal joint corresponds to only one bending degree of freedom, a single-axis sensor (such as an inductive sensor) is used to measure the movement of the interphalangeal joint, which has a simple structure and low product cost.

[0071] In some embodiments, see Figure 2A and Figure 4 , the first strain sensor is not arranged separately at the distal interphalangeal joint, and the first strain sensor is arranged only at the proximal interphalangeal joint. The deformation data at the distal interphalangeal joint can be generated by mapping the deformation data of the corresponding proximal interphalangeal joint. Figure 2B and Figure 4 , the first strain sensor is arranged at positions 1, 3, 6, 9 and 12 on the user's finger. For example, the first strain sensor 425 is arranged at position 1 on the thumb, and position 1 corresponds to the proximal interphalangeal joint 229 on the thumb. For another example, the first strain sensor 424 is arranged at position 3 on the index finger, and position 3 corresponds to the proximal interphalangeal joint 227 on the index finger. For another example, the first strain sensor 423 is arranged at position 6 on the middle finger, and position 6 corresponds to the proximal interphalangeal joint 225 on the middle finger.

[0072] Arranging the first strain sensor only at the interphalangeal joint closest to the metacarpophalangeal joint of each finger of the user can simplify the structure of the glove system 400, reduce product costs, and ensure the accuracy of deformation data collection.

[0073] In some embodiments, the second strain sensor is a multi-axis sensor for collecting deformation of the metacarpophalangeal joint in two degrees of freedom (i.e., bending and swinging). In some embodiments, the second strain sensor includes various flexible bending sensors, such as inductive sensors, resistive sensors, capacitive sensors, optical fiber sensors, etc. As an example only, the second strain sensor includes multiple capacitor structures, and the capacitance of the multiple capacitor structures can change separately as the metacarpophalangeal joint changes in each degree of freedom. For the specific structure of the second strain sensor including multiple capacitor structures, please refer to Figure 5-8B and related descriptions.

[0074] See also Figure 5 and Figure 6 In some embodiments, the second strain sensor 500 includes a flexible substrate 510, a first capacitor structure 520 and a second capacitor structure 530. In some embodiments, as Figure 5 As shown, the first capacitor structure 520 and the second capacitor structure 530 are distributed on both sides of the flexible substrate 510 along the thickness direction, and the projection of the first capacitor structure 520 on the flexible substrate 510 at least partially overlaps with the projection of the second capacitor structure 530 on the flexible substrate 510. In some embodiments, as Figure 6As shown, the first capacitor structure 520 and the second capacitor structure 530 are distributed on the same side of the hand-flexible substrate 510 along the thickness direction.

[0075] The flexible substrate 510 has a flexible property and is easily deformed (such as bending) when subjected to an external force. In some embodiments, in order to facilitate fitting with human joints, the flexible substrate 510 may have a flat structure. In this case, the flexible substrate 510 has a thickness direction, which may be as follows: Figure 5 The Z-axis direction is shown.

[0076] The capacitor structure (including the first capacitor structure 520 and the second capacitor structure 530) is a structure for measuring the bending deformation of the flexible substrate 510. Specifically, the capacitor structure has a corresponding area, and the electrical quantity of the capacitor structure (for example, capacitance) is proportional to its area (or a dimensional parameter related to the area, such as the length, width of the capacitor structure or the bending angle of the second strain sensor, etc.), that is, the electrical quantity of the capacitor structure in different directions is proportional to the deformation of the second strain sensor in different degrees of freedom, thereby reflecting the deformation (such as bending angle, bending direction). It should be understood that the second strain sensor may not be limited to a capacitor structure, for example, it may also be a resistor structure or a capacitor-resistor composite structure. In some embodiments, the first capacitor structure 520 and the second capacitor structure 530 may both include a structure arranged in the thickness direction of the flexible substrate 510 (such as Figure 5 or Figure 6 The multilayer structure on the same side surface of the flexible substrate 510 (Z-axis direction shown in the figure), each layer of each multilayer structure is stacked along the thickness direction. Wherein, the multilayer structure is a structure formed by stacking layer structures. The layers of each multilayer structure stacked in the thickness direction can be understood as follows: each layer in the multiple layer structures of the first capacitor structure 520 and the second capacitor structure 530 is arranged along the thickness direction of the flexible substrate 510 and stacked together. In some embodiments, the multilayer structure includes a second conductive layer, an intermediate layer and a first conductive layer. In some embodiments, the multilayer structure includes a second conductive layer, a second intermediate layer, a third conductive layer, a first intermediate layer and a first conductive layer. The specific layered structure included in the multilayer structure can be found below.

[0077] When different capacitor structures are arranged at different positions of the second strain sensor 500, these capacitor structures will produce differentiated responses to the deformation of different dimensions of the flexible substrate 510. When the flexible substrate 510 produces a certain dimension of deformation, the detection parameters generated by these capacitor structures have characteristics corresponding to the deformation of this dimension; and when the flexible substrate 510 produces another dimension of deformation, the detection parameters generated by these capacitor structures will have corresponding characteristics. It can be understood that the characteristics of the detection parameters generated by these capacitor structures will correspond to the deformation dimensions of the flexible substrate 510 one by one, and on this basis, the deformation of the flexible substrate 510 can be identified according to the detection parameters of each capacitor structure. In some embodiments, the processor (for example, the processor 140) can determine the deformation of the flexible substrate 510 in at least two dimensions through a specific algorithm according to the parameters related to capacitance of each capacitor structure (for example, the first capacitor structure 520, the second capacitor structure 530). For example, the deformation of the flexible substrate 510 in at least two dimensions is determined by a machine learning model, a mapping relationship or a functional relationship. The description of the deformation in at least two dimensions can be found below.

[0078] When the second strain sensor 500 (flexible substrate 510) is bent and deformed, the physical shape of at least part of the capacitor structure (e.g., the first capacitor structure 520 and the second capacitor structure 530) located on the flexible substrate 510 will change accordingly, thereby causing the corresponding capacitance to change. For example, the bending of the second strain sensor 500 will cause the area of ​​the capacitor structure to change, thereby changing the capacitance of the capacitor structure. By collecting the capacitance of the capacitor structure or parameters related to the capacitance, and analyzing the changes in the capacitance of the capacitor structure or parameters related to the capacitance, the bending condition (such as bending angle, bending direction) of the second strain sensor 500 can be sensed more accurately.

[0079] like Figure 5As shown, in some embodiments, the first capacitor structure 520 and the second capacitor structure 530 are respectively distributed on both sides of the flexible substrate 510 in the thickness direction. In some embodiments, the first capacitor structure 520 and the second capacitor structure 530 are symmetrically arranged along the flexible substrate 510 in the thickness direction, and the projection of the first capacitor structure 520 on the flexible substrate 510 and the projection of the second capacitor structure 530 on the flexible substrate 510 completely overlap. When the first capacitor structure 520 and the second capacitor structure 530 are symmetrically arranged about the flexible substrate 510 in the thickness direction, the two capacitor structures have the same response to some external interference (for example, the second strain sensor is stretched or compressed as a whole along a certain direction). At this time, according to the parameters related to the capacitance of the capacitor structure, the influence of the external interference on the second strain sensor 500 can be eliminated through the differential processing algorithm, thereby improving the sensitivity of determining the deformation of at least two degrees of freedom of the flexible substrate 510.

[0080] In some embodiments, the flexible substrate 510 includes a short axis direction and a long axis direction perpendicular to the thickness direction. Figure 5 The deformations in multiple degrees of freedom generated by the second strain sensor 500 (flexible substrate 510) shown in the figure include at least bending deformation around an axis parallel to the short axis direction and stretching or compressing deformation along the long axis direction. Figure 5 The X-axis direction is shown; the long axis direction can be Figure 5 The Y-axis direction is shown.

[0081] like Figure 5 As shown, when the second strain sensor 500 is bent and deformed around an axis parallel to the short axis direction (i.e., the X-axis direction), the first capacitor structure 520 and the second capacitor structure 530 will undergo tensile deformation and compressive deformation respectively. For example, the first capacitor structure 520 will be bent and elongated, and the second capacitor structure 530 will be bent and compressed. At this time, the capacitances of the first capacitor structure 520 and the second capacitor structure 530 will undergo opposite changes. In this case, the difference in capacitance between the first capacitor structure 520 and the second capacitor structure 530 can reflect the bending direction and degree of bending of the second strain sensor 500 around the axis parallel to the X-axis direction, and since the first capacitor structure 520 and the second capacitor structure 530 are stretched and compressed to substantially the same extent, the sum of their capacitances can remain substantially unchanged.

[0082] When the second strain sensor 500 is stretched or compressed along the long axis direction, the first capacitor structure 520 and the second capacitor structure 530 are stretched or compressed synchronously, and the capacitance of the first capacitor structure 520 and the second capacitor structure 530 changes synchronously. In this case, the difference between the capacitance of the first capacitor structure 520 and the second capacitor structure 530 remains substantially unchanged (or close to 0), and the sum of the two can reflect the degree of stretching or compression of the second strain sensor 500 along the long axis direction.

[0083] In some embodiments, by comparing the characteristics of the capacitance of the first capacitor structure 520 and the second capacitor structure 530 under the above two degrees of freedom, for example, the relationship between the sum (difference) of the capacitance and the deformation of the flexible substrate 510, the mutual interference between the deformations of the two degrees of freedom can be avoided, and the deformation of the flexible substrate 510 in the two degrees of freedom can be effectively distinguished. For example, when the second strain sensor 500 is stretched or compressed as a whole, the first capacitor structure 520 and the second capacitor structure 530 will be stretched or compressed synchronously, and the synchronous stretching or compression of the first capacitor structure 520 and the second capacitor structure 530 is regarded as common mode interference. At this time, differential processing of the signal (such as capacitance) can eliminate this common mode interference, so that the second strain sensor 500 is insensitive to its own stretching or compression deformation, and is only sensitive to the bending deformation around the axis parallel to the short axis direction (i.e., the X-axis direction), so that the second strain sensor 500 can accurately detect the bending deformation of this degree of freedom. That is, the difference between the capacitance of the first capacitor structure 520 and the second capacitor structure 530 mainly reflects the bending deformation of the flexible substrate 510 around an axis parallel to the short axis direction (i.e., the X-axis direction). Similarly, the sum of the capacitance of the first capacitor structure 520 and the second capacitor structure 530 mainly reflects the tensile or compressive deformation of the flexible substrate 510 along the long axis direction. More about the detection principle of the tensile or compressive deformation in the long axis direction is similar to the detection principle of the second strain sensor 500 having four capacitor structures. For details, please refer to FIG. 8A to FIG. 10 and its related description.

[0084] like Figure 6 As shown, in some embodiments, the flexible substrate 510 includes a long axis direction perpendicular to the thickness direction, the first capacitor structure 520 and the second capacitor structure 530 are distributed on the same side of the flexible substrate 510 in the thickness direction, and the first capacitor structure 520 and the second capacitor structure 530 are arranged side by side and both extend along the long axis direction of the flexible substrate 510.

[0085] In some embodiments, the first capacitor structure 520 and the second capacitor structure 530 are symmetrically arranged along a mid-section parallel to a plane formed by the thickness direction and the long axis direction, and the mid-section is located on the flexible substrate 510. When the first capacitor structure 520 and the second capacitor structure 530 are symmetrically arranged about the flexible substrate 510 on the mid-section, the two capacitor structures have the same response to partial external interference (for example, the second strain sensor 500 is stretched or compressed as a whole along a certain direction). At this time, the processing circuit 16 can eliminate the influence of external interference on the second strain sensor 500 through a differential processing algorithm based on the parameters related to the capacitance of the capacitor structure (for example, the first capacitor structure 520 and the second capacitor structure 530), thereby improving the sensitivity of determining the deformation of at least two degrees of freedom of the flexible substrate 510. For more information about the mid-section, please refer to Fig. 7A and Figure 7B and its related description.

[0086] In some embodiments, Figure 6 The degree of freedom deformation generated by the second strain sensor 500 (flexible substrate 510) shown includes at least bending deformation around an axis parallel to the thickness direction and tensile or compressive deformation along the long axis direction.

[0087] like Figure 6 As shown, when the second strain sensor 500 is bent and deformed along an axis parallel to the thickness direction (i.e., the Z-axis direction), the first capacitor structure 520 and the second capacitor structure 530 will undergo tensile deformation and compressive deformation respectively. For example, the first capacitor structure 520 will be bent and elongated, and the second capacitor structure 530 will be bent and compressed. At this time, the capacitances of the first capacitor structure 520 and the second capacitor structure 530 will undergo opposite changes. In this case, the difference in capacitance between the first capacitor structure 520 and the second capacitor structure 530 can reflect the bending direction and degree of bending of the second strain sensor 500 around the axis parallel to the Z-axis direction, and since the first capacitor structure 520 and the second capacitor structure 530 are stretched and compressed to substantially the same extent, the sum of their capacitances can remain substantially unchanged.

[0088] when Figure 6 When the second strain sensor 500 is stretched or compressed along the long axis, the first capacitor structure 520 and the second capacitor structure 530 are stretched or compressed synchronously, and the capacitance of the first capacitor structure 520 and the second capacitor structure 530 changes synchronously. In this case, the difference between the capacitance of the first capacitor structure 520 and the second capacitor structure 530 remains substantially unchanged (or close to 0), and the sum of the two can reflect the degree of stretching or compression of the second strain sensor 500 along the long axis.

[0089] In some embodiments, by comparing the characteristics of the capacitance of the first capacitor structure 520 and the second capacitor structure 530 under the above two degrees of freedom, for example, the relationship between the sum (difference) of the capacitance and the deformation of the flexible substrate 510, the mutual interference between the deformations of the two degrees of freedom can be avoided, and the deformation of the flexible substrate 510 in the two degrees of freedom can be effectively distinguished. For example, when the second strain sensor 500 is stretched or compressed as a whole, the first capacitor structure 520 and the second capacitor structure 530 will be stretched or compressed synchronously, and the synchronous stretching or compression of the first capacitor structure 520 and the second capacitor structure 530 is regarded as common mode interference. At this time, differential processing of the signal (such as capacitance) can eliminate this common mode interference, so that the second strain sensor 500 is insensitive to its own stretching or compression deformation, and is only sensitive to the bending deformation along the axis parallel to the thickness direction (i.e., the Z-axis direction), so that the second strain sensor 500 can accurately detect the bending deformation of this degree of freedom. That is, the difference between the capacitance of the first capacitor structure 520 and the second capacitor structure 530 mainly reflects the bending deformation of the flexible substrate 510 around an axis parallel to the thickness direction (i.e., the Z-axis direction). Similarly, the sum of the capacitance of the first capacitor structure 520 and the second capacitor structure 530 mainly reflects the tensile or compressive deformation of the flexible substrate 510 along the long axis direction. More about the detection principle of the tensile or compressive deformation in the long axis direction is similar to the detection principle of the second strain sensor 500 having four capacitor structures. For details, please refer to FIG. 8A to FIG. 10 and its related description.

[0090] Fig. 7A is a schematic diagram of the distribution of four capacitor structures on a flexible substrate according to some embodiments of this specification; Figure 7B is based on Fig. 7A A schematic diagram of the cross-sectional structure along the Y-axis is shown.

[0091] like Fig. 7A and Figure 7B As shown, in some embodiments, compared to Figure 6 The second strain sensor 500 further includes a third capacitor structure 540 and a fourth capacitor structure 550. The first capacitor structure 520 and the second capacitor structure 530 are arranged side by side on one side surface of the flexible substrate 510 along the thickness direction, and both extend along the long axis direction; the third capacitor structure 540 and the fourth capacitor structure 550 are arranged side by side on the other side surface of the flexible substrate 510 along the thickness direction, and both extend along the long axis direction.

[0092] In some embodiments, the processor reads capacitance-related parameters of the first capacitor structure 520 , the second capacitor structure 530 , the third capacitor structure 540 , and the fourth capacitor structure 550 , respectively, and determines deformation of the flexible substrate 510 in at least two degrees of freedom based on the parameters.

[0093] In some embodiments, Fig. 7A The degree of freedom deformation generated by the second strain sensor 500 (flexible substrate 510) shown in the figure includes at least bending deformation around an axis parallel to the thickness direction, bending deformation around an axis parallel to the short axis direction, and tensile or compressive deformation along the long axis direction of the flexible substrate 510. For the purpose of illustration, the following is combined with Fig. 8A , Figure 8B , Fig. 9 and Fig.10 The capacitance-related parameters of each capacitor structure under deformation with different degrees of freedom are described respectively.

[0094] In some embodiments, parameters related to capacitance include: C1, C2, C3, C4, Ctotal, dCx, dCz; and Ctotal = C1 + C2 + C3 + C4, dCx after composite differential operation = (C1 + C2) - (C3 + C4), dCz after composite differential operation = (C1 + C3) - (C2 + C4). Wherein, C1, C2, C3, C4 represent the capacitance of the first capacitor structure 520, the second capacitor structure 530, the third capacitor structure 540 and the fourth capacitor structure 550 respectively.

[0095] In some embodiments, the first capacitor structure 520 and the second capacitor structure 530 are symmetrically arranged about the first middle section S1, and the third capacitor structure 540 and the fourth capacitor structure 550 are symmetrically arranged about the first middle section S1. The first middle section S1 represents: a section parallel to the plane formed by the thickness direction and the long axis direction in the flexible substrate 510; the first capacitor structure 520 and the third capacitor structure 540 are symmetrically arranged about the second middle section S2 of the flexible substrate 510, and the second capacitor structure 530 and the fourth capacitor structure 550 are symmetrically arranged about the second middle section S2. The second middle section S2 represents: a mid-plane parallel to the plane formed by the long axis direction and the short axis direction in the flexible substrate 510.

[0096] By setting four symmetrical capacitor structures on the second strain sensor 500 and performing a composite differential operation, common mode interference can be effectively eliminated in the process of identifying the bending deformation of the sensor. As an example only, when the second strain sensor 500 is stretched or compressed as a whole, the first capacitor structure 520, the second capacitor structure 530, the third capacitor structure 540 and the fourth capacitor structure 550 will be stretched or compressed synchronously, and the stretching or compression of the four capacitor structures is regarded as common mode interference. The dCx and dCz obtained by setting four capacitor structures and performing composite differential processing on the signal remain unchanged, effectively eliminating this common mode interference, so that the flexible second strain sensor 500 is insensitive to its own stretching or compression deformation, and is only sensitive to its own bending deformation, thereby increasing the accuracy of the second strain sensor 500.

[0097] Fig. 8Ais a schematic diagram of a sensor without deformation according to some embodiments of this specification; Figure 8B is based on Fig. 8A The diagram shows the deformation of the sensor after being stretched or compressed along the long axis.

[0098] In some embodiments, when the first capacitor structure 520 , the second capacitor structure 530 , the third capacitor structure 540 and the fourth capacitor structure 550 are all capacitor structures, the second strain sensor 500 can identify tensile or compressive deformation along the long axis direction of the flexible substrate 11 according to parameters related to capacitance.

[0099] In some embodiments, Fig. 8A When the second strain sensor 500 shown is not deformed, the capacitance of the four capacitor structures can be obtained by the following formula (1). For the purpose of illustration only, the four capacitor structures of the second strain sensor 500 are considered to be completely consistent and symmetrical about the flexible substrate 510 (i.e., the first middle section S1 and the second middle section S2). Among them, ε0 represents the dielectric constant of vacuum; ε represents the relative dielectric constant of each of the four capacitor structures (i.e., the middle layer, see below); d represents the thickness of the dielectric layer of each of the four capacitor structures; A represents the area of ​​each of the four capacitor structures on the plane formed by the long axis direction and the short axis direction; L0 represents the initial length of each of the four capacitor structures in the long axis direction of the flexible substrate 510; w represents the width of each of the four capacitor structures in the short axis direction of the flexible substrate 510.

[0100] In some embodiments, Figure 8B As shown, when the second strain sensor 500 is stretched or compressed along the long axis direction (i.e., the Y axis direction), the initial length L0 of each of the four capacitor structures is stretched or compressed to Lx. Considering that the thickness of each of the four capacitor structures changes very little, for the convenience of explanation, it is approximately assumed that the thickness of each of the four capacitor structures remains unchanged. According to formula (1), the capacitance change of the four capacitor structures can be obtained as follows: formula (2).

[0101] At this time, Ctotal, dCx, and dCz are determined by the following formulas (3), (4), and (5), respectively. dCx= (C1+C2)-(C3+C4)=0 (4) dCz= (C1+C3)-(C2+C4)=0 (5)

[0102] When the second strain sensor 500 is stretched or compressed along the long axis, the four capacitor structures will be stretched or compressed synchronously, and the capacitance of the four capacitor structures will change synchronously. In this case, the sum of the capacitances of the four capacitor structures can reflect the degree of stretching or compression of the second strain sensor 500 (flexible substrate 510) along the long axis. According to formulas (2) and (3), Ctotal is only related to the length Lx after the capacitor structure changes, and Lx can be used to represent the stretching or compression deformation of the second strain sensor 500 along the long axis, so Ctotal can be used to reflect the stretching or compression deformation of the second strain sensor 500 (flexible substrate 510) along the long axis.

[0103] According to formula (4), dCx reflects the difference between the sum of the capacitance C1 of the first capacitance structure 520 and the capacitance C2 of the second capacitance structure 530 and the sum of the capacitance C3 of the third capacitance structure 540 and the capacitance C4 of the fourth capacitance structure 550. Figure 8B From the structural distribution of the four capacitor structures, it can be seen that the sum of the capacitance C1 of the first capacitor structure 520 and the capacitance C2 of the second capacitor structure 530, that is, C1+C2, can reflect the bending deformation of the upper side of the flexible substrate 510 in the thickness direction; the sum of the capacitance C3 of the third capacitor structure 540 and the capacitance C4 of the fourth capacitor structure 550, that is, C3+C4, can reflect the bending deformation of the lower side of the flexible substrate 510 in the thickness direction. Therefore, dCx is used to reflect the difference in bending deformation generated by the upper and lower sides (i.e., the upper and lower sides along the thickness direction) of the flexible substrate 510 when it is deformed, which is related to the bending deformation around the axis parallel to the short axis direction (i.e., the X-axis direction), while the deformation of stretching or compression along the long axis direction (i.e., the Y-axis direction) does not cause the deformation difference between the upper and lower sides of the flexible substrate 510, so dCx is a constant of 0.

[0104] Similarly, according to formula (5), dCz is used to reflect the difference in bending deformation generated on the two side surfaces along the short axis direction when the flexible substrate 510 is deformed. dCz is only related to the bending deformation around the axis parallel to the thickness direction (i.e., the Z-axis direction), and the deformation caused by stretching or compressing along the long axis direction (i.e., the Y-axis direction) will not cause the deformation difference between the two side surfaces of the flexible substrate 510 along the short axis direction, so dCz is also a constant 0.

[0105] In some embodiments, the output parameter Ctotal of the second strain sensor 500 stretched or compressed along the Y axis varies linearly in direct proportion to the stretched length or compressed length Lx, and has extremely high linearity, while dCz and dCx are both 0, and are not affected by the stretched length or compressed length Lx. Therefore, the second strain sensor 500 can identify the tensile or compressive deformation along the long axis direction of the flexible substrate 510 according to the parameter Ctotal related to capacitance.

[0106] Fig. 9 is based on Fig. 8A The sensor shown is a side view schematic diagram after being bent and deformed around an axis parallel to the short axis direction.

[0107] In some embodiments, when the first capacitor structure 520, the second capacitor structure 530, the third capacitor structure 540 and the fourth capacitor structure 550 are all capacitor structures, the second strain sensor 500 can identify the bending deformation along the flexible substrate 510 around an axis parallel to the short axis direction according to the parameter dCx related to the capacitance.

[0108] like Fig. 8A and Fig. 9 As shown, when the second strain sensor 500 is bent and deformed along an axis parallel to the short axis direction (i.e., the X-axis direction), for the convenience of explanation, it is approximately considered that the second strain sensor 500 after bending and deformation is a circular arc, the first capacitor structure 520 and the second capacitor structure 530 are bent and elongated to L1, and the third capacitor structure 540 and the fourth capacitor structure 550 are bent and compressed to L3. Considering that the thickness of each of the four capacitor structures changes very little, for the convenience of explanation, it is approximately considered that the thickness of each of the four capacitor structures remains unchanged. According to formula (1), it can be known that the capacitance C1 of the first capacitor structure 520 and the capacitance C2 of the second capacitor structure 530 change to the following formula (6), and the capacitance C3 of the third capacitor structure 540 and the capacitance C4 of the fourth capacitor structure 550 change to the following formula (7).

[0109] At this time, Ctotal, dCx, and dCz are determined by the following formulas (8), (9), and (10), respectively. dCz= (C1+C3)-(C2+C4)=0 (10) Wherein, R0 represents the radius of the arc of the bending deformation of the flexible substrate 510; R1 represents the radius of the arc of the bending deformation of the first capacitor structure 520 and the second capacitor structure 530; R2 represents the radius of the arc of the bending deformation of the third capacitor structure 540 and the fourth capacitor structure 550; t represents Fig. 8A The thickness of the second strain sensor 500 is shown; L1 represents the length of the arc of the first capacitor structure 520 and the second capacitor structure 530 bending and deforming; L3 represents the length of the arc of the third capacitor structure 540 and the fourth capacitor structure 550 bending and deforming.

[0110] When the second strain sensor 500 is bent and deformed along an axis parallel to the short axis direction, for example, the first capacitor structure 520 and the second capacitor structure 530 are bent and stretched, and the third capacitor structure 540 and the fourth capacitor structure 550 are bent and compressed. At this time, the sum of the capacitance C1 of the first capacitor structure 520 and the capacitance C2 of the second capacitor structure 530, i.e., C1+C2, and the sum of the capacitance C3 of the third capacitor structure 540 and the capacitance C4 of the fourth capacitor structure 550, i.e., C3+C4, have an opposite change relationship. At this time, Ctotal obtained by adding the capacitances of the four capacitor structures can offset the change trends of C1+C2 and C3+C4, that is, Ctotal is the constant shown in formula (8) at this time, and Ctotal cannot be used to reflect the bending deformation of the second strain sensor 500 along the axis parallel to the short axis direction.

[0111] In some embodiments, the output parameter dCx of the second strain sensor 500 after bending deformation around an axis parallel to the minor axis direction (i.e., the X-axis direction) varies linearly in direct proportion to the bending angle β, and has extremely high linearity, while dCz and Ctotal are both constants and are not affected by the bending angle β. Therefore, the second strain sensor 500 can identify bending deformation along an axis parallel to the minor axis direction based on the parameter dCx related to capacitance.

[0112] It should be noted that, in addition to the case of the four capacitor structures described above, the second strain sensor 500 may have three or more capacitor structures distributed on the two side surfaces of the flexible substrate 510 along the thickness direction, and all extend along the long axis direction. As long as the deformations of different dimensions can be characterized by the capacitance-related parameters of these capacitor structures, deformations of multiple dimensions can be identified. As an example only, there are three capacitor structures on the second strain sensor 500, two of which are distributed on the upper side of the flexible substrate, and the other is distributed on the lower side of the flexible substrate. At this time, the capacitance-related parameters of the three capacitor structures are also related to the bending deformation around the X-axis (or Z-axis). At this time, the bending deformation of the second strain sensor 500 around the X-axis (or Z-axis) can also be calculated by combining the capacitance-related parameters generated by the three sensor structures.

[0113] Fig.10 is based on Fig. 8A The sensor shown is a top view schematic diagram after being bent and deformed around an axis parallel to the thickness direction.

[0114] In some embodiments, when the first capacitor structure 520, the second capacitor structure 530, the third capacitor structure 540 and the fourth capacitor structure 550 are all capacitor structures, the second strain sensor 500 can identify the bending deformation along the flexible substrate 510 around an axis parallel to the thickness direction according to the parameter dCz related to the capacitance.

[0115] like Fig. 8A and Fig.10 As shown, when the second strain sensor 500 is bent and deformed along an axis parallel to the thickness direction (i.e., the Z-axis direction), for the convenience of description, it is approximately considered that the second strain sensor 500 after bending and deformation can be an arc, and the first capacitor structure 520 and the third capacitor structure 540 ( Fig.10 ) is bent and elongated to L4, the second capacitor structure 530 and the fourth capacitor structure 550 ( Fig.10 (not shown) is bent and compressed to L2. Considering that the thickness of each of the four capacitor structures changes very little, for the convenience of explanation, it is approximately assumed that the thickness of each of the four capacitor structures remains unchanged. According to formula (1), the capacitance C1 of the first capacitor structure 520 and the capacitance C3 of the third capacitor structure 540 are changed to the following formula (11), and the capacitance C2 of the second capacitor structure 530 and the capacitance C4 of the fourth capacitor structure 550 are changed to the following formula (12).

[0116] At this time, Ctotal, dCx, and dCz are determined by the following formulas (13), (14), and (15), respectively. dCx= (C1+C2)-(C3+C4)=0 (14) Among them, r0 represents the radius of the arc of the bending deformation of the flexible substrate 510; r1 represents the radius of the arc of the bending deformation of the first capacitor structure 520 and the third capacitor structure 540; r2 represents the radius of the arc of the bending deformation of the second capacitor structure 530 and the fourth capacitor structure 550; L2 represents the length of the arc of the bending deformation of the first capacitor structure 520 and the third capacitor structure 540; L4 represents the length of the arc of the bending deformation of the second capacitor structure 530 and the fourth capacitor structure 550.

[0117] In some embodiments, the output parameter dCz of the second strain sensor 500 after bending deformation around an axis parallel to the thickness direction (i.e., the Z-axis direction) varies linearly in direct proportion to the bending angle α, and has extremely high linearity, while dCx and Ctotal are both constants and are not affected by the bending angle α. Therefore, the second strain sensor 500 can identify bending deformation along an axis parallel to the thickness direction based on the parameter dCz related to capacitance.

[0118] In some embodiments, when the first capacitor structure 520, the second capacitor structure 530, the third capacitor structure 540 and the fourth capacitor structure 550 are all resistor structures, the processor can determine the deformation of the flexible substrate 510 in at least two dimensions according to the parameter resistance related to the four capacitor structures. For example, the resistances of the four capacitor structures are: R1 = R2 = R3 = R4 = ρ A d , the area of ​​each capacitor structure after the deformation of the second strain sensor 500 is substituted therein and a differential operation is performed, and a result similar to the parameters related to the capacitance can be obtained, so that the processor can determine the bending deformation of the second strain sensor 500 around the axis parallel to the thickness direction, the bending deformation around the axis parallel to the short axis direction, and the tensile or compressive deformation along the long axis direction of the flexible substrate. Wherein, ρ represents the resistivity of each of the four capacitor structures (i.e., the middle layer, see below).

[0119] In some embodiments, the processor can identify a composite deformation in which deformations of any dimension simultaneously exist among the bending deformation of the second strain sensor 500 about an axis parallel to the thickness direction, the bending deformation about an axis parallel to the short axis direction, and the tensile or compressive deformation along the long axis direction of the flexible substrate 510. For example, the processor can simultaneously calculate the changes in the parameters Ctotal, dCx, and dCz related to the capacitance, thereby simultaneously restoring the components of the deformations of different dimensions to restore the actual bending deformation of the second strain sensor 500.

[0120] Therefore, the embodiments of the present specification can measure deformations in multiple degrees of freedom (for example, including three dimensions of bending around the X-axis, bending around the Z-axis, and stretching along the Y-axis) through a single sensor, thereby realizing the detection of motion information in multiple dimensions, which is beneficial for simplifying the preparation process and miniaturization design while improving the detection accuracy.

[0121] Fig.11 is a schematic cross-sectional view of a second strain sensor according to some embodiments of the present specification.

[0122] like Fig.11As shown, in some embodiments, each capacitor structure includes a second conductive layer, an intermediate layer, and a first conductive layer stacked sequentially away from the flexible substrate 510 in the thickness direction. For example, the first capacitor structure 520 includes a second conductive layer 522, intermediate layers 52-53, and a first conductive layer 521 stacked sequentially away from the flexible substrate 510; the second capacitor structure 530 includes a second conductive layer 532, intermediate layers 52-53, and a first conductive layer 531 stacked sequentially away from the flexible substrate 510; the third capacitor structure 540 includes a second conductive layer 542, intermediate layers 54-55, and a first conductive layer 541 stacked sequentially away from the flexible substrate 510; the fourth capacitor structure 550 includes a second conductive layer 552, intermediate layers 54-55, and a first conductive layer 551 stacked sequentially away from the flexible substrate 510. In some embodiments, the intermediate layer is between the first conductive layer and the second conductive layer.

[0123] In some embodiments, the first conductive layer and the second conductive layer of each capacitor structure include an elastic conductive material, which can make the first conductive layer and the second conductive layer conductive and can return to their original shape when the external force disappears. In some embodiments, the elastic conductive material includes but is not limited to conductive film, conductive ink, conductive polymer material, conductive gel, liquid metal, etc. In some embodiments, the first conductive layer and the second conductive layer include conductive film, which is made by mixing conductive particles with polymer materials. In some embodiments, polymer materials include but are not limited to silicone, rubber or resin, etc. In some embodiments, the first conductive layer and the second conductive layer include conductive ink, which is made by mixing conductive particles with ink materials, and the conductive ink can be prepared by printing to obtain a conductive pattern. In some embodiments, the first conductive layer and the second conductive layer include conductive polymer materials, conductive gel, liquid metal, etc. In some embodiments, conductive polymer materials include but are not limited to polypyrrole, poly (3,4-ethylenedioxythiophene) - polystyrene sulfonate (PEDOT:PSS, Poly (3,4-ethylenedioxythiophene) polystyrene sulfonate), etc.

[0124] In some embodiments, the elastic conductive material includes an elastic material filled with conductive particles, and the conductivity of the first conductive layer and the second conductive layer can be adjusted by filling the conductive particles in the elastic material. In some embodiments, the elastic material includes silicone, rubber, resin, polydimethylsiloxane (PDMS), polyurethane, styrene-butadiene-styrene (SBS), etc. In some embodiments, the conductive particles include metal powder and carbon powder, carbon nanotubes, silver nanowires, carbon black, graphite powder, graphene, etc.

[0125] In some embodiments, the middle layer includes an elastic insulating material, and each capacitor structure is a capacitor structure. For example, the elastic insulating material includes silicone, rubber, polydimethylsiloxane (PDMS), thermoplastic polyurethane (TPU), etc. In some embodiments, the middle layer includes a high-resistance elastic material, and the resistivity of the middle layer is more than 1000 times greater than the resistivity of the first conductive layer and the second conductive layer. In this case, each capacitor structure is a capacitor-resistor composite capacitor structure.

[0126] In some embodiments, the thickness of the first conductive layer and the second conductive layer of each capacitor structure is in the range of 1 to 100 um. In some embodiments, the width of the first conductive layer and the second conductive layer of each capacitor structure is in the range of 0.5 to 10 mm. In some embodiments, the interval between the first conductive layer 521 of the first capacitor structure 520 and the first conductive layer 531 of the second capacitor structure 530 is in the range of 0.02 to 2 mm. In some embodiments, the interval between the second conductive layer 522 of the first capacitor structure 520 and the second conductive layer 532 of the second capacitor structure 530 is in the range of 0.02 to 2 mm. In some embodiments, the interval between the first conductive layer 541 of the third capacitor structure 540 and the first conductive layer 551 of the fourth capacitor structure 550 is in the range of 0.02 to 2 mm. In some embodiments, the interval between the second conductive layer 542 of the third capacitor structure 540 and the second conductive layer 552 of the fourth capacitor structure 550 is in the range of 0.02 to 2 mm.

[0127] In some embodiments, the conductivity of the first conductive layer is greater than the conductivity of the intermediate layer.

[0128] Conductivity is a parameter used to describe the ease of charge flow in a substance. Since the conductivity of the first conductive layer is greater than that of the second conductive layer, the first conductive layer has better conductivity. Therefore, the resistance of the first conductive layer is less than that of the second conductive layer. It should be noted that in this specification, the resistance of a certain component refers to the resistance between two surfaces of the component spaced along the thickness direction of the flexible substrate 510. The resistance of the first conductive layer refers to the resistance between two surfaces of the first conductive layer spaced along the thickness direction of the flexible substrate 510, and the resistance of the second conductive layer may refer to the resistance between two surfaces of the second conductive layer spaced along the thickness direction of the flexible substrate 510. In some embodiments, the conductivity of the first conductive layer may be more than 100 times that of the second conductive layer. In some embodiments, by setting the density of the conductive particles filled in the elastic material of the first conductive layer to be greater than the density of the conductive particles filled in the elastic material of the second conductive layer, the conductivity of the first conductive layer can be greater than that of the second conductive layer.

[0129] When the capacitor structure (e.g., the first capacitor structure 520, the second capacitor structure 530, the third capacitor structure 540, and the fourth capacitor structure 550) is a capacitor-resistance composite capacitor structure or a single capacitor structure, the resistance between the two surfaces of the intermediate layer spaced along the thickness direction of the flexible substrate 510 should not be too small, so as to facilitate the subsequent measurement of the resistance and the analysis of the change in resistance. In some embodiments, the resistance between the two surfaces of the intermediate layer spaced along the thickness direction of the flexible substrate 510 is greater than 0.8 MΩ. For example, when the capacitor structure (e.g., the first capacitor structure 520, the second capacitor structure 530, the third capacitor structure 540, and the fourth capacitor structure 550) is a capacitor-resistance composite capacitor structure, the resistance between the two surfaces of the intermediate layer spaced along the thickness direction of the flexible substrate 510 may also be 0.8 MΩ to 550 GΩ. For another example, when the capacitor structure (e.g., the first capacitor structure 520, the second capacitor structure 530, the third capacitor structure 540, and the fourth capacitor structure 550) is a single capacitor structure, the resistance between the two surfaces of the intermediate layer spaced apart along the thickness direction of the flexible substrate 510 can be larger, for example, the resistance can be greater than 550 GΩ.

[0130] By setting the resistance between the two surfaces of the intermediate layer along the thickness direction of the flexible substrate 510 to be greater than 0.8 MΩ, the intermediate layer can be made conductive while having a sufficiently large resistance, thereby ensuring the measurement of the resistance of the intermediate layer and the analysis of the change in resistance, which can accurately reflect the bending condition of the second strain sensor 500.

[0131] In some embodiments, the relative dielectric constant of the intermediate layer is greater than 2. The relative dielectric constant is a physical parameter that characterizes the dielectric properties or polarization properties of a dielectric material, and its value is equal to the ratio of the capacitance of a capacitor of the same size made with the corresponding material as the medium to the capacitance of a capacitor of the same size made with a vacuum as the medium. The value of the relative dielectric constant is also a characterization of the material's ability to store electricity, also known as relative permittivity. A substance with a relative dielectric constant greater than 2 is a polar substance, that is, an intermediate layer with a relative dielectric constant greater than 2 has a certain ability to store electricity. Therefore, the intermediate layer can be equivalent to a parallel combination of a resistor element and a capacitor element.

[0132] In some embodiments, the relative dielectric constant of the intermediate layer may also be greater than or equal to 4. Preferably, the relative dielectric constant of the intermediate layer is greater than 5. In some embodiments, the relative dielectric constant of the intermediate layer is greater than 10.

[0133] The relative dielectric constant of the middle layer is set to be greater than 2, so that the middle layer can be both a resistor and a capacitor. During the bending process of the second strain sensor 500, the capacitance and resistance of the middle layer will change with the deformation of the flexible substrate 510. Therefore, the parameters related to the capacitance and resistance of the middle layer can reflect the bending of the second strain sensor 500. In this embodiment, the capacitance and resistance exist at the same time to reflect the bending of the second strain sensor 500, which can significantly improve the sensitivity and accuracy of the second strain sensor 500.

[0134] In addition, by setting the resistance between the two surfaces of the intermediate layer along the thickness direction of the flexible substrate 510 to be greater than 0.8 MΩ, it can also be ensured that the intermediate layer can exhibit both better resistance performance and better capacitance performance, thereby ensuring the sensitivity and accuracy of the second strain sensor 500.

[0135] In some embodiments, two capacitor structures on the same side surface of the flexible substrate 510 may share a first conductive layer, and the second conductive layers of the two capacitor structures are spaced apart along the short axis direction of the flexible substrate 510. In some embodiments, more conductive layers (such as a third conductive layer, etc.) may be provided in a stacked manner along the thickness direction of each inductive structure, which can effectively improve the sensitivity of the sensor 500 in detecting deformations of each degree of freedom. For example, each capacitor structure includes a second conductive layer, a second intermediate layer, a third conductive layer, a first intermediate layer, and a first conductive layer stacked sequentially away from the flexible substrate 510 along the thickness direction. Among them, the parameters of the third conductive layer, the first conductive layer, and the second conductive layer are consistent; the parameters of the second intermediate layer, the first intermediate layer, and the intermediate layer described above are consistent.

[0136] In some embodiments, the glove system 400 can collect the movement of the wrist joint. Figure 3 In the three-dimensional coordinate system shown, the wrist joint (for example, Figure 2AThe wrist joint 230) shown in the figure has three degrees of freedom: bending, swinging, and rotation. The bending and swinging of the wrist joint are controlled by the wrist joint, which can cause deformation of the wrist joint. The rotation of the wrist joint is controlled by the rotation of the user's forearm, which causes the overall rotation of the wrist joint.

[0137] In some embodiments, in order to collect the movement of the wrist joint in three degrees of freedom, the glove system 400 also includes two inertial sensors, and the two inertial sensors are arranged on the glove body 410, corresponding to the two side areas of the wrist joint. The processor 440 is configured to receive and process the data collected by the inertial sensors. In some embodiments, the two inertial sensors are located on both sides of the wrist joint in the direction of arm extension, that is, the front and back sides of the wrist joint, the front side of the wrist joint refers to the side facing the back of the hand, and the back side of the wrist joint refers to the side facing the forearm. For ease of understanding, the two sides of the wrist joint can be understood as the hand area or forearm area that is close to the wrist joint in two directions but basically does not deform with the deformation of the wrist joint. For example, the glove system 400 includes a first inertial sensor 451 and a second inertial sensor 452, and the first inertial sensor 451 and the second inertial sensor 452 are respectively located on the glove body 410 corresponding to Figure 2B The hand positions 14 and 15 are shown. The two inertial sensors can respectively collect the position information of both sides of the wrist joint, so as to identify the movement of the wrist joint in three degrees of freedom: rotation, bending and swinging.

[0138] In some embodiments, in order to collect the movement of the wrist joint in three degrees of freedom, the glove system 400 may include an inertial sensor and a third strain sensor. The inertial sensor and the third strain sensor cooperate to collect the movement of the wrist joint. In some embodiments, the third strain sensor may include a multi-degree-of-freedom sensor, which can be used to collect the deformation of the wrist joint in multiple degrees of freedom. As an example only, the third strain sensor may be a sensor that is the same or similar to the second strain sensor, and can collect the deformation of the wrist joint in two or more degrees of freedom. Figure 4 As shown, the inertial sensor and the third strain sensor 460 are arranged on the glove body 410, and the third strain sensor 460 is located at the wrist joint, that is, corresponding to the glove body 410 corresponding to the third strain sensor 460. Figure 2B The inertial sensor is located in an area outside the wrist joint, such as the front or back side of the wrist joint as described above. In some embodiments, the inertial sensor can be located on either side of the wrist joint in the direction of arm extension. For example, the inertial sensor is located on the glove body 410 corresponding to Figure 2B The hand position 14 or 15 shown, that is, the inertial sensor is Figure 4 The first inertial sensor 451 or the second inertial sensor 452 is shown. The processor 440 is configured to receive and process data collected by the inertial sensor and the third strain sensor.

[0139] By using two inertial sensors or combining an inertial sensor with a strain sensor, motion acquisition of multiple degrees of freedom of the wrist joint can be achieved. Users can flexibly choose a combination of different sensor types to achieve motion acquisition of multiple degrees of freedom according to different application scenarios.

[0140] Continue to see Figure 4 In some embodiments, the glove body 410 includes fabric wrapped around each finger and palm of the user, and fabric located between adjacent fingers. The fabric between adjacent fingers can realize the connection between the roots of adjacent fingers (near the metacarpophalangeal joints), which may cause the fabrics at the roots of the fingers to pull each other, thereby causing the data collected by the second strain sensors at the adjacent metacarpophalangeal joints to interfere with each other. In order to reduce the above interference, a structure that reduces or avoids pulling between the fabrics on adjacent fingers can be provided between the fabrics of adjacent fingers, so that the elastic modulus of the fabric between adjacent fingers is less than the elastic modulus of the fabric on each finger.

[0141] By providing a structure between the fabrics of adjacent fingers to reduce or avoid pulling between the fabrics at the bases of adjacent fingers when the fingers move, the elastic modulus of the fabric between adjacent fingers is made smaller than the elastic modulus of the fabric on each finger, thereby reducing mutual interference between the second strain sensors at the bases of different fingers, ensuring that the data collected by each second strain sensor can accurately reflect the joint deformation at the corresponding position.

[0142] In some embodiments, the structure for reducing the pulling between the fabrics on adjacent fingers includes at least one of a slit structure, an elastic fabric structure, or a pleated structure. That is, the fabric between adjacent fingers may have at least one of a slit structure, an elastic fabric structure, or a pleated structure. Figure 4 As shown, the slit structure 470 refers to a slit provided in the glove fabric between the second strain sensors. The slit may be in any shape, such as a rhombus, a rectangle, etc. In some embodiments, the elasticity of the elastic fabric is greater than the elasticity of the fabric in other regions of the glove body. In some embodiments, the elastic fabric structure or the pleated structure refers to the elastic fabric provided at the glove fabric between the second strain sensors, or the fabric with pleats, which can avoid damaging the overall aesthetics of the glove body fabric. In some embodiments, in order to further buffer the pulling between the fabrics on adjacent fingers, the slit structure, the elastic fabric structure or the pleated structure extends along the length direction of the fingers. In some embodiments, the pleated structure includes a plurality of pleats, and the plurality of pleats are arranged along the direction between adjacent fingers. In some embodiments, the elastic fabric structure or the pleated structure may exist simultaneously with the slit structure 470 and be filled in the slit structure 470, while maintaining the integrity of the glove body fabric, reducing the pulling between the fabrics at the base of adjacent fingers as much as possible.

[0143] In some embodiments, the processor is integrated into the glove body. For example, the processor can be located in the corresponding palm portion. Figure 4 As shown, the processor 440 can be located at the corresponding back of the hand. The processor can read data related to multiple first strain sensors, multiple second strain sensors, inertial sensors and third strain sensors, and the user's gesture can be determined based on the data. For example, a function or machine learning is used to construct the relationship between data and finger shape. Specifically, the original data set of sensor data and joint angles is obtained, and a function is constructed based on the data set, or a machine learning model is trained. Thereby, the mapping between sensor data and joint angles (or the mapping between sensor data and gestures) is achieved. After determining the user's gesture, it can be used in various application scenarios such as sign language learning applications (action reproduction), deaf-mute voice, gesture control methods, etc.

[0144] In some embodiments, after determining the user gesture, the processor may output a gesture representation corresponding to the user's gesture on the display interface, and output feedback information based on the distance between the gesture representation and the preset gesture. The display interface is provided by an external device, such as a mobile phone screen or a computer screen. The feedback information may include the comparison result between the user's gesture representation and the preset gesture. The distance between the gesture representation and the preset gesture may reflect the degree of similarity between the user gesture and the preset gesture. The closer the distance, the higher the similarity between the user gesture and the preset gesture. In some embodiments, the distance may be obtained by first mapping the gesture representation with the preset gesture, and further calculating the distance between the gesture representation and the corresponding point on the preset gesture. The feedback information may be used to remind the user whether his gesture is the same as the preset gesture or the similarity between his gesture and the preset gesture. For example, the feedback information may be the similarity between the gesture representation and the preset gesture expressed as a percentage. The processing flow of the processor outputting feedback information based on the user's gesture and the distance between the gesture and the preset gesture may be applied to a variety of application scenarios, for example, Fig.12 The gesture game application scenario shown, for example, Fig.13 The application scenario of sign language learning is shown.

[0145] Fig.12 is a processing flow chart of a processor according to some embodiments of the present specification.

[0146] like Fig.12 As shown, in some embodiments, in a gesture game application scenario, the processing flow 12 of the processor includes the following steps.

[0147] 121. Play the sample animation.

[0148] In some embodiments, the processor controls the display interface to display or play an animation containing an exemplary gesture. The exemplary gesture is used to guide the user to make a gesture. In some embodiments, the processing flow of playing the exemplary animation can be triggered after the user wears the glove body, or it can be triggered by the user himself.

[0149] 122. Glove data calibration.

[0150] In some embodiments, the user wears the glove body and makes gestures following the exemplary gestures to perform data calibration of the glove system. The data calibration of the glove system includes calibration of the deviation between the position of the strain sensor on the glove body and the corresponding joint position caused by wearing. Optionally, the example animation in step 121 may include a gesture of a specific posture. When the user wears the glove body and imitates the gesture of the specific posture, the processor can calibrate the data in the standard database with the data collected at this time, so that the calibrated data can more accurately reflect the finger posture of the user. In some embodiments, step 122 is not necessary, or can be performed before step 121.

[0151] 123. Collect player gestures.

[0152] In some embodiments, when a player wears gloves and makes gestures, the strain sensors on the gloves corresponding to the user's hand joints can generate strain data, thereby enabling the collection of the player's gestures.

[0153] 124. Recognize gestures based on sensor data.

[0154] In some embodiments, the processor can restore the user's gestures based on the strain data of the strain sensors on the glove corresponding to each of the user's hand joints. In some embodiments, the user can make multiple gestures in sequence, and the processor can continuously recognize the user's multiple gestures based on the sensor data and store the user's gestures in sequence.

[0155] 125. Pass if the whole set of actions can be reproduced.

[0156] In some embodiments, the processor may compare the stored multiple gestures of the user with multiple preset gestures in sequence, determine the distance between the multiple gesture representations and the multiple preset gestures, and output feedback information. If the distance between the multiple gesture representations and the multiple preset gestures is less than a preset threshold, it means that the full set of actions are reproduced, and the output feedback information is passed and triggers the next game process. The distance between the multiple gesture representations and the multiple preset gestures can reflect the average similarity between the user's multiple gestures and the corresponding multiple preset gestures. The smaller the distance, the higher the average similarity between the multiple gestures and the one-to-one corresponding multiple preset gestures. The preset threshold may correspond to, for example, an average degree of fit between the multiple gesture representations and the multiple preset gestures of 70%.

[0157] 126. If the action is not reproduced, restart the game.

[0158] In some embodiments, the processor may compare the stored multiple gestures of the user with multiple preset gestures in order, determine the distance between the multiple gesture representations and the multiple preset gestures, and output feedback information. If the distance between the multiple gesture representations and the multiple preset gestures is greater than a preset threshold (for example, corresponding to a 70% match between the multiple gesture representations and the multiple preset gestures), it means that the full set of actions is not reproduced, and the output feedback information is a gesture error.

[0159] 127. Replay the player’s gesture process and play special effect animation.

[0160] In some embodiments, the processor can control the display interface to display the gesture representations corresponding to the user's gestures in sequence. In some embodiments, when the user achieves a full set of action reproduction, the processor can replay the player's gesture process and can also play special effect animations.

[0161] Fig.13 is a processing flow chart of a processor according to some other embodiments of the present specification.

[0162] like Fig.13 As shown, in some embodiments, in a sign language learning application scenario, the processing flow 13 of the processor includes the following steps.

[0163] 131. Glove data calibration.

[0164] In some embodiments, the data calibration of the glove system includes calibrating the deviation between the position of the strain sensor on the glove body and the corresponding joint position caused by wearing. In some embodiments, the user wears the glove body and can make gestures following the gestures included in the calibration process displayed on the display interface to perform data calibration of the glove system.

[0165] 132. Play sample sign language.

[0166] In some embodiments, the processor controls the display interface to display or play sample sign language. The sample sign language is used to show the user standard sign language gestures, thereby guiding the user to learn sign language. In some embodiments, the processing flow of playing the sample sign language can be automatically triggered after the glove data is calibrated, or it can be triggered by the user.

[0167] 133. Collect user gestures.

[0168] In some embodiments, when a user puts on gloves and makes gestures, the strain sensors on the gloves corresponding to the user's hand joints can generate strain data, thereby enabling the collection of the player's gestures.

[0169] 134. Recognize gestures based on sensor data.

[0170] In some embodiments, the processor can restore the user's gestures based on the strain data of the strain sensors on the gloves corresponding to the user's hand joints. In some embodiments, the processor can display the restored user gestures on the display interface in the form of gesture representations.

[0171] 135. When the action is repeated, the corresponding audio is played.

[0172] In some embodiments, the processor may compare the gesture representation with the example sign language, determine the distance between the gesture representation and the example sign language, and output feedback information. If the distance between the gesture representation and the example sign language is less than a preset threshold (for example, corresponding to a 70% match between the gesture representation and the example sign language), the action is reproduced, and the output feedback information is to end the training process and play the corresponding audio (for example, congratulations on passing the training).

[0173] 136. If the action is not reproduced, retrain.

[0174] In some embodiments, the processor may compare the gesture representation with the example sign language, determine the distance between the gesture representation and the example sign language, and output feedback information. If the distance between the gesture representation and the example sign language is greater than a preset threshold (for example, corresponding to a 70% match between the gesture representation and the example sign language), the action is not reproduced, and the feedback information output is to restart the training process.

[0175] 137. After a period of time, assess the learned movements.

[0176] In some embodiments, the processor may mark the preset gesture (i.e., sample sign language) reproduced by the user and redisplay it after a period of time. For example, the processor may automatically re-execute the training process for the preset gesture reproduced or restored by the user according to the user's instructions or after a period of time to achieve repeated assessment.

[0177] In some embodiments, after determining the user gesture, the processor can read the mapping relationship between the gesture and the voice data packet, and then play the voice information based on the user gesture and the mapping relationship. The mapping relationship between the gesture and the voice data packet can be pre-built and stored in a database, or provided by a third party. The processor plays the voice information according to the user gesture and the mapping relationship, which can be applied to a variety of application scenarios, for example, Fig.14 The application scenario shown is for assisting the deaf-mute to speak.

[0178] Fig.14 is a processing flow chart of a processor according to some embodiments of the present specification.

[0179] like Fig.14As shown, in some embodiments, in an application scenario of assisting the deaf-mute to speak, the processing flow 14 of the processor includes the following steps.

[0180] 141. Glove data calibration.

[0181] In some embodiments, the data calibration of the glove system includes calibrating the deviation between the position of the strain sensor on the glove body and the corresponding joint position caused by wearing. In some embodiments, the user wears the glove body and can make gestures following the gestures included in the calibration process displayed on the display interface to perform data calibration of the glove system.

[0182] 142. Recognize gestures based on sensor data.

[0183] In some embodiments, when a user wears gloves and makes a sign language gesture, the strain sensors on the gloves corresponding to the user's hand joints can generate strain data, and the processor can restore the user's gestures based on the strain data of the strain sensors on the gloves corresponding to the user's hand joints. In some embodiments, the user can make multiple gestures in succession to express a complete sentence. The processor can continuously recognize multiple gestures of the user based on the sensor data and store the user's gestures in order.

[0184] 143. The loudspeaker plays the sound corresponding to the sign language.

[0185] In some embodiments, the processor recognizes a user gesture and controls the speaker to play voice information corresponding to the user gesture. The speaker may be provided by an external device. In some embodiments, the processor may recognize a user gesture and determine the distance between the user gesture and a preset gesture. For example, if the distance between the user gesture and the preset gesture is less than a preset threshold (for example, the degree of consistency between the corresponding multiple gesture representations and the multiple preset gestures is 70%), the voice information is controlled to be played; if the distance between the user gesture and the multiple preset gestures is greater than a preset threshold (for example, the degree of consistency between the corresponding multiple gesture representations and the multiple preset gestures is 70%), the voice information is not played, and the user is prompted to re-enter the gesture.

[0186] Fig.15 is a processing flow chart of a processor according to some embodiments of the present specification.

[0187] In some embodiments, after determining the user gesture, the processor can read the mapping relationship between the gesture and the execution instruction, and then execute the instruction based on the user gesture and the mapping relationship. The mapping relationship between the gesture and the execution instruction can be pre-built and stored in a database, or provided by a third party. The processor executes the instruction according to the user gesture and the mapping relationship, which can be applied to a variety of application scenarios, for example, Fig.15 The application scenario of gesture control shown.

[0188] Fig.15 is a processing flow chart of a processor according to some embodiments of the present specification.

[0189] like Fig.15 As shown, in some embodiments, in an application scenario of gesture control, the processing flow 15 of the processor includes the following steps.

[0190] 151. Predefined operation gestures.

[0191] In some embodiments, the operation gesture can be predefined by the user, that is, the mapping relationship between the gesture and the execution instruction can be predefined by the user. In some embodiments, the user can pre-set the mapping relationship between the gesture and the corresponding execution instruction of the external device (such as a game console, an Internet of Things device). For example, the user can define a mapping relationship between a five-finger gesture and an external device to execute a screenshot instruction. For example, the user can define a mapping relationship between a five-finger gesture and an external device to execute a play instruction. For another example, the user can define a V-shaped gesture composed of the index finger and the middle finger to establish a mapping relationship with an external device to execute a photo taking instruction.

[0192] 152. Glove data calibration.

[0193] In some embodiments, the data calibration of the glove system includes calibrating the deviation between the position of the strain sensor on the glove body and the corresponding joint position caused by wearing. In some embodiments, the data of the glove system can be calibrated from time to time. The user wears the glove body and can make gestures following the gestures included in the calibration process displayed on the display interface to calibrate the data of the glove system.

[0194] 153. Collect user gestures.

[0195] In some embodiments, when a user puts on gloves and makes gestures, the strain sensors on the gloves corresponding to the user's hand joints can generate strain data, thereby enabling the collection of the player's gestures.

[0196] 154. Recognize gestures based on sensor data.

[0197] In some embodiments, the processor can restore the user's gestures based on the strain data of the strain sensors on the gloves corresponding to the user's hand joints. In some embodiments, the processor can display the restored user gestures on the display interface in the form of gesture representations.

[0198] 155. Execute instructions based on gestures.

[0199] In some embodiments, the processor recognizes user gestures and controls the external device to execute the instruction corresponding to the user gesture according to the mapping relationship between the user's predefined operation gesture and the execution instruction. For example, the user can input a gesture of five fingers together to control the external device to execute a screenshot instruction. For example, the user can input a gesture of five fingers spread out to control the external device to execute a play instruction. For another example, the user can input a V-shaped gesture of the index finger and middle finger to control the external device to execute a photo taking instruction.

[0200] Fig.16 It is a flow chart of a method for gesture reproduction according to some embodiments of this specification.

[0201] like Fig.16 As shown, in some embodiments, the gesture replication method 16 includes the following steps.

[0202] 161. Obtain sensor data from the user's hand based on the glove system.

[0203] In some embodiments, the glove system includes a glove body and a plurality of first strain sensors and a plurality of second strain sensors arranged on the glove body, when the user wears the glove body, each of the plurality of first strain sensors is located at an interphalangeal joint of the user, and is configured to measure the deformation of the interphalangeal joint in a single degree of freedom. Each of the plurality of second strain sensors is located at a metacarpophalangeal joint, and is configured to measure the deformation of the metacarpophalangeal joint in two degrees of freedom, and both the single degree of freedom and the two degrees of freedom include a degree of freedom corresponding to finger bending.

[0204] In some embodiments, the first strain sensor includes a single degree of freedom sensor, such as a single axis sensor (such as an inductive, resistive bending sensor or a capacitive stretching sensor). In some embodiments, the second strain sensor includes a multi-degree of freedom sensor, such as a multi-axis sensor (such as a capacitive multi-axis motion sensor). The deformation of the interphalangeal joint corresponds to the one degree of freedom of bending. The deformation of the metacarpophalangeal joint corresponds to the two degrees of freedom of bending and swinging. Thus, each first strain sensor can correspond to the deformation of one interphalangeal joint among the multiple interphalangeal joints of the hand in the degree of freedom of bending, that is, when any interphalangeal joint performs bending motion, the first strain sensor can measure the deformation of the glove body at the corresponding interphalangeal joint. Each second strain sensor can correspond to the deformation of one metacarpophalangeal joint among the multiple metacarpophalangeal joints in the two degrees of freedom of bending and swinging, that is, when any metacarpophalangeal joint performs bending or swinging motion, the second strain sensor can measure the deformation of the glove body at the corresponding metacarpophalangeal joint. In summary, the multiple first strain sensors and the multiple second strain sensors jointly provide deformation data of at least 15 degrees of freedom on at least the user's fingers. For more information about the glove system, see the relevant section above.

[0205] 162. Determine a user's gesture based on the sensor data.

[0206] In some embodiments, when a user makes a gesture, it can cause strain sensors on the glove corresponding to each hand joint of the user to generate strain data, and the processor can restore the user's gesture based on the strain data of the strain sensors on the glove corresponding to each hand joint of the user.

[0207] 163. Output a gesture representation corresponding to the gesture on a display interface.

[0208] In some embodiments, after determining the user gesture, a gesture representation corresponding to the user's gesture can be output on the display interface. The gesture representation can be a hand posture represented or simulated by points, lines, surfaces, etc. or a combination thereof. For example, multiple joints of the user's hand can be represented by multiple points on the display interface, and the connecting lines between some of the points can be used to represent the bones or hand frames between the joints. For another example, a hand in a corresponding posture can be simulated based on the recognized gesture and displayed on the display interface. The display interface is provided by an external device, such as a mobile phone screen or a computer screen. In some embodiments, the user can make multiple gestures in sequence, and the processor can continuously identify multiple gestures of the user based on the sensor data, and display the user's gestures in sequence.

[0209] 164. Output feedback information according to the distance between the gesture representation and a preset gesture.

[0210] In some embodiments, the processor may output feedback information based on the distance between the gesture representation and the preset gesture. The feedback information may include the comparison result of the user's gesture representation and the preset gesture, etc. The distance between the gesture representation and the preset gesture may reflect the similarity between the user's gesture and the preset gesture. The closer the distance is, the higher the similarity between the user's gesture and the preset gesture is. In some embodiments, the distance may be obtained by first mapping the gesture representation with the preset gesture, and further calculating the distance between the gesture representation and the corresponding point on the preset gesture. The feedback information may be used to remind the user whether his gesture is the same as the preset gesture or the similarity between his gesture and the preset gesture. For example, the feedback information may be the similarity between the gesture representation and the preset gesture expressed as a percentage. The processing flow of the processor outputting feedback information based on the user's gesture and the distance between the preset gesture may be applied to a variety of application scenarios, such as gesture game application scenarios or sign language learning application scenarios.

[0211] Fig.17 It is a flow chart of the method of voice playback shown in some embodiments of this specification.

[0212] like Fig.17As shown, in some embodiments, the voice playing method 17 includes the following steps.

[0213] 171. Obtain sensor data from the user's hand based on the glove system.

[0214] In some embodiments, the glove system includes a glove body and a plurality of first strain sensors and a plurality of second strain sensors arranged on the glove body, when the user wears the glove body, each of the plurality of first strain sensors is located at an interphalangeal joint of the user, and is configured to measure the deformation of the interphalangeal joint in a single degree of freedom. Each of the plurality of second strain sensors is located at a metacarpophalangeal joint, and is configured to measure the deformation of the metacarpophalangeal joint in two degrees of freedom, and both the single degree of freedom and the two degrees of freedom include a degree of freedom corresponding to finger bending.

[0215] In some embodiments, the first strain sensor includes a single degree of freedom sensor, such as a single axis sensor (such as an inductive, resistive bending sensor or a capacitive stretching sensor). In some embodiments, the second strain sensor includes a multi-degree of freedom sensor, such as a multi-axis sensor (such as a capacitive multi-axis motion sensor). The deformation of the interphalangeal joint corresponds to the one degree of freedom of bending. The deformation of the metacarpophalangeal joint corresponds to the two degrees of freedom of bending and swinging. Thus, each first strain sensor can correspond to the deformation of one interphalangeal joint among the multiple interphalangeal joints of the hand in the degree of freedom of bending, that is, when any interphalangeal joint performs bending motion, the first strain sensor can measure the deformation of the glove body at the corresponding interphalangeal joint. Each second strain sensor can correspond to the deformation of one metacarpophalangeal joint among the multiple metacarpophalangeal joints in the two degrees of freedom of bending and swinging, that is, when any metacarpophalangeal joint performs bending or swinging motion, the second strain sensor can measure the deformation of the glove body at the corresponding metacarpophalangeal joint. In summary, the multiple first strain sensors and the multiple second strain sensors jointly provide deformation data of at least 15 degrees of freedom on at least the user's fingers. For more information about the glove system, see the relevant section above.

[0216] 172. Determine a user's gesture based on the sensor data.

[0217] In some embodiments, when a user makes a gesture, it can cause strain sensors on the glove corresponding to each hand joint of the user to generate strain data, and the processor can restore the user's gesture based on the strain data of the strain sensors on the glove corresponding to each hand joint of the user.

[0218] 173. Read the mapping relationship between gestures and voice data packets.

[0219] In some embodiments, the mapping relationship between gestures and voice data packets can be predefined by the user. For example, the user can define a mapping relationship between a gesture of five fingers together and the voice "stop". For example, the user can define a mapping relationship between a gesture of five fingers spread out and the voice "hey". For another example, the user can define a mapping relationship between a V-shaped gesture composed of the index finger and the middle finger and the voice "take a photo". In some embodiments, the mapping relationship between gestures and voice data packets can also be established by a sign language database, which includes a mapping relationship between sign language gestures and expression vocabulary.

[0220] 174. Play voice information based on the user's gesture and the mapping relationship.

[0221] In some embodiments, the processor recognizes user gestures and controls an external device (such as a speaker) to play voice information based on the mapping relationship between the gestures and the voice data packets. For example, the user can input a gesture of five fingers together to control the external device to output the voice "stop". For example, the user can input a gesture of five fingers spread out to control the external device to output the voice "hey". For another example, the user can input a V-shaped gesture of the index finger and middle finger combination to control the external device to output the voice "take a photo". For another example, the user can input a sign language gesture to control the external device to output the voice corresponding to the sign language.

[0222] For more information about voice playback methods, see Fig.14 and its related descriptions.

[0223] Fig.18 It is a flow chart of the gesture control method shown in some embodiments of this specification.

[0224] like Fig.18 As shown, in some embodiments, the gesture control method 18 includes the following steps.

[0225] 181. Obtain sensor data from the user's hand based on the glove system.

[0226] In some embodiments, the execution instruction glove system includes a glove body and a plurality of first strain sensors and a plurality of second strain sensors arranged on the execution instruction glove body. When the user wears the execution instruction glove body, each of the plurality of first strain sensors is located at an interphalangeal joint of the execution instruction user and is configured to measure the deformation of the interphalangeal joint in a single degree of freedom. Each of the plurality of second strain sensors is located at a metacarpophalangeal joint and is configured to measure the deformation of the metacarpophalangeal joint in two degrees of freedom. Both the single degree of freedom and the two degrees of freedom include the degree of freedom corresponding to finger bending.

[0227] In some embodiments, the first strain sensor includes a single degree of freedom sensor, such as a single axis sensor (such as an inductive, resistive bending sensor or a capacitive stretching sensor). In some embodiments, the second strain sensor includes a multi-degree of freedom sensor, such as a multi-axis sensor (such as a capacitive multi-axis motion sensor). The interphalangeal joint corresponds to the one degree of freedom of bending. The metacarpophalangeal joint corresponds to the two degrees of freedom of bending and swinging. Thus, each first strain sensor can correspond to measuring the deformation of one interphalangeal joint among the nine interphalangeal joints of the hand in the bending degree of freedom, that is, when any interphalangeal joint performs bending motion, the first strain sensor can measure the deformation of the glove body at the corresponding interphalangeal joint. Each second strain sensor can correspond to measuring the deformation of one metacarpophalangeal joint among the five metacarpophalangeal joints in the two degrees of freedom of bending and swinging, that is, when any metacarpophalangeal joint performs bending or swinging motion, the second strain sensor can measure the deformation of the glove body at the corresponding metacarpophalangeal joint. In summary, multiple first strain sensors and multiple second strain sensors jointly provide deformation data of at least 15 degrees of freedom on at least the user's fingers. For more information about the glove system, please refer to the relevant part above.

[0228] 182. Determine a user's gesture based on sensor data.

[0229] In some embodiments, when a user wears gloves and makes gestures, strain sensors on the gloves corresponding to the joints of the user's hands can generate strain data. The processor can restore the user's gestures based on the strain data of the strain sensors on the gloves corresponding to the joints of the user's hands. In some embodiments, the processor can display the restored user gestures on the display interface in the form of gesture representations.

[0230] 183. The mapping relationship between reading gestures and executing instructions.

[0231] In some embodiments, the mapping relationship between gestures and execution instructions can be predefined by the user. In some embodiments, the user can pre-set the mapping relationship between gestures and corresponding execution instructions of external devices (such as game consoles). For example, the user can define a mapping relationship between a gesture of five fingers together and an external device to execute a screenshot instruction. For example, the user can define a mapping relationship between a gesture of five fingers spread out and an external device to execute a play instruction. For another example, the user can define a mapping relationship between a V-shaped gesture composed of the index finger and the middle finger and an external device to execute a photo taking instruction. In some embodiments, the mapping relationship between gestures and execution instructions can also be defined by the manufacturer.

[0232] 184. Execute instructions based on the user's gesture and the mapping relationship.

[0233] In some embodiments, the processor recognizes user gestures and controls the external device to execute the instruction corresponding to the user gesture according to the mapping relationship between the user's predefined operation gesture and the execution instruction. For example, the user can input a gesture of five fingers together to control the external device to execute a screenshot instruction. For example, the user can input a gesture of five fingers spread out to control the external device to execute a play instruction. For another example, the user can input a V-shaped gesture of the index finger and middle finger to control the external device to execute a photo taking instruction.

[0234] For more information about gesture control methods, see Fig.15 and its related descriptions.

[0235] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of this specification. Although not explicitly stated here, those skilled in the art may make various modifications, improvements and corrections to this specification. Such modifications, improvements and corrections are suggested in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this specification.

[0236] At the same time, this specification uses specific words to describe the embodiments of this specification. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of this specification. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures or characteristics in one or more embodiments of this specification can be appropriately combined.

[0237] In addition, unless explicitly stated in the claims, the order of the processing elements and sequences described in this specification, the use of alphanumeric characters, or the use of other names are not intended to limit the order of the processes and methods of this specification. Although the above disclosure discusses some invention embodiments that are currently considered useful through various examples, it should be understood that such details are only for illustrative purposes, and the attached claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that are consistent with the essence and scope of the embodiments of this specification. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only by software solutions, such as installing the described system on an existing server or mobile device.

[0238] Similarly, it should be noted that in order to simplify the description disclosed in this specification and thus help understand one or more embodiments of the invention, in the above description of the embodiments of this specification, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the subject matter of this specification are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

[0239] In some embodiments, numbers describing the number of components and attributes are used. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise specified, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of this specification are approximate values, in specific embodiments, the setting of such numerical values ​​is as accurate as possible within the feasible range.

[0240] Each patent, patent application, patent application publication, and other materials, such as articles, books, specifications, publications, documents, etc., cited in this specification are hereby incorporated by reference in their entirety. Except for application history documents that are inconsistent with or conflicting with the contents of this specification, documents that limit the broadest scope of the claims of this specification (currently or later attached to this specification) are also excluded. It should be noted that if the descriptions, definitions, and / or use of terms in the materials attached to this specification are inconsistent or conflicting with the contents described in this specification, the descriptions, definitions, and / or use of terms in this specification shall prevail.

[0241] Finally, it should be understood that the embodiments described in this specification are only used to illustrate the principles of the embodiments of this specification. Other variations may also fall within the scope of this specification. Therefore, as an example and not a limitation, alternative configurations of the embodiments of this specification may be considered consistent with the teachings of this specification. Accordingly, the embodiments of this specification are not limited to the embodiments explicitly introduced and described in this specification.

Claims

1. A glove system, comprising: Glove body; as well as A plurality of first strain sensors and a plurality of second strain sensors are arranged on the glove body, wherein when a user wears the glove body, each of the plurality of first strain sensors is located at an interphalangeal joint of the user and is configured to measure the deformation of the interphalangeal joint in a single degree of freedom, and each of the plurality of second strain sensors is located at a metacarpophalangeal joint and is configured to measure the deformation of the metacarpophalangeal joint in two degrees of freedom, wherein the single degree of freedom and the two degrees of freedom both include a degree of freedom corresponding to finger bending.

2. The glove system according to claim 1, wherein the plurality of first strain sensors and the plurality of second strain sensors together provide data reflecting deformation of no less than 15 degrees of freedom on the user's fingers.

3. The glove system according to claim 1, further comprising two inertial sensors, wherein: When the user wears the glove body, the two inertial sensors are respectively located on both sides of the user's wrist joint and are configured to jointly measure the movement of the wrist joint in three degrees of freedom.

4. The glove system according to claim 1, further comprising a third strain sensor located at a wrist joint of the user and an inertial sensor located outside the wrist joint. 5 . The glove system according to claim 1 , wherein the first strain sensor comprises an inductive sensor, and an inductance of the inductive sensor changes with deformation of the interphalangeal joint. 6 . The glove system according to claim 1 , wherein the second strain sensor comprises a plurality of capacitive structures, and the capacitances of the plurality of capacitive structures change respectively as the metacarpophalangeal joint changes in each degree of freedom.

7. The glove system according to claim 6, wherein the second strain sensor comprises: Flexible substrate; The first capacitor structure and the second capacitor structure each include a multilayer structure arranged on the same side surface of the flexible substrate in the thickness direction, and each layer of the multilayer structure is stacked along the thickness direction.

8. The glove system according to claim 1, wherein the glove body comprises a cloth wrapped around each finger of the user and a cloth located between adjacent fingers, wherein: The elastic modulus of the cloth between the cloths of adjacent fingers is smaller than the elastic modulus of the cloth on each of the fingers.

9. The glove system according to claim 1, wherein the plurality of first strain sensors are arranged only at the interphalangeal joints of the user's fingers closest to the metacarpophalangeal joints.

10. The glove system of claim 1 , further comprising a processor configured to: reading data associated with the plurality of first strain sensors and the plurality of second strain sensors; and A gesture of the user is determined based on the data.

11. The glove system according to claim 10, wherein the processor is configured to: Outputting a gesture representation corresponding to the user's gesture on a display interface; and Output feedback information according to the distance between the gesture representation and the preset gesture.

12. The glove system according to claim 10, wherein the processor is configured to: Read the mapping relationship between gestures and voice data packets; and The voice information is played based on the user's gesture and the mapping relationship.

13. The glove system according to claim 10, wherein the processor is configured to: Read the mapping relationship between gestures and execution instructions; and An instruction is executed based on the user's gesture and the mapping relationship.

14. A gesture reproduction method, comprising: Acquiring sensor data of a user's hand based on a glove system, wherein the glove system includes a glove body and a plurality of first strain sensors and a plurality of second strain sensors arranged on the glove body, when the user wears the glove body, each of the plurality of first strain sensors is located at an interphalangeal joint of the user and is configured to measure the deformation of the interphalangeal joint in a single degree of freedom, each of the plurality of second strain sensors is located at a metacarpophalangeal joint and is configured to measure the deformation of the metacarpophalangeal joint in two degrees of freedom, wherein the single degree of freedom and the two degrees of freedom both include a degree of freedom corresponding to finger bending; determining a gesture of the user based on the sensor data; Outputting a gesture representation corresponding to the gesture on a display interface; and Output feedback information according to the distance between the gesture representation and the preset gesture.

15. A voice playing method, comprising: Acquiring sensor data of a user's hand based on a glove system, wherein the glove system includes a glove body and a plurality of first strain sensors and a plurality of second strain sensors arranged on the glove body, when the user wears the glove body, each of the plurality of first strain sensors is located at an interphalangeal joint of the user and is configured to measure the deformation of the interphalangeal joint in a single degree of freedom, each of the plurality of second strain sensors is located at a metacarpophalangeal joint and is configured to measure the deformation of the metacarpophalangeal joint in two degrees of freedom, wherein the single degree of freedom and the two degrees of freedom both include a degree of freedom corresponding to finger bending; determining a gesture of the user based on the sensor data; Read the mapping relationship between gestures and voice data packets; and The voice information is played based on the user's gesture and the mapping relationship.

16. A gesture control method, comprising: Acquiring sensor data of a user's hand based on a glove system, wherein the glove system includes a glove body and a plurality of first strain sensors and a plurality of second strain sensors arranged on the glove body, when the user wears the glove body, each of the plurality of first strain sensors is located at an interphalangeal joint of the user and is configured to measure the deformation of the interphalangeal joint in a single degree of freedom, each of the plurality of second strain sensors is located at a metacarpophalangeal joint and is configured to measure the deformation of the metacarpophalangeal joint in two degrees of freedom, wherein the single degree of freedom and the two degrees of freedom both include a degree of freedom corresponding to finger bending; determining a gesture of the user based on the sensor data; Read the mapping relationship between gestures and execution instructions; and An instruction is executed based on the user's gesture and the mapping relationship.

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