A binding structure, binding method and waterproof testing method for capacitive touch screen

Abstract

The present invention belongs to the technical field of capacitive touch screens, and specifically discloses a binding structure, binding method, and waterproof testing method for a capacitive touch screen. The binding structure includes an ITO film substrate, a cover plate, a silver paste circuit layer connected to a capacitive touch screen sensor, an insulating layer, an adhesive layer, and a first FPC cover film, an FPC gold finger, a second FPC cover film, and a conductive tape layer connected to an FPC. The binding method involves sequentially bonding the layers, adjusting the edges, filling with glue, and pressing and curing. The waterproof testing method is to place the bound product in a water tank to ensure that the FPC components and the gold finger are not exposed to water, continuously power on for 700 hours, take it out every day for functional testing, and it is considered qualified if all test items pass. This structure and method improve the stability and waterproof performance of the touch screen, ensuring product quality.

Description

Technical Field

[0001] The present invention relates to the technical field of capacitive touch screens, and in particular to a binding structure, a binding method and a waterproof testing method for a capacitive touch screen. Background Art

[0002] With the rapid development of mobile technology, capacitive touchscreens have become widely used in various mobile devices. This is especially true in entertainment venues like bars, where mobile terminals serve as essential service and management tools, making their stability and reliability paramount. However, these venues often host liquids such as alcohol, which can inevitably leak into devices during use. This poses significant challenges to the waterproof performance of capacitive touchscreens and the stability of their binding structures.

[0003] Capacitive touchscreens typically use a glass or plastic surface covered with a conductive film, sensing changes in charge on the touch surface to enable touch operation. While this design provides a pleasant touch experience, it also makes the touchscreen susceptible to interference from moisture, humidity, or water droplets. In humid environments like bars, if liquids such as alcohol infiltrate the device, particularly in the binding area, it can cause a short circuit or silver ion migration, leading to a progressive short circuit and ultimately causing the product to malfunction.

[0004] Furthermore, capacitive touch screens often operate in complex and variable environments, with small bonding areas and limited conductive areas, making it even more difficult to guarantee waterproofing and electrical insulation performance. Furthermore, the lack of airtightness in the bonding environment exacerbates this problem, making the product more susceptible to environmental influences. This effect is particularly pronounced in highly humid environments, such as bars, where external influences can easily lead to short circuits or slow migration of silver ions, impacting the product's proper operation and service life.

[0005] Therefore, how to improve the waterproof performance of the capacitive touch screen and the stability of the binding structure has become an urgent problem to be solved. Summary of the Invention

[0006] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a method in the field of X technology, particularly a binding structure, binding method and waterproof testing method for a capacitive touch screen, for solving the problems in the prior art.

[0007] To achieve the above-mentioned and other related objectives, the present invention provides a binding structure for a capacitive touch screen, comprising:

[0008] ITO film substrate;

[0009] a cover plate, arranged opposite to the ITO thin film substrate;

[0010] The first component is connected to the capacitive touch screen sensor and is disposed between the ITO film substrate and the cover plate. The first component includes, from the ITO film substrate outward, the following components:

[0011] A silver paste circuit layer is provided on the ITO thin film substrate;

[0012] an insulating layer, disposed on the silver paste circuit layer;

[0013] an adhesive layer, disposed on the insulating layer and connected to the cover plate;

[0014] The second component is connected to the FPC and is disposed between the ITO film substrate and the cover plate. The second component is stacked in sequence from the cover plate inwards and includes:

[0015] A first FPC cover film is provided on the cover plate;

[0016] FPC gold fingers, provided on the first FPC cover film;

[0017] A second FPC covering film is provided on a portion of the FPC gold finger area;

[0018] A conductive tape layer, one side of which is connected to the partial area of ​​the second FPC cover film not covering the FPC gold finger, and the other side is connected to the silver paste circuit layer; the two ends of the conductive tape layer are respectively connected to the second FPC cover film and the insulating layer.

[0019] Optionally, one end of the insulating layer covers the edge of the FPC gold finger along its length direction, and the covered lateral distance is no more than 0.1 mm.

[0020] Optionally, one end of the first FPC covering film extends outside the FPC gold finger and onto the insulating layer, and covers the insulating layer to a depth of 0.1-0.2 mm.

[0021] Optionally, a gap is formed between the first FPC cover film and the adhesive layer, the gap is located between the cover plate and the insulating layer, and 8008 anti-oxidation glue is provided in the gap.

[0022] Optionally, a right-angle opening is formed between the second FPC cover film and the silver paste circuit layer, and the silver paste circuit layer is partially exposed on the right-angle opening, and the exposed portion is provided with ECS0601 glue.

[0023] In a second aspect, the present invention provides a capacitive touch screen binding method, which is applied to the above-mentioned capacitive touch screen binding structure, comprising:

[0024] Laminating the silver paste circuit layer to the ITO film substrate, then evenly coating or laminating the insulating layer on the silver paste circuit layer, and then laminating the adhesive layer on the insulating layer, ensuring that one side of the adhesive layer faces the direction of bonding with the cover plate;

[0025] Laminating a first FPC cover film on the cover plate, then placing an FPC gold finger on the first FPC cover film, and then laminating a second FPC cover film on a portion of the FPC gold finger to protect the gold finger from external interference, while leaving a portion of the gold finger uncovered by the second FPC cover film;

[0026] Stick one side of the conductive tape layer to the part of the second FPC cover film that is not covered by the FPC gold finger, and align and stick the other side to the silver paste circuit layer to ensure good conductivity. At the same time, the two ends of the conductive tape layer are in close contact with the second FPC cover film and the edge of the insulation layer respectively;

[0027] Adjust the edge of the insulating layer so that it covers the edge of the FPC gold finger along the length direction, and the lateral distance of the coverage is controlled to be no more than 0.1mm. Extend one end of the first FPC cover film appropriately beyond the edge of the FPC gold finger and cover it on the insulating layer. The coverage depth is controlled within the range of 0.1-0.2mm;

[0028] The gap formed between the first FPC cover film and the adhesive layer is filled with 8008 anti-oxidation glue to ensure structural stability and prevent oxidation;

[0029] At the right angle formed between the second FPC cover film and the silver paste circuit layer, the exposed part of the silver paste circuit layer is filled with ECS0601 glue to enhance structural sealing and electrical insulation;

[0030] Use appropriate lamination equipment and process parameters to press the cover plate to the ITO film substrate to ensure that all layers are tightly bonded, and then perform heat curing to complete the binding of the FPC and the capacitive touch screen sensor.

[0031] Optionally, the adhesive layer is made of OCA optically transparent adhesive.

[0032] Optionally, the conductive tape layer is anisotropic conductive hot-melt tape.

[0033] In a third aspect, the present invention provides a method for testing the waterproofness of a capacitive touch screen, which is applied to the binding structure of the above-mentioned capacitive touch screen, comprising:

[0034] Place the bonded product completely in a water tank for waterproof testing, ensuring that the FPC component area and the gold fingers of the outlet terminals are not exposed to water.

[0035] During the test, the product was powered on by connecting the test board and kept powered on for 700 hours;

[0036] Take the product out of water once a day and perform functional testing on the product using test software. If all functional test items pass, the product is qualified.

[0037] Optionally, the functional test items include but are not limited to touch screen sensitivity test, response speed test, touch accuracy test, screen display stability test, electrical insulation performance test and sealing test.

[0038] As described above, the capacitive touch screen binding structure proposed by the present invention has the following beneficial effects:

[0039] This invention effectively prevents water penetration through a sophisticated laminated structure and specialized glue filling. This ensures that, while protecting the FPC component area and the gold fingers at the output terminals from water, the capacitive touch screen can be fully submerged in a water tank for extended waterproof testing without damage, significantly enhancing the product's waterproof performance. The precise coverage of the insulating layer and the ingenious design of the conductive tape layer effectively isolate the silver paste circuit layer from direct contact with other layers, preventing silver ion migration, thereby extending the product's service life and improving electrical insulation performance and stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 Shown is a schematic diagram of a binding structure of a capacitive touch screen before binding according to an embodiment of the present invention;

[0041] Figure 2 Shown is a schematic diagram of a binding structure of a capacitive touch screen after binding according to an embodiment of the present invention;

[0042] Figure 3 Shown is a flow chart of a method for binding a capacitive touch screen according to an embodiment of the present invention;

[0043] Figure 4 A test schematic diagram showing a method for testing waterproofness of a capacitive touch screen according to an embodiment of the present invention is shown;

[0044] Description of reference numerals:

[0045] ITO film substrate 10, silver paste circuit layer 11, insulation layer 12, adhesive layer 13, cover plate 20, first FPC cover film 21, FPC gold finger 22, second FPC cover film 23, conductive tape layer 24, 8008 anti-oxidation glue 25, ECS0601 glue 26, water tank 31, binding area 32, outlet terminal 33, test board 34, computer 35. DETAILED DESCRIPTION

[0046] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0047] It should be noted that the diagrams provided in the present embodiment are only schematic illustrations of the basic concept of the present invention. The diagrams only show the components related to the present invention and are not drawn according to the number, shape and size of the components during actual implementation. The type, quantity and ratio of each component during actual implementation can be changed at will, and the component layout type may also be more complex. The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read. They are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they have no technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the efficacy and purpose of the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be considered as the scope of the implementation of the present invention without substantially changing the technical content.

[0048] Example 1

[0049] A binding structure for a capacitive touch screen, such as Figure 1 and Figure 2 As shown, the structure includes an ITO thin film substrate 10, a cover plate 20, a first component connected to the capacitive touch screen sensor, and a second component connected to the FPC. These components and their interconnected relationships will be described in detail below.

[0050] The ITO film substrate 10 is the foundation of the capacitive touch screen, offering excellent conductivity and light transmittance. Other functional layers can be added to the ITO film substrate 10 to complete the touch screen structure. The cover plate 20, positioned opposite the ITO film substrate 10, protects the touch screen's internal structure from environmental influences. Made of glass, plastic, or other transparent materials, the cover plate 20 ensures the touch screen's light transmittance and aesthetic quality.

[0051] The first component is connected to the capacitive touch screen sensor and is disposed between the ITO film substrate 10 and the cover plate 20. From the ITO film substrate 10 outward, it includes, in order: a silver paste circuit layer 11, an insulating layer 12, and an adhesive layer 13. The silver paste circuit layer 11 is disposed on the ITO film substrate 10 and is used to achieve the conductive function of the touch screen. The silver paste circuit layer 11 is prepared on the ITO film substrate 10 by printing, coating, or sputtering to form the desired circuit pattern. The insulating layer 12 is disposed on the silver paste circuit layer 11 and is used to isolate the silver paste circuit layer 11 from the external environment to prevent external interference from affecting the performance of the touch screen. The insulating layer 12 is made of an organic or inorganic material, such as polyester, polyimide, or silicon oxide. The adhesive layer 13 is disposed on the insulating layer 12 and is connected to the cover plate 20. The adhesive layer 13 is used to tightly combine the cover plate 20 with the ITO film substrate 10 and the various functional layers thereon to form a complete touch screen structure. The adhesive layer 13 is made of a material with high light transmittance and strong adhesion, such as OCA optically transparent adhesive.

[0052] The second component is connected to the FPC and is arranged between the ITO film substrate 10 and the cover plate 20. It includes a first FPC covering film, an FPC gold finger 22, a second FPC covering film and a conductive tape layer 24 stacked in sequence from the cover plate 20 inward. Among them, the first FPC covering film is arranged on the cover plate 20 to protect the FPC gold finger 22 and its connecting parts from the influence of the external environment. The first FPC covering film is made of flexible materials such as polyimide to ensure that it has good flexibility and durability; the FPC gold finger 22 is arranged on the first FPC covering film to realize the connection between the FPC and the internal circuit of the touch screen. The FPC gold finger 22 is made of gold-plated copper or aluminum to improve its conductivity and corrosion resistance; the second FPC covering film is arranged on a part of the FPC gold finger 22 to further protect the FPC gold finger 22 from external interference. At the same time, a part of the FPC gold finger 22 is left uncovered by the second FPC covering film so as to be connected to the conductive part inside the touch screen; the conductive One side of the electrical tape layer 24 is connected to the partial area of ​​the second FPC cover film that is not covered by the FPC gold finger 22, and the other side is connected to the silver paste circuit layer 11. The conductive tape layer 24 is used to realize the conductive connection between the FPC and the internal circuit of the touch screen, and ensure the stability and reliability of the connection. The conductive tape layer 24 is made of materials with excellent conductive properties and thermal stability, such as anisotropic conductive hot-melt tape. The two ends of the conductive tape layer 24 are respectively connected to the second FPC cover film and the insulating layer 12, which not only realizes the electrical connection between the FPC gold finger 22 and the silver paste circuit layer 11, but also further improves the stability and reliability of the overall structure.

[0053] Furthermore, according to a preferred embodiment of the present invention, one end of the insulating layer 12 extends longitudinally to the edge of the FPC gold finger 22, with the lateral distance of the covering not exceeding 0.1 mm. This further prevents external interference with the FPC gold finger 22, thereby improving the reliability and stability of the touch screen.

[0054] In a more preferred embodiment, one end of the first FPC coverlay extends beyond the FPC gold finger 22 and onto the insulating layer 12, covering the insulating layer 12 to a depth of 0.1-0.2 mm. Specifically, when considering the first FPC coverlay, FPC gold finger 22, second FPC coverlay, and the FPC as a whole, the depth of coverage of the insulating layer 12 is limited to no more than 0.3 mm. This design eliminates any gap between the insulating layer 12 and the FPC gold finger 22, effectively protecting against environmental damage and further extending the overall service life of the touchscreen.

[0055] A further optimized implementation detail is that a gap is reserved between the first FPC cover film and the adhesive layer 13. This gap, located between the cover plate 20 and the insulating layer 12, is filled with 8008 anti-oxidation glue 25. This design not only ensures the structural stability of the touch screen but also effectively prevents oxidation, significantly improving the durability and reliability of the touch screen.

[0056] In addition, a right-angled opening is formed at the junction of the second FPC covering film and the silver paste circuit layer 11. The end face portion of the silver paste circuit layer 11 is connected to the second FPC covering film, and the other portion is exposed on the right-angled opening. The exposed portion is coated with ECS0601 glue 26. ECS0601 glue 26 has good fluidity and strong sealing, thereby ensuring the stability of the connection and overall performance.

[0057] Example 2

[0058] Reference Figure 1-Figure 3 As shown, the capacitive touch screen binding method provided by the present invention is applied to the binding structure of the above-mentioned capacitive touch screen, and includes the following steps:

[0059] S1. Laminating the silver paste circuit layer 11 to the ITO film substrate 10, then uniformly coating or laminating the insulating layer 12 on the silver paste circuit layer 11, and then laminating the adhesive layer 13 on the insulating layer 12, ensuring that one side of the adhesive layer 13 faces the direction of bonding with the cover plate 20;

[0060] S2. Laminating a first FPC cover film on the cover plate 20, then placing an FPC gold finger 22 on the first FPC cover film, and then laminating a second FPC cover film on a portion of the FPC gold finger 22 to protect the FPC gold finger 22 from external interference, while leaving a portion of the FPC gold finger 22 uncovered by the second FPC cover film.

[0061] S3. Paste one side of the conductive tape layer 24 to the portion of the second FPC cover film that is not covered by the FPC gold finger 22, and align and paste the other side to the silver paste circuit layer 11 to ensure good conductivity and achieve conductive connection between the FPC and the internal circuit of the touch screen. At the same time, the two ends of the conductive tape layer 24 are in close contact with the edges of the second FPC cover film and the insulating layer 12 respectively;

[0062] S4. Adjust the edge of the insulating layer 12 so that it covers the edge of the FPC gold finger 22 in the length direction, and the lateral distance of the coverage is controlled to be no more than 0.1 mm. Extend one end of the first FPC cover film appropriately beyond the edge of the FPC gold finger 22 and cover the insulating layer 12. The coverage depth is controlled within the range of 0.1-0.2 mm.

[0063] S5. Fill the gap formed between the first FPC cover film and the adhesive layer 13 with 8008 anti-oxidation glue 25 to ensure structural stability and prevent oxidation.

[0064] S6. Fill the exposed portion of the silver paste circuit layer 11 with ECS0601 glue 26 at the right angle formed between the second FPC cover film and the silver paste circuit layer 11 to enhance structural sealing and electrical insulation.

[0065] S7. Use appropriate lamination equipment and process parameters to press the cover plate 20 and the ITO film substrate 10 to ensure that all layers are tightly bonded, and then perform heat curing treatment to complete the binding of the FPC and the capacitive touch screen sensor.

[0066] Specifically, due to the effects of the pressing equipment and process parameters, the conductive tape layer 24 will be subjected to a certain pressure, thereby undergoing a certain deformation, that is, reducing its volume to ensure a good conductive connection between the silver paste circuit layer 11 and the FPC gold finger 22. Since the FPC gold finger 22 covers the edge of the insulating layer 12, the FPC gold finger 22 will come into contact with the insulating layer 12 during the binding process. The FPC gold finger 22 will squeeze the insulating layer 12. The insulating layer 12 has a certain elasticity and plasticity to ensure close contact with the insulating layer 12. This close contact helps to reduce resistance and interference in the electrical connection and improve the performance of the touch screen.

[0067] The above-mentioned binding method based on the capacitive touch screen binding structure has significant beneficial effects, especially in terms of waterproofing and silver ion migration. Through fine interlayer structure design and rigorous binding process, such as using 8008 anti-oxidation glue 25 and ECS0601 glue 26 for filling, the sealing and electrical insulation of the structure are effectively enhanced, thereby greatly improving the waterproof performance of the touch screen and ensuring that stable electrical performance can be maintained in a humid environment. At the same time, the solution effectively blocks the silver ion migration path in the silver paste circuit layer 11 by controlling the coverage and close contact of the insulating layer 12 on the FPC gold finger 22, reducing the risk of electrical performance degradation and touch screen failure caused by silver ion migration. In addition, the deformation treatment during the lamination process further ensures a good conductive connection between the conductive tape layer 24 and the silver paste circuit layer 11 and the FPC gold finger 22, thereby improving the overall performance and reliability of the touch screen. In summary, the binding solution provides an effective solution to the waterproofing and silver ion migration problems of capacitive touch screens.

[0068] Example 3

[0069] Reference Figure 4 As shown, the present invention also provides a waterproof testing method for a capacitive touch screen, which is applied to the binding structure of the above-mentioned capacitive touch screen.

[0070] Place the product's bonding area completely in a water tank for a waterproof test, ensuring that the FPC and FPC gold fingers are not exposed to water.

[0071] During the test, the product was powered on by connecting the test board to a computer and maintaining power for 700 hours. In this embodiment, the test board was connected to the product's output terminals to transmit test signals to the touch screen and receive response signals from the touch screen. These signals include, but are not limited to, touch input signals, screen display signals, and electrical insulation performance test signals.

[0072] Take the product out of water once a day and perform functional testing on the product using testing software on a computer. If all functional test items pass, the product is qualified.

[0073] Functional testing includes, but is not limited to, touch screen sensitivity testing, response speed testing, touch accuracy testing, screen display stability testing, electrical insulation performance testing, and sealing testing. Functional testing allows for a comprehensive assessment of a product's performance in waterproof testing and determines whether it passes the test.

[0074] Touch screen sensitivity test: Tests the touch screen's response speed to touch input to ensure that the screen can accurately sense and respond to user touches, slides, and other operations in a humid environment.

[0075] Response Speed ​​Test: Measures the time difference between touch input and corresponding changes on the screen, evaluating the screen's instant responsiveness under waterproof conditions.

[0076] Touch Accuracy Test: Through a preset touch path or pattern, the touch screen is tested to see if it can accurately identify and track the user's touch trajectory during the waterproof test.

[0077] Screen display stability test: Under continuous power supply and humid environment, observe whether the screen display is stable, without flickering, black screen or display abnormality.

[0078] Electrical insulation performance test: Use an insulation resistance tester to detect the insulation resistance between the touch screen's internal circuit and the external environment to ensure that no electrical short circuit or leakage occurs during the waterproof test.

[0079] Sealing test: By observing or detecting whether water has penetrated into the touch screen during the waterproof test, the sealing performance of the touch screen is evaluated to see whether it meets the design requirements.

[0080] In summary, the waterproof testing method provided can fully simulate the product's use in extremely humid environments by placing the entire product in a water tank for a long period of waterproof testing, thereby comprehensively evaluating its waterproof performance. Through rigorous waterproof testing and comprehensive functional testing, products with substandard performance can be screened out, thereby improving the overall product quality and reliability, ensuring that the products ultimately delivered to consumers have excellent waterproof performance and stable usage performance.

[0081] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A binding structure for a capacitive touch screen, characterized in that: include ITO film substrate; a cover plate, disposed opposite to the ITO thin film substrate; The first component is connected to the capacitive touch screen sensor and is disposed between the ITO film substrate and the cover plate. The first component includes, from the ITO film substrate outward, the following components: A silver paste circuit layer is provided on the ITO thin film substrate; an insulating layer, disposed on the silver paste circuit layer; an adhesive layer, disposed on the insulating layer and connected to the cover plate; The second component is connected to the FPC and is disposed between the ITO film substrate and the cover plate. The second component is stacked in sequence from the cover plate inwards and includes: a first FPC cover film, disposed on the cover plate; FPC gold fingers, provided on the first FPC cover film; A second FPC cover film is provided on a portion of the FPC gold finger area; a conductive tape layer, one side of which is connected to a portion of the second FPC cover film that is not covered by the FPC gold finger, and the other side of which is connected to the silver paste circuit layer; two ends of the conductive tape layer are respectively connected to the second FPC cover film and the insulating layer; One end of the insulating layer covers the edge of the FPC gold finger along its length, and the lateral distance covered is no more than 0.1mm; One end of the first FPC covering film extends outside the FPC gold finger and onto the insulating layer, and covers the insulating layer to a depth of 0.1-0.2 mm.

2. The capacitive touch screen binding structure according to claim 1, wherein: A gap is formed between the first FPC cover film and the adhesive layer. The gap is located between the cover plate and the insulating layer. 8008 anti-oxidation glue is provided in the gap.

3. The capacitive touch screen binding structure according to claim 2, wherein: A right-angled opening is formed between the second FPC cover film and the silver paste circuit layer. Part of the silver paste circuit layer is exposed on the right-angled opening, and the exposed part is provided with ECS0601 glue.

4. A capacitive touch screen binding method, applied to the capacitive touch screen binding structure according to any one of claims 1 to 3, characterized in that: The following steps are involved: Lay the silver paste circuit layer onto the ITO film substrate, then evenly coat or laminate an insulating layer on the silver paste circuit layer, and then lay an adhesive layer on the insulating layer, ensuring that one side of the adhesive layer faces the direction of bonding with the cover plate; Lay the first FPC cover film on the cover plate, then place the FPC gold finger on the first FPC cover film, and then lay the second FPC cover film on part of the FPC gold finger to protect the gold finger from external interference, while leaving part of the gold finger uncovered by the second FPC cover film; Stick one side of the conductive tape layer to the area of ​​the second FPC cover film that is not covered by the FPC gold finger, and align and stick the other side to the silver paste circuit layer to ensure good conductivity. At the same time, the two ends of the conductive tape layer are in close contact with the second FPC cover film and the edge of the insulation layer respectively; Adjust the edge of the insulating layer so that it covers the edge of the FPC gold finger along the length direction, and the horizontal distance of the coverage is controlled to be no more than 0.1mm. Extend one end of the first FPC cover film appropriately beyond the edge of the FPC gold finger and cover it on the insulating layer. The coverage depth is controlled within the range of 0.1-0.2mm. The space formed between the first FPC cover film and the adhesive layer is filled with 8008 anti-oxidation glue to ensure structural stability and prevent oxidation; At the right angle formed between the second FPC cover film and the silver paste circuit layer, the exposed part of the silver paste circuit layer is filled with ECS0601 glue to enhance structural sealing and electrical insulation; Use appropriate lamination equipment and process parameters to press the cover plate to the ITO film substrate to ensure that all layers are tightly bonded, and then perform heat curing to complete the binding of the FPC and the capacitive touch screen sensor.

5. The capacitive touch screen binding method according to claim 4, characterized in that: The adhesive layer is made of OCA optically transparent adhesive.

6. The capacitive touch screen binding method according to claim 4, characterized in that: The conductive tape layer is anisotropic conductive hot-melt tape.

7. A method for testing the waterproofness of a capacitive touch screen, applied to the binding structure of the capacitive touch screen according to any one of claims 1 to 3, characterized in that: include: The bonded product is completely placed in a water tank for a waterproof test, ensuring that the FPC component area and the gold fingers of the output terminals are not exposed to water. During the test, the product is powered on by connecting the test board and the power is continuously supplied for 700 hours. Take the product out of water once a day and perform functional testing on the product using test software. If all functional test items pass, the product is qualified.

8. The method for testing the waterproofness of a capacitive touch screen according to claim 7, wherein: The functional test items include touch screen sensitivity test, response speed test, touch accuracy test, screen display stability test, electrical insulation performance test and sealing test.

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