Display device, storage medium, and display method

Abstract

The invention provides a display device, a storage medium and a display method capable of easily evaluating the edge shape of a film. The display method comprises the following steps: on the basis of an image obtained by shooting a peripheral region of the front surface of a substrate with a coating film formed on the front surface, for each of a plurality of circumferential positions around the center of the substrate, determining the peripheral region of the front surface of the substrate; acquiring edge information indicating a relationship between the circumferential position and an edge position of the coating film in a radial direction of the substrate; a step for displaying, on a monitor, a graph indicating the edge position for each of the circumferential positions on the basis of the edge information; and a step for determining a display range relating to the edge position on the graph on the basis of statistical information on the edge position included in the edge information before the graph is displayed on the monitor.

Description

Technical Field

[0001] The invention relates to a display device, a storage medium and a display method. Background Art

[0002] Patent Document 1 discloses a coating treatment method including a step of removing a coating film on the peripheral edge portion of a substrate.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2006-86189 Summary of the invention

[0006] Technical problem to be solved by the invention

[0007] The present invention provides a display device, a storage medium, and a display method capable of easily evaluating the edge shape of a coating film.

[0008] Technical solutions for solving technical problems

[0009] A display method according to one aspect of the present invention includes: a step of acquiring edge information representing the relationship between a circumferential position and an edge position of the coating in a radial direction of the substrate for each circumferential position included in a plurality of circumferential positions around the center of the substrate based on an image obtained by photographing a peripheral area of ​​the front side of a substrate having a coating formed on the front side; a step of displaying a curve graph representing the edge position of each circumferential position on a monitor based on the edge information; and a step of determining a display range related to the edge position on the curve graph based on statistical information of the edge position included in the edge information before displaying the curve graph on the monitor.

[0010] Effects of the Invention

[0011] According to the present invention, a display device, a storage medium, and a display method are provided, which can easily evaluate the edge shape of a coating film. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a top view schematically showing an example of a substrate processing apparatus.

[0013] Figure 2 It is a front view schematically showing an example of a substrate processing apparatus.

[0014] Figure 3 It is a schematic diagram showing an example of a liquid processing unit.

[0015] Figure 4 It is a schematic diagram showing an example of an inspection unit.

[0016] Figure 5 This is a block diagram showing an example of the functional configuration of a control device and a display device.

[0017] Figure 6 (a) Figure 6 (b) Figure 6 (c) and Figure 6 (d) is a schematic diagram illustrating a state of processing performed by the liquid processing unit.

[0018] Figure 7 (a) is a schematic diagram showing an example of a peripheral captured image. Figure 7 (b) is a diagram showing an example of edge information.

[0019] Figure 8 This is a schematic diagram showing an example of a monitor displaying a graph.

[0020] Fig. 9 This is a diagram illustrating the relationship between the display range and statistical information.

[0021] Fig.10 This is a block diagram showing an example of the hardware configuration of the control device and the display device.

[0022] Fig.11 This is a flowchart showing an example of a display method.

[0023] Fig.12 This is a schematic diagram showing an example of a monitor displaying a graph.

[0024] Fig.13 This is an example of a graph obtained before and after adjustment.

[0025] Fig.14 This is an example of a graph created during the research process.

[0026] Fig.15 This is an example of a graph created during the research process.

[0027] Fig.16 This is a schematic diagram showing an example of a monitor displaying a graph.

[0028] Fig.17 This is a schematic diagram showing an example of a monitor displaying a graph and related information.

[0029] Fig.18 This is a diagram illustrating the relationship between abnormality classification, abnormality cause, and candidate countermeasures.

[0030] Fig.19 (a) and Fig.19(b) is a schematic diagram showing an example of a sloped portion formed on the outer peripheral portion of the substrate. Fig.19 (c) is a schematic diagram showing an example of a substrate in a state where a plurality of coating films are formed.

[0031] Fig. 20 This is a schematic diagram showing an example of a monitor displaying a graph.

[0032] Fig.21 This is a schematic diagram showing an example of a monitor displaying a graph and related information.

[0033] Fig. 22 (a) Fig. 22 (b) Fig. 22 (c) and Fig. 22 (d) is a diagram for explaining an example of the contribution rate of each component of the deviation.

[0034] Fig.23 This is a schematic diagram showing an example of a monitor displaying a graph.

[0035] Description of Reference Numerals

[0036] 1...wafer processing system, U1...liquid processing unit, U3...inspection unit, W...wafer, Wa...front side, R, R1...resist coating, 200...display device, 202...monitor, 212...information acquisition unit, 214...information display unit, 216...range determination unit, 224...abnormality type determination unit, 226...candidate countermeasure determination unit, Gr...graph. DETAILED DESCRIPTION

[0037] Hereinafter, a wafer processing system as a substrate processing apparatus according to the present embodiment will be described with reference to the accompanying drawings. In addition, in this specification, elements having substantially the same functional configuration are denoted by the same reference numerals and repeated descriptions are omitted.

[0038] <Wafer processing system>

[0039] First, the configuration of a wafer processing system according to this embodiment will be described. Figure 1 , Figure 2 1 and 2 are a top view and a front view schematically showing the general structure of the wafer processing system 1. In this embodiment, the wafer processing system 1 is described as an example of a photolithography processing system that performs a resist film forming process and a development process on a wafer W. The wafer W that is the processing object of the wafer processing system 1 may also be circular.

[0040] like Figure 1As shown, the wafer processing system 1 includes: a box station 2 for carrying in and out a box C containing a plurality of wafers W; and a processing station 3, which is provided with a plurality of various processing devices for performing prescribed processing on the wafers W. Furthermore, the wafer processing system 1 has a structure that integrally connects the box station 2, the processing station 3, and an interface station 4 for transferring wafers W between the exposure device (not shown) adjacent to the processing station 3 on the opposite side. In addition, as shown in FIG. Figure 1 As shown, two processing stations 3 are provided between the cassette station 2 and the interface station 4, but one or more processing stations may be provided.

[0041] The cassette station 2 is provided with a plurality of cassette stages 21 and wafer conveying devices 22 and 23. The cassette station 2 uses the wafer conveying device 22 or 23 to convey the wafer W between the cassette C placed on the cassette stage 21 and the processing station 3. Therefore, the wafer conveying devices 22 and 23 are each provided with a driving mechanism in directions such as the X direction, the Y direction, the up-down direction, and the direction around the vertical axis (θ direction) as required, and may be provided with a driving mechanism in all directions.

[0042] At least one of the wafer conveyors 22 and 23 can deliver the wafer W to the cassette C, and can also deliver the wafer W to the processing station 3. The delivery of the wafer W to the processing station 3 refers to, for example, the delivery of the wafer W to the third block G3 provided with a delivery device accessible to the wafer conveyor 33 in the processing station 3 described later. The third block G3 may also include a plurality of delivery devices (not shown) arranged in the vertical direction.

[0043] Furthermore, the cassette station 2 may be provided with an inspection device (not shown) for inspecting the wafer W at a position accessible by either the wafer transport devices 22 and 23 .

[0044] A plurality of blocks are provided in the processing station 3, for example, the first, second and fourth blocks G1, G2 and G4. Figure 2 As shown, a plurality of layers 31 having first and second blocks G1 and G2 are stacked in the vertical direction. Figure 1 A first block G1 is provided on the negative side of the X direction of the processing station 3. Figure 1 A second block G2 is provided on the positive X-direction side of the processing station 3. Figure 1 A fourth block G4 is provided at the positive Y direction side of the processing station 3 or at the connection part with other adjacent processing stations 3. The fourth block G4 may also be provided with a plurality of handover devices arranged in the vertical direction. In addition, the third block G3 may also be provided in the processing station 3.

[0045] A plurality of processing devices are arranged in the first block G1, such as a patterning film forming device and a developing processing device, which are not shown in the figure. As the patterning film forming device, for example, in addition to the resist film forming device, an anti-reflection film forming device may also be included. For example, a plurality of processing devices are arranged in a horizontal direction. In addition, the number, arrangement, and type of these processing devices can be arbitrarily selected.

[0046] In these patterning film forming devices and developing processing devices, for example, a process of supplying a predetermined processing liquid or a process of supplying a predetermined gas onto the wafer W is performed. Thus, in the patterning film forming device, a resist film used as a mask when forming a pattern of a film on the lower layer side, an anti-reflection film for efficiently performing a light irradiation process such as an exposure process, and the like are formed. On the other hand, in the developing processing device, a portion of the resist film after exposure is removed to form a concave-convex shape as the above-mentioned mask. The first block G1 may also include a liquid processing unit U1 as an example of a patterning film forming device.

[0047] For example, in the second block G2, heat treatment devices (not shown) for performing heat treatment such as heating and cooling of the wafer W are arranged in the vertical direction and the horizontal direction. In addition, in the second block G2, in order to improve the fixation of the resist liquid and the wafer W, Figure 2 A hydrophobizing device for performing hydrophobizing treatment and a peripheral exposure device for exposing the outer periphery of the wafer W (both not shown) are arranged in the Z direction and the horizontal direction. The number and arrangement of these heat treatment devices, hydrophobizing devices, and peripheral exposure devices can also be arbitrarily selected.

[0048] like Figure 1 As shown in FIG. 1 , a region sandwiched between the first block G1 and the second block G2 in a plan view forms a wafer conveyance region 32. In the wafer conveyance region 32, for example, a wafer conveyance device 33 is disposed.

[0049] The wafer conveyor 33 has a conveyor arm that can move in the X direction, the Y direction, the θ direction, and the vertical direction. The wafer conveyor 33 can move within the wafer conveying area 32 to convey the wafer W to a predetermined device in the surrounding first block G1, second block G2, third block G3, and fourth block G4. Figure 1 As shown, in the case where there are multiple processing stations 3, the chip conveying device 33 arranged at the processing station 3 located on the side of the interface station 4 can not only convey the chip W to the first, second, and fourth blocks G1, G2, and G4, but also can convey the chip W to a specified device in the fifth block G5 described later.

[0050] For example, a plurality of wafer conveying devices 33 are arranged vertically. One wafer conveying device 33 can convey the wafer W to a plurality of layers 31 stacked vertically (see Figure 2 ) is a predetermined device at the height of the plurality of layers 31 on the upper side. For the predetermined devices at the height of the plurality of layers 31 located below these layers 31, the wafer W can be transported by other wafer transport devices 33. A plurality of wafer transport areas 32 are provided to enable such transport of the wafer W. In addition, the number of wafer transport devices 33 and the number of layers 31 corresponding to one wafer transport device 33 can be arbitrarily selected, such as by providing a wafer transport device 33 for each layer 31.

[0051] In addition, the wafer transfer area 32 or the first block G1 or the second block G2 may also include a shuttle device (not shown) that linearly transfers the wafer W between a space adjacent to one side of the processing station 3 and another space adjacent to the opposite side.

[0052] The interface station 4 is provided with a fifth block G5 including a plurality of delivery devices, and wafer conveying devices 41 and 42. The interface station 4 uses the wafer conveying device 41 or 42 to convey the wafer W between the fifth block G5 where the wafer W is delivered by the wafer conveying device 33 and the exposure device. Therefore, the wafer conveying devices 41 and 42 each have a driving mechanism in the X direction, the Y direction, the up-down direction, and the direction around the vertical axis (θ direction) as required, and may also have a driving mechanism in all directions. At least one of the wafer conveying devices 41 and 42 can support the wafer W and convey the wafer W between the delivery device and the exposure device in the fifth block G5.

[0053] A cleaning device for cleaning the surface of the wafer W and the above-mentioned peripheral exposure device may be provided in the interface station 4 at a position accessible to either the wafer transfer devices 41 and 42 .

[0054] The inspection device can be installed in the box station 2 as described above, but in the processing station 3 and the interface station 4, it can also be installed in any conveying arm ( Figure 1 or Figure 2 For example, as an example of an inspection device, an inspection unit U3 may also be provided in the processing station 3.

[0055] The above wafer processing system 1 is provided with a control device 100. The control device 100 is, for example, a computer, and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of the wafer W in the wafer processing system 1. In addition, the program storage unit also stores a program for controlling the operation of the drive system of the above-mentioned various processing devices, conveying devices, etc. to realize the wafer processing in the wafer processing system 1. In addition, the above-mentioned program can also be recorded in a computer-readable storage medium H, and installed from the storage medium H to the control device 100.

[0056] The wafer processing system 1 may include a display device 200 in addition to the control device 100. The display device 200 is connected to the control device 100 so as to be communicable. The display device 200 will be described in detail later.

[0057] <Operation of Wafer Processing System>

[0058] The wafer processing system 1 is configured as described above. Next, an example of wafer processing performed using the wafer processing system 1 configured as described above will be described.

[0059] First, a cassette C containing a plurality of wafers W is brought into the cassette station 2 of the wafer processing system 1 and placed on the cassette stage 21. Next, the wafers W in the cassette C are sequentially taken out by the wafer conveyor 22 or 23 and conveyed to the delivery device of the third block G3.

[0060] The wafer W transported to the delivery device of the third block G3 is supported by the wafer conveying device 33 and transported to the hydrophobic treatment device set in the second block G2 for hydrophobic treatment. Then, the wafer W is transported by the wafer conveying device 33 to the resist film forming device (for example, the liquid processing unit U1) to form a resist film on the wafer W. After that, the wafer W is transported to the heat treatment device for pre-baking treatment, and then transported to the delivery device of the fifth block G5. In addition, in the case of Figure 1 , Figure 2 In the case where there are multiple processing stations 3, the wafer W is temporarily placed in the delivery device of the fourth block G4 before being transported to the delivery device of the fifth block G5, and then delivered to multiple wafer conveying devices 33. In addition, the wafer W can also be transported to the peripheral exposure device by the wafer conveying device 33 as needed to perform exposure processing on the peripheral portion of the wafer W.

[0061] The wafer W transferred to the transfer device of the fifth block G5 is transferred to the exposure device by the wafer transfer devices 41 and 42, and is exposed in a predetermined pattern. In addition, the wafer W may be cleaned by a cleaning device before the exposure process.

[0062] The wafer W after the exposure process is transported to the transfer device of the fifth block G5 by the wafer transport devices 41 and 42. Thereafter, the wafer W is transported to the thermal treatment device by the wafer transport device 33 for post-exposure baking.

[0063] The wafer W subjected to the post-exposure baking treatment is transported to the developing treatment device by the wafer transport device 33 for development. After the development is completed, the wafer W is transported to the heat treatment device 40 by the wafer transport device 33 for post-bake treatment.

[0064] After that, the wafer W is transported to the delivery device of the third block G3 by the wafer transport device 33, and transported to the cassette C of the specified cassette stage 21 by the wafer transport device 22 or 23 of the cassette station 2. In this way, a series of photolithography steps are completed. The inspection unit U3 may be used to inspect the wafer W in the middle of a series of photolithography steps. The inspection unit U3 may also be used to inspect the wafer W for adjustment in the adjustment stage before starting the processing of the wafer W based on the series of photolithography steps.

[0065] In addition, the wafer processing system in the present invention is not limited to the structure and operation described above. For example, in the above-mentioned embodiment, it is described that the wafer W is transferred between the interface station 4 and the exposure device, but it is not necessary to be directly connected to the exposure device. In this case, for example, after the wafer W is transferred from the box station 2 to the transport processing station 3 and necessary processing is performed, it is transported to the box station 2 again for output to the outside. In addition, it is also possible not to set up unnecessary devices among the devices cited as processing devices, or not to perform processing in the devices.

[0066] <Liquid Processing Unit>

[0067] Next, refer to Figure 3 , an example of the liquid processing unit U1 is described. The liquid processing unit U1 supplies a processing liquid for forming a resist film (hereinafter referred to as "processing liquid L1") to the front surface Wa of the wafer W, forming a coating of the processing liquid L1 (hereinafter referred to as "resist coating"). In addition, the liquid processing unit U1 supplies a processing liquid for removing the resist coating (hereinafter referred to as "processing liquid L2") to the peripheral portion of the resist coating, forming a resist coating with the peripheral portion removed. The liquid processing unit U1, for example, has a rotating holding unit 50, a first processing liquid supply unit 60, and a second processing liquid supply unit 70.

[0068] The rotating holding part 50 holds the wafer W and rotates it. The rotating holding part 50 includes, for example, a holding part 52 and a rotation driving part 54. The holding part 52 supports the central part of the wafer W horizontally arranged with the front surface Wa facing upward, and holds the wafer W by adsorption (for example, vacuum adsorption). The rotation driving part 54 includes, for example, a power source such as an electric motor, and rotates the holding part 52 around the vertical center axis CL. Thus, the wafer W held by the holding part 52 rotates. The holding part 52 may also hold the wafer W in a manner such that the center axis CL is substantially consistent with the center of the wafer W.

[0069] The first processing liquid supply unit 60 supplies the processing liquid L1 to the front side Wa of the wafer W. The first processing liquid supply unit 60 includes a nozzle 61, a liquid source 62, a supply path 63, a valve 64, and a nozzle driving unit 65. The nozzle 61 releases the processing liquid L1 to the front side Wa of the wafer W held by the holding unit 52. The liquid source 62 contains the processing liquid L1 and presses the processing liquid L1 to the nozzle 61. The supply path 63 connects the liquid source 62 and the nozzle 61, and guides the processing liquid L1 from the liquid source 62 to the nozzle 61. The valve 64 is, for example, a pneumatic valve, which opens and closes the flow path in the supply path 63. The nozzle driving unit 65 includes a power source such as an electric motor to move the nozzle 61 in the horizontal direction. The nozzle driving unit 65 moves the nozzle 61, for example, between the central axis CL and the area outside the wafer W. The valve 64 and the nozzle driving unit 65 operate based on an action instruction from the control device 100.

[0070] The second processing liquid supply unit 70 supplies the processing liquid L2 as a chemical liquid for removing the resist film to the front surface Wa of the wafer W. The processing liquid L2 is a solvent capable of removing (dissolving) the resist film formed by the processing liquid L1. As a specific example of the processing liquid L2, an organic solvent such as a diluent can be cited. The second processing liquid supply unit 70 includes, for example, a nozzle 71, a liquid source 72, a supply path 73, a valve 74, and a nozzle driving unit 75.

[0071] The nozzle 71 releases the processing liquid L2 toward the front side Wa of the wafer W held by the holding portion 52. The liquid source 72 contains the processing liquid L2 and pressurizes the processing liquid L2 to the nozzle 71. The supply path 73 connects the liquid source 72 and the nozzle 71, and guides the processing liquid L2 from the liquid source 72 to the nozzle 71. The valve 74 is, for example, a pneumatic valve, and opens and closes the flow path in the supply path 73. The nozzle driving portion 75 includes a power source such as an electric motor, and moves the nozzle 71 in the horizontal direction. The valve 74 and the nozzle driving portion 75 operate based on an operation instruction from the control device 100. In a state where the nozzle 71 is arranged at a position where the processing liquid L2 can be released to the peripheral area of ​​the front side Wa by the nozzle driving portion 75, the processing liquid L2 is released from the nozzle 71 while the wafer W is rotated by the rotating holding portion 50, thereby removing the peripheral portion of the resist coating.

[0072] (Inspection Unit)

[0073] Next, refer to Figure 4 , an example of the structure of the inspection unit U3 is described in detail. The inspection unit U3 obtains image data as front information indicating the state of the front Wa by photographing the front Wa of the wafer W. In addition, the inspection unit U3 adjusts the orientation of the wafer W using a marking portion such as a notch formed on the wafer W. Figure 4 As shown, the inspection unit U3 includes a holding portion 81 , a rotation driving portion 82 , a detection portion 83 , and an imaging portion 87 .

[0074] The holding part 81 supports the central part of the wafer W horizontally arranged with the front surface Wa facing upward, and holds the wafer W by adsorption (e.g., vacuum adsorption). The rotation drive part 82 includes a power source such as an electric motor, and rotates the holding part 81 around the vertical center axis. Thus, the wafer W held by the holding part 81 rotates.

[0075] The detection unit 83 detects the mark portion of the wafer W. The detection unit 83 includes, for example, a light projecting unit 85 and a light receiving unit 86. The light projecting unit 85 emits light toward the peripheral portion of the rotating wafer W. The light projecting unit 85 is, for example, arranged above the peripheral portion of the wafer W, and emits light downward. The light receiving unit 86 receives the light emitted by the light projecting unit 85. The light receiving unit 86 is, for example, arranged below the peripheral portion of the wafer W in a manner opposite to the light projecting unit 85. The light receiving unit 86 outputs light receiving information indicating the result of light receiving to the control device 100. Based on the light receiving information, the control device 100 performs adjustment so that the mark portion becomes a predetermined angle. That is, the orientation of the wafer W is adjusted.

[0076] The imaging unit 87 is a camera that captures at least the peripheral area of ​​the front side Wa of the wafer W. When a resist film is formed on the front side Wa of the wafer W with the peripheral portion removed, the inspection unit U3 uses the imaging unit 87 to capture a capture range including the outer edge of the resist film and the outer edge of the wafer W while rotating the holding unit 81 (wafer W) using the rotation drive unit 82. The imaging unit 87 is disposed above the wafer W held by the holding unit 81. The imaging unit 87 operates according to an operation instruction from the control device 100, and outputs the acquired image data to the control device 100. Based on the image data, the state of the peripheral portion of the front side Wa (resist film) is inspected.

[0077] (Control device)

[0078] Next, an example of the control device 100 is described. The control device 100 controls each device and each unit included in the wafer processing system 1. Figure 5As shown, the control device 100 includes an operation instruction storage unit 112, a delivery control unit 114, a liquid processing control unit 116, and an imaging control unit 118 as functional structures (hereinafter referred to as "functional blocks"). The processing executed by these functional blocks is equivalent to the processing executed by the control device 100.

[0079] The operation instruction holding unit 112 holds (stores) operation conditions related to the formation of the resist film and the removal of the peripheral portion of the resist film by the liquid processing unit U1. The operation conditions can also be adjusted by an operator such as an operator. The operation conditions include, for example, the position of the conveying device when the wafer W is delivered in a manner that the rotating holding unit 50 holds the wafer W, and the configuration position of the nozzle 71 when removing the peripheral portion of the resist film.

[0080] The delivery control unit 114 executes a process of placing the wafer W before the resist coating is formed on the holding unit 52 of the rotating holding unit 50 by the wafer conveying device 33. The delivery control unit 114 may also control the wafer conveying device 33 based on the operation conditions stored in the operation command holding unit 112 to convey the wafer W into the liquid processing unit U1 and place the wafer W on the holding unit 52. At this time, the delivery control unit 114 may also control the wafer conveying device 33 to move to the position of the conveying device when the wafer W is delivered indicated by the above-mentioned operation conditions.

[0081] The liquid processing control unit 116 controls the liquid processing unit U1 so that a resist film is formed on the front surface Wa of the wafer W. For example, the liquid processing control unit 116 controls the nozzle driving unit 65 so that the nozzle 61 is arranged on the above-mentioned central axis CL in a state where the wafer W is held by the holding unit 52. Then, as shown in FIG. Figure 6 As shown in FIG. 2 ( a ), the liquid processing control unit 116 controls the first processing liquid supply unit 60 to discharge the processing liquid L1 from the nozzle 61 while rotating the holding unit 52 using the rotation drive unit 54 .

[0082] After the resist film is formed, the liquid processing control unit 116 controls the liquid processing unit U1 to remove the peripheral portion of the resist film. For example, the liquid processing control unit 116 controls the nozzle driving unit 75 to configure the nozzle 71 based on the operation conditions stored in the operation command holding unit 112. Figure 6 (b) of FIG. 1 illustrates the configuration of the nozzle 71. Figure 6 In (b) and the like, the resist film formed by the processing liquid L1 is indicated by “R”. The liquid processing control unit 116 may control the nozzle driving unit 75 so as to arrange the nozzle 71 at the arrangement position of the nozzle 71 indicated by the above-mentioned operation conditions.

[0083] After the nozzle 71 is arranged, the liquid processing control unit 116 controls the second processing liquid supply unit 70 to discharge the processing liquid L2 for removing the resist film R from the nozzle 71 toward the peripheral portion of the resist film R while rotating the holding unit 52 using the rotation drive unit 54 . Figure 6 (c) shows an example of releasing the processing liquid L2 from the nozzle 71. By rotating the wafer W while releasing the processing liquid L2 from the nozzle 71 to the peripheral portion of the resist film R, as shown in FIG. Figure 6 As shown in (d), the resist film R in a state where the peripheral portion is removed is formed. In removing the peripheral portion of the resist film R, the peripheral portion may be removed over the entire circumference of the resist film R. In this case, a portion of an annular region located near the outer edge of the resist film R is removed. Hereinafter, the resist film R in a state where the peripheral portion is removed is abbreviated as "resist film R1".

[0084] The imaging control unit 118 controls the inspection unit U3 so that the imaging unit 87 images the peripheral area of ​​the front surface Wa of the wafer W on which the resist film R1 is formed. The imaging control unit 118, for example, rotates the holding unit 81 holding the wafer W using the rotation drive unit 82 while the imaging unit 87 images the imaging range including the outer edge of the resist film R1 and the outer edge of the wafer W, thereby acquiring image data from the imaging unit 87. Figure 7 (a) is a schematic diagram illustrating an image obtained by photographing the peripheral portion of the front Wa (an image based on the above-mentioned image data). Figure 7 In the image shown in (a) of FIG. 1 , the horizontal direction represents the circumferential direction around the center of the wafer W, and the vertical direction represents the radial direction of the wafer W.

[0085] (Display device)

[0086] Next, an example of the display device 200 will be described. The display device 200 is a device for displaying a part of the information acquired by the control device 100 to an operator or the like. The display device 200 is connected to a monitor 202 (see Figure 1 ), the display device 200 displays the status acquired from the control device 100 on the monitor 202. For example, the operator or the like uses the display device 200 to confirm the information displayed on the monitor 202 and adjust the operation conditions stored in the operation instruction storage unit 112. The display device 200 includes, for example, an information acquisition unit 212, an information display unit 214, and a range determination unit 216 as functional blocks. The processing executed by these functional blocks is equivalent to the processing executed by the display device 200.

[0087] The information acquisition unit 212 acquires edge information based on an image (hereinafter referred to as "peripheral captured image PI") obtained by capturing the peripheral region of the front surface Wa of the wafer W having the resist film R1 (film) formed on the front surface Wa. The edge information is information indicating the relationship between each circumferential position included in a plurality of circumferential positions around the center of the wafer W and the edge position of the resist film R1 in the radial direction of the wafer W. The edge position of the resist film R1 is, for example, the position of the outer edge of the resist film R1.

[0088] The circumferential position is determined, for example, by the angle from the above-mentioned notch or other marking portion (reference position) in the circumferential direction around the center of the wafer W. The edge position of the resist film R1 is determined, for example, by the shortest distance between the center of the wafer W (the above-mentioned center axis CL) and the edge of the resist film R1. The edge (outer edge) of the resist film R1 is located at a position that is closer to the inside than the outer edge of the front side Wa of the wafer W. Therefore, the edge position of the resist film R1 can also be determined by the shortest distance between the theoretical position of the outer edge of the front side Wa and the edge of the resist film R1. The shortest distance between the theoretical position of the outer edge of the front side Wa and the edge of the resist film R1 is equivalent to the width of the portion from which a part of the resist film R is removed, and therefore can also be referred to as the removal width (cut width). Below, an example is given of calculating the edge position of the resist film R1 as the removal width.

[0089] exist Figure 7 In the peripheral image PI shown in (a), the edge (outer edge) of the resist coating R1 is represented by "E1", and the theoretical position of the outer edge of the front surface Wa is represented by "E0". In addition, the circumferential direction around the center of the wafer W is represented by "θ", and the radial direction of the wafer W is represented by "r".

[0090] The information acquisition unit 212 may also calculate the edge position of the resist coating R1 for each specified angle in the circumferential direction when generating edge information. The information acquisition unit 212 may also calculate the edge position of the resist coating R1 at any angle (e.g., 1°) between 0.5° and 30°. In the peripheral image PI, the position of the mark portion of the wafer W may also be set to 0°. The information acquisition unit 212 may calculate the edge position of the resist coating R1 based on the peripheral image PI by any image processing method.

[0091] Depending on the circumferential position, that is, the angle from the mark portion, the edge position of the resist film R1 may be different due to various reasons. Figure 7(b) shows an example of edge information, and for a plurality of circumferential positions having different values, each is associated with an edge position at the circumferential position. In addition, instead of the information acquisition unit 212 calculating the edge position itself, the information acquisition unit 212 may obtain edge information generated by calculating the edge position externally (e.g., the control device 100) from the outside.

[0092] The information display unit 214 displays a graph Gr indicating the edge position for each circumferential position on the monitor 202 based on the edge information. Figure 8 FIG. 2 shows an example of a graph Gr displayed on the monitor 202. The graph Gr visually shows the relationship between the circumferential position (angle from the mark portion) and the edge position. Figure 8 As shown, the graph Gr may be a graph of orthogonal coordinates (two-dimensional orthogonal coordinates) in which the vertical axis represents the edge position and the horizontal axis represents the circumferential position.

[0093] Figure 8 The illustrated graph Gr is a distribution graph, and the graph is drawn by plotting the values ​​of the edge position included in the edge information. The vertical axis representing the edge position may also be a linear scale in which the numerical values ​​(plotted positions) are arranged at equal intervals. The horizontal axis representing the circumferential position may also be a linear scale. The information display unit 214 displays the graph Gr on the monitor 202 according to the display range determined by the range determination unit 216. The following is an example of a display method of the graph Gr in conjunction with the description of the range determination unit 216.

[0094] Before displaying the graph Gr on the monitor 202, the range determination unit 216 determines the display range related to the edge position on the graph Gr based on the statistical information of the edge position included in the edge information. Determining the display range means determining the maximum and minimum values ​​of the edge position on the graph Gr. Figure 8 In the illustrated orthogonal coordinate graph (distribution graph), the display range related to the edge position is determined by determining the maximum value and the minimum value of the vertical axis.

[0095] exist Figure 8 In the graph Gr, the minimum value of the edge position is represented by "A" and the maximum value is represented by "B". In addition, the maximum and minimum values ​​are determined, and the range of the vertical axis is defined according to the maximum and minimum values. Therefore, the maximum and minimum values ​​themselves may be displayed on the graph Gr instead of being displayed on the graph Gr. Figure 8 In the example, "A" and "B" are recorded for the sake of convenience. Figure 8 In other figures, even when "A" and "B" are shown, the same meaning is described.

[0096] Even if the value of the edge position included in the edge information is the same, the appearance of the shape formed by plotting the edge position according to the values ​​of the minimum value A and the maximum value B (hereinafter referred to as the "plotted shape of the edge") is different. Specifically, when the difference between the maximum value B and the minimum value A is large, the change of the edge position in the plotted shape of the edge on the graph Gr becomes small. On the contrary, when the difference between the maximum value B and the minimum value A is small, the change of the edge position in the plotted shape of the edge on the graph Gr becomes large.

[0097] The information display unit 214 displays the graph Gr not only for one wafer W but also for a plurality of wafers W. In this case, the range determination unit 216 determines the display range related to the edge position for each wafer W. Assuming that the edge information obtained is different between wafers W, the display range of the edge position in the graph Gr may also be different due to the difference in edge information. The information display unit 214 may display the graph Gr in such a manner that the size of the graph Gr itself on the monitor 202 is constant even if the display range of the edge position is different.

[0098] The statistical information used to determine the display range related to the edge position may also include at least a part of the five-number summary obtained when making a box plot related to the edge position based on the edge information. The statistical information may include the first quartile, the median (the second quartile) and the third quartile in the five-number summary. The range determination unit 216 may determine the display range based on the difference between the third quartile and the first quartile (interquartile range) and the median. Fig. 9 2 illustrates the relationship between the statistical information based on the box plot and the graph Gr displayed on the monitor 202.

[0099] When the first quartile is represented as "Q1", the median (second quartile) is represented as "Med", and the third quartile is represented as "Q3", the range determination unit 216 can also determine the minimum value A and the maximum value B by the following equations (1) and (2).

[0100] A=Med-{(Q3-Q1)×α}···(1)

[0101] B=Med+{(Q3-Q1)×α}···(2)

[0102] In formula (1) and formula (2), α is a constant greater than 1. From the perspective of avoiding not displaying necessary data in the edge information, α can be greater than 1.1, greater than 1.2, greater than 1.3, or greater than 1.4. From the perspective of making it easy for an operator observing the graph Gr to grasp the change in edge position corresponding to the change in circumferential position when observing the change, α can be less than 2.0, less than 1.8, less than 1.7, or less than 1.6. By setting α to less than 1.5, the deviation value OU based on the box plot can be not displayed in the graph Gr. α is, for example, greater than 1.0 and less than 2.0, 1.1 to 1.8, or 1.4 to 1.6.

[0103] The range determination unit 216 may use an average value instead of a median value to determine the minimum value A and the maximum value B. When the average value is expressed as "Mean", the range determination unit 216 may determine the minimum value A and the maximum value B by the following equations (3) and (4).

[0104] A=Mean-{(Q3-Q1)×α}···(3)

[0105] B=Mean+{(Q3-Q1)×α}···(4)

[0106] As described above, the range determination unit 216 can determine the display range based on the median or average of the edge positions included in the edge information and a value obtained by multiplying the difference between the third quartile and the first quartile by a constant greater than 1. In addition, α can be a fixed constant or can be adjusted by the operator before drawing the graph Gr.

[0107] Fig.10 An example of the hardware structure of the control device 100 and the display device 200 is schematically shown. The control device 100 includes a circuit 180. The circuit 180 has a processor 181, a memory 182, a storage 183, an input / output port 184, and a communication port 185. The storage 183 is composed of one or more non-volatile storage devices such as a flash memory or a hard disk. The storage 183 stores programs for each functional block constituting the control device 100.

[0108] The memory 182 is composed of one or more volatile storage devices such as a random access memory. The memory 182 temporarily stores programs loaded from the memory 183. The processor 181 is composed of one or more computing devices such as a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit). The processor 181 constitutes each functional block of the control device 100 by executing the program loaded into the memory 182. The calculation results of the processor 181 are temporarily stored in the memory 182. The input and output port 184 inputs and outputs information with the liquid processing unit U1 and the inspection unit U3, etc. according to the request from the processor 181. The communication port 185 communicates with the display device 200 via wired, wireless or communication network according to the request from the processor 181.

[0109] The display device 200 includes a circuit 280. The circuit 280 has a processor 281, a memory 282, a storage 283, an input / output port 284, and a communication port 285. The storage 283 is composed of one or more non-volatile storage devices such as a flash memory or a hard disk. The storage 283 stores programs for constituting each functional block of the display device 200. The storage 283 stores at least a display program for causing a computer to execute the following steps: a step of acquiring edge information for each circumferential position based on the peripheral captured image PI, the edge information indicating the relationship between the circumferential position and the edge position of the resist film R1 in the radial direction of the wafer W; a step of displaying a graph Gr indicating the edge position of each circumferential position on the monitor 202 based on the edge information; and a step of determining a display range related to the edge position on the graph Gr based on the statistical information of the edge position contained in the edge information before displaying the graph Gr on the monitor 202.

[0110] The memory 282 is composed of one or more volatile storage devices such as a random access memory. The memory 282 temporarily stores programs loaded from the memory 283. The processor 281 is composed of one or more computing devices such as a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit). The processor 281 constitutes each functional block of the display device 200 by executing the program (display program) loaded into the memory 282. The calculation results of the processor 281 are temporarily stored in the memory 282. The input and output port 284 inputs and outputs information with the monitor 202, etc. according to the request from the processor 281. The communication port 285 communicates with the control device 100 via wired, wireless or communication network according to the request from the processor 281.

[0111] The display program may also be provided on the basis of being fixedly recorded on a tangible recording medium such as a CD-ROM, a DVD-ROM or a semiconductor memory. Alternatively, the display program may also be provided via a communication network as a data signal superimposed on a carrier. At least one of the control device 100 and the display device 200 may also be composed of a plurality of computers that can be connected to each other for communication. The control device 100 and the display device 200 may also be composed of one computer. For example, a monitor 202 may also be connected to the control device 100, and the control device 100 may have an information acquisition unit 212, an information display unit 214 and a range determination unit 216, whereby the control device 100 functions as a display device. The display device 200 may also display the graph Gr on a monitor connected to another computer.

[0112] <Display method>

[0113] Next, refer to Fig.11 , the display method executed in the display device 200 is described. Fig.11 As shown, the display device 200 first executes step S11. In step S11, for example, the display device 200 waits until the peripheral captured image PI is input. In one example, whenever an inspection process of inspecting the front surface Wa of the wafer W including the resist film R1 (the resist film R after the peripheral portion is removed) is performed, the peripheral captured image PI is input to the display device 200 from the imaging control unit 118 of the control device 100.

[0114] Next, the display device 200 executes step S12. In step S12, for example, the information acquisition unit 212 calculates the edge position of the resist coating R1 for a plurality of circumferential positions around the center of the wafer W based on the peripheral captured image PI, thereby acquiring the above-mentioned edge information. The information acquisition unit 212 may also calculate the edge position on the image based on detecting the edge based on the change in pixel value for each circumferential position (for example, each specified angle). The information acquisition unit 212 may also calculate the removal width for each circumferential position as the edge position of the resist coating R1, wherein the removal width represents the position of the edge from the theoretical circumference of the front side Wa of the wafer W. The smaller the removal width, the closer the outer edge of the resist coating R1 at the circumferential position is to the circumferential edge of the front side Wa, and the larger the removal width, the farther the outer edge of the resist coating R1 at the circumferential position is from the circumferential edge of the front side Wa.

[0115] Next, the display device 200 executes step S13. In step S13, for example, the range determination unit 216 determines the display range related to the edge position in the graph Gr displayed on the monitor 202 in the next step S14. In one example, the range determination unit 216 calculates the minimum value A and the maximum value B related to the removal width using the above equations (1) and (2), or the above equations (3) and (4).

[0116] Next, the display device 200 executes step S14. In step S14, for example, the information display unit 214 displays a graph Gr showing the change of the removal width relative to the change of the circumferential position on the monitor 202 according to the result of the display range determination in step S13 and the edge information obtained in step S12. Thus, the operator or the like can confirm the state of the edge at the peripheral portion of the wafer W that is the object of the inspection process (for example, the result after the removal with the processing liquid L2). After that, the process executed by the display device 200 returns to step S11, and the display device 200 repeats the series of processes of steps S12 to S14 in accordance with the repeated inspection process of the wafer W.

[0117] (Variation Example)

[0118] Fig.11 The series of processes shown is an example and can be changed appropriately. In the above series of processes, the display device 200 can execute a step and the next step in parallel, or can execute each step in a different order from the above example. The display device 200 can also omit any step. The display device 200 can also execute steps with different contents from the above example in the above series of processes.

[0119] The form of the graph Gr is not limited to the above-mentioned orthogonal coordinates. Fig.12 As shown, the graph Gr displayed on the monitor 202 by the information display unit 214 may be a polar coordinate graph in which the distance from the origin represents the edge position and the angle (declination) around the origin represents the circumferential position.

[0120] Fig.12 The illustrated graph Gr is a distribution graph in polar coordinate format, and the graph is drawn by plotting the values ​​of the edge position included in the edge information. When focusing on a piece of data consisting of a circumferential position and an edge position in the edge information, the position where the data is plotted is determined based on the circumferential position and the edge position. That is, on the graph Gr, the angle around the origin is determined based on the circumferential position, and the distance from the origin is determined based on the edge position. Fig.12 In FIG. 1 , for the purpose of explanation, the origin of the graph Gr is represented by “O”.

[0121] The distance from the origin indicating the edge position may be a linear scale in which numerical values ​​(plotted positions) are arranged at equal intervals. When the edge position is indicated by the removal width, the information display unit 214 may create the graph Gr in such a manner that the removal width decreases as the distance from the origin of the graph Gr increases. When the edge position is indicated by the distance from the center of the wafer W, the information display unit 214 may create the graph Gr in such a manner that the distance from the center of the wafer W increases as the distance from the origin of the graph Gr increases.

[0122] The graph Gr may also include a display area Z1 and a non-display area Z2. The display area Z1 is an area in the graph Gr where data representing edge positions included in edge information are plotted. The non-display area Z2 is an area in the graph Gr where data representing edge positions included in edge information are not plotted. The non-display area Z2 is a circular area that includes the origin of the graph Gr and is located in the center. The center of the circular non-display area Z2 coincides with the origin of the graph Gr. The display area Z1 is an annular area surrounding the non-display area Z2. The radius of the non-display area Z2 may also be 0.9 to 1.1 times, 0.95 to 1.05 times, or 0.98 to 1.02 times the width of the display area Z1 (the shortest distance between the inner edge and the outer edge). For example, the radius of the non-display area Z2 coincides with the width of the display area Z1.

[0123] Even when the polar coordinate graph Gr is displayed on the monitor 202, the information display unit 214 displays the graph Gr on the monitor 202 in accordance with the display range determined by the range determination unit 216. The range determination unit 216 determines the maximum and minimum values ​​of the edge positions on the polar coordinate graph Gr based on the statistical information of the edge positions included in the edge information. Fig.12 In the graph, the maximum value of the edge position is represented by "B", and the minimum value of the edge position is represented by "A". In addition, the origin of the curve graph is represented by "O". When the radius of the non-display area Z2 is consistent with the width of the display area Z1, the value of the origin O is calculated by the calculation formula "B+(BA)".

[0124] exist Fig.12In the example shown (the example showing the width removed), the maximum value B is equivalent to the circumference of the inner edge of the annular display area Z1, and the minimum value A is equivalent to the circumference of the outer edge of the display area Z1. Similar to the orthogonal coordinate graph Gr (distribution graph), the size of the change in the edge position in the plotted shape representing the edge in the graph Gr varies depending on the setting of the minimum value A and the maximum value B. The range determination unit 216 may also calculate the minimum value A and the maximum value B using the above-mentioned equations (1) and (2). The range determination unit 216 may also calculate the minimum value A and the maximum value B using the above-mentioned equations (3) and (4) instead of the above-mentioned equations (1) and (2).

[0125] Next, refer to Fig.13 , as shown in Fig.12 The graph Gr is displayed on the monitor 202 in polar coordinate format as shown in the example. In the inspection of the wafer W using the peripheral captured image PI, the operator or the like evaluates whether the shape of the edge of the resist film R1 is appropriate based on the edge information. One of the cases where the shape of the edge is inappropriate is "eccentricity" which means that the center of the edge shape is offset from the center of the wafer W. In the case where the edge shape is eccentric, for example, the position of the wafer conveyor 33 when delivering the wafer W from the wafer conveyor 33 to the holding portion 52 of the liquid processing unit U1 is adjusted.

[0126] exist Fig.13 In "(a)" and "(b)", for the sake of explanation, the graphs of orthogonal coordinates are shown on the left and the graphs of polar coordinates are shown on the right. Fig.13 (a) shows a graph of edge information obtained before adjusting the position of the wafer conveyor 33. Fig.13 (b) in FIG. 1 shows a graph of edge information obtained after adjusting the position of the wafer conveyor 33. When a graph of orthogonal coordinates is shown on the monitor 202, an operator or the like needs to Fig.13 The graph on the left side of (a) shows that eccentricity has occurred. In this case, the operator or the like needs to imagine (visualize) the actual edge shape in his or her mind based on the graph of the orthogonal coordinates.

[0127] On the other hand, Fig.13 The polar coordinate graph on the right side of (a) shows a shape close to the actual edge shape on the monitor 202. Therefore, even if the operator does not imagine the edge shape in his mind, he can immediately understand the edge shape by observing the graph on the monitor 202. Fig.13 In the right side graphs of (a) and (b), the center of the edge shape is represented by "CP (Δx, Δy)". Fig.13 Compared with (a), Fig.13In the right side graph of (b), CP(Δx, Δy) is close to the origin of the graph.

[0128] Another example of an inappropriate edge shape is when the edge shape is not a circle (a perfect circle) but an "ellipse". Fig.13 In the graphs on the right side of (a) and (b), the single-point dashed line represents a perfect circle with the center of the edge shape as the center. Whether the edge shape is an ellipse or not can be evaluated more easily with the polar coordinate graph than with the orthogonal coordinate graph. For example, in order to be able to evaluate whether the edge shape is an ellipse based on the orthogonal coordinate graph, a certain degree of proficiency is required. In contrast, by displaying the polar coordinate graph on the monitor 202, even an operator with little experience can easily evaluate whether it is an ellipse.

[0129] As a result of various studies, the following findings were obtained: by setting the display area Z1 and the non-display area Z2 in the polar coordinate graph Gr, and setting the minimum value A and the maximum value B as described above (see Fig.12 ), the edge shape on the graph Gr can be made closer to the actual shape. Fig.14 and Fig.15 , explaining the graphs produced during the research. Fig.14 and Fig.15 In order to facilitate understanding, the orthogonal coordinate graphs are shown side by side next to the polar coordinate graphs. Fig.14 (a) and (b) in Fig.15 In each of (a) and (b) in FIG. 1 , “MAX” indicates the maximum value of the edge position in the edge information, and “MIN” indicates the minimum value of the edge position in the edge information.

[0130] exist Fig.14 In the polar coordinate curve graph shown in (a), the origin is set to 0 mm, and the outermost periphery is set to 150 mm as an example of the radius of the wafer W. Moreover, the edge position is the distance from the center of the wafer W. An example of the removal width at the peripheral area of ​​the front Wa is about 1 / 300 to 1 / 50 times the radius of the wafer W. Therefore, according to Fig.14 In the polar coordinate graph in (a), it is difficult to understand the change in the edge position relative to the change in the circumferential position.

[0131] then Fig.14 The example shown in (a) was produced and studied Fig.14 (b) shows the polar coordinate graph. Fig.14In the polar coordinate graph shown in (b), the edge position is the removal width, the origin is set to the maximum value in the measurement result (edge ​​information), and the outermost periphery is set to the minimum value in the measurement result (edge ​​information). In addition, the entire circular area including the origin is set as the area for plotting data. In this case, the origin of the graph is the maximum value of the measurement result (the maximum value of the removal width), so when there are two or more peaks in the plotted shape of the graph, an extremely contracted part is generated in the polar coordinate graph.

[0132] according to Fig.14 The research results are shown in the graph (b). Fig.15 As shown in (a) of FIG. 1 , the display area Z1 and the non-display area Z2 are set in the polar coordinate graph. Fig.15 In the polar coordinate curve diagram shown in (a), the edge position is the removal width, and the circumference of the inner edge of the display area Z1 is set as the maximum value of the measurement result (edge ​​information), and the circumference of the outer edge of the display area Z1 is set as the minimum value of the measurement result (edge ​​information). In this case, Fig.14 Compared with the graph shown in (b), the discomfort is reduced, but the distortion relative to the actual edge shape (ellipse) remains. For example, the distortion is large in the portion close to the maximum value of the measurement result.

[0133] exist Fig.15 (b) shows that when the measurement result (edge ​​information) contains an offset value, Fig.15 The graph of polar coordinates is drawn under the same conditions as the graph shown in (a). "MAX (outlier)" indicates the maximum value of the measurement result and is the deviation value, and "MIN (outlier)" indicates the minimum value of the measurement result and is the deviation value. In this case, the minimum and maximum values ​​in the display range of the graph are set as the deviation values, respectively, and it is difficult to understand the change of the edge position relative to the change of the circumferential position from the graph.

[0134] according to Fig.15 Based on the results of the study of the graphs shown in (a) and (b), the minimum value A and the maximum value B of the edge position on the graph are set by the calculation of equations (1) and (2), or the calculation of equations (3) and (4). Fig.12 In the curve graph shown in FIG. 1 , the distortion is small relative to the actual edge shape (ellipse) and is not easily affected by the deviation value.

[0135] Fig.162 shows another example of the graph Gr displayed on the monitor 202. The information display unit 214 may display the graph Gr on the monitor 202 in such a manner that the points representing the edge positions respectively associated with the plurality of circumferential positions are displayed in colors corresponding to the sizes of the edge positions. Fig.16 In the graph shown, light and dark represent the difference in color. For example, the color of the plotted points is set so as to change in descending order from the maximum value of the removal width to red, orange, yellow, green, blue, and purple. In this case, the difference in color makes it easier to understand the portion with a small removal width and the portion with a large removal width.

[0136] Fig.17 Another example of the monitor 202 in a state of displaying the graph Gr is shown. In addition to displaying the graph Gr, the information display unit 214 can also display related information obtained from the edge information on the monitor 202. In addition to displaying the graph Gr, the information display unit 214 can also display the first related information 252 on the monitor 202. The first related information 252 is information indicating the contribution rate of each cause of the deviation of the edge position in one edge information (within one wafer W). The degree of deviation of the edge position can be evaluated by calculating the standard deviation (σ), for example. However, based on the calculated value of the standard deviation, it is impossible to understand what kind of cause is caused and to what extent these causes contribute to the deviation.

[0137] The deviation of the edge position in the edge information includes, as causes, a first component, a second component, and a residual component. The first component is a component caused by the eccentricity of the difference between the center of the edge shape obtained by the set of edge positions at multiple circumferential positions and the center of the wafer W (deviation caused by eccentricity). The second component is a component caused by the above-mentioned edge shape becoming an ellipse (deviation caused by becoming an ellipse). The residual component is a component caused by the residual other than the first component and the second component (deviation caused by the residual). The residual component is mainly a component caused by the roughness of the small changes (concavity and convexity) generated at the edge.

[0138] The display device 200 may also include a contribution rate calculation unit 222 as a functional block (see Figure 5 ). The contribution rate calculation unit 222 calculates the contribution rate of the first component, the contribution rate of the second component, and the contribution rate of the residual component. The contribution rate calculation unit 222 may, for example, perform polynomial model fitting on the edge information and calculate the above contribution rates based on the coefficients of the polynomial (approximate formula) obtained by model fitting.

[0139] The formula shown in the following formula (5) is an example of an approximate formula used in polynomial model fitting. In formula (5), w is a variable representing the removal width (edge ​​position), and θ is a variable representing the circumferential position. In addition, w0 is a constant, and (-c1), (-s1), (-c2) and (-s2) are coefficients. Through model fitting, the coefficients of (-c1), (-s1), (-c2) and (-s2) can be obtained based on the edge information. Using (-c1) and (-s1), the eccentric position in the edge shape can be calculated, and using (-c2) and (-s2), the ellipse deflection angle and ellipse amplitude can be calculated.

[0140] w=w0+(-c1)cosθ+(-s1)sinθ+(-c2)cos2θ+(-s2)sin2θ…(5)

[0141] When calculating the contribution rate of each component, the contribution rate calculation unit 222 first standardizes each removal width included in the edge information so that the average is 0 and the standard deviation is 1. That is, the contribution rate calculation unit 222 divides the value obtained by subtracting the average value (μ) of the removal width from each calculated value of the removal width by the standard deviation (σ) of the removal width, thereby performing standardization. Regarding the standardized removal width, the contribution rate calculation unit 222 calculates the coefficients of the approximate formula shown in Formula (5) by model fitting.

[0142] After normalizing and calculating the coefficients of the approximate formula, the contribution rate calculation unit 222 calculates the contribution rates of the first component, the second component, and the residual component using the following equations (6) to (8). In equations (6) to (8), the square of r means the coefficient of determination of the multiple regression equation.

[0143] Contribution of the first component:

[0144] Contribution of the second component:

[0145] Contribution rate of residual component: 1-r 2 …(8)

[0146] The information display unit 214 may also display the second related information 254 on the monitor 202 in addition to the graph Gr and the first related information 252. The second related information 254 includes information indicating the result of determining the type of abnormality between the edge shape obtained from the edge information (the shape of the actual edge measured) and the theoretical edge shape. The theoretical edge shape is, for example, a perfect circle whose center coincides with the center of the wafer W and whose radius is a set value. The second related information 254 includes information indicating candidate countermeasures corresponding to the result of determining the type of abnormality.

[0147] exist Fig.18 The relationship between the classification of abnormalities in edge shapes obtained based on edge information and the cause of the abnormalities, and the relationship between the cause of the abnormalities and candidate countermeasures are illustrated. As the classification of abnormalities, for example, errors in the average removal width, eccentricity, ellipse, and roughness (small changes) in the edge can be cited. The classification of abnormalities and the candidate countermeasures corresponding to the classification of abnormalities are pre-associated. Two or more candidate countermeasures may also be associated with one classification of abnormalities. The display device 200 may also store information associating the classification of abnormalities with the candidate countermeasures for eliminating the abnormalities (hereinafter referred to as "associated information"). The associated information may not include Fig.18 The cause of the exception shown.

[0148] The display device 200 may include an abnormality type identification unit 224 and a candidate countermeasure determination unit 226 as functional blocks (see Figure 5 ). After the information acquisition unit 212 acquires the edge information, the abnormality type identification unit 224 identifies the type of abnormality existing between the edge shape obtained by the set of edge positions at a plurality of circumferential positions and the theoretical edge shape.

[0149] The abnormality type determination unit 224 may, for example, determine whether the average removal width contains an error by comparing the arithmetic mean of the edge position with a set value after calculating the average value of the edge position based on the edge information. The abnormality type determination unit 224 may also determine that the abnormal classification is eccentricity when the value of three times the standard deviation is greater than a prescribed value and the contribution rate of the first component is greater than a prescribed value. The abnormality type determination unit 224 may also determine that the abnormal classification is ellipse when the value of three times the standard deviation is greater than a prescribed value and the contribution rate of the second component is greater than a prescribed value. The abnormality type determination unit 224 may also determine that the abnormal classification is roughness when the value of three times the standard deviation is greater than a prescribed value and the contribution rate of the residual component is greater than a prescribed value.

[0150] The candidate countermeasure decision unit 226 may also decide a candidate countermeasure corresponding to the result of the determination of the type of abnormality based on the above-mentioned related information after the abnormality type determination unit 224 determines the type of abnormality. The information display unit 214 may also display the result of the determination of the type of abnormality and the result of the determination of the candidate countermeasure on the monitor 202 as the second related information 254.

[0151] like Fig.17As shown in the example, the abnormality type determination unit 224 may determine two or more abnormality classifications. The candidate countermeasure determination unit 226 may also determine two or more candidate countermeasures for one abnormality classification. By displaying the determination result of the abnormality classification and the decision result of the candidate countermeasure for eliminating the abnormality on the monitor 202, even an inexperienced operator can easily understand the countermeasure that should be prioritized. Fig.17 In the example shown, eccentricity and ellipse are determined as abnormality classifications.

[0152] The information display unit 214 may display either the first related information 252 or the second related information 254 together with the graph Gr on the monitor 202 instead of both the first related information 252 and the second related information 254. The information display unit 214 may display the first related information 252 and the second related information 254 separately from the screen displaying the graph Gr on the monitor 202. In one example, the information display unit 214 may switch between the screen displaying the graph Gr and the screen displaying at least one of the first related information 252 and the second related information 254 based on user input.

[0153] The information display unit 214 may display other information on the monitor 202 together with the graph Gr, in addition to or in place of the first related information 252 and the second related information 254. Examples of other information displayed on the monitor 202 include the arithmetic mean of the removed width, the center (eccentric position) of the edge shape, the ellipse deflection angle, the ellipse amplitude, the standard deviation indicating the degree of deviation, and other statistical information (average value, range, maximum value, and minimum value) of the edge position.

[0154] The display device 200 may not have the function of drawing a distribution graph of polar coordinates, but may have the function of drawing a distribution graph of orthogonal coordinates. In this case, the information display unit 214 may draw the distribution graph after transforming each edge position determined by the edge information into orthogonal coordinates. Fig.12 The polar coordinate graph Gr as shown in the example. That is, the polar coordinate graph Gr can be a graph in which information indicating edge positions is expressed by distances from the origin and angles around the origin when displayed on the monitor 202.

[0155] like Fig.19 (a) and Fig.19 As shown in (b), a bevel portion BP may be formed on the outer periphery of the wafer W. The bevel portion BP is a portion formed by chamfering the outer periphery of the wafer W. Fig.19As shown in (a) of FIG. 1 , the chamfered portion BP is formed by chamfering the wafer W in such a way that the outer edge thereof is curved when viewed from the side. Fig.19 As shown in (b) of FIG. 1 , the bevel portion BP is formed by chamfering so as to form inclined planes on the front side and the back side.

[0156] In the present invention, when a bevel portion BP is formed on the outer periphery of the wafer W, the "front side" of the wafer W also includes the bevel portion BP when viewed from the front side Wa. In this case, the front side Wa includes a substantially flat plane portion and a curved surface or inclined surface of the bevel portion BP (a portion that can be viewed from the front side Wa). Fig.19 (a) and Fig.19 In each figure (b) of FIG. 1 , "bL" indicates the boundary between the bevel portion BP of the front surface Wa and the portion other than the bevel portion BP. The boundary bL extends in the circumferential direction around the center of the wafer W. When the bevel portion BP is formed, the edge position of the resist film R1 is located inside the boundary bL. The bevel portion BP may also be included in the peripheral captured image PI, which is an image obtained by capturing the peripheral area of ​​the front surface Wa of the wafer W.

[0157] like Fig.19 As shown in (c), a plurality of resist films may be formed on the front surface Wa of the wafer W. The peripheral edge portions of the plurality of resist films may also be removed by the processing liquid L2 or the like. Fig.19 In the example shown in (c), as a plurality of resist films whose peripheral portions have been removed, resist films R1, R2, and R3 are formed on the front surface Wa. The resist films R1, R2, and R3 are formed in an overlapping manner starting from the front surface Wa. Fig.19 In (c), “E1” represents the edge (outer edge) of the resist film R1, “E2” represents the edge (outer edge) of the resist film R2, and “E3” represents the edge (outer edge) of the resist film R3.

[0158] The information acquisition unit 212 of the display device 200 may also acquire edge information related to the edge E1, edge information related to the edge E2, and edge information related to the edge E3. The edge information related to the edge E1 is information indicating the relationship between the circumferential position and the radial position of the edge E1 for each circumferential position. The peripheral captured image PI for obtaining the edge information related to the edge E1 may also be obtained before the resist film R2 and the resist film R3 are formed.

[0159] The edge information related to the edge E2 is information indicating the relationship between the circumferential position and the radial position of the edge E2 for each circumferential position. The peripheral captured image PI for obtaining the edge information related to the edge E2 can also be obtained before the resist coating R3 is formed. The edge information related to the edge E3 is information indicating the relationship between the circumferential position and the radial position of the edge E3 for each circumferential position. From the peripheral captured image PI obtained after the resist coating R3 is formed, only the edge information related to the edge E3 can be obtained, or the edge information related to the edge E1, the edge E2, and the edge E3 can be obtained separately.

[0160] like Fig. 20 As shown, the information display unit 214 may display a graph Gr including information indicating the edge position related to the edge E1, information indicating the edge position related to the edge E2, and information indicating the edge position related to the edge E3 on the monitor 202. Fig. 20 In FIG. 1 , “EL1” is a plot group (point group) representing edge positions related to edge E1, and is plotted on the graph Gr based on edge information related to edge E1. “EL2” is a plot group representing edge positions related to edge E2, and is plotted on the graph Gr based on edge information related to edge E2. “EL3” is a plot group (point group) representing edge positions related to edge E3, and is plotted on the graph Gr based on edge information related to edge E3. A plot group (plots) represents a collection of points (data points).

[0161] The minimum value A and the maximum value B that define the display range of the graph Gr may also be determined based on edge information that combines all edge information related to edge E1, edge information related to edge E2, and edge information related to edge E3 (hereinafter referred to as "combined edge information"). The range determination unit 216 may determine the minimum value A and the maximum value B using the above-mentioned formulas (1) and (2), or the above-mentioned formulas (3) and (4) based on statistical information calculated based on the above-mentioned combined edge information. Alternatively, the range determination unit 216 may determine the display range of the graph Gr based on the range defined by the arithmetic mean of the minimum value A and the arithmetic mean of the maximum value B after determining the minimum value A and the maximum value B for each edge. By simultaneously displaying information related to a plurality of edges on the graph Gr, an operator or the like can easily understand the relationship between the edge shapes.

[0162] When information about a plurality of edges is displayed on the graph Gr, it is also possible to switch to a screen displaying detailed information about a designated edge among the plurality of edges based on an input from a user such as an operator. Fig. 20In the illustrated screen, the user can also specify an edge. For example, the user may select a plot group related to each edge on the graph Gr by pressing or the like, or a button for selecting an edge may be displayed on the screen separately from the graph Gr.

[0163] Fig.21 2 shows an example of a screen after the user selects edge E1 and switches. After the user selects, the information display unit 214 can display a graph Gr showing only the edge position of the selected edge, that is, edge E1, on the monitor 202. At this time, the range determination unit 216 can recalculate the minimum value A and the maximum value B by considering only the edge information related to edge E1, and then change the display range of the edge position on the graph Gr. After the user selects, the information display unit 214 can also Fig.16 Similarly to the display form shown in the example, a graph Gr is drawn which indicates the edge position of the edge E1 which is the selected edge in color.

[0164] After the user's selection, the information display unit 214 may display related information obtained from edge information related to the selected edge on the monitor 202 in addition to the graph Gr related to the selected edge. The information display unit 214 may also display the first related information 252, the second related information 254, and at least one of various information other than the first related information 252 and the second related information 254 on the monitor 202 as the above-mentioned related information together with the graph Gr.

[0165] The contribution rate calculation unit 222 may also calculate the contribution rate of the first component, the second component, the third component, the fourth component, and the residual component instead of the contribution rate of the first component, the contribution rate of the second component, and the contribution rate of the residual component. The first related information 252 may also include information representing the contribution rate of the first component, the second component, the third component, the fourth component, and the residual component. The contribution rate calculation unit 222 may also use the approximate formula shown in the following formula (9) instead of the above formula (5) to perform polynomial model fitting. Compared with formula (5), the terms of cos3θ, sin3θ, cos4θ, and sin4θ are added to formula (9).

[0166] w=w0+(-c1)cosθ+(-s1)sinθ+(-c2)cos2θ+(-s2)sin2θ+(-c3)cos3θ+(-s3)sin3θ+(-c4)cos4θ+(-s4)sin4θ…(9)

[0167] When calculating the contribution rate of each component, for example, similar to the above example, the contribution rate calculation unit 222 standardizes each removal width included in the edge information so that the average is 0 and the standard deviation is 1. Regarding the standardized removal width, the contribution rate calculation unit 222 calculates the coefficient of the approximate formula shown in formula (9) by model fitting. After standardizing and calculating the coefficient of the approximate formula, the contribution rate calculation unit 222 calculates the contribution rates of the first component, the second component, the third component, the fourth component, and the residual component through the following formulas (10) to (14).

[0168] Contribution of the first component:

[0169] Contribution of the second component:

[0170] Contribution rate of the third component:

[0171] Contribution rate of the fourth component:

[0172] Contribution rate of residual component: 1-r 2 …(14)

[0173] exist Fig.21 In the illustrated first related information 252, "Eccentricity" represents the first component, and "Ellipse" represents the second component. In addition, "3 cycles" represents the third component, "4 cycles" represents the fourth component, and "Roughness" represents the residual component. Fig. 22 (a) shows a plot group ΔC1 based on the first component (component caused by eccentricity), and "PC" is a perfect circle. Here, "plot group" refers to the collection of points drawn in the scatter plot. When observing a circle from a certain reference point in the circumferential position (when observing in a curve graph of orthogonal coordinates), the plot group ΔC1 changes in a way that forms a peak and a valley. Fig. 22 (b) shows a plot group ΔC2 based on the second component (component due to the ellipse). When one circle is observed from the reference point of the circumferential position, the plot group ΔC2 changes so as to form two peaks and two valleys.

[0174] exist Fig. 22 (c) shows the plot group ΔC3 based on the third component. When observing one circle from the reference point of the circumferential position, the plot group ΔC3 changes in a way that forms three peaks and three valleys. The third component can be said to be a deviation caused by the edge shape becoming a shape with three cycles of change. Using (-c3) and (-s3), the amplitude and deflection angle in the shape with 3 cycles of change can be calculated. Fig. 22 (d) shows the plot group ΔC4 based on the fourth component. When observing one circle from the reference point of the circumferential position, the plot group ΔC4 changes in a way that four peaks and four valleys are formed on the curve graph. The fourth component can be said to be a deviation caused by the edge shape becoming a shape with four cycles of change. Using (-c4) and (-s4), the amplitude and deflection angle in the shape with four cycles of change can be calculated.

[0175] The residual component is a component caused by the residual other than the first component, the second component, the third component, and the fourth component (deviation caused by the residual). As described above, as polynomials for model fitting, equation (5) including terms up to cos2θ and sin2θ, and equation (9) including terms up to cos4θ and sin4θ are exemplified. The polynomial for model fitting is not limited to equation (5) and equation (9), and may be an equation including terms up to cos(nθ) and sin(nθ) (where n is an integer greater than 2).

[0176] exist Fig.23 , there is illustrated a case where the graph Gr is displayed on the monitor 202 in a manner different from the various examples described above. In the case where a bevel portion BP is formed on the outer peripheral portion of the chip W, as described above, the peripheral captured image PI can also be captured in a manner that includes the bevel portion BP and the boundary bL of the portion that is not the bevel portion BP. The information acquisition unit 212 can also obtain boundary information from the peripheral captured image PI in the same way as the edge information about the edge of the resist film R1 is obtained. The boundary information is information that represents the relationship between the circumferential position and the position of the boundary bL in the radial direction of the chip W (hereinafter referred to as "the boundary position of the bevel portion BP") for each circumferential position. The boundary position of the bevel portion BP can also be defined by the shortest distance in the radial direction between the theoretical position of the outer edge of the chip W and the boundary bL.

[0177] The information display unit 214 may display the graph Gr on the monitor 202 in a manner that indicates the boundary position of the slope portion BP at each circumferential position in addition to the edge position at each circumferential position. Fig.23 In FIG. 1 , a plot group (a collection of points) indicated by “EL” represents an edge position at each circumferential position.

[0178] In one example, the information display unit 214 divides the display area Z1 indicating the area where the plot group EL related to the edge position is drawn into two areas according to the boundary position of the slope portion BP. Fig.23In the figure, the area located on the outside of the two areas divided by the boundary position of the bevel portion BP is represented by "Z11", and the area located on the inside is represented by "Z12". The information display unit 214 can also display (depict) the area Z11 and the area Z12 in different ways. In one example, the concentration of the color in the grayscale is different between the area Z11 and the area Z12, or the color is different, or the pattern of the background is different. In this case, the boundary BL between the area Z11 and the area Z12 on the curve graph Gr represents the boundary position of the bevel portion BP at each circumferential position.

[0179] Instead of making the display method different, the information display unit 214 may display the background of the entire display area Z1 in the same manner and, similarly to the plot group EL, draw a plot group (a collection of points) indicating the boundary position of the bevel portion BP on the graph Gr. The information display unit 214 may display the center Δcp1 of the edge shape based on the information on the edge of the resist film R1 and the center Δcp2 of the shape based on the information on the boundary position of the bevel portion BP on the graph Gr.

[0180] By simultaneously displaying information related to the edge of the resist film R1 and information related to the boundary position of the bevel portion BP on the graph Gr, the operator and the like can easily grasp the relationship between the shape of the boundary bL and the edge shape. The shape of the boundary bL refers to the outer edge of the usable range of the front side Wa of the wafer W. For example, when the position of the boundary bL in the radial direction of the wafer W is different depending on the circumferential position, even if the position of the nozzle 71 for releasing the processing liquid L2 for removing a portion of the resist film R is constant, the flow of the processing liquid L2 after the release also changes. Due to this change, the edge position (removal width) of the resist film R1 may be different depending on the circumferential position. In one example, on the graph Gr, when the shape of the boundary position of the bevel portion BP shows the same tendency as the edge shape of the resist film R1, the operator and the like can judge that the shape of the wafer W itself before the formation of the resist film is likely to be the cause of abnormalities such as eccentricity.

[0181] In the above example, the resist film R is formed by applying the processing liquid L1, but the method of forming the resist film R is not limited thereto. The patterning film forming device of the wafer processing system 1 can form the resist film R by vapor deposition (e.g., CVD: Chemical Vapor Deposition). The patterning film forming device can also form the resist film R by various methods other than the application and vapor deposition of the processing liquid L1.

[0182] In the above example, the peripheral portion of the resist film R is removed by the processing liquid L2, but the method of removing the peripheral portion is not limited thereto. The peripheral portion of the resist film R may also be removed by the peripheral exposure device of the wafer processing system 1. The wafer processing system 1 may also remove the peripheral portion of the resist film R by various other methods other than supplying and exposing the processing liquid L2.

[0183] A ring-shaped resist film R may be formed in the peripheral region of the front surface Wa of the wafer W. In this case, the information acquisition unit 212 of the display device 200 may acquire the position of the inner edge of the ring-shaped resist film R for each of a plurality of circumferential positions as edge information. The film to be the target of the edge information displayed by the display device 200 is not limited to the resist film R. The display device 200 may display the graph Gr indicating the edge position of any type of film on the monitor 202. In one of the various examples described above, at least a part of the contents described in other examples may be combined.

[0184] <Summary of the Invention>

[0185] The present invention relates to the following methods or structures (1) to (21).

[0186] (1) A display method, comprising: a step of acquiring edge information for each circumferential position included in a plurality of circumferential positions around the center of the substrate (W), based on an image (PI) obtained by photographing a peripheral area of ​​a front side (W) of a substrate (W) having a coating (R1) formed on the front side (W), the edge information representing the relationship between the circumferential position and the edge position of the coating (R1) in the radial direction of the substrate (W); a step of displaying a graph (Gr) representing the edge position of each circumferential position on a monitor (202) based on the edge information; and a step of determining a display range related to the edge position on the graph (Gr) based on statistical information of the edge position included in the edge information before displaying the graph (Gr) on the monitor (202).

[0187] In the display method, the display range related to the edge position on the graph (Gr) is determined based on the statistical information of the edge position included in the edge information. Depending on the setting of the display range, there is a tendency that the change of the edge position cannot be seen in the edge shape obtained from the edge information, or the data of a part of the edge position is not displayed, which makes it difficult to evaluate the edge shape. In contrast, in the above-mentioned display method, since the display range is determined based on the statistical information, the operator who sees the graph (Gr) can draw the graph (Gr) on the monitor (202) within the range that makes it easy to evaluate the edge shape obtained from the edge information. Therefore, the above-mentioned display method can easily evaluate the edge shape of the coating.

[0188] (2) A display method according to (1) above, wherein the statistical information includes at least a portion of a five-number summary obtained when a box plot related to edge positions is produced based on edge information.

[0189] In this case, the display range on the graph (Gr) is determined and changed based on the information for creating the box plot. Therefore, the operator or the like can easily evaluate the state of the edge in the edge shape by observing the graph (Gr).

[0190] (3) A display method according to (2) above, wherein, in the step of determining the display range, the display range is determined based on the median or mean of the edge positions contained in the edge information and a value obtained by multiplying the difference between the third quartile and the first quartile by a constant greater than 1.

[0191] In this case, it is possible to avoid non-display of necessary data in the edge information, and the operator or the like can easily grasp the change in the edge position corresponding to the change in the circumferential position when observing the change in the edge position.

[0192] (4) The display method according to any one of (1) to (3) above, wherein the graph (Gr) is a graph of polar coordinates in which the distance from the origin represents the edge position and the angle around the origin represents the circumferential position.

[0193] In this case, the state of the edge based on the edge information can be displayed to the operator or the like in a form close to the actual shape of the edge. Therefore, the edge shape of the coating can be evaluated more easily.

[0194] (5) A display method according to (4) above, wherein, in the step of displaying the graph (Gr) on the monitor (202), points representing edge positions associated with a plurality of circumferential positions are displayed in a color corresponding to the size of the edge positions.

[0195] In this case, the size of the edge position relative to the reference position (for example, the outer edge position of the front side) can also be understood based on the color. Therefore, the convenience of the user such as the operator can be improved.

[0196] (6) The display method according to any one of (1) to (3) above, wherein the graph (Gr) is a graph of orthogonal coordinates in which the vertical axis represents the edge position and the horizontal axis represents the circumferential position.

[0197] In this case, since the change in the edge position is expressed as a change in the vertical axis, it is easy for an operator or the like to understand the change in the edge position.

[0198] (7) A display method according to any one of (1) to (6) above, further comprising the following steps: with respect to the deviation of the edge position in the edge information, at least the contribution rate of the first component caused by the eccentricity of the difference between the center of the edge shape obtained by a set of edge positions at a plurality of circumferential positions and the center of the substrate (W), the contribution rate of the second component caused by the edge shape becoming an ellipse, and the contribution rate of the residual component caused by the residual are displayed on the monitor (202).

[0199] In this case, an operator or the like can easily know why and to what extent the deviation in edge position has occurred.

[0200] (8) A display method according to any one of the above (1) to (7), which further includes: a step of determining the type of anomaly between an edge shape obtained by a set of edge positions at multiple circumferential positions and a theoretical edge shape; a step of determining a candidate countermeasure corresponding to the result of determining the type of anomaly based on association information that establishes an association between the type of anomaly and a candidate countermeasure for eliminating the anomaly; and a step of displaying the result of determining the type of anomaly and the result of determining the candidate countermeasure on a monitor (202).

[0201] In this case, even an inexperienced operator can easily understand the high priority countermeasure to be performed next. As a result, the execution content of the countermeasure for eliminating the abnormality is less likely to differ among the operators.

[0202] (9) A display method according to the above (8), wherein in the above display method, a curve graph (Gr), a determination result of the type of abnormality and a determination result of a candidate countermeasure, and a contribution rate of the deviation of the edge position in the edge information are displayed together on a monitor (202), and the above contribution rate includes: a contribution rate of a first component caused by the eccentricity of the difference between the center of an edge shape obtained by a set of edge positions at a plurality of circumferential positions and the center of a substrate (W); a contribution rate of a second component caused by the edge shape becoming an ellipse; and a contribution rate of a residual component caused by a residual.

[0203] In this case, an operator or the like can comprehensively judge various information and decide on an appropriate measure.

[0204] (10) A display method according to any one of the above (1) to (9), wherein the image (PI) is obtained by photographing a portion including a bevel portion (BP) formed on the outer peripheral portion of the substrate (W) and a boundary (bL) of a portion other than the bevel portion (BP), and in a curve graph (Gr) displayed on a monitor (202), in addition to indicating the edge position of each circumferential position, the position of the boundary (bL) in the radial direction of the substrate (W) is also indicated for each circumferential position.

[0205] In this case, an operator or the like can easily understand the relationship between the shape of the boundary (bL) and the edge shape based on the graph (Gr).

[0206] (11) A computer-readable storage medium storing a program (display program) for causing a device to execute the display method described in any one of (1) to (10) above.

[0207] (12) A display device (200), comprising: an information acquisition unit (212), which, based on an image (PI) obtained by photographing a peripheral area of ​​a front side (W) of a substrate (W) having a coating (R1) formed on the front side (Wa), acquires edge information representing the relationship between each circumferential position included in a plurality of circumferential positions around the center of the substrate (W) and the edge position of the coating (R1) in the radial direction of the substrate (W); an information display unit (214), which, based on the edge information, displays a curve graph (Gr) representing the edge position of each circumferential position on a monitor (202); and a range determination unit (216), which, before displaying the curve graph (Gr) on the monitor (202), determines a display range related to the edge position on the curve graph (Gr) based on statistical information of the edge position included in the edge information.

[0208] This display device can easily evaluate the edge shape of the coating film, similarly to the above-mentioned display method.

[0209] (13) A display device (200) according to (12) above, wherein the statistical information includes at least a portion of a five-number summary obtained when a box plot related to edge positions is produced based on edge information.

[0210] In this case, an operator or the like can easily evaluate the state of the edge in the edge shape by observing the graph (Gr).

[0211] (14) A display device (200) according to the above (13), wherein the range determination unit (216) determines the display range based on the median or average of the edge positions contained in the edge information and a value obtained by multiplying the difference between the third quartile and the first quartile by a constant greater than 1.

[0212] In this case, it is possible to avoid non-display of necessary data in the edge information, and the operator or the like can easily grasp the change in the edge position corresponding to the change in the circumferential position when observing the change in the edge position.

[0213] (15) A display device (200) according to any one of (12) to (14) above, wherein the graph (Gr) is a graph of polar coordinates in which the distance from the origin (O) represents the edge position and the angle around the origin (O) represents the circumferential position.

[0214] In this case, the state of the edge based on the edge information can be displayed to the operator or the like in a form close to the actual shape of the edge. Therefore, the edge shape of the coating can be evaluated more easily.

[0215] (16) A display device (200) according to the above (15), wherein when the information display unit (214) displays the curve graph (Gr) on the monitor (202), the point representing the edge position associated with each of the plurality of circumferential positions is displayed in a color corresponding to the size of the edge position.

[0216] In this case, the size of the edge position relative to the reference position (for example, the outer edge position of the front side) can also be understood based on the color. Therefore, the convenience of the user such as the operator can be improved.

[0217] (17) A display device (200) according to any one of (12) to (14) above, wherein the graph (Gr) is a graph of orthogonal coordinates in which the vertical axis represents the edge position and the horizontal axis represents the circumferential position.

[0218] In this case, since the change in the edge position is expressed as a change in the vertical axis, it is easy for an operator or the like to understand the change in the edge position.

[0219] (18) A display device (200) according to any one of the above (12) to (17), wherein the information display unit (214) displays on the monitor (202) at least the contribution rate of the first component caused by the eccentricity of the difference between the center of the edge shape obtained by the set of edge positions at multiple circumferential positions and the center of the substrate (W), the contribution rate of the second component caused by the edge shape becoming an ellipse, and the contribution rate of the residual component caused by the residual, with respect to the deviation of the edge position in the edge information.

[0220] In this case, an operator or the like can easily know why and to what extent the deviation in edge position has occurred.

[0221] (19) A display device (200) according to any one of the above (12) to (17), further comprising: an abnormality type determination unit (224) which determines the type of abnormality existing between an edge shape obtained by a set of edge positions at a plurality of circumferential positions and a theoretical edge shape; and a candidate countermeasure determination unit (226) which determines a candidate countermeasure corresponding to the result of determining the type of abnormality based on association information that establishes an association between the type of abnormality and a candidate countermeasure for eliminating the abnormality, wherein the information display unit (214) displays the result of determining the type of abnormality and the result of determining the candidate countermeasure on the monitor (202).

[0222] In this case, even an inexperienced operator can easily understand the high priority countermeasure to be performed next. As a result, the execution content of the countermeasure for eliminating the abnormality is less likely to differ among the operators.

[0223] (20) According to the display device (200) described in (19) above, the information display unit (214) displays the curve graph (Gr), the determination result of the type of abnormality and the decision result of the candidate countermeasures, and the contribution rate of the deviation of the edge position in the edge information on the monitor (202), wherein the above contribution rate includes: the contribution rate of the first component caused by the eccentricity of the difference between the center of the edge shape obtained by the set of edge positions at multiple circumferential positions and the center of the substrate (W); the contribution rate of the second component caused by the edge shape becoming an ellipse; and the contribution rate of the residual component caused by the residual.

[0224] In this case, an operator or the like can comprehensively judge various information and decide on an appropriate measure.

[0225] (21) A display device (200) according to any one of the above (12) to (20), wherein the image (PI) is obtained by photographing a portion including a bevel portion (BP) formed on the outer periphery of the substrate (W) and a boundary (bL) of a portion other than the bevel portion (BP), and the information display unit (214) displays the curve graph (Gr) on the monitor (202) in a manner that indicates, in addition to the edge position of each circumferential position, the position of the boundary (bL) in the radial direction of the substrate (W) at each circumferential position.

[0226] In this case, the operator or the like can easily understand the relationship between the shape of the boundary (bL) and the edge shape based on the graph (Gr).

Claims

1. A display method, characterized in that: include: A step of acquiring edge information indicating a relationship between each circumferential position included in a plurality of circumferential positions around the center of the substrate and an edge position of the coating in a radial direction of the substrate based on an image obtained by photographing a peripheral region of the front surface of the substrate having the coating formed on the front surface; Based on the edge information, a step of displaying a graph indicating the edge position at each circumferential position on a monitor; and Before displaying the graph on the monitor, a step of determining a display range related to the edge position on the graph based on statistical information of the edge position included in the edge information.

2. The display method according to claim 1, characterized in that: The statistical information includes at least a part of a five-number summary obtained when a box plot related to the edge position is generated based on the edge information.

3. The display method according to claim 2, characterized in that: In the step of determining the display range, the display range is determined based on the median or average of the edge positions included in the edge information and a value obtained by multiplying a difference between the third quartile and the first quartile by a constant greater than 1.

4. The display method according to any one of claims 1 to 3, characterized in that: The graph is a graph in which the distance from the origin represents the edge position and the angle around the origin represents the polar coordinates of the circumferential position.

5. The display method according to claim 4, characterized in that: In the step of displaying the graph on the monitor, the points indicating the edge positions associated with the plurality of circumferential positions are displayed in a color corresponding to the size of the edge positions.

6. The display method according to any one of claims 1 to 3, characterized in that: The graph is a graph of orthogonal coordinates in which the vertical axis represents the edge position and the horizontal axis represents the circumferential position.

7. The display method according to any one of claims 1 to 3, characterized in that: The following steps are also included: Regarding the deviation of the edge position in the edge information, at least the contribution rate of the first component caused by the eccentricity of the difference between the center of the edge shape obtained by the set of the edge positions at the multiple circumferential positions and the center of the substrate, the contribution rate of the second component caused by the edge shape becoming an ellipse, and the contribution rate of the residual component caused by the residual are displayed on the monitor.

8. The display method according to any one of claims 1 to 3, characterized in that: Also includes: a step of determining a kind of anomaly existing between an edge shape obtained from a set of said edge positions at said plurality of circumferential positions and a shape of a theoretical edge; A step of determining the candidate countermeasure corresponding to the determination result of the type of the abnormality based on association information associating the type of the abnormality with the candidate countermeasure for eliminating the abnormality; and The step of displaying the identification result of the type of the abnormality and the decision result of the candidate countermeasure on the monitor.

9. The display method according to claim 8, characterized in that: In the display method, the graph, the determination result of the type of the abnormality, the decision result of the candidate countermeasures, and the contribution rate of the deviation of the edge position in the edge information are displayed on the monitor together. The contribution rates include: representing a contribution rate of a first component caused by an eccentricity of a difference between a center of an edge shape obtained by a set of the edge positions at the plurality of circumferential positions and a center of the substrate; a contribution rate of the second component caused by the edge shape becoming an ellipse; and The contribution rate of the residual component caused by the residual.

10. The display method according to any one of claims 1 to 3, characterized in that: The image is captured in a manner that includes a boundary between a sloped portion formed on the outer peripheral portion of the substrate and a portion other than the sloped portion. In the graph displayed on the monitor, in addition to indicating the edge position for each circumferential position, the position of the boundary in the radial direction of the substrate is indicated for each circumferential position.

11. A computer-readable storage medium, characterized in that: A program for causing a device to execute the display method according to any one of claims 1 to 3 is stored.

12. A display device, characterized in that: include: an information acquisition unit that acquires edge information indicating a relationship between each circumferential position included in a plurality of circumferential positions around the center of the substrate and an edge position of the coating in a radial direction of the substrate based on an image obtained by photographing a peripheral region of the front surface of the substrate having the coating formed on the front surface; an information display unit that displays a graph indicating the edge position at each of the circumferential positions on a monitor based on the edge information; and A range determination unit determines a display range related to the edge position on the graph based on statistical information of the edge position included in the edge information before displaying the graph on the monitor.

13. The display device according to claim 12, wherein: The statistical information includes at least a part of a five-number summary obtained when a box plot related to the edge position is generated based on the edge information.

14. The display device according to claim 13, wherein: The range determination unit determines the display range based on a median or an average of the edge positions included in the edge information and a value obtained by multiplying a difference between a third quartile and a first quartile by a constant greater than 1.

15. The display device according to any one of claims 12 to 14, characterized in that: The graph is a graph in which the distance from the origin represents the edge position and the angle around the origin represents the polar coordinates of the circumferential position.

16. The display device according to claim 15, characterized in that: When displaying the graph on the monitor, the information display unit displays the points indicating the edge positions associated with the plurality of circumferential positions, respectively, in a color corresponding to the size of the edge positions.

17. The display device according to any one of claims 12 to 14, characterized in that: The graph is a graph of orthogonal coordinates in which the vertical axis represents the edge position and the horizontal axis represents the circumferential position.

18. The display device according to any one of claims 12 to 14, characterized in that: The information display unit displays on the monitor at least the contribution rate of the first component caused by the eccentricity of the difference between the center of the edge shape obtained by the set of the edge positions at the multiple circumferential positions and the center of the substrate, the contribution rate of the second component caused by the edge shape becoming an ellipse, and the contribution rate of the residual component caused by the residual, with respect to the deviation of the edge position in the edge information.

19. The display device according to any one of claims 12 to 14, characterized in that: Also includes: an abnormality type determination unit that determines a type of abnormality existing between an edge shape obtained from a set of the edge positions at the plurality of circumferential positions and a theoretical edge shape; and a candidate countermeasure determination unit that determines the candidate countermeasure corresponding to the result of determining the type of the abnormality based on association information that associates the type of the abnormality with candidate countermeasures for eliminating the abnormality, The information display unit displays the identification result of the type of the abnormality and the decision result of the candidate countermeasure on the monitor.

20. The display device according to claim 19, wherein: The information display unit displays the graph, the determination result of the type of the abnormality, the determination result of the candidate countermeasures, and the contribution rate of the deviation of the edge position in the edge information on the monitor together. The contribution rates include: representing a contribution rate of a first component caused by an eccentricity of a difference between a center of an edge shape obtained by a set of the edge positions at the plurality of circumferential positions and a center of the substrate; a contribution rate of the second component caused by the edge shape becoming an ellipse; and The contribution rate of the residual component caused by the residual.

21. The display device according to any one of claims 12 to 14, characterized in that: The image is captured in a manner that includes a boundary between a sloped portion formed on the outer peripheral portion of the substrate and a portion other than the sloped portion. The information display section displays the graph on the monitor in a manner that indicates the position of the boundary in the radial direction of the substrate for each circumferential position in addition to the edge position for each circumferential position.

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