COC eutectic machine

Abstract

The invention relates to the technical field of eutectic machines, and discloses a COC eutectic machine which comprises a cabinet and a machine shell, and a COC blue film stripping mechanism is arranged on one side of the top of the cabinet; when a patch chip is fed to the correction mechanism, observation is carried out through a laser confocal microscope in the correction feedback mechanism, and a lifting platform in the correction feedback mechanism is matched with a universal joint and a connecting arm, so that the front-back and up-down positions of the microscope can be adjusted; therefore, the position of a chip in a chip positioning groove in the correction mechanism can be accurately observed, an operator can more clearly observe the position of the chip in the chip positioning groove, and the position of the chip is fed back to a display through a signal line after being shot by a micro single camera. In this way, the position and state of the chip fed to the correcting mechanism can be fed back in a high-precision mode, the position of the chip can be adjusted in a high-precision mode conveniently, and therefore the machining precision of the follow-up patch chip is higher.

Description

Technical Field

[0001] The present invention relates to the technical field of eutectic machines, in particular to a COC eutectic machine. Background Art

[0002] The COC eutectic machine is one of the common equipment for semiconductor chip mounting processing. It is used to bond the substrate and the chip together by melting the solder through a controlled temperature curve after CDD positioning. When the COC eutectic machine performs mounting operations, the chip is first fixed in the corresponding position by the COC blue film, and then the solder is melted by high temperature to firmly bond the chip and the substrate together. In this process, the blue film plays a temporary fixing role and is removed after the mounting is completed. Therefore, although the COC blue film only plays an auxiliary role in the entire process, it is crucial to ensure the accuracy and efficiency of the mounting.

[0003] For example, the Chinese patent authorization announcement number is CN118983238A, "discloses a COC eutectic machine, including: a cabinet and a housing, a housing is provided on one side of the top of the cabinet, a COC blue film demoulding mechanism is provided on one side of the top of the cabinet, and a COC welding nozzle is provided on one side of the housing above the COC blue film demoulding mechanism"; In the above-mentioned comparative document, the angle of the microscope in the left and right directions is adjusted by the cooperation of the rotating sleeve and the locking screw, so that the microscope can magnify and see the surface structure of the chip and the substrate, helping the operator to see the position and state of the chip and the substrate more clearly, so as to perform the patch operation more accurately; When the above-mentioned eutectic machine is actually used, after the chip is processed by bonding, it is corrected by the correction mechanism and then adsorbed by the conveying nozzle for position adjustment. However, when the chip is loaded to the correction mechanism after bonding processing, there is a lack of high-precision position feedback mechanism for the chip. Through the cooperation of a simple industrial camera, the resolution is relatively limited. The deviation of the chip correction position after bonding is large, which affects the subsequent high-precision processing of the chip. Summary of the invention

[0004] The purpose of the present invention is to provide a COC eutectic machine, which can add a high-precision correction feedback mechanism to the correction mechanism, so that the position correction of the patch chip is more accurate and the subsequent processing accuracy of the patch chip is higher.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a COC eutectic machine, comprising a cabinet and a casing, a COC blue film demolding mechanism is arranged on one side of the top of the cabinet, a COC chip welding nozzle is arranged on the top of the cabinet near the top of the COC blue film demolding mechanism, a correction mechanism is arranged on one side of the top of the cabinet near the COC blue film demolding mechanism, a chip positioning groove is arranged on the top of the correction mechanism, and the chip positioning groove is used for positioning and correcting the chip position, a correction feedback mechanism is arranged on one side of the casing, the correction feedback mechanism comprises a lifting platform fixedly mounted on the casing, a universal joint is fixedly connected to the telescopic end of the lifting platform, a connecting arm is hinged on one side of the universal joint, a microscope is hinged on one end of the connecting arm, a micro single camera is arranged on the side of the microscope away from the objective lens, and a display is installed on the front side of the casing away from the COC blue film demolding mechanism.

[0006] Preferably, a eutectic soldering station is provided on one side of the top of the cabinet close to the correction mechanism, and a feeding mechanism is installed on one side of the top of the cabinet close to the eutectic soldering station.

[0007] Preferably, an industrial camera is provided on one side of the housing above the COC blue film stripping mechanism and the eutectic soldering station.

[0008] Preferably, a COC transport nozzle is provided on the top of the cabinet away from the COC blue film stripping mechanism.

[0009] Preferably, the COC transport nozzle is electrically connected to the micro single camera on the top of the correction mechanism.

[0010] Preferably, the microscope is a laser confocal microscope, the micro single camera is an M43 micro single camera, and a signal line is installed between the micro single camera and the display.

[0011] Preferably, a light blocking sleeve is fixedly installed on the side of the micro single camera and the microscope away from the objective lens, and a spring pin is fixedly installed on the telescopic end of the lifting platform, and the spring pin is used to lock and position the telescopic end of the lifting platform.

[0012] Preferably, the COC blue film demolding mechanism includes an X-axis linear motor and a Y-axis linear motor, the X-axis linear motor is fixedly connected to the top surface of the cabinet, the Y-axis linear motor is fixedly connected above the slider of the X-axis linear motor, and a chip blue film disk is provided above the slider of the Y-axis linear motor.

[0013] Compared with the prior art, the present invention has the following beneficial effects: When the patch chip of the present invention is loaded onto the correction mechanism, it is observed through the laser confocal microscope in the correction feedback mechanism. The lifting platform in the correction feedback mechanism cooperates with the universal joint and the connecting arm to adjust the front and back and up and down position of the microscope, so that the chip position in the chip positioning groove in the correction mechanism can be accurately observed, which is convenient for the operator to observe the position of the chip in the chip positioning groove more clearly, and after shooting with the micro single camera, it is fed back to the display through the signal line, thus realizing high-precision feedback of the chip position and state of the chip loaded onto the correction mechanism, facilitating high-precision adjustment of the chip position, thereby making the subsequent patch chip processing more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the correction structure in the present invention; Figure 3 It is a schematic diagram of the structure of the deviation correction feedback mechanism in the present invention.

[0015] In the figure: 1. Cabinet; 2. Casing; 3. Industrial camera; 4. COC chip welding nozzle; 5. COC blue film stripping mechanism; 6. Correction mechanism; 7. Eutectic soldering station; 8. Unloading mechanism; 9. COC transport nozzle; 10. Correction feedback mechanism; 11. Lifting platform; 12. Universal joint; 13. Connecting arm; 14. Microscope; 15. Micro single camera; 16. Signal line; 17. Light blocking sleeve; 111. Spring pin; 21. Display. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. The described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0017] See also Figure 1-3 The present invention provides a technical solution: a COC eutectic machine, comprising a cabinet 1 and a housing 2, a COC blue film stripping mechanism 5 is arranged on one side of the top of the cabinet 1, a COC chip welding nozzle 4 is arranged near the top of the cabinet 1 above the COC blue film stripping mechanism 5, a correction mechanism 6 is arranged on one side of the top of the cabinet 1 near the COC blue film stripping mechanism 5, a chip positioning groove is arranged on the top of the correction mechanism 6, and the chip positioning groove is used to position and correct the chip; A correction feedback mechanism 10 is provided on one side of the housing 2, and the correction feedback mechanism 10 includes a lifting platform 11 fixedly installed on the housing 2, a telescopic end of the lifting platform 11 is fixedly connected to a universal joint 12, a connecting arm 13 is hinged on one side of the universal joint 12, a microscope 14 is hinged on one end of the connecting arm 13, a micro single camera 15 is provided on the side of the microscope 14 away from the objective lens, and a display 21 is installed on the front side of the housing 2 away from the COC blue film stripping mechanism 5; The specific structures and the technical solutions for the mutual cooperation of the COC chip welding nozzle 4, the COC blue film stripping mechanism 5, the correction mechanism 6, the eutectic soldering station 7, the unloading mechanism 8 and the COC transport nozzle 9 are all the existing public technical solutions for eutectic machines, which will not be described in detail here; When the patch chip is loaded to the correction mechanism 6, it is observed through the laser confocal microscope 14 in the correction feedback mechanism 10. The lifting platform 11 in the correction feedback mechanism 10 cooperates with the universal joint 12 and the connecting arm 13 to adjust the microscope 14 front and back and up and down, so that the chip position in the chip positioning groove in the correction mechanism 6 can be accurately observed, which is convenient for the operator to observe the position of the chip in the chip positioning groove more clearly, and after shooting with the micro single camera 15, it is fed back to the display 21 through the signal line 16, so that the chip position and status of the chip loaded to the correction mechanism 6 can be fed back with high precision, which is convenient for high-precision adjustment of the chip position, so that the subsequent patch chip processing accuracy is higher.

[0018] Among them, a eutectic soldering station 7 is arranged on the top of the cabinet 1 near the correction mechanism 6, a feeding mechanism 8 is installed on the top of the cabinet 1 near the eutectic soldering station 7, an industrial camera 3 is arranged on one side of the housing 2 above the COC blue film stripping mechanism 5 and the eutectic soldering station 7, a COC conveying nozzle 9 is arranged on the top of the cabinet 1 away from the COC blue film stripping mechanism 5, and the COC conveying nozzle 9 is electrically connected to the micro single camera 15 on the top of the correction mechanism 6. After the chip is stripped by the COC blue film stripping mechanism 5 after the patch is completed, the COC conveying nozzle 9 moves the guide module to place the chip on the correction mechanism 6 The position of the chip is determined by the industrial camera 3 above the correction mechanism 6. After calculation by the image recognition algorithm and the corresponding software module on the industrial camera 3, a command is sent to the COC transport nozzle 9. The COC transport nozzle 9 adjusts the chip forward and backward according to the received command, and then sucks the chip away and sends it to the eutectic soldering station 7. An industrial camera 3 is also fixed on the eutectic soldering station 7. It also calculates whether the position of the chip and the bracket is correct through the image recognition algorithm and the corresponding software module. When the position is correct, welding is performed, thereby avoiding the production of defective products caused by misaligned welding and improving the product qualification rate.

[0019] Among them, the microscope 14 is a laser confocal microscope, the micro-single camera 15 is an M43 micro-single camera, a signal line 16 is installed between the micro-single camera 15 and the display 21, and a light blocking sleeve 17 is fixedly installed on the micro-single camera 15 and the microscope 14 away from the objective lens. The light blocking sleeve 17 can closely connect the micro-single camera 15 and the microscope 14, thereby avoiding light leakage and light entering. A spring pin 111 is fixedly installed on the telescopic end of the lifting platform 11, and the spring pin 111 is used to lock and position the telescopic end of the lifting platform 11. The COC blue film stripping mechanism 5 includes an X-axis linear motor and a Y-axis linear motor. The X-axis linear motor is fixedly connected to the top surface of the cabinet 1, and the Y-axis linear motor is fixedly connected to the top surface of the cabinet 1. The machine is fixedly connected above the slider of the X-axis linear motor, and a chip blue film disk is provided above the slider of the Y-axis linear motor. When the SMD chip is loaded to the correction mechanism 6, it is observed through the laser confocal microscope 14 in the correction feedback mechanism 10, and the chip position in the chip positioning groove in the correction mechanism 6 is accurately observed, which is convenient for the operator to observe the position of the chip in the chip positioning groove more clearly, and after shooting with the micro single camera 15, it is fed back to the display 21 through the signal line 16, so that the chip position and state of the chip loaded to the correction mechanism 6 can be fed back with high precision, which is convenient for high-precision adjustment of the chip position, thereby making the subsequent SMD chip processing more accurate.

[0020] Working principle: When in use, the lifting platform 11 in the correction feedback mechanism 10 cooperates with the universal joint 12 and the connecting arm 13 to adjust the microscope 14 forward and backward and up and down, so as to accurately observe the chip position in the chip positioning groove in the correction mechanism 6; When the patch chip is loaded to the correction mechanism 6, it is observed through the laser confocal microscope 14 in the correction feedback mechanism 10, so that the chip position in the chip positioning groove in the correction mechanism 6 can be accurately observed, which is convenient for the operator to observe the position of the chip in the chip positioning groove more clearly, and after shooting with the micro single camera 15, it is fed back to the display 21 through the signal line 16, so that the chip position and state of the chip loaded to the correction mechanism 6 can be fed back with high precision, which is convenient for high-precision adjustment of the chip position, so that the subsequent patch chip processing accuracy is higher.

[0021] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes and modifications may be made to these embodiments without departing from the principles of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A COC eutectic machine, comprising a cabinet (1) and a housing (2), characterized in that: A COC blue film stripping mechanism (5) is arranged on one side of the top of the cabinet (1); a COC chip welding suction nozzle (4) is arranged on the top of the cabinet (1) near the top of the COC blue film stripping mechanism (5); a correction mechanism (6) is arranged on the top of the cabinet (1) near the COC blue film stripping mechanism (5); a chip positioning groove is arranged on the top of the correction mechanism (6); and the chip positioning groove is used to correct the position of the chip; a deviation correction feedback mechanism (10) is arranged on one side of the housing (2); the deviation correction feedback mechanism (10) comprises a lifting platform (11) fixedly mounted on the housing (2); a telescopic end of the lifting platform (11) is fixedly connected to a universal joint (12); a connecting arm (13) is hinged on one side of the universal joint (12); a microscope (14) is hinged on one end of the connecting arm (13); a micro single camera (15) is arranged on the side of the microscope (14) away from the objective lens; and a display (21) is installed on the front side of the housing (2) away from the COC blue film stripping mechanism (5).

2. The COC eutectic machine according to claim 1, characterized in that: A eutectic soldering platform (7) is provided on one side of the top of the cabinet (1) close to the correction mechanism (6), and a material discharge mechanism (8) is installed on one side of the top of the cabinet (1) close to the eutectic soldering platform (7).

3. The COC eutectic machine according to claim 2, characterized in that: An industrial camera (3) is arranged on one side of the housing (2) above the COC blue film stripping mechanism (5) and the eutectic soldering station (7).

4. The COC eutectic machine according to claim 3, characterized in that: A COC transport suction nozzle (9) is provided on the top of the cabinet (1) on a side away from the COC blue film stripping mechanism (5).

5. The COC eutectic machine according to claim 4, characterized in that: The COC transport nozzle (9) is electrically connected to the micro single camera (15) on the top of the correction mechanism (6).

6. The COC eutectic machine according to claim 5, characterized in that: The microscope (14) is a laser confocal microscope, the micro-single camera (15) is an M43 micro-single camera, and a signal line (16) is installed between the micro-single camera (15) and the display (21).

7. The COC eutectic machine according to claim 6, characterized in that: A light blocking sleeve (17) is fixedly mounted on the side of the micro single camera (15) and the microscope (14) away from the objective lens, and a spring pin (111) is fixedly mounted on the telescopic end of the lifting platform (11), and the spring pin (111) is used to lock and position the telescopic end of the lifting platform (11).

8. The COC eutectic machine according to claim 7, characterized in that: The COC blue film stripping mechanism (5) comprises an X-axis linear motor and a Y-axis linear motor, wherein the X-axis linear motor is fixedly connected to the top surface of the cabinet (1), and the Y-axis linear motor is fixedly connected above a slider of the X-axis linear motor, and a chip blue film disk is provided above the slider of the Y-axis linear motor.

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