Battery assembly and electric equipment

Abstract

The invention discloses a battery assembly and electric equipment. The battery assembly comprises a circuit board assembly and a battery cell. The circuit board assembly comprises a substrate, a solder layer and an adapter which are sequentially arranged in a stacked mode in the first direction, the substrate comprises a bonding pad area, and at least part of the adapter is located in the bonding pad area when observed in the first direction. Observed in the first direction, the bonding pad area comprises a metal material area and a non-metal material area, at least part of the solder layer is located in the metal material area, and the solder layer is connected with the metal material area and the adapter. The battery cell comprises a first electrode terminal, the first electrode terminal is welded to one side, back to the solder layer, of the adapter in the first direction, and a welding spot is formed at the welding position; in the first direction, the projection of the welding spot is located in the non-metal material area, and the projection of the welding flux layer and the projection of the welding spot are not overlapped. By adopting the scheme provided by the invention, the possibility of generating solder beads on the solder layer can be reduced.

Description

Technical Field

[0001] The present application belongs to the field of energy storage technology, and in particular relates to a battery assembly and electrical equipment. Background Art

[0002] At present, in order to avoid the electrode terminals of the battery cell from penetrating the circuit board when welding them, it is usually necessary to set a layer of adapter (usually a nickel sheet) between the circuit board and the electrode terminals. Specifically, the pad area of ​​the circuit board and the adapter are connected by solder (usually solder paste), and the electrode terminal is then welded to the adapter, thereby forming a stacked structure of the circuit board, solder layer, adapter and electrode terminal. In this structure, when welding the electrode terminal and the adapter, a large amount of heat absorbed at the solder point of the adapter is directly transferred to the solder layer, and the components of the solder layer are vaporized by heat to form bubbles, which carry the molten solder to overflow to the edge area of ​​the pad to form solder beads. The generation of solder beads increases the risk of short circuit of components in the circuit board, and the solder beads may be attached to the battery cell with the clamps in the production process, causing damage to the battery cell. Summary of the invention

[0003] In view of the above situation, it is necessary to provide a battery assembly that can reduce the possibility of solder beads being generated in the solder layer during the welding process between the electrode terminal and the adapter.

[0004] The first aspect of an embodiment of the present application provides a battery assembly, which includes a circuit board assembly and a battery cell. The circuit board assembly includes a substrate, a solder layer and a transition piece stacked in sequence along a first direction, the substrate includes a pad area, and when viewed along the first direction, at least part of the transition piece is located in the pad area, and the first direction is the thickness direction of the circuit board assembly. When viewed along the first direction, the pad area includes a metal material area and a non-metal material area, the edge of the metal material area is connected to the edge of the non-metal material area, at least part of the solder layer is located in the metal material area, and the solder layer connects the metal material area and the transition piece. The battery cell includes a first electrode terminal, the first electrode terminal is welded to a side of the transition piece that is away from the solder layer along the first direction, and a solder joint is formed at the welding point between the first electrode terminal and the transition piece; along the first direction, the projection of the solder joint is located in the non-metal material area, and the projection of the solder layer and the solder joint do not overlap.

[0005] In this battery assembly, since the projection of the weld point along the first direction is located in the non-metallic material area, the projection of the solder layer and the weld point do not overlap. When welding the first electrode terminal and the adapter, part of the heat generated by the welding is transferred and dissipated by the adapter, and part of the heat is transferred to the metal material area via the non-metallic material area. In this way, compared with the solution in the prior art in which heat is directly transferred to the solder layer, the temperature rise of the solder layer during the welding process between the first electrode terminal and the adapter is significantly reduced. Therefore, the solution provided in the present application is conducive to reducing the risk of solder beads generated in the solder layer, and reducing the risk of short circuit or damage to the battery assembly caused by solder beads.

[0006] In one or more embodiments of the present application, the solder layer is separated from a projection of the solder joint along the first direction.

[0007] In one or more embodiments of the present application, the substrate includes a base material layer and a conductive metal layer stacked along a first direction, the base material layer includes a connection area and an exposed area, and when observed along the first direction, the conductive metal layer covers the connection area, and the exposed area is exposed from the conductive metal layer, the conductive metal layer forms a metal material area, and the exposed area forms a non-metallic material area.

[0008] In one or more embodiments of the present application, the substrate includes a base material layer, a conductive metal layer and a first solder resist film layer stacked in sequence along a first direction, the conductive metal layer includes a first sub-region and a second sub-region, and when observed along the first direction, the first solder resist film layer covers the first sub-region, and the second sub-region is exposed in the first solder resist film layer, the second sub-region forms a metal material region, and the first solder resist film layer forms a non-metallic material region.

[0009] In one or more embodiments of the present application, the substrate includes a second solder resist layer, the conductive metal layer includes a third sub-region, the second solder resist layer covers the third sub-region when viewed along a first direction, the metal material region includes a first edge and a second edge, the non-metal material region is connected to the first edge, the second solder resist layer is connected to the second edge, and the solder layer is connected to the second solder resist layer. The metal material region is formed on the surface of the conductive metal layer, and the second solder resist layer covers a portion of the surface of the conductive metal layer and surrounds the edge of the metal material region that is not connected to the non-metal material region, so that the second solder resist layer surrounds the edge of the solder layer, and when the solder layer is heated during the welding process of the first electrode terminal and the adapter, the second solder resist layer can suppress the generation of solder beads.

[0010] In one or more embodiments of the present application, along the first direction, the second solder resist layer and the adapter are stacked, and the projection of the adapter covers the metal material area and the non-metal material area. In this way, the solder layer can be confined to the space enclosed by the adapter, the second solder resist layer and the conductive metal layer, further suppressing the generation and transfer of solder beads. Suppressing the transfer of solder beads from the solder layer to other locations on the circuit board is conducive to reducing the possibility of short circuits or damage to the circuit board components.

[0011] In one or more embodiments of the present application, when viewed along the first direction, the width of the second solder resist layer is W, 0.15 mm ≤ W ≤ 0.6 mm. When W ≥ 0.15 mm, the width of the second solder resist layer is not too small, which is conducive to reducing the difficulty of setting the second solder resist layer. When W ≤ 0.6 mm, the width of the second solder resist layer is not too large, which is conducive to reducing the occupation of the surface of the conductive metal layer by the second solder resist layer, so as to increase the area of ​​the metal material area and the non-metal material area.

[0012] In one or more embodiments of the present application, 0.15 mm≤W≤0.3 mm. Setting W≤0.3 mm is beneficial to further reduce the occupation of the second solder resist layer on the surface of the conductive metal layer.

[0013] In one or more embodiments of the present application, the conductive metal layer includes a plurality of positioning areas, and when viewed along the first direction, the positioning areas are exposed to the second solder resist layer, and the positioning areas are in contact with the second solder resist layer. When viewed along the first direction, the positioning areas overlap with the corners of the adapter. Providing the positioning areas is conducive to enabling production equipment to automatically identify the position of the adapter to achieve automated production.

[0014] In one or more embodiments of the present application, when viewed along the first direction, the shape of the positioning area is a rectangle, and the length of any edge of the positioning area is L, 0.15mm≤L≤0.2mm. When L≥0.15mm, the length of the edge of the positioning area is not too short, which is conducive to reducing the difficulty of processing the positioning area; when L≤0.2mm, the length of the edge of the positioning area is not too long, and the area of ​​the positioning area is not too large, which is conducive to reducing the occupation of the surface of the conductive metal layer by the positioning area.

[0015] In one or more embodiments of the present application, the material of the metal material area includes copper, the material of the solder layer includes tin, and the material of the non-metal material area includes at least one of phenolic resin, polytetrafluoroethylene, polyimide, epoxy resin, acrylic resin, or polyurethane resin. With the aforementioned materials, the wettability of the material of the solder layer in the metal material area is greater than that in the non-metal material area, so the solder in the molten state spreads almost only in the metal material area, and rarely or even not spreads to the non-metal material area, thereby, the non-metal material area plays a role in limiting the position of the solder layer, so that the projection of the solder layer and the solder joint does not overlap.

[0016] In one or more embodiments of the present application, when viewed along the first direction, the metal material region has a notch, at least a portion of the non-metal material region is embedded in the notch, and a sideline of the non-metal material region is connected to the metal material region.

[0017] In one or more embodiments of the present application, when observed along the first direction, the metal material region is an annular structure, the non-metal material region is embedded in the middle of the metal material region, and the edge line of the non-metal material region is connected to the metal material region.

[0018] In one or more embodiments of the present application, two metal material regions are provided, and the two metal material regions are respectively located on opposite sides of the non-metal material region along the length direction or the width direction thereof.

[0019] A second aspect of the embodiments of the present application provides an electrical device, which includes a battery assembly as described in any of the aforementioned embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of a battery assembly in one embodiment of the present application.

[0021] Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure at II-II.

[0022] Figure 3 It is a schematic diagram of the structural decomposition of a battery assembly in one embodiment of the present application.

[0023] Figure 4 yes Figure 1 Schematic diagram of the cross-sectional structure at IV-IV in the figure.

[0024] Figure 5 1 is a front view of a partial area of ​​a substrate in one embodiment of the present application.

[0025] Figure 61 is a front view of a partial area of ​​a substrate in one embodiment of the present application.

[0026] Figure 7 1 is a front view of a partial area of ​​a substrate in one embodiment of the present application.

[0027] Figure 8 1 is a front view of a partial area of ​​a substrate in one embodiment of the present application.

[0028] Fig. 9 1 is a front view of a partial area of ​​a substrate in one embodiment of the present application.

[0029] Fig.10 1 is a front view of a partial area of ​​a substrate in one embodiment of the present application.

[0030] Fig.11 1 is a front view of a partial area of ​​a substrate in one embodiment of the present application.

[0031] Fig.12 1 is a front view of a partial area of ​​a substrate in one embodiment of the present application.

[0032] Fig.13 It is a schematic diagram of the structure of an electrical device in an embodiment of the present application.

[0033] Main component symbols 100, battery assembly; 10, battery cell; 11, housing; 12, electrode assembly; 121, positive electrode sheet; 1211, positive electrode current collector; 1212, positive electrode active material layer; 122, separator; 123, negative electrode sheet; 1231, negative electrode current collector; 1232, negative electrode active material layer; 13, first electrode terminal; 131, welding point; 14, second electrode terminal; 20, circuit board assembly; 21, substrate; 211 , substrate layer; 212, conductive metal layer; 212a, positioning area; 212b, first edge; 212c, second edge; 21a, pad area; 21b, metal material area; 21c, non-metal material area; 21d, notch; 213, first solder resist film layer; 214, second solder resist film layer; 215, electronic component; 22, solder layer; 23, adapter; 1000, electrical equipment; X, first direction.

[0034] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0036] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be a centrally disposed element at the same time. When an element is considered to be "disposed on" another element, it may be directly disposed on the other element or there may be a centrally disposed element at the same time.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0038] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0039] In the description of the embodiments of the present application, the term "perpendicular" is used to describe an ideal state between two components. In actual production or use, there may be a state that is approximately perpendicular between the two components. The two components described as "perpendicular" may not be absolutely straight lines or planes, but may be roughly straight lines or planes. From a macroscopic point of view, if the overall extension direction is a straight line or a plane, the components can be considered to be "straight lines" or "planes".

[0040] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. The various embodiments in the present application may be combined with each other in the absence of conflict.

[0041] An embodiment of the present application provides a battery assembly, which includes a circuit board assembly and a battery cell. The circuit board assembly includes a substrate, a solder layer and a transfer piece stacked in sequence along a first direction, the substrate includes a pad area, and when viewed along the first direction, at least part of the transfer piece is located in the pad area, and the first direction is the thickness direction of the circuit board assembly. When viewed along the first direction, the pad area includes a metal material area and a non-metal material area, the edge of the metal material area is connected to the edge of the non-metal material area, at least part of the solder layer is located in the metal material area, and the solder layer connects the metal material area and the transfer piece. The battery cell includes a first electrode terminal, the first electrode terminal is welded to a side of the transfer piece that is opposite to the solder layer along the first direction, and a solder joint is formed at the welding point between the first electrode terminal and the transfer piece; along the first direction, the projection of the solder joint is located in the non-metal material area, and the projection of the solder layer and the solder joint do not overlap.

[0042] In this battery assembly, since the projection of the welding point along the first direction is located in the non-metallic material area, the projection of the solder layer and the welding point do not overlap. When welding the first electrode terminal and the adapter, part of the heat generated by welding is transferred and dissipated by the adapter, and part of the heat is transferred to the metal material area via the non-metallic material area. In this way, compared with the solution in the prior art in which heat is directly transferred to the solder layer, the temperature rise of the solder layer during the welding process between the first electrode terminal and the adapter is significantly reduced. Therefore, the solution provided in the embodiment of the present application is conducive to reducing the risk of solder beads generated in the solder layer, and reducing the risk of short circuit or damage to the battery assembly caused by solder beads.

[0043] The embodiments of the present application are further described below in conjunction with the accompanying drawings. For ease of description, a spatial rectangular coordinate system is established in the accompanying drawings with the thickness direction of the circuit board assembly as the first direction X, the length direction of the battery cell as the second direction Y, and the width direction of the battery cell as the third direction Z.

[0044] like Figure 1 As shown, an embodiment of the present application provides a battery assembly 100 , which includes a battery cell 10 and a circuit board assembly 20 .

[0045] In some embodiments, Figure 1 and Figure 2 As shown, the battery cell 10 includes a shell 11, an electrode assembly 12, an electrolyte (not shown), a first electrode terminal 13 and a second electrode terminal 14. The electrode assembly 12 and the electrolyte are both accommodated in the shell 11. The first electrode terminal 13 and the second electrode terminal 14 are both connected to the electrode assembly 12. Part of the first electrode terminal 13 and part of the second electrode terminal 14 extend out of the shell 11.

[0046] In some embodiments, the housing 11 is a flexible packaging bag, such as an aluminum-plastic film. In other embodiments, the housing 11 is a hard shell, such as a plastic shell, or a metal shell including at least one of steel alloy, aluminum alloy, and copper alloy.

[0047] In some embodiments, the electrode assembly 12 includes a positive electrode sheet 121 , a negative electrode sheet 123 , and a separator 122 that are stacked. The separator 122 is located between the positive electrode sheet 121 and the negative electrode sheet 123 to insulate the positive electrode sheet 121 from the negative electrode sheet 123 .

[0048] In some embodiments, Figure 2 As shown, the positive electrode sheet 121, the separator 122 and the negative electrode sheet 123 are sequentially stacked and then wound to form a winding structure.

[0049] In some embodiments, a plurality of positive electrode sheets 121 , a separator 122 , and a plurality of negative electrode sheets 123 are alternately stacked to form a stacked structure.

[0050] In some embodiments, Figure 2 As shown, the first electrode terminal 13 is connected to one of the positive electrode sheet 121 and the negative electrode sheet 123 , and the second electrode terminal 14 is connected to the other of the positive electrode sheet 121 and the negative electrode sheet 123 .

[0051] In some embodiments, Figure 2 As shown, the positive electrode sheet 121 includes a positive electrode current collector 1211 and a positive electrode active material layer 1212 , and the positive electrode active material layer 1212 is disposed on one or both sides of the positive electrode current collector 1211 along the thickness direction thereof.

[0052] In some embodiments, Figure 2 As shown, the negative electrode sheet 123 includes a negative electrode current collector 1231 and a negative electrode active material layer 1232 , and the negative electrode active material layer 1232 is disposed on one or both sides of the negative electrode current collector 1231 along the thickness direction thereof.

[0053] In some embodiments, both the positive electrode current collector 1211 and the negative electrode current collector 1231 are metal layers. As an illustrative example, the positive electrode current collector 1211 may be a metal layer including at least one of aluminum, nickel, tantalum, and titanium, such as aluminum foil. The negative electrode current collector 1231 may be a metal layer including at least one of copper, nickel, tantalum, and titanium, such as copper foil.

[0054] In some embodiments, the positive active material layer 1212 includes a positive active material, which includes at least one of lithium cobalt oxide, lithium nickel cobalt manganese oxide, lithium nickel cobalt aluminum oxide, lithium iron phosphate, lithium manganese iron phosphate, or lithium manganese oxide.

[0055] In some embodiments, the negative electrode active material layer 1232 includes a negative electrode active material, which includes at least one of graphite, hard carbon, soft carbon, silicon, silicon-oxygen material, and silicon-carbon material.

[0056] In some embodiments, the isolation film 122 is made of insulating film materials such as polyethylene film, polypropylene film, polyester film or polyimide film.

[0057] In some embodiments, the electrolyte includes an electrolyte salt. The electrolyte salt includes at least one of an organic lithium salt or an inorganic lithium salt.

[0058] In some embodiments, the electrolyte salt is not limited to lithium hexafluorophosphate (LiPF 6 ), bis(trifluoromethanesulfonyl)imide lithium LiN (CF 3 SO 2 ) 2 (LiTFSI), lithium bis(fluorosulfonyl)imide Li(N(SO 2 F) 2 )(LiFSI), lithium hexafluorocesium oxide (LiCsF 6 ), lithium perchlorate (LiClO 4 ) or lithium trifluoromethanesulfonate (LiCF 3 SO 3 ) at least one of.

[0059] In some embodiments, Figure 1 and Figures 3 to 5 As shown, the circuit board assembly 20 includes a substrate 21, a solder layer 22 and a adapter 23 which are stacked in sequence along a first direction X. The substrate 21 includes a pad area 21a. When viewed along the first direction X, at least a portion of the adapter 23 is located in the pad area 21a. The first direction X is the thickness direction of the circuit board assembly 20.

[0060] In some embodiments, Figures 3 to 5As shown, when viewed along the first direction X, the pad region 21a includes a metal material region 21b and a non-metal material region 21c, the edge of the metal material region 21b is connected to the edge of the non-metal material region 21c, at least part of the solder layer 22 is located in the metal material region 21b, and the solder layer 22 welds the metal material region 21b and the adapter 23. The first electrode terminal 13 is welded to the side of the adapter 23 that is opposite to the solder layer 22 along the first direction X, and a solder joint 131 is formed at the welding point between the first electrode terminal 13 and the adapter 23; along the first direction X, the projection of the solder joint 131 is located in the non-metal material region 21c, and the projections of the solder layer 22 and the solder joint 131 do not overlap. The overlap of the projections of the two includes that the projections of the two completely overlap and that the projections of the two partially overlap; along the first direction X, the projections of the solder layer 22 and the solder joint 131 do not overlap, which means that along the first direction X, the projections of the solder layer 22 and the solder joint 131 do not overlap at all.

[0061] In this battery assembly, since the projection of the welding point 131 along the first direction X is located in the non-metallic material area 21c, the solder layer 22 does not overlap with the projection of the welding point 131. When welding the first electrode terminal 13 and the adapter 23, part of the heat generated by welding is transferred and dissipated by the adapter 23, and part of it is transferred to the metal material area 21b via the non-metallic material area 21c. In this way, compared with the solution in the prior art in which heat is directly transferred to the solder layer 22, the temperature rise of the solder layer 22 during the welding process of the first electrode terminal 13 and the adapter 23 is significantly reduced. Therefore, the solution provided by the embodiment of the present application is conducive to reducing the risk of solder beads generated by the solder layer 22, and reducing the risk of short circuit or damage to the battery assembly 100 caused by solder beads.

[0062] In some embodiments, the solder layer 22 is separated from the projection of the solder joint 131 along the first direction X. In this way, the risk of solder beads generated by the solder layer 22 can be further reduced.

[0063] In some embodiments, the number of welding points 131 is one or more.

[0064] In some embodiments, the material of the metal material region includes copper.

[0065] In some embodiments, the material of the solder layer includes tin.

[0066] In some embodiments, the material of the non-metal material region includes at least one of phenolic resin, polytetrafluoroethylene, polyimide, epoxy resin, acrylic resin, or polyurethane resin.

[0067] With the aforementioned materials, the wettability of the material of the solder layer 22 in the metal material region 21b is greater than that in the non-metal material region 21c, so the solder in the molten state spreads almost only in the metal material region 21b, and rarely or even not spreads to the non-metal material region 21c, thus, the non-metal material region 21c plays a role in limiting the position of the solder layer 22, so that the projection of the solder layer 22 and the solder joint 131 do not overlap. Here, wettability refers to the ability or tendency of a liquid (such as molten solder) to spread on a solid surface.

[0068] In some embodiments, the connection process between the substrate 21 and the adapter 23 is as follows: apply solder to the metal material area 21b, stack the adapter 23 on the solder, heat appropriately to make the solder molten, spread the solder along the surface of the metal material area 21b, partially penetrate into the metal material area 21b of the substrate 21, and partially penetrate into the adapter 23, thereby welding the metal material area 21b and the adapter 23 through the solder, and the solder cools down and solidifies to form a solder layer 22. It should be noted that Figure 4 The cross-sectional view of the battery assembly is simplified in FIG. 1 , and the portion where the solder penetrates into the metal material region 21 b of the substrate 21 and into the adapter 23 is not shown.

[0069] In some embodiments, Figure 4 and Figure 5 As shown, the substrate 21 includes a base material layer 211, a conductive metal layer 212 and a first solder resist film layer 213 which are sequentially stacked along a first direction X. The conductive metal layer 212 includes a first sub-region and a second sub-region. When viewed along the first direction X, the first solder resist film layer 213 covers the first sub-region, and the second sub-region is exposed from the first solder resist film layer 213. The second sub-region forms a metal material region 21b, and the first sub-region covered with the first solder resist film layer 213 forms a non-metal material region 21c. Specifically, the conductive metal layer 212 has a first surface, which is a surface of the conductive metal layer 212 in the thickness direction thereof. A portion of the surface of the first surface is the first sub-region. The first solder resist film layer 213 covers the first sub-region, and a portion of the surface of the first surface separated from the first solder resist film layer 213 is the second sub-region. The conductive metal layer 212 is a conductive metal layer attached to the base material layer 211, which can be a single-layer metal structure or a composite structure of multiple layers of metal.

[0070] In some embodiments, Figure 6As shown, the substrate 21 includes a base material layer 211 and a conductive metal layer 212 stacked along a first direction X. The base material layer 211 includes a connection area and an exposed area. When viewed along the first direction X, the conductive metal layer 212 covers the connection area, and the exposed area is exposed from the conductive metal layer 212. The conductive metal layer 212 forms a metal material area 21b, and the exposed area forms a non-metal material area 21c. Specifically, the base material layer 211 has a second surface, which is a surface of the base material layer 211 in the thickness direction thereof. The conductive metal layer 212 is disposed on the second surface and covers part of the surface of the second surface. The area of ​​the second surface covered by the conductive metal layer 212 is the connection area, and the surface of the second surface separated from the conductive metal layer 212 is used to form the exposed area.

[0071] In some embodiments, the material of the conductive metal layer 212 includes but is not limited to single copper, copper plated with gold, copper plated with silver, copper plated with tin, copper plated with nickel, or a composite material of copper and cyclic nitrogen compound material.

[0072] In some embodiments, the material of the substrate layer 211 includes at least one of phenolic resin, polytetrafluoroethylene, polyimide, or epoxy resin.

[0073] In some embodiments, the material of the first solder resist layer 213 includes at least one of epoxy resin, acrylic resin, phenolic resin, or polyurethane resin.

[0074] Figures 5 to 12 A front view of a part of the substrate 21 is shown to show the pad area 21a and the positioning area 212a mentioned later. It should be noted that, based on the different ways of forming the metal material area 21b and the non-metal material area 21c, there is a height difference along the first direction X between the metal material area 21b and the non-metal material area 21c. This height difference also limits the spreading of the solder in the pad area, so that the solder layer is maintained in the metal material area 21b as much as possible. Based on the observation angle along the first direction X looking straight at the substrate 21, Figures 5 to 12 This height difference is not reflected in the figure.

[0075] It should be supplemented that, in some embodiments, there is no height difference between the metal material region 21 b and the non-metal material region 21 c .

[0076] In some embodiments, Figure 5 and Figure 6 As shown, viewed along the first direction X, the metal material region 21b has a notch 21d, at least a portion of the non-metal material region 21c is embedded in the notch 21d of the metal material region 21b, and the edge of the non-metal material region 21c is connected to the metal material region 21b.

[0077] In some embodiments, Figure 7 and Figure 8 As shown, when viewed along the first direction X, the metal material region 21b is an annular structure, and the non-metal material region 21c is embedded in the middle of the metal material region 21b, that is, the metal material region 21b is arranged around the non-metal material region 21c, and the edge line of the non-metal material region 21c is connected to the metal material region 21b.

[0078] In some embodiments, Fig. 9 and Fig.10 As shown, when viewed along the first direction X, there are two metal material regions 21b, which are respectively located on opposite sides of the non-metal material region 21c along its length direction or width direction, and the edge lines of the non-metal material region 21c are connected to the metal material region 21b.

[0079] In some embodiments, Fig.11 and Fig.12 As shown, the metal material region 21b and the non-metal material region 21c are both rectangular, the metal material region 21b is located on one side of the non-metal material region 21c in the width direction, and the length sides of the metal material region 21b and the non-metal material region 21c are connected.

[0080] It should be noted that the above is only an enumeration of the shapes and relative positional relationships of the metal material area 21b and the non-metal material area 21c and is not exhaustive. Those skilled in the art can adjust the shapes and relative positional relationships of the metal material area 21b and the non-metal material area 21c as needed to meet product requirements.

[0081] In some embodiments, Figure 1 and Figure 3 As shown, the substrate 21 further includes an electronic component 215 , and the electronic component 215 is connected to the conductive metal layer.

[0082] In some embodiments, Figure 5As shown, the substrate 21 includes a second solder resist film layer 214, the conductive metal layer 212 includes a third sub-region, and when observed along the first direction X, the second solder resist film layer 214 covers the third sub-region, the metal material region 21b includes a first edge 212b and a second edge 212c, the non-metallic material region 21c is connected to the first edge 212b, and the second solder resist film layer 214 is connected to the second edge 212c, that is, the second solder resist film layer 214 surrounds the edge of the metal material region 21b that is not connected to the non-metallic material region 21c, and the solder layer 22 is connected to the second solder resist film layer 214. The metal material area 21b is formed on the surface of the conductive metal layer 212, the solder layer 22 is coated on the metal material area 21b, and the second solder resist film layer 214 covers part of the surface of the conductive metal layer 212 and surrounds the edge of the metal material area 21b that is not connected to the non-metal material area 21c, so that the second solder resist film layer 214 surrounds the edge of the solder layer 22. When the solder layer 22 is heated during the welding process of the first electrode terminal 13 and the adapter 23, the second solder resist film layer 214 can suppress the generation of solder beads.

[0083] In some embodiments, the first solder resist layer 213 and the second solder resist layer 214 are different parts of the same solder resist. Figure 5 , Fig.10 and Fig.12 This is the case as shown in Figure 5 , Fig.10 and Fig.12 The dotted line in FIG. 2 represents the boundary between the first solder resist layer 213 and the second solder resist layer 214. In other embodiments, as shown in FIG. Figure 8 As shown, the first solder resist layer 213 and the second solder resist layer 214 are two solder resist films.

[0084] In some embodiments, along the first direction X, the second solder resist layer 214 is stacked with the adapter 23, and the projection of the adapter 23 covers the metal material area 21b and the non-metal material area 21c. In this way, the solder layer 22 can be confined in the space enclosed by the adapter 23, the first solder resist layer 213, the second solder resist layer 214 and the conductive metal layer 212, further suppressing the generation and transfer of solder beads. Suppressing the transfer of solder beads from the solder layer 22 to other locations of the circuit board is conducive to reducing the possibility of short circuit or damage to the circuit board assembly 20.

[0085] In some embodiments, Figure 5As shown, when observed along the first direction X, the width of the second solder resist film layer 214 is W, 0.15mm≤W≤0.6mm. Specifically, when observed along the first direction X, the second solder resist film layer 214 includes an inner edge surrounding the metal material area 21b and an outer edge opposite to the inner edge, and the width of the second solder resist film is the distance between the outer edge and the inner edge of the second solder resist film layer 214. When W≥0.15mm is set, the width of the second solder resist film layer 214 is not too small, which is conducive to reducing the process difficulty of setting the second solder resist film layer 214. When W≤0.6mm is set, the width of the second solder resist film layer 214 is not too large, which is conducive to reducing the occupation of the second solder resist film layer 214 on the surface of the conductive metal layer 212, so as to increase the area of ​​the metal material area 21b and the non-metallic material area 21c.

[0086] In some embodiments, 0.15 mm≤W≤0.3 mm. Setting W≤0.3 mm is beneficial to further reduce the occupation of the second solder resist layer 214 on the surface of the conductive metal layer 212 .

[0087] In some embodiments, the value of W is any one of 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, and 0.55 mm.

[0088] In some embodiments, Figure 5 As shown, the conductive metal layer 212 includes a plurality of positioning areas 212a. When viewed along the first direction X, the positioning areas 212a are exposed to the second solder resist layer 214, and the positioning areas 212a are connected to the second solder resist layer 214. When viewed along the first direction X, the positioning areas 212a overlap with the corners of the adapter 23. During the production process of the battery assembly 100, the visual module (e.g., CCD camera) of the production equipment determines the position where the adapter 23 needs to be placed by identifying the position of the positioning area 212a. Setting the positioning area 212a is conducive to enabling the production equipment to automatically identify the position of the adapter 23 to achieve automated production.

[0089] In some embodiments, Figure 5 As shown, when viewed along the first direction X, the shape of the positioning area 212a is a rectangle, and the length of any edge of the positioning area 212a is L, 0.15mm≤L≤0.2mm. When L≥0.15mm is set, the length of the edge of the positioning area 212a is not too short, which is conducive to reducing the difficulty of processing the positioning area 212a; when L≤0.2mm is set, the length of the edge of the positioning area 212a is not too long, and the area of ​​the positioning area 212a is not too large, which is conducive to reducing the occupation of the surface of the conductive metal layer 212 by the positioning area 212a.

[0090] In some embodiments, the value of L is any one of 0.16 mm, 0.17 mm, 0.18 mm, and 0.19 mm.

[0091] like Fig.13 As shown, an embodiment of the present application further provides an electric device 1000, which includes a battery assembly 100 as described in any of the aforementioned embodiments.

[0092] In some embodiments, the types of electric devices 1000 include, but are not limited to, consumer electronic products (such as mobile phones and laptop computers), electric toys, and electric tools.

[0093] Those skilled in the art should recognize that the above embodiments are only used to illustrate the present application and are not intended to be limiting of the present application. As long as they are within the spirit and scope of the present application, appropriate changes and modifications to the above embodiments are within the scope of the present application.

Claims

1. A battery assembly, characterized in that: Including circuit board assembly and battery cells; The circuit board assembly comprises a substrate, a solder layer and a transfer component which are sequentially stacked along a first direction, the substrate comprises a pad area, and when viewed along the first direction, at least part of the transfer component is located in the pad area, and the first direction is a thickness direction of the circuit board assembly; When viewed along the first direction, the pad region includes a metal material region and a non-metal material region, an edge of the metal material region is connected to an edge of the non-metal material region, at least a portion of the solder layer is located in the metal material region, and the solder layer connects the metal material region and the adapter; The battery cell includes a first electrode terminal, which is welded to the side of the adapter along the first direction facing away from the solder layer, and a solder spot is formed at the welding point between the first electrode terminal and the adapter; along the first direction, the projection of the solder spot is located in the non-metallic material area, and the solder layer and the projection of the solder spot do not overlap.

2. The battery assembly according to claim 1, characterized in that The substrate includes a base material layer and a conductive metal layer stacked along the first direction, the base material layer includes a connection area and an exposed area, and when observed along the first direction, the conductive metal layer covers the connection area, and the exposed area is exposed from the conductive metal layer, the conductive metal layer forms the metal material area, and the exposed area forms the non-metal material area.

3. The battery assembly according to claim 1, characterized in that The substrate includes a base material layer, a conductive metal layer and a first solder resist film layer stacked in sequence along the first direction, the conductive metal layer includes a first sub-region and a second sub-region, and when observed along the first direction, the first solder resist film layer covers the first sub-region, and the second sub-region is exposed in the first solder resist film layer, the second sub-region forms the metal material region, and the first solder resist film layer forms the non-metal material region.

4. The battery assembly according to claim 2 or 3, characterized in that: The substrate includes a second solder resist film layer, the conductive metal layer includes a third sub-region, and when viewed along the first direction, the second solder resist film layer covers the third sub-region, the metal material region includes a first edge and a second edge, the non-metallic material region is connected to the first edge, the second solder resist film layer is connected to the second edge, and the solder layer is connected to the second solder resist film layer.

5. The battery assembly according to claim 4, characterized in that: Along the first direction, the transition component covers the metal material area, the non-metal material area and the second solder resist layer.

6. The battery assembly according to claim 5, characterized in that: The conductive metal layer includes a plurality of positioning areas, and when viewed along the first direction, the positioning areas are exposed to the second solder resist layer, and the positioning areas are in contact with the second solder resist layer; When viewed along the first direction, the positioning area overlaps with an angle of the adapter.

7. The battery assembly according to claim 1, characterized in that: The material of the metal material area includes copper, the material of the solder layer includes tin, and the material of the non-metal material area includes at least one of phenolic resin, polytetrafluoroethylene, polyimide, epoxy resin, acrylic resin or polyurethane resin.

8. The battery assembly according to claim 1, wherein: When viewed along the first direction, the metal material region has a notch, at least a portion of the non-metal material region is embedded in the notch, and a sideline of the non-metal material region is connected to the metal material region.

9. The battery assembly according to claim 1, wherein: When viewed along the first direction, the metal material region is an annular structure, the non-metal material region is embedded in the middle of the metal material region, and the edge of the non-metal material region is connected to the metal material region.

10. The battery assembly according to claim 1, wherein: There are two metal material regions, and the two metal material regions are respectively located at two opposite sides of the non-metal material region along the length direction or the width direction thereof.

11. An electrical device, characterized in that: A battery assembly comprising the battery assembly as claimed in any one of claims 1 to 10.

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