Electrical connector device and method

Abstract

An electrical connector assembly and method are described herein. The electrical connector may include a plug connector. The electrical connector may include a docking interface. The docking interface may include a plurality of plates. An electrical connector may include a substrate. The electrical connector may include a cable connector. The density of the electrical connectors is at least 256 differential pairs per square inch. The electrical connector may include at least one internal and / or external lock mechanism.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to U.S. patent application No. 63 / 590,266, filed on October 13, 2023, the disclosure of which is hereby incorporated by reference into this application as if fully set forth herein. Technical Field

[0002] The present embodiments generally relate to electrical connector devices / assemblies, and specific embodiments are presented as electrical connectors. Background Art

[0003] Typical connectors for operation at 112G / 224G may require a wafer substrate to have a larger width to accommodate the connector. However, this increase in the size of the wafer package substrate may increase insertion loss and / or make the wafer package substrate more susceptible to curling, warping, and / or loss of coplanarity during the reflow process. Therefore, it is necessary to improve the size of the wafer package substrate, reduce the width of the connector, minimize coplanarity issues, and / or minimize insertion loss.

[0004] The present invention aims to overcome the shortcomings of the prior art, or at least to improve the prior art. Brief description of other technical features

[0005] The disclosure of U.S. Patent Application No. 63 / 590,266 is hereby incorporated by reference into this application for any and all purposes. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] In the drawings, like components shown in different views are indicated by like reference numerals. Also, the drawings are not necessarily drawn to scale, emphasis instead generally being placed upon illustrating the principles of the invention.

[0007] Figure 1 is a perspective view of an electrical connector assembly according to one embodiment, illustrating an electrical connector according to one embodiment.

[0008] Figure 2 yes Figure 1 Exploded view of the electrical connector shown.

[0009] Figure 3A Is multiple Figure 1 A perspective view of the electrical connector shown.

[0010] Figure 3B yes Figure 3A Side view of the vertical cable shown.

[0011] Figure 3C yes Figure 3A Side view of right angle cable shown.

[0012] Figure 4A yes Figure 3A A perspective view of a right angle cable and electrical connector is shown.

[0013] Figure 4B yes Figure 4A Side view of right angle cable shown.

[0014] Figure 5 yes Figure 1 A perspective view of one embodiment of a mating interface of an electrical connector is shown.

[0015] Figure 6 yes Figure 5 Exploded view of the docking interface shown.

[0016] Figure 7 is a perspective view of an electrical connector assembly presenting 1024 pairs.

[0017] Figure 8 is a perspective view showing an electrical connector assembly with 1192 pairs and / or 1280 pairs.

[0018] Fig. 9 is a perspective view of an electrical connector showing a mating interface or a plate surrounding the cable connector and / or spaced a distance from a substrate.

[0019] Fig.10 It is a perspective view of an electrical connector, wherein the mating surface is exposed.

[0020] Fig.11 is a graph of an embodiment showing an impedance curve from a cable to a package.

[0021] Fig.12 is a graph of one embodiment illustrating the effect of shielding return path transition.

[0022] Fig.13 is a graph showing the differential FD near-end crosstalk power sum, according to one embodiment.

[0023] Fig.14 is a graph showing the differential FD far-end crosstalk power sum, according to one embodiment.

[0024] Fig.15 A package (PKG) and PCB (printed circuit board) embodiment of 64 blocks is shown.

[0025] Fig.16A and Fig. 16B A cage according to one embodiment is shown.

[0026] Fig.17 A portion of the package substrate wiring is shown.

[0027] Fig.18It is a package and PCB comparison diagram of an embodiment, showing the turning design for vertical wiring.

[0028] Fig.19A – 19C is a schematic diagram of an embodiment of a mezzanine connector, showing a height of less than 8 mm.

[0029] Fig. 20 Another embodiment of an electrical connector is shown in which a portion of a cable connector is removed to reveal a locking mechanism.

[0030] Fig. 20A yes Fig. 20 An enlarged cross-sectional view showing a latch locking mechanism for engagement between docking interfaces.

[0031] Fig.21 yes Fig. 20 Exploded diagram of .

[0032] Fig. 22 is a perspective view of the docking interface showing the assembled socket base and grounding member.

[0033] Fig.22A yes Fig. 22 An enlarged perspective view of .

[0034] Fig.23 yes Fig. 22 Exploded diagram of .

[0035] Fig.24 is a perspective view of a row of cavities receiving a docking interface having a row or more connectors.

[0036] Fig.25 yes Fig.24 Exploded diagram of .

[0037] Fig.25A and Fig.25B yes Fig.25 An enlarged perspective view of .

[0038] Fig.26 The present invention is an electrical connector according to another embodiment, in which a portion of a cable connector is removed to reveal a docking interface and a portion of an opened plug connector.

[0039] Fig. 27 yes Fig.26 A perspective view of an electrical connector is shown with the housing of the mating interface partially opened and the plug connector housing partially removed, illustrating a reinforcement member and a retaining member of one embodiment.

[0040] Fig.28 yes Fig.26 A perspective view of an electrical connector is shown with the docking interface and cable connector separated from the plug connector and the housing portion of the docking interface removed.

[0041] Fig.29 yes Fig.26 An exploded view of one row of cavities of a docking interface is shown, the interface receiving a portion of a row or more connectors.

[0042] Fig.30 yes Fig.26 The graph of the illustrated embodiment shows the differential FD NEXT power sum.

[0043] Fig.31 yes Fig.26 The graph of the illustrated embodiment shows the differential FD far-end crosstalk power sum.

[0044] Fig.32 Detailed Description of the Invention The electrical connector system of another embodiment is shown in which a first electrical connector is partially removed to show a docking interface, and a second electrical connector is partially in an open state.

[0045] Fig.33 yes Fig.32 A perspective view of an electrical connector system is shown, wherein a housing of a mating interface is partially opened and a portion of a housing of a second electrical connector is removed to illustrate a reinforcement member and a retaining member of an embodiment.

[0046] Fig.34 yes Fig.32 A perspective view of an electrical connector system is shown with the docking interface and the first electrical connector separated from the second electrical connector and the housing of the docking interface partially removed.

[0047] Fig.35 is an electrical connector system of another embodiment, wherein a portion of the first electrical connector is removed to show the mating interface and a portion of the second electrical connector is in an open state.

[0048] Fig.36 yes Fig.35 A perspective view of an electrical connector system is shown with a housing of a docking interface partially opened and a housing of a second electrical connector removed to illustrate a reinforcement member and a retaining member of one embodiment.

[0049] Fig.37 yes Fig.35 A perspective view of an electrical connector system is shown with the docking interface and the first electrical connector separated from the second electrical connector and the housing of the docking interface removed. Detailed Description

[0050] Referring to the accompanying drawings, one embodiment provides one or more electrical connector assemblies 20. The assembly 20 may include at least one or more electrical connectors 30. In some embodiments, the electrical connector may include a width of about 12.5 mm, an operating speed of about 224 Gbps, and / or a package size of about 75 mm. The number of pairs may be 64 pairs in less than half an inch, or a density greater than 256 pairs per square inch. In some embodiments, the size and shape of the electrical connector may enable multiple electrical connectors to be mounted on a single side of a wafer package substrate no larger than about 75 mm square (75 mm x 75 mm) to about 85 mm square (85 mm x 85 mm), multiple electrical connectors may carry at least 1024 differential signal pairs together, and multiple electrical connectors may transmit Pam4 signals of about 224 Gbps / sec at a bandwidth of about 56 GHz to about 70 GHz, and the far end crosstalk (FEXT) does not exceed about -40 dB. In various embodiments, the size and shape of the electrical connectors may be mounted on a single side of a chip package substrate no larger than about 75 mm x 75 mm to about 85 mm x 85 mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and the plurality of electrical connectors transmit PAM4 signals at about 224 Gigabytes per second in a bandwidth range of about 56 GHz to about 70 GHz, with a near-end crosstalk (NEXT) of no more than about -50 dB. In some embodiments, the length of each side of the chip package substrate is no larger than about 75-96 mm, including each side having a length of about 80 mm ± 5 mm and 91 mm ± 5 mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, the plurality of electrical connectors transmit PAM-4 signals at about 224 Gigabytes per second in a bandwidth range of about 56 GHz to about 70 GHz, and the far-end crosstalk is no more than about -40 dB.

[0051] Now refer to the figure, Figure 1-4B An exemplary embodiment of an electrical connector assembly 20 according to one aspect of the present invention is shown. The electrical connector assembly 20 includes an electrical connector 30 and / or a plurality of cable connectors 40 configured to mate with the electrical connector 30. The electrical connector 30 may include or be connected to a circuit substrate 50, such as a chip packaging substrate 50a, a printed circuit board 50b. As shown in one embodiment, the connector 30 may be positioned / mounted on a single side of the circuit substrate 50 (e.g., 50a, 50b). However, in some embodiments, the connector 30 may be disposed on both sides. Figure 5 and Figure 6, the electrical connector 30 may include a docking interface or cable head organizer 60 (e.g., an egg rack docking interface or shield). The docking interface 60 may include a plurality of interlocking plates 62 that define a plurality of cavities 63. The connector 30 may include or be configured to dock with one or more cable connectors 40. Each cavity 63 may be sized to accept a cable connector 40 or dock with a cable connector 40. The electrical connector 30 may include one or more plug connectors 70. The electrical connector 30 or plug connector 70 also includes one or more electrical contacts 71 and / or one or more grounding contact elements 72. Each electrical contact 71 is located within the cavity 63, is electrically isolated from the interlocking plates 62, and is configured to dock with a contact 42 (e.g., a socket) of the cable connector 40. Each grounding contact element 72 is electrically grounded and is configured to dock with at least one board 62 (e.g., direct, indirect, first board, second board). The plug connector 70 (e.g., grounding contact element, electrical contact) is soldered to a circuit substrate 50 (e.g., 50a, 50b). At Figure 7 In some of the embodiments shown, a solution with 1024 pairs can be used. Figure 8 In other embodiments shown, solutions with 1192 pairs or 1280 pairs may be used. It should be understood that the wafer packaging substrate may have an isolation area dedicated to the integrated circuit die. The integrated circuit die may be mounted in the keep-out area of ​​the wafer packaging substrate. Therefore, in some examples, it is understood that no electrical connectors are mounted on or mounted on the wafer packaging substrate in the keep-out area. In one example, the keep-out area may define an area of ​​approximately 40 mm square.

[0052] In some embodiments, at least one interlocking plate 62 (e.g., the first interlocking plate) is conductive and provides a ground connection between the cable connector 40 and the circuit substrate 50 or a portion thereof. Generally, the interlocking plate 62 can be conductive or insulating. Fig. 9 and Fig.10 As shown, at least one interlocking plate 62 includes an end 64 remote from the circuit substrate 50 and a butt end 65 for electrically contacting the conductive outer shield element 43 of the cable connector 40. To reduce / control the impedance back and forth, the spacing or distance D from the circuit substrate 50 (e.g., package 50a, 50b) to the end 64 of the plate 62 / shield 43 can be reduced by the length L of the plate 62 or cavity 63. The remaining portion of the length or distance D from the circuit substrate to the end 64 may be at least one source of crosstalk. The plate 62 defining the cavity 63 covers or overlaps approximately 85% to 95% of the length L from the cable connector 40 to the package or substrate 50 to minimize the distance D. As shown in FIG. Fig. 9As shown in one embodiment of , the plate 62 defining the cavity 63 covers or overlaps about 90% of the length L of the cable connector 40 to the package to reduce crosstalk, while the remaining portion or the remainder of the distance D can be 10% from the substrate. Fig.11 An example of a cable-to-package impedance curve is shown, with a simulation showing a TDR signal of 92Ω + / - 5Ω at 6 picoseconds (20%-80% rise time).

[0053] In some embodiments, the end 64 of the plate 62 or cavity 63 may be spaced a certain distance (e.g., a predetermined distance D) from the package / substrate 50. The end 64 or plate 62 may abut / position / dock against the ground contact element 72 of the plug connector at the distance D. The ground contact element 72, or a portion thereof, may be spaced a distance D from the plate 62, or a portion thereof (e.g., the end 64) from the substrate 90. In one embodiment shown, the ground contact element 72 extends / extends from the circuit substrate 50 (e.g., 50a, 50b). The ground contact element 72 may include one or more arms / blades. For example, the ground contact element may include at least one arm, at least two arms, at least three arms, at least four arms, or four or more arms. Increasing the number of arms may increase the contact area / width when docking with a docking interface (e.g., a plate). As shown in one embodiment, the ground contact element 72 may include two arms 72a, 72b (e.g., at least two laterally offset cantilever beams) that extend upward and away from each other to form a slot 73 for receiving the end 64 of the plate 62 (e.g., the first piece). The two arms may be offset from the rest of the ground contact element or body. The two arms 72a may be offset from each other by a distance along the length or plane of the slot 73 of the receiving plate 62. Although the two arms may not overlap or intersect along the length of the slot, it should be understood that in some embodiments, a portion of the two arms may overlap. One or more portions (e.g., arms) of the slot or ground contact element 72 may define a stop or vertical stop mechanism for limiting further axial movement of the plate 62 in the slot or toward the circuit substrate. The stop may position the docking interface, plate, or cavity at a distance D. In addition, the first and second arms 72a, 72b may be mirror images of each other about the plane of the slot 73. The first arm 72a engages with the interior of one cavity / plate, and the second arm 72b engages with the interior of an adjacent cavity / plate. In one embodiment shown, the two ground contact elements 72 may engage with adjacent parallel plates 62 (e.g., the first plate) rather than the adjacent second plate that defines the cavity 63 of the receiving cable connector 40. However, in some embodiments, one or more ground contact elements 72 may engage with one or more second plates and / or engage with one or more first plates. In one embodiment shown, each arm 72a, 72b may be spring loaded or biased to push toward slot 73 or engage with plate 62. In addition, each arm or the distal free end of the arm may be expanded / bent from the slot or engaging plate. As shown in one embodiment, arm 72 may be surrounded by air or free space and not in contact with plastic or insulating components. There may be no plastic between the butt end of ground contact element 72 and the butt end of signal contact 71. The butt ends of 71 and 72 may be unrestricted or not surrounded by plastic or insulating components.The arm 72 (e.g., butt end) may be independent, protruding above the plastic of the plug connector 70 at the base of the arm and / or extending (e.g., not inside the plastic). In addition, there may be no plastic or insulating material on the extension line between the butt end of arm 72b and the butt end of the adjacent arm 72b. FIG. 12 shows an example of S parameters for a shielded return path or ground contact element. The simulation implementation shown in FIG. 12 was conducted under the conditions of 92Ω + / - 5Ω, 6 picoseconds (20%-80% rise time). In some embodiments, the contact may include one or more solder balls / solder blocks 74. In one embodiment shown, the ground contact element 72 includes at least one solder ball 74. It should be understood that the ground contact element 72 may include one or more solder balls. For example, at least one solder block, at least two solder blocks, or at least three solder blocks. In some embodiments, two or more solder blocks may be adjacent to each other (e.g., arranged linearly). In some embodiments, the soldering of the contact may be one or more elongated pads of different lengths. In some embodiments, the electrical / signal contact 71 can be perpendicular to the ground contact element 72 .

[0054] In a preferred embodiment, the interlocking plate 62 is a metal plate formed by any suitable method, such as metal stamping. In other embodiments, the interlocking plate 62 is formed by other methods, including molding and / or machining of polymer materials, molding and / or machining of metals, or a structure of coating a metal frame with a polymer material. In some embodiments, the plastic frame / base can be plated.

[0055] In some embodiments, the interlocking / interconnecting plate 62 includes a plurality of first plates 62a and a plurality of second plates 62b, as shown in FIGS. 5 and 6. The plate 62 may include one or more grooves 66 and / or one or more slots 67. The grooves (if used) may interlock with the slots (if used) to define the cavity 63. The first plate 62a may include a plurality of first slots 67a aligned with the plurality of first grooves 66a. The second plate 62b may include a plurality of second slots 67b aligned with the plurality of second grooves 66b. The second plate 62b is laterally positioned and interconnected relative to the first plate 62a by interlocking the first slots 67a with the second grooves 66b and the second slots 67b with the first grooves 66a, so that when assembled, the plurality of first plates and the second plates define a plurality of cavities 63. The slot 67 / groove 66 engagement, or the mating interface 60, provides a fully enclosed or 360 degree shielding / perimeter for one or more cable connectors 40. 360 degree shielding or plates can reduce crosstalk between cable connectors within the cavity. This can prevent or reduce gaps / holes / channels in the cavity wall, thereby reducing crosstalk. The walls of the slot / groove joint can meet or overlap the edges of the opposing slot / groove joint to reduce gaps. As shown in Figure 13, multiple electrical connectors can transmit about 70Ghz signals with no more than about -40dB of far end crosstalk. The simulation shown in Figure 13 was conducted at 92Ω + / - 5Ω, 6 picoseconds (20%-80% rise time).

[0056] In some embodiments, the docking interface 60 may include a housing 68. The housing 68, if used, may include a plurality of grooves 69 located on the inner periphery. The grooves 69 may maintain the spacing of the cavity 63 / plate 62 and / or provide rigidity to one or more plates 62. The grooves 69 may receive the ends of the first plate 62a and the second plate 62b.

[0057] In some embodiments, the electrical connector 30 may include one or more gaps / spaces 32 between the cable connectors 40 to reduce crosstalk. In some embodiments, larger spaces or distances between rows can reduce near-end crosstalk of the package. In one embodiment shown, the gap 32 can be defined by one or more rows of cavities 63 that do not contain cable connectors 40 defined by multiple plates 62. The gaps 32 within one or more rows or arrays of cable connectors 40 that do not contain cable connectors 40 can reduce crosstalk between cable connectors 40. As shown in one embodiment, one or more rows / gaps 32 that do not contain cable connectors 40 can be defined by multiple smaller cavities (e.g., smaller through holes) or closely spaced plates. Smaller rows or gaps 32 (if used) can be defined by at least two adjacent parallel plates (e.g., first plate 62a and / or second plate 62b) with a spacing smaller than the spacing of the remaining parallel plates. Grooves 66 and slots 67 can be provided on each plate 62 to determine gaps 32 of various row spacings / spacings D. Although not shown, the spacing (e.g., row spacing) between the intersecting plates 62 of the first plate and the second plate can be smaller to define smaller rows. In addition, as shown in FIG. 14 , the plurality of electrical connectors can transmit approximately 70 GHz signals with near-end crosstalk not exceeding approximately -50 dB. The simulation embodiment shown in FIG. 14 was conducted under 92Ω + / - 5Ω, 6 picoseconds (20%-80% rise time) conditions.

[0058] In some embodiments, the component / connector or a portion thereof (e.g., a docking interface, a plug connector, and / or a cable connector) can be a simulated 224 Gigabytes per second Pam4 signal in one embodiment, with 92Ω + / - 5Ω at 6 picoseconds and a rise time of 20%-80%. In some embodiments, the bandwidth can be about 70 to 50 GHz. In some embodiments, the bandwidth can be about 56 GHz. In various embodiments, the far-end crosstalk can be about -30 dB (decibel) to about -45 dB. For example, less than or equal to -30 dB, less than or equal to -35 dB, less than or equal to -40 dB, and / or less than or equal to -45 dB. In some embodiments, the insertion loss can be between about 0 dB and about -5 dB. For example, between 0 dB and -1 dB, between -1 dB and -2 dB, between -2 dB and -3 dB, between -3 dB and -4 dB, and / or between -4 dB and -5 dB. The bandwidth may be about 50 GHz to about 80 GHz. For example, 50 GHz, 55 GHz, 60 GHz, 65 GHz, 70 GHz, 75 GHz, and / or 80 GHz. In different embodiments, the near-end crosstalk may be about -40 dB to about -60 dB. For example, less than or equal to -40 dB, less than or equal to -45 dB, less than or equal to -50 dB, less than or equal to -55 dB, and / or less than or equal to -60 dB. In some embodiments, the insertion loss may be between about 0 dB and about -5 dB. For example, between 0 dB and -1 dB, between -1 dB and -2 dB, between 2 dB and -3 dB, between -3 dB and -4 dB, and / or between -4 dB and -5 dB. The bandwidth may be about 50 GHz to about 70 GHz. For example, 50 GHz, 55 GHz, 60 GHz, 65 GHz, and / or 70 GHz.

[0059] In some embodiments, the assembly 20 or electrical connector 30 may include a bend / cable organizer 80 for one or more cables 90. In some embodiments, the bend / cable organizer 80 may include a strain relief 81. The strain relief 81, if used, may be a hot melt adhesive. As shown in FIG. 3A and FIG. 15 , the bend organizer 80 may be used for a vertical cable 90a or a right angle cable 90b. The overall height of the electrical connector 30 or assembly 20 may be less than 15 mm. The height of the right angle cable 90b with the bend organizer 80 is approximately 15 mm. The height of the vertical cable 90a with the bend organizer 80 is approximately 10 mm.

[0060] In some embodiments, one or more cables 90 can be connected to one or more cable connectors 40. Although in one embodiment shown, the cables 90 are shown as dual cables, it should be understood that various cables can be used and still be within the scope of the present invention. For example, coaxial cables can be used in some embodiments. The cable 90 can include a shielding layer, such as a wrapped shielding layer, an extruded shielding layer, or any type of grounding shielding layer, reference shielding layer, or EMI shielding layer. The shielding can be stripped relative to the exposed surface of the central electrical insulator, and can also be partially stripped, but is not limited to a length greater than 0 mm to about 1 mm to 2 mm, or 0 mm, or 2 mm or more, or 0 mm to 0.5 mm. Any connector can include conductive material or electrically dissipative material, magnetic absorption material.

[0061] In some embodiments, the assembly 20 or electrical connector may include one or more mounting brackets 95. Fig.16A As shown in FIG. 16B , one example of a fixing bracket 95 may be one or more spring fingers. A fixing device (if used) may ensure that the parts fit together and / or facilitate maintenance. Another example of a fixing bracket may be a latch.

[0062] In some embodiments, the circuit substrate 50 may have a determined wiring density. For example, as shown in FIG. 17 , the package or wafer substrate package may start with a 350 micron pitch to minimize far-end crosstalk and reduce the pitch to 200 microns for wiring vias. A BGA pitch of 0.35 may determine the wiring density (e.g., 224 gigabits per second). There may be a 64-pair printed circuit board embodiment. As shown in FIG. 15 , the PCB version may be about 5 mm wider and deeper than the wafer substrate package. In addition, FIG. 18 shows a comparison of one embodiment of the package with a PCB embodiment. The figure shows a steering design for vertical wiring. The package may be 2 layers, while the PCB may be 4 / 8 layers.

[0063] In some embodiments, the electrical connector assembly may include a lower RA height option. For example, the cable organizer compatibility may be less than 8 mm. As shown in Figures 19A-19C, the arrangement may be a stacked flexible sheet 98 in a sandwich arrangement. As shown, an example may be 4 3-layer flexible films stacked together, one of which is welded to the connector. The flexible sheet 98 may be converted into one or more cables to obtain longer lengths.

[0064] In some embodiments, the electrical connector assembly 20, the electrical connector 30, the docking interface 60, 160, the substrate 50 and / or the plug connector 70, 170 may include one or more locking mechanisms 82 or portions thereof to couple the docking interface 160 to the plug connector 170. In one embodiment shown in FIGS. 20-23, the locking mechanism 82 may be an intermediate or internal locking mechanism spaced or positioned inwardly from the periphery (e.g., outer shell, wall) of the electrical connector 30 / connector 170 / dock interface 160. The locking mechanism 82 may include one or more latches, clips, or friction locks 82a (e.g., intermediate, internal). The one or more clips 82a are shown as being internal or internal to the plug connector 170, the docking interface 160 and / or the electrical connector 30 (e.g., periphery). Although the clips 82a are shown as being internal to the electrical / plug connector 30, 170 and / or the docking interface 160, it should be understood that in some embodiments, external clips (e.g., located on the periphery, walls) may be used in conjunction with internal clip / locking mechanisms. One or more clips 82a extend upward from the spaced interior of the bottom and / or periphery of the plug connector 170 and / or the substrate 50. The clips may extend upward from an intermediate wall or inner wall 82ab extending between or within the peripheral walls (e.g., opposing walls) of the plug interface 160 (e.g., base, grounding member) or the plug connector 170. In one embodiment shown, two spaced-apart clips 82a may be spring loaded in a lateral direction (e.g., in opposite directions inwardly toward opposite sides of the interior panel 82b) to the plane of the clips 82a and / or the inner wall 82ab. The clip 82a generates friction force on the locking mechanism 82 of the docking interface 160 or a portion thereof (e.g., the inner panel 82b, the slot 82ba) to reduce or prevent axial separation between the docking interface 160 and the plug connector 170. The locking mechanism 82 of the plug interface 160 or a portion thereof may be one or more sockets / snaps 82ba and / or the inner panel 82b, which releasably engage the one or more clips 82a. When assembled, the clip 82a engages with the inner panel 82b of the plug interface 160 or a portion thereof (e.g., the upper notch / snaps / sockets 82ba). The clip 82a of the plug connector 170 interferes with the axial separation of the docking interface 160 or the inner / middle panel 82b. The inner panel 82b may be located in the gap 32 between the cable connector 40 and / or the cavity 32 (e.g., the cable connector row). The upper edge of the inner panel 82b may include one or more notches / snaps 82ba. If two notches 82ba are used, the notches may be spaced apart from one another along the length of the panel 82b. One or more portions of the locking mechanism 82 may be interchanged between the docking interface 160 and the plug connector 170.For example, it should be appreciated that in some embodiments, the docking interface 160 may include a clip and the plug connector 170 may include an internal panel.

[0065] In one embodiment shown in FIGS. 20-25 , the docking interface 160 may include a plurality of interlocking plates 62 defining at least one row R1 of cavities 63 that receive at least one row or one or more cable connectors 40. The interlocking plates 62 may include at least two third / opposing / parallel plates 62c that are interconnected by one or more fourth / parallel plates 62d that are transverse to the third plate. The fourth plate 62d may define opposing end plates at opposite ends of a row of cavities or third plates 62c. Each row R1 may include a third plate and a fourth plate. The docking interface 160 may include multiple rows R1 defined by the third and fourth plates. The cavity 63 may have through holes (e.g., open at the top and open at the bottom) defined by the third and fourth plates 62c, 62d. In some embodiments, the third plate 62c may include one or more through holes 62ca that receive one or more protrusions 62da extending from the periphery (e.g., opposite ends / sides) of the fourth plate 62d when assembled. As shown in one embodiment in FIGS. 24, 25 and 25B, the third plate 62c may include one or more through holes or openings 62ca (e.g., in a direction from the butt end 65 to between the end 64). As shown in FIGS. 24, 25 and 25A, each fourth plate 62d may include one or more protrusions or elongated protrusions 62da located on opposite sides / edges that engage with corresponding openings 62ca of the opposite third plate 62c. The butt ends 65 of one or more third plates 62c and / or fourth plates 62d may include a plurality of arcuate edges to butt or fit with one or more cables 90 or cable connectors 40. As shown in FIGS. 24 and 25, the other end of the opposing / parallel third plate 62c may be longer than the arcuate edge and extend beyond the arcuate edge. In some embodiments, solder paste may be applied near the butt joint of the hole / protrusion. The cavity defined by the third and fourth plates 62c, 62d may receive the cable connector 40. The end plate or fourth plate 62d can be spaced inward from the opposite end of the third plate or row R1 to define a groove 200b. The groove 200b may include a bottom opening for receiving or inserting the tongue component 200a of the remaining portion of the docking interface 160 (such as a base, a grounding member). The third / fourth plate 62c, 62d (e.g., grounding metal) can be stamped and / or plated. In some embodiments, the plates 62 can be solder paste printed, tin solder plated and / or laser welded together. The cavity or the third and / or fourth plate can be assembled with one or more hot blades and one or more cable connectors 40 therein. When assembled, a row of R1 cavities defined by the third plate 62c, the fourth plate 62d is adjacent to one or more rows of R1 cavities. As shown in Figures 20, 20A and 21, adjacent third plates 62c of adjacent cavities / rows R1 can be placed in parallel and / or in contact with each other.As shown in one embodiment in FIG. 20 , the locking mechanism 82 or portions thereof, the inner wall 82ab, the gap 32, the inner panel 82b, the groove 82ba, and / or the clip 82a may separate two adjacent rows R1.

[0066] In some embodiments, the docking interface 160 may include a plate (e.g., third, fourth, etc.), a socket base 160a, and / or a grounding member 160b. In some embodiments, the socket base 160a may be, but is not limited to, molded plastic, and / or the grounding member 160b may be, but is not limited to, stamped metal (e.g., conductive metal). The base 160a or docking interface 160 may include one or more internal panels 82b and / or a locking mechanism 82 or a portion thereof in some embodiments. The base 160a may include a housing 68 having a peripheral wall 68a defining a through hole 68b. The internal panel 82b may be located inside or inside the periphery and extend between opposing walls of the peripheral wall 68a and / or intersect the through hole 68b. The grounding member 160b may include a peripheral wall 68c defining a through hole 68d. The peripheral wall 68c of the grounding member 160b may include a channel 68e (e.g., a U-shaped, inverted channel). The grounding member peripheral wall 68c may be butted against the base peripheral wall 68a. The channel 68e or grounding member wall 68c may receive the upper edge of the base peripheral wall 68a. The docking interface 160 may include one or more tongue-and-groove joints 200. The opposing wall 68c of the grounding member 160b may include one or more tongue members or docking surfaces 200a adjacent to the opposing wall of the base 160a. The tongue members 200a are disposed along at least one wall of the base 160a / grounding member 160b and may be spaced apart from each adjacent tongue member 200a along the wall by a groove 68f (e.g., vertically, longitudinally). Although not shown, the width of the groove 68f may increase from the distal free end of the tongue piece to the proximal end or upper edge of the grounding member. For example, the groove may include an upper groove portion that is larger than a lower groove portion. The tongue member may be located inside the peripheral wall 68a and butt / engage with one or more grooves 200b of one or more rows R1 / opposite ends of the third and / or fourth plates 62c, 62d of the butt interface. Although not shown, the tongue member or a portion thereof may be spaced inwardly away from the inner surface of the bottom wall 68a. The plates 62c, 62b may contact one or more walls 68c (e.g., opposing walls, one wall, two walls, three walls, etc.) of the grounding member 160b and / or adjacent plates / rows (e.g., 62c, 62b).

[0067] In some embodiments, the plates 62c, 62d defining one or more rows of cavities 63 of R1 may be engaged with the grounding member 160b and / or the base 160a by one or more latches. In one embodiment shown in FIGS. 20-24, the latch may be one or more tongue-and-groove engagements 200 between the plates 62 (e.g., the third and fourth plates) and the grounding member 160b and / or the base 160a. It should be understood that various engagements or latches may be used between the plates 62 and the grounding member 160b. One or more opposing tongues 200a of the base / grounding member engage or receive opposing grooves 200b or ends of one or more rows R1 of the cavities 63 defined by the third and fourth plates, and / or position the third plates 62d of adjacent rows R1 in contact with each other when assembled. If used, the tongues 200a and / or grooves 200b adjacent to the opposing walls of the grounding member 160b may be adjacent to the opposing ends of the interior panel 82b. The end of the third plate 62c or groove 200b (e.g., a portion of row R1) may extend between the tongue 200a or a portion thereof (e.g., groove 68f) and / or bottom wall 68a to slidably engage the tongue and groove. In some embodiments, a latch locking mechanism 300 may be used to axially lock the tongue-and-groove joint 200 or a portion of the joint interface therebetween. In one embodiment shown in FIGS. 20-25, the latch locking mechanism 300 may be a releasable engagement between the grounding member 160b and the plate 62 (e.g., 62c, 62d) and / or row R1. As shown in FIG. 20A, one or more third plates 62c may include one or more protrusions 300a adjacent and extending outwardly from opposite ends of one or more rows R1, which may releasably engage with one or more protrusions 300b that extend outwardly or laterally from adjacent tongues 200a into the groove 68f therebetween. If protrusions 300b are used, a portion of the slot 68f between adjacent tongues 200a can be narrowed. The latch mechanism 300 (e.g., protrusions 300a, 300b, openings, etc.) (if used) can engage after axial engagement / movement (e.g., sliding) a certain distance when engaging the tongue and groove joint 200. For example, relative sliding between the tongue and groove joint causes one or more protrusions 300a of a row of cavities / plates containing the docking interface of the cable connector 40 to engage (e.g., axially) with one or more protrusions 300b of the grounding member and / or base of the docking interface. In addition, when the docking interface 160 is assembled to the plug connector 170, the clip 82a (if used) can extend upward between the inner panel 82b and the adjacent third panel 62c on one or both sides of the inner panel.If two clips 82a are used as shown in one embodiment, the clips may extend along or abut opposite sides of the interior panel 82b of the base 160a.

[0068] In some embodiments, the electrical connector 30 and / or the cable connector 40 may include shielding for differential signal pairs (eg, 60, 160), while the plug connector 70, 170 does not provide shielding for differential signal pairs. Fig.26 As shown, the plug connectors 70, 170 do not have their own independent peripheral shielding or egg-cage shielding (eg, crosstalk). Only the electrical connector 30 and / or the cable connector 40 include a peripheral, egg-cage shielding (eg, crosstalk) or mating interface 60, 160 for the differential signal pairs.

[0069] In some embodiments, the electrical connector assembly 20, the electrical connector 30, the docking interface 60, 160, the substrate 50 and / or the plug connector 70, 170 may include one or more locking mechanisms 182 or portions thereof to couple the docking interface 160 to the plug connector 170 (e.g., housing, substrate). In one embodiment shown in FIGS. 26-29, the locking mechanism 182 may be an external locking mechanism positioned within the periphery (e.g., outer housing, wall) of the electrical connector 30 / connector 170 / dock interface 160. The locking mechanism 182 may include one or more latches or clips 182a (e.g., external latches or clips). The one or more clips 182a are shown as being on the outside (e.g., periphery) of the plug connector 170, the docking interface 160 and / or the electrical connector 30. Although the clips 182a are shown as being external to the electrical / plug connectors 30, 170 and / or the docking interface 160, it should be understood that in some embodiments, internal clips (e.g., located on the periphery, on the wall) may be used in conjunction with an external clip / locking mechanism. One or more clips 182a extend downwardly from the bottom of the docking interface 160 or are contained in the housing 168 of the electrical connector 30. The clips 182a may extend downwardly from one or more outer walls 168a (e.g., opposite) to releasably dock with the plug connector 170 (e.g., housing 178, outer wall 178a, socket 179). One or more sockets 170 within the housing 178 and / or outer wall 178a of the plug connector 170 may releasably receive the one or more clips 182a. The socket 179 may extend from or dock with the chip packaging substrate 50 (e.g., 50a, 50b). In one embodiment shown, two spaced-apart clips 182a can be spring loaded in a direction transverse to the plane of the clips 182a (e.g., in opposite directions inwardly of the connector). The clips 182a can include one or more protrusions 182b that releasably engage with one or more holes 179a of the bracket 179 or housing 178. It should be understood that the clips 182a and brackets 179 can be interchanged and still remain within the scope of the present invention.

[0070] In some embodiments, the plug connector 170 (e.g., housing) and / or the circuit substrate 50 may include one or more reinforcement members 180. The reinforcement member 180 may support one or more portions of the plug connector 70, 170. As shown in one embodiment in FIGS. 26-29, one or more reinforcement members 180 may be connected to the circuit board side of the circuit substrate 50 and / or one or more portions of the docking housing 178 (e.g., bottom 178b, outer wall 178a). As shown, in some embodiments, one reinforcement member may engage with three outer walls 178a, and in some embodiments, may also engage with a single outer wall or the entire periphery of the outer wall. The illustrated embodiment includes two opposing reinforcement members. The reinforcement member may include one or more upwardly protruding parts / tabs 181 that engage with the housing 178 (e.g., wall). The tab 181 may include one or more posts 181a received within the base 177 of the housing 178 and / or one or more posts 181b having holes 181ba that may receive offset tabs 178c of the housing 178. In some embodiments, the reinforcement may support the bottom / base wall 178b or the periphery or edge of the housing 178. The reinforcement or portions thereof may be made of conductive material, non-conductive material, or both. In some embodiments, the reinforcement may be stainless steel. It should be understood that the reinforcement may be of various shapes, sizes, quantities, locations, and configurations while still being within the scope of the present invention.

[0071] In some embodiments, the assembly 20, cable connector 40, and / or docking interface 60, 160 may include one or more retaining members 190. The one or more retaining members 190 may align or maintain engagement (e.g., conductive, non-conductive) between one or more portions of the docking interface 160. In some embodiments, the securing member 190 may retain and / or align (e.g., horizontally, vertically) the plate 62, cavity 63, egg rack shield, or docking interface, or portions thereof. In some embodiments, the securing member 190 may secure and / or align (e.g., horizontally, vertically) the egg rack shield, cavity 63, plate 62 to the housing 168. In one embodiment shown in FIGS. 26-29, the securing member 190 may be one or more elongated members or rods 191 (e.g., horizontally) that engage with one or more elongated slots / holes 192 of the housing 168 (e.g., wall) and / or one or more slots / holes 193 of the plate 62 / cavity 63 / egg rack shield. The securing member or portions thereof may be made of conductive material, non-conductive material, or both. It should be understood that the securing members / mechanisms may be of various shapes, sizes, numbers, locations and configurations while still remaining within the scope of the present invention.

[0072] In some embodiments, one or more ends 65 of one or more plates 62 may be in electrical contact with the conductive outer shielding element 43 of the cable connector 40. As shown in FIGS. 24, 25, and 25A, the butt ends 65 of one or more third plates 62c and / or second plates 62d may include a plurality of arcuate edges to butt or fit with one or more cables 90 or cable connectors 40 (e.g., outer shielding element 43). In some embodiments, the butt ends 65 may be in direct contact with the outer shielding element 43. As shown in FIGS. 26-29, the butt ends 65 of one or more third plates 62c may include a plurality of flat edges to butt or fit with one or more cables 90 or cable connectors 40 (e.g., outer shielding element 43) or portions thereof. In addition, in some embodiments, the butt interface 160 and / or connector 30 may include epoxy 65a at one or more conductive joints. For example, as shown in one embodiment in FIGS. 26-29 , an epoxy 65 a (eg, conductive) may be used between the planar shaped butt end 65 or one or more portions of the plate 62 (eg, the butt end) and the outer shield element 43 .

[0073] As another example, referring to FIGS. 32-34 , a board-to-board or mezzanine electrical connector system 53 may include first and second circuit board connectors 96 , 97 that are configured to dock with each other. The first and second circuit board connectors 96 , 97 are configured to be mounted on respective first and second substrates 51 a , 51 b , which may be configured as the substrate 50 described herein. The configuration of the first circuit board connector 96 may refer to the electrical connector 30 described herein, including the plug connectors 70 , 170. The docking interface of the second electrical board connector 97 may refer to the cable connector 40 described herein, which is configured to mate with the electrical connector 30. The second circuit board connector 97 may be configured to be mounted on a substrate, as described herein with reference to the electrical connector 30 , including the plug connectors 70 and 170. Therefore, the second circuit board connector 97 may be configured to be mounted on the second substrate 51 b. Therefore, during operation, when the first and second circuit board connectors 96 , 97 are respectively mounted on the first and second substrates 50 a , 50 b and dock with each other, the respective substrates in the first and second substrates 51 a , 51 b may be in electrical communication with each other.

[0074] Referring now to FIGS. 35-37 , the cable-to-cable electrical connector system 57 may include first and second cable connectors 94, 95 configured to mate with each other. The corresponding first and second plurality of cables may be mounted to the electrical contacts of the first and second cable connectors 94, 95, respectively. The configuration of the first cable connector 94 may refer to the cable connector 40. The docking interface of the second cable connector 95 may refer to the electrical connector 30 described herein, including the plug connectors 70, 170, which may be docked with the cable connector 40 described herein. Therefore, the second cable connector 95 may be configured to mate with the first cable connector 94. The second cable connector 95 may be configured to electrically communicate with the cable, such as the cable connector 40 described herein. Therefore, the electrical contacts of the second cable connector 95 may be configured to be mounted to the second plurality of cables. During operation, when the first and second cable connectors 94, 95 are docked with each other, corresponding cables in the first and second plurality of cables may be electrically communicated with each other.

[0075] In some embodiments, FIG. 30 and FIG. 31 illustrate the differential FD near-end crosstalk sum and the differential FD far-end crosstalk power sum of one embodiment of the electrical connector shown in FIGS. 26-29. As shown in FIG. 30, the near-end crosstalk of multiple electrical connectors does not exceed about -50 dB when transmitting about 70 GHz signals. The simulated embodiment shown in FIG. 30 is the total power sum, i.e., the sum of all noise sources in accordance with industry standards. In addition, as shown in FIG. 31, the far-end crosstalk of multiple electrical connectors does not exceed about -30 dB when transmitting about 70 GHz signals. The simulated embodiment shown in FIG. 31 is the total power sum, i.e., the sum of all noise sources in accordance with industry standards.

[0076] In some embodiments, the components / connectors 20, 30 or portions thereof (e.g., a docking interface, a plug connector, a circuit substrate and / or a cable connector) may include at least 257 differential pairs per square inch, at least 256-264 differential pairs per square inch, at least 139-263 differential pairs per square inch, at least 138-145 differential pairs per square inch and / or at least 88-137 differential pairs per square inch.

[0077] In some embodiments, the components / connectors 20, 30 or portions thereof (e.g., a docking interface, a plug connector, a circuit substrate and / or a cable connector) may include at least 257 single-ended pins per square inch, at least 256-264 single-ended pins per square inch, at least 139-263 single-ended pins per square inch, at least 138-145 single-ended pins per square inch and / or at least 88-137 single-ended pins per square inch.

[0078] In some embodiments, components / connectors 20, 30 or portions thereof (e.g., docking interfaces, plug connectors, circuit substrates, and / or cable connectors) may include at least 127 differential pairs per square inch, at least 128 differential pairs per square inch, and / or at least 129 differential pairs per square inch.

[0079] In some implementations, components / connectors 20, 30, or portions thereof (eg, docking interfaces, plug connectors, circuit substrates, and / or cable connectors) may include conductors of approximately 32, 33, 34, 35, and / or 36 AWG.

[0080] In some embodiments, components / connectors 20, 30 or portions thereof (eg, docking interfaces, plug connectors, circuit substrates, and / or cable connectors) may include approximately 92 ohms plus / minus 9 ohms, or plus / minus 5%, and / or plus / minus 10%.

[0081] In some implementations, the components / connectors 20 , 30 , or portions thereof (eg, a docking interface, a plug connector, a circuit substrate, and / or a cable connector) may include an IL to XT separation of greater than about 55 dB at about 25 GHz.

[0082] In some embodiments, the components / connectors 20 , 30 or portions thereof (eg, a docking interface, a plug connector, a circuit substrate, and / or a cable connector) may include an IL to XT separation of greater than about 40 dB at about 60 GHz.

[0083] In some embodiments, the components / connectors 20, 30 or portions thereof (eg, docking interfaces, plug connectors, circuit substrates, and / or cable connectors) may include a bandwidth of 60 GHz.

[0084] In some embodiments, components / connectors 20, 30 or portions thereof (eg, docking interfaces, plug connectors, circuit substrates, and / or cable connectors) may include non-offset, edge-coupled connectors (fully symmetrical paths in the connector).

[0085] In some embodiments, the components / connectors 20, 30 or portions thereof (eg, a docking interface, a plug connector, a circuit substrate, and / or a cable connector) may include a cable, a mezzanine, and / or a card edge connector.

[0086] In some implementations, the components / connectors 20 , 30 , or portions thereof (eg, a docking interface, a plug connector, a circuit substrate, and / or a cable connector) may include single-wire routing in a chip package substrate.

[0087] In some embodiments, the components / connectors 20, 30 or portions thereof (eg, docking interfaces, plug connectors, circuit substrates, and / or cable connectors) may include SMT / BGA / surface mount. In some embodiments, through-hole mounting may be used.

[0088] For example, in some embodiments of the present invention, the size and shape of the electrical connectors may enable multiple electrical connectors to be suitable for a single-sided chip packaging substrate no larger than approximately 75 mm x 75 mm to approximately 85 mm x 85 mm, multiple electrical connectors to collectively carry at least 1024 differential signal pairs, and / or multiple electrical connectors to transmit approximately 224 Gigabytes per second Pam4 signals at a bandwidth of approximately 56 GHz to approximately 70 GHz, and the far-end crosstalk does not exceed approximately -40 dB.

[0089] In some embodiments, the size and shape of the electrical connectors can enable multiple electrical connectors to fit on a single side of a bare die package substrate that is no larger than about 75 mm x 75 mm to about 85 mm x 85 mm, the multiple electrical connectors collectively carry at least 1024 differential signal pairs, and / or the multiple electrical connectors transmit Pam4 signals at approximately 224 Gigabytes per second at a bandwidth of approximately 56 GHz to approximately 70 GHz with a near-end crosstalk of no more than approximately -50 dB.

[0090] Additionally, in some embodiments, the plurality of electrical connectors may transmit signals at a frequency of about 60 GHz with a far-end crosstalk of no more than about -45 dB. In various embodiments, the plurality of electrical connectors may transmit signals at a frequency of about 50 GHz with a near-end crosstalk of no more than about -45 dB. In some embodiments, each of the plurality of electrical connectors may include an egg-crate docking interface. In various embodiments, the electrical connector may be configured to dock with a cable connector.

[0091] In some embodiments, an electrical connector may include a docking interface having a plurality of interconnected plates defining a plurality of cavities therein.

[0092] In addition, in some embodiments, the connector may include a plurality of cable connectors mated in a plurality of cavities. In various embodiments, each of the plurality of plates may include a plurality of slits aligned with the plurality of slots. In some embodiments, the plurality of plates may define a circumference of a first cavity in the plurality of cavities without any gaps therein. In various embodiments, the plurality of plates may define a row of cavities without any of the plurality of cable connectors. In some embodiments, the plurality of plates may extend to about 90% of the length of the cable connector to the substrate. In various embodiments, the electrical connector may include a substrate and a ground contact element, positioning the plurality of plates at a distance from the substrate. In some embodiments, the electrical connector may include a wafer package substrate no greater than about 75 mm x 75 mm to about 85 mm x 85 mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and / or the plurality of electrical connectors transmit about 224 Gigabytes per second Pam4 signals at a bandwidth of about 56 GHz to about 70 GHz, and the far-end crosstalk does not exceed about -40 dB, or the near-end crosstalk does not exceed about -50 dB. In various embodiments, the plurality of electrical connectors can transmit signals at a frequency of about 60 GHz with a far-end crosstalk of no more than about -45 dB. In some embodiments, the plurality of electrical connectors can transmit signals at a frequency of about 50 GHz with a near-end crosstalk of no more than about -45 dB.

[0093] Additionally, in some embodiments, an electrical connector configured to connect to a die package may include a density of at least 256 differential pairs per square inch.

[0094] In various embodiments, the electrical connector can transmit Pam4 signals at about 224 gigabits per second with crosstalk not exceeding about -40 dB. In some embodiments, the connector can transmit at a bandwidth of about 56 GHz to about 70 GHz.

[0095] Furthermore, in some embodiments, the electrical connector may include a docking interface. In various embodiments, the connector may include a plug connector having at least one ground contact element configured to mate with the docking interface.

[0096] In some embodiments, the ground contact element may include at least one arm that docks with the docking interface. In various embodiments, the ground contact element may include at least two arms that dock with the docking interface. In various embodiments, the ground contact element may include at least three arms that dock with the docking interface. In various embodiments, the ground contact element may include at least four arms that dock with the docking interface. In various embodiments, the ground contact element includes four or more arms that dock with the docking interface. In various embodiments, the ground contact element may include at least one solder block. In various embodiments, the ground contact element may include at least two solder blocks that are adjacent to each other. In various embodiments, the ground contact element may include at least three solder blocks that are adjacent to each other.

[0097] In some embodiments, the electrical connector may include at least one of a docking interface, a plug connector, and / or a cable connector. In various embodiments, the connector may include a 224 Gbps Pam4 signal at 6 picoseconds with a rise time of 20%-80%.

[0098] In some embodiments, the connector may include at least one of far-end crosstalk and / or insertion loss. In various embodiments, the far-end crosstalk may be less than or equal to -30 dB. In some embodiments, the far-end crosstalk may be less than or equal to -35 dB. In various embodiments, the far-end crosstalk may be less than or equal to -40 dB. In some embodiments, the far-end crosstalk may be less than or equal to -45 dB. In various embodiments, the insertion loss may be between 0 dB and -1 dB. In some embodiments, the insertion loss may be between -1 dB and -2 dB. In various embodiments, the insertion loss may be between -2 dB and -3 dB. In some embodiments, the insertion loss may be between -3 dB and -4 dB. In various embodiments, the insertion loss may be between -4 dB and -5 dB. In some embodiments, the frequency of the connector may be 50 GHz, 55 GHz, 60 GHz, 65 GHz, 70 GHz, 75 GHz, and / or 80 GHz.

[0099] In various embodiments, the electrical connector may include at least one of near-end crosstalk and / or insertion loss. In some embodiments, the near-end crosstalk may be less than or equal to -40dB. In various embodiments, the near-end crosstalk may be less than or equal to -45dB. In various embodiments, the near-end crosstalk may be less than or equal to -50dB. In some embodiments, the near-end crosstalk may be less than or equal to -55dB. In various embodiments, the near-end crosstalk may be less than or equal to -60dB. In some embodiments, the insertion loss may be between 0dB and -1dB. In various embodiments, the insertion loss may be between -1dB and -2dB. In some embodiments, the insertion loss may be between -2dB and -3dB. In some embodiments, the insertion loss may be between -3dB and -4dB. In various embodiments, the insertion loss may be between -4dB and -5dB. In some embodiments, the frequency of the connector may be 50GHz, 55GHz, 60GHz, 65GHz, and / or 70GHz.

[0100] Additionally, in some embodiments, the electrical connector can include a periphery.In various embodiments, the connector can include a locking mechanism positioned within the periphery of the electrical connector.

[0101] In some embodiments, the electrical connector may include a docking interface and a plug connector, wherein the locking mechanism may be positioned within the periphery of at least one of the docking interface and / or the plug connector. In various embodiments, the locking mechanism may include at least one clip. In some embodiments, the locking mechanism may include at least two clips. In various embodiments, the locking mechanism may include at least one notch. In some embodiments, the locking mechanism may include at least two notches. In various embodiments, the locking mechanism may be positioned within at least one gap between adjacent cavity rows. In some embodiments, the electrical connector may include a plurality of cable connectors, wherein the locking mechanism may be positioned between adjacent cable connectors of the plurality of cable connectors. In various embodiments, the electrical connector may include a plurality of cavities, wherein the locking mechanism may be disposed between adjacent cavities of the plurality of cavities. In some embodiments, the locking mechanism may be internally away from one or more walls of the periphery of the electrical connector. In various embodiments, the connector may be configured to be connected to a chip package having a density of at least 256 differential pairs per square inch.

[0102] In some embodiments, the electrical connector may include a plurality of differential signal pairs. In various embodiments, the electrical connector may include a plurality of ground contact elements, each ground contact element being configured to receive a corresponding portion of an egg-crate shield of a mating connector, wherein the electrical connector is free of an egg-crate crosstalk shield, and is sized and shaped such that each of the plurality of electrical connectors is respectively adapted to fit a single side of a wafer package substrate having a side length of no greater than about 75-96 mm, including about 80 mm ± 5 mm and 91 mm ± 5 mm, the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, the plurality of electrical connectors transmit a PAM-4 signal of about 224 Gigabytes per second at a bandwidth of about 56 GHz to about 70 GHz, and the far-end crosstalk does not exceed about -40 dB.

[0103] In addition, in some embodiments, the electrical connector also includes a first housing carrying a differential signal pair, and at least two or more of the plurality of ground contacts each define at least two laterally offset cantilever beams, wherein each of the at least two laterally offset cantilever beams has a respective free end. In various embodiments, the differential signal pairs are surface mounted on a chip packaging substrate. In some embodiments, the differential signal pairs may each include a first and a second stamped and formed electrical conductor. In some embodiments, the electrical connector may further include a conductive or non-conductive, magnetically attractive material, or an electrically lossy material. In various embodiments, the plurality of differential signal pairs are respectively electrically connected, physically connected, or both electrically and physically connected to corresponding connecting pieces on the chip packaging substrate.

[0104] In some embodiments, the electrical connector may include a docking interface having a housing and a plurality of plates defining a plurality of cavities in the housing. In various embodiments, the electrical connector may include at least one retainer to retain at least one of the plurality of plates between the housings or / and to retain the plurality of plates with the housing.

[0105] In addition, in some embodiments, at least one fixing member can fix multiple plates therebetween. In various embodiments, at least one fixing member can fix multiple plates to the housing. In some embodiments, at least one fixing member can fix multiple plates therebetween and fix multiple plates to the housing. In various embodiments, at least one fixing member can be an elongated member that engages with one or more slots. In some embodiments, at least one fixing member can be conductive or non-conductive.

[0106] In some embodiments, the electrical connector may include a periphery.In various embodiments, the electrical connector may include a locking mechanism disposed on the periphery of the electrical connector.

[0107] In addition, in some embodiments, the electrical connector may include a docking interface and a plug connector, wherein the locking mechanism may be positioned at the periphery of at least one of the docking interface and / or the plug connector. In various embodiments, the locking mechanism may include at least one clip. In some embodiments, the locking mechanism may include at least two clips. In various embodiments, the locking mechanism may include at least one socket that releasably docks with at least one clip. In some embodiments, the electrical connector may include another locking mechanism located at the periphery.

[0108] In some embodiments, the electrical connector may include a plug connector having a housing. In various embodiments, the electrical connector may include at least one reinforcement member connected to the housing.

[0109] In addition, in some embodiments, at least one reinforcement member may be connected to the board side of the wafer package substrate. In various embodiments, the electrical connector may include at least two reinforcement members spaced apart from each other in a horizontal plane. In some embodiments, at least one reinforcement member may be conductive or non-conductive.

[0110] Several embodiments have been described and illustrated herein, but a person of ordinary skill in the art will readily conceive of other various methods and / or structures to achieve the functions described herein and / or obtain the results and / or one or more advantages described herein, and each such variation and / or modification is considered to be within the scope of the embodiments described herein. More generally, it is readily understood by those skilled in the art that all parameters, dimensions, materials and settings described herein are exemplary, and the actual parameters, dimensions, materials and / or settings will depend on one or more specific applications in which the present invention is used. A person skilled in the art will recognize, or can determine by routine experimentation, that there are many equivalents to the specific embodiments described herein. Therefore, it should be understood that the foregoing embodiments are presented only by way of example, and within the scope of the attached claims and their equivalents, the embodiments may be implemented in a manner other than the specific description and claims. The embodiments of the present disclosure are directed to each individual feature, system, article, material and / or method described herein. In addition, if two or more features, systems, articles, materials and / or methods are not mutually inconsistent, any combination of these features, systems, articles, materials and / or methods is also included within the scope of the present disclosure.

[0111] All definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and / or ordinary meanings of the defined terms.

[0112] The indefinite articles "a" and "an" as used herein in the specification and claims should be understood to mean "at least one" unless clearly indicated to the contrary.

[0113] The phrase "and / or" used herein in the specification and claims should be understood as "either or both" of the elements so combined, i.e., elements that exist in combination in some cases and not in other cases. Multiple elements listed with "and / or" should be understood in the same way, i.e., "one or more" elements connected together. In addition to the elements specifically specified by the "and / or" clause, other elements may be optionally present, whether they are related or unrelated to the specifically specified elements. Therefore, as a non-limiting example, when "A and / or B" is used with open language such as "including", in one embodiment, it may refer to only A (optionally including elements other than B); in another embodiment, it may refer to only B (optionally including elements other than A); in another embodiment, it may refer to both A and B (optionally including other elements); and so on.

[0114] As used herein, “or” shall be understood to have the same meaning as “and / or” as defined above. For example, when separating items in a list, “or” or “and / or” shall be interpreted as being inclusive, i.e., including at least one, but also including more than one of a quantity or list of elements, and optional additional unlisted items. Only terms that clearly indicate the opposite, such as “only one” or “exactly one”, or “consisting of…” as used in the claims, refer to only one element in a quantity or list of elements. Generally speaking, the term “or” as used herein shall be interpreted as indicating an alternative (i.e., “either one, but not both”) only when preceded by an alternative term such as “either”, “one of”, “only one of”, or “exactly one of”. “Mainly consisting of…” as used in the claims shall have the ordinary meaning used in the field of patent law.

[0115] As used herein in the specification and claims, the phrase "at least one" when referring to a list of one or more elements should be understood as at least one element selected from any one or more elements in the list of elements, but not necessarily including at least one of each element specifically listed in the list of elements, nor any combination of elements in the list of elements. This definition also allows that in the list of elements referred to by the phrase "at least one", other elements may be selectively present in addition to the specifically specified elements, whether these elements are related or unrelated to the specifically specified elements. Therefore, as a non-limiting example, "at least one of A and B" (or equivalent to "at least one of A or B", or equivalent to "at least one of A and / or B") may refer to at least one in one embodiment, optionally including more than one A, without B (optionally including elements other than B); in another embodiment, it refers to at least one optionally including more than one B, without A (optionally including elements other than A); in another embodiment, it refers to at least one optionally including more than one A, and at least one optionally including more than one B (optionally including other elements), and so on.

[0116] It should also be understood that, unless explicitly stated to the contrary, in any method claimed herein that includes more than one step or act, the order of the steps or acts of the method are not necessarily limited to the order in which the steps or acts of the method are recited.

[0117] In the claims and the above description, all transitional phrases, such as "comprises", "including", "carrying", "having", "containing", "involving", "having", "consisting of", etc., shall be understood as open-ended, i.e., including but not limited to. Only the transitional phrases "consisting of" and "consisting mainly of" shall be closed or semi-closed transitional phrases, respectively, as provided in Section 2111.03 of the Manual of Patent Examining Procedure of the United States Patent Office.

[0118] It should be understood that the application of the embodiments of the present invention is not limited to the structural details and component arrangements described in the description or shown in the drawings. The present invention may also have other embodiments and may be implemented or performed in various ways. Unless otherwise limited, the terms "connected", "coupled", "in communication with" and "mounted" and their variations are broad terms herein and include direct and indirect connections, couplings and installations. In addition, the terms "connected" and "coupled" and their variations are not limited to physical or mechanical connections or couplings.

[0119] The above description of several embodiments of the present invention is for illustrative purposes. It is not intended to be exhaustive or to limit the invention to the precise steps and / or forms disclosed, and it is obvious that many modifications and variations are possible in light of the above teachings.

Claims

1. A circuit board connector, the size and shape of which are such that a plurality of the circuit board connectors are adapted to a chip packaging substrate no larger than about 75 mm square to about 85 mm square, the plurality of the circuit board connectors collectively carrying at least 1024 differential signal pairs, and the plurality of the circuit board connectors transmitting about 224 Gigabytes per second of Pam4 signals at a bandwidth of about 56 GHz to about 70 GHz with a far-end crosstalk of no more than about -40 dB, wherein the circuit board connector is configured to mate with a second circuit board connector.

2. The circuit board connector of claim 1, wherein the chip package substrate includes a cutout area of ​​approximately 40 mm, wherein the integrated circuit chip is configured to be mounted in the cutout area.

3. A circuit board connector, the size and shape of which are such that a plurality of the circuit board connectors are adapted to a chip packaging substrate no larger than about 75 mm square to about 85 mm square, the plurality of the circuit board connectors collectively carrying at least 1024 differential signal pairs, and the plurality of the circuit board connectors transmitting about 224 Gigabytes per second of Pam4 signals at a bandwidth of about 56 GHz to about 70 GHz and a near-end crosstalk of no more than about -50 dB, wherein the circuit board connector is configured to dock with a second circuit board connector.

4. The circuit board connector of claim 3, wherein the chip package substrate includes a cutout area of ​​approximately 40 mm, wherein the integrated circuit chip is configured to be mounted in the cutout area.

5. The circuit board connector of any one of claims 1 to 4, wherein the plurality of circuit board connectors transmit signals at a bandwidth of about 60 gigahertz with a far end crosstalk of no more than about -45 decibels.

6. The circuit board connector of any one of claims 1 to 5, wherein the plurality of circuit board connectors transmit signals at a bandwidth of about 50 gigahertz with a near end crosstalk of no more than about -45 decibels.

7. The circuit board connector of any one of the preceding claims 1 to 6, wherein each of the plurality of circuit board connectors comprises an egg-cradle docking interface.

8. A circuit board connector according to any one of the preceding claims 1 to 7, wherein the electrical connector comprises a board connector.

9. A circuit board connector, comprising: A docking interface has a plurality of interconnected boards defining a plurality of cavities therebetween, wherein the electrical connector is configured to mate with the circuit board connector.

10. The circuit board connector of claim 9, further comprising a plurality of cable connectors mating with the plurality of cavities.

11. The circuit board connector of claim 9 or 10, wherein each of the plurality of boards comprises a plurality of slots, the plurality of slots being aligned with the plurality of slots.

12. The circuit board connector according to any one of claims 9 to 11, wherein the plurality of plates define a perimeter of one of the plurality of cavities without any gaps therein.

13. The circuit board connector of any one of claims 10 to 12, wherein the plurality of plates define a row of cavities in which none of the plurality of cable connectors is present.

14. The circuit board connector of any one of claims 9 to 13, wherein the plurality of plates extend to about 90% of the length of the cable connector.

15. The circuit board connector according to any one of claims 9 to 14 further comprises a plurality of electrical connectors, wherein the plurality of electrical connectors collectively carry at least 1024 differential signal pairs, and the plurality of electrical connectors transmit Pam4 signals at approximately 224 Gigabytes per second at a bandwidth of approximately 56 GHz to approximately 70 GHz, with a far-end crosstalk of no more than approximately -40 dB or a near-end crosstalk of no more than approximately -50 dB.

16. The circuit board connector of claim 15, wherein the plurality of electrical connectors transmit signals at a bandwidth of about 60 gigahertz with a far end crosstalk of no more than about -45 decibels.

17. The circuit board connector of any one of claims 15 to 16, wherein the plurality of electrical connectors transmit signals at a bandwidth of about 50 gigahertz with a near end crosstalk of no more than about -45 dB.

18. A circuit board connector configured to be attached to a chip package, the circuit board connector comprising: A density of at least 256 differential signal pairs per inch, wherein the electrical connector is configured to mate with a circuit board connector.

19. The circuit board connector of claim 18, wherein the circuit board connector transmits approximately 224 Gigabytes per second Pam4 signals with no more than approximately -40 decibels of crosstalk.

20. The circuit board connector of any one of claims 18 to 19, the circuit board connector transmitting signals at a bandwidth of about 56 gigahertz to about 70 gigahertz.

21. A circuit board connector, comprising: Docking interface; A plug connector has at least one ground contact element, wherein the ground contact element is configured to mate with the docking interface, wherein the electrical connector is configured to mate with the circuit board connector.

22. The circuit board connector of claim 21, wherein the ground contact element comprises at least one arm, the at least one arm mating with the mating interface.

23. The circuit board connector according to any one of claims 21 to 22, wherein the ground contact element comprises at least two arms, the at least two arms mating with the mating interface.

24. The circuit board connector according to any one of claims 21 to 23, wherein the ground contact element comprises at least three arms, and the at least three arms mate with the docking interface.

25. The circuit board connector according to any one of claims 21 to 24, wherein the ground contact element comprises at least four arms, the at least four arms mating with the mating interface.

26. The circuit board connector according to any one of claims 19 to 23, wherein the ground contact element comprises four or more arms, the four or more arms mating with the mating interface.

27. A circuit board connector according to any one of claims 21 to 26, wherein the ground contact element comprises at least one solder bump.

28. A circuit board connector according to any one of claims 21 to 27, wherein the ground contact element comprises at least two adjacent solder bumps.

29. A circuit board connector according to any one of the preceding claims 21 to 28, wherein the ground contact element comprises at least three immediately adjacent solder masses.

30. A circuit board connector configured to transmit a 224 Gigabytes per second Pam4 signal at 6 picoseconds with a rise time of 20% to 80%, wherein the circuit board connector is configured to mate with a second circuit board connector.

31. The circuit board connector of claim 30, further comprising at least one of far-end crosstalk and / or insertion loss.

32. The circuit board connector of claim 31, wherein the far-end crosstalk is less than or equal to -30 decibels.

33. The circuit board connector of any one of claims 31 to 32, wherein the far-end crosstalk is less than or equal to -35 dB.

34. A circuit board connector according to any one of claims 31 to 33, wherein the far end crosstalk is less than or equal to -40 decibels.

35. A circuit board connector according to any one of claims 31 to 34, wherein the far end crosstalk is less than or equal to -45 dB.

36. A circuit board connector according to any one of the preceding claims 31 to 35, wherein the insertion loss is between 0 dB and -1 dB.

37. A circuit board connector as claimed in any one of claims 31 to 36, wherein the insertion loss is between -1 dB and -2 dB.

38. A circuit board connector as claimed in any one of claims 31 to 37, wherein the insertion loss is between -2dB and -3dB.

39. A circuit board connector as claimed in any one of claims 31 to 38, wherein the insertion loss is between -3dB and -4dB.

40. A circuit board connector as claimed in any one of claims 31 to 39, wherein the insertion loss is between -4 dB and -5 dB.

41. A circuit board connector as claimed in any one of claims 31 to 40 at 50 GHz.

42. A circuit board connector as claimed in any one of claims 31 to 41 at 55 GHz.

43. A circuit board connector as claimed in any one of claims 31 to 42 at 60 GHz.

44. A circuit board connector as claimed in any one of claims 31 to 43 at 65 GHz.

45. A circuit board connector as claimed in any one of claims 31 to 44 at 70 GHz.

46. ​​A circuit board connector as claimed in any one of claims 31 to 45 at 75 GHz.

47. A circuit board connector as claimed in any one of claims 31 to 46 at 80 GHz.

48. The circuit board connector of claim 30, further comprising at least one of near-end crosstalk and / or insertion loss.

49. The circuit board connector of claim 48, wherein the near-end crosstalk is less than or equal to -40 decibels.

50. The circuit board connector of any one of claims 48 to 49, wherein the near-end crosstalk is less than or equal to -45 dB.

51. A circuit board connector as claimed in any one of claims 48 to 50, wherein the near-end crosstalk is less than or equal to -50 decibels.

52. A circuit board connector as claimed in any one of claims 48 to 50, wherein the near-end crosstalk is less than or equal to -55 decibels.

53. A circuit board connector as claimed in any one of claims 48 to 52, wherein the near-end crosstalk is less than or equal to -60 decibels.

54. A circuit board connector according to any one of preceding claims 48 to 53, wherein the insertion loss is between 0 dB and -1 dB.

55. A circuit board connector as claimed in any one of claims 48 to 54, wherein the insertion loss is between -1 dB and -2 dB.

56. A circuit board connector as claimed in any one of claims 48 to 55, wherein the insertion loss is between -2dB and -3dB.

57. A circuit board connector as claimed in any one of claims 48 to 56, wherein the insertion loss is between -3dB and -4dB.

58. A circuit board connector as claimed in any one of claims 48 to 57, wherein the insertion loss is between -4dB and -5dB.

59. A circuit board connector as claimed in any one of claims 48 to 58 at 50 GHz.

60. A circuit board connector as claimed in any one of claims 48 to 59 at 55 GHz.

61. A circuit board connector as claimed in any one of claims 48 to 60, which is capable of operating at 60 GHz.

62. A circuit board connector as claimed in any one of claims 48 to 61 at 65 GHz.

63. A circuit board connector as claimed in any one of claims 48 to 62, which is at 70 gigahertz.

64. A cable connector configured to transmit a 224 Gigabytes per second Pam4 signal at 6 picoseconds with a rise time of 20% to 80%, wherein the cable connector is configured to mate with a second cable connector.

65. The circuit board connector of claim 64, further comprising at least one of far-end crosstalk and / or insertion loss.

66. A circuit board connector as described in claim 65, wherein the far-end crosstalk is less than or equal to -30 decibels.

67. A circuit board connector as claimed in any one of claims 65 to 66, wherein the far-end crosstalk is less than or equal to -35 decibels.

68. A circuit board connector as claimed in any one of claims 65 to 67, wherein the far-end crosstalk is less than or equal to -40 decibels.

69. A circuit board connector as claimed in any one of claims 65 to 67, wherein the far-end crosstalk is less than or equal to -45 decibels.

70. A circuit board connector as claimed in any one of claims 65 to 69, wherein the insertion loss is between 0 dB and -1 dB.

71. A circuit board connector as claimed in any one of claims 65 to 70, wherein the insertion loss is between -1 dB and -2 dB.

72. A circuit board connector as claimed in any one of claims 65 to 71, wherein the insertion loss is between -2dB and -3dB.

73. A circuit board connector as claimed in any one of claims 65 to 72, wherein the insertion loss is between -3dB and -4dB.

74. A circuit board connector as claimed in any one of claims 65 to 73, wherein the insertion loss is between -4dB and -5dB.

75. A circuit board connector as claimed in any one of claims 65 to 74, which is capable of operating at 50 GHz.

76. A circuit board connector as claimed in any one of claims 65 to 75, which operates at 55 GHz.

77. A circuit board connector as claimed in any one of claims 65 to 76, which operates at 60 GHz.

78. A circuit board connector as claimed in any one of claims 65 to 77, which is 65 gigahertz.

79. A circuit board connector as claimed in any one of claims 65 to 78, which operates at 70 GHz.

80. A circuit board connector as claimed in any one of claims 65 to 79, operating at 75 GHz.

81. A circuit board connector as claimed in any one of claims 65 to 80, which operates at 80 GHz.

82. The circuit board connector of claim 64, further comprising at least one of near-end crosstalk and / or insertion loss.

83. A circuit board connector as described in claim 82, wherein the near-end crosstalk is less than or equal to -40 decibels.

84. A circuit board connector as claimed in any one of claims 82 to 83, wherein the near-end crosstalk is less than or equal to -45 decibels.

85. A circuit board connector as claimed in any one of claims 82 to 84, wherein the near-end crosstalk is less than or equal to -50 decibels.

86. A circuit board connector as claimed in any one of claims 82 to 85, wherein the near-end crosstalk is less than or equal to -55 decibels.

87. A circuit board connector as claimed in any one of claims 82 to 86, wherein the near-end crosstalk is less than or equal to -60 decibels.

88. A circuit board connector according to any one of the preceding claims 82 to 87, wherein the insertion loss is between 0 dB and -1 dB.

89. A circuit board connector as claimed in any one of claims 82 to 88, wherein the insertion loss is between -1 dB and -2 dB.

90. A circuit board connector as claimed in any one of claims 82 to 89, wherein the insertion loss is between -2dB and -3dB.

91. A circuit board connector as claimed in any one of claims 82 to 90, wherein the insertion loss is between -3dB and -4dB.

92. A circuit board connector as claimed in any one of claims 82 to 91, wherein the insertion loss is between -4dB and -5dB.

93. A circuit board connector as claimed in any one of claims 82 to 92, which operates at 50 GHz.

94. A circuit board connector as claimed in any one of claims 82 to 93, which operates at 55 GHz.

95. A circuit board connector as claimed in any one of claims 82 to 94, which operates at 60 GHz.

96. A circuit board connector as claimed in any one of claims 82 to 95, which operates at 65 GHz.

97. A circuit board connector as claimed in any one of claims 82 to 96, which operates at 70 GHz.

98. An electrical connector, comprising: Periphery; and A locking mechanism is located within the periphery of the electrical connector, wherein the electrical connector is configured to mate with a board connector.

99. The electrical connector according to claim 98, further comprising a docking interface and a plug connector, wherein the locking mechanism is located within an outer periphery of at least one of the docking interface and / or the plug connector.

100. The electrical connector of any one of claims 98 to 99, wherein the locking mechanism comprises at least one clip.

101. An electrical connector according to any one of claims 98 to 100, wherein the locking mechanism comprises at least two clips.

102. An electrical connector according to any one of claims 98 to 101, wherein the locking mechanism comprises at least one notch.

103. An electrical connector according to any one of claims 98 to 102, wherein the locking mechanism comprises at least two notches.

104. An electrical connector as claimed in any one of claims 98 to 103, wherein the locking mechanism is located in at least one gap between adjacent rows of cavities.

105. The electrical connector of any one of claims 98 to 104, further comprising a plurality of cable connectors, wherein the locking mechanism is located between adjacent cable connectors of the plurality of cable connectors.

106. The electrical connector of any one of claims 98 to 105, further comprising a plurality of cavities, wherein the locking mechanism is located between adjacent cavities of the plurality of cavities.

107. An electrical connector as claimed in any one of claims 98 to 106, wherein the locking mechanism is spaced apart from one or more walls of a periphery of the electrical connector.

108. An electrical connector as claimed in any one of claims 98 to 107, wherein the electrical connector is configured to be attached to a chip package having a density of at least 256 differential signal pairs per inch.

109. A cable connector, comprising: Multiple differential signal pairs; and a plurality of ground contact elements, each of the plurality of ground contact elements being configured to receive a corresponding egg crate shield of a docking connector; The electrical connector has no egg-crate crosstalk shielding, the size and shape of the electrical connector are such that a plurality of the circuit board connectors are adapted to a single side of a chip packaging substrate, the chip packaging substrate having each side no greater than about 75 to 96 mm, including about 85±5 mm and 91±5 mm, the plurality of circuit board connectors collectively carry at least 1024 differential signal pairs, and the plurality of circuit board connectors transmit about 224 Gigabytes per second Pam4 signals at a bandwidth of about 56 GHz to about 70 GHz with a far-end crosstalk of no more than about -40 dB, wherein the cable connector is configured to dock with a second cable connector.

110. A cable connector according to claim 109, wherein the electrical connector further comprises a first shell, the first shell carrying a plurality of differential signal pairs and at least two or more of the plurality of ground contact elements, each ground contact element being provided with at least two laterally offset cantilever beams, wherein each of the at least two laterally offset cantilever beams has a free end.

111. The cable connector of any one of claims 109 to 110, wherein each of the plurality of differential signal pairs is surface mounted to the chip package substrate.

112. The electrical cable connector of any one of claims 109 to 111, wherein each of the plurality of differential signal pairs comprises first and second stamped and formed conductive members.

113. The cable connector according to any one of claims 109 to 112 further comprising a conductive material or a non-conductive material, a magnetically absorptive material or an electrically dissipative material.

114. The cable connector according to any one of claims 109 to 113, wherein the plurality of differential signal pairs are electrically connected, physically connected, or both electrically and physically connected to the respective corresponding connection pads of the chip substrate.

115. A circuit board connector, comprising: Multiple differential signal pairs; and a plurality of ground contact elements, each of the plurality of ground contact elements being configured to receive a corresponding egg crate shield of a docking connector; The electrical connector has no egg-crate crosstalk shielding, the size and shape of the electrical connector are such that a plurality of the circuit board connectors are adapted to a single side of a chip packaging substrate, the chip packaging substrate having each side no greater than about 75 to 96 mm, including about 85±5 mm and 91±5 mm, the plurality of circuit board connectors collectively carry at least 1024 differential signal pairs, and the plurality of circuit board connectors transmit about 224 Gigabytes per second of Pam4 signals at a bandwidth of about 56 GHz to about 70 GHz with a far-end crosstalk of no more than about -40 dB, wherein the electrical connector is configured to dock with a board connector.

116. A circuit board connector according to claim 115, wherein the electrical connector further comprises a first shell, the first shell carrying a plurality of differential signal pairs and at least two or more of the plurality of ground contact elements, each ground contact element being provided with at least two laterally offset cantilever beams, wherein each of the at least two laterally offset cantilever beams has a free end.

117. A circuit board connector as claimed in any one of claims 115 to 116, wherein each of the plurality of differential signal pairs is mounted to the chip package substrate in a surface mount manner.

118. The circuit board connector of any one of claims 115 to 117, wherein each of the plurality of differential signal pairs comprises first and second stamped and formed conductive members.

119. The circuit board cable connector of any one of claims 115 to 118, further comprising a conductive material or a non-conductive material, a magnetically absorptive material, or an electrically dissipative material.

120. A circuit board connector according to any one of claims 115 to 119, wherein the plurality of differential signal pairs are electrically connected, physically connected, or both electrically and physically connected to the respective corresponding connection pads of the chip substrate.

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