Cleaning equipment for wafer carrier

Abstract

The invention relates to the technical field of semiconductor carriers, in particular to cleaning equipment for a wafer carrier, which comprises a rotating mechanism. The wafer carrier comprises a carrier body and a carrier cover. A lifting part, a handle and a positioning groove are arranged on the carrier main body. The rotating mechanism comprises a rotating motor, a rotating shaft, a product support, a supporting side support, a rotating side support and a reset spring. Compared with the prior art, hot air and hot water are used for cleaning and drying the carrier, and the cleaning efficiency of the carrier is improved. By arranging the lifting mechanism and the rotating mechanism to drive the wafer carrier to rotate, it can be guaranteed that the wafer carrier is comprehensively cleaned, the cleaning efficiency is high, the productivity is improved, water and gas can be saved, and the production cost is reduced. By arranging the supporting side support and the rotating side support, the wafer carrier placed in the product support is fixed, it is guaranteed that cleaning is efficient and stable, meanwhile, feeding and discharging are convenient, and operation is easy.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor carriers, and in particular to a cleaning device for a wafer carrier. Background Art

[0002] Wafer carriers, a type of semiconductor carrier, are precision carriers designed for semiconductor wafers. They are designed to meet strict clean room standards to ensure the physical safety and chemical purity of wafers throughout the manufacturing process. Wafers are the basis of semiconductor devices, and are covered with thousands or even millions of tiny integrated circuits. Any slight contamination or damage may cause a large number of chips to fail. The importance of wafer carriers is self-evident. Therefore, wafer carriers need to be cleaned before use.

[0003] Currently, most wafer carrier cleaning is done by direct rinsing under normal conditions, which often requires a large amount of water and gas consumption, resulting in high cleaning costs. In addition, since both the inside and outside of the wafer carrier need to be cleaned, conventional rinsing methods take a long time and have low cleaning efficiency. Summary of the invention

[0004] In view of this, the present invention provides a cleaning device for a wafer carrier to solve the above technical problems.

[0005] A cleaning device for a wafer carrier, comprising a rotating mechanism. The wafer carrier placed in the cleaning device for the wafer carrier comprises a carrier body and a carrier cover covering the carrier body. The carrier body is provided with a lifting portion located at the top, two handles located on the side, and three positioning grooves located at the bottom. The lifting portion, the handles and the positioning grooves are respectively located on the side surfaces of the carrier body adjacent to the carrier cover, wherein the lifting portion and the positioning grooves are respectively located on two opposite side surfaces, and the two handles are respectively located on two opposite planes. The rotating mechanism comprises a rotating motor, a rotating shaft connected to the rotating motor, a product support connected to the rotating shaft, two supporting side supports arranged on the product support, two rotating side supports arranged on the product support, and two reset springs respectively connected to the rotating side supports and the product support. The supporting side supports and the rotating side supports are respectively arranged on two opposite side surfaces of the product support, and are both adjacent to the connecting surface where the rotating shaft is located. The side surfaces of the supporting side support and the rotating side support are respectively parallel to the side surfaces of the driving assembly. The two supporting side supports each include a side support bottom plate, at least two side support mounting rods vertically fixed on the side support bottom plate, and a side support fixing block spaced apart from the side support bottom plate. The rotating side support includes a rotating portion connected to the product support, a pressing end arranged on the rotating portion, and a snap-fit ​​end arranged on the rotating portion. The rotating portion is located between the pressing end and the snap-fit ​​end. The pressing end is located on a side of the rotating side support close to the supporting side support. The snap-fit ​​end is located on a side of the rotating side support close to the rotating motor. An acute angle is formed between the pressing end and the snap-fit ​​end. The length of the pressing end is less than the length of the snap-fit ​​end. A first acute angle is formed between the line connecting the abutment point of the side support fixing block with the lifting portion and the abutment point of the pressing end with the edge of the wafer carrier and the central axis of the rotating shaft. A second acute angle is formed between a line connecting the center of the rotating part and the contact point between the side support fixing block and the lifting part and the central axis of the rotating shaft. The first acute angle is greater than the second acute angle.

[0006] Furthermore, the cleaning equipment for the wafer carrier also includes a cleaning and conveying mechanism, a cleaning mechanism arranged in the cleaning and conveying mechanism, a jet mechanism arranged in the cleaning and conveying mechanism, and an infrared heating mechanism arranged in the cleaning and conveying mechanism.

[0007] Furthermore, the cleaning and conveying mechanism includes a cleaning chamber surrounded by side panels, a lifting cover covering the cleaning chamber, and a lifting mechanism connecting the cleaning chamber and the lifting cover, and a sealing strip is provided at the edge of the lifting cover.

[0008] Furthermore, the lifting mechanism includes a pair of driving assemblies arranged on the outer wall of the cleaning chamber, and two support rods respectively arranged on the two driving assemblies, the two driving assemblies are arranged on two opposite sides of the cleaning chamber, one end of the support rod is fixed to the driving assembly, and the other end is connected to the lifting cover.

[0009] Furthermore, the cleaning mechanism includes a plurality of hot water inlets arranged on the outer wall of the cleaning chamber, a plurality of water spray pipes arranged in the cleaning chamber, a plurality of hot water nozzles arranged on the water spray pipes, and a hot water outlet arranged on the side wall of the cleaning chamber, and the jet pipe is arranged parallel to the water spray pipe.

[0010] Furthermore, the lifting portion includes a connecting end disposed on the carrier body, and a lifting end disposed on the connecting end.

[0011] Furthermore, the product bracket is provided with two fixed support rods for setting the supporting side support, one rotating support rod for setting the rotating side support, and one spring support rod for setting the return spring, the fixed support rod and the supporting side support are located on the same side, the rotating support rod and the spring support rod are located on the same side, and are arranged parallel to each other.

[0012] Furthermore, the jet mechanism includes an air inlet interface arranged on the outer wall of the cleaning chamber, a plurality of jet pipes arranged in the cleaning chamber, and a plurality of gas nozzles arranged on the water spray pipe.

[0013] Furthermore, the infrared heating mechanism includes a plurality of infrared fixed tubes arranged on the outer wall of the cleaning chamber, and a plurality of infrared lamp tubes arranged on the infrared fixed tubes.

[0014] Furthermore, one end of the return spring is connected to the buckling end, and the other end is connected to the spring support rod.

[0015] Compared with the prior art, the cleaning equipment for wafer carriers provided by the present invention maintains the temperature in the cleaning chamber by setting the infrared heating mechanism, so that the wafer carrier is at a higher cleaning temperature, thereby making it easy to remove impurities on the surface of the wafer carrier, and by setting the cleaning mechanism and the jet mechanism, the carrier is cleaned and dried by hot air and hot water, thereby improving the cleaning efficiency of the carrier. By setting the lifting mechanism and the rotating mechanism to drive the wafer carrier to rotate, on the one hand, the dust and sewage on the surface of the carrier can be thrown off by centrifugal force, and at the same time, it can ensure that the inside and outside of the wafer carrier are fully cleaned at 360 degrees, with fast cleaning speed and high efficiency, improving production capacity, and saving water and gas, reducing production costs. By setting the supporting side support and the rotating side support, the wafer carrier placed in the product bracket is fixed, and the rotating side support is rotated by utilizing the dead weight of the wafer carrier to support and fix the wafer carrier, so that the wafer carrier will not be displaced during the cleaning process, thereby ensuring efficient and stable cleaning. At the same time, loading and unloading are convenient and the operation is simple, which can effectively improve the efficiency of loading and unloading. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic structural diagram of a cleaning device for a wafer carrier provided by the present invention.

[0017] Figure 2 for Figure 1 A schematic structural diagram of the wafer carrier 60 of the wafer carrier cleaning device.

[0018] Figure 3 for Figure 2 A schematic structural diagram of the wafer carrier 60 of the wafer carrier cleaning device from another perspective.

[0019] Figure 4 for Figure 1 A schematic structural diagram of the rotating mechanism 20 of the cleaning device for wafer carrier.

[0020] Figure 5 for Figure 1 A partial structural schematic diagram of a cleaning device for a wafer carrier.

[0021] Description of reference numerals: fixed tooling 10, cleaning chamber 11, lifting cover plate 12, lifting mechanism 13, driving assembly 131, support rod 132, rotating mechanism 20, rotating motor 21, rotating shaft 22, product support 23, fixed support rod 231, rotating support rod 232, spring support rod 233, supporting side support 24, side support bottom plate 241, side support mounting rod 242, side support fixing block 243, rotating side support 25, rotating part 251, pressing end 252, snap-fit ​​end 253, return spring 26, cleaning mechanism 30, hot water inlet 31, water spray pipe 32, hot water nozzle 33, hot water outlet 34, jet mechanism 40, air inlet interface 41, jet pipe 42, gas nozzle 43, infrared heating mechanism 50, infrared fixing tube 51, infrared lamp tube 52, wafer carrier 60, carrier body 61, carrier cover 62, lifting portion 63, connecting end 631, lifting end 632, handle 64, positioning groove 65. DETAILED DESCRIPTION

[0022] The specific embodiments of the present invention are further described in detail below. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the protection scope of the present invention.

[0023] like Figures 1 to 5 As shown, it is a schematic diagram of the structure of a cleaning device for a wafer carrier provided by the present invention. The cleaning device for a wafer carrier includes a cleaning conveying mechanism 10, a rotating mechanism 20 arranged on the cleaning conveying mechanism 10, a cleaning mechanism 30 arranged in the cleaning conveying mechanism 10, an air jet mechanism 40 arranged in the cleaning conveying mechanism 10, and an infrared heating mechanism 50 arranged in the cleaning conveying mechanism 10. It can be imagined that the cleaning device for a wafer carrier also includes some other functional modules such as valve components, electrical intelligent control systems, etc., which are technologies well known to those skilled in the art and will not be described one by one here.

[0024] It should be noted that if Figures 2 to 3 As shown, it is a schematic diagram of the structure of a wafer carrier 60 placed in the cleaning device for the wafer carrier for cleaning. The wafer carrier 60 includes a carrier body 61 and a carrier cover 62 covering the carrier body 61. The carrier body 61 is a box-shaped structure, which is open on one side and has a wafer placement rack arranged inside. The carrier cover 62 is connected to the opening of the carrier body 61 through a snap-fit ​​structure, and seals the inside of the carrier body 61.

[0025] The carrier body 61 is provided with a lifting portion 63 at the top, two handles 64 at both sides, and three positioning grooves 65 at the bottom. The lifting portion 63, the handles 64, and the positioning grooves 65 are respectively located on the side surfaces of the carrier body 61 adjacent to the carrier cover 62, wherein the lifting portion 63 and the positioning grooves 65 are respectively located on two opposite side surfaces, and the two handles 64 are respectively located on the other two opposite side surfaces.

[0026] The lifting portion 63 includes a connecting end 631 disposed on the carrier body 61, and a lifting end 632 disposed on the connecting end 631. The connecting end 631 is located between the lifting end 632 and the carrier body 61, and is a rectangular cylindrical structure, and has a plurality of openings on the side wall for the robot or the overhead crane to insert. The lifting end 632 is a rectangular plate-like structure, and the area of ​​the plate surface is larger than the cross-sectional area of ​​the connecting end 631 in the radial direction. Specifically, the edge of the lifting end 632 is perpendicular to the side wall of the connecting end 631 to form a "π"-shaped structure on the axial cross section of the connecting end 631, so as to facilitate the robot or the overhead crane to grasp.

[0027] The handle 64 is a structure that is convenient for workers to hold and use for carrying the carrier body 61. The positioning groove 65 is a groove provided on the carrier body 61 for positioning the carrier body 61. Its specific setting method and orientation are not the main content of this application, so it will not be described here. The two positioning grooves 65 located on the side close to the carrier cover 62 are at the same distance from the carrier cover 62, and can be symmetrical with the central axis of the side where the carrier cover 62 is located as the symmetry axis.

[0028] The cleaning and conveying mechanism 10 includes a cleaning chamber 11 surrounded by side panels, a lifting cover plate 12 covering the cleaning chamber 11 , and a lifting mechanism 13 connecting the cleaning chamber 11 and the lifting cover plate 12 .

[0029] The cleaning chamber 11 is formed by a plurality of side panels and a bottom panel, and is opened vertically upward, so that the product can be placed in the cleaning chamber 11 for cleaning by the lifting action of the lifting mechanism 13 .

[0030] The lifting cover 12 is a rectangular plate, which can cover the top opening of the cleaning chamber 11, and a sealing strip is provided at the edge of the lifting cover 12, so that when the lifting cover 12 descends under the action of the lifting mechanism 13 and covers the cleaning chamber 11, the edge remains sealed, and the cleaning liquid will not leak out when cleaning is carried out inside.

[0031] The lifting mechanism 13 includes a pair of drive assemblies 131 arranged on the outer wall of the cleaning chamber 11, and two support rods 132 respectively arranged on the two drive assemblies 131. The drive assembly 131 includes a slide rail, a slider and a drive motor, which is a prior art widely used in the field of mechanical production and should be well known to those skilled in the art. It is not the main content of this application, so it is only briefly described here. In addition, the two drive assemblies 131 are arranged on two opposite sides of the cleaning chamber 11 to evenly bear the force and ensure stable support for the lifting cover plate 12. One end of the support rod 132 is fixed to the drive assembly 131, and the other end is connected to the lifting cover plate 12, so as to support and connect the lifting cover plate 12, and can be driven by the drive assembly 131 to move away from and cover the cleaning chamber 11.

[0032] The rotating mechanism 20 includes a rotating motor 21 arranged on the lifting cover 12, a rotating shaft 22 connected to the rotating motor 21, a product holder 23 connected to the rotating shaft 22, two supporting side supports 24 arranged on the product holder 23, two rotating side supports 25 arranged on the product holder 23, and two return springs 26 respectively connected to the rotating side supports 25 and the product holder 23.

[0033] The main body of the rotating motor 21 is fixed on the lifting cover 12, and the driving end passes through the lifting cover 12 and is arranged toward the cleaning chamber 11 to serve as a driving force for driving the rotating mechanism 20 to rotate. It can be a driving device such as a servo motor, and no specific limitation is made here.

[0034] One end of the rotating shaft 22 is connected to the driving end of the rotating motor 21, and the other end is connected to the top of the product support 23 to perform transmission. Under the driving action of the rotating motor 21, the product support 23 is driven to rotate. The rotating shaft 22 can be a hollow shaft body, so that the wires can be routed and the air pipes can be set in the rotating shaft 22 by setting a contact ring at the connection end.

[0035] The product support 23 is a rectangular frame structure, which can be constructed by metal rods made of stainless steel or alloy. The product support 23 is provided with two fixed support rods 231 for setting the support side bracket 24, a rotating support rod 232 for setting the rotating side bracket 25, and a spring support rod 233 for setting the return spring 26. The fixed support rod 231 and the support side bracket 24 are located on the same side. The rotating support rod 232 and the spring support rod 233 are located on the same side and are arranged parallel to each other.

[0036] The supporting side bracket 24 and the rotating side bracket 25 are respectively arranged on two opposite sides of the product support 23, and are both adjacent to the connecting surface where the rotating shaft 22 is located, so as to respectively correspond to the lifting portion 63 and the positioning groove 65. In addition, the sides where the supporting side bracket 24 and the rotating side bracket 25 are arranged are respectively parallel to the sides where the driving assembly 131 is arranged, so as to reserve a path for the wafer carrier 60 to be placed in the product support 23.

[0037] The two supporting side brackets 24 are adjacent and axially symmetrically arranged. Each of the supporting side brackets 24 includes a side bracket bottom plate 241, at least two side bracket mounting rods 242 vertically fixed to the side bracket bottom plate 241, and a side bracket fixing block 243 spaced apart from the side bracket bottom plate 241.

[0038] The side support bottom plate 241 is two clamping plates fixed by fasteners, which are interlocked and screwed to the two fixed support rods 231 by fasteners to achieve stable setting and serve as the base plate of the supporting side support 24. The side support mounting rods 242 are arranged at intervals from each other to support the side support fixing block 243. Preferably, the end of the side support mounting rod 242 close to the side support bottom plate 241 adopts a threaded structure to adjust the distance between the side support fixing block 243 and the side support bottom plate 241, so as to adapt to the wafer carrier 60 of different sizes. The side support fixing block 243 is fixed to the end of the side support mounting rod 242 and has a single-side opening, and the width of the opening is consistent with the thickness of the lifting end 632, so that two adjacent side support fixing blocks 243 together form a slot for the lifting end 632 to be inserted, and the wafer carrier 60 can be limited when placed in the product support 23, so that the wafer carrier 60 will not be displaced due to the rotation of the product support 23.

[0039] The rotating side support 25 is a V-shaped structure, including a rotating portion 251 connected to the product support 23 , a pressing end 252 disposed on the rotating portion 251 , and a buckling end 253 disposed on the rotating portion 251 .

[0040] The rotating part 251 is located between the pressing end 252 and the snap-fit ​​end 253, and is connected to the rotating support rod 232 through a connecting bearing, such as a ball bearing, so that the rotating side support 25 can rotate along the rotating support rod 232. The pressing end 252 is located on the side of the rotating side support 25 facing the supporting side support 24, and the snap-fit ​​end 253 is located on the side of the rotating side support 25 facing the lifting cover 12. The pressing end 252 and the snap-fit ​​end 253 form an acute angle, thereby forming a V-shaped structure. The length of the pressing end 252 is less than the length of the snap-fit ​​end 253, so that when the wafer carrier 60 is opened toward the product holder 23, the edge of the opening of the carrier body 61 is pressed on the pressing end 252, and drives the rotating side support 25 to rotate clockwise until the snap-fit ​​end 253 abuts against the positioning groove 65. Correspondingly, a pressing block is provided at the end of the free end of the pressing end 252, and the extension direction of the pressing block is consistent with the extension direction of the pressing end 252, so that when the snap-fit ​​end 253 is snap-fitted into the positioning groove 65, the contact surface is in vertical contact, thereby obtaining a better resisting effect.

[0041] One end of the return spring 26 is connected to the buckle end 253, and the other end is connected to the spring support rod 233. In the absence of external force, the buckle end 253 will be pulled perpendicular to the rotating support rod 232. It can be imagined that when the wafer carrier 60 is cleaned and taken out from the product support 23, the return spring 26 will pull the rotating side support 25 to rotate counterclockwise, and the pressing end 252 will be tilted, so as to facilitate the next wafer carrier 60 to be placed.

[0042] Due to the product characteristics of the wafer carrier 60, and other devices such as a wafer placement rack may be arranged inside it, when the wafer carrier 60 is placed in the product support 23, in order to ensure the balance of the wafer carrier 60 during rotation and the uniformity of cleaning, and to leave no dead angle, the central axis of the wafer carrier 60 must be in the same straight line with the rotation axis 22. However, due to the structural design of the wafer carrier 60 itself, the lifting portion 63 abutting against the supporting side support 24 and the edge of the wafer carrier 60 abutting against the rotating side support 25 are not on the same plane, that is, there is an angle between the line connecting the two supporting points and the central axis of the rotation axis 22. At the same time, the contact point between the pressing end 252 and the contact edge of the wafer carrier 60 is not located at the center of the rotating part 251, so when the wafer carrier 60 is placed vertically, a first acute angle is formed between the line connecting the contact point between the side support fixing block 243 and the lifting part 63 and the contact point between the pressing end 252 and the edge of the wafer carrier 60 and the central axis of the rotating shaft 22. At the same time, a second acute angle is formed between the line connecting the center of the rotating part 251 and the contact point between the side support fixing block 243 and the lifting part 63 and the central axis of the rotating shaft 22, and the first acute angle is greater than the second acute angle.

[0043] Therefore, when the wafer carrier 60 is placed on the supporting side support 24 and the rotating side support 25, by making the first acute angle greater than the second acute angle, it is possible to compensate for the structural defect of the rotating side support 25, that is, the structural defect that the contact point between the pressing end 252 and the contact edge of the wafer carrier 60 is not located at the center of the rotating part 251, which causes the wafer carrier 60 to be unable to be placed vertically. Therefore, the difference between the second acute angle and the first acute angle should be sufficient to enable the wafer carrier 60 to be placed vertically, which is related to the size of the wafer carrier 60 and the structural accuracy of the supporting side support 24 and the rotating side support 25.

[0044] The return spring 26 can not only automatically return the rotating side support 25 after the wafer carrier 60 is removed from the rotating mechanism 20, but also pull the locking end 253. When the return spring 26 reaches its ultimate stretching position, the wafer carrier 60 is in a vertical position.

[0045] The cleaning mechanism 30 includes a plurality of hot water inlets 31 arranged on the outer wall of the cleaning chamber 11, a plurality of water spray pipes 32 arranged in the cleaning chamber 11, a plurality of hot water nozzles 33 arranged on the water spray pipes 32, and a hot water outlet 34 arranged on the side wall of the cleaning chamber 11.

[0046] The hot water inlet 31 is directly connected to the water spray pipe 32 by a hot water pipe, such as a PPR hot water pipe. The hot water inlet 31 can be provided with an interface, a valve, etc., so as to facilitate the connection with a hot water source and a water pump. In an actual product, the number of the water spray pipe 32 and the hot water inlet 31 can be set according to the total number of the hot water nozzles 33 set, such as setting a hot water pipeline combining a branch pipe and a main pipe when the number is large. The hot water nozzle 33 is a high-pressure nozzle.

[0047] As in this embodiment, a water spray pipe 32 is provided at the corner and the center of the cleaning chamber 11, and a plurality of hot water spray heads 33 are provided on each of the water spray pipes 32, wherein the hot water spray heads 33 on the water spray pipe 32 located in the center of the cleaning chamber 11 face different directions to perform all-round cleaning of the wafer carrier 60. In addition, in this embodiment, hot water at 60°C to 70°C is used for flushing to ensure that dust and impurities on the surface of the wafer carrier 60 can be flushed, and accordingly, the materials of the connecting water pipes and the hot water spray heads 33 should be able to meet the temperature requirements.

[0048] The hot water outlet 34 is arranged on the side wall of the cleaning chamber 11 and is located close to the bottom plate, and is provided with a water pump and a water-gas separator. It and the above-mentioned hot water nozzle 33 and valve are all existing technologies widely used in the field of industrial production and should be well known to those skilled in the art, so they will not be described in detail here.

[0049] The jet mechanism 40 includes an air inlet interface 41 disposed on the outer wall of the cleaning chamber 11 , a plurality of jet pipes 42 disposed in the cleaning chamber 11 , and a plurality of gas nozzles 43 disposed on the water spray pipe 32 .

[0050] The air inlet interface 41 is connected to the air jet pipe 42 by an air pipe. The air jet pipe 42 may be arranged in parallel with the water jet pipe 32, and the number may be the same. In addition, at least one air jet pipe 42 is arranged between the product support 23 and the lifting cover 12 to blow air to the top of the wafer carrier 60. The air jet pipe 42 may be fixed on the lifting cover 12 and pass through the lifting cover 12 to supply air. These are all contents that can be thought of by those skilled in the art, and will not be described in detail one by one here.

[0051] The above-mentioned components, such as the jet pipe 42, the control valve and the connecting air pipe, are all existing technologies widely used in the field of industrial production and should be well known to those skilled in the art, so they will not be described in detail here.

[0052] The infrared heating mechanism 50 includes a plurality of infrared fixed tubes 51 disposed on the outer wall of the cleaning chamber 11 , and a plurality of infrared lamp tubes 52 disposed on the infrared fixed tubes 51 .

[0053] The infrared fixed tube 51 is fixed on the bottom plate of the cleaning chamber 11 and is a hollow structure for easy wiring. The infrared lamp tube 52 is arranged on the infrared fixed tube 51 and may be provided with a lampshade, a protective rod and other structures. In this embodiment, the infrared fixed tube 51 and the infrared lamp tube 52 are arranged at the corners and the center of the cleaning chamber 11, so as to heat both the inside and the outside of the wafer carrier 60.

[0054] The above-mentioned components, such as the infrared lamp 52 and the electrical controller, are all existing technologies widely used in the field of industrial production and should be well known to those skilled in the art, so they will not be described in detail here.

[0055] When in use, after the wafer carrier 60 is fixed in the product support 23, the lifting mechanism 13 drives the lifting cover 12 to descend. After the lifting cover 12 is lowered to cover the cleaning chamber 11, the rotating motor 21 drives the product support 23 to rotate continuously, and the rotation direction is a combination of forward and reverse rotation. At the same time, the valve of the air inlet interface 41 is opened, and the hot water nozzle 33 simultaneously sprays high-pressure water on the inside and outside of the wafer carrier 60. After the water spraying operation is completed, the cleaning mechanism 30 is closed, the infrared heating mechanism 50 is turned on and heated, and the air jet mechanism 40 simultaneously blows air on the inside and outside of the wafer carrier 60, so as to achieve rapid cleaning of the wafer carrier 60. After the cleaning is completed, the infrared heating mechanism 50 and the air jet mechanism 40 are closed, and the rotation is stopped. The lifting mechanism 13 raises the lifting cover 12, and the unloading mechanism unloads the material.

[0056] In addition, in order to achieve separate cleaning of the carrier cover 62, a tooling for fixing the carrier cover 62 can be set on one side of the product holder 23, and a cleaning compartment can be set in the cleaning chamber 11, in which at least one set of the cleaning mechanism 30, the jet mechanism 40 and the infrared heating mechanism 50 is set, so that when the product holder 23 descends into the cleaning chamber 11, the carrier cover 62 simultaneously enters the cleaning compartment for cleaning.

[0057] Compared with the prior art, the cleaning equipment for wafer carriers provided by the present invention maintains the temperature in the cleaning chamber 11 by setting the infrared heating mechanism 50, so that the wafer carrier 60 is at a higher cleaning temperature, thereby making it easy to remove impurities on the surface of the wafer carrier 60, and by setting the cleaning mechanism 30 and the jet mechanism 40, the carrier is cleaned and dried by hot air and hot water, thereby improving the cleaning efficiency of the carrier. By setting the lifting mechanism 13 and the rotating mechanism 20 to drive the wafer carrier 60 to rotate, on the one hand, the dust and sewage on the surface of the carrier can be thrown off by centrifugal force, and at the same time, it can ensure that the inside and outside of the wafer carrier 60 are fully cleaned at 360 degrees, with fast cleaning speed and high efficiency, improving production capacity, and saving water and gas, reducing production costs. By setting the supporting side support 24 and the rotating side support 25, the wafer carrier 60 placed in the product bracket 23 is fixed, and the rotating side support 25 is rotated by utilizing the dead weight of the wafer carrier 60 to support and fix the wafer carrier 60, so that the wafer carrier 60 will not be displaced during the cleaning process, thereby ensuring efficient and stable cleaning. At the same time, loading and unloading are convenient and the operation is simple, which can effectively improve the efficiency of loading and unloading.

[0058] The above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modification, equivalent substitution or improvement within the spirit of the present invention is included in the scope of the claims of the present invention.

Claims

1. A cleaning device for a wafer carrier, the wafer carrier comprising a carrier body and a carrier cover covering the carrier body, the carrier body is provided with a lifting portion located at the top, two handles located at both sides, and three positioning grooves located at the bottom, the lifting portion, the handles and the positioning grooves are respectively located on the side surfaces of the carrier body adjacent to the carrier cover, wherein the lifting portion and the positioning grooves are respectively located on two opposite side surfaces, and the two handles are respectively located on the other two opposite side surfaces, characterized in that: The cleaning device for the wafer carrier comprises a rotating mechanism, the rotating mechanism comprises a rotating motor, a rotating shaft connected to the rotating motor, a product support connected to the rotating shaft, two supporting side supports arranged on the product support, two rotating side supports arranged on the product support, and two return springs respectively connected to the rotating side supports and the product support, the supporting side supports and the rotating side supports are respectively arranged on two opposite side surfaces of the product support, the side surfaces of the supporting side supports and the rotating side supports are both adjacent to the connecting surface where the rotating shaft is located, the two supporting side supports each comprise a side support bottom plate, at least two side support mounting rods vertically fixed to the side support bottom plate, and a side support fixing block spaced apart from the side support bottom plate, the rotating side support comprises a rotating portion connected to the product support, a pressing end arranged on the rotating portion, And a snap-fit ​​end arranged on the rotating part, the rotating part is located between the pressing end and the snap-fit ​​end, the pressing end is located on the side of the rotating side support facing the supporting side support, and the snap-fit ​​end is located on the side of the rotating side support facing the rotating motor, an acute angle is formed between the pressing end and the snap-fit ​​end, the length of the pressing end is less than the length of the snap-fit ​​end, a first acute angle is formed between a line connecting a contact point between the side support fixing block and the lifting part and a contact point between the pressing end and the edge of the wafer carrier and a central axis of the rotating shaft, a second acute angle is formed between a line connecting the center of the rotating part and a contact point between the side support fixing block and the lifting part and the central axis of the rotating shaft, the first acute angle is greater than the second acute angle, and the difference between the second acute angle and the first acute angle enables the wafer carrier to be placed vertically, and when the reset spring reaches its limit stretching position, the wafer carrier is in a vertical position.

2. The cleaning device for a wafer carrier according to claim 1, characterized in that: The cleaning device for the wafer carrier also includes a cleaning and conveying mechanism, a cleaning mechanism arranged in the cleaning and conveying mechanism, an air jet mechanism arranged in the cleaning and conveying mechanism, and an infrared heating mechanism arranged in the cleaning and conveying mechanism.

3. The cleaning device for a wafer carrier according to claim 2, characterized in that: The cleaning and conveying mechanism comprises a cleaning chamber surrounded by side plates, a lifting cover plate covering the cleaning chamber, and a lifting mechanism connecting the cleaning chamber and the lifting cover plate, and a sealing strip is arranged at the edge of the lifting cover plate.

4. The cleaning device for a wafer carrier according to claim 3, characterized in that: The lifting mechanism includes a pair of driving components arranged on the outer wall of the cleaning chamber, and two support rods respectively arranged on the two driving components. The two driving components are arranged on two opposite sides of the cleaning chamber. One end of the support rod is fixed to the driving component, and the other end is connected to the lifting cover.

5. The cleaning device for a wafer carrier according to claim 2, characterized in that: The cleaning mechanism includes a plurality of hot water inlets arranged on the outer wall of the cleaning chamber, a plurality of water spray pipes arranged in the cleaning chamber, a plurality of hot water nozzles arranged on the water spray pipes, and a hot water outlet arranged on the side wall of the cleaning chamber, and the air spray pipe is arranged parallel to the water spray pipe.

6. The cleaning device for a wafer carrier according to claim 1, characterized in that: The lifting portion includes a connecting end disposed on the carrier body and a lifting end disposed on the connecting end.

7. The cleaning device for a wafer carrier according to claim 1, characterized in that: The product bracket is provided with two fixed support rods for setting the supporting side support, a rotating support rod for setting the rotating side support, and a spring support rod for setting the return spring. The fixed support rod and the supporting side support are located on the same side, and the rotating support rod and the spring support rod are located on the same side and are arranged parallel to each other.

8. The cleaning device for a wafer carrier according to claim 2, characterized in that: The jet mechanism comprises an air inlet interface arranged on the outer wall of the cleaning chamber, a plurality of jet pipes arranged in the cleaning chamber, and a plurality of gas nozzles arranged on the water spray pipe.

9. The cleaning device for a wafer carrier according to claim 2, characterized in that: The infrared heating mechanism comprises a plurality of infrared fixed tubes arranged on the outer wall of the cleaning chamber, and a plurality of infrared lamp tubes arranged on the infrared fixed tubes.

10. The cleaning device for a wafer carrier according to claim 7, characterized in that: One end of the return spring is connected to the buckling end, and the other end is connected to the spring support rod.

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