A circuit board planar grinding device capable of planning grinding paths

Abstract

The present invention discloses a planar grinding device for circuit boards capable of planning grinding paths, which relates to the field of surface grinding of circuit boards and includes a grinding workbench. A rectangular groove is formed in the top of the grinding workbench, and a special-shaped tooling mechanism is arranged in the rectangular groove. The special-shaped tooling mechanism includes a rotating tooling plate, a negative pressure support tube, and a sliding support tube. The rotating tooling plate is rotatably connected to the grinding workbench, and the rotation axis of the rotating tooling plate is horizontally arranged. The negative pressure support tube is fixedly penetrated through the middle of the rotating tooling plate, and a plurality of sliding support tubes are slidably penetrated through the rotating tooling plate. The plurality of sliding support tubes are arranged in a rectangular array. The axial length of the negative pressure support tube is equal to the axial length of the sliding support tube. Under normal conditions, the top surface height of the sliding support tube is higher than the top surface height of the negative pressure support tube. The circuit board is suspended and tooled, greatly increasing the tooling contact area of the circuit board, with stronger stability and more uniform force.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board surface grinding, and specifically relates to a circuit board planar grinding device capable of planning a grinding path. Background Art

[0002] A circuit board is one of the important components in the electronics industry. Almost every electronic device, from electronic watches, calculators to computers, electronic communication devices, military weapon systems, and artificial intelligence devices, etc., requires the use of a circuit board. Currently, under the overall trend of digitization, networking, and intelligence in the electronics information manufacturing industry, the application scope of circuit boards is becoming wider and wider. Currently, during the production process of circuit boards, the upper plane and the lower plane of the circuit board need to be ground to remove burrs and make the friction coefficient of the circuit board meet the requirements. Since the shape of the circuit board will be correspondingly adjusted according to the spatial size of the installation environment, the shape of the circuit board is not necessarily regular, and the grinding process is carried out on the special-shaped circuit board. However, the existing grinding devices cannot plan the grinding path according to the shape of the circuit board. When grinding the plane of the circuit board, the length of each movement path of the grinding roller is the same, and the size of the circuit board is covered by a large range of grinding, resulting in a large number of idling situations of the grinding roller, that is, the grinding roller is separated from the circuit board for the grinding operation, thereby reducing the grinding efficiency of the circuit board; secondly, when grinding the circuit board, the circuit board needs to be suspended by a tooling, so that the side wall and the upper surface of the circuit board are exposed for grinding operations. Currently, the circuit board is suspended by a tooling through a negative pressure adsorption method, and the tooling contact area of the circuit board is small. On the one hand, the tooling strength is low, and on the other hand, local pressure on the circuit board will be too large during the grinding operation, resulting in the situation of being crushed, and the tooling force on the circuit board is uneven. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a circuit board planar grinding device capable of planning a grinding path to solve the deficiencies of the prior art.

[0004] The purpose of the present invention is achieved by the following technical solutions: A circuit board planar grinding device capable of planning a grinding path, including a grinding workbench, a rectangular groove is opened at the top of the grinding workbench, a special-shaped tooling mechanism is arranged in the rectangular groove, the special-shaped tooling mechanism includes a rotating tooling plate, a negative pressure support pipe, and a sliding support pipe. The rotating tooling plate is rotationally connected to the grinding workbench, the rotation axis of the rotating tooling plate is horizontally arranged, the negative pressure support pipe is fixedly penetrated through the middle of the rotating tooling plate, a plurality of the sliding support pipes are slidably penetrated through the rotating tooling plate, and a plurality of the sliding support pipes are arranged in a rectangular array. The axial length of the negative pressure support pipe is equal to the axial length of the sliding support pipe. Under normal conditions, the top surface height of the sliding support pipe is higher than the top surface height of the negative pressure support pipe;

[0005] It further includes a path grinding mechanism, which includes a fixed base plate, a sliding column, a lifting cross beam, a sliding cross beam, a high-precision slide plate and a grinding frame. There are two parallel fixed base plates, and the grinding workbench is located between the two fixed base plates. A first linear driving module is horizontally arranged on the top surface of the fixed base plate. The sliding column is installed on the slide of the first linear driving module. A first screw rod transmission pair is arranged on the side wall of the sliding column. The two ends of the lifting cross beam are respectively connected to the two first screw rod transmission pairs. A second linear driving module is installed on the bottom surface of the lifting cross beam. The sliding cross beam is installed on the slide of the second linear driving module. A second screw rod transmission pair is arranged at the bottom of the sliding cross beam. The high-precision slide plate is installed on the second screw rod transmission pair. The grinding frame is a U-shaped structure with an opening facing downwards, and the grinding frame is fixedly installed at the bottom of the high-precision slide plate. A grinding roller is rotatably arranged in the opening of the grinding frame. The moving direction of the sliding cross beam is perpendicular to the moving direction of the sliding column, and the moving direction of the high-precision slide plate is parallel to the moving direction of the sliding column.

[0006] Further, the first screw rod transmission pair includes a first screw rod, a first screw rod slider and a first screw rod motor. A vertical chute is opened on the side wall of the sliding column. The first screw rod is rotatably installed in the vertical chute. The first screw rod slider is threadedly sleeved on the first screw rod, and the first screw rod slider is slidably adapted to the vertical chute. The first screw rod motor is installed at the top of the sliding column, and the output shaft of the first screw rod motor is drivingly connected to the first screw rod.

[0007] Further, the second screw rod transmission pair includes a second screw rod, a second screw rod slider and a second screw rod motor. A horizontal chute is opened at the bottom of the sliding cross beam. The second screw rod is rotatably installed in the horizontal chute. The second screw rod slider is threadedly sleeved on the second screw rod, and the second screw rod slider is slidably adapted to the horizontal chute. The second screw rod motor is installed at one end of the sliding cross beam, and the output shaft of the second screw rod motor is drivingly connected to the second screw rod. A grinding motor is installed on the side wall of the grinding frame, and the output shaft of the grinding motor is drivingly connected to one end of the grinding roller.

[0008] Further, a tooling round hole is penetrated through the rotating tooling plate at the position where the sliding support tube is provided. The sliding support tube slidably passes through the tooling round hole. A limiting ring is fixedly sleeved on the sliding support tube. A spring is sleeved on the sliding support tube, and the two ends of the spring are respectively connected to the rotating tooling plate and the limiting ring.

[0009] Further, all the sliding support tubes in a vertical direction are taken as a group of support components, and each group of the support components corresponds to a locking mechanism. The locking mechanism includes a lock rod, a pressing block and a downward pressing block. A lock cavity is longitudinally formed in the rotary tooling plate. The lock rod is slidably arranged in the lock cavity. A lock hole communicating with the lock cavity is formed in the side wall of the tooling round hole. The pressing block is slidably arranged in the lock hole. Each pressing block is correspondingly provided with a downward pressing block. The downward pressing block is fixedly connected to the lock rod. A wedge-shaped surface is arranged at one end of the pressing block in the lock cavity. The wedge-shaped surface is located on the moving path of the downward pressing block. A driving plate is arranged on one side wall of the rotary tooling plate. One end of the lock rod penetrates out of the lock cavity and is connected to the driving plate. Push cylinders are arranged at both ends of the driving plate. The cylinder body of the push cylinder is installed on the rotary tooling plate, and the telescopic shaft of the push cylinder is connected to the driving plate.

[0010] Further, main shafts are fixed at both ends of the rotary tooling plate. The main shafts are rotatably connected to the grinding workbench. A main shaft driving cavity is arranged in the grinding workbench. One of the main shafts penetrates into the main shaft driving cavity and is connected to a driven belt pulley. A main shaft motor is arranged in the main shaft driving cavity. The output shaft of the main shaft motor is connected to a driving belt pulley. The driving belt pulley is connected to the driven belt pulley through a synchronous belt.

[0011] Further, the negative pressure support tube includes a support body and a pressure cover. A negative pressure hole is formed at the bottom of the support body. The support body is connected to a negative pressure pump through a negative pressure tube. The negative pressure tube communicates with the negative pressure hole. A detection groove is formed at the top of the support body. A pressure sensor is installed in the detection groove. The pressure shaft of the pressure sensor is connected to the pressure cover. The bottom surface of the pressure cover is located above the top surface of the support body.

[0012] Further, auxiliary clamping mechanisms are arranged on both sides of the rectangular groove of the grinding workbench. The auxiliary clamping mechanism includes a lifting seat, a horizontal moving seat, a rotating column, a rotating shaft and a U-shaped clamping frame. A clamping installation groove is formed in the top surface of the grinding workbench along its height direction. The lifting seat is arranged in the clamping installation groove. The lifting seat has a degree of freedom to move along the height direction of the grinding workbench. The horizontal moving seat is slidably arranged on the lifting seat. The rotating column is rotatably arranged on the top of the horizontal moving seat. The rotation axis of the rotating column is vertically arranged. One end of the rotating shaft is rotatably connected to the rotating column, and the other end is connected to the U-shaped clamping frame. The bottom surface of the U-shaped opening of the U-shaped clamping frame is flush with the supporting surface of the negative pressure support tube. A downward pressing cylinder is installed on the top of the U-shaped clamping frame. The telescopic shaft of the downward pressing cylinder penetrates into the U-shaped opening and is connected to a downward pressing clamping block.

[0013] Further, a lifting cylinder is vertically installed in the clamping and mounting groove. The telescopic shaft of the lifting cylinder is connected to the lifting seat. An adjusting cylinder is installed on the lifting seat, and the telescopic shaft of the adjusting cylinder is connected to the horizontal moving seat.

[0014] Further, a rotating main shaft is fixed at the bottom of the rotating column. The rotating main shaft is rotatably connected to the horizontal moving seat. A first motor is installed in the horizontal moving seat. The output shaft of the first motor is drivingly connected to the rotating main shaft. A second motor is installed on the rotating column, and the output shaft of the second motor is drivingly connected to one end of the rotating shaft.

[0015] The beneficial effects of the present invention are as follows:

[0016] 1. The path grinding mechanism has three degrees of freedom of movement, that is, the grinding roller has the freedom to move rapidly in three directions along the X, Y, and Z axes in the space coordinate system. It can quickly drive the grinding roller to move to the grinding position according to the outer shape size of the circuit board, and then drive the grinding roller to contact the surface of the circuit board for grinding operation through the second lead screw transmission pair. The transmission accuracy of the second lead screw transmission pair is relatively high, enabling the grinding roller to move slowly to complete the grinding operation. For special-shaped circuit boards, it drives the grinding roller to quickly move to the grinding position for grinding, greatly shortening the ineffective grinding path and improving the grinding efficiency.

[0017] 2. Place the circuit board on the sliding support tube. By pressing down the circuit board, the circuit board squeezes the sliding support tube to move downward until the circuit board contacts the negative pressure support tube and then stops moving. Thus, the bottom of the sliding support tube in contact with the circuit board is flush with the bottom of the negative pressure support tube. Then remove the circuit board, rotate the rotating tooling plate by 180°, and then place the circuit board on the sliding support tube flush with the negative pressure support tube, thereby suspending the circuit board for tooling. This greatly increases the tooling contact area of the circuit board, with stronger stability and more uniform force. And the sliding support tube that does not contact the circuit board is located below the circuit board and will not block the grinding operation of the grinding roller. Description of the Drawings

[0018] Figure 1 is a structural schematic diagram of a circuit board planar grinding device capable of planning grinding paths according to the present invention Figure 1 ;

[0019] Figure 2 is an internal structural schematic diagram of the grinding workbench in a circuit board planar grinding device capable of planning grinding paths according to the present invention;

[0020] Figure 3 is Figure 2 the enlarged view at A in

[0021] Figure 4Internal structure schematic diagram of the rotating tooling plate in a circuit board planar grinding device capable of planning grinding paths according to the present invention;

[0022] Figure 5 For Figure 4 Enlarged view at position B in;

[0023] Figure 6 Structural schematic of a circuit board planar grinding device capable of planning grinding paths according to the present invention Figure 2 ;

[0024] Figure 7 Structural schematic of a circuit board planar grinding device capable of planning grinding paths according to the present invention Figure 3 ;

[0025] Figure 8 Structural schematic of a circuit board planar grinding device capable of planning grinding paths according to the present invention Figure 4 ;

[0026] Figure 9 Schematic diagram of the state of the circuit board in the tooling area according to the present invention;

[0027] In the figure, 1 - grinding workbench, 2 - rectangular groove, 3 - rotating tooling plate, 4 - negative pressure support tube, 5 - sliding support tube, 6 - fixed substrate, 7 - sliding column, 8 - lifting crossbeam, 9 - sliding crossbeam, 10 - high-precision slide plate, 11 - grinding frame, 12 - first linear drive module, 13 - second linear drive module, 14 - grinding roller, 15 - first lead screw, 16 - first lead screw slider, 17 - first lead screw motor, 18 - vertical sliding groove, 19 - second lead screw, 20 - second lead screw slider, 21 - second lead screw motor, 22 - horizontal sliding groove, 23 - grinding motor, 24 - tooling round hole, 25 - limit ring, 26 - spring, 27 - locking rod, 28 - pressing block, 29 - pressing block, 30 - locking cavity, 31 - locking hole, 32 - wedge surface, 33 - drive plate, 34 - pushing cylinder, 35 - main shaft, 36 - main shaft drive cavity, 37 - driven pulley, 38 - main shaft motor, 39 - driving pulley, 40 - synchronous belt, 41 - support body, 42 - pressure cover, 43 - negative pressure hole, 44 - detection groove, 45 - pressure sensor, 46 - horizontal moving seat, 47 - rotating column, 48 - rotating shaft, 49 - U-shaped clamping frame, 50 - pressing cylinder, 51 - pressing clamping block, 52 - clamping installation groove, 53 - adjusting cylinder, 54 - rotating main shaft, 55 - second motor, 56 - lifting seat, 57 - lifting cylinder. Detailed implementation method

[0028] The technical solution of the present invention will be further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following description.

[0029] Example 1:

[0030] As Figures 1 to 9 shown, a planar grinding device for a circuit board capable of planning a grinding path includes a grinding workbench 1 and a path grinding mechanism. A rectangular groove 2 is formed at the top of the grinding workbench 1. An irregular tooling mechanism is arranged in the rectangular groove 2. The irregular tooling mechanism includes a rotating tooling plate 3, a negative pressure support tube 4, and a sliding support tube 5. The rotating tooling plate 3 is rotatably connected to the grinding workbench 1, and the rotation axis of the rotating tooling plate 3 is horizontally arranged. The negative pressure support tube 4 is fixedly penetrated through the middle of the rotating tooling plate 3. A plurality of sliding support tubes 5 are slidably penetrated through the rotating tooling plate 3. The plurality of sliding support tubes 5 are arranged in a rectangular array. The axial length of the negative pressure support tube 4 is equal to the axial length of the sliding support tube 5. Under normal conditions, the top surface height of the sliding support tube 5 is higher than the top surface height of the negative pressure support tube 4. Referring to Figure 9 the tooling schematic diagram, the tooling method for the irregular circuit board is as follows: The circuit board is adsorbed and placed on the sliding support tube 5 by a robotic arm, and the circuit board is pressed down to make the sliding support tube 5 move downward under the pressure of the circuit board. When the circuit board contacts the negative pressure support tube 4, the pressing of the circuit board stops. Since the axial length of the negative pressure support tube 4 is equal to the axial length of the sliding support tube 5, the sliding support tube 5 in contact with the circuit board is arranged at the same height as the negative pressure support tube 4, so that a plurality of sliding support tubes 5 can move adaptively following the shape of the circuit board to provide the largest support contact area according to the shape of the circuit board. Then, the circuit board is removed and the rotating tooling plate 3 is rotated 180°, and the tooling area of the circuit board can be formed. Subsequently, the circuit board can be directly loaded into the tooling area. The sliding support tube flush with the negative pressure support tube 4 and the negative pressure support tube 4 jointly support the circuit board. At the same time, the negative pressure support tube 4 generates negative pressure to adsorb the circuit board, improving the tooling stability of the circuit board, thereby tooling the circuit board in suspension, greatly increasing the tooling contact area of the circuit board, with stronger stability and more uniform force. The sliding support tubes 5 that do not contact the circuit board are located below the circuit board and will not block the grinding operation of the path grinding mechanism, so that the path grinding mechanism and the irregular tooling mechanism do not interfere with each other.

[0031] Embodiment 2:

[0032] On the basis of Embodiment 1, as Figure 1 、 Figures 6 to 8As shown in the figure, the path grinding mechanism includes a fixed base plate 6, a sliding column 7, a lifting cross beam 8, a sliding cross beam 9, a high-precision slide plate 10 and a grinding frame 11. There are two fixed base plates 6 arranged in parallel. The grinding workbench 1 is located between the two fixed base plates 6. A first linear drive module 12 is horizontally arranged on the top surface of the fixed base plate 6. The sliding column 7 is installed on the slide of the first linear drive module 12. A first lead screw transmission pair is arranged on the side wall of the sliding column 7. The two ends of the lifting cross beam 8 are respectively connected to the two first lead screw transmission pairs. A second linear drive module 13 is installed on the bottom surface of the lifting cross beam 8. The sliding cross beam 9 is installed on the slide of the second linear drive module 13. A second lead screw transmission pair is arranged at the bottom of the sliding cross beam 9. The high-precision slide plate 10 is installed on the second lead screw transmission pair. The grinding frame 11 is a U-shaped structure with an opening facing downwards. The grinding frame 11 is fixedly installed at the bottom of the high-precision slide plate 10. A grinding roller 14 is rotatably arranged inside the opening of the grinding frame 11. The moving direction of the sliding cross beam 9 is perpendicular to the moving direction of the sliding column 7. The moving direction of the high-precision slide plate 10 is parallel to the moving direction of the sliding column 7. When grinding a special-shaped circuit board of a certain model, taking the position of the negative pressure support tube 4 as the coordinate origin, the dimension standard reference of the special-shaped circuit board is corresponding to the coordinate origin, so that the coordinate information of each corner of the special-shaped circuit board can be obtained. Taking this coordinate information as the moving path of the path grinding mechanism, when the circuit board is loaded onto the tooling area, the dimension standard reference of the circuit board is roughly coincident with the coordinate origin. Thus, the coordinate information of each corner of the circuit board can provide a reference for the moving coordinates of the grinding roller 14, and the moving path of the grinding roller 14 can be planned in advance. The specific moving grinding path is as follows: The sliding column 7 is driven by the first linear drive module 12 to move linearly, with a relatively fast response speed. The sliding cross beam 9 is driven by the second linear drive module 13 to move linearly, so that the grinding roller 14 has degrees of freedom to move in two directions along the X and Y axes on the horizontal plane. Both are driven by linear drive modules, which can drive the grinding roller 14 to move quickly, so that the grinding roller 14 quickly moves to a corner position of the circuit board. Then the lifting cross beam 8 drives it to descend through the first lead screw transmission pair, so that the grinding roller 14 contacts the surface of the circuit board. Then the grinding roller 14 is driven to move linearly through the second lead screw transmission pair, so that the grinding roller 14 moves longitudinally for grinding operations. The first lead screw transmission pair and the second lead screw transmission pair have relatively high moving precision, and high-precision grinding operations can be realized. Then, the sliding cross beam 9 drives the grinding roller 14 to move transversely, and the moving distance is less than the axial length of the grinding roller 14, so that it can completely cover the surface of the circuit board to complete the grinding operation. Then, the grinding roller 14 is again driven to move longitudinally through the second lead screw transmission pair for grinding operations. After the grinding is completed in this direction, the sliding cross beam 9 drives the grinding roller 14 to move transversely again. When encountering the special-shaped position of the circuit board, through the rapid movement of the sliding column 7 and the sliding cross beam 9, the grinding roller 14 quickly moves to the edge position of the circuit board.Then, the second lead screw transmission pair drives the grinding roller 14 to move slowly for grinding operations. This process is repeated to comprehensively grind the surface of the circuit board, enabling it to quickly move to the edge position according to the shape of the circuit board for grinding operations, greatly shortening the ineffective grinding path and improving the grinding efficiency.

[0033] Further, the first lead screw transmission pair includes a first lead screw 15, a first lead screw slider 16, and a first lead screw motor 17. A vertical chute 18 is formed on the side wall of the sliding column 7. The first lead screw 15 is rotatably installed in the vertical chute 18. A first lead screw slider 16 is threadedly sleeved on the first lead screw 15, and the first lead screw slider 16 is slidably fitted in the vertical chute 18. The top of the sliding column 7 is provided with a first lead screw motor 17, and the output shaft of the first lead screw motor 17 is drivingly connected to the first lead screw 15. Both ends of the lifting cross beam 8 are respectively connected to the two first lead screw sliders 16. By driving the first lead screw 15 to rotate through the first lead screw motor 17, the first lead screw slider 16 makes a linear movement along the axial direction of the first lead screw 15, causing the first lead screw slider 16 to drive the lifting cross beam 8 to move up and down, enabling the grinding roller 14 to move upward to separate from the circuit board or driving the grinding roller 14 to move downward to contact the circuit board for grinding operations. The second lead screw transmission pair includes a second lead screw 19, a second lead screw slider 20, and a second lead screw motor 21. A horizontal chute 22 is formed at the bottom of the sliding cross beam 9. The second lead screw 19 is rotatably installed in the horizontal chute 22. The second lead screw slider 20 is threadedly sleeved on the second lead screw 19, and the second lead screw slider 20 is slidably fitted in the horizontal chute 22. One end of the sliding cross beam 9 is provided with a second lead screw motor 21, and the output shaft of the second lead screw motor 21 is drivingly connected to the second lead screw 19. A grinding motor 23 is installed on the side wall of the grinding frame 11, and the output shaft of the grinding motor 23 is drivingly connected to one end of the grinding roller 14. When the grinding roller 14 contacts the circuit board for grinding operations, the horizontal linear movement of the grinding roller 14 is driven by the second lead screw transmission pair. Specifically, the second lead screw motor 21 drives the second lead screw 19 to rotate, causing the second lead screw slider 20 to make a linear movement along the axial direction of the second lead screw 19, enabling the second lead screw slider 20 to drive the high-precision slide plate 10 to move, and the high-precision slide plate 10 drives the grinding roller 14 to make a linear movement to complete the grinding operation.

[0034] Embodiment Three:

[0035] Due to the relatively high grinding intensity, the impact on the circuit board is significant. Simply restricting the horizontal movement freedom of the circuit board through negative pressure is not stable enough. Also, after one side of the circuit board is ground, the circuit board needs to be flipped 180° for grinding the other side. Therefore, on the basis of Embodiment Two, as Figures 1 to 8As shown, auxiliary clamping mechanisms are provided on both sides of the rectangular groove 2 of the grinding workbench 1. The auxiliary clamping mechanism includes a lifting seat 56, a horizontal moving seat 46, a rotating column 47, a rotating shaft 48, and a U-shaped clamping frame 49. A clamping installation groove 52 is formed in the top surface of the grinding workbench 1 along its height direction. The lifting seat 56 is arranged in the clamping installation groove 52 and has the freedom to move along the height direction of the grinding workbench 1. The horizontal moving seat 46 is slidably arranged on the lifting seat 56. The rotating column 47 is rotatably arranged on the top of the horizontal moving seat 46, and the rotation axis of the rotating column 47 is vertically arranged. One end of the rotating shaft 48 is rotatably connected to the rotating column 47, and the other end is connected to the U-shaped clamping frame 49. The bottom surface of the U-shaped opening of the U-shaped clamping frame 49 is flush with the supporting surface of the negative pressure support tube 4. A pressing cylinder 50 is installed on the top of the U-shaped clamping frame 49. The telescopic shaft of the pressing cylinder 50 penetrates into the U-shaped opening and is connected to a pressing clamping block 51. A lifting cylinder 57 is vertically installed in the clamping installation groove 52, and the telescopic shaft of the lifting cylinder 57 is connected to the lifting seat 56. An adjusting cylinder 53 is installed on the lifting seat 56, and the telescopic shaft of the adjusting cylinder 53 is connected to the horizontal moving seat 46. The bottom of the rotating column 47 is fixed with a rotating main shaft 54, and the rotating main shaft 54 is rotatably connected to the horizontal moving seat 46. A first motor is installed in the horizontal moving seat 46, and the output shaft of the first motor is drivingly connected to the rotating main shaft 54. A second motor 55 is installed on the rotating column 47, and the output shaft of the second motor 55 is drivingly connected to one end of the rotating shaft 48. Under normal conditions, the bottom surface of the U-shaped opening of the U-shaped clamping frame 49 is flush with the supporting surface of the negative pressure support tube 4. After the circuit board is loaded into the tooling area, the path grinding mechanism processes the circuit board from one end to the other end. To avoid interference with the auxiliary clamping mechanism, the auxiliary clamping mechanism far from the grinding roller 14 works. The adjusting cylinder 53 drives the U-shaped clamping frame 49 to move closer to the circuit board, so that the circuit board is located within the U-shaped opening of the U-shaped clamping frame 49. Then, the pressing cylinder 50 drives the pressing clamping block 51 to move closer to the circuit board, so that the pressing clamping block 51 contacts the circuit board. The clamping operation of the circuit board is completed through the combined action of the pressing clamping block 51 and the U-shaped clamping frame 49. At this time, the circuit board has a large supporting contact area and is limited by both mechanical clamping and negative pressure, so that the circuit board has strong tooling strength and ensures that the circuit board will not shift during the grinding process, and has a good grinding effect. When the grinding roller 14 approaches the working auxiliary clamping mechanism, the other auxiliary clamping mechanism first acts to clamp the circuit board. After the clamping is completed, the auxiliary clamping mechanism close to the grinding roller 14 releases the circuit board and resets. At this time, this auxiliary clamping mechanism is not within the working range of the grinding roller 14, so that it will not interfere with the auxiliary clamping mechanism. When one side of the circuit board is ground, the grinding roller 14 moves to one side of the circuit board, and the auxiliary clamping mechanism far from the grinding roller 14 acts, so that the pressing clamping block 51 and the U-shaped clamping frame 49 act together to clamp the circuit board. Then, the lifting cylinder 57 drives the lifting seat 56 to move upward, thereby driving the circuit board to move upward, so that the circuit board is separated from the sliding support tube 5.When the circuit board is flipped, it will not collide with the sliding support tube 5 and the negative pressure support tube 4. Then, the second motor 55 drives the rotating shaft 48 to rotate, so as to drive the U-shaped clamping frame 49 to rotate 180°, and then rotate the circuit board 180 degrees. Then, the lifting cylinder 57 drives the lifting seat 56 to move downward, places the circuit board in the tooling area. Then, the pressing cylinder 50 drives the pressing clamping block 51 to move upward, so as to loosen the circuit board. Then, the adjusting cylinder 53 drives the U-shaped clamping frame 49 to separate from the circuit board. Finally, the second motor 55 drives the U-shaped clamping frame 49 to rotate 180° to reset, and repeat the above grinding operation to complete the grinding of the other side of the circuit board.

[0036] Embodiment 4:

[0037] On the basis of Embodiment 3, as Figures 1 to 5As shown in the figure, a tooling circular hole 24 is penetrated and opened at the position of the rotating tooling plate 3 where the sliding support tube 5 is arranged. The sliding support tube 5 slides through the tooling circular hole 24. A limiting ring 25 is fixedly sleeved on the sliding support tube 5. A spring 26 is sleeved on the sliding support tube 5. The two ends of the spring 26 are respectively connected to the rotating tooling plate 3 and the limiting ring 25. All the sliding support tubes 5 in a longitudinal direction form a set of support components. Each set of support components corresponds to a locking mechanism. The locking mechanism includes a locking rod 27, a pressing block 28 and a pressing block 29. A locking cavity 30 is longitudinally opened in the rotating tooling plate 3. The locking rod 27 is slidably arranged in the locking cavity 30. A locking hole 31 communicating with the locking cavity 30 is opened on the side wall of the tooling circular hole 24. The pressing block 28 is slidably arranged in the locking hole 31. Each pressing block 28 is correspondingly provided with a pressing block 29. The pressing block 29 is fixedly connected to the locking rod 27. A wedge surface 32 is arranged at one end of the pressing block 28 in the locking cavity 30. The wedge surface 32 is located on the moving path of the pressing block 29. A driving plate 33 is arranged on one side wall of the rotating tooling plate 3. One end of the locking rod 27 penetrates out of the locking cavity 30 and is connected to the driving plate 33. Push cylinders 34 are arranged at both ends of the driving plate 33. The cylinder body of the push cylinder 34 is installed on the rotating tooling plate 3. The telescopic shaft of the push cylinder 34 is connected to the driving plate 33. Under normal conditions, the pressing block 29 is separated from the pressing block 28, so that under the action of the spring 26, the sliding support tube 5 and the negative pressure support tube 4 are arranged up and down staggeredly, that is, the top surface of the sliding support tube 5 is higher than the top surface of the negative pressure support tube 4. When the circuit board is placed on the sliding support tube 5 and pressed down, the sliding support tube 5 will stretch the spring 26 and move downward. When the circuit board contacts the negative pressure support tube 4, the push cylinder 34 drives the driving plate 33 to move close to the rotating tooling plate 3, so that the driving plate 33 simultaneously pushes a plurality of locking rods 27 to move, so that the locking rods 27 drive a plurality of pressing blocks 29 thereon to move. The pressing block 29 moves close to the pressing block 28. The pressing block 29 will squeeze the wedge surface 32 of the pressing block 28. Under the action of the wedge surface 32, the pressing block 28 moves to press against the sliding support tube 5, thereby locking the position of the sliding support tube 5, so that the sliding support tube 5 will not reset due to the reaction force of the spring 26, making the tooling area stable. Then the rotating tooling plate 3 is rotated 180°, and the grinding operation can be carried out on the circuit board of the same model. When it is necessary to grind the circuit board of a new model, the push cylinder 34 drives the driving plate 33 to move away from the rotating tooling plate 3, so that the driving plate 33 drives the locking rod 27 to move, so that the pressing block 29 is separated from the pressing block 28. At this time, the sliding support tube 5 resets under the reaction force of the spring 26. Then the rotating tooling plate 3 is rotated within a range of 180°, and the new model circuit board is pressed down on the sliding support tube 5 again to obtain the tooling area of the circuit board. Finally, the tooling area is locked by using the driving plate 33, so that the corresponding tooling area can be obtained for circuit boards of different shapes. The circuit board has a large support contact area in the tooling area, and the force on the circuit board tooling is more stable, so that the circuit board is not easily damaged during the grinding process.

[0038] Further, the negative pressure support tube 4 includes a support body 41 and a pressure cover 42. A negative pressure hole 43 is formed at the bottom of the support body 41. The support body 41 is connected to a negative pressure pump through a negative pressure tube, and the negative pressure tube communicates with the negative pressure hole 43. A detection groove 44 is formed at the top of the support body 41, and a pressure sensor 45 is installed in the detection groove 44. The pressure shaft of the pressure sensor 45 is connected to the pressure cover 42, and the bottom surface of the pressure cover 42 is located above the top surface of the support body 41. During the process of forming the tooling area, when the pressing circuit board contacts the negative pressure support tube 4, the circuit board will contact the pressure cover 42, and the pressure is transmitted to the pressure sensor 45 through the pressure cover 42. According to the feedback information of the pressure sensor 45, it can be judged whether the circuit board has been pressed down to contact the negative pressure support tube 4, so as to accurately and quickly judge whether the circuit board has been pressed down in place; a negative pressure is generated in the negative pressure hole 43 by the negative pressure pump. After the rotary tooling plate 3 rotates 180°, the negative pressure hole 43 of the support body 41 acts on the circuit board upward, so that the circuit board can be negatively pressure adsorbed.

[0039] Embodiment Five:

[0040] Based on Embodiment Four, as Figure 1 and Figure 2 shown, main shafts 35 are fixed at both ends of the rotary tooling plate 3. The main shafts 35 are rotatably connected to the grinding workbench 1. A main shaft drive cavity 36 is provided in the grinding workbench 1. One of the main shafts 35 penetrates into the main shaft drive cavity 36 and is connected to a driven belt pulley 37. A main shaft motor 38 is arranged in the main shaft drive cavity 36. The output shaft of the main shaft motor 38 is connected to a driving belt pulley 39. The driving belt pulley 39 is drivingly connected to the driven belt pulley 37 through a synchronous belt 40. The main shaft motor 38 drives the driving belt pulley 39 to rotate. The driving belt pulley 39 drives the driven belt pulley 37 to rotate through the synchronous belt 40. The driven belt pulley 37 drives the main shaft 35 to rotate. The main shaft 35 drives the rotary tooling plate 3 to rotate, so that the rotary tooling plate 3 rotates 180° each time. To avoid wire winding, the rotary tooling plate 3 deflects and resets in a reciprocating 180-degree manner without rotating a full circle.

Claims

1. A circuit board surface grinding device capable of planning a grinding path, comprising a grinding workbench (1), characterized in that: The top of the grinding workbench (1) is provided with a rectangular groove (2), and a special-shaped tooling mechanism is arranged in the rectangular groove (2), and the special-shaped tooling mechanism comprises a rotating tooling plate (3), a negative pressure support tube (4) and a sliding support tube (5), the rotating tooling plate (3) is rotatably connected to the grinding workbench (1), the rotation axis of the rotating tooling plate (3) is arranged horizontally, the negative pressure support tube (4) is fixedly penetrated in the middle of the rotating tooling plate (3), and a plurality of sliding support tubes (5) are slidably penetrated on the rotating tooling plate (3), and the plurality of sliding support tubes (5) are arranged in a rectangular array, the axial length of the negative pressure support tube (4) is equal to the axial length of the sliding support tube (5), and under normal conditions, the top surface height of the sliding support tube (5) is higher than the top surface height of the negative pressure support tube (4); The invention also comprises a path grinding mechanism, wherein the path grinding mechanism comprises a fixed base plate (6), a sliding column (7), a lifting beam (8), a sliding beam (9), a high-precision slide plate (10) and a grinding frame (11), wherein two fixed base plates (6) are arranged in parallel, and the grinding workbench (1) is located between the two fixed base plates (6). A first linear drive module (12) is horizontally arranged on the top surface of the fixed base plate (6), the sliding column (7) is mounted on a slide seat of the first linear drive module (12), a first screw transmission pair is arranged on the side wall of the sliding column (7), two ends of the lifting beam (8) are respectively connected to two of the first screw transmission pairs, and the bottom of the lifting beam (8) is connected to the first linear drive module (12). A second linear drive module (13) is installed on the surface, the sliding beam (9) is installed on the slide seat of the second linear drive module (13), the bottom of the sliding beam (9) is provided with a second screw transmission pair, the high-precision slide plate (10) is installed on the second screw transmission pair, the grinding frame (11) is a U-shaped structure with an opening facing downward, the grinding frame (11) is fixedly installed at the bottom of the high-precision slide plate (10), a grinding roller (14) is rotatably arranged in the opening of the grinding frame (11), the moving direction of the sliding beam (9) is perpendicular to the moving direction of the sliding column (7), and the moving direction of the high-precision slide plate (10) is parallel to the moving direction of the sliding column (7); The rotating tooling plate (3) is provided with a tooling circular hole (24) at a position where the sliding support tube (5) is provided, the sliding support tube (5) slides through the tooling circular hole (24), a limiting ring (25) is fixedly sleeved on the sliding support tube (5), a spring (26) is sleeved on the sliding support tube (5), and two ends of the spring (26) are respectively connected to the rotating tooling plate (3) and the limiting ring (25); All the sliding support tubes (5) in a longitudinal direction are regarded as a group of support components, each group of the support components corresponds to a locking mechanism, the locking mechanism comprises a locking rod (27), a clamping block (28) and a pressing block (29), a locking cavity (30) is provided in the longitudinal direction of the rotating tooling plate (3), the locking rod (27) is slidably arranged in the locking cavity (30), a locking hole (31) communicating with the locking cavity (30) is provided on the side wall of the tooling circular hole (24), the clamping block (28) is slidably arranged in the locking hole (31), each of the clamping blocks (28) is correspondingly provided with a pressing block (29), and the pressing block ( 29) is fixedly connected to the locking rod (27), one end of the pressing block (28) located in the locking cavity (30) is provided with a wedge-shaped surface (32), and the wedge-shaped surface (32) is located on the moving path of the pressing block (29), a side wall of the rotating tooling plate (3) is provided with a driving plate (33), one end of the locking rod (27) passes through the locking cavity (30) and is connected to the driving plate (33), and both ends of the driving plate (33) are provided with a pushing cylinder (34), the cylinder body of the pushing cylinder (34) is installed on the rotating tooling plate (3), and the telescopic shaft of the pushing cylinder (34) is connected to the driving plate (33).

2. A circuit board surface polishing device capable of planning a polishing path according to claim 1, characterized in that: The first screw transmission pair comprises a first screw (15), a first screw slider (16) and a first screw motor (17); a vertical slide groove (18) is provided on the side wall of the sliding column (7); the first screw (15) is rotatably mounted in the vertical slide groove (18); a first screw slider (16) is threadedly mounted on the first screw (15); the first screw slider (16) is slidably adapted to the vertical slide groove (18); the first screw motor (17) is installed on the top of the sliding column (7); and the output shaft of the first screw motor (17) is drivingly connected to the first screw (15).

3. A circuit board surface polishing device capable of planning a polishing path according to claim 1, characterized in that: The second screw transmission pair comprises a second screw (19), a second screw slider (20) and a second screw motor (21); a transverse sliding groove (22) is provided at the bottom of the sliding crossbeam (9); the second screw (19) is rotatably mounted in the transverse sliding groove (22); the second screw slider (20) is threadedly mounted on the second screw (19); the second screw slider (20) is slidably adapted to the transverse sliding groove (22); the second screw motor (21) is mounted at one end of the sliding crossbeam (9); the output shaft of the second screw motor (21) is drivingly connected to the second screw (19); a grinding motor (23) is mounted on the side wall of the grinding frame (11); the output shaft of the grinding motor (23) is drivingly connected to one end of the grinding roller (14).

4. A circuit board surface polishing device capable of planning a polishing path according to claim 1, characterized in that: A spindle (35) is fixed at both ends of the rotating tooling plate (3), and the spindle (35) is rotatably connected to the grinding workbench (1). A spindle drive cavity (36) is provided in the grinding workbench (1), and one of the spindles (35) penetrates into the spindle drive cavity (36) and is connected to a driven pulley (37). A spindle motor (38) is provided in the spindle drive cavity (36), and an output shaft of the spindle motor (38) is connected to a driving pulley (39), and the driving pulley (39) is connected to the driven pulley (37) through a synchronous belt (40).

5. A circuit board surface polishing device capable of planning a polishing path according to claim 1, characterized in that: The negative pressure support tube (4) comprises a support body (41) and a pressure cover (42); a negative pressure hole (43) is provided at the bottom of the support body (41); the support body (41) is connected to a negative pressure pump via a negative pressure tube; the negative pressure tube is connected to the negative pressure hole (43); a detection groove (44) is provided at the top of the support body (41); a pressure sensor (45) is installed in the detection groove (44); a pressure shaft of the pressure sensor (45) is connected to the pressure cover (42); and a bottom surface of the pressure cover (42) is located above a top surface of the support body (41).

6. A circuit board surface polishing device capable of planning a polishing path according to claim 1, characterized in that: The grinding workbench (1) is provided with auxiliary clamping mechanisms on both sides of the rectangular groove (2), and the auxiliary clamping mechanisms include a lifting seat (56), a horizontal movable seat (46), a rotating column (47), a rotating shaft (48) and a U-shaped clamping frame (49). The top surface of the grinding workbench (1) is provided with a clamping installation groove (52) along its own height direction. The lifting seat (56) is arranged in the clamping installation groove (52). The lifting seat (56) has the freedom to move along the height direction of the grinding workbench (1). The horizontal movable seat (46) is slidably arranged on the lifting seat (56). On the seat (56), the rotating column (47) is rotatably arranged on the top of the horizontally movable seat (46), the rotating axis of the rotating column (47) is vertically arranged, one end of the rotating shaft (48) is rotatably connected to the rotating column (47), and the other end is connected to the U-shaped clamping frame (49), the bottom surface of the U-shaped opening of the U-shaped clamping frame (49) is flush with the supporting surface of the negative pressure support tube (4), and a downward pressure cylinder (50) is installed on the top of the U-shaped clamping frame (49), and the telescopic shaft of the downward pressure cylinder (50) is inserted into the U-shaped opening and connected to a downward pressure clamping block (51).

7. A circuit board surface polishing device capable of planning a polishing path according to claim 6, characterized in that: A lifting cylinder (57) is vertically installed in the clamping installation groove (52), and the telescopic shaft of the lifting cylinder (57) is connected to the lifting seat (56). An adjusting cylinder (53) is installed on the lifting seat (56), and the telescopic shaft of the adjusting cylinder (53) is connected to the horizontal moving seat (46).

8. A circuit board surface polishing device capable of planning a polishing path according to claim 6, characterized in that: A rotating main shaft (54) is fixed at the bottom of the rotating column (47), and the rotating main shaft (54) is rotatably connected to the horizontal movable seat (46). A first motor is installed in the horizontal movable seat (46), and the output shaft of the first motor is drivingly connected to the rotating main shaft (54). A second motor (55) is installed on the rotating column (47), and the output shaft of the second motor (55) is drivingly connected to one end of the rotating shaft (48).

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