A polyimide film, a method for preparing the same, and an application thereof

The polyimide film prepared by polycondensation reaction of ortho-side-group aromatic diamine monomer and alicyclic dianhydride monomer exhibits excellent insulation and heat resistance at high temperatures, solving the problems of leakage current and energy storage loss of polyimide film at high temperatures, and achieving a breakthrough in high-temperature electrostatic energy storage.

CN119842073BActive Publication Date: 2026-03-17CENT SOUTH UNIV
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Patent Information

Application Number
CN202510016407.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-01-06
Publication Date
2026-03-17
Estimated Expiration
2045-01-06

AI Technical Summary

Technical Problem

Existing polyimide films suffer from severe leakage current and energy storage loss at high temperatures, making them unsuitable for effective application under high-temperature conditions. Furthermore, it is difficult to balance heat resistance and insulation properties.

Method used

A polycondensation reaction was carried out using an ortho-side-group aromatic diamine monomer and an alicyclic dianhydride monomer. By introducing a side group at the ortho position of the amino group of the diamine monomer, the conjugation effect was reduced, the stiffness and insulation properties of the polymer were improved, and a high glass transition temperature was maintained.

Benefits of technology

The prepared polyimide film exhibits high Weibull static breakdown and high energy storage efficiency at 300℃, and can be used for nearly 40,000 cycles at 300℃, achieving excellent electrostatic energy storage performance at high temperatures.

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Abstract

This invention relates to the field of polymer dielectric technology and discloses a method for preparing a polyimide film, comprising the following steps: (1) alicyclic dianhydride monomer and an ortho-side-group aromatic diamine monomer undergo a polycondensation reaction in an organic solvent to obtain a precursor solution; (2) the precursor solution is formed into a film, and then dried and subjected to an imidization reaction to obtain a polyimide film; the imidization reaction is carried out under vacuum conditions, and the imidization reaction is a programmed temperature rise reaction, specifically: holding at 180-210℃ for 1-2 h, then raising the temperature to 240-260℃ and holding for 1-2 h, and continuing to raise the temperature to T and holding for 0.5-1 h; wherein, T = T g -t,T g The glass transition temperature of the polymer is 10℃≤t≤20℃. The polyimide film prepared by this invention exhibits high insulation and heat resistance properties, allowing for energy storage applications at temperatures up to 300℃.
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