Core particle testing method, system and equipment, storage medium and computer program product

Abstract

The invention relates to a core particle testing method and system, computer equipment, a storage medium and a computer program product, and is applied to the technical field of chip testing. The method comprises the following steps: acquiring the number of module chips of a to-be-tested core particle; determining at least one test environment component matched with the number of the module chips; the at least one test environment assembly is in one-to-one correspondence with the module chips of the to-be-tested core particles; and running each test environment component in parallel, and testing the corresponding module chip through each test environment component according to a preset test case to obtain a test result of each module chip. By adopting the method, different chip specifications can be adapted, the development cost is saved, the test environment components run in parallel when the core particles are tested, and the test efficiency of the core particles is improved.

Description

Technical Field

[0001] The present application relates to the field of chip testing technology, and in particular to a chip testing method, system, computer equipment, storage medium and computer program product. Background Art

[0002] When designing a chiplet, the chip is decomposed into multiple modular dies according to different computing units or functional units, and then multiple modular dies are interconnected and packaged into a chiplet chip. Due to the different number of decomposed dies, the specifications of different chiplets are different. Traditional chip platforms cannot be flexibly adapted according to chiplet specifications, and developing different test platforms for each specification of chiplets requires a lot of manpower and material resources. Summary of the invention

[0003] Based on this, it is necessary to provide a chip testing method, system, computer equipment, computer-readable storage medium and computer program product that can adapt to different chip specifications in order to address the above technical problems.

[0004] In a first aspect, the present application provides a core particle testing method. The method comprises:

[0005] Get the number of module chips of the core to be tested;

[0006] Determine at least one test environment component that matches the number of the module chips; the at least one test environment component corresponds one-to-one to the module chips of the core particles to be tested;

[0007] Run various test environment components in parallel, test corresponding module chips according to preset test cases through each test environment component, and obtain test results of each module chip.

[0008] In one embodiment, the test environment component includes at least one functional test component, and the corresponding module chip is tested according to a preset test case through each test environment component, including:

[0009] For each test environment component, obtaining function enabling information of a current module chip through the current test environment component; the current module chip corresponds to the current test environment component;

[0010] Determine at least one function to be tested according to the acquired function enabling information, and call at least one function test component; the at least one function test component corresponds to the at least one function to be tested one by one;

[0011] Through each functional test component according to the preset test cases, the corresponding functions to be tested in the current module chip are tested.

[0012] In one embodiment, the functional test component includes an initialization component, a data generator and a data collector, and the corresponding to-be-tested function in the current module chip is tested according to a preset test case by each functional test component, including:

[0013] For each functional test component, the current functional test component calls the initialization component to initialize the current to-be-tested function of the current module chip; the current to-be-tested function corresponds to the current functional test component;

[0014] When the current module chip is initialized, the data generator is called through the current functional test component to generate current test data according to a preset test case, and the current test data is sent to the current module chip to instruct the current module chip to process the current test data using the current function to be tested, obtain current processed data, and feed back the current processed data;

[0015] The data collector is called by the current function test component to receive the current processing data, and the test result of the current function to be tested is determined according to the current processing data.

[0016] In one embodiment, the initialization components of each functional test component in the same test environment component are run in series to determine whether the current module chip has completed the initialization process, including:

[0017] Determine whether each initialization component in the current test environment component has completed initialization;

[0018] When all initialization components in the current test environment component have completed initialization, it is determined that the current module chip has completed initialization.

[0019] In one embodiment, each test environment component communicates with the corresponding module chip through the same virtual interface component.

[0020] In a second aspect, the present application also provides a core particle testing system. The system includes: a configuration component, a test environment component, a core particle to be tested, and a set of use cases;

[0021] The configuration component is used to obtain the number of module chips of the core particle to be tested, and determine at least one test environment component that matches the number of module chips; the at least one test environment component corresponds to the module chips of the core particle to be tested one by one;

[0022] The test environment component is used to obtain preset test cases from the test case set, and test the corresponding module chips according to the obtained test cases to obtain test results of each module chip;

[0023] Wherein, the at least one test environment component runs in parallel.

[0024] In one of the embodiments, the test environment component includes at least one functional test component;

[0025] The configuration component is further used to obtain function enabling information of each module chip, and send the function enabling information of each module chip to the at least one test environment component;

[0026] The test environment component is further used to obtain function enable information of the current module chip; the current module chip corresponds to the current test environment component; according to the obtained function enable information, at least one function to be tested is determined, and at least one function test component is called; the at least one function test component corresponds to the at least one function to be tested one by one;

[0027] The functional testing component is used to obtain preset test cases from the test case set, and test the corresponding to-be-tested function in the current module chip according to the obtained test cases.

[0028] In one embodiment, the functional test component includes an initialization component, a data generator, and a data collector;

[0029] The initialization component is used to initialize the current function to be tested of the current module chip; the current function to be tested corresponds to the current functional test component;

[0030] The data generator is used to obtain a preset test case from the case set when the current module chip completes initialization, generate current test data according to the obtained test case, and send the current test data to the current module chip to instruct the current module chip to process the current test data using the current function to be tested to obtain current processed data, and feed back the current processed data;

[0031] The data collector is used to receive the current processing data and determine the test result of the current function to be tested according to the current processing data.

[0032] In a third aspect, the present application further provides a computer device. The computer device includes a memory and a processor, the memory stores a computer program, and the processor implements the following steps when executing the computer program:

[0033] Get the number of module chips of the core to be tested;

[0034] Determine at least one test environment component that matches the number of the module chips; the at least one test environment component corresponds one-to-one to the module chips of the core particles to be tested;

[0035] Run various test environment components in parallel, test corresponding module chips according to preset test cases through each test environment component, and obtain test results of each module chip.

[0036] In a fourth aspect, the present application further provides a computer-readable storage medium. The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the following steps are implemented:

[0037] Get the number of module chips of the core to be tested;

[0038] Determine at least one test environment component that matches the number of the module chips; the at least one test environment component corresponds one-to-one to the module chips of the core particles to be tested;

[0039] Run various test environment components in parallel, test corresponding module chips according to preset test cases through each test environment component, and obtain test results of each module chip.

[0040] In a fifth aspect, the present application further provides a computer program product. The computer program product includes a computer program, and when the computer program is executed by a processor, the following steps are implemented:

[0041] Get the number of module chips of the core to be tested;

[0042] Determine at least one test environment component that matches the number of the module chips; the at least one test environment component corresponds one-to-one to the module chips of the core particles to be tested;

[0043] Run various test environment components in parallel, test corresponding module chips according to preset test cases through each test environment component, and obtain test results of each module chip.

[0044] The above-mentioned chip testing method, system, computer equipment, storage medium and computer program product obtain the number of module chips of the chip to be tested; determine at least one test environment component that matches the number of module chips; at least one test environment component corresponds one-to-one to the module chip of the chip to be tested; run each test environment component in parallel, and test the corresponding module chip according to the preset test case through each test environment component to obtain the test result of each module chip, which can adapt to different chip specifications and save development costs. When testing the chip, each test environment component runs in parallel, which improves the test efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 It is a schematic diagram of the structure of the traditional chip platform architecture;

[0046] Figure 2 A schematic diagram of a process of a core particle testing method in one embodiment;

[0047] Figure 3 A schematic diagram of a flow chart of steps for testing a module chip in one embodiment;

[0048] Figure 4 A schematic diagram of parameter configuration of a configuration component in an embodiment;

[0049] Figure 5 A schematic diagram of a flow chart of steps for testing functions to be tested in a test module chip in one embodiment;

[0050] Figure 6 A schematic diagram of the structure of a chip platform architecture in one embodiment;

[0051] Figure 7 A schematic diagram of a workflow of an initialization component in one embodiment;

[0052] Figure 8 A schematic diagram of the initialization progress of a chip platform in one embodiment;

[0053] Fig. 9 A schematic diagram of the code hierarchy of a chip platform in one embodiment;

[0054] Fig.10 A schematic diagram of the code hierarchy of a chip platform in another embodiment;

[0055] Fig.11 is a structural block diagram of a core particle testing system in one embodiment;

[0056] Fig.12 FIG. 4 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0057] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0058] Reference Figure 1 , Figure 1The structure of a traditional chip platform architecture is shown. The traditional chip platform consists of a test environment component (env), a use case set, and a chip under test. Among them, the use case set contains all test cases for the chip under test, and each test case is a test code configured by the staff for each function of the chip; the test environment component includes an initialization component, a data generator, and a data collector. After the traditional chip platform is started, the initialization component initializes all functional modules in the chip under test. According to the instructions of different use cases, the data generator generates data and transmits it to the chip under test. After the chip processes, the output data is sent to the data collector. The staff determines whether the chip is running normally based on the output data.

[0059] Chiplets have many specifications. When using traditional chip platforms to test smaller chiplets, it will consume too many server resources. When testing larger chiplets, the test will take a long time due to the performance limitations of the chip platform. It can be seen that traditional chip platforms cannot be flexibly adapted according to chiplet specifications, and developing different test platforms for each chiplet specification requires a lot of manpower and material resources.

[0060] In order to solve the above problems, this application sets the number of module chips so that the chip platform can adapt to different chip specifications. Among them, each test environment component is reduced from the scale of a multi-module whole chip to the scale of a single module chip, which reduces the development difficulty and saves labor costs. When testing the chip, the test environment components run in parallel, which improves the test efficiency of the chip.

[0061] In one embodiment, Figure 2 As shown, a core particle testing method is provided. This embodiment uses the method applied to a core particle testing system as an example for illustration. The core particle testing method includes the following steps:

[0062] Step 202, obtaining the number of module chips of the chip to be tested.

[0063] Among them, due to different specifications of chiplets, the number of decomposed computing units or functional units is different. The chiplet includes multiple modular bare chips (die). The number of module chips in this embodiment is the number of bare chips included in the chiplet to be tested. The chiplet testing system is set with a global variable to characterize the number of module chips in the chiplet to be tested. The number of module chips of the chiplet to be tested is obtained by reading the global variable; optionally, the number of module chips is set by the staff according to the chiplet specifications; optionally, the number of module chips is obtained by identifying the chiplet to be tested.

[0064] In some implementations, the chip to be tested is arranged inside the chip test system and is the chip to be tested of the chip test system; in other implementations, the chip to be tested is placed outside the chip test system and is connected to the chip test system. This embodiment does not limit the connection method between the chip to be tested and the chip test system, which can be a data line connection method.

[0065] Step 204, determining at least one test environment component that matches the number of the module chips; the at least one test environment component corresponds one-to-one to the module chips of the core particles to be tested.

[0066] In some implementations, a corresponding number of test environment components are instantiated by the number of module chips. For example, for the tested core particles with 4 die specifications, 4 test environment components are instantiated, test environment component 1 corresponds to module chip 1, test environment component 2 corresponds to module chip 2, and so on.

[0067] In some implementations, the chiplet testing system is provided with a plurality of test environment components, a corresponding number of test environment components are selected from the components according to the number of module chips, and the selected test environment components are started.

[0068] Step 206, running various test environment components in parallel, testing corresponding module chips according to preset test cases through various test environment components, and obtaining test results of various module chips.

[0069] Among them, the core particle test system is provided with a use case set, and the use case set contains all test cases for each module chip in the core particle to be tested. Each test case is a test code configured by the staff for each function of the module chip, and the test case is used to indicate the test input, execution conditions and expected results. The preset test case used by each test environment component in this embodiment is a test case pre-configured in the use case set for the module chip corresponding to the test environment component. After each test environment component in the core particle test system is started, according to the preset test case, the module chip corresponding to the test environment component is tested to obtain the test result of the corresponding module chip. Optionally, the test data received by multiple test environment components are integrated and displayed to the staff, and the staff judges whether the operation of the core particle to be tested is normal based on the displayed data.

[0070] Exemplarily, the chip test system includes a configuration component, in which a global variable "die number" is set. Assuming that the chip to be tested has a specification of 4 dies, "die number" is set to 4. When testing, 4 test environment components are instantiated, each of which corresponds to a module chip, and the corresponding module chip is tested through each test environment component. Since the main functions and structures of multiple module chips of the chip to be tested are similar, the test environment component and its internal components are designed for one module chip, so that the complexity of the test environment component is only for the scale of one module chip, reducing the development workload.

[0071] In the above-mentioned chip testing method, the number of module chips of the chip to be tested is obtained; at least one test environment component matching the number of module chips is determined; at least one test environment component corresponds one-to-one to the module chip of the chip to be tested; each test environment component is run in parallel, and the corresponding module chip is tested according to the preset test case through each test environment component to obtain the test result of each module chip. It can adapt to different chip specifications, save development costs, and each test environment component runs in parallel when testing the chip, which improves the test efficiency of the chip.

[0072] In one embodiment, Figure 3 As shown, the test environment component includes at least one functional test component, and the corresponding module chip is tested according to a preset test case through each test environment component, including:

[0073] Step 302: for each test environment component, obtain function enabling information of the current module chip through the current test environment component; the current module chip corresponds to the current test environment component.

[0074] The current test environment component is any instantiated test environment component, and each test environment component corresponds to a module chip. The configuration component is set with the global variable "die number" and the enable information of each function of each module chip. The function enable information is used to indicate the on and off status of each function in the module chip. Figure 4 For example, Figure 4 The figure shows the parameter configuration of a configuration component. Assume that the chip to be tested has 4 die specifications and a module chip has 5 functions. Figure 4In the above code, die1~die4 refers to the first module chip to the fourth module chip, and function 1~function 5 refers to the first function to the fifth function. Each function can be tested separately or combined with other functions. When testing the chip, the staff configures the function switches of each module chip in the configuration component according to the actual test requirements. For example, die1 enables functions 1~3, die2 enables functions 2~3, die3 enables functions 3~4, and die4 enables functions 3~5. By configuring the enable information of each function of each module chip, the functions that are not used during the test can be turned off without initializing these functions, saving computing resources.

[0075] Step 304: determine at least one function to be tested according to the acquired function enabling information, and call at least one function testing component; the at least one function testing component corresponds one-to-one to the at least one function to be tested.

[0076] The process of determining at least one function to be tested according to the acquired function enable information includes: determining one or more functions to be tested that are in an enabled state in the current module chip according to the acquired function enable information. Each function to be tested corresponds to a functional test component, and the number of functional test components called by the current test environment component is consistent with the number of functions to be tested that are in an enabled state in the functional enable information.

[0077] In one implementation, the configuration component sends the function enable information of each module chip to the test environment component corresponding to each module chip. The current test environment component obtains the function enable information of the current module chip from the configuration component, and tests one or more functions in the current module chip that are in an enabled state according to the function enable information. For example, the function enable information of module chip 1 is sent to test environment component 1, and test environment component 1 tests one or more functions in the enabled state in module chip 1 according to the obtained function enable information.

[0078] Step 306: Test the corresponding to-be-tested functions in the current module chip through various functional test components according to preset test cases.

[0079] Among them, the preset test cases used by each functional test component in this embodiment are test cases pre-configured in the case set for the function to be tested corresponding to the functional test component. After being started, each functional test component under each test environment component in the core particle test system tests the function to be tested corresponding to the functional test component according to the preset test cases to obtain the test results of the function to be tested. According to the test data received by each functional test component in the same test environment component, it can be determined whether the function in the turned-on state in a module chip in the core particle to be tested is normal.

[0080] In this embodiment, for each test environment component, the function enable information of the current module chip is obtained through the current test environment component; the current module chip corresponds to the current test environment component; according to the obtained function enable information, at least one function to be tested is determined, and at least one function test component is called; at least one function test component corresponds one to one with at least one function to be tested; through each functional test component, according to the preset test case, the corresponding function to be tested in the current module chip is tested, and the function enable information of each module chip can be configured according to the test requirements, thereby avoiding the waste of resources caused by useless functions to the test process, and testing multiple functions of each module chip in the core particle through multiple functional test components, further improving the test efficiency of the core particle.

[0081] In one embodiment, Figure 5 As shown, the functional test component includes an initialization component, a data generator and a data collector, and the step 306 includes:

[0082] Step 502 : for each functional test component, the current functional test component calls the initialization component to initialize the current to-be-tested function of the current module chip; the current to-be-tested function corresponds to the current functional test component.

[0083] Reference Figure 6 , Figure 6 The structure of a chip platform architecture is shown. Assuming that the test environment component of a module chip is used to test 5 functions, the test environment component includes 5 sets of initialization components, data generators and data collectors, such as Figure 6 Initialization components 1~5, data generators 1~5 and data collectors 1~5.

[0084] In some embodiments, the test environment components are instantiated according to the number of module chips and the number of functions to be tested, wherein the number of instantiated test environment components is consistent with the number of module chips, and the number of functional test components included in each instantiated test environment component is consistent with the number of functions to be tested. For example, for 4 die specifications of the tested chips, 4 test environment components are instantiated, test environment component 1 corresponds to module chip 1, test environment component 2 corresponds to module chip 2, and so on. Assuming that module chip 1 has 4 functions to be tested, the instantiated test environment component 1 includes 4 initialization components, 4 data generators and 4 data collectors.

[0085] In some implementations, each instantiated test environment component includes multiple functional test components, each functional test component includes an initialization component, a data generator, and a data collector, and a corresponding number of functional test components are selected from the multiple functional test components according to the number of functions to be tested, and a corresponding number of functional test components are called to test the functions to be tested, such as Figure 6 , assuming that the number of functions to be tested is 3, the instantiated test environment components include initialization components 1~5, data generators 1~5 and data collectors 1~5, and the corresponding number of functional test components are selected in order as functional test component 1 (including initialization component 1, data generator 1 and data collector 1), functional test component 2 (including initialization component 2, data generator 2 and data collector 2) and functional test component 3 (including initialization component 3, data generator 3 and data collector 3).

[0086] In some implementations, each functional test component included in the instantiated test environment component corresponds one-to-one to each function of the module chip, and at least one corresponding initialization component is selected according to at least one function to be tested that is in an enabled state. For example, functional test component 1 corresponds to function 1 of the module chip, and functional test component 2 corresponds to function 2 of the module chip. If function 1 is in an enabled state and function 2 is in a disabled state in the acquired function enable information, functional test component 1 is called to test function 1.

[0087] Each functional test component runs the initialization code through the functional test component to complete the initialization task of the function to be tested. In one implementation, multiple functional test components in the same test environment component run in parallel, and the initialization components of each functional test component complete the initialization task in parallel. In one implementation, the initialization components of multiple functional test components in the same test environment component complete the initialization task in series, and after the initialization is completed, the data generators of multiple functional test components in the same test environment component run in parallel.

[0088] Step 504, when the current module chip has completed initialization, the data generator is called through the current functional test component to generate current test data according to a preset test case, and the current test data is sent to the current module chip to instruct the current module chip to use the current function to be tested to process the current test data, obtain current processed data, and feed back the current processed data.

[0089] In one implementation, if the initialization task has been executed for one or more functions to be tested that are in an enabled state in the current module chip, it is determined that the previous module chip has completed initialization.

[0090] Among them, after at least one function to be tested in the current module chip is initialized, each functional test component calls the corresponding data generator in parallel, each data generator corresponds to a function to be tested, and for each functional test component, the data generator corresponding to the current functional test component is used to generate current test data according to the test case matching the current function to be tested in the case set, and the current test data is sent to the current module chip corresponding to the current test environment component, and the current module chip is driven to use the current function to be tested to process the received data, and the processed data is fed back to the data collector corresponding to the current function to be tested. In one implementation, the current test environment component communicates with the current module chip through a virtual interface component, the data generator sends the current test data to the current module chip through the virtual interface component, and the current module chip sends the current processed data to the data collector through the virtual interface component.

[0091] Step 506: The current function test component calls the data collector to receive the current processing data, and determines the test result of the current function to be tested according to the current processing data.

[0092] Among them, for each functional test component, the data collector corresponding to the current functional test component is used to obtain the current processing data obtained by the chip to be tested using the current function to be tested from the virtual interface component. In one implementation, according to the test case matching the current function to be tested in the use case set, the expected result data is determined, and the current processing data is compared with the expected result data to determine the test result of the current function to be tested.

[0093] In this embodiment, for each functional test component, the current functional test component calls the initialization component to initialize the current function to be tested of the current module chip; the current function to be tested corresponds to the current functional test component; when the current module chip is initialized, the current functional test component calls the data generator to generate current test data according to the preset test case, and sends the current test data to the current module chip to instruct the current module chip to use the current function to be tested to process the current test data, obtain the current processing data, and feed back the current processing data; the current functional test component calls the data collector to receive the current processing data, and determines the test result of the current function to be tested according to the current processing data. In the above manner, the initialization component, data generator and data collector corresponding to the function to be tested are used to test each function to be tested in parallel, which further improves the test efficiency of the core particle.

[0094] In one embodiment, the initialization components of each functional test component in the same test environment component are run serially to determine whether the current module chip has completed initialization, including: determining whether each initialization component in the current test environment component has completed initialization; when each initialization component in the current test environment component has completed initialization, determining that the current module chip has completed initialization.

[0095] Among them, when testing a core particle to be tested that contains multiple module chips, multiple test environment components run in parallel without affecting each other. During the chip initialization process, the initialization of each module chip is carried out in parallel, which can save running time and server resources. However, for each module chip, the initialization of each function of each module chip is carried out in series. For each functional test component, when each initialization component in the current test environment component has completed the initialization task, the data generator and data collector are called through the current functional test component to test the function to be tested corresponding to the current functional test component. After the initialization is completed, multiple functional test components under the same test environment component run in parallel, further improving the test efficiency of the core particle.

[0096] In one embodiment, each test environment component communicates with the corresponding module chip through the same virtual interface component.

[0097] Among them, each test environment component and each module chip in the core particle to be tested are connected to the same virtual interface component. Due to the differences in interface connections and other places between each module chip, data interaction is completed through the virtual interface component, making the differences between each module chip invisible to each test environment component. Setting up a virtual interface to transmit data can eliminate the interface differences between each module chip in the core particle to be tested, improve the data transmission efficiency between the test environment component and the module chip, and further improve the test efficiency of the core particle.

[0098] In one embodiment, the method further includes: when an initialization exception occurs in the current test environment component, obtaining an initialization log corresponding to the current test environment component; and determining a function to be tested with the initialization exception according to the initialization log.

[0099] Optionally, when the current test environment component has an initialization exception, an error event is triggered. By monitoring the error event during the initialization process, it is determined whether the current test environment component has an initialization exception. Optionally, an initialization timeout event is triggered when the working signal of any data generator in the current test environment component is not detected within a preset time. When the initialization timeout event is monitored, it is determined that the current test environment component has an initialization exception. This embodiment does not limit this. By analyzing the initialization log, the to-be-tested function with the initialization exception is determined.

[0100] In one embodiment, the method further includes: before initializing each function to be tested, printing a start mark in the initialization log corresponding to the current test environment component; after initializing each function to be tested, printing an end mark in the initialization log corresponding to the current test environment component;

[0101] The step of determining the function to be tested with initialization abnormality according to the initialization log includes: querying at least one start tag and at least one end tag in the initialization log; and determining the function to be tested with initialization abnormality according to the at least one start tag and at least one end tag.

[0102] Each initialization component runs the corresponding function initialization code, refer to Figure 7 , print the start mark "start" before running the function initialization code, and print the end mark "done" after running the function initialization code. In a specific implementation, add log print statements at the beginning and end of the function initialization code, and the log print is set to always print, so as to avoid the system lowering the log print level when resources are tight. By setting the print mark in the log, it is easy to locate abnormal situations.

[0103] Reference Figure 8 , Figure 8 The chip to be tested is a chip with a scale of 4 dies, among which die1 enables functions 1~3, die2 enables functions 2~3, die3 enables functions 3~4, and die4 enables functions 3~5. The initialization process of each module chip die is parallel, and the initialization of each function in each module chip die is serial. Each initialization component initializes a function, prints "start" at the beginning of running the function initialization code, and prints "done" statements to the log at the end of running the function initialization code, so that the staff can clearly understand the initialization time distribution of each module chip and each function. If a module chip hangs abnormally during the initialization of a certain function, the problem can be located by searching the log, which greatly improves work efficiency.

[0104] In one embodiment, referring to Fig. 9, assuming that the number of module chips of the core to be tested is 4, the overall code hierarchy of the chip platform is: the first layer is the chip platform code, the chip platform hierarchy instantiates the configuration component, env[4], use case set, chip under test, and virtual interface component. The chip under test hierarchy instantiates the code of 4 dies, where the number of instantiated dies is equal to the "number of dies" in the configuration component. env[4] is a class array containing 4 test environment components, and the number of test environment components is equal to the "number of dies" in the configuration component. Each test environment component and its underlying code are the same. When the chip platform is running, the 4 test environment groups run in parallel, and each test environment group interacts with the corresponding die in the chip under test through the virtual interface component alone, without affecting each other.

[0105] Assume that the full specification of a chip supports 4 dies. Due to different actual needs, the chip can be tailored, for example, to 1 die and 2 die specifications. For the specifications of 1 die and 2 die, the chip platform of this embodiment only needs to modify the "number of dies" in the configuration component to complete the corresponding adaptation. Taking the 2 die specification as an example, refer to Fig.10 , set the "number of dies" in the configuration component to 2, instantiate two test environment components at the chip platform level, namely env[2], and also instantiate the codes of two dies at the chip level. In this way, different chip specifications can be quickly adapted, saving development costs.

[0106] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0107] Based on the same inventive concept, the embodiment of the present application also provides a core particle testing system for implementing the core particle testing method involved above. The implementation scheme for solving the problem provided by the system is similar to the implementation scheme recorded in the above method, so the specific limitations in one or more core particle testing system embodiments provided below can refer to the limitations of the core particle testing method above, and will not be repeated here.

[0108] In one embodiment, Fig.11As shown, a core particle testing system is provided, including: a configuration component 112, a test environment component 114, a core particle to be tested 116 and a use case set 118; wherein:

[0109] The configuration component 112 is used to obtain the number of module chips of the core particle 116 to be tested, and determine at least one test environment component 114 matching the number of module chips; the at least one test environment component 114 corresponds to the module chips of the core particle 116 to be tested.

[0110] The test environment component 114 is used to obtain preset test cases from the use case set 118, and test the corresponding module chips according to the obtained test cases to obtain test results of each module chip; wherein at least one test environment component runs in parallel.

[0111] In the above-mentioned chip test system, a configuration component obtains the number of module chips of the chip to be tested; determines at least one test environment component that matches the number of module chips; at least one test environment component corresponds one-to-one to the module chip of the chip to be tested; the test environment component obtains preset test cases from a use case set, and tests the corresponding module chips according to the obtained test cases to obtain test results of each module chip. At least one test environment component runs in parallel, which can adapt to different chip specifications, saving development costs. When testing the chip, each test environment component runs in parallel, which improves the test efficiency of the chip.

[0112] In one embodiment, the test environment component 114 includes at least one functional test component;

[0113] The configuration component 112 is further used to obtain function enabling information of each module chip, and send the function enabling information of each module chip to the at least one test environment component 114;

[0114] The test environment component 114 is used to obtain function enablement information of the current module chip; the current module chip corresponds to the current test environment component 114; according to the obtained function enablement information, at least one function to be tested is determined, and at least one function test component is called; the at least one function test component corresponds to the at least one function to be tested one by one;

[0115] The functional testing component is used to obtain preset test cases from the test case set 118, and test the corresponding to-be-tested functions in the current module chip according to the obtained test cases.

[0116] In one embodiment, referring to Fig.11 , the functional test component includes an initialization component, a data generator and a data collector;

[0117] The initialization component is used to initialize the current function to be tested of the current module chip; the current function to be tested corresponds to the current functional test component;

[0118] The data generator is used to obtain a preset test case from the case set 118 when the current module chip completes initialization, generate current test data according to the obtained test case, and send the current test data to the current module chip to instruct the current module chip to process the current test data using the current function to be tested to obtain current processed data, and feed back the current processed data;

[0119] The data collector is used to receive the current processing data and determine the test result of the current function to be tested according to the current processing data.

[0120] In one embodiment, the initialization components of each functional test component in the same test environment component 114 are run in series, and the data generator is also used to determine whether the initialization components of each functional test component in the current test environment component 114 have completed initialization;

[0121] When the initialization components of each functional test component in the current test environment component 114 have completed initialization, it is determined that the current module chip has completed initialization.

[0122] In one embodiment, Fig.11 As shown, the chip test system is further provided with a virtual interface component, and each test environment component 114 communicates with the corresponding module chip through the same virtual interface component.

[0123] Each module in the above-mentioned core particle test system can be implemented in whole or in part by software, hardware and their combination. Each of the above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the corresponding operations of each of the above modules.

[0124] In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as follows: Fig.12As shown. The computer device includes a processor, a memory, an input / output interface (Input / Output, referred to as I / O) and a communication interface. Among them, the processor, the memory and the input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The input / output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a core particle testing method is implemented.

[0125] Those skilled in the art will understand that Fig.12 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0126] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the following steps are implemented:

[0127] Get the number of module chips of the core to be tested;

[0128] Determine at least one test environment component that matches the number of the module chips; the at least one test environment component corresponds one-to-one to the module chips of the core particles to be tested;

[0129] Run various test environment components in parallel, test corresponding module chips according to preset test cases through each test environment component, and obtain test results of each module chip.

[0130] In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

[0131] For each test environment component, obtaining function enabling information of a current module chip through the current test environment component; the current module chip corresponds to the current test environment component;

[0132] Determine at least one function to be tested according to the acquired function enabling information, and call at least one function test component; the at least one function test component corresponds to the at least one function to be tested one by one;

[0133] Through each functional test component according to the preset test cases, the corresponding functions to be tested in the current module chip are tested.

[0134] In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

[0135] For each functional test component, the current functional test component calls the initialization component to initialize the current to-be-tested function of the current module chip; the current to-be-tested function corresponds to the current functional test component;

[0136] When the current module chip is initialized, the data generator is called through the current functional test component to generate current test data according to a preset test case, and the current test data is sent to the current module chip to instruct the current module chip to process the current test data using the current function to be tested, obtain current processed data, and feed back the current processed data;

[0137] The data collector is called by the current function test component to receive the current processing data, and the test result of the current function to be tested is determined according to the current processing data.

[0138] In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

[0139] Determine whether each initialization component in the current test environment component has completed initialization;

[0140] When all initialization components in the current test environment component have completed initialization, it is determined that the current module chip has completed initialization.

[0141] In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

[0142] Each test environment component communicates with the corresponding module chip through the same virtual interface component.

[0143] In one embodiment, a computer readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented:

[0144] Get the number of module chips of the core to be tested;

[0145] Determine at least one test environment component that matches the number of the module chips; the at least one test environment component corresponds one-to-one to the module chips of the core particles to be tested;

[0146] Run various test environment components in parallel, test corresponding module chips according to preset test cases through each test environment component, and obtain test results of each module chip.

[0147] In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

[0148] For each test environment component, obtaining function enabling information of a current module chip through the current test environment component; the current module chip corresponds to the current test environment component;

[0149] Determine at least one function to be tested according to the acquired function enabling information, and call at least one function test component; the at least one function test component corresponds to the at least one function to be tested one by one;

[0150] Through each functional test component according to the preset test case, the corresponding to-be-tested function in the current module chip is tested.

[0151] In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

[0152] For each functional test component, the current functional test component calls the initialization component to initialize the current to-be-tested function of the current module chip; the current to-be-tested function corresponds to the current functional test component;

[0153] When the current module chip is initialized, the data generator is called through the current functional test component to generate current test data according to a preset test case, and the current test data is sent to the current module chip to instruct the current module chip to process the current test data using the current function to be tested, obtain current processed data, and feed back the current processed data;

[0154] The data collector is called by the current function test component to receive the current processing data, and the test result of the current function to be tested is determined according to the current processing data.

[0155] In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

[0156] Determine whether each initialization component in the current test environment component has completed initialization;

[0157] When all initialization components in the current test environment component have completed initialization, it is determined that the current module chip has completed initialization.

[0158] In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

[0159] Each test environment component communicates with the corresponding module chip through the same virtual interface component.

[0160] In one embodiment, a computer program product is provided, comprising a computer program, which, when executed by a processor, implements the following steps:

[0161] Get the number of module chips of the core to be tested;

[0162] Determine at least one test environment component that matches the number of the module chips; the at least one test environment component corresponds one-to-one to the module chips of the core particles to be tested;

[0163] Run various test environment components in parallel, test corresponding module chips according to preset test cases through each test environment component, and obtain test results of each module chip.

[0164] In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

[0165] For each test environment component, obtaining function enabling information of a current module chip through the current test environment component; the current module chip corresponds to the current test environment component;

[0166] Determine at least one function to be tested according to the acquired function enabling information, and call at least one function test component; the at least one function test component corresponds to the at least one function to be tested one by one;

[0167] Through each functional test component according to the preset test cases, the corresponding functions to be tested in the current module chip are tested.

[0168] In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

[0169] For each functional test component, the current functional test component calls the initialization component to initialize the current to-be-tested function of the current module chip; the current to-be-tested function corresponds to the current functional test component;

[0170] When the current module chip is initialized, the data generator is called through the current functional test component to generate current test data according to a preset test case, and the current test data is sent to the current module chip to instruct the current module chip to process the current test data using the current function to be tested, obtain current processed data, and feed back the current processed data;

[0171] The data collector is called by the current function test component to receive the current processing data, and the test result of the current function to be tested is determined according to the current processing data.

[0172] In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

[0173] Determine whether each initialization component in the current test environment component has completed initialization;

[0174] When all initialization components in the current test environment component have completed initialization, it is determined that the current module chip has completed initialization.

[0175] In one embodiment, when the computer program is executed by a processor, the following steps are also implemented:

[0176] Each test environment component communicates with the corresponding module chip through the same virtual interface component.

[0177] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0178] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0179] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0180] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A core particle testing method, characterized in that: The method comprises: Get the number of module chips of the core to be tested; Determine at least one test environment component that matches the number of the module chips; the at least one test environment component corresponds one-to-one to the module chips of the core particles to be tested; Run various test environment components in parallel, test corresponding module chips according to preset test cases through each test environment component, and obtain test results of each module chip.

2. The method according to claim 1, characterized in that: The test environment component includes at least one functional test component, and the corresponding module chip is tested according to a preset test case through each test environment component, including: For each test environment component, obtaining function enabling information of a current module chip through the current test environment component; the current module chip corresponds to the current test environment component; Determine at least one function to be tested according to the acquired function enabling information, and call at least one function test component; the at least one function test component corresponds to the at least one function to be tested one by one; Through each functional test component according to the preset test case, the corresponding to-be-tested function in the current module chip is tested.

3. The method according to claim 2, characterized in that The functional test component includes an initialization component, a data generator and a data collector. The function to be tested in the current module chip is tested by each functional test component according to a preset test case, including: For each functional test component, the current functional test component calls the initialization component to initialize the current to-be-tested function of the current module chip; the current to-be-tested function corresponds to the current functional test component; When the current module chip is initialized, the data generator is called through the current functional test component to generate current test data according to a preset test case, and the current test data is sent to the current module chip to instruct the current module chip to process the current test data using the current function to be tested, obtain current processed data, and feed back the current processed data; The data collector is called by the current function test component to receive the current processing data, and the test result of the current function to be tested is determined according to the current processing data.

4. The method according to claim 3, characterized in that The initialization components of each functional test component in the same test environment component are run in series to determine whether the current module chip has completed the initialization process, including: Determine whether each initialization component in the current test environment component has completed initialization; When all initialization components in the current test environment component have completed initialization, it is determined that the current module chip has completed initialization.

5. The method according to any one of claims 1 to 4, characterized in that Each test environment component communicates with the corresponding module chip through the same virtual interface component.

6. A chip testing system, characterized in that: The system includes: a configuration component, a test environment component, a core particle to be tested, and a set of use cases; The configuration component is used to obtain the number of module chips of the core particle to be tested, and determine at least one test environment component that matches the number of module chips; the at least one test environment component corresponds to the module chips of the core particle to be tested one by one; The test environment component is used to obtain preset test cases from the test case set, and test the corresponding module chips according to the obtained test cases to obtain test results of each module chip; Wherein, the at least one test environment component runs in parallel.

7. The system according to claim 6, characterized in that The test environment component includes at least one functional test component; The configuration component is further used to obtain function enabling information of each module chip, and send the function enabling information of each module chip to the at least one test environment component; The test environment component is further used to obtain function enable information of the current module chip; the current module chip corresponds to the current test environment component; according to the obtained function enable information, at least one function to be tested is determined, and at least one function test component is called; The at least one functional test component corresponds one-to-one to the at least one function to be tested; The functional testing component is used to obtain preset test cases from the test case set, and test the corresponding to-be-tested function in the current module chip according to the obtained test cases.

8. The system according to claim 7, characterized in that The functional test component includes an initialization component, a data generator and a data collector; The initialization component is used to initialize the current function to be tested of the current module chip; the current function to be tested corresponds to the current functional test component; The data generator is used to obtain a preset test case from the case set when the current module chip completes initialization, generate current test data according to the obtained test case, and send the current test data to the current module chip to instruct the current module chip to process the current test data using the current function to be tested to obtain current processed data, and feed back the current processed data; The data collector is used to receive the current processing data and determine the test result of the current function to be tested according to the current processing data.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 5 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 5 are implemented.

11. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 5 are implemented.

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