Backlight module, manufacturing method thereof and display equipment

Abstract

The invention discloses a backlight module, a manufacturing method thereof and display equipment, and the backlight module comprises a substrate which comprises a first surface and a second surface which are opposite to each other; the light-emitting device is located on the side, away from the second surface, of the first surface; the first groove is formed in the first surface of the substrate; a first plane is arranged at the bottom of the first groove and is parallel to the second surface; the scattering structure is located on the side, away from the second surface, of the first plane and located at the bottom of the first groove. Therefore, the scattering structure is arranged on the first plane, so that when light rays which are totally reflected on the second surface of the substrate are transmitted to the first plane, the light rays are emitted from different angles under the action of the scattering structure, and when the light rays are emitted to the second surface of the substrate again, the light rays which are totally reflected can be reduced; therefore, dark rings generated by total reflection can be eliminated, and the backlight uniformity of the backlight module is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a backlight module, a manufacturing method thereof and a display device. Background Art

[0002] Passive light-emitting display devices mainly include a display panel and a backlight module, wherein the display panel is located on the light-emitting side of the backlight module, and the display panel is used to modulate the light emitted by the backlight module to realize image display. Mini Light Emitting Diode (Mini LED) backlight technology can increase the number of light-emitting devices without changing the display panel area by reducing the size of LED devices to the order of 100μm, thereby providing a higher brightness backlight. At the same time, the backlight is divided into many independently controllable areas, and the on and off or brightness of the light-emitting devices in each area can be accurately controlled according to the content of the picture to be displayed, so as to achieve a high contrast and high dynamic range display effect. As display devices continue to pursue better display effects, backlight modules also need to adapt to this trend. How to improve the uniformity of the backlight of the backlight module is currently the main concern. Summary of the invention

[0003] The embodiment of the present invention provides a backlight module, a manufacturing method thereof and a display device, which are used to improve the uniformity of the backlight of the backlight module.

[0004] In a first aspect, an embodiment of the present invention provides a backlight module, comprising:

[0005] a substrate substrate, the substrate substrate comprising opposing first and second surfaces;

[0006] a light emitting device, located on a side of the first surface facing away from the second surface;

[0007] A first groove is located on the first surface of the substrate; the bottom of the first groove has a first plane, and the first plane is parallel to the second surface;

[0008] The scattering structure is located on a side of the first plane away from the second surface and is located at the bottom of the first groove.

[0009] In a second aspect, an embodiment of the present invention provides a method for manufacturing a backlight module, comprising:

[0010] forming a first groove on a first surface of the base substrate;

[0011] forming a scattering structure on a first plane at the bottom of the first groove;

[0012] A light emitting unit is formed on a side of the first surface facing away from the second surface.

[0013] In a third aspect, an embodiment of the present invention provides a display device, including the backlight module as described in the first aspect above.

[0014] The beneficial effects of the present invention are as follows:

[0015] A backlight module, a manufacturing method thereof and a display device provided by an embodiment of the present invention include: a substrate, the substrate includes a first surface and a second surface opposite to each other; a light emitting device, located on the side of the first surface away from the second surface; a first groove, located on the first surface of the substrate; the bottom of the first groove has a first plane, the first plane is parallel to the second surface; a scattering structure, located on the side of the first plane away from the second surface, and located at the bottom of the first groove. In this way, by arranging the scattering structure on the first plane, when the light that is totally reflected on the second surface of the substrate is transmitted to the first plane, it is emitted from different angles under the action of the scattering structure, and when the light is emitted to the second surface of the substrate again, the light that is totally reflected can be reduced, thereby eliminating the dark ring caused by the total reflection, and improving the uniformity of the backlight of the backlight module. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a cross-sectional view of a backlight module in the prior art;

[0017] Figure 2 A cross-sectional view of a first backlight module provided in an embodiment of the present invention;

[0018] Figure 3 A schematic diagram of light propagation when no scattering structure is provided in the backlight module provided in an embodiment of the present invention;

[0019] Figure 4 A schematic diagram of light propagation when a scattering structure is provided in a backlight module provided in an embodiment of the present invention;

[0020] Figure 5 A top view of a base substrate in a backlight module provided in an embodiment of the present invention;

[0021] Figure 6 is a cross-sectional view of a second backlight module provided in an embodiment of the present invention;

[0022] Figure 7 A cross-sectional view of a third backlight module provided in an embodiment of the present invention;

[0023] Figure 8 A flow chart of a method for manufacturing a backlight module provided in an embodiment of the present invention;

[0024] Fig. 9 A schematic diagram of a partial backlight module manufacturing process provided in an embodiment of the present invention;

[0025] Fig.10 A top view of a part of the backlight module manufacturing process provided in an embodiment of the present invention;

[0026] Fig.11 A schematic diagram of another part of the backlight module manufacturing process provided in an embodiment of the present invention;

[0027] Fig.12 A schematic diagram of another part of the backlight module manufacturing process provided in an embodiment of the present invention;

[0028] Fig.13 A schematic diagram of another part of the backlight module manufacturing process provided in an embodiment of the present invention;

[0029] Fig.14 A schematic diagram of another part of the backlight module manufacturing process provided in an embodiment of the present invention;

[0030] Fig.15 A schematic diagram of another part of the backlight module manufacturing process provided in an embodiment of the present invention;

[0031] Fig.16 A schematic diagram of another part of the backlight module manufacturing process provided in an embodiment of the present invention;

[0032] Fig.17 A schematic diagram of another part of the backlight module manufacturing process provided in an embodiment of the present invention;

[0033] Fig.18 A schematic diagram of another part of the backlight module manufacturing process provided in an embodiment of the present invention;

[0034] Fig.19 A schematic diagram of another part of the backlight module manufacturing process provided in an embodiment of the present invention;

[0035] Fig. 20 A schematic diagram of another part of the backlight module manufacturing process provided in an embodiment of the present invention;

[0036] Fig.21 A schematic diagram of another part of the backlight module manufacturing process provided in an embodiment of the present invention;

[0037] Fig. 22 A schematic diagram of another part of the backlight module manufacturing process provided in an embodiment of the present invention;

[0038] Fig.23 A schematic diagram of the structure of a display device provided in an embodiment of the present invention;

[0039] Fig.24 The present invention is a schematic diagram of the structure of another display device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0040] The following will be combined with the accompanying drawings to describe in detail a backlight module, a manufacturing method thereof, and a specific implementation of a display device provided by an embodiment of the present invention. It should be noted that the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0041] Figure 1 The structure of a typical backlight module in the related art is shown in FIG. Figure 1 As shown, in the related art, the backlight module generally includes a lamp board 10 and a plurality of functional film layers stacked in sequence on the light emitting side of the lamp board 10 , wherein the plurality of film layers include a quantum dot film 20 and a diffusion film 30 .

[0042] Since the film layers such as the lamp panel 10, the quantum dot film 20 and the diffusion film 30 are independent film layer structures, they need to be assembled in a certain way, such as bonding different functional film layers by setting an adhesive layer. Therefore, based on this structure, it is difficult to further reduce the thickness of the backlight module, which makes it difficult to meet the development trend of thinner and lighter display devices.

[0043] In view of this, the present invention provides a backlight module, which is used to achieve a lighter and thinner backlight module and improve the uniformity of the backlight of the backlight module.

[0044] The embodiment of the present invention provides a backlight module, such as Figure 2 As shown, including:

[0045] A base substrate 100, the base substrate 100 comprises a first surface 101 and a second surface 102 opposite to each other;

[0046] The light emitting device 200 is located on a side of the first surface 101 away from the second surface 102;

[0047] The first groove G1 is located on the first surface 101 of the base substrate 100 ; the bottom of the first groove G1 has a first plane P1 , and the first plane P1 is parallel to the second surface 102 ;

[0048] The scattering structure 300 is located on a side of the first plane P1 away from the second surface 102 and is located at the bottom of the first groove G1 .

[0049] In this way, by setting a scattering structure on the first plane, when the light that is totally reflected on the second surface of the substrate is transmitted to the first plane, it is emitted from different angles under the action of the scattering structure. When the light is emitted to the second surface of the substrate again, the light that is totally reflected can be reduced, thereby eliminating the dark ring caused by total reflection and improving the uniformity of the backlight of the backlight module.

[0050] Among them, Figure 2 As shown, the base substrate 100 is used to carry other components arranged thereon. The shape and size of the base substrate 100 are adapted to the shape and size of the display device to which it is applied. Generally speaking, the shape of the base substrate 100 can be square, rectangular, etc. When applied to a special-shaped display device, the shape of the base substrate 100 can also be a special-shaped shape such as a circle, which is not limited here. The base substrate 100 can be made of a transparent substrate material commonly used in the field of display technology, such as optical glass and optical plastic, which is not limited here.

[0051] The base substrate 100 includes a first surface 101 and a second surface 102 relative to each other, wherein the first surface 101 is used to support other components in the backlight module, including the light-emitting device 200. The light emitted by the light-emitting device 200 is incident on the base substrate 100 from the side where the first surface 101 is located, and the second surface 102 serves as the light-emitting surface of the backlight module and can usually be a plane.

[0052] It should be understood that Figure 3 As shown, Figure 3 This is a schematic diagram of light propagation when no scattering structure is set. Figure 3 A light ray totally reflected on the second surface 102 is shown in the figure, and the light ray includes a first segment a1, a second segment a2 and a third segment a3. After totally reflecting the first segment a1 incident on the second surface 102, it becomes an outgoing light segment a2. Then, the second segment a2 propagates to the first plane P1. After reflecting the second segment a2 incident on the first plane P1, it becomes an outgoing light segment a3. Since the first plane P1 is parallel to the second surface 102, the third segment a3 is parallel to the first segment a1. After propagating to the second surface 102, the third segment a3 will continue to be totally reflected, which will cause a dark ring to appear on the light emitting surface of the backlight module, i.e., the second surface 102, thereby reducing the uniformity of the backlight of the backlight module.

[0053] like Figure 4 As shown, Figure 4 FIG. 1 is a schematic diagram of light propagation when a scattering structure 300 is provided on the first surface P1. For the sake of clarity, only a partial structure of the backlight module is shown. Figure 4A light ray totally reflected from the second surface 102 is shown in the figure, and the light ray includes a fourth segment a4, a fifth segment a5 and a sixth segment a6. After totally reflecting, the fourth segment a4 incident on the second surface 102 becomes an outgoing light segment a5, and then the fifth segment a5 propagates to the first plane P1 and enters the interior of the scattering structure 300. The scattering structure 300 is relatively thin, so the deflection of the light ray can be ignored. After reflecting, the fifth segment a5 incident on the surface of the scattering structure becomes an outgoing light segment a6. The sixth segment a6 is not parallel to the fourth segment a4, thereby reducing the probability of totally reflecting the sixth segment a6 again. That is, when the light ray totally reflected from the second surface 102 of the substrate substrate propagates to the first plane P1, it is emitted from different angles under the action of the scattering structure 300. When the light ray is emitted to the second surface 102 of the substrate substrate again, the light ray totally reflected can be reduced, thereby eliminating the dark ring caused by total reflection and improving the uniformity of the backlight of the backlight module.

[0054] Alternatively, if Figure 2 As shown, the scattering structure 300 includes: scattering units 301 arranged in an array, and the scattering units 301 are hemispherical. In this way, the scattering structure 300 provided with hemispherical scattering units 301 can emit light more evenly from various angles, thereby improving the uniformity of the backlight of the backlight module.

[0055] Of course, the shape of the scattering unit is not limited to a hemispherical shape, and may also be a hemispherical shape or other shapes, which are not specifically limited here.

[0056] Alternatively, if Figure 2 As shown, the scattering structure 300 covers the first surface P1, and the scattering units 301 are closely arranged. In this way, by providing closely arranged scattering units 301, and the scattering structure 300 composed of the scattering units 301 covers the first surface P1, when the light that is totally reflected on the second surface 102 of the base substrate 100 propagates to any position of the first plane P1, it can be emitted from different angles under the action of the scattering structure 300, further improving the uniformity of the backlight of the backlight module.

[0057] In order to clearly show the location of the scattering structure, Figure 5 As shown, Figure 5 is a top view of the substrate 100 from the side of the light emitting device. Figure 5 As can be seen in the figure, a first groove G1 is provided on the base substrate 1, a top view of a first plane P1 in the first groove G1 is in a circular ring shape, and the scattering structure 300 covers the first plane P1. It should be understood that for the sake of clarity, Figure 5 The specific structure of each scattering unit in the scattering structure 300 is not shown.

[0058] Optionally, the material of the scattering unit includes photoresist. Thus, the scattering unit is made of photoresist, which has a simple manufacturing process and low cost, and is conducive to the industrialized production of the backlight module.

[0059] Of course, the scattering unit may also be made of other materials known to those skilled in the art, and no specific limitation is made here.

[0060] When the scattering unit is manufactured by using photoresist, the photoresist needs to be spin-coated. In order to improve the quality of the spin-coating, the first groove is improved in the embodiment of the present invention.

[0061] like Figure 6 As shown, the first groove G1 has an edge region B, and the slope angle of the edge region B is greater than 90°. Figure 2 As shown, for Figure 2 In the first groove G1 shown, the slope angle at the first plane P1 can be considered to be 180°, and the slope angle at the edge of the first groove G1 is 90°, that is, the smaller the slope angle, the steeper the side wall of the first groove G1.

[0062] Thus, by setting the slope angle of the edge region in the first groove to be greater than 90°, the edge of the first groove is smooth, and when the photoresist is spin-coated, the photoresist is not easy to accumulate in the first groove, which is beneficial to the production of the scattering unit and improves the reliability of the backlight module. In addition, the slope angle of the edge region in the first groove is greater than 90°, which can also improve the exchange efficiency of the etching solution in the subsequent process and the spreading effect of the printing glue.

[0063] Furthermore, the slope angle of the edge region gradually decreases along the direction close to the edge of the first groove, and the minimum slope angle of the edge region is 140°. In this way, the slope angle gradually decreases, and the minimum slope angle is 140°, which further eliminates the accumulation of photoresist in the first groove, and the uniform light effect of the first groove will not be reduced due to the excessive slope angle.

[0064] Alternatively, if Figure 2 As shown, the backlight module also includes a first reflective layer 400, and the bottom of the first groove G1 also has a protruding structure T, and the surface of the protruding structure T covers the first reflective layer 400; the scattering structure 300 surrounds the first reflective layer 400, and the orthographic projection of the scattering structure 300 on the second surface 102 does not overlap with the orthographic projection of the first reflective layer 400 on the second surface 102.

[0065] In order to allow light to smoothly enter the interior of the base substrate, the first reflective layer only covers a portion of the inner surface of the first groove, and the light incident on the first groove is transmitted to the interior of the base substrate through the area not covered by the first reflective layer.

[0066] In this way, the first reflective layer can be used to reflect light around the first groove, scattering the light to achieve a uniform light effect. In addition, part of the bottom area of ​​the first groove can be raised upward to form a raised structure, and the first reflective layer covers the surface of the raised structure, adapting to the surface shape of the raised structure, which can further improve the uniform light effect.

[0067] For example, Figure 2 As shown, along the direction from the second surface 102 to the first surface 101, the cross-sectional area of ​​the protruding structure T gradually decreases, and the protruding structure T is formed into a cone-like structure, so that the first reflecting layer 400 covering the side wall of the protruding structure T forms an inclined slope or an inclined curved surface relative to the first surface 101, which is beneficial for the first reflecting layer 400 to reflect light to the surroundings of the protruding structure T, thereby improving the light utilization rate.

[0068] During the manufacturing process, when etching the base substrate 100 to open the first groove G1, a portion of the base substrate 100 located in the center area of ​​the first groove G1 may be retained, thereby forming a protruding structure T. For example, by etching the base substrate 100 using a wet etching process, the following protruding structure T may be formed: Figure 2 In the convex structure T shown, the depressions on both sides of the convex structure T are curved surfaces. Correspondingly, the first reflective layer 400 covering the sidewalls of the convex structure T forms an inclined curved surface relative to the first surface 101 .

[0069] In practical applications, the bottom of the first groove G1 may also be a flat structure, or a concave structure, or an uneven structure, or other structures, which are not specifically limited here.

[0070] Alternatively, if Figure 2 As shown, the first groove G1 is filled with a transparent filling portion 500 , and the transparent filling portion 500 is located on a side of the first reflective layer 400 and the scattering structure 300 away from the base substrate 100 .

[0071] In this way, the transparent filling part can support and bear the other structures arranged above it, and the light entering the first groove is incident on the interior of the base substrate through the interface between the transparent filling part and the base substrate. The refractive index of the transparent filling part can be set to be the same or similar to the refractive index of the base substrate, thereby reducing the reflection loss of light at the interface between the transparent filling part and the base substrate and improving the utilization rate of light.

[0072] Alternatively, if Figure 2 As shown, a second reflective layer 600 is disposed on the side of the first surface 101 facing away from the second surface 102 . The second reflective layer 600 has an opening K. The orthographic projection of the opening K on the second surface 102 falls within the orthographic projection of the first groove G1 on the second surface 102 .

[0073] The possible relative position relationship between the opening K of the second reflective layer 600 and other structures in the first groove G1 is as follows:

[0074] The orthographic projection of the top of the protruding structure T on the second surface 102 falls within the orthographic projection of the opening K on the second surface 102, so that the first reflective layer 400 covering the surface of the protruding structure T can be fully utilized to reflect the light incident from the opening K to the surroundings of the protruding structure T, thereby improving the uniformity of the reflected light.

[0075] In addition, the second reflective layer 600 located between the edge of the opening K and the edge of the first groove G1 protrudes toward the inner side of the first groove G1 relative to the edge of the first groove G1, and the transparent filling part 500 can support the portion of the second reflective layer 600 protruding toward the inner side of the first groove G1 relative to the edge of the first groove G1, so that it does not contact the inner wall of the first groove G1, so that the portion of the second reflective layer 600 located on the inner side of the first groove G1 forms an eaves structure relative to the first groove G1, and the eaves structure can be used to reflect the light emitted by the first reflective layer 400, prevent the light from leaking from the side of the first groove G1 facing the light-emitting device 200 and causing loss, thereby improving the utilization rate of the light.

[0076] Alternatively, if Figure 6 As shown, the backlight module may further include a color conversion layer 700, and the color conversion layer 700 fills the opening K of the second reflective layer 600. The color conversion layer 700 is used to convert the color of the light emitted by the light emitting device 200 to convert the color of the light emitted by the light emitting device 200 into a desired color. The color conversion layer 700 may be made of a fluorescent material or a quantum dot material, which is not limited here. For example, the light emitting device 200 may be a blue light LED, and the color conversion layer 700 may be made of a quantum dot material, and the color conversion layer 700 may convert the blue light emitted by the light emitting device 200 into white light for backlighting.

[0077] In addition, if Figure 6 As shown, the surface of the color conversion layer 700 facing away from the base substrate 100 can be set to be flush with the surface of the second reflective layer 600 facing away from the base substrate 100, or set to be higher than the surface of the second reflective layer 600 facing away from the base substrate 100 ( Figure 6 (not shown), the surface of the color conversion layer 700 facing the base substrate 100 can be set to be flush with the surface of the second reflective layer 600 facing the base substrate 100 ( Figure 6The color conversion layer 700 is not shown in the figure), or is set to be lower than the surface of the second reflective layer 600 facing the base substrate 100, thereby changing the thickness of the color conversion layer 700, and the specific thickness of the color conversion layer 700 can be set as needed. When the color conversion layer 700 is set thicker, the color of the incident light can be fully converted. When the color conversion layer 700 is set thinner, the backlight module can be made thinner. The specific thickness of the color conversion layer 700 is not limited here.

[0078] Alternatively, if Figure 7 As shown, the backlight module further includes a light extraction structure 900, which is located on a side surface of the second reflective layer 600 away from the second surface 102. The light extraction structure is also provided with an opening, which is provided corresponding to the opening of the second reflective layer 600, and the light extraction structure 900 can be made of, but not limited to, non-transparent materials such as metal materials.

[0079] In this way, by setting up a light-collecting structure, the light entering the base substrate can be controlled. When the backlight module includes multiple light-emitting devices, by controlling the opening size of the light-collecting structure corresponding to each light-emitting device, the light incident on the base substrate by each light-emitting device can be controlled, thereby achieving regulation of the brightness of each location on the light-emitting surface of the backlight module, thereby improving the uniformity of the backlight of the backlight module.

[0080] Alternatively, if Figure 7 As shown, the first surface 101 is provided with a plurality of second grooves G2 arranged in an array, and the second grooves G2 surround the first grooves G1; the backlight module also includes a light homogenizing structure 800, and the light homogenizing structure 800 is formed by a high reflectivity material filled in the second grooves G2.

[0081] The high reflectivity material includes but is not limited to titanium dioxide, barium oxide and other materials, and the reflectivity of the light uniforming structure 800 and the second reflective layer 600 to the light can be different. The shape of the orthographic projection of the second groove G2 on the second surface 102 can be but is not limited to any one or more of a circle, a square, an ellipse, a rectangle, a polygon, etc., which is not specifically limited here. In addition, if Figure 5 As shown, from Figure 5 It can be clearly seen that the second grooves G2 are arranged in an array, and the second grooves G2 surround the first grooves G1.

[0082] In this way, the light homogenizing structure can receive the light reflected by the first reflective layer and incident on the light homogenizing structure through the base substrate, and scatter the part of the light, thereby further improving the backlight brightness uniformity of the backlight module.

[0083] In addition, since the refractive index of the base substrate is greater than that of air, light at some angles may be totally reflected inside the base substrate and cannot be emitted from the second surface to the outside of the base substrate for backlighting, resulting in poor light extraction capability of the base substrate. By adjusting the scattering angle of the light homogenization structure, the angle range of light emitted from the scattering protrusions is changed, so that most of the light is incident on the second surface at an angle less than the total reflection angle, and is emitted from the second surface to the outside of the base substrate for backlighting, thereby improving the light extraction efficiency of the backlight module.

[0084] In addition, when the slope angle of the edge area of ​​the first groove is set to be relatively large, the light homogenization effect of the light homogenization structure will be affected. In this case, the light homogenization structure can be rearranged to make adjustments and still ensure the required light homogenization effect.

[0085] Alternatively, if Figure 7 As shown, the backlight module also includes a wiring structure layer Z, which is located between the base substrate 100 and the light-emitting device 200, and the orthographic projection of the wiring structure layer Z on the second surface 102 and the orthographic projection of the color conversion layer 700 on the second surface 102 are staggered with each other to avoid blocking the light propagation path between the light-emitting device 200 and the color conversion layer 700.

[0086] In addition, a driving circuit is formed in the wiring structure layer Z, and the driving circuit is used to drive the light-emitting device 20 to emit light. The wiring structure layer Z may also include a pad, and the light-emitting device 200 is electrically connected to the driving circuit in the wiring structure layer Z through the pad. When the surface of the color conversion layer 700 facing away from the base substrate 100 is set to be flush with the surface of the second reflective layer 600 facing away from the base substrate 100, the color conversion layer 700 will not occupy the space between the wiring structure layer Z and the first groove G1, so that the thickness of the wiring structure layer Z can be small enough to meet the design requirements of the thin and light backlight module.

[0087] like Figure 7 As shown, the backlight module further includes a first encapsulation layer F1, which is located between the light extraction structure 900 and the light emitting device 200, and the first encapsulation layer F1 is disposed on the entire surface. The first encapsulation layer F1 may be a single-layer structure or a multi-layer structure, for example, a single-layer organic film or inorganic film, or an organic film and an inorganic film alternately stacked, which is not specifically limited here.

[0088] In this way, the first encapsulation layer can protect the color conversion layer and other film layers, thereby reducing the risk of water and oxygen corrosion causing the color conversion layer to fail. In addition, the first encapsulation layer can also provide a relatively flat surface for forming the wiring structure layer, so as to improve the accuracy of the wiring structure layer preparation process, which is conducive to improving its electrical performance.

[0089] like Figure 7As shown, the backlight module may further include a second encapsulation layer F2, which is located on the side of the light emitting device 200 away from the second surface 102, and the second encapsulation layer F2 is disposed on the entire surface. The second encapsulation layer F2 may be made of a material with a high reflectivity, such as white oil or white glue, which is not limited here. In this way, the light may be reflected into the opening of the second reflective layer 600 to improve the utilization rate of the light, and the light emitting device 200 and other film layers may be protected.

[0090] Based on the same inventive concept, the embodiment of the present invention also provides a method for manufacturing a backlight module, such as Figure 8 As shown, including:

[0091] S801, forming a first groove on a first surface of a base substrate;

[0092] S802, forming a scattering structure on a first plane at the bottom of the first groove;

[0093] S803 , forming a light-emitting unit on a side of the first surface facing away from the second surface.

[0094] In this way, by forming a scattering structure on the first plane, when the light that is totally reflected on the second surface of the substrate is transmitted to the first plane, it is emitted from different angles under the action of the scattering structure. When the light is emitted to the second surface of the substrate again, the light that is totally reflected can be reduced, thereby eliminating the dark ring caused by total reflection and improving the uniformity of the backlight of the backlight module.

[0095] Optionally, forming the first groove on the first surface of the substrate includes: performing dry etching on the first surface; forming the first groove on the first surface, wherein the slope angle of the edge area of ​​the first groove is greater than 90°. The dry etching includes but is not limited to ashing with oxygen.

[0096] In this way, by performing dry etching treatment on the first surface of the substrate, the dry etching treatment can modify the substrate, change the internal structure of the substrate, thereby affecting the etching rate, and the dry etching treatment can increase the roughness of the first surface, and improve the first surface's permeation effect on the etching liquid in the subsequent etching process, so that when etching to form the first groove, the etching liquid can be drilled on the surface of the substrate, and the etching rate in the direction parallel to the first surface can be increased, so that the etching liquid can penetrate the first surface and penetrate to the bottom of the mask, so that the etching rate of the substrate parallel to the first surface is greater than the etching rate in the direction perpendicular to the first surface, and after etching to form the first groove, the slope angle of the edge area of ​​the first groove is greater than 90°. In addition, after the first surface of the substrate is dry-etched, the time for forming the first groove can be reduced, and the production efficiency of the backlight module can be improved.

[0097] It should be understood that when the first surface is not dry-etched, the ratio of the lateral and longitudinal etching rates of the etching solution on the substrate substrate is 1:1. After the first surface is dry-etched, the lateral etching rate of the substrate substrate can be increased, thereby changing the ratio of the lateral and longitudinal etching rates, thereby increasing the slope angle of the edge area.

[0098] Optionally, forming a first groove on the first surface of the substrate includes: forming an etching material layer in a partial area of ​​the first surface; forming the first groove on the first surface, wherein the orthographic projection of the etching material layer on the second surface overlaps with the orthographic projection of an edge area of ​​the first groove on the second surface, and the slope angle of the edge area is greater than 90°. The material of the etching material layer includes, but is not limited to, metal materials such as aluminum, copper, and silver.

[0099] In this way, by forming an etching material layer, when etching to form the first groove, the etching material layer is etched first due to its higher etching rate, so that the etching solution is filled to the position of the etching material layer, and the substrate is continuously etched from the position of the etching material layer, thereby increasing the etching rate of the substrate in a direction parallel to the first surface, thereby making the etching rate in a direction parallel to the first surface greater than the etching rate in a direction perpendicular to the first surface. After etching to form the first groove, the slope angle of the edge area of ​​the first groove is greater than 90°, and the slope angle of the edge area of ​​the first groove can be adjusted by changing the length and width of the etching material layer.

[0100] The following is an explanation of the method for preparing the backlight module provided by the embodiment of the present invention in conjunction with specific embodiments.

[0101] Step S1: Fig. 9 As shown, a first groove G1 is formed on the first surface 101 of the base substrate 100 .

[0102] The specific process may include: forming a first mask M1 on the first surface 101 of the base substrate 100, the first mask M1 having an opening at a position corresponding to the first groove G1, etching the base substrate 100 exposed by the opening of the first mask M1 with an etching liquid to form the first groove G1. The first mask may be made of, but not limited to, metal Mo, the etching liquid may be made of, but not limited to, HF (hydrofluoric acid), and the etching liquid flows in a direction parallel to the first surface during the etching process, the opening of the first mask M1 may be an annular opening, part of the first mask M1 is located in the outer area of ​​the annular opening, and part of the first mask M1 is located in the area surrounded by the annular opening, so that when etching the base substrate 100, the first groove G1 and the convex structure T at the bottom of the first groove G1 may be formed simultaneously, wherein the position at the bottom of the first groove G1 corresponding to the opening of the first mask M1 will form a first plane P1 due to the same etching rate, and the area covered by the first mask will be corroded by the etching liquid due to isotropy to form a 1 / 4 circle structure, that is, Fig. 9 The structure shown.

[0103] In addition, in order to clearly show the morphology of the first mask, as shown in FIG. Fig.10 As shown, Fig.10 FIG. 1 is a top view after a first mask is formed on the first surface of the substrate. The black filled area in the figure is the area of ​​the first surface covered by the first mask, and the area not filled with black is the opening of the first mask, exposing the substrate. Fig.10 It can be seen that the opening of the first mask is ring-shaped.

[0104] Step S2: Fig.11 As shown, a first reflective layer 400 is formed at the bottom of the first groove G1.

[0105] The specific process may include: after forming the first groove G1, the first mask may be retained, and the first reflective layer 400 may be formed by sputtering deposition or the like. During the sputtering deposition process, the reflective material partially covers the surface of the protruding structure T to form the first reflective layer 400, and the remaining part is deposited on the surface of the first mask, and then the first mask and the reflective material thereon are removed together.

[0106] Step S3: Fig.12 As shown, a scattering structure 300 is formed on a first plane P1 at the bottom of the first groove G1.

[0107] The specific process may include: after forming the first reflective layer 400, spin coating the photoresist PR in the first groove G1, and after exposing and developing the photoresist PR, a scattering structure 300 consisting of scattering units 301 with specific morphology can be formed. The scattering units 301 with specific morphology, such as hemispherical, can be formed through different exposure and development processes.

[0108] Step S4: Fig.13 As shown, a transparent filling portion 500 is filled in the first groove G1.

[0109] The specific process may include: depositing a transparent filling portion 500 in the first groove G1, and after completing step S4, the following may be formed: Fig.13 The structure shown.

[0110] Step S5: Fig.14 As shown, a second reflective layer 600 is formed on the first surface 101 and the transparent filling part 500 .

[0111] The specific process may include: forming a whole layer of the second reflective layer 600 on the transparent filling part 500 and the first surface 101 by sputtering deposition or the like, and then forming a second mask M2 on the second reflective layer 600, wherein the second mask M2 has an opening at a position corresponding to the first groove G1, and an opening K may be formed on the second reflective layer 600 by an etching process.

[0112] Step S6: Fig.15 As shown, a first encapsulation layer F1 is formed on the second reflective layer 600 .

[0113] The specific process may include: forming the first encapsulation layer F1 on the entire surface by sputtering deposition or the like, and performing a planarization process. After completing step S6, the following may be formed: Fig.15 The structure shown.

[0114] Step S7: Fig.16 As shown, a wiring structure layer Z is formed on the side of the first packaging layer F1 away from the substrate 100. After completing step S7, the following can be formed: Fig.16 In the structure shown, the pattern of the routing structure layer Z can be designed according to requirements and is not limited here.

[0115] Step S8: Fig.17 As shown, the light emitting device 200 is connected on the wiring structure layer Z. After completing step S8, the following can be formed: Fig.17 In the structure shown, the light emitting device 200 can be connected to a set position of the wiring structure layer Z by welding or bonding.

[0116] Step S9: Fig.18 As shown, a second encapsulation layer F2 is formed on the light emitting device 200 .

[0117] The specific process may include: forming the second encapsulation layer F2 on the entire surface by sputtering deposition or the like, and performing a planarization process. After completing step S9, the following may be formed: Fig.18 The structure shown.

[0118] Optionally, in some embodiments of the present invention, before step S1, the first surface of the substrate is further treated with dry etching. The specific process may include: using oxygen to ash the first surface, and then performing step S1 after the ashing is completed. After performing step S1, the following can be obtained: Fig.19 The structure shown.

[0119] Optionally, in some embodiments of the present invention, before step S1, the method further includes: Fig. 20 As shown, an etching material layer C is formed on the first surface 101 of the substrate 100. The specific process may include: forming an etching material layer C on the first surface 101 of the substrate 100, and then performing step S1, and the etching material layer surrounds the opening of the first mask layer in step S1. After performing step S1, the following can be obtained: Fig.19 The structure shown.

[0120] Optionally, in some embodiments of the present invention, before step S1, the method further includes: Fig.21 As shown, a light homogenizing structure 800 is formed on the first surface 101 of the base substrate 100. The specific process may include: firstly forming a third mask M3 on the first surface 101 of the base substrate 100, the third mask M3 has a plurality of openings exposing the base substrate 100, then etching the base substrate 100 through the third mask M3 to form a plurality of second grooves G2, and filling the second grooves G2 with a high reflectivity material ( Fig.21 The light homogenizing structure 800 is formed by removing the third mask M3 and then performing subsequent processes. In practical applications, the first groove G1 may be made first, and then the second groove G2 may be opened on the first surface 101 of the base substrate 100, which is not limited here.

[0121] Optionally, in some embodiments of the present invention, between step S5 and step S6, the following steps are further included: Fig. 22 As shown, a color conversion layer 700 is formed at the opening K. The specific process may include: after forming the second reflective layer 600, the second mask may be retained, the color conversion material is evenly distributed in a suitable solvent (such as an organic solvent) to form a solution, the solution is coated in the opening K, and then cured to form the color conversion layer 700, and then the second mask is removed, and then the color conversion layer 700 can be obtained. Fig. 22 Of course, when the surface of the color conversion layer facing away from the substrate is higher than the surface of the second reflective layer facing away from the substrate, the color conversion layer can be set thicker with the help of the second mask, or, when the surface of the color conversion layer facing the substrate is lower than the surface of the second reflective layer facing the substrate, a groove can be set in the transparent filling part, and a solution formed by the color conversion material can be coated in the groove, so as to form a thicker color conversion layer.

[0122] In practical applications, the method for manufacturing the backlight module provided by the present invention can also be adjusted according to the specific structure of the backlight module provided by the present invention, which will not be described in detail here.

[0123] In this way, the backlight module can be manufactured through the above steps S1 to S9. The obtained backlight module includes a scattering structure, which improves the uniformity of the backlight of the backlight module.

[0124] Based on the same inventive concept, an embodiment of the present invention further provides a display device, the implementation principle of the display device is similar to the implementation principle of the aforementioned backlight module. The specific implementation method of the display device can refer to the embodiment of the aforementioned backlight module, and the repeated parts will not be repeated.

[0125] Specifically, an embodiment of the present invention provides a display device, such as Fig.23 As shown, it includes the backlight module 1 as described above. The display device further includes a display panel 2, which is located on a side of the base substrate 100 away from the light emitting device 200.

[0126] Alternatively, if Fig.24 As shown, the display panel 2 may be a liquid crystal display panel, and the display panel 2 includes an array substrate 21 and an opposite substrate 22 that are arranged opposite to each other, and a liquid crystal layer 23 located between the array substrate 21 and the opposite substrate 22. Fig.24 As shown, the base substrate 100 of the backlight module 1 can be reused as the substrate of the array substrate 21, that is, the film layer structure of the array substrate 21 can be directly manufactured on the surface of the base substrate 100 of the backlight module 1, thereby further reducing the thickness of the display device. In some embodiments, the base substrate 100 of the backlight module 1 can also be reused as the substrate of the opposite substrate 22 ( Fig.24 That is to say, the film layer structure of the opposite substrate 22 can be directly manufactured on the surface of the base substrate 100 of the backlight module, and the specific arrangement of the display panel 2 is not limited here.

[0127] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A backlight module, characterized in that: include: a substrate substrate, the substrate substrate comprising opposing first and second surfaces; a light emitting device, located on a side of the first surface facing away from the second surface; A first groove is located on the first surface of the substrate; The bottom of the first groove has a first plane, and the first plane is parallel to the second surface; The scattering structure is located on a side of the first plane away from the second surface and is located at the bottom of the first groove.

2. The backlight module according to claim 1, characterized in that: The scattering structure includes: scattering units arranged in an array, and the scattering units are hemispherical.

3. The backlight module according to claim 2, characterized in that: The scattering structure covers the first surface, and the scattering units are closely arranged.

4. The backlight module according to claim 2, wherein: The material of the scattering unit includes photoresist.

5. The backlight module according to claim 1, wherein: The first groove has an edge region, and the slope angle of the edge region is greater than 90°.

6. The backlight module according to claim 5, characterized in that: The slope angle of the edge region gradually decreases along a direction approaching the edge of the first groove, and the minimum slope angle of the edge region is 140°.

7. The backlight module according to claim 1, wherein: The backlight module further includes a first reflective layer, the bottom of the first groove further includes a convex structure, and the surface of the convex structure covers the first reflective layer; The scattering structure surrounds the first reflective layer, and an orthographic projection of the scattering structure on the second surface does not overlap with an orthographic projection of the first reflective layer on the second surface.

8. The backlight module according to claim 7, characterized in that: The first groove is filled with a transparent filling portion, and the transparent filling portion is located on a side of the first reflective layer and the scattering structure away from the base substrate.

9. The backlight module according to claim 1, wherein: A second reflective layer is disposed on a side of the first surface facing away from the second surface. The second reflective layer has an opening. The orthographic projection of the opening on the second surface falls within the orthographic projection of the first groove on the second surface.

10. The backlight module according to claim 1, wherein: The first surface is provided with a plurality of second grooves arranged in an array, and the second grooves surround the first grooves; The backlight module further includes a light homogenizing structure, and the light homogenizing structure is formed by a high reflectivity material filled in the second groove.

11. A method for manufacturing a backlight module, characterized in that: include: forming a first groove on a first surface of the base substrate; forming a scattering structure on a first plane at the bottom of the first groove; A light emitting unit is formed on a side of the first surface facing away from the second surface.

12. The method according to claim 11, characterized in that: Forming a first groove on a first surface of the substrate includes: Performing dry etching on the first surface; A first groove is formed on the first surface, and a slope angle of an edge area of ​​the first groove is greater than 90°.

13. The manufacturing method according to claim 11, characterized in that: Forming a first groove on a first surface of the substrate includes: forming an etching material layer in a partial area of ​​the first surface; A first groove is formed on the first surface, and the orthographic projection of the etching material layer on the second surface overlaps with the orthographic projection of an edge area of ​​the first groove on the second surface, and the slope angle of the edge area is greater than 90°.

14. A display device, characterized in that: It comprises the backlight module as described in any one of claims 1-10.

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