Array substrate mother board, cutting method thereof and display device

Abstract

The invention provides an array substrate mother board, a cutting method thereof and a display device, at least one side in a fixed area of the array substrate mother board is provided with a fixed binding part, the array substrate mother board further comprises a to-be-cut part connected to the fixed binding part, at least part, away from the fixed binding part, of the to-be-cut part is used for being cut off, the length of the to-be-cut part is larger than or equal to 118 micrometers, and the length of the to-be-cut part is larger than or equal to 118 micrometers. Therefore, the phenomenon that photomasks of different specifications are adopted to manufacture display devices with frames of different sizes is avoided, and the product design and development cost is reduced.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to an array substrate motherboard and a cutting method thereof, and a display device. Background Art

[0002] At present, display panels need to be patterned with the aid of a mask to form display areas and non-display areas, that is, each mask of a certain specification can only form a display panel with a corresponding frame size. However, the market demand for display panels with different frame sizes is increasing, resulting in a mask of a certain specification being unable to meet the production of display panels with multiple frame sizes. Therefore, multiple masks of different specifications are required to form display panels with multiple frame sizes, which greatly increases the cost of product design and development. Summary of the invention

[0003] The purpose of the present invention is to provide an array substrate motherboard and a cutting method thereof, and a display device, which solves the technical problem that display panels with different frame sizes need to be produced through masks of different specifications, resulting in high product design and development costs.

[0004] In a first aspect, an embodiment of the present invention provides an array substrate motherboard, comprising:

[0005] A fixing area, wherein at least one side of the fixing area is provided with a fixing binding portion;

[0006] The portion to be cut is connected to the fixed binding portion, at least a portion of the portion to be cut away from the fixed binding portion is used to be cut off, and the length of the portion to be cut is greater than or equal to 118 microns.

[0007] In a second aspect, an embodiment of the present invention provides a method for cutting an array substrate motherboard, which is used for cutting the array substrate motherboard as described above, comprising:

[0008] A portion of the portion to be cut away from the fixed binding portion is cut to remove a corresponding portion of the portion to be cut.

[0009] In a third aspect, an embodiment of the present invention provides a display device, comprising:

[0010] The array substrate is obtained by cutting off a portion of the to-be-cut portion away from the fixing and binding portion in any one of the array substrate motherboards described above.

[0011] In a fourth aspect, an embodiment of the present invention provides another display device, comprising a display area and a non-display area located at least on one side of the display area, including:

[0012] substrate;

[0013] A pixel layer, located on the substrate and in the display area;

[0014] a first metal layer, located on the substrate and in the non-display area, the first metal layer being electrically connected to the pixel layer, the first metal layer comprising an electrically connected binding portion and an extending portion, the extending portion being located on a side of the binding portion away from the display area, and the width of the binding portion being greater than the width of the extending portion;

[0015] Wherein, the length of the extension portion is greater than or equal to 118 microns.

[0016] In a fifth aspect, an embodiment of the present invention provides yet another display device, comprising a display area and a non-display area located at least on one side of the display area, comprising:

[0017] substrate;

[0018] A pixel layer, located on the substrate and in the display area;

[0019] A first metal layer is located on the substrate and in the non-display area. The first metal layer is electrically connected to the pixel layer. The first metal layer includes a first sub-binding portion, a second sub-binding portion, and a connecting portion electrically connected between the first sub-binding portion and the second sub-binding portion. The width of the first sub-binding portion and the width of the second sub-binding portion are both greater than the width of the connecting portion.

[0020] The present invention provides an array substrate motherboard and a cutting method thereof, and a display device. The array substrate motherboard includes a fixed area, at least one side of the fixed area is provided with a fixed binding portion, the array substrate motherboard also includes a to-be-cut portion connected to the fixed binding portion, at least a portion of the to-be-cut portion away from the fixed binding portion is used to be cut off, and the length of the to-be-cut portion is greater than or equal to 118 microns, so that before leaving the factory, the extension portion can be cut to a corresponding length portion according to the frame size requirements of the display device, thereby meeting the frame size required by the display device, and can avoid using different specifications of masks to produce display devices with frames of different sizes. Display devices with frames of different sizes can be produced only by redundantly setting the length of the extension portion before leaving the factory, thereby reducing the product design and development cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 and Figure 2 A top view of an array substrate motherboard provided in an embodiment of the present invention.

[0022] Figure 3 A top view of a display device provided by an embodiment of the present invention.

[0023] Figure 4 and Figure 5 A circuit layout diagram of a partial structure of a display device is provided for an embodiment of the present invention.

[0024] Figure 6 A cross-sectional view of a display device provided by an embodiment of the present invention.

[0025] Figure 7 A cross-sectional view of a partial structure of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0026] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0027] The terms "first", "second", etc. in the present invention are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or modules is not limited to the listed steps or modules, but may optionally include steps or modules that are not listed, or may optionally include other steps or modules that are inherent to these processes, methods, products or devices.

[0028] Reference to "embodiment" in this document means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments. In addition, it should be noted that the drawings only provide structures that are closely related to the present invention, and some details that are not closely related to the invention are omitted. The purpose is to simplify the drawings and make the inventive point clear at a glance, rather than to indicate that the actual device is the same as the attached drawings. Figure 1 The same is not a limitation of the actual device.

[0029] The present invention provides an array substrate motherboard, which includes but is not limited to the following embodiments and combinations of the following embodiments.

[0030] In some embodiments, Figure 1 and Figure 2 As shown, the array substrate motherboard 200 includes: a fixed area a1, at least one side of the fixed area a1 is provided with a fixed binding portion 201; a portion to be cut 202, connected to the fixed binding portion 201, at least a portion of the portion to be cut 202 away from the fixed binding portion 201 is used to be cut off, and the length of the portion to be cut 202 is greater than or equal to 118 microns.

[0031] The array substrate motherboard 200 may be a rigid substrate, and the array substrate motherboard 200 may be used to form a plurality of array substrates, each of which is used to form a corresponding display device. The array substrate motherboard 200 may include adjacent fixed areas a1 and non-fixed areas a2, the to-be-cut portion 202 is located in the non-fixed area a2, the fixed area a1 includes a display area A of the corresponding display device and a non-display area B surrounding the display area A, and the fixed binding portion 201 is located in the corresponding non-display area B.

[0032] It can be understood that in this embodiment, the array substrate motherboard 200 is configured to include a portion 202 to be cut located on a side of the fixed binding portion 201 away from the display area A, and at least a portion of the portion 202 to be cut away from the fixed binding portion 201 is used to be cut off. Specifically, in the array substrate motherboard 200, the length of the portion 202 to be cut is set to a corresponding range according to the range of the frame size requirements of the display device, and later the portion 202 to be cut is cut to a corresponding length according to the frame size requirements of the display device, so that the sum of the lengths of the fixed binding portion 201 and the retained portion of the portion 202 to be cut together constitutes the frame size of the display device. Therefore, it is possible to avoid using masks of different specifications to produce display devices with frame sizes of different sizes, and display devices with frame sizes of different sizes can be produced only by redundantly setting the length of the portion 202 to be cut before leaving the factory, thereby reducing the cost of product design and development.

[0033] It should be noted that the present embodiment takes into account the cutting precision of the cutting device, that is, assuming that the portion to be cut 202 needs to be completely removed, the portion of the fixed binding portion 201 with a length of 118 microns close to the portion to be cut 202 may actually be removed more. Therefore, the length of the portion to be cut 202 in the present embodiment is greater than or equal to 118 microns, which can avoid damage to the fixed binding portion 201 due to the cutting precision of the cutting device.

[0034] In some embodiments, Figure 1 and Figure 2 As shown, the portion to be cut 202 includes a first extension portion 2021 , the first extension portion 2021 includes an area used as a cutting position of the portion to be cut 202 , and the width of the fixed binding portion 201 is greater than the width of the first extension portion 2021 .

[0035] Combined with the above discussion, it can be known that the first extension portion 2021 can be the part of the to-be-cut portion 202 away from the fixed area a1. When the to-be-cut portion 202 is cut, since the first extension portion 2021 is closest to the outer edge of the non-fixed area a1, it can be used as the cut-off position.

[0036] Similarly, when the cutting position is located at one end of the first extension portion 2021 close to the fixed area a1, taking into account the cutting accuracy of the cutting device, in order to reduce the cutting to other areas in the fixed binding portion 201 or the portion to be cut 2021, the length of the first extension portion can also be set to be greater than or equal to 118 microns.

[0037] It should be noted that since the fixed binding portion 201 remaining in the display device needs to be bound to other circuits, and the first extension portion 2021 is at risk of being cut, in order to save materials and facilitate cutting, the width of the first extension portion 2021 can be set smaller.

[0038] In some embodiments, Figure 1 As shown, the first extension portion 2021 is in contact with the fixed binding portion 201. That is, no other structure is provided between the first extension portion 2021 and the fixed binding portion 201 at this time, and the first extension portion 2021 can be cut into corresponding lengths to form a display device with corresponding frame size.

[0039] In some embodiments, Figure 2 As shown, the portion to be cut 202 also includes a second extension portion 2022 and a non-fixed binding portion 2023 connected between the first extension portion 2021 and the second extension portion 2022, the second extension portion 2022 includes an area used as a resection position for the portion to be cut 202, and the width of the fixed binding portion 201 is greater than the width of the second extension portion 2022.

[0040] Combined with the above discussion, it can be seen that this embodiment and Figure 1 The difference between the embodiment shown is that in this embodiment, a second extension portion 2022 and a non-fixed binding portion 2023 are provided between the first extension portion 2021 and the fixed binding portion 201. In addition to the first extension portion 2021, the second extension portion 2022 can also be used as a cutting position of the to-be-cut portion 202, which increases the selection of positions in the to-be-cut portion 202. At the same time, the non-fixed binding portion 2023 is not cut off but remains in the display device, and the non-fixed binding portion 2023 can also be bound to other circuits.

[0041] Similarly to the above discussion, the width of the second extension portion 2022 can also be set to be smaller to save material and facilitate cutting.

[0042] Similarly, when the cutting position is located at one end of the second extension portion 2022 close to the fixed area a1, taking into account the cutting accuracy of the cutting device, in order to reduce the cutting to other areas in the fixed binding portion 201 or the portion to be cut 202, the length of the second extension portion 2022 can also be set to be greater than or equal to 118 microns.

[0043] Further, such as Figure 2 As shown, the first extension portion 2021 is located on a side of the non-fixed binding portion 2023 away from the fixed area a1 , and the length of the first extension portion 2021 is greater than or equal to the length of the second extension portion 2022 .

[0044] It can be understood that since the cutting position is on either the first extension portion 2021 or the second extension portion 2022, at least a portion of the first extension portion 2021 that is farther away from the fixed area a1 will be cut, and the second extension portion 2022 is more likely to remain in the display device, the length of the second extension portion 2022 is set to be smaller here, so as to maximize the screen-to-body ratio of the display device.

[0045] The present invention also provides a method for cutting an array substrate motherboard, which is used for cutting any array substrate motherboard as described above, and includes but is not limited to the following steps:

[0046] S1, cutting a portion of the portion to be cut away from the fixed binding portion to remove a corresponding portion of the portion to be cut.

[0047] Combined with the above discussion, it can be known that in the array substrate motherboard 200, the length of the portion to be cut 202 can be set to a corresponding range according to the range of the frame size requirements of the display device, and the portion to be cut 202 is cut to a corresponding length according to the frame size requirements of the display device in the later stage to remove the corresponding portion of the portion to be cut 202, thereby obtaining a display device with a frame size that meets the requirements. Since display devices with frames of different sizes can be manufactured only by redundantly setting the length of the portion to be cut 202 before leaving the factory, the product design and development costs are reduced.

[0048] In some embodiments, based on the fact that the portion to be cut includes a first extension portion, the width of the fixed binding portion is greater than the width of the first extension portion; wherein the above step S1 may include but is not limited to the following steps:

[0049] S101, performing cutting in the first extension portion to remove a corresponding portion of the portion to be cut.

[0050] That is, since the first extension portion 2021 may be a portion of the to-be-cut portion 202 away from the fixed area a1, when the to-be-cut portion 202 is cut, the first extension portion 2021 is closest to the outer edge of the non-fixed area a1 and thus may be used as the cut-off position.

[0051] In some embodiments, the portion to be cut further includes a first extension portion, a second extension portion, and a non-fixed binding portion connected between the first extension portion and the second extension portion, and the width of the fixed binding portion is greater than the width of the first extension portion and the width of the second extension portion; wherein the above step S1 may include but is not limited to the following steps:

[0052] S102: performing cutting in the first extension portion or the second extension portion to remove a corresponding portion of the portion to be cut.

[0053] It can be understood that in this embodiment, since the second extension portion 2022 and the non-fixed binding portion 2023 are arranged between the first extension portion 2021 and the fixed binding portion 201, the second extension portion 2022 can also be used as the cutting position of the portion to be cut 202, increasing the choice of positions in the portion to be cut 202.

[0054] The present invention provides a display device 100, combining Figures 1 to 6 As shown, it includes: an array substrate (including the substrate 10 below and the pixel layer 20, the first metal layer 30 and other structures located thereon), which is obtained by cutting off the part of the to-be-cut portion 202 in the array substrate motherboard 200 as described above, which is away from the fixed binding portion 201.

[0055] The display device 100 includes: a display area A, contained in the fixed area a1; a non-display area B, located on at least one side of the display area A, including the fixed binding portion 201 and the uncut portion of the to-be-cut portion 202.

[0056] The present invention provides another display device, which includes but is not limited to the following embodiments and combinations of the following embodiments.

[0057] In some embodiments, in combination Figures 3 to 6 As shown, the display device 100 includes a display area A and a non-display area B located on at least one side of the display area A, including: a substrate 10; a pixel layer 20, located on the substrate 10 and located in the display area A; a first metal layer 30, located on the substrate 10 and located in the non-display area B, the first metal layer 30 is electrically connected to the pixel layer 20, the first metal layer 30 includes an electrically connected binding portion 301 and an extension portion 302, the extension portion 302 is located on the side of the binding portion 301 away from the display area A, the width of the binding portion 301 is greater than the width of the extension portion 302; wherein the length of the extension portion 302 is greater than or equal to 118 microns.

[0058] The substrate 10 may be a rigid substrate, and the binding portion 301 disposed in the non-display area B on the substrate 10 may be bound to the circuit board 40. The display device 100 may further include: a second metal layer 80, which is disposed on the substrate 10 and in the display area A, and is disposed in the same layer as and electrically connected to the first metal layer 30, and the pixel layer 20 is electrically connected to the first metal layer 30 through the second metal layer 80. Specifically, the second metal layer 80 may include a plurality of data lines 801 and a plurality of gate lines 802, the pixel layer 20 includes a plurality of sub-pixels (not shown), each gate line 802 is electrically connected to the corresponding plurality of sub-pixels and a gate driving circuit disposed in the non-display area B to provide a gate signal to the corresponding plurality of sub-pixels, and each data line 801 is electrically connected to the corresponding plurality of sub-pixels and a source driving chip to provide a data signal to the corresponding plurality of sub-pixels.

[0059] Furthermore, the display device 100 may further include a plurality of connection lines 90 connected between the plurality of data lines 801 and the source driver chip, Figure 1 The chip 50 includes a source driver chip as an example. The number of connecting wires 90 can be equal to the number of data lines 801, and each connecting wire 90 is electrically connected between the corresponding data line 801 and the source driver chip; the number of connecting wires 90 can be less than the number of data lines 801, and each connecting wire 90 can be electrically connected to the corresponding data line 801 in a time-sharing manner through a multiplexing circuit to transmit the corresponding data signal thereto. The area where the multiple connecting wires 90 are located can be fan-shaped. In order to reduce the impedance difference of the connecting wires 90 at different positions in the fan-shaped area, the connecting wires 90 near the middle area can be set as follows: Figure 2 and Figure 3 The curved shape shown.

[0060] The first metal layer 30 , the second metal layer 80 and the plurality of connection lines 90 may be manufactured by the same process and disposed in the same layer.

[0061] It should be noted that in order to improve the screen-to-body ratio of the display device 100, the circuit board 40 (e.g., a flexible circuit board) bound thereto with greater flexibility is generally bent toward the back of the substrate 10 to make the size of the portion of the substrate 10 located on the side of the binding portion 301 away from the display area A (i.e., the length of the extension portion 302 of this embodiment) smaller, that is, the size of the non-display area B can be set smaller. The circuit board 40 and the substrate 10 can be connected by the following method: Figure 1 and Figure 6 COG (Chip On Glass) as shown in (a) or Figure 6The chip 50 in the COG is packaged by the chip packaging technology of COF (Chip On FPC, chip on flexible circuit board) shown in (b). Among them, the chip 50 in the COG is fixed on the substrate 10, and the chip 50 can be connected to the electrode on the substrate 10 by flip chip conduction. For example, the first metal layer 30 can include two electrically disconnected binding parts 301, and the chip 50 and the circuit board 40 can be electrically connected to the two electrically disconnected binding parts 301 respectively, and the two binding parts 301 can also be electrically connected through the wires located on the substrate 10; the chip 50 in the COF is fixed on the flexible circuit board (that is, the above-mentioned circuit board 40), and is connected to the circuit on the substrate 10 through the flexible circuit board.

[0062] As discussed above, the binding portion 301 in the first metal layer 30 of the present embodiment can be bound to the circuit board 40 and / or the chip 50 to transmit the signals in the circuit board 40 and / or the chip 50 to the pixel layer 20, and the extension portion 302 in the first metal layer 30 can be electrically connected to the test board in the test stage before shipment to detect the on-off status of the circuit through the luminescence of the pixel layer 20, so the width of the binding portion 301 can be greater than the width of the extension portion 302, so that the size of the binding portion 301 is larger to improve the reliability of the binding.

[0063] It should be noted that in this embodiment, the length L1 of the extension portion 302 of the first metal layer 30 located on the side of the binding portion 301 away from the display area A is set to be greater than or equal to 118 microns, which can be regarded as the cutting accuracy of the cutting device, that is, Figure 4 and Figure 5 The second cutting line C2 in the embodiment needs to extend beyond the end of the binding portion 301 away from the display area A by at least 118 micrometers, so that the binding portion 301 will not be damaged after cutting along the second cutting line C2.

[0064] Of course, the cutting can also be performed from any position between the second cutting line C2 and the first cutting line C1. Similarly, the distance between the edge of the display device 100 obtained after the first cutting line C1 is actually equal to 118 microns from the original first cutting line C1. That is, when setting the length L1 of the extension portion 302, the influence of the cutting accuracy of the cutting device needs to be considered. Combined with the above discussion, it can be seen that the length L1 of the extension portion 302 can be the distance between the first cutting line C1 and the second cutting line C2 plus the cutting accuracy of the cutting device.

[0065] Specifically, the design idea of ​​this embodiment is: the length of the extension portion 302 before the display device 100 leaves the factory can be set to be greater than the remaining cutting length caused by the cutting accuracy of the cutting device (for example, 118 microns), and the extension portion 302 can be cut to a portion of the corresponding length according to the frame size requirement of the display device 100 before leaving the factory, so as to leave a portion of the extension portion 302 in the finished display device 100, that is, the length of the extension portion 302 before the display device 100 leaves the factory is set to be at least greater than the remaining cutting length caused by the cutting accuracy of the cutting device, so as to avoid cutting to the binding portion 301 during later cutting, and at the same time, it is necessary to set the maximum value of the length of the extension portion 302 before the display device 100 leaves the factory according to the maximum value of the frame size requirement of the display device 100, so that the frame size of the display device 100 after leaving the factory can also reach the maximum value of the frame size requirement of the display device 100. At this point, the position of the above-mentioned “first cutting line C1 ” can be understood to be determined by the remaining cutting length caused by the cutting accuracy of the cutting device after the above-mentioned test before leaving the factory and the maximum value of the frame size requirement of the display device 100 .

[0066] In combination with the above discussion, it can be seen that since the present embodiment protects the display device 100 after leaving the factory, the extension portion 302 at this time can be the extension portion 302 before leaving the factory that has been cut by the cutting device or not cut by the cutting device, and the extension portion 302 before leaving the factory can be cut by the cutting device to a maximum length corresponding to the "cutting accuracy of the cutting device" (i.e., equal to 118 microns), that is, the length of the extension portion 302 of the present embodiment is greater than or equal to 118 microns, and its maximum length can be the extent of the extension portion 302 before leaving the factory that has not been cut by the cutting device, and the specific numerical value is not limited here.

[0067] It can be understood that the design concept of the extension portion 302 and its length in this embodiment is that before the display device 100 leaves the factory, the extension portion 302 can be cut to a corresponding length according to the frame size requirement of the display device 100, thereby retaining the portion corresponding to the frame size requirement of the display device 100 (that is, the extension portion 302 in the finished product), which can avoid using masks of different specifications to produce display devices 100 with frames of different sizes. Display devices 100 with frames of different sizes can be produced only by redundantly setting the length of the extension portion 302 before leaving the factory, thereby reducing the cost of product design and development.

[0068] In some embodiments, Figures 3 to 5As shown, the length of the extension portion 302 is less than or equal to the length of the binding portion 301. The first metal layer 30 may include a plurality of terminals 300 arranged at intervals, and each terminal 300 includes at least one of the above-mentioned binding portions 301 and at least one corresponding extension portion 302. In combination with the above discussion, it can be seen that in the display device 100 after leaving the factory, the binding portion 301 can be bound to the circuit board 40, and the side of the extension portion 302 away from the binding portion 301 is in a suspended state, so it can be considered that the extension portion 302 is not used to transmit signals.

[0069] It can be understood that the design idea of ​​this embodiment can be: before leaving the factory, the length of the extension part 302 before cutting is set according to the frame size requirement of the display device 100, and the length of the corresponding binding part 301 is set to the maximum. Among them, the sum of the length of the binding part 301 and the remaining length caused by the "cutting accuracy of the cutting device" can be equal to the minimum value of the frame size requirement of the display device 100. When the finished product is a display device 100 with the smallest or smaller frame size, the length of the binding part 301 can be greater than the length of the extension part 302, so that the area of ​​the first metal layer 30 to be bound to the circuit board 40 later is larger, thereby improving the reliability of the binding.

[0070] Of course, if the difference between the minimum and maximum values ​​of the border size requirements of the display device 100 before leaving the factory is large, and the border size of the final product of the display device 100 is large, the difference in the length of the binding portion 301 before and after leaving the factory will be small. At this time, the length of the binding portion 301 in the finished product may also be less than or equal to the length of the extension portion 302.

[0071] In some embodiments, Figure 5 As shown, the binding portion 301 includes: a first sub-binding portion 3011; a second sub-binding portion 3012, located between the first sub-binding portion 3011 and the extending portion 302; a connecting portion 3013, electrically connected between the first sub-binding portion 3011 and the second sub-binding portion 3012, and the width of the first sub-binding portion 3011 and the width of the second sub-binding portion 3012 are both greater than the width of the connecting portion 3013.

[0072] Specifically, based on the above discussion that the binding portion 301 can be bound to the circuit board 40, this embodiment further configures the binding portion 301 to include a connecting portion 3013 and a first sub-binding portion 3011 and a second sub-binding portion 3012 connected by the connecting portion 3013. The width of the first sub-binding portion 3011 and the width of the second sub-binding portion 3012 are both greater than the width of the connecting portion 3013, that is, the first sub-binding portion 3011 and the second sub-binding portion 3012 can be used to bind to the circuit board 40, and the connecting portion 3013 can be used to divide the first sub-binding portion 3011 and the second sub-binding portion 3012 and electrically connect the two.

[0073] Specifically, the design idea of ​​this embodiment is: the binding part 301 can be set to include a connection part 3013 that can be cut and the above-mentioned extension part 302 before the display device 100 leaves the factory. When the lengths of the first sub-binding part 3011 and the second sub-binding part 3012 are determined, the sum of the lengths of the connection part 3013 and the above-mentioned extension part 302 can also be reasonably set according to the range of the frame size requirements of the display device 100 before leaving the factory. This process also needs to consider the remaining cutting length (for example, 118 microns) caused by the cutting accuracy of the cutting device, so that the corresponding position in the extension part 302 or the corresponding position in the connection part 3013 can be cut according to the frame size requirements of the display device 100 before leaving the factory.

[0074] Among them, combined Figures 1 to 3 As shown, if the cutting position of the cutting device before delivery is within the extension portion 302, the finished display device 100 can retain the connecting portion 3013, the first sub-binding portion 3011 and the second sub-binding portion 3012 of this embodiment; if the cutting position of the cutting device before delivery is within the connecting portion 3013, the first sub-binding portion 3011 is located on the side of the second sub-binding portion 3012 away from the display area A, then Figure 3 The second sub-binding portion 3012 in the finished display device 100 can be understood as Figure 4 The binding section 301 in Figure 5 The part of the connection portion 3013 in the Figure 4 The extension portion 302 in the embodiment of the present invention.

[0075] Similarly, as discussed above, since the cutting position of the cutting device before shipment may also be located within the connecting portion 3013, even if the cutting is not ultimately performed from the corresponding position in the connecting portion 3013 before shipment, the length of the connecting portion 3013 in the final product needs to be greater than or equal to 118 microns to avoid cutting into the first sub-binding portion 3011 remaining on the substrate 10 during subsequent cutting.

[0076] Of course, the first metal layer 30 can also be configured to include more (greater than 2) sub-binding parts and corresponding multiple connecting parts 3013 to increase the number of positions where the display device 100 can be cut by the cutting device before leaving the factory, thereby meeting the needs of products with more sizes of frames.

[0077] In some embodiments, Figure 5 As shown, the length of the connecting portion 3013 is less than or equal to the length of the extending portion 302. Specifically, in order to avoid the connecting portion 3013 being too long, which may cause a greater risk of cutting the first sub-binding portion 3011 (for example, the first sub-binding portion 3011) that is further away from the display area A under the same frame size requirement, the length of the connecting portion 3013 is set shorter in this embodiment. For example, when the frame size required by the display device 100 is larger, since the length of the connecting portion 3013 is shorter, the size in the non-display area B accounts for a smaller proportion, and it can even be cut from the corresponding position in the extending portion 302 to retain the first sub-binding portion 3011 and the second sub-binding portion 3012, thereby increasing the number of areas where the first metal layer 30 is later bound to the circuit board 40, reducing the risk of the circuit board 40 floating during the binding process, and further improving the reliability of the binding.

[0078] That is, the length of the connecting portion 3013 of the present embodiment can be slightly larger than 118 microns, that is, the connecting portion 3013 is only used as a cutting position. At the same time, the length of the extension portion 302 can be set larger so that the pre-factory cutting device has more options when cutting in the extension portion 302.

[0079] Furthermore, the design idea of ​​this embodiment can be: before leaving the factory, the length of the extension part 302 before cutting and the length of the connecting part 3013 (shorter length) are set according to the frame size requirements of the display device 100, and at the same time, the length of the corresponding binding part 301 is maximized.

[0080] Among them, the sum of the length of the second sub-binding portion 3012 which is closer to the display area A and the remaining length caused by the "cutting accuracy of the cutting device" can be equal to the minimum value of the border size requirement of the display device 100. When the finished product is a display device 100 with a minimum or smaller border size, the length of the second sub-binding portion 3012 can be greater than the length of the connecting portion 3013, so that the area where the second sub-binding portion 3012 is later bound to the circuit board 40 is larger, thereby improving the reliability of the binding.

[0081] Among them, the sum of the length of the first sub-binding portion 3011, the length of the extension portion 302 before cutting and the remaining length caused by the "cutting accuracy of the cutting device" which is farther away from the display area A can be equal to the maximum value of the frame size requirement of the display device 100. When the finished product is a display device 100 with a largest or larger frame size, the length of the first sub-binding portion 3011 and the length of the second sub-binding portion 3012 can be greater than the length of the connecting portion 3013, and further, can also be greater than the length of the extension portion 302, so that the effective area of ​​the binding portion 301 for later binding with the circuit board 40 is larger, thereby improving the reliability of the binding.

[0082] In some embodiments, in combination Figures 3 to 7 As shown, the display device 100 further includes: a conductive adhesive layer 60, located on the binding portion 301; the above-mentioned circuit board 40, located on the conductive adhesive layer 60, and bound and electrically connected to the binding portion 301 through the conductive adhesive layer 60. The stable contact between the conductive particles in the conductive adhesive is caused by the curing or drying of the conductive adhesive. Before the conductive adhesive is cured or dried, the conductive particles are separated in the adhesive and have no continuous contact with each other, so they are in an insulating state; after the conductive adhesive is cured or dried to form the above-mentioned conductive adhesive layer 60, the volume of the adhesive shrinks due to the volatilization of the solvent and the curing of the adhesive, so that the conductive particles are in a stable continuous state with each other, and thus exhibit conductivity. Therefore, the adhesion property of the conductive adhesive layer 60 can bind the circuit board 40 to the binding portion 301, and the conductive property of the conductive adhesive layer 60 can electrically connect the circuit board 40 to the binding portion 301.

[0083] As discussed above, the first metal layer 30 may include a plurality of terminals 300 arranged at intervals, each terminal 300 includes at least one of the above-mentioned binding portions 301 and a corresponding at least one extending portion 302. Correspondingly, a plurality of pins corresponding to the plurality of terminals 300 in the first metal layer 30 may also be provided on the circuit board 40. The signals transmitted by the binding portions 301 belonging to different terminals 300 are different, so that different pins in the circuit board 40 receive different signals. Therefore, in order to avoid short circuits between different terminals 300, the conductive adhesive layer 60 needs to be provided only on the plurality of terminals 300, and it is avoided to be provided between two adjacent terminals 300 so as to electrically connect the two adjacent terminals 300.

[0084] In some embodiments, in combination Figures 3 to 7 As shown, the display device 100 further includes: an insulating layer 70, located between the binding portion 301 and the conductive adhesive layer 60, the insulating layer 70 including a via hole 701, and the circuit board 40 is electrically connected to the binding portion 301 through the via hole 701. The insulating layer 70 located on the binding portion 301 can not only insulate the multiple terminals 300, but also protect the multiple terminals 300 to reduce the risk of oxidation thereof.

[0085] Specifically, the insulating layer 70 can be set as a whole layer, and can fill the gap between the two adjacent terminals 300 in the binding part 301 while covering the binding part 301, or it can be set as a plurality of insulating parts, each of which covers the corresponding terminal 300. Regardless of how the insulating layer 70 is set, considering that the circuit board 40 only needs to be electrically connected to the plurality of terminals 300 in the binding part 301, at least one via 701 can be set in the insulating layer 70 corresponding to the area of ​​each terminal 300, and each via 701 can be filled with conductive material to be electrically connected to the corresponding pin in the circuit board 40 through the conductive adhesive layer 60 located above the insulating layer 70. The conductive material filled in each via 701 can also be electrically connected to the corresponding binding part 301 in the first metal layer 30 located below the insulating layer 70, so as to realize the electrical connection between the pin in the circuit board 40 and the corresponding binding part 301. Among them, the conductive material filled in the via 701 can be the same as the material of the conductive adhesive layer 60.

[0086] The present invention provides another display device, which includes but is not limited to the following embodiments and combinations of the following embodiments.

[0087] In some embodiments, in combination Figures 3 to 7 As shown, the display device 100 includes a display area A and a non-display area B located on at least one side of the display area A, including: a substrate 10; a pixel layer 20, located on the substrate 10 and in the display area A; a first metal layer 30, located on the substrate 10 and in the non-display area B, the first metal layer 30 is electrically connected to the pixel layer, the first metal layer 30 includes a first sub-binding portion 3011, a second sub-binding portion 3012, and a connecting portion 3013 electrically connected between the first sub-binding portion 3011 and the second sub-binding portion 3012, the width of the first sub-binding portion 3011 and the width of the second sub-binding portion 3012 are both greater than the width of the connecting portion 3013.

[0088] The display area A, the non-display area B, the substrate 10 and the pixel layer 20 of this embodiment may all refer to the above related discussions.

[0089] It can be understood that since the first metal layer 30 of the present embodiment includes the first sub-binding portion 3011, the second sub-binding portion 3012 and the connecting portion 3013, the present embodiment can be understood as the finished product display device 100 at least depends on whether cutting is performed in the connecting portion 3013 before leaving the factory. That is, before the display device 100 leaves the factory, it can be determined whether to cut at the corresponding position in the connecting portion 3013 according to the frame size requirements of the display device 100, so as to meet the required frame size of the display device 100. It can also avoid using different specifications of masks to produce display devices 100 with frames of different sizes. Display devices 100 with frames of different sizes can be produced only by setting the first metal layer 30 to include the first sub-binding portion 3011, the second sub-binding portion 3012 and the connecting portion 3013 before leaving the factory, thereby reducing the cost of product design and development.

[0090] Similarly, the first metal layer 30 can also be configured to include more (greater than 2) sub-binding parts and corresponding multiple connecting parts 3013 to increase the number of positions where the display device 100 can be cut by the cutting device before leaving the factory, thereby meeting the needs of products with more sizes of frames.

[0091] Similarly, the finished display device 100 of this embodiment may also include the above-mentioned extension portion 302, which may also be understood as the structure left on the substrate 10 after the circuit electrically connected to the test board of the display device 100 during the test stage before delivery is cut by the cutting device. Figure 3 The difference between the discussion of the embodiment is that, since the display device 100 in the finished product already includes the connection portion 3013, the length of the extension portion 302 is not limited to be greater than or equal to 118 microns, that is, the length of the extension portion 302 of the embodiment can also be less than 118 microns, that is, before leaving the factory, the display device 100 of the corresponding frame size is produced only by whether to cut in the connection portion 3013. At this time, the extension portion 302 is only used to electrically connect with the test board during the test phase. Furthermore, the length of the extension portion 302 can be less than or equal to the length of the binding portion 301, so that the display device 100 has a larger binding portion 301 to bind with the circuit board 40 and / or the chip 50, thereby improving the reliability of the binding.

[0092] Furthermore, the length of the connecting portion 3013 of the present embodiment may also be greater than or equal to 118 micrometers to avoid cutting to the first sub-binding portion 3011 remaining on the substrate 10 during subsequent cutting.

[0093] Furthermore, the length of the connection portion 3013 of the present embodiment may be less than or equal to the length of the extension portion 302. When the required frame size of the display device 100 is large, since the length of the connection portion 3013 is short, the size in the non-display area B accounts for a small proportion, and it can even be cut from the corresponding position in the extension portion 302 to retain the first sub-binding portion 3011 and the second sub-binding portion 3012, thereby increasing the number of areas where the first metal layer 30 is later bound to the circuit board 40, reducing the risk of the circuit board 40 floating during the binding process, and further improving the reliability of the binding.

[0094] Furthermore, the display device 100 of this embodiment may also include the above-mentioned conductive adhesive layer 60 , insulating layer 70 and via 701 , and the details may refer to the above-mentioned related descriptions.

[0095] In the display device 100 discussed above, considering that the display device 100 after leaving the factory requires the binding part 301 to transmit signals during operation and the extension part 302 is only used to constitute the non-display area B, on the one hand, the oxidation resistance of the material of the binding part 301 can be better than that of the extension part 302, and its conductivity can be better than that of the extension part 302. On the other hand, the thickness of the binding part 301 can be greater than the thickness of the extension part 302 to improve the mechanical properties of the binding part 301.

[0096] The display device provided in the present invention can be cut from the array substrate motherboard described above by the array substrate motherboard cutting method described above.

[0097] The array substrate motherboard and its cutting method, and the display device provided in the embodiments of the present invention are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present invention. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An array substrate motherboard, characterized in that: include: A fixing area, wherein at least one side of the fixing area is provided with a fixing binding portion; The portion to be cut is connected to the fixed binding portion, at least a portion of the portion to be cut away from the fixed binding portion is used to be cut off, and the length of the portion to be cut is greater than or equal to 118 microns.

2. The array substrate motherboard according to claim 1, characterized in that: The portion to be cut includes a first extending portion, the first extending portion includes an area used as a cutting position of the portion to be cut, and the width of the fixing and binding portion is greater than the width of the first extending portion.

3. The array substrate motherboard according to claim 2, characterized in that: The length of the first extension portion is greater than or equal to 118 micrometers.

4. The array substrate motherboard according to claim 2, characterized in that: The first extending portion is in contact with and connected to the fixed binding portion.

5. The array substrate motherboard according to claim 2, characterized in that: The portion to be cut also includes a second extension portion and a non-fixed binding portion connected between the first extension portion and the second extension portion, the second extension portion includes an area used as a cutting position for the portion to be cut, and the width of the fixed binding portion is greater than the width of the second extension portion.

6. The array substrate motherboard according to claim 5, characterized in that: The length of the second extension portion is greater than or equal to 118 micrometers.

7. The array substrate motherboard according to claim 5, characterized in that: The first extension portion is located at a side of the non-fixed binding portion away from the fixed area, and the length of the first extension portion is greater than or equal to the length of the second extension portion.

8. A method for cutting an array substrate motherboard, characterized in that: For cutting the array substrate motherboard as claimed in claim 1, comprising: A portion of the portion to be cut away from the fixed binding portion is cut to remove a corresponding portion of the portion to be cut.

9. The method for cutting an array substrate motherboard according to claim 8, wherein: The portion to be cut includes a first extension portion, and the width of the fixed binding portion is greater than the width of the first extension portion; The step of cutting a portion of the portion to be cut away from the fixed binding portion to remove a corresponding portion of the portion to be cut includes: Cutting is performed in the first extension portion to remove a corresponding portion of the portion to be cut.

10. The method for cutting an array substrate motherboard according to claim 8, wherein: The portion to be cut further includes a first extension portion, a second extension portion, and a non-fixed binding portion connected between the first extension portion and the second extension portion, wherein the width of the fixed binding portion is greater than the width of the first extension portion and the width of the second extension portion; The step of cutting a portion of the portion to be cut away from the fixed binding portion to remove a corresponding portion of the portion to be cut includes: Cutting is performed in the first extension portion or the second extension portion to remove a corresponding portion of the portion to be cut.

11. A display device, characterized in that: include: An array substrate is obtained by cutting off a portion of the to-be-cut portion away from the fixing and binding portion in the array substrate motherboard according to any one of claims 1 to 10.

12. The display device according to claim 11, wherein: The display device comprises: A display area, included in the fixed area; The non-display area is located at least on one side of the display area, and includes the fixed binding portion and a portion of the to-be-cut portion that has not been cut off.

13. A display device, characterized in that: The device comprises a display area and a non-display area located at least on one side of the display area, including: substrate; A pixel layer, located on the substrate and in the display area; a first metal layer, located on the substrate and in the non-display area, the first metal layer being electrically connected to the pixel layer, the first metal layer comprising an electrically connected binding portion and an extending portion, the extending portion being located on a side of the binding portion away from the display area, and the width of the binding portion being greater than the width of the extending portion; Wherein, the length of the extension portion is greater than or equal to 118 microns.

14. The display device according to claim 13, wherein: The length of the extending portion is less than or equal to the length of the binding portion.

15. The display device according to claim 13 or 14, characterized in that: The binding part comprises: First Sub-Binding Department; a second sub-binding portion, located between the first sub-binding portion and the extending portion; The connecting portion is electrically connected between the first sub-binding portion and the second sub-binding portion, and the width of the first sub-binding portion and the width of the second sub-binding portion are both greater than the width of the connecting portion.

16. The display device according to claim 15, characterized in that The length of the connecting portion is greater than or equal to 118 micrometers.

17. The display device according to claim 15, characterized in that: The length of the connecting portion is less than or equal to the length of the extending portion.

18. The display device according to claim 13 or 14, characterized in that: Also includes: A conductive adhesive layer, located on the binding portion; The circuit board is located on the conductive adhesive layer and is bound and electrically connected to the binding part through the conductive adhesive layer.

19. The display device according to claim 18, wherein: Also includes: The insulating layer is located between the binding part and the conductive adhesive layer, and the insulating layer includes a via hole, through which the circuit board is electrically connected to the binding part.

20. A display device, characterized in that: The device comprises a display area and a non-display area located at least on one side of the display area, including: substrate; A pixel layer, located on the substrate and in the display area; A first metal layer is located on the substrate and in the non-display area. The first metal layer is electrically connected to the pixel layer. The first metal layer includes a first sub-binding portion, a second sub-binding portion, and a connecting portion electrically connected between the first sub-binding portion and the second sub-binding portion. The width of the first sub-binding portion and the width of the second sub-binding portion are both greater than the width of the connecting portion.

21. The display device according to claim 20, characterized in that The first metal layer further includes an extension portion located on a side of the first sub-binding portion and the second sub-binding portion away from the display area, and widths of the first sub-binding portion and the second sub-binding portion are both greater than a width of the extension portion.

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