Display device

By installing support members in the pin bonding area of ​​the array substrate of the display device and connecting decorative parts to block the pin bonding area, the bottleneck of narrow frame technology is solved, and the size of non-display area is reduced, and the aesthetics and technological sense are improved.

CN119851569APending Publication Date: 2025-04-18GUANGZHOU CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Patent Information

Application Number
CN202411997294.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2025-04-18

AI Technical Summary

Technical Problem

When the existing display devices pursue narrow frame size, they encounter technical bottlenecks and it is difficult to effectively reduce the size of the non-display area of ​​the display device.

Method used

By installing the support in the pin bonding area of ​​the array substrate and connecting the decorative parts to the support, the pin bonding area is blocked, thereby reducing the size of the non-display area of ​​the display device.

Benefits of technology

The non-display area size of the display device is reduced, the aesthetics and technological sense of the display device are improved, and technical problems caused by too small borders are avoided.

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Abstract

The embodiment of the invention provides a display device. The display device comprises an array substrate, a supporting part and a decorating part. The array substrate comprises a pin combination area. The supporting piece is located in the pin combination area of the array substrate. The decorating part is connected to the supporting part and shields the pin combination area. The decorating part is installed on the display device through the supporting part located in the pin combination area, and the size of the non-display area of the display device is reduced.
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Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display device. Background Art

[0002] As display devices become more and more popular, people have higher and higher requirements for the aesthetics of display devices. At present, in order to make the appearance of display devices more beautiful and more technological, people are increasingly pursuing narrow borders of display devices, hoping that the borders are as small as possible. However, as the borders become smaller, narrow borders have encountered technical bottlenecks. Summary of the invention

[0003] The embodiments of the present application provide a display device to reduce the size of the display device, so as to at least partially solve the above technical problems.

[0004] In order to achieve the above-mentioned purpose, an embodiment of the present application provides a display device. The display device includes an array substrate, a support member and a decorative member. The array substrate includes a pin bonding area. The support member is located in the pin bonding area of ​​the array substrate. The decorative member is connected to the support member and blocks the pin bonding area.

[0005] Optionally, the supporting member includes a magnetic member, and the decorative member is adsorbed on the magnetic member.

[0006] Optionally, a plurality of magnetic members are fixed to the pin bonding area.

[0007] Optionally, the display device further includes a first adhesive layer, and the first adhesive layer is located between the magnetic member and the array substrate.

[0008] Optionally, the thickness of the first adhesive layer is smaller than the thickness of the magnetic member.

[0009] Optionally, the support member includes a second adhesive layer, and the second adhesive layer bonds the decorative member and the array substrate.

[0010] Optionally, the array substrate includes a conductive structure located in the pin bonding area; the display device further includes a protective layer, which covers the conductive structure and is located between the support member and the array substrate.

[0011] Optionally, the display device further comprises a flexible film, which is bound to the pin bonding area, and at least one of the flexible films is located between the array substrate and the support member.

[0012] Optionally, the display device further comprises an opposing substrate and a first polarizer, wherein the opposing substrate is arranged opposite to the array substrate. The first polarizer is attached to a surface of the opposing substrate away from the array substrate. The pin bonding area extends outward relative to the opposing substrate, and the decorative member is also attached to a surface of the opposing substrate away from the array substrate and in contact with the first polarizer.

[0013] Optionally, the display device further comprises a coating layer, which is located on a surface of the decorative member facing away from the supporting member, and has the same color as a surface of the first polarizer facing away from the array substrate.

[0014] Optionally, the sum of the thickness of the decorative element and the thickness of the coating is equal to the thickness of the first polarizer.

[0015] Optionally, the thickness of the support member is smaller than the thickness of the opposing substrate.

[0016] Optionally, the decorative member includes a strip-shaped main body portion, which is fixed on the support member and covers the pin bonding area.

[0017] In the display device of some embodiments of the present application, the decorative member is mounted on the display device via a support member located in the pin bonding area, thereby reducing the size of the non-display area of ​​the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of a planar structure of a display device provided in an embodiment of the present application;

[0019] Figure 2 The embodiment of the present application provides Figure 1 A schematic diagram of a cross-sectional structure taken along the A-A' tangent line shown;

[0020] Figure 3 A schematic diagram of a partial structure of a support member of a display device provided in an embodiment of the present application being fixed to a pin bonding area;

[0021] Figure 4 Another partial structural schematic diagram of a display device provided in an embodiment of the present application in which a support member is fixed to a pin bonding area;

[0022] Figure 5 The embodiment of the present application provides Figure 1 Another schematic diagram of a cross-sectional structure taken along the AA' tangent line is shown;

[0023] Figure 6 The embodiment of the present application provides Figure 1 Another schematic diagram of a cross-sectional structure taken along the AA' line is shown.

[0024] The reference numerals are as follows:

[0025] 100. Display device;

[0026] 11. Display panel;

[0027] 12, array substrate; 12A, array area; 12B, pin bonding area; 121, substrate; 122, conductive structure; 123, binding pin;

[0028] 13. Counter substrate; 131. Counter substrate;

[0029] 14. backlight module; 141. optical film; 142. light source; 143. back plate; 144. light-transmitting plate;

[0030] 21. Support member; 211. First support member; 212. Second support member; 22. Magnetic member; 23. Second adhesive layer;

[0031] 31. a first bonding layer;

[0032] 41. Decorative element; 411. Strip-shaped main body; 412. First bending portion;

[0033] 51. Protective layer; 52. Coating;

[0034] 61. flexible film; 62. driving unit;

[0035] 711, a first polarizer; 712, a second polarizer;

[0036] 81. Support frame; 811. Frame body; 812. Support protrusion. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0038] See also Figures 1 to 6 As shown, an embodiment of the present application provides a display device 100. The display device 100 includes a display panel 11. The display panel 11 is used for display. The display panel 11 can be any one of a liquid crystal display panel, an organic light emitting diode display panel, a quantum dot display panel, a micro light emitting diode display panel, and a sub-millimeter light emitting diode display panel. The display panel 11 can also be any one of a flexible display panel, a foldable display panel, a rollable display panel, and a rigid display panel.

[0039] In some embodiments, see Figures 2 to 6 As shown, the display panel 11 includes an array substrate 12. The array substrate 12 includes an array area 12A and a pin bonding area 12B. The array area 12A is adjacent to the pin bonding area 12B.

[0040] The array area 12A of the array substrate 12 overlaps the display area of ​​the display panel 11. The array substrate 12 includes a substrate 121. The array area 12A is provided with a pixel driving circuit (not shown in the figure) and a signal line (not shown in the figure) located on the substrate 121, and the signal line is connected to the pixel driving circuit.

[0041] The pin bonding area 12B of the array substrate 12 overlaps with the non-display area of ​​the display panel 11 .

[0042] In some embodiments, see Figure 2 As shown, the array substrate 12 includes a conductive structure 122 located in the pin bonding area 12B. The conductive structure 122 transmits the driving signal to the array area 12A.

[0043] In some embodiments, the conductive structure 122 may include a binding pin 123. The conductive structure 122 may also include a conductive trace. A plurality of binding pins 123 are connected to a plurality of signal lines (not shown) of the array area 12A. The binding pins 123 are used to input a driving signal and output the driving signal to the pixel driving circuit through the signal line, so that the display panel 11 realizes display.

[0044] In some embodiments, see Figure 2 , Figure 5 as well as Figure 6 As shown, the display device 100 further includes a protective layer 51 , and the protective layer 51 covers the conductive structure 122 . The protective layer 51 protects the conductive structure 122 .

[0045] In some embodiments, the protection layer 51 may include a moisture-proof material to improve the problem of water corroding the conductive structure 122. The moisture-proof material may be a conventional material.

[0046] In some embodiments, the protection layer 51 may also include an oxygen absorbing material to improve the problem of oxygen corroding the conductive structure 122. The oxygen absorbing material may be a conventional material.

[0047] In some embodiments, the protective layer 51 may include a protective adhesive layer, such as optical protective adhesive such as Tuffy adhesive.

[0048] In some embodiments, see Figures 2 to 6As shown, the display panel 11 further includes an opposing substrate 13. The opposing substrate 13 is disposed opposite to the array substrate 12. The pin bonding area 12B extends outward relative to the opposing substrate 13 so as to facilitate binding the flexible film 61 carrying the driving unit 62 to the binding pins 123 of the pin bonding area 12B.

[0049] In some embodiments, the counter substrate 13 and the array substrate 12 may be connected by a sealant (not shown in the figure).

[0050] In some embodiments, a liquid crystal layer (not shown in the figure) is disposed between the counter substrate 13 and the array substrate 12. In other words, the display panel 11 is a liquid crystal display panel 11.

[0051] In some embodiments, the counter substrate 13 may include a counter substrate 131 and a color filter layer (not shown in the figure), and the color filter layer is located on the side of the counter substrate 131 facing the array substrate 12, that is, the counter substrate 13 is a color filter substrate. In other embodiments, the counter substrate 13 may also be a packaging substrate.

[0052] In some embodiments, see Figure 2 , Figure 5 as well as Figure 6 As shown, the display device 100 further includes a support frame 81. The support frame 81 includes a frame body 811. The frame body 811 is frame-shaped, and the middle of the frame body is an opening. The display panel 11 is fixed to the frame body 811. In an exemplary embodiment, when the display panel 11 includes an array substrate 12, the side of the array substrate 12 facing away from the opposing substrate 13 is fixed to the frame body 811 through an adhesive layer. The adhesive layer may include but is not limited to foam adhesive and the like.

[0053] In some embodiments, see Figure 2 , Figure 5 as well as Figure 6 As shown, when the display panel 11 is a liquid crystal display panel, the display device 100 further includes a backlight module 14. The backlight module 14 may include a light-transmitting plate 144 such as a light guide plate, and the light-transmitting plate 144 is fixed to a side of the frame body away from the display panel 11.

[0054] In some embodiments, see Figure 2 , Figure 5 as well as Figure 6 As shown, the backlight module 14 may further include an optical film 141. The optical film 141 is located on the light-transmitting plate 144. The optical film 141 may include at least one of a brightness enhancement film and a diffusion film.

[0055] In some embodiments, see Figure 2 , Figure 5 as well as Figure 6As shown, the backlight module 14 may further include a light source 142. The light source 142 may be located on a side of the light-transmitting plate 144. The light source 142 may be located on a side of the light-transmitting plate 144 that is away from the display panel 11.

[0056] In some embodiments, see Figure 2 , Figure 5 as well as Figure 6 As shown, the backlight module 14 may further include a back plate 143. The back plate 143 includes a housing space, and the light source 142, the light-transmitting plate 144, and the optical film 141 are located in the housing space. The support frame 81 is fixed to the back plate 143 to achieve the fixation of the support frame 81, and then the display panel 11 is fixed to the light-emitting side of the backlight module 14.

[0057] In some embodiments, see Figures 1 to 6 As shown, the display device 100 further includes a support member 21 and a decorative member 41. The support member 21 is located in the pin bonding area 12B of the array substrate 12. The decorative member 41 is connected to the support member 21 and shields the pin bonding area 12B. In this way, the decorative member 41 shields the pin bonding area 12B and is installed on the display device 100 through the support member 21 located in the pin bonding area 12B, that is, the decorative member 41 is installed using the non-display area of ​​the array substrate 12 that needs to be shielded, so as to reduce the size of the non-display area of ​​the display device 100.

[0058] In some embodiments, the thickness D1 of the support member 21 is less than the thickness d1 of the opposing substrate 13, thereby reducing the risk of the decorative member 41 on the support member 21 protruding from the display panel 11, thereby reducing the risk of a step difference between the decorative member 41 on the support member 21 and the display panel 11, and improving the appearance of the display panel 11.

[0059] In some embodiments, see Figure 2 , Figure 5 as well as Figure 6 As shown, when the protective layer 51 covers the conductive structure 122 , the protective layer 51 is located between the support member 21 and the array substrate 12 , thereby reducing the risk of the support member 21 damaging the conductive structure 122 covered by the protective layer 51 .

[0060] In some embodiments, see Figure 2 As shown, when the protective layer 51 covers the conductive structure 122, part of the protective layer 51 is also located between the support member 21 and the counter substrate 13, further enhancing the protective effect of the protective layer 51 on the conductive structure 122. In addition, the risk of direct contact between the support member 21 and the counter substrate 13 causing damage to the counter substrate 13 is reduced.

[0061] In some embodiments, the thickness D2 of the protective layer 51 is less than the thickness D1 of the support member 21 , so that the thickness of the support member 21 is thick enough to better play a supporting role.

[0062] In some embodiments, the thickness D2 of the protection layer 51 is 8 micrometers to 12 micrometers, which ensures that the protection layer 51 protects the conductive structure 122 and provides more space for arranging the support member 21 .

[0063] In some embodiments, see Figure 3 and Figure 4 As shown, the display device 100 further includes a flexible film 61. A plurality of flexible films 61 are bound to the binding pins 123 of the pin binding area 12B at intervals. A driving unit 62 is disposed on each flexible film 61. The driving unit 62 transmits a driving signal to the binding pins 123 of the pin binding area 12B through the flexible film 61, and the binding pins 123 then transmit the driving signal to the pixel driving circuit of the array area 12A through the signal line.

[0064] In some embodiments, see Figure 3 and Figure 4 As shown, the orthographic projection of at least one support member 21 on the array substrate 12 is located between adjacent flexible films 61 , thereby reducing the risk of the support member 21 causing damage to the flexible film 61 .

[0065] In some embodiments, see Figure 4 As shown, at least one flexible film 61 is located between the array substrate 12 and the support member 21. In this way, the support member 21 is arranged on the flexible film 61 to increase the number of the support members 21 and the total support area, and improve the firmness of the support members 21 fixing the decorative member 41.

[0066] In some embodiments, continue to refer to Figure 4 As shown, the plurality of support members 21 include a first support member 211 and a second support member 212. The first support member 211 is located on the flexible film 61, and the second support member 212 is located between adjacent flexible films 61. Along the arrangement direction of the plurality of flexible films 61, the dimension D4 of the first support member 211 is smaller than the dimension D5 of the second support member 212. In this way, the first support member 211 can be installed on the flexible film 61 more flexibly, and the risk of the first support member 211 causing damage to the flexible film 61 is reduced.

[0067] In some embodiments, see Figures 2 to 4 As shown, the support member 21 includes a magnetic member 22. The decorative member 41 is adsorbed on the magnetic member 22. The decorative member 41 is fixed to the display device 100 by the magnetic adsorption force of the magnetic member 22, which not only simplifies the installation process of the decorative member 41, but also facilitates the disassembly and replacement of the decorative member 41.

[0068] In some embodiments, the magnetic member 22 may be in a strip shape.

[0069] In some embodiments, the magnetic member 22 includes but is not limited to magnetic materials such as neodymium iron boron magnets.

[0070] In some embodiments, see 3 and Figure 4 As shown, multiple magnetic members 22 are fixed to the pin bonding area 12B. The multiple magnetic members 22 are relatively small in size, so that the multiple magnetic members 22 can be more flexibly installed in the pin bonding area 12B with a relatively small size. In addition, the multiple magnetic members 22 are relatively small in size, which reduces the risk of damage to the magnetic members 22 due to their large size.

[0071] In some embodiments, along the arrangement direction of the plurality of magnetic members 22, the sizes of at least two magnetic members 22 may be the same to simplify the process of forming the at least two magnetic members 22. In other embodiments, the sizes of at least two magnetic members 22 may be different from each other to enhance the flexibility of fixing the at least two magnetic members 22 to the pin bonding area 12B.

[0072] In some embodiments, a magnetic member 22 may be fixed to the pin bonding area 12B. The decorative member 41 is fixed to a magnetic member 22 .

[0073] In some embodiments, see Figures 2 to 4 As shown, part of the magnetic member 22 extends outward relative to the pin bonding area 12B, that is, part of the magnetic member 22 is located outside the pin bonding area 12B, so as to increase the support area of ​​the magnetic member 22 and enhance the firmness of the support member 21 fixing the decorative member 41.

[0074] In some embodiments, see Figure 2 As shown, the display device 100 further includes a first adhesive layer 31 . The first adhesive layer 31 is located between the magnetic member 22 and the array substrate 12 , so that the magnetic member 22 is fixed to the pin bonding area 12B of the array substrate 12 through the first adhesive layer 31 .

[0075] In some embodiments, the thickness D3 of the first adhesive layer 31 is less than the thickness of the magnetic member 22 . The first adhesive layer 31 is thinner and the magnetic member 22 is thicker, thereby reducing the risk of damage to the magnetic member 22 due to its thin thickness.

[0076] In some embodiments, the thickness of the first adhesive layer 31 may be 0.02 mm to 0.05 mm, which ensures that the first adhesive layer 31 has sufficient adhesive strength and can provide more layout space for the magnetic component 22 .

[0077] In some embodiments, the thickness of the magnetic member 22 can be 0.2 mm to 0.4 mm, reducing the risk of the magnetic member 22 being damaged due to its thin thickness, while also improving the risk of the magnetic member 22 being too thick, causing a step difference between the decorative member 41 located on the magnetic member 22 and the display panel 11 .

[0078] In some embodiments, see Figure 5 and Figure 6 As shown, the support member 21 may include a second adhesive layer 23 , and the second adhesive layer 23 bonds the decorative member 41 to the array substrate 12 . In this way, the decorative member 41 is mounted on the display device 100 through the second adhesive layer 23 .

[0079] In some embodiments, see Figure 5 As shown, when the protective layer 51 covers the conductive structure 122 and the protective layer 51 is located in a partial area of ​​the pin bonding area 12B, the second adhesive layer 23 covers the protective layer 51 and the array substrate 12 in the pin bonding area 12B.

[0080] In some embodiments, see Figure 6 As shown, when the protective layer 51 covers the conductive structure 122 and the protective layer 51 is located in the entire pin bonding area 12B, the second adhesive layer 23 is located between the protective layer 51 and the decorative member 41 .

[0081] In some embodiments, the second adhesive layer 23 may include a double-sided adhesive layer to ensure that the second adhesive layer 23 provides adhesiveness and has sufficient mechanical strength to support the decorative element 41. The double-sided adhesive layer includes a substrate layer and an adhesive layer located on the substrate layer. The substrate layer may include a flexible film 61.

[0082] In some embodiments, the thickness of the second adhesive layer 23 is greater than the thickness of the protective layer 51. In this way, the second adhesive layer 23 is guaranteed to provide good support.

[0083] In some embodiments, see Figure 1 , Figure 2 , Figure 5 as well as Figure 6 As shown, the display device 100 further includes a first polarizer 711. The first polarizer 711 is attached to the surface of the counter substrate 13 that is away from the array substrate 12. The first polarizer 711 is used to adjust the display effect of the display device 100.

[0084] In some embodiments, see Figure 1 , Figure 2 , Figure 5 as well as Figure 6As shown, the display device 100 further includes a second polarizer 712. The display panel 11 is located between the first polarizer 711 and the second polarizer 712. The second polarizer 712 cooperates with the first polarizer 712 to adjust the display effect of the display device 100.

[0085] In some embodiments, see Figure 1 , Figure 2 , Figure 5 as well as Figure 6 As shown, the decoration member 41 is also attached to the surface of the opposing substrate 13 away from the array substrate 12 and is spliced ​​with the first polarizer 711 so that there is no gap between the first polarizer 711 and the decoration member 41 , thereby improving the appearance of the display device 100 .

[0086] In some embodiments, the material of the decorative element 41 may include metals such as stainless steel, so that the decorative element 41 not only plays a decorative role, but also has a certain mechanical strength to reduce the risk of damage under the action of external forces.

[0087] In some embodiments, see Figure 2 , Figure 5 as well as Figure 6 As shown, the display device 100 further includes a coating 52. The coating 52 is located on the surface of the decorative member 41 facing away from the support member 21. The color of the coating 52 is the same as the color of the surface of the first polarizer 711 facing away from the array substrate 12. The appearance of the coating 52 is similar to the appearance of the first polarizer 711, and the display panel 11 achieves a borderless effect.

[0088] In some embodiments, see Figure 2 , Figure 5 as well as Figure 6 As shown, the sum of the thickness of the decorative element 41 and the thickness of the coating 52 is equal to the thickness of the first polarizer 711. It is ensured that there is no step difference between the coating 52 and the first polarizer 711 to achieve a better product appearance effect.

[0089] In some embodiments, the thickness of the decorative element 41 is greater than the thickness of the coating 52. The decorative element 41 is ensured to be thick enough to have sufficient mechanical strength to play a protective role.

[0090] In some embodiments, the decorative member 41 includes a strip-shaped main body 411, which is fixed to the support member 21 and blocks the pin-bonding area 12B. In this way, the decorative member 41 replaces the front frame in the related art, blocks the pin-bonding area 12B of the array substrate 12, and eliminates the step difference between the pin-bonding area 12B and the display panel 11.

[0091] In some embodiments, see Figure 2 , Figure 5 and Figure 6As shown, the decorative member 41 can also shield the support frame 81 .

[0092] In some embodiments, see Figure 2 and Figure 6 As shown, the decorative member 41 is spaced apart from the support frame 81 .

[0093] In some embodiments, see Figure 5 As shown, the support frame 81 may further include a support protrusion 812, and the support protrusion 812 is located on the frame body 811. The strip-shaped main body 411 is also fixed on the support protrusion 812 to increase the support area for the decorative element 41.

[0094] In other embodiments, see Figure 5 As shown, the decorative element 41 may further include a first bending portion 412. The first bending portion 412 is bent relative to the strip-shaped main body portion 411 in a direction away from the coating 52. The first bending portion 412 may limit the movement of the decorative element 41.

[0095] In some embodiments, see Figure 5 As shown, the first bending portion 412 may be located on a side of the support frame 81 away from the opening of the support frame 81. In this way, the first bending portion 412 may limit the movement of the decorative element 41.

[0096] In other embodiments, the decorative element 41 may further include a second bending portion (not shown in the figure), and the second bending portion is connected to the first bending portion 412. The strip-shaped main body portion 411, the first bending portion 412 and the second bending portion are U-shaped as a whole.

[0097] In summary, in the display device of the embodiment of the present application, the decorative member is mounted on the display device via the support member located in the pin bonding area, thereby reducing the size of the non-display area of ​​the display device.

[0098] The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technical personnel in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display device, characterized in that: include: An array substrate, including a pin bonding area; A support member, located in the pin bonding area of ​​the array substrate; as well as The decorative piece is connected to the supporting piece and covers the pin bonding area.

2. The display device according to claim 1, characterized in that The supporting member includes a magnetic member, and the decorative member is adsorbed on the magnetic member.

3. The display device according to claim 2, characterized in that: A plurality of magnetic members are fixed to the pin bonding area.

4. The display device according to claim 2, characterized in that: A portion of the magnetic member extends outward relative to the pin bonding area.

5. The display device according to claim 2, characterized in that: Also includes: The first adhesive layer is located between the magnetic component and the array substrate.

6. The display device according to claim 5, characterized in that: The thickness of the first adhesive layer is smaller than the thickness of the magnetic member.

7. The display device according to claim 1, characterized in that: The supporting member includes a second adhesive layer, and the second adhesive layer adheres the decorative member and the array substrate.

8. The display device according to any one of claims 1 to 7, characterized in that: The array substrate comprises a conductive structure located in the pin bonding area; the display device further comprises a protective layer, which covers the conductive structure and is located between the support member and the array substrate.

9. The display device according to any one of claims 1 to 7, characterized in that: Also includes: A plurality of flexible films are bound to the pin bonding area, and an orthographic projection of at least one of the support members on the array substrate is located between adjacent flexible films.

10. The display device according to claim 9, characterized in that: At least one of the flexible films is located between the array substrate and the support member.

11. The display device according to any one of claims 1 to 7, characterized in that: Also includes: An opposing substrate, arranged opposite to the array substrate; as well as A first polarizer, attached to a surface of the counter substrate facing away from the array substrate; The pin bonding area extends outward relative to the opposing substrate, and the decorative component is also attached to the surface of the opposing substrate away from the array substrate and spliced ​​with the first polarizer.

12. The display device according to claim 11, characterized in that: Also includes: The coating is located on the surface of the decorative member facing away from the supporting member, and the color of the coating is the same as the color of the surface of the first polarizer facing away from the array substrate.

13. The display device according to claim 12, characterized in that: The sum of the thickness of the decorative element and the thickness of the coating is equal to the thickness of the first polarizer.

14. The display device according to claim 11, characterized in that: The thickness of the support member is smaller than the thickness of the counter substrate.

15. The display device according to any one of claims 1 to 7, characterized in that: The decorative piece includes a strip-shaped main body portion, which is fixed on the support piece and covers the pin bonding area.

Citation Information

Patent Citations

  • Display panel, display device and manufacturing method of display device

    CN112526792A

  • Display panel, manufacturing method of display panel and display device

    CN114859595A

  • Display device

    CN119200268A

  • Liquid crystal display device

    CN209400827U

  • Display device

    CN221841574U