Phase change radiator and phase change radiating system

Abstract

The invention provides a phase change radiator and a phase change radiating system. The phase change radiator comprises a substrate, radiating fins and a working medium pump. A liquid storage cavity is formed in the lower side in the base plate, a gas-phase working medium cavity is formed in the upper side in the base plate, the heat absorption evaporation runner is arranged between the liquid storage cavity and the gas-phase working medium cavity, the top end of the heat absorption evaporation runner is communicated with the gas-phase working medium cavity, and the gas-phase working medium cavity is provided with an overflow port communicated with the liquid storage cavity. The working medium pump is used for conveying the working medium in the liquid storage cavity to the bottom end of the heat absorption evaporation runner. A heat source mounting part is arranged in the first surface area of the substrate corresponding to the heat absorption evaporation flow channel. The cooling fins are installed on the second face of the base plate and provided with condensation pipelines, the upper ends of the cooling fins are provided with steam inlets communicated with the gas phase working medium cavity, and the lower ends of the cooling fins are provided with liquid return ports communicated with the liquid storage cavity. According to the phase change radiator, through the design of the heat absorption evaporation flow channel and the working medium pump, it is ensured that the liquid level in the heat absorption evaporation flow channel is higher than the heat source mounting part, and heat of heat source parts with different heights is rapidly guided out and efficiently radiated.

Description

Technical Field

[0001] The present application relates to the technical field of phase change heat sinks, and in particular to a phase change heat sink and a phase change heat dissipation system suitable for multiple heat sources. Background Art

[0002] With the rapid development of semiconductor technology, the integration of high-power components is getting higher and higher, and the power density is getting higher and higher. The heat generated during operation is getting larger and larger, and the heat flux density is getting higher and higher. Conventional heat sinks can hardly meet the heat dissipation needs of high heat flux density. If the heat generated by the power device cannot be dissipated quickly and in time, the chip temperature in the power device will increase, which will cause the working efficiency to decrease and the service life to shorten, and even cause the device to be damaged and fail. Therefore, it is necessary to develop an efficient heat sink to solve the heat dissipation problem of high-power devices with high heat flux density and high heat.

[0003] In order to solve the heat dissipation problem of multi-heat source high heat flux chips, most manufacturers are currently developing three-dimensional (3D) phase change heat dissipation technology, that is, the heat sink substrate in contact with the chip (heat source) and the heat sink fins combined with the heat sink substrate are set as a connected sealed cavity, and a certain amount of heat transfer medium is filled in the sealed cavity. The heat transfer medium absorbs heat in the heat source joint in the heat sink substrate cavity and evaporates into gas, enters the heat sink fin cavity to condense and release heat, and conducts heat to the air flowing through the heat sink fins and takes it away. After the gas condenses, it returns to the heat sink substrate cavity by gravity to participate in the next evaporation and condensation heat conduction and heat dissipation cycle. This type of heat sink has a fast thermal conductivity rate and high heat dissipation efficiency. It meets the heat dissipation needs of the latest high heat flux chips in the 5G communication, power electronics and other industries. It is a new type of high-efficiency heat dissipation technology.

[0004] However, for chip heat dissipation with multiple heat sources, especially when the heat sources (chips) are not on the same horizontal plane, the lower heat sources are located below the liquid level of the heat transfer medium, and the upper heat sources are often located above the liquid level of the heat transfer medium. The heat dissipation of the upper heat source only relies on the thermal conductivity of the substrate, which leads to deterioration of heat dissipation and limits the application of the radiator. Summary of the invention

[0005] The purpose of the present application is to provide a phase change heat sink and a phase change heat dissipation system, which ensures that the liquid level in the heat absorption evaporation flow channel is higher than the heat source installation part through the design of the heat absorption evaporation flow channel and the working fluid pump to achieve rapid heat extraction and efficient heat dissipation of heat source components at different heights.

[0006] In a first aspect, the present application provides a phase change heat sink, comprising a substrate, heat dissipation fins and a working fluid pump.

[0007] The substrate is provided with a liquid storage chamber, an endothermic evaporation channel and a gas phase working medium chamber; the liquid storage chamber is provided at the lower side of the substrate for storing liquid phase heat transfer working medium; the gas phase working medium chamber is provided at the upper side of the substrate, the endothermic evaporation channel is provided between the liquid storage chamber and the gas phase working medium chamber and extends from bottom to top, the top of the endothermic evaporation channel is connected with the gas phase working medium chamber, the gas phase working medium chamber is provided with an overflow port and connected with the liquid storage chamber. The inlet of the working medium pump is connected with the liquid storage chamber, and the outlet of the working medium pump is connected with the bottom of the endothermic evaporation channel.

[0008] The substrate comprises a first surface and a second surface opposite to each other, and a plurality of heat source mounting parts are sequentially arranged from bottom to top in the area of ​​the first surface of the substrate corresponding to the heat absorption evaporation flow channel. A plurality of heat dissipation fins are installed on the second surface of the substrate; a condensation pipeline is arranged in each heat dissipation fin, a steam inlet of the condensation pipeline is arranged at the upper end of the heat dissipation fin, and a liquid return port of the condensation pipeline is arranged at the lower end of the heat dissipation fin, the steam inlet is connected to the gas phase working medium chamber, and the liquid return port is connected to the liquid storage chamber.

[0009] In an implementable scheme, the number of endothermic evaporation flow channels is at least two, which are arranged between the liquid storage chamber and the gas phase working fluid chamber and extend from bottom to top, the bottoms of the multiple endothermic evaporation flow channels are interconnected, and the tops of the multiple endothermic evaporation flow channels are interconnected with the gas phase working fluid chamber.

[0010] In an implementable solution, at least one endothermic evaporation channel is provided with a branch channel, the top of which is connected to the gas phase working medium chamber; a heat source mounting portion is also provided in the area of ​​the first surface of the substrate corresponding to the branch channel.

[0011] In an implementable solution, a liquid return cavity is provided in the substrate, the upper end of the liquid return cavity is communicated with the overflow port of the gas phase working medium cavity, and the lower end of the liquid return cavity is communicated with the liquid storage cavity.

[0012] In an implementable solution, the condensation pipes in the heat dissipation fins are composed of a plurality of grid-like pipes that are interconnected.

[0013] In an practicable solution, the heat dissipation fin is a composite plate structure, including a first plate and a second plate that are assembled together, and the condensation pipeline is formed by a rolling and blowing process or a mold forming and brazing process.

[0014] In an implementable solution, the bottom of the condensation pipeline of the heat dissipation fin is inclined, and the side away from the substrate is higher than the side close to the substrate; the liquid return port of the heat dissipation fin is set at the lowest point of the bottom of the condensation pipeline.

[0015] In an implementable solution, an enhanced evaporation heat exchange structure is provided on the inner wall of the heat-absorbing evaporation flow channel corresponding to the heat source mounting portion.

[0016] In an implementable solution, when the phase change heat sink is in operation, the liquid level in the heat absorption evaporation channel is at least higher than the height of the heat source mounting portion at the top.

[0017] In a second aspect, the present application provides a heat source heat dissipation system, comprising a heat source component, a working fluid pump controller and the aforementioned phase change radiator. The heat source component is mounted on a heat source mounting portion provided on the surface of a substrate of the phase change radiator, and the working fluid pump controller is used to obtain the temperature of the heat source component, and control the start and stop of the working fluid pump based on the obtained temperature.

[0018] Compared with the prior art, the beneficial effects of the present application include at least: when the phase change heat sink of the present application is working, the endothermic evaporation channel is filled with liquid phase working fluid, that is, the liquid level in the endothermic evaporation channel is at least higher than the height of the heat source mounting portion at the top, thereby enabling the heat source component at the top to be located below the liquid level of the liquid phase working fluid, thereby enabling the heat generated by the heat source components at different heights to be quickly dissipated through the phase change of the heat transfer working fluid, thereby improving the heat dissipation efficiency.

[0019] At the same time, the endothermic evaporation flow channel is a channel extending from bottom to top, which can form a good guiding effect. Specifically, the working fluid pump transports the liquid phase working fluid in the liquid storage chamber to the bottom of the endothermic evaporation flow channel, and driven by the working fluid pump, the liquid phase working fluid flows from bottom to top through the endothermic evaporation flow channel and absorbs heat and evaporates. The flow boiling heat transfer coefficient is high and the heat absorption rate is fast. Heat sources at different heights can quickly transfer heat to the phase change heat transfer working fluid, with good temperature uniformity and better heat dissipation.

[0020] In addition, the gas-liquid mixture coming from the heat-absorbing evaporation flow channel is separated into gas and liquid in this area, and only the gas phase working medium enters the condensation pipeline of the heat dissipation fin from the upper part for heat release and condensation, and the condensed liquid phase working medium returns to the liquid storage cavity at the bottom, so that the space occupied by the liquid in the heat dissipation fin is minimized, and most of the cavity area of ​​the condensation pipeline is used for heat dissipation and condensation. The heat dissipation fin area utilization rate is high, the temperature uniformity is good, and the heat dissipation capacity is large. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a three-dimensional diagram of a phase change heat sink according to an embodiment of the present application.

[0023] Figure 2This is a cross-sectional view of a multi-zone phase change heat sink along a direction parallel to the heat dissipation fins according to an embodiment of the present application.

[0024] Figure 3 This is a cross-sectional view of an embodiment of the present application after the heat source component is installed, taken along a direction parallel to the heat dissipation fins.

[0025] Figure 4 This is a structural cross-sectional view of a first type of heat-absorbing evaporation channel in a substrate according to an embodiment of the present application.

[0026] Figure 5 This is a cross-sectional view of the structure of a second type of heat-absorbing evaporation channel in a substrate shown in an embodiment of the present application.

[0027] Figure 6 This is a structural cross-sectional view of a third type of heat-absorbing evaporation channel in a substrate shown in an embodiment of the present application.

[0028] Figure 7 This is a structural cross-sectional view of a fourth type of heat-absorbing evaporation channel in a substrate shown in an embodiment of the present application.

[0029] Figure 8 for Figure 2 Section view along AA.

[0030] In the figure: 1. substrate; 01. substrate shell; 02. substrate cover; 11. liquid storage chamber; 111. heat source mounting part; 12. heat absorption evaporation flow channel; 121. branch flow channel; 13. gas phase working fluid chamber; 131. overflow port; 14. liquid return pipe chamber; 15. enhanced evaporation heat exchange structure; 2. heat dissipation fins; 201. condensation pipeline; 202. steam inlet; 203. liquid return port; 204. first plate; 205. second plate; 3. working fluid pump; 31. liquid inlet pipe; 32. liquid outlet pipe; 4. heat source component. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0033] like Figure 1 As shown, an embodiment of the present application provides a phase change heat sink, including a substrate 1, heat dissipation fins 2 and a working fluid pump 3.

[0034] like Figures 2 to 7 As shown, a liquid storage chamber 11, an endothermic evaporation channel 12 and a gas phase working medium chamber 13 are provided inside the substrate 1. The liquid storage chamber 11 is provided at the lower side of the inside of the substrate 1 for storing liquid phase heat transfer medium. The gas phase working medium chamber 13 is provided at the upper side of the inside of the substrate 1, and the endothermic evaporation channel 12 is provided between the liquid storage chamber 11 and the gas phase working medium chamber 13 and extends from bottom to top. The top of the endothermic evaporation channel 12 is connected with the gas phase working medium chamber 13, and the gas phase working medium chamber 13 is provided with an overflow port 131 and is connected with the liquid storage chamber 11. The substrate 1 may include a substrate shell 01 and a substrate cover plate 02, which are formed by splicing. A cavity structure is provided inside the substrate shell 01, and the substrate cover plate 02 may be a flat plate structure. After the substrate cover plate 02 and the substrate shell 01 are spliced ​​together, cavities such as the endothermic evaporation channel 12, the liquid storage chamber 11, and the gas phase working medium chamber 13 are formed. The inlet of the working fluid pump 3 is connected to the liquid storage chamber 11 through the liquid inlet pipe 31 , and the outlet of the working fluid pump 3 is connected to the bottom end of the heat absorption evaporation flow channel 12 through the liquid outlet pipe 32 .

[0035] like Figure 2 and Figure 3 As shown, the substrate 1 includes a first surface and a second surface opposite to each other, and a plurality of heat source mounting portions 111 are sequentially arranged from bottom to top in the area of ​​the first surface of the substrate 1 corresponding to the heat absorbing evaporation flow channel 12. A plurality of heat dissipating fins 2 are installed on the second surface of the substrate 1, and a condensation pipeline 201 is arranged in each heat dissipating fin 2. A steam inlet 202 of the condensation pipeline 201 is arranged at the upper end of the heat dissipating fin 2, and a liquid return port 203 of the condensation pipeline 201 is arranged at the lower end of the heat dissipating fin 2. The steam inlet 202 is connected to the gas phase working medium chamber 13, and the liquid return port 203 is connected to the liquid storage chamber 11.

[0036] When the phase change heat sink of the present application is working, Figure 3 As shown, the endothermic evaporation channel 12 is filled with liquid phase medium, that is, the liquid level in the endothermic evaporation channel 12 is at least higher than the height of the heat source mounting portion 111 at the top, thereby allowing the heat source component 4 (such as a chip) at the top to be located below the liquid level of the liquid phase medium, thereby allowing the heat generated by the heat source components 4 at different heights to be quickly dissipated through the phase change of the heat transfer medium, thereby improving the heat dissipation efficiency.

[0037] Specifically, the liquid phase working medium in the endothermic evaporation flow channel 12 absorbs the heat generated by the heat source components 4 at various heights, evaporates to form a gas phase working medium, gathers in the gas phase working medium chamber 13 at the top, then enters the heat dissipation fins 2 to release heat and condense into a liquid phase working medium, and then returns to the liquid storage chamber 11. Then, according to the temperature of the heat source components or according to the set time interval, the working medium pump 3 is intermittently started to transport the liquid phase working medium in the liquid storage chamber 11 to the endothermic evaporation flow channel 12 to replenish the liquid phase working medium consumption in the endothermic evaporation flow channel 12, and ensure that the liquid level in the endothermic evaporation flow channel 12 can be higher than the height of all heat source components. The redundant liquid phase working medium in the endothermic evaporation flow channel 12 returns to the liquid storage chamber 11 through the overflow port 131. This reciprocating process realizes a rapid heat conduction and heat dissipation cycle for multiple heat sources.

[0038] At the same time, the endothermic evaporation flow channel 12 is a channel extending from bottom to top, which can form a good guiding effect. Specifically, the working fluid pump 3 transports the liquid phase working fluid in the liquid storage chamber 11 to the bottom of the endothermic evaporation flow channel 12, and under the drive of the working fluid pump 3, the liquid phase working fluid flows from bottom to top through the endothermic evaporation flow channel 12 and absorbs heat and evaporates. The efficient flow boiling has a high heat transfer coefficient and a fast heat absorption rate. Heat sources at different heights can quickly transfer heat to the phase change heat transfer working fluid, with good temperature uniformity and better heat dissipation.

[0039] In addition, the gas-liquid mixture from the endothermic evaporation flow channel 12 is separated into gas and liquid in this area, and only the gas phase working medium enters the condensation pipeline 201 of the heat dissipation fin 2 from the top for heat release condensation, and the condensed liquid phase working medium returns to the liquid storage chamber 11 at the bottom, so that the space occupied by the liquid in the heat dissipation fin 2 is minimized, and most of the cavity area of ​​the condensation pipeline 201 is used for heat dissipation and condensation. The heat dissipation fin 2 has a high area utilization rate, good temperature uniformity, and a large heat dissipation capacity.

[0040] Furthermore, the partitioned cavities in the substrate 1 and the cavities of the condensation pipeline 201 in the heat dissipation fins 2 are interconnected, and heat conduction and heat dissipation are cyclically performed through phase change evaporation and condensation of the working fluid. The pressure balance in each partition is consistent, the temperature is uniform, the thermal conductivity rate is fast, the heat dissipation efficiency is high, and the structure is compact.

[0041] In one embodiment, if Figure 6 As shown, the number of the heat absorption evaporation flow channel 12 may be one.

[0042] In one embodiment, if Figure 4 and Figure 5 As shown, the heat absorbing evaporation flow channels 12 may be provided with multiple, at least two, arranged between the liquid storage chamber 11 and the gas phase working medium chamber 13 and extending from bottom to top, the bottoms of the multiple heat absorbing evaporation flow channels 12 are interconnected, and the tops of the multiple heat absorbing evaporation flow channels 12 are interconnected with the gas phase working medium chamber 13. The multiple heat absorbing evaporation flow channels 12 can be arranged in a horizontal and vertical array with multiple heat source components to meet the cooling needs of multiple heat sources.

[0043] Among them, the working fluid pump 3 transports the liquid working fluid in the liquid storage chamber 11 to the bottom of the multiple heat-absorbing evaporation flow channels 12, and drives the liquid working fluid to flow from bottom to top along the multiple heat-absorbing evaporation flow channels 12. The liquid working fluid flow in the multiple heat-absorbing evaporation flow channels 12 absorbs the heat generated by the heat source components 4 at various heights, evaporates to form a gas-phase working fluid, gathers in the gas-phase working fluid chamber 13 at the upper part, and enters the heat dissipation fins 2.

[0044] In one embodiment, if Figure 4 As shown, when there are multiple heat absorption and evaporation flow channels 12, the multiple heat absorption and evaporation flow channels 12 can be arranged to be evenly spaced and distributed.

[0045] In one embodiment, if Figure 5 As shown, when there are multiple endothermic evaporation channels 12, limited by the size of the substrate 1 or the installation requirements of the heat source component, parts of two or more endothermic evaporation channels 12 can be close to each other or completely connected.

[0046] In one embodiment, if Figure 7 As shown, at least one endothermic evaporation channel 12 may be provided with a branch channel 121, the top of which is connected to the gas phase working medium chamber 13. A heat source mounting portion 111 is also provided in the region of the first surface of the substrate 1 corresponding to the branch channel 121.

[0047] In one embodiment, if Figures 4 to 7 As shown, a liquid return lumen 14 may be provided in the substrate 1, the upper end of the liquid return lumen 14 is connected to the overflow port 131 of the gas phase working medium chamber 13, and the lower end of the liquid return lumen 14 is connected to the liquid storage chamber 11. The liquid return lumen 14 may also be a pipe section externally disposed outside the substrate 1 to achieve communication between the overflow port 131 and the liquid storage chamber 11.

[0048] In one embodiment, if Figure 2 and Figure 3 As shown, the condensation pipeline 201 in the heat dissipation fin 2 is composed of a plurality of interconnected grid-like pipelines. The grid-like pipelines can be hexagonal honeycomb, multiple U-shaped, diamond-shaped, triangular, circular ring-shaped or any combination thereof connected end to end.

[0049] In one embodiment, if Figure 8As shown, the heat dissipation fin 2 can be a composite plate structure, including a first plate 204 and a second plate 205 assembled together, and the condensation pipeline 201 is formed by a rolling and inflation process or a mold forming and brazing process. The materials of the first plate 204 and the second plate 205 are both metal materials with good thermal conductivity, specifically, they can include but are not limited to copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy or any combination of any one or more, that is, the first plate 204 and the second plate 205 can be a single layer material layer or a multi-layer material layer, but the inner layer is preferably an aluminum material layer.

[0050] In one example, the first plate 204 and the second plate 205 may be a copper-aluminum composite plate including a copper material layer and an aluminum material layer, or a stainless steel-aluminum composite plate including a stainless steel material layer and an aluminum material layer, or a titanium-aluminum composite plate including a titanium material layer and an aluminum material layer. The inner layers of the first plate 204 and the second plate 205 may be set as aluminum material layers and contact each other. When the first plate 204 and the second plate 205 are aluminum-copper composite plates, it can be ensured that the copper material layer is located on the outside, that is, the outer surface of the heat sink fin 2 is a copper layer, which can be directly welded and has excellent heat dissipation performance.

[0051] In one embodiment, if Figure 2 and Figure 3 As shown, the bottom of the condensation pipeline 201 of the heat dissipation fin 2 is inclined, with the side away from the substrate 1 being higher than the side close to the substrate 1. The liquid return port 203 of the heat dissipation fin 2 is arranged at the lowest point of the bottom of the condensation pipeline 201 to facilitate the reflux of the liquid working medium.

[0052] In one embodiment, if Figures 2 to 7 As shown, an enhanced evaporation heat exchange structure 15 is provided on the inner wall of the heat absorbing evaporation flow channel 12 corresponding to the heat source mounting portion 111. The enhanced evaporation heat exchange structure 15 can be a convex structure arranged in an array, and can be made by subtractive processing on the substrate 1 body. The enhanced evaporation heat exchange structure 15 increases the contact area with the liquid phase working medium, and can absorb heat and transfer heat faster.

[0053] like Figure 3 As shown, the embodiment of the present application provides a heat source heat dissipation system, including a heat source component 4 (such as a chip), a working fluid pump controller (not shown in the figure) and the aforementioned phase change heat sink. The heat source component 4 is mounted on a heat source mounting portion 111 provided on the surface of the substrate 1 of the phase change heat sink, and the working fluid pump controller is used to obtain the temperature of the heat source component 4, and control the start and stop of the working fluid pump 3 based on the obtained temperature.

[0054] The heat source component 4 may be a chip with a temperature detection function. The temperature data acquired by the chip itself is transmitted to the working fluid pump controller, so that the working fluid pump controller controls the start and stop of the working fluid pump 3 based on the acquired temperature.

[0055] An independent temperature detection sensor may also be arranged near the heat source component 4 and communicated with the working fluid pump controller. The temperature data acquired by the temperature detection sensor is transmitted to the working fluid pump controller, so that the working fluid pump controller controls the start and stop of the working fluid pump 3 based on the acquired temperature.

[0056] The multi-zone phase change heat sink of the present application can be widely used in 5G communications, AI large model training data centers and edge computing, high-power laser equipment, power electronics and new energy and other fields.

[0057] The above description is only a partial embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A phase change heat sink, comprising a substrate (1) and heat dissipation fins (2), characterized in that: It also includes a working fluid pump (3); The substrate (1) is provided with a liquid storage chamber (11), a heat absorbing evaporation channel (12) and a gas phase working medium chamber (13); the liquid storage chamber (11) is provided at the lower side of the substrate (1) for storing liquid phase heat transfer working medium; the gas phase working medium chamber (13) is provided at the upper side of the substrate (1); the heat absorbing evaporation channel (12) is provided between the liquid storage chamber (11) and the gas phase working medium chamber (13) and extends from bottom to top; the top end of the heat absorbing evaporation channel (12) is in communication with the gas phase working medium chamber (13); the gas phase working medium chamber (13) is provided with an overflow port (131) and is in communication with the liquid storage chamber (11); The inlet of the working fluid pump (3) is in communication with the liquid storage chamber (11), and the outlet of the working fluid pump (3) is in communication with the bottom end of the heat absorption evaporation channel (12); The substrate (1) comprises a first surface and a second surface that are opposite to each other, and a plurality of heat source mounting portions (111) are sequentially arranged from bottom to top in the region of the first surface of the substrate (1) corresponding to the heat absorption evaporation flow channel (12); A plurality of the heat dissipation fins (2) are mounted on the second surface of the substrate (1); each of the heat dissipation fins (2) is provided with a condensation pipeline (201); a steam inlet (202) of the condensation pipeline (201) is provided at the upper end of the heat dissipation fin (2); a liquid return port (203) of the condensation pipeline (201) is provided at the lower end of the heat dissipation fin (2); the steam inlet (202) is connected to the gas phase working fluid chamber (13); and the liquid return port (203) is connected to the liquid storage chamber (11).

2. The phase change heat sink according to claim 1, characterized in that: The number of the endothermic evaporation flow channels (12) is at least two, which are arranged between the liquid storage chamber (11) and the gas phase working medium chamber (13) and extend from bottom to top; the bottoms of the plurality of endothermic evaporation flow channels (12) are interconnected, and the tops of the plurality of endothermic evaporation flow channels (12) are interconnected with the gas phase working medium chamber (13).

3. The phase change heat sink according to claim 2, characterized in that: At least one of the endothermic evaporation channels (12) is provided with a branch channel (121), and the top end of the branch channel (121) is connected to the gas phase working medium chamber (13); The heat source mounting portion (111) is also provided in the region of the first surface of the substrate (1) corresponding to the branch flow channel (121).

4. The phase change heat sink according to claim 1, characterized in that: A liquid return tube cavity (14) is provided in the substrate (1), the upper end of the liquid return tube cavity (14) is connected to the overflow port (131) of the gas phase working medium cavity (13), and the lower end of the liquid return tube cavity (14) is connected to the liquid storage cavity (11).

5. The phase change heat sink according to claim 1, characterized in that: The condensation pipeline (201) in the heat dissipation fin (2) is composed of a plurality of grid-like pipelines that are interconnected.

6. The phase change heat sink according to claim 5, characterized in that: The heat dissipation fin (2) is a composite plate structure, comprising a first plate (204) and a second plate (205) assembled together, and the condensation pipeline (201) is formed by a rolling and inflation process or a mold forming and brazing process.

7. The phase change heat sink according to claim 1, characterized in that: The bottom of the condensation pipeline (201) of the heat dissipation fin (2) is inclined, with the side away from the substrate (1) being higher than the side close to the substrate (1); The liquid return port (203) of the heat dissipation fin (2) is arranged at the lowest point of the bottom of the condensation pipeline (201).

8. The phase change heat sink according to any one of claims 1 to 7, characterized in that: An enhanced evaporation heat exchange structure (15) is provided on the inner wall of the heat-absorbing evaporation flow channel (12) corresponding to the heat source mounting portion (111).

9. The phase change heat sink according to any one of claims 1 to 7, characterized in that: When the phase-change heat sink is in operation, the liquid level in the heat-absorbing evaporation channel (12) is at least higher than the height of the heat source mounting portion (111) at the top.

10. A heat source heat dissipation system, comprising a heat source component (4), characterized in that: It also includes a working fluid pump controller and a phase change heat sink as claimed in any one of claims 1 to 9; The heat source component (4) is mounted on a heat source mounting portion (111) provided on the surface of the substrate (1) of the phase change heat sink; The working fluid pump controller is used to obtain the temperature of the heat source component (4), and to control the start and stop of the working fluid pump (3) based on the obtained temperature.

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