Display panel and display device

Abstract

The invention provides a display panel and a display device. The display panel comprises a first edge area and a second edge area. The display panel comprises an array substrate, a plurality of light emitting devices and a packaging layer, and the packaging layer is located on the sides, away from the array substrate, of the light emitting devices. The array substrate comprises a substrate and a side line, the side line is located in the first edge area and comprises a first part and a second part which are electrically connected, the first part is located on the side, facing the packaging layer, of the substrate, and the second part is located on the side, away from the packaging layer, of the substrate; a first packaging part of the packaging layer is located in the first edge area, a second packaging part is located in the second edge area, and the shape of the first packaging part is different from that of the second packaging part. The first packaging part and the second packaging part are designed to be different, different requirements of the first packaging area and the second packaging area for electrostatic protection are met, the first edge area and the second edge area are made to have the small width as much as possible, and a narrow frame or no frame is achieved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display substrate and a display device. Background Art

[0002] In order to protect the light-emitting devices in the display panel, an encapsulation layer is usually prepared on the light-emitting devices. For example, in order to avoid scratching the LED chip when attaching the protective film material, an encapsulation layer can be prepared on the LED chip. The encapsulation layer can encapsulate the LED chip underneath it, so that when the protective film material is attached, the encapsulation layer protects the LED chip from scratches. However, for display panels with extremely narrow borders or no borders, such as the borderless display panels included in the spliced ​​screen, how the edge position of the encapsulation layer should be designed to ensure the performance of the display panel is a topic that needs to be studied. Summary of the invention

[0003] In view of this, embodiments of the present application provide a display panel and a display device to solve the above problems.

[0004] In a first aspect, the present application provides a display panel, comprising a first edge region and a second edge region; the display panel comprises an array substrate, a plurality of light-emitting devices and a packaging layer, the packaging layer being located on a side of the light-emitting device away from the array substrate; the array substrate comprises a substrate and a side wiring, the side wiring being located in the first edge region and comprising a first part and a second part being electrically connected, the first part being located on a side of the substrate facing the packaging layer and the second part being located on a side of the substrate away from the packaging layer; the first packaging portion of the packaging layer is located in the first edge region, the second packaging portion is located in the second edge region, and the shape of the first packaging portion is different from the shape of the second packaging portion.

[0005] In a second aspect, the present application provides a display device, comprising the display panel provided in the first aspect.

[0006] In the technical solution of the embodiment of the present application, according to the electrostatic protection requirements of the first edge region and the second edge region, the first encapsulation part in the first edge region and the second encapsulation part in the second edge region are designed to be different, so that the first edge region and the second edge region can obtain different electrostatic protection capabilities. In addition, the shapes of the first encapsulation part and the second encapsulation part are designed to be different, so that the first edge region and the second edge region can have as small a width as possible while meeting the different electrostatic protection requirements of the first encapsulation region and the second encapsulation region, so that the frame of the display panel is narrow or at least the edge region is frameless. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0008] Figure 1 A schematic diagram of a display panel provided in an embodiment of the present application; Figure 2 for Figure 1 A schematic cross-sectional view along the A1-A2 direction; Figure 3 for Figure 1 A schematic cross-sectional view along the B1-B2 direction; Figure 4 is a cross-sectional schematic diagram of a display panel related to an embodiment of the present application; Figure 5 for Figure 1 A schematic cross-sectional view along the A1-A2 direction; Figure 6 for Figure 1 A schematic cross-sectional view along the A1-A2 direction; Figure 7 for Figure 1 A schematic cross-sectional view along the A1-A2 direction; Figure 8 for Figure 1 A schematic cross-sectional view along the A1-A2 direction; Fig. 9 for Figure 1 A schematic cross-sectional view along the A1-A2 direction; Fig.10 for Figure 8 and Fig. 9 A partial schematic diagram of the Fig.11 for Figure 1 A schematic cross-sectional view along the C1-C2 direction; Fig.12 for Figure 1 A schematic cross-sectional view along the B1-B2 direction; Fig.13 for Figure 1 A schematic cross-sectional view along the C1-C2 direction; Fig.14 for Figure 1 A schematic cross-sectional view along the B1-B2 direction; Fig.15 for Figure 1 A schematic cross-sectional view along the C1-C2 direction; Fig.16 for Figure 1 A schematic cross-sectional view along the C1-C2 direction; Fig.17 for Figure 1 A schematic cross-sectional view along the C1-C2 direction; Fig.18 A schematic diagram of a display device provided in an embodiment of the present application; Fig.19 A schematic diagram of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0009] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0010] It should be clear that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0011] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "an" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0012] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0013] In the description of this specification, it is necessary to understand that the words such as "substantially", "approximately", "approximately", "about", "roughly", "substantially" and the like described in the claims and embodiments of the present application refer to what can be generally recognized within a reasonable process operation range or tolerance range, rather than an exact value.

[0014] It should be understood that although the terms first, second, etc. may be used to describe thresholds, preset values, directions, etc. in the embodiments of the present application, these should not be limited to these terms. These terms are only used to distinguish thresholds, preset values, directions, etc. from each other. For example, without departing from the scope of the embodiments of the present application, the first direction may also be referred to as the second direction, and similarly, the second direction may also be referred to as the first direction. The applicant of this case has provided a solution to the problems existing in the prior art through careful and in-depth research.

[0015] Figure 1 A schematic diagram of a display panel provided in an embodiment of the present application, Figure 2 for Figure 1 A schematic cross-sectional view along the A1-A2 direction, Figure 3 for Figure 1 A schematic cross-sectional view along the B1-B2 direction.

[0016] The present application embodiment provides a display panel 01, combined with Figure 1 and Figure 2 , Figure 3 The display panel 01 includes a first edge region R1 and a second edge region R2. The first edge region R1 and the second edge region R2 are both regions of the display panel 01 close to the edge of the display panel 01, and the first edge region R1 and the second edge region R2 may be regions close to different edges of the display panel 01.

[0017] For example, Figure 1 As shown, the display panel 01 includes a first edge L1 and the first edge L1 is located at one side of the display panel 01 in the first direction X, wherein the first edge region R1 is a region of the display panel 01 close to the first edge L1; the display panel 01 includes a second edge L2 and the second edge L2 is located at one side of the display panel 01 in the second direction Y, wherein the second edge region R2 is a region of the display panel 01 close to the second edge L2. In addition, the edge of the first edge region R1 may overlap with the first edge L1, and the edge of the second edge region R2 may overlap with the second edge L2.

[0018] It should be noted that Figure 1 This is only an illustration of the positional relationship between the first edge L1 and the second edge L2, and the positional relationship between the first edge region R1 and the second edge region R2. Figure 1 Other situations other than those shown in the examples are not limited in this application.

[0019] Combination Figure 1 and Figure 2 , Figure 3 The display panel 01 includes an array substrate 10, a plurality of light emitting devices 20 and an encapsulation layer 30. The light emitting devices 20 are located on one side of the array substrate 10 and the encapsulation layer 30 is located on a side of the light emitting devices 20 away from the array substrate 10.

[0020] The array substrate 10 in the display panel 01 is a substrate for controlling the light-emitting devices 20 . The array substrate 10 may include pixel circuits and signal lines that provide signals thereto.

[0021] The light emitting device 20 is a structure for emitting light in the display panel 01. The light emitting device 20 may be an organic light emitting diode (OLED), in which case the light emitting device 20 may be prepared on the array substrate 10 by a process such as evaporation; the light emitting device 20 may also be a sub-millimeter light emitting diode (Mini-LED), a micro light emitting diode (Micro-LED), etc. in which case the light emitting device 20 may be combined with the array substrate 10 by plugging, welding, bonding, etc.

[0022] The encapsulation layer 30 is located on the side of the light emitting device 20 away from the array substrate 10, and is used to protect the light emitting device 20. On the one hand, it prevents subsequent processes from causing wear to the light emitting device 20; on the other hand, it prevents external water and oxygen from invading the light emitting device 20 and the array substrate 10 and causing corrosion to them.

[0023] In addition, the encapsulation layer 30 is located on the side of the light emitting device 20 away from the array substrate 10, which can be regarded as the encapsulation layer 30 being located on the side of the light emitting device 20 facing the light emitting surface of the display panel 01. Therefore, the encapsulation layer 30 is preferably a light-transmitting structure. When the encapsulation layer 30 is a light-transmitting structure, the light emitted by the light emitting device 20 can be emitted from the light emitting surface of the display panel 01 after passing through the encapsulation layer 30. Among them, the encapsulation layer 30 can be made of a material that reduces the loss of the light emitted by the light emitting device 20 when transmitting the light emitted by the light emitting device 20.

[0024] In order to enable the array substrate 10 to receive and generate electric signals to drive the light emitting device 20, the array substrate 10 needs to be bound to an IC or a flexible circuit board. When it is necessary to ensure that the display panel 01 has a narrow frame or no frame, the IC and / or flexible circuit board bound to the array substrate 10 can be bound to the array substrate 10 on the side of the array substrate 10 away from the light emitting device 20.

[0025] The array substrate 10 includes a substrate 11 and a driving layer 12 located on a side of the substrate 11 facing the encapsulation layer 30 . The driving layer 12 may include transistors and / or pixel circuits, signal lines, and the like.

[0026] In addition, the array substrate 10 further includes a side wiring 13, which is used to electrically connect the signal line located on the side of the substrate 11 facing the light-emitting device 20 with the external electrode located on the side of the substrate 11 facing away from the light-emitting device 20. The external electrode located on the side of the substrate 11 facing away from the light-emitting device 20 is used to bind with the IC and / or the flexible circuit board, so that the IC and / or the flexible circuit board located on the side of the substrate 11 facing away from the light-emitting device 20 can perform signal interaction with the signal line located on the side of the substrate 11 facing the encapsulation layer 30.

[0027] Therefore, the side trace 13 includes an electrically connected first portion 131 and a second portion 132, wherein the first portion 131 is located on the side of the substrate 11 facing the encapsulation layer 30 and the second portion 132 is located on the side of the substrate 11 away from the encapsulation layer 30. The side trace 13 may also include a connecting portion 133, wherein the connecting portion 133 is located on the side surface of the array substrate 10 belonging to the first edge region R1, and the connecting portion 133 connects the first portion 131 and the second portion 132. The first portion 131 is used to electrically connect to at least part of the signal line located on the side of the substrate 11 facing the encapsulation layer 30, for example, the first portion 131 is electrically connected to the transfer electrode located on the side of the substrate 11 facing the encapsulation layer 30 and the transfer electrode is connected to at least part of the signal line located on the side of the substrate 11 facing the encapsulation layer 30; the second portion 132 is used to electrically connect to the external electrode located on the side of the substrate 11 away from the encapsulation layer 30 and the external electrode is used to electrically connect to the IC and / or the flexible circuit board located on the side of the substrate 11 away from the encapsulation layer 30.

[0028] like Figure 2 As shown, the side trace 13 is located in the first edge region R1, and the first edge region R1 includes the side trace 13 and the second edge region R2 does not include the side trace 13. The side trace 13 needs to be wound through the side of the substrate 11 facing the encapsulation layer 30 to the side of the substrate 11 facing away from the encapsulation layer 30. Due to the existence of the side trace 13, the probability of static electricity in the first edge region R1 is significantly greater than the probability of static electricity injury in the first edge region R1. Therefore, the first edge region R1 and the second edge region R2 have different requirements for static electricity protection.

[0029] In the embodiments of the present application, Figure 2 and Figure 3 The encapsulation layer 30 includes a first encapsulation portion 31 and a second encapsulation portion 32, the first encapsulation portion 31 is located in the first edge region R1 and the second encapsulation portion 32 is located in the second edge region R2, and the shape of the first encapsulation portion 31 is different from the shape of the second encapsulation portion 32. That is, the shape of the portion of the encapsulation layer 30 included in the first edge region R1 is different from the shape of the portion of the encapsulation layer 30 included in the second edge region R2.

[0030] In the technical solution of the embodiment of the present application, according to the electrostatic protection requirements of the first edge region R1 and the second edge region R2, the first encapsulation part 31 in the first edge region R1 and the second encapsulation part 32 in the second edge region R2 are designed to be different, so that the first edge region R1 and the second edge region R2 can obtain different electrostatic protection capabilities. In addition, the shapes of the first encapsulation part 31 and the second encapsulation part 32 are designed to be different, so that the first edge region R1 and the second edge region R2 can have as small a width as possible while meeting the different electrostatic protection requirements of the first encapsulation region and the second encapsulation region, so that the frame of the display panel 01 is narrow or at least the edge region is frameless.

[0031] In one embodiment of the present application, Figure 2 As shown, a surface 310 of the first packaging portion 31 facing away from the array substrate 10 is a curved surface.

[0032] Among them, the surface 310 of the first packaging part 31 facing away from the array substrate 10 may include a first curved surface portion and a second curved surface portion, and in a direction parallel to the plane where the array substrate 10 is located, the first curved surface portion is farther away from the edge of the display panel 01 than the second curved surface portion; and in a direction perpendicular to the plane where the array substrate 10 is located, the first curved surface portion is farther away from the array substrate 10 than the second curved surface portion.

[0033] like Figure 2 As shown, the closer the portion of the first encapsulation portion 31 is to the edge of the display panel 01, the smaller the distance between the surface 310 of the first encapsulation portion 31 facing away from the array substrate 10 and the array substrate 10. That is, in the first edge region R1, the distance between the surface 310 of the first encapsulation portion 31 facing away from the array substrate 10 and the array substrate 10 gradually decreases along the direction pointing to the edge of the display panel 01.

[0034] In addition, if Figure 2 As shown, the encapsulation layer 30 includes a lower surface 301 facing the array substrate 10 and substantially parallel to the plane where the array substrate 10 is located, and the encapsulation layer 30 also includes an upper surface 302 facing away from the array substrate 10 and substantially parallel to the plane where the array substrate 10 is located. Among them, the surface of the first encapsulation part 31 connected between the upper surface 301 and the lower surface 302 can be the surface 310 of the first encapsulation part 31 facing away from the array substrate 10, and the surface 310 is a curved surface.

[0035] Figure 4 It is a cross-sectional schematic diagram of a display panel related to an embodiment of the present application.

[0036] like Figure 4As shown, if the encapsulation layer 30 is located in the first edge region R1, the surface 303 connecting the lower surface 301 and the upper surface 302 of the encapsulation layer 30 is a plane perpendicular to the upper surface 302 and the lower surface 301, and a sharp corner 300 will be included between the surface 303 and the upper surface 302 and the lower surface 301 of the encapsulation layer 30. Static electricity is easily accumulated near the sharp corner 300. When the first edge region R1 includes the sharp corner 300, since the first edge region R1 also includes the side trace 13, a conductive path is formed between the side trace 13 in the first edge region R1 and the static electricity near the sharp corner 300, that is, the structure including the encapsulation layer 30 in the first edge region R1 is easily damaged by static electricity.

[0037] In the embodiment of the present application, by setting the surface 310 of the first packaging part 31 away from the array substrate 10 as a curved surface, the probability of static electricity accumulation in the first edge region R1 is reduced, and the risk of the film structure, signal lines, devices, etc. in the first edge region R1 being damaged by static electricity is reduced, thereby improving the yield of the display panel 01. In addition, by setting the surface 310 of the first packaging part 31 away from the array substrate 10 as a curved surface, the risk of cracking of the corners of the first packaging part 31 in the first edge region R1 during the process after the packaging layer 30 is prepared and / or during transportation is reduced.

[0038] Figure 5 for Figure 1 A schematic cross-sectional view along the A1-A2 direction.

[0039] like Figure 5 As shown, the display panel 01 may further include a protective film material 40, which is located on a side of the encapsulation layer 30 away from the array substrate 10, and is used to protect the film layer below from damage. The protective film material 40 and the encapsulation layer 30 may be bonded together by optical adhesive.

[0040] In the embodiment of the present application, since the first packaging part 31 has a certain width and the surface 310 facing away from the array substrate 10 is a curved surface, the protective film material 40 can be well bonded to the first packaging part 31 during the bonding process between the protective film material 40 and the packaging layer 30, thereby preventing bubbles from forming between the protective film material 40 and the first packaging part 31 to affect the visual effect of the display panel 01.

[0041] In a technical solution corresponding to the embodiment of the present application, the first packaging part 31 can be a self-leveling structure prepared by a self-leveling process, that is, after the light-emitting device 20 is obtained on the array substrate 10, a liquid packaging material can be prepared by dripping or coating, and the packaging material is subjected to gravity and surface tension of the packaging material, so that the packaging material forms a smooth arc surface in the first edge region R1. The packaging material can be an organic material such as epoxy resin.

[0042] Combination Figure 2 and Figure 3 The encapsulation layer 30 further includes a third encapsulation portion 33, which is located on the side of the first edge region R1 and the second edge region R2 away from the edge of the display panel 01, that is, the third encapsulation portion 33 is located outside the first edge region R1 and the second edge region R2. The first encapsulation portion 31 and the second encapsulation portion 32 are both portions of the encapsulation layer 30 adjacent to the edge of the display panel 01, and the third encapsulation portion 33 may be a portion of the encapsulation layer 30 away from the edge of the display panel 01, or in other words, the third encapsulation layer 30 is a portion of the encapsulation layer 30 located in the middle area of ​​the display panel 01. The third encapsulation layer 30 can be regarded as a regular portion located in most areas of the display panel 01.

[0043] In one embodiment of the present application, Figure 2 As shown, the width of the first packaging part 31 in a direction parallel to the plane of the substrate 11 is W1, which can be regarded as the width of the first packaging part 31 extending from the side of the first edge area R1 away from the edge of the display panel 01 to the direction where the edge of the display panel 01 is located is W1.

[0044] Please continue to refer to Figure 2 , the thickness of the third encapsulation part 33 in the direction perpendicular to the plane where the substrate 11 is located is H1, that is, the thickness of the conventional part of the encapsulation layer 30 away from the edge of the display panel 01 in the direction perpendicular to the plane where the substrate 11 is located is H1. It should be noted that the structure below the third encapsulation part 33 does not necessarily have a flat surface, which results in that the surface of the third encapsulation part 33 facing the array substrate 10 is not necessarily a plane. H1 can be the maximum thickness of the third encapsulation part 33 in the direction perpendicular to the plane where the substrate 11 is located, H1 can also be the average thickness of the third encapsulation part 33 in the direction perpendicular to the plane where the substrate 11 is located, and H1 can also be the thickness corresponding to the relatively flat area of ​​the surface of the third encapsulation part 33 facing the array substrate 10. The thickness of the third encapsulation part 33 is usually large, so no matter which of the above methods is used to characterize H1, it can basically reflect the overall thickness of the third encapsulation part 33.

[0045] In this embodiment, W1 is greater than or equal to 10 H1, that is, the width of the first encapsulation part 31 is greater than or equal to 10 times the thickness of the third encapsulation part 33. The technical solution provided in this embodiment can make the width of the first encapsulation part 31 larger. When the surface 310 of the first encapsulation part 31 facing away from the array substrate 10 is a curved surface, the curved surface can be a curved surface with a gentle curvature, so that the risk of a sharp point appearing in the first edge area R1 is greatly reduced; in addition, when the display panel 01 also includes a protective film material 40 bonded to the encapsulation layer 30, the curved surface with a gentle curvature in the first encapsulation part 31 can make the bonding yield of the protective film material 40 and the first encapsulation part 31 very high. Furthermore, when the first encapsulation part 31 is prepared by a self-leveling process, the first encapsulation part 31 with a larger width is easier to obtain, and the process difficulty is low.

[0046] In a technical solution corresponding to this embodiment, combined with Figure 1 and Figure 2 , Figure 3 The first encapsulation part 31, the second encapsulation part 32 and the third encapsulation part 33 are an integrated structure, so the first encapsulation part 31, the second encapsulation part 32 and the third encapsulation part 33 are respectively parts located at different positions in the encapsulation layer 30. In the present technical solution, the third encapsulation part 33 is connected to the first encapsulation part 31 and the second encapsulation part 32 and is connected to form an integrated structure.

[0047] In one implementation, the surface of the first packaging part 31 that is away from the array substrate 10 may begin to have an arc surface starting from the position connected to the third packaging part 33. Then, when preparing the packaging layer 30, the packaging material may be dripped near the position of the third packaging part 33 close to the first edge area R1. By controlling the viscosity, dripping amount, and dripping position of the packaging material, the shape of the packaging material when it spreads to the edge of the display panel 01 can be controlled to form a self-leveling structure.

[0048] Figure 6 for Figure 1 A schematic cross-sectional view along the A1-A2 direction.

[0049] In one embodiment of the present application, Figure 6 As shown, the array substrate 10 includes a first film layer 50, and the first film layer 50 is located between the encapsulation layer 30 and the substrate 11. The first encapsulation portion 31 contacts the first film layer 50, and the edge of the first encapsulation portion 31 close to the edge of the display panel 01 contacts the first film layer 50. For example, Figure 6 The first edge region R1 shown is adjacent to the edge of the right side of the display panel 01. Figure 6 The edge of the first packaging portion 31 shown in the figure close to the edge of the display panel 01 is the right edge of the first packaging portion 31 .

[0050] In this embodiment, the first film layer 50 also includes a portion located in the first edge region R1, and the portion of the first film layer 50 located in the first edge region R1 extends more relative to the first packaging portion 31 in the direction of the edge of the display panel 01. Therefore, the surface of the portion of the first film layer 50 located in the first edge region R1 away from the substrate 11 can be used as the bearing surface of the first packaging portion 31, which can also enable the first packaging portion 31 to obtain a relatively flat bearing surface, which is conducive to reducing the probability of the prepared first packaging portion 31 having a sharp point. If the surface of the first packaging portion 31 facing away from the array substrate 10 is a curved surface, the technical solution provided in this embodiment is conducive to the formation of the curved surface.

[0051] In addition, when the first packaging portion 31 is obtained by adopting a self-leveling process, the packaging material in the first edge region R1 needs to flow on the first film layer 50 to form a self-leveling structure, and it is easier to obtain a smooth curved surface.

[0052] In one embodiment of the present application, the first film layer 50 can be a shading layer, which can reduce the amount of external ambient light entering the array substrate 10, thereby reducing the reflection of ambient light and improving the display effect of the display panel 01; at the same time, it can avoid changes in the transistor characteristics of the array substrate 10 and ensure the driving effect of the display panel 01.

[0053] Figure 7 for Figure 1 A schematic cross-sectional view along the A1-A2 direction.

[0054] In a technical solution corresponding to this embodiment, as Figure 7 As shown, the first film layer 50 may be located between the light emitting device 20 and the substrate 11. For example, the first film layer 50 may be located between the light emitting device 20 and the driving layer 12, and the driving layer 12 may include transistors and signal lines.

[0055] In a technical solution corresponding to this embodiment, as Figure 6 As shown, the first film layer 50 includes a light shielding structure 51, and the light shielding structure 51 is at least located between adjacent light emitting devices 20. The light shielding structure 51 is used to prevent external ambient light from being emitted to the array substrate 10 through the area between adjacent light emitting devices 20.

[0056] In an implementation method corresponding to the present technical solution, if Figure 6 As shown, the thickness of the light shielding structure 51 in the first film layer 50 in the direction perpendicular to the plane where the substrate 11 is located is greater than or equal to 5 μm, and the thickness of the portion of the first film layer 50 located in the first edge region R1 in the direction perpendicular to the plane where the substrate 11 is located is also greater than or equal to 5 μm, and the portion of the first film layer 50 located in the first edge region R1 is relatively flat. For example, the first film layer 50 can be a film layer made of organic material.

[0057] In the present implementation, when the portion of the first film layer 50 located in the first edge region R1 contacts the first packaging part 31 and supports the first packaging part 31, since the first film layer 50 has a larger thickness, that is, has better flatness, the surface of the first packaging part 31 facing away from the array substrate 10 is easier to be prepared as a smooth curved surface, and is also more conducive to using a self-leveling process to prepare the first packaging part 31 with a self-leveling structure.

[0058] In addition, the optical density of the first light shielding structure 51 may be less than or equal to 0.4. When the thickness of the light shielding structure 51 is greater than or equal to 5 μm, even if its optical density is less than or equal to 0.4, its light shielding effect can meet the requirements.

[0059] Since the shading structure 51 is located between the light-emitting devices 20 and the thickness of the shading structure 51 is greater than or equal to 5μm, the risk of the shading structure 51 climbing onto the light-emitting device 20 increases when preparing the first film layer 50. If the shading structure 51 climbs onto the light-emitting device 20, the amount of light emitted by the light-emitting device 20 from the light-emitting surface of the display panel 01 will be reduced. However, the light density of the shading structure 51 in the present implementation is less than or equal to 0.4, so the shading structure 51 that climbs onto the light-emitting device 20 has little effect on the amount of light emitted by the light-emitting device 20. Therefore, the thickness of the shading structure 51 of the display panel 01 provided by the present implementation is greater than or equal to 5μm and the light density is less than or equal to 0.4, which takes into account both the shading effect of the first film layer 50 and the luminous efficiency of the display panel 01.

[0060] Figure 8 for Figure 1 A schematic cross-sectional view along the A1-A2 direction, Fig. 9 for Figure 1 A schematic cross-sectional view along the A1-A2 direction.

[0061] In one embodiment of the present application, Figure 8 and Fig. 9 As shown, the array substrate 10 includes a second film layer 14, and the second film layer 14 contacts the surface of the side wiring 13 away from the substrate 11. The second film layer 14 can be used as a protective film layer to protect the side wiring 13. Figure 8 and Fig. 9 As shown, the second film layer 14 includes a portion located on the side surface of the display panel 01 and on the same side as the side trace 13, and the second film layer 14 includes a portion located on the side of the substrate 11 away from the encapsulation layer 30 and a portion located on the side of the substrate 11 facing the encapsulation layer 30. For example, Figure 8 and Fig. 9 As shown, the second film layer 14 covers the surface of the side trace 13 that is not in contact with the substrate 11 .

[0062] In this embodiment, at least part of the first encapsulation portion 31 contacts the second film layer 14, that is, the part of the second film layer 14 located on the side of the substrate 11 facing the encapsulation layer 30 is at least arranged in the first edge region R1 and contacts at least part of the first encapsulation portion 31. Figure 8 and Fig. 9 As shown, at least a portion of the second film layer 14 located on the side of the substrate 11 facing the encapsulation layer 30 is disposed between the first encapsulation portion 31 and the first portion 131. Therefore, in the first edge region R1, at least a portion of the second film layer 14 serves as a bearing surface for the first encapsulation portion 31.

[0063] In a technical solution corresponding to the present embodiment, the second film layer 14 includes a third part 141, and the third part 141 is located between the substrate 11 and the packaging layer 30. Since at least part of the first packaging part 31 is in contact with the second film layer 14, at least part of the third part 141 is in contact with at least part of the first packaging part 31.

[0064] The edge of the third portion 141 away from the edge of the display panel 01 is located on the side of the first packaging portion 31 away from the edge of the display panel 01. For example, Figure 8 The first edge region R1 shown is adjacent to the edge of the right side of the display panel 01. Figure 8 The edge of the third portion 141 away from the edge of the display panel 01 is the left edge of the third portion 141 , and the left edge of the third portion 61 is further to the left than the left edge of the first packaging portion 31 .

[0065] In addition, along the direction perpendicular to the plane where the substrate 10 is located, a portion of the third portion 141 may not overlap with the first packaging portion 31. Figure 8 As shown, a portion of the third portion 141 close to the edge of the display panel 01 does not overlap with the first packaging portion 31 .

[0066] In this embodiment, the second film layer 14 includes a portion located between the first packaging part 31 and the substrate 11, and the portion of the second film layer 14 extends more in the direction away from the edge of the display panel 01 relative to the first packaging part 31. Therefore, the surface of the portion of the second film layer 14 located between the first packaging part 31 and the substrate 11 away from the substrate 11 serves as the bearing surface of the first packaging part 31, thereby enabling the first packaging part 31 to obtain a relatively flat bearing surface, which is conducive to reducing the probability of the prepared first packaging part 31 having a sharp point. If the surface of the first packaging part 31 facing away from the array substrate 10 is a curved surface, the technical solution provided in this embodiment is conducive to the formation of the curved surface.

[0067] In addition, when the first packaging portion 31 is obtained by adopting a self-leveling process, the packaging material in the first edge region R1 needs to flow on the second film layer 14 to form a self-leveling structure, and it is easier to obtain a smooth curved surface.

[0068] In this embodiment, there may be a large distance between the edge of the third portion 141 away from the edge of the display panel 01 and the edge of the display panel 01 , so that the second film layer 14 can effectively protect the side traces 13 on the side of the substrate 11 facing the encapsulation layer 30 .

[0069] In one embodiment of the present application, Fig. 9 As shown, the array substrate 10 includes a first film layer 50 , which is located between the packaging layer 30 and the substrate 11 ; the second film layer 14 includes a third portion 141 , which is located between the substrate 11 and the packaging layer 30 .

[0070] The first packaging part 31 includes a first sub-packaging part 311 and a second sub-packaging part 312, and the second sub-packaging part 312 is located on a side of the first sub-packaging part 311 close to the edge of the display panel 01. The first sub-packaging part 311 is in contact with the first film layer 50, and the second sub-packaging part 312 is in contact with the third part 141. That is, the portion of the first film layer 50 located in the first edge region R1 serves as a bearing surface of a portion of the first packaging part 31 that is relatively far from the edge of the display panel 01, and the portion of the second film layer 14 located on the side of the substrate 11 facing the packaging layer 30 and located in the first edge region R1 serves as a bearing surface of a portion of the first packaging part 31 that is relatively close to the edge of the display panel 01.

[0071] In this embodiment, a portion of the first film layer 50 and a portion of the second film layer 14 are spliced ​​together to serve as the bearing surface of the first packaging portion 31. Therefore, there can be a large distance between the portion of the first film layer 50 located in the first edge region R1 and the edge of the display panel 01, so as to avoid the first film layer 50 flowing toward the side surface of the display panel 01 to produce an uneven structure. In addition, there can also be a large distance between the edge of the third portion 141 away from the edge of the display panel 01 and the edge of the display panel 01, so that the second film layer 14 can effectively protect the side wiring 13 on the side of the substrate 11 facing the packaging layer 30.

[0072] In a technical solution corresponding to this embodiment, as Fig. 9 As shown, the surface of the first film layer 50 away from the substrate 11 is flush with the surface of the third portion 141 away from the substrate 11. In this technical solution, the distance between the surface of the first film layer 50 away from the substrate 11 and the substrate 11 is substantially equal to the distance between the surface of the fourth portion away from the substrate 11 and the substrate 11.

[0073] The bearing surface for bearing the first packaging part 31 obtained by splicing the first film layer 50 and the third part 141 is a flat structure, which is conducive to reducing the probability of the first packaging part 31 having a sharp point. If the surface of the first packaging part 31 facing away from the array substrate 10 is a curved surface, the technical solution provided in this embodiment is conducive to the formation of the curved surface. In addition, when the first packaging part 31 is obtained by a self-leveling process, the packaging material in the first edge region R1 needs to flow on the bearing surface to form a self-leveling structure, and it is easier to obtain a smooth curved surface.

[0074] In a technical solution corresponding to the present embodiment, if the difference between the wetting angle of the first film layer 50 and the wetting angle of the second film layer 14 is less than a preset value, the wetting degree of the first film layer 50 and the second film layer 14 by the packaging material is not much different. For example, if the wetting angle of the first film layer 50 is the same as the wetting angle of the second film layer 14, the wetting degree of the first film layer 50 and the second film layer 14 by the packaging material is the same.

[0075] In one implementation, the first film layer 50 and the second film layer 14 are made of the same material, so that the encapsulation material has the same degree of wetting on the first film layer 50 and the second film layer 14 .

[0076] In this embodiment, the wetting degree of the packaging material on the first film layer 50 and the second film layer 14 is not much different. Therefore, when the packaging material forms the packaging layer 30, the surface of the first packaging part 31 away from the array substrate 10 is easy to form a relatively smooth arc surface. When the first packaging part 31 is obtained by a self-leveling process, the packaging material in the first edge region R1 flows on the first film layer 50 and the second film layer 14 to form a self-leveling structure, and it is easier to obtain a smooth arc surface.

[0077] In one embodiment of the present application, the second film layer 14 may be a light shielding layer, which can reduce the risk of the side trace 60 being detected by the human eye. In addition, when the third portion 141 in the second film layer 14 serves as the bearing surface of the first packaging portion 31 and when the first edge region R1 includes the light emitting device 20, the third portion 141 can block the external ambient light from entering the array substrate 10.

[0078] Fig.10 for Figure 8 and Fig. 9 A partial schematic diagram of the .

[0079] In one embodiment of the present application, Fig.10 As shown, the thickness of the first portion 131 in the direction perpendicular to the plane where the substrate 11 is located is H4, and the thickness of the third portion 141 in the direction perpendicular to the plane where the substrate 11 is located is H5, and H5>H4. That is, the thickness of the third portion 141 covering the first portion 131 is greater than the thickness of the first portion 131.

[0080] When the third portion 141 serves as at least a partial bearing surface of the first packaging portion 31, the flatness of the surface of the third portion 141 facing the first packaging portion 31 is affected by the structure below the third portion 141. By setting the thickness of the third portion 141 to be greater than the thickness of the first portion 131 below it, the flatness of the surface of the third portion 141 facing the first packaging portion 31 is less affected by the first portion 131, that is, the flatness of the surface of the third portion 141 facing the first packaging portion 31 is better.

[0081] In a technical solution corresponding to this embodiment, H5>5 H4, that is, the thickness of the third part 141 covering the first part 131 is greater than 5 times the thickness of the first part 131. When the thickness of the third part 141 is greater than 5 times the thickness of the first part 131, the flatness of the surface for supporting the first packaging part 31 is basically not affected by the thickness of the first part 131 below it. The thickness of the first portion 131 along a direction perpendicular to the plane where the substrate 11 is located is about 1 μm.

[0082] In one embodiment of the present application, Figure 3 As shown, the surface of the second encapsulation part 32 facing the edge of the display panel 01 is an inclined first plane 320, that is, in the second edge region R2, the side surface connecting the lower surface 301 and the upper surface 302 of the encapsulation layer 30 is an inclined first plane 320. That is, the portion of the encapsulation layer 30 located in the second edge region R2 includes a chamfered structure.

[0083] In this embodiment, the chamfered structure prevents the encapsulation layer 30 from having an obvious tip in the second edge region R2 ; in addition, considering the thickness of the encapsulation layer 30 , etc., the width of the chamfered structure parallel to the plane where the substrate 11 is located will not be too large.

[0084] In one embodiment of the present application, Figure 3 As shown, the angle between the first plane 320 and the substrate 11 is α, 30°≤α≤60°, that is, the inclination angle of the first plane 320 is between 30° and 60°.

[0085] If the first plane 320 is too flat, its width in the direction parallel to the plane of the substrate 11 is larger. At this time, if the encapsulation layer 30 is bonded to the protective film material 40, the protective film material 40 is easy to bond to the first plane 320 of the second encapsulation part 32; and because the first plane 320 is a chamfered structure, bubbles are easy to appear when the protective film material 40 is bonded to the second encapsulation part 32, affecting the visual effect of the display panel 01. If the first plane 320 is too steep, there is a greater risk of cracking during preparation and transportation. When the inclination angle of the first plane 320 is between 30° and 60°, it will not be too flat or too steep, alleviating the above problems.

[0086] Fig.11 for Figure 1 A schematic cross-sectional view along the C1-C2 direction.

[0087] In one embodiment of the present application, Fig.11 As shown, the array substrate 10 includes a second film layer 14, and the display panel 01 also includes a third film layer 60. The second film layer 14 is in contact with the surface of the first portion 131 away from the substrate 11, as shown in FIG. Fig.11 As shown, the second film layer 14 can contact the surface of the side wiring 13 away from the substrate 11 to protect the side wiring 13. The third film layer 60 at least contacts the side surface of the array substrate 10 in the second edge region R2 and the first plane 320, as shown in FIG. Fig.11 As shown, the third film layer 60 is attached to the side surface and the first plane of the array substrate 10 .

[0088] In the embodiment of the present application, the third film layer 60 and the second film layer 14 are made of the same material, and the third film layer 60 and the second film layer 14 can be prepared by using the same material and the same process. In addition, the second film layer 14 and the third film layer 60 are both light shielding layers, and the second film layer 14 covers the surface of the side wiring 13 away from the base substrate 10, which can reduce the risk of the side wiring 60 being detected by the human eye; the third film layer 60 can also reduce the risk of the metal or other reflective structures exposed in the edge area of ​​the second edge area R2 being detected by the human eye.

[0089] In a technical solution corresponding to this embodiment, the third film layer 60 is conformally attached to the first plane 320. For example, Fig.11 As shown, after the second packaging portion 32 is formed, that is, after the first plane 320 is obtained, the third film layer 60 is prepared and part of the third film layer 60 is conformally deposited on the first plane 320 .

[0090] In one embodiment of the present application, Figure 3 and Fig.11As shown, in the second edge region R2, the angle between the surface of the array substrate 10 facing the encapsulation layer 30 and the side surface of the array substrate 10 is 90°. That is, the array substrate 10 is not chamfered near the position near the encapsulation layer 30 in the second edge region R2, but the second encapsulation portion 32 near this position is chamfered, which reduces the risk of cracking near this position of the display panel; in addition, if the array substrate 10 is not chamfered near the position near the encapsulation layer 30 in the second edge region R2, the width of the second edge region R2 is relatively narrow, which is conducive to the display panel 01 to achieve a narrow frame or no frame When the angle between the surface of the array substrate 10 facing the encapsulation layer 30 and the side surface of the array substrate 10 is 90°, it is not necessary to perform cutting, grinding and other processes for chamfering at this position. This reduces the gap problem caused by cutting and grinding in the second edge region R2 of the film structure located on the side of the substrate 11 facing the encapsulation layer 30 in the array substrate 10, thereby ensuring the display effect of the display panel 01.

[0091] Fig.12 for Figure 1 A schematic cross-sectional view along the B1-B2 direction.

[0092] An embodiment of the present application, such as Fig.12 As shown, in the second edge region R2, the surface of at least part of the film layer of the array substrate 10 located on the side of the substrate 11 facing the encapsulation layer 30 facing the edge of the display panel 01 is an inclined second plane 100, and the angle between the second plane 100 and the substrate 11 is α. Fig.12 As shown, the second plane 100 and the first plane 320 are located in the same plane.

[0093] In one embodiment of the present application, in the first edge region R1 , the surface between the upper surface of the array substrate 10 facing the encapsulation layer 30 and its side surface is an inclined plane structure, thereby reducing the risk of disconnection between the side trace 13 located on the side surface of the display panel 01 and the first portion 131 .

[0094] In addition, in the first edge region R1 and the second edge region R2 , the surface between the lower surface of the array substrate 10 away from the encapsulation layer 30 and the side surface thereof may also be an inclined plane structure to reduce the risk of cracking.

[0095] It should be noted that the planes involved in the embodiments of the present application are all planes within the range of process error, and are also planes that can be obtained with existing process accuracy.

[0096] In one embodiment of the present application, Fig.11 , Fig.13 and Fig.14As shown, the width of the first packaging portion 31 in a direction parallel to the plane where the substrate 11 is located is greater than the width of the second packaging portion 32 in a direction parallel to the plane where the substrate 11 is located.

[0097] In the embodiment of the present application, since the first edge region R1 includes the side wiring 13, the first edge region R1 has a higher demand for electrostatic protection, and the larger the width of the first packaging portion 31, the smoother its arc surface, and the less likely it is to have a sharp point. Therefore, setting the width of the first packaging portion 31 to be larger can make its structure meet the electrostatic protection needs of the first edge region R1 as much as possible; in addition, the difficulty of bonding the protective film material 40 to the first packaging portion 31 is lower and the bonding yield is higher, and the visual effect of the first edge region R1 is avoided to the greatest extent possible from being significantly different from that of other regions.

[0098] In the embodiment of the present application, since the second edge region R2 does not include the side wiring 13, the second edge region R2 has a lower demand for electrostatic protection than the first edge region R1. Taking into account the risk of the display panel 01 cracking in the second edge region R2, the second packaging portion 32 can be set to include an inclined first plane 320. Among them, the inclination angle of the first plane 320 can be relatively large, so that the width of the second packaging portion 32 is relatively small. If the width of the second packaging portion 32 is large, if the light emitted by the light-emitting device 20 is emitted through the second packaging portion 32, the light path and light amount of the light emitted are significantly different from those of other regions. Therefore, setting the width of the second packaging portion 32 to be smaller can minimize the influence of the thickness change of the packaging portion 30 on the light emitting effect of the display panel 02. In addition, if the protective film material 40 is not bonded to the second packaging part 32 in the second edge area R2, when the width of the second packaging part 32 is smaller, the area where the packaging part 30 is not bonded to the protective film material 40 is smaller, that is, the visual effect difference problem caused by the part of the packaging part 30 not bonding to the protective film material 40 in the display panel 01 is relatively small.

[0099] In one embodiment of the present application, Fig.11 , Fig.13 and Fig.14 As shown, along a direction perpendicular to the plane where the display panel 01 is located, the first encapsulation portion 31 overlaps with the light emitting device 20 and the second encapsulation portion 32 does not overlap with the light emitting device 20 .

[0100] In this embodiment, even if the width of the first encapsulation part 31 is larger than the width of the second encapsulation part 32, the first encapsulation part 31 overlaps with the light emitting device 20, so the existence of the first encapsulation part 31 does not increase the border width of the display panel 01. In addition, even if the thickness change of the first encapsulation part 31 affects the emission of light emitted by the light emitting device 20, since the arc surface of the first encapsulation part 31 is smoother, the light emission effect of the first edge region R1 where the first encapsulation part 31 is located will not have a sudden change, that is, the display effect of the first edge region R1 is relatively good.

[0101] In addition, the second packaging portion 32 does not overlap with the light-emitting device 20 , so the influence of the thickness change of the packaging portion 30 on the light emitting effect of the display panel 02 can be minimized.

[0102] Fig.13 for Figure 1 A schematic cross-sectional view along the C1-C2 direction.

[0103] In one embodiment of the present application, Fig.13 As shown, the display panel 01 further includes a protective film 40, which is located on a side of the encapsulation layer 30 away from the array substrate 10. The protective film 40 and the encapsulation layer 30 can be bonded together by optical adhesive. The protective film 40 is used to protect the encapsulation layer 30.

[0104] In this embodiment, if Fig.13 As shown, the protective film material 40 is attached to the first packaging part 31 and is not attached to the second packaging part 32. Fig.13 As shown, the protective film material 40 is bent in the first edge area R1 toward the direction of the surface of the first packaging part 31 away from the array substrate 10 and is adhered to the surface of the first packaging part 31 away from the array substrate 10; while the protective film material 40 is not bent in the direction of the first plane 320 in the second border area R2, but maintains a shape basically the same as the part on the third packaging part 33.

[0105] Since the width of the second packaging portion 32 is relatively small, the visual effect difference problem in the display panel 01 caused by the part of the packaging portion 30 not being in contact with the protective film material 40 is relatively small.

[0106] Fig.14 for Figure 1 A schematic cross-sectional view along the B1-B2 direction.

[0107] In a technical solution corresponding to the present embodiment, the display panel 01 further includes a filling layer 70, the filling layer 70 is in contact with at least the side surface of the array substrate 10 and the first plane 320 in the second edge region R2, and a portion of the filling layer 70 fills the gap between the array substrate 10 and the protective film material 40 in the second edge region R2. Since the protective film material 40 is not in contact with the first plane 320, in order to support the protective film material 40, the filling layer 70 may be provided on the side surface in the second edge region R2, and the filling layer 70 in the second edge region R2 may be in contact with the protective film material to effectively support the protective film material 40 and prevent the protective film material 40 from warping in the second edge region R2.

[0108] Fig.15 for Figure 1 A cross-sectional diagram along the C1-C2 direction, Fig.16 for Figure 1 A schematic cross-sectional view along the C1-C2 direction.

[0109] In addition, the filling layer 70 not only fills the gap between the array substrate 10 and the protective film material 40 in the second edge region R2, but also fills the gap between the array substrate 10 and the protective film material 40 in the first edge region R1. Fig.15 and Fig.16 As shown, the filling layer 70 is in contact with at least the side surface of the second film layer 14 in the first edge region R1 , and a portion of the filling layer 70 fills the gap between the second film layer 14 and the protective film material 40 .

[0110] In one technical solution, Fig.15 As shown, the first edge region R1 may include the second film layer 14 and the filling layer 70 , and the second edge region R2 may include the third film layer 60 and the filling layer 70 .

[0111] In one technical solution, Fig.16 As shown, the first edge region R1 may include the second film layer 14 and the filling layer 70, and the second edge region R2 may not include the third film layer 60 but include the filling layer 70. When the second edge region R2 does not include the third film layer 60, the width of the second edge region R2 may be minimized.

[0112] In one implementation, the filling layer 70 is a light shielding layer, and the filling layer 70 minimizes the probability that the reflective structure such as metal in the edge area of ​​the display panel 01 is visible to the human eye.

[0113] In one implementation, the filling layer 70 is a light-transmitting structure.

[0114] Fig.17 for Figure 1 A schematic cross-sectional view along the C1-C2 direction.

[0115] In a technical solution corresponding to the embodiment of the present application, as Fig.17 As shown, the display panel 01 further includes an electrostatic conductive layer 80, at least part of which is located on a side of the filling layer 70 close to the edge of the display panel 01. The electrostatic conductive layer 80 may be a light shielding layer. In addition, the electrostatic conductive layer 80 may include low-resistance ink, for example, the electrostatic conductive layer 80 may be made of a low-resistance ink process.

[0116] The electrostatic conductive layer 80 can reduce the risk of static electricity outside the display panel 01 entering the display panel 01 through the side surface. When the filling layer 70 is a light-transmitting structure, the electrostatic conductive layer 80 is a light-shielding layer, which can minimize the probability of reflective structures such as metal in the edge area of ​​the display panel 01 being seen by the human eye.

[0117] Fig.18 A schematic diagram of a display device provided in an embodiment of the present application, Fig.19 A schematic diagram of a display device provided in an embodiment of the present application.

[0118] Based on the same inventive concept, an embodiment of the present invention further provides a display device, such as Fig.18 As shown, the display device includes the above-mentioned display panel 01. Of course, Fig.18 The display device shown is for illustration only, and the display device may be any electronic device with a display function, such as a mobile phone, a tablet computer, a laptop computer, an e-reader or a television.

[0119] Based on the same inventive concept, an embodiment of the present invention further provides a splicing display device, such as Fig.19 As shown, the display device is a spliced ​​display device including the above-mentioned display panel 01. At least part of the first edge area R1 and the second edge area R2 of the display panel 01 can be its splicing area, and the splicing area is the edge area of ​​the display panel 01 when it is spliced ​​with the adjacent display panel 01. This type of spliced ​​display device can be a spliced ​​large screen, which can be used in public information display (Public Information Display, PID) scenes such as stations and airports. When the spliced ​​display device includes the above-mentioned display panel 01, it can take into account the anti-static requirements and splicing seam width of different positions of the display device at the same time, thereby improving the display effect of the spliced ​​display device.

Claims

1. A display panel, characterized in that: The display panel comprises a first edge region and a second edge region; The display panel comprises an array substrate, a plurality of light emitting devices and an encapsulation layer, wherein the light emitting devices are located on one side of the array substrate and the encapsulation layer is located on a side of the light emitting devices away from the array substrate; The array substrate comprises a substrate and a side wiring, the side wiring comprises a first portion and a second portion which are electrically connected, the first portion is located on a side of the substrate facing the encapsulation layer and the second portion is located on a side of the substrate facing away from the encapsulation layer; Among them, the side routing is located in the first edge area; the packaging layer includes a first packaging part and a second packaging part, the first packaging part is located in the first edge area, the second packaging part is located in the second edge area, and the shape of the first packaging part is different from the shape of the second packaging part.

2. The display panel according to claim 1, characterized in that: A width of the first encapsulation portion in a direction parallel to a plane where the substrate is located is greater than a width of the second encapsulation portion in a direction parallel to the plane where the substrate is located.

3. The display panel according to claim 1 or 2, characterized in that: Along a direction perpendicular to a plane where the display panel is located, the first encapsulation portion overlaps with the light emitting device and the second encapsulation portion does not overlap with the light emitting device.

4. The display panel according to claim 1, characterized in that: A surface of the first packaging portion facing away from the array substrate is a curved surface.

5. The display panel according to claim 4, characterized in that: The encapsulation layer further includes a third encapsulation portion, and the third encapsulation portion is located at a side of the first edge region and the second edge region away from an edge of the display panel; The width of the first encapsulation portion in a direction parallel to the plane where the substrate is located is W1, the thickness of the third encapsulation portion in a direction perpendicular to the plane where the substrate is located is H1, and W1 is greater than or equal to 10 H1.

6. The display panel according to claim 5, characterized in that: The first packaging part, the second packaging part and the third packaging part are an integrated structure.

7. The display panel according to claim 4, characterized in that: The array substrate includes a first film layer, which is located between the packaging layer and the substrate; the first packaging portion contacts the first film layer, and an edge of the first packaging portion close to an edge of the display panel contacts the first film layer.

8. The display panel according to claim 7, characterized in that: The first film layer includes a light-shielding structure, and the light-shielding structure is at least located between adjacent light-emitting devices.

9. The display panel according to claim 7, characterized in that: The thickness of the light-shielding structure in the first film layer in a direction perpendicular to the plane where the substrate is located is greater than or equal to 5 μm, and the optical density is less than or equal to 0.

4.

10. The display panel according to claim 4, characterized in that: The array substrate comprises a second film layer, wherein the second film layer contacts a surface of the side wiring away from the substrate; At least a portion of the first encapsulation portion is in contact with the second film layer.

11. The display panel according to claim 10, characterized in that: The second film layer includes a third portion, and the third portion is located between the substrate and the encapsulation layer; An edge of the third portion away from an edge of the display panel is located on a side of the first encapsulation portion away from an edge of the display panel.

12. The display panel according to claim 10, characterized in that: The array substrate comprises a first film layer, the first film layer is located between the packaging layer and the substrate; the second film layer comprises a third portion, the third portion is located between the substrate and the packaging layer; The first packaging part includes a first sub-packaging part and a second sub-packaging part, the second sub-packaging part is located on a side of the first sub-packaging part close to an edge of the display panel; the first sub-packaging part contacts the first film layer and the second sub-packaging part contacts the third part.

13. The display panel according to claim 12, characterized in that: A surface of the first film layer away from the substrate is flush with a surface of the third portion away from the substrate.

14. The display panel according to claim 12, characterized in that: A difference between a wetting angle of the first film layer and a wetting angle of the second film layer is smaller than a preset value.

15. The display panel according to claim 14, characterized in that: The first film layer and the second film layer are made of the same material.

16. The display panel according to claim 11 or 12, characterized in that: The thickness of the first portion along a direction perpendicular to the plane where the substrate is located is H4, and the thickness of the third portion along a direction perpendicular to the plane where the substrate is located is H5, where H5>H4.

17. The display panel according to claim 16, characterized in that: H5>5 H4。 18. The display panel according to claim 1, characterized in that: A surface of the second packaging portion facing the edge of the display panel is an inclined first plane.

19. The display panel according to claim 18, characterized in that: The angle between the first plane and the substrate is α, 30°≤α≤60°.

20. The display panel according to claim 18, characterized in that: In the second edge region, an angle between a surface of the substrate facing the encapsulation layer and a side surface of the substrate is 90°.

21. The display panel according to claim 20, characterized in that: In the second edge region, a surface of at least part of the film layer of the array substrate located on the side of the substrate facing the encapsulation layer facing the edge of the display panel is an inclined second plane, and an angle α is formed between the second plane and the substrate.

22. The display panel according to claim 18, characterized in that: The array substrate includes a second film layer and the display panel further includes a third film layer, the second film layer is in contact with a surface of the first portion away from the substrate, and the third film layer is in contact with at least a side surface of the array substrate in the second edge region and the first plane; The third film layer and the second film layer are made of the same material, and both the second film layer and the third film layer are light shielding layers.

23. The display panel according to claim 22, characterized in that: The third film layer is conformally attached to the first plane.

24. The display panel according to claim 18, characterized in that: The display panel further comprises a protective film material, and the protective film material is located on a side of the encapsulation layer away from the array substrate; The protective film material is bonded to the first packaging portion but not bonded to the second packaging portion.

25. The display panel according to claim 24, characterized in that: The display panel further includes a filling layer, which contacts at least the side surface of the array substrate and the first plane in the second edge region, and partially fills a gap between the array substrate and the protective film material in the second edge region.

26. The display panel according to claim 25, characterized in that: The filling layer is a light-shielding layer.

27. The display panel according to claim 25, characterized in that: The filling layer is a light-transmitting structure.

28. The display panel according to claim 27, characterized in that: The display panel further comprises an electrostatic conductive layer, at least a part of which is located on a side of the filling layer close to an edge of the display panel; the electrostatic conductive layer is a light shielding layer.

29. A display device, characterized in that: A display panel comprising any one of claims 1-28.

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