Raspberry cutting seedling raising method and matrix formula

Abstract

The invention belongs to the technical field of raspberry seedling raising, and discloses a raspberry cutting seedling raising method and a matrix formula, the matrix formula comprises the following raw materials: red loam, an organic fertilizer, peat, chaff, vermiculite and perlite, and the volume ratio of the red loam to the organic fertilizer to the peat to the chaff to the vermiculite to the perlite is (3-7): (5-9): (1-4): (1-2): (1-2): 1; the method comprises the following steps: S1, preparing and treating a matrix; s2, selecting and processing cuttings; s3, cutting and seedling stage management. The problem that an existing raspberry cutting seedling raising mode is low in survival rate is solved.

Description

Technical Field

[0001] The invention relates to the technical field of raspberry seedling cultivation, and in particular to a raspberry cutting seedling cultivation method and a matrix formula. Background Art

[0002] Raspberry, also known as blackberry, is a perennial shrub fruit tree of the genus Rubus (Rubus L.) in the family Rosaceae, and is one of the third-generation fruits. Raspberries can be propagated by seeds, but more commonly they are propagated asexually, such as by cuttings, divisions or layering. Among them, cuttings are one of the simpler and most commonly used methods. Cutting propagation can maintain the excellent traits of the mother plant, ensuring that the new plants have the same fruit quality and disease resistance as the mother plant, and the cultivation cost is relatively low. In addition, compared to seed propagation, cuttings can propagate raspberry seedlings more quickly and in large quantities, the operation is simple and the seedling raising time is shorter.

[0003] However, the existing cutting seedling method has a low survival rate, requires a large amount of mother plant material, increases material and labor costs, and reduces land utilization, hindering the rapid promotion and application of excellent varieties and limiting the speed of agricultural technological progress. Summary of the invention

[0004] The invention aims to provide a method for raising raspberry seedlings by cuttings and a matrix formula, so as to solve the problem of low survival rate of the existing raspberry seedling raising method by cuttings.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] A matrix formula for raspberry cutting seedling cultivation, wherein raw materials of the matrix formula include red soil, organic fertilizer, peat, rice husk, vermiculite and perlite, and the volume ratio of the red soil, organic fertilizer, peat, rice husk, vermiculite and perlite is 3-7:5-9:1-4:1-2:1-2:1.

[0007] Furthermore, the volume ratio of red soil, organic fertilizer, peat, rice husk, vermiculite and perlite is: 4:5:2:2:2:1.

[0008] A method for growing raspberry seedlings by cuttings using the above-mentioned matrix formula for growing raspberry seedlings by cuttings comprises the following steps:

[0009] S1. Prepare and treat the substrate: mix red soil, organic fertilizer, peat, rice husk, vermiculite and perlite according to volume ratio, and add 0.2% carbendazim for sterilization;

[0010] S2, selecting and processing cuttings: cutting cuttings, ensuring that the cuttings have nodes, bevel the lower end, apply a sealant to the top end to seal, and soak them in a treatment agent, then remove them and dry them for later use; wherein the treatment agent is NAA and IAA;

[0011] S3. Management of cuttings and seedlings: insert the cuttings obtained from S2 obliquely into the substrate of S1, keep warm and shaded, use an atomizer to humidify so that the cuttings seedlings are always in water mist within 20 days after cutting, and spray carbendazim, diammonium dihydrogen phosphate foliar fertilizer and potassium dihydrogen phosphate regularly after cutting.

[0012] Furthermore, in S2, the length of the cut cuttings is 15 cm to 20 cm, there are 2 nodes on the cuttings, and 2 to 3 leaflets are retained on the first node at the upper end.

[0013] Further, in S2, the treatment agent is NAA 1200ppm+IAA 350ppm, and the immersion time is 30min.

[0014] Further, in S2, the treatment agent is NAA 1100ppm+IAA 450ppm, and the immersion time is 30min.

[0015] Furthermore, in S4, spray 800 times diluted carbendazim once every 7 days after cutting, for a total of 2 to 3 times; spray 3% diammonium dihydrogen phosphate foliar fertilizer 10 days after cutting, spray 0.2% carbendazim once every 7 to 10 days after cutting; spray 5 mg / L dipotassium dihydrogen phosphate once every 15 to 20 days after cutting.

[0016] The beneficial effects of the technical solution are:

[0017] The present invention adopts red soil, organic fertilizer, peat, rice husk, vermiculite and perlite in a volume ratio to form a seedling medium, which is rich in raw materials, low in cost and environmentally friendly. The cutting survival rate of the raspberry cuttings cultivated by the matrix of the present invention reaches more than 95%, which greatly reduces the mother plant materials, saves material costs and labor costs, improves land utilization, and promotes the rapid promotion and application of excellent varieties. DETAILED DESCRIPTION

[0018] The present invention is further described in detail below in conjunction with the embodiments:

[0019] Example 1

[0020] S1. Prepare and treat the substrate: mix red soil: organic fertilizer: peat: rice husk: vermiculite: perlite in a volume ratio of 4:5:2:2:2:1, and add 0.2% carbendazim for sterilization;

[0021] S2. Select and process cuttings: Cut cuttings, the length of which is generally 15 cm to 20 cm, ensure that there are 2 nodes on the cuttings, retain 2 to 3 leaflets on the first node at the upper end, cut the lower end obliquely, and seal the top with paraffin to keep moisture; soak the collected cuttings in NAA 1200ppm+IAA 350ppm or NAA 1100ppm+IAA 450ppm for 30 minutes, then remove and dry for later use;

[0022] S3. Management of cuttings and seedlings: insert the cuttings obtained from S2 obliquely into the substrate of S1 at a depth of 5 cm, maintain the temperature in the seedling shed below 30℃, shade 50%, use an atomizer to humidify, keep the cuttings seedlings in water mist for 20 days after cutting, spray 800 times diluted carbendazim once every 7 days, for a total of 2 to 3 times; 10 days after cutting, spray 3% diammonium dihydrogen phosphate foliar fertilizer to promote the growth of new roots; spray 0.2% carbendazim once every 7 to 10 days after cutting; spray 5 mg / L potassium dihydrogen phosphate once every 15 to 20 days after cutting.

[0023] Example 2

[0024] The difference between this embodiment and embodiment 1 is that red soil: organic fertilizer: peat: rice husk: vermiculite: perlite are mixed in a volume ratio of 3:5:4:2:1:1, and 0.2% carbendazim is added for sterilization.

[0025] Example 3

[0026] The difference between this embodiment and embodiment 1 is that red soil: organic fertilizer: peat: rice husk: vermiculite: perlite are mixed in a volume ratio of 3:9:1:1:1:1, and 0.2% carbendazim is added for sterilization.

[0027] Example 4

[0028] The difference between this embodiment and embodiment 1 is that red soil: organic fertilizer: peat: rice husk: vermiculite: perlite are mixed in a volume ratio of 7:5:1:1:1:1, and 0.2% carbendazim is added for sterilization.

[0029] The seedling medium and seedling method of the invention greatly improve the survival rate of cuttings, especially the implementation effect of red soil: organic fertilizer: peat: rice husk: vermiculite: perlite = 4:5:2:2:2:1 is the best, and the survival rate of cuttings can reach more than 95%, which is more than 10% higher than that of ordinary cutting seedlings.

[0030] In summary, the present invention adopts red soil, organic fertilizer, peat, rice husk, vermiculite and perlite in a volume ratio to form a seedling medium, which is rich in raw materials, low in cost and environmentally friendly. The cutting survival rate of the raspberry cuttings cultivated by the matrix of the present invention reaches more than 95%, which greatly reduces the mother plant materials, saves material costs and labor costs, and improves land utilization, and promotes the rapid promotion and application of excellent varieties.

[0031] The above is only an embodiment of the present invention, and the common knowledge such as the known specific technical solutions or characteristics in the solution is not described in detail here. It should be pointed out that for those skilled in the art, several modifications and improvements can be made without departing from the technical solution of the present invention, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A matrix formula for raspberry cutting seedling cultivation, characterized in that: The raw materials of the matrix formula include red soil, organic fertilizer, peat, rice husk, vermiculite and perlite, and the volume ratio of the red soil, organic fertilizer, peat, rice husk, vermiculite and perlite is 3-7:5-9:1-4:1-2:1-2:

1.

2. The matrix formula for raspberry cutting seedling cultivation according to claim 1, characterized in that: The volume ratio of red soil, organic fertilizer, peat, rice husk, vermiculite and perlite is: 4:5:2:2:2:

1.

3. A method for growing raspberry seedlings by cutting using the matrix formula for growing raspberry seedlings by cutting according to any one of claims 1 to 2, characterized in that: The following steps are involved: S1. Prepare and treat the substrate: mix red soil, organic fertilizer, peat, rice husk, vermiculite and perlite according to volume ratio, and add 0.2% carbendazim for sterilization; S2, selecting and processing cuttings: cutting cuttings, ensuring that the cuttings have nodes, bevel the lower end, apply a sealant to the top end to seal, and soak them in a treatment agent, then remove them and dry them for later use; wherein the treatment agent is NAA and IAA; S3. Management of cuttings and seedlings: insert the cuttings obtained from S2 obliquely into the substrate of S1, keep warm and shaded, use an atomizer to humidify so that the cuttings seedlings are always in water mist within 20 days after cutting, and spray carbendazim, diammonium dihydrogen phosphate foliar fertilizer and potassium dihydrogen phosphate regularly after cutting.

4. The method for raising raspberry seedlings by cuttings according to claim 3, characterized in that: In S2, the length of the cut cuttings is 15cm to 20cm, there are 2 nodes on the cuttings, and 2 to 3 leaflets are retained on the first node at the upper end.

5. A method for raising raspberry seedlings by cuttings according to claim 3, characterized in that: In S2, the treatment agent is NAA 1200ppm + IAA 350ppm, and the immersion time is 30min.

6. A method for growing raspberry seedlings by cuttings according to claim 3, characterized in that: In S2, the treatment agent was NAA1100ppm+IAA 450ppm, and the soaking time was 30min.

7. A method for growing raspberry seedlings by cuttings according to claim 3, characterized in that: In S4, spray 800 times diluted carbendazim once every 7 days after cutting, for a total of 2 to 3 times; spray 3% diammonium phosphate foliar fertilizer 10 days after cutting, spray 0.2% carbendazim once every 7 to 10 days after cutting; spray 5 mg / L dipotassium dihydrogen phosphate once every 15 to 20 days after cutting.