A platinum catalyst precursor without post-curing and a preparation method thereof

By preparing a platinum catalyst base without post-curing, the problems of easy oxidation and poor dispersibility of Castel platinum catalyst in organosilicon thermal conductive adhesives were solved, achieving performance stability and reliability of thermal conductive adhesives during high-temperature aging and improving the service life of electronic components.

CN119859414BActive Publication Date: 2026-02-17SHENZHEN BORNSUN IND CO LTD
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Patent Information

Application Number
CN202510166123.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-02-14
Publication Date
2026-02-17
Estimated Expiration
2045-02-14

AI Technical Summary

Technical Problem

Existing Castel platinum catalysts are easily oxidized in silicone thermally conductive adhesives, exhibiting poor dispersibility and compatibility, leading to post-curing phenomena that affect the performance stability of the thermally conductive adhesive and the service life of electronic components.

Method used

The original adhesive for the non-curing platinum catalyst contains organosilicon polymers, platinum catalyst, mesoporous alumina, antioxidants, anti-settling agents, and dispersants. Through a specific preparation method, the antioxidant and dispersibility of the catalyst are improved, ensuring the stability of the modulus and resilience of the material during long-term high-temperature aging.

Benefits of technology

This method achieves good dispersibility and compatibility of platinum catalyst in silicone thermally conductive adhesive, avoids post-curing phenomenon, ensures the stability and reliability of the thermally conductive adhesive's performance during long-term high-temperature aging, and protects the long-term use of electronic components.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a non-post-curing platinum catalyst raw glue, which comprises the following components in mass fractions: 5-60 parts of an organic silicon polymer, 0.1-5 parts of a platinum catalyst, 40-65 parts of mesoporous alumina, 0.2-3 parts of an antioxidant, 0.5-8 parts of an anti-settling agent, 0.03-6 parts of a dispersing agent and 3-10 parts of a solvent. The non-post-curing platinum catalyst raw glue has excellent oxidation resistance, good dispersibility and compatibility in a silicone heat-conducting glue formula, and the modulus and resilience of the material remain stable during long-term aging at high temperatures, and the application of the non-post-curing platinum catalyst raw glue in a heat-conducting glue formula containing a large amount of heat-conducting fillers almost does not cause post-curing, and the application meets the application requirements of high stability and high reliability of the heat-conducting glue.
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Description

Technical Field

[0001] This invention relates to the field of thermal conductive materials technology, and in particular to a non-curing platinum catalyst base and its preparation method. Background Technology

[0002] In the field of thermally conductive fillers for the thermal interface gaps of electronic components, addition-type silicone is widely used due to its flexibility, excellent weather resistance, and low processing requirements, leading to a series of silicone-based thermal conductive products such as thermally conductive pads, thermally conductive silicone gels, and thermally conductive potting compounds. Platinum catalyst is an indispensable and important component in these products, playing a catalytic role in curing.

[0003] Early catalysts used chloroplatinic acid, but due to its low catalytic efficiency, the industry now predominantly uses Castells platinum catalysts. In practice, Castells platinum catalysts are typically diluted with silicone oil or a solvent and then directly added to the formulation system and mixed with other components.

[0004] However, currently, Castells platinum catalysts are easily exposed to air during storage and addition, which can lead to partial reduction to platinum and loss of catalytic activity.

[0005] Secondly, the Castel platinum catalyst is complexed onto small organic molecules, which have a smaller molecular weight compared to the silicone oil in the thermally conductive adhesive formulation. Furthermore, the inorganic thermally conductive filler typically accounts for 60-95% of the thermally conductive adhesive, and the small organic catalyst molecules have a lower density than the inorganic powder filler, resulting in a significant difference between the liquid and solid phases. During pressurized dispensing processes or other production steps requiring pressure, or during long-term natural storage, the small molecular weight of the organic catalyst and the large density difference between it and the inorganic powder filler make it easy to separate from the formulation system.

[0006] Furthermore, in pursuit of high thermal conductivity, thermally conductive adhesives use increasingly larger particle sizes of thermally conductive filler powders, with known particle sizes ranging from approximately 1 to 200 μm. Small organic catalyst molecules exhibit poor compatibility with inorganic thermally conductive filler powders, and the significant size difference makes it difficult to disperse small-molecule catalysts within the system. Large-particle-size inorganic fillers hinder the migration and dispersion of catalyst molecules, leading to localized catalyst aggregation and reduced local catalyst content.

[0007] For the reasons mentioned above, the reduced activity or uneven dispersion of ordinary platinum catalysts during the production or application of thermally conductive adhesives can lead to the initial cross-linking and curing degree of the silicone thermally conductive adhesive failing to reach the true cross-linking degree specified in the formulation. The suitability of a formulation application is often assessed based on the initial cross-linking degree. After being applied to electronic products and subjected to prolonged high-temperature environments, the initially uncross-linked portions will continue to react and cross-link, resulting in a continuous increase in the thermally conductive adhesive's modulus—a phenomenon known as post-curing. When the thermally conductive adhesive's modulus increases beyond a set value, it can cause stress damage to electronic components, affecting their lifespan. Simultaneously, it reduces flexibility, weakens resilience, decreases thermal interface contact, and deteriorates heat transfer performance.

[0008] Therefore, designing and preparing a catalyst with excellent antioxidant properties, good dispersibility and compatibility in organosilicon thermal conductive adhesive formulations, and high compressive strength can effectively solve the post-curing problem of thermal conductive adhesives, improve the performance stability of product modulus and resilience, and meet the application requirements of high reliability of thermal conductive adhesives. Summary of the Invention

[0009] In order to solve the problems existing in the prior art, the purpose of this invention is to provide a platinum catalyst base gel without post-curing and its preparation method. This platinum catalyst base gel has excellent oxidation resistance and good dispersibility and compatibility in organosilicon thermal conductive adhesive formulations.

[0010] This invention provides the following technical solution:

[0011] This invention provides a post-curing-free platinum catalyst base, comprising the following components in parts by weight: 5-60 parts of organosilicon polymer, 0.1-5 parts of platinum catalyst, 40-65 parts of mesoporous alumina, 0.2-3 parts of antioxidant, 0.5-8 parts of anti-settling agent, 0.03-6 parts of dispersant, and 10 parts of solvent.

[0012] Furthermore, the molecular formula of the platinum catalyst is selected from C8H. 18 One of OPtSi2 and Pt(C3H6SiO)4.

[0013] Preferably, the platinum catalyst contains 200,000 to 500,000 ppm of platinum.

[0014] Furthermore, the organosilicon polymer is selected from one or a combination of two of terminal vinyl polydimethylsiloxane and terminal methyl polydimethylsiloxane.

[0015] Furthermore, the viscosity of the organosilicon polymer is 50-100000 mPa·s.

[0016] Furthermore, the mesoporous alumina has a medium particle size of 1-200 μm and a specific surface area of ​​30-600 m². 2 / g, total pore volume is 0.1-0.4cm³ 3 / g.

[0017] Furthermore, the antioxidant is selected from one or a combination of two of the following: 2,6-di-tert-butyl-p-cresol, tert-butylhydroquinone, 3,5-di-tert-butyl-4-hydroxyphenylpropionic acid, N,N'-bis(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl)propanediamine, tris(2,4-di-tert-butylphenyl) phosphite, and pentaerythritol-diphosphite.

[0018] Furthermore, the anti-settling agent is one of fumed silica and precipitated silica, and the specific surface area of ​​the anti-settling agent is 180-260 m². 2 / g.

[0019] Furthermore, the molecular structure of the dispersant is shown in formula (1) below.

[0020]

[0021] Where n is 8–16, m is 12–30, and R is methoxy or ethoxy.

[0022] Furthermore, the solvent is isopropanol or butanol.

[0023] This application also provides a method for preparing the above-mentioned post-curing-free platinum catalyst base, comprising the following steps:

[0024] S1. Disperse the platinum catalyst evenly in the solvent to obtain a platinum catalyst solvent solution;

[0025] S2. Place the mesoporous alumina into the platinum catalyst solvent and soak it in a vacuum environment for 1-12 hours.

[0026] S3. Take out the mesoporous alumina and bake it under vacuum at a temperature of 40-60℃ for 10-90 minutes to obtain platinum-alumina particles.

[0027] S4. Mix the organosilicon polymer, anti-settling agent and dispersant evenly, heat to 90-160℃ and stir under vacuum for 0.5-3 hours to obtain base material 1;

[0028] S5. After cooling base material 1 to below 50°C, add antioxidant and continue stirring under vacuum for 0.5-2 hours to obtain base material 2.

[0029] S6. Add platinum-alumina particles to base material 2 and stir under vacuum for 1-4 hours to obtain platinum catalyst raw material.

[0030] Through the above design, the present invention has the following effects:

[0031] The non-post-curing platinum catalyst base of the present invention has excellent oxidation resistance, good dispersibility and compatibility in organosilicon thermal conductive adhesive formulations, and maintains stable modulus and resilience properties during long-term high-temperature aging. When applied to thermal conductive adhesive formulations containing a large amount of thermally conductive filler, almost no post-curing phenomenon occurs, thus meeting the application requirements of high stability and high reliability of thermal conductive adhesives. Detailed Implementation

[0032] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] It should be understood that, when used in this specification and the appended claims, the terms “comprising” and “including” indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0034] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0035] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0036] Furthermore, terms like "roughly" and "basically" are used to indicate that the content does not require absolute precision, but rather allows for a certain degree of deviation. For example, "roughly equal" does not simply mean absolute equality; in actual production and operation, achieving absolute "equality" is difficult, and a certain degree of deviation is generally present. Therefore, besides absolute equality, "roughly equal to" also includes the aforementioned situation where a certain degree of deviation exists. Using this as an example, in other cases, unless otherwise specified, terms like "roughly" and "basically" have similar meanings.

[0037] Example 1

[0038] A post-curing platinum catalyst base adhesive comprises the following components in parts by weight: 51.17 parts of organosilicon polymer, 0.1 parts of platinum catalyst, 40 parts of mesoporous alumina, 0.2 parts of antioxidant, 8 parts of anti-settling agent, 0.03 parts of dispersant, and 10 parts of isopropanol.

[0039] The organosilicon polymer is vinyl-terminated polydimethylsiloxane with a viscosity of 100,000 mPa·s.

[0040] The molecular formula of platinum catalyst is C8H. 18 OPtSi2, with a platinum content of 300,000 ppm.

[0041] Mesoporous alumina has a medium particle size of 1 μm and a specific surface area of ​​600 m². 2 / g, total pore volume is 0.1cm³ 3 / g.

[0042] The antioxidant is a combination of 2,6-di-tert-butyl-p-cresol and bis(2,4-dicumylphenyl)pentaerythritol-diphosphite in a ratio of 2:1.1.

[0043] The anti-settling agent is fumed silica produced by fumed silica production, with a specific surface area of ​​180 m². 2 / g.

[0044] The molecular structure of the dispersant is shown in formula (1):

[0045]

[0046] Where n is 16, m is 12, and R is ethoxy.

[0047] The preparation method of the non-curing platinum catalyst base in this embodiment includes the following steps:

[0048] S1. Disperse the platinum catalyst evenly in the solvent to obtain a platinum catalyst solvent solution;

[0049] S2. Place the mesoporous alumina into the platinum catalyst solvent and soak it in a vacuum environment for 12 hours.

[0050] S3. Take out the mesoporous alumina and bake it under vacuum at 60°C for 90 minutes to obtain platinum-alumina particles;

[0051] S4. Mix the organosilicon polymer, anti-settling agent and dispersant evenly, heat to 90℃ and stir under vacuum for 3 hours to obtain base material 1;

[0052] S5. After the temperature of base material 1 is reduced to 40℃, an antioxidant is added, and stirring is continued under vacuum for 0.5h to obtain base material 2;

[0053] S6. Add platinum-alumina particles to base material 2 and stir under vacuum for 1 hour to obtain platinum catalyst raw material.

[0054] Example 2

[0055] A post-curing platinum catalyst base adhesive comprises the following components in parts by weight: 20.5 parts of organosilicon polymer, 5 parts of platinum catalyst, 65 parts of mesoporous alumina, 3 parts of antioxidant, 0.5 parts of anti-settling agent, 6 parts of dispersant, and 10 parts of isopropanol.

[0056] The organosilicon polymer is vinyl-terminated polydimethylsiloxane with a viscosity of 2000 mPa·s.

[0057] The molecular formula of platinum catalyst is C8H. 18 OPtSi2, with a platinum content of 200,000 ppm.

[0058] Mesoporous alumina has a medium particle size of 200 μm and a specific surface area of ​​30 m². 2 / g, total pore volume is 0.4cm³ 3 / g.

[0059] The antioxidant is a combination of tert-butylhydroquinone and tris(2,4-di-tert-butylphenyl) phosphite in a ratio of 1:3.1.

[0060] The anti-settling agent is fumed silica produced by fumed silica production, with a specific surface area of ​​260 m². 2 / g.

[0061] The molecular structure of the dispersant is shown in formula (1):

[0062]

[0063] Where n is 8, m is 30, and R is methoxyl.

[0064] The preparation method of the non-curing platinum catalyst base in this embodiment includes the following steps:

[0065] S1. Disperse the platinum catalyst evenly in the solvent to obtain a platinum catalyst solvent solution;

[0066] S2. Place the mesoporous alumina into the platinum catalyst solvent and soak it in a vacuum environment for 1 hour;

[0067] S3. Take out the mesoporous alumina and bake it under vacuum at 40°C for 10 minutes to obtain platinum-alumina particles.

[0068] S4. Mix the organosilicon polymer, anti-settling agent and dispersant evenly, heat to 160℃ and stir under vacuum for 0.5h to obtain base material 1;

[0069] S5. After the temperature of base material 1 is reduced to 30°C, an antioxidant is added, and stirring is continued under vacuum for 2 hours to obtain base material 2.

[0070] S6. Add platinum-alumina particles to base material 2 and stir under vacuum for 4 hours to obtain platinum catalyst raw material.

[0071] Example 3

[0072] A post-curing platinum catalyst base adhesive comprises the following components in parts by weight: 5 parts of organosilicon polymer, 2 parts of platinum catalyst, 50 parts of mesoporous alumina, 1 part of antioxidant, 3 parts of anti-settling agent, 5 parts of dispersant, and 10 parts of isopropanol.

[0073] The organosilicon polymer is vinyl-terminated polydimethylsiloxane with a viscosity of 50,000 mPa·s.

[0074] The molecular formula of platinum catalyst is C8H. 18 OPtSi2, with a platinum content of 300,000 ppm.

[0075] Mesoporous alumina has a medium particle size of 100 μm and a specific surface area of ​​100 m². 2 / g, total pore volume is 0.2cm³ 3 / g.

[0076] The antioxidant is tert-butylhydroquinone.

[0077] The anti-settling agent is precipitated silica with a specific surface area of ​​220 m². 2 / g.

[0078] The molecular structure of the dispersant is shown in formula (1):

[0079]

[0080] Where n is 12, m is 20, and R is methoxyl.

[0081] The preparation method of the non-curing platinum catalyst base in this embodiment includes the following steps:

[0082] S1. Disperse the platinum catalyst evenly in the solvent to obtain a platinum catalyst solvent solution;

[0083] S2. Place the mesoporous alumina into the platinum catalyst solvent and soak it in a vacuum environment for 6 hours.

[0084] S3. Take out the mesoporous alumina and bake it under vacuum at 65°C for 10 minutes to obtain platinum-alumina particles.

[0085] S4. Mix the organosilicon polymer, anti-settling agent and dispersant evenly, heat to 120℃ and stir under vacuum for 1 hour to obtain base material 1;

[0086] S5. After the temperature of base material 1 is reduced to 30°C, an antioxidant is added, and stirring is continued under vacuum for 1 hour to obtain base material 2.

[0087] S6. Add platinum-alumina particles to base material 2 and stir under vacuum for 2.5 hours to obtain platinum catalyst raw material.

[0088] Example 4

[0089] A post-curing platinum catalyst base adhesive comprises the following components in parts by weight: 60 parts of organosilicon polymer, 3 parts of platinum catalyst, 50 parts of mesoporous alumina, 2 parts of antioxidant, 2 parts of anti-settling agent, 2 parts of dispersant, and 10 parts of isopropanol.

[0090] The organosilicon polymer is vinyl-terminated polydimethylsiloxane with a viscosity of 30,000 mPa·s.

[0091] The molecular formula of the platinum catalyst is Pt(C3H6SiO)4, and the platinum content is 400,000 ppm.

[0092] Mesoporous alumina has a medium particle size of 120 μm and a specific surface area of ​​200 m². 2 / g, total pore volume is 0.4cm³ 3 / g.

[0093] The antioxidant is 3,5-di-tert-butyl-4-hydroxyphenylpropionic acid.

[0094] The anti-settling agent is fumed silica produced by fumed silica production, with a specific surface area of ​​260 m². 2 / g.

[0095] The molecular structure of the dispersant is shown in formula (1):

[0096]

[0097] Where n is 10, m is 24, and R is ethoxy.

[0098] The preparation method of the non-curing platinum catalyst base in this embodiment includes the following steps:

[0099] S1. Disperse the platinum catalyst evenly in the solvent to obtain a platinum catalyst solvent solution;

[0100] S2. Place the mesoporous alumina into the platinum catalyst solvent and soak it in a vacuum environment for 8 hours.

[0101] S3. Take out the mesoporous alumina and bake it under vacuum at 45°C for 50 minutes to obtain platinum-alumina particles;

[0102] S4. Mix the organosilicon polymer, anti-settling agent and dispersant evenly, heat to 130℃ and stir under vacuum for 1.5h to obtain base material 1;

[0103] S5. After the temperature of base material 1 is reduced to 30°C, an antioxidant is added, and stirring is continued under vacuum for 2 hours to obtain base material 2.

[0104] S6. Add platinum-alumina particles to base material 2 and stir under vacuum for 3 hours to obtain platinum catalyst raw material.

[0105] Comparative Example 1

[0106] This comparative example uses a 3000 ppm Castel platinum catalyst.

[0107] Comparative Example 2

[0108] The only difference between this comparative example and Example 1 is that the mass fraction of mesoporous alumina is 30 parts.

[0109] Comparative Example 3

[0110] The only difference between this comparative example and Example 1 is that the mass fraction of mesoporous alumina is 70 parts.

[0111] Comparative Example 4

[0112] The only difference between this comparative example and Example 1 is that n is 6 and m is 32 in the dispersant.

[0113] Comparative Example 5

[0114] The only difference between this comparative example and Example 1 is that n is 18 and m is 10 in the dispersant.

[0115] Comparative Example 6

[0116] The only difference between this comparative example and Example 1 is the preparation method of the platinum catalyst-free raw adhesive, which includes the following steps:

[0117] S1. Disperse the platinum catalyst evenly in the solvent to obtain a platinum catalyst solvent solution;

[0118] S2. Place the mesoporous alumina into the platinum catalyst solvent and soak it in a vacuum environment for 12 hours.

[0119] S3. Take out the mesoporous alumina and bake it under vacuum at 60°C for 90 minutes to obtain platinum-alumina particles;

[0120] S4. Mix the organosilicon polymer, anti-settling agent, and dispersant evenly, heat to 90°C and stir under vacuum for 3 hours, then add antioxidant and stir for 0.5 hours to obtain the base material;

[0121] S5. Add platinum-alumina particles to the base material and stir under vacuum for 1 hour to obtain platinum catalyst raw material.

[0122] Comparative Example 7

[0123] The only difference between this comparative example and Example 2 is that the preparation method of the non-curing platinum catalyst base is carried out under non-vacuum conditions.

[0124] Comparative Example 8

[0125] The only difference between this comparative example and Example 1 is that the stirring temperature is 80°C in step S4.

[0126] Comparative Example 9

[0127] The only difference between this comparative example and Example 1 is that in step S4, the stirring temperature is 200°C and the stirring time is 20 min.

[0128] Comparative Example 10

[0129] The only difference between this comparative example and Example 1 is that the mass fraction of the organosilicon polymer is 3 parts, the mass fraction of the anti-settling agent is 0.2 parts, and the mass fraction of the dispersant is 0.01 parts.

[0130] Comparative Example 11

[0131] The only difference between this comparative example and Example 1 is that the mass fraction of the organosilicon polymer is 60 parts, the mass fraction of the anti-settling agent is 12 parts, and the mass fraction of the dispersant is 0.03 parts.

[0132] Comparative Example 12

[0133] The only difference between this comparative example and Example 2 is that the antioxidant content is 0.1 parts by mass.

[0134] Comparative Example 13

[0135] The only difference between this comparative example and Example 2 is that the antioxidant is 2,2'-methylenebis(4-tert-octyl-6-benzotriazolephenol).

[0136] The post-curing platinum catalyst base gels of Examples 1-4 and Comparative Examples 1-13 were used to prepare thermally conductive gels. The thermally conductive gels comprised the following components by mass fraction: 0.001 parts of the post-curing platinum catalyst base gels of Examples 1-4 and Comparative Examples 1-13, 1 part of vinyl silicone oil, 0.04 parts of hydrogen-containing silicone oil, 18 parts of thermally conductive filler, and 0.004 parts of coupling agent.

[0137] The following application tests were conducted on the thermally conductive gel:

[0138] (I) Application Testing 1

[0139] By mass, 0.001 parts of the uncured platinum catalyst raw material from Examples 1-4 and Comparative Examples 1-13, 1 part of vinyl silicone oil (viscosity 500 mPa·s), 0.04 parts of hydrogen-containing silicone oil (hydrogen content 0.3%), 18 parts of thermally conductive filler (a mixture of 5 μm and 90 μm alumina in a ratio of 2:3), and 0.004 parts of coupling agent (dodecyltriethoxysilane) were uniformly dispersed in a dynamic disperser. After vacuum degassing, gel sheets were prepared. The initial hardness of the gel sheets was tested, and the modulus and resilience were measured after aging in a 160°C oven for 200H, 500H, and 1000H, respectively. The test results are shown in Tables 1 and 2 below.

[0140] Table 1. Application Test 1: Modulus Test Results

[0141]

[0142]

[0143] Table 2 Application Test 1 Rebound Rate Test Results

[0144]

[0145]

[0146] (II) Application Test 2

[0147] By mass, 0.001 parts of the uncured platinum catalyst raw material from Examples 1-4 and Comparative Examples 1-13, 1 part of vinyl silicone oil (viscosity 1000 mPa·s), 0.04 parts of hydrogen-containing silicone oil (hydrogen content 0.18%), 11 parts of thermally conductive filler (3 μm and 40 μm alumina in a ratio of 1:4), and 0.002 parts of coupling agent (dodecyltriethoxysilane) were uniformly dispersed in a dynamic disperser. After vacuum degassing, gel sheets were prepared. The initial hardness of the gel sheets was tested, and the modulus and resilience were measured after aging in a 160℃ oven for 200H, 500H, and 1000H, respectively. The test results are shown in Tables 3 and 4 below.

[0148] Table 3 Application Test 2 Modulus Test Results

[0149]

[0150]

[0151] Table 4. Application Test 2: Rebound Rate Test Results

[0152]

[0153] (III) Application Testing 3

[0154] By mass, 0.001 parts of the uncured platinum catalyst raw material from Examples 1-4 and Comparative Examples 1-13, 1 part of vinyl silicone oil (viscosity 100 mPa·s), 0.04 parts of hydrogen-containing silicone oil (hydrogen content 0.1%), 24 parts of thermally conductive filler (1 μm, 40 μm, and 120 μm aluminum nitride in a ratio of 1:2:3.5), and 0.006 parts of coupling agent (dodecyltrimethoxysilane) were uniformly dispersed in a dynamic disperser. After vacuum degassing, gel sheets were prepared. The initial hardness of the gel sheets was tested, and the modulus and resilience were measured after aging in a 160°C oven for 200 H, 500 H, and 1000 H, respectively. The test results are shown in Tables 5 and 6 below.

[0155] Table 5 Application Test 3 Modulus Test Results

[0156]

[0157]

[0158] Table 6 Application Test 3 Rebound Rate Test Results

[0159]

[0160] The application test results above show that the platinum catalyst binder of this invention, when applied to thermally conductive adhesive formulations containing a large amount of thermally conductive filler, exhibits almost no post-curing phenomenon. During long-term high-temperature aging, the modulus and resilience of the material remain stable, providing reliable and stable protection for the long-term use of electronic components. In contrast, products prepared directly using commercially available Castel platinum catalysts or platinum catalyst binders obtained by modifying the technical solution of this invention show significant post-curing after high-temperature aging, with the modulus increasing several times and the resilience decreasing several times, severely affecting the reliability of the product.

[0161] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A non-postcured platinum catalyst gum, characterized by, Components including the following mass fractions: silicone polymer 5-60 parts, platinum gold catalyst 0.1-5 parts, mesoporous alumina 40-65 parts, antioxidant 0.2-3 parts, anti-settling agent 0.5-8 parts, dispersant 0.03-6 parts, solvent 3-10 parts; The platinum catalyst has a molecular formula selected from the group consisting of C8H 18 one of OPtSi2 and Pt(C3H6SiO)4; the platinum content of the platinum catalyst is 200-500 ppm; The molecular structure of the dispersant is shown in the following formula (1): Formula (1), Wherein n is 8~16, m is 12~30, R is methoxy or ethoxy; The preparation method of the non-post-curing platinum gold catalyst raw glue comprises the following steps: S1, disperse the platinum gold catalyst uniformly in the solvent to obtain a platinum gold catalyst solvent solution; S2, put the mesoporous alumina into the platinum gold catalyst solvent solution and soak for 1-12h in a vacuum environment; S3, take out the mesoporous alumina and bake for 10-90min under vacuum at a temperature of 40-60℃ to obtain platinum-alumina particles; S4, mix the silicone polymer, anti-settling agent and dispersant uniformly, heat to 90-160℃ and stir under vacuum for 0.5-3h to obtain base 1; S5, after cooling base 1 to below 50℃, add the antioxidant and continue to stir under vacuum for 0.5-2h to obtain base 2; S6, add the platinum-alumina particles to base 2 and stir under vacuum for 1-4h to obtain the platinum gold catalyst raw glue.

2. The non-postcured platinum catalyst precursor gum according to claim 1, wherein, The silicone polymer is selected from one or a combination of both of end-vinyl polydimethylsiloxane and end-methyl polydimethylsiloxane.

3. The non-postcured platinum catalyst precursor gum according to claim 1, wherein, The viscosity of the silicone polymer is 50-100000mPa·s.

4. The non-postcured platinum catalyst precursor gum of claim 1, wherein, The mesoporous alumina has a medium particle size of 1-200 μm, a specific surface area of 30-600 m 2 / g, and a total pore volume of 0.1-0.4 cm 3 / g.

5. The non-postcured platinum catalyst precursor gum of claim 1, wherein, The antioxidant is selected from one or a combination of both of 2,6-di-tert-butyl-p-cresol, tert-butyl-hydroquinone, 3,5-di-tert-butyl-4-hydroxybenzene propionic acid, N,N'-bis(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl)propylenediamine, tris(2,4-di-tert-butylphenyl) phosphite, bis(2,4-dicumylphenyl) pentaerythritol-diphosphite.

6. The non-postcured platinum catalyst precursor gum of claim 1, wherein, The anti-settling agent is one of fumed white carbon black and precipitated white carbon black, and the specific surface area of the anti-settling agent is 180-260 m 2 / g.

7. The non-postcured platinum catalyst precursor gum of claim 1, wherein, The solvent is isopropyl alcohol or butanol.

8. A process for preparing a non-postcured platinum catalyst precursor gum according to any one of claims 1 to 7, characterized by, The method comprises the following steps: S1, disperse the platinum gold catalyst uniformly in the solvent to obtain a platinum gold catalyst solvent solution; S2, put the mesoporous alumina into the platinum gold catalyst solvent solution and soak for 1-12h in a vacuum environment; S3, take out the mesoporous alumina and bake for 10-90min under vacuum at a temperature of 40-60℃ to obtain platinum-alumina particles; S4, mix the silicone polymer, anti-settling agent and dispersant uniformly, heat to 90-160℃ and stir under vacuum for 0.5-3h to obtain base 1; S5, after cooling base 1 to below 50℃, add the antioxidant and continue to stir under vacuum for 0.5-2h to obtain base 2; S6, add the platinum-alumina particles to base 2 and stir under vacuum for 1-4h to obtain the platinum gold catalyst raw glue.

Citation Information

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