Temperature value calculation method, air conditioner control method and air conditioner
By utilizing the temperature output function and heat transfer model of the intelligent power module in the air conditioning drive board, the temperature of the power factor correction module is calculated, which solves the problem that the PFC power circuit temperature cannot be monitored in real time in the prior art, and accurately temperature monitoring and control are achieved.
Patent Information
- Application Number
- CN202510013822.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-06
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2045-01-06
AI Technical Summary
In the prior art, how to determine the temperature of the PFC power circuit in the air conditioner driving board without additional temperature sensors is a technical problem that needs to be solved.
By utilizing the built-in temperature output function of the intelligent power module, combining the characteristics of the intelligent power module and the power factor correction module in the air conditioner driver board have the same or similar heat transfer structure, a temperature calculation method based on the heat transfer model is established. The method includes obtaining the ambient temperature and the power value of the intelligent power module, calculating the temperature of the intelligent power module, and further calculating the temperature of the power factor correction module by verifying the accuracy of the heat transfer model.
It is realized that the power device temperature of the power factor correction module in the air conditioner driving board is accurately calculated without adding an additional temperature sensor, and the problem of difficulty in real-time monitoring of the PFC power circuit temperature in the prior art is solved.
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Figure CN119860580A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of air conditioners, and in particular to a temperature value calculation method, an air conditioner control method and an air conditioner. Background Art
[0002] The power factor correction module (PFC) is one of the functional modules in the air conditioner driver board. Its main function is to improve the power factor of the air conditioner during operation, reduce grid harmonic interference and improve energy efficiency. The PFC power circuit adjusts the waveform of the input current through the rectification and control circuit to make it more synchronized with the input voltage waveform, thereby reducing reactive power loss.
[0003] In the prior art, how to determine the temperature of the PFC power circuit in the air conditioner driving board without adding an additional temperature sensor is a technical problem that needs to be solved. Summary of the invention
[0004] The purpose of the present invention is to overcome the above technical deficiencies and provide a method for calculating a temperature value, a method for controlling an air conditioner and an air conditioner, so as to solve the problem in the related art of how to determine the temperature of a PFC power circuit in an air conditioner driving board without adding an additional temperature sensor.
[0005] In order to achieve the above technical objectives, the present invention adopts the following technical solutions: In a first aspect, the present invention provides a method for calculating a temperature value, the method comprising: During the operation of the air conditioner, a first temperature value, a second temperature value, a power value of an intelligent power module, and a power value of a power factor correction module are obtained; wherein the intelligent power module and the power factor correction module have the same or similar heat transfer structure; wherein the first temperature value is a temperature value output by the intelligent power module, and the second temperature value is an ambient temperature value of a driving board of the air conditioner; Calculating a third temperature value based on the second temperature value, the power value of the intelligent power module and a preset heat transfer model of the intelligent power module; wherein the heat transfer model of the intelligent power module is pre-constructed based on the heat transfer structure of the intelligent power module; Determine whether a difference between the first temperature value and the third temperature value is less than or equal to a first preset threshold; When the temperature is less than or equal to the first preset threshold, a fourth temperature value is calculated based on the second temperature value, the power value of the power factor correction module and a preset heat transfer model of the power factor correction module; wherein the heat transfer model of the power factor correction module is pre-constructed based on the heat transfer structure of the power factor correction module.
[0006] In a second aspect, the present invention provides a method for controlling an air conditioner, comprising: Determine whether the fourth temperature value is in the first target temperature range or the second target temperature range; wherein the fourth temperature value is calculated by the above method; wherein the first target temperature range is a temperature range indicating that a protection operation control strategy needs to be adopted; the second target temperature range is a temperature range indicating that a shutdown protection strategy needs to be adopted, and the lower limit value of the second target temperature range is greater than or equal to the upper limit value of the first target temperature range; When the fourth temperature value is within the first target temperature range, executing a preset protection operation control strategy to perform a temperature reduction process on the power factor correction module; When the fourth temperature value is within the second target temperature range, at least the air conditioner is controlled to shut down.
[0007] In a third aspect, the present invention provides an air conditioner, comprising a controller, wherein the controller is used to execute the above-mentioned method for calculating the temperature value or to execute the above-mentioned method for controlling the air conditioner.
[0008] Beneficial effects: The present invention utilizes the built-in temperature output function of the intelligent power module, combined with the characteristics that the intelligent power module and the power factor correction module in the air conditioner driver board have the same or similar heat transfer structure, to establish a temperature calculation method based on the heat transfer model. By obtaining the ambient temperature (second temperature value) and the power value of the intelligent power module, the temperature (third temperature value) of the intelligent power module is calculated, and the accuracy of the heat transfer model is verified. When the model is verified, the power value and ambient temperature of the power factor correction module are further combined to calculate its temperature (fourth temperature value) through the heat transfer model of the power factor correction module. This method can accurately calculate the temperature of the power device of the power factor correction module in the air conditioner driver board without adding additional temperature sensors, thereby effectively solving the technical problem of how to determine the temperature of the PFC power circuit in the air conditioner driver board without adding additional temperature sensors in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1 is a flow chart of a method for calculating a temperature value provided by an embodiment of the present invention; Figure 2 is a flow chart of a method for controlling an air conditioner provided by an embodiment of the present invention; Figure 3 is a flow chart of a method for controlling an air conditioner provided by an embodiment of the present invention; Figure 4 An intelligent power module and a heat transfer structure of a power factor correction module provided by an embodiment of the present invention; Figure 5 The block diagram of an air conditioner driving board provided by an embodiment of the present invention. DETAILED DESCRIPTION
[0010] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.
[0011] In the related art, the air conditioner driver board is the core circuit board in the air conditioner, which is used to drive and control various functional modules of the air conditioner. The air conditioner driver board usually contains multiple high-power devices, such as power factor correction (PFC) modules and intelligent power modules (IPM). The PFC module is a power electronic module used to improve the power factor of electrical equipment, thereby optimizing the efficiency of electric energy use. Power factor is a key indicator for measuring the efficiency of electric energy utilization. A high power factor means that more electric energy is effectively used rather than wasted on reactive power. The IPM module is a highly integrated power electronic module that integrates power devices (such as IGBT or MOSFET), drive circuits, and protection circuits. The IPM module is a core module for controlling and driving high-power equipment such as motors and compressors.
[0012] The power devices in the PFC module and IPM module will generate a lot of heat during the operation of the air conditioner, and excessive temperature may cause damage to the power devices or performance degradation, thus affecting the normal operation of the air conditioner. In order to ensure the reliability and safety of the air conditioner, it is very important to monitor the temperature of these power devices in real time and take appropriate control measures.
[0013] In the prior art, a method of directly installing a temperature sensor on a power device is usually used to monitor its temperature. For example, an independent temperature sensor is added to the IGBT or diode of the PFC module to monitor the temperature of the device in real time. However, this method has the following obvious defects: First, adding additional temperature sensors can significantly increase hardware costs, especially when multiple sensors are needed to monitor multiple devices, where the cost cumulative effect is even more significant.
[0014] Then, each additional temperature sensor requires an additional set of corresponding circuits and signal acquisition channels, which not only complicates the hardware design of the driver board, but may also increase signal interference and errors.
[0015] Finally, temperature sensors may age, drift, or even be damaged after long-term use, increasing the complexity and cost of equipment maintenance.
[0016] Therefore, how to determine the temperature of the PFC power circuit in the air conditioner driver board without adding an additional temperature sensor is a technical problem that needs to be solved.
[0017] The present invention utilizes the temperature output function of the IPM module in the air-conditioning driving board and combines it with the heat transfer model to deduce the temperature value of the PFC module, thereby realizing real-time temperature monitoring of the PFC module without adding additional temperature sensors.
[0018] like Figure 1 As shown, this embodiment provides a method for calculating a temperature value, characterized in that the execution subject of the method may be a controller, and the method may include: Step S12: During the operation of the air conditioner, a first temperature value, a second temperature value, a power value of an intelligent power module, and a power value of a power factor correction module are obtained; wherein the intelligent power module and the power factor correction module have the same or similar heat transfer structure; wherein the first temperature value is the temperature value output by the intelligent power module, and the second temperature value is the ambient temperature value of the air conditioner driving board.
[0019] In this implementation, the process of the air conditioner operating can be expressed as the air conditioner operating normally.
[0020] In this implementation, the step of obtaining the first temperature value may be: First, the controller obtains the real-time output voltage value of the intelligent power module through the temperature output pin of the intelligent power module.
[0021] Then, the controller calculates the first temperature value according to a preset curve corresponding to the temperature and output voltage of the intelligent power module.
[0022] In this implementation, the step of obtaining the second temperature value may be: First, the controller sends a request to a preset ambient temperature bag to obtain the second temperature value. The ambient temperature bag can be set near the air conditioner driving board, and the ambient temperature bag can collect the ambient temperature value of the air conditioner driving board.
[0023] Specifically, during the operation of the air conditioner, the controller will send a request to the ambient temperature package according to the predetermined operation logic (for example, every fixed time period or when an event is triggered), requiring the ambient temperature package to provide the current ambient temperature value. The ambient temperature package can be connected to the controller through a physical or wireless communication interface. For example, the controller can send a temperature reading instruction to the temperature package through the I²C bus; the controller can send a communication request to the temperature package through the SPI bus; the controller can also send a data reading instruction through the serial port protocol; the controller can also send a temperature reading instruction through a wireless protocol (for example, BLE or ZigBee).
[0024] It is understood that the ambient temperature package may be integrated with a temperature sensor (e.g., NTC thermistor, digital temperature sensor, etc.), which can measure the current ambient temperature and convert the analog signal into a digital signal. The processing unit of the ambient temperature package can calibrate and process the temperature data and convert it into a standardized temperature value (e.g., Celsius). The ambient temperature package can store the processed temperature value in its internal register, waiting for the controller to read it.
[0025] Then, the controller receives a second temperature value returned by the ambient temperature bulb.
[0026] In this implementation, the step of obtaining the power value of the intelligent power module may be: First, the controller obtains the real-time input current value of the intelligent power module by detecting the current signal at the input end of the intelligent power module. Specifically, the controller detects the current flowing through the intelligent power module through a current sampling circuit (current detection resistor or Hall sensor) connected to the input end of the intelligent power module. The current sampling circuit converts the detected current signal into a voltage signal, and converts the analog signal into a digital signal through an analog-to-digital converter (ADC). The controller reads the digital signal output by the analog-to-digital converter and calculates the actual input current based on the calibration parameters (e.g., resistance value) of the current sampling circuit.
[0027] Then, the controller obtains the real-time input voltage value of the intelligent power module by detecting the voltage signal at the input end of the intelligent power module. Specifically, the controller obtains the voltage at the input end of the intelligent power module through a voltage divider circuit or a directly connected voltage sensor. The voltage signal is converted into a digital signal through an analog-to-digital converter (ADC). The controller reads the digital output of the analog-to-digital converter and calculates the actual input voltage based on the calibration parameters of the voltage detection circuit (for example, the voltage divider ratio).
[0028] Finally, the controller uses the acquired input current value and input voltage value to calculate the real-time power value of the intelligent power module. Specifically, if the intelligent power module operates in pulse modulation mode (PWM mode), the input current value and input voltage value may change dynamically, and the controller can calculate the average power value.
[0029] In this implementation, the power value of the power factor correction module can be obtained in the same manner, and the details will not be repeated.
[0030] In this embodiment, the air conditioner driving board may be a control circuit board for managing the operation of the air conditioner, and may integrate a controller, a power module, a power module (eg, an intelligent power module and a power factor correction module) and a temperature detection module.
[0031] Specifically, the air conditioner driving board may be a split air conditioner driving board, a central air conditioner driving board, a variable frequency air conditioner driving board, or a commercial air conditioner driving board.
[0032] In this embodiment, the intelligent power module can be a highly integrated module that integrates power switching devices (for example, IGBT or MOSFET), drive circuits and protection circuits, and can be used to drive and control high-power loads such as compressors, motors or fans in air conditioners.
[0033] Specifically, the intelligent power module may be an IGBT type intelligent power module, or a MOSFET type intelligent power module, etc.
[0034] In this embodiment, the power factor correction module may be a power electronic module for improving the efficiency of electric energy utilization, and the power factor may be optimized by adjusting the input current waveform to make it consistent with the grid voltage waveform.
[0035] Specifically, the power factor correction module may be a single-stage power factor correction module, a double-stage power factor correction module, a boost power factor correction module, a three-phase power factor correction module, and the like.
[0036] In this embodiment, the intelligent power module and the power factor correction module are configured in the same air conditioner driving board and have the same or similar heat transfer structure.
[0037] The heat transfer structure may refer to a structural design of how the heat generated inside the intelligent power module and the power factor correction module is conducted to an external heat sink through a heat transfer path and finally diffused to the surrounding environment of the driving board.
[0038] In a specific embodiment, the intelligent power module and the power factor correction module may have the same heat transfer structure. The intelligent power module and the power factor correction module have the same heat transfer structure, which means that their heat transfer paths and thermal resistance components are substantially the same.
[0039] Specifically, the heat transfer structure of the intelligent power module and the power factor correction module may be: 1. Heat transfer path from power device to module housing (first thermal resistance): The heat generated by the power devices (e.g., IGBT or MOSFET) inside the intelligent power module and the power devices (e.g., diode, MOSFET or IGBT) inside the power factor correction module is transferred to the module housing through the thermal conductive layer at the bottom of the power device. It is understandable that since the chip packaging of the two modules may be different (e.g., chip size, material, thermal conductive interface, etc.), the specific thermal resistance value of the first thermal resistor may be different, but the transfer path is consistent.
[0040] 2. Heat transfer path from module housing to thermal grease layer (second thermal resistance): The module housing and the heat sink are connected by a thermal grease layer, which serves as an intermediate medium for heat transfer and has consistent thermal conductivity. The intelligent power module and the power factor correction module can use the same thermal grease type and thickness, so the thermal resistance value of the second thermal resistor can be the same. It is understandable that the intelligent power module and the power factor correction module may not use the same thermal grease type and thickness, so the thermal resistance value of the second thermal resistor may also be different.
[0041] 3. Heat transfer path from thermal grease layer to radiator (third thermal resistance): The intelligent power module and the power factor correction module are in direct contact with the heat sink, and the heat sink evenly distributes the heat to the surrounding environment through a high thermal conductivity material (for example, an aluminum profile or a copper profile). Since the intelligent power module and the power factor correction module are both installed in parallel on the same heat sink, the thermal resistance value of the heat sink part can be the same.
[0042] It is understandable that both the intelligent power module and the power factor correction module transfer heat to the heat sink and dissipate it into the environment through the same heat transfer path (first thermal resistor → second thermal resistor → third thermal resistor), ensuring the consistency of the heat transfer structure. Although the specific thermal resistance value of the first thermal resistor may vary due to differences in the internal structure of the module and the chip packaging, this does not affect the heat transfer model built based on the same heat transfer path. That is, in the temperature calculation, the thermal resistance value is obtained through calibration of experimental and empirical data. Even if the value of the first thermal resistor is different, as long as the thermal resistance parameters of the corresponding module are substituted into the calculation model, its temperature value can still be accurately calculated.
[0043] Specifically, in a specific scenario example, the intelligent power module and the power factor correction module are both installed on a long strip radiator, one side of the radiator is connected to the refrigerant pipe, and the other side is connected to the cooling air duct outside the driver board. The radiator material is aluminum profile, the bottom thickness is uniform, the fin height is consistent, the airflow channel design is the same, and the fan provides the same cooling wind field. The thickness of the thermal grease is controlled within 0.1mm, and the thermal conductivity is 8.5W / mK to ensure efficient heat transfer. Heat transfer path: power device → module housing → thermal grease → radiator → air or refrigerant pipe.
[0044] In a specific embodiment, the intelligent power module and the power factor correction module may have the same heat transfer structure. Specifically, the heat transfer structure of the intelligent power module and the power factor correction module may be: 1. Heat transfer path from power device to module substrate (first thermal resistance): The heat generated inside the power devices (e.g., IGBT, MOSFET, or diode) of the intelligent power module and the power factor correction module is transferred to the module substrate through the thermal interface material (e.g., solder layer or thermal adhesive layer) at the bottom of the chip. The module substrate can be a ceramic substrate with high thermal conductivity (e.g., aluminum nitride ceramic or aluminum oxide ceramic) or a metal substrate (e.g., copper substrate or aluminum substrate). Since the power device packaging and substrate materials of the two modules may be different, the specific thermal resistance value of the first thermal resistor may be different, but the heat transfer path of both is power device → thermal interface layer → module substrate.
[0045] 2. Heat transfer path from module substrate to heat sink (second thermal resistance): Heat is transferred between the module substrate and the heat sink through a thermally conductive gasket (for example, a graphite sheet or a thermally conductive insulating sheet). The thermally conductive gasket has both thermal conductivity and electrical insulation. The material and thickness of the thermally conductive gasket can be the same or different. If the two modules use the same type of thermally conductive gasket (such as a graphite sheet of the same thickness), the second thermal resistance value can be the same. If different gasket materials or thicknesses are selected according to the module thermal power requirements, the second thermal resistance value can be different.
[0046] 3. Heat transfer path from heat sink to cooling channel (third thermal resistance): The heat sink on the module substrate is in direct contact with the external cooling channel, which can be a forced air cooling channel or a liquid cooling channel. The two modules share the same cooling channel, and the material (such as aluminum alloy or copper) and geometric structure of the heat sink can be the same, so the thermal resistance value of the third thermal resistor can be consistent.
[0047] In a specific embodiment, the intelligent power module and the power factor correction module may have similar heat transfer structures. Specifically: The heat transfer structure of the intelligent power module may be a heat transfer structure having three layers of thermal resistance: 1. Heat transfer path from power device to module housing (first thermal resistance): The heat generated by the power devices (for example, IGBT or MOSFET) inside the intelligent power module is transferred to the module housing through the thermal conductive layer at the bottom of the device. The thermal conductive layer can be a solder layer or a thermal conductive adhesive material with low thermal resistance.
[0048] 2. Heat transfer path from module housing to thermal grease layer (second thermal resistance): The module housing is connected to the heat sink through thermal grease, which serves as a medium for heat transfer.
[0049] 3. Heat transfer path from thermal grease layer to radiator (third thermal resistance): The thermal grease layer transfers the heat to the heat sink, which dissipates the heat to the environment through natural or forced convection.
[0050] The heat transfer structure of the power factor correction module may be a heat transfer structure having 4 layers of thermal resistance: 1. Heat transfer path from power device to module substrate (first thermal resistance): The heat generated by the power devices (e.g., diodes or MOSFETs) inside the power factor correction module is transferred to the module substrate through the thermal interface material. The substrate material can be a ceramic substrate (e.g., aluminum nitride or aluminum oxide) or a metal substrate (copper).
[0051] 2. Heat transfer path from module substrate to module housing (second thermal resistance): The heat transfer path from the module substrate to the module housing needs to pass through an additional interface layer (e.g., bonding material or thermally conductive layer). This additional thermal resistance (second thermal resistance) exists in the power factor correction module, but its value is small and has limited impact on the overall thermal transfer performance.
[0052] 3. Heat transfer path from module housing to thermal grease layer (third thermal resistance): The module housing and the heat sink are connected by thermal grease, which serves as a medium for heat transfer.
[0053] 4. Heat transfer path from thermal grease layer to radiator (fourth thermal resistance): The thermal grease layer transfers the heat to the heat sink, which dissipates the heat to the environment through natural or forced convection.
[0054] It can be understood that the heat transfer paths of the two modules include a heat transfer process from the power device to the module housing, then to the thermal grease layer and the heat sink, and finally to the environment. The heat transfer structures of the intelligent power module and the power factor correction module are both series heat transfer paths (the intelligent power module and the power factor correction module are in parallel and can be connected in parallel on the same heat sink), and the heat of both is ultimately transferred to the environment through the same heat sink. The heat transfer paths of the two modules are highly similar, both including the transfer process from the power device to the module housing (or substrate), the module housing to the thermal grease, and the thermal grease to the heat sink.
[0055] Both the intelligent power module and the power factor correction module are connected to the environment through the heat transfer path of the heat sink, so the heat transfer structure of the two modules is essentially the same path. Once the heat transfer model of the intelligent power module is verified to be correct (the first temperature value matches the third temperature value calculated by the heat transfer model), it can be inferred that the heat transfer model of the power factor correction module is also correct. The reason is that the heat transfer paths of the two modules (although there are slight differences in the number of layers or details) are essentially the same, and the calculation logic of the heat transfer model is the same, and the accuracy of the overall heat transfer model will not be affected by the difference in individual thermal resistance.
[0056] Step S14: Calculate a third temperature value based on the second temperature value, the power value of the intelligent power module and a preset heat transfer model of the intelligent power module, wherein the heat transfer model of the intelligent power module is pre-constructed based on the heat transfer structure of the intelligent power module.
[0057] In this implementation, the second temperature value and the power value of the intelligent power module may be input into a preset heat transfer model of the intelligent power module, thereby calculating the third temperature value.
[0058] In this implementation, the heat transfer model of the intelligent power module may be: The third temperature value is equal to the second temperature value plus the power value of the intelligent power module multiplied by the total thermal resistance; wherein the total thermal resistance is the sum of the first thermal resistance, the second thermal resistance and the third thermal resistance; wherein the first thermal resistance represents the thermal resistance between the power device and the corresponding module housing; the second thermal resistance represents the thermal resistance between the corresponding module housing and the thermal grease layer; and the third thermal resistance represents the thermal resistance of the radiator.
[0059] In a specific embodiment, the expression of the heat transfer model of the intelligent power module can be: In the formula, Expressed as the third temperature value, Expressed as the first thermal resistance, Expressed as the second thermal resistance, Expressed as the third thermal resistance, Expressed as the second temperature value, Represents the power value of the intelligent power module; where, It is expressed as the thermal resistance of multiple heat transfer paths inside the intelligent power module. It can be understood that , … It can be the heat transfer path from the IGBT or MOSFET wafer inside the intelligent power module to the module housing; it can be the heat transfer path from the diode and other power devices in the intelligent power module to the housing; it can also be the coupled heat transfer path between different devices (such as IGBT and diode).
[0060] Step S16: Determine whether the difference between the first temperature value and the third temperature value is less than or equal to a first preset threshold.
[0061] In this embodiment, the first preset threshold may be an allowable difference value set based on the temperature sensor accuracy of the intelligent power module and the error range of the heat transfer model, and is used to verify the accuracy of the heat transfer model of the intelligent power module.
[0062] Specifically, first, the first temperature value of the intelligent power module is detected through its internal temperature output pin, and the detection value may have a certain measurement error. For example, if the temperature sensor accuracy of the intelligent power module is ±1°C, the preset threshold can cover the measurement error. Then, the third temperature value calculated by the heat transfer model is based on the second temperature value (ambient temperature), the power value and thermal resistance data of the module, wherein the power value and thermal resistance data of the module may deviate due to factors such as experimental calibration errors and environmental fluctuations. Therefore, the first preset threshold can be a comprehensive value of the temperature sensor error and the heat transfer model error to ensure that the calculation result of the model can be determined to be accurate within this range. For example, if the temperature sensor error is ±1°C and the model error is ±1.5°C, the first preset threshold can be set to ±2.5°C.
[0063] Step S18: When the temperature is less than or equal to the first preset threshold, a fourth temperature value is calculated based on the second temperature value, the power value of the power factor correction module and a preset heat transfer model of the power factor correction module; wherein the heat transfer model of the power factor correction module is pre-constructed based on the heat transfer structure of the power factor correction module.
[0064] In this embodiment, the second temperature value and the power value of the power factor correction module may be input into a preset heat transfer model of the power factor correction module for calculation, thereby obtaining the fourth temperature value.
[0065] The preset heat transfer model of the power factor correction module is: The fourth temperature value is equal to the second temperature value plus the power value of the power factor correction module multiplied by the total thermal resistance.
[0066] In a specific embodiment, the preset heat transfer model of the power factor correction module is: In the formula, Expressed as the fourth temperature value, Expressed as the first thermal resistance, Expressed as the second thermal resistance, Expressed as the third thermal resistance, Expressed as the second temperature value, Represents the power value of the power factor correction module; where, It is expressed as the thermal resistance of multiple heat transfer paths inside the power factor correction module. It can be understood that It can be the heat transfer path from the wafer of the IGBT switch device and other power devices (diode) inside the power factor correction module to the module housing; it can also be the heat transfer path of the devices inside the module (such as transistors, inductors, filters); it can also be an independent heat path formed by the thermal coupling effect of series or parallel connection between the devices.
[0067] It is understandable that the intelligent power module and the power factor correction module have the following common or similar physical characteristics during the heat transfer process: Both contain power devices (e.g., IGBTs, MOSFETs, diodes), which are the main heat sources and their generated power is dissipated through heat transfer paths.
[0068] The heat transfer paths of both include power devices, module housing, thermal interface materials (such as thermal grease), heat sinks and other parts, which are highly similar in thermal resistance structure.
[0069] Both are affected by the ambient temperature of the air conditioner driving board (the second temperature value).
[0070] Therefore, this same or similar heat transfer structure is the consistent physical basis for constructing the heat transfer models of the two.
[0071] It is also understandable that the heat transfer model needs to be built based on the actual physical structure. If the heat transfer structures of the two are different, the construction basis of the model cannot be unified, resulting in large differences in the model properties of the two. Since the two have the same or similar heat transfer paths (such as the path from the power device to the housing, the path from the housing to the heat sink, etc.), the calculation method of thermal resistance and the heat transfer formula are comparable, thus laying the foundation for building models with the same properties.
[0072] The present invention utilizes the built-in temperature output function of the intelligent power module, combined with the characteristics that the intelligent power module and the power factor correction module in the air conditioner driver board have the same or similar heat transfer structure, to establish a temperature calculation method based on the heat transfer model. By obtaining the ambient temperature (second temperature value) and the power value of the intelligent power module, the temperature (third temperature value) of the intelligent power module is calculated, and the accuracy of the heat transfer model is verified. When the model is verified, the power value and ambient temperature of the power factor correction module are further combined to calculate its temperature (fourth temperature value) through the heat transfer model of the power factor correction module. This method can accurately calculate the temperature of the power device of the power factor correction module in the air conditioner driver board without adding additional temperature sensors, thereby effectively solving the technical problem of how to determine the temperature of the PFC power circuit in the air conditioner driver board without adding additional temperature sensors in the prior art.
[0073] In some embodiments, the step of obtaining the first temperature value includes: Step S122: Obtain the real-time output voltage value of the intelligent power module through the temperature output pin of the intelligent power module.
[0074] In this embodiment, the controller reads the output voltage value of the temperature output pin connected to the intelligent power module in real time. The temperature output pin of the intelligent power module will output a temperature-related voltage signal according to the temperature change inside the module. The controller uses the internal ADC (analog-to-digital converter) module to convert the analog voltage signal of the output pin into a digital signal for subsequent calculation and processing.
[0075] Step S124: Calculate the first temperature value according to a preset curve corresponding to the temperature and output voltage of the intelligent power module.
[0076] In this embodiment, a corresponding curve data table of the temperature and output voltage of the intelligent power module is pre-stored in the controller. The data table can be generated by the module manufacturer or laboratory testing to ensure its accuracy and reliability. The controller searches for the corresponding temperature value from the temperature-voltage correspondence table based on the real-time output voltage value collected. If the actual voltage value is not at the point defined in the table, the controller can calculate the exact temperature value through an interpolation algorithm (such as linear interpolation). The controller stores the calculated first temperature value in the internal memory and provides it to the subsequent temperature judgment or model calculation module for use.
[0077] In this embodiment, the real-time output voltage value of the intelligent power module is directly obtained through the temperature output pin of the intelligent power module, and the first temperature value of the intelligent power module is calculated in combination with the preset temperature and output voltage corresponding curve. This scheme has significant beneficial effects: there is no need to add additional temperature sensors, and accurate monitoring of the module temperature can be achieved by relying only on the existing hardware resources of the intelligent power module. This not only simplifies the hardware design and reduces costs, but also avoids errors that may be caused by improper installation or layout of external sensors. At the same time, the temperature output characteristics of the module itself can reflect the thermal state inside the module in real time, providing reliable basic data for subsequent heat transfer model verification and related temperature calculations.
[0078] In some embodiments, the power factor correction module and the intelligent power module have the same heat transfer structure in the air conditioner driving board, and the power factor correction module and the intelligent power module are both configured in the same radiator, and the radiator is used to dissipate heat for the power factor correction module and the intelligent power module; The preset heat transfer model of the intelligent power module is: The third temperature value is equal to the second temperature value plus the power value of the intelligent power module multiplied by the total thermal resistance; wherein the total thermal resistance is the sum of the first thermal resistance, the second thermal resistance and the third thermal resistance; wherein the first thermal resistance represents the thermal resistance between the power device and the corresponding module housing; the second thermal resistance represents the thermal resistance between the corresponding module housing and the thermal conductive silicone grease layer; the third thermal resistance represents the thermal resistance of the radiator; The preset heat transfer model of the power factor correction module is: The fourth temperature value is equal to the second temperature value plus the power value of the power factor correction module multiplied by the total thermal resistance.
[0079] In this embodiment, by configuring the power factor correction module and the intelligent power module on the radiator in the same air conditioner driving board, and ensuring that the two modules have the same heat transfer structure, the uniformity of the heat transfer model and the simplification of the calculation logic can be ensured. Since the heat transfer paths (including the first thermal resistance, the second thermal resistance and the third thermal resistance) of the two modules are consistent, and their heat transfer models have been preset before the air conditioner is operated, there is no need to configure the heat transfer model in real time or make complex adjustments during operation. By first verifying whether the heat transfer model of the intelligent power module is accurate (i.e., by calculating the third temperature value and comparing it with the first temperature value), it can be ensured that the heat transfer model of the power factor correction module is also reliable under the same logic. Subsequently, the fourth temperature value is calculated based on the preset heat transfer model of the power factor correction module, thereby achieving an accurate estimation of the temperature of the power device inside the module. This method not only improves the reliability of model construction and verification, but also avoids hardware changes and real-time adjustments during operation, reduces system complexity, and improves the operating safety and temperature control effect of the air conditioner.
[0080] In some implementations, the preset heat transfer model of the power factor correction module is: In the formula, Expressed as the fourth temperature value, Expressed as the first thermal resistance, Expressed as the second thermal resistance, Expressed as the third thermal resistance, Expressed as the second temperature value, Represents the power value of the power factor correction module; where, Expressed as the thermal resistance of multiple heat transfer paths inside the power factor correction module.
[0081] It can be understood that the first thermal resistance adopts the calculation method of parallel thermal resistance, which can more accurately reflect the actual heat flow distribution of multiple heat transfer paths inside the power factor correction module. Since there may be multiple heat transfer paths in multiple power devices or different areas of power devices inside the module, the thermal resistance values of these paths are different, but they jointly affect the overall heat transfer efficiency. Through the calculation method of parallel thermal resistance, the thermal resistance of these different paths can be equivalent to a comprehensive thermal resistance, thereby simplifying the calculation model and ensuring that the calculation results are closer to the actual situation. In addition, the calculation method of parallel thermal resistance can effectively consider the differences in the contribution of each heat transfer path to the overall heat flow, improve the accuracy and versatility of the model calculation, so that the heat transfer model can not only accurately reflect the complex thermal resistance characteristics, but also facilitate rapid calculation and verification in practical applications.
[0082] In this embodiment, a preset heat transfer model of the power factor correction module is used to perform parallel calculation based on the thermal resistances of multiple internal heat transfer paths to obtain the comprehensive thermal resistance of the module, and combined with the external thermal resistance ( and ) and the ambient temperature, and finally calculates the fourth temperature value of the power device inside the power factor correction module. The beneficial effect of this method is that by clarifying the multiple heat transfer paths and thermal resistance parameters inside the power factor correction module, and combining the power value and ambient temperature value of the module, the heat transfer model of the power factor correction module can be accurately constructed, thereby realizing the accurate calculation of the internal temperature of the power factor correction module without adding additional sensors. This model calculation method can avoid the complex real-time measurement hardware requirements and improve the system operation efficiency and reliability.
[0083] like Figure 2 As shown, this embodiment provides a control method for an air conditioner. The execution subject of the control method can also be a controller. The method may include: Step S22: Determine whether the fourth temperature value is in the first target temperature range or the second target temperature range; wherein the fourth temperature value is calculated by a temperature value calculation method provided by the above embodiment; wherein the first target temperature range is a temperature range indicating that a protective operation control strategy needs to be adopted; the second target temperature range is a temperature range indicating that a shutdown protection strategy needs to be adopted, and the lower limit value of the second target temperature range must be greater than or equal to the upper limit value of the first target temperature range.
[0084] In this embodiment, the controller receives a fourth temperature value calculated according to the temperature value calculation method, and compares the fourth temperature value with a pre-set first target temperature interval and a second target temperature interval. Specifically, the controller first determines whether the fourth temperature value falls within the first target temperature interval, which indicates the temperature range in which a protective operation control strategy needs to be adopted. If the fourth temperature value is not within the first target temperature interval, it is further determined whether the fourth temperature value falls within the second target temperature interval, which indicates the temperature range in which shutdown protection needs to be adopted. Through this judgment, the controller can distinguish the temperature range in which the current fourth temperature value is located, and adopt a corresponding control strategy based on the judgment result. It can be understood that if the fourth temperature value is neither in the first target temperature interval nor in the second target temperature interval, it means that it is in a normal operating state, and the following control operations do not need to be performed.
[0085] Step S24: when the fourth temperature value is within the first target temperature range, executing a preset protection operation control strategy to perform a temperature reduction process on the power factor correction module.
[0086] In this embodiment, when the controller determines that the fourth temperature value is within the first target temperature range, the preset protection operation control strategy is activated to reduce the temperature of the power factor correction module to prevent it from continuing to heat up and exceeding the safety range. Specifically, the controller executes the preset protection operation control strategy may be: Increase the operating frequency of the fan to enhance air convection and heat dissipation efficiency; Lower the temperature of the refrigerant pipe to improve the heat dissipation performance of the power factor correction module through the refrigerant heat dissipation system; Adjust the operating mode of the air conditioner, such as limiting the power output of the power factor correction module to reduce the heat generated by its power consumption; Dynamically adjust the fan operation mode. For example, by controlling the start / stop mode of the fan, its operation time and wind field distribution can be dynamically adjusted to reduce power consumption while ensuring heat dissipation efficiency. Increasing the refrigerant flow rate or speeding up the refrigerant circulation speed can improve the refrigerant's heat absorption capacity and reduce the temperature of the power factor correction module.
[0087] Through the above control strategy, the controller can effectively reduce the temperature of the power factor correction module within the first target temperature range, thereby preventing the temperature from further increasing and causing potential damage to the module and the system.
[0088] Step S26: when the fourth temperature value is within the second target temperature range, at least the air conditioner is controlled to shut down.
[0089] In this embodiment, when the controller determines that the fourth temperature value is within the second target temperature range, it indicates that the temperature of the power factor correction module has exceeded the threshold of safe operation, and there is a potential risk of overheating. In order to avoid irreversible damage to the power factor correction module due to high temperature, the controller immediately controls the air conditioner to shut down and stops all operating tasks related to the power factor correction module. At the same time, the controller can trigger a preset alarm mechanism, such as sending an alarm message to the user interface to prompt the user that the power factor correction module is at risk of overheating. Through this shutdown protection measure, the controller can terminate the operation of the module in time to avoid further damage, while improving the safety and reliability of the air conditioner.
[0090] This embodiment realizes accurate hierarchical management of the temperature of the power factor correction module by dividing the fourth temperature value of the power factor correction module into a first target temperature interval and a second target temperature interval. When the fourth temperature value is in the first target temperature interval, the air conditioner can automatically execute a protective operation control strategy, for example, adding heat dissipation measures or adjusting the operating state, so as to effectively reduce the temperature of the power factor correction module, ensure that the power factor correction module operates within a safe range, and extend its service life. When the fourth temperature value is in the second target temperature interval, the air conditioner can be shut down in time to avoid more serious equipment failures caused by high temperature damage to the power factor correction module, thereby improving the safety and reliability of the air conditioner. Through the hierarchical temperature control management strategy, this embodiment can achieve a dynamic balance between temperature protection and stability, and significantly improve the efficiency and safety of the overall operation of the air conditioner.
[0091] In some embodiments, the step of executing a preset protection operation control strategy to perform a temperature reduction process on the power factor correction module includes: The operating frequency of the preset fan is increased to increase the wind field; wherein the fan is a fan that cools the power factor correction module.
[0092] In this embodiment, the controller monitors the temperature of the power factor correction module in real time, and determines whether the temperature value is in the first target temperature range through the fourth temperature value obtained by the above calculation. When the controller detects that the fourth temperature value is in the first target temperature range, the controller sends a control instruction to the preset heat dissipation fan to increase the operating frequency of the fan. The control instruction may specifically include a parameter value for increasing the fan speed to ensure the enhancement of the wind field. After the fan speed is increased, the air flow rate around the radiator increases significantly, thereby quickly taking away the heat on the surface of the power factor correction module and reducing the temperature of the module. After the fan frequency is increased, the controller can continue to monitor the fourth temperature value. If the fourth temperature value has not yet dropped to a safe range, the controller can further optimize the fan frequency until the fourth temperature value reaches the ideal range or triggers other protective measures.
[0093] Alternatively, the temperature of the refrigerant heat dissipation pipe is lowered to improve the heat dissipation effect of the refrigerant; wherein the refrigerant heat dissipation pipe is a refrigerant heat dissipation pipe that cools the power factor correction module.
[0094] In this embodiment, the controller detects the current working state of the refrigerant system, including the current temperature of the refrigerant pipe, according to the real-time temperature of the power factor correction module. When the controller detects that the fourth temperature value is in the first target temperature range, it sends an instruction to the refrigerant system to reduce the temperature of the refrigerant heat dissipation pipe. Specific operations may include: adjusting the operating power of the refrigerant compressor to enhance the refrigeration capacity of the refrigerant; adjusting the opening of the expansion valve to optimize the flow and temperature of the refrigerant; enhancing the heat dissipation effect of the condenser, and improving the refrigerant circulation efficiency by controlling the fan or other condensing devices. After the refrigerant temperature is reduced, the temperature difference of the refrigerant heat dissipation pipe increases, and the heat of the radiator is transferred to the refrigerant pipe more quickly, thereby improving the overall heat dissipation performance and effectively reducing the temperature of the power factor correction module.
[0095] In this embodiment, by increasing the preset operating frequency of the fan to increase the wind field and / or reducing the temperature of the refrigerant heat dissipation pipe to improve the refrigerant heat dissipation effect, efficient cooling of the power factor correction module can be achieved. The beneficial effects of this control strategy are that, firstly, by increasing the operating frequency of the fan, the fluidity of the air around the radiator is enhanced, the heat dissipation of the module surface is accelerated, and thus the temperature of the module is reduced; secondly, by optimizing the temperature setting of the refrigerant heat dissipation pipe, the heat absorption capacity of the refrigerant is further improved, and the overall heat dissipation effect is enhanced.
[0096] In some implementations, the step of at least controlling the air conditioner to shut down includes: The air conditioner is controlled to shut down and a preset first alarm measure is executed; wherein the first alarm measure is an alarm measure for prompting that a power factor correction module is faulty.
[0097] In this embodiment, the first alarm measure may be an audible and visual alarm. Specifically, a built-in buzzer of the air conditioner emits a warning sound, and an alarm indicator light is lit on the display panel to remind the user that the power factor correction module has a fault.
[0098] In this embodiment, the first alarm measure may be a display screen prompt. Specifically, a prompt message, such as "Power factor correction module overheated, please check the device", is displayed on the control panel of the air conditioner or the display screen of the remote control terminal to provide specific fault information.
[0099] In this embodiment, the first alarm measure may be a remote notification. For example, an alarm notification may be sent to a user's mobile phone APP, SMS or email via Wi-Fi or mobile network to inform the user of the overheating of the power factor correction module.
[0100] In this embodiment, by controlling the air conditioner to shut down and executing the preset first alarm measure, when the temperature of the power factor correction module exceeds the second target temperature range (i.e., the temperature range where shutdown protection is required), the operation of the air conditioner can be interrupted in time to avoid damage to the power factor correction module or other key components due to overheating, thereby improving the safety and reliability of the system. At the same time, the first alarm measure clearly indicates the possible fault information of the power factor correction module, providing a quick and accurate guide for subsequent equipment maintenance and troubleshooting, reducing system downtime and operation and maintenance costs, thereby further improving the user experience and efficiency of the air conditioner.
[0101] In some implementations, before the step of determining whether the fourth temperature value is within the first target temperature interval or the second target temperature interval, the method further includes: Step S201: when the air conditioner is started for the first time or restarted after being stopped for a preset time, the current first temperature value and the second temperature value are obtained.
[0102] In this embodiment, the controller monitors the state of the air conditioner, and when it is detected that the air conditioner is in the first power-on startup state, or the air conditioner is restarted from the shutdown state and the shutdown time has reached the preset time, the temperature acquisition process is triggered. The preset time can be set according to the ambient temperature stabilization time or the internal heat dissipation characteristics of the intelligent power module, for example, 10 minutes or longer. The controller reads the real-time output voltage value through the temperature output pin of the intelligent power module. The controller converts the voltage value into the current first temperature value (i.e., the temperature of the intelligent power module) according to the corresponding curve of the preset temperature and the output voltage. The controller sends a request to the environmental temperature sensing package arranged near the air conditioner driver board. The environmental temperature sensing package responds to the request, collects the current ambient temperature value of the air conditioner driver board, and returns the value to the controller as the second temperature value.
[0103] Step S202: Determine whether the difference between the first temperature value and the second temperature value is less than or equal to a second preset threshold.
[0104] In this implementation manner, the controller performs a difference calculation between the acquired first temperature value (intelligent power module temperature) and the second temperature value (ambient temperature) to obtain the difference.
[0105] In this embodiment, the second preset threshold value may be an error range determined according to the temperature output characteristics of the intelligent power module and the accuracy of the ambient temperature sensor. The first temperature value of the intelligent power module is calculated by the temperature output pin and the corresponding voltage-temperature curve, and there is often a certain sampling accuracy error. For example, the temperature sampling accuracy may be ±1°C. The second temperature value (ambient temperature) is collected by the ambient temperature package, and the ambient temperature package itself also has a certain temperature measurement error, such as ±0.5°C. Therefore, the second preset threshold value may be ±1.5°C.
[0106] Step S203: When the temperature is greater than a second preset threshold, executing a preset second alarm measure; wherein the second alarm measure is an alarm measure for indicating that the temperature sampling of the intelligent power module is abnormal.
[0107] In this embodiment, when the controller determines that the difference is greater than the second preset threshold, the second alarm measure is immediately triggered to indicate that the temperature sampling of the intelligent power module may be abnormal. For example, the controller can display fault information on the air conditioner display panel, such as "Intelligent power module temperature sampling abnormality", and light up the relevant alarm indicator light. The controller can send a fault alarm notification to the user's mobile terminal via Wi-Fi or mobile network, prompting the user to check the device. The controller can record the alarm event in the internal storage of the air conditioner, including data such as the time when the alarm occurred, the first temperature value, the second temperature value, and the difference, to facilitate subsequent fault diagnosis and maintenance.
[0108] In this embodiment, when the air conditioner is started for the first time or restarted after being shut down for a preset time, the current first temperature value (temperature value output by the intelligent power module) and the second temperature value (ambient temperature value) are first obtained, and the difference between the two is judged, so that it can be effectively verified whether there is an abnormality in the temperature sampling of the intelligent power module. If the difference is greater than the second preset threshold, the preset second alarm measure is triggered, indicating that the temperature sampling of the intelligent power module may be abnormal. The beneficial effect of this method is that, through the temperature comparison check at startup, the temperature sampling deviation or fault of the intelligent power module can be discovered in time before the air conditioner is running, avoiding the failure of subsequent temperature calculation and protection strategy due to sampling error. Furthermore, this mechanism improves the reliability of the air conditioner operation, provides a more accurate data basis for the temperature monitoring and protection of the power factor correction module, and effectively prevents potential faults or safety hazards caused by abnormal temperature sampling.
[0109] like Figure 3 As shown, in some embodiments, before the step of determining whether the fourth temperature value is in the first target temperature interval or the second target temperature interval, the method further includes: Step S204: when the temperature is less than or equal to the second preset threshold, the intelligent power module and the power factor correction module are controlled to run for a preset fixed time with a preset fixed duty cycle and after running for the preset fixed time, the current first temperature value is updated.
[0110] In this embodiment, the controller first determines whether the difference between the first temperature value and the second temperature value in the previous step is less than or equal to the second preset threshold value. If the condition is met, enter this step. The controller can control the intelligent power module and the power factor correction module to run for a fixed period of time according to the preset fixed duty cycle parameters. For example, the fixed duty cycle can be set to 50%, and the running time can be 60 seconds. After the fixed operation is completed, the controller obtains the new real-time output voltage value through the temperature output pin of the intelligent power module, and calculates the first temperature value after the operation according to the preset temperature-voltage corresponding curve, and stores it as the updated first temperature value.
[0111] Step S205: According to the second temperature value, determine the reference temperature value of the intelligent power module from a preset data table; wherein the data table is pre-configured with the reference temperature value of the intelligent power module under different ambient temperatures when the intelligent power module and the power factor correction module are controlled to run at a preset fixed duty cycle for a preset fixed time.
[0112] In this embodiment, the controller searches for a reference temperature value corresponding to the current second temperature value in a preset data table. The data table pre-configures the reference temperature value of the intelligent power module after running the intelligent power module and the power factor correction module at a preset fixed duty cycle for a fixed time at different ambient temperatures. It is understood that if the second temperature value does not completely match the entry in the data table, the controller can use an interpolation algorithm (e.g., linear interpolation) to calculate the closest reference temperature value.
[0113] Step S206: determining whether the difference between the reference temperature value of the intelligent power module and the updated first temperature value is less than or equal to a third preset threshold; In this embodiment, the controller may calculate the difference between the updated first temperature value (obtained in step S204) and the reference temperature value (obtained in step S205). The controller compares the calculated difference with a third preset threshold value. The third preset threshold value may be ±2°C, ±3°C, or ±3.5°C, etc.
[0114] If it is less than or equal to the third preset threshold, it means that the temperature sampling of the intelligent power module is normal and meets expectations, and the subsequent process can be entered.
[0115] If it is greater than the third preset threshold, the next step of alarm processing is entered.
[0116] Step S207: When the value is greater than the third preset threshold, executing the preset second alarm measure.
[0117] In this embodiment, when the controller determines that the difference is greater than the third preset threshold, it is considered that the temperature sampling of the intelligent power module is abnormal, and the second alarm measure is triggered. For example, the controller displays an alarm message on the air conditioner display panel, such as "Intelligent power module temperature sampling is abnormal, please check the device", and lights up the alarm indicator light.
[0118] In this embodiment, when the second preset threshold meets the conditions, the intelligent power module and the power factor correction module are further controlled to run for a fixed time with a preset fixed duty cycle, and the reference temperature value of the intelligent power module is obtained from the preset data table in combination with the ambient temperature value, and compared with the updated actual first temperature value. The beneficial effect of this method is that through temperature sampling and comparison verification under fixed operating conditions, the accuracy of the heat transfer model and temperature sampling of the intelligent power module can be effectively checked, thereby further confirming whether the temperature monitoring function of the module is normal. Through the pre-configuration of the data table, it can be ensured that the reference temperature value matches the actual operating conditions, thereby improving the accuracy of the comparison. If the comparison result shows that the difference exceeds the third preset threshold, the second alarm measure is executed in time, and potential temperature sampling anomalies or thermal model deviations can be discovered before the air conditioner is operated, avoiding the failure of subsequent temperature control and protection strategies, thereby enhancing the safety, reliability and temperature control capabilities of the system.
[0119] like Figure 4 As shown, in a specific and possible implementation, a heat transfer structure of an intelligent power module and a power factor correction module is provided: The heat generated by the IGBT in the PFC circuit in the figure is dissipated to the refrigerant pipe and the air through heat conduction, through the thermal grease and the heat sink, and finally through heat convection. is the IGBT temperature in the PFC circuit; The temperature of the heat dissipating silicone grease; is the temperature of the radiator; T is the ambient temperature of the electrical box at this time (this temperature can be obtained by the ambient temperature package of the electrical box); is the thermal resistance of multiple heat transfer paths between the IGBT body and the chip housing; is the thermal resistance of the heat dissipation silicone grease; is the thermal resistance of the heat sink.
[0120] P is the total power of the power device; is the temperature difference; is the total thermal resistance, because the power device and the heat sink are in series mode, so: In the formula, Expressed as the fourth temperature value, Expressed as the first thermal resistance, Expressed as the second thermal resistance, Expressed as the third thermal resistance, Expressed as the second temperature value, Represents the power value of the power factor correction module; where, , … Expressed as the thermal resistance of multiple heat transfer paths inside the power factor correction module.
[0121] The thermal resistance can be calculated as follows: Where: σ is the material thickness along the direction of heat flow; λ is the thermal conductivity; S is the material area perpendicular to the direction of heat flow.
[0122] like Figure 5 As shown, according to an embodiment of the present invention, an air conditioner includes a controller, wherein the controller is used to execute the above-mentioned temperature value calculation method or the above-mentioned air conditioner control method.
[0123] Specifically, in this embodiment, the controller can be configured in the same air conditioner driving board with the intelligent power module and the power factor correction module. The intelligent power module and the power factor correction module have the same or similar heat transfer structure.
[0124] In this embodiment, the controller may also be provided separately, and is not configured in the same air conditioner driving board with the intelligent power module and the power factor correction module.
[0125] In this embodiment, the intelligent power module and the power factor correction module may not be configured in the same air conditioner driver board. For example, the intelligent power module is configured in one air conditioner driver board, and the power factor correction module is configured in another air conditioner driver board, but in this case, the intelligent power module and the power factor correction module also have the same or similar heat transfer structure.
[0126] According to an embodiment of the present invention, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a computer, the computer executes the method described in any of the above embodiments.
[0127] According to an embodiment of the present invention, a computer program product including instructions is also provided. When the instructions are executed by a computer, the computer executes a method in any one of the above embodiments.
[0128] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0129] Optionally, the specific examples in this embodiment may refer to the examples described in the above embodiments, and this embodiment will not be described in detail here.
[0130] The serial numbers of the above-mentioned embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.
[0131] In the above embodiments of the present application, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments.
[0132] The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.
Claims
1. A method for calculating a temperature value, characterized in that: The method comprises: During the operation of the air conditioner, a first temperature value, a second temperature value, a power value of an intelligent power module, and a power value of a power factor correction module are obtained; wherein the intelligent power module and the power factor correction module have the same or similar heat transfer structure; wherein the first temperature value is a temperature value output by the intelligent power module, and the second temperature value is an ambient temperature value of a driving board of the air conditioner; Calculating a third temperature value based on the second temperature value, the power value of the intelligent power module and a preset heat transfer model of the intelligent power module; wherein the heat transfer model of the intelligent power module is pre-constructed based on the heat transfer structure of the intelligent power module; Determine whether a difference between the first temperature value and the third temperature value is less than or equal to a first preset threshold; When the temperature is less than or equal to the first preset threshold, a fourth temperature value is calculated based on the second temperature value, the power value of the power factor correction module and a preset heat transfer model of the power factor correction module; wherein the heat transfer model of the power factor correction module is pre-constructed based on the heat transfer structure of the power factor correction module.
2. The method according to claim 1, characterized in that: The step of obtaining the first temperature value comprises: Obtain the real-time output voltage value of the intelligent power module through the temperature output pin of the intelligent power module; The first temperature value is calculated according to a preset curve corresponding to the temperature and output voltage of the intelligent power module.
3. The method according to claim 1, characterized in that The power factor correction module and the intelligent power module have the same heat transfer structure in the air conditioner driving board, and the power factor correction module and the intelligent power module are both configured in the same radiator, and the radiator is used to dissipate heat for the power factor correction module and the intelligent power module; The preset heat transfer model of the intelligent power module is: The third temperature value is equal to the second temperature value plus the power value of the intelligent power module multiplied by the total thermal resistance; wherein the total thermal resistance is the sum of the first thermal resistance, the second thermal resistance and the third thermal resistance; wherein the first thermal resistance represents the thermal resistance between the power device and the corresponding module housing; the second thermal resistance represents the thermal resistance between the corresponding module housing and the thermal conductive silicone grease layer; the third thermal resistance represents the thermal resistance of the radiator; The preset heat transfer model of the power factor correction module is: The fourth temperature value is equal to the second temperature value plus the power value of the power factor correction module multiplied by the total thermal resistance.
4. The method according to claim 3, characterized in that The preset heat transfer model of the power factor correction module is: In the formula, Expressed as the fourth temperature value, Expressed as the first thermal resistance, Expressed as the second thermal resistance, Expressed as the third thermal resistance, Expressed as the second temperature value, Represents the power value of the power factor correction module; where, Expressed as the thermal resistance of multiple heat transfer paths inside the power factor correction module.
5. A method for controlling an air conditioner, characterized in that: include: Determine whether the fourth temperature value is in the first target temperature range or the second target temperature range; wherein the fourth temperature value is calculated by the method described in any one of claims 1 to 4; wherein the first target temperature range is a temperature range indicating that a protective operation control strategy needs to be adopted; the second target temperature range is a temperature range indicating that a shutdown protection strategy needs to be adopted, and the lower limit value of the second target temperature range is greater than or equal to the upper limit value of the first target temperature range; When the fourth temperature value is within the first target temperature range, executing a preset protection operation control strategy to perform a temperature reduction process on the power factor correction module; When the fourth temperature value is within the second target temperature range, at least the air conditioner is controlled to shut down.
6. The method according to claim 5, characterized in that The step of executing a preset protection operation control strategy to perform a temperature reduction process on the power factor correction module includes: Increasing the operating frequency of a preset fan to increase the wind field; wherein the fan is a fan that cools the power factor correction module; or, The temperature of the refrigerant heat dissipation pipe is lowered to improve the heat dissipation effect of the refrigerant; wherein the refrigerant heat dissipation pipe is a refrigerant heat dissipation pipe that performs cooling on the power factor correction module.
7. The method according to claim 5, characterized in that The step of at least controlling the air conditioner to shut down comprises: The air conditioner is controlled to shut down and a preset first alarm measure is executed; wherein the first alarm measure is an alarm measure for prompting that a power factor correction module is faulty.
8. The method according to claim 5, characterized in that Before the step of determining whether the fourth temperature value is within the first target temperature range or the second target temperature range, the method further includes: When the air conditioner is started for the first time or restarted after being stopped for a preset time, obtaining the current first temperature value and the second temperature value; Determining whether a difference between the first temperature value and the second temperature value is less than or equal to a second preset threshold; When the temperature is greater than a second preset threshold, a preset second alarm measure is executed; wherein the second alarm measure is an alarm measure indicating abnormal temperature sampling of the intelligent power module.
9. The method according to claim 8, characterized in that Before the step of determining whether the fourth temperature value is within the first target temperature range or the second target temperature range, the method further includes: When the temperature is less than or equal to the second preset threshold, the intelligent power module and the power factor correction module are controlled to run for a preset fixed time with a preset fixed duty cycle, and after running for the preset fixed time, the current first temperature value is updated; According to the second temperature value, determining a reference temperature value of the intelligent power module from a preset data table; wherein the data table is pre-configured with reference temperature values of the intelligent power module when the intelligent power module and the power factor correction module are controlled to run for a preset fixed time at a preset fixed duty cycle under different ambient temperatures; Determine whether a difference between a reference temperature value of the intelligent power module and an updated first temperature value is less than or equal to a third preset threshold; When the value is greater than a third preset threshold, a preset second alarm measure is executed.
10. An air conditioner, characterized in that: It comprises a controller, wherein the controller is used to execute the temperature value calculation method described in any one of claims 1-4 or to execute the air conditioner control method described in any one of claims 5-9.
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