Processing device

Abstract

The invention provides a processing device with improved energy efficiency. The processing apparatus (10) can heat, pressurize and control the atmosphere of the substrate (90). A processing apparatus (10) is provided with a substrate holding member (20) having: a mounting section (22) for mounting and housing a substrate (90); and a sealing part (24) formed so as to surround the placement part (22), the processing device (10) being capable of forming a sealed space surrounded by the sealing part (24). The processing device (10) is provided with a holding member interior gas flow path (61) and a heating part interior gas flow path (62) that communicate with the interior of the sealed space.

Description

Technical Field

[0001] The present invention relates to a processing device for processing a processed component such as a substrate. Background Art

[0002] In recent years, research and development that contributes to energy efficiency has been conducted in order to ensure that more people have access to affordable, reliable, and sustainable modern energy.

[0003] In processing devices for processing substrates and other processed parts, it is also required to contribute to energy efficiency. For example, Patent Document 1 describes a processing device for pressurizing, heating, and controlling the atmosphere of a substrate in a chamber space, and the processing device achieves energy efficiency by reliably isolating the chamber space from the external atmosphere.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2009-220151 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, the processing apparatus of Patent Document 1 needs to perform atmosphere control in the entire chamber, and therefore there is room for improvement in terms of energy efficiency when performing atmosphere control.

[0009] The present invention provides a processing device with improved energy efficiency.

[0010] Means for solving problems

[0011] The present invention relates to a processing device, which can heat, pressurize and control the atmosphere of a processed part.

[0012] in,

[0013] The processing device is provided with a base component, and the base component has:

[0014] a loading portion for loading and storing the workpiece; and

[0015] a sealing portion formed so as to surround the mounting portion,

[0016] The processing device can form a closed space surrounded by the sealing portion,

[0017] The processing device has a gas flow path communicating with the interior of the closed space.

[0018] Effects of the Invention

[0019] According to the present invention, the atmosphere of the workpiece can be controlled by controlling the atmosphere of the closed space surrounded by the sealing portion, so that the space for atmosphere control can be reduced and the energy efficiency of atmosphere control in the processing device can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a perspective view of the processing device according to the first embodiment of the present invention as seen from obliquely above.

[0021] Figure 2 It is targeting Figure 1 A three-dimensional view of the processing device with the pressurizing shaft and the cover component removed, viewed from obliquely above.

[0022] Figure 3 It is targeting Figure 2 A three-dimensional view of the processing device observed from obliquely above in a state where the positioning components and the pressing member are further removed.

[0023] Figure 4 yes Figure 1 AA cross-sectional view of the processing device.

[0024] Figure 5 Yes Description Figure 1 A flowchart of an example of a processing process for a substrate by a processing device.

[0025] Figure 6 This is a perspective view of a processing device according to a second embodiment of the present invention as seen from obliquely above.

[0026] Figure 7 yes Figure 6 BB cross-sectional view of the processing device.

[0027] Figure 8 This is a perspective view of the pressurizing shaft viewed from obliquely above.

[0028] Fig. 9 This is a perspective view of a processing device according to a modified example of the second embodiment of the present invention as seen from obliquely above.

[0029] Description of Reference Numerals

[0030] 10 Processing equipment

[0031] 20 Substrate holding member (base member)

[0032] 22 Loading section

[0033] 23 Flow path groove

[0034] 24 Sealing part

[0035] 30 Pressure shaft

[0036] 37 Pressurization unit

[0037] 38 Pressure acquisition unit

[0038] 40 Cover parts

[0039] 41 Supporting part

[0040] 50 Heating unit

[0041] 61 Gas flow path in holding component (gas flow path in base part)

[0042] 62 Gas flow path in heating unit

[0043] 90 Substrate (processed part) DETAILED DESCRIPTION

[0044] Hereinafter, each embodiment of the processing device of the present invention will be described based on the drawings. In addition, the drawings are viewed along the direction of the reference numerals.

[0045] [First embodiment]

[0046] (Structure of processing device)

[0047] The processing device 10 of this embodiment can heat, pressurize and control the atmosphere of the substrate 90. Figure 1 As shown, the processing device 10 includes a substrate holding member 20 , a pressurizing shaft 30 , a cover member 40 , and a heating unit 50 .

[0048] like Figures 2 to 4 As shown, the substrate holding component 20 includes: a main surface portion 21; a loading portion 22 for loading and storing the substrate 90; a flow path groove portion 23, which is formed in a manner surrounding the loading portion 22 when viewed from above; and a sealing portion 24, which is formed in a manner surrounding the outer side of the flow path groove portion 23 when viewed from above.

[0049] The main surface 21 has a substantially flat shape extending forward, backward, left and right. A substantially columnar positioning pin 25 protruding upward is provided on the main surface 21. Two positioning pins 25 are provided at diagonal positions in front, back, left and right directions when viewed from above.

[0050] The placement portion 22 has a concave shape that is recessed downward from the main surface portion 21 , and can position and accommodate the substrate 90 in the concave portion.

[0051] The flow channel portion 23 has a concave shape that is shallower than the mounting portion 22 and is recessed downward, and is formed so as to surround the mounting portion 22 when viewed from above.

[0052] The sealing portion 24 is formed so as to surround the flow path groove portion 23 when viewed from above. The sealing portion 24 has a substantially flat sealing surface 241 that protrudes upward from the main surface portion 21 on the outer peripheral side of the flow path groove portion 23 when viewed from above and extends in the front, back, left, and right directions; and an annular sealing groove 242 that is recessed downward from the sealing surface 241 in a concave shape. An O-ring 243 is disposed in the sealing groove 242.

[0053] The substrate holding member 20 is provided with a holding member internal gas flow path 61 through which an inert gas described later flows. The holding member internal gas flow path 61 penetrates the substrate holding member 20 in the up-down direction. An upper opening portion 61a opening upward from the flow path groove portion 23 is formed at the upper end of the holding member internal gas flow path 61, and a lower opening portion 61b opening downward from the lower surface of the substrate holding member 20 is formed at the lower end of the holding member internal gas flow path 61. In this way, the holding member internal gas flow path 61 is provided in a manner communicating with the flow path groove portion 23.

[0054] The pressure shaft 30 is arranged above the substrate holding member 20. The pressure shaft 30 has a generally cylindrical shape with a bottom extending in the up-down direction. The pressure shaft 30 can move up and down. The pressure shaft 30 is a hollow heat-insulating shaft formed of a heat-insulating material. In addition, the pressure shaft 30 can also be a hollow shaft formed of a heat-conducting material, and a heater is accommodated in the hollow interior. The pressure shaft 30 is preferably a structure in which the heat generated by the heating unit 50 described later is not dissipated from the substrate holding member 20 via the pressure shaft 30.

[0055] The cover member 40 is detachably fixed to the upper surface of the substrate holding member 20 by means of fixing members such as bolts. The cover member 40 includes: a support portion 41 that surrounds the lower end of the pressure shaft 30 and extends in a hollow cylindrical shape in the vertical direction, through which the pressure shaft 30 is inserted; and a cover portion 42 that extends from the lower end of the support portion 41 in a flange-like manner in the front, rear, left, and right directions.

[0056] The cover 40 is fixed to the upper surface of the substrate holding member 20 while the cover 42 presses downward the O-ring 243 disposed in the sealing groove 242 of the substrate holding member 20. Thus, the gap between the cover 40 and the substrate holding member 20 is kept sealed by the O-ring 243 disposed in the sealing groove 242.

[0057] An annular seal groove 411 that is recessed toward the outer circumference is formed on the inner circumferential surface near the upper end of the support portion 41. An O-ring 412 is disposed in the seal groove 411. Therefore, the gap between the support portion 41 of the cover member 40 and the pressurizing shaft 30 is sealed by the O-ring 412.

[0058] The pressurizing shaft 30 can slide in the up-down direction along the inner peripheral surface of the support portion 41 of the cover member 40 while maintaining a state in which a gap between the pressurizing shaft 30 and the support portion 41 of the cover member 40 is sealed by the O-ring 412 .

[0059] As described above, the gap between the cover part 40 and the substrate holding part 20 is sealed by the O-ring 243 arranged in the sealing groove 242, and the gap between the support part 41 of the cover part 40 and the pressure shaft 30 is sealed by the O-ring 412 arranged in the sealing groove 411, thereby forming a closed space surrounded by the cover part 42 of the cover part 40, the sealing part 24 of the substrate holding part 20, and the substrate holding part 20.

[0060] In this way, when processing the substrate 90 , the placement portion 22 on which the substrate 90 is placed can be made into a closed space by the cover member 40 and the substrate holding member 20 .

[0061] Therefore, when processing the substrate 90, the atmosphere of the substrate 90 can be controlled by controlling the atmosphere of the enclosed space surrounded by the cover part 42 of the cover part 40, the sealing part 24 of the substrate holding part 20, and the substrate holding part 20, thereby reducing the space for atmosphere control and improving the energy efficiency of the processing device 10 when processing the substrate 90.

[0062] Furthermore, the space surrounded by the sealing portion 24, the substrate holding member 20, and the cover member 40 can be used as a closed space by using the cover member 40 that can be attached to and detached from the substrate holding member 20. Therefore, the closed space can be easily formed after the substrate 90 is placed on the substrate holding member 20. This can improve the productivity when processing the substrate 90.

[0063] The heating section 50 has a substantially rectangular parallelepiped shape. A heating section internal gas flow path 62 for the flow of an inert gas described later is provided inside the heating section 50 having a substantially rectangular parallelepiped shape. An upper opening 62a opening upward from the upper surface of the heating section 50 is formed at one end of the heating section internal gas flow path 62, and a lateral opening 62b opening in a substantially horizontal direction from the side surfaces forming the front, rear, left, and right surfaces of the heating section 50 is formed at the other end of the heating section internal gas flow path 62. The upper opening 62a of the heating section internal gas flow path 62 is connected to the lower opening 61b of the holding member internal gas flow path 61 of the substrate holding member 20, and the heating section internal gas flow path 62 is communicated with the holding member internal gas flow path 61.

[0064] In this way, by integrally forming at least a portion (gas flow path 62 inside the heating part) of the gas flow path (gas flow path 62 inside the heating part and gas flow path 61 inside the holding part) that is connected to the enclosed space surrounded by the sealing part 24, the substrate holding part 20 and the cover part 40 with the heating part 50, the manufacturing cost of the processing device 10 can be reduced.

[0065] In addition, at least a portion of the gas flow path (gas flow path 62 in the heating section and gas flow path 61 in the holding component) (gas flow path 62 in the heating section) passes through the interior of the heating section 50 and is connected to the enclosed space surrounded by the sealing section 24, the substrate holding component 20 and the cover component 40, thereby enabling the processing device 10 to be miniaturized.

[0066] Furthermore, at least a portion of the gas flow path (the gas flow path 62 in the heating part and the gas flow path 61 in the holding part) (the gas flow path 61 in the holding part) passes through the interior of the substrate holding part 20 and is connected to the enclosed space surrounded by the sealing part 24, the substrate holding part 20 and the cover part 40, thereby enabling the processing device 10 to be miniaturized.

[0067] A sealing groove 201 is formed on the lower surface of the substrate holding member 20 so as to surround the lower opening 61b of the holding member internal gas flow path 61. An O-ring 202 is disposed in the sealing groove 201. Thus, the connection between the heating unit internal gas flow path 62 and the holding member internal gas flow path 61 is sealed.

[0068] Thus, even if the heating unit 50 and the substrate holding member 20 are separate members, a closed gas flow path (the heating unit in-gas flow path 62 and the holding member in-gas flow path 61 ) can be formed, so that the manufacturing of the processing apparatus 10 becomes easy.

[0069] Furthermore, the gas flow path (the gas flow path 62 in the heating portion and the gas flow path 61 in the retaining member) is connected to the flow path groove portion 23 formed in a manner surrounding the mounting portion 22, so that the substrate 90 can be stably held on the mounting portion 22 and the atmosphere of the substrate 90 can be controlled with good energy efficiency.

[0070] The lateral opening 62b of the gas flow path 62 in the heating section is connected to an intake and exhaust pipe 63. When processing the substrate 90, after the placing section 22 of the substrate holding member 20 is made into a closed space, the inert gas described later is taken in and exhausted through the self-intake exhaust pipe 63, so that the atmosphere of the substrate 90 can be controlled.

[0071] A heater storage section 51 for storing a heater (not shown) serving as a heat source is provided inside the heating section 50 having a substantially rectangular parallelepiped shape. In the present embodiment, the heater storage section 51 extends in a tubular shape in a substantially horizontal direction, and one end is opened in a substantially horizontal direction from the side surface forming the front, back, left, and right surfaces of the heating section 50. And, the heater is inserted from the opening. The heater stored in the heater storage section 51 is, for example, a cartridge heater. The cartridge heater is a heater obtained by covering a heating element such as a nickel-chromium alloy wire with a metal tube.

[0072] A thermocouple housing portion 52 for housing a thermocouple (not shown) functioning as a temperature sensor is provided inside the heating portion 50 having a substantially rectangular parallelepiped shape. In the present embodiment, the thermocouple housing portion 52 is provided above the heater housing portion 51, that is, provided between the heater housing portion 51 and the substrate holding member 20 in the up-down direction, extends in a tubular shape in a substantially horizontal direction, and one end is opened in a substantially horizontal direction from a side surface forming the front, back, left, and right surfaces of the heating portion 50. Then, the thermocouple is inserted from the opening.

[0073] In addition, in the present embodiment, a thermocouple storage portion 28 for storing a thermocouple is also provided in the substrate holding member 20. The thermocouple storage portion 28 is provided below the mounting portion 22, that is, provided between the heater storage portion 51 and the mounting portion 22 in the vertical direction, extends in a tubular shape in a substantially horizontal direction, and one end is opened in a substantially horizontal direction from the side surface forming the front, rear, left, and right surfaces of the heating portion 50. And, the thermocouple is inserted from this opening.

[0074] When processing the substrate 90, the positioning member 26 is arranged on the upper surface of the substrate holding member 20. The positioning member 26 has a flat plate shape and is arranged in a manner to cover the main surface portion 21, the mounting portion 22, and the flow path groove portion 23 from above. Two positioning holes 261 penetrating in the up-down direction are provided in the positioning member 26 at the diagonal positions of the front, back, left, and right when viewed from above. Moreover, when the positioning member 26 is arranged on the upper surface of the substrate holding member 20, the two positioning pins 25 provided on the main surface portion 21 of the substrate holding member 20 are respectively inserted into the two positioning holes 261 of the positioning member 26. Thus, the positioning member 26 is positioned and arranged on the upper surface of the substrate holding member 20.

[0075] A pressing piece placement hole 262 is formed in a substantially central portion of the positioning member 26 in the front, rear, left, and right directions. The pressing piece placement hole 262 penetrates in the up-down direction and has a substantially rectangular shape when viewed from above.

[0076] When processing the substrate 90, the substantially rectangular pressing member 27 having substantially the same shape as the pressing member placement hole 262 and being insertable through the pressing member placement hole 262 is placed. The pressing member 27 is thicker than the positioning member 26 in the vertical direction.

[0077] (An example of a process for processing a substrate by a processing device)

[0078] Next, refer to Figure 5 An example of a processing process of the substrate 90 by the processing apparatus 10 will be described.

[0079] First, a substrate 90 coated with a bonding material for bonding the element is prepared (step S101). The bonding material is, for example, a bonding material for sintering bonding. The bonding material is in a paste state when applied to the substrate 90. Then, the bonding material is sintered by heating and pressurizing, and the element is sintered and bonded to the substrate 90. The bonding material is, for example, a silver (Ag) sintering bonding material. Then, as Figure 3 and Figure 4 As shown, the substrate 90 coated with the bonding material is placed on the placement portion 22 of the substrate holding member 20 (step S102 ).

[0080] Then, if Figure 2 As shown, the positioning pin 25 of the substrate holding member 20 is passed through the positioning hole 261 of the positioning member 26, so that the positioning member 26 is positioned and arranged on the upper surface of the substrate holding member 20 (step S103). Then, the pressing member 27 is arranged in the pressing member arrangement hole 262 of the positioning member 26.

[0081] Then, a component (not shown) bonded to the substrate 90 is positioned relative to the substrate 90 and arranged in the pressing element arrangement hole 262 of the positioning member 26 (step S104 ). Next, the pressing element 27 is arranged in the pressing element arrangement hole 262 of the positioning member 26 (step S105 ).

[0082] Next, the cover member 40 and the pressure shaft 30 are set on the substrate holding member 20 (step S106). At this time, the pressure shaft 30 may be inserted through the support portion 41 of the cover member 40 after the cover member 40 is fixed to the upper surface of the substrate holding member 20 by a fixing member such as a bolt, or the cover member 40 may be fixed to the upper surface of the substrate holding member 20 by a fixing member such as a bolt while the pressure shaft 30 is inserted through the support portion 41 of the cover member 40. In addition, in step S106, when the pressure shaft 30 is inserted through the support portion 41 of the cover member 40, there is a gap between the pressure shaft 30 and the pressing member 27, and the state in which the pressing member 27 is not pressed by the pressure shaft 30 is maintained.

[0083] like Figure 4 As shown in the figure, when the cover member 40 is set on the substrate holding member 20, the cover part 42 presses the O-ring 243 arranged in the sealing groove 242 of the substrate holding member 20 downward, and the gap between the cover member 40 and the substrate holding member 20 is sealed by the O-ring 243 arranged in the sealing groove 242. Furthermore, as described above, the gap between the support part 41 of the cover member 40 and the pressure shaft 30 is sealed by the O-ring 412. As a result, the placement part 22 becomes a closed space surrounded by the cover part 42 of the cover member 40, the sealing part 24 of the substrate holding member 20, and the substrate holding member 20.

[0084] In this way, the pressure shaft 30 can slide in the up-down direction along the inner peripheral surface of the support portion 41 of the cover member 40 while maintaining the gap between the pressure shaft 30 and the support portion 41 of the cover member 40 sealed by the O-ring 412, so that a closed space surrounded by the cover portion 42 of the cover member 40, the sealing portion 24 of the substrate holding member 20, and the substrate holding member 20 can be formed with a simple structure. Thus, the cost reduction and miniaturization of the processing device 10 can be achieved.

[0085] After that, in the state where the placing part 22 is a closed space, the atmosphere of the placing part 22 is controlled through the air intake and exhaust pipe 63 (step S107). As an example, the placing part 22 is made into a substantially vacuum state by exhausting the air filled in the placing part 22 which is a closed space from the air intake and exhaust pipe 63. As another example, the placing part 22 which is a closed space is filled with an inert gas, such as nitrogen, from the air intake and exhaust pipe 63. Thus, the placing part 22 which is a closed space can be made into a deoxygenated space.

[0086] Next, the pressure shaft 30 is moved downward to control the pressure on the component and the substrate 90 (step S108). The thickness of the pressing member 27 in the vertical direction is thicker than the positioning member 26. Therefore, when the pressure shaft 30 is moved downward, the pressure shaft 30 contacts the pressing member 27 before the positioning member 26, and presses the pressing member 27 downward. Thus, a prescribed load is applied to the component and the substrate 90 via the pressing member 27 by the pressure shaft 30. In addition, step S108 can also be performed in parallel with the atmosphere control of the carrier 22 in step S107. That is, the atmosphere control of the carrier 22 in step S107 can also be performed in a state where a preliminary load less than the prescribed load is applied to the component and the substrate 90 via the pressure shaft 30 via the pressing member 27.

[0087] Next, heating control is performed to heat the substrate 90 placed on the placement section 22 by the heating section 50 (step S109). Specifically, the substrate 90 placed on the placement section 22 is heated by causing the heater stored in the heater storage section 51 to generate heat. In addition, step S109 may be performed in parallel with the pressurization control of the element and the substrate 90 in step S108. That is, the pressurization control of the element and the substrate 90 in step S108 may be performed while the substrate 90 is preheated by the heating section 50.

[0088] Thus, in a state where the element is pressed against the substrate 90 via the bonding material at a predetermined pressure by the pressing member 27 via the press shaft 30, the substrate 90 to which the element is temporarily bonded via the bonding material is heated to a predetermined temperature by the heating unit 50. As a result, the bonding material is sintered, and the element is sinter-bonded to the substrate 90 (step S110).

[0089] After that, the substrate 90 is cooled as needed (step S111), the placing part 22, which is a sealed space, is opened to the atmosphere (step S112), the pressurizing shaft 30 is moved upward (step S113), and the cover member 40 is removed (step S114). Then, after the pressing member 27 is removed (step S115), the positioning member 26 is removed (step S116), and the substrate 90 with the components joined is taken out (step S117), and a series of processing steps are completed.

[0090] [Second embodiment]

[0091] Next, refer to Figure 6~Figure 8 A processing device 10 according to a second embodiment will be described. In the following description, components common to the processing device 10 according to the first embodiment are denoted by common reference numerals in the specification and drawings.

[0092] like Figure 6 as well as Figure 7 As shown, the processing device 10 of the second embodiment includes a substrate holding member 20, a plurality of pressure shafts 30, a cover member 40, and a heating unit 50. In the processing device 10 of the second embodiment, a closed space surrounded by the cover portion 42 of the cover member 40, the sealing portion 24 of the substrate holding member 20, and the substrate holding member 20 is also formed, and the atmosphere of the substrate 90 can be controlled by controlling the atmosphere of the closed space. Regarding the substrate holding member 20, the cover member 40 and the heating unit 50, although the shapes are different from those of the processing device 10 of the first embodiment, the basic structure is common, so repeated description is omitted. In addition, regarding the processing process of the substrate performed by the aforementioned processing device, since it is common with the first embodiment, repeated description is omitted.

[0093] A plurality of substrates 90 are placed on the substrate holding member 20, and the plurality of pressurizing shafts 30 can pressurize the corresponding plurality of substrates 90. Here, an example in which two pressurizing shafts 30 are provided is described, but three or more pressurizing shafts 30 can also be provided. It should be noted that the plurality of pressurizing shafts 30 can also be a structure capable of pressurizing different regions in a single substrate 90.

[0094] A common pressurizing portion 37 for pressurizing all of the pressurizing shafts 30 is provided above the plurality of pressurizing shafts 30 , and the plurality of pressurizing shafts 30 are pressurized by the common pressurizing portion 37 .

[0095] If the structure of the pressurizing shaft 30 is described in detail, each pressurizing shaft 30 includes a hollow upper shaft portion 31 extending in the vertical direction, a lower shaft portion 32 extending in the vertical direction, and an elastic member 33 disposed between the upper shaft portion 31 and the lower shaft portion 32. The elastic member 33 is, for example, a coil spring.

[0096] A pressed surface 31b pressed by the pressing portion 37 is formed at the upper end of the upper shaft portion 31. An enlarged diameter portion 31a having an enlarged outer diameter is formed at the lower end of the upper shaft portion 31, and the elastic member 33 abuts from below.

[0097] The upper end portion of the lower shaft portion 32 is inserted into the internal space S of the upper shaft portion 31 from below, and is provided in the internal space S to be slidable relative to the upper shaft portion 31 .

[0098] An enlarged diameter portion 32a having an enlarged outer diameter is formed at the center portion in the vertical direction of the lower shaft portion 32. An elastic member 33 is installed between the enlarged diameter portion 32a of the lower shaft portion 32 and the enlarged diameter portion 31a of the upper shaft portion 31. The elastic member 33 is provided so as to be able to bias the lower shaft portion 32 downward relative to the upper shaft portion 31.

[0099] The lower end of the lower shaft portion 32 is inserted through and supported by the support portion 41 of the cover member 40. Figure 6 as well as Figure 7 In the example shown, a single support portion 41 is provided with a plurality of through holes through which the plurality of lower shaft portions 32 are inserted, that is, a single support portion 41 supports the plurality of lower shaft portions 32. An O-ring 412 is disposed on the inner circumferential surface of the support portion 41, so that the gap between the support portion 41 and the lower shaft portion 32 is sealed by the O-ring 412.

[0100] The front end of the lower end of the lower shaft portion 32 presses the unillustrated element and substrate 90. Preferably, a heat insulating member such as ceramic or high heat-resistant resin is provided at the front end of the lower end of the lower shaft portion 32. In addition, a pressing member 27 may also be provided at the front end of the lower end of the lower shaft portion 32.

[0101] According to the pressurizing shaft 30 having the above-described structure, the pressure input from the pressurizing portion 37 is transmitted in the order of the upper shaft portion 31 , the elastic member 33 , and the lower shaft portion 32 , and the element and the substrate 90 are pressed.

[0102] As described above, since the processing device 10 of the present embodiment is provided with a plurality of pressurizing shafts 30 , it is possible to pressurize a plurality of substrates 90 or to pressurize different regions in a single substrate 90 .

[0103] The pressurizing portion 37 is moved in the up-down direction by being driven by, for example, a motor or a hydraulic or air cylinder (not shown), and pressurizes all of the two pressurizing shafts 30 .

[0104] The structure of the pressurizing portion 37 is described in detail. The pressurizing portion 37 is configured to pressurize the pressurized surfaces 31b of the upper ends of the plurality of upper shaft portions 31. The pressurizing portion 37 has a plurality of retaining portions (bushings) 37a through which the upper ends of the plurality of upper shaft portions 31 are inserted and which retain the upper shaft portions 31 so as to be slidable in the up-down direction.

[0105] In this way, since all of the plurality of pressurizing shafts 30 are pressurized by the common pressurizing portion 37 , the entire pressurizing process performed by the processing device 10 can be simplified.

[0106] In addition, the pressurizing part 37 may not be a part that pressurizes all of the plurality of pressurizing shafts 30. For example, a plurality of pressurizing parts 37 may be provided corresponding to the plurality of pressurizing shafts 30. In this case, the plurality of pressurizing parts 37 can operate independently, and as a result, the plurality of pressurizing shafts 30 can operate independently.

[0107] A pressure acquisition unit 38 is provided at a pressurizing portion of the pressurizing unit 37 that pressurizes each pressurizing shaft 30. The pressure acquisition unit 38 is a pressure sensor that acquires the pressure applied from the pressurizing unit 37 to each pressurizing shaft 30. The processing device 10 can acquire the pressure applied from each pressurizing shaft 30 to the substrate 90 by calculation or reference to a predetermined map, etc., based on the pressure applied from the pressurizing unit 37 to each pressurizing shaft 30. That is, the pressure acquisition unit 38 can also be said to be a pressure sensor that acquires the pressure applied from each pressurizing shaft 30 to the substrate 90.

[0108] In this way, since the pressure acquisition unit 38 that acquires the pressure applied from the pressurizing shaft 30 to the substrate 90 is provided, it is possible to appropriately pressurize the substrate 90 while understanding the pressurization state of the substrate 90 .

[0109] like Figure 7 as well as Figure 8 As shown, a fluid inlet and outlet hole 31c is provided on the upper shaft portion 31. The fluid inlet and outlet hole 31c is provided on the pressurized surface 31b in the up-down direction and is connected to the internal space S of the upper shaft portion 31. With such a structure, an escape channel for air from the internal space S of the upper shaft portion 31 into which the lower shaft portion 32 is inserted to the outside is ensured, so that the internal pressure of the internal space S increases due to the relative up-down movement of the lower shaft portion 32, and it is possible to avoid the generation of unexpected repulsive force between the upper shaft portion 31 and the lower shaft portion 32. In addition, a cutout portion capable of suppressing the increase in the internal pressure of the internal space S may be provided on the upper shaft portion 31 instead of the fluid inlet and outlet hole 31c.

[0110] (Variation)

[0111] In the above-mentioned embodiment, a plurality of pressurizing shafts 30 are supported by a single support portion 41, but it may also be Fig. 9As shown in the figure, a plurality of pressurizing shafts 30 are supported by a plurality of corresponding support parts 41. In such a structure, a height adjustment member (for example, a plate-shaped member) for adjusting the height may be sandwiched between the enlarged diameter portion 32a of the lower shaft portion 32 and the elastic member 33. For example, the pressure applied from the pressurizing shaft 30 to the substrate 90 can be changed between the pressurizing shaft 30 provided with the height adjustment member and the pressurizing shaft 30 not provided with the height adjustment member.

[0112] Above, various embodiments of the present invention have been described with reference to the accompanying drawings, but the present invention is certainly not limited to the relevant embodiments. Obviously, those skilled in the art can think of various variations or modifications within the scope of the technical solution, and it should be understood that these variations and modifications also belong to the technical scope of the present invention. In addition, the various constituent elements in the above-mentioned embodiments can also be arbitrarily combined within the scope of the main purpose of the invention.

[0113] For example, in the aforementioned embodiments, the substrate holding member 20 and the heating unit 50 are different components, and the gas flow path 62 in the heating unit is sealed and connected with the gas flow path 61 in the holding member by the O-ring 202 disposed in the sealing groove 201, but the substrate holding member 20 and the heating unit 50 can also be integrally formed by mechanical processing such as cutting. Thus, it is not necessary to configure an O-ring or the like between the substrate holding member 20 and the heating unit 50, the number of components can be reduced, and the gas flow path 62 in the heating unit and the gas flow path 61 in the holding member can be sealed and connected more reliably.

[0114] In addition, the processing device 10 of each embodiment described above may also have a function of cooling the enclosed space when the atmosphere of the enclosed space is controlled. For example, the processing device 10 may further include a cooling mechanism such as an air-cooled heat sink, a Peltier element, or a water-cooled pipe.

[0115] At least the following matters are described in this specification: In parentheses, corresponding components in the above-mentioned embodiment are shown as an example, but the present invention is not limited to this.

[0116] (1) A processing device (processing device 10) capable of heating, pressurizing, and controlling the atmosphere of a workpiece (substrate 90),

[0117] in,

[0118] The processing device includes a base member (substrate holding member 20), and the base member has:

[0119] A loading portion (loading portion 22) for loading and storing the workpiece; and

[0120] a sealing portion (sealing portion 24) formed so as to surround the mounting portion,

[0121] The processing device can form a closed space surrounded by the sealing portion,

[0122] This processing device includes gas flow paths (holding member in-gas flow path 61 , heating section in-gas flow path 62 ) communicating with the interior of the sealed space.

[0123] According to (1), the atmosphere of the workpiece can be controlled by controlling the atmosphere of the closed space surrounded by the sealing portion, so that the space for atmosphere control can be reduced, and the energy efficiency when performing atmosphere control in the processing device can be improved.

[0124] (2) The processing device according to (1), wherein:

[0125] The processing device further includes a cover member (cover member 40) capable of sealing the space surrounded by the sealing portion and detachable from the base member.

[0126] The enclosed space is a space surrounded by the sealing portion, the base member, and the cover member.

[0127] According to (2), the space surrounded by the sealing portion, the base member, and the cover member can be set as a closed space by using a cover member that can be attached to and detached from the base member, so that the closed space can be easily formed after the workpiece is placed on the base member. This can improve the productivity when processing the workpiece.

[0128] (3) The processing device according to (1) or (2), wherein:

[0129] The processing device further includes a heating unit (heating unit 50) for heating the workpiece.

[0130] At least a portion of the gas flow path is formed integrally with the heating unit.

[0131] According to (3), by forming at least a portion of the gas flow path communicating with the sealed space integrally with the heating unit, the manufacturing cost of the processing device can be reduced.

[0132] (4) The processing device according to (3), wherein:

[0133] The gas flow path communicates with the sealed space in a manner that at least a portion thereof passes through the interior of the heating unit.

[0134] According to (4), since at least a part of the gas flow path communicating with the sealed space passes through the interior of the heating unit and communicates with the sealed space, the processing device can be reduced in size.

[0135] (5) The processing device according to (3), wherein:

[0136] The gas flow path communicates with the sealed space in a manner that at least a portion thereof passes through the interior of the base member.

[0137] According to (5), since at least a part of the gas flow path communicating with the sealed space passes through the inside of the base member and communicates with the sealed space, the processing device can be reduced in size.

[0138] (6) The processing device according to (3), wherein:

[0139] The gas flow path has:

[0140] a heating section internal gas flow path (heating section internal gas flow path 62 ) passing through the interior of the heating section; and

[0141] The base portion internal gas flow path (holding member internal gas flow path 61) passes through the interior of the base member,

[0142] A connection portion between the gas flow path in the heating portion and the gas flow path in the base portion is sealed.

[0143] According to (6), even if the heating unit and the base member are separate members, a closed gas flow path can be formed, so that the manufacturing of the processing device becomes easy.

[0144] (7) The processing device according to (3), wherein:

[0145] The base component and the heating portion are integrally formed.

[0146] According to (7), it is not necessary to arrange a sealing member such as an O-ring between the base member and the heating unit, so that the number of components can be reduced, and the gas flow path between the base member and the heating unit can be sealed more reliably.

[0147] (8) The processing device according to (3), wherein:

[0148] The base member has a flow path groove portion (flow path groove portion 23) formed so as to surround the mounting portion.

[0149] The sealing portion is formed so as to surround the flow path groove portion.

[0150] The flow path groove portion communicates with the gas flow path.

[0151] According to (8), since the gas flow path communicates with the flow path groove portion formed so as to surround the mounting portion, the workpiece can be stably held on the mounting portion, and the atmosphere of the workpiece can be controlled with good energy efficiency.

[0152] (9) The processing device according to (2), wherein:

[0153] The processing device further includes a pressurizing shaft (pressurizing shaft 30) for pressurizing a predetermined area of ​​the workpiece.

[0154] The cover member includes a support portion (support portion 41 ) through which the pressurizing shaft is inserted.

[0155] The pressurizing shaft is capable of sliding while maintaining a sealed gap between the pressurizing shaft and the supporting portion.

[0156] According to (9), since the pressurizing shaft can slide while maintaining the gap between the pressurizing shaft and the support portion of the cover member sealed, a closed space surrounded by the sealing portion can be formed with a simple structure. This can reduce the cost and size of the processing device.

[0157] (10) The processing device according to (9), wherein:

[0158] The pressure shaft includes a plurality of pressure shafts,

[0159] The plurality of pressurizing axes can pressurize the plurality of workpieces that correspond to each other, or can pressurize different regions in a single workpiece.

[0160] According to (10), since a plurality of pressurizing shafts are provided, it is possible to pressurize a plurality of workpieces or to pressurize different regions in a single workpiece.

[0161] (11) The processing device according to (10), wherein:

[0162] The processing device further includes a common pressurizing section (pressurizing section 37) for pressurizing all of the plurality of pressurizing shafts.

[0163] The plurality of pressurizing shafts are pressurized by the common pressurizing portion.

[0164] According to (11), since all of the plurality of pressurizing axes are pressurized from a common pressurizing portion, the entire pressurizing process can be simplified.

[0165] (12) The processing device according to any one of (9) to (11), wherein:

[0166] The processing apparatus further includes a pressure acquisition unit (pressure acquisition unit 38 ) that acquires the pressure applied from the pressurizing axis to the workpiece.

[0167] According to (12), since the pressure acquisition unit is provided to acquire the pressure applied to the workpiece from the pressurizing axis, it is possible to appropriately pressurize the workpiece while understanding the pressurization condition of the workpiece.

Claims

1. A processing device capable of heating, pressurizing and controlling the atmosphere of a processed part. in, The processing device is provided with a base component, and the base component has: a loading portion for loading and storing the workpiece; and a sealing portion formed so as to surround the mounting portion, The processing device can form a closed space surrounded by the sealing portion, The processing device includes a gas flow path communicating with the interior of the closed space.

2. The processing device according to claim 1, wherein: The processing device further includes a cover member capable of sealing the space surrounded by the sealing portion and being attachable to and detachable from the base member. The enclosed space is a space surrounded by the sealing portion, the base member, and the cover member.

3. The processing device according to claim 1 or 2, wherein: The processing device further comprises a heating unit for heating the processed part. At least a portion of the gas flow path is formed integrally with the heating unit.

4. The processing device according to claim 3, wherein: The gas flow path communicates with the sealed space so that at least a portion thereof passes through the interior of the heating unit.

5. The processing device according to claim 3, wherein: The gas flow path communicates with the sealed space in a manner that at least a portion thereof passes through the interior of the base member.

6. The processing device according to claim 3, wherein: The gas flow path has: a gas flow path in the heating section, which passes through the interior of the heating section; and a base internal gas flow path, which passes through the interior of the base member, A connection portion between the gas flow path in the heating portion and the gas flow path in the base portion is sealed.

7. The processing device according to claim 3, wherein: The base component and the heating portion are integrally formed.

8. The processing device according to claim 3, wherein: The base member has a flow path groove portion formed so as to surround the mounting portion. The sealing portion is formed so as to surround the flow path groove portion. The flow path groove portion communicates with the gas flow path.

9. The processing device according to claim 2, wherein: The processing device further includes a pressurizing shaft for pressurizing a predetermined area of ​​the workpiece. The cover member has a support portion through which the pressurizing shaft is inserted. The pressurizing shaft is capable of sliding while maintaining a sealed gap between the pressurizing shaft and the supporting portion.

10. The processing device according to claim 9, wherein: The pressure shaft includes a plurality of pressure shafts, The plurality of pressurizing axes can pressurize the plurality of workpieces that correspond to each other, or can pressurize different regions in a single workpiece.

11. The processing device according to claim 10, wherein: The processing device further includes a common pressurizing unit for pressurizing all of the plurality of pressurizing shafts. The plurality of pressurizing shafts are pressurized by the common pressurizing portion.

12. The processing device according to any one of claims 9 to 11, wherein: The processing apparatus further includes a pressure obtaining unit that obtains the pressure applied from the pressurizing axis to the workpiece.

Images