A PCB detection board

Abstract

The present invention relates to the technical field of radio frequency power detection, and specifically relates to a PCB detection board, which includes a substrate provided with a first through hole and a voltage detection ring. The voltage detection ring surrounds the outside of the first through hole. A radio frequency conductor passes through the first through hole to form a parasitic capacitance with the voltage detection ring. A postage hole or a V-shaped groove is also provided on the substrate, and the postage hole or the V-shaped groove is arranged between the first through hole and the voltage detection ring; the voltage detection ring is a single-ring structure, including a first wire and an electrode plate, and a postage hole or a V-shaped groove is arranged between the first wire and the electrode plate; alternatively, the voltage detection ring includes a plurality of nested rings, and adjacent two rings are electrically connected, and the postage hole or the V-shaped groove is arranged between the adjacent two rings. The electrode plate of the present application can be disassembled through a detachable structure to change the capacitance value of the parasitic capacitance, effectively improving the adaptability and versatility of the detection board, and can be applicable to radio frequency conductors of various sizes.

Description

Technical Field

[0001] The present invention relates to the technical field of power detection, and particularly to a PCB detection board. Background Art

[0002] When the existing radio frequency power supply outputs power, it is necessary to collect the power value at the output end, compare it with the power value set by the user, and perform PID closed-loop control. Currently, in the prior art, a power detection PCB board can be used to detect current and voltage respectively. The radio frequency conductor passes through the circular through hole of the PCB board, and a parasitic capacitance is formed between the circular voltage induction copper ring fixed on the side wall and the radio frequency conductor to detect voltage, and a current transformer located on the PCB board is used to detect current.

[0003] However, in the prior art, some voltage induction copper rings have large gaps inside. During the detection process, the axis of the radio frequency conductor may deviate from the center of the voltage induction copper ring, resulting in inaccurate voltage detection; although some voltage induction copper rings are provided with insulating parts inside to fix the radio frequency conductor and ensure the concentricity of the radio frequency conductor and the voltage induction copper ring, they cannot adapt to radio frequency conductors of different sizes; in addition, the size of the existing voltage induction copper ring is fixed and cannot be adjusted to change the parasitic capacitance between it and the radio frequency conductor, so that the versatility and adaptability of the power detection PCB board are low. Summary of the Invention

[0004] The purpose of the present invention is to overcome the technical problems in the prior art that the PCB detection board may not be able to ensure the concentricity between the voltage detection ring and the radio frequency conductor, cannot adapt to radio frequency conductors of different sizes, and cannot adjust the parasitic capacitance value between the voltage induction copper ring and the radio frequency conductor, and provide a PCB detection board.

[0005] The present invention provides a PCB detection board, which includes a substrate provided with a first through hole and a voltage detection ring. A detection circuit is also provided on the substrate. The voltage detection ring surrounds the outside of the first through hole and is electrically connected to the detection circuit. The radio frequency conductor passes through the first through hole and forms a parasitic capacitance with the voltage detection ring. The detection circuit collects the voltage signal of the radio frequency conductor through the parasitic capacitance. A postage hole or a V-shaped groove is also formed on the substrate, and the postage hole or the V-shaped groove is arranged between the first through hole and the voltage detection ring; the voltage detection ring is a single-ring structure, including a first wire and a second wire connected in series to form a ring, and an electrode plate connected in parallel with the first wire. The postage hole or the V-shaped groove is arranged between the first wire and the electrode plate; alternatively, the voltage detection ring includes a plurality of nested rings, and adjacent rings are electrically connected. The postage hole or the V-shaped groove is arranged between adjacent rings.

[0006] The outer side of the radio frequency conductor, the inner side of the voltage detection ring, and the insulating medium between the radio frequency conductor and the voltage detection ring jointly form a parasitic capacitance. During the voltage detection test, it is found that the capacitance values of the parasitic capacitances of voltage detection rings with different numbers of electrode plates or rings are different. In this application, the voltage detection ring on the detection board is designed as a detection ring structure formed by connecting multiple detachable electrode plates, or a detection ring structure formed by multiple nested rings. The number of electrode plates or rings in the voltage detection ring can be reduced by disassembling and removing the electrode plates or rings in the voltage detection ring, thereby changing the capacitance value of the parasitic capacitance to further adapt to the power output detection of different radio frequency power supplies. In addition, by providing a perforated pattern or a V-groove between the voltage detection ring and the first through hole, the aperture of the first through hole can also be enlarged, so that the detection board can be adapted to a radio frequency conductor of a larger size. Here, the detachable connection structure can be a perforated pattern or a V-groove opened on the substrate. When it is necessary to change the parasitic capacitance between the voltage detection ring and the radio frequency conductor, the detachable structures such as the perforated pattern or the V-groove can be used to remove the electrode plates or rings from the voltage detection ring, and thus the purpose of changing the capacitance value of the parasitic capacitance can be achieved. Compared with the fixed structure of installing electrode plates on the existing detection board, which causes the electrode plates to be unable to be disassembled, the electrode plates or rings in this application can be disassembled through the detachable structure to change the parasitic capacitance, effectively improving the adaptability and versatility of the detection board, and can be applied to radio frequency conductors of various sizes.

[0007] Preferably, the voltage detection ring is a single-ring structure, including a plurality of electrode plates. The plurality of electrode plates are located outside the first through hole and are arranged along the circumference of the first through hole. The second wire is connected between two adjacent electrode plates. The substrate is provided with a second through hole on one side of the electrode plate and the perforated pattern or the V-groove on the other side of the electrode plate.

[0008] The voltage detection ring can be a single-ring structure, which can be formed by a plurality of circumferentially arranged electrode plates, a second wire connected in series between the electrode plates, and a first wire connected in parallel with the electrode plates. The electrode plates can be installed in the voltage detection ring through a variety of detachable structures. The capacitance value of the parasitic capacitance can be changed by disassembling the electrode plates from the voltage detection ring. After the electrode plates are disassembled, the second wire and the first wire can keep the circuit on the voltage detection ring conducting. Here, the electrode plates can be of various shapes, such as arc-shaped plates, flat plates, etc. Among them, the arc-shaped plate can be an arc-shaped plate with the same diameter as the voltage detection ring, or an arc-shaped plate with a different diameter from the voltage detection ring.

[0009] Preferably, the perforated pattern is arranged along the electrode plates; or the V-groove is parallel to the electrode plates.

[0010] Here, the perf holes can be formed by arranging multiple small holes. The arrangement directions of the perf holes and the V-grooves can be along the arrangement of the electrode plates. When disassembling the electrode plates, the electrode plates can be broken off simply along the positions of the perf holes or the V-grooves, thereby reducing the number of electrode plates in the voltage detection loop to change the parasitic capacitance.

[0011] Preferably, the voltage detection loop is a multi-loop structure, including a plurality of loops. All of the plurality of loops surround the first through hole and are sequentially sleeved from the inside to the outside. Adjacent two of the loops are connected by a third wire.

[0012] The voltage detection loop can also be a multi-loop structure, that is, composed of a plurality of nested loop structures. The plurality of loops are separated by a substrate, and a detachable structure is provided on the substrate to facilitate the sequential removal of the loop structures from the inside to the outside, that is, changing the number of layers of the loops to change the capacitance value of the parasitic capacitance. In addition, after removing the inner loop, the inner diameter of the first through hole can also be changed to be adaptable to a radio frequency conductor with a larger diameter.

[0013] Preferably, the outermost loop is electrically connected to the detection circuit through a third wire.

[0014] Preferably, the loop includes a plurality of electrode plates. The plurality of electrode plates are located outside the first through hole and are arranged along the circumference of the first through hole. The loop further includes a second wire and a first wire. The second wire is connected between adjacent two of the electrode plates. Two ends of the first wire are respectively connected to adjacent two of the second wires; the substrate is provided with a second through hole on one side of the electrode plate and is provided with the perf hole or the V-groove on the other side of the electrode plate.

[0015] Each loop in the multi-layer loop structure can also be formed into a petal-shaped electrode plate structure similar to a single-loop structure, that is, a plurality of electrode plates are arranged on the loop, and the parasitic capacitance value between each loop and the radio frequency conductor can also be adjusted by changing the number of electrode plates on each loop.

[0016] Preferably, a capacitor in series with the voltage detection loop is provided on the substrate.

[0017] A parasitic capacitance is formed between the voltage detection loop and the radio frequency conductor. This capacitor is in series with the parasitic capacitance and divides the voltage. When detecting the voltage, the voltage value of the radio frequency current flowing through the radio frequency conductor is calculated by detecting the voltage of this series capacitor.

[0018] Preferably, a current transformer provided on the substrate is further included. The current transformer is located outside the voltage detection loop.

[0019] The current transformer generates an induced current through magnetic field coupling. The current sampling signal is obtained by collecting the current signals at both ends of the current transformer.

[0020] Preferably, a shielding ring is provided between the current transformer and the voltage detection loop.

[0021] The shielding ring is mainly used to reduce the mutual influence between the current transformer and the voltage detection loop on the substrate.

[0022] Preferably, the first through hole is located at the center of the voltage detection loop, and the RF conductor can be adapted to the first through hole.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0024] The present invention provides a PCB detection board. On the one hand, by providing a perf hole or a V-groove on the substrate, it is convenient to change the aperture size of the first through hole in the way of detachable structures such as perf holes or V-grooves to adapt to RF conductors of different sizes, effectively improving the adaptability and versatility of the PCB detection board, and it can be applied to the current and voltage detection of RF conductors of various sizes. On the other hand, the voltage detection loop on the detection board is designed as a detection loop structure formed by connecting a plurality of detachable electrode plates or rings. The electrode plates or rings in the voltage detection loop can be disassembled and removed to reduce the number of electrode plates or rings in the voltage detection loop, thereby changing the capacitance value of the parasitic capacitance formed between the voltage detection loop and the RF conductor to further adapt to the power output detection of different RF power supplies. Here, the detachable connection structure can be a structure such as a perf hole or a V-groove. When it is necessary to change the parasitic capacitance between the voltage detection loop and the RF conductor, it is convenient to use detachable structures such as perf holes or V-grooves to remove the electrode plates or rings from the voltage detection loop, and thus the purpose of changing the capacitance value of the parasitic capacitance can be achieved. Compared with the electrode plates that cannot be disassembled on the existing detection board, the electrode plates or ring structures in this application can be disassembled through the detachable structure to change the parasitic capacitance, effectively improving the adaptability and versatility of the detection board, and it can be applicable to RF conductors of various sizes. Description of the Drawings

[0025] Figure 1 It is a schematic structural diagram of the first voltage detection loop provided on the PCB detection board of the present invention.

[0026] Figure 2 It is a schematic diagram of the detachable perf hole structure corresponding to the first voltage detection loop.

[0027] Figure 3 It is a schematic diagram of the detachable V-groove structure corresponding to the first voltage detection loop.

[0028] Figure 4 For Figure 3 The cross-sectional view at "A - A" in

[0029] Figure 5 For Figure 3Cross-sectional view at "B-B".

[0030] Figure 6 Isometric schematic diagram of the first voltage detection loop.

[0031] Figure 7 Structural schematic diagram of the second voltage detection loop provided on the PCB detection board of the present invention.

[0032] Figure 8 Isometric schematic diagram of the detachable structure of the postage hole corresponding to the second voltage detection loop.

[0033] Figure 9 Structural schematic diagram of the third voltage detection loop provided on the PCB detection board of the present invention.

[0034] Figure 10 Is Figure 9 Local enlarged view at "C" in

[0035] Markings in the figure:

[0036] 1. Substrate, 11. First through hole, 12. Postage hole, 13. V-shaped groove, 14. Second through hole, 2. Voltage detection loop, 21. Electrode plate, 22. Second wire, 23. First wire, 24. Loop, 25. Third wire, 3. RF conductor, 4. Capacitor, 5. Current transformer, 6. Detection circuit. Specific embodiments

[0037] The present invention will be further described in detail below in conjunction with specific embodiments. However, this should not be construed as limiting the scope of the above-mentioned subject matter of the present invention to the following embodiments. All technologies implemented based on the content of the present invention fall within the scope of the present invention.

[0038] In the description of the specific embodiments of the present invention, without special instructions, the expression terms of the orientation or positional relationship indicated by "upper", "lower", "left", "right", "center", "inner", "outer", etc. are all based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the invention product / device / device is commonly used. These orientation or positional relationship terms are only for the convenience of describing the present invention solution or simplifying the description in the specific embodiments, so as to facilitate technicians to quickly understand the solution, rather than indicating or implying that a specific device / component / element must have a specific orientation, or be constructed and operated in a specific positional relationship. Therefore, it should not be construed as a limitation to the present invention.

[0039] In addition, when terms such as "horizontal", "vertical", "hanging", "parallel" appear, it does not mean that the corresponding device / component / element is required to be absolutely horizontal or vertical or hanging or parallel, but it can be slightly inclined or deviated. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and it does not mean that the structure must be completely horizontal, but it can be slightly inclined. Or, it can be simply understood that the corresponding device / component / element is arranged in directions such as "horizontal", "vertical", "hanging", "parallel", etc., and can have an error / deviation of ±10% relative to the corresponding direction setting, more preferably an error / deviation within ±8%, more preferably an error / deviation within ±6%, more preferably an error / deviation within ±5%, more preferably an error / deviation within ±4%. As long as the corresponding device / component / element is within the error / deviation range, it can still perform its function in the solution of the present invention.

[0040] In addition, when expressions such as "first", "second", "third", etc. appear in the terms, they are only used to distinguish the description of the same or similar components, and should not be understood as emphasizing or implying the relative importance of specific components.

[0041] In addition, in the description of the embodiments of the present invention, "several", "multiple", "a number of" represent at least 2. It can be any situation such as 2, 3, 4, 5, 6, 7, 8, 9, etc., and even can be a situation of more than 9.

[0042] In addition, in the description of the technical solution of the present invention, unless otherwise clearly specified / defined / restricted, where terms such as "set", "installed", "connected", "connected", "provided with", "laid", "arranged" appear, they should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be connection means commonly used in the art such as welding, riveting, bolting, screw connection, etc. Such a connection can be a mechanical connection, an electrical connection or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components.

[0043] Embodiment

[0044] This embodiment provides a PCB detection board.

[0045] Figure 1 It is a schematic structural diagram of the first voltage detection ring provided on the PCB detection board of the present invention; Figure 2 It is a schematic detachable structure diagram of the pinhole corresponding to the first voltage detection ring; Figure 3 It is a schematic detachable structure diagram of the V-groove corresponding to the first voltage detection ring; Figure 4 It is Figure 3 The cross-sectional view at "A-A" in Figure 5 It is Figure 3Cross-sectional view at "B-B"; Figure 6 Schematic three-dimensional diagram of the first voltage detection loop; Figure 7 Schematic structural diagram of the second voltage detection loop provided on the PCB detection board of the present invention; Figure 8 Schematic diagram of the detachable structure of the stamp holes corresponding to the second voltage detection loop; Figure 9 Schematic structural diagram of the third voltage detection loop provided on the PCB detection board of the present invention; Figure 10 is Figure 9 Partial enlarged view at "C" in;

[0046] As Figure 1 shown, the PCB detection board includes a substrate 1 and a voltage detection loop 2 connected to the substrate 1. A first through hole 11 concentric with the voltage detection loop 2 is provided on the substrate 1. The radio frequency conductor 3 passes through the first through hole 11 and forms a parasitic capacitance with the voltage detection loop 2. In order to enable the PCB detection board to adapt to radio frequency conductors 3 of different sizes, and at the same time make the concentricity between the radio frequency conductor 3 and the voltage detection loop 2 higher, a plurality of sets of stamp holes 12 arranged in a ring are provided on the substrate 1 between the first through hole 11 and the voltage detection loop 2. The substrate 1 can be broken along a set of stamp holes 12 to expand the aperture of the first through hole 11 so that the PCB detection board can adapt to radio frequency conductors of different sizes. Similarly, setting a plurality of sets of annular V-grooves can also achieve the above function.

[0047] As Figures 1 to 6 shown in is the first voltage detection loop 2 of this embodiment and the PCB detection board on which the first voltage detection loop 2 is installed. The first voltage detection loop 2 includes a plurality of electrode plates 21 arranged circumferentially. The plurality of electrode plates 21 are located outside the first through hole 11 and are arranged along the circumference of the first through hole 11. A second wire 22 is connected between two adjacent electrode plates 21. That is to say, the electrode plates 21 and the second wires 22 are alternately arranged in the circumferential direction of the voltage detection loop 2. After the electrode plates 21 and the second wires 22 are connected circumferentially, a complete annular structure can be formed; the voltage detection loop 2 can be provided on the substrate 1. A first through hole 11 is provided on the substrate 1. The first through hole 11 is located in the voltage detection loop 2. That is to say, the voltage detection loop 2 surrounds the outside of the first through hole 11. At the same time, the voltage detection loop 2 is also electrically connected to the detection circuit 6 provided on the substrate 1; the radio frequency conductor 3 and the voltage detection loop 2 can be spaced apart by the substrate 1 or air. A parasitic capacitance can be formed between the radio frequency conductor 3 and the voltage detection loop 2; a first wire 23 is connected in parallel on one side of the electrode plate 21, and the first wire 23 is located outside the parasitic capacitance. That is to say, the first wire 23 is not between the radio frequency conductor 3 and the electrode plate 21, but is located on the other side of the electrode plate 21 relative to the radio frequency conductor 3, that is, on the outside of the annular structure formed by the connection of the plurality of electrode plates 21 shown in the figure. The two ends of the first wire 23 are respectively connected to the two second wires 22 on both sides of the electrode plate 21 connected in parallel.

[0048] Specifically, the shape of the electrode plate 21 can be an arc-shaped plate as shown in the figure, and the inner arc surface of the arc-shaped plate faces the center of the voltage detection ring 2, that is, the penetration position of the radio frequency conductor 3. The first wire 23 is connected in parallel on one side of the outer arc surface of the arc-shaped plate, and the first wire 23 can also be formed into an arc-shaped structure concentric with the electrode plate 21. Of course, the electrode plate 21 can also be of other shapes, such as a flat plate. One side surface of the flat plate faces the center of the voltage detection ring 2, and the first wire 23 can be formed into a broken line shape and connected in parallel on the other side of the flat plate. Or the electrode plate 21 can also be an arc-shaped plate with the same inner diameter as the voltage detection ring 2. And when the electrode plate 21 is an arc-shaped plate, the orientation of the arc-shaped plate can also be opposite to that shown in the figure, that is, the outer arc surface faces the center of the voltage detection ring 2, and the first wire 23 is connected in parallel on one side of the inner arc surface of the arc-shaped plate. The present invention does not specifically limit the shapes of the electrode plate 21 and the first wire 23, the orientations of the two side surfaces of the electrode plate 21, and the number of the electrode plates 21 in the voltage detection ring 2.

[0049] In this embodiment, as Figures 1 to 6 shown in the first voltage detection ring 2 provided on the substrate 1, the electrode plate 21 and the parallel-connected first wire 23 can be insulated by the substrate 1, and a perforated pattern 12 is provided on the substrate 1 between the electrode plate 21 and the parallel-connected first wire 23. The perforated pattern 12 can be arranged along the electrode plate 21 and the perforated pattern is close to the electrode plate 21. That is to say, the connection line formed between multiple small holes in the perforated pattern 12 is parallel to the plate surface of the electrode plate 21. For example, if the electrode plate 21 in the figure is an arc-shaped plate, then the perforated pattern 12 is arranged to form an arc parallel to the outer arc surface of the arc-shaped plate. When it is necessary to reduce the number of the electrode plates 21 in the voltage detection ring 2 to change the parasitic capacitance, only need to break the substrate 1 between the electrode plate 21 and the first wire 23 along the corresponding perforated pattern 12, and the electrode plate 21 can be integrally removed from the voltage detection ring 2. Of course, the arrangement shape of the perforated pattern 12 is also related to the shape of the electrode plate 21. If the electrode plate 21 is a flat plate, the connection line between the perforated patterns 12 can also be formed into a straight line parallel to the flat plate. Here, the present invention does not specifically limit the arrangement manner of the perforated pattern.

[0050] In addition to the above-mentioned perforated pattern 12, the detachable connection structure of the electrode plate 21 can also be Figure 3In the V-groove structure shown, the V-groove 13 can be opened at the same position on the substrate 1 as the postage hole 12. It can be understood that at the position of the V-groove 13, the thickness of the substrate 1 is reduced. When the substrate 1 on both sides of the V-groove 13 is bent, the stress can be concentrated at the V-groove 13, so that the breaking position of the substrate 1 is formed in the V-groove 13. Through the V-groove 13 structure, it is also convenient to remove the electrode plate 21 to change the parasitic capacitance; after the electrode plate 21 is removed through the detachable structure of the postage hole or the V-groove 13, the first wire 23 in parallel with the electrode plate 21 can maintain the connection with the second wire 22, and the annular electrical path of the voltage detection ring 2 can be maintained for voltage detection.

[0051] On the substrate 1 on the other side of the electrode plate 21 relative to the postage hole 12, a second through hole 14 is opened. The second through hole 14 can leave a space to facilitate the removal operation of the electrode plate 21 along the postage hole 12.

[0052] As Figure 7 and Figure 8 Shown in [Figures] are the second voltage detection ring of this embodiment and the PCB detection board installed with the second voltage detection ring. The second voltage detection ring includes a plurality of rings 24 sleeved from the inside out in sequence. The plurality of rings 24 can be connected through a third wire 25, and are insulated from each other by the substrate 1 between the plurality of rings 24. The radio frequency conductor 3 can pass through the first through hole 11 and be located in the innermost ring 24, and maintain a spaced distance from the ring 24 to generate a parasitic capacitance.

[0053] Specifically, corresponding detachable structures can also be provided on the substrate 1 between the plurality of rings 24 so that the rings 24 can be detached from the voltage detection ring 2. For example, postage holes 12 arranged in multiple layers in a ring shape and surrounding the first through hole 11 can be opened on the substrate 1 between the plurality of rings 24. The substrate 1 can be broken and removed at the postage hole 12 of any layer. If the postage hole 12 between the innermost ring 24 and the first through hole 11 is broken, the aperture of the first through hole 11 can be enlarged to fit a radio frequency conductor 3 with a larger diameter; if the postage hole 12 between the plurality of rings 24 is broken, the inner ring 24 can be separated from the outer ring 24, that is, the inner ring 24 is detached from the voltage detection ring 2, so as to enlarge the aperture of the first through hole 11 while changing the distance between the radio frequency conductor 3 and the closest ring 24, and further change the capacitance value of the parasitic capacitance.

[0054] Of course, the multiple layers of postage stamp holes 12 formed between the multiple rings 24 can also be replaced with a V-groove structure (not shown in the figure). Here, the V-groove can also be used as another detachable structure to facilitate the disassembly of the ring 24 and the substrate 1 in the voltage detection ring 2. The opening position of the V-groove and its layout shape on the substrate 1 are the same as those of the above-mentioned multiple layers of postage stamp holes 12. The specific structure of the V-groove here and the principle of disconnection and disassembly are the same as those of the V-groove in the first type of voltage detection ring 2, and will not be specifically described here.

[0055] As Figure 9 and Figure 10 shown in Figure 9 is the third type of voltage detection ring of this embodiment and the PCB detection board installed with the third type of voltage detection ring. The third type of voltage detection ring includes multiple rings 24 sleeved together. Multiple electrode plates 21 can be arranged circumferentially on each ring 24 ( Figure 9 only the outermost ring 24 is shown with electrode plates 21 in ). The multiple electrode plates 21 are located outside the first through hole 11 and are arranged along the circumference of the first through hole 11. It can be understood that the solution of the third type of voltage detection ring is formed by combining the above-mentioned first type of voltage detection ring and the second type of voltage detection ring. Detachable structures are correspondingly provided for the multiple electrode plates 21 and the multiple rings 24 in the third type of voltage detection ring. For example, postage stamp holes are formed on the substrate 1 between the electrode plates 21 and the shunt-connected first wire 23, and multiple layers of postage stamp holes are formed between the multiple rings 24, which can facilitate the removal of the electrode plates 21, the rings 24, and the substrate 1 respectively to change the parasitic capacitance. Similarly, the above-mentioned postage stamp hole structure can be replaced with a V-groove structure, which can also realize the convenient removal of the electrode plates 21, the rings 24, and the substrate 1 to change the parasitic capacitance; in the solution of the third type of voltage detection ring, the change of the parasitic capacitance can be achieved in the following ways. For example, only the electrode plates 21 on the ring 24 are removed, or the ring 24 with the electrode plates 21 is removed as a whole, or only the substrate 1 inside the innermost ring 24 is removed, etc. The specific removal method can be selected as needed during the actual voltage detection operation, and the present invention does not make specific limitations on this.

[0056] In this embodiment, as Figure 1 , Figure 7 and Figure 9 shown in the three PCB detection boards, a capacitor 4 connected in series with the voltage detection ring 2 can also be provided on the substrate 1. A parasitic capacitance is formed between the voltage detection ring 2 and the radio frequency conductor 3. This capacitor 4 is connected in series with the parasitic capacitance and divides the voltage. During the actual detection process, the actual voltage of the radio frequency conductor is calculated by detecting the voltage value of this series capacitor; in addition, a current transformer 5 can also be provided on the substrate 1. The current transformer 5 can be in a ring shape and is wound outside the voltage detection ring 2. The current transformer 5 can generate an induced current through magnetic field coupling, and the current sampling signal can be obtained by collecting the induced current signals at both ends of the current transformer 5 for current detection.

[0057] A shielding ring (not shown in the figure) can also be provided between the current transformer 5 and the voltage detection loop 2. The shielding ring can isolate the current signal on the current transformer 5 and the voltage signal on the voltage detection loop 2 from each other to avoid crosstalk.

[0058] In summary, the PCB detection board of the present invention can be provided with postage holes or V-grooves on the substrate, which can facilitate changing the aperture size of the first through-hole in the way of using detachable structures such as postage holes or V-grooves to adapt to RF conductors of different sizes and dimensions, effectively improving the adaptability and versatility of the PCB detection board, and can be applied to the current and voltage detection of RF conductors of various sizes. At the same time, the voltage detection loop on the detection board can be designed as a detection loop structure formed by connecting a plurality of detachable electrode plates or rings. The electrode plates or rings in the voltage detection loop can be disassembled and removed to reduce the number of electrode plates or rings in the voltage detection loop, thereby changing the capacitance value of the parasitic capacitance formed between the voltage detection loop and the RF conductor to further adapt to the power output detection of different RF power supplies. Here, the detachable connection structure can be a structure such as a postage hole or a V-groove. When it is necessary to change the parasitic capacitance between the voltage detection loop and the RF conductor, it is convenient to use detachable structures such as postage holes or V-grooves to remove the electrode plates or rings from the voltage detection loop, and thus the purpose of changing the capacitance value of the parasitic capacitance can be achieved. Compared with the fixed structure of installing electrode plates on the existing detection board where the electrode plates cannot be disassembled, the electrode plate or ring structure of the present application can be disassembled through the detachable structure to change the parasitic capacitance, effectively improving the adaptability and versatility of the detection board and being applicable to RF conductors of various sizes.

[0059] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A PCB detection board, comprising a substrate (1) provided with a first through hole (11) and a voltage detection ring (2), the substrate (1) further provided with a detection circuit (6), the voltage detection ring (2) surrounding the outside of the first through hole (11) and being electrically connected to the detection circuit (6), a radio frequency conductor (3) passing through the first through hole (11) and forming a parasitic capacitance with the voltage detection ring (2), the detection circuit (6) collecting a voltage signal of the radio frequency conductor (3) through the parasitic capacitance, characterized in that: The substrate (1) is also provided with a stamp hole (12) or a V-shaped groove (13), and the stamp hole (12) or the V-shaped groove (13) is arranged between the first through hole (11) and the voltage detection ring (2); The voltage detection ring (2) is a single ring structure, comprising a first wire (23) and a second wire (22) connected in series to form a ring, and a plurality of electrode plates (21) connected in parallel with the first wire (23), wherein the plurality of electrode plates (21) are located outside the first through hole (11) and are arranged along the circumference of the first through hole (11); the second wire (22) is connected between two adjacent electrode plates (21); the stamp hole (12) or the V-shaped groove (13) is provided between the first wire (23) and the electrode plate (21); the stamp holes (12) are arranged along the electrode plate (21), and the V-shaped groove (13) is parallel to the electrode plate (21); Alternatively, the voltage detection ring (2) comprises a plurality of nested rings (24), two adjacent rings (24) are electrically connected, and the stamp hole (12) or the V-shaped groove (13) is arranged between two adjacent rings (24).

2. The PCB detection board according to claim 1, characterized in that: The voltage detection ring (2) is a single ring structure, and the substrate (1) is provided with a second through hole (14) on the other side of the electrode plate (21) relative to the stamp hole (12) or the V-shaped groove (13).

3. The PCB detection board according to claim 1, characterized in that: The voltage detection ring (2) is a multi-ring structure, comprising a plurality of rings (24), wherein the plurality of rings (24) surround the first through hole (11) and are sequentially sleeved from the inside to the outside, and two adjacent rings (24) are connected via a third wire (25).

4. The PCB detection board according to claim 3, characterized in that: The outermost ring (24) is electrically connected to the detection circuit (6) via a third wire (25).

5. The PCB detection board according to claim 3, characterized in that: The ring (24) comprises a plurality of electrode plates (21), the plurality of electrode plates (21) being located outside the first through hole (11) and arranged along the circumference of the first through hole (11), the ring (24) further comprising a second wire (22) and the first wire (23), the second wire (22) being connected between two adjacent electrode plates (21), and the two ends of the first wire (23) being respectively connected to two adjacent second wires (22); the substrate (1) is provided with a second through hole (14) on one side of the electrode plate (21), and is provided with the stamp hole (12) or the V-shaped groove (13) on the other side of the electrode plate (21).

6. The PCB detection board according to any one of claims 1 to 5, characterized in that: The substrate (1) is provided with a capacitor (4) which is connected in series with the voltage detection ring (2).

7. The PCB detection board according to any one of claims 1 to 5, characterized in that: It also comprises a current transformer (5) arranged on the substrate (1), wherein the current transformer (5) is located outside the voltage detection loop (2).

8. The PCB detection board according to claim 7, characterized in that: A shielding ring is provided between the current transformer (5) and the voltage detection ring (2).

9. The PCB detection board according to any one of claims 1 to 5, characterized in that: The first through hole (11) is located at the center of the voltage detection ring (2), and the radio frequency conductor (3) is capable of matching with the first through hole (11).

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