Substrate cleaning apparatus and substrate cleaning method

Abstract

The invention provides a substrate cleaning apparatus and a substrate cleaning method, which can detect the contact state of a cleaning member with respect to a substrate, thereby enabling the cleaning member to clean the substrate well, and can determine the conveying state of the substrate, the installation state of the cleaning member, and the occurrence of abnormality in the substrate cleaning apparatus. A substrate cleaning device (100) for cleaning at least one of the front surface and the back surface of a conveyed glass plate (G) as a surface to be cleaned, the substrate cleaning device (100) being provided with: a substrate conveying device (10) for conveying the glass plate (G); a disk brush (23) that is in contact with the surface to be cleaned of the conveyed glass plate (G) while rotating; a plurality of load cells (61) for measuring the load applied to the surface to be cleaned by the disk brush (23) at a plurality of locations in the width direction intersecting the conveyance direction (X) of the glass plate (G); and a control unit (71) as a detection unit that detects the state of contact between the disk brush (23) and the glass plate (G) on the basis of measurement data from the plurality of load cells (61), and determines, on the basis of the detected state of contact, the state of conveyance of the glass plate (G), the state of installation of the disk brush (23), or the occurrence of an abnormality in the substrate cleaning device (100).

Description

Technical Field

[0001] The invention relates to a substrate cleaning device and a substrate cleaning method. Background Art

[0002] For example, the surface of a glass plate used for a flat panel display (FPD: Flat Panel Display) such as LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode) is cleaned by a cleaning device.

[0003] Patent Document 1 describes a glass plate cleaning device in which a cleaning member composed of a plurality of disc brushes is rotated in contact with the surface of a glass plate being conveyed to remove deposits attached to the surface of the glass plate. In the cleaning device, an adjustment unit is used to finely adjust the position of the cleaning member relative to the surface of the glass plate to adjust the contact state.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-30570 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, in a cleaning device that adjusts the contact state based on the height of the cleaning member as in Patent Document 1, the front end position of the cleaning member must be accurately detected to adjust the height, and this adjustment operation takes time and effort. Moreover, it is difficult to maintain a constant cleaning force on the glass plate by simply adjusting the height of the cleaning member, and there is a possibility that the cleaning state will be uneven depending on the location.

[0009] In addition, the cleaning member may no longer be in contact with the glass plate due to wear, etc. Therefore, it is necessary to confirm whether the cleaning member is actually in contact with the surface of the glass plate. The detection of the contact state accompanying the confirmation of the surface contact takes one to several hours in one cleaning line.

[0010] Therefore, an object of the present invention is to provide a substrate cleaning device, which can detect the contact state of the cleaning member relative to the substrate, so as to clean the substrate well using the cleaning member, and can determine the conveying state of the substrate, the setting state of the cleaning member, and the occurrence of abnormalities in the substrate cleaning device.

[0011] Technical solutions to solve problems

[0012] The present invention is constituted by the following structure.

[0013] (1) A substrate cleaning device for cleaning at least one of the front and back surfaces of a conveyed substrate as a cleaned surface, comprising: a substrate conveying device for conveying the substrate; a cleaning member for rotating while contacting the cleaned surface of the conveyed substrate; a plurality of load meters for measuring the load applied to the cleaned surface by the cleaning member at a plurality of locations in a width direction intersecting the conveying direction of the substrate; and a detection unit for detecting a contact state between the cleaning member and the substrate based on measurement data from the plurality of load meters, and determining a conveying state of the substrate, a setting state of the cleaning member, or the occurrence of an abnormality in the substrate cleaning device based on the detected contact state.

[0014] (2) A substrate cleaning device for cleaning at least one of the front and back surfaces of a conveyed substrate as a cleaned surface, wherein the device comprises: a substrate conveying device for conveying the substrate; a plurality of cleaning processing units arranged in a conveying direction of the substrate and cleaning the cleaned surface of the substrate using a cleaning member; a load meter respectively provided in the plurality of cleaning processing units and measuring the load applied by the cleaning member to the cleaned surface; and a detection unit for detecting the contact state between the cleaning member and the substrate based on the measurement data from the plurality of load meters, and determining the conveying state of the substrate or the setting state of the cleaning member based on the detected contact state.

[0015] (3) A substrate cleaning method, wherein at least one of the front and back surfaces of a substrate is cleaned as a cleaned surface, wherein the substrate is transported by a substrate conveying device; a cleaning member is caused to rotate while contacting the cleaned surface of the conveyed substrate to clean the cleaned surface; a load applied to the cleaned surface by the cleaning member is measured by a plurality of load meters arranged at a plurality of locations in a width direction intersecting with the conveying direction of the substrate; and in a detection unit, based on measurement data from the plurality of load meters, a contact state between the cleaning member and the substrate is detected, and based on the detected contact state, a determination is made as to the conveying state of the substrate, the setting state of the cleaning member, or the occurrence of an abnormality in the substrate cleaning device.

[0016] (4) A substrate cleaning method, wherein at least one of the front and back surfaces of a substrate is cleaned as a cleaned surface, wherein the substrate is transported by a substrate transport device; in a plurality of cleaning processing sections arranged in a transport direction of the substrate, the cleaned surface of the substrate is cleaned by a cleaning member; using load meters respectively provided in the plurality of cleaning processing sections, the load applied to the cleaned surface by the cleaning member is measured; in a detection section, based on measurement data from the plurality of load meters, the contact state between the cleaning member and the substrate is detected, and based on the detected contact state, the transport state of the substrate, the setting state of the cleaning member, or the occurrence of an abnormality in the substrate cleaning device is determined.

[0017] Effects of the Invention

[0018] According to the substrate cleaning device of the present invention, by detecting the contact state of the cleaning member relative to the substrate, the substrate can be well cleaned using the cleaning member, and the conveying state of the substrate, the setting state of the cleaning member, and the occurrence of abnormalities in the substrate cleaning device can be determined. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic plan view of a substrate transfer device including a substrate cleaning device according to an embodiment of the present invention.

[0020] Figure 2 yes Figure 1 AA section view in.

[0021] Figure 3 This is a side view of a substrate cleaning device with a portion cut away.

[0022] Figure 4 This is a block diagram illustrating a schematic configuration of a control system of a substrate cleaning apparatus.

[0023] Figure 5 This is a schematic diagram showing measurement data of the load cell during normal transportation.

[0024] Figure 6 This is a schematic diagram for explaining the determination of substrate position deviation.

[0025] Figure 7 This is a schematic diagram for explaining the determination of substrate tilt.

[0026] Figure 8 This is a schematic diagram for explaining the determination of the occurrence of stagnation.

[0027] Fig. 9 This is a schematic diagram for explaining the determination of the setting status. DETAILED DESCRIPTION

[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0029] Figure 1 It is a schematic plan view of a substrate transfer apparatus 10 including a substrate cleaning apparatus 100 according to an embodiment of the present invention.

[0030] like Figure 1 As shown, the substrate cleaning apparatus 100 according to the present embodiment is incorporated in a substrate transfer apparatus 10 including a plurality of transfer units 11 .

[0031] The substrate cleaning device 100 is a device for cleaning a glass plate (substrate) G formed into a rectangular shape. The glass plate G cleaned by the substrate cleaning device 100 is made of an alkali-free glass material used for a flat panel display (FPD: Flat Panel Display) such as LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode). The substrate cleaning device 100 is a device for cleaning the surface of the glass plate G being transported horizontally, and in particular, cleaning the surface of the glass plate G that has been subjected to various treatments and processing.

[0032] The plurality of conveying units 11 constituting the substrate conveying device 10 have conveying rollers 13 disposed at the top and bottom or at the bottom. In the present embodiment, the conveying rollers 13 are horizontally disposed at upper and lower relative positions, and the glass plate G passes between them. The conveying unit 11 conveys the glass plate G in a conveying direction X which is one direction by rotating the upper and lower conveying rollers 13 in opposite directions with the glass plate G sandwiched therebetween.

[0033] The substrate cleaning apparatus 100 is disposed between the transport units 11. In this example, two transport units 11 are set as one set, and the substrate cleaning apparatus 100 is disposed between the transport units 11 of these sets.

[0034] Figure 2 yes Figure 1 AA section view in. Figure 3 It is a side view of the substrate cleaning apparatus 100 in which a part is cut away.

[0035] like Figure 2 As shown, the substrate cleaning device 100 includes a support frame 21 and a plurality of disc brushes (cleaning members) 23. The plurality of disc brushes 23 are supported by the support frame 21 and arranged in a width direction orthogonal to the conveying direction X of the glass plate G. The disc brush 23 is, for example, a sponge brush made of a resin such as PVA (polyvinyl alcohol) or a bristle brush made of a resin such as nylon (polyamide), and is, for example, cylindrical with an outer diameter of 50 mm to 150 mm.

[0036] The support frame 21 includes pillars 31 disposed on both sides of the conveyance path of the glass sheet G and a frame 33 spanned between the pillars 31. The frame 33 is disposed along the surface to be cleaned of the glass sheet G being conveyed.

[0037] like Figure 2 and Figure 3 As shown, the frame 33 has a plurality of support mechanisms 35 arranged in the longitudinal direction. These support mechanisms 35 are provided corresponding to the disk brushes 23 , and each disk brush 23 is supported on the frame 33 by the support mechanisms 35 .

[0038] The support mechanism 35 has a support shaft 39 having a fixing plate 37 at the lower end thereof, and the disc brush 23 is mounted on the fixing plate 37. The support shaft 39 has a transmission gear 41 at its upper end, and the transmission gears 41 of adjacent support shafts 39 mesh with each other. Adjacent transmission gears 41 may also be connected via other gears between the transmission gears 41.

[0039] The support frame 21 supports a rotary motor 45 that rotates the drive gear 43 via a fixed frame (not shown). The drive gear 43 of the rotary motor 45 meshes with the transmission gear 41 on one end of the frame 33. Thus, when the drive gear 43 is rotated by the rotary motor 45, the rotational force of the drive gear 43 is transmitted to the mutually meshing transmission gears 41 to rotate the support shafts 39. Thus, the disc brush 23 mounted on the fixed plate 37 of each support shaft 39 rotates. In addition, the rotation speed of the disc brush 23 based on the rotary motor 45 is preferably 100 rpm to 500 rpm.

[0040] like Figure 3 As shown, the support mechanism 35 includes a flange 51 and a bearing 53. The bearing 53 is assembled to the flange 51, and the support shaft 39 is rotatably supported by the bearing 53.

[0041] The flange 51 of the support mechanism 35 is disposed between a pair of support walls 55 provided upright on the frame 33. A linear motion bearing 57 is provided between the flange 51 and the support wall 55, and the support mechanism 35 is supported by the linear motion bearing 57 so as to be movable in the approaching and separating directions relative to the surface of the glass plate G, that is, in the vertical direction.

[0042] The substrate cleaning apparatus 100 includes a load cell (load meter) 61 , a laser displacement meter 63 , and an accelerometer 65 .

[0043] The load cell 61 is provided between the frame 33 and the flange 51 of the support mechanism 35, and measures the load from the support mechanism 35 applied to the frame 33. The load cell 61 is provided between the flange 51 of the support mechanism 35 and the frame 33, and the support mechanism 35 supports a plurality of disc brushes 23 arranged in the width direction orthogonal to the conveying direction X. The load cell 61 is preferably provided between at least the flange 51 of the support mechanism 35 supporting the disc brushes 23 at both ends and the frame 33. In addition, the load cell 61 may be provided between the flange 51 of all the support mechanisms 35 supporting the disc brushes 23 and the frame 33.

[0044] The laser displacement meter 63 is disposed above the frame 33. The laser displacement meter 63 irradiates the frame 33 with laser light and detects the reflected light. Thus, the displacement amount of the frame 33 in the vertical direction is detected in a non-contact manner. The accelerometer 65 is fixed to the upper surface of the frame 33. The accelerometer 65 detects the vibration of the frame 33.

[0045] Figure 4 This is a block diagram illustrating a schematic configuration of a control system of the substrate cleaning apparatus 100 .

[0046] like Figure 4 As shown in FIG. 1 , the substrate cleaning device 100 includes a control unit 71, and is driven by the control unit 71. The control unit 71 is connected to the rotary motor 45, and the rotary motor 45 is driven by the control unit 71. In addition, the control unit 71 is connected to the force sensor 61, the laser displacement meter 63, and the accelerometer 65, and measurement data is sent from these force sensor 61, the laser displacement meter 63, and the accelerometer 65 to the control unit 71. The control unit 71 also functions as a detection unit that detects the contact state of the disk brush 23 with respect to the glass plate G based on the measurement data from the force sensor 61, the laser displacement meter 63, and the accelerometer 65.

[0047] The substrate cleaning device 100 is provided with a nozzle (not shown) for spraying a cleaning liquid onto the surface of the glass plate G, and the cleaning liquid is sprayed onto the surface of the glass plate G from the nozzle. In the substrate cleaning device 100 having the above structure, when the glass plate G is fed between the upper and lower conveying rollers 13 constituting the conveying unit 11, the glass plate G is sandwiched by the upper and lower conveying rollers 13 and conveyed in the conveying direction X. For the glass plate G conveyed in the conveying direction X, the substrate cleaning device 100 disposed between the conveying units 11 sprays the cleaning liquid onto the surface of the glass plate G from the nozzle, and the disk brush 23 contacts the surface while rotating. Thus, the attached matter on the surface of the glass plate G is removed and cleaned.

[0048] like Figure 1As shown, for example, the substrate cleaning device 100 includes a slurry cleaning processing unit Ps, a detergent cleaning processing unit Pc, and a pure water cleaning processing unit Pw in order from the upstream side of the substrate conveying device 10. In the slurry cleaning processing unit Ps, for example, a slurry containing cerium oxide or the like is sprayed from a nozzle, and the surface of the glass plate G is cleaned by the slurry using a disk brush 23. In the detergent cleaning processing unit Pc, for example, an acidic cleaning agent, a neutral cleaning agent, or an alkaline cleaning agent is sprayed from a nozzle, and the surface of the glass plate G is cleaned by a cleaning liquid using a disk brush 23. In the pure water cleaning processing unit Pw, pure water is sprayed from a nozzle, and the surface of the glass plate G is cleaned by pure water using a disk brush 23.

[0049] In the detergent cleaning treatment section Pc, for example, an acidic cleaning agent containing organic phosphonic acid, polycarboxylate, or aromatic sulfonic acid, a neutral aqueous cleaning agent containing an amine-alkylene oxide adduct, or an alkaline cleaning agent containing an inorganic base such as lithium hydroxide, sodium hydroxide, potassium hydroxide, lithium carbonate, sodium carbonate, or potassium carbonate can be used. Thus, in the detergent cleaning treatment section Pc, the polishing abrasive particles composed of cerium oxide or the like remaining and / or attached to the surface of the polished glass plate G can be well dispersed and removed without damaging the flatness of the glass plate G.

[0050] In the substrate cleaning apparatus 100, during the cleaning process in the slurry cleaning process section Ps, the detergent cleaning process section Pc, and the pure water cleaning process section Pw, the load cell 61 sends measurement data to the control section 71. Then, the control section 71 detects the contact state such as the presence or absence of the surface contact of each disk brush 23 with respect to the glass plate G and the contact pressure based on the measurement data from the load cell 61.

[0051] Specifically, the control unit 71 obtains the load when the disk brush 23 contacts the surface of the glass plate G, that is, the contact load F1, and the load when the disk brush 23 does not contact the surface of the glass plate G, that is, the non-contact load F2. Here, the force sensor 61 is provided between the frame 33 and the flange 51 of the support mechanism 35. Therefore, the non-contact load F2 is the sum of the weights of the disk brush 23, the support shaft 39 that fixes the disk brush 23 to the fixed plate 37, the bearing 53 that supports the support shaft 39 in a rotatable manner, and the flange 51 to which the bearing 53 is assembled. That is, by obtaining the load difference ΔF between the contact load F1 and the non-contact load F2, the contact state of each disk brush 23 with respect to the glass plate G can be detected.

[0052] The control unit 71 compares the contact load F1 and the non-contact load F2 to calculate a load difference ΔF (ΔF=|F1−F2|) based on the measurement data from the load cell 61 , and detects the contact state of each disk brush 23 with respect to the glass plate G.

[0053] In addition, in each cleaning process, the measurement data from the laser displacement meter 63 and the accelerometer 65 are sent to the control unit 71 together with the measurement data from the load cell 61. Then, the control unit 71 obtains the displacement amount of the frame 33 and the vibration of the frame 33 when the disk brush 23 contacts the glass plate G based on the measurement data from the laser displacement meter 63 and the accelerometer 65, and detects the contact state of the plurality of disk brushes 23 with respect to the glass plate G.

[0054] The control unit 71 detects a change in the load of the rotary motor 45 when the disk brush 23 contacts the glass plate G. The contact state of the disk brush 23 with respect to the glass plate G is detected based on the change in the load of the rotary motor 45 .

[0055] Thus, according to the substrate cleaning device 100 involved in the present embodiment, there is provided a force sensor 61 which is arranged on the frame 33 and measures the load applied by the disk brush 23 to the surface of the glass plate G. Therefore, based on the measurement data of the force sensor 61, the contact state of the disk brush 23 relative to the surface of the glass plate G can be easily and accurately detected by the control unit 71. Moreover, based on the detected contact state, the contact load of the disk brush 23 relative to the surface of the glass plate G can be easily and in a short time adjusted to make the cleaning force based on the disk brush 23 constant. At this time, a driving unit (not shown) which adjusts the contact state between the disk brush 23 and the glass plate G can also be connected to the control unit 71. The driving unit can control the position of the disk brush 23 by, for example, moving the support shaft 39 in the abutment direction of the disk brush 23 relative to the glass plate G. In this case, the driving unit controls the contact state of the disk brush 23 and the glass plate G by moving the support shaft 39 in the contact direction based on the contact state of the disk brush 23 and the glass plate G detected by the control unit 71 and a preset threshold value.

[0056] Furthermore, the control unit 71 as a detection unit determines the conveyance state of the glass plate G and the setting state of the disc brush 23 based on the contact state of the disc brush 23 in each substrate cleaning device 100 of the slurry cleaning processing unit Ps, the detergent cleaning processing unit Pc, and the pure water cleaning processing unit Pw with respect to the glass plate G. Hereinafter, the determination of the conveyance state of the glass plate G and the determination of the setting state of the disc brush 23 performed by the control unit 71 will be described.

[0057] <Determination of Conveying State of Glass Sheet>

[0058] First, the determination of the conveying state of the glass plate G by the control unit 71 based on the detected contact state between the disc brush 23 and the glass plate G is described. In addition, in the following determination, an example is given of the determination based on the measurement data from the force sensor 61 provided corresponding to the disc brushes 23a and 23b at both ends (provided between the flange 51 of the support mechanism 35 supporting the disc brushes 23a and 23b at both ends and the frame 33).

[0059] Figure 5 It is a schematic diagram showing measurement data of the load cell 61 during normal conveyance. Figure 6 This is a schematic diagram for explaining the determination of substrate position deviation. Figure 7 This is a schematic diagram for explaining the determination of substrate tilt. Figure 8 This is a schematic diagram for explaining the determination of the occurrence of stagnation.

[0060] (Normal delivery status)

[0061] like Figure 5 As shown, when the glass plate G is normally conveyed, the load difference ΔFa at the disk brush 23a on one end side is the same as the load difference ΔFb at the disk brush 23b on the other end side and is constant. In addition, the contact timing tma1 when the glass plate G contacts the disk brush 23a on one end side and the separation timing tma2 when the glass plate G separates from the disk brush 23a are the same as the contact timing tmb1 when the glass plate G contacts the disk brush 23b on the other end side and the separation timing tmb2 when the glass plate G separates from the disk brush 23b. Moreover, the contact time Tta when the disk brush 23a on one end side contacts the glass plate G is the same as the contact time Ttb when the disk brush 23b on the other end side contacts the glass plate G. Therefore, when the glass plate G is conveyed sequentially in the conveying direction X, the substrate interval Tsa when the disk brush 23a on one end side does not contact the glass plate G is the same as the substrate interval Tsb when the disk brush 23a on the other end side does not contact the glass plate G.

[0062] Furthermore, the control unit 71 determines that the glass sheet G is normally conveyed when, for example, the load differences ΔFa and ΔFb at the disk brushes 23a and 23b at both ends are the same and constant, and the contact timings tma1 and tmb1, the separation timings tma2 and tmb2, and the contact times Tta and Ttb are the same.

[0063] (Substrate position deviation determination)

[0064] There is a case where the glass plate G is conveyed in a state where it is positionally offset in the width direction orthogonal to the conveying direction X. For example, Figure 6As shown in FIG. 1 , when the glass sheet G is conveyed with a position shift toward the disc brush 23a on one end in the width direction, the contact area of ​​the disc brush 23b on the other end with respect to the glass sheet G is reduced. Therefore, in this case, the load difference ΔFb at the disc brush 23b on the other end is smaller than the load difference ΔFa at the disc brush 23a on the one end. That is, when the glass sheet G is conveyed with a position shift in the width direction orthogonal to the conveying direction X, the load difference ΔFa at the disc brush 23a on one end is different from the load difference ΔFb at the disc brush 23b on the other end.

[0065] Then, the control unit 71 compares the load differences ΔFa and ΔFb, and determines that the glass sheet G is misaligned when the load difference ΔFa at the disk brush 23a on one end is different from the load difference ΔFb at the disk brush 23b on the other end.

[0066] (Substrate tilt determination)

[0067] There are cases where the glass sheet G is conveyed in an inclined state when viewed from above. Figure 7 As shown, when the glass sheet G is conveyed in a state in which one end side of the glass sheet G is tilted so as to protrude toward the front side of the conveying direction X, the contact timing tma1 at the disc brush 23a on the one end side deviates from the contact timing tmb1 at the disc brush 23b on the other end side, and similarly, the separation timing tma2 at the disc brush 23a on the one end side deviates from the separation timing tmb2 at the disc brush 23b on the other end side. Moreover, in the disc brush 23a on the one end side, the load difference ΔFa gradually increases as the glass sheet G contacts from the side edge. In contrast, in the disc brush 23b on the other end side, the load difference ΔFb gradually decreases as the glass sheet G separates from the side edge.

[0068] Then, the control unit 71 determines the tilt state of the glass sheet G by monitoring the contact timings tma1 and tmb1 and the separation timings tma2 and tmb2 of the disk brushes 23 a and 23 b and the changes in the load differences ΔFa and ΔFb.

[0069] (Determination of stagnation occurrence)

[0070] There is a situation where the conveying speed of the conveyed glass sheet G is slowed down due to contact with the disk brush 23. Figure 8 As shown in FIG. 1 , the time from when the glass plate G separates from the disk brushes 23a and 23b to when the next glass plate G contacts the disk brushes 23a and 23b, that is, the substrate intervals Tsa and Tsb, are longer than those during normal conveyance (see FIG. 1 ). Figure 8 middle dashed line) short.

[0071] The control unit 71 monitors the substrate intervals Tsa and Tsb to determine whether the glass sheet G is stagnant. Alternatively, the glass sheet G may be stagnant by monitoring the contact times Tta and Ttb of the disk brushes 23a and 23b with the glass sheet G.

[0072] <Determination of the setting status of the disc brush>

[0073] Next, the determination of the setting state of the disk brush 23 based on the contact state between the disk brush 23 and the glass plate G is described. In the following determination, the determination is based on the measurement data from the force sensors 61 provided corresponding to the disk brushes 23a and 23b at both ends and the disk brush 23c in the center.

[0074] Fig. 9 This is a schematic diagram for explaining the determination of the setting status.

[0075] There is a case where the disk brushes 23 arranged in the width direction are tilted in the height direction relative to the glass plate G being conveyed. Fig. 9 As shown in the figure, when the arrangement of the disc brushes 23 is tilted upward from one end side to the other end side, the contact pressures of the disc brush 23a at one end side, the disc brush 23c at the center, and the disc brush 23b at the other end side with respect to the glass plate G are different, and the load differences ΔFa, ΔFc, and ΔFb are different. Specifically, the load difference ΔFc at the disc brush 23c at the center is smaller than the load difference ΔFa at the disc brush 23a at one end side, and the load difference ΔFb at the disc brush 23b at the other end side is smaller than the load difference ΔFc at the disc brush 23c at the center.

[0076] Then, the control unit 71 compares the load differences ΔFa, ΔFc, and ΔFb, and determines that the disk brushes 23 arranged in the width direction are tilted in the height direction based on the presence or absence of a difference in the load differences ΔFa, ΔFc, and ΔFb and the state of the difference.

[0077] Thus, according to the substrate cleaning device 100 involved in this embodiment, the contact state of the disk brush 23 with respect to the glass plate G can be accurately detected based on the measurement data of the plurality of force sensors 61, and based on the detection result, the conveying state of the glass plate G or the setting state of the disk brush 23 can be determined. In addition, although not shown in the figure, by improving the time resolution of the measurement based on the force sensor 61, the vibration in the substrate cleaning device is detected, and based on the detection result (by comparing with the normal state), the presence or absence of abnormality in the substrate cleaning device (and the location of occurrence) can be determined. And based on the determination result, the conveying state of the glass plate G, the setting state of the disk brush 23, and the cause of the abnormality can be accurately corrected, and the glass plate G can be well cleaned by the disk brush 23.

[0078] As the causes of the abnormality of the conveying state of the glass plate G, the abnormality of the setting state of the disc brush 23, and the abnormality of the substrate cleaning device, the abnormality of the conveying roller (wear of the gear, etc.), the abnormality of the contact load caused by the disc brush 23 (abnormality of the driving part, wear of the disc brush 23, wear of the gear, etc.), the mixing of foreign matter, etc. are considered. If these abnormalities are left, it is possible to cause uneven cleaning, and then cause the generation of defects in the obtained glass plate G (reduction in quality). In addition, if the glass plates G are in contact with each other and damaged, not only the glass plates G, but also the substrate cleaning device itself may be damaged, which may cause an increase in the cost of replacing the parts of the equipment and a decrease in the yield. According to the present invention, the type of the above-mentioned abnormality and / or the location where the abnormality occurs can be quickly determined, so that the conveying state of the glass plate G, the setting state of the disc brush 23, and the cause of the abnormality can be corrected with less labor, cost and time. In addition, as a specific method, for example, after stopping the operation of the substrate cleaning device as needed, the conveying state of the glass plate G, the setting state of the disc brush 23, and the cause of the abnormality can be corrected by manual and / or robot units.

[0079] In addition, in the above embodiment, a structure in which a plurality of disc brushes 23 are arranged in a row in the width direction is exemplified, but the substrate cleaning apparatus 100 may also be a structure having a plurality of rows of disc brushes 23 arranged in the width direction. In this case, the force sensor 61 may be provided in all rows of disc brushes 23 or in any row of disc brushes 23.

[0080] For example, when the system is composed of a slurry cleaning section Ps, a detergent cleaning section Pc, and a pure water cleaning section Pw, it is preferable to provide a force sensor on the disk brush 23 in at least one row of each cleaning section.

[0081] In addition, according to the substrate cleaning apparatus 100 involved in this embodiment, the force sensor 61 is provided between the support mechanism 35 supporting the disc brush 23 and the frame 33, and the load of the support mechanism 35 supporting the disc brush 23 relative to the frame 33 can be measured. Therefore, based on the difference between the measured values ​​of the force sensor 61 when the disc brush 23 is in contact with the surface of the glass plate G and when it is not in contact, the contact state of the disc brush 23 with the surface of the glass plate G can be accurately detected.

[0082] Furthermore, the substrate cleaning apparatus 100 includes a laser displacement meter 63 for measuring the displacement of the frame 33. Therefore, the displacement of the frame 33 when the disk brush 23 contacts the glass plate G is obtained based on the measurement data from the laser displacement meter 63, and the contact state of the disk brush 23 with respect to the glass plate G can be detected more accurately.

[0083] In addition, if Figure 2 As shown, the substrate cleaning apparatus 100 may include a displacement meter such as a strain gauge 81 or a tensile force sensor 83 for detecting the displacement of the frame 33 instead of the laser displacement meter 63 or together with the laser displacement meter 63. For example, the strain gauge 81 is mounted on the frame 33, and the tensile force sensor 83 is mounted on the connection portion between the support 31 and the frame 33. Furthermore, by using the strain gauge 81 and the tensile force sensor 83 to detect the displacement of the frame 33, the contact state of the plurality of disk brushes 23 with respect to the glass plate G can be detected in more detail.

[0084] Furthermore, the substrate cleaning apparatus 100 includes an accelerometer 65 for detecting vibration of the frame 33. Therefore, based on the measurement data from the accelerometer 65, the vibration of the frame 33 when the disk brush 23 contacts the glass plate G is obtained, and the contact state of the disk brush 23 with respect to the glass plate G can be detected more accurately.

[0085] In addition, the closer the accelerometer 65 is to the disk brush 23, the better it can detect vibration. Therefore, the accelerometer 65 is preferably set at a position close to the disk brush 23 in the frame 33. In addition, as the accelerometer 65, any accelerometer can be used as long as it can measure vibration in at least one axial direction. In this case, the vibration of the frame 33 along the contact direction of the disk brush 23 with the glass plate G is detected by the accelerometer 65.

[0086] In addition, in the substrate cleaning device 100, a surface pressure sensor 85 may be provided between the fixing plate 37 and the disc brush 23 to detect the change in pressure applied to the disc brush 23 when the disc brush 23 contacts the glass plate G. Thus, based on the detection result from the surface pressure sensor 85, the contact state of each disc brush 23 with respect to the glass plate G can be detected in more detail. In addition, the surface pressure sensor 85 may be provided between the frame 33 and the flange 51 of the support mechanism 35 in the same manner as the force sensor 61 to detect the change in pressure applied to the frame 33 from the flange 51 of the support mechanism 35. Thus, based on the detection result from the surface pressure sensor 85, the contact state of each disc brush 23 with respect to the glass plate G can be detected in more detail.

[0087] Furthermore, according to the substrate cleaning apparatus 100 , the control unit 71 detects the load variation of the rotary motor 45 when the disk brush 23 contacts the glass plate G. Based on the load variation of the rotary motor 45 , the contact state of the disk brush 23 with respect to the glass plate G can be detected more accurately.

[0088] In addition, in the present embodiment, all the disc brushes 23 are rotated by one rotary motor 45, but the same number of rotary motors 45 as the disc brushes 23 may be provided, and each disc brush 23 may be rotated by the rotary motor 45. In addition, the disc brush 23 may be divided into several units, and the disc brushes 23 constituting the unit may be rotated by the rotary motor 45 provided for each unit.

[0089] In the above embodiment, the disk brush 23 that cleans the surface of the conveyed glass plate G is described by way of example, but the present invention can of course also be applied to the case where the contact state of the disk brush that cleans the back of the glass plate G with respect to the glass plate G is detected. In this case, based on the measurement data from the force sensor between the frame 33 and the flange 51 of the support mechanism 35, the load when the disk brush 23 contacts the back of the glass plate G, that is, the contact load F1, and the load when the disk brush 23 does not contact the back of the glass plate G, that is, the non-contact load F2 are obtained. Then, the load difference ΔF (ΔF=|F1-F2|) between these contact load F1 and non-contact load F2 is calculated, and the contact state of each disk brush 23 with respect to the glass plate G is detected based on the load difference ΔF.

[0090] In addition, as the force sensor 61, for example, a bolt-type force sensor of a simple structure for measuring the axial force of a bolt may be used. When using the bolt-type force sensor, for example, the frame 33 and the flange 51 of the support mechanism 35 are fastened by the bolt-type force sensor. Then, the contact load F1 and the non-contact load F2 are obtained based on the measurement data of the axial force of the bolt-type force sensor, and the contact state of each disk brush 23 with respect to the glass plate G is detected based on the load difference ΔF between the contact load F1 and the non-contact load F2.

[0091] In addition, the substrate cleaning device 100 may be configured such that a load cell 61 is provided in each cleaning processing section such as the slurry cleaning processing section Ps, the detergent cleaning processing section Pc, and the pure water cleaning processing section Pw. In this case, the contact state of the disk brush 23 with respect to the glass plate G can be accurately detected based on the measurement data of the load cell 61 of each cleaning processing section, and the conveying state of the glass plate G or the setting state of the disk brush 23 can be determined based on the detection result. That is, based on the load data measured by the load cell 61 provided in each cleaning processing section, the load difference, the contact time, the separation time, the substrate interval and / or the contact time are detected, thereby determining the abnormality of the conveying state of the substrate, the abnormality of the setting state of the cleaning member, and particularly where these abnormalities occur in the substrate conveying path.

[0092] In addition, the cleaning member that comes into contact with the glass plate G for cleaning is not limited to the disc brush 23, and may also be a roller brush that is rotated along the rotation axis of the glass plate G so that a brush disposed around the rotation axis comes into contact with the glass plate G for cleaning. That is, each of the plurality of cleaning members arranged in the width direction of the glass may be the disc brush 23 or the roller brush.

[0093] In addition, in the above-mentioned embodiment, a structure in which a plurality of disc brushes 23 are arranged in a row in the width direction is illustrated, but the substrate cleaning device 100 may also be a structure having a roller brush extending in the width direction. In this case, a force sensor 61 (load meter) may also be provided at each of the support mechanisms at both ends of the width direction supporting the roller brush. In addition, in this case, the number of roller brushes extending in the width direction is not limited to one, and a plurality of roller brushes may be arranged in the width direction and / or the conveying direction, and may also be combined with the disc brush 23.

[0094] In addition, the present invention can also be applied to cleaning electronic devices other than LCD, OLED, and FPD, such as glass substrates for optical elements, glass plates, solar cells, etc. In addition, the substrate to be cleaned is not limited to a glass plate, and can also be a substrate formed of metal, ceramic, or resin.

[0095] Thus, the present invention is not limited to the above-mentioned embodiments, and the combinations of the structures of the embodiments, changes and applications made by those skilled in the art based on the description in the specification and known technologies are also within the scope of the present invention and are included in the scope of protection required.

[0096] As described above, the following matters are disclosed in this specification.

[0097] (1) A substrate cleaning device for cleaning at least one of the front and back surfaces of a conveyed substrate as a cleaned surface, comprising: a substrate conveying device for conveying the substrate; a cleaning member for rotating while contacting the cleaned surface of the conveyed substrate; a plurality of load meters for measuring the load applied to the cleaned surface by the cleaning member at a plurality of locations in a width direction intersecting the conveying direction of the substrate; and a detection unit for detecting a contact state between the cleaning member and the substrate based on measurement data from the plurality of load meters, and determining a conveying state of the substrate, a setting state of the cleaning member, or the occurrence of an abnormality in the substrate cleaning device based on the detected contact state.

[0098] According to the substrate cleaning device, the contact state of the cleaning member relative to the substrate can be accurately detected based on the measurement data of multiple load cells, and the conveying state of the substrate, the setting state of the cleaning member, or the occurrence of abnormality in the substrate cleaning device can be determined based on the detection result. Moreover, based on the determination result, the conveying state of the substrate, the setting state of the cleaning member, and the cause of the abnormality can be accurately corrected, and the substrate can be well cleaned using the cleaning member.

[0099] (2) The substrate cleaning apparatus according to (1), wherein the load meter is provided at least at both ends in a width direction intersecting with a conveyance direction of the substrate.

[0100] According to this substrate cleaning apparatus, it is possible to determine the conveyance state of the substrate, the installation state of the cleaning member, or the occurrence of abnormality in the substrate cleaning apparatus based on the measurement data from the load cell while suppressing the cost.

[0101] (3) A substrate cleaning device according to (1) or (2), wherein a plurality of cleaning processing units that utilize the cleaning member to clean the cleaned surface of the substrate are arranged in the conveying direction, and the load applied by the cleaning member to the cleaned surface is measured by the load meter at a plurality of locations in the width direction intersecting the conveying direction in each of the cleaning processing units.

[0102] According to the substrate cleaning device, in a plurality of cleaning processing sections, the conveying state of the substrate, the setting state of the cleaning component, or the occurrence of an abnormality in the substrate cleaning device can be accurately determined. Thus, even when different cleaning processes are performed in each cleaning processing section, the conveying state of the substrate, the setting state of the cleaning component, and the cause of the abnormality can be accurately corrected.

[0103] (4) A substrate cleaning device for cleaning at least one of the front and back surfaces of a conveyed substrate as a cleaned surface, wherein the device comprises: a substrate conveying device for conveying the substrate; a plurality of cleaning processing units arranged in a conveying direction of the substrate and cleaning the cleaned surface of the substrate using a cleaning member; a load meter respectively provided in the plurality of cleaning processing units and measuring the load applied to the cleaned surface by the cleaning member; and a detection unit for detecting the contact state between the cleaning member and the substrate based on measurement data from the plurality of load meters, and determining the conveying state of the substrate, the setting state of the cleaning member, or the occurrence of an abnormality in the substrate cleaning device based on the detected contact state.

[0104] According to the substrate cleaning device, the contact state of the cleaning member relative to the substrate can be accurately detected based on the measurement data of the load meter installed in each cleaning processing unit, and the conveying state of the substrate, the setting state of the cleaning member, or the occurrence of abnormality in the substrate cleaning device can be determined based on the detection result. Moreover, based on the determination result, the conveying state of the substrate, the setting state of the cleaning member, and the cause of the abnormality can be accurately corrected, and the substrate can be well cleaned using the cleaning member.

[0105] (5) A substrate cleaning device according to any one of (1) to (4), wherein the detection unit detects at least one information selected from load difference, contact timing, separation timing, substrate interval, and contact time at the corresponding cleaning component as a contact state based on measurement data from each of the load meters, and compares or monitors the contact state obtained by each of the load meters among the plurality of load meters, thereby determining the conveying state of the substrate, the setting state of the cleaning component, or the occurrence of an abnormality in the substrate cleaning device.

[0106] According to the substrate cleaning device, when an abnormality occurs in the conveying state of the substrate, the setting state of the cleaning component, or the substrate cleaning device, it is possible to determine that the abnormality has occurred, the type of abnormality, and / or the location where the abnormality has occurred, and the conveying state of the substrate, the setting state of the cleaning component, and the cause of the abnormality can be accurately corrected, and the cleaning component can be used to clean the substrate well.

[0107] (6) A substrate cleaning method, wherein at least one of the front and back surfaces of a substrate is cleaned as a cleaned surface, wherein the substrate is transported by a substrate conveying device; a cleaning member is caused to rotate while contacting the cleaned surface of the conveyed substrate to clean the cleaned surface; a load applied to the cleaned surface by the cleaning member is measured by a plurality of load meters arranged at a plurality of locations in a width direction intersecting with the conveying direction of the substrate; and in a detection unit, based on measurement data from the plurality of load meters, a contact state between the cleaning member and the substrate is detected, and based on the detected contact state, a determination is made as to the conveying state of the substrate, the setting state of the cleaning member, or the occurrence of an abnormality in the substrate cleaning device.

[0108] According to the substrate cleaning method, the contact state of the cleaning member relative to the substrate can be accurately detected based on the measurement data of multiple load cells, and the conveying state of the substrate, the setting state of the cleaning member, or the occurrence of abnormality in the substrate cleaning device can be determined based on the detection result. Moreover, based on the determination result, the conveying state of the substrate, the setting state of the cleaning member, and the cause of the abnormality can be accurately corrected, and the substrate can be well cleaned using the cleaning member.

[0109] (7) The substrate cleaning method according to (6), wherein the load cell is provided at least at both ends in a width direction intersecting with a conveyance direction of the substrate.

[0110] According to this substrate cleaning method, it is possible to suppress costs and determine the conveyance state of the substrate, the installation state of the cleaning member, or the occurrence of abnormality in the substrate cleaning apparatus based on the measurement data from the load cell.

[0111] (8) A substrate cleaning method according to (6) or (7), wherein a plurality of cleaning processing units that utilize the cleaning member to perform cleaning processing on the cleaned surface of the substrate are arranged in the conveying direction, and the load applied by the cleaning member to the cleaned surface is measured by the load meter at a plurality of locations in the width direction intersecting the conveying direction in each of the cleaning processing units.

[0112] According to the substrate cleaning method, in a plurality of cleaning processing sections, the conveying state of the substrate, the setting state of the cleaning component, or the occurrence of abnormality in the substrate cleaning device can be accurately determined. Thus, even when different cleaning processes are performed in each cleaning processing section, the conveying state of the substrate, the setting state of the cleaning component, and the cause of the abnormality can be accurately corrected.

[0113] (9) A substrate cleaning method, wherein at least one of the front and back surfaces of a substrate is cleaned as a cleaned surface, wherein the substrate is transported by a substrate transport device; in a plurality of cleaning processing sections arranged in a transport direction of the substrate, the cleaned surface of the substrate is cleaned by a cleaning member; using load meters respectively provided in the plurality of cleaning processing sections, the load applied to the cleaned surface by the cleaning member is measured; and in a detection section, based on measurement data from the plurality of load meters, the contact state between the cleaning member and the substrate is detected, and based on the detected contact state, the transport state of the substrate, the setting state of the cleaning member, or the occurrence of an abnormality in the substrate cleaning device is determined.

[0114] According to the substrate cleaning method, the contact state of the cleaning member relative to the substrate can be accurately detected based on the measurement data of the load meter set in each cleaning processing unit, and the conveying state of the substrate, the setting state of the cleaning member, or the occurrence of abnormality in the substrate cleaning device can be determined based on the detection result. Moreover, based on the determination result, the conveying state of the substrate, the setting state of the cleaning member, and the cause of the abnormality can be accurately corrected, and the substrate can be well cleaned using the cleaning member.

[0115] (10) A substrate cleaning method according to any one of (6) to (9), wherein, in the detection unit, based on the measurement data from each of the load meters, at least one information selected from the load difference, contact timing, separation timing, substrate interval, and contact time at the corresponding cleaning component is detected as the contact state, and the contact state obtained by each of the load meters is compared or monitored among the plurality of load meters, thereby determining the conveying state of the substrate, the setting state of the cleaning component, or the occurrence of an abnormality in the substrate cleaning device.

[0116] According to this substrate cleaning method, when an abnormality occurs in the conveying state of the substrate, the setting state of the cleaning component, or the substrate cleaning device, it is possible to determine that the abnormality has occurred, the type of abnormality, and / or the location where the abnormality has occurred, and the conveying state of the substrate, the setting state of the cleaning component, and the cause of the abnormality can be accurately corrected, and the cleaning component can be used to clean the substrate well.

[0117] While the present invention has been described in detail and with reference to specific embodiments thereof, it will be apparent to one skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the present invention.

[0118] This application is based on Japanese Utility Model Application No. 2023-003667 filed on October 6, 2023, and the contents are incorporated herein by reference.

[0119] Description of symbols

[0120] 10. substrate conveying device;

[0121] 23, 23a, 23b, 23c disc brush (cleaning member);

[0122] 61 force sensor (load meter);

[0123] 71 control unit (detection unit);

[0124] 100 substrate cleaning device;

[0125] G Glass plate (substrate);

[0126] Ps slurry cleaning and treatment section (cleaning and treatment section);

[0127] Pc detergent cleaning treatment unit (cleaning treatment unit);

[0128] Pw Pure water cleaning treatment unit (cleaning treatment unit).

Claims

1. A substrate cleaning device, which cleans at least one of the front and back surfaces of a substrate being transported as a cleaned surface, wherein: have: A substrate conveying device for conveying the substrate; a cleaning member that rotates while contacting the cleaned surface of the conveyed substrate; a plurality of load meters for measuring the load applied by the cleaning member to the cleaned surface at a plurality of locations in a width direction intersecting with a conveying direction of the substrate; and The detection unit detects the contact state between the cleaning member and the substrate based on the measurement data from the plurality of load meters, and determines the conveying state of the substrate, the setting state of the cleaning member, or the occurrence of an abnormality in the substrate cleaning device based on the detected contact state.

2. The substrate cleaning device according to claim 1, wherein: The load meter is provided at least at both ends in a width direction intersecting with a conveyance direction of the substrate.

3. The substrate cleaning device according to claim 1 or 2, wherein: A plurality of cleaning processing units that perform cleaning processing on the cleaned surface of the substrate using the cleaning member are arranged in the conveying direction, The load applied by the cleaning member to the cleaned surface is measured by the load meter at a plurality of locations in the width direction intersecting the conveying direction in each of the cleaning processing sections.

4. A substrate cleaning device, which cleans at least one of the front and back surfaces of a substrate being transported as a cleaned surface, wherein: have: A substrate conveying device for conveying the substrate; A plurality of cleaning processing units are arranged in the conveying direction of the substrate and use cleaning components to perform cleaning processing on the cleaned surface of the substrate; A load meter is provided at each of the plurality of cleaning processing parts to measure the load applied by the cleaning member to the cleaned surface; and The detection unit detects the contact state between the cleaning member and the substrate based on the measurement data from the plurality of load meters, and determines the conveying state of the substrate, the setting state of the cleaning member, or the occurrence of an abnormality in the substrate cleaning device based on the detected contact state.

5. The substrate cleaning device according to any one of claims 1, 2 and 4, wherein: The detection unit detects at least one information selected from the load difference, contact timing, separation timing, substrate interval, and contact time at the corresponding cleaning component as a contact state based on the measurement data from each of the load meters, and compares or monitors the contact state obtained by each of the load meters among the plurality of load meters, thereby determining the conveying state of the substrate, the setting state of the cleaning component, or the occurrence of an abnormality in the substrate cleaning device.

6. A substrate cleaning method, wherein at least one of the front and back surfaces of the substrate is used as a cleaned surface for cleaning, wherein: transporting the substrate using a substrate transport device; causing the cleaning member to contact the cleaned surface of the conveyed substrate while rotating to clean the cleaned surface; Measuring the load applied by the cleaning member to the cleaned surface using a plurality of load meters provided at a plurality of locations in a width direction intersecting with a conveying direction of the substrate; and In the detection unit, the contact state between the cleaning member and the substrate is detected based on the measurement data from the plurality of load meters, and the conveying state of the substrate, the setting state of the cleaning member or the occurrence of an abnormality in the substrate cleaning device is determined based on the detected contact state.

7. The substrate cleaning method according to claim 6, wherein: The load meter is provided at least at both ends in a width direction intersecting with a conveyance direction of the substrate.

8. The substrate cleaning method according to claim 6 or 7, wherein: A plurality of cleaning processing units that perform cleaning processing on the cleaned surface of the substrate using the cleaning member are arranged in the conveying direction, The load applied by the cleaning member to the cleaned surface is measured by the load meter at a plurality of locations in the width direction intersecting the conveying direction in each of the cleaning processing sections.

9. A substrate cleaning method, wherein at least one of the front and back surfaces of the substrate is used as a cleaned surface for cleaning, wherein: transporting the substrate using a substrate transport device; In a plurality of cleaning processing sections arranged in the conveying direction of the substrate, the cleaning surface of the substrate is cleaned by using a cleaning member; Using load meters respectively provided in the plurality of cleaning processing parts, the load applied by the cleaning member to the cleaned surface is measured; In the detection unit, the contact state between the cleaning member and the substrate is detected based on the measurement data from the plurality of load meters, and the conveying state of the substrate, the setting state of the cleaning member or the occurrence of an abnormality in the substrate cleaning device is determined based on the detected contact state.

10. The substrate cleaning method according to any one of claims 6, 7 and 9, wherein: In the detection unit, based on the measurement data from each of the load meters, at least one information selected from the load difference, contact timing, separation timing, substrate interval, and contact time at the corresponding cleaning component is detected as the contact state, and the contact state obtained by each of the load meters is compared or monitored among the plurality of load meters, thereby determining the conveying state of the substrate, the setting state of the cleaning component, or the occurrence of an abnormality in the substrate cleaning device.

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