Molding device surface machining micro-modeling method and device for 3D micro-modeling

Abstract

The invention relates to a surface machining micro-modeling method and device for a forming device for 3D micro-modeling, and relates to the field of device machining. The forming device surface machining micro-modeling device for 3D micro-modeling comprises a carrier, a laser machining system arranged on the carrier in a sliding mode and a laser diameter measuring system, the carrier is provided with a clamping assembly used for clamping a forming device and further comprises a rotating torque motor used for driving the forming device to rotate, the laser machining system comprises a moving assembly, and the moving assembly is used for moving the forming device. A laser output device is arranged on the moving assembly, a laser range finder is arranged on the laser output device, the moving assembly is arranged on the carrier in a sliding mode, and the laser diameter measuring system comprises a laser transmitter and a receiver; according to the surface machining micro-modeling device for the forming device for 3D micro-modeling, automatic focusing is achieved through the laser range finder, defocusing in the machining process is avoided, the precision and efficiency of 3D micro-modeling machining are remarkably improved, and large-scale preparation of micro-nano-level micro-modeling is achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of device processing, and in particular relates to a method and device for surface processing micro-modeling of a molding device for 3D micro-modeling. Background Art

[0002] With the rapid development of new energy vehicles and energy storage markets, the requirements for battery performance are becoming increasingly stringent, especially the increasing demands for fast charging capabilities and cycle life. This has prompted the research and development of 3D micro-modeling technology. 3D micro-modeling current collectors and 3D micro-modeling electrodes can improve the fast charging performance and cycle life of batteries in both ionic and electronic conductivity.

[0003] Femtosecond laser is an ideal tool for precision processing due to its ultrashort pulse width and nonlinear absorption characteristics. It can process micro-nano structures without damaging the substrate, providing new possibilities for the processing of 3D micro-molding devices.

[0004] At present, in order to meet the demand for improving battery performance, mechanical engraving, electrolytic polishing, chemical etching and other methods are usually used to make molded devices with specific patterns. These methods have their own advantages and disadvantages. The mechanical engraving method is simple and direct, but it is difficult to form complex and subtle geometric shapes; although the electrolytic polishing method can form a relatively uniform surface, it cannot effectively fill deep grooves; although chemical etching can achieve more complex graphical processing, it is greatly limited by the erosion and selectivity of the solution, and it is easy to cause environmental pollution; these methods are difficult to balance the processing accuracy, efficiency, environmental protection and other aspects. Especially when it comes to the preparation of nano-level or submicron-level microstructures, the existing 3D micro-modeling technology generally has the disadvantages of low processing accuracy, high cost and difficulty in mass production, especially when making microstructures with specific shapes and sizes. It is more obvious that it is not only difficult to achieve the ideal molding quality, but also due to the unstable process, the product quality fluctuates greatly, which in turn affects the performance stability of the final product. In addition, the existing technology cannot accurately and quickly find the focus of the laser during use, and it is easy to defocus during the processing process. At the same time, due to the change in diameter caused by the grinding of the molded device, the existing technology cannot accurately measure the diameter of the molded device, resulting in large fluctuations in product quality. Summary of the invention

[0005] The purpose of the present invention is to provide a method and device for surface processing micro-modeling of a molding device for 3D micro-modeling with a simple structure and reasonable design in order to solve the above-mentioned problems.

[0006] The present invention achieves the above-mentioned purpose through the following technical solutions:

[0007] A first aspect of the present invention provides a micro-molding device for surface processing of a molding device for 3D micro-molding, comprising a carrier device, on which a laser processing system is slidably arranged, and further comprising a laser diameter measuring system;

[0008] Wherein, the carrier device comprises a carrier, and a clamping assembly is arranged on the carrier for clamping the formed device;

[0009] The laser processing system comprises a moving component, on which a laser output device is arranged, on which a laser rangefinder is arranged, and the moving component is slidably arranged on the carrier;

[0010] The laser diameter measuring system comprises a laser transmitter and a receiver.

[0011] Furthermore, the clamping assembly includes a fixed block and a slider, the slider is set on the carrier through a track sliding, the fixed block is set in the moving direction of the slider, and the fixed block and the slider are opposite to each other. The tops of the two groups of ejector pins are on the same horizontal line.

[0012] Furthermore, the moving assembly includes an X-axis control system, a Y-axis control system and a Z-axis control system. The X-axis control system includes an M-frame, and the M-frame is slidably disposed on the carrier and mounted above the slider.

[0013] Furthermore, a gate frame is arranged on one side of the fixed block close to the slider, the forming device is arranged through the gate frame, the transmitter and the receiver are both arranged on the gate frame, and the two are arranged symmetrically about the forming device axis.

[0014] Furthermore, the X-axis control system, the Y-axis control system and the Z-axis control system all include a motor, a lead screw and a slide rail, the Y-axis control system also includes a first fixed frame, the Z-axis control system includes a second fixed frame, the second fixed frame is slidably set on the first fixed frame, and the laser output device is set on the second fixed frame.

[0015] Furthermore, the slider is provided with a fixing bolt, and the fixing bolt is used to fix the position of the slider.

[0016] Furthermore, a rotary torque motor is arranged on one side of the fixed block away from the slider, the output end of the rotary torque motor is connected to one group of the ejector pins, the other group of the ejector pins is rotationally connected to the slider, and the horizontal position thereof is controlled by a telescopic adjustment block.

[0017] Furthermore, the laser rangefinder is installed on the side of the laser output device away from the M frame, and an exhaust system is also provided to collect debris volatilized by laser etching.

[0018] A second aspect of the present invention provides a method for processing micro-modeling on the surface of a molding device for 3D micro-modeling, using the above-mentioned device, and comprising the following steps:

[0019] S1, clamping the formed component by using two groups of ejector pins;

[0020] S2, adjust the laser output parameters, start the laser diameter measuring system to measure the diameter of the formed component;

[0021] S3, controlling the laser head of the laser output device to engrave along a straight line path parallel to the forming device through the moving component, and at the same time driving the forming device to rotate in a clockwise direction through the rotating torque motor;

[0022] S4, when the laser reaches the specified end point, the forming device stops rotating, the moving component controls the laser output device to return to the starting point, and the forming device rotates again according to the predetermined increment;

[0023] S5, repeat step S4 until the entire surface is covered;

[0024] S6, controlling the laser head of the laser output device to engrave along a straight line path parallel to the forming device through the moving component, and at the same time driving the forming device to rotate in a counterclockwise direction through the rotating torque motor;

[0025] S7, repeat step S6 until the entire surface is covered.

[0026] Furthermore, in step S2, the spot size and pulse frequency of the laser output device are specifically included.

[0027] The beneficial effects of the present invention are as follows: the present invention utilizes a laser rangefinder for automatic focusing, thereby avoiding defocusing during processing, which results in inconsistent micro-modeling morphology; utilizes a laser diameter gauge to accurately measure the diameter of a molded device, accurately calculates the linear velocity, and the diameter error can be controlled within the range of ±5 μm; significantly improves the accuracy and efficiency of 3D micro-modeling processing, and realizes large-scale preparation of micro-nano-level micro-modeling, which is particularly suitable for applications in the battery field; a rotary torque motor drives the molded device to rotate, and the mutual cooperation ensures the rotation accuracy; the spirally processed molded device has good consistency in the distribution of protrusions and pits pressed on the surface of the current collector, and the produced battery can also avoid the phenomenon of lithium plating of the battery. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0029] Figure 2 It is a schematic diagram of the structure of the clamping assembly of the present invention;

[0030] Figure 3It is a schematic diagram of the structures of the X-axis control system, the Y-axis control system and the Z-axis control system of the present invention;

[0031] Figure 4 is a laser reflection diagram of the present invention;

[0032] Figure 5 This is a clockwise processed forming device diagram of the present invention (the black spiral line is the roller itself, and the white area is the laser etched area);

[0033] Figure 6 It is a diagram of a molded device after clockwise and counterclockwise processing of the present invention is completed (the intersection of the positive spiral and the counter-spiral is a boss);

[0034] Figure 7 It is a partially spirally processed boss of the present invention;

[0035] Figure 8 It is a diagram of a method for partially spirally machining a boss according to the present invention;

[0036] Fig. 9 is a surface diagram of the current collector of the present invention without spiral processing (black represents protrusions on the surface of the current collector, and white represents pits on the surface of the current collector);

[0037] Fig.10 : is a surface image of the current collector of the present invention using spiral processing (black represents protrusions on the surface of the current collector, and white represents pits on the surface of the current collector);

[0038] Fig.11 It is a diagram of a non-spiral processed forming device of the present invention;

[0039] Fig.12 It is a diagram of a spirally processed forming device according to the present invention.

[0040] In the figure: 101, carrier; 102, fixed block; 103, slider; 104, rotary torque motor; 105, track; 106, baffle; 107, ejector; 108, fixing bolt; 109, telescopic adjustment block; 201, M frame; 203, laser output device; 204, X-axis control system; 205, Y-axis control system; 206, Z-axis control system; 207, exhaust system; 208, first fixed frame; 209, second fixed frame; 301, door frame; 302, laser transmitter; 303, receiver; 401, laser rangefinder. DETAILED DESCRIPTION

[0041] The present application is further described in detail below in conjunction with the accompanying drawings. It is necessary to point out here that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technical personnel in this field can make some non-essential improvements and adjustments to the present application based on the above application content.

[0042] refer to Figure 1 , Figure 2 and Figure 3 The structural schematic diagram shown is a micro-molding device for surface processing of a molding device for 3D micro-molding, comprising a carrier device, a laser processing system is slidably arranged on the carrier device, and also comprises a laser diameter measuring system;

[0043] The carrier device includes a carrier 101, and a clamping assembly is provided on the carrier 101 for clamping the formed device;

[0044] The clamping assembly includes a fixed block 102 and a slider 103. The slider 103 is slidably arranged on the carrier 101 through a track 105. The fixed block 102 is arranged in the moving direction of the slider 103. The fixed block 102 and the slider 103 are both provided with ejector pins 107 on the opposite side. The two sets of ejector pins 107 are on the same horizontal line. The slider 103 has limited movement displacement, and the maximum position and the minimum position are controlled by the baffle 106.

[0045] The slider 103 is provided with a fixing bolt 108, and the fixing bolt 108 is used to fix the position of the slider 103;

[0046] The laser processing system includes a moving component, on which a laser output device 203 is arranged, on which a laser rangefinder 401 is arranged, and the moving component is slidably arranged on a carrier 101;

[0047] like Figure 4 As shown, the laser rangefinder 401 is installed on the side of the laser output device 203 away from the M frame 201. As the laser output device 203 moves back and forth, the effective range of the laser displacement sensor is 20-30mm. Each time the laser displacement sensor works, it measures the distance, finds the best focus of the laser output device 203 on the surface of the molding device, and uses the laser triangulation reflection principle to calculate the position of the reflected light spot through trigonometric functions to obtain the distance;

[0048] The laser rangefinder 401 preferably uses the laser displacement sensor IL-S025. The IL-S025 laser displacement sensor can provide very high measurement accuracy and resolution, and is suitable for applications that require extremely fine measurements. This high accuracy can usually reach the micron level, or even higher, to meet the needs of precision machining or testing, with a repeatability of 1μm. It is also equipped with an exhaust system 207, which uses a HDD-150P exhaust fan to collect the volatile debris from laser etching; the M frame 201 uses an integrated casting structure to improve stability during movement;

[0049] The laser output device 203 uses a laser with adjustable spot, the spot range is 25 microns-60 microns, and the pulse frequency is 1 to 500KHz red light. The laser manufacturer is Keyence, and the output pulse frequency is adjusted to control the height and morphology of the micro-molding boss;

[0050] The moving assembly includes an X-axis control system 204, a Y-axis control system 205, and a Z-axis control system 206. The X-axis control system 204 includes an M-frame 201, which is slidably disposed on the carrier 101 and mounted above the slider 103;

[0051] The X-axis control system 204, the Y-axis control system 205 and the Z-axis control system 206 all include a servo motor, an NSK ball screw and a slide rail. The Y-axis control system 205 also includes a first fixed frame 208, and the Z-axis control system 206 includes a second fixed frame 209. The second fixed frame 209 is slidably set on the first fixed frame 208, and the laser output device 203 is set on the second fixed frame 209; wherein, the slide rail of the X-axis control system 204 preferably adopts an M ID6-350 slide rail, the servo motor controls the ball screw to rotate and drive the laser output device 203 to move left and right, and the two ends of the M frame 201 adopt M ID slide rails for auxiliary movement; the slide rail of the Y-axis control system preferably adopts an M ID6-250 slide rail, the servo motor controls the ball screw to rotate and drive the laser output device 203 to move forward and backward, and the two slide rails are fixed parallel to the NSK ball screw on the left side of the M frame 201; the slide rail of the Z-axis control system 206 preferably adopts an M ID6-250 slide rail. ID6-150 slide rail, servo motor controls the ball screw to rotate and drive the laser output device 203 to move up and down. The two slide rails are fixed parallel to the ball screw on the left side of the fixed frame 2. The movement accuracy of the X-axis control system 204, the Y-axis control system 205 and the Z-axis control system 206 can all reach 1μm.

[0052] The laser diameter measuring system includes a laser transmitter 302 and a receiver 303;

[0053] Among them, the laser transmitter 302 uses a high-speed rotating HeNe laser transmitter to generate a laser beam; the laser beam is processed by a group of lenses and becomes parallel light. The measurement process: when the parallel laser beam is irradiated on the object to be measured, scattering will occur. The receiver 303 is located at the position after the laser beam passes through the object, and is used to receive the scattered laser beam; the receiver 303 can measure the intensity of the laser beam and convert it into an electrical signal; signal processing: after the received electrical signal is amplified and processed, the laser diameter gauge can calculate the diameter of the formed component; the laser diameter measurement system can move along the slide rail of the X-axis control system 204 parallel to the formed component, measure the roller body diameter of the formed component at different positions, and calculate the diameter of the formed component at each position.

[0054] A rotating torque motor 104 is arranged on the side of the fixed block 102 away from the slider 103. The output end of the rotating torque motor 104 is connected to one set of ejector pins 107. The other set of ejector pins 107 is rotatably connected to the slider 103, and the horizontal position thereof is controlled by the telescopic adjustment block 109. A grating ruler measuring device is also included, and the grating ruler ensures the rotation accuracy.

[0055] The rotary torque motor 104 must have a high-precision adjustment function, and the minimum rotation angle can be controlled to 1 / 7° to meet the needs of molding components of different specifications; the laser ranging device should have a fast response feature and be able to complete focus positioning within milliseconds; the use of a grating ruler ensures the accuracy of each rotation of the molding component; the control system is recommended to use a PLC controller with good compatibility and programming flexibility.

[0056] Furthermore, a gate frame 301 is provided on one side of the fixed block 102 close to the slider 103, the forming device is provided through the gate frame 301, the transmitter 302 and the receiver 303 are both provided on the gate frame 301, and the two are provided symmetrically with respect to the forming device axis.

[0057] You can also design a general control system to coordinate the action flow of each component through the general control system. Specifically, you can use PLC (Programmable Logic Controller). The basic components of PLC include:

[0058] Central Processing Unit (CPU): It is used to handle control logic, calculations and instruction execution and is the brain of the PLC.

[0059] Input module: Receives signals from external devices such as sensors and switches and transmits them to the PLC for processing.

[0060] Output module: controls the actions of execution devices (such as motors, valves, etc.) according to the processing results of PLC.

[0061] Power module: provides the required power for PLC.

[0062] Programming device: used to write and modify PLC control programs, generally using graphical programming languages ​​such as ladder diagrams and function block diagrams.

[0063] PLC is an existing mature technology and is not further improved in this application, so it will not be described in detail.

[0064] It should be noted that the molded component carrier device designed in this scheme is mainly used for processing molded components with a diameter of Ф20mm-Ф500mm, a length of 100mm-1200mm, and a weight of less than 2t.

[0065] How it works:

[0066] 1) Adjustment of the laser output device 203 spot: The size of the laser output device 203 spot is changed by changing the distance between the convex lens and the laser output device 203. Placing the convex lens near the focal position of the spot can achieve the focusing of the spot, thereby reducing the spot size. Adjusting the distance between the convex lens and the laser can change the focusing ability of the convex lens, thereby accurately controlling the size of the spot.

[0067] 2) Finding the laser focus: activating the laser rangefinder 401 to automatically adjust the focus of the laser output device 203;

[0068] 3) Spiral processing of the formed device: the laser head of the laser output device 203 is moved to engrave along the parallel straight path of the formed device, and the rotary torque motor 104 is turned on to drive the formed device to rotate in the clockwise direction. During this period, the laser rangefinder 401 continuously searches for the focus to ensure that it does not defocus during the processing; whenever the laser reaches the specified end point, the formed device stops rotating, and the laser head returns to the starting point. After that, the formed device rotates again according to the predetermined increment, and the above steps are repeated until the entire surface is covered; the alternating etching strategy of positive spiral and reverse spiral helps to ensure uniform distribution of micro-shapes; after the clockwise and counterclockwise processing is completed, the intersection of the positive spiral and the reverse spiral is a boss, and the processing results are as follows Figure 5 , Figure 6 As shown;

[0069] like Figure 7 , Figure 8 As shown, the lateral spacing L1 between the bosses is determined by the galvanometer of the laser output device 203, the vertical spacing L2 between the bosses is determined by the angle θ, the morphology of the bosses is controlled by the rotation arc l and the angle θ, and the height of the bosses is controlled by the spot size D, the pulse frequency f, the laser power W and the lateral speed v;

[0070] The calculation formula of angle θ is:

[0071] θ=arctan(nΠd / L)

[0072] Wherein, n is the number of revolutions of the torque motor 104 during the laser processing in the horizontal direction; d is the diameter of the formed component; and L is the length of the formed component.

[0073] Assume that the rotational linear velocity of the molding device is V, and the calculation formula is:

[0074] V=nΠdv / L

[0075] Among them, n is the number of revolutions of the torque motor during the horizontal processing of the laser; d is the diameter of the formed device; v is the lateral movement speed during the laser processing; L is the length of the formed device.

[0076] The processing steps include:

[0077] 1) Turn on the laser diameter measuring system to measure the diameter of the molded component;

[0078] 2) Setting the spot size D and pulse frequency f, output power and horizontal traverse speed v of the laser output device 203;

[0079] 3) Start the laser distance measuring device to ensure that the laser focus is accurately located on the surface of the roller body of the forming device;

[0080] 4) Setting the length of the forming device, setting the number of revolutions n of the forming device during the processing, and setting the increment l of the second revolution;

[0081] 5) Turn on the PLC master control button to start processing;

[0082] 6) After processing is completed, turn off the equipment and check the processing effect.

[0083] Embodiment 1

[0084] A forming device of Ф100*500mm was selected, the laser spot D=40μm, the pulse frequency f=300KHz, the output power of 1.2kW, the input number of rotations n=3, the laser traverse speed v=17mm / min, the galvanometer width of 80 microns, and the rotation increment l=100 microns were selected.

[0085] θ=arctan(nΠd / L)=arctan(3*3.14*100 / 500)=62°;

[0086] V=nΠdv / L=3*3.14*100*17 / 500=32.028mm / min;

[0087] Angular velocity of the molded device: ω = V / r = 32.028 / 50 = 0.64056 rad / min;

[0088] The machined micro-shapes have a lateral spacing of 80 μm and a longitudinal spacing of 88 μm;

[0089] The size of the micro-modeling feature is 50*60μm, and the micro-modeling height is 30μm.

[0090] Embodiment 2:

[0091] A forming device of Ф100*500mm was selected, the laser spot D=30μm, the pulse frequency f=300KHz, the output power of 1.2kW, the input number of rotations n=3, the laser traverse speed v=17mm / min, the galvanometer width of 80 microns, and the rotation increment l=100 microns were selected.

[0092] θ=arctan(nΠd / L)=arctan(3*3.14*100 / 500)=62°;

[0093] V=nΠdv / L=3*3.14*100*17 / 500=32.028mm / min;

[0094] Angular velocity of the molded device: ω = V / r = 32.028 / 50 = 0.64056 rad / min;

[0095] The lateral spacing of the processed micro-shapes is 79μm and the longitudinal spacing is 87μm.

[0096] The size of the micro-shape is 40*42μm, and the height of the micro-shape is 28μm.

[0097] Embodiment three:

[0098] A forming device of Ф100*500mm was selected, the laser spot D=30μm, the pulse frequency f=300KHz, the output power of 1.2kW, the input number of rotations n=6, the laser traverse speed v=34mm / min, the galvanometer width of 120 microns, and the rotation increment l=100 microns were selected.

[0099] θ=arctan(nΠd / L)=arctan(6*3.14*100 / 500)=75°;

[0100] V=nΠdv / L=3*3.14*100*17 / 500=64.056mm / min;

[0101] Angular velocity of the molded device: ω = V / r = 32.028 / 50 = 1.28112 rad / min;

[0102] The lateral spacing of the processed micro-shapes is 118μm and the longitudinal spacing is 147μm.

[0103] The size of the micro-modeling feature is 60*70μm, and the micro-modeling height is 24μm.

[0104] A comparative example is given: the size of the molded components in the comparative example is Ф100*500mm

[0105]

[0106]

[0107] The microscopic shapes on the surface of the molded device produced by the device of the present invention and the conventional device are uniform in lateral and longitudinal spacing, and the current collector is pressed, such as Fig. 9 , Fig.10 As shown, the protrusions and pits formed on the surface of the current collector, sampling 3*2mm3D micro-molded current collector, it can be clearly found that the number of protrusions and pits on the surface of the current collector produced by the non-spiral processing molding device is inconsistent (protrusions: 15, pits: 18), and the number of protrusions and pits on the surface of the current collector produced by the spiral processing molding device is consistent (protrusions: 15.5 pits: 15.5). Due to the inconsistency of protrusions and pits, the coating of the current collector will be uneven during the coating process;

[0108] according to Fig.11 , Fig.12 It can be seen that the micro-shaped current collector surface produced by the non-spiral processing forming device has only protrusions or only pits along the X-axis direction or the Y-axis direction, and the current collector produced by the spiral processing forming device has both protrusions and pits in the same direction, which avoids the lithium deposition of the battery. The distribution of protrusions and pits pressed on the surface of the current collector by the spiral processing forming device is more consistent, and the batteries produced can also avoid the lithium deposition of the battery.

[0109] For pressed 3D micro-shaped pole pieces, spiral processing and non-spiral processing produce the same effect.

[0110] This technology is mainly applicable to the production of 3D micro-shaped current collectors and pole pieces, and is particularly suitable for micro-shaped molded devices that can improve the fast charging performance and extend the service life of lithium batteries. It solves the problem of how to efficiently and accurately form three-dimensional micro-shapes at the micron level on the surface of molded devices, and especially emphasizes the ability to finely control the height, spacing and morphology of the micro-shapes, which facilitates the misalignment of the upper and lower molding bosses during the molding process of 3D micro-shaped pole pieces or 3D micro-shaped current collectors, thereby significantly improving the fast charging performance and life of the battery.

[0111] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A micro-modeling device for surface processing of a molding device for 3D micro-modeling, characterized in that: It includes a carrier device, on which a laser processing system is slidably arranged, and also includes a laser diameter measuring system; The carrier device comprises a carrier (101), on which a clamping assembly is arranged for clamping the formed device, and further comprises a rotary torque motor (104), wherein the rotary torque motor (104) is used for driving the formed device to rotate; The laser processing system comprises a moving component, a laser output device (203) is arranged on the moving component, a laser rangefinder (401) is arranged on the laser output device (203), and the moving component is slidably arranged on the carrier (101); The laser diameter measurement system comprises a laser transmitter (302) and a receiver (303).

2. A 3D micro-molding device for surface processing of a molding component according to claim 1, characterized in that: The clamping assembly comprises a fixed block (102) and a slider (103); the slider (103) is slidably arranged on a carrier (101) via a track (105); the fixed block (102) is arranged in the moving direction of the slider (103); ejector pins (107) are arranged on opposite sides of the fixed block (102) and the slider (103); and the tips of the two groups of ejector pins (107) are on the same horizontal line.

3. A 3D micro-molding device for surface processing of a molding component according to claim 2, characterized in that: The moving component comprises an X-axis control system (204), a Y-axis control system (205) and a Z-axis control system (206); the X-axis control system (204) comprises an M-frame (201); the M-frame (201) is slidably arranged on the carrier (101) and is mounted above the slider (103).

4. The surface processing micro-modeling device for forming components for 3D micro-modeling according to claim 1, characterized in that: A gate frame (301) is arranged on one side of the fixed block (102) close to the sliding block (103); a forming device is arranged through the gate frame (301); and both the transmitter (302) and the receiver (303) are arranged on the gate frame (301) and are arranged symmetrically about the forming device axis.

5. The surface processing micro-modeling device for forming components for 3D micro-modeling according to claim 3, characterized in that: The X-axis control system (204), the Y-axis control system (205) and the Z-axis control system (206) all include a motor, a lead screw and a slide rail; the Y-axis control system (205) further includes a first fixed frame (208); the Z-axis control system (206) includes a second fixed frame (209); the second fixed frame (209) is slidably disposed on the first fixed frame (208); and the laser output device (203) is disposed on the second fixed frame (209).

6. The surface processing micro-modeling device for forming components for 3D micro-modeling according to claim 2, characterized in that: The slider (103) is provided with a fixing bolt (108), and the fixing bolt (108) is used to fix the position of the slider (103).

7. The surface processing micro-modeling device for forming components for 3D micro-modeling according to claim 1, characterized in that: The rotary torque motor (104) is arranged on a side of the fixed block (102) away from the slider (103), the output end of the rotary torque motor (104) is connected to a group of ejector pins (107), another group of ejector pins (107) is rotationally connected to the slider (103), and the horizontal position thereof is controlled by a telescopic adjustment block (109), and a grating ruler measuring device is also included.

8. The surface processing micro-modeling device for forming components for 3D micro-modeling according to claim 5, characterized in that: The laser rangefinder (401) is installed on a side of the laser output device (203) away from the M frame (201).

9. A method for surface processing micro-modeling of a molding device for 3D micro-modeling, comprising the micro-modeling device as claimed in claim 8, characterized in that: It also includes the following steps: S1, clamping the formed component by using two groups of ejector pins (107); S2, adjusting the parameters of the laser output device (203), and starting the laser diameter measuring system to measure the diameter of the formed component; S3, controlling the laser head of the laser output device (203) to carve along a straight line path parallel to the forming device through the moving component, and at the same time driving the forming device to rotate in a clockwise direction through the rotating torque motor (104); S4, when the laser reaches the designated end point, the forming device stops rotating, the moving assembly controls the laser output device (203) to return to the starting point, and the forming device rotates again according to a predetermined increment; S5, repeat step S4 until the entire surface is covered; S6, controlling the laser head of the laser output device (203) to carve along a straight line path parallel to the forming device through the moving component, and at the same time driving the forming device to rotate in a counterclockwise direction through the rotating torque motor (104); S7, repeat step S6 until the entire surface is covered.

10. The method for surface processing micro-modeling of a molding component for 3D micro-modeling according to claim 9, characterized in that: In step S2, the laser output device (203) parameters include the spot size and pulse frequency of the laser output device (203).

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