Metallic bond sintering grinding wheel

Abstract

The invention discloses a metallic bond sintered grinding wheel which comprises a base body and a grinding material, the grinding material is bonded to the end face of the base body through an adhesive, and the grinding material comprises the following raw materials: 40-60% of copper powder; 20 to 30 percent of tin powder; 15 to 25% of silver powder; and the balance of copper-tin alloy powder. The guiding property and self-sharpening property of the grinding material are enhanced by introducing the silver powder into the formula of the grinding material, the toughness of the binding agent is improved by adding the copper-tin alloy while the silver powder is utilized to realize strong retention and easy sintering, and the quality and the service life of the product are ensured.

Description

Technical Field

[0001] The invention relates to the technical field of sintered grinding wheels, in particular to a metal bond sintered grinding wheel. Background Art

[0002] Metal bond sintered grinding wheels are generally used in deep processing industries such as optical glass, sapphire glass, touch screen glass, precision ceramics, automotive parts, medical equipment, cemented carbide, semiconductors, etc. Their main functions are drilling, edge grinding or trimming.

[0003] When processing harder and more brittle materials, the lifespan and quality of traditional metal sintered grinding rods cannot meet the requirements.

[0004] Therefore, how to provide a metal bond sintered grinding wheel to solve the problems existing in the prior art is of great significance to its application. Summary of the invention

[0005] In view of this, the purpose of the present application is to provide a metal bond sintered grinding wheel to solve the problem that the lifespan and quality of traditional metal sintered grinding rods cannot meet the requirements when processing harder and more brittle materials.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A metal bond sintered grinding wheel comprises a base and an abrasive, wherein the abrasive is bonded to the end surface of the base by an adhesive;

[0008] The preparation of the grinding wheel comprises the following steps:

[0009] S1: weigh the abrasive raw materials;

[0010] S2: Mix the weighed abrasives and press them into a green body using a mold;

[0011] S3: Sintering the embryo into abrasives:

[0012] S4: The abrasive is bonded and fixed to the substrate by a bonding agent.

[0013] Preferably, the specific steps of S1 are as follows:

[0014] S1.1: According to the formula requirements of a certain ratio, copper powder, tin powder and silver powder are accurately weighed;

[0015] S1.2: First, put the accurately weighed silver powder into a beaker, add 100% alcohol of the total volume of the silver powder, and perform ultrasonic dispersion treatment for 8-15 minutes at a temperature of 40-50°C, then add copper powder, tin powder, and copper-tin alloy powder and perform ultrasonic treatment until the alcohol is completely evaporated;

[0016] S1.3: The ultrasonically treated powder, diamond and epoxy resin are mixed by ball milling in an acetone solution, and then stainless steel balls are added for ball milling. The materials are taken out, dried and sieved, the balls are separated, and the powder is crushed and granulated;

[0017] S1.4: Then mix the granulated diamond powder, 200# copper-tin alloy powder and a small amount of resin glue in a three-dimensional mixing material for 25-40 minutes, dry and sieve.

[0018] Preferably, in S1.1: copper powder, tin powder, silver powder and copper-tin alloy powder constitute the metal matrix, and the mass percentage of each component is as follows:

[0019] Copper powder: 40-60%;

[0020] Tin powder: 20-30%;

[0021] Silver powder: 15-25%;

[0022] Remaining amount of copper-tin alloy powder.

[0023] Preferably, in S1.3, the ball-to-material ratio is 5:1 (wt.%), the mass ratio of large and small balls (2 mm and 1 mm) is 4:1, the speed of the omnidirectional ball mill is 180-230 rpm, and the mixing is performed for 40-60 min.

[0024] Preferably, the specific steps of S2 are as follows:

[0025] The powder is evenly put into the cold pressing mold. The pressure acting on the mold is 2±0.5t / cm2. The pressure is maintained for 9-14s. After demolding, a cold pressed body with uniform density is obtained.

[0026] Preferably, the specific steps of S3 are as follows:

[0027] The cold-pressed green body in step S2 is placed in a sintering furnace, heated at a rate of 20-30°C / min, heated to 200-300°C and kept warm for 60-120min; heated to a sintering temperature of 700-800°C, kept warm for 40-80min, cooled naturally, and sintering is completed.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The introduction of silver powder into the abrasive formula of the present invention enhances the guiding property and self-sharpening property of the abrasive. While utilizing the silver powder to achieve strong holding force and easy sintering, the present invention adds copper-tin alloy to improve the toughness of the binder, thereby ensuring product quality and service life.

[0030] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application so that it can be implemented in accordance with the contents of the specification, and to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following is a detailed description of the preferred embodiments of the present application in conjunction with the accompanying drawings as follows.

[0031] Based on the detailed description of the specific embodiments of the present application in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other objects, advantages and features of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. In all drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.

[0033] Figure 1 It is a structural schematic diagram of the present invention.

[0034] In the figure: 100, substrate; 200, abrasive. DETAILED DESCRIPTION

[0035] To make the purpose, technical scheme and advantages of the embodiment of the present application clearer, the technical scheme in the embodiment of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the present application. Obviously, the described embodiment is a part of the embodiment of the present application, rather than all of the embodiments. In the following description, specific details such as specific configuration and components are provided only to help fully understand the embodiments of the present application. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. In addition, for clarity and brevity, the description of known functions and structures is omitted in the embodiment.

[0036] In addition, the present application may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplicity and clarity, and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0037] The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, B exists alone, and A and B exist at the same time. The term " / and" in this article describes another type of association object relationship, indicating that there can be two relationships. For example, A / and B can mean: A exists alone, and A and B exist alone. In addition, the character " / " in this article generally indicates that the previous and next associated objects are in an "or" relationship.

[0038] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusions.

[0039] See also Figure 1 , the present invention provides a technical solution of a metal bond sintered grinding wheel: comprising a base body and an abrasive, wherein the abrasive is bonded to the end surface of the base body by an adhesive;

[0040] The preparation of the grinding wheel includes the following steps:

[0041] S1: weigh the abrasive raw materials;

[0042] S2: Mix the weighed abrasives and press them into a green body using a mold;

[0043] S3: Sintering the embryo into abrasives:

[0044] S4: The abrasive is bonded and fixed to the substrate by a bonding agent.

[0045] The specific steps of S1 are as follows:

[0046] S1.1: According to the formula requirements of a certain ratio, copper powder, tin powder and silver powder are accurately weighed;

[0047] S1.2: First, put the accurately weighed silver powder into a beaker, add 100% alcohol of the total volume of the silver powder, and perform ultrasonic dispersion treatment for 8-15 minutes at a temperature of 40-50°C, then add copper powder, tin powder, and copper-tin alloy powder and perform ultrasonic treatment until the alcohol is completely evaporated;

[0048] S1.3: The ultrasonically treated powder, diamond and epoxy resin are mixed by ball milling in an acetone solution, and then stainless steel balls are added for ball milling. The materials are taken out, dried and sieved, the balls are separated, and the powder is crushed and granulated;

[0049] S1.4: Then mix the granulated diamond powder, 200# copper-tin alloy powder and a small amount of resin glue in a three-dimensional mixing material for 25-40 minutes, dry and sieve.

[0050] In S1.1: Copper powder, tin powder, silver powder and copper-tin alloy powder constitute the metal matrix, and the mass percentage of each component is as follows:

[0051] Copper powder 40-60%

[0052] Tin powder 20-30%

[0053] Silver powder 15-25%

[0054] Remaining amount of copper-tin alloy powder.

[0055] In S1.3, the ball-to-material ratio is 5:1 (wt.%), the mass ratio of large and small balls (2 mm and 1 mm) is 4:1, the speed of the omnidirectional ball mill is 180-230 rpm, and the mixing is performed for 40-60 min.

[0056] The specific steps of S2 are as follows:

[0057] The powder is evenly put into the cold pressing mold. The pressure acting on the mold is 2±0.5t / cm2. The pressure is maintained for 9-14s. After demolding, a cold pressed green body with uniform density is obtained.

[0058] The specific steps of S3 are as follows:

[0059] The cold-pressed green body in step S2 is placed in a sintering furnace, with a heating rate of 20-30°C / min, heated to 200-300°C and kept warm for 60-120min; heated to a sintering temperature of 700-800°C, kept warm for 40-80min, then heated to a maximum temperature of 880-950°C and kept warm for 60-90min, cooled naturally to complete sintering.

[0060] When used specifically, the raw materials are weighed according to the ratio of 40-60% copper powder, 20-30% tin powder, 15-25% copper-tin alloy powder as the remainder. Subsequently, the accurately weighed silver powder is first put into a beaker, and alcohol that accounts for 100% of the total volume of the silver powder is added, and ultrasonic dispersion treatment is performed for 8-15 minutes at a temperature of 40-50°C. Then, copper powder, tin powder, and copper-tin alloy powder are added and ultrasonic treatment is performed until the alcohol is completely evaporated; the ultrasonically treated powder is ball-milled and mixed with diamond and epoxy resin glue in an acetone solution, with a ball-to-material ratio of 5:1 (wt.%), a mass ratio of large and small balls (2mm and 1mm) of 4:1, the rotation speed of the omnidirectional ball mill is 180-230rpm, and the mixture is mixed for 40-60 minutes. The material is taken out, dried, sieved, the ball-to-material is separated, and the powder is crushed and granulated. ; Then the granulated diamond powder, 200# copper-tin alloy powder and a small amount of resin glue are mixed in the three-dimensional mixture for 25-40 minutes, dried and sieved; The powder is evenly put into the cold pressing mold, the pressure acting on the mold is 2±0.5t / cm2, the pressure is maintained for 9-14s, and a cold-pressed green body with uniform density is obtained after demoulding. The cold-pressed green body is put into a sintering furnace with a heating rate of 20-30℃ / min, and the temperature is raised to 200-300℃ and kept warm for 60-120min; the temperature is raised to a sintering temperature of 700-800℃, kept warm for 40-80min, and cooled naturally to complete sintering. The abrasive is bonded and fixed to the substrate with a binder, and a chip groove is set between adjacent abrasives 200. Both ends of the abrasive 200 are provided with arcs to facilitate chip removal.

[0061] The above description is only the preferred embodiment of the present invention, which does not limit the protection scope of the present invention. For those skilled in the art, the present invention can be modified and varied in various ways. Within the spirit and principle of the present invention, any change, modification, replacement, integration and parameter change of these embodiments by conventional substitution or capable of achieving the same function without departing from the principle and spirit of the present invention shall fall within the protection scope of the present invention.

Claims

1. A metal bond sintered grinding wheel, characterized in that: It comprises a substrate (100) and an abrasive (200), wherein the abrasive (200) is bonded to the end surface of the substrate (100) by an adhesive; The preparation of the grinding wheel comprises the following steps: S1: weigh the abrasive raw materials; S2: Mix the weighed abrasives and press them into a green body using a mold; S3: Sintering the green body into abrasives: S4: The abrasive is bonded and fixed to the substrate by a bonding agent.

2. According to the metal bond sintered grinding wheel of claim 1, the specific steps of S1 are as follows: S1.1: According to the formula requirements of a certain ratio, copper powder, tin powder and silver powder are accurately weighed; S1.2: First, put the accurately weighed silver powder into a beaker, add 100% alcohol of the total volume of the silver powder, and perform ultrasonic dispersion treatment for 8-15 minutes at a temperature of 40-50°C, then add copper powder, tin powder, and copper-tin alloy powder and perform ultrasonic treatment until the alcohol is completely evaporated; S1.3: The ultrasonically treated powder, diamond and epoxy resin are mixed by ball milling in an acetone solution, and then stainless steel balls are added for ball milling. The materials are taken out, dried and sieved, the balls are separated, and the powder is crushed and granulated; S1.4: Then mix the granulated diamond powder, 200# copper-tin alloy powder and a small amount of resin glue in a three-dimensional mixing material for 25-40 minutes, dry and sieve.

3. The metal bond sintered grinding wheel according to claim 2, characterized in that: In S1.1, copper powder, tin powder, silver powder and copper-tin alloy powder constitute the metal matrix, and the mass percentage of each component is as follows: Copper powder: 40-60%; Tin powder: 20-30%; Silver powder: 15-25%; Remaining amount of copper-tin alloy powder.

4. The metal bond sintered grinding wheel according to claim 3, characterized in that: In the S1.3, the ball-to-material ratio is 5:1 (wt.%), the mass ratio of large and small balls (2 mm and 1 mm) is 4:1, the speed of the omnidirectional ball mill is 180-230 rpm, and the mixing is performed for 40-60 minutes.

5. A metal bond sintered grinding wheel as claimed in claim 4, characterized in that: The specific steps of S2 are as follows: The powder is evenly put into the cold pressing mold. The pressure acting on the mold is 2±0.5t / cm2. The pressure is maintained for 9-14s. After demolding, a cold pressed green body with uniform density is obtained.

6. The metal bond sintered grinding wheel according to claim 5, characterized in that: The specific steps of S3 are as follows: The cold-pressed green body in step S2 is placed in a sintering furnace, heated at a rate of 20-30°C / min, heated to 200-300°C and kept warm for 60-120min; heated to a sintering temperature of 700-800°C, kept warm for 40-80min, cooled naturally, and sintering is completed.

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