A method and apparatus for die cutting a TP foam tape

Abstract

The application discloses a die cutting method and device for TP foam adhesive, which eliminates internal stress of the material and forms a micro plastic deformation layer by pre-pressing the release base film and the foam adhesive material, thereby reducing cutting rebound, cutting burrs, collapse and warping; the base material of the pre-pressed material is peeled off, then the foam double-sided adhesive is die cut by using a die cutting machine, and the foam waste is peeled off to obtain a die cut material; the die cutting machine dynamically adjusts the feeding rate according to the die cutting stage during the die cutting process, so as to reduce the initial impact on the material and prevent the material from being bonded, and eliminate the gel migration; the feature point coordinates of the die cut material are obtained based on a visual recognition tool, and the die cut material is positioned and compensated according to the feature point coordinates by using an elastic limiting mechanism, then the die cut material is aligned and attached with the release film to obtain the TP foam adhesive, so that the alignment accuracy of the multi-layer material is improved, and the high-precision attachment of the complex irregular profile such as the TP foam adhesive of a mobile phone is met.

Description

Technical Field

[0001] This application relates to the field of die-cutting technology, and in particular to a die-cutting method and apparatus for TP foam adhesive. Background Technology

[0002] TP foam adhesive is a crucial buffer and bonding material between the touch panel (TP) and the display screen, and its die-cutting precision directly affects the assembly quality of the screen components. Currently, TP foam adhesive is typically produced using a traditional stamping process, employing a die-cutting tool at a fixed angle (usually a 90° right-angle blade) to complete the switching in one go, followed by manual or mechanical removal of waste material.

[0003] However, the high pressure of traditional stamping processes causes instantaneous deformation of the material, concentrating stress at the cutting edge and resulting in burrs, collapse, or warping. Fixed-angle cutting tools cannot adapt to the elastic recoil of the material, causing colloid migration. Furthermore, mechanical positioning methods lead to large misalignment in multi-layer composite materials. Therefore, a high-precision die-cutting method for TP foam adhesive is urgently needed. Summary of the Invention

[0004] This application provides a die-cutting method and apparatus for TP foam adhesive to solve the technical problems of stress concentration and large alignment deviation in the existing TP foam adhesive die-cutting process.

[0005] To address the aforementioned technical problems, in a first aspect, embodiments of this application provide a die-cutting method for TP foam adhesive, comprising:

[0006] The release film and foam adhesive material are pre-pressed to obtain a pre-pressed material, wherein the foam adhesive material includes a substrate and foam double-sided adhesive.

[0007] The substrate of the pre-compressed material is peeled off, and then the foam double-sided tape is die-cut using a die-cutting machine. The foam waste is peeled off to obtain the die-cut material. The die-cutting machine dynamically adjusts the feed rate according to the die-cutting stage during the die-cutting process.

[0008] The feature point coordinates of the die-cutting material are obtained using a visual recognition tool, and the die-cutting material is positioned and compensated according to the feature point coordinates using an elastic limiting mechanism. Then, the die-cutting material is aligned and bonded to the release film to obtain TP foam adhesive.

[0009] In some embodiments, the pre-compression of the release liner and the foam adhesive material to obtain a pre-compressed material includes:

[0010] The release film and the foam adhesive material are respectively conveyed to the pre-compression platform, and the release film and the foam adhesive material are pre-compressed twice. The pressure of the first pre-compression is 0.5MPa to 0.8MPa, and the pressure of the second pre-compression is 1.2MPa to 1.5MPa.

[0011] In some embodiments, the surface of the pre-compression platform is provided with an array of micro-protrusions, the height of which is 20μm to 50μm.

[0012] In some embodiments, the method of using a die-cutting machine to die-cut the pre-compression material to obtain die-cut material includes:

[0013] Based on the die-cutting thickness of the pre-compression material, the die-cutting parameters of the die-cutting machine are determined. The die-cutting parameters include the roller cutter entry angle and the rotation speed of each die-cutting stage. The die-cutting stage includes the entry period, the stabilization period, and the retraction period.

[0014] The target roller cutter corresponding to the cutting angle of the roller cutter is invoked, and the rotation speed of the target roller cutter is controlled in each die-cutting stage to die-cut the pre-pressed material to obtain die-cut material.

[0015] In some embodiments, determining the die-cutting parameters of the die-cutting machine based on the die-cutting thickness of the pre-compression material includes:

[0016] When the die-cutting thickness of the pre-compression material is not greater than the preset thickness, the die-cutting parameters of the die-cutting machine are determined to be the first preset parameters;

[0017] When the die-cutting thickness of the pre-pressed material is greater than the preset thickness, the die-cutting parameters of the die-cutting machine are calculated based on the preset die-cutting parameter calculation formula.

[0018] In some embodiments, the expression for the preset die-cutting parameter calculation formula is:

[0019]

[0020] Where h is the die-cutting thickness of the pre-pressed material, r is the radius of the roller cutter, θ is the cutting angle of the roller cutter, t is the contact time between the roller cutter and the pre-pressed material, v1 is the rotation speed during the cutting phase, v2 is the rotation speed during the stabilization phase, v3 is the rotation speed during the retraction phase, v′ is the first preset rotation speed, and v″ is the second preset rotation speed.

[0021] In some embodiments, the positioning compensation of the die-cutting material using the elastic limiting mechanism based on the coordinates of the feature points includes:

[0022] The positional deviation of the die-cutting material is determined based on the coordinates of the feature points.

[0023] When the positional deviation exceeds a preset value, a compensation amount for the die-cutting material is generated.

[0024] The elastic limiting mechanism is used to position and compensate the die-cutting material according to the compensation amount.

[0025] In some embodiments, the elastic limiting mechanism includes a piezoelectric ceramic drive module and a magnetorheological damper connected to the positioning platform, wherein the damping coefficient of the magnetorheological damper can be dynamically adjusted with the compensation amount.

[0026] Secondly, embodiments of this application also provide a die-cutting apparatus for TP foam adhesive, comprising:

[0027] A pre-compression mechanism is used to pre-compress the release film and the foam adhesive material to obtain a pre-compressed material, wherein the foam adhesive material includes a substrate and foam double-sided adhesive.

[0028] The die-cutting mechanism is used to peel off the substrate of the pre-compressed material, and then use a die-cutting machine to die-cut the foam double-sided tape and peel off the foam waste to obtain the die-cut material. The die-cutting machine dynamically adjusts the feed rate according to the die-cutting stage during the die-cutting process.

[0029] The bonding mechanism is used to obtain the feature point coordinates of the die-cutting material based on a visual recognition tool, and to use an elastic limiting mechanism to position and compensate the die-cutting material according to the feature point coordinates. Then, the die-cutting material is aligned and bonded with the release film to obtain TP foam adhesive.

[0030] Thirdly, embodiments of this application also provide a die-cutting device, including a processor and a memory, wherein the memory is used to store a computer program, and the computer program, when executed by the processor, implements the die-cutting method for TP foam adhesive as described in the first aspect.

[0031] Compared with the prior art, this application has at least the following beneficial effects:

[0032] This application pre-compresses the release film and foam adhesive material to eliminate internal stress and form a micro-plastic deformation layer, thereby reducing cutting springback and minimizing cutting burrs, collapse, and warping. The pre-compressed material is then peeled off, and the foam double-sided adhesive is die-cut using a die-cutting machine, removing waste foam material to obtain die-cut material. The die-cutting machine dynamically adjusts the feed rate according to the die-cutting stage to reduce initial impact on the material and prevent material adhesion, eliminating adhesive migration. Based on a visual recognition tool, the feature point coordinates of the die-cut material are obtained, and an elastic limiting mechanism is used to position and compensate the die-cut material according to these coordinates. The die-cut material is then aligned and bonded to the release film to obtain TP foam adhesive, improving the alignment accuracy of multi-layer materials and meeting the high-precision bonding requirements of complex irregular contours such as TP foam adhesive for mobile phones. Attached Figure Description

[0033] Figure 1 This is a schematic flowchart illustrating the die-cutting method for TP foam adhesive according to an embodiment of this application;

[0034] Figure 2This is a schematic diagram of the TP foam adhesive shown in the embodiments of this application;

[0035] Figure 3 This is a structural block diagram of a die-cutting device for TP foam adhesive shown in an embodiment of this application;

[0036] Figure 4 This is a structural block diagram of a die-cutting device shown in an embodiment of this application. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0038] Please refer to Figure 1 , Figure 1 This is a flowchart illustrating a die-cutting method for TP foam adhesive provided in an embodiment of this application. The die-cutting method for TP foam adhesive in this embodiment includes steps S101 to S103, detailed below:

[0039] Step S101: Pre-press the release film and foam adhesive material to obtain pre-pressed material, wherein the foam adhesive material includes a substrate and foam double-sided adhesive.

[0040] In this step, the pre-compression operation can reduce deformation or defects caused by uneven internal stress of the material, thereby improving the accuracy and yield of subsequent processing.

[0041] In some embodiments, step S101 includes:

[0042] The release film and the foam adhesive material are respectively conveyed to the pre-compression platform, and the release film and the foam adhesive material are pre-compressed twice. The pressure of the first pre-compression is 0.5MPa to 0.8MPa, and the pressure of the second pre-compression is 1.2MPa to 1.5MPa.

[0043] In this embodiment, the traditional process uses single pre-compression or direct die-cutting, which does not fully release the internal stress of the material, resulting in edge springback (springback amount > 0.2mm) and dimensional deviation (±0.3mm) after cutting. In this embodiment, the first pre-compression can eliminate the internal stress of the material, eliminate local deformation, and eliminate interface bubbles between the foam double-sided adhesive and the release film; the second pre-compression can make the pre-compression material form a micro-plastic deformation layer, stabilize the material structure and enhance the interfacial bonding force, and form a uniform stress distribution, so that the elastic shrinkage of the foam during die-cutting is reduced by 60%, thereby reducing the instantaneous deformation of the material and improving the die-cutting quality.

[0044] Optionally, the surface of the pre-compression platform is provided with an array of micro-protrusions, the height of which is 20μm to 50μm, to effectively release the internal stress of the material in conjunction with the pre-compression operation, thereby improving the uniformity and stability of the material, avoiding material delamination or damage caused by stress concentration, and improving processing quality and material reliability.

[0045] Step S102: Peel off the substrate of the pre-compressed material, and then use a die-cutting machine to die-cut the foam double-sided tape and peel off the foam waste to obtain the die-cut material. The die-cutting machine dynamically adjusts the feed rate according to the die-cutting stage during the die-cutting process.

[0046] In this step, the pre-compressed material is peeled off from the substrate, and the foam double-sided adhesive material is placed into the die-cutting machine. The die-cutting program is started according to the preset die-cutting parameters and process requirements. During the die-cutting process, the die-cutting machine dynamically adjusts the feed rate according to different die-cutting stages to ensure cutting accuracy and efficiency. After die-cutting is completed, the foam waste generated during cutting is peeled off manually or by automated equipment, ultimately obtaining die-cut material that meets the design requirements.

[0047] Traditional vertical stamping methods are prone to edge stress concentration, leading to poor die-cutting quality. Therefore, this embodiment employs a roller die-cutting machine. By dynamically adjusting the feed rate of the die-cutting machine, die-cutting accuracy and processing efficiency can be effectively improved, avoiding cutting deviations or material waste caused by a fixed feed rate. Simultaneously, dynamic adjustment can adapt to the process requirements of different die-cutting stages, ensuring the integrity and consistency of the foam double-sided adhesive material, thereby improving the quality and reliability of the final die-cut material.

[0048] In some embodiments, the method of die-cutting the pre-compression material using a die-cutting machine to obtain die-cut material includes:

[0049] Based on the die-cutting thickness of the pre-compression material, the die-cutting parameters of the die-cutting machine are determined. The die-cutting parameters include the roller cutter entry angle and the rotation speed of each die-cutting stage. The die-cutting stage includes the entry period, the stabilization period, and the retraction period.

[0050] The target roller cutter corresponding to the cutting angle of the roller cutter is invoked, and the rotation speed of the target roller cutter is controlled in each die-cutting stage to die-cut the pre-pressed material to obtain die-cut material.

[0051] In this embodiment, the die-cutting thickness is the thickness of the foam double-sided tape. Because the die-cutting machine's rollers and the pre-pressed material conveyed by the rollers begin contacting each other before they reach a horizontal plane, the rollers create an angled surface on the horizontal cut of the foam double-sided tape, resulting in poor die-cutting quality. Therefore, this embodiment selects a roller with an appropriate entry angle and rotation speed based on the die-cutting thickness of the pre-pressed material, reducing the slope of the foam double-sided tape's angled surface. This effectively improves die-cutting accuracy and processing efficiency, reduces material waste, and ensures the quality and consistency of the die-cut material.

[0052] Optionally, determining the die-cutting parameters of the die-cutting machine based on the die-cutting thickness of the pre-compression material includes:

[0053] When the die-cutting thickness of the pre-compression material is not greater than the preset thickness, the die-cutting parameters of the die-cutting machine are determined to be the first preset parameters;

[0054] When the die-cut thickness of the pre-compression material is greater than the preset thickness, the die-cutting parameters of the die-cutting machine are calculated based on the preset die-cutting parameter calculation formula; the expression of the preset die-cutting parameter calculation formula is:

[0055]

[0056] Where h is the die-cutting thickness of the pre-pressed material, r is the radius of the roller cutter, θ is the cutting angle of the roller cutter, t is the contact time between the roller cutter and the pre-pressed material, v1 is the rotation speed during the cutting phase, v2 is the rotation speed during the stabilization phase, v3 is the rotation speed during the retraction phase, v′ is the first preset rotation speed, and v″ is the second preset rotation speed.

[0057] In this optional embodiment, when the die-cutting thickness is not greater than a preset thickness, the contact depth between the roller and the pre-pressed material is shallow, and the bevel formed by the die-cutting is very short, thus not affecting the die-cutting quality. When the die-cutting thickness is greater than the preset thickness, the roller cutting angle is calculated based on the die-cutting thickness of the pre-pressed material and the roller radius. Combined with the contact time between the roller and the material, the rotational speed during the cutting period is calculated to improve the die-cutting quality. The contact time between the roller and the material is a preset value, and the first preset rotational speed and the second preset rotational speed are preset values ​​for the reference angular momentum and the average external torque.

[0058] Step S103: Based on the visual recognition tool, the feature point coordinates of the die-cutting material are obtained, and the elastic limiting mechanism is used to position and compensate the die-cutting material according to the feature point coordinates. Then, the die-cutting material is aligned and bonded with the release film to obtain TP foam adhesive.

[0059] In this step, such as Figure 2As shown, TP foam adhesive includes a release liner, die-cut foam double-sided adhesive, and a release film. This embodiment uses a visual recognition tool (such as a CCD camera) to acquire the feature point coordinates of the die-cut material, and then combines this with an elastic limiting mechanism for positioning compensation, achieving high-precision alignment and bonding. This not only improves the accuracy of the alignment between the die-cut material and the release film, reducing potential offsets or misalignments during bonding, but also ensures the quality and consistency of the final TP foam adhesive product. Furthermore, automation and precision methods effectively improve production efficiency, reduce material waste and labor costs, thereby optimizing the overall production process.

[0060] In some embodiments, the positioning compensation of the die-cutting material using the elastic limiting mechanism based on the feature point coordinates includes:

[0061] The positional deviation of the die-cutting material is determined based on the coordinates of the feature points.

[0062] When the positional deviation exceeds a preset value, a compensation amount for the die-cutting material is generated.

[0063] The elastic limiting mechanism is used to position and compensate the die-cutting material according to the compensation amount.

[0064] Optionally, the elastic limiting mechanism includes a piezoelectric ceramic drive module and a magnetorheological damper connected to the positioning platform, wherein the damping coefficient of the magnetorheological damper can be dynamically adjusted according to the compensation amount.

[0065] In this embodiment, for example, an optical marker image of the material surface after pre-compression is acquired by a CCD camera; the marker contour is extracted using an image processing algorithm (Gaussian filtering + Canny edge detection); the center coordinates of the marker are fitted by the least squares method, and the position deviation ΔP is calculated; a compensation vector V = K·ΔP (K is the material elastic coefficient) is generated based on the visual positioning result; the piezoelectric ceramic module is driven to adjust the position of the limiting post, with a compensation accuracy of ±0.01mm; and the magnetorheological damper adjusts the damping coefficient in real time to ensure compensation stability.

[0066] To perform the die-cutting method for TP foam adhesive corresponding to the above method embodiments, in order to achieve the corresponding functions and technical effects, see [link to documentation]. Figure 3 , Figure 3 This diagram illustrates a structural block diagram of a die-cutting apparatus for TP foam adhesive according to an embodiment of this application. For ease of explanation, only the parts relevant to this embodiment are shown. The die-cutting apparatus for TP foam adhesive provided in this embodiment includes:

[0067] The pre-compression mechanism 301 is used to pre-compress the release film and the foam adhesive material to obtain the pre-compressed material, wherein the foam adhesive material includes a substrate and foam double-sided adhesive.

[0068] The die-cutting mechanism 302 is used to peel off the substrate of the pre-compressed material, and then use a die-cutting machine to die-cut the foam double-sided tape and peel off the foam waste to obtain the die-cut material. The die-cutting machine dynamically adjusts the feed rate according to the die-cutting stage during the die-cutting process.

[0069] The bonding mechanism 303 is used to obtain the feature point coordinates of the die-cutting material based on a visual recognition tool, and to use an elastic limiting mechanism to perform positioning compensation on the die-cutting material according to the feature point coordinates, and then to align and bond the die-cutting material with the release film to obtain TP foam adhesive.

[0070] In some embodiments, the pre-compression mechanism 301 is specifically used for:

[0071] The release film and the foam adhesive material are respectively conveyed to the pre-compression platform, and the release film and the foam adhesive material are pre-compressed twice. The pressure of the first pre-compression is 0.5MPa to 0.8MPa, and the pressure of the second pre-compression is 1.2MPa to 1.5MPa.

[0072] Optionally, the surface of the pre-compression platform is provided with an array of micro-protrusions, the height of which is 20μm to 50μm.

[0073] In some embodiments, the die-cutting mechanism 302 is specifically used for:

[0074] Based on the die-cutting thickness of the pre-compression material, the die-cutting parameters of the die-cutting machine are determined. The die-cutting parameters include the roller cutter entry angle and the rotation speed of each die-cutting stage. The die-cutting stage includes the entry period, the stabilization period, and the retraction period.

[0075] The target roller cutter corresponding to the cutting angle of the roller cutter is invoked, and the rotation speed of the target roller cutter is controlled in each die-cutting stage to die-cut the pre-pressed material to obtain die-cut material.

[0076] In some embodiments, the die-cutting mechanism 302 is further configured to:

[0077] When the die-cutting thickness of the pre-compression material is not greater than the preset thickness, the die-cutting parameters of the die-cutting machine are determined to be the first preset parameters;

[0078] When the die-cutting thickness of the pre-pressed material is greater than the preset thickness, the die-cutting parameters of the die-cutting machine are calculated based on the preset die-cutting parameter calculation formula.

[0079] Optionally, the expression for the preset die-cutting parameter calculation formula is:

[0080]

[0081] Where h is the die-cutting thickness of the pre-pressed material, r is the radius of the roller cutter, θ is the cutting angle of the roller cutter, t is the contact time between the roller cutter and the pre-pressed material, v1 is the rotation speed during the cutting phase, v2 is the rotation speed during the stabilization phase, v3 is the rotation speed during the retraction phase, v′ is the first preset rotation speed, and v″ is the second preset rotation speed.

[0082] In some embodiments, the bonding mechanism 303 is specifically used for:

[0083] The positional deviation of the die-cutting material is determined based on the coordinates of the feature points.

[0084] When the positional deviation exceeds a preset value, a compensation amount for the die-cutting material is generated.

[0085] The elastic limiting mechanism is used to position and compensate the die-cutting material according to the compensation amount.

[0086] Optionally, the elastic limiting mechanism includes a piezoelectric ceramic drive module and a magnetorheological damper connected to the positioning platform, wherein the damping coefficient of the magnetorheological damper can be dynamically adjusted according to the compensation amount.

[0087] The die-cutting device for TP foam adhesive described above can implement the die-cutting method for TP foam adhesive in the above method embodiments. The options in the above method embodiments are also applicable to this embodiment, and will not be detailed here. The remaining contents of this application embodiment can be referred to the contents of the above method embodiments, and will not be repeated in this embodiment.

[0088] Figure 4 This is a schematic diagram of the structure of a die-cutting device provided in one embodiment of this application. Figure 4 As shown, the die-cutting device 4 of this embodiment includes: at least one processor 40 ( Figure 4 (Only one is shown in the diagram), memory 41, and computer program 42 stored in said memory 41 and executable on said at least one processor 40, wherein said processor 40 executes said computer program 42 to implement the steps in any of the above method embodiments.

[0089] The die-cutting equipment may include, but is not limited to, a processor 40 and a memory 41. Those skilled in the art will understand that... Figure 4 This is merely an example of the die-cutting device 4 and does not constitute a limitation on the die-cutting device 4. It may include more or fewer components than shown in the figure, or combine certain components, or different components, such as input / output devices, network access devices, etc.

[0090] The processor 40 may be a Central Processing Unit (CPU), or it may be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0091] In some embodiments, the memory 41 may be an internal storage unit of the die-cutting device 4, such as a hard disk or memory of the die-cutting device 4. In other embodiments, the memory 41 may be an external storage device of the die-cutting device 4, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the die-cutting device 4. Furthermore, the memory 41 may include both internal and external storage units of the die-cutting device 4. The memory 41 is used to store operating systems, applications, bootloaders, data, and other programs, such as the program code of computer programs. The memory 41 can also be used to temporarily store data that has been output or will be output.

[0092] In addition, embodiments of this application also provide a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps in any of the above method embodiments.

[0093] This application provides a computer program product that, when run on a die-cutting device, causes the die-cutting device to execute the steps described in the above-described method embodiments.

[0094] In the several embodiments provided in this application, it will be understood that each block in the flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those shown in the figures. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved.

[0095] If the aforementioned functions are implemented as software functional modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0096] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this application. It should be understood that the above descriptions are merely specific embodiments of this application and are not intended to limit the scope of protection of this application. In particular, it should be noted that any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application for those skilled in the art.

Claims

1. A method of die cutting a TP foam tape, characterized by, The application relates to a TP foam adhesive production method and device. The method comprises the following steps: pre-pressing a release bottom film and a foam adhesive material to obtain pre-pressed material, wherein the foam adhesive material comprises a base material and foam double-sided adhesive tape; peeling off the base material of the pre-pressed material, and then using a die-cutting machine to die-cut the foam double-sided adhesive tape and peel off foam waste to obtain die-cut material, wherein the die-cutting machine dynamically adjusts the feeding speed according to the die-cutting stage during the die-cutting process; obtaining feature point coordinates of the die-cut material based on a visual recognition tool, and then using an elastic limiting mechanism to position and compensate the die-cut material according to the feature point coordinates, and then aligning and bonding the die-cut material with the release film to obtain TP foam adhesive. The method comprises the following steps: pre-pressing a release bottom film and a foam adhesive material to obtain pre-pressed material, wherein the foam adhesive material comprises a base material and foam double-sided adhesive tape; peeling off the base material of the pre-pressed material, and then using a die-cutting machine to die-cut the foam double-sided adhesive tape and peel off foam waste to obtain die-cut material, wherein the die-cutting machine dynamically adjusts the feeding speed according to the die-cutting stage during the die-cutting process; obtaining feature point coordinates of the die-cut material based on a visual recognition tool, and then using an elastic limiting mechanism to position and compensate the die-cut material according to the feature point coordinates, and then aligning and bonding the die-cut material with the release film to obtain TP foam adhesive. The method comprises the following steps: pre-pressing a release bottom film and a foam adhesive material to obtain pre-pressed material, wherein the foam adhesive material comprises a base material and foam double-sided adhesive tape; peeling off the base material of the pre-pressed material, and then using a die-cutting machine to die-cut the foam double-sided adhesive tape and peel off foam waste to obtain die-cut material, wherein the die-cutting machine dynamically adjusts the feeding speed according to the die-cutting stage during the die-cutting process; obtaining feature point coordinates of the die-cut material based on a visual recognition tool, and then using an elastic limiting mechanism to position and compensate the die-cut material according to the feature point coordinates, and then aligning and bonding the die-cut material with the release film to obtain TP foam adhesive. The method comprises the following steps: pre-pressing a release bottom film and a foam adhesive material to obtain pre-pressed material, wherein the foam adhesive material comprises a base material and foam double-sided adhesive tape; peeling off the base material of the pre-pressed material, and then using a die-cutting machine to die-cut the foam double-sided adhesive tape and peel off foam waste to obtain die-cut material, wherein the die-cutting machine dynamically adjusts the feeding speed according to the die-cutting stage during the die-cutting process; obtaining feature point coordinates of the die-cut material based on a visual recognition tool, and then using an elastic limiting mechanism to position and compensate the die-cut material according to the feature point coordinates, and then aligning and bonding the die-cut material with the release film to obtain TP foam adhesive. The method comprises the following steps: pre-pressing a release bottom film and a foam adhesive material to obtain pre-pressed material, wherein the foam adhesive material comprises a base material and foam double-sided adhesive tape; peeling off the base material of the pre-pressed material, and then using a die-cutting machine to die-cut the foam double-sided adhesive tape and peel off foam waste to obtain die-cut material, wherein the die-cutting machine dynamically adjusts the feeding speed according to the die-cutting stage during the die-cutting process; obtaining feature point coordinates of the die-cut material based on a visual recognition tool, and then using an elastic limiting mechanism to position and compensate the die-cut material according to the feature point coordinates, and then aligning and bonding the die-cut material with the release film to obtain TP foam adhesive. The method comprises the following steps: pre-pressing a release bottom film and a foam adhesive material to obtain pre-pressed material, wherein the foam adhesive material comprises a base material and foam double-sided adhesive tape; peeling off the base material of the pre-pressed material, and then using a die-cutting machine to die-cut the foam double-sided adhesive tape and peel off foam waste to obtain die-cut material, wherein the die-cutting machine dynamically adjusts the feeding speed according to the die-cutting stage during the die-cutting process; obtaining feature point coordinates of the die-cut material based on a visual recognition tool, and then using an elastic limiting mechanism to position and compensate the die-cut material according to the feature point coordinates, and then aligning and bonding the die-cut material with the release film to obtain TP foam adhesive.

2. The method of claim 1, wherein the TP foam tape is a double-coated tape. The method comprises the following steps: pre-pressing a release bottom film and a foam adhesive material to obtain pre-pressed material, wherein the foam adhesive material comprises a base material and foam double-sided adhesive tape; peeling off the base material of the pre-pressed material, and then using a die-cutting machine to die-cut the foam double-sided adhesive tape and peel off foam waste to obtain die-cut material, wherein the die-cutting machine dynamically adjusts the feeding speed according to the die-cutting stage during the die-cutting process; obtaining feature point coordinates of the die-cut material based on a visual recognition tool, and then using an elastic limiting mechanism to position and compensate the die-cut material according to the feature point coordinates, and then aligning and bonding the die-cut material with the release film to obtain TP foam adhesive. The method comprises the following steps: pre-pressing a release bottom film and a foam adhesive material to obtain pre-pressed material, wherein the foam adhesive material comprises a base material and foam double-sided adhesive tape; peeling off the base material of the pre-pressed material, and then using a die-cutting machine to die-cut the foam double-sided adhesive tape and peel off foam waste to obtain die-cut material, wherein the die-cutting machine dynamically adjusts the feeding speed according to the die-cutting stage during the die-cutting process; obtaining feature point coordinates of the die-cut material based on a visual recognition tool, and then using an elastic limiting mechanism to position and compensate the die-cut material according to the feature point coordinates, and then aligning and bonding the die-cut material with the release film to obtain TP foam adhesive.

3. The method of claim 2, wherein the TP foam tape is cut by a die cutter. ​ 4. The method of claim 1, wherein the TP foam tape is a double-coated tape. ​ ​ ​ 5. The method of claim 4, wherein the TP foam tape is cut by a die cutter. ​ wherein h is the die-cut thickness of the pre-press material, r is the radius of the roller knife, θ is the roller knife cutting angle, t is the contact time of the roller knife with the pre-press material, v1 is the rotation rate during the cutting-in period, v2 is the rotation rate during the stable period, v3 is the rotation rate during the cutting-out period, v ' is a first pre-set rotation rate, and v" is a second pre-set rotation rate.

6. The method of claim 1, wherein the TP foam tape is a double-coated tape. ​ ​ ​ ​ 7. The method of claim 6, wherein the TP foam tape is cut by a die cutter. ​ 8. A die cutting apparatus for TP foam glue, characterized by, ​ ​ ​ The fitting mechanism is used for acquiring feature point coordinates of the die-cut material based on a visual recognition tool, positioning and compensating the die-cut material according to the feature point coordinates by using an elastic limiting mechanism, aligning and fitting the die-cut material with the release film, and obtaining TP foam rubber; The die-cutting mechanism is specifically used for: According to the die-cutting thickness of the pre-pressing material, the die-cutting parameters of the die-cutting machine are determined, the die-cutting parameters include the roll cutter cutting angle and the rotation rate of each die-cutting stage, and the die-cutting stage includes the cutting-in period, the stable period and the roll retraction period; The target roll cutter corresponding to the roll cutter cutting angle is called, and the rotation rate of the target roll cutter in each die-cutting stage is controlled to die-cut the pre-pressing material, and the die-cutting material is obtained.

9. A die cutting apparatus characterized by, The method comprises a processor and a memory, the memory is used for storing a computer program, and the computer program is executed by the processor to realize the die-cutting method of the TP foam rubber as claimed in any one of claims 1 to 7.

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