Support structure, manufacturing method thereof, and electronic device

Abstract

The invention provides a supporting structure, a manufacturing method thereof and electronic equipment, the supporting structure comprises a first composite layer and a first heat conduction layer, the first composite layer is attached to at least one side of the first heat conduction layer, and the first composite layer is in heat conduction connection with the first heat conduction layer, the first composite layer comprises a first rubber main body and first fibers arranged in the first rubber main body, the hardness of the first fibers is higher than that of the first rubber main body, and the heat conductivity coefficient of the first fibers is higher than that of the first rubber main body. The overall density of the first composite layer is smaller than that of the metal material, so that weight reduction of the supporting structure can be achieved; the first fibers are high in strength, so that the overall strength of the first composite layer can be improved, and the strength performance of the supporting structure is guaranteed; the first heat conduction layer is arranged on one side of the first composite layer, so that the overall heat absorption capacity of the supporting structure can be improved, and loss of heat in a connecting area of the supporting structure and a display module and other heating modules connected with the supporting structure is accelerated.

Description

Technical Field

[0001] The present application belongs to the technical field of display devices, and more specifically, to a supporting structure, a manufacturing method thereof, and an electronic device. Background Art

[0002] As technology continues to advance, the need for weight reduction in electronic devices such as mobile phones and tablets is becoming more urgent. In electronic devices, the display module is an important component, and a high-strength support structure is provided on one side. The support structure is connected to the display module and plays a key role in supporting the display module. However, it is difficult for a high-strength support structure to simultaneously take into account the two key performances of weight reduction and heat dissipation. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a support structure, a manufacturing method thereof and an electronic device to solve the technical problem in the prior art that it is difficult for a high-strength support structure to simultaneously take into account weight reduction and heat dissipation.

[0004] To achieve the above purpose, the technical solution adopted in this application is:

[0005] In a first aspect, a support structure is provided, comprising:

[0006] A first heat conducting layer;

[0007] A first composite layer, along the thickness direction of the first heat-conducting layer, the first composite layer is attached to at least one side of the first heat-conducting layer and is thermally connected to the first heat-conducting layer;

[0008] The first composite layer includes a first adhesive body and first fibers disposed in the first adhesive body, the hardness of the first fibers is higher than the hardness of the first adhesive body, and the thermal conductivity of the first fibers is higher than the thermal conductivity of the first adhesive body.

[0009] In some embodiments, the heat-conducting layer is a first heat-conducting layer, the supporting structure further comprises a second composite layer, the first composite layer and the second composite layer are respectively arranged on two opposite sides of the first heat-conducting layer, the first heat-conducting layer is sealed and arranged between the first composite layer and the second composite layer, and is heat-conductingly connected to the second composite layer; wherein,

[0010] The second composite layer includes a second adhesive body and second fibers disposed in the second adhesive body, the hardness of the second fibers is higher than the hardness of the second adhesive body, and the thermal conductivity of the second fibers is higher than the thermal conductivity of the second adhesive body.

[0011] In some embodiments, an edge of the second adhesive body is sealed to an edge of the first adhesive body, so that the first heat conductive layer is sealed between the first composite layer and the second composite layer.

[0012] In some embodiments, the first heat conducting layer is provided with a plurality of first through holes, the first composite layer is provided with a first protrusion at a position corresponding to each of the first through holes, the first protrusion passes through the first through hole and is connected to the second composite layer; and / or,

[0013] The second composite layer is provided with second protrusions at positions corresponding to the first through holes. The second protrusions pass through the first through holes and are connected to the first composite layer.

[0014] In some embodiments, the first fiber comprises at least one of a carbon fiber, a metal fiber, and a carbon nanotube;

[0015] And / or, the second fiber includes at least one of carbon fiber, metal fiber and carbon nanotube.

[0016] In some embodiments, the length of the first fiber extends along a first direction, the length of the second fiber extends along a second direction, and the first direction and the second direction are arranged at an angle.

[0017] In some embodiments, the support structure further comprises:

[0018] a third composite layer, the third composite layer being stacked on a side of the second composite layer away from the first composite layer, the third composite layer comprising a third adhesive body and third fibers disposed in the third adhesive body, the hardness of the third fibers being higher than the hardness of the third adhesive body of the third composite layer, and the thermal conductivity of the third fibers being higher than the thermal conductivity of the third adhesive body;

[0019] The second heat-conducting layer is sealed between the third composite layer and the second composite layer, and the second heat-conducting layer is thermally connected to the third composite layer and the second composite layer respectively.

[0020] In some embodiments, the length direction of the second fiber is arranged at an angle with the length directions of the first fiber and the third fiber respectively.

[0021] In some embodiments, the length directions of the first fiber and the third fiber are arranged in parallel.

[0022] In some embodiments, the elastic modulus of the second fibers is higher than the elastic modulus of the first fibers and the third fibers.

[0023] In some embodiments, the elastic modulus of the first fibers is equal to the elastic modulus of the third fibers.

[0024] In some embodiments, the support structure is an axisymmetric structure.

[0025] In some embodiments, a conductive layer is disposed on a side of the first composite layer facing away from the first heat conductive layer, and the conductive layer is used to be connected to a grounding structure.

[0026] In some embodiments, the thickness of the conductive layer is less than 10 μm; preferably, the thickness of the conductive layer is less than 5 μm; and / or the maximum surface resistance of the conductive layer is less than 2Ω; preferably, the maximum surface resistance of the conductive layer is less than 1Ω; and / or the adhesion of the conductive layer to the first composite layer is greater than or equal to 4B.

[0027] In some embodiments, the thickness of the support structure is 0.1 mm to 1 mm; preferably, the thickness of the support structure is 0.1 mm to 0.15 mm; and / or,

[0028] The elastic modulus of the support structure is greater than or equal to 70 GPa; and / or,

[0029] The tensile strength of the support structure is greater than or equal to 700Mpa; and / or,

[0030] The elongation at break of the supporting structure is greater than or equal to 1%.

[0031] In some embodiments, the thickness of the first heat-conducting layer is 5 μm to 100 μm, preferably, the thickness of the first heat-conducting layer is 12 μm to 30 μm; and / or,

[0032] Along a direction perpendicular to the thickness of the first heat-conducting layer, the thermal conductivity of the first heat-conducting layer is greater than or equal to 1400 w / (m*k).

[0033] In a second aspect, a method for manufacturing a support structure is provided, for manufacturing the above-mentioned support structure, the manufacturing method comprising:

[0034] Immersing the first fiber in the first glue to obtain a first composite layer to be cured;

[0035] Laying the first composite layer to be cured on at least one side surface of the first heat conductive layer in the thickness direction to obtain a first laminated structure;

[0036] The first laminate structure is pressed using a preset pressure to solidify the first composite layer and adhere it to the first heat conductive layer to obtain the support structure.

[0037] In a third aspect, a method for manufacturing a support structure is provided, for manufacturing the above-mentioned support structure, the manufacturing method comprising:

[0038] Arranging the first fibers in a first preset direction and immersing the fibers in a first glue to obtain a first composite layer to be cured;

[0039] Arranging the second fibers in a second preset direction and immersing them in the second glue to obtain a second composite layer to be cured;

[0040] The first composite layer to be cured is stacked on one side surface of the first heat-conducting layer along the thickness direction, and the second composite layer to be cured is stacked on the other side surface opposite to the first heat-conducting layer along the thickness direction to obtain a second stacked structure;

[0041] The second laminate structure is pressed using a preset pressure, so that the first composite layer and the second composite layer are cured and attached to the first heat conductive layer, so as to obtain the support structure.

[0042] In some embodiments, in the step of obtaining the second laminated structure, the length direction of the first fiber and the length direction of the second fiber are set at an angle, wherein the length direction of the first fiber is the first preset direction, and the length direction of the second fiber is the second preset direction.

[0043] In a fourth aspect, a method for manufacturing a support structure is provided, for manufacturing the above-mentioned support structure, the manufacturing method comprising:

[0044] Arranging the first fibers in a first preset direction and immersing the fibers in a first glue to obtain a first composite layer to be cured;

[0045] Arranging the second fibers in a second preset direction and immersing them in the second glue to obtain a second composite layer to be cured;

[0046] Arranging the third fibers according to a third preset direction and immersing the fibers in a third glue to obtain a third composite layer to be cured;

[0047] The first composite layer to be cured is stacked on one side surface of the first heat conductive layer in the thickness direction, the second composite layer to be cured is stacked on the other side surface of the first heat conductive layer in the thickness direction, the second heat conductive layer is stacked on the surface of the second composite layer facing away from the first heat conductive layer, and the third composite layer is stacked on the surface of the second heat conductive layer facing away from the second composite layer, so as to obtain a third laminated structure;

[0048] The third laminate structure is pressed together using a preset pressure, so that the first composite layer, the second composite layer and the third composite layer are solidified and attached to the first heat conductive layer and the second heat conductive layer respectively, so as to obtain the support structure.

[0049] In some embodiments, in the step of obtaining the third laminated structure, the length direction of the second fiber is set at an angle to the length directions of the first fiber and the third fiber, respectively, wherein the length direction of the first fiber is the first preset direction, the length direction of the second fiber is the second preset direction, and the length direction of the third fiber is the third preset direction.

[0050] In some embodiments, in the step of obtaining the third stacked structure, the length direction of the first fibers is parallel to the length direction of the third fibers.

[0051] In a fifth aspect, an electronic device is provided, comprising a display module and the above-mentioned supporting structure, wherein the supporting structure is connected to the display module to support the display module.

[0052] The support structure provided by the present application has the following beneficial effects: the support structure includes a first composite layer and a heat-conducting layer, the overall density of the first composite layer is less than the density of the metal material, so that the weight of the support structure can be reduced; in addition, a first fiber is arranged in the first composite layer, and the first fiber has a relatively high strength, so that the overall strength of the first composite layer can be improved to ensure the strength performance of the support structure, thereby ensuring the supporting effect of the support structure on the display module and other related module structures, and the first fiber has a relatively high thermal conductivity, so that the thermal conductivity of the first composite layer can be improved, which helps to improve the heat dissipation effect of the display module and other related modules connected to the support structure, and reduce the accumulation of heat in the display module and other related modules; a heat-conducting layer is arranged on one side of the first composite layer, which can improve the overall heat absorption capacity of the support structure, so as to accelerate the heat dissipation in the connection area of ​​the support structure and the display module and other heat-generating modules connected thereto; through the above arrangement, the first composite layer has a relatively high strength and a relatively low density, which helps to ensure the strength of the support structure and reduce the weight of the support structure, and in addition, the first composite layer and the heat-conducting layer both have a relatively high heat dissipation performance, which helps to ensure the heat dissipation performance of the support structure and helps to reduce the accumulation of heat in the display module and other related modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0054] Figure 1 A schematic diagram of a support structure provided in one embodiment of the present application;

[0055] Figure 2 A schematic diagram of a support structure provided in another embodiment of the present application;

[0056] Figure 3 for Figure 2 A schematic top view of the support structure shown;

[0057] Figure 4 for Figure 2 A partial enlarged schematic diagram of a heat-conducting layer of the support structure shown;

[0058] Figure 5 A partial enlarged schematic diagram of a support structure provided in yet another embodiment of the present application;

[0059] Figure 6 for Figure 5 A schematic diagram of a second composite layer of the support structure shown;

[0060] Figure 7 for Figure 5 A schematic diagram of a first composite layer of a support structure is shown;

[0061] Figure 8 A schematic diagram of a support structure provided in yet another embodiment of the present application;

[0062] Fig. 9 A schematic diagram of a support structure provided in yet another embodiment of the present application;

[0063] Fig.10 A schematic diagram of a conductive layer provided in an embodiment of the present application.

[0064] Among them, the reference numerals in the figure are:

[0065] 1. First composite layer; 11. First protrusion; 12. First fiber; 2. First heat-conducting layer; 21. First through hole; 3. Second composite layer; 31. Second protrusion; 32. Second fiber; 4. Second heat-conducting layer; 5. Third composite layer; 51. Third fiber; 6. Conductive layer; 61. First layer; 62. Second layer; 63. Third layer. DETAILED DESCRIPTION

[0066] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0067] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0068] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0069] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0070] In today's era of rapid technological development, electronic devices such as mobile phones and tablets have become indispensable tools in people's daily lives and work. As consumers' requirements for the portability and user experience of electronic devices continue to increase, the demand for weight reduction of electronic devices has become increasingly strong.

[0071] In the structure of electronic devices, the display module is a key component for realizing information visualization, and the support structure set on one side of the display module also plays a vital role. The support structure is connected to the display module, and its main function is to provide a stable support for the display module, ensuring that the display module can maintain the correct position and posture in the electronic device, thereby ensuring the normal operation of the display module.

[0072] As a component that provides a stable support structure for the display module, the support structure needs to have high strength. In the related art, the support structure of the display module of the electronic device is mostly made of metal materials. Metal materials have good strength and rigidity and can provide reliable support for the display module. However, the density of metal materials is relatively high, which makes it difficult for electronic devices using metal support structures to meet the current growing demand for weight reduction in terms of weight. Overweight electronic devices will not only cause inconvenience to users in carrying and operating, but may also affect the competitiveness of the product in the market.

[0073] In order to solve the problem of heavy weight of metal support structures, some support structures in related technologies have begun to be made of polymer materials with low density and high strength. The density of polymer materials is relatively low, which can effectively reduce the weight of electronic equipment and meet the demand for weight reduction to a certain extent. However, although the support structure made of polymer materials performs well in terms of weight, its thermal conductivity is relatively poor.

[0074] The display module will generate a certain amount of heat during operation, and good heat dissipation performance is essential to ensure the normal operation of the display module and extend its service life. Due to the insufficient thermal conductivity of the polymer material support structure, the heat generated by the display module is difficult to dissipate effectively, and the heat accumulates in the connection area between the polymer material support structure and the display module, making the temperature of the connection area higher. Excessive temperature may not only affect the display effect of the display module, but also accelerate the aging of the display module and surrounding components, reducing the overall performance and reliability of the electronic equipment.

[0075] In summary, the current support structure of the display module faces the dilemma of having difficulty balancing weight reduction and heat dissipation in practical applications.

[0076] Based on this, an embodiment of the present application provides a support structure, a manufacturing method thereof, and an electronic device, wherein the support structure includes a first composite layer and a first heat-conducting layer, and along the thickness direction of the first heat-conducting layer, the first composite layer is attached to at least one side of the first heat-conducting layer, and the first composite layer is thermally connected to the first heat-conducting layer, wherein the first composite layer includes a first adhesive body and a first fiber arranged in the first adhesive body, the hardness of the first fiber is higher than the hardness of the first adhesive body, and the thermal conductivity of the first fiber is higher than the thermal conductivity of the first adhesive body.

[0077] The support structure provided by the embodiment of the present application includes a first composite layer and a heat-conducting layer. The density of the first adhesive body is lower than the density of the metal. Therefore, the overall density of the first composite layer is lower than the density of the metal material, thereby achieving weight reduction of the support structure. In addition, a first fiber is arranged in the first composite layer. The first fiber has a high strength. Thus, the overall strength of the first composite layer can be improved to ensure the strength performance of the support structure, thereby ensuring the supporting effect of the support structure on the display module and other related module structures. In addition, the first fiber has a high thermal conductivity. Thus, the thermal conductivity of the first composite layer can be improved, which is helpful to improve the display connected to the support structure. The heat dissipation effect of the module and other related modules can be improved, and the accumulation of heat in the display module and other related modules can be reduced; a thermal conductive layer is set on one side of the first composite layer, which can enhance the heat absorption capacity of the support structure as a whole, so as to accelerate the heat dissipation in the connection area of ​​the support structure and the display module and other heat-generating modules connected thereto; through the above settings, the first composite layer has higher strength and lower density, which helps to ensure the strength of the support structure and reduce the weight of the support structure. In addition, the first composite layer and the thermal conductive layer both have higher heat dissipation performance, which helps to ensure the heat dissipation performance of the support structure and helps to reduce the accumulation of heat in the display module and other related modules.

[0078] Reference Figure 1The embodiment of the present application first provides a supporting structure, including a first composite layer 1 and a first heat-conducting layer 2. Along the thickness direction of the first heat-conducting layer 2, the first composite layer 1 is attached to at least one side of the first heat-conducting layer 2, and the first composite layer 1 is thermally connected to the first heat-conducting layer 2, wherein the first composite layer 1 includes a first adhesive body and a first fiber 12 arranged in the first adhesive body, the hardness of the first fiber 12 is higher than the hardness of the first adhesive body, and the thermal conductivity of the first fiber 12 is higher than the thermal conductivity of the first adhesive body.

[0079] It should be noted that the first thermal conductive layer 2 can be made of a high thermal conductivity material. When the first composite layer 1 is connected to a heating module such as a display module of an electronic device, it can quickly absorb heat from the first composite layer 1 for heat dissipation. When the first thermal conductive layer 2 is connected to a heating module such as a display module, it can quickly absorb heat from the heating module such as the display module and quickly transfer the heat to the first composite layer 1 for heat dissipation. The first thermal conductive layer 2 can be made of non-metallic materials, such as graphene, graphite, carbon nanotubes, etc., and can also be made of metal materials, such as aluminum, aluminum alloy, copper-based alloy, etc.

[0080] It should be noted that heat conduction connection refers to the use of specific methods and materials to establish a channel between two or more objects that can efficiently transfer heat, so as to transfer heat from the high-temperature end to the low-temperature end, so as to meet the requirements of heat dissipation, heat distribution or thermal management in different scenarios. The first composite layer 1 is thermally connected to the first thermal conductive layer 2, and heat can be transferred between the first composite layer 1 and the first thermal conductive layer 2, so that heat can be dissipated from the display module and other heat-generating modules.

[0081] It should be noted that hardness refers to the ability of the material surface to resist local deformation, especially plastic deformation, indentation or scratch. Hardness can reflect the wear resistance and resistance to local damage of the material surface. The hardness of the first fiber 12 and the first rubber body can be measured by a specific hardness test method. Commonly used hardness test methods include Brinell hardness, Rockwell hardness, Vickers hardness, etc. For example, the Brinell hardness test is to use a steel ball or a carbide ball of a certain diameter to press into the surface of the sample with a specified test force. After a specified holding time, the test force is removed and the diameter of the indentation on the surface of the sample is measured to calculate the hardness value. Generally speaking, for the same material, its hardness and strength are both characterizations of the ability of the material to resist external forces. To a certain extent, hardness and strength have a positive correlation. Generally speaking, the higher the strength of the material, the greater its hardness. This is because factors such as the bonding force between atoms inside the material and the crystal structure have an important influence on hardness and strength. When the bonding force between atoms inside the material is strong and the crystal structure is stable, the material can withstand a large external force without plastic deformation (high strength) and can also resist other objects from pressing into or scratching its surface (high hardness). In this way, the hardness of the first fiber 12 is higher than the hardness of the first rubber body, which can also be understood as the strength of the first fiber 12 is higher than the strength of the first rubber body.

[0082] It should be noted that thermal conductivity is an important physical quantity to measure the thermal conductivity of materials. It specifically refers to the amount of heat transferred through an area of ​​1 square meter in 1 second under stable heat transfer conditions when the temperature difference between the two surfaces of a 1 meter thick material is 1K (or 1°C). The magnitude of the thermal conductivity reflects the ability of a material to conduct heat. The larger the thermal conductivity, the easier and faster the material conducts heat. Conversely, the smaller the thermal conductivity, the better the thermal insulation performance of the material. The higher the thermal conductivity of the first fiber 12 is than that of the first adhesive body, which indicates that the first fiber 12 has a higher ability to conduct heat than the first adhesive body. There are two methods for determining thermal conductivity. One of them is the steady-state method: under steady-state conditions, when the temperature distribution inside the material does not change with time, the thermal conductivity is calculated using Fourier's thermal conductivity law by measuring the temperature distribution and heat flow of the material under a stable heat flow state. For example, for some materials with a cylindrical shape or suitable for making cylindrical specimens, the material to be tested can be made into a cylindrical shape, heated in the inner cylinder and cooled in the outer cylinder, so that the heat is transferred steadily along the radial direction. The thermal conductivity of the material is calculated by measuring the temperature of the inner and outer cylinders and parameters such as the heat flow. The other method is the non-steady-state method: by applying a time-varying heat flow or temperature to the material, measuring the change response of the temperature inside the material over time, and inferring the thermal conductivity based on the non-steady-state theory of heat conduction. This method has a relatively short measurement time and is suitable for measuring materials with low thermal conductivity and occasions with high measurement efficiency requirements. For example, a thin metal wire (hot wire) can be used as a heating source and evenly buried in the material to be measured. At a certain moment, a constant heating power is applied to the hot wire, and the temperature of the material around the hot wire will increase over time. By measuring the relationship between the change of the hot wire temperature over time and using the mathematical model established by the heat conduction theory, the thermal conductivity of the material can be calculated. The thermal conductivity of the first thermal conductive layer can be higher than the thermal conductivity of the first composite layer.

[0083] It should be noted that the strength of the first fiber 12 is higher than the strength of the first adhesive body, and the thermal conductivity of the first fiber 12 is higher than the thermal conductivity of the first adhesive body. In this way, the first fiber 12 can be a high-strength and high-thermal-conductivity fiber. For example, the first fiber 12 can be a carbon fiber, a metal fiber, a carbon nanotube, etc.; the arrangement direction of the first fiber 12 in the first composite layer 1 can be disorderly or orderly; when the first composite layer 1 is connected to a heating module such as a display module of an electronic device, the first adhesive body and the first fiber 12 of the first composite layer 1 can absorb the heat of the heating module such as the display module, and the heat absorbed by the first composite layer 1 can be transferred to the first thermal conductive layer 2 for heat dissipation; when the first thermal conductive layer 2 is connected to a heating module such as a display module, the first thermal conductive layer 2 can absorb the heat of the heating module such as the display module, and the heat absorbed by the first thermal conductive layer 2 can be transferred to the first adhesive body and the first fiber 12 of the first composite layer 1 for heat dissipation.

[0084] It should be noted that the first glue body of the first composite layer 1 can be cured by the first glue, and the first glue can be a thermosetting glue. For example, the thermosetting glue can be epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.; the first glue can also be a light-curing glue. For example, the light-curing glue can be acrylate glue, ultraviolet light-curing glue, etc.; in addition, the first glue can also be a moisture-curing glue. For example, the moisture-curing glue can be cyanoacrylate glue, PUR (polyurethane reactive, moisture-curing reactive polyurethane hot melt adhesive), etc.

[0085] The support structure provided in the embodiment of the present application includes a first composite layer 1 and a first heat-conducting layer 2. It can be understood that the density of the first adhesive body is less than the density of the metal, so the density of the first composite layer 1 as a whole can be less than the density of the metal material, so that the weight of the support structure can be reduced; in addition, a first fiber 12 is arranged in the first composite layer 1, and the first fiber 12 has a high strength, so that the overall strength of the first composite layer 1 can be improved to ensure the strength performance of the support structure, thereby ensuring the support effect of the support structure on the display module and other related module structures, and the first fiber 12 has a high thermal conductivity, so that the thermal conductivity of the first composite layer 1 can be improved, which is helpful to improve the support structure. The heat dissipation effect of the display module and other related modules connected to the structure can reduce the accumulation of heat in the display module and other related modules; the first thermal conductive layer 2 is set on one side of the first composite layer 1, which can enhance the heat absorption capacity of the supporting structure as a whole, so as to accelerate the heat dissipation in the connection area of ​​the supporting structure and the display module and other heat-generating modules connected thereto; through the above arrangement, the first composite layer 1 has higher strength and lower density, which helps to ensure the strength of the supporting structure and reduce the weight of the supporting structure. In addition, the first composite layer 1 and the first thermal conductive layer 2 both have higher heat dissipation performance, which helps to ensure the heat dissipation performance of the supporting structure and helps to reduce the accumulation of heat in the display module and other related modules.

[0086] Reference Figure 2 and Figure 3 In some embodiments, the support structure also includes a second composite layer 3, the first composite layer 1 and the second composite layer 3 are respectively arranged on opposite sides of the first thermal conductive layer 2, the first thermal conductive layer 2 is sealed between the first composite layer 1 and the second composite layer 3, and the first thermal conductive layer 2 is sealed and connected to the second composite layer 3, wherein the second composite layer 3 includes a second adhesive body and a second fiber 32 arranged in the second adhesive body, the hardness of the second fiber 32 is higher than the hardness of the second adhesive body, and the thermal conductivity of the second fiber 32 is higher than the thermal conductivity of the second adhesive body.

[0087] It should be noted that the second glue body of the second composite layer 3 can be cured by the second glue, and the second glue can be a heat-curing glue. For example, the heat-curing glue can be epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.; the second glue can also be a light-curing glue. For example, the light-curing glue can be acrylate glue, UV-curing glue, etc.; in addition, the second glue can also be a moisture-curing glue. For example, the moisture-curing glue can be cyanoacrylate glue, PUR (polyurethane reactive, moisture-curing reactive polyurethane hot melt adhesive), etc.

[0088] It should be noted that the hardness of the second fiber 32 is higher than that of the second adhesive body, and the hardness of the material is positively correlated with its strength. Therefore, the strength of the second fiber 32 is higher than that of the second adhesive body. In addition, the thermal conductivity of the second fiber 32 is higher than that of the second adhesive body of the second composite layer 3. Therefore, the second fiber 32 can be a high-strength and high-thermal-conductivity fiber. For example, the second fiber 32 can be a carbon fiber, a metal fiber, a carbon nanotube, etc.; wherein the materials of the first fiber 12 and the second fiber 32 can be the same or different. When the first composite layer 1 is connected to a heat-generating module such as a display module of an electronic device, the first adhesive body and the first fiber 12 of the first composite layer 1 can absorb the heat of the heat-generating module such as the display module, and the heat absorbed by the first composite layer 1 can be transferred to the second composite layer 3 through the first thermal conductive layer 2 for heat dissipation; when the second composite layer 3 is connected to a heat-generating module such as a display module, the second adhesive body and the second fiber 32 can absorb the heat of the heat-generating module such as the display module, and the heat absorbed by the second composite layer 3 can be transferred to the first adhesive body and the first fiber 12 through the first thermal conductive layer 2 for heat dissipation. The thermal conductivity of the first heat conducting layer 2 may be higher than the thermal conductivity of the second composite layer.

[0089] The first composite layer 1 and the second composite layer 3 are respectively arranged on both sides of the first heat-conducting layer 2. The first composite layer 1 and the second composite layer 3 can both support the first heat-conducting layer 2, thereby enhancing the overall strength of the supporting structure to ensure the supporting stability of the supporting structure for the display module; in addition, the first composite layer 1 and the second composite layer 3 can seal the first heat-conducting layer 2, thereby reducing the exposure of the first heat-conducting layer 2, thereby reducing the possibility of the first heat-conducting layer 2 being broken, thereby improving the quality of the supporting structure.

[0090] In some embodiments, the first heat conducting layer 2 may be a graphite layer.

[0091] It can be understood that compared with metal materials, the density of graphite is lower, and its mass is lighter under the condition of equal volume. Therefore, setting the first thermal conductive layer 2 as a graphite layer can reduce the weight of the support structure and help achieve a lightweight design of the support structure. In addition, graphite has a high thermal conductivity and can quickly absorb heat, thereby ensuring the heat dissipation capacity of the support structure. Using the first composite layer 1 and the second composite layer 3 to encapsulate the first thermal conductive layer 2 can reduce the probability of damage or cracking of the first thermal conductive layer 2, thereby ensuring the strength of the support structure, thereby ensuring the support stability of the support structure for related module structures such as the display module.

[0092] In some embodiments, the edge of the second adhesive body is sealed to the edge of the first adhesive body, so that the first heat-conducting layer 2 is sealed between the first composite layer 1 and the second composite layer 3. By sealing the edge of the second adhesive body to the edge of the first adhesive body, the entire first heat-conducting layer can be encapsulated between the first composite layer 1 and the second composite layer 3, so that the edge of the first heat-conducting layer 2 will not be exposed to the environment, thereby reducing the possibility of the first heat-conducting layer 2 being broken, and thus improving the quality of the support structure.

[0093] In some embodiments, the first composite layer 1 and the second composite layer 3 are of equal size, that is, the circumferential side surfaces of the first composite layer 1 and the second composite layer 3 are aligned.

[0094] Reference Figure 3 In some embodiments, the distance between the edge of the first heat-conducting layer 2 and the edges of the first composite layer 1 and the second composite layer 3 is L1, and L1 ≥ 1 mm. Setting the distance between the edge of the first heat-conducting layer 2 and the edges of the first composite layer 1 and the second composite layer 3 to be not less than 1 mm can ensure the connection area of ​​the first composite layer 1 and the second composite layer 3, thereby ensuring the connection strength between the first composite layer 1 and the second composite layer 3, and reducing the risk of separation of the first composite layer 1 and the second composite layer 3.

[0095] Reference Figures 4 to 7 In some embodiments, the first heat conducting layer 2 is provided with a plurality of first through holes 21, and the first composite layer 1 is provided with first protrusions 11 at positions corresponding to the first through holes 21, and the first protrusions 11 pass through the first through holes 21 and are connected to the second composite layer 3. The first through holes 21 are provided in the first heat conducting layer 2, and the first protrusions 11 are provided in the first composite layer 1, the first protrusions 11 can be provided in the first through holes 21, and the ends of the first protrusions 11 can be connected to the second composite layer 3, so that the connection range between the first composite layer 1 and the second composite layer 3 can be increased, the bonding strength between the first composite layer 1 and the second composite layer 3 can be enhanced, and the risk of separation between the first composite layer 1 and the second composite layer 3 can be reduced, so that the risk of cracking of the first heat conducting layer 2 can be reduced, which helps to ensure the overall strength of the supporting structure.

[0096] In some embodiments, the second composite layer 3 is provided with second protrusions 31 at positions corresponding to the first through holes 21 , and the second protrusions 31 pass through the first through holes 21 and are connected to the first composite layer 1 .

[0097] A first through hole 21 is provided in the first heat-conducting layer 2, and a second protrusion 31 is provided in the second composite layer 3. The second protrusion 31 can be provided in the first through hole 21, and an end of the second protrusion 31 can be connected to the first composite layer 1, so that the connection range between the first composite layer 1 and the second composite layer 3 can be increased, the bonding strength between the first composite layer 1 and the second composite layer 3 can be enhanced, and the risk of separation between the first composite layer 1 and the second composite layer 3 can be reduced. In this way, the risk of cracking of the first heat-conducting layer 2 can be reduced, which helps to ensure the overall strength of the supporting structure.

[0098] In some embodiments, the first composite layer 1 is provided with a first protrusion 11, and the second composite layer 3 is provided with a second protrusion 31. The lengths of the first protrusion 11 and the second protrusion 31 are both smaller than the thickness of the first thermal conductive layer 2, that is, the lengths of the first protrusion 11 and the second protrusion 31 are both smaller than the length of the first through hole 21. In this way, the first protrusion 11 arranged in the first through hole 21 can be connected to the corresponding second protrusion 31 arranged in the first through hole 21 to realize the connection between the first composite layer 1 and the second composite layer 3.

[0099] In some embodiments, the first protrusion 11 can be filled in the first through hole 21, that is, the periphery of the first protrusion 11 can be connected to the hole wall of the first through hole 21. This can increase the connection area between the first composite layer 1 and the first thermal conductive layer 2, reduce the risk of cracking of the first thermal conductive layer 2, and help improve the strength of the supporting structure.

[0100] In some embodiments, the second protrusion 31 can be filled in the first through hole 21, that is, the periphery of the second protrusion 31 can be connected to the hole wall of the first through hole 21. This can increase the connection area between the second composite layer 3 and the first thermal conductive layer 2, reduce the risk of cracking of the first thermal conductive layer, and help improve the strength of the support structure.

[0101] In some embodiments, the cross-sectional shape of the first through hole 21 may be circular, elliptical, rectangular, polygonal or the like, or may be an irregular shape. The first thermal conductive layer 2 may be provided with a plurality of first through holes 21, and the shapes of the plurality of first through holes 21 may be the same or different, or some of the first through holes 21 may have the same shape and other first through holes 21 may have different shapes.

[0102] In some embodiments, the cross-sectional shape of the first through hole 21 may be circular, and the aperture D1 of the first through hole 21 may be not less than 1 mm, that is, D1 ≥ 1 mm, so that it is convenient to form the first through hole 21 on the first thermal conductive layer 2. In addition, the cross-sectional dimensions of the first protrusion 11 and the second protrusion 31 may be appropriately increased, which helps to improve the strength of the first protrusion 11 and the second protrusion 31, thereby improving the bonding stability of the first composite layer 1 and the second composite layer 3. Exemplarily, D1 may be 1 mm, 1.1 mm, 1.2 mm, 1.31 mm, 2.12 mm, etc.

[0103] In some embodiments, the first fibers 12 include at least one of carbon fibers, metal fibers, and carbon nanotubes.

[0104] Carbon fiber refers to high-strength and high-modulus fiber with a carbon content of more than 90%. It has extremely high tensile strength, which can even exceed the strength of steel of the same quality; its density is low, usually between 1.5 and 2.0 g / cm 3 In addition, carbon fiber has good thermal conductivity, and its thermal conductivity in the fiber direction can exceed that of copper, up to 700w / (m*k). Therefore, the first fiber 12 includes carbon fiber, which can ensure the thermal conductivity of the first fiber 12, thereby ensuring the thermal conductivity of the support structure, and in addition, can ensure the strength of the first fiber 12, thereby ensuring the overall strength of the support structure.

[0105] Metal fiber is a fibrous material with a high aspect ratio (ratio of length to diameter) made of metal material. Common metal fiber materials include stainless steel, copper, aluminum, nickel, etc. Through a specific processing technology, the metal can be made into a filament or fiber, and its diameter is usually between a few microns and tens of microns. Metal fiber has high strength and modulus, can withstand large tension and external forces, is not easy to deform and break, and can be used to enhance the mechanical properties of composite materials. In addition, metal has excellent thermal conductivity, and metal fiber also has this property, which can quickly transfer heat and help heat dissipation and thermal management. Therefore, the first fiber 12 includes metal fiber, which can ensure the thermal conductivity of the first fiber 12, thereby ensuring the thermal conductivity of the support structure. In addition, the strength of the first fiber 12 can also be guaranteed, thereby ensuring the overall strength of the support structure.

[0106] Carbon nanotubes are a type of tubular nanomaterial composed of carbon atoms, and their structure is similar to a seamless, hollow tube formed by curling graphene sheets. According to the number of layers of the tube wall, they can be divided into single-walled carbon nanotubes and multi-walled carbon nanotubes. Single-walled carbon nanotubes are formed by curling a layer of graphene sheets, and the tube diameter is usually around 1nm; multi-walled carbon nanotubes are formed by coaxially curling multiple layers of graphene sheets, and the tube diameter is generally between a few nanometers and tens of nanometers. Carbon nanotubes have extremely high strength and modulus, and have high thermal conductivity. Therefore, the first fiber includes carbon nanotubes, which can ensure the thermal conductivity of the first fiber 12, thereby ensuring the thermal conductivity of the support structure. In addition, the strength of the first fiber 12 can also be ensured, thereby ensuring the overall strength of the support structure.

[0107] For example, in some embodiments, all the first fibers 12 in the first composite layer 1 may be carbon fibers, in other embodiments, all the first fibers 12 in the first composite layer 1 may be metal fibers, and in still other embodiments, all the first fibers 12 in the first composite layer 1 may be carbon nanotubes; in some other embodiments, a portion of the first fibers 12 in the first composite layer 1 may be carbon fibers, a portion of the first fibers 12 may be metal fibers, and the remaining portion of the first fibers 12 may be carbon nanotubes.

[0108] In other embodiments, the second fiber 32 includes at least one of carbon fiber, metal fiber and carbon nanotube. The second fiber 32 includes at least one of carbon fiber, metal fiber and carbon nanotube, which can ensure the thermal conductivity of the second fiber 32, thereby ensuring the thermal conductivity of the support structure, and in addition, the strength of the second fiber 32 can be ensured, thereby ensuring the overall strength of the support structure.

[0109] In some embodiments, all the second fibers 32 in the second composite layer 3 may be carbon fibers, in other embodiments, all the second fibers 32 in the second composite layer 3 may be metal fibers, and in still other embodiments, all the second fibers 32 in the second composite layer 3 may be carbon nanotubes; in some other embodiments, a portion of the second fibers 32 in the second composite layer 3 may be carbon fibers, a portion of the second fibers 32 may be metal fibers, and the remaining portion of the second fibers 32 may be carbon nanotubes.

[0110] In some embodiments, the first composite layer 1 includes a plurality of first fibers 12, and the lengths of all the first fibers 12 in the first composite layer 1 extend along a first direction. The second composite layer 3 includes a plurality of second fibers 32, and the lengths of all the second fibers 32 in the second composite layer 3 extend along a second direction. The first direction and the second direction are arranged at an angle.

[0111] It should be noted that the first direction and the second direction are arranged at an angle, and the first direction and the second direction may be perpendicular, that is, the angle between the first direction and the second direction may be a right angle, and the first direction and the second direction may also be non-perpendicular, so that the angle between the first direction and the second direction may be an acute angle or an obtuse angle. Exemplarily, in some embodiments, the first direction may be the Y-axis direction shown in the figure, the second direction may be the X-axis direction shown in the figure, and the first composite layer 1 and the second composite layer 3 may be stacked along the Z-axis direction shown in the figure.

[0112] Extending the length of all the first fibers 12 in the first composite layer 1 along the first direction can give full play to the high strength and high modulus characteristics of the first fibers 12 in the length direction thereof, so that the first composite layer 1 has good tensile, compressive and bending strengths in the first direction, thereby enhancing the strength of the support structure in the first direction; in addition, compared with the design of disordered arrangement, in this embodiment, all the first fibers 12 are arranged in order, and the performance of the first composite layer 1 is relatively stable and predictable, which is convenient for structural design and performance optimization, and the arrangement direction and density of the first fibers 12 can be precisely controlled to achieve precise regulation of the performance of the support structure to meet the needs of different usage scenarios; the same is true for extending the length of all the second fibers 32 in the second composite layer 3 along the second direction; the first direction and the second direction are set at an angle, that is, the length directions of the first fibers 12 and the second fibers 32 are set at an angle, and the combination of the first fibers 12 and the second fibers 32 can form a mesh structure, so that the strength of the support structure in each direction can be improved, thereby improving the support effect on related module structures such as display modules.

[0113] In some embodiments, the first direction and the second direction are arranged perpendicularly, that is, the length directions of the first fiber and the second fiber are arranged perpendicularly. In this way, the first fiber and the second fiber can make the supporting structure have high strength and high modulus properties in two perpendicular directions, thereby ensuring the overall strength of the supporting structure.

[0114] In some embodiments, the density of the first fibers 12 in the first composite layer 1 is the same as the density of the second fibers 32 in the second composite layer 3. It can be understood that the overall strength of the first composite layer 1 is related to the density of the first fibers 12, and the overall strength of the second composite layer 3 is related to the density of the second fibers 32. By making the density of the first fibers 12 in the first composite layer 1 and the density of the second fibers 32 in the second composite layer 3 the same, the first composite layer 1 and the second composite layer 3 can have similar strengths, which can reduce the problem of uneven stress in the supporting structure caused by the strength difference between the first composite layer 1 and the second composite layer 3, thereby reducing the probability of warping of the supporting structure.

[0115] Reference Figure 8In some embodiments, the supporting structure further includes a third composite layer 5 and a second heat-conducting layer 4. The third composite layer 5 is stacked on the side of the second composite layer 3 away from the first composite layer 1. The third composite layer 5 includes a third adhesive body and a third fiber 51 arranged in the third adhesive body. The hardness of the third fiber 51 is higher than the hardness of the third adhesive body, and the thermal conductivity of the third fiber 51 is higher than the thermal conductivity of the third adhesive body. The second heat-conducting layer 4 is sealed between the third composite layer 5 and the second composite layer 3, and the second heat-conducting layer 4 is thermally connected to the third composite layer 5 and the second composite layer 3 respectively.

[0116] It should be noted that the thermal conductivity of the second heat-conducting layer 4 may be higher than the thermal conductivity of the first composite layer 1, the second composite layer 3 and the third composite layer 5. The second heat-conducting layer 4 may be made of non-metallic materials, such as graphene, graphite, carbon nanotubes, etc., or may be made of metallic materials, such as aluminum, aluminum alloy, copper-based alloy, etc.

[0117] It should be noted that the third glue body of the third composite layer 5 can be solidified by the third glue, and the third glue can be a thermosetting glue. For example, the thermosetting glue can be epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.; the third glue can also be a light-curing glue. For example, the light-curing glue can be acrylate glue, ultraviolet light-curing glue, etc.; in addition, the third glue can also be a moisture-curing glue. For example, the moisture-curing glue can be cyanoacrylate glue, PUR (polyurethane reactive, moisture-curing reactive polyurethane hot melt adhesive), etc.

[0118] It should be noted that the hardness of the third fiber 51 is higher than that of the third adhesive body, and the hardness of the material is positively correlated with its strength. Therefore, the strength of the third fiber 51 is higher than that of the third adhesive body. The thermal conductivity of the third fiber 51 is higher than that of the third adhesive body of the third composite layer 5. The third fiber 51 can be a high-strength and high-thermal conductivity fiber. Exemplarily, the third fiber 51 can be carbon fiber, metal fiber, carbon nanotube, etc.; wherein, the materials of the first fiber 12, the second fiber 32 and the third fiber 51 can be the same or different. When the first composite layer 1 is connected to a heat-generating module such as a display module of an electronic device, the first adhesive body and the first fiber 12 can absorb heat from the display module and other heat-generating modules, and the heat absorbed by the first composite layer 1 can be transferred to the third composite layer 5 in sequence through the first thermal conductive layer 2, the second composite layer 3, and the second thermal conductive layer 4 for dissipation; when the third composite layer 5 is connected to a heat-generating module such as a display module, the third adhesive body and the third fiber 51 can absorb heat from the display module and other heat-generating modules, and the heat absorbed by the third composite layer 5 can be transferred to the first adhesive body and the first fiber 12 in sequence through the second thermal conductive layer 4, the second composite layer 3, and the first thermal conductive layer 2 for dissipation.

[0119] The provision of the third composite layer 5 can enhance the strength of the supporting structure, thereby reducing the deformation of the supporting structure, thereby ensuring the supporting effect on the display module and other related module structures; a second thermal conductive layer 4 is provided between the third composite layer 5 and the second composite layer 3, and the second thermal conductive layer 4 can quickly absorb heat, thereby promoting heat transfer, and helping to improve the heat dissipation performance of the supporting structure; using the third composite layer 5 and the second composite layer 3 to encapsulate the second thermal conductive layer 4 can reduce the risk of cracking or damage of the second thermal conductive layer 4, thereby ensuring the integrity of the supporting structure.

[0120] In some embodiments, a plurality of third fibers 51 are disposed in the third composite layer 5, and the third fibers 51 include at least one of carbon fibers, metal fibers, and carbon nanotubes. The third fibers 51 include at least one of carbon fibers, metal fibers, and carbon nanotubes, which can ensure the thermal conductivity of the third fibers 51, thereby ensuring the thermal conductivity of the support structure, and in addition, can also ensure the strength of the third fibers 51, thereby ensuring the overall strength of the support structure.

[0121] In some embodiments, a plurality of third fibers 51 are disposed in the third composite layer 5 , and the length directions of the second fibers 32 in the second composite layer 3 are disposed at angles to the length directions of the first fibers 12 and the third fibers 51 .

[0122] The length direction of the second fibers 32 in the second composite layer 3 is set at an angle to the length directions of the first fibers 12 and the third fibers 51, respectively. The second fibers 32 and the first fibers 12 as well as the second fibers 32 and the third fibers 51 can be combined to form a mesh structure, respectively. In this way, the strength of the supporting structure in all directions can be improved, thereby improving the supporting effect on related module structures such as display modules.

[0123] In some embodiments, the length directions of the first fibers 12 and the third fibers 51 are arranged in parallel. The third composite layer 5 and the first composite layer 1 are respectively located on both sides of the second composite layer 3, and the length directions of the first fibers 12 and the third fibers 51 are arranged in parallel. The fibers on both sides of the second composite layer 3 are arranged in the same direction, so that the forces on both sides of the second composite layer 3 are balanced, which can reduce the internal stress of the support structure, thereby reducing the warping of the support structure.

[0124] In some embodiments, the lengths of all third fibers 51 in the third composite layer 5 extend along the first direction, the lengths of all first fibers 12 in the first composite layer 1 extend along the first direction, the lengths of the second fibers 32 extend along the second direction, and the first direction and the second direction are arranged perpendicularly.

[0125] The lengths of all the third fibers 51 in the third composite layer 5 extend along the first direction, and the lengths of all the first fibers 12 in the first composite layer 1 extend along the first direction, that is, the length directions of the third fibers 51 are parallel to the length directions of the first fibers 12, and the first direction is perpendicular to the second direction, that is, the length directions of the second fibers 32 are perpendicular to the length directions of the first fibers 12 and the third fibers 51, respectively, and the internal stress of the support structure is balanced, thereby reducing the probability of warping of the support structure.

[0126] In some embodiments, the density of the third fibers 51 in the third composite layer 5 is the same as the density of the first fibers 12 in the first composite layer 1. It can be understood that the overall strength of the third composite layer 5 is related to the density of the third fibers 51, and the overall strength of the first composite layer 1 is related to the density of the first fibers 12. By making the density of the first fibers 12 in the first composite layer 1 and the density of the third fibers 51 in the third composite layer 5 the same, the first composite layer 1 and the third composite layer 5 can have similar strengths. This can reduce the problem of uneven stress in the supporting structure caused by the strength difference between the first composite layer 1 and the third composite layer 5, thereby reducing the probability of warping of the supporting structure.

[0127] In some embodiments, the elastic modulus of the second fibers 32 is greater than the elastic modulus of the first fibers 12 and the third fibers 51 .

[0128] The elastic modulus is the ratio of stress to strain in the elastic deformation stage of a material, and it is an important indicator for measuring the material's ability to resist elastic deformation. Setting the elastic modulus of the second fiber 32 to be greater than the elastic modulus of the first fiber 12 and the third fiber 51 can improve the overall strength of the support structure, thereby reducing the deformation of the support structure when subjected to force; when the support structure absorbs heat and heats up, the deformation of the support structure can be reduced, so that the support structure can ultimately maintain a precise size and shape. In addition, the support structure is prone to fatigue during use, and the use of the second fiber 32 with a larger elastic modulus can better resist such fatigue damage.

[0129] In some embodiments, the elastic modulus of the third fiber 51 is equal to the elastic modulus of the first fiber 12. In this embodiment, the third composite layer 5 and the first composite layer 1 are located on both sides of the second composite layer 3, so that the elastic modulus of the adhesive layers on both sides of the second composite layer 3 is the same, so that the forces on both sides of the second composite layer 3 are balanced, so that the internal stress of the support structure can be reduced, thereby reducing the warping of the support structure.

[0130] In some embodiments, the first composite layer 1, the second composite layer 3 and the third composite layer 5 are respectively cured by carbon fiber prepregs, and the model of the carbon fiber prepregs can be T700, T800, M40 or other carbon fiber prepregs with the same strength as the model. In some embodiments, the first composite layer 1 and the third composite layer 5 can use T700 carbon fiber prepregs, and the second composite layer 3 can use T800 or M40 carbon fiber prepregs. After the carbon fiber prepregs are cured, a carbon fiber reinforced polymer (CFRP) can be obtained, and the first composite layer 1, the second composite layer 3 and the third composite layer 5 are all CFRP.

[0131] In some embodiments, the second heat conducting layer 4 may be a graphite layer.

[0132] It can be understood that compared with metal materials, the density of graphite is lower, and its mass is lighter under the condition of equal volume. Therefore, setting the second thermal conductive layer 4 as a graphite layer can reduce the weight of the support structure and help achieve a lightweight design of the support structure. In addition, graphite has a high thermal conductivity and can quickly absorb heat, thereby ensuring the heat dissipation capacity of the support structure. Using the second composite layer 3 and the third composite layer 5 to encapsulate the second thermal conductive layer 4 can reduce the probability of damage or cracking of the second thermal conductive layer 4, thereby ensuring the strength of the support structure, thereby ensuring the support stability of the support structure for related module structures such as the display module.

[0133] In some embodiments, the structure of the second heat-conducting layer 4 may be the same as that of the first heat-conducting layer 2. For example, the second heat-conducting layer 4 may be provided with a second through hole, the second composite layer 3 may be provided with a third protrusion, the second protrusion is provided in the second through hole, and the third protrusion is connected to the third composite layer 5. The second through hole is provided in the second heat-conducting layer 4, and the third protrusion is provided in the second composite layer 3. The third protrusion may be provided in the second through hole, and the end of the second protrusion may be connected to the third composite layer 5. In this way, the connection range between the third composite layer 5 and the second composite layer 3 can be increased, the bonding strength between the third composite layer 5 and the second composite layer 3 can be enhanced, and the risk of separation between the third composite layer 5 and the second composite layer 3 can be reduced. In this way, the risk of cracking of the second heat-conducting layer 4 can be reduced, which helps to ensure the overall strength of the supporting structure.

[0134] In some embodiments, the third composite layer 5 is provided with a fourth protrusion, the fourth protrusion is disposed in the second through hole, and the fourth protrusion is connected to the third composite layer.

[0135] A second through hole is provided in the second heat-conducting layer 4, and a fourth protrusion is provided in the third composite layer 5. The fourth protrusion can be provided in the second through hole, and the end of the third protrusion can be connected to the second composite layer 3. In this way, the connection range between the third composite layer 5 and the second composite layer 3 can be increased, the bonding strength between the third composite layer 5 and the second composite layer 3 can be enhanced, and the risk of separation of the third composite layer 5 and the second composite layer 3 can be reduced. In this way, the risk of cracking of the first heat-conducting layer can be reduced, which helps to ensure the overall strength of the supporting structure.

[0136] In some embodiments, the second composite layer 3 is provided with a third protrusion, and the third composite layer 5 is provided with a fourth protrusion. The lengths of the third protrusion and the fourth protrusion are both smaller than the thickness of the second thermal conductive layer 4, that is, the lengths of the third protrusion and the fourth protrusion are both smaller than the length of the second through hole. In this way, the third protrusion arranged in the second through hole can be connected with the corresponding fourth protrusion arranged in the second through hole to realize the connection between the third composite layer 5 and the second composite layer 3.

[0137] In some embodiments, the third protrusion can be filled in the second through hole, that is, the periphery of the third protrusion can be connected to the hole wall of the second through hole. This can increase the connection area between the second composite layer 3 and the second thermal conductive layer 4, reduce the risk of cracking of the second thermal conductive layer 4, and help improve the strength of the support structure.

[0138] In some embodiments, the fourth protrusion can be filled in the second through hole, that is, the periphery of the fourth protrusion can be connected to the hole wall of the second through hole. This can increase the connection area between the third composite layer 5 and the second thermal conductive layer 4, reduce the risk of cracking of the second thermal conductive layer 4, and help improve the strength of the support structure.

[0139] In some embodiments, the cross-sectional shape of the second through hole may be circular, elliptical, rectangular, polygonal or the like, or may be an irregular shape. The second thermal conductive layer 4 may be provided with a plurality of second through holes, and the shapes of the plurality of second through holes may be the same or different, or some of the second through holes may have the same shape and other second through holes may have different shapes.

[0140] In some embodiments, the cross-sectional shape of the second through hole may be circular, and the aperture D2 of the second through hole may be not less than 1 mm, that is, D2 ≥ 1 mm, so that it is convenient to form the second through hole on the second thermal conductive layer 4. In addition, the cross-sectional dimensions of the third protrusion and the fourth protrusion may be appropriately increased, which helps to improve the strength of the third protrusion and the fourth protrusion, thereby improving the bonding stability of the third composite layer 5 and the second composite layer 3. Exemplarily, D2 may be 1 mm, 1.1 mm, 1.2 mm, 1.31 mm, 2.12 mm, etc.

[0141] In some embodiments, the first through hole 21 and the second through hole may have the same aperture, and in other embodiments, the first through hole 21 and the second through hole may have different apertures.

[0142] In some embodiments, the third composite layer 5 and the second composite layer 3 are of equal size, that is, the circumferential side surfaces of the third composite layer 5 and the second composite layer 3 are aligned.

[0143] In some embodiments, the distance between the edge of the second heat-conducting layer 4 and the edges of the third composite layer 5 and the second composite layer 3 is L2, and L2 ≥ 1 mm. Setting the distance between the edge of the second heat-conducting layer 4 and the edges of the third composite layer 5 and the second composite layer 3 to be not less than 1 mm can ensure the connection area of ​​the third composite layer 5 and the second composite layer 3, thereby ensuring the connection strength between the third composite layer 5 and the second composite layer 3, and reducing the risk of separation of the third composite layer 5 and the second composite layer 3.

[0144] In some embodiments, the sizes of the second heat-conducting layer 4 and the first heat-conducting layer 2 may be equal, and in other embodiments, the sizes of the first heat-conducting layer 2 and the second heat-conducting layer 4 may be unequal.

[0145] In some embodiments, the thickness of the second thermally conductive layer 4 can be 5 μm to 100 μm. Setting the thickness of the second thermally conductive layer 4 to be no less than 5 μm can allow the second thermally conductive layer 4 to have a certain strength, thereby reducing the risk of breakage of the second thermally conductive layer 4; setting the thickness of the second thermally conductive layer 4 to be no more than 100 μm can reduce the space occupied by the second thermally conductive layer 4, thereby reducing the size of the supporting structure, thereby reducing the space occupied by the supporting structure in the electronic device. In addition, it can also meet the requirements of both heat dissipation and thinness.

[0146] In some embodiments, the thickness of the second heat conducting layer 4 may be 12 μm to 30 μm. For example, the thickness of the second heat conducting layer 4 may be 12 μm, 14 μm, 18 μm, 20 μm, 21 μm, 22 μm, 24 μm, 26 μm, 27 μm, 28 μm, or 30 μm.

[0147] In some embodiments, the thickness of the second heat-conducting layer 4 may be equal to the thickness of the first heat-conducting layer. In other embodiments, the thickness of the second heat-conducting layer 4 may be different from the thickness of the first heat-conducting layer.

[0148] In some embodiments, along a direction parallel to the second heat-conducting layer 4, that is, along a direction parallel to a plane formed by the X-axis and the Y-axis shown in the figure, the thermal conductivity of the second heat-conducting layer 4 is not less than 1400 w / (m*k).

[0149] In some embodiments, the support structure is an axisymmetric structure.

[0150] It should be noted that an axisymmetric structure refers to an object or structure that is symmetrically distributed relative to a certain straight line (called the axis of symmetry or central axis), and after being folded along the axis of symmetry, the parts on both sides of the axis of symmetry can completely overlap. For the support structure in the embodiment of the present application, its cross section can be symmetrical about its central axis.

[0151] The support structure is set as an axisymmetric structure. When the support structure is subjected to external force, the stress can be distributed more evenly and the occurrence of stress concentration can be reduced. In this way, the support structure can have better stability and bearing capacity. In addition, the stress inside the support structure can be balanced and the warping caused by the asymmetric stress distribution of each layer can be reduced.

[0152] Exemplarily, the third composite layer 5 and the first composite layer 1 may be symmetrically arranged about the central axis of the support structure itself, and the second heat conducting layer 4 and the first heat conducting layer 2 of the support structure may be symmetrically arranged about the central axis of the support structure itself.

[0153] Reference Fig. 9 In some embodiments, a conductive layer 6 is disposed on a side of the first composite layer 1 facing away from the second composite layer 3 , and the conductive layer 6 is used to be connected to a grounding structure.

[0154] It should be noted that the conductive layer 6 may cover the entire side of the first composite layer 1 away from the second composite layer 3, or may be disposed on a portion of the first composite layer 1 away from the second composite layer 3. When the supporting structure includes the first composite layer 1 and the second composite layer 3, the second composite layer 3 may be used to connect to the display module, and when the supporting structure includes the first composite layer 1, the second composite layer 3 and the third composite layer 5, the third composite layer 5 may be used to connect to the display module. That is, the conductive layer 6 may be disposed on the side of the supporting structure away from the display module.

[0155] A conductive layer 6 is disposed on the side of the first composite layer 1 facing away from the second composite layer 3 . The conductive layer 6 can be connected to a grounding structure, so that the display module is grounded, or the entire electronic device is grounded, which helps to improve the safety of the electronic device.

[0156] In some embodiments, the conductive layer 6 may be a multi-layer structure. For example, the conductive layer 6 may include a first layer 61, a second layer 62, and a third layer 63 stacked in sequence, wherein the first layer 61 may be connected to the first composite layer 1, and the first layer 61 is a metal nickel layer, so that the first layer 61 can be stably attached to the first composite layer 1, so that the conductive layer 6 as a whole can be stably attached to the first composite layer 1, and the second layer 62 may be a metal silver layer or a metal copper layer, so that the overall resistance of the conductive layer 6 can be reduced, and the third layer 63 may be a metal nickel layer, and the third layer 63 may cover the second layer 62, thereby reducing the contact between the second layer 62 and the air, reducing the oxidation of the second layer 62, and playing an anti-oxidation protection role for the second layer 62; the first layer 61, the second layer 62, and the third layer 63 may be arranged in parallel, so that the overall resistance of the conductive layer 6 can be further reduced. In this embodiment, the conductive layer 6 can be formed on the first composite layer 1 by electroplating, sputtering, etc. Exemplarily, the conductive layer 6 can be formed by physical vapor deposition (PVD) on the side of the first composite layer 1 away from the second composite layer 3 .

[0157] In some embodiments, the conductive layer 6 may also be a conductive adhesive layer containing nano-metal particles such as nano-silver particles and nano-nickel particles. It should be noted that the colloid of the conductive adhesive layer may be solidified by glue, and the glue may be a thermosetting glue. For example, the thermosetting glue may be epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.; the glue may also be a light-curing glue. For example, the light-curing glue may be acrylate glue, ultraviolet light-curing glue, etc.; in addition, the glue may also be a moisture-curing glue. For example, the moisture-curing glue may be cyanoacrylate glue, PUR (polyurethane reactive, moisture-curing reactive polyurethane hot melt adhesive), etc.

[0158] In some embodiments, the maximum surface resistance of the conductive layer is less than 2Ω.

[0159] It should be noted that when the conductive layer 6 is connected in different directions, the resistance value of the conductive layer 6 will be different. For example, when the width of the conductive layer 6 is smaller than its length, the resistance value generated by connecting the conductive layer along the width direction of the conductive layer 6 is smaller than the resistance value generated by connecting the conductive layer 6 along the length direction of the conductive layer 6. That is, the resistance value generated by the conductive layer 6 is related to the connection method, and the greater the connection distance, the greater the resistance value generated by the conductive layer 6. Therefore, when the conductive layer is connected along the diagonal direction of the conductive layer 6, the resistance value generated is greater.

[0160] By setting the maximum value of the surface resistance of the conductive layer 6 to be less than 2Ω, the interference current can flow to the ground structure through the conductive layer 6, thereby reducing the interference of the current on the display module.

[0161] In some embodiments, the maximum surface resistance of the conductive layer 6 is less than 1Ω. This can further reduce the interference of the current on the display module.

[0162] In some embodiments, the thickness of the conductive layer 6 may be less than 10 μm. Setting the thickness of the conductive layer 6 to less than 10 μm can reduce the influence of the conductive layer on the overall structure of the support structure, thereby ensuring the heat dissipation performance of the support structure.

[0163] In some embodiments, the thickness of the conductive layer 6 may be less than 5 μm, which can further reduce the influence of the conductive layer on the overall structure of the support structure, thereby ensuring the heat dissipation performance of the support structure.

[0164] Illustratively, the thickness of the conductive layer 6 may be 3 μm, 3.2 μm, 3.4 μm, 3.6 μm, 3.8 μm, 4 μm, 4.2 μm, 4.4 μm, 4.6 μm, 4.8 μm, or 5 μm.

[0165] In some embodiments, the adhesion of the conductive layer 6 is not less than 4B.

[0166] It should be noted that adhesion is a description of the degree of firmness of the bond between materials such as coatings, inks, and films and the surface of the object to which they are attached, and it is derived from the internationally accepted 100-grid test standard. The 100-grid test is a common method for evaluating coating adhesion. During the test, a sharp knife is used to cut 10*10 small squares on the coating surface (the side length of each small square is usually 1mm or 2mm) to form a grid pattern of 100 small squares. Then, use a special tape (such as 3M600 tape) to stick it tightly on the cut grid, and quickly and evenly peel off the tape. The level of adhesion is judged by observing the shedding of the coating in the grid area. The adhesion rating is divided into 5 levels, from 0B to 5B. The higher the level, the better the adhesion, as follows:

[0167] 5B: The coating of the 100 small squares cut out was not peeled off at all.

[0168] 4B: Among the 100 small squares, no more than 5% of the squares have coating peeling.

[0169] 3B: 5% to 15% of the squares have coating peeling off.

[0170] 2B: The coating peeling ratio reaches 15% to 35%.

[0171] 1B: The coating peeling ratio is between 35% and 65%.

[0172] 0B: More than 65% of the squares have coating peeling off, or even the entire coating has almost completely peeled off.

[0173] By setting the adhesion of the conductive layer 6 to be no less than 4B, the bonding stability between the conductive layer 6 and the first composite layer 1 can be ensured, thereby ensuring the grounding effect of the module structure.

[0174] In some embodiments, the overall thickness of the support structure ranges from 0.1 mm to 1 mm. Setting the overall thickness range of the support structure to not less than 0.1 mm can allow the support structure to have a certain thickness, thereby ensuring the overall strength of the support structure. Setting the overall thickness of the support structure to not more than 1 mm can limit the thickness of the support structure to reduce the space occupied by the support structure in the electronic device.

[0175] In some embodiments, the overall thickness of the support structure ranges from 0.1 mm to 0.15 mm. Setting the overall thickness of the support structure to no greater than 0.15 mm can further reduce the space occupied by the support structure in the electronic device.

[0176] Illustratively, the thickness of the entire support structure may be 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, or 0.15 mm.

[0177] In some embodiments, the elastic modulus of the entire support structure is greater than or equal to 70 GPa.

[0178] The elastic modulus refers to the ratio of stress to strain acting on a material during its elastic deformation stage. The elastic modulus characterizes the rigidity or hardness of a material. The larger the elastic modulus, the smaller the elastic deformation of the material under the same stress, that is, the less likely the material is to undergo elastic deformation, and the harder and more rigid it appears; conversely, the smaller the elastic modulus, the easier it is for the material to undergo elastic deformation when subjected to stress, and the softer it appears.

[0179] Setting the elastic modulus of the support structure to be greater than or equal to 70 GPa can make the support structure have a certain rigidity so that the support structure can stably support the display module. In addition, it can also make the support structure have a certain flexibility. When subjected to a collision impact, the support structure can produce a certain deformation to reduce the impact of the impact on the display module.

[0180] In some embodiments, the tensile strength of the support structure is greater than or equal to 700 MPa.

[0181] Tensile strength refers to the maximum tensile stress that a material can withstand before it breaks. It characterizes the material's ability to resist tensile damage and is measured through a tensile test. In a tensile test, an axial tensile force is applied to a material specimen of standard shape and size to gradually elongate it until it breaks. During this process, the tensile force will continue to increase, and the elongation of the specimen will also change accordingly. When the tensile force reaches its maximum value, the corresponding stress at this time is the tensile strength of the material.

[0182] Setting the tensile strength of the support structure to be greater than or equal to 700 MPa can prevent the support structure from breaking when subjected to a large tensile force, so that the material can still maintain structural integrity under a large load.

[0183] In some embodiments, the elongation at break of the support structure is greater than or equal to 1%.

[0184] Elongation at break refers to the percentage of the length added to the gauge length of a material when it breaks during stretching to the original gauge length. In simple terms, it is the extent to which a material can be stretched before being broken, and is an important indicator for measuring the plasticity of a material. Elongation at break intuitively reflects the plasticity of a material. Materials with good plasticity have a higher elongation at break and can deform greatly when subjected to force without breaking immediately, which allows the material to be made into various shapes through plastic deformation during processing, such as through rolling, forging, stretching and other processes to be processed into plates, pipes, wires, etc. At the same time, during use, materials with good plasticity can absorb more energy, have better resistance when subjected to impact or overload, and are not prone to sudden brittle fracture, which improves the safety and reliability of the material.

[0185] Setting the fracture elongation of the support structure to be greater than or equal to 1% can enable the support structure to have a certain degree of plastic deformation ability before tensile fracture, that is, the support structure is not completely brittle and can undergo a certain degree of plastic deformation when subjected to tension. It can absorb and disperse energy through its own deformation to reduce the probability of brittle fracture, which helps to improve the support stability of the support structure.

[0186] In some embodiments, the thickness of the first heat-conducting layer 2 may be 5 μm to 100 μm. Setting the thickness of the first heat-conducting layer 2 to be not less than 5 μm can allow the first heat-conducting layer 2 to have a certain strength, thereby reducing the risk of the first heat-conducting layer 2 being broken; setting the thickness of the first heat-conducting layer 2 to be not more than 100 μm can reduce the space occupied by the first heat-conducting layer 2, thereby reducing the size of the supporting structure, thereby reducing the space occupied by the supporting structure in the electronic device, and in addition, it can also meet the requirements of both heat dissipation and thinness.

[0187] In some embodiments, the thickness of the first heat-conducting layer 2 may be 12 μm to 30 μm. Setting the thickness of the first heat-conducting layer 2 to be not less than 12 μm can allow the first heat-conducting layer 2 to have a certain strength, thereby further reducing the risk of the first heat-conducting layer 2 being broken; setting the thickness of the first heat-conducting layer 2 to be not more than 30 μm can further reduce the space occupied by the first heat-conducting layer 2, thereby reducing the size of the support structure, thereby reducing the space occupied by the support structure in the electronic device.

[0188] Exemplarily, the thickness of the first heat conducting layer 2 may be 12 μm, 14 μm, 18 μm, 20 μm, 21 μm, 22 μm, 24 μm, 26 μm, 27 μm, 28 μm, or 30 μm.

[0189] In some embodiments, the thickness of the second thermally conductive layer 4 may be 5 μm to 100 μm. In some embodiments, the thickness of the second thermally conductive layer 4 may be 12 μm to 30 μm. Exemplarily, the thickness of the second thermally conductive layer 4 may be 12 μm, 14 μm, 18 μm, 20 μm, 21 μm, 22 μm, 24 μm, 26 μm, 27 μm, 28 μm, or 30 μm.

[0190] In some embodiments, the thickness of the second heat-conducting layer 4 may be the same as the thickness of the first heat-conducting layer 2 , and in other embodiments, the thickness of the second heat-conducting layer 4 may be different from the thickness of the first heat-conducting layer 2 .

[0191] In some embodiments, the thermal conductivity of the first thermally conductive layer 2 is greater than or equal to 1400w / (m*k) in a direction perpendicular to the thickness of the first thermally conductive layer 2, that is, in a direction parallel to the plane formed by the X-axis and the Y-axis shown in the figure. Setting the thermal conductivity of the first thermally conductive layer 2 to be greater than or equal to 1400w / (m*k) can make the first thermally conductive layer 2 have a higher heat dissipation capacity, thereby reducing the accumulation of heat in the connection area between the display module and the support structure; in addition, for some miniaturized electronic devices with limited space, the use of the first thermally conductive layer 2 with a high thermal conductivity can achieve good heat dissipation effect in a smaller heat dissipation space, which is conducive to the miniaturization and lightweight design of electronic devices.

[0192] In some embodiments, the thermal conductivity of the second thermally conductive layer is greater than or equal to 1400w / (m*k) in a direction perpendicular to the thickness of the second thermally conductive layer 4, that is, in a direction parallel to the plane formed by the X-axis and the Y-axis shown in the figure. Setting the thermal conductivity of the second thermally conductive layer 4 to be greater than or equal to 1400w / (m*k) can make the second thermally conductive layer 4 have a higher heat dissipation capacity, thereby reducing the accumulation of heat in the connection area between the display module and the support structure; in addition, for some miniaturized electronic devices with limited space, the use of the first thermally conductive layer 2 with a high thermal conductivity can achieve good heat dissipation effect in a smaller heat dissipation space, which is conducive to the miniaturization and lightweight design of electronic devices.

[0193] In some embodiments, the thermal conductivity of the first heat conducting layer 2 may be the same as the thermal conductivity of the second heat conducting layer 4 .

[0194] In some embodiments, the support structure may further include a fourth composite layer, a third heat-conducting layer, etc., wherein the fourth composite layer may be arranged on the side of the third composite layer 5 away from the second composite layer 3, the third heat-conducting layer may be sandwiched between the fourth composite layer and the third composite layer 5, the connection method between the fourth composite layer and the third composite layer 5 may be the same as the connection method between the third composite layer 5 and the second composite layer 3, and the structure of the third heat-conducting layer may be the same as the structure of the second heat-conducting layer 4; in other embodiments, the support structure may also have a larger number of composite layers and heat-conducting layers.

[0195] The present application also provides a method for manufacturing a support structure, which is used to manufacture the support structure in any of the above embodiments, comprising the following steps:

[0196] Immersing the first fiber 12 in the first glue to obtain a first composite layer 1 to be cured;

[0197] The first composite layer 1 to be cured is stacked on at least one side surface of the first heat conductive layer 2 along the thickness direction to obtain a first stacked structure;

[0198] The first laminate structure is pressed with a preset pressure so that the first composite layer 1 is solidified and attached to the first heat conductive layer 2 to obtain a support structure.

[0199] In this embodiment, the first composite layer 1 and the first thermal conductive layer 2 are pressed together using a preset pressure, which can increase the pressure between the first composite layer 1 and the first thermal conductive layer 2, thereby increasing the degree of bonding between the first composite layer 1 and the first thermal conductive layer 2 and ensuring the stability of the supporting structure.

[0200] In some embodiments, when the first stacked structure is pressed using a preset pressure, the temperature may be raised to a preset temperature and maintained for a preset time.

[0201] It should be noted that the embodiment of the present application raises the temperature to a preset temperature to cure the first composite layer 1. The first glue of the first composite layer 1 can be a thermosetting glue. Exemplarily, the thermosetting glue can be epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.

[0202] During the lamination process, the temperature is raised to a preset temperature, that is, the first composite layer 1 is cured by heat by hot pressing, thereby forming a support structure, which can reduce the difficulty of forming the support structure.

[0203] The preset temperature may be 80°C to 180°C; illustratively, the preset temperature may be 80°C, 90°C, 100°C, 110°C, 120°C, 130°C, 140°C, 150°C, 160°C, 170°C, or 180°C.

[0204] In some embodiments, the preset time may be 10 min to 30 min. For example, the preset time may be 10 min, 15 min, 20 min, 25 min, or 30 min.

[0205] In some embodiments, the preset pressure may be 0.5 MPa to 6 MPa. For example, the preset pressure may be 0.5 MPa, 1 MPa, 1.5 MPa, 2 MPa, 2.5 MPa, 3 MPa, 3.5 MPa, 4 MPa, 4.5 MPa, 5 MPa, 5.5 MPa, or 6 MPa.

[0206] In any of the above embodiments, the first composite layer 1 to be cured may be a carbon fiber prepreg.

[0207] In some embodiments, after heat pressing, the edge of the support structure may be trimmed to adjust the shape of the support structure.

[0208] In some embodiments, after hot pressing, a conductive layer 6 may be formed on a side of the first composite layer 1 facing away from the first heat conductive layer to obtain a support structure with a conductive layer 6 .

[0209] In some embodiments, the conductive layer 6 can be formed by physical vapor deposition (PVD) or by coating. For example, when the conductive layer 6 is formed by coating, a resin material containing nano-silver particles and nano-nickel particles can be coated on the side of the first composite layer 1 away from the second composite layer 3. The coating thickness formed by coating is less than 10 μm, and then the coating is baked at a baking temperature in the range of 80°C to 150°C. For example, the baking temperature can be 80°C, 90°C, 100°C, 110°C, 120°C, 130°C, 140°C, or 150°C, and the baking time is 10 min to 30 min; for example, the baking time can be 10 min, 15 min, 20 min, 25 min, or 30 min.

[0210] In some embodiments, after the conductive layer 6 is formed, the support structure may be cut using a laser to trim the shape of the support structure.

[0211] The present application also provides a method for manufacturing a support structure, which is used to manufacture the support structure in any of the above embodiments, comprising the following steps:

[0212] Arranging the first fibers 12 in a first preset direction and immersing them in the first glue to obtain a first composite layer 1 to be cured;

[0213] Arrange the second fibers 32 according to a second preset direction and immerse them in the second glue to obtain a second composite layer 3 to be cured;

[0214] The first composite layer 1 to be cured is stacked on one side surface of the first heat conductive layer 2 along the thickness direction, and the second composite layer 3 to be cured is stacked on the other side surface of the first heat conductive layer 2 along the thickness direction to obtain a second laminated structure;

[0215] The second laminate structure is pressed together using a preset pressure, so that the first composite layer 1 and the second composite layer 3 are solidified and attached to the first heat conductive layer 2 to obtain a support structure.

[0216] It should be noted that, in some embodiments, the first preset direction and the second preset direction may be arranged in parallel, and in other embodiments, the first preset direction and the second preset direction may be arranged at an angle.

[0217] In this embodiment, the second laminate structure is pressed with a preset pressure, which can increase the pressure between the first composite layer 1, the first heat-conducting layer 2 and the second composite layer 3, thereby increasing the degree of bonding between the first composite layer 1, the first heat-conducting layer 2 and the second composite layer 3, and ensuring the stability of the support structure. Before the first composite layer 1 and the second composite layer 3 are solidified, the first fiber 12 is arranged in the first preset direction, and the second fiber 32 is arranged in the second preset direction, so that the first fiber 12 of the formed support structure can be arranged in the first preset direction, and the second fiber 32 can be arranged in the second preset direction, which can reduce the difficulty of arranging the first fiber 12 and the second fiber 32, and help reduce the difficulty of forming the support structure; in addition, the first fiber 12 is arranged in the first preset direction, and the second fiber 32 is arranged in the second preset direction, so that the first fiber 12 and the second fiber 32 are arranged in an orderly manner, so that the performance of the first composite layer 1 and the second composite layer 3 can be relatively stable and predictable, which is convenient for structural design and performance optimization, and the arrangement direction and density of the first fiber 12 and the second fiber 32 can be precisely controlled to achieve precise regulation of the performance of the support structure to meet the needs of different usage scenarios.

[0218] In some embodiments, in the step of obtaining the second laminated structure, the length direction of the first fiber 12 and the length direction of the second fiber 32 are set at an angle, wherein the length direction of the first fiber 12 is a first preset direction, and the length direction of the second fiber 32 is a second preset direction.

[0219] The first preset direction and the second preset direction are set at an angle, that is, the length directions of the first fibers 12 and the second fibers 32 are set at an angle. The first fibers 12 and the second fibers 32 can be combined to form a mesh structure. In this way, the strength of the supporting structure in all directions can be improved, thereby improving the supporting effect on related module structures such as display modules.

[0220] In some embodiments, the first preset direction may be the first direction in any of the above embodiments, and the second preset direction may be the second direction in any of the above embodiments.

[0221] In some embodiments, when the second stacked structure is pressed using a preset pressure, the temperature may be raised to a preset temperature and maintained for a preset time.

[0222] It should be noted that the embodiment of the present application raises the temperature to a preset temperature to cure the first composite layer 1 and the second composite layer. The first glue and the second glue can be thermosetting glues. Exemplarily, the thermosetting glue can be epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.

[0223] During the lamination process, the temperature is raised to a preset temperature, that is, the first composite layer 1 and the second composite layer are cured by heat pressing to form a support structure, thereby reducing the difficulty of forming the support structure.

[0224] The preset temperature may be 80°C to 180°C; illustratively, the preset temperature may be 80°C, 90°C, 100°C, 110°C, 120°C, 130°C, 140°C, 150°C, 160°C, 170°C, or 180°C.

[0225] In some embodiments, the preset time may be 10 min to 30 min. For example, the preset time may be 10 min, 15 min, 20 min, 25 min, or 30 min.

[0226] In some embodiments, the preset pressure may be 0.5 MPa to 6 MPa. For example, the preset pressure may be 0.5 MPa, 1 MPa, 1.5 MPa, 2 MPa, 2.5 MPa, 3 MPa, 3.5 MPa, 4 MPa, 4.5 MPa, 5 MPa, 5.5 MPa, or 6 MPa.

[0227] In any of the above embodiments, the first composite layer 1 and the second composite layer to be cured may be carbon fiber prepregs.

[0228] In some embodiments, after heat pressing, the edge of the support structure may be trimmed to adjust the shape of the support structure.

[0229] In some embodiments, after hot pressing, a conductive layer 6 may be formed on a side of the first composite layer 1 facing away from the second composite layer 3 to obtain a support structure with a conductive layer 6 .

[0230] In some embodiments, the conductive layer 6 can be formed by physical vapor deposition (PVD) or by coating. For example, when the conductive layer 6 is formed by coating, a resin material containing nano-silver particles and nano-nickel particles can be coated on the side of the first composite layer 1 away from the second composite layer 3. The coating thickness formed by coating is less than 10 μm, and then the coating is baked at a baking temperature in the range of 80°C to 150°C. For example, the baking temperature can be 80°C, 90°C, 100°C, 110°C, 120°C, 130°C, 140°C, or 150°C, and the baking time is 10 min to 30 min; for example, the baking time can be 10 min, 15 min, 20 min, 25 min, or 30 min.

[0231] In some embodiments, after the conductive layer 6 is formed, the support structure may be cut using a laser to trim the shape of the support structure.

[0232] The present application also provides a method for manufacturing a support structure, which is used to manufacture the support structure in any of the above embodiments, comprising the following steps:

[0233] Arranging the first fibers 12 in a first preset direction and immersing them in the first glue to obtain a first composite layer 1 to be cured;

[0234] Arrange the second fibers 32 according to a second preset direction and immerse them in the second glue to obtain a second composite layer 3 to be cured;

[0235] Arrange the third fibers 51 according to a third preset direction and immerse them in a third glue to obtain a third composite layer 5 to be cured;

[0236] The first composite layer 1 to be cured is stacked on one side surface of the first heat conductive layer 2 along the thickness direction, the second composite layer 3 to be cured is stacked on the other side surface of the first heat conductive layer 2 along the thickness direction, the second heat conductive layer 4 is stacked on the surface of the second composite layer 3 facing away from the first heat conductive layer 2, and the third composite layer 5 is stacked on the surface of the second heat conductive layer 4 facing away from the second composite layer 3, so as to obtain a third laminated structure;

[0237] The third laminate structure is pressed with a preset pressure so that the first composite layer 1, the second composite layer 3 and the third composite layer 5 are solidified and attached to the first heat conductive layer 2 and the second heat conductive layer 4 respectively, so as to obtain the support structure.

[0238] It should be noted that, in some embodiments, the first preset direction, the second preset direction, and the third preset direction may be parallel, or two of them may be parallel and set at an angle to the other, or they may be set at an angle to each other.

[0239] In this embodiment, the third laminate structure is pressed with a preset pressure, which can increase the pressure between the first composite layer 1, the first heat-conducting layer 2, the second composite layer 3, the second heat-conducting layer 4 and the third composite layer 5, thereby increasing the bonding degree of the first composite layer 1, the first heat-conducting layer 2, the second composite layer 3, the second heat-conducting layer 4 and the third composite layer 5, and ensuring the stability of the support structure. Before the first composite layer 1, the second composite layer 3 and the third composite layer 5 are solidified, the first fiber 12 is arranged in the first preset direction, the second fiber 32 is arranged in the second preset direction, and the third fiber 51 is arranged in the third preset direction, so that the first fiber 12 of the molded support structure can be arranged in the first preset direction, the second fiber 32 can be arranged in the second preset direction, and the third fiber 51 can be arranged in the third preset direction. This can reduce the difficulty of arranging the first fiber 12, the second fiber 32 and the third fiber 51, which helps to reduce the difficulty of molding the support structure; in addition, Arranging the first fibers 12 in a first preset direction, arranging the second fibers 32 in a second preset direction, and arranging the third fibers 51 in a third preset direction can make the first fibers 12, the second fibers 32, and the third fibers 51 arranged in order, so that the performance of the first composite layer 1, the second composite layer 3, and the third composite layer 5 can be relatively stable and predictable, which is convenient for structural design and performance optimization, and by precisely controlling the arrangement direction and density of the first fibers 12, the second fibers 32, and the third fibers 51, precise regulation of the performance of the supporting structure can be achieved to meet the needs of different usage scenarios.

[0240] In some embodiments, in the step of obtaining the third laminated structure, the length direction of the second fiber 32 is set at an angle to the length directions of the first fiber 12 and the third fiber 51, respectively, wherein the length direction of the first fiber 12 is a first preset direction, the length direction of the second fiber 32 is a second preset direction, and the length direction of the third fiber 51 is a third preset direction.

[0241] The length direction of the second fiber 32 is set at an angle with the length direction of the first fiber 12 and the third fiber 51. The second fiber 32 can be combined with the first fiber 12 and the third fiber 51 to form a mesh structure. In this way, the strength of the supporting structure in all directions can be improved, thereby improving the supporting effect on related module structures such as display modules.

[0242] In some embodiments, in the step of obtaining the second stacked structure, the length direction of the first fibers 12 is parallel to the length direction of the third fibers 51 .

[0243] The third composite layer 5 and the first composite layer 1 are respectively located on both sides of the second composite layer 3, and the length directions of the first fiber 12 and the third fiber 51 are arranged in parallel. The fibers on both sides of the second composite layer 3 are arranged in the same direction. In this way, the forces on both sides of the second composite layer 3 are balanced, which can reduce the internal stress of the support structure, thereby reducing the warping of the support structure.

[0244] Thus, the first preset direction and the third preset direction may be the first direction in any of the above embodiments, and the second preset direction may be the second direction in any of the above embodiments.

[0245] In some embodiments, when the third laminate structure is pressed using a preset pressure, the temperature may be raised to a preset temperature and maintained for a preset time.

[0246] It should be noted that the embodiment of the present application raises the temperature to a preset temperature to cure the first composite layer 1, the second composite layer 3 and the third composite layer 5. The first glue, the second glue and the third glue can be thermosetting glues. Exemplarily, the thermosetting glue can be epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.

[0247] During the lamination process, the temperature is raised to a preset temperature, that is, the first composite layer 1, the second composite layer 3 and the third composite layer 5 are cured by heat pressing to form a support structure, thereby reducing the difficulty of forming the support structure.

[0248] The preset temperature may be 80°C to 180°C; illustratively, the preset temperature may be 80°C, 90°C, 100°C, 110°C, 120°C, 130°C, 140°C, 150°C, 160°C, 170°C, or 180°C.

[0249] In some embodiments, the preset time may be 10 min to 30 min. For example, the preset time may be 10 min, 15 min, 20 min, 25 min, or 30 min.

[0250] In some embodiments, the preset pressure may be 0.5 MPa to 6 MPa. For example, the preset pressure may be 0.5 MPa, 1 MPa, 1.5 MPa, 2 MPa, 2.5 MPa, 3 MPa, 3.5 MPa, 4 MPa, 4.5 MPa, 5 MPa, 5.5 MPa, or 6 MPa.

[0251] In any of the above embodiments, the first composite layer 1, the second composite layer 3 and the third composite layer 5 to be cured may be carbon fiber prepregs.

[0252] In some embodiments, after heat pressing, the edge of the support structure may be trimmed to adjust the shape of the support structure.

[0253] In some embodiments, after hot pressing, a conductive layer 6 may be formed on a side of the first composite layer 1 facing away from the second composite layer 3 to obtain a support structure with a conductive layer 6 .

[0254] In some embodiments, the conductive layer 6 can be formed by physical vapor deposition (PVD) or by coating. For example, when the conductive layer 6 is formed by coating, a resin material containing nano-silver particles and nano-nickel particles can be coated on the side of the first composite layer 1 away from the second composite layer 3. The coating thickness formed by coating is less than 10 μm, and then the coating is baked at a baking temperature in the range of 80°C to 150°C. For example, the baking temperature can be 80°C, 90°C, 100°C, 110°C, 120°C, 130°C, 140°C, or 150°C, and the baking time is 10 min to 30 min; for example, the baking time can be 10 min, 15 min, 20 min, 25 min, or 30 min.

[0255] In some embodiments, after the conductive layer 6 is formed, the support structure may be cut using a laser to trim the shape of the support structure.

[0256] The embodiment of the present application also provides an electronic device, including a display module and a support structure in any of the above embodiments, wherein the support structure is connected to the display module to support the display module. Since the support structure has high strength, it can stably support the display module, which helps to improve the performance stability of the electronic device; since the support structure can effectively absorb and transfer the heat generated by the display module, the heat is not easy to accumulate at the connection between it and the support structure, thus, the overheating of the display module can be reduced, which helps to ensure the performance of the display module; since the support structure has a small mass, the weight of the electronic device can be reduced.

[0257] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A support structure, characterized in that: include: A first heat conducting layer; A first composite layer, along the thickness direction of the first heat-conducting layer, the first composite layer is attached to at least one side of the first heat-conducting layer and is thermally connected to the first heat-conducting layer; The first composite layer includes a first adhesive body and first fibers disposed in the first adhesive body, the hardness of the first fibers is higher than the hardness of the first adhesive body, and the thermal conductivity of the first fibers is higher than the thermal conductivity of the first adhesive body.

2. The support structure according to claim 1, characterized in that The support structure further includes a second composite layer, wherein the first composite layer and the second composite layer are respectively arranged on two opposite sides of the first heat-conducting layer, and the first heat-conducting layer is sealed between the first composite layer and the second composite layer and is heat-conductingly connected to the second composite layer; wherein, The second composite layer includes a second adhesive body and second fibers disposed in the second adhesive body, the hardness of the second fibers is higher than the hardness of the second adhesive body, and the thermal conductivity of the second fibers is higher than the thermal conductivity of the second adhesive body; Preferably, the edge of the second adhesive body is sealed to the edge of the first adhesive body, so that the first heat-conducting layer is sealed between the first composite layer and the second composite layer; Preferably, the first heat conducting layer is provided with a plurality of first through holes, the first composite layer is provided with a first protrusion at a position corresponding to each of the first through holes, the first protrusion passes through the first through hole and is connected to the second composite layer; and / or, The second composite layer is provided with second protrusions at positions corresponding to the first through holes, and the second protrusions pass through the first through holes and are connected to the first composite layer; Preferably, the first fiber comprises at least one of carbon fiber, metal fiber and carbon nanotube; and / or, the second fiber comprises at least one of carbon fiber, metal fiber and carbon nanotube; Preferably, the length of the first fiber extends along a first direction, the length of the second fiber extends along a second direction, and the first direction and the second direction are arranged at an angle.

3. The support structure according to claim 2, characterized in that: The support structure also includes: a third composite layer, the third composite layer being stacked on a side of the second composite layer away from the first composite layer, the third composite layer comprising a third adhesive body and third fibers disposed in the third adhesive body, the hardness of the third fibers being higher than the hardness of the third adhesive body of the third composite layer, and the thermal conductivity of the third fibers being higher than the thermal conductivity of the third adhesive body; A second heat-conducting layer, wherein the second heat-conducting layer is sealed between the third composite layer and the second composite layer, and the second heat-conducting layer is thermally connected to the third composite layer and the second composite layer respectively; Preferably, the length direction of the second fiber is arranged at an angle with the length directions of the first fiber and the third fiber respectively.

4. The support structure according to claim 3, characterized in that The length directions of the first fibers and the third fibers are arranged in parallel.

5. The support structure according to claim 3, characterized in that: The elastic modulus of the second fiber is higher than the elastic modulus of the first fiber and the third fiber; Preferably, the elastic modulus of the first fibers is equal to the elastic modulus of the third fibers.

6. The support structure according to any one of claims 1 to 5, characterized in that: The support structure is an axisymmetric structure; And / or, a conductive layer is provided on a side of the first composite layer away from the first heat-conducting layer, and the conductive layer is used to be connected to the grounding structure; preferably, the thickness of the conductive layer is less than 10 μm; preferably, the thickness of the conductive layer is less than 5 μm; and / or, the maximum surface resistance of the conductive layer is less than 2Ω; preferably, the maximum surface resistance of the conductive layer is less than 1Ω; and / or, the adhesion of the conductive layer to the first composite layer is greater than or equal to 4B; and / or, the thickness of the support structure is 0.1 mm to 1 mm; preferably, the thickness of the support structure is 0.1 mm to 0.15 mm; and / or, the elastic modulus of the support structure is greater than or equal to 70 Gpa; and / or, the tensile strength of the support structure is greater than or equal to 700 Mpa; and / or, the elongation at break of the support structure is greater than or equal to 1%; And / or, the thickness of the first heat-conducting layer is 5 μm to 100 μm; preferably, the thickness of the first heat-conducting layer is 12 μm to 30 μm; And / or, along a direction perpendicular to the thickness of the first heat-conducting layer, the thermal conductivity of the first heat-conducting layer is greater than or equal to 1400 w / (m*k).

7. A method for manufacturing a support structure, characterized in that: Used to manufacture the support structure according to any one of claims 1 to 6, the manufacturing method comprising: Immersing the first fiber in the first glue to obtain a first composite layer to be cured; Laying the first composite layer to be cured on at least one side surface of the first heat conductive layer in the thickness direction to obtain a first laminated structure; The first laminate structure is pressed using a preset pressure to solidify the first composite layer and adhere it to the first heat conductive layer to obtain the support structure.

8. A method for manufacturing a support structure, characterized in that: Used to manufacture the support structure according to any one of claims 1 to 6, the manufacturing method comprising: Arranging the first fibers in a first preset direction and immersing the fibers in a first glue to obtain a first composite layer to be cured; Arranging the second fibers in a second preset direction and immersing them in a second glue to obtain a second composite layer to be cured; The first composite layer to be cured is stacked on one side surface of the first heat-conducting layer along the thickness direction, and the second composite layer to be cured is stacked on the other side surface opposite to the first heat-conducting layer along the thickness direction to obtain a second stacked structure; Using a preset pressure to press the second laminate structure, so that the first composite layer and the second composite layer are solidified and attached to the first heat conductive layer, so as to obtain the support structure; Preferably, in the step of obtaining the second laminated structure, the length direction of the first fiber and the length direction of the second fiber are set at an angle, wherein the length direction of the first fiber is the first preset direction, and the length direction of the second fiber is the second preset direction.

9. A method for manufacturing a support structure, characterized in that: Used to manufacture the support structure according to any one of claims 1 to 6, the manufacturing method comprising: Arranging the first fibers in a first preset direction and immersing the fibers in a first glue to obtain a first composite layer to be cured; Arranging the second fibers in a second preset direction and immersing them in a second glue to obtain a second composite layer to be cured; Arranging the third fibers according to a third preset direction and immersing the fibers in a third glue to obtain a third composite layer to be cured; The first composite layer to be cured is stacked on one side surface of the first heat conductive layer in the thickness direction, the second composite layer to be cured is stacked on the other side surface of the first heat conductive layer in the thickness direction, the second heat conductive layer is stacked on the surface of the second composite layer facing away from the first heat conductive layer, and the third composite layer is stacked on the surface of the second heat conductive layer facing away from the second composite layer, so as to obtain a third laminated structure; Pressing the third laminate structure using a preset pressure so that the first composite layer, the second composite layer and the third composite layer are solidified and attached to the first heat conductive layer and the second heat conductive layer respectively, so as to obtain the support structure; Preferably, in the step of obtaining the third laminated structure, the length direction of the second fiber is arranged at an angle with the length directions of the first fiber and the third fiber, respectively, wherein the length direction of the first fiber is the first preset direction, the length direction of the second fiber is the second preset direction, and the length direction of the third fiber is the third preset direction; Preferably, in the step of obtaining the third stacked structure, the length direction of the first fibers is parallel to the length direction of the third fibers.

10. An electronic device, comprising a display module, characterized in that: It also includes the supporting structure according to any one of claims 1 to 6, wherein the supporting structure is connected to the display module to support the display module.

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