Circuit board packaging and transferring system

Abstract

A circuit board packaging and transferring system belongs to the technical field of printed circuit board conveying and packaging and comprises a stacking assembly and a transferring device. Each stacking assembly comprises a transverse guide groove, the tail end of each transverse guide groove is provided with a longitudinal guide groove, the junction of the transverse guide groove and the longitudinal guide groove is provided with an arc transition structure, the transverse guide grooves and the longitudinal guide grooves are used for laying buffer strips, and the front ends of the transverse guide grooves are provided with clamping groove cutting assemblies for machining the buffer strips. The longitudinal guide groove is provided with a cutter hole used for allowing the cutter to penetrate through. The outer side walls of the two longitudinal guide grooves of the paired stacking assemblies are oppositely arranged, and the two transverse guide grooves belong to the same horizontal height. The transferring device is used for transferring the circuit boards to the middle of the stacking assemblies arranged in pairs and at least has the function of controlling the circuit boards to move in the vertical direction and the horizontal direction. According to the scheme, automatic packaging can be achieved, high packaging efficiency is achieved, and the circuit boards packaged through the scheme can effectively prevent scratches from being generated between the adjacent circuit boards.

Description

Technical Field

[0001] The invention belongs to the technical field of printed circuit board conveying and packaging, and in particular relates to a circuit board packaging and transferring system. Background Art

[0002] To ensure the safety of circuit boards during storage and transportation, they need to be packaged after processing. The commonly used packaging method is to use bubble bags to vacuum-pack the stacked circuit boards. In order to improve efficiency during the packaging process, existing packaging equipment also uses robotic arms or adsorption transfer equipment to automatically stack circuit boards. Although the existing packaging process has high efficiency, this type of packaging method causes the surfaces of adjacent circuit boards to come into direct contact, resulting in the risk of scratches on the circuit boards. Summary of the invention

[0003] In order to solve the deficiencies of the prior art, the present invention provides a circuit board packaging and transfer system, which can realize automated packaging and has high packaging efficiency. In addition, the circuit boards packaged by this solution can effectively prevent scratches between adjacent circuit boards.

[0004] In order to achieve the purpose of the present invention, the following scheme is proposed: A circuit board packaging and transfer system comprises: a stacking component and a transfer device.

[0005] The stacking assembly is provided with at least one pair, which includes a horizontally arranged transverse guide groove, the end of which is provided with a vertically downward longitudinal guide groove, and the junction of the two has an arc transition structure, the top surface of the transverse guide groove and the outer side wall of the longitudinal guide groove are both used to lay and guide the buffer strip to move, the buffer strip has toughness, and a cutting groove assembly is provided at the front end of the transverse guide groove, which is used to form a card groove on the surface of the buffer strip, and the card groove is perpendicular to the moving direction of the buffer strip, and a cutter is provided below the transverse guide groove, which is perpendicular to the moving direction of the buffer strip on the longitudinal guide groove, and the longitudinal guide groove is provided with a cutter hole for passing the cutter; the outer side walls of the two longitudinal guide grooves of the paired stacking assembly are arranged oppositely, and the two transverse guide grooves are at the same horizontal height; the distance between the surfaces of the buffer strips in the longitudinal guide grooves on both sides is less than the width of the circuit board, and the distance between the bottom surfaces of the card grooves on both sides is greater than the width of the circuit board; The transfer device is used to transfer the circuit board to the middle of the paired stacking components, and the transfer device at least has the function of controlling the circuit board to move in the vertical and horizontal directions.

[0006] The beneficial effects of the present invention are: 1. This solution uses the card slots of the buffer strip to space and fix the circuit boards, effectively preventing contact between adjacent circuit boards, thereby avoiding scratches on the circuit boards.

[0007] 2. The solution realizes the automatic transfer, stacking and packaging process of circuit boards, has a higher degree of automation, and can effectively improve the packaging and transfer efficiency of circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.

[0009] Figure 1 The overall structural diagram of the preferred solution of the present application is shown.

[0010] Figure 2 An end view of a preferred embodiment of the present invention is shown.

[0011] Figure 3 Shows Figure 2 A partial enlarged view of point A in the middle.

[0012] Figure 4 A schematic diagram of the bottom structure of the stacking assembly is shown.

[0013] Figure 5 A schematic diagram of the top structure of the stacking assembly is shown.

[0014] Figure 6 The overall structural schematic diagram of the stockpile assembly after the buffer strips are laid is shown.

[0015] Figure 7 Shows Figure 6 A partial enlarged view of point B in the middle.

[0016] Markings in the figure: stacking component -1, transverse guide groove -11, limit strip -112, longitudinal guide groove -12, cutter hole -121, extension plate -122, cutter -13, friction wheel -14, rotating motor -15, circular blade -16, driven bevel gear -161, transmission shaft -162, driving bevel gear -163, driving motor -164, position sensor -17, grooving component -2, cutting line -21, pulley -22, U-shaped frame -23, cutting motor -24, gantry -25, screw -26, transfer device -3, horizontal transfer component -31, vertical transfer component -32, suction cup -33, track -41, telescopic device -42, conveying track -43, lifting component -44, support plate -45, lifting device -46, buffer strip -9, card slot -91, guide slot -92. DETAILED DESCRIPTION

[0017] To make the objectives, technical solutions and advantages of the embodiments of the present invention more clear, the implementation modes of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0018] like Figures 1 to 6 As shown, a circuit board packaging transfer system includes: a stacking component 1, a transfer device 3 The stacking assembly 1 is provided with at least one pair, which includes a horizontally arranged transverse guide groove 11, at the end of which is provided with a vertically downward longitudinal guide groove 12, and the junction between the two has an arc transition structure. The top surface of the transverse guide groove 11 and the outer side wall of the longitudinal guide groove 12 are both used to lay and guide the movement of the buffer strip 9. The buffer strip 9 has toughness so that it can smoothly pass through the arc transition structure between the transverse guide groove 11 and the longitudinal guide groove 12. The buffer strip 9 can be made of pearl cotton strips or flexible foam strips. Specifically, in the present embodiment, the outer side wall of the longitudinal guide groove 12 refers to the side wall of the longitudinal guide groove 12 facing the rear of the transverse guide groove 11. The buffer strip 9 enters from the front end of the transverse guide groove 11 and moves out from the rear end, then enters from the upper end of the longitudinal guide groove 12, and finally moves out from the lower end of the longitudinal guide groove 12. During the movement of the buffer strip 9, its back side is in close contact with the top surface of the transverse guide groove 11 and the outer side wall of the longitudinal guide groove 12. A groove cutting component 2 is provided at the front end of the transverse guide groove 11 for forming a card groove 91 on the surface of the buffer strip 9. The card groove 91 is perpendicular to the moving direction of the buffer strip 9. It can also be understood that the card groove 91 is perpendicular to the top surface of the transverse guide groove 11 and the connection direction of the front and rear ends of the transverse guide groove 11. The card groove 91 is a "groove" structure. , so it must pass through the back of the buffer strip 9, so there must be a predetermined interval between the bottom of the card slot 91 and the back of the buffer strip 9, and a cutter 13 is provided below the transverse guide groove 11, which is perpendicular to the moving direction of the buffer strip 9 on the longitudinal guide groove 12, and can also be understood as the cutter 13 is perpendicular to the connecting direction between the upper and lower ends of the longitudinal guide groove 12, and the longitudinal guide groove 12 is provided with a cutter hole 121 for passing the cutter 13; the outer side walls of the two longitudinal guide grooves 12 of the paired stacking assembly 1 are arranged opposite to each other, and the two transverse guide grooves 11 belong to the same horizontal height; the distance between the surfaces of the buffer strips 9 located in the longitudinal guide grooves 12 on both sides is less than the width of the circuit board, and the distance between the bottom surfaces of the card slots 91 on both sides is greater than the width of the circuit board.

[0019] The transfer device 3 is used to transfer the circuit board to the middle of the paired stacking components 1. The transfer device 3 has at least the function of controlling the movement of the circuit board in the vertical and horizontal directions. To achieve the above purpose, a multi-axis robotic arm or a mechanical device with horizontal and vertical drive can be used.

[0020] The conveying track 43 is arranged below the middle position of the same pair of stacking components 1, and the conveying direction of the conveying track 43 is as follows: Figure 1The arrow in the middle is consistent with the extension direction of the card slot 91, which is used to transport the packaging box. A lifting assembly 44 is provided below the conveying track 43, which includes a plurality of support plates 45 inserted between the rollers of the conveying track 43, and is used to control the lifting and lowering of the packaging box on the conveying track 43. The lifting assembly 44 is located below the middle position of the stacking assembly 1 set in the same pair. A lifting device 46 is provided at the bottom of the lifting assembly 44, which is used to control the lifting and lowering of the lifting assembly 44. When working, when the empty packaging box moves to the position above the lifting assembly 44, the lifting assembly 44 lifts the packaging box to a predetermined position, so that the packaging box is sleeved on the outside of the lower ends of the two longitudinal guide grooves 12, so that the stacked box The circuit boards can be loaded into the packaging box more smoothly. After the buffer strip 9 is cut off, the stacked circuit boards can automatically fall into the packaging box under the action of gravity. After completing the above work, the lifting assembly 44 descends to separate the packaging box from the longitudinal guide groove 12 and fall on the conveying track 43 again, and then it is output by the conveying track 43; the packaging box moves to the position above the lifting assembly 44. The position of the packaging box can be detected by setting a sensor on the side of the conveying track 43. When the sensor detects the position signal of the packaging box, it indicates that the packaging box has moved to the predetermined position above the lifting assembly 44. At this time, the lifting assembly 44 can lift the packaging box upward.

[0021] The above structure can be used to implement the most basic packaging transfer scheme of this scheme, and the specific process is as follows: when used for the first time, manually lay the buffer strip 9 on the two groups of pushing components 1. When laying, first insert the front end of the buffer strip 9 from the front end of the transverse guide groove 11. When the front end of the buffer strip 9 passes the predetermined position of the groove cutting component 2, the groove cutting component 2 is used to open a groove 91 with a predetermined depth on the top surface of the buffer strip 9, and then continue to move the buffer strip 9 to the end of the transverse guide groove 11. After each movement of the buffer strip 9 by a predetermined distance, the groove cutting component 2 is used to process a groove 91 on its top surface, and the buffer strip 9 is passed around the arc transition structure and then inserted into the upper end of the longitudinal guide groove 12. At this point, the work content of manually laying the buffer strip 9 when used for the first time is completed, and then the circuit boards can be automatically transferred and stacked. At this time, the top surface of the buffer strip 9 located at the arc transition structure will be in an arc bending state under the guidance of the arc transition structure, so that the corresponding card slot 91 at this place will be in an open state; the transfer device 3 is used to control the position of the circuit board in the vertical direction so that it is aligned with the open card slot 91, and the circuit board is located between the two groups of stacking components 1, and then the transfer device 3 is used to control the circuit board to pass through the card slots 91 in the open state on both sides. Because the distance between the surfaces of the buffer strips 9 located in the longitudinal guide grooves 12 on both sides is less than the width of the circuit board, and the distance between the bottom surfaces of the card slots 91 on both sides is greater than the width of the circuit board, the two side edges of the circuit board in the width direction are just located in the card slots 91 on both sides; the transfer device 3 is used to push the circuit board inserted into the card slot 91 downward, and the bottom surface of the circuit board will abut against the physical part below the card slot 91, and the physical part abutting against the circuit board is used to push the two buffer strips 9 to move toward the lower end of the longitudinal guide groove 12 together. The transfer device 3 can control the descending distance of the circuit board and simultaneously achieve the purpose of controlling the moving distance of the buffer bar 9. When the circuit board moves downward by a predetermined distance, the transfer device 3 separates from the circuit board and begins to prepare to transfer the next circuit board. The predetermined distance that the circuit board moves downward is the same as the spacing between adjacent card slots 91. It can also be understood in reverse that the transfer device 3 is used to control the descending distance of the circuit board, and the distance is also the distance of the card slots 91 processed on the buffer bar 9, that is, after the transfer device 3 transfers and moves downward each circuit board, the slot cutting component 2 opens a card slot 91 on the top surface of the buffer bar 9 to ensure the continuity and uniformity of the card slots 91 on the buffer bar 9; after the transfer device 3 is used to stack multiple circuit boards on the buffer bar 9 along the longitudinal guide groove 12, the buffer bar 9 is cut off by the cutter 13 through the cutter hole 121, thereby forming a packaging state of a group of stacked circuit boards. The telescopic cylinder or linear motor can be used to control the reciprocating movement of the cutter 13 to achieve the purpose of cutting the buffer bar 9. In the specific working process, the two longitudinal guide grooves 12 can be inserted into the packaging box, so that the buffer strip 9 and the stacked circuit boards can automatically fall into the packaging box.In the above scheme, the slots 91 of the buffer strips 9 are used to space and fix the circuit boards, effectively preventing contact between adjacent circuit boards, thereby avoiding scratches on the circuit boards; and the above scheme realizes the automatic transfer, stacking and packaging process of the circuit boards, has a higher degree of automation, and can effectively improve the packaging and transfer efficiency of the circuit boards.

[0022] Preferably, Figures 3 to 5 and Figure 7 As shown, a friction wheel 14 is provided inside the angle between the longitudinal guide groove 12 and the transverse guide groove 11, and its outer wall is tangent to the outer wall of the longitudinal guide groove 12 and the top surface of the transverse guide groove 11. One quarter of the outer surface of the friction wheel 14 contacts the buffer strip 9, and the friction wheel 14 is arranged to rotate around the axis. Because the longitudinal guide groove 12 and the transverse guide groove 11 are respectively in the vertical and horizontal planes, the two are perpendicular to each other. In addition, the friction wheel 14 is located inside the angle between the longitudinal guide groove 12 and the transverse guide groove 11, so one quarter of the outer surface of the friction wheel 14 must be exposed between the outer wall of the longitudinal guide groove 12 and the top surface of the transverse guide groove 11, so as to replace the arc transition structure between the longitudinal guide groove 12 and the transverse guide groove 11 and contact the back surface of the buffer strip 9, so that the friction force of the buffer strip 9 at the arc bend can be reduced, so that the buffer strip 9 can move downward more smoothly under the push of the circuit board.

[0023] Preferably, the surface of the friction wheel 14 is provided with a structure to increase friction, such as Figure 3 , Figure 5 As shown, the stacking assembly 1 is provided with a rotating motor 15 for driving the friction wheel 14 to rotate. When the friction wheel 14 rotates, the linear speed of the outer surface is consistent with the speed at which the transfer device 3 drives the circuit board to descend. This solution uses the rotating motor 15 to drive the friction wheel 14 to rotate, which can not only prevent the friction wheel 14 from generating an upward friction force on the buffer bar 9, but also use the friction wheel 14 to increase the driving force of the buffer bar 9 to move downward following the circuit board, making it easier for the buffer bar 9 to move downward. The friction-increasing structure provided on the surface of the friction wheel 14 can increase the friction force that drives the buffer bar 9 to move downward. The convex strips arranged in an array along the circumferential outer wall of the friction wheel 14 can be used as a structure for increasing friction, and a rubber layer sprayed or bonded on the surface of the friction wheel 14 can also be used as a structure for increasing friction.

[0024] Preferred as Figures 5 to 7As shown, a circular blade 16 is provided on each side of the front end of the transverse guide groove 11, which is used to process the guide groove 92 on both sides of the buffer strip 9. The guide groove 92 is arranged along the length direction of the buffer strip 9, and the guide groove 92 is located between the back of the buffer strip 9 and the bottom surface of the card slot 91. Limiting strips 112 are provided in parallel on both sides of the top surface of the transverse guide groove 11 and both sides of the outer wall of the longitudinal guide groove 12, which are used to match the guide groove 92. When the buffer strip 9 is transported in the transverse guide groove 11, the limiting strips 112 are clamped in the guide grooves 92 on both sides of the buffer strip 9 to ensure that the back of the buffer strip 9 fits with the top surface of the transverse guide groove 11 and the outer wall of the longitudinal guide groove 12, so that the buffer strip 9 can move smoothly along the trajectory of the transverse guide groove 11 and the longitudinal guide groove 12, and can prevent the buffer strip 9 from separating from the longitudinal guide groove 12 when the cutter 13 cuts. Specifically, the two circular blades 16 are driven by independently arranged motors. The guide groove 92 is opened between the back surface of the buffer strip 9 and the bottom surface of the card slot 91, so that the card slot 91 can be exposed between the limiting strips 112 set on the two longitudinal guide grooves 12 to prevent the edge of the circuit board from contacting the limiting strips 112 during stacking.

[0025] Further preferably, Figure 5 As shown, a driven bevel gear 161 is coaxially provided at the bottom of the circular blade 16, a transmission shaft 162 is provided at the bottom of the transverse guide groove 11, and a driving bevel gear 163 meshing with the two driven bevel gears 161 is provided at both ends thereof, and a driving motor 164 is provided at the bottom of the transverse guide groove 11, which is connected to the transmission shaft 162 by a parallel gear transmission, and is used to drive the transmission shaft 162 to rotate, thereby driving the two circular blades 16 to rotate, so that the two circular blades 16 rotate synchronously, and the cutting directions of the two circular blades 16 on the buffer strip 9 are consistent.

[0026] Preferably, Figure 5 , Figure 6As shown, the grooving assembly 2 includes a cutting line 21 of an annular structure and a pair of parallelly arranged pulleys 22. The two pulleys 22 tighten the cutting line 21 with clothes. The two pulleys 22 are rotatably arranged on both sides of a U-shaped frame 23, and the U-shaped opening of the U-shaped frame 23 faces downward. The closest distance between the two pulleys is greater than the width of the buffer strip 9. The U-shaped frame 23 is provided with a cutting motor 24 for driving one of the pulleys 22 to rotate. The cutting line 21 between the two pulleys 22 is parallel to the extension direction of the slot 91, and the U-shaped frame 23 is moved in the vertical direction and arranged above the transverse guide slot 11. Specifically, the movement of the U-shaped frame 23 can be controlled by a vertically arranged cylinder. When processing the card slot 91, the cutting motor 24 is used to drive the pulley 22 to rotate, so that the cutting line 21 rotates rapidly, and then the U-shaped frame 23 is moved downward, so that the cutting line 21 gradually contacts the buffer strip 9, and the rotating cutting line 21 is used to process the card slot 91 on the top surface of the buffer strip 9. The depth of the card slot 91 is determined by controlling the descending height of the U-shaped frame 23. In this embodiment, a gantry 25 is provided at the top of the transverse guide groove 11, and a vertical screw rod 26 is provided on the gantry 25. The screw rod 26 passes through the U-shaped frame 23, and the screw rod 26 is driven by an independently arranged motor. Drive, sliders are provided at both ends of the U-shaped frame 23, and the sliders are slidably connected to the columns on both sides of the gantry 25, so as to guide the U-shaped frame 23, and an independently arranged motor drives the U-shaped frame 23 to move in the vertical direction through the screw rod 26; as another preferred structure, a disc-shaped blade can also be provided and coaxially installed on the main shaft of a motor, the disc-shaped blade is perpendicular to the front and rear end connection line of the transverse guide groove 11, the lower edge of the disc-shaped blade is in the same horizontal plane as the bottom surface of the card slot 91, and a moving device is provided to drive the motor to move back and forth along the extension direction of the card slot 91, so that the card slot 91 is processed on the top surface of the buffer strip 9 by using the disc-shaped blade.

[0027] Preferably, Figure 3As shown, a position sensor 17 for detecting the circuit board arrival signal is provided on one side of at least one longitudinal guide groove 12 of the same stacking assembly 1. The circuit board position signal detected by the position sensor 17 is used as the basis for starting the cutter 13 and the groove cutting assembly 2, and as the basis for the transfer device 3 to stop moving downward, and count. The position sensor 17 is located below the cutter 13, and the distance between the position sensor 17 and the cutter 13 is equal to half the distance between adjacent slots 91. During operation, when the position sensor 17 detects the arrival signal of a circuit board, it counts once; at the same time, the transfer device 3 stops pushing the circuit board downward, and the buffer bar 9 also stops moving downward. When the count number reaches the set value of the system, the cutter 13 passes through the cutter hole 121 to cut the buffer bar 9, and the cutting position is in the middle of the adjacent slots 91, so as to ensure that the circuit boards above and below the cutting position are still limited by the slots 91; when the position sensor 17 detects the circuit board, the groove cutting assembly 2 processes the slots 91 on the top surface of the buffer bar 9, so as to ensure that the intervals between the slots 91 are consistent.

[0028] As a further preference, when the system is equipped with a friction wheel 14 , a rotary motor 15 and a position sensor 17 , when the position sensor 17 detects a circuit board in place signal, the rotary motor 15 stops working and stops the friction wheel 14 from driving the buffer bar 9 .

[0029] Preferably, Figure 1 , Figure 2 As shown, the transfer device 3 includes a horizontal transfer component 31 arranged horizontally, a vertical transfer component 32 is arranged below the movable part, and a horizontal suction cup 33 is arranged at the lower end of the movable rod of the vertical transfer component 32. The horizontal transfer component 31 is used to drive the vertical transfer component 32 to reciprocate in the horizontal direction. The moving trajectory is parallel to the extension direction of the card slot 91 and is located between the two groups of stacking components 1 arranged in the same pair. The vertical transfer component 32 is used to drive the suction cup 33 to reciprocate in the vertical direction, and the suction cup 33 is used to absorb the circuit board on the feeding track. During operation, the suction cup 33 is used to suck up the circuit board on the vertical rod of the feeding track, and then the circuit board is moved to a predetermined height through the vertical transfer component 32 so that the circuit board is aligned with the open slot 91, and then the horizontal transfer component 31 is used to drive the vertical transfer component 32 and the circuit board to move toward the slot 91, and the circuit board is inserted into the open slot 91, and then the vertical transfer component 32 is used to push the circuit board downward by a predetermined distance, which is the same as the spacing between adjacent slots 91, and then the suction cup 33 releases the circuit board, and the next circuit board is transferred in the same manner as described above. The circuit boards transferred to the buffer bar 9 will be in a stacked packaging state along the longitudinal guide groove 12.

[0030] Preferably, the distance between the two groups of stacking assemblies 1 of the same pair has an adjustable function. Through this arrangement, when packaging, the lower ends of the two longitudinal guide grooves 12 can be inserted into the packaging box, and then the stacking assembly 1 is moved to both ends so that the inner side walls of the two longitudinal guide grooves 12 are pressed against the opposite inner walls of the packaging box, thereby achieving the purpose of positioning and fixing the packaging box; and by adjusting the distance between the stacking assemblies 1, circuit boards of different widths can also be packaged.

[0031] As another preferred embodiment, a plurality of pairs of stacking assemblies 1 are provided along the extending direction of the card slots 91 to accommodate the packaging of longer circuit boards.

[0032] Specifically, Figure 1 , Figure 2 As shown, a fixed track 41 is provided below the corresponding transverse guide groove 11 of the packaging transfer system, and the extension direction of the track 41 is consistent with the length direction of the transverse guide groove 11. The bottom of the transverse guide groove 11 is slidably connected to the corresponding track 41 below, and the outer end of the track 41 is provided with a telescopic device 42 for automatically adjusting the distance between the same pair of two groups of stacking components 1.

[0033] Further preferably, the distance between the lower end surface of the longitudinal guide groove 12 and the cutter 13 is greater than or equal to one times the spacing between adjacent card grooves 91 to ensure that the buffer strip 9 is still in a fit with the longitudinal guide groove 12 during cutting, and is less than three times the spacing between adjacent card grooves 91 to reduce the friction between the buffer strip 9 below the incision and the longitudinal guide groove 12 after the buffer strip 9 is cut, so that the circuit board below the incision can automatically fall under the action of gravity.

[0034] Further preferably, Figure 4 , Figure 5 As shown, an extension plate 122 is extended downward from the lower end of the longitudinal guide groove 12. When packing, the extension plate 122 is inserted into the packing box and pressed against the inner wall of the packing box to achieve the function of positioning and fixing the packing box.

[0035] The above is only a preferred embodiment of the present invention, and is not intended to be the only one or to limit the present invention. It should be understood by those skilled in the art that various changes or equivalent substitutions made to the present invention without departing from the scope of the present invention are within the scope of protection of the present invention.

Claims

1. A circuit board packaging transfer system, characterized in that: include: The stacking assembly (1) is provided with at least one pair of horizontally arranged transverse guide grooves (11), the ends of which are provided with vertically downwardly directed longitudinal guide grooves (12), the junction of the two having an arc transition structure, the top surface of the transverse guide groove (11) and the outer side wall of the longitudinal guide groove (12) are both used for laying the buffer strip (9) and guiding the buffer strip (9) to move, the front end of the transverse guide groove (11) is provided with a groove cutting assembly (2) for processing the surface of the buffer strip (9) to form a groove (91), the groove (91) being perpendicular to the moving direction of the buffer strip (9), and the transverse guide groove A cutter (13) is provided below the buffer strip (9) (11), which is perpendicular to the moving direction of the buffer strip (9) on the longitudinal guide groove (12), and the longitudinal guide groove (12) is provided with a cutter hole (121) for passing the cutter (13); the outer side walls of the two longitudinal guide grooves (12) of the paired stacking assembly (1) are arranged opposite to each other, and the two transverse guide grooves (11) are at the same horizontal height; the distance between the surfaces of the buffer strips (9) located in the longitudinal guide grooves (12) on both sides is less than the width of the circuit board, and the distance between the bottom surfaces of the card slots (91) on both sides is greater than the width of the circuit board; The transfer device (3) is used to transfer the circuit board to the middle of the paired stacking components (1), and the transfer device (3) has at least the function of controlling the movement of the circuit board in the vertical and horizontal directions.

2. A circuit board packaging transfer system according to claim 1, characterized in that: A friction wheel (14) is provided inside the angle between the longitudinal guide groove (12) and the transverse guide groove (11), and its outer wall is tangent to the outer wall of the longitudinal guide groove (12) and the top surface of the transverse guide groove (11). One quarter of the outer surface of the friction wheel (14) is in contact with the buffer strip (9), and the friction wheel (14) is rotatably arranged.

3. A circuit board packaging transfer system according to claim 2, characterized in that: The surface of the friction wheel (14) is provided with a structure for increasing friction, and the stacking assembly (1) is provided with a rotating motor (15) for driving the friction wheel (14) to rotate. When the friction wheel (14) rotates, the linear speed of the outer surface is consistent with the speed at which the transfer device (3) drives the circuit board to move vertically downward.

4. A circuit board packaging transfer system according to claim 1, characterized in that: A circular blade (16) is provided on each side of the front end of the transverse guide groove (11) for machining guide grooves (92) on both sides of the buffer strip (9). The guide grooves (92) are arranged along the length direction of the buffer strip (9). The guide grooves (92) are located between the back surface of the buffer strip (9) and the bottom surface of the card slot (91). Limiting strips (112) are provided in parallel on both sides of the top surface of the transverse guide groove (11) and on both sides of the outer side wall of the longitudinal guide groove (12) for matching the guide grooves (92).

5. A circuit board packaging transfer system according to claim 4, characterized in that: A driven bevel gear (161) is coaxially arranged at the bottom of each circular blade (16), a transmission shaft (162) is arranged at the bottom of the transverse guide groove (11), and driving bevel gears (163) meshing with the two driven bevel gears (161) are arranged at both ends of the transmission shaft (162), and a driving motor (164) is arranged at the bottom of the transverse guide groove (11), which is connected to the transmission shaft (162) by means of parallel gear transmission.

6. A circuit board packaging transfer system according to claim 1, characterized in that: The groove cutting assembly (2) comprises a cutting line (21) of an annular structure and a pair of parallel belt wheels (22), the two belt wheels (22) tighten the cutting line (21), the two belt wheels (22) are rotatably arranged on both sides of a U-shaped frame (23), and the U-shaped opening of the U-shaped frame (23) faces downward, the closest distance between the two belt wheels (22) is greater than the width of the buffer strip (9), the U-shaped frame (23) is provided with a cutting motor (24) for driving one of the belt wheels (22) to rotate, the cutting line (21) between the two belt wheels (22) is parallel to the extension direction of the slot (91), and the U-shaped frame (23) is arranged above the transverse guide slot (11) in a vertically movable manner.

7. A circuit board packaging transfer system according to claim 1, characterized in that: A position sensor (17) for detecting a circuit board arrival signal is provided on one side of at least one longitudinal guide groove (12) of the same pair of stacking components (1). The position sensor (17) is located below the cutter (13), and the distance between the position sensor (17) and the cutter (13) is equal to half the distance between adjacent slots (91).

8. A circuit board packaging transfer system according to claim 1, characterized in that: The transfer device (3) comprises a horizontal transfer assembly (31) arranged horizontally, a vertical transfer assembly (32) being arranged below the movable part thereof, a suction cup (33) being arranged in a horizontal state at the lower end of the movable rod of the vertical transfer assembly (32), the horizontal transfer assembly (31) being used to drive the vertical transfer assembly (32) to move back and forth in a horizontal direction, the moving track being parallel to the extension direction of the card slot (91) and being located between two groups of stacking assemblies (1) arranged in the same pair, the vertical transfer assembly (32) being used to drive the suction cup (33) to move back and forth in a vertical direction, and the suction cup (33) being used to suck the circuit board on the feeding track.

9. A circuit board packaging transfer system according to claim 1, characterized in that: The distance between the same pair of stacking components (1) is adjustable.

10. A circuit board packaging transfer system according to claim 1, characterized in that: It also includes a conveying track (43) arranged below the middle position of the same pair of stacking assemblies (1), whose conveying direction is consistent with the extension direction of the card slot (91) and is used to convey the packaging box. A lifting assembly (44) is provided below the conveying track (43), which includes a plurality of support plates (45) inserted between rollers of the conveying track (43) and is used to control the lifting and lowering of the packaging box on the conveying track (43). The lifting assembly (44) is located below the middle position of the same pair of stacking assemblies (1), and a lifting device (46) is provided at the bottom of the lifting assembly (44) for controlling the lifting and lowering of the lifting assembly (44).

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