Sealing waterproof pouring seal type epoxy adhesive applied to high voltage wire harness and preparation method thereof

Abstract

The application relates to the technical field of epoxy glue processing, in particular to a sealing waterproof pouring type epoxy glue applied to high-voltage wire harness and a preparation method thereof, which is prepared from the following raw materials in percentage by weight: multifunctional epoxy resin 40-50%, reinforcing filler 10-15%, heat-conducting filler 5-8%, nano clay 4-5%, CTBN toughening agent 3-5%, silane coupling agent 1-2%, antioxidant 0.5-1%, curing agent 2-3%, and the rest is diluent; the reinforcing filler is composed of nano silicon dioxide and glass fiber; by adopting the above formula, the high-temperature resistance and aging resistance of the sealing waterproof pouring type epoxy glue applied to high-voltage wire harness can be remarkably improved. In a long-time high-temperature environment, the epoxy glue can maintain high insulation resistance and mechanical strength, reduces performance decline caused by softening and aging, thereby effectively prolonging the service life of the high-voltage wire harness.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of epoxy glue processing, in particular to a sealing waterproof pouring type epoxy glue for high-voltage wire harness and a preparation method thereof. BACKGROUND

[0002] High-voltage cable glue, namely sealing glue or insulation glue for high-voltage cables, plays a crucial role in the manufacturing, installation and maintenance process of high-voltage cables in new energy vehicles, and is used to fix cable joints, terminals and other accessories to ensure that they are firmly connected together, prevent current leakage and short circuit faults, and improve the stability and reliability of the cable system. Among them, epoxy resin is widely used on high-voltage wire harness due to its many unique advantages such as high insulation performance, large structural strength and good sealing performance.

[0003] However, a large amount of heat is generated during the use of high-voltage wires, and the duration is relatively long, so that the epoxy resin pouring glue is prone to softening and aging. The softening of the epoxy resin not only causes a significant decrease in its insulation resistance, increasing the risk of cable leakage or short circuit faults, but also weakens its original mechanical strength, making the cable more vulnerable to damage when subjected to external impact or vibration. These negative effects will inevitably affect the overall reliability of the cable, shorten its service life, and thus may pose a potential threat to the safe operation of new energy vehicles. SUMMARY

[0004] In order to solve the problem that the epoxy resin will soften and age when it is in a high-temperature environment for a long time, the application provides a sealing waterproof pouring type epoxy glue for high-voltage wire harness and a preparation method thereof.

[0005] In the first aspect, the application provides a sealing waterproof pouring type epoxy glue for high-voltage wire harness, which adopts the following technical scheme:

[0006] A sealing waterproof pouring type epoxy glue for high-voltage wire harness is prepared from the following raw materials by weight percentage:

[0007] Multifunctional epoxy resin 40-50%

[0008] Reinforcing filler 10-15%

[0009] Thermal conductive filler 5-8%

[0010] Nano-clay 4-5%

[0011] CTBN toughening agent 3-5%

[0012] Silane coupling agent 1-2%

[0013] Antioxidant 0.5-1%

[0014] Curing agent 2-3%

[0015] The remaining amount is a diluent.

[0016] The reinforcing filler is composed of nano-silica and glass fibers.

[0017] By adopting the above technical scheme, the high-temperature resistance and anti-aging performance of the sealing waterproof pouring type epoxy glue for high-voltage wire harness can be significantly improved. In a long-term high-temperature environment, the epoxy glue can maintain high insulation resistance and mechanical strength, reduce the performance decline caused by softening and aging, thereby effectively prolonging the service life of the high-voltage wire harness and ensuring the safe and reliable operation of the high-voltage wire harness system of the new energy vehicle.

[0018] Among them, by adding nano-silica and glass fibers as reinforcing fillers, the impact resistance and mechanical strength of the cured epoxy resin glue can be further improved, at the same time, nano-silica can fill the micro voids between glass fibers, further optimize the microstructure of the epoxy resin glue, so that the epoxy resin glue can better disperse stress when subjected to external force impact, preventing crack propagation.

[0019] The high-voltage cable generates a large amount of heat during operation, and the heat-conducting filler can effectively conduct heat, reduce the temperature inside the epoxy glue, and reduce the risk of softening and aging caused by high temperature. The synergistic effect of the heat-conducting filler and the reinforcing filler forms an efficient heat conduction network. The reinforcing effect of nano-silica and glass fibers can ensure the stable dispersion of the heat-conducting filler in the matrix, so that heat can be quickly and uniformly conducted away, thereby better protecting the epoxy resin glue.

[0020] Nano-clay has a good layered structure and barrier property, which can be uniformly dispersed in the epoxy resin to form a physical barrier layer to prevent the penetration of water and oxygen, further improving the sealing and waterproof performance and oxidation resistance of the epoxy glue. At the same time, dispersion in the epoxy resin can also improve its toughness and heat resistance. Synergistic effect with nano-reinforcing filler and heat-conducting filler enhances the overall structural stability of the epoxy resin glue. The layered structure of nano-clay can form a composite reinforcing phase with nano-silica and glass fibers, further improving the mechanical properties and heat resistance of the material, and its barrier property can effectively delay the aging process of the epoxy resin.

[0021] CTBN toughening agent can effectively improve the toughness of epoxy resin, so that it is not easy to crack when subjected to external force impact, improving the impact resistance of the material. Synergistic effect with nano-reinforcing filler and nano-clay forms a "rigid and flexible" structure. Nano-reinforcing filler provides high-strength support, nano-clay provides barrier and reinforcing effect, and CTBN toughening agent acts as a buffer when the epoxy resin glue is subjected to external force impact, so that the epoxy resin glue has good toughness while maintaining high strength, effectively preventing damage caused by external force impact.

[0022] The silane coupling agent can improve the interfacial bonding force of the epoxy resin with nano-silica, glass fiber and nano-clay, enhance the synergistic effect between the components, improve the dispersibility and compatibility of nano-silica, glass fiber and nano-clay in the epoxy resin matrix, and enhance the heat resistance, aging resistance and mechanical properties of the epoxy resin. The curing agent crosslinks with the multi-functional epoxy resin to form a stable three-dimensional network structure, giving the epoxy adhesive high strength, high insulation and good heat resistance. The diluent is used to adjust the viscosity of the epoxy adhesive, so that it has good flowability during the pouring process, can fully fill the voids at the cable joint and other parts, and ensure the sealing effect.

[0023] Preferably, the weight ratio of the nano-silica and the glass fiber is (4-6):3.

[0024] By optimizing the amount of nano-silica and glass fiber, a more uniform dispersion structure is formed in the epoxy resin, further dispersing stress, improving the impact resistance and mechanical strength of the epoxy resin adhesive, and further improving the thermal stability of the epoxy resin adhesive, reducing the softening and aging of the material in high temperature environment.

[0025] Preferably, the nano-clay is modified nano-clay, which is prepared by the following method:

[0026] A: Stir the nano-clay and the acidic solution together, then filter, take the filter residue, and leach to obtain porous clay;

[0027] B: Mix the porous clay with 1-hexadecyl-3-methyl imidazole bromide solution, ultrasonic, filter, take the filter residue, and dry to obtain modified nano-clay.

[0028] The modified nano-clay is treated by ultrasonic and surface modification, so that it can be more uniformly dispersed in the epoxy resin matrix to form a good interfacial bond. This uniform dispersion and good bonding can effectively absorb and disperse external force, improve the toughness of the epoxy resin, and reduce the brittle failure of the material when subjected to impact or vibration. Through acid treatment, impurities on the surface and between the layers of the clay can be removed, the pore channels can be unblocked, the porous structure can be increased, which helps to absorb and disperse stress, improve the toughness and heat resistance of the epoxy resin adhesive. 1-hexadecyl-3-methyl imidazole bromide can be inserted into the interlayer of the clay through ion exchange, increasing the interlayer spacing of the clay, which can be uniformly dispersed in the epoxy resin matrix to form a good interfacial bond. When subjected to external force, the nano-clay can effectively absorb and disperse stress, improving the toughness and impact resistance of the composite epoxy resin adhesive. At the same time, 1-hexadecyl-3-methyl imidazole bromide has good thermal stability, and the porous clay is mixed with 1-hexadecyl-3-methyl imidazole bromide solution by ultrasonic, which improves the heat resistance of the epoxy resin adhesive and helps to reduce the softening and performance degradation of the epoxy resin adhesive in high temperature environment.

[0029] Preferably, the weight ratio of the nanoclay to the 1-hexadecyl-3-methyl imidazole bromide solution is 1:(4-6).

[0030] By adopting the above technical solution, the weight ratio of the nanoclay and the 1-hexadecyl-3-methyl imidazole bromide solution is optimized, so that the imidazole bromide salt can fully cover the surface of the nanoclay, and the heat resistance of the epoxy resin glue is improved, which helps to reduce the softening and performance decline of the epoxy resin glue in a high-temperature environment.

[0031] Preferably, the multifunctional epoxy resin is composed of bisphenol A type epoxy resin and polyphenol type glycidyl ether epoxy resin in a weight ratio of 1:(1-3).

[0032] By adopting the above technical solution, the bisphenol A type epoxy resin has good mechanical strength and bonding performance, and the polyphenol type glycidyl ether epoxy resin has a large crosslinking density after curing due to the presence of multiple epoxy groups, which further enhances the strength and modulus of the material. The combination of the two makes the epoxy glue have higher mechanical strength and better impact resistance after curing. At the same time, the heat resistance of the polyphenol type glycidyl ether epoxy resin is better than that of the bisphenol A type epoxy resin. By adjusting the ratio of the two, the heat resistance of the epoxy glue can be significantly improved while ensuring the mechanical properties, making it more suitable for the application of new energy vehicles high-voltage cables in high-temperature environments.

[0033] Preferably, the average particle size of the nanosilica is 50-200 nm, and the average particle size of the glass fiber is 5-10 microns.

[0034] By adopting the above technical solution, the particle size range of the nanosilica and the glass fiber is optimized, which can significantly improve the high-temperature resistance and anti-aging performance of the sealing and waterproof pouring type epoxy glue for high-voltage wire harness, and optimize its mechanical properties and sealing performance. In a long-term high-temperature environment, the epoxy glue can maintain high insulation resistance and mechanical strength, reducing the performance decline caused by softening and aging, thereby effectively prolonging the service life of the sealing and waterproof pouring type epoxy glue for high-voltage wire harness.

[0035] Preferably, the curing agent is at least one of DDM, DDS, methyl hexahydrophthalic anhydride, and bismaleimide.

[0036] By adopting the above technical solution, the curing of the multifunctional epoxy resin can be further promoted, and the cured multifunctional epoxy resin has a high glass transition temperature and thermal decomposition temperature, and can also significantly improve the mechanical strength and toughness of the multifunctional epoxy resin.

[0037] Preferably, the silane coupling agent is at least one of gamma-glycidoxypropyltrimethoxysilane, gamma-glycidoxypropyltriethoxysilane, gamma-(2,3-epoxypropoxy)propyltrimethoxysilane, gamma-(2,3-epoxypropoxy)propylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, and 3-mercaptopropyltrimethoxysilane.

[0038] By adopting the technical solution, the type of silane coupling agent is optimized, the dispersibility of nanosilica, glass fiber, and nanoclay in the multifunctional epoxy resin is further improved, the agglomeration of nanosilica, glass fiber, and nanoclay is reduced, and the nanosilica, glass fiber, and nanoclay are uniformly distributed, thereby further optimizing the mechanical properties and heat resistance of the sealing and waterproof pouring type epoxy adhesive for high-voltage wire harnesses.

[0039] Preferably, the nanoclay is at least one of nanomontmorillonite, nanokaolinite, nanoelloite, nanatapochite, and nanobentonite.

[0040] The nanoclay has a layered or tubular structure, can form a nanoscale reinforcing phase in the epoxy resin matrix, and can significantly improve the mechanical properties, thermal stability, and high-temperature resistance of the sealing and waterproof pouring type epoxy adhesive for high-voltage wire harnesses.

[0041] In a second aspect, the application provides a preparation method of a sealing and waterproof pouring type epoxy adhesive for high-voltage wire harnesses, which adopts the following technical solution:

[0042] A preparation method of a sealing and waterproof pouring type epoxy adhesive for high-voltage wire harnesses, comprising the following steps:

[0043] 1) mixing the reinforcing filler, the heat-conducting filler, and the silane coupling agent to obtain a mixture;

[0044] 2) stirring the multifunctional epoxy resin, the nanoclay, the CTBN toughening agent, the antioxidant, the curing agent, and the diluent uniformly, then adding the mixture and stirring uniformly to obtain the sealing and waterproof pouring type epoxy adhesive for high-voltage wire harnesses.

[0045] By adopting the technical solution, the components can be fully mixed and uniform, forming a uniform glue system, which is convenient for subsequent construction.

[0046] In summary, the application has the following beneficial effects:

[0047] 1、The application prepares a sealing waterproof pouring type epoxy glue for high-voltage wire harness by using multifunctional epoxy resin, nanoclay, CTBN toughening agent, antioxidant, curing agent, reinforcing filler, thermal conductive filler, silane coupling agent and diluent, which significantly improves the high-temperature resistance and anti-aging performance of the sealing waterproof pouring type epoxy glue for high-voltage wire harness, optimizes the mechanical properties and sealing performance. In a long time high-temperature environment, the epoxy glue can maintain high insulation resistance and mechanical strength, reduce the performance decline caused by softening and aging, thereby effectively prolonging the service life of the glue and ensuring the safe and reliable operation of the high-voltage electrical system of the new energy vehicle. DETAILED DESCRIPTION

[0048] EMBODIMENT

[0049] The CTBN toughening agent is purchased from Hengshui Chiluoma New Material Co., Ltd., and the model is LR820.

[0050] The bisphenol A type epoxy resin is purchased from Meizhou Fuxi Chemical Co., Ltd., and the specification is 240.

[0051] The polyphenol type glycidyl ether epoxy resin is purchased from Nantong Xinnaxi New Material Technology Co., Ltd., and the model is S-186.

[0052] EMBODIMENT 1

[0053] A sealing waterproof pouring type epoxy glue for high-voltage wire harness is prepared by the following method:

[0054] 1) Mix the reinforcing filler 100g, the thermal conductive filler 50g (boron nitride) and the silane coupling agent 10g (γ-glycidyl ether oxypropyl trimethoxysilane) to obtain a mixture;

[0055] 2) Mix the multifunctional epoxy resin 400g, the nanoclay 40g (nanometer montmorillonite), the CTBN toughening agent 30g, the antioxidant 5g (antioxidant V-991), the curing agent 20g (DDM) and the diluent 345g (1,6-hexanediol diglycidyl ether) uniformly, then add the mixture and stir uniformly to obtain the sealing waterproof pouring type epoxy glue for high-voltage wire harness.

[0056] The reinforcing filler is composed of nanosilica and glass fiber in a weight ratio of 1:1, the average particle size of the nanosilica is 50 nm, and the average particle size of the glass fiber is 5 microns.

[0057] Embodiments 2-3 are different from embodiment 1 in that the types, amounts and parameters of the raw materials for preparing the sealing waterproof pouring type epoxy glue for high-voltage wire harness are different, and the specific differences are shown in Table 1:

[0058] Table 1 Types, amounts and parameters of raw materials for preparing the sealing waterproof pouring type epoxy glue for high-voltage wire harness in embodiments 1-3

[0059]

[0060]

[0061] Example 2-3 uses bisphenol A type epoxy resin.

[0062] The reinforcing filler in Example 2 is nano-silica and glass fiber in a weight ratio of 1:1, the average particle size of the nano-silica is 100 nm, and the average particle size of the glass fiber is 8 microns.

[0063] The reinforcing filler in Example 3 is nano-silica and glass fiber in a weight ratio of 1:1, the average particle size of the nano-silica is 200 nm, and the average particle size of the glass fiber is 10 microns.

[0064] Example 4

[0065] A sealing waterproof pouring type epoxy glue for high-voltage wiring harness, the difference between this embodiment and Example 1 is that the reinforcing filler is nano-silica and glass fiber in a weight ratio of 4:3.

[0066] Example 5

[0067] A sealing waterproof pouring type epoxy glue for high-voltage wiring harness, the difference between this embodiment and Example 1 is that the reinforcing filler is nano-silica and glass fiber in a weight ratio of 6:3.

[0068] Example 6

[0069] A sealing waterproof pouring type epoxy glue for high-voltage wiring harness, the difference between this embodiment and Example 1 is that the nano-clay is modified nano-clay, which is prepared by the following method:

[0070] A: Nano-clay 40g (nano-montmorillonite) and acid solution (hydrochloric acid solution, mass fraction 10%) are stirred together for 1h, then filtered, and the filter residue is taken and washed to obtain porous clay;

[0071] B: Mix the porous clay with 1-hexadecyl-3-methyl imidazole bromide solution 160g, ultrasonic for 30min, filter, take the filter residue, dry to obtain modified nano-clay.

[0072] Example 7

[0073] A sealing waterproof pouring type epoxy glue for high-voltage wiring harness, the difference between this embodiment and Example 4 is that the nano-clay is modified nano-clay, which is prepared by the following method:

[0074] A: Stir 40g of nano clay (nano montmorillonite) with an acidic solution (sulfuric acid solution, mass fraction of 10%) for 1 hour, then filter, take the filter residue, rinse, and obtain porous clay.

[0075] B: Mix porous clay with 240g of 1-hexadecyl-3-methylimidazolium bromide solution, sonicate for 30min, filter, collect the filter residue, and dry to obtain modified nano-clay.

[0076] Example 8

[0077] A sealing and waterproof potting epoxy adhesive for high-voltage wiring harnesses, differing from Example 6 in that the 1-hexadecyl-3-methylimidazolium bromide solution is replaced with purified water. 95.8

[0078] Example 9

[0079] A sealing and waterproof potting epoxy adhesive for high-voltage wire harnesses, the difference between this embodiment and embodiment 6 is that the hydrochloric acid solution is replaced with pure water.

[0080] Example 10

[0081] A sealing and waterproof potting epoxy adhesive for high-voltage wire harnesses. The difference between this embodiment and Embodiment 1 is that the multifunctional epoxy resin is composed of bisphenol A type epoxy resin and polyphenol type glycidyl ether epoxy resin in a weight ratio of 1:1.

[0082] Example 11

[0083] A sealing and waterproof potting epoxy adhesive for high-voltage wire harnesses. The difference between this embodiment and Embodiment 7 is that the multifunctional epoxy resin is composed of bisphenol A type epoxy resin and polyphenol type glycidyl ether epoxy resin in a weight ratio of 1:3.

[0084] Comparative Example

[0085] Comparative Example 1

[0086] A sealing and waterproof potting epoxy adhesive for high-voltage wire harnesses, the difference between this embodiment and embodiment 1 is that the reinforcing filler is all nano-silica.

[0087] Comparative Example 2

[0088] A sealing and waterproof potting epoxy adhesive for high-voltage wire harnesses, the difference between this embodiment and Embodiment 1 is that the reinforcing filler is entirely made of glass fiber.

[0089] Comparative Example 3

[0090] A sealing and waterproof potting epoxy adhesive for high-voltage wiring harnesses. The difference between this embodiment and Embodiment 1 is that fumed silica is used instead of an equal mass of nano-clay.

[0091] Comparative Example 4

[0092] A sealing and waterproof potting epoxy adhesive for high-voltage wire harnesses. The difference between this embodiment and Embodiment 1 is that HyPoxRA20 is used instead of an equal mass of CTBN toughening agent.

[0093] HyPoxRA20 was purchased from Guangzhou Siteyuan Chemical Co., Ltd.

[0094] Detection methods / test methods

[0095] Tensile strength test: Tensile properties: Tested at 23℃ using a universal tensile testing machine CMT4202 according to GB / T2567-2008.

[0096] Volume resistivity: Tested at 23℃ using a ZC-90G resistivity meter according to GB / T31838.2-2019.

[0097] Aging resistance test: The sealing and waterproof potting epoxy resins prepared in Examples 1-11 and Comparative Examples 1-4 for high-voltage wire harnesses were cured and placed in a 200℃ constant temperature oven for 1000 hours. After curing, the resins were removed and the surface was observed for powdering, cracking, or obvious discoloration. If no powdering, cracking, or obvious discoloration was observed, the tensile strength and volume resistivity were tested. The experimental data are shown in Table 2.

[0098] Table 2. Experimental data of Examples 1-11 and Comparative Examples 1-4

[0099]

[0100]

[0101] Compared with Example 1, Comparative Example 1 had higher tensile strength and volume resistivity before aging than Example 1. However, after aging test, Comparative Example 1 showed cracking.

[0102] Compared with Example 1, Comparative Example 2 showed that the tensile strength and volume resistivity of Comparative Example 2 before aging were lower than those of Example 1, and pulverization occurred after the aging test.

[0103] The experimental data from Example 1 and Comparative Examples 1-2 show that by mixing nano-silica and glass fiber in a specific ratio, it is possible to ensure that the sealing and waterproof potting epoxy for high-voltage wire harnesses has high tensile strength and volume resistivity, as well as good heat resistance.

[0104] Comparing Example 1 and Comparative Examples 3-4, the tensile strength and volume resistivity of Example 1 and Comparative Examples 3-4 are basically similar. However, after aging tests, cracking occurred in Comparative Example 3 and obvious discoloration occurred in Comparative Example 4. This indicates that by using nano-clay, CTBN toughening agent and other raw materials together, it is beneficial to improve the heat resistance, tensile strength and insulation of the sealing and waterproofing potting epoxy resin for high-voltage wire harnesses.

[0105] Compared with Examples 1 and Examples 4-5, the tensile strength of Examples 4-5 is improved, and the rate of change of tensile strength after aging test is less than that of Example 1. This indicates that optimizing the amount of nano-silica and glass fiber is beneficial to improving the heat resistance and tensile strength of the sealing and waterproofing potting epoxy adhesive used in high-voltage wire harnesses.

[0106] Compared with Example 1, Example 6 has improved tensile strength, and after aging test, the rate of change of tensile strength is less than that of Example 1.

[0107] Compared with Example 4, Example 7 showed improved tensile strength, and the rate of change of tensile strength after aging test was less than that of Example 4.

[0108] Comparing Examples 6 and 8-9, the tensile strength of Example 6 is higher than that of Examples 8-9, and the rate of change of tensile strength after aging test is greater than that of Examples 8-9.

[0109] Experimental data from Examples 1 and 6, 4 and 7, and 6 and 8-9 show that the modified nano-clay prepared by the method in this application is beneficial to improving the heat resistance and tensile strength of the sealing and waterproofing potting epoxy adhesive used in high-voltage wiring harnesses.

[0110] Comparing Example 1 and Example 10, Example 10 has higher tensile strength and volume resistivity before aging than Example 1, and after aging test, the rate of change of tensile strength is greater than that of Example 10.

[0111] Comparing Example 7 and Example 11, Example 11 has higher tensile strength and volume resistivity before aging than Example 7, and after aging test, the rate of change of tensile strength is greater than that of Example 7.

[0112] The experimental data from Examples 1 and 10, 7 and 11 show that using a mixture of bisphenol A type epoxy resin and polyphenol type glycidyl ether epoxy resin is beneficial to improving the heat resistance, tensile strength and insulation properties of sealing and waterproofing potting epoxy adhesives used in high-voltage wire harnesses.

[0113] This specific embodiment is merely an explanation of this application and is not intended to limit it. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of this application.

Claims

1. A sealing and waterproof potting epoxy adhesive for high-voltage wire harnesses, characterized in that, It is prepared from the following raw materials by weight percentage: Multifunctional epoxy resin 40-50% Reinforcing filler 10-15% 5-8% thermally conductive filler Nano clay 4-5% CTBN toughening agent 3-5% Silane coupling agent 1-2% Antioxidant 0.5-1% 2-3% curing agent The remainder is diluent; The reinforcing filler is composed of nano-silica and glass fiber; The multifunctional epoxy resin is composed of bisphenol A type epoxy resin and polyphenol type glycidyl ether epoxy resin in a weight ratio of 1:(1-3).

2. The epoxy resin for sealing and waterproofing high-voltage wire harnesses according to claim 1, characterized in that: The weight ratio of the nano-silica to the glass fiber is (4-6):

3.

3. The epoxy resin for sealing and waterproofing high-voltage wire harnesses according to claim 2, characterized in that, The nano-clay is a modified nano-clay, prepared by the following method: A: The nano-clay is stirred together with an acidic solution, then filtered, the filter residue is collected, and washed to obtain porous clay. B: The porous clay was mixed with a 1-hexadecyl-3-methylimidazolium bromide solution, sonicated, filtered, and the filter residue was collected and dried to obtain modified nano-clay.

4. The sealing and waterproofing epoxy adhesive for high-voltage wire harnesses according to claim 1, characterized in that: The weight ratio of the nano-clay to the 1-hexadecyl-3-methylimidazolium bromide solution is 1:(4-6).

5. The sealing and waterproofing epoxy adhesive for high-voltage wire harnesses according to claim 4, characterized in that: The average particle size of the nano-silica is 50-200 nm, and the average particle size of the glass fiber is 5-10 micrometers.

6. The sealing and waterproofing epoxy adhesive for high-voltage wire harnesses according to claim 1, characterized in that: The curing agent is at least one of DDM, DDS, methylhexahydrophthalic anhydride and bismaleimide.

7. The sealing and waterproofing epoxy adhesive for high-voltage wire harnesses according to claim 1, characterized in that: The silane coupling agent is at least one selected from γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-(2,3-epoxypropoxy)propylmethyldimethoxysilane, 3-mercaptopropyltriethoxysilane, and 3-mercaptopropyltrimethoxysilane.

8. The sealing and waterproofing epoxy adhesive for high-voltage wire harnesses according to claim 1, characterized in that: The nano-clay is at least one of nano-montmorillonite, nano-kaolinite, nano-haloite, nano-attapulgite, and nano-bentonite.

9. A method for preparing a sealing and waterproof potting epoxy adhesive for high-voltage wire harnesses as described in any one of claims 1-8, characterized in that, Includes the following steps: 1) Mix the reinforcing filler, thermally conductive filler, and silane coupling agent to obtain a mixture; 2) Mix the multifunctional epoxy resin, nano clay, CTBN toughening agent, antioxidant, curing agent and diluent evenly, then add the mixture and mix evenly to obtain a sealing and waterproof potting epoxy adhesive for high voltage wire harnesses.

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