Plating solution treatment equipment for electroplating diamond wire production

Abstract

The invention discloses plating solution treatment equipment for electroplating diamond wire production, which comprises a plating solution tank, the back of the plating solution tank is also connected with a fixing assembly, the plating solution tank is also sleeved with a circulating solution pump which is sleeved with the plating solution tank, and the circulating solution pump is connected with a plurality of solution inlets and solution outlets which are connected with the plating solution tank; a liquid outlet valve pipe group and a liquid inlet valve pipe group which are matched with the liquid inlet and the liquid outlet are arranged on the circulating liquid pump, a digital filtering tank for filtering the plating liquid is connected between the liquid outlet valve pipe group and the liquid inlet valve pipe group, and a digital instrument group for monitoring the quality of internal liquid is connected in the digital filtering tank. Compared with the prior art, the plating solution treatment equipment for electroplating diamond wire production has the advantages that application is convenient, online plating solution treatment application is achieved, and the flow can be adjusted and controlled.

Description

Technical Field

[0001] The invention relates to the technical field of plating solution treatment, and in particular to a plating solution treatment device for producing electroplated diamond wires. Background Art

[0002] Diamond wire is a diamond tool made of nickel as a binder, in which diamond powder is evenly consolidated on high-strength steel wire through the co-deposition of nickel. Compared with traditional cutting processes, diamond wire has the advantages of high cutting efficiency, less material loss, high chip output rate and less environmental pollution.

[0003] During its processing, when dispersants and organic impurities in the plating solution accumulate to a certain amount, the plating solution needs to be transferred to a plating solution treatment workshop to remove impure metal ions, dispersants, organic impurities and dirt in the plating solution. The equipment needs to be shut down for post-processing, resulting in a chain reaction of low equipment utilization rate and low output, which is not conducive to use. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the above technical defects and provide a plating solution processing equipment for the production of electroplated diamond wires which is convenient to use, can process the plating solution online, and has adjustable flow rate.

[0005] In order to solve the above technical problems, the technical solution provided by the present invention is: a plating solution processing device for producing electroplated diamond wires, comprising a plating solution tank, the back of which is also connected to a fixing assembly, the outside of the plating solution tank is also sleeved with a circulating liquid pump sleeved with the plating solution tank, and the circulating liquid pump is connected with a plurality of liquid inlets and liquid outlets connected with the plating solution tank;

[0006] The circulating liquid pump is provided with a liquid outlet valve pipe group and a liquid inlet valve pipe group matching the liquid inlet and the liquid outlet, a digital filter tank for filtering the plating solution is connected between the liquid outlet valve pipe group and the liquid inlet valve pipe group, and a digital instrument group for monitoring the internal liquid quality is connected inside the digital filter tank.

[0007] Preferably, a reflux pipe group is provided between the liquid outlet valve pipe group and the liquid inlet valve pipe group and connected to the circulating liquid pump.

[0008] Preferably, the fixing assembly includes mounting buckle grooves arranged on both sides of the circulating liquid pump, and mounting buckle plates are slidably provided in the mounting buckle grooves.

[0009] Preferably, the reflux pipe group includes a main pipe whose two ends are respectively connected to the liquid outlet valve pipe group and the liquid inlet valve pipe group and an auxiliary pipe connected to the middle of the main pipe, and control valves 1 are connected to both ends of the auxiliary pipe on the main pipe.

[0010] Preferably, the liquid outlet valve pipe group and the liquid inlet valve pipe group include a liquid pipe connected to the digital filter tank and a liquid head connected to the circulating liquid pump, the liquid head includes connector 1 and connector 2 connected to the circulating liquid pump, a control valve 2 is connected between connector 1 and connector 2, and a control valve 3 is connected on the liquid pipe near the liquid head.

[0011] Preferably, the liquid pipe in the digital filter tank and the liquid outlet valve pipe group is also connected to a reflux extension pipe, and the reflux extension pipe extends to the bottom of the digital filter tank.

[0012] Preferably, the digital filter tank is connected with a filter group arranged from top to bottom, the filter group is provided with multiple layers, and the digital instrument group is provided with multiple groups respectively arranged above each layer of the filter group.

[0013] Preferably, the top of the digital filter tank is connected with a sealing valve cover, the middle of the sealing valve cover is connected with an air pipe head, the middle of the filter group is provided with an air pipe running through the top and bottom thereof, and the bottom end of the air pipe head is threadedly connected to the top of the air pipe;

[0014] The air pipe extending to the filter layer of the filter group is connected with a recoil pipe, and the recoil pipe is connected with a plurality of recoil heads arranged upward. The bottom of the digital filter tank is located above the liquid inlet valve pipe group and is also connected with a polymer film.

[0015] The advantages of the present invention compared with the prior art are: in the present application, by means of installing a circulating liquid pump outside the plating liquid tank, cooperating with the liquid inlet valve tank group and the liquid outlet valve pipe group connected to the liquid pump, online processing of the plating liquid in the plating liquid tank is realized, and the digital filter tank is used to digitally monitor the quality of the plating liquid, wherein the additionally installed reflux pipe group cooperates with multiple groups of control valves set at different positions to control the direction of different liquids, thereby meeting different needs for flow regulation during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The present invention is a schematic diagram of the structure of a plating solution treatment device for producing electroplated diamond wires.

[0017] Figure 2 It is a structural schematic diagram of a cross-section of a digital filter tank.

[0018] Figure 3 It is a structural schematic diagram of a cross-section of a fixed component.

[0019] As shown in the figure: 1. Plating liquid tank, 2. Fixed component, 3. Circulating liquid pump, 4. Liquid inlet, 5. Liquid outlet, 6. Liquid outlet valve pipe group, 7. Liquid inlet valve pipe group, 8. Digital filter tank, 9. Reflux pipe group, 10. Mounting buckle groove, 11. Mounting buckle plate, 12. Main pipe, 13. Auxiliary pipe, 14. Control valve one, 15. Liquid pipe, 16. Liquid head, 17. Connector one, 18. Connector two, 19. Control valve two, 20. Control valve three, 21. Reflux extension pipe, 22. Solenoid valve, 23. Filter group, 24. Digital instrument group, 25. Sealing valve cover, 26. Air pipe head, 27. Air pipe, 28. Recoil pipe, 29. Polymer film. DETAILED DESCRIPTION

[0020] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0021] Combined with Figure 1-3 As shown, a plating solution processing equipment for electroplating diamond wire production is characterized in that it includes a plating solution tank 1, the back of the plating solution tank 1 is also connected to a fixing component 2, the outside of the plating solution tank 1 is also sleeved with a circulating liquid pump 3 sleeved with the plating solution tank 1, and the circulating liquid pump 3 is connected to a plurality of liquid inlets 4 and liquid outlets 5 connected to the plating solution tank 1, and the liquid flow in the plating solution tank 1 is controlled by the liquid inlet 4 and the liquid outlet 5.

[0022] The fixing assembly 2 includes mounting buckle grooves 10 arranged on both sides of the circulating liquid pump 3, and mounting buckle plates 11 are slidably arranged in the mounting buckle grooves 10.

[0023] When used specifically:

[0024] The circulating liquid pump 3 is provided with a liquid outlet valve tube group 6 and a liquid inlet valve tube group 7 matching the liquid inlet 4 and the liquid outlet 5. A digital filter tank 8 for filtering the plating liquid is connected between the liquid outlet valve tube group 6 and the liquid inlet valve tube group 7. The digital filter tank 8 is connected with a digital instrument group 24 for monitoring the internal liquid quality. The setting of the digital instrument group 24 can intuitively understand the filtering condition of the plating liquid in the digital filter tank 8, so that the filter medium in the digital filter tank 8 can be replaced regularly.

[0025] In one embodiment:

[0026] A reflux pipe group 9 is also provided between the liquid outlet valve pipe group 6 and the liquid inlet valve pipe group 7, which is connected to the circulating liquid pump 3. In order to cooperate with the use thereof, a reflux port is also provided on the plating liquid tank 1 in cooperation with the circulating liquid pump 3, so that whether to enable it can be selected according to actual use needs.

[0027] Based on the above embodiment:

[0028] The reflux pipe group 9 includes a main pipe 12 whose two ends are respectively connected to the liquid outlet valve pipe group 6 and the liquid inlet valve pipe group 7, and an auxiliary pipe 13 connected to the middle of the main pipe 12. Both ends of the auxiliary pipe 13 on the main pipe 12 are connected to a control valve 14. The setting of the control valve 1 can control the selection of enabling the connection between the liquid inlet valve pipe group 7 and the reflux pipe group 9 or the selection of enabling the connection between the liquid outlet valve pipe group 6 and the reflux pipe group 9.

[0029] When used specifically:

[0030] The liquid outlet valve pipe group 6 and the liquid inlet valve pipe group 7 include a liquid pipe 15 connected to the digital filter tank 8 and a liquid head 16 connected to the circulating liquid pump 3. The liquid head 16 includes a connector 17 and a connector 2 18 connected to the circulating liquid pump 3. A control valve 2 19 is connected between the connector 1 17 and the connector 2 18. A control valve 3 20 is connected to the liquid pipe 15 near the liquid head 16. At the same time, the liquid pipe 15 in the digital filter tank 8 and the liquid outlet valve pipe group 6 are also connected to a reflux extension pipe 21. The reflux extension pipe 21 extends to the bottom of the digital filter tank 8, and a solenoid valve 22 is connected between the reflux extension pipe 21 and the liquid pipe 15.

[0031] By selectively activating the control valve three on the liquid outlet valve pipe group 6 and the liquid inlet valve pipe group 7, the control valve two 19 and the control valve one 14 on the reflux pipe group 9, there are a variety of pipe and valve coordination modes, and different valve bodies can be opened and closed for regulation according to the plating liquid in the tank body to meet different usage needs.

[0032] During the plating solution treatment, in order to ensure the treatment efficiency, the digital filter tank 8 is connected with a filter group 23 arranged from top to bottom, the filter group 23 is provided with multiple layers, the digital instrument group 24 is provided with multiple groups respectively arranged above each layer of the filter group 23, the top of the digital filter tank 8 is connected with a sealing valve cover 25, the middle part of the sealing valve cover 25 is connected with an air pipe head 26, the middle part of the filter group 23 is provided with an air pipe 27 running through the top and bottom thereof, the bottom end of the air pipe head 26 is threadedly connected to the top of the air pipe 27; the air pipe 27 extending to the filter layer of the filter group 23 is connected with a recoil pipe 28, the recoil pipe 28 is connected with a number of recoil heads arranged upward, and the bottom of the digital filter tank 8 located on the upper part of the liquid inlet valve pipe group 7 is also connected with a polymer film 29.

[0033] The cooperation of the air pipe and the recoil head can be used to recoil and clean the particle blockage on the filter layer, thereby ensuring the filtering effect of the plating solution.

[0034] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0035] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the present invention to be protected.

[0036] The scope of the present invention is defined by the appended claims and their equivalents, and therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention but merely represents selected embodiments of the present invention.

[0037] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of the present invention.

[0038] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0039] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0041] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0043] The present invention and its embodiments are described above, and such description is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if ordinary technicians in the field are inspired by it, without departing from the purpose of the invention, they can design a structure and embodiment similar to the technical solution without creativity, which should belong to the protection scope of the present invention.

Claims

1. A plating solution treatment device for producing electroplated diamond wire, characterized in that: The invention comprises a plating liquid tank (1), the back of which is also connected to a fixing assembly (2), the outside of which is also sleeved with a circulating liquid pump (3) sleeved with the plating liquid tank (1), and the circulating liquid pump (3) is connected to a plurality of liquid inlets (4) and liquid outlets (5) connected with the plating liquid tank (1); The circulating liquid pump (3) is provided with a liquid outlet valve pipe group (6) and a liquid inlet valve pipe group (7) matching with the liquid inlet (4) and the liquid outlet (5); a digital filter tank (8) for filtering the plating liquid is connected between the liquid outlet valve pipe group (6) and the liquid inlet valve pipe group (7); and a digital instrument group (24) for monitoring the quality of the internal liquid is connected inside the digital filter tank (8).

2. The plating solution treatment equipment for producing electroplated diamond wire according to claim 1, characterized in that: A reflux pipe group (9) is also provided between the liquid outlet valve pipe group (6) and the liquid inlet valve pipe group (7) and is connected to the circulating liquid pump (3).

3. The plating solution treatment equipment for producing electroplated diamond wire according to claim 1 or 2, characterized in that: The fixing assembly (2) comprises mounting buckle grooves (10) arranged on both sides of the circulating liquid pump (3), and mounting buckle plates (11) are slidably arranged in the mounting buckle grooves (10).

4. The plating solution treatment equipment for producing electroplated diamond wire according to claim 2, characterized in that: The reflux pipe group (9) comprises a main pipe (12) whose two ends are respectively connected to the liquid outlet valve pipe group (6) and the liquid inlet valve pipe group (7), and an auxiliary pipe (13) connected to the middle of the main pipe (12). Both ends of the auxiliary pipe (13) on the main pipe (12) are connected to control valves 1 (14).

5. The plating solution treatment equipment for producing electroplated diamond wire according to claim 4, characterized in that: The liquid outlet valve pipe group (6) and the liquid inlet valve pipe group (7) comprise a liquid pipe (15) connected to the digital filter tank (8) and a liquid head (16) connected to the circulating liquid pump (3); the liquid head (16) comprises a connector 1 (17) and a connector 2 (18) connected to the circulating liquid pump (3); a control valve 2 (19) is connected between the connector 1 (17) and the connector 2 (18); and a control valve 3 (20) is connected to the liquid pipe (15) near the liquid head (16).

6. The plating solution treatment equipment for producing electroplated diamond wire according to claim 5, characterized in that: A reflux extension pipe (21) is also connected to the liquid pipe (15) of the liquid outlet valve pipe group (6) in the digital filter tank (8), the reflux extension pipe (21) extends to the bottom of the digital filter tank (8), and a solenoid valve (22) is connected between the reflux extension pipe (21) and the liquid pipe (15).

7. The plating solution treatment equipment for producing electroplated diamond wire according to claim 2 or 6, characterized in that: The digital filter tank (8) is internally connected with a filter group (23) arranged from top to bottom, the filter group (23) is provided with multiple layers, and the digital instrument group (24) is provided with multiple groups respectively arranged above each layer of the filter group (23).

8. The plating solution treatment equipment for producing electroplated diamond wire according to claim 7, characterized in that: The top of the digital filter tank (8) is connected to a sealing valve cover (25), the middle of the sealing valve cover (25) is connected to an air pipe head (26), the middle of the filter group (23) is provided with an air pipe (27) running through the top and bottom thereof, and the bottom end of the air pipe head (26) is threadedly connected to the top of the air pipe (27); The air pipe (27) extending to the filter layer of the filter group (23) is connected to a backwash pipe (28), and the backwash pipe (28) is connected to a plurality of backwash heads arranged upward. The bottom of the digital filter tank (8) located above the liquid inlet valve pipe group (7) is also connected to a polymer film (29).

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