Infrared laser annular induction device

Abstract

The invention discloses an infrared laser annular induction device, which relates to the technical field of sensors and comprises a flexible transmitting plate, a flexible receiving plate and a mounting ring, a transmitting circuit is arranged on the flexible transmitting plate, and a receiving circuit is arranged on the flexible receiving plate; the plurality of flexible transmitting plates and the plurality of flexible receiving plates are annularly distributed on the inner ring wall of the mounting ring at equal intervals, and transmitting circuits on the flexible transmitting plates and receiving circuits on the flexible receiving plates are arranged at intervals; the transmitting circuit and the receiving circuit are electrically connected with the detection mainboard circuit respectively; the flexible transmitting board and the transmitting circuit on the flexible transmitting board form a transmitting FPC, and the flexible receiving board and the receiving circuit on the flexible receiving board form a receiving FPC. With the adoption of the flexible printed circuit board, under the corresponding use requirements of the mounting rings with different diameters, the flexible printed circuit board only needs to be cut into the FPC with the corresponding length and then is sleeved in the mounting ring, so that the universality of the product is improved.

Description

Technical Field

[0001] The present application relates to the field of sensor technology, and in particular to an infrared laser ring sensing device. Background Art

[0002] At present, the annular sensing devices basically use infrared sensing arrays, and all of them are hard PCBs. The biggest drawback is that different diameters of the rings need to correspond to different circuits, which leads to a long product cycle and is prone to waste. Specifically, different products correspond to different diameters. If they are not universal, they can only be redeveloped, resulting in a long product cycle; different products correspond to different diameters of the rings. If they are not universal, it is easy to cause inventory retention of certain products. Summary of the invention

[0003] The purpose of this application is to provide an infrared laser ring sensing device to solve the technical problems raised in the above background.

[0004] To achieve the above-mentioned purpose, the present application discloses the following technical solutions: an infrared laser ring-shaped sensing device, comprising a flexible transmitting plate, a flexible receiving plate and a mounting ring;

[0005] The flexible transmitting board is provided with a transmitting circuit, and the flexible receiving board is provided with a receiving circuit; a plurality of the flexible transmitting boards and a plurality of the flexible receiving boards are distributed on the inner ring wall of the mounting ring at equal intervals, and the transmitting circuit on the flexible transmitting board and the receiving circuit on the flexible receiving board are arranged at intervals; the transmitting circuit and the receiving circuit are electrically connected to the detection main board circuit respectively; the flexible transmitting board and the transmitting circuit thereon constitute a transmitting FPC, and the flexible receiving board and the receiving circuit thereon constitute a receiving FPC;

[0006] In the working state, when the transmitting circuit on one of the flexible transmitting boards is started to emit light, when the receiving circuit on the flexible receiving board arranged opposite to the flexible transmitting board cannot receive the light, it means that the emitted light is blocked; the transmitting circuit on the flexible transmitting board is turned off, and the transmitting circuit on another flexible transmitting board is started, and it is monitored whether the receiving circuit on the corresponding flexible receiving board can receive the emitted light; until the transmitting circuits on all the flexible transmitting boards are started and then turned off to complete an induction detection.

[0007] Preferably, the detection mainboard circuit includes: a detection mainboard U1, a receiving signal interface circuit, a transmitting signal interface circuit, a power supply circuit, and NPN and PNP output circuits;

[0008] The receiving signal interface circuit includes a chip resistor row RN and a socket row CN-J, one end of the chip resistor row RN is connected to the detection mainboard U1, and the other end is connected to the socket row CN-J;

[0009] The transmission signal interface circuit includes PNP type band-stop transistor Q1, PNP type band-stop transistor Q2, PNP type band-stop transistor Q3, PNP type band-stop transistor Q4, PNP type band-stop transistor Q5 and a socket CN-F, and the bases of the PNP type band-stop transistor Q1, the PNP type band-stop transistor Q2, the PNP type band-stop transistor Q3, the PNP type band-stop transistor Q4 and the PNP type band-stop transistor Q5 are respectively connected to the detection mainboard U1, The collectors of the PNP type band-stop transistor Q1, the PNP type band-stop transistor Q2, the PNP type band-stop transistor Q3, the PNP type band-stop transistor Q4 and the PNP type band-stop transistor Q5 are respectively connected to the socket CN-F, and the emitters of the PNP type band-stop transistor Q1, the PNP type band-stop transistor Q2, the PNP type band-stop transistor Q3, the PNP type band-stop transistor Q4 and the PNP type band-stop transistor Q5 are connected and then grounded;

[0010] The power supply circuit includes an inductor L1, a resistor R2, a capacitor C8, a capacitor C20, a power chip U2, a capacitor C19, an inductor L2, a resistor R3, a resistor R4, an inductor L3, a capacitor C12 and a step-down circuit; Pin 1 of the inductor L1 is connected to VCC, Pin 2 of the inductor L1 is respectively connected to Pin 1 of the capacitor C8, Pin 1 of the capacitor C20, Pin 1 of the resistor R2 and Pin 5 of the power chip U2, Pin 2 of the capacitor C8 and the capacitor C20 are connected to ground; Pin 2 of the resistor R2 is connected to Pin 4 of the power chip U2, Pin 1 of the capacitor C19 and Pin 1 of the inductor L2 are respectively connected to Pin 6 of the power chip U2, Pin 2 of the capacitor C19 is connected to pin 1 of the power chip U2, pin 1 of the resistor R3 is connected to pin 3 of the power chip, and pin 2 of the power chip U2 is connected to pin 2 of the resistor R3 and then grounded; pin 2 of the inductor L2 is respectively connected to pin 1 of the capacitor C11, pin 1 of the inductor L3 and pin 1 of the resistor R4, and pin 2 of the resistor R4 is connected to pin 2 of the resistor R3; pin 2 of the capacitor C11 is grounded; pin 2 of the inductor L3 is respectively connected to pin 1 of the capacitor C12 and the step-down circuit, and pin 2 of the inductor L3 is also connected to a +6V output voltage terminal, and the step-down circuit is used to output +3.3V and +5V voltages;

[0011] The NPN and PNP output circuits are connected to the detection main board U1.

[0012] Preferably, the step-down circuit includes a voltage stabilizing chip U3 and a voltage stabilizing chip U4;

[0013] Pin 1 of the voltage stabilizing chip U3 is connected to pin 2 of the inductor L3, and pin 1 of the voltage stabilizing chip U3 is connected to pin 3; pin 2 of the capacitor C12 is grounded; pin 2 of the voltage stabilizing chip U3 is grounded; pin 5 of the voltage stabilizing chip U3 is connected to the +3.3V output voltage terminal, and pin 5 of the voltage stabilizing chip is connected to pin 1 of the capacitor C13, and pin 2 of the capacitor C13 is grounded.

[0014] Pin 1 of the voltage stabilizing chip U4 is connected to pin 2 of the inductor L3, and pin 1 of the voltage stabilizing chip U4 is connected to pin 3; pin 2 of the capacitor C12 is grounded; pin 2 of the voltage stabilizing chip U4 is grounded; pin 5 of the voltage stabilizing chip U4 is connected to the +5V output voltage terminal, and pin 5 of the voltage stabilizing chip is connected to pin 1 of the capacitor C14, and pin 2 of the capacitor C14 is grounded.

[0015] Preferably, the NPN and PNP output circuits include: a PNP-type band-resistance transistor Q7, a resistor R15, a light-emitting diode LED1, a voltage-stabilizing diode D3, an NPN-type band-resistance transistor Q6, a voltage-stabilizing diode D2, a self-recovery fuse F1, a self-recovery fuse F2, a socket CN1, a voltage-stabilizing diode D1, a capacitor C18 and a voltage-stabilizing diode D4;

[0016] The base of the PNP type band-block transistor Q7 is connected to the detection mainboard U1 and the pin 1 of the resistor R15 respectively, the pin 2 of the resistor R15 is connected to the positive electrode of the light-emitting diode LED1, the negative electrode of the light-emitting diode LED1, the emitter of the PNP type band-block transistor Q7 and the positive electrode of the voltage-stabilizing diode D3 are connected and then grounded;

[0017] The collector of the PNP type band-blocking transistor Q7 is respectively connected to the base of the NPN type band-blocking transistor Q6, the cathode of the voltage-resetting diode D3 and the pin 1 of the resettable fuse F1, the collector of the NPN type band-blocking transistor Q6 is connected to the cathode of the voltage-resetting diode D2 and then connected to VCC, the emitter of the NPN type band-blocking transistor Q6 is respectively connected to the anode of the voltage-resetting diode D2 and the pin 1 of the resettable fuse F2, the pin 2 of the resettable fuse F1 is connected to the pin 2 of the resettable fuse F2 and then connected to the pin 1 of the socket CN1, the pin 2 of the socket CN1 is grounded, the pin 1 of the socket CN1 is connected to the anode of the voltage-resetting diode D1, the cathode of the voltage-resetting diode D1 is respectively connected to the pin 1 of the capacitor C18, the cathode of the voltage-resetting diode D4 and VCC, the pin 2 of the capacitor C18 is connected to the anode of the voltage-resetting diode D4 and then grounded.

[0018] Beneficial effect: The infrared laser ring sensing device of the present application is composed of a flexible transmitting board, a flexible receiving board, a mounting ring and corresponding circuits, and the flexible transmitting board and the transmitting circuit thereon constitute a transmitting FPC, and the flexible receiving board and the receiving circuit thereon constitute a receiving FPC. In order to meet the corresponding usage requirements for mounting rings of different diameters, it is only necessary to cut the FPC into corresponding lengths and then insert it into the mounting ring, thereby improving the versatility of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A circuit schematic diagram of the detection mainboard U1 provided in an embodiment of the present application;

[0021] Figure 2 A circuit schematic diagram of a receiving signal interface circuit provided in an embodiment of the present application;

[0022] Figure 3 A circuit schematic diagram of a transmission signal interface circuit provided in an embodiment of the present application;

[0023] Figure 4 A circuit schematic diagram of a power supply circuit provided in an embodiment of the present application;

[0024] Figure 5 A circuit schematic diagram of an NPN and PNP output circuit provided in an embodiment of the present application;

[0025] Figure 6 A circuit schematic diagram of a transmitting circuit provided in an embodiment of the present application;

[0026] Figure 7 A circuit schematic diagram of a receiving circuit provided in an embodiment of the present application;

[0027] Figure 8 This is a circuit schematic diagram of the acquisition control circuit provided in an embodiment of the present application. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0029] In this article, the term "comprising" is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, the elements defined by the sentence "comprising..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0030] The present embodiment discloses an infrared laser ring sensing device, including a flexible transmitting board, a flexible receiving board and a mounting ring. The mounting ring can be any one of the prior art. A transmitting circuit is arranged on the flexible transmitting board, a receiving circuit is arranged on the flexible receiving board, and the transmitting circuit and the receiving circuit are electrically connected to the detection main board circuit respectively; the flexible transmitting board and the transmitting circuit thereon constitute a transmitting FPC, and the flexible receiving board and the receiving circuit thereon constitute a receiving FPC. A plurality of the flexible transmitting boards and a plurality of the flexible receiving boards are distributed on the inner ring wall of the mounting ring at equal intervals, and the transmitting circuit on the flexible transmitting board and the receiving circuit on the flexible receiving board are arranged at intervals.

[0031] In the working state, when the transmitting circuit on one of the flexible transmitting boards is started to emit light, when the receiving circuit on the flexible receiving board arranged opposite to the flexible transmitting board cannot receive the light, it means that the emitted light is blocked; the transmitting circuit on the flexible transmitting board is turned off, and the transmitting circuit on another flexible transmitting board is started, and it is monitored whether the receiving circuit on the corresponding flexible receiving board can receive the emitted light; until the transmitting circuits on all the flexible transmitting boards are started and then turned off to complete an induction detection.

[0032] Based on the above, the infrared laser ring sensing device of this embodiment realizes that when required to use installation rings of different diameters, the FPC only needs to be cut into corresponding lengths and then inserted into the installation ring, thereby improving the versatility of the product.

[0033] In this embodiment, in order to ensure that the corresponding FPC can accurately adapt to the installation in the installation ring and meet the usage requirements (that is, to achieve the aforementioned working state) after being intercepted, this embodiment further improves the receiving circuit, the transmitting circuit and the detection main board circuit, thereby ensuring that the receiving circuit and the transmitting circuit can achieve accurate detection under the control of the detection main board circuit.

[0034] Specifically, the detection mainboard circuit includes: a detection mainboard U1, a receiving signal interface circuit, a transmitting signal interface circuit, a power supply circuit, an NPN and PNP output circuit, a receiving lamp matrix circuit and a transmitting lamp matrix circuit. In this embodiment, the model of the detection mainboard U1 is STM32F051 K8U6, and its pin diagram and peripheral circuits are as follows: Figure 1 As shown, the specific parameters of the electronic components involved are detailed in the figure and will not be elaborated in this text.

[0035] The receiving signal interface circuit includes a chip resistor row RN and a socket row CN-J. One end of the chip resistor row RN is connected to the detection mainboard U1, and the other end is connected to the socket row CN-J. In this embodiment, the installation ring is divided into left and right halves as an example. Figure 2 As shown, the chip resistor row RN1 and the socket CN-J5 constitute the left half of the receiving signal interface circuit, and the chip resistor row RN2 and the socket CN-J4 constitute the right half of the receiving signal interface circuit. Among them, one end of the chip resistor row RN1 is connected to the 6-10 pins of the detection mainboard U1, and one end of the chip resistor row RN2 is connected to the 11-15 pins of the detection mainboard U1. The specific parameters of the electronic components involved are detailed in the figure, and this text will not be repeated here.

[0036] The transmission signal interface circuit includes PNP type band-stop transistor Q1, PNP type band-stop transistor Q2, PNP type band-stop transistor Q3, PNP type band-stop transistor Q4, PNP type band-stop transistor Q5 and a socket CN-F, and the bases of the PNP type band-stop transistor Q1, the PNP type band-stop transistor Q2, the PNP type band-stop transistor Q3, the PNP type band-stop transistor Q4 and the PNP type band-stop transistor Q5 are respectively connected to the detection mainboard U1, The collectors of the PNP type band-stop transistor Q1, the PNP type band-stop transistor Q2, the PNP type band-stop transistor Q3, the PNP type band-stop transistor Q4 and the PNP type band-stop transistor Q5 are respectively connected to the socket CN-F, and the emitters of the PNP type band-stop transistor Q1, the PNP type band-stop transistor Q2, the PNP type band-stop transistor Q3, the PNP type band-stop transistor Q4 and the PNP type band-stop transistor Q5 are connected and then grounded. In this embodiment, taking the installation ring divided into left and right halves as an example, as Figure 3As shown, the PNP type band-stop transistor Q11, PNP type band-stop transistor Q21, PNP type band-stop transistor Q31, PNP type band-stop transistor Q41, PNP type band-stop transistor Q51 and the plug CN-F3 constitute the transmission signal interface circuit of the left half; the PNP type band-stop transistor Q12, PNP type band-stop transistor Q22, PNP type band-stop transistor Q32, PNP type band-stop transistor Q42, PNP type band-stop transistor Q52 and the plug CN-F2 constitute the transmission signal interface circuit of the right half. Among them, the specific connection relationship between the internal components involved, the component parameters and the connection relationship with other circuits are detailed in the figure, and this text will not be repeated here.

[0037] like Figure 4 As shown, the power supply circuit includes an inductor L1, a resistor R2, a capacitor C8, a capacitor C20, a power chip U2, a capacitor C19, an inductor L2, a resistor R3, a resistor R4, an inductor L3, a capacitor C12 and a step-down circuit; Pin 1 of the inductor L1 is connected to VCC, Pin 2 of the inductor L1 is respectively connected to Pin 1 of the capacitor C8, Pin 1 of the capacitor C20, Pin 1 of the resistor R2 and Pin 5 of the power chip U2, and Pin 2 of the capacitor C8 and the capacitor C20 are connected to ground; Pin 2 of the resistor R2 is connected to Pin 4 of the power chip U2, Pin 1 of the capacitor C19 and Pin 1 of the inductor L2 are respectively connected to Pin 6 of the power chip U2. The 2nd pin of the capacitor C19 is connected to the 1st pin of the power chip U2, the 1st pin of the resistor R3 is connected to the 3rd pin of the power chip, and the 2nd pin of the power chip U2 is connected to the 2nd pin of the resistor R3 and then grounded; the 2nd pin of the inductor L2 is respectively connected to the 1st pin of the capacitor C11, the 1st pin of the inductor L3 and the 1st pin of the resistor R4, and the 2nd pin of the resistor R4 is connected to the 2nd pin of the resistor R3; the 2nd pin of the capacitor C11 is grounded; the 2nd pin of the inductor L3 is respectively connected to the 1st pin of the capacitor C12 and the step-down circuit, and the 2nd pin of the inductor L3 is also connected to the +6V output voltage terminal, and the step-down circuit is used to output +3.3V and +5V voltages. In this regard, the power circuit of this embodiment adopts the DCDC+LD0 method to realize the function of providing 6V, 5V and 3.3V voltages to meet the operation of the device. Among them, the specific parameters of the electronic components involved and the connection relationship with other circuits are shown in the figure, and this text will not be repeated here.

[0038] In this embodiment, if Figure 4 In the embodiment, the step-down circuit includes a voltage stabilizing chip U3 and a voltage stabilizing chip U4.

[0039] Pin 1 of the voltage stabilizing chip U3 is connected to pin 2 of the inductor L3, and pin 1 of the voltage stabilizing chip U3 is connected to pin 3; pin 2 of the capacitor C12 is grounded; pin 2 of the voltage stabilizing chip U3 is grounded; pin 5 of the voltage stabilizing chip U3 is connected to the +3.3V output voltage terminal, and pin 5 of the voltage stabilizing chip is connected to pin 1 of the capacitor C13, and pin 2 of the capacitor C13 is grounded.

[0040] Pin 1 of the voltage stabilizing chip U4 is connected to pin 2 of the inductor L3, and pin 1 of the voltage stabilizing chip U4 is connected to pin 3; pin 2 of the capacitor C12 is grounded; pin 2 of the voltage stabilizing chip U4 is grounded; pin 5 of the voltage stabilizing chip U4 is connected to the +5V output voltage terminal, and pin 5 of the voltage stabilizing chip is connected to pin 1 of the capacitor C14, and pin 2 of the capacitor C14 is grounded.

[0041] In this embodiment, the NPN and PNP output circuits are connected to the detection mainboard U1. Figure 5 As shown, the NPN and PNP output circuits include: a PNP-type band-resistance transistor Q7, a resistor R15, a light-emitting diode LED1, a voltage-stabilizing diode D3, an NPN-type band-resistance transistor Q6, a voltage-stabilizing diode D2, a resettable fuse F1, a resettable fuse F2, a socket CN1, a voltage-stabilizing diode D1, a capacitor C18 and a voltage-stabilizing diode D4.

[0042] The base of the PNP type band-block transistor Q7 is connected to the detection mainboard U1 and the pin 1 of the resistor R15 respectively, the pin 2 of the resistor R15 is connected to the positive electrode of the light-emitting diode LED1, the negative electrode of the light-emitting diode LED1, the emitter of the PNP type band-block transistor Q7 and the positive electrode of the voltage-stabilizing diode D3 are connected and then grounded;

[0043] The collector of the PNP type band-blocking transistor Q7 is respectively connected to the base of the NPN type band-blocking transistor Q6, the cathode of the voltage-resetting diode D3 and the pin 1 of the resettable fuse F1, the collector of the NPN type band-blocking transistor Q6 is connected to the cathode of the voltage-resetting diode D2 and then connected to VCC, the emitter of the NPN type band-blocking transistor Q6 is respectively connected to the anode of the voltage-resetting diode D2 and the pin 1 of the resettable fuse F2, the pin 2 of the resettable fuse F1 is connected to the pin 2 of the resettable fuse F2 and then connected to the pin 1 of the socket CN1, the pin 2 of the socket CN1 is grounded, the pin 1 of the socket CN1 is connected to the anode of the voltage-resetting diode D1, the cathode of the voltage-resetting diode D1 is respectively connected to the pin 1 of the capacitor C18, the cathode of the voltage-resetting diode D4 and VCC, the pin 2 of the capacitor C18 is connected to the anode of the voltage-resetting diode D4 and then grounded. The specific parameters of the electronic components involved and the connection relationship with other circuits are shown in the figure, and this text will not be repeated here. In this regard, the NPN and PNP output circuits provided in this embodiment include output overcurrent protection and surge protection.

[0044] In this embodiment, the specific circuit contents of the transmitting circuit are as follows: Figure 6 As shown, the specific circuit contents of the receiving circuit are as follows Figure 7 As shown, the specific parameters of the electronic components involved and the connection relationship with other circuits are shown in the figure, which will not be repeated in this text. Further, in order to ensure the reliability in practical applications, the receiving circuit is also connected with Figure 8 The acquisition control circuit connection shown in the figure, wherein the specific parameters of the electronic components involved and the connection relationship with other circuits are detailed in the figure, and this text will not be repeated here. In this regard, this embodiment adopts a DC isolation method to collect signals and amplifies each group of signals separately, thereby ensuring the accuracy and reliability of the collected signals.

[0045] Finally, it should be noted that the above is only a preferred embodiment of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. An infrared laser ring sensing device, characterized in that: It includes a flexible transmitting plate, a flexible receiving plate and a mounting ring; The flexible transmitting board is provided with a transmitting circuit, and the flexible receiving board is provided with a receiving circuit; a plurality of the flexible transmitting boards and a plurality of the flexible receiving boards are distributed on the inner ring wall of the mounting ring at equal intervals, and the transmitting circuit on the flexible transmitting board and the receiving circuit on the flexible receiving board are arranged at intervals; the transmitting circuit and the receiving circuit are electrically connected to the detection main board circuit respectively; the flexible transmitting board and the transmitting circuit thereon constitute a transmitting FPC, and the flexible receiving board and the receiving circuit thereon constitute a receiving FPC; In the working state, when the transmitting circuit on one of the flexible transmitting boards is started to transmit light, when the receiving circuit on the flexible receiving board arranged opposite to the flexible transmitting board cannot receive the light, it indicates that the transmitted light is blocked; the transmitting circuit on the flexible transmitting board is turned off, and the transmitting circuit on another flexible transmitting board is started, and it is monitored whether the receiving circuit on the corresponding flexible receiving board can receive the transmitted light; Until the transmitting circuits on all the flexible transmitting boards are started and then turned off, an induction detection is completed; The detection mainboard circuit includes: a detection mainboard U1, a receiving signal interface circuit, a transmitting signal interface circuit, a power supply circuit, and NPN and PNP output circuits; The receiving signal interface circuit includes a chip resistor row RN and a socket row CN-J, one end of the chip resistor row RN is connected to the detection mainboard U1, and the other end is connected to the socket row CN-J; The transmission signal interface circuit includes a PNP type band-stop transistor Q1, a PNP type band-stop transistor Q2, a PNP type band-stop transistor Q3, a PNP type band-stop transistor Q4, a PNP type band-stop transistor Q5 and a socket CN-F, wherein the bases of the PNP type band-stop transistor Q1, the PNP type band-stop transistor Q2, the PNP type band-stop transistor Q3, the PNP type band-stop transistor Q4 and the PNP type band-stop transistor Q5 are respectively connected to the detection mainboard U1, The collectors of the PNP type band-stop transistor Q1, the PNP type band-stop transistor Q2, the PNP type band-stop transistor Q3, the PNP type band-stop transistor Q4 and the PNP type band-stop transistor Q5 are respectively connected to the socket CN-F, and the emitters of the PNP type band-stop transistor Q1, the PNP type band-stop transistor Q2, the PNP type band-stop transistor Q3, the PNP type band-stop transistor Q4 and the PNP type band-stop transistor Q5 are connected and then grounded; The power supply circuit includes an inductor L1, a resistor R2, a capacitor C8, a capacitor C20, a power chip U2, a capacitor C19, an inductor L2, a resistor R3, a resistor R4, an inductor L3, a capacitor C12 and a step-down circuit; Pin 1 of the inductor L1 is connected to VCC, Pin 2 of the inductor L1 is respectively connected to Pin 1 of the capacitor C8, Pin 1 of the capacitor C20, Pin 1 of the resistor R2 and Pin 5 of the power chip U2, and Pin 2 of the capacitor C8 and the capacitor C20 are connected to ground; Pin 2 of the resistor R2 is connected to Pin 4 of the power chip U2, and Pin 1 of the capacitor C19 and Pin 1 of the inductor L2 are respectively connected to Pin 6 of the power chip U2. , Pin 2 of the capacitor C19 is connected to Pin 1 of the power chip U2, Pin 1 of the resistor R3 is connected to Pin 3 of the power chip, Pin 2 of the power chip U2 is connected to Pin 2 of the resistor R3 and then grounded; Pin 2 of the inductor L2 is respectively connected to Pin 1 of the capacitor C11, Pin 1 of the inductor L3 and Pin 1 of the resistor R4, Pin 2 of the resistor R4 is connected to Pin 2 of the resistor R3; Pin 2 of the capacitor C11 is grounded; Pin 2 of the inductor L3 is respectively connected to Pin 1 of the capacitor C12 and the step-down circuit, Pin 2 of the inductor L3 is also connected to a +6V output voltage terminal, and the step-down circuit is used to output +3.3V and +5V voltages; The NPN and PNP output circuits are connected to the detection main board U1.

2. The infrared laser ring sensing device according to claim 1, characterized in that: The step-down circuit includes a voltage stabilizing chip U3 and a voltage stabilizing chip U4; Pin 1 of the voltage stabilizing chip U3 is connected to pin 2 of the inductor L3, and pin 1 of the voltage stabilizing chip U3 is connected to pin 3; pin 2 of the capacitor C12 is grounded; pin 2 of the voltage stabilizing chip U3 is grounded; pin 5 of the voltage stabilizing chip U3 is connected to the +3.3V output voltage terminal, and pin 5 of the voltage stabilizing chip is connected to pin 1 of the capacitor C13, and pin 2 of the capacitor C13 is grounded; Pin 1 of the voltage stabilizing chip U4 is connected to pin 2 of the inductor L3, and pin 1 of the voltage stabilizing chip U4 is connected to pin 3; pin 2 of the capacitor C12 is grounded; pin 2 of the voltage stabilizing chip U4 is grounded; pin 5 of the voltage stabilizing chip U4 is connected to the +5V output voltage terminal, and pin 5 of the voltage stabilizing chip is connected to pin 1 of the capacitor C14, and pin 2 of the capacitor C14 is grounded.

3. The infrared laser ring sensing device according to claim 1, characterized in that: The NPN and PNP output circuits include: a PNP type band-resistance transistor Q7, a resistor R15, a light-emitting diode LED1, a voltage-stabilizing diode D3, an NPN type band-resistance transistor Q6, a voltage-stabilizing diode D2, a self-recovering fuse F1, a self-recovering fuse F2, a socket CN1, a voltage-stabilizing diode D1, a capacitor C18 and a voltage-stabilizing diode D4; The base of the PNP type band-block transistor Q7 is connected to the detection mainboard U1 and the pin 1 of the resistor R15 respectively, the pin 2 of the resistor R15 is connected to the positive electrode of the light-emitting diode LED1, the negative electrode of the light-emitting diode LED1, the emitter of the PNP type band-block transistor Q7 and the positive electrode of the voltage-stabilizing diode D3 are connected and then grounded; The collector of the PNP type band-blocking transistor Q7 is respectively connected to the base of the NPN type band-blocking transistor Q6, the cathode of the voltage-resetting diode D3 and the pin 1 of the resettable fuse F1, the collector of the NPN type band-blocking transistor Q6 is connected to the cathode of the voltage-resetting diode D2 and then connected to VCC, the emitter of the NPN type band-blocking transistor Q6 is respectively connected to the anode of the voltage-resetting diode D2 and the pin 1 of the resettable fuse F2, the pin 2 of the resettable fuse F1 is connected to the pin 2 of the resettable fuse F2 and then connected to the pin 1 of the socket CN1, the pin 2 of the socket CN1 is grounded, the pin 1 of the socket CN1 is connected to the anode of the voltage-resetting diode D1, the cathode of the voltage-resetting diode D1 is respectively connected to the pin 1 of the capacitor C18, the cathode of the voltage-resetting diode D4 and VCC, the pin 2 of the capacitor C18 is connected to the anode of the voltage-resetting diode D4 and then grounded.

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