Display panel, preparation method thereof and display device

Abstract

The invention relates to a display panel, a preparation method thereof and a display device. The preparation method comprises the following steps: providing a first substrate; a first erasable layer comprising a first hollow part is printed on the surface of one side of the substrate in an ink-jet mode; the first hollow part penetrates through the first erasable layer in the direction perpendicular to the plane where the first substrate is located; curing the first erasable layer; preparing a first conductive layer on one side, far away from the first substrate, of the first erasable layer; a part of the first conductive layer is located in the first hollow part; the thickness of the first erasable layer is larger than that of the first conductive layer in the direction perpendicular to the plane where the first substrate is located; the first erasable layer is cleared with a first elimination material. By preparing the first erasable layer which can be removed by the first elimination material as a mold for manufacturing the first conductive layer, manufacturing of the first conductive layer in a specific shape and specification is facilitated, the thickness of the first conductive layer is made to be low, rapid removal of the first erasable layer is facilitated, and the manufacturing efficiency of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] Among the current display technology solutions, in common touch capacitive screens, the touch electrodes are basically made using a subtractive process, which uses laser dry etching / yellow light and other processes after sputtering / coating the electrodes, thereby realizing subtractive touch electrode circuit production. For the production of touch electrode circuits, the most commonly used subtractive solution in the market is the laser station, which has the greatest impact on the progress of the entire solution. This station occupies a large area and is a heavy machinery station, which obviously increases the production cost of the touch capacitive screen. Based on the development of the industry, the price of external capacitive screens is particularly limited by the high resolution of frame-mounted models, and its price is increasingly moving towards a competitive market. There is an urgent need for a low-priced and highly reliable touch capacitive screen production solution to break through, in order to obtain a large amount of incremental value and increase the market share of capacitive screens. Summary of the invention

[0003] Based on this, it is necessary to provide a display panel and a manufacturing method thereof, and a display device that can reduce the manufacturing cost of a touch capacitive screen in order to address the above technical problems.

[0004] In a first aspect, the present application provides a method for preparing a display panel, comprising:

[0005] providing a first substrate;

[0006] Inkjet printing a first removable layer on a first side of the first base substrate; wherein the first removable layer comprises at least one first hollow portion, and the first hollow portion penetrates the first removable layer in a direction perpendicular to the plane where the first base substrate is located;

[0007] curing the first removable layer;

[0008] A first conductive layer is prepared on a side of the first erasable layer away from the first substrate; wherein at least a portion of the first conductive layer is located in the first hollow portion; and in a direction perpendicular to the plane where the first substrate is located, a thickness of the first erasable layer is greater than a thickness of the first conductive layer;

[0009] The first removable layer is removed using a first removable material.

[0010] In one embodiment, before inkjet printing the first removable layer on the first side of the first substrate, the method further includes:

[0011] A second removable layer is prepared on the first side of the first substrate; wherein the second removable layer includes at least one second hollow portion, and the second hollow portion penetrates the second removable layer in a direction perpendicular to the plane where the first substrate is located, and the first hollow portion and the second hollow portion at least partially overlap;

[0012] After removing the first erasable layer by using the first erasable material, the method further comprises:

[0013] The second erasable layer is removed using a first erasable material or a second erasable material.

[0014] In one embodiment, after removing the first removable layer using the first removing material, the method further comprises:

[0015] Preparing a first insulating layer on a side of the first conductive layer away from the first substrate; wherein the first insulating layer covers the first conductive layer;

[0016] A third removable layer is inkjet printed on a surface of the first insulating layer away from the first base substrate; wherein the third removable layer comprises at least one third hollow portion, and the third hollow portion penetrates the third removable layer in a direction perpendicular to the plane where the first base substrate is located;

[0017] curing the third removable layer;

[0018] A second conductive layer is prepared on a side of the third erasable layer away from the first substrate; wherein at least a portion of the second conductive layer is located in the third hollow portion; and in a direction perpendicular to the plane where the first substrate is located, the thickness of the third erasable layer is greater than the thickness of the second conductive layer;

[0019] The third removable layer is removed using a third removable material.

[0020] In one embodiment, after removing the first removable layer using the first removing material, the method further comprises:

[0021] Prepare a first protective layer on a side of the first conductive layer away from the first substrate;

[0022] A fourth erasable layer is inkjet printed on a surface of the first substrate away from the first conductive layer; wherein the fourth erasable layer comprises at least one fourth hollow portion, and the fourth hollow portion penetrates the fourth erasable layer in a direction perpendicular to the plane where the first substrate is located;

[0023] curing the fourth removable layer;

[0024] A third conductive layer is prepared on a side of the fourth erasable layer away from the first substrate; wherein at least a portion of the third conductive layer is located in the fourth hollow portion; and in a direction perpendicular to the plane where the first substrate is located, the thickness of the fourth erasable layer is greater than the thickness of the third conductive layer;

[0025] The fourth removable layer is removed using a fourth removable material.

[0026] In one embodiment, after removing the first removable layer using the first removing material, the method further comprises:

[0027] Providing a second substrate; wherein the second substrate is located on a side of the first conductive layer away from the first substrate;

[0028] Inkjet printing a fifth removable layer on the first side of the second base substrate; wherein the fifth removable layer includes at least one fifth hollow portion, and the fifth hollow portion penetrates the fifth removable layer in a direction perpendicular to the plane where the second base substrate is located;

[0029] curing the fifth removable layer;

[0030] A fourth conductive layer is formed on a side of the fifth erasable layer away from the second substrate; wherein at least a portion of the fourth conductive layer is located in the fifth hollow portion; and in a direction perpendicular to the plane where the second substrate is located, the thickness of the fifth erasable layer is greater than the thickness of the fourth conductive layer;

[0031] The fifth removable layer is removed using a fifth removable material.

[0032] In one embodiment, the inkjet printing of the first removable layer on the first side of the first substrate comprises:

[0033] A first water-based, oil-soluble, or solvent-based removable layer is inkjet printed on the first side of the first substrate; wherein the first removable layer is made of a base resin, and the base resin includes at least one of amino acid, acrylic acid, and polyurethane.

[0034] In one embodiment, the inkjet printing of the first removable layer on the first side of the first substrate comprises:

[0035] On the first side of the first substrate, a first removable layer with a thickness D1 is inkjet printed in a direction perpendicular to the plane where the first substrate is located, 20 μm≤D1≤200 μm.

[0036] In one embodiment, the step of preparing a first conductive layer on a side of the first removable layer away from the first substrate includes:

[0037] preparing a first indium tin oxide film on a side of the first removable layer away from the first substrate; or,

[0038] Preparing a first silver nanowire film on a side of the first removable layer away from the first substrate; or,

[0039] A first metal mesh film is prepared on a side of the first removable layer away from the first substrate.

[0040] In one embodiment, the step of preparing a first conductive layer on a side of the first removable layer away from the first substrate includes:

[0041] A first conductive layer is sputtered on a side of the first removable layer away from the first substrate.

[0042] In one embodiment, the inkjet printing of the first removable layer on the first side of the first substrate comprises:

[0043] A first erasable layer including a plurality of first erasable units is inkjet printed on the first side of the first substrate; wherein, along a direction parallel to the plane where the first substrate is located, at least one group of adjacently arranged first erasable units includes a first hollow portion between them.

[0044] In one embodiment, the inkjet printing of a first removable layer including a plurality of first removable units on the first side of the first substrate comprises:

[0045] A first erasable layer is inkjet printed on the first side of the first substrate, comprising a plurality of first erasable units with a printing precision of P1, 5nm≤P1≤200nm; wherein the printing precision P1 is the printing precision of the printing height and the printing width of the first erasable unit.

[0046] In one embodiment, the inkjet printing of the first removable layer on the first side of the first substrate comprises:

[0047] On the first side of the first substrate, a first removable layer is inkjet printed using a first nozzle with an inkjet printing accuracy of P2, 90%×(1440*720 / inch)≤P2≤110%×(1440*720 / inch).

[0048] In one embodiment, before preparing the first conductive layer on the side of the first removable layer away from the first substrate, the method further includes:

[0049] A first primer layer is prepared on a side of the first removable layer away from the first substrate; wherein the preparation material of the first primer layer includes a silicon-based material.

[0050] In one embodiment, the step of preparing a first primer layer on a side of the first removable layer away from the first substrate includes:

[0051] On a side of the first removable layer away from the first substrate, a first primer layer with a thickness of D2 is prepared in a direction perpendicular to the plane where the first substrate is located, and 5nm≤D2≤100nm.

[0052] In one embodiment, the step of preparing a first conductive layer on a side of the first removable layer away from the first substrate includes:

[0053] On a side of the first removable layer away from the first substrate, a first conductive layer with a thickness of D3 is prepared in a direction perpendicular to the plane where the first substrate is located, and 5 μm≤D3≤200 μm.

[0054] In one embodiment, before preparing the first conductive layer on the side of the first removable layer away from the first substrate, the method further includes:

[0055] On the side of the first erasable layer away from the first base substrate, an erasable layer with a thickness of D4 is prepared in a direction perpendicular to the plane where the first base substrate is located, and 20 μm≤D4≤200 μm.

[0056] In a second aspect, the present application further provides a display panel, which is obtained by using any one of the methods for preparing a display panel.

[0057] In a third aspect, the present application also provides a display device, which includes the display panel.

[0058] The above-mentioned display panel and its preparation method and display device, in the preparation method of the display panel, a first removable layer including a first hollow portion is first prepared on the first side of the first base substrate by inkjet printing, and the first removable layer is solidified, and then a first conductive layer is further prepared on the side of the first removable layer away from the first base substrate, so that part of the first conductive layer is made in the first hollow portion of the first removable layer, and finally the first removable layer is removed by a first removable material to retain the first conductive layer located in the area where the first hollow portion is located, thereby realizing the production of the first conductive layer located in a specific area on one side of the first base substrate in the display panel, and preparing the first removable layer that can be removed by the first removable material as a mold for the production of the first conductive layer is conducive to the production of the first conductive layer of a specific shape and specification, and the production process is relatively simple, and at the same time, the thickness of the first conductive layer is made lower than that of the first removable layer, which is conducive to the rapid removal of the first removable layer by the first removable material, which is conducive to improving the production efficiency of the display panel, and in addition, it can also ensure that the production cost of the first conductive layer is low, which is conducive to reducing the production cost of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0060] Figure 1 A flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0061] Figure 2 A schematic plan view of a display panel provided in an embodiment of the present application;

[0062] Figure 3 Provided in the embodiments of this application Figure 2 A cross-sectional schematic diagram of a preparation process of AA';

[0063] Figure 4 Provided in the embodiments of this application Figure 2 A schematic plan view of the first removable layer during the preparation of region B;

[0064] Figure 5 A flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0065] Figure 6 Provided in the embodiments of this application Figure 2 A cross-sectional schematic diagram of another preparation process of AA';

[0066] Figure 7 A flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0067] Figure 8 A flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0068] Fig. 9 A schematic plan view of a display device provided in an embodiment of the present application;

[0069] Fig.10 Provided in the embodiments of this application Fig. 9 A schematic cross-sectional view of CC';

[0070] Fig.11 Provided in the embodiments of this application Fig. 9 Another cross-sectional schematic diagram of CC'. DETAILED DESCRIPTION

[0071] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Preferred embodiments of the present invention are provided in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0072] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0073] In this document, spatially related terms such as "upper" and "lower" are defined with reference to the accompanying drawings. Therefore, it will be understood that "upper" and "lower" are used interchangeably. It will be understood that when a layer is referred to as being "on" another layer, it can be directly formed on the other layer, or intervening layers may also be present. Therefore, it will be understood that when a layer is referred to as being "directly on" another layer, there are no intervening layers interposed therebetween.

[0074] In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity. It is understood that when a layer or element is referred to as being "on" another layer or substrate, the layer or element may be directly on the other layer or substrate, or there may be intervening layers. In addition, it is also understood that when a layer is referred to as being "between" two layers, the layer may be the only layer between the two layers, or there may be one or more intervening layers. In addition, the same reference numerals always represent the same elements.

[0075] Hereinafter, although terms such as "first", "second", etc. may be used to describe various components, these components are not necessarily limited to the above terms. The above terms are only used to distinguish one component from another component. It will also be understood that expressions used in the singular form include plural expressions, unless the expression in the singular form has a significantly different meaning in the context. In addition, in the following embodiments, it will also be understood that the terms "comprising" and / or "having" used herein illustrate the presence of the stated features or components, but do not exclude the presence or addition of one or more other features or components.

[0076] In the following embodiments, when a layer, region, or element is "connected", it can be interpreted that the layer, region, or element is not only directly connected but also connected through other constituent elements placed therebetween. For example, when a layer, region, element, etc. is described as being connected or electrically connected, the layer, region, element, etc. can be connected or electrically connected not only directly or directly, but also through another layer, region, element, etc. placed therebetween.

[0077] As used in the application documents, the term "and / or" includes any and all combinations of one or more of the related listed items. When a statement such as "at least one (one) of..." is placed after a list of elements (elements), it modifies the entire list of elements (elements), rather than modifying the individual elements (elements) in the list (elements).

[0078] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present invention pertains. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0079] It should also be understood that the terms “include / comprises” or “having” and the like specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0080] As described in the background technology, in the production of touch capacitive screens in the prior art, there is a problem of excessively high production costs. The inventors have found that the reason for this problem is that in the prior art, touch electrodes are basically produced using a subtractive process, in which laser dry engraving / yellow light and other processes are performed after sputtering / coating the electrodes, thereby realizing subtractive touch electrode circuit production. Not only are the touch electrode production processes numerous, but they also require the use of a relatively expensive laser workstation.

[0081] Figure 1 A flow chart of a method for preparing a display panel provided in an embodiment of the present application, Figure 2 A schematic plan view of a display panel provided in an embodiment of the present application, Figure 3 Provided in the embodiments of this application Figure 2 A cross-sectional schematic diagram of a preparation process of AA', Figure 4 Provided in the embodiments of this application Figure 2 A schematic diagram of a plan view of the first removable layer during the preparation of the B region, see Figure 1-Figure 4 Based on the above reasons, the present invention provides a method for preparing a display panel, which specifically includes the following steps 101 to 105:

[0082] Step 101 : providing a first base substrate 10 .

[0083] Specifically, the preparation method of the display panel 100 provided in the present application includes the production of a conductive layer. Therefore, it is necessary to first provide a first base substrate 10 through step 101 to serve as a receiving substrate for the production of a conductive layer in subsequent processes, such as the production of a conductive layer. It should be noted that the present application does not specifically limit the production material of the first base substrate 10. The first base substrate 10 may, for example, be a flexible base substrate or a rigid base substrate. Among them, the material of the flexible base substrate may be ultra-thin glass, metal foil or polymer plastic material; ultra-thin glass may include ultra-thin alkali-free glass, metal foil may include stainless steel foil, aluminum foil, copper foil, etc., polymer plastic material may include polyimide (PI), polyvinyl alcohol (PVA), polyethylene terephthalate (PET), etc.; the material of the rigid base substrate may be glass or silicon wafer; glass may include aluminosilicate glass, soda-lime glass (white glass) or green glass, etc. It should be noted that the materials used to make the above-mentioned flexible substrates and rigid substrates are merely exemplary and not limiting.

[0084] In step 102, inkjet print a first removable layer 11 on a first side of a first base substrate 10; wherein the first removable layer 11 includes at least one first hollow portion 12, and the first hollow portion 12 penetrates the first removable layer 11 along a direction perpendicular to the plane where the first base substrate 10 is located.

[0085] Specifically, after providing the first base substrate 10 in step 101, step 102 may be further performed to print the first removable layer 11 on the first side of the first base substrate 10 by inkjet printing. It should be noted that the first removable layer 11 produced in the present application is not a full-surface type. The first removable layer 11 includes one or more first hollow portions 12. In the direction perpendicular to the plane where the first base substrate 10 is located, these first hollow portions 12 all penetrate the first removable layer 11, so as to expose the first side surface of the first base substrate 10 in the first removable layer 11 through the first hollow portions 12. That is, the present application prepares the first removable layer 11 including the multiple first hollow portions 12, so as to use the first removable layer 11 including the multiple first hollow portions 12 as a mold, so as to facilitate the preparation of other film layer structures required for the display panel 100 in the first hollow portions 12 in the subsequent process.

[0086] It should be added that the present application does not limit the number of film layers of the film layer structure that can be prepared in the first hollow portion 12 , and the type and number of film layers to be prepared in the first hollow portion 12 can be selected according to demand.

[0087] It should also be added that the present application does not make any specific limitation on the shape of the first hollow portion 12. The shape of the orthographic projection of the first hollow portion 12 on the plane where the first base substrate 10 is located can be selected according to the shape of the film layer structure to be prepared in the first hollow portion 12 in the subsequent process. For example, the shape of the orthographic projection of the first hollow portion 12 on the plane where the first base substrate 10 is located can be selected as a long rectangle, a diamond, a square, etc., as long as the shape of the first hollow portion 12 can meet the shape requirements of the film layer structure subsequently prepared in the first hollow portion 12.

[0088] Step 103 , curing the first removable layer 11 .

[0089] Specifically, after preparing the first removable layer 11 including the first hollow portion 12 on the first side of the first base substrate 10 through step 102, in order to further improve the stability of the first removable layer 11 and ensure that the shape of the film layer structure subsequently prepared in the first hollow portion 12 is the same as the preset shape, the first removable layer 11 prepared in step 102 can be further cured through step 103 to improve the shape stability of the film layer structure subsequently prepared in the first hollow portion 12.

[0090] It should also be added that, in the process of curing the first removable layer 11 , at least one of UV (Ultraviolet Rays) curing, thermal curing, and natural curing at room temperature can be selected.

[0091] Step 104, preparing a first conductive layer 13 on a side of the first eliminable layer 11 away from the first base substrate 10; wherein at least a portion of the first conductive layer 13 is located in the first hollow portion 12; and, along a direction perpendicular to the plane where the first base substrate 10 is located, the thickness of the first eliminable layer 11 is greater than the thickness of the first conductive layer 13.

[0092] Specifically, after the first removable layer 11 is cured by step 103, step 104 may be further performed to prepare the first conductive layer 13 on the side of the first removable layer 11 away from the first base substrate 10. Since the first removable layer 11 includes a plurality of first hollow portions 12 extending through the thickness thereof, Figure 3 As shown, the material for preparing the first conductive layer 13 partially enters the first hollow portion 12 and partially is located on the surface of the first removable layer 11 away from the first base substrate 10 .

[0093] Please continue to refer to Figure 3 The present application further provides an optional implementation manner, in which the thickness of the first conductive layer 13 prepared by step 104 is smaller than the thickness of the first removable layer 11 prepared by step 103, specifically, in a direction perpendicular to the plane where the first substrate 10 is located, the thickness of the first removable layer 11 is greater than the thickness of the first conductive layer 13, that is, since the first removable layer 11 and the first conductive layer 13 located in the first hollow portion 12 are both in contact with the first side of the first substrate 10, the height of the first hollow portion 12 is greater than the thickness of the first conductive layer 13 prepared therein, so that within the range between the side surface of the first conductive layer 13 located in the first hollow portion 12 away from the first substrate 10 and the side surface of the first removable layer 11 away from the first substrate 10, the side surface of the first removable layer 11 intersecting with the plane where the first substrate 10 is located is not covered by the preparation material of the first conductive layer 13. In addition, making the thickness of the first conductive layer 13 smaller is also beneficial to making the overall film thickness of the final display panel 100 smaller, which is beneficial to the thinning design trend of the display panel 100 and its corresponding display device.

[0094] Step 105: removing the first erasable layer 11 using a first erasable material.

[0095] Specifically, after the first conductive layer 13 is prepared through step 104, step 105 can be further performed to clean the first erasable layer 11 using a first erasable material that can remove the first erasable layer 11. Since the thickness of the first conductive layer 13 prepared in step 104 is smaller than the thickness of the first erasable layer 11, a portion of the side wall of the first erasable layer 11 facing the first hollow portion 12 is not covered by the first conductive layer 13. Therefore, the first erasable layer 11 can be removed by contacting the first erasable material with the side wall of the first erasable layer 11 facing the first hollow portion 12. Since the first erasable layer 11 is removed, the preparation material of a portion of the first conductive layer 13 located on the side of the first erasable layer 11 away from the first base substrate 10 will also fall off, so that after the first erasable layer 11 is removed through step 105, as shown in FIG. Figure 3 As shown, only the first base substrate 10 and the first conductive layer 13 located in the area where the original first hollow portion 12 is located are retained.

[0096] Since the orthographic projection shape of the original first hollow portion 12 on the plane where the first substrate 10 is located is the same as the orthographic projection shape of the sub-electrode in the first conductive layer 13 after the preparation is required on the plane where the first substrate 10 is located, that is, the first removable layer 11 with the first hollow portion 12 is equivalent to a mold for making the first conductive layer 13. Therefore, by executing the above steps 101 to 105, the Figure 3 The first substrate 10 and the first conductive layer 13 located on the first side thereof are shown in the figure.

[0097] It should be added that the present application does not specifically limit the preparation material of the first erasable layer 11 and the corresponding first erasable material, as long as the first erasable material can achieve the removal of the first erasable layer 11. In addition, the present application does not specifically limit the physical factors such as temperature, humidity, time, etc. required for the first erasable material to remove the first erasable layer 11, and the relevant selected materials and physical factors can be regulated according to needs, as long as the first erasable material can achieve the removal of the first erasable layer 11.

[0098] It should also be noted that in the embodiment provided by the present application, the first removable coating is printed by inkjet printing, rather than by traditional offset printing or other process means, because the inkjet printing coating has a higher film preparation accuracy, which is more conducive to controlling the shape, size, thickness and other specifications of the first hollow portion 12 formed, thereby being more conducive to improving the accuracy of the sub-electrodes of the first conductive layer 13 subsequently prepared in the first hollow portion 12, that is, it is conducive to improving the manufacturing accuracy of the first conductive layer 13, and therefore, it can further improve the manufacturing accuracy of the display panel 100 and improve the use effect of the display panel 100. In addition, the use of inkjet printing technology can use the advantages of software to quickly realize multiple solutions without adding machines. Compared with gravure printing, it saves a lot of molds and multiple equipment site costs, which can greatly reduce the fixed asset costs of the product, thereby greatly reducing the manufacturing cost; inkjet printing technology is more efficient than other solutions, and can also greatly reduce the product manufacturing cost and reduce the product price. It is also necessary to emphasize that the inkjet printing solution can greatly reduce the high cost of public boards. Different patterns and customer customization requirements can be realized using software. The method is simple and the development cycle is short. It can greatly reduce manufacturing costs and thus reduce the cost of finished products.

[0099] In other words, the method for preparing the display panel provided in this application is an additive solution. Compared with the prior art, it greatly reduces the time-consuming process of laser dry etching, reduces the overall cost and improves the production yield and efficiency. At the same time, it can avoid the problems of laser-induced explosion points when the conductive layer undergoes the laser dry etching process in the prior art, thereby improving the product yield and reducing the product cost.

[0100] An embodiment for reference is provided here. If the preparation of the first conductive layer 13 is used to realize the touch function in the display device, then the first conductive layer 13 obtained by the preparation method of the display panel 100 provided in the present application can be used as the touch electrode layer in the display device. The preparation accuracy of the sub-electrodes in the touch electrode layer is improved, which is beneficial to improving the touch accuracy of the corresponding display device, thereby helping to improve the user experience of the corresponding display device.

[0101] In the preparation method of the above-mentioned display panel 100 provided in the present application, a first removable layer 11 including a first hollow portion 12 is first prepared on a first side of a first base substrate 10 by inkjet printing, and the first removable layer 11 is cured, and then a first conductive layer 13 is further prepared on a side of the first removable layer 11 away from the first base substrate 10, so that a portion of the first conductive layer 13 is made in the first hollow portion 12 of the first removable layer 11, and finally the first removable layer 11 is removed by using a first removable material to retain the first conductive layer 13 located in the area where the first hollow portion 12 is located, thereby achieving the display panel 10 0, the production of the first conductive layer 13 located in a specific area on one side of the first base substrate 10 is facilitated by preparing a first erasable layer 11 that can be removed by a first erasable material as a mold for the first conductive layer 13, which is conducive to the production of the first conductive layer 13 of a specific shape and specification, and the production process is relatively simple. At the same time, the thickness of the first conductive layer 13 is made lower than that of the first erasable layer 11, which is conducive to the rapid removal of the first erasable layer 11 by the first erasable material, which is conducive to improving the production efficiency of the display panel 100. In addition, it can also ensure that the production cost of the first conductive layer 13 is low, which is conducive to reducing the production cost of the display panel 100.

[0102] It should also be noted that the manufacturing method of the display panel 100 provided in the present application mainly involves how to realize the manufacturing of the first substrate 10 and the first conductive layer 13 on the surface thereof. Therefore, the present application is not limited to the manufacturing of the display panel 100. Any structural member that needs to be manufactured with a conductive layer can adopt the manufacturing method of the display panel provided in the present application. For example, it can also be used for the manufacturing of grid lines in the photovoltaic field.

[0103] Figure 5 A flow chart of another method for preparing a display panel provided in an embodiment of the present application, Figure 6 Provided in the embodiments of this application Figure 2 A cross-sectional schematic diagram of another preparation process of AA' is shown in FIG. Figure 6 For the sake of clarity, some figures do not mark the entire first conductive layer 13, but mark it on a sub-electrode in the first conductive layer 13. For the marking of the first conductive layer 13, please refer to Figure 3 ,or Figure 6 Please combine the last film structure diagram in Figure 2 , Figure 4 Reference Figure 5 , Figure 6 In an exemplary embodiment, the method for manufacturing the display panel 100 provided in the present application may further include step 106 and step 107 in addition to the above-mentioned steps 101 to 105. Among them:

[0104] Before executing step 102, inkjet printing the first removable layer 11 on the first side of the first base substrate 10, the method further includes:

[0105] Step 106, preparing a second removable layer 21 on the first side of the first base substrate 10; wherein the second removable layer 21 includes at least one second hollow portion 22, and the second hollow portion 22 penetrates the second removable layer 21 along a direction perpendicular to the plane of the first base substrate 10, and the first hollow portion 12 and the second hollow portion 22 at least partially overlap.

[0106] Specifically, since the material of the first base substrate 10 may be an organic material and the material of the first removable layer 11 may be an inorganic material, if the inorganic material is prepared directly on the surface of the organic material, the adhesion between the two may be insufficient, and the first removable layer 11 may fall off from the first side of the first base substrate 10. Therefore, the present application provides an optional implementation method of adding step 106 before step 102. Specifically, after the first base substrate 10 is provided in step 101, the second removable layer 21 is first prepared on the first side of the first base substrate 10 through step 106. Here, the preparation method of the second removable layer 21 can be selected to be inkjet printing, and the prepared second removable layer 21 includes a second hollow portion 22 corresponding to the first hollow portion 12 in the first removable layer 11 to be prepared later, and along the direction perpendicular to the plane where the first base substrate 10 is located, the first hollow portion 12 and the second hollow portion 22 at least partially overlap, so that the second hollow portion 22 and the first hollow portion 12 prepared later are in a through state. The second hollow portion 22 penetrates the second removable layer 21 along a direction perpendicular to the plane where the first base substrate 10 is located, so that the through first hollow portion 12 and the second hollow portion 22 can expose the first side of the first base substrate 10 .

[0107] It should also be added that the present application provides an optional implementation method in which the orthographic projections of the second erasable layer 21 prepared by step 106 and the first erasable layer 11 prepared by step 102 on the plane where the first base substrate 10 is located completely overlap, and the orthographic projections of the second hollow portion 22 located in the second erasable layer 21 and the first hollow portion 12 located in the first erasable layer 11 on the plane where the first base substrate 10 is located also completely overlap, so that the first conductive layer 13 subsequently prepared by step 104 can be partially directly fallen into the through-connected first hollow portion 12 and second hollow portion 22 to form the production of the first conductive layer 13 of the required style.

[0108] It should also be added that the present application provides an optional implementation scheme in which the properties of the selected preparation material of the second erasable layer 21 can be between the first base substrate 10 made of organic material and the first erasable layer 11 made of inorganic material, so that the adhesion between the second erasable layer 21 and the first base substrate 10, and the adhesion between the second erasable layer 21 and the first erasable layer 11 are both higher than the adhesion between the first base substrate 10 and the first erasable layer 11, thereby improving the contact stability between the three film layer structures of the first base substrate 10, the second erasable layer 21, and the first erasable layer 11.

[0109] It should also be added that, while executing step 103 to cure the first erasable layer 11, the second erasable layer 21 can also be cured at the same time. In addition, the second erasable layer 21 can be cured before executing step 102. This application does not specifically limit this. In addition, since the time difference between the completion of the second erasable layer 21 and the preparation of the first conductive layer 13 is greater than the time difference between the completion of the first erasable layer 11 and the preparation of the first conductive layer 13, without affecting the manufacturing effect of the display panel 100 and when the second erasable layer 21 is not easily deformed, it is also possible to choose not to provide a special curing step for the second erasable layer 21, thereby simplifying the manufacturing process of the display panel 100 and improving the manufacturing efficiency of the display panel 100.

[0110] like Figure 5 , Figure 6 As shown, after performing step 105, using the first eliminating material to remove the first removable layer 11, the method further includes:

[0111] Step 107 , removing the second erasable layer 21 by using the first erasable material or the second erasable material.

[0112] Specifically, when the preparation process of the display panel 100 includes the preparation of the second erasable layer 21, the present application provides an optional implementation method, after executing step 105 to use the first erasable material to remove the first erasable layer 11, if the first erasable material can also remove the second erasable layer 21, step 107 can be further executed to continue to use the first erasable material to remove the second erasable layer 21; if the first erasable material cannot remove the second erasable layer 21, step 107 can be further executed to use the second erasable material that can remove the second erasable layer 21 to remove it.

[0113] That is, when the preparation process of the display panel 100 includes the preparation of the second eliminable layer 21, it is necessary to completely remove the first eliminable layer 11 and the second eliminable layer 21 located on the first side of the first base substrate 10 after the preparation of the first conductive layer 13 is completed, so as to obtain Figure 6 Finally, the structure shown only includes the first base substrate 10 and the first conductive layer 13 having a specific required pattern.

[0114] It should be added that the present application does not specifically limit the preparation material of the second erasable layer 21 and the corresponding second erasable material, as long as the second erasable material can achieve the removal of the second erasable layer 21. In addition, the present application does not specifically limit the physical factors such as temperature, humidity, time, etc. required for the second erasable material to remove the second erasable layer 21, and the relevant selected materials and physical factors can be regulated according to needs, as long as the second erasable material can achieve the removal of the second erasable layer 21.

[0115] Figure 7 This is another flow chart of a method for preparing a display panel provided in an embodiment of the present application. It should be noted that the first insulating layer, the third eliminating layer, the third hollow portion, and the second conductive layer are not drawn in the drawings of the present application. For the third eliminating layer, the third hollow portion, and the second conductive layer, please refer to Figure 3 , Figure 4 The first eliminating layer 11, the first hollow portion 12, the first conductive layer 13, and the first insulating layer shown in the figure are insulating layers conventionally used by those skilled in the art and are not specifically described here.

[0116] Therefore, please combine Figure 2-Figure 4 Reference Figure 7 In an exemplary embodiment, the method for manufacturing the display panel 100 provided in the present application may further include steps 108 to 112 in addition to the above steps 101 to 105. Among them:

[0117] After performing step 105, using the first erasable material to remove the first erasable layer 11, the method further includes:

[0118] Step 108, preparing a first insulating layer on a side of the first conductive layer 13 away from the first substrate 10; wherein the first insulating layer covers the first conductive layer 13;

[0119] Step 109, inkjet printing a third removable layer on a surface of the first insulating layer away from the first base substrate 10; wherein the third removable layer includes at least one third hollow portion, and the third hollow portion penetrates the third removable layer in a direction perpendicular to the plane where the first base substrate 10 is located;

[0120] Step 110, curing the third removable layer;

[0121] Step 111, preparing a second conductive layer on a side of the third removable layer away from the first base substrate 10; wherein at least a portion of the second conductive layer is located in the third hollow portion; and in a direction perpendicular to the plane where the first base substrate 10 is located, the thickness of the third removable layer is greater than the thickness of the second conductive layer;

[0122] Step 112, using a third erasable material to remove the third erasable layer.

[0123] Specifically, the present application also provides a method for preparing a display panel 100, including steps 101 to 105, and steps 108 to 112. After step 105 is completed, step 108 is further performed to further prepare a first insulating layer on the side of the first conductive layer 13 away from the first base substrate 10, and the prepared first insulating layer is made to completely cover or encapsulate each sub-electrode in the first conductive layer 13, that is, the first insulating layer is made to cover each sub-electrode in the first conductive layer 13 on the orthographic projection of the plane where the first base substrate 10 is located, and the first conductive layer 13 and the back are connected by the first insulating layer. The conductive material prepared in succession is isolated to avoid crosstalk between electrical signals; then step 109 can be further performed to prepare a third removable layer by inkjet printing on the side surface of the first insulating layer away from the first base substrate 10. It should be noted that the third removable layer prepared in the present application is not a full-surface type. The third removable layer includes one or more third hollow parts. In the direction perpendicular to the plane where the first base substrate 10 is located, these third hollow parts all penetrate the third removable layer, so as to expose the side surface of the first insulating layer away from the first base substrate 10 in the third removable layer through the third hollow part. That is, the present application prepares a third removable layer including a plurality of third hollow parts, so as to use the third removable layer including a plurality of third hollow parts as a mold, so as to facilitate the preparation of other film layer structures required for the display panel 100 in the third hollow part in the subsequent process. After step 109, step 110 can be further performed to solidify the third removable layer to improve the stability of the third removable layer, which is conducive to ensuring that the shape of the film layer structure prepared in the third hollow part is the same as the preset shape.

[0124] After the third removable layer is solidified, step 111 can be further performed to prepare a second conductive layer on a side of the third removable layer away from the first base substrate 10. Since the third removable layer includes a plurality of third hollow portions extending through its thickness, the preparation material of the second conductive layer will partially enter the third hollow portions and partially be located on the surface of the third removable layer on a side away from the first base substrate 10. The present application further provides an optional implementation method, in which the thickness of the second conductive layer prepared by step 111 is smaller than the thickness of the third removable layer prepared by step 109, specifically, in the direction perpendicular to the plane where the first base substrate 10 is located, the thickness of the third removable layer is greater than the thickness of the second conductive layer, that is, since the third removable layer and the second conductive layer located in the third hollow portion are in contact with the side surface of the first insulating layer away from the first base substrate 10, the height of the third hollow portion will be greater than the thickness of the second conductive layer prepared therein, so that within the range between the side surface of the second conductive layer located in the third hollow portion away from the first base substrate 10 and the side surface of the third removable layer away from the first base substrate 10, the side surface of the third removable layer intersecting with the plane where the first base substrate 10 is located is not covered by the preparation material of the second conductive layer. In addition, making the thickness of the second conductive layer smaller is also conducive to making the overall film thickness of the display panel 100 smaller, which is conducive to the thinning design trend of the display panel 100 and its corresponding display device.

[0125] After step 111 is performed, step 112 may be further performed, in which the third erasable layer is cleaned by using a third erasable material capable of removing the third erasable layer. Since the thickness of the second conductive layer produced in step 111 is smaller than that of the third erasable layer, a part of the side wall of the third erasable layer facing the third hollow portion is not covered by the second conductive layer. Therefore, the third erasable layer can be removed by contacting the third erasable material with the side wall of the third erasable layer facing the third hollow portion. Since the third erasable layer is removed, the preparation material of part of the third conductive layer located on the side of the third erasable layer away from the first base substrate 10 will also fall off, so that after the third erasable layer is removed by step 112, only the second conductive layer located on the side of the first insulating layer away from the first base substrate 10 and in the area where the third hollow portion was originally located is retained. Since the orthographic projection shape of the original third hollow portion on the plane where the first base substrate 10 is located is the same as the orthographic projection shape of the sub-electrode in the second conductive layer after the required preparation on the plane where the first base substrate 10 is located, that is, the third eliminable layer with the third hollow portion is equivalent to a mold for making the second conductive layer. Therefore, by executing the above steps 101-105 and 108-112, the required module structure can be obtained, and the module structure includes the first base substrate 10, the first conductive layer 13, the first insulating layer, and the second conductive layer which are stacked in sequence.

[0126] It should be supplemented that the first conductive layer 13 and the second conductive layer isolated by the first insulating layer manufactured in the present application can be used as a touch module in a display device to realize the touch function of the touch module.

[0127] It should also be added that the present application does not make any specific limitation on the shape of the third hollow portion. The shape of the orthographic projection of the third hollow portion on the plane where the first base substrate 10 is located can be selected according to the shape of the film layer structure to be prepared in the third hollow portion in the subsequent process. For example, the shape of the orthographic projection of the third hollow portion on the plane where the first base substrate 10 is located can be selected as a long rectangle, a diamond, a square, etc., as long as the shape of the third hollow portion can meet the shape requirements of the film layer structure subsequently prepared in the third hollow portion.

[0128] It should also be added that when the display panel 100 includes the first conductive layer 13 and the second conductive layer at the same time, the first conductive layer 13 and the second conductive layer can be selected to have the same specifications or different specifications, and the present application does not make specific restrictions on this. For example, the first conductive layer 13 can be composed of a plurality of strip-shaped sub-electrodes, and in this case, the second conductive layer corresponding to it can include a plurality of strip-shaped sub-electrodes, or a plurality of block-shaped sub-electrodes, or a plurality of comb-shaped sub-electrodes, etc.; in addition, the orthographic projection of the sub-electrode in the first conductive layer 13 on the plane where the first base substrate 10 is located can be set to have a certain overlapping area with the orthographic projection of the sub-electrode in the corresponding second conductive layer on the plane where the first base substrate 10 is located, or it can be selected to have no overlapping area with the orthographic projection of the sub-electrode in the corresponding second conductive layer on the plane where the first base substrate 10 is located; the present application does not make specific restrictions on this, and the pattern of the first conductive layer 13 can be made according to the requirements, and the pattern of the second conductive layer can be made according to the requirements, as long as the functions required by the design can be achieved.

[0129] It should also be added that the present application does not make any specific restrictions on the preparation material of the third erasable layer and the corresponding third elimination material, as long as the third elimination material can achieve the removal of the third erasable layer. In addition, the present application does not make any specific restrictions on the physical factors such as temperature, humidity, time, etc. required for the third elimination material to remove the third erasable layer. The relevant selected materials and physical factors can be regulated according to needs, as long as the third elimination material can achieve the removal of the third erasable layer. Among them, the third elimination material can be the same as the first elimination material or the second elimination material, as long as the removal of the third erasable layer can be achieved. Similarly, the preparation material of the third erasable layer and the preparation material of the first erasable layer 11 can be selected from the same material, but the present application is not limited to this.

[0130] Figure 8 Flow chart of another method for preparing a display panel provided in an embodiment of the present application. It should be noted that the first protective layer, the fourth elimination layer, the fourth hollow portion and the third conductive layer are not drawn in the drawings of the present application. For the fourth elimination layer, the fourth hollow portion and the third conductive layer, please refer to Figure 3 , Figure 4 The first elimination layer 11, the first hollow portion 12, the first conductive layer 13, and the first protective layer are protective film layers conventionally used by those skilled in the art, and are not specifically described here.

[0131] Therefore, please combine Figure 2-Figure 4 Reference Figure 8 In an exemplary embodiment, the method for manufacturing the display panel 100 provided in the present application may further include steps 113 to 117 in addition to the above-mentioned steps 101 to 105. Among them:

[0132] After performing step 105, using the first erasable material to remove the first erasable layer 11, the method further includes:

[0133] Step 113, preparing a first protective layer on a side of the first conductive layer 13 away from the first base substrate 10;

[0134] Step 114, inkjet printing a fourth erasable layer on a surface of the first base substrate 10 away from the first conductive layer 13; wherein the fourth erasable layer includes at least one fourth hollow portion, and the fourth hollow portion penetrates the fourth erasable layer in a direction perpendicular to the plane where the first base substrate 10 is located;

[0135] Step 115, curing the fourth removable layer;

[0136] Step 116, preparing a third conductive layer on a side of the fourth erasable layer away from the first base substrate 10; wherein at least a portion of the third conductive layer is located in the fourth hollow portion; and in a direction perpendicular to the plane where the first base substrate 10 is located, the thickness of the fourth erasable layer is greater than the thickness of the third conductive layer;

[0137] Step 117, using a fourth erasable material to remove the fourth erasable layer.

[0138] Specifically, the present application also provides a method for preparing a display panel 100, including steps 101 to 105, and steps 113 to 117. After step 105 is completed, step 113 is further performed to further prepare a first protective layer on the side of the first conductive layer 13 away from the first base substrate 10, and the prepared first protective layer is capable of completely covering each sub-electrode in the first conductive layer 13, that is, the first protective layer is made to cover or encapsulate each sub-electrode in the first conductive layer 13 on the orthographic projection of the plane where the first base substrate 10 is located, and the first protective layer is used to protect at least the surface of the first conductive layer 13 away from the first base substrate 10, so as to avoid the subsequent process from damaging the first conductive layer 13. The first conductive layer 13 is scratched or damaged; the module structure of the first base substrate 10, the first conductive layer 13, and the first protective layer is then turned over, and step 114 is further performed to prepare a fourth erasable layer by inkjet printing on the surface of the first base substrate 10 on the side away from the first conductive layer 13. It should be noted that the fourth erasable layer prepared in the present application is not a full-surface type. The fourth erasable layer includes one or more fourth hollow parts. In the direction perpendicular to the plane where the first base substrate 10 is located, these fourth hollow parts all penetrate the fourth erasable layer, so as to expose the surface of the first base substrate 10 on the side away from the first conductive layer 13 in the fourth erasable layer through the fourth hollow parts. That is, the present application prepares a fourth erasable layer including a plurality of fourth hollow parts, so as to use the fourth erasable layer including a plurality of fourth hollow parts as a mold, so as to facilitate the preparation of other film layer structures required for the display panel 100 in the fourth hollow parts in the subsequent process. After step 114 , step 115 may be further performed to solidify the fourth removable layer to improve the stability of the fourth removable layer, which is beneficial to ensure that the shape of the film layer structure subsequently prepared in the fourth hollow portion is the same as the preset shape.

[0139] After the fourth removable layer is solidified, step 116 can be further performed to prepare a third conductive layer on the side of the fourth removable layer away from the first base substrate 10. Since the fourth removable layer includes a plurality of fourth hollow portions extending through its thickness, the preparation material of the third conductive layer will partially enter the fourth hollow portions and partially be located on the surface of the fourth removable layer on the side away from the first base substrate 10. The present application further provides an optional implementation method, in which the thickness of the third conductive layer prepared by step 116 is smaller than the thickness of the fourth removable layer prepared by step 114, specifically, in the direction perpendicular to the plane where the first base substrate 10 is located, the thickness of the fourth removable layer is greater than the thickness of the third conductive layer, that is, since the fourth removable layer and the third conductive layer located in the fourth hollow portion are in contact with the side surface of the first base substrate 10 away from the first conductive layer 13, the height of the fourth hollow portion will be greater than the thickness of the third conductive layer prepared therein, so that the side surface of the third conductive layer located in the fourth hollow portion away from the first base substrate 10 and the side surface of the fourth removable layer away from the first base substrate 10 are within the range between the side surface of the fourth removable layer away from the first base substrate 10, and the side surface of the fourth removable layer away from the first base substrate 10, the side surface of the fourth removable layer intersecting with the plane where the first base substrate 10 is located is not covered by the preparation material of the third conductive layer. In addition, making the thickness of the third conductive layer smaller is also conducive to making the overall film thickness of the display panel 100 smaller, which is conducive to the thinning design trend of the display panel 100 and its corresponding display device.

[0140] After step 116 is performed, step 117 can be further performed to clean the fourth erasable layer using a fourth erasable material that can remove the fourth erasable layer. Since the thickness of the third conductive layer produced in step 116 is smaller than that of the fourth erasable layer, a portion of the side wall of the fourth erasable layer facing the fourth hollow portion is not covered by the third conductive layer. Therefore, the fourth erasable layer can be removed by contacting the fourth erasable material with the side wall of the fourth erasable layer facing the fourth hollow portion. Since the fourth erasable layer is removed, the preparation material of part of the third conductive layer located on the side of the fourth erasable layer away from the first base substrate 10 will also fall off, so that after the fourth erasable layer is removed by step 117, only the third conductive layer located on the side of the first base substrate 10 away from the first conductive layer 13 and in the area where the fourth hollow portion was originally located is retained. Since the orthographic projection shape of the original fourth hollow portion on the plane where the first base substrate 10 is located is the same as the orthographic projection shape of the neutron electrode in the third conductive layer after the required preparation is completed on the plane where the first base substrate 10 is located, that is, the fourth eliminable layer with the fourth hollow portion is equivalent to a mold for making the third conductive layer. Therefore, by executing the above steps 101-105 and steps 113-117, the required module structure can be obtained, and the module structure includes a first protective layer, a first conductive layer 13, a first base substrate 10, and a third conductive layer stacked in sequence.

[0141] It should be added that the first conductive layer 13 and the third conductive layer isolated by the first base substrate 10 manufactured in the present application can be used as a touch module in a display device to realize the touch function of the touch module. In addition, in the subsequent use of the module, if the first protective layer is not needed, the first protective layer can also be removed.

[0142] It should also be added that the present application does not make any specific limitation on the shape of the fourth hollow portion. The shape of the orthographic projection of the fourth hollow portion on the plane where the first base substrate 10 is located can be selected according to the shape of the film layer structure to be prepared in the fourth hollow portion in the subsequent process. For example, the shape of the orthographic projection of the fourth hollow portion on the plane where the first base substrate 10 is located can be selected as a long rectangle, a diamond, a square, etc., as long as the shape of the fourth hollow portion can meet the shape requirements of the film layer structure subsequently prepared in the fourth hollow portion.

[0143] It should also be added that when the display panel 100 includes both the first conductive layer 13 and the third conductive layer, the first conductive layer 13 and the third conductive layer can be selected to have the same specifications or different specifications, and this application does not make any specific limitation on this.

[0144] It should also be added that the present application does not make any specific restrictions on the preparation material of the fourth erasable layer and the corresponding fourth elimination material, as long as the fourth elimination material can achieve the removal of the fourth erasable layer. In addition, the present application does not make any specific restrictions on the physical factors such as temperature, humidity, time, etc. required for the fourth elimination material to remove the fourth erasable layer. The relevant selected materials and physical factors can be regulated according to needs, as long as the fourth elimination material can achieve the removal of the fourth erasable layer. Among them, the fourth elimination material can be the same as the first elimination material or the second elimination material, as long as the fourth erasable layer can be removed. Similarly, the preparation material of the fourth erasable layer and the preparation material of the first erasable layer 11 can be selected from the same material, but the present application is not limited to this.

[0145] Please refer to Figure 1-Figure 4 In an exemplary embodiment, the method for manufacturing the display panel 100 provided in the present application may further include steps 118 to 122 in addition to the above steps 101 to 105. Among them:

[0146] After performing step 105, using the first erasable material to remove the first erasable layer 11, the method further includes:

[0147] Step 118, providing a second base substrate; wherein the second base substrate is located on a side of the first conductive layer 13 away from the first base substrate 10;

[0148] Step 119, inkjet printing a fifth removable layer on the first side of the second base substrate; wherein the fifth removable layer includes at least one fifth hollow portion, and the fifth hollow portion penetrates the fifth removable layer in a direction perpendicular to the plane where the second base substrate is located;

[0149] Step 120, curing the fifth removable layer;

[0150] Step 121, preparing a fourth conductive layer on a side of the fifth removable layer away from the second substrate; wherein at least a portion of the fourth conductive layer is located in the fifth hollow portion; and in a direction perpendicular to the plane where the second substrate is located, the thickness of the fifth removable layer is greater than the thickness of the fourth conductive layer;

[0151] Step 122, removing the fifth removable layer using a fifth removable material.

[0152] Specifically, steps 118 to 122 provided here are equivalent to the repetition of steps 101 to 105, and the second base substrate, the fifth removable layer, the fifth hollow portion, the fourth conductive layer, and the fifth removable material in steps 118 to 122 are equivalent to the first base substrate 10, the first removable layer 11, the first hollow portion 12, the first conductive layer 13, and the first removable material in steps 101 to 105. The second base substrate, the fifth removable layer, the fifth hollow portion, the fourth conductive layer, the fifth removable material, the first base substrate 10, the first removable layer 11, the first hollow portion 12, the first conductive layer 13, and the first removable material can be selected to have the same manufacturing materials and manufacturing specifications according to design requirements, and can also be at least partially differentiated according to requirements.

[0153] The module structure obtained by executing steps 101 to 105 and steps 118 to 122 may include a first base substrate 10, a first conductive layer 13, a second base substrate, and a fourth conductive layer which are stacked in sequence.

[0154] It should be supplemented that the first conductive layer 13 and the fourth conductive layer isolated by the second base substrate manufactured in the present application can be used as a touch module in a display device to realize the touch function of the touch module.

[0155] For the preparation of the rest of the second base substrate, the fifth eliminable layer, the fifth hollow portion, the fourth conductive layer, and the fifth eliminable material, reference can be made to the above-mentioned preparation process and corresponding embodiment selections regarding the first base substrate 10, the first eliminable layer 11, the first hollow portion 12, the first conductive layer 13, and the first eliminable material, and no further details will be given here.

[0156] It should also be added that when the first base substrate 10 and the first conductive layer 13, the second base substrate and the fourth conductive layer are used for a display module, they can be prepared separately and then modularized in combination with a liquid crystal box. The first base substrate 10 and the first conductive layer 13, the second base substrate and the fourth conductive layer are respectively arranged on both sides of the liquid crystal box to form a module structure in which the first base substrate 10, the first conductive layer 13, the liquid crystal box, the fourth conductive layer, and the second base substrate are stacked in sequence.

[0157] Please continue to refer to Figure 1-Figure 4 In an exemplary embodiment, in the method for preparing the display panel 100 provided in the present application, the above-mentioned step 102, inkjet printing the first removable layer 11 on the first side of the first base substrate 10, can be specifically performed as follows: inkjet printing the first water-based, oil-soluble, or solvent-based first removable layer 11 on the first side of the first base substrate 10; wherein the manufacturing material of the first removable layer 11 is a base resin, and the base resin includes at least one of amino acid, acrylic acid, and polyurethane.

[0158] Specifically, for the above step 102, the first removable layer 11 is inkjet printed on the first side of the first base substrate 10. The present application provides an optional implementation method, in which the specific execution content of this step is: printing the first water-based removable layer 11 on the first side of the first base substrate 10 by inkjet printing, or printing the first oil-soluble removable layer 11 on the first side of the first base substrate 10 by inkjet printing, or printing the first solvent-based removable layer 11 on the first side of the first base substrate 10 by inkjet printing; that is, the present application provides at least three materials that can be used to prepare the first removable layer 11, and these three materials are respectively water-based materials that can be washed away by water, oil-soluble materials that can be dissolved by oil, and solvent-based materials that can be dissolved by specific solvents. The present application does not specifically limit the type of material selected for the preparation of the first removable layer 11, and it can be selected according to needs. For example, the first removable layer 11 can be made of a base resin material, which includes at least one of amino acid, acrylic acid, and polyurethane. That is, the base resin can be any one of amino acid, acrylic acid, and polyurethane, or a combination of any two, or a combination of the three; but it is not limited to these three. Of course, other materials that can be removed by a specific material can also be selected to make the first removable layer 11.

[0159] Please continue to refer to Figure 1-Figure 4 In an exemplary embodiment, in the method for preparing the display panel 100 provided in the present application, the above-mentioned step 102, inkjet printing the first removable layer 11 on the first side of the first base substrate 10, can be specifically performed as follows: on the first side of the first base substrate 10, in a direction perpendicular to the plane where the first base substrate 10 is located, inkjet printing the first removable layer 11 with a thickness of D1, 20μm≤D1≤200μm.

[0160] Specifically, the present application also provides an optional implementation method that the preparation thickness D1 of the first removable layer 11 can be between 20μm and 200μm in the direction perpendicular to the plane where the first base substrate 10 is located. For example, the first removable layer 11 can be prepared with a thickness of 20μm, 50μm, 120μm, 160μm, 200μm, etc. within this value range. If the preparation thickness of the first removable layer 11 is less than 20μm, a higher preparation process is required, which will inevitably increase the production cost of the display panel; if the preparation thickness is greater than 200μm, the film thickness of the entire display panel will be too large, which is not conducive to the thin design trend of the related display device; therefore, the preparation thickness D1 of the first removable layer 11 is set between 20μm and 200μm, which can not only save the production cost of the display panel, but also avoid causing the module thickness of the related display device to be too large. Of course, this is only a range of values ​​for the thickness of the first removable layer 11 provided in the present application, but the present application is not limited thereto, and the thickness of the first removable layer 11 can also be selected according to needs.

[0161] Please continue to refer to Figure 1-Figure 4 In an exemplary embodiment, in the method for preparing the display panel 100 provided in the present application, the above step 104, preparing the first conductive layer 13 on the side of the first removable layer 11 away from the first base substrate 10, can be specifically performed as follows: preparing a first indium tin oxide film on the side of the first removable layer 11 away from the first base substrate 10; or,

[0162] A first silver nanowire film is prepared on a side of the first removable layer 11 away from the first substrate 10; or,

[0163] A first metal mesh film is prepared on a side of the first removable layer 11 away from the first base substrate 10 .

[0164] Specifically, for the above step 104, the first conductive layer 13 is prepared on the side of the first removable layer 11 away from the first base substrate 10. The present application provides an optional implementation method, in which the specific execution content of this step is: preparing a first ITO (Indium-Tin-Oxide) on the side of the first removable layer 11 away from the first base substrate 10, or preparing a first SNW (Silver Nanowire) on the side of the first removable layer 11 away from the first base substrate 10, or preparing a first MM (Metal Mesh) on the side of the first removable layer 11 away from the first base substrate 10. That is, the present application provides three optional types of the first conductive layer 13, namely ITO, SNW, and MM, but the present application is not limited to this, and the specific preparation type of the first conductive layer 13 can also be selected according to the needs. At the same time, the shape, size and other preparation specifications of the first hollow portion 12 in the first removable layer 11 are selected according to the required type of the first conductive layer 13.

[0165] Please continue to refer to Figure 1-Figure 4 In an exemplary embodiment, in the method for preparing the display panel 100 provided in the present application, the above-mentioned step 104, preparing the first conductive layer 13 on the side of the first removable layer 11 away from the first base substrate 10, can be specifically performed as follows: sputtering the first conductive layer 13 on the side of the first removable layer 11 away from the first base substrate 10.

[0166] Specifically, for the above-mentioned step 104, a first conductive layer 13 is prepared on the side of the first removable layer 11 away from the first base substrate 10. The present application provides an optional implementation method, and the specific execution content of this step is: the first conductive layer 13 is prepared by sputtering on the side of the first removable layer 11 away from the first base substrate 10. The first conductive layer 13 prepared by sputtering has good controllability of film thickness and good adhesion effect with the first base substrate 10, which is beneficial to improving the yield of the display panel 100 prepared by the preparation method of the display panel 100 provided in the present application, and is beneficial to improving the service life of the related display device.

[0167] Please continue to refer to Figure 1-Figure 4In an exemplary embodiment, in the method for preparing the display panel 100 provided in the present application, the above step 102, inkjet printing the first erasable layer 11 on the first side of the first base substrate 10, can be specifically performed as follows: inkjet printing the first erasable layer 11 including a plurality of first erasable units on the first side of the first base substrate 10; wherein, along a direction parallel to the plane where the first base substrate 10 is located, at least one group of adjacently arranged first erasable units includes a first hollow portion 12 between them. Further, inkjet printing the first erasable layer 11 including a plurality of first erasable units on the first side of the first base substrate 10 can be selectively performed as follows: inkjet printing the first erasable layer 11 including a plurality of first erasable units with a printing precision of P1 on the first side of the first base substrate 10, 5nm≤P1≤200nm; wherein the printing precision P1 is the printing precision of the printing height and printing width of the first erasable units.

[0168] Specifically, Figure 4As shown, the first erasable units are located on the left and right sides of the first hollow portion 12; based on this, for the above-mentioned step 102, the first erasable layer 11 is inkjet printed on the first side of the first base substrate 10. The present application provides an optional implementation method, and the specific execution content of this step is: prepare a first erasable layer 11 including a plurality of first erasable units by inkjet printing on the first side of the first base substrate 10, that is, along the direction of the plane where the first base substrate 10 is located, the first erasable layer 11 includes first erasable units and first hollow portions 12 that are alternately arranged in sequence, or it can be said that some of the first erasable units are arranged at least partially around the first hollow portion 12. On this basis, the present application also provides an optional implementation method, in which the line height and line spacing of the first erasable unit (for example, the erasable line of inkjet printing) can be selected to have a value range of 5nm~200nm accuracy, for example, 5nm accuracy, 40nm accuracy, 90nm accuracy, 160nm accuracy, 200nm accuracy, etc. can be selected. If the printing accuracy of the line height and line spacing of the first erasable unit is less than 5nm, inkjet printing technology with higher printing accuracy is required, which will inevitably increase the production cost of the display panel; if the printing accuracy is greater than 200nm, it may cause the printing width and height of the first erasable unit to be too large, or the fineness of the printed pattern is difficult to control, which is not conducive to improving the refinement of the conductive lines prepared subsequently, which will affect the user experience of the corresponding display device, and may also increase the time to remove the first erasable layer and reduce the preparation efficiency of the display panel; therefore, the line height and line spacing of inkjet printing are selected with an accuracy of 5nm~200nm, which can improve the preparation efficiency and accuracy of the display panel at a lower production cost, and improve the use effect of the corresponding display device. Of course, this is only a selectable range of values ​​for the preparation accuracy of the first erasable unit provided by the present application, but the present application is not limited thereto, and the preparation accuracy of the first erasable unit can also be selected according to needs. It should also be added that the present application does not limit the shape of the orthographic projection of the first erasable unit on the plane where the first substrate 10 is located.

[0169] Please continue to refer to Figure 1-Figure 4 In an exemplary embodiment, in the method for preparing the display panel 100 provided in the present application, the above-mentioned step 102, inkjet printing the first removable layer 11 on the first side of the first base substrate 10, can be specifically performed as follows: on the first side of the first base substrate 10, inkjet printing the first removable layer 11 using a first nozzle with an inkjet printing accuracy of P2, 90%×(1440*720 / inch)≤P2≤110%×(1440*720 / inch).

[0170] Specifically, for the above step 102, the first removable layer 11 is inkjet printed on the first side of the first base substrate 10. The present application provides an optional implementation method, in which the specific execution content of this step is: the first removable layer 11 is inkjet printed using a first nozzle on the first side of the first base substrate 10. A first nozzle with an inkjet printing accuracy of 1440*720 / inch can be selected to improve the printing accuracy of the first removable layer 11, thereby facilitating the improvement of the accuracy of the first conductive layer 13 produced by the preparation method of the display panel 100 provided by the present application. Among them, the above accuracy 1440*720 / inch is converted into a line width and line length of 18nm*35nm. Of course, a first nozzle with an inkjet printing accuracy within the value range of 90%×(1440*720 / inch) to 110%×(1440*720 / inch) can also be selected, as long as the printing accuracy of the first removable layer 11 can be guaranteed. This is only a range of values ​​of inkjet printing accuracy that can be selected for the first nozzle provided by the present application, but the present application is not limited thereto.

[0171] Please continue to refer to Figure 1-Figure 4 In an exemplary embodiment, the method for manufacturing the display panel 100 provided in the present application may further include step 123 in addition to the above steps 101 to 105. Among them:

[0172] Before performing step 104, forming the first conductive layer 13 on the side of the first removable layer 11 away from the first base substrate 10, the method further includes:

[0173] Step 123, prepare a first primer layer on the side of the first removable layer 11 away from the first base substrate 10; wherein the preparation material of the first primer layer includes a silicon-based material. Further, the first primer layer is prepared on the side of the first removable layer 11 away from the first base substrate 10, which can be selectively performed as follows: on the side of the first removable layer 11 away from the first base substrate 10, in a direction perpendicular to the plane where the first base substrate 10 is located, prepare a first primer layer with a thickness of D2, 5nm≤D2≤100nm.

[0174] Specifically, the present application also provides a method for preparing a display panel 100. In addition to steps 101 to 105, step 123 may be further added before step 104. A first bottom layer corresponding to the first conductive layer 13 is prepared on the side of the first removable layer 11 away from the first base substrate 10. The first bottom layer partially falls into the first hollow portion 12 before the first conductive layer 13 is prepared. The preparation material of the first bottom layer may be a silicon-based material. The silicon-based material is a low-refractive-index material, which can reduce the reflectivity difference between the sputtering area of ​​the first conductive layer 13 and the first base substrate 10, thereby reducing the visibility of the module pattern of the subsequently sputtered first conductive layer 13 under visible light, which is beneficial to improving the display uniformity of the display panel 100. The preparation thickness of the first bottom layer is set between 5nm and 100nm, which can avoid the problem of increased process costs due to too small preparation thickness, and can also avoid too large preparation thickness, which is not conducive to the thinning design trend of the display panel. Of course, this is just a selectable value range for the preparation thickness of the first bottom layer provided in the present application, but the present application is not limited thereto.

[0175] Please continue to refer to Figure 1-Figure 4 In an exemplary embodiment, in the method for preparing the display panel 100 provided in the present application, the above-mentioned step 104, preparing the first conductive layer 13 on the side of the first removable layer 11 away from the first base substrate 10, can be specifically performed as follows: on the side of the first removable layer 11 away from the first base substrate 10, in a direction perpendicular to the plane where the first base substrate 10 is located, preparing the first conductive layer 13 with a thickness of D3, 5μm≤D3≤200μm.

[0176] Specifically, for the above step 104, the first conductive layer 13 is prepared on the side of the first removable layer 11 away from the first base substrate 10. The present application provides an optional implementation method, and the specific execution content of this step is: on the side of the first removable layer 11 away from the first base substrate 10, along the direction perpendicular to the plane where the first base substrate 10 is located, prepare the first conductive layer 13 with a thickness range of 5μm-200μm, so as to avoid the problem of increased process cost due to too small preparation thickness of the first conductive layer 13, and also avoid the problem of too large preparation thickness, which is not conducive to the thinning design trend of the display panel. Of course, this is only a selectable value range of the preparation thickness of the first conductive layer 13 provided by the present application, but the present application is not limited to this.

[0177] Please continue to refer to Figure 1-Figure 4 In an exemplary embodiment, the method for manufacturing the display panel 100 provided in the present application may further include step 124 in addition to the above-mentioned steps 101 to 105. Among them:

[0178] Before performing step 104, forming the first conductive layer 13 on the side of the first removable layer 11 away from the first base substrate 10, the method further includes:

[0179] Step 124 , on the side of the first erasable layer 11 away from the first base substrate 10 , in a direction perpendicular to the plane where the first base substrate 10 is located, prepare an erasable layer with a thickness of D4, 20 μm≤D4≤200 μm.

[0180] Specifically, the present application also provides a method for preparing a display panel 100. In addition to steps 101 to 105, step 124 may be further added before step 104. A corresponding index matching layer (index matching layer) is prepared for the first conductive layer 13 on the side of the first erasable layer 11 away from the first base substrate 10. The IM (index matching) layer can improve the visual brightness, eliminate the pattern background corresponding to the first conductive layer 13, and achieve a display uniformity effect of the corresponding display device. The present application provides an optional implementation method of preparing an index matching layer with a thickness range of 20μm-200μm, which avoids the problem of increased process costs due to the preparation thickness of the index matching layer being too small, and can also avoid the preparation thickness being too large, which is not conducive to the thinning design trend of the display panel. Of course, this is only a selectable range of values ​​for the preparation thickness of the index matching layer provided in the present application, but the present application is not limited to this.

[0181] In addition, it should be added that before preparing the first conductive layer 13 in step 104 , both the IM layer and the first primer layer can be manufactured, so as to further improve the display uniformity effect of the corresponding display device.

[0182] It should be understood that, although the steps in the flowchart of the accompanying drawings are displayed in sequence as indicated by the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a portion of the steps in the accompanying drawings may include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a portion of the steps or stages in other steps.

[0183] Based on the same inventive concept, the present application also provides a display panel 100, which is manufactured by any of the above-mentioned methods for manufacturing the display panel 100 provided in the present application. The display panel 100 in the embodiment of the present application may include a display panel 100 with a display function and / or a touch function. The film layer structure included in the display panel 100 includes at least the above-mentioned first base substrate and the first conductive layer, or at least the above-mentioned first base substrate, the first conductive layer, the first insulating layer, and the second conductive layer, or at least the above-mentioned first protective layer, the first conductive layer, the first base substrate, and the third conductive layer, or at least the above-mentioned first base substrate, the first conductive layer, the second base substrate, the fourth conductive layer, and the like.

[0184] Fig. 9 A schematic plan view of a display device provided in an embodiment of the present application, Fig.10 Provided in the embodiments of this application Fig. 9 A cross-sectional diagram of CC', Fig.11 Provided in the embodiments of this application Fig. 9 Another cross-sectional diagram of CC', please refer to Figure 1-Figure 8 Reference Figure 9-11 Based on the same inventive concept, the present application also provides a display device 300, which includes any of the above-mentioned display panels 100 provided in the present application. The display device 300 provided in the embodiment of the present invention may be an all-in-one machine, a tablet, a computer, a mobile phone, a television, an electronic paper, a digital photo frame, a wearable device, a vehicle-mounted display device 300 or other display devices 300 with display functions, and the present invention does not impose specific restrictions on this. The display device 300 provided in the embodiment of the present invention has the beneficial effects involved in the preparation method related to the display panel 100 provided in the embodiment of the present invention. For details, please refer to the specific description of the preparation method related to the display panel 100 in the above-mentioned embodiments, which will not be repeated in this embodiment.

[0185] See attached Fig.10 The display device 300 in one embodiment of the present application includes a display panel 100 and a cover plate 200. The cover plate 200 is used to protect the display panel 100 from external impact and to obtain a positive display of the product. Specifically, the display panel 100 is attached to the inner side of the cover plate 200 through a bonding adhesive layer 30. For example, the bonding adhesive layer 30 can be an OCA optical adhesive layer; Fig.10In the illustrated embodiment, OCA30 is located between the conductive film group and the cover plate 200. The conductive film group includes a first conductive film group 33 and a second conductive film group 34. Here, the first conductive film group 33 and the second conductive film group 34 are, for example, the structural assembly of the first base substrate, the first conductive layer, the second base substrate, and the fourth conductive layer provided in the present application. The cover plate 200 needs to cover the front of the display panel 100 and have good light transmittance. For example, in some embodiments, the cover plate 200 may include at least one of sapphire glass and gorilla glass. In other embodiments, the cover plate 200 may also include one of polyethylene terephthalate, polycarbonate, polyethersulfone, polynaphthalate, and polynorbornene. In addition, as Fig.11 As shown, the present application also provides an optional implementation, in which OCA30 is located between the first conductive film group 33 and the cover plate 200, and between the first conductive film group 33 and the second conductive film group 34, where the first conductive film group 33 and the second conductive film group 34 are, for example, the first substrate and the first conductive layer provided in the present application.

[0186] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0187] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for preparing a display panel, characterized in that: include: providing a first substrate; Inkjet printing a first removable layer on a first side of the first base substrate; wherein the first removable layer comprises at least one first hollow portion, and the first hollow portion penetrates the first removable layer in a direction perpendicular to the plane where the first base substrate is located; curing the first removable layer; A first conductive layer is prepared on a side of the first erasable layer away from the first substrate; wherein at least a portion of the first conductive layer is located in the first hollow portion; and in a direction perpendicular to the plane where the first substrate is located, a thickness of the first erasable layer is greater than a thickness of the first conductive layer; The first removable layer is removed using a first removable material.

2. The method for preparing a display panel according to claim 1, characterized in that: Before inkjet printing the first removable layer on the first side of the first substrate, the method further comprises: A second removable layer is prepared on the first side of the first substrate; wherein the second removable layer includes at least one second hollow portion, and the second hollow portion penetrates the second removable layer in a direction perpendicular to the plane where the first substrate is located, and the first hollow portion and the second hollow portion at least partially overlap; After removing the first erasable layer by using the first erasable material, the method further comprises: The second erasable layer is removed using a first erasable material or a second erasable material.

3. The method for preparing a display panel according to claim 1, characterized in that: After removing the first erasable layer by using the first erasable material, the method further comprises: Preparing a first insulating layer on a side of the first conductive layer away from the first substrate; wherein the first insulating layer covers the first conductive layer; A third removable layer is inkjet printed on a surface of the first insulating layer away from the first base substrate; wherein the third removable layer comprises at least one third hollow portion, and the third hollow portion penetrates the third removable layer in a direction perpendicular to the plane where the first base substrate is located; curing the third removable layer; A second conductive layer is prepared on a side of the third erasable layer away from the first substrate; wherein at least a portion of the second conductive layer is located in the third hollow portion; and in a direction perpendicular to the plane where the first substrate is located, the thickness of the third erasable layer is greater than the thickness of the second conductive layer; The third removable layer is removed using a third removable material.

4. The method for preparing a display panel according to claim 1, characterized in that: After removing the first erasable layer by using the first erasable material, the method further comprises: Prepare a first protective layer on a side of the first conductive layer away from the first substrate; A fourth erasable layer is inkjet printed on a surface of the first substrate away from the first conductive layer; wherein the fourth erasable layer comprises at least one fourth hollow portion, and the fourth hollow portion penetrates the fourth erasable layer in a direction perpendicular to the plane where the first substrate is located; curing the fourth removable layer; A third conductive layer is prepared on a side of the fourth erasable layer away from the first substrate; wherein at least a portion of the third conductive layer is located in the fourth hollow portion; and in a direction perpendicular to the plane where the first substrate is located, the thickness of the fourth erasable layer is greater than the thickness of the third conductive layer; The fourth removable layer is removed using a fourth removable material.

5. The method for preparing a display panel according to claim 1, characterized in that: After removing the first erasable layer by using the first erasable material, the method further comprises: Providing a second substrate; wherein the second substrate is located on a side of the first conductive layer away from the first substrate; Inkjet printing a fifth removable layer on the first side of the second base substrate; wherein the fifth removable layer includes at least one fifth hollow portion, and the fifth hollow portion penetrates the fifth removable layer in a direction perpendicular to the plane where the second base substrate is located; curing the fifth removable layer; A fourth conductive layer is formed on a side of the fifth erasable layer away from the second substrate; wherein at least a portion of the fourth conductive layer is located in the fifth hollow portion; and in a direction perpendicular to the plane where the second substrate is located, the thickness of the fifth erasable layer is greater than the thickness of the fourth conductive layer; The fifth removable layer is removed using a fifth removable material.

6. The method for preparing a display panel according to claim 1, characterized in that: The inkjet printing of the first removable layer on the first side of the first substrate comprises: A first water-based, oil-soluble, or solvent-based removable layer is inkjet printed on the first side of the first substrate; wherein the first removable layer is made of a base resin, and the base resin includes at least one of amino acid, acrylic acid, and polyurethane.

7. The method for preparing a display panel according to claim 1, characterized in that: The inkjet printing of the first removable layer on the first side of the first substrate comprises: On the first side of the first substrate, a first removable layer with a thickness D1 is inkjet printed in a direction perpendicular to the plane where the first substrate is located, 20 μm≤D1≤200 μm.

8. The method for preparing a display panel according to claim 1, characterized in that: The step of preparing a first conductive layer on a side of the first removable layer away from the first substrate includes: preparing a first indium tin oxide film on a side of the first removable layer away from the first substrate; or, Preparing a first silver nanowire film on a side of the first removable layer away from the first substrate; or, A first metal mesh film is prepared on a side of the first removable layer away from the first substrate.

9. The method for preparing a display panel according to claim 1, characterized in that: The step of preparing a first conductive layer on a side of the first removable layer away from the first substrate includes: A first conductive layer is sputtered on a side of the first removable layer away from the first substrate.

10. The method for manufacturing a display panel according to claim 1, characterized in that: The inkjet printing of the first removable layer on the first side of the first substrate comprises: A first erasable layer including a plurality of first erasable units is inkjet printed on the first side of the first substrate; wherein, along a direction parallel to the plane where the first substrate is located, at least one group of adjacently arranged first erasable units includes a first hollow portion between them.

11. The method for preparing a display panel according to claim 10, characterized in that: The inkjet printing of a first removable layer including a plurality of first removable units on the first side of the first substrate comprises: A first erasable layer is inkjet printed on the first side of the first substrate, comprising a plurality of first erasable units with a printing precision of P1, 5nm≤P1≤200nm; wherein the printing precision P1 is the printing precision of the printing height and the printing width of the first erasable unit.

12. The method for manufacturing a display panel according to claim 1, characterized in that: The inkjet printing of the first removable layer on the first side of the first substrate comprises: On the first side of the first substrate, a first removable layer is inkjet printed using a first nozzle with an inkjet printing accuracy of P2, 90%×(1440*720 / inch)≤P2≤110%×(1440*720 / inch).

13. The method for manufacturing a display panel according to claim 1, characterized in that: Before preparing the first conductive layer on the side of the first removable layer away from the first substrate, the method further comprises: A first primer layer is prepared on a side of the first removable layer away from the first substrate; wherein the preparation material of the first primer layer includes a silicon-based material.

14. The method for preparing a display panel according to claim 13, characterized in that: The step of preparing a first primer layer on a side of the first removable layer away from the first substrate includes: On a side of the first removable layer away from the first substrate, a first primer layer with a thickness of D2 is prepared in a direction perpendicular to the plane where the first substrate is located, and 5nm≤D2≤100nm.

15. The method for manufacturing a display panel according to claim 1, characterized in that: The step of preparing a first conductive layer on a side of the first removable layer away from the first substrate includes: On a side of the first removable layer away from the first substrate, a first conductive layer with a thickness of D3 is prepared in a direction perpendicular to the plane where the first substrate is located, and 5 μm≤D3≤200 μm.

16. The method for manufacturing a display panel according to claim 1, characterized in that: Before preparing the first conductive layer on the side of the first removable layer away from the first substrate, the method further comprises: On the side of the first erasable layer away from the first base substrate, an erasable layer with a thickness of D4 is prepared in a direction perpendicular to the plane where the first base substrate is located, and 20 μm≤D4≤200 μm.

17. A display panel, characterized in that: The display panel is obtained by the method for preparing the display panel according to any one of claims 1 to 16.

18. A display device, characterized in that: Comprising the display panel as claimed in claim 17.

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