Simulation method and system based on conducted interference emission, medium and equipment

Abstract

The invention discloses a simulation method and system based on conducted interference emission, a medium and equipment. The method comprises the following steps: acquiring test environment parameters and parameter information of equipment to be tested; constructing a three-dimensional environment model according to the test environment parameters and the parameter information of the to-be-tested equipment; performing simulation analysis according to preset three-dimensional simulation parameters and the three-dimensional environment model to obtain electromagnetic scattering parameters corresponding to the three-dimensional environment model; constructing a circuit model according to preset circuit diagram information, and combining the circuit model and the three-dimensional environment model according to the electromagnetic scattering parameters to obtain a conducted emission simulation model; and performing simulation analysis according to the conducted emission simulation model and preset circuit simulation parameters to obtain a conducted emission simulation result. According to the invention, through parameterization and modularization modeling and integration of the environment model and the circuit model, the accuracy and flexibility of simulation are significantly improved.

Description

Technical Field

[0001] The present invention belongs to the field of conducted interference emission simulation, and relates to a simulation method, system, medium and equipment based on conducted interference emission. Background Art

[0002] As the complexity and integration of electronic devices continue to increase, ensuring their electromagnetic compatibility becomes critical. Conducted emission simulation helps engineers predict and solve potential electromagnetic interference problems by simulating the electromagnetic behavior of circuits under different working conditions. This simulation technology is widely used in automotive electronics, communication equipment, consumer electronics and other fields, and is of great significance for improving product reliability and compliance.

[0003] Although the existing conducted emission simulation technology has made some progress, it still has some limitations. For example, some existing methods based on frequency domain analysis have limited accuracy when dealing with nonlinear components; other methods based on time domain analysis are less efficient when analyzing high-frequency signals. In addition, existing technologies often require complex parameter configurations and lack flexibility in the output of simulation results, making it difficult to meet the needs of different application scenarios. These problems limit the scope of application and practicality of simulation tools, especially in the face of increasingly complex circuit designs, which urgently requires a more efficient and accurate simulation solution. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present application provides a simulation method, system, medium and device based on conducted interference emission, which improves the accuracy and flexibility of conducted emission simulation.

[0005] To achieve the above object, in a first aspect, the present invention provides a simulation method based on conducted interference emission, comprising:

[0006] Obtain test environment parameters and parameter information of the device under test;

[0007] Constructing a three-dimensional environment model according to the test environment parameters and parameter information of the device under test;

[0008] Performing simulation analysis according to preset three-dimensional simulation parameters and the three-dimensional environment model to obtain electromagnetic scattering parameters corresponding to the three-dimensional environment model;

[0009] According to the preset circuit diagram information, a circuit model is constructed, and according to the electromagnetic scattering parameters, the circuit model and the three-dimensional environment model are combined to obtain a conducted emission simulation model;

[0010] According to the conducted emission simulation model and preset circuit simulation parameters, simulation analysis is performed to obtain conducted emission simulation results.

[0011] Compared with the prior art, the embodiments of the present application have the following beneficial effects: obtaining the parameter information of the test environment parameters and the device under test, ensuring that the simulation model constructed subsequently can accurately reflect the specific conditions of the actual test environment and the device under test, thereby improving the authenticity and reliability of the simulation; constructing a three-dimensional environmental model through parameterization and modularization, covering all factors that may affect electromagnetic behavior, making the simulation results more accurate, reducing experimental errors, and improving the flexibility of simulation testing; through simulation analysis of the environmental model, predicting the electromagnetic scattering characteristics in advance, saving the time and cost of actual testing, and providing more comprehensive data support; combining the electromagnetic scattering parameters with the circuit model to achieve seamless integration from the electromagnetic field domain to the circuit domain, making the simulation results closer to the actual situation, and improving the overall performance evaluation accuracy of the system; performing simulation analysis based on the conducted emission simulation model not only takes into account the behavior of the circuit elements, but also integrates the electromagnetic scattering characteristics, thereby significantly improving the accuracy of the simulation results.

[0012] In some embodiments of the first aspect of the present application, constructing a three-dimensional environment model according to the test environment parameters and parameter information of the device under test includes:

[0013] Generate a corresponding desktop model in a preset simulation test environment according to the desktop size information, material information and location information in the test environment parameters;

[0014] According to the size information, material information and position information of the non-conductive support in the test environment parameters, in the simulation test environment, a corresponding non-conductive support model is generated;

[0015] According to the dimension information and conductivity information of the shielding room floor in the test environment parameters, a corresponding shielding room floor model is generated in the simulation test environment.

[0016] Compared with the prior art, the above embodiment has the following beneficial effects: by generating desktop, non-conductive support and shielded room floor models, the realism of the simulation environment is improved, the accuracy of electromagnetic scattering parameters obtained in subsequent simulations is ensured, thereby improving the reliability and practicality of the entire simulation process.

[0017] In some embodiments of the first aspect of the present application, the constructing of the three-dimensional environment model according to the test environment parameters and parameter information of the device under test further includes:

[0018] Generate a corresponding lap joint model in the simulation test environment according to the size information, position information and conductivity information of the lap joint in the test environment parameters;

[0019] According to the size information and position information of the line impedance stabilization network in the test environment parameters, in the simulation test environment, a corresponding line impedance stabilization network model is generated;

[0020] According to the size parameters, material information parameters, position parameters and electrical parameters in the parameter information of the test device, a corresponding device under test model is generated in the simulation test environment.

[0021] Compared with the prior art, the above embodiment has the following beneficial effects: by adding models of strapping strips, line impedance stabilization networks and models of the device under test, the simulation environment is further enriched, ensuring that the electromagnetic characteristics of each component are accurately simulated, thereby improving the accuracy and reliability of the simulation results.

[0022] In some embodiments of the first aspect of the present application, the constructing of the three-dimensional environment model according to the test environment parameters and parameter information of the device under test further includes:

[0023] Generate a connection cable model according to preset size parameters and material parameters of the connection cable; wherein the connection cable model includes a first connection cable model and a second connection cable model, the first connection cable model is used to connect the cable input port of the device under test and the output port of the line impedance stabilization network, and the second connection cable model is used to connect the cable output port of the device under test and the input port of the line impedance stabilization network;

[0024] Generate an air cavity model according to the material parameters of the air cavity in the test environment parameters, and the size information and position information of the three-dimensional environment model;

[0025] The desktop model, the non-conductive support model, the shielding room floor model, the lap bar model, the line impedance stabilization network model, the device under test model, the connecting cable model and the air cavity model are assembled to obtain a three-dimensional environment model.

[0026] Compared with the prior art, the above embodiment has the following beneficial effects: by generating a connecting cable and air cavity model and integrating it with other sub-models, a complete three-dimensional environmental model is constructed, which significantly improves the authenticity of the simulation environment and the accuracy of the simulation results, and ensures the reliability of the electromagnetic scattering parameters.

[0027] In some embodiments of the first aspect of the present application, performing simulation analysis according to preset three-dimensional simulation parameters and the three-dimensional environment model to obtain electromagnetic scattering parameters corresponding to the three-dimensional environment model includes:

[0028] According to the impedance parameters in the three-dimensional simulation parameters, impedance parameters are respectively allocated to the power supply end in the device under test model and the input end and the output end in the line impedance stabilization network model;

[0029] Allocate global excitation parameters for all ports in the three-dimensional environment model according to the excitation parameters in the three-dimensional simulation parameters; wherein the global excitation parameters include: solution frequency type, center frequency, maximum number of iterations, convergence standard, start frequency and end frequency;

[0030] According to a preset electromagnetic simulation algorithm, and each model parameter, each impedance parameter and global excitation parameter in the three-dimensional environment model, an electromagnetic field calculation is performed to obtain the electromagnetic scattering parameters.

[0031] Compared with the prior art, the above embodiment has the following beneficial effects: by setting reasonable impedance parameters and global excitation parameters and performing electromagnetic field calculations, accurate extraction of electromagnetic scattering parameters during the simulation process is ensured, the reliability and accuracy of the simulation results are improved, and high-quality data support is provided for subsequent simulation analysis.

[0032] In some embodiments of the first aspect of the present application, the circuit model is constructed according to the preset circuit diagram information, and the circuit model and the three-dimensional environment model are combined according to the electromagnetic scattering parameters to obtain the conducted emission simulation model, including:

[0033] Analyze the circuit diagram information to obtain parameter information and connection relationship of each component;

[0034] According to the parameter information and connection relationship of each component, a circuit diagram model is constructed, that is, a circuit model is generated;

[0035] A multi-port network node is created for the circuit model, and the electromagnetic scattering parameters are associated with the multi-port network node to obtain a conduction emission simulation model; wherein the multi-port network node is associated with the nodes of each component according to a preset rule.

[0036] Compared with the prior art, the above embodiment has the following beneficial effects: through circuit diagram analysis, circuit model construction and association of electromagnetic scattering parameters, effective integration of electromagnetic scattering data and circuit model is achieved, which significantly improves the comprehensiveness and accuracy of simulation results and provides strong support for complex electromagnetic compatibility analysis.

[0037] In some embodiments of the first aspect of the present application, performing simulation analysis according to the conducted emission simulation model and preset circuit simulation parameters to obtain conducted emission simulation results includes:

[0038] Obtaining a time step parameter and a stop time parameter of the circuit simulation parameter;

[0039] According to the preset conducted emission simulation algorithm, the time step parameter, the stop time parameter and all model parameters of the conducted emission simulation model, simulation analysis is performed to obtain simulation results.

[0040] Compared with the prior art, the above embodiment has the following beneficial effects: by reasonably setting the time step and stop time parameters and combining the conducted emission simulation algorithm for analysis, the efficiency and stability of the simulation process are ensured, and finally a reliable conducted emission simulation result is obtained.

[0041] In a second aspect, the present invention further provides a simulation system based on conducted interference emission, comprising: a data acquisition module, an environment model construction module, an environment model analysis module, a simulation model construction module and a result output module;

[0042] Wherein, the data acquisition module is used to obtain the test environment parameters and parameter information of the device under test;

[0043] The environment model building module is used to build a three-dimensional environment model according to the test environment parameters and parameter information of the device under test;

[0044] The environmental model analysis module is used to perform simulation analysis according to preset three-dimensional simulation parameters and the three-dimensional environmental model to obtain electromagnetic scattering parameters corresponding to the three-dimensional environmental model;

[0045] The simulation model building module is used to build a circuit model according to preset circuit diagram information, and to combine the circuit model and the three-dimensional environment model according to the electromagnetic scattering parameters to obtain a conducted emission simulation model;

[0046] The result output module is used to perform simulation analysis according to the conducted emission simulation model and preset circuit simulation parameters to obtain conducted emission simulation results.

[0047] Compared with the prior art, the above embodiments of the present application have the following beneficial effects: obtaining the test environment parameters and the parameter information of the device to be tested, ensuring that the simulation model constructed subsequently can accurately reflect the specific conditions of the actual test environment and the device to be tested, and improving the authenticity and reliability of the simulation; constructing a three-dimensional environmental model through parameterization and modularization, covering all factors that may affect electromagnetic behavior, making the simulation results more accurate, reducing experimental errors, and improving the flexibility of simulation testing; through simulation analysis of the environmental model, predicting the electromagnetic scattering characteristics in advance, saving the time and cost of actual testing, and providing more comprehensive data support; combining the electromagnetic scattering parameters with the circuit model to achieve seamless integration from the electromagnetic field domain to the circuit domain, making the simulation results closer to the actual situation, and improving the overall performance evaluation accuracy of the system; performing simulation analysis based on the conducted emission simulation model not only takes into account the behavior of the circuit elements, but also integrates the electromagnetic scattering characteristics, significantly improving the accuracy of the simulation results.

[0048] In a third aspect, the present invention also provides a simulation device based on conducted interference emission, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program implements the steps of a simulation method based on conducted interference emission when loaded into the processor.

[0049] In a fourth aspect, an embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the simulation method based on conducted interference emission are implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 : A flow chart of a simulation method based on conducted interference emission provided in some embodiments of the present invention.

[0051] Figure 2 : A structural diagram of a simulation system based on conducted interference emission provided in some embodiments of the present invention.

[0052] Figure 3 : A structural diagram of a simulation device based on conducted interference emission provided in some embodiments of the present invention.

[0053] Figure 4 : A schematic diagram of a three-dimensional environment model of a simulation embodiment based on conducted interference emission provided by the present invention.

[0054] Figure 5 : A schematic diagram of port settings for a simulation embodiment based on conducted interference emission provided by the present invention.

[0055] Figure 6: A schematic diagram of excitation parameter settings for a simulation embodiment based on conducted interference emission provided by the present invention.

[0056] Figure 7 : A circuit simulation link diagram of a simulation embodiment based on conducted interference emission provided by the present invention.

[0057] Figure 8 : A rendering of the data results of a simulation embodiment based on conducted interference emission provided by the present invention. DETAILED DESCRIPTION

[0058] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0059] Embodiment 1:

[0060] Please refer to Figure 1 , a simulation method based on conducted interference emission provided by an embodiment of the present invention, comprising steps S1 to S5:

[0061] Step S1: Acquire test environment parameters and parameter information of the device under test.

[0062] Among them, the test environment parameters and parameter information of the device to be tested are used to construct a simulation model. The test environment parameters include information such as the size, position and material of various environmental factors such as the desktop, non-conductive support, shielding room floor, lap strips, line impedance stabilization network, connecting cables and air cavity. The parameter information of the device to be tested includes size parameters, material information parameters, position parameters and electrical parameters.

[0063] In this embodiment, step S1 obtains the test environment parameters and parameter information of the device under test, thereby ensuring that the simulation model constructed subsequently can accurately reflect the specific conditions of the actual test environment and the device under test, thereby improving the authenticity and reliability of the simulation.

[0064] Step S2: constructing a three-dimensional environment model according to the test environment parameters and parameter information of the device to be tested.

[0065] Preferably, in some embodiments of the present application, step S2 can be implemented by the following preferred implementation, specifically including steps S21 to S29:

[0066] S21: Generate a corresponding desktop model in a preset simulation test environment according to the desktop size information, material information and position information in the test environment parameters.

[0067] S22: generating a corresponding non-conductive support model in the simulation test environment according to the size information, material information and position information of the non-conductive support in the test environment parameters.

[0068] S23: generating a corresponding shielding room floor model in the simulation test environment according to the size information and conductivity information of the shielding room floor in the test environment parameters.

[0069] In steps S21-S23, by generating models of the desktop, non-conductive support and shielded room floor, the realism of the simulation environment is improved, ensuring the accuracy of electromagnetic scattering parameters obtained in subsequent simulations, thereby improving the reliability and practicality of the entire simulation process.

[0070] S24: generating a corresponding lap joint strip model in the simulation test environment according to the size information, position information and conductivity information of the lap joint strip in the test environment parameters.

[0071] S25: generating a corresponding line impedance stabilization network model in the simulation test environment according to the size information and position information of the line impedance stabilization network in the test environment parameters.

[0072] S26: generating a corresponding device under test model in the simulation test environment according to the size parameters, material information parameters, position parameters and electrical parameters in the parameter information of the device under test.

[0073] In steps S24-S26, by adding models of strapping bars, line impedance stabilization networks and device under test models, the simulation environment is further enriched, ensuring that the electromagnetic characteristics of each component are accurately simulated, thereby improving the accuracy and reliability of the simulation results.

[0074] S27: Generate a connection cable model according to preset size parameters and material parameters of the connection cable.

[0075] Among them, the connection cable model includes a first connection cable model and a second connection cable model, the first connection cable model is used to connect the cable input port of the device under test and the output port of the line impedance stabilization network, and the second connection cable model is used to connect the cable output port of the device under test and the input port of the line impedance stabilization network.

[0076] S28: Generate an air cavity model according to the material parameters of the air cavity in the test environment parameters, and the size information and position information of the three-dimensional environment model.

[0077] S29: Assemble the desktop model, non-conductive support model, shielding room floor model, lap bar model, line impedance stabilization network model, device under test model, connecting cable model and air cavity model to obtain a three-dimensional environment model.

[0078] In steps S27-S29, a complete three-dimensional environment model is constructed by generating connecting cable and air cavity models and integrating them with other sub-models, which significantly improves the realism of the simulation environment and the accuracy of the simulation results and ensures the reliability of the electromagnetic scattering parameters.

[0079] In a specific implementation, step S2 can also be implemented by operating a high-frequency structure simulator (such as ANSYS HFSS software), and the effect is as follows: Figure 4 The schematic diagram of the three-dimensional environmental model shown in the figure, wherein the actual operation is as follows: establish a test table, wherein the table top height can be set to 80-90cm according to the requirements of the standard, the table top length can be 2.5m, and the width can be 1m, so as to ensure that the experimental equipment can be fully placed; set the test table material to wood; establish a non-conductive support, place the non-conductive support on the test table, the thickness can be 5cm, the width can be 0.6m, the length can be set to be more than 2m but less than the length of the test table, and the non-conductive support material can be set to dry wood; establish the shielding room floor, set the length and width parameters of the floor according to the actual size of the shielding room, and set the conductivity according to the actual material properties; establish a lap joint, establish a lap joint surface at an appropriate position, set the length and width of the lap joint according to the standard, and modify the conductivity of the lap joint material according to the actual situation; set the detailed size parameters of the line impedance stabilization network according to the actual size, and in the three-dimensional modeling interface Generate an initial cube, establish a line impedance stabilization network model, and place it in a suitable position on the test table (for example, close to the test table and placed in a suitable position on the left side of the non-conductive support); establish a model of the device under test, import the device under test into the HFSS three-dimensional simulation environment through the model import function, and place the device under test in a suitable position, and set the material properties of the device under test according to actual conditions; establish a connecting cable, establish a cable model between the cable input and output ends of the device under test and the input and output ends of the line impedance stabilization network, set the core wire material to the material of the required metal conductor, and the outer layer to the material of the corresponding insulation layer, and set the radius of the core wire layer and the insulation layer according to actual conditions; generate an initial cube as an air cavity in the three-dimensional modeling interface, modify the detailed size parameter settings and material properties of the air cavity model so that it can completely wrap the remaining model components, and finally obtain a three-dimensional environmental model.

[0080] Step S3: performing simulation analysis according to preset three-dimensional simulation parameters and the three-dimensional environment model to obtain electromagnetic scattering parameters corresponding to the three-dimensional environment model.

[0081] Preferably, in some embodiments of the present application, step S3 can be implemented by the following preferred implementation, specifically including steps S31 to S33:

[0082] S31: allocating impedance parameters to the power supply end in the device under test model and the input end and the output end in the line impedance stabilization network model according to the impedance parameters in the three-dimensional simulation parameters;

[0083] Similarly, if the operation is implemented in a high-frequency structure simulator (such as HFSS software), the impedance port can be set for the line impedance stabilization network model and the cable connection port of the device under test, for example, set to 50Ω. For specific settings, please refer to Figure 5 The port setting diagram is shown.

[0084] S32: allocating global excitation parameters to all ports in the three-dimensional environment model according to the excitation parameters in the three-dimensional simulation parameters; wherein the global excitation parameters include: solution frequency type, center frequency, maximum number of iterations, convergence standard, start frequency and end frequency;

[0085] Similarly, if the operation is implemented in a high-frequency structure simulator (such as HFSS software), for example, the solution frequency type is set to "single", the center frequency value is 0.2GHz, the maximum number of iterations is 99, and the convergence standard (i.e. Maximum Delta S) is 0.02; in the sweep setting pane, set the sweep type to "interpolating" interpolation sweep; you can also set the start frequency to 10KHz and the end frequency to 10MHz; finally, save all the sweep settings and complete the configuration of the excitation parameters. The effect is as follows: Figure 6 Schematic diagram of the excitation parameter settings shown.

[0086] S33: performing electromagnetic field calculation according to a preset electromagnetic simulation algorithm, and various model parameters, various impedance parameters and global excitation parameters in the three-dimensional environment model to obtain the electromagnetic scattering parameters.

[0087] In step S3, by setting reasonable impedance parameters and global excitation parameters and performing electromagnetic field calculations, the accurate extraction of electromagnetic scattering parameters during the simulation process is ensured, the reliability and accuracy of the simulation results are improved, and high-quality data support is provided for subsequent simulation analysis.

[0088] Step S4: constructing a circuit model according to preset circuit diagram information, and combining the circuit model and the three-dimensional environment model according to the electromagnetic scattering parameters to obtain a conducted emission simulation model.

[0089] Preferably, in some embodiments of the present application, step S4 can be implemented by the following preferred implementation, specifically including steps S41 to S43:

[0090] S41: parsing the circuit diagram information to obtain parameter information and connection relationship of each component;

[0091] S42: constructing a circuit diagram model according to the parameter information and connection relationship of each component, that is, generating a circuit model;

[0092] S43: creating a multi-port network node for the circuit model, associating the electromagnetic scattering parameters with the multi-port network node, and obtaining a conduction emission simulation model; wherein the multi-port network node is associated with the nodes of each component according to a preset rule.

[0093] In the specific implementation, for example, if you operate in HFSS software, you can also manually drag the 3D environment model as a multi-port network to the drawing interface of the circuit model to achieve the association between the two models. Similarly, when generating the circuit model, you can also manually draw it according to the circuit diagram. The effect is as follows Figure 7 The circuit simulation link diagram is shown.

[0094] In step S4, through circuit diagram analysis, circuit model construction and association of electromagnetic scattering parameters, effective integration of electromagnetic scattering data and circuit models is achieved, which significantly improves the comprehensiveness and accuracy of simulation results and provides strong support for complex electromagnetic compatibility analysis.

[0095] Step S5: performing simulation analysis according to the conducted emission simulation model and preset circuit simulation parameters to obtain conducted emission simulation results.

[0096] Preferably, in some embodiments of the present application, step S5 can be implemented by the following preferred implementation, specifically including step S51 to step S52:

[0097] S51: Obtaining a time step parameter and a stop time parameter of the circuit simulation parameter;

[0098] S52: Perform simulation analysis according to a preset conducted emission simulation algorithm, the time step parameter, the stop time parameter and all model parameters of the conducted emission simulation model to obtain simulation results.

[0099] In the specific implementation, if you operate in HFSS software, you can start the simulation after setting the relevant parameters. The software will automatically analyze the current, voltage and impedance characteristics of each component in the circuit, and obtain the S parameters, transmission characteristics, gain, phase response and power loss data of the circuit system. At the same time, it monitors the simulation process and records the status until the end of the simulation. In addition, you can also make some additional settings after the simulation is completed, such as: set the "result domain" to "spectral", set the "analysis algorithm" to select "FFT algorithm", set the "data type" to select "voltage", select the unit as "dB", and export the conducted emission simulation results. Then right-click in the result graph to select the specified point (specify points), enter the limit input window, and enter the coordinates (10K, 94), (500K, 60), (10M, 60) in turn to complete the limit curve setting and generate the final result data containing the limit information. The effect is as follows: Figure 8 The effect diagram of the data results is shown.

[0100] In step S5, by reasonably setting the time step and stop time parameters and combining the conducted emission simulation algorithm for analysis, the efficiency and stability of the simulation process are ensured, and finally a reliable conducted emission simulation result is obtained.

[0101] In summary, compared with the prior art, the above embodiments of the present application have the following beneficial effects: obtaining the test environment parameters and the parameter information of the device to be tested, ensuring that the subsequently constructed simulation model can accurately reflect the actual test environment and the specific conditions of the device to be tested, and improving the authenticity and reliability of the simulation; constructing a three-dimensional environmental model through parameterization and modularization, covering all factors that may affect electromagnetic behavior, making the simulation results more accurate, reducing experimental errors, and improving the flexibility of simulation testing; through simulation analysis of the environmental model, predicting the electromagnetic scattering characteristics in advance, saving the time and cost of actual testing, and providing more comprehensive data support; combining the electromagnetic scattering parameters with the circuit model to achieve seamless integration from the electromagnetic field domain to the circuit domain, making the simulation results closer to the actual situation, and improving the overall performance evaluation accuracy of the system; performing simulation analysis based on the conducted emission simulation model not only takes into account the behavior of the circuit elements, but also integrates the electromagnetic scattering characteristics, significantly improving the accuracy of the simulation results.

[0102] Embodiment 2:

[0103] Please refer to Figure 2 , based on the same inventive concept, a simulation system based on conducted interference emission disclosed in an embodiment of the present invention includes: a data acquisition module M1, an environment model construction module M2, an environment model analysis module M3, a simulation model construction module M4 and a result output module M5;

[0104] The data acquisition module M1 is used to obtain the test environment parameters and parameter information of the device under test.

[0105] The data acquisition module M1 of this embodiment obtains the parameter information of the test environment parameters and the device under test, thereby ensuring that the simulation model constructed subsequently can accurately reflect the specific conditions of the actual test environment and the device under test, thereby improving the authenticity and reliability of the simulation.

[0106] The environment model building module M2 is used to build a three-dimensional environment model according to the test environment parameters and parameter information of the device to be tested.

[0107] The environment model building module M2 includes: a desktop model building unit, a non-conductive support model building unit, a shielding room floor model building unit, a lap bar model building unit, a line impedance stabilization network model building unit, a device under test model building unit, a connecting cable model building unit, an air cavity model building unit and an integration unit;

[0108] The desktop model construction unit is used to generate a corresponding desktop model in a preset simulation test environment according to the desktop size information, material information and position information in the test environment parameters.

[0109] The non-conductive support model building unit is used to generate a corresponding non-conductive support model in the simulation test environment according to the size information, material information and position information of the non-conductive support in the test environment parameters.

[0110] The shielding room floor model construction unit is used to generate a corresponding shielding room floor model in the simulation test environment according to the size information and conductivity information of the shielding room floor in the test environment parameters.

[0111] The lap joint strip model building unit is used to generate a corresponding lap joint strip model in the simulation test environment according to the size information, position information and conductivity information of the lap joint strip in the test environment parameters.

[0112] The line impedance stabilization network model construction unit is used to generate a corresponding line impedance stabilization network model in the simulation test environment according to the size information and position information of the line impedance stabilization network in the test environment parameters.

[0113] The device under test model building unit is used to generate a corresponding device under test model in the simulation test environment according to the size parameters, material information parameters, position parameters and electrical parameters in the parameter information of the device under test.

[0114] The connection cable model building unit is used to generate a connection cable model according to preset size parameters and material parameters of the connection cable.

[0115] Among them, the connection cable model includes a first connection cable model and a second connection cable model, the first connection cable model is used to connect the cable input port of the device under test and the output port of the line impedance stabilization network, and the second connection cable model is used to connect the cable output port of the device under test and the input port of the line impedance stabilization network.

[0116] The air cavity model construction unit is used to generate an air cavity model according to the material parameters of the air cavity in the test environment parameters, and the size information and position information of the three-dimensional environment model.

[0117] The integration unit is used to collect the desktop model, non-conductive support model, shielding room floor model, lap bar model, line impedance stabilization network model, device under test model, connecting cable model and air cavity model to obtain a three-dimensional environment model.

[0118] The environmental model construction module M2 of this embodiment constructs a three-dimensional environmental model through parameterization and modularization, covering all factors that may affect electromagnetic behavior, making the simulation results more accurate, reducing experimental errors, and improving the flexibility of simulation tests.

[0119] The environmental model analysis module M3 is used to perform simulation analysis according to preset three-dimensional simulation parameters and the three-dimensional environmental model to obtain electromagnetic scattering parameters corresponding to the three-dimensional environmental model.

[0120] The environmental model analysis module M3 includes: an impedance setting unit, an excitation parameter setting unit and an electromagnetic calculation unit.

[0121] The impedance setting unit is used to allocate impedance parameters to the power supply end in the device under test model and the input end and the output end in the line impedance stabilization network model according to the impedance parameters in the three-dimensional simulation parameters.

[0122] The excitation parameter setting unit is used to allocate global excitation parameters to all ports in the three-dimensional environment model according to the excitation parameters in the three-dimensional simulation parameters; wherein the global excitation parameters include: solution frequency type, center frequency, maximum number of iterations, convergence standard, start frequency and end frequency.

[0123] The electromagnetic calculation unit is used to perform electromagnetic field calculation according to a preset electromagnetic simulation algorithm and various model parameters, various impedance parameters and global excitation parameters in the three-dimensional environment model to obtain the electromagnetic scattering parameters.

[0124] The environmental model analysis module M3 of this embodiment ensures the accurate extraction of electromagnetic scattering parameters during the simulation process by setting reasonable impedance parameters and global excitation parameters and performing electromagnetic field calculations, improves the reliability and accuracy of the simulation results, and provides high-quality data support for subsequent simulation analysis.

[0125] The simulation model building module M4 is used to build a circuit model according to preset circuit diagram information, and to combine the circuit model and the three-dimensional environment model according to the electromagnetic scattering parameters to obtain a conducted emission simulation model.

[0126] The simulation model building module M4 includes: a parsing unit, a circuit model building unit and a simulation model generating unit.

[0127] The analysis unit is used to analyze the circuit diagram information and obtain parameter information and connection relationship of each component.

[0128] The circuit model building unit is used to build a circuit diagram model according to the parameter information and connection relationship of each component, that is, to generate a circuit model.

[0129] The simulation model generation unit is used to create a multi-port network node for the circuit model, associate the electromagnetic scattering parameters with the multi-port network node, and obtain a conducted emission simulation model; wherein the multi-port network node is associated with the nodes of each component according to a preset rule.

[0130] The simulation model construction module M4 of this embodiment realizes the effective integration of electromagnetic scattering data and circuit model through circuit diagram analysis, circuit model construction and association of electromagnetic scattering parameters, significantly improves the comprehensiveness and accuracy of simulation results, and provides strong support for complex electromagnetic compatibility analysis.

[0131] The result output module M5 is used to perform simulation analysis according to the conducted emission simulation model and preset circuit simulation parameters to obtain conducted emission simulation results.

[0132] The result output module M5 includes: a time parameter setting unit and a simulation analysis unit.

[0133] The time parameter setting unit is used to obtain the time step parameter and the stop time parameter of the circuit simulation parameter;

[0134] The simulation analysis unit is used to perform simulation analysis according to a preset conducted emission simulation algorithm, the time step parameter, the stop time parameter and all model parameters of the conducted emission simulation model to obtain a simulation result.

[0135] The result output module M5 of this embodiment ensures the efficiency and stability of the simulation process by reasonably setting the time step and stop time parameters and combining the conducted emission simulation algorithm for analysis, and finally obtains reliable conducted emission simulation results.

[0136] In summary, compared with the prior art, the embodiments of the present application have the following beneficial effects: obtaining the test environment parameters and the parameter information of the device to be tested, ensuring that the subsequently constructed simulation model can accurately reflect the actual test environment and the specific conditions of the device to be tested, and improving the authenticity and reliability of the simulation; constructing a three-dimensional environmental model through parameterization and modularization, covering all factors that may affect electromagnetic behavior, making the simulation results more accurate, reducing experimental errors, and improving the flexibility of simulation testing; through simulation analysis of the environmental model, predicting the electromagnetic scattering characteristics in advance, saving the time and cost of actual testing, and providing more comprehensive data support; combining the electromagnetic scattering parameters with the circuit model to achieve seamless integration from the electromagnetic field domain to the circuit domain, making the simulation results closer to the actual situation, and improving the overall performance evaluation accuracy of the system; performing simulation analysis based on the conducted emission simulation model not only takes into account the behavior of the circuit elements, but also integrates the electromagnetic scattering characteristics, significantly improving the accuracy of the simulation results.

[0137] The division of the modules described above is only a logical function division. There may be other division methods in actual implementation. For example, multiple modules may be combined or integrated into another system.

[0138] Embodiment three:

[0139] Figure 3 The structure diagram of a simulation device based on conducted interference emission of the present application is shown. Figure 3 As shown, the simulation device based on conducted interference emission may include: a processor N1, a memory N2, a data interface N3 and a communication bus N4.

[0140] Among them: the processor N1, the memory N2, and the data interface N3 communicate with each other through the communication bus N4; the data interface N3 is used for data communication with other devices such as an input device or an output device; the processor N1 is used to execute the program N5, which can specifically execute the relevant steps in the above-mentioned embodiment of the simulation method based on conducted interference emission.

[0141] Specifically, the program N5 may include program codes, and the program codes include computer executable instructions.

[0142] The processor N1 may be a central processing unit CPU, or an application-specific integrated circuit ASIC (Application Specific Integrated Circuit), or one or more integrated circuits configured to implement the embodiments of the present application. The one or more processors included in the simulation device based on conducted interference emission may be processors of the same type, such as one or more CPUs, or may be processors of different types, such as one or more CPUs and one or more ASICs.

[0143] The memory N2 is used to store the program N5. The memory N2 may include a high-speed RAM memory, and may also include a non-volatile memory (non-volatile memory), such as at least one disk memory.

[0144] The algorithms or displays provided herein are not inherently related to any particular computer, virtual system or other device. In addition, the embodiments of the present application are not directed to any particular programming language.

[0145] Embodiment 4:

[0146] An embodiment of the present invention also provides a computer-readable storage medium, which stores at least one executable instruction. When the executable instruction is executed on a simulation device / system based on conducted interference emission, the simulation device / system based on conducted interference emission executes a simulation method based on conducted interference emission in any of the above method embodiments.

[0147] In the specification provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. Similarly, in order to simplify the application and help understand one or more of the various inventive aspects, in the above description of the exemplary embodiments of the present application, the various features of the embodiments of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. Wherein, the claims that follow the specific embodiment are thus clearly incorporated into the specific embodiment, wherein each claim itself is used as a separate embodiment of the application.

[0148] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and further may be divided into a plurality of submodules or subunits or subcomponents. Except that at least some of such features and / or processes or units are mutually exclusive.

Claims

1. A simulation method based on conducted interference emission, characterized in that: include: Obtain test environment parameters and parameter information of the device under test; Constructing a three-dimensional environment model according to the test environment parameters and parameter information of the device under test; Performing simulation analysis according to preset three-dimensional simulation parameters and the three-dimensional environment model to obtain electromagnetic scattering parameters corresponding to the three-dimensional environment model; According to the preset circuit diagram information, a circuit model is constructed, and according to the electromagnetic scattering parameters, the circuit model and the three-dimensional environment model are combined to obtain a conducted emission simulation model; According to the conducted emission simulation model and preset circuit simulation parameters, simulation analysis is performed to obtain conducted emission simulation results.

2. A simulation method based on conducted interference emission as claimed in claim 1, characterized in that: The constructing of a three-dimensional environment model according to the test environment parameters and parameter information of the device under test includes: Generate a corresponding desktop model in a preset simulation test environment according to the desktop size information, material information and location information in the test environment parameters; According to the size information, material information and position information of the non-conductive support in the test environment parameters, in the simulation test environment, a corresponding non-conductive support model is generated; According to the dimension information and conductivity information of the shielding room floor in the test environment parameters, a corresponding shielding room floor model is generated in the simulation test environment.

3. A simulation method based on conducted interference emission as claimed in claim 2, characterized in that: The constructing of the three-dimensional environment model according to the test environment parameters and parameter information of the device under test also includes: Generate a corresponding lap joint model in the simulation test environment according to the size information, position information and conductivity information of the lap joint in the test environment parameters; According to the size information and position information of the line impedance stabilization network in the test environment parameters, in the simulation test environment, a corresponding line impedance stabilization network model is generated; According to the size parameters, material information parameters, position parameters and electrical parameters in the parameter information of the test device, a corresponding device under test model is generated in the simulation test environment.

4. A simulation method based on conducted interference emission as claimed in claim 3, characterized in that: The constructing of the three-dimensional environment model according to the test environment parameters and parameter information of the device under test also includes: Generate a connection cable model according to preset size parameters and material parameters of the connection cable; wherein the connection cable model includes a first connection cable model and a second connection cable model, the first connection cable model is used to connect the cable input port of the device under test and the output port of the line impedance stabilization network, and the second connection cable model is used to connect the cable output port of the device under test and the input port of the line impedance stabilization network; Generate an air cavity model according to the material parameters of the air cavity in the test environment parameters, and the size information and position information of the three-dimensional environment model; The desktop model, the non-conductive support model, the shielding room floor model, the lap bar model, the line impedance stabilization network model, the device under test model, the connecting cable model and the air cavity model are assembled to obtain a three-dimensional environment model.

5. A simulation method based on conducted interference emission as claimed in claim 4, characterized in that: The performing simulation analysis according to the preset three-dimensional simulation parameters and the three-dimensional environment model to obtain electromagnetic scattering parameters corresponding to the three-dimensional environment model includes: According to the impedance parameters in the three-dimensional simulation parameters, impedance parameters are respectively allocated to the power supply end in the device under test model and the input end and the output end in the line impedance stabilization network model; Allocate global excitation parameters for all ports in the three-dimensional environment model according to the excitation parameters in the three-dimensional simulation parameters; wherein the global excitation parameters include: solution frequency type, center frequency, maximum number of iterations, convergence standard, start frequency and end frequency; According to a preset electromagnetic simulation algorithm, and each model parameter, each impedance parameter and global excitation parameter in the three-dimensional environment model, an electromagnetic field calculation is performed to obtain the electromagnetic scattering parameters.

6. A simulation method based on conducted interference emission as claimed in claim 5, characterized in that: The circuit model is constructed according to the preset circuit diagram information, and the circuit model and the three-dimensional environment model are combined according to the electromagnetic scattering parameters to obtain a conducted emission simulation model, including: Analyze the circuit diagram information to obtain parameter information and connection relationship of each component; According to the parameter information and connection relationship of each component, a circuit diagram model is constructed, that is, a circuit model is generated; A multi-port network node is created for the circuit model, and the electromagnetic scattering parameters are associated with the multi-port network node to obtain a conduction emission simulation model; wherein the multi-port network node is associated with the nodes of each component according to a preset rule.

7. A simulation method based on conducted interference emission as claimed in claim 6, characterized in that: The performing simulation analysis according to the conducted emission simulation model and preset circuit simulation parameters to obtain conducted emission simulation results includes: Obtaining a time step parameter and a stop time parameter of the circuit simulation parameter; According to the preset conducted emission simulation algorithm, the time step parameter, the stop time parameter and all model parameters of the conducted emission simulation model, simulation analysis is performed to obtain simulation results.

8. A simulation system based on conducted interference emission, characterized in that: include: Data acquisition module, environment model building module, environment model analysis module, simulation model building module and result output module; Wherein, the data acquisition module is used to obtain the test environment parameters and parameter information of the device under test; The environment model building module is used to build a three-dimensional environment model according to the test environment parameters and parameter information of the device under test; The environmental model analysis module is used to perform simulation analysis according to preset three-dimensional simulation parameters and the three-dimensional environmental model to obtain electromagnetic scattering parameters corresponding to the three-dimensional environmental model; The simulation model building module is used to build a circuit model according to preset circuit diagram information, and to combine the circuit model and the three-dimensional environment model according to the electromagnetic scattering parameters to obtain a conducted emission simulation model; The result output module is used to perform simulation analysis according to the conducted emission simulation model and preset circuit simulation parameters to obtain conducted emission simulation results.

9. A simulation device based on conducted interference emission, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the computer program is loaded into a processor, the steps of a simulation method based on conducted interference emission according to claims 1 to 7 are implemented.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of a simulation method based on conducted interference emission according to claims 1 to 7 are implemented.

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