Display module and display device

Abstract

The application provides a display module and a display device. The display module comprises a display panel and a circuit board. The circuit board is electrically connected with a first pin in a non-display area of the display panel. The first pin comprises a first crimping portion and a first transmission portion electrically connected with the first crimping portion. The width of the first crimping portion is greater than the width of the first transmission portion. The pin in the display module is designed in a widened special shape, so as to increase the crimping area between the pin of the display panel and the pin of the circuit board, and reduce the risk of burn caused by abnormal crimping between the display panel and the circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display module and a display device. BACKGROUND

[0002] At present, in the production and detection of flexible display products, aging process needs to be performed on the panel to reduce the leakage current of the array substrate in the product, so as to achieve the purpose of eliminating the bright spot of the display picture. However, the problem of product burn often occurs in the process of product aging. SUMMARY

[0003] The purpose of the present application is to provide a display module and a display device to solve the problem that the product is easily burned in the aging process in the prior art.

[0004] To achieve the above purpose, the present application provides a display module, which comprises a display panel and a circuit board. The display panel has a display area and a non-display area connected with the display area. The circuit board is electrically connected with the non-display area of the display panel. The display panel comprises a first pin, which is located in the non-display area and electrically connected with the circuit board. The first pin comprises a first crimping part and a first transmission part electrically connected with the first crimping part, and the width of the first crimping part is greater than that of the first transmission part.

[0005] Further, the circuit board further comprises a first wiring layer and a substrate layer. The first wiring layer is arranged on the side of the substrate layer close to the display panel and is electrically connected with the first pin. The substrate layer is arranged on the side of the first wiring layer away from the display panel. The first wiring layer comprises a plurality of second pins, which are respectively electrically connected with the driving circuit of the circuit board and at least part of the first pin.

[0006] Further, the second pin comprises a second crimping part and a second transmission part. The second crimping part is electrically connected with the first crimping part. The second transmission part is electrically connected with the second crimping part and the driving circuit. The width of the second crimping part is greater than that of the second transmission part. Preferably, the orthographic projection of the second crimping part on the display panel at least partially overlaps the orthographic projection of the corresponding first crimping part on the display panel. Preferably, the orthographic projection of the second crimping part on the display panel is located within the range of the orthographic projection of the corresponding first crimping part on the display panel.

[0007] Further, the first trace layer further comprises a plurality of first signal lines and a plurality of third pins. One end of the first signal line is electrically connected with the driving circuit. The third pin is arranged staggered with the second pin and located on a side of the first signal line away from the driving circuit. The third pin is electrically connected with at least part of the first pin.

[0008] Further, the circuit board further comprises a second trace layer. The second trace layer is arranged on a side of the substrate layer away from the first trace layer. The second trace layer comprises a plurality of second signal lines. Two ends of the second signal line are respectively electrically connected with the first signal line and the third pin.

[0009] Further, the third pin comprises a third crimping portion and a third transmission portion. The third crimping portion is electrically connected with the first crimping portion. The third transmission portion is located on a side of the third crimping portion away from the first signal line and is electrically connected with the third crimping portion. The third pin is arranged along a first direction and extends along a second direction perpendicular to the first direction. In the first direction, the width of the third crimping portion is greater than the width of the third transmission portion. Preferably, the orthographic projection of the third crimping portion on the display panel at least partially overlaps the orthographic projection of the corresponding first crimping portion on the display panel. Preferably, the orthographic projection of the third crimping portion on the display panel is located within the range of the orthographic projection of the corresponding first crimping portion on the display panel.

[0010] Further, a plurality of connection holes are arranged in the substrate layer. The second trace layer covers and fills the connection holes. Two ends of each second signal line are respectively provided with at least one connection hole. The orthographic projections of a plurality of connection holes corresponding to the same second signal line on the first trace layer are respectively located on the first signal line and the third pin. Preferably, the orthographic projection of the connection hole on the third pin is located on the third transmission portion.

[0011] Further, the distance between the first crimping portion corresponding to the second pin and the display area is greater than the distance between the first crimping portion corresponding to the third pin and the display area. Preferably, the first crimping portions in adjacent two first pins are arranged staggered.

[0012] Further, the first signal line and the second pin are arranged one by one in the first direction and extend along a second direction perpendicular to the first direction. Preferably, in the second direction, the length of the first signal line is less than the length of the second pin. Preferably, the distance between the third crimping portion and the driving circuit is greater than the distance between the second crimping portion and the driving circuit.

[0013] Further, the material of the substrate layer comprises a flexible insulating material. The material of the first trace layer and the second trace layer comprises a conductive metal. Preferably, the flexible insulating material comprises polyimide.

[0014] The application further provides a display device comprising the display module as described above.

[0015] The application has the advantages that the display module and the display device increase the pressing area between the pins of the display panel and the pins of the circuit board by widening the pins of the display module, thereby improving the fault tolerance of the offset between the display panel and the circuit board and reducing the risk of signal transmission abnormality or even burning due to the offset between the display panel and the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments description. Obviously, the drawings in the following description only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0017] Figure 1 FIG. 1 is a structural schematic diagram of the display module in the embodiment of the application;

[0018] Figure 2 FIG. 2 is a connection schematic diagram of the pins in the display panel and the pins in the circuit board in the embodiment of the application;

[0019] Figure 3 FIG. 3 is a cross-sectional structural schematic diagram of the display module at AA' line in the embodiment of the application; Figure 2

[0020] Figure 4 FIG. 4 is a cross-sectional structural schematic diagram of the display module at BB' line in the embodiment of the application; Figure 2

[0021] Figure 5 FIG. 5 is a structural schematic diagram of the first pin in the embodiment of the application;

[0022] Figure 6 FIG. 6 is a structural schematic diagram of the first trace layer in the embodiment of the application;

[0023] Figure 7 FIG. 7 is a connection schematic diagram of the second pin in the display panel and the pin in the circuit board in another embodiment of the application;

[0024] Figure 8 FIG. 8 is a connection schematic diagram of the third pin in the display panel and the pin in the circuit board in another embodiment of the application;

[0025] ​​The components in the figures are as follows:

[0026] Display module 1; display panel 100;

[0027] Display area AA; non-display area NA;

[0028] Circuit board 200; first trace layer 201;

[0029] Substrate layer 202; second trace layer 203;

[0030] First pin 10; first crimping portion 11;

[0031] First transmission portion 12; second pin 20;

[0032] Second crimping portion 21; second transmission portion 22;

[0033] Third pin 30; third crimping portion 31;

[0034] Third transmission portion 32; first signal line 40;

[0035] Connecting hole 50; second signal line 60;

[0036] Driving circuit 70. DETAILED DESCRIPTION

[0037] The preferred embodiments of the present application are described below with reference to the accompanying drawings, which demonstrate the present application can be implemented, and the application embodiments can completely introduce the present application to the person skilled in the art, so that the technical content of the present application is more clear and convenient to understand. The present application can be embodied in many different forms of application embodiments, and the protection scope of the present application is not limited to the embodiments mentioned in the text.

[0038] In the drawings, the components with the same structure are denoted by the same reference numerals, and the components with similar structure or function are denoted by similar reference numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present application does not limit the size and thickness of each component. In order to make the drawing clearer, the thickness of the components is appropriately exaggerated in some places in the drawings.

[0039] Furthermore, the description herein of any aspect of the application refers to the additional drawings that accompany the present application, which illustrate specific aspects of the application as it can be implemented. Directional terms as used herein—such as "upper," "lower," "front," "back," "left," "right," "in," "out," "side," and the like—are made only by reference to the additional drawings as they can be implemented, and are not intended to mean or imply that the referenced device or element must be in a specific orientation, constructed, and operated in a particular way to indicate or imply that the referenced device or element must be in a specific orientation, constructed, and operated in a particular way, and are thus not to be understood as limiting the present application. Furthermore, the terms "first," "second," "third," etc., are used only for descriptive purposes and do not connote or imply relative importance.

[0040] When certain elements are described as being "on" another element, they can be directly on the other element or intervening elements can also be present. When an element is described as being "mounted to" or "connected to" another element, it is understood that both "mounting" or "connection" can be direct or indirect mounting or connection through an intervening element.

[0041] In the related AMOLED (Active-Matrix Organic Light-Emitting Diode) display product, LTPO (Low Temperature Polycrystalline Oxide) or LTPS (Low Temperature Poly-Silicon) is mainly used as a semiconductor material to manufacture TFT (Thin Film Transistor) in the array substrate, and the TFT has a common problem of leakage, and the leakage of the TFT will cause a bright spot in the display picture. The main means to solve the bright spot in the display picture at present is to use a large voltage (1-10 times of the normal lighting voltage) and a large current (5-20 times of the normal lighting current) to age the TFT, so as to reduce the leakage current of the TFT, thereby achieving the purpose of eliminating the bright spot in the display picture. In the aging process, a circuit board is generally used for pressing the product, and if the product or the circuit board is pressed abnormally or causes a large voltage and a large current, the product and the circuit board will be burned, thereby causing the product and the circuit board to be scrapped, and after one product is burned, the subsequent products will be continuously burned, which causes batch abnormality of the products, seriously affects the qualified rate of the products, and increases the production cost.

[0042] Based on the technical problems described in the related display technology, a display module 1 is provided in the embodiment of the application, as shown in Figure 1As shown in FIG. 1, the display module 1 comprises a display panel 100 and a circuit board 200 electrically connected with the display panel 100. The display panel 100 is used to display an image, and the circuit board 200 is used to transmit a driving signal to the circuit in the display panel 100.

[0043] In the embodiment of the present application, the circuit board 200 can be a FPCB (Flexible Printed Circuit Board), which is used to transmit a driving signal with large voltage and large current to the display panel 100 in the aging process. In other embodiments of the present application, the circuit board 200 can also be a COF (Chip On Film), a PCB (Printed Circuit Board) or other circuit boards, which are directly used as a driving component in the display module 1 and electrically connected with the display panel 100 through a bonding process, so as to transmit a display signal to the display panel 100.

[0044] As shown in FIG. 1, the display panel 100 has a display area AA and a non-display area NA connected with the display area AA. In the display area AA, the display panel 100 comprises a TFT, a light emitting device and other circuit devices, which are driven by all the devices to make the display area AA present an image. In the non-display area NA, the display panel 100 is provided with a plurality of first pins 10, which are regularly arranged along a first direction X parallel to the boundary of the display area AA and electrically connected with the devices in the display area AA through a signal trace. The first pins 10 are used as a connection port of the display panel 100 to electrically connect the display panel 100 with a driving component outside the display panel 100, so as to drive or test the devices in the display area AA. Figure 2

[0045] As shown in FIG. 1, the display panel 100 has a display area AA and a non-display area NA connected with the display area AA. In the display area AA, the display panel 100 comprises a TFT, a light emitting device and other circuit devices, which are driven by all the devices to make the display area AA present an image. In the non-display area NA, the display panel 100 is provided with a plurality of first pins 10, which are regularly arranged along a first direction X parallel to the boundary of the display area AA and electrically connected with the devices in the display area AA through a signal trace. The first pins 10 are used as a connection port of the display panel 100 to electrically connect the display panel 100 with a driving component outside the display panel 100, so as to drive or test the devices in the display area AA. Figure 2 Figure 3 and Figure 4 ​​As shown in the figure, the circuit board 200 is arranged on one side of the display panel 100, which includes a first trace layer 201, a second trace layer 203 and a substrate layer 202. The first trace layer 201 is arranged on the surface of the substrate layer 202 facing the display panel 100, and the second trace layer 203 is arranged on the surface of the substrate layer 202 away from the display panel 100. The first trace layer 201 of the circuit board 200 is in contact with the first pin 10 of the display panel 100, so as to realize the signal transmission between the circuit board 200 and the display panel 100. The substrate layer 202 is used to insulate and isolate the first trace layer 201 and the second trace layer 203, so as to prevent short circuit between the first trace layer 201 and the second trace layer 203. The material of the first trace layer 201 and the second trace layer 203 includes metal with excellent conductivity, such as copper, silver, aluminum, titanium, molybdenum, nickel, etc. The material of the substrate layer 202 includes flexible insulating material, such as polyimide (PI) and the like.

[0046] The first trace layer 201 includes a plurality of second pins 20, a plurality of third pins 30 and a plurality of first signal lines 40. The second pins 20 and the first signal lines 40 are arranged in a staggered manner along the first direction X, and are parallel to each other along the second direction Y perpendicular to the first direction X, so as to be electrically connected with the driving circuit 70 in the circuit board 200. The third pins 30 are arranged on the side of the first signal lines 40 away from the driving circuit 70, and are arranged along the first direction X and extend along the second direction Y, and are arranged in a staggered manner with the second pins 20. The third pins 30 and the second pins 20 are respectively in contact with the surface of the corresponding first pins 10 away from the display panel 100. The second pins 20 and the third pins 30 transmit different types of signals, the second pins 20 are directly electrically connected with the driving circuit 70 in the circuit board 200, and the third pins 30 are indirectly electrically connected with the driving circuit 70 in the circuit board 200 through the second trace layer 203 and the first signal lines 40, so as to realize the transmission of different types of signals.

[0047] The second trace layer 203 includes a plurality of second signal lines 60, the plurality of second signal lines 60 are arranged along the first direction X and extend along the second direction Y, and the projections of the two ends of the second signal lines 60 on the substrate layer 202 overlap the first signal lines 40 and the third pins 30, respectively. The substrate layer 202 is provided with a plurality of connection holes 50, and each of the two ends of the second signal lines 60 is provided with at least one connection hole 50, and the projections of the connection holes 50 at the two ends of the same second signal line 60 on the first trace layer 201 are located on the first signal lines 40 and the third pins 30, respectively, that is, one end of each connection hole 50 is in communication with the second signal line 60, and the other end is in communication with the first signal line 40 or the third pin 30. The second signal line 60 covers and fills the corresponding connection hole 50, thereby realizing electrical connection with the corresponding first signal line 40 and third pin 30 through the connection hole 50. Preferably, the projection of the connection hole 50 on the third pin 30 is located on the third transmission part 32. The first signal line 40 and the third pin 30 are bridged by the corresponding second signal line 60, thereby preventing the phenomenon of short circuit between the first pin 10 originally connected with the second pin 20 and the third pin 30 after the displacement of the circuit board 200, that is, even if the offset occurs, the first pin 10 corresponding to the second pin 20 will only contact the surface of the substrate layer between the first signal line 40 and the third pin 30 and be disconnected, thereby reducing the risk of burning of the display panel 100 and the circuit board 200 due to short circuit.

[0048] Specifically, as shown in FIG. 1, Figure 5 Specifically, as shown in FIG. 1,

[0049] Specifically, as shown in FIG. 1, Figure 6As shown in FIG. 1, each second pin 20 has a second crimping portion 21 and a second transmission portion 22 electrically connected with the second crimping portion 21. The second crimping portion 21 corresponds to the first crimping portion 11, one end of the second transmission portion 22 is electrically connected with the first crimping portion 11, and the other end is electrically connected with the driving circuit 70 in the circuit board 200. The second crimping portion 21 is used for crimping with the first crimping portion 11, and the second transmission portion 22 is used for connecting the second crimping portion 21 with the driving circuit 70 in the driving circuit 70, so as to realize the signal transmission between the circuit board 200 and the display panel 100. Further, the width of the second crimping portion 21 in the first direction X is greater than the width of the second transmission portion 22 in the first direction X, so as to further increase the crimping area between the first pin 10 and the second pin 20, and also to reduce the metal abrasion generated by the second pin 20 during crimping, improve the reuse frequency and service life of the circuit board 200. Preferably, the orthogonal projection of the second crimping portion 21 on the display panel 100 at least partially overlaps the orthogonal projection of the corresponding first crimping portion 11 on the display panel 100, and the orthogonal projection of the second transmission portion 22 on the display panel 100 at least partially overlaps the orthogonal projection of the corresponding first transmission portion 12 on the display panel 100, so as to transmit accurate signals between the first pin 10 and the second pin 20 in the normal crimping state. Alternatively, the orthogonal projection of the second crimping portion 21 on the display panel 100 is located in the range of the orthogonal projection of the corresponding first crimping portion 11 on the display panel 100.

[0050] Each third pin 30 has a third crimping portion 31 and a third transmission portion 32 electrically connected with the third crimping portion 31. The third crimping portion 31 corresponds to the first crimping portion 11, one end of the third transmission portion 32 is electrically connected with the third crimping portion 31, and the other end is electrically connected with the second signal line 60 through the connecting hole 50 in the substrate layer 202, so as to realize the transmission of different driving signals between the third pin 30 and the second pin 20. Further, the width of the third crimping portion 31 in the first direction X is greater than the width of the third transmission portion 32 in the first direction X, so as to further increase the crimping area between the first pin 10 and the third pin 30, and also to reduce the metal abrasion generated by the third pin 30 during crimping, improve the reuse frequency and service life of the circuit board 200. Preferably, the orthogonal projection of the third crimping portion 31 on the display panel 100 at least partially overlaps the orthogonal projection of the corresponding first crimping portion 11 on the display panel 100, and the orthogonal projection of the third transmission portion 32 on the display panel 100 overlaps the orthogonal projection of the corresponding first transmission portion 12 on the display panel 100, so as to transmit accurate signals between the first pin 10 and the third pin 30 in the normal crimping state. Alternatively, the orthogonal projection of the third crimping portion 31 on the display panel 100 is located in the range of the orthogonal projection of the corresponding first crimping portion 11 on the display panel 100.

[0051] Further, the distance between the first crimping part 11 corresponding to the second pin 20 and the display area AA is greater than the distance between the first crimping part 11 corresponding to the third pin 30 and the display area AA, which causes the first crimping parts 11 in the two adjacent first pins 10 to be arranged staggeredly, so that when the first pins 10 are offset from the second pins 20 and the third pins 30, the phenomenon of simultaneous connection of different pins (i.e., the same first pin 10 is simultaneously connected to the second pin 20 and the third pin 30) does not occur, and there is more fault tolerance space. Further, the staggered arrangement of the first crimping parts 11 also causes the second crimping parts 21 and the third crimping parts 31 corresponding to the first crimping parts 11 to be arranged staggeredly, i.e., the distance between the third crimping part 31 and the driving circuit 70 is greater than the distance between the second crimping part 21 and the driving circuit 70, and the length of the first signal line 40 in the second direction Y is less than the length of the second pin 20 in the second direction Y.

[0052] In the display module 1 provided in the embodiment of the present application, two pins (i.e., the second pin 20 and the third pin 30) with different connection modes are arranged in the first wiring layer 201 of the circuit board 200 to realize transmission of different signals. In other embodiments of the present application, as shown in Figure 7 and Figure 8 , only the second pins 20 or the third pins 30 with different lengths and arranged at intervals can be arranged in the first wiring layer 201 of the circuit board 200, and only a single connection mode is used to electrically connect the first pins 10 of the display panel 100. The connection structure is similar to that of the display module 1 provided in the embodiment, and thus will not be described in detail here. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0053] In the embodiment of the present application, a display device, which can be an AMOLED display device, is also provided, and includes the display panel 100 as described above. The display device can be any display device with a display function, such as a mobile phone, a notebook computer, a tablet computer, etc.

[0054] In the embodiment of the present application, the pins in the display module are designed to be widened and shaped, so as to increase the crimping area between the pins of the display panel and the pins of the circuit board, thereby improving the fault tolerance rate of the display panel and the circuit board when they are offset, reducing the risk of signal transmission abnormality or even burning after the display panel and the circuit board are crimped and offset, and also reducing the crimping wear between the pins of the display panel and the pins of the circuit board, thereby prolonging the service life of the product. Meanwhile, in the embodiment of the present application, the widened parts of the pins in the display module are arranged staggeredly, so as to prevent the same pin from being simultaneously connected to two different pins, and further improve the fault tolerance rate of the display panel and the circuit board when they are offset.

[0055] While the application has been described with reference to particular embodiments, it is to be understood that the application is not limited to the particulars disclosed. Rather, it is a continuation of the principles and applications of the present application. It is therefore to be understood that numerous modifications, both as to the details and embodiments illustrated and the application defined by the appended claims, can be made as forms of the application. It is also to be understood that the terminology used herein is for the purpose of describing the particular embodiments only and is not intended to limit the scope of the present application which will be limited only by the appended claims. It is further understood that the features described in connection with one embodiment can be used in conjunction with another embodiment.

Claims

1. A display module, characterized in that, include: A display panel has a display area and a non-display area connected to the display area; The circuit board is electrically connected to the non-display area of ​​the display panel. The display panel includes a first pin, which is located in the non-display area, and the circuit board is electrically connected to the first pin. The first pin includes a first crimp portion and a first transmission portion electrically connected to the first crimp portion, wherein the width of the first crimp portion is greater than the width of the first transmission portion; The circuit board includes: Substrate layer; The first wiring layer is disposed on the side of the substrate layer close to the display panel and is electrically connected to the first pin; The second wiring layer is disposed on the side of the substrate layer opposite to the first wiring layer; The first routing layer includes: Multiple first signal lines, one end of which is electrically connected to the drive circuit of the circuit board; Multiple second pins, each of which is electrically connected to the drive circuit of the circuit board and at least a portion of the first pin; Multiple third pins are staggered from the second pins and located on the side of the first signal line away from the driving circuit, and the third pins are electrically connected to at least a portion of the first pins; The second trace layer includes a plurality of second signal lines, the two ends of which are electrically connected to the first signal line and the third pin, respectively.

2. The display module as described in claim 1, characterized in that, The second pin includes: The second crimping part is electrically connected to the first crimping part; The second transmission unit is electrically connected to the second crimping unit and the drive circuit. The width of the second crimping part is greater than the width of the second transmission part.

3. The display module as described in claim 2, characterized in that, The orthographic projection of the second pressing part on the display panel at least partially overlaps with the orthographic projection of the corresponding first pressing part on the display panel.

4. The display module as described in claim 3, characterized in that, The orthographic projection of the second pressing part on the display panel is located within the orthographic projection range of the corresponding first pressing part on the display panel.

5. The display module as described in claim 2, characterized in that, The third pin includes: The third crimping part is electrically connected to the first crimping part; The third transmission unit is located on the side of the third crimping part away from the first signal line and is electrically connected to the third crimping part; The third pin is arranged along a first direction and extends along a second direction perpendicular to the first direction; In the first direction, the width of the third crimping portion is greater than the width of the third transmission portion.

6. The display module as claimed in claim 5, wherein the orthographic projection of the third pressing portion on the display panel at least partially overlaps with the orthographic projection of the corresponding first pressing portion on the display panel.

7. The display module as claimed in claim 6, wherein the orthographic projection of the third pressing portion on the display panel is located within the orthographic projection range of the corresponding first pressing portion on the display panel.

8. The display module as described in claim 5, characterized in that, The substrate layer has a plurality of connection holes, the second trace layer covers and fills the connection holes, and each of the second signal lines has at least one connection hole at each end; The orthographic projections of the plurality of connection holes corresponding to the same second signal line on the first trace layer are respectively located on the first signal line and the third pin.

9. The display module as described in claim 8, characterized in that, The orthogonal projection of the connection hole on the third pin is located on the third transmission section.

10. The display module as described in claim 1, characterized in that, The distance between the first crimping portion corresponding to the second pin and the display area is greater than the distance between the first crimping portion corresponding to the third pin and the display area.

11. The display module as described in claim 10, characterized in that, The first crimping portions of two adjacent first pins are staggered.

12. The display module as described in claim 5, characterized in that, The first signal line and the second pin are spaced apart in the first direction and extend along a second direction perpendicular to the first direction.

13. The display module as described in claim 12, characterized in that, In the second direction, the length of the first signal line is less than the length of the second pin.

14. The display module as described in claim 12, characterized in that, The distance between the third crimping part and the driving circuit is greater than the distance between the second crimping part and the driving circuit.

15. The display module as described in claim 1, characterized in that, The substrate layer is made of a flexible insulating material; The materials of the first and second wiring layers include conductive metals.

16. The display module as described in claim 15, characterized in that, The flexible insulating material includes polyimide.

17. A display device, characterized in that, Includes the display module as described in any one of claims 1-16.

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