A borderless notebook display screen and its manufacturing method

Abstract

The present invention relates to the technical field of display screens, and discloses a borderless notebook display screen and a manufacturing method thereof. The method includes performing a structural analysis on the substrate of the display screen, performing COF packaging treatment on each of the initial area units, mounting Micro-LED chips on the preprocessing area units and performing selective pre-curing treatment, collecting in real time the temperature change data of the preliminarily mounted area units, grouping the area units with balanced temperature, performing overall curing and local solder joint correction on the pre-cured substrate, and performing color and brightness consistency calibration on the cured substrate to obtain a borderless notebook display screen with stable structure; by analyzing the thermal field baseline data of the display screen substrate and optimizing the manufacturing process of the display screen according to the thermal field distribution model, the problem of uneven stress on the welding points is solved; local overheating and deformation are effectively avoided, and the stability and display effect of the display screen during long-term use are ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of display screens, and more particularly, to a borderless notebook display screen and a manufacturing method thereof. Background Art

[0002] With the increasing trend of electronic devices towards being thinner, lighter, and more portable, especially in the fields of mobile devices such as laptop computers and smartphones, borderless display screens have become one of the design trends. Borderless notebook display screens are mainly characterized by ultra-narrow borders, which can not only provide a larger display area and a better visual experience but also be favored by consumers due to their unique appearance design. Borderless display screens usually adopt advanced display technologies such as OLED, LCD, Micro-LED, etc. to achieve high resolution, wide color gamut, and lower power consumption requirements.

[0003] Existing borderless notebook display screens mainly rely on packaging processes and thermal management technologies, but there are often problems of uneven stress on the welding points during the welding process. Specifically, due to uneven stress on the welding points, local overheating areas will be generated during the welding process, resulting in inconsistent thermal expansion, which in turn affects the long-term stability of the display screen. Especially during the curing stage, inaccurate temperature control leads to significant differences in temperature distribution in different regions, and some regions are prone to overheating, causing the display screen to deform and resulting in a decline in the display effect.

[0004] Therefore, it is necessary to provide a borderless notebook display screen and a manufacturing method thereof to solve the problem that the existing manufacturing of borderless notebook display screens easily causes the display screen to deform and results in a decline in the display effect. Summary of the Invention

[0005] The main object of the present invention is to provide a borderless notebook display screen and a manufacturing method thereof, aiming to solve the technical problems mentioned in the above background art.

[0006] The present invention adopts the following technical solutions:

[0007] A borderless notebook display screen and a manufacturing method thereof, comprising:

[0008] Performing a structural analysis on the substrate of the display screen to obtain the thermal field baseline data of the substrate, and dividing the substrate into a plurality of initial region units based on the thermal field baseline data to obtain the thermal field distribution model of each initial region unit;

[0009] Performing COF packaging treatment on each of the initial region units, generating a layout strategy for the driving circuit based on the thermal field distribution model, and integrating the driving circuit onto the flexible circuit board of the initial region unit to obtain a preprocessed region unit integrated with the driving circuit;

[0010] Mount Micro-LED chips on the preprocessed area units and perform selective pre-curing treatment, dynamically adjust the force distribution at the solder joints during the mounting process, and obtain the preliminarily mounted area units;

[0011] Collect the temperature change data of the preliminarily mounted area units in real time, construct a dynamic temperature change surface, perform piecewise integral calculation on the temperature change surface, and when the integral value exceeds the preset temperature threshold, perform pulse temperature compensation to obtain area units with temperature equilibrium;

[0012] Group the area units with temperature equilibrium, calculate the thermal stability of each group based on the thermal field distribution model, allocate different reflow temperature curves according to the thermal stability, and adjust the reflow temperature curve based on the plastic deformation trend of the solder joints to perform segmented reflow curing to obtain a pre-cured substrate;

[0013] Perform overall curing and local solder joint correction on the pre-cured substrate, and perform color and brightness consistency calibration on the cured substrate to obtain a borderless notebook display screen with stable structure.

[0014] Further, the step of performing structural analysis on the substrate of the display screen, obtaining the thermal field baseline data of the substrate, and dividing the substrate into multiple initial area units based on the thermal field baseline data to obtain the thermal field distribution model of each initial area unit includes:

[0015] Obtain the physical property data of the substrate of the display screen, where the physical property data includes the thermal conductivity, specific heat capacity, and structural thickness of the substrate, and perform thermal field simulation on the substrate based on the physical property data using the finite element analysis method to obtain thermal response simulation data;

[0016] According to the thermal response simulation data, select a set grid density to divide the substrate into multiple thermally equivalent area units;

[0017] Calculate the local temperature change of each thermally equivalent area unit to establish a global thermal field distribution map, and divide the substrate according to the global thermal field distribution map to obtain multiple initial area units;

[0018] Based on the temperature difference and thermal conductivity between the initial area units, perform thermal field optimization on the boundary fine-tuning of the initial area units through an iterative optimization algorithm, and perform dynamic adjustment according to the thermal stability of the initial area units to generate a thermal field distribution model.

[0019] Further, the step of performing thermal field optimization on the boundary fine-tuning of the initial area units through an iterative optimization algorithm based on the temperature difference and thermal conductivity between the initial area units, and performing dynamic adjustment according to the thermal stability of the initial area units to generate a thermal field distribution model includes:

[0020] Analyze the thermal response data of the initial region units, and use the principal component analysis method to reduce the dimensions of the temperature difference and thermal conductivity of each region to obtain thermal response characteristic data;

[0021] Based on the thermal response characteristic data, use the clustering algorithm to divide the initial region units into different thermal response groups;

[0022] Apply the iterative optimization algorithm to finely adjust the boundaries of each thermal response group to narrow the temperature difference between the thermal response groups, and adjust the boundary positions according to the thermal conductivity and boundary conditions of each thermal response group to obtain the optimized region boundaries;

[0023] Simulate the thermal field distribution of the optimized region boundaries, and eliminate potential deviations from the boundaries of the initial region units based on the simulation results to obtain an accurate thermal field distribution model;

[0024] According to the accurate thermal field distribution model, use the weighted average method to dynamically adjust the thermal stability of the initial region units, mark the initial region units with stability lower than the preset stability threshold and perform correction processing to generate a thermal field distribution model with high thermal stability and uniform thermal distribution.

[0025] Further, the steps of performing COF packaging processing on each of the initial region units, generating a layout strategy for the driving circuit based on the thermal field distribution model, and integrating the driving circuit onto the flexible circuit board of the initial region unit to obtain a preprocessed region unit integrated with the driving circuit include:

[0026] Perform surface pretreatment on each of the initial region units, and coat a conductive adhesive on the surface of each of the initial region units;

[0027] Calculate the thermal response characteristics of each initial region unit according to the thermal field distribution model, design a COF packaging structure in combination with the physical characteristic data, and generate a COF packaging scheme;

[0028] Based on the COF packaging scheme, dock the flexible circuit board with the surface of the initial region unit by the thin film laser packaging method to obtain a region unit with stable packaging;

[0029] Perform thermal field analysis on the region unit with stable packaging, and determine the local heat load distribution of each region unit according to the thermal response characteristics and thermal field distribution model of each region unit to obtain a heat load calculation model;

[0030] According to the heat load calculation model, a computer-aided design tool is used to generate a layout strategy for the drive circuit, and temperature-voltage coupling simulation analysis is performed on the layout strategy to obtain the current density distribution and temperature rise data of each regional unit, and the parameters of the layout strategy are adjusted to obtain the optimal layout strategy of the drive circuit;

[0031] Based on the optimal layout strategy, the drive circuit is soldered to the flexible circuit board of the initial regional unit to obtain a preprocessed regional unit integrated with the drive circuit.

[0032] Further, the step of mounting Micro-LED chips on the preprocessed regional unit and performing selective pre-curing treatment, and dynamically adjusting the force distribution at the solder joints during the mounting process to obtain a preliminarily mounted regional unit includes:

[0033] Measure the surface finish of the preprocessed regional unit to obtain surface roughness data, and generate an optimized surface treatment process for the preprocessed regional unit based on the surface roughness data;

[0034] Based on the optimized surface treatment process, the surface of the preprocessed regional unit is ion-treated to a preset standard to obtain a regional unit with a flat surface;

[0035] According to the regional unit with a flat surface, the mounting points of the Micro-LED chips are optimized based on the thermal field distribution model, and stress analysis is performed on each regional unit to adjust the mounting position of each Micro-LED chip to obtain a chip mounting scheme;

[0036] Perform dynamic mounting simulation on the chip mounting scheme, obtain the simulation results of the dynamic mounting simulation through finite element analysis, and dynamically adjust the welding temperature and pressure parameters according to the simulation results to obtain an optimized welding process;

[0037] Based on the optimized welding process, the Micro-LED chips are mounted on the regional unit with a flat surface, and the solder joints of the Micro-LED chips are locally heated to a predetermined curing temperature to obtain a preliminarily mounted regional unit.

[0038] Further, the step of real-time collecting the temperature change data of the preliminarily mounted regional unit, constructing a dynamic temperature change surface, performing piecewise integral calculation on the temperature change surface, and performing pulse temperature compensation when the integral value exceeds a preset temperature threshold to obtain a regional unit with temperature equilibrium includes:

[0039] Based on the temperature sensor array, the temperature change data at different positions of the preliminarily mounted area unit is collected in real time to construct a temperature data matrix, and the temperature data matrix is mapped to the temperature distribution of the preliminarily mounted area unit at different time points to obtain a temperature change data set;

[0040] The interpolation algorithm is used to smooth the temperature change data set to obtain a temperature change surface;

[0041] The temperature change surface is divided into multiple sub-regions, and the numerical integration method is used to integrate each sub-region to obtain the temperature change value of each sub-region. All the temperature change values are summarized to obtain the temperature integral value of the preliminarily mounted area unit;

[0042] The temperature integral value is compared with a preset temperature threshold to determine whether the temperature integral value exceeds the preset temperature threshold;

[0043] When the temperature integral value exceeds the preset threshold, dynamic pulse temperature compensation is performed on the preliminarily mounted area unit with a preset pulse heating time and a preset pulse intensity to obtain a region unit with temperature equilibrium.

[0044] Further, the steps of grouping the temperature-equilibrated area units, calculating the thermal stability of each group based on the thermal field distribution model, allocating different reflow temperature curves according to the thermal stability, and adjusting the reflow temperature curve based on the solder joint plastic deformation trend to perform segmented reflow curing to obtain a pre-cured substrate include:

[0045] Group the temperature-equilibrated area units, and calculate the heat capacity, thermal response time, and thermal expansion coefficient of each group of regions based on the thermal field distribution model to obtain the thermal stability data of each area unit;

[0046] According to the thermal stability data, the clustering analysis algorithm is used to classify each group of regions to obtain a classification result, so as to allocate different reflow curing temperature curves to different groups of regions;

[0047] According to the classification result, the regression analysis algorithm is used to generate different reflow temperature curves, and the reflow temperature curves are optimized through a regression model to obtain optimized reflow temperature curves;

[0048] According to the optimized reflow temperature curve, preliminary reflow curing treatment is performed on each group of regions, and the reflow temperature curve is fine-tuned based on a feedback control system to obtain a stable reflow curing region;

[0049] Calculate the stress state of the solder joints in the reflow curing area based on the plastic deformation trend of the solder joints, and adjust the heating section parameters of the reflow temperature curve according to the calculation results to perform optimized reflow curing treatment on each grouped area;

[0050] Perform temperature verification on the grouped areas after optimized reflow curing, and use an infrared thermal imager to detect the temperature distribution of each grouped area to make the temperature distribution of each grouped area uniform, obtaining a pre-cured substrate.

[0051] Further, the steps of performing overall curing and local solder joint correction on the pre-cured substrate, and performing color and brightness consistency calibration on the cured substrate to obtain a borderless notebook display screen with stable structure include:

[0052] Use a segmented temperature control strategy to heat and cool the pre-cured substrate, and adjust the heating rate and cooling rate based on the real-time temperature data during the segmented reflow curing process to obtain a cured substrate with uniform temperature distribution;

[0053] According to the solder joint distribution map of the cured substrate with uniform temperature distribution, perform optical detection on the local solder joints of the cured substrate based on an automatic optical detection system, and perform laser repair on the defective solder joints according to the detection results to obtain a fully cured substrate;

[0054] Scan the display area of the fully cured substrate based on a color analyzer, collect the color data of each pixel point, generate a preliminary calibration curve based on the color data to perform preliminary color adjustment on the fully cured substrate, obtaining a substrate with preliminary color calibration;

[0055] Perform point-by-point brightness measurement on the display area of the substrate with preliminary color calibration based on a brightness detection device, collect the brightness value data of each pixel point, and use a data fitting algorithm to generate a brightness compensation curve to adjust the driving current of each pixel point, obtaining a substrate with consistent brightness;

[0056] Use a dynamic calibration system to comprehensively analyze the display area of the substrate with consistent brightness, and correct the remaining color and brightness deviations to obtain a borderless notebook display screen with stable structure.

[0057] A borderless notebook display screen, characterized in that it adopts the manufacturing method described in any one of the above, including a display screen substrate and a Micro-LED chip array, the display screen substrate is provided with a flexible circuit board, and the Micro-LED chip array is connected to the flexible circuit board;

[0058] One end of the display screen substrate facing away from the Micro-LED chip array is provided with a heat dissipation component, and the heat dissipation component includes a heat sink and a heat conduction pipe. The heat sink is in contact with the display screen substrate, the heat conduction pipe is connected to the heat sink, and the heat conduction pipe is connected to the circuit board of the display screen substrate;

[0059] A housing is further provided on a side of the heat sink facing away from the display screen substrate, and the peripheral side of the heat sink and the heat conduction pipe are both connected to the inner wall of the housing.

[0060] Beneficial effects:

[0061] In the present invention, by analyzing the thermal field baseline data of the display screen substrate and optimizing the manufacturing process of the display screen according to the thermal field distribution model, the problem of uneven stress on the welding points is solved. The dynamic temperature of the pretreatment area unit is monitored, and a dynamic temperature change surface is constructed to analyze the temperature change in real time, which can timely adjust the stress distribution of the welding points, ensure uniform temperature distribution during the welding process, effectively avoid local overheating and deformation, and ensure the stability and display effect of the display screen during long-term use. In addition, by adjusting the differential reflow temperature curve and the plastic deformation trend of the solder joints, the reflow curing process is further optimized. By precisely controlling the reflow temperature and the thermal stability during the curing process, not only the overall stability of the display screen is improved, but also the problem of display screen deformation caused by uneven reflow curing is effectively reduced. Combining local correction during the welding process and color and brightness consistency calibration, the borderless notebook display screen reaches a higher standard in terms of color reproduction and brightness consistency, and finally ensures the high quality and performance of the display screen. Description of the drawings

[0062] Figure 1 is a schematic flow chart of a manufacturing method of a borderless notebook display screen of the present invention;

[0063] Figure 2 is an exploded structural schematic diagram of a borderless notebook display screen of the present invention.

[0064] Wherein: 1. Display screen substrate; 2. Micro-LED chip array; 3. Flexible circuit board; 4. Heat sink; 5. Heat conduction pipe; 6. Housing.

[0065] The realization, functional characteristics and advantages of the object of the present invention will be further described with reference to the embodiments and the drawings. Specific embodiments

[0066] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0067] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality of" means two or more unless otherwise specifically defined.

[0068] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected" and "coupled" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0069] In the present invention, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "under" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is lower than that of the second feature.

[0070] Referring to Figure 1 , the present invention provides a method for manufacturing a borderless notebook display screen, including:

[0071] S1: Conduct a structural analysis on the substrate of the display screen to obtain the thermal field baseline data of the substrate, and divide the substrate into a plurality of initial region units based on the thermal field baseline data to obtain the thermal field distribution models of the respective initial region units;

[0072] In step S1, the substrate of the display screen is first structurally analyzed to obtain its thermal field baseline data. The thermal field characteristics of the substrate have an important influence on the overall performance of the display screen. The finite element analysis method can be combined with an infrared thermal imager and an embedded thermal sensor to perform a multi-condition thermal field test on the substrate to obtain the thermal field baseline data of the substrate, which is used to construct a thermal field distribution model, and the substrate is divided into multiple initial area units based on the model. The principle of regional division is to ensure that the thermal field distribution of each unit is as uniform as possible, while considering the thermal expansion characteristics of the substrate under different working conditions. In this way, high-temperature hot spots or thermal stress concentration areas that may appear on the substrate can be identified in advance, thereby providing a basis for subsequent drive circuit layout and welding process optimization.

[0073] S2: performing COF packaging processing on each of the initial regional units, generating a layout strategy for the driving circuit based on the thermal field distribution model, integrating the driving circuit onto the flexible circuit board of the initial regional unit, and obtaining a pre-processing regional unit with an integrated driving circuit;

[0074] In step S2, each initial area unit is subjected to COF packaging processing, and a layout strategy for the driving circuit is formulated based on the aforementioned thermal field distribution model. COF packaging can integrate the driver chip directly onto the flexible circuit board, reduce the complexity of PCB connection, and improve the signal transmission speed and reliability. When laying out the driving circuit, the thermal field characteristics of each area unit are considered, and the driving circuits with higher heat generation are evenly distributed to avoid excessive local temperature affecting the circuit stability. In addition, during the packaging process, high-precision dispensing and welding technology are used to make the solder joints of the driver chip evenly stressed, reduce the risk of solder joint cracking or circuit failure, and improve the reliability and life of the COF package.

[0075] S3: Mounting the Micro-LED chip on the pre-treated regional unit and performing selective pre-curing treatment, dynamically adjusting the force distribution of the welding point during the mounting process, and obtaining a preliminarily mounted regional unit;

[0076] In step S3, the Micro-LED chip is mounted to the pre-treatment area unit and a selective pre-curing treatment is performed. During the mounting process, precision robotic arms and visual alignment systems are used to ensure the precise positioning of the Micro-LED chip on the substrate. In order to improve the welding quality, this step uses dynamic mounting pressure control technology to adjust the force distribution of the welding points during the mounting process according to the thermal expansion characteristics of the substrate area, and reduce the welding pressure in areas with greater thermal stress to avoid solder joint breakage or poor welding due to excessive local force. In addition, during the pre-curing process, low-temperature curing technology is used to initially fix the solder joints and ensure that the chip does not shift during the subsequent reflow curing process to improve welding consistency.

[0077] S4: Collect the temperature change data of the initially mounted area units in real time, construct a dynamic temperature change surface, perform piecewise integral calculation on the temperature change surface, and when the integral value exceeds the preset temperature threshold, perform pulse temperature compensation to obtain area units with balanced temperature;

[0078] In step S4, collect the temperature change data of the initially mounted area units in real time and construct a dynamic temperature change surface. This surface is based on the data of multiple-point temperature sensors and can accurately reflect the temperature changes in each area through interpolation calculation. In actual production, the temperature distribution may be uneven in different areas due to material differences or heat dissipation conditions. To solve this problem, in this step, perform piecewise integral calculation on the temperature change surface. When the integral value of a certain area exceeds the preset temperature threshold, the system will execute the pulse temperature compensation strategy, that is, precisely adjust the temperature of this area through the local temperature control system to make the overall temperature distribution tend to be balanced. This can effectively reduce the uneven thermal expansion and contraction of materials caused by local overheating, improve the reliability of the solder joints, and reduce the risk of substrate deformation.

[0079] S5: Group the area units with balanced temperature, calculate the thermal stability of each group based on the thermal field distribution model, allocate different reflow temperature curves according to the thermal stability, and adjust the reflow temperature curve based on the plastic deformation trend of the solder joints to perform segmented reflow curing to obtain a pre-cured substrate;

[0080] In step S5, group the area units with balanced temperature and calculate the thermal stability of each group based on the thermal field distribution model. Since the heat capacity, heat dissipation conditions, and soldering characteristics of different areas are different, a single reflow soldering curve cannot be used. Instead, different reflow temperature curves should be formulated according to the thermal stability of each area. For areas with lower thermal stability, reduce the heating rate and temperature shock to reduce the risk of solder joint stress concentration. In addition, adopt a segmented heating strategy during the reflow curing process, that is, first perform low-temperature preheating to gradually soften the solder joints, and then perform high-temperature curing to optimize the plastic deformation trend of the solder joints, reduce solder joint cracking or deformation, and improve the consistency and reliability of reflow curing.

[0081] S6: Perform overall curing and local solder joint correction on the pre-cured substrate, and perform color and brightness consistency calibration on the cured substrate to obtain a borderless notebook display screen with stable structure.

[0082] In step S6, the pre-cured substrate is subjected to overall curing and local solder joint correction, and color and brightness consistency calibration is performed. The overall curing adopts a uniform heat treatment process to eliminate the residual stress that may occur in the solder joints during the reflow process and improve the welding reliability. For local welding defects, such as solder joint collapse, voids, etc., this step fills or remelts the solder joints through laser repair technology to ensure that the quality of all solder joints meets the standard requirements. Finally, color and brightness consistency calibration is performed. Through precision optical detection equipment, the color and brightness parameters of each display unit are analyzed, and by fine-tuning the current and PWM signals of the driving circuit, pixel-level brightness and color consistency are achieved, which can ensure that the final display screen meets high standards in terms of brightness uniformity, color restoration ability, etc., and improve the user's visual experience.

[0083] In summary, by analyzing the thermal field baseline data of the display screen substrate and optimizing the manufacturing process of the display screen according to the thermal field distribution model, the problem of uneven stress on the welding points is solved. By dynamically monitoring the temperature of the pre-treatment area units, constructing a dynamic temperature change surface, and analyzing the temperature change in real time, the stress distribution of the welding points can be adjusted in a timely manner to ensure uniform temperature distribution during the welding process, effectively avoiding local overheating and deformation, and ensuring the stability and display effect of the display screen during long-term use. In addition, by adjusting the differential reflow temperature curve and the solder joint plastic deformation trend, the reflow curing process is further optimized. By precisely controlling the reflow temperature and the thermal stability during the curing process, not only the overall stability of the display screen is improved, but also the deformation problem of the display screen caused by uneven reflow curing is effectively reduced. Combining local correction during the welding process and color and brightness consistency calibration makes the borderless notebook display screen reach higher standards in terms of color restoration and brightness consistency, and finally ensures the high quality and performance of the display screen.

[0084] In one embodiment, the step of performing a structural analysis on the substrate of the display screen to obtain the thermal field baseline data of the substrate and dividing the substrate into a plurality of initial area units based on the thermal field baseline data to obtain the thermal field distribution model of each initial area unit includes:

[0085] Obtain the physical property data of the substrate of the display screen, where the physical property data includes the thermal conductivity, specific heat capacity, and structural thickness of the substrate, and perform a thermal field simulation on the substrate using the finite element analysis method based on the physical property data to obtain thermal response simulation data;

[0086] According to the thermal response simulation data, select a set grid density to divide the substrate into a plurality of thermally equivalent area units;

[0087] Calculate the local temperature change of each of the thermal equivalent region units to establish a global thermal field distribution map, and divide the substrate according to the global thermal field distribution map to obtain a plurality of initial region units;

[0088] Based on the temperature difference and thermal conductivity between the initial region units, optimize the thermal field by fine-tuning the boundaries of the initial region units through an iterative optimization algorithm, and dynamically adjust according to the thermal stability of the initial region units to generate a thermal field distribution model.

[0089] In the above embodiment, obtaining the physical property data of the display substrate is the basis for establishing the thermal field distribution model. The physical property data mainly includes thermal conductivity, specific heat capacity, and structural thickness, which determine the heat transfer ability of the substrate and its thermal response characteristics under different temperature conditions. Thermal conductivity determines the diffusion rate of heat in the substrate, specific heat capacity affects the heat storage capacity of the substrate, and structural thickness directly affects the overall thermal inertia. To improve the accuracy of the data, a laser thermal conductivity analyzer is used to measure the thermal conductivity, a differential scanning calorimeter is used to evaluate the specific heat capacity, and X-ray tomography technology is combined to accurately measure the thickness distribution of the substrate. Based on the above physical property data, the finite element analysis method (is used to simulate the thermal field of the substrate to obtain the thermal response data of the substrate under different working conditions. In this process, a thermal-structural coupling analysis model is used to simulate the heat transfer and thermal stress distribution of the substrate under different temperature gradients. For the Micro-LED chip mounting area, simulate the heat source power distribution during its working state, and combine the thermal diffusion characteristics of the substrate material to calculate the temperature change of the substrate per unit time. Through finite element analysis, thermal response simulation data can be obtained, which is used to predict the temperature distribution of the substrate under specific thermal loads and provide a basis for subsequent thermal region division.

[0090] Based on the thermal response simulation data, divide the substrate into a plurality of thermal equivalent region units, and adopt an adaptive grid meshing strategy, that is, dynamically adjust the grid density according to the local temperature gradient of the substrate. In the region where the temperature changes violently, the grid density is set higher to obtain more refined thermal field distribution data; while in the region with a lower temperature gradient, the grid density is appropriately reduced to reduce the amount of calculation. After the division, each thermal equivalent region unit can be regarded as an independent region with relatively uniform heat transfer characteristics.

[0091] Calculate the local temperature change of each thermal equivalent region unit and establish a global thermal field distribution map. Through time-sequential temperature analysis, the temperature evolution curve of the substrate at different time points can be obtained, and a complete temperature field mapping can be generated based on this. Based on this distribution map, the substrate is divided to obtain a plurality of initial region units. The division principle of the initial region units is to try to ensure uniform temperature distribution inside the unit while reducing the thermal gradient difference between regions.

[0092] Finally, based on the temperature difference and thermal conductivity between the initial regional units, an iterative optimization algorithm is used to finely adjust the boundaries of the initial regional units to further optimize the thermal field distribution. Specifically, in this step, thermal coupling finite element iterative calculation is used to analyze the heat transfer paths between different units and adjust the unit boundaries to make the heat flow direction more uniform. When the temperature gradient of a certain regional unit is too large, the boundary position is adjusted to reduce the temperature difference with the adjacent region, thereby improving the overall thermal stability. In addition, a dynamic adjustment strategy is also used to optimize the thermal field distribution model according to the thermal response characteristics of different units, so that the finally generated thermal field distribution model can not only accurately describe the thermal transfer characteristics of the substrate, but also provide an optimal thermal management solution for subsequent welding and packaging processes.

[0093] In one example, the step of optimizing the thermal field by finely adjusting the boundaries of the initial regional units through an iterative optimization algorithm based on the temperature difference and thermal conductivity between the initial regional units, and dynamically adjusting according to the thermal stability of the initial regional units to generate a thermal field distribution model includes:

[0094] Analyze the thermal response data of the initial regional units, and use the principal component analysis method to reduce the dimension of the temperature difference and thermal conductivity of each region to obtain thermal response characteristic data;

[0095] Based on the thermal response characteristic data, use the clustering algorithm to divide the initial regional units into different thermal response groups;

[0096] Apply the iterative optimization algorithm to finely adjust the boundaries of each thermal response group to narrow the temperature difference between the thermal response groups, and adjust the boundary position according to the thermal conductivity and boundary conditions of each thermal response group to obtain the optimized regional boundary;

[0097] Simulate the thermal field distribution of the optimized regional boundary, and eliminate potential deviations from the boundaries of the initial regional units based on the simulation results to obtain an accurate thermal field distribution model;

[0098] According to the accurate thermal field distribution model, use the weighted average method to dynamically adjust the thermal stability of the initial regional units, mark the initial regional units with stability lower than the preset stability threshold and perform correction processing to generate a thermal field distribution model with high thermal stability and uniform thermal distribution.

[0099] In the above embodiments, in-depth analysis is performed on the thermal response data of the initial regional units. The principal component analysis method is used to reduce the dimensions of the temperature difference, thermal conductivity, and heat flux density of each region, so as to extract key thermal response characteristic data. The dimension of the initial thermal response data is relatively high, and the complexity of directly performing optimization calculations is relatively large. Through principal component analysis, the core factors mainly affecting the thermal distribution can be extracted, such as the main temperature gradient direction and the strength of the heat conduction ability, thereby reducing calculation redundancy and improving the efficiency of subsequent clustering analysis.

[0100] After obtaining the thermal response characteristic data, the DBSCAN clustering algorithm is used to group the initial regional units to form different thermal response groups. The purpose of clustering is to classify regions with similar thermal response characteristics so that customized adjustments can be made for different thermal characteristic regions during optimization. Specifically, the Euclidean distance is used to calculate the thermal response similarity between the initial regional units, and regions with similar temperature gradients and thermal conductivities are classified into the same thermal response group.

[0101] The iterative optimization algorithm is applied to fine-tune the boundaries of each thermal response group to narrow the temperature difference between different thermal response groups. By adjusting the boundary positions of adjacent regions, the heat flux transmission is made more uniform, thereby reducing local thermal stress. During the boundary optimization process, if the thermal conductivity difference between two adjacent units is large, the boundary position is adjusted to appropriately expand the high-thermal-conductivity region and appropriately contract the low-thermal-conductivity region to balance the heat diffusion ability. In addition, for regions with high temperature gradients, Laplacian smoothing optimization is used in this step to further adjust the boundaries to reduce the temperature mutation at the boundaries and improve the overall thermal stability.

[0102] After optimizing the boundaries, the thermal field distribution of the optimized regional boundaries is simulated to verify the optimization effect and further correct potential thermal field deviations. The finite element simulation is used to calculate the adjusted thermal field distribution, and analyze whether there are still local temperature anomalies or thermal gradient mutations after optimization. If the simulation results show that there are still large temperature differences at some boundaries, the boundary conditions are re-adjusted, including optimizing the heat conduction path, adjusting the local heat dissipation structure, or optimizing the heat flux direction, etc., to ensure that the optimized thermal field distribution is more uniform. Finally, after eliminating potential deviations, a more accurate thermal field distribution model is obtained.

[0103] According to the accurate thermal field distribution model, the weighted average method is used to dynamically adjust the thermal stability of the initial regional units. Specifically, according to the temperature volatility, heat diffusion rate, and thermal conductivity uniformity of each region, the thermal stability weight is calculated, and the overall stability of the region is judged based on the weighted result. When the stability of a certain regional unit is lower than the preset stability threshold, correction processing is performed, including adjusting the boundary position of the region, optimizing the local heat dissipation structure, or adding a thermal buffer layer in the high-temperature region to enhance its thermal stability. After this dynamic adjustment process, a thermal field distribution model with high thermal stability and uniform thermal distribution is finally generated.

[0104] In this embodiment, the calculation expression is:

[0105]

[0106] Wherein, is the thermal field distribution model; is the current thermal field distribution matrix, representing the global thermal field distribution at the

[0107] t-th round of iteration before optimization, where each element corresponds to the temperature state of a certain regional unit; is the thermal gradient optimization step coefficient, is the regional boundary gradient operator, is the temperature gradient optimization term, represents the temperature difference matrix between adjacent regions, is the temperature optimization weight, is the thermal conductivity optimization term, represents the regional thermal conductivity difference matrix, is the thermal conductivity optimization weight; is the thermal stability correction term, is the stability scoring matrix of region i, is the stability weight, is the thermal stability correction weight, N is the number of regional units; is the finite element thermal simulation correction term, is the simulation correction weight, represents the corrected thermal field calculated by the finite element analysis.

[0108] In one embodiment, the steps of performing COF packaging on each of the initial regional units, generating a layout strategy for the driving circuit based on the thermal field distribution model, and integrating the driving circuit onto the flexible circuit board of the initial regional unit to obtain a preprocessed regional unit with an integrated driving circuit include:

[0109] Performing surface pretreatment on each of the initial regional units and coating a conductive adhesive on the surface of each of the initial regional units;

[0110] Calculate the thermal response characteristics of each initial regional unit according to the thermal field distribution model, design a COF packaging structure in combination with the physical property data, and generate a COF packaging solution;

[0111] Based on the COF packaging solution, dock the flexible circuit board with the surface of the initial regional unit through the thin-film laser packaging method to obtain a regional unit with stable packaging;

[0112] Conduct a thermal field analysis on the regional unit with stable packaging. According to the thermal response characteristics of each regional unit and the thermal field distribution model, determine the local heat load distribution of each regional unit to obtain a heat load calculation model;

[0113] According to the heat load calculation model, use computer-aided design tools to generate a layout strategy for the drive circuit, and conduct a temperature-voltage coupling simulation analysis on the layout strategy to obtain the current density distribution and temperature rise data of each regional unit, and adjust the parameters of the layout strategy to obtain the optimal layout strategy of the drive circuit;

[0114] Based on the optimal layout strategy, weld the drive circuit to the flexible circuit board of the initial regional unit to obtain a preprocessed regional unit integrated with the drive circuit.

[0115] In the above embodiment, surface pretreatment is performed on each initial regional unit, and a conductive adhesive is coated on its surface to improve the stability and reliability of electrical connection in the subsequent packaging process. Based on the thermal field distribution model, calculate the thermal response characteristics of each initial regional unit, and in combination with the physical property data of the display screen substrate, such as thermal conductivity, specific heat capacity, and thickness, design a highly targeted COF packaging structure, thereby generating a COF packaging solution that adapts to the thermal response requirements of different regions.

[0116] According to this packaging solution, accurately dock the flexible circuit board with the surface of the initial regional unit through thin-film laser packaging technology to form a stable packaging regional unit, ensuring thermal stability and mechanical strength during the packaging process. For each regional unit with stable packaging, conduct a detailed thermal field analysis, and in combination with the thermal response characteristics and the thermal field distribution model, determine the local heat load distribution of each regional unit, and construct a heat load calculation model to deeply understand the thermal stress and thermal gradient changes that each regional unit may encounter during operation, ensuring that the packaged regional unit will not cause performance degradation due to overheating or excessive temperature fluctuations.

[0117] Based on this heat load calculation model, a layout strategy for the drive circuit is generated using computer-aided design tools, and combined with temperature-voltage coupling simulation analysis, the current density distribution and temperature rise data of each regional unit are further obtained. During the simulation analysis process, according to the current density distribution in different regions, various parameters of the drive circuit layout strategy are adjusted to optimize the layout scheme, so that the drive circuits in each region can operate efficiently without exceeding the safe temperature threshold, avoiding drive circuit failures or performance degradation caused by local overheating. Finally, after obtaining the optimal layout strategy, the drive circuit is integrated onto the flexible circuit board through precision soldering technology to complete the integration and preliminary packaging of the drive circuit, obtaining the preprocessing regional unit, ensuring that this unit can provide a stable and uniform current distribution in practical applications and can adapt to the heat load requirements of different regions.

[0118] In one embodiment, the step of mounting the Micro-LED chip on the preprocessing regional unit and performing selective pre-curing treatment, and dynamically adjusting the force distribution at the solder joints during the mounting process to obtain the preliminarily mounted regional unit includes:

[0119] Measure the surface finish of the preprocessing regional unit to obtain surface roughness data, and generate an optimized surface treatment process for the preprocessing regional unit based on the surface roughness data;

[0120] Based on the optimized surface treatment process, perform ion treatment on the surface of the preprocessing regional unit to a preset standard to obtain a regional unit with a flat surface;

[0121] According to the regional unit with a flat surface, optimize the layout of the mounting points of the Micro-LED chip based on the thermal field distribution model, and perform stress analysis on each regional unit to adjust the mounting position of each Micro-LED chip to obtain a chip mounting scheme;

[0122] Perform dynamic mounting simulation on the chip mounting scheme, and obtain the simulation results of the dynamic mounting simulation through finite element analysis. According to the simulation results, dynamically adjust the welding temperature and pressure parameters to obtain an optimized welding process;

[0123] Mount the Micro-LED chip on the regional unit with a flat surface based on the optimized welding process, and locally heat the solder joints of the Micro-LED chip to a predetermined curing temperature to obtain the preliminarily mounted regional unit.

[0124] In the above embodiments, the surface of the preprocessing region unit is measured for surface finish to obtain surface roughness data, and then an optimized surface treatment process for the region unit is generated based on these roughness data. This can identify the minute defects and non-uniformities present on the surface, thereby formulating a set of targeted optimized surface treatment processes. Based on this optimized process, the ion treatment technology is used to perform surface treatment on the preprocessing region unit until its surface meets the preset flatness standard, ensuring a smooth and clean surface and reducing poor chip mounting or welding stress concentration caused by surface non-uniformities.

[0125] After obtaining a flat surface of the region unit, the layout of the mounting points of the Micro-LED chips is optimized in combination with the thermal field distribution model. By calculating the thermal response characteristics of different regions, the layout of the Micro-LED chips can be optimized to ensure that the mounting position of each chip meets the requirements of heat conduction and stress distribution. On this basis, the stress analysis method is used to perform a detailed analysis on each region unit, and the specific mounting position of each Micro-LED chip is adjusted to ensure uniform stress on the welding points during the welding process, thereby avoiding solder joint damage or chip failure caused by excessive local stress, and finally obtaining a reasonable chip mounting scheme.

[0126] Based on the formulated chip mounting scheme, dynamic mounting simulation is carried out, and the simulation results are obtained through finite element analysis (FEM). The simulation process can accurately simulate the heat distribution, pressure action, and stress on the welding points during the chip mounting process, thereby ensuring that there will be no problems of excessive temperature or pressure during the actual mounting process. Under the guidance of the simulation results, the welding temperature and pressure parameters are further adjusted to ensure that the heat load and stress distribution during the welding process are in an optimal state, reducing potential risks during the welding process. Finally, based on the optimized welding process, the Micro-LED chips are actually mounted on the surface-flat region units. During this process, the solder joints of the chips are locally heated to make the solder joints reach the predetermined curing temperature, ensuring that the welding points can be firmly connected and maintain long-term stability, thereby obtaining the preliminarily mounted region units.

[0127] In one embodiment, the steps of collecting the temperature change data of the preliminarily mounted region unit in real time, constructing a dynamic temperature change surface, performing piecewise integral calculation on the temperature change surface, and when the integral value exceeds the preset temperature threshold, performing pulse temperature compensation to obtain a region unit with temperature equilibrium include:

[0128] Based on the temperature sensor array, the temperature change data at different positions of the preliminarily mounted region unit are collected in real time to construct a temperature data matrix, and the temperature data matrix is mapped to the temperature distribution of the preliminarily mounted region unit at different time points to obtain a temperature change data set;

[0129] The temperature change data set is smoothed using an interpolation algorithm to obtain a temperature change surface;

[0130] The temperature change surface is divided into multiple segmented regions, and numerical integration is used to integrate each segmented region to obtain the temperature change value of each segmented region. All the temperature change values are summarized to obtain the temperature integral value of the preliminary mounting area unit;

[0131] The temperature integral value is compared with a preset temperature threshold to determine whether the temperature integral value exceeds the preset temperature threshold;

[0132] When the temperature integral value exceeds the preset threshold, dynamic pulse temperature compensation is performed on the preliminary mounting area unit with a preset pulse heating time and a preset pulse intensity to obtain a region unit with balanced temperature.

[0133] In the above embodiment, based on the temperature sensor array, temperature change data at different positions of the preliminary mounting area unit are collected in real time. By constructing a temperature data matrix, these data reflect the temperature distribution of the area unit at different time points, forming a complete temperature change data set.

[0134] An interpolation algorithm is used to smooth the temperature change data set to obtain a more accurate temperature change surface, ensuring that temperature fluctuations are effectively suppressed. The temperature change surface is divided into multiple segmented regions, and numerical integration is applied to integrate each segmented region to obtain the temperature change values of each region. The temperature change values of all regions are summarized, and finally the temperature integral value of the entire preliminary mounting area unit is calculated. The temperature integral value is compared with a preset temperature threshold to determine whether it exceeds the preset upper temperature limit. When the temperature integral value exceeds the preset threshold, the system activates a preset pulse heating strategy. By controlling the preset pulse heating time and intensity, dynamic temperature compensation is performed on the area unit to ensure temperature balance and avoid welding quality problems caused by local overheating.

[0135] In one embodiment, the step of grouping the region units with balanced temperature, calculating the thermal stability of each group based on the thermal field distribution model, allocating different reflow temperature curves according to the thermal stability, and adjusting the reflow temperature curve to perform segmented reflow curing based on the plastic deformation trend of the solder joints to obtain a pre-cured substrate includes:

[0136] Group the region units with balanced temperature, and calculate the heat capacity, thermal response time, and thermal expansion coefficient of each grouped region based on the thermal field distribution model to obtain the thermal stability data of each region unit;

[0137] Classify each grouped area through a clustering analysis algorithm based on the thermal stability data to obtain a classification result, so as to assign different reflow curing temperature curves to different types of grouped areas;

[0138] According to the classification result, use a regression analysis algorithm to generate a differentiated reflow temperature curve, and optimize the reflow temperature curve through a regression model to obtain an optimized reflow temperature curve;

[0139] Perform preliminary reflow curing treatment on each grouped area according to the optimized reflow temperature curve, and fine-tune the reflow temperature curve based on a feedback control system to obtain a stable reflow curing area;

[0140] Calculate the stress state of the solder joints in the reflow curing area based on the plastic deformation trend of the solder joints, and adjust the heating section parameters of the reflow temperature curve according to the calculation results to perform optimized reflow curing treatment on each grouped area;

[0141] Perform temperature verification on the grouped areas after optimized reflow curing, and use an infrared thermal imager to detect the temperature distribution of each grouped area to make the temperature distribution of each grouped area uniform, obtaining a pre-cured substrate.

[0142] In the above embodiment, the area units after temperature equalization are grouped, and the heat capacity, heat response time, and thermal expansion coefficient of each grouped area are calculated based on a thermal field distribution model, so as to obtain the thermal stability data of each area unit, providing a basis for the subsequent differentiated allocation of the reflow temperature curve. According to the thermal stability data, a clustering analysis algorithm is used to classify each grouped area, so as to formulate a reflow temperature curve with strong adaptability according to the thermal stability characteristics of different types.

[0143] According to the classification result, further use a regression analysis algorithm to generate a differentiated reflow temperature curve, and optimize the reflow temperature curve. Adjust the parameters of the temperature curve through a regression model to ensure that it can effectively adapt to the thermal requirements of different areas. On this basis, according to the optimized reflow temperature curve, perform preliminary reflow curing treatment on each grouped area, and at the same time fine-tune the reflow temperature curve through a feedback control system, and adjust the temperature parameters in real time to ensure stable temperature control in each area, and finally form a stable reflow curing area.

[0144] During the optimized reflow curing process, considering the plastic deformation trend of the solder joints, use a calculation model to analyze the stress state of the solder joints, and adjust the heating section parameters in the reflow temperature curve according to the analysis results to avoid plastic deformation of the solder joints caused by local overheating or uneven temperature, and further optimize the reflow curing treatment process. In the temperature verification stage, use an infrared thermal imager to detect the temperature distribution of each grouped area to ensure uniform temperature distribution in each area, thereby obtaining a pre-cured substrate and completing the optimization of the welding process.

[0145] In one embodiment, the steps of integrally curing the pre-cured substrate, locally correcting solder joints, and calibrating the color and brightness consistency of the cured substrate to obtain a borderless notebook display screen with stable structure include:

[0146] The pre-cured substrate is heated and cooled by using a segmented temperature control strategy, and the heating rate and cooling rate are adjusted based on the real-time temperature data during the segmented reflow curing process to obtain a cured substrate with uniform temperature distribution;

[0147] According to the solder joint distribution map of the cured substrate with uniform temperature distribution, the local solder joints of the cured substrate are optically detected based on an automatic optical detection system, and the defective solder joints are laser repaired according to the detection results to obtain a completed cured substrate;

[0148] Based on a color analyzer, the display area of the completed cured substrate is scanned to collect color data of each pixel point, and a preliminary calibration curve is generated based on the color data to perform preliminary color adjustment on the completed cured substrate to obtain a substrate with preliminary color calibration;

[0149] Based on a brightness detection device, the display area of the substrate with preliminary color calibration is measured point by point for brightness, the brightness value data of each pixel point is collected, and a data fitting algorithm is used to generate a brightness compensation curve to adjust the driving current of each pixel point to obtain a substrate with uniform brightness;

[0150] A dynamic calibration system is used to comprehensively analyze the display area of the substrate with uniform brightness, correct the remaining color and brightness deviations, and obtain a borderless notebook display screen with stable structure.

[0151] In the above embodiment, the pre-cured substrate is heated and cooled by using a segmented temperature control strategy, and the heating rate and cooling rate are dynamically adjusted based on the real-time temperature data during the segmented reflow curing process to ensure uniform temperature distribution, avoid local overheating or overcooling, and thus obtain a cured substrate with uniform temperature.

[0152] According to the solder joint distribution map of the cured substrate, the local solder joints of the substrate are detected by combining an automatic optical detection system, and the defective solder joints in the detection results are laser repaired to eliminate welding defects and ensure the solder joint quality, and finally a completed cured substrate is obtained. Based on a color analyzer, the display area of the completed cured substrate is scanned to collect the color data of each pixel point, and a preliminary calibration curve is generated according to these color data, and the substrate is preliminarily color-adjusted by adjusting the color parameters to obtain a substrate with preliminary color calibration.

[0153] After the color adjustment is completed, a brightness detection device is used to measure the brightness of the substrate after preliminary color calibration point by point, collect the brightness value data of each pixel point, and generate a brightness compensation curve through a data fitting algorithm to finely adjust the driving current of each pixel point, so as to achieve brightness consistency and ensure the brightness uniformity of the display screen. A dynamic calibration system is used to comprehensively analyze the substrate with consistent brightness, correct any remaining color and brightness deviations, and finally obtain a borderless notebook display screen with a stable structure, uniform color and brightness.

[0154] Referring to Figure 2 , the present invention also provides a borderless notebook display screen, which adopts the manufacturing method described in any one of the above, and includes a display screen substrate 1 and a Micro-LED chip array 2. The display screen substrate 1 is provided with a flexible circuit board 3, and the Micro-LED chip array 2 is connected to the flexible circuit board 3;

[0155] One end surface of the display screen substrate 1 facing away from the Micro-LED chip array 2 is provided with a heat dissipation component, and the heat dissipation component includes a heat sink 4 and a heat conduction pipe 5. The heat sink 4 is in contact with the display screen substrate 1, the heat conduction pipe is connected to the heat sink 4, and the heat conduction pipe is connected to the circuit board of the display screen substrate 1;

[0156] On the side of the heat sink 4 facing away from the display screen substrate 1, a housing 6 is further provided, and the periphery of the heat sink 4 and the heat conduction pipe 5 are both connected to the inner wall of the housing 6.

[0157] In the above embodiment, a flexible circuit board 3 is provided on the front surface of the display screen substrate 1, and the Micro-LED chip array 2 is connected to the flexible circuit board 3 to ensure the efficient transmission of circuit signals. A heat dissipation component is provided on the back surface of the display screen substrate 1, and the heat dissipation component includes a heat sink 4 and a heat conduction pipe 5. The heat sink 4 is in close contact with the display screen substrate 1, and can effectively conduct the heat generated on the substrate to the heat sink 4. The heat conduction pipe 5 is connected to the heat sink 4 and extends to the circuit board part of the display screen substrate 1, further enhancing the heat conduction efficiency. This heat dissipation design can ensure that under high load or long-term use, the internal temperature of the display screen is effectively reduced, preventing performance attenuation or failure caused by overheating.

[0158] The back surface of the heat sink 4 is provided with a housing 6, and the inner wall of the housing 6 is connected to the periphery of the heat sink 4 and the heat conduction pipe 5 to form a complete heat dissipation system, ensuring that heat can be quickly and evenly conducted out from the display screen substrate 1, while protecting the internal components from the external environment. This heat dissipation structure not only improves the working stability of the display screen, but also effectively extends the service life of the display screen, ensuring the durability of the display effect.

[0159] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a borderless notebook display screen, characterized in that: include: Performing structural analysis on a substrate of a display screen to obtain thermal field baseline data of the substrate, dividing the substrate into a plurality of initial area units based on the thermal field baseline data, and obtaining a thermal field distribution model of each initial area unit; Performing COF packaging processing on each of the initial regional units, generating a layout strategy for the drive circuit based on the thermal field distribution model, integrating the drive circuit onto the flexible circuit board of the initial regional unit, and obtaining a pre-processed regional unit with an integrated drive circuit; Mounting the Micro-LED chip on the pre-treated regional unit and performing a selective pre-curing treatment, dynamically adjusting the force distribution of the soldering point during the mounting process, and obtaining a preliminarily mounted regional unit; Real-time acquisition of temperature change data of the preliminarily mounted regional units, construction of a dynamic temperature change surface, slice-by-slice integral calculation of the temperature change surface, and when the integral value exceeds a preset temperature threshold, pulse temperature compensation is performed to obtain a temperature-balanced regional unit; The temperature-balanced regional units are grouped, the thermal stability of each group is calculated based on the thermal field distribution model, a differentiated reflow temperature curve is allocated according to the thermal stability, and the reflow temperature curve is adjusted based on the plastic deformation trend of the solder joint to perform segmented reflow curing to obtain a pre-cured substrate; The pre-cured substrate is cured as a whole and the local solder joints are corrected, and the cured substrate is calibrated for color and brightness consistency to obtain a frameless notebook display screen with a stable structure.

2. The method for manufacturing a borderless notebook display screen according to claim 1, characterized in that: The step of performing structural analysis on the substrate of the display screen to obtain thermal field baseline data of the substrate, dividing the substrate into a plurality of initial area units based on the thermal field baseline data, and obtaining a thermal field distribution model of each initial area unit includes: Acquiring physical property data of a substrate of a display screen, the physical property data including thermal conductivity, specific heat capacity and structural thickness of the substrate, and performing thermal field simulation on the substrate using a finite element analysis method based on the physical property data to obtain thermal response simulation data; According to the thermal response simulation data, selecting and setting a grid density to divide the substrate into a plurality of thermally equivalent area units; Calculating the local temperature change of each thermally equivalent regional unit to establish a global thermal field distribution map, and dividing the substrate according to the global thermal field distribution map to obtain a plurality of initial regional units; Based on the temperature difference and thermal conductivity between the initial regional unit regions, the thermal field is optimized by fine-tuning the boundaries of the initial regional unit through an iterative optimization algorithm, and dynamic adjustments are made according to the thermal stability of the initial regional unit to generate a thermal field distribution model.

3. The method for manufacturing a borderless notebook display screen according to claim 2, characterized in that: The step of optimizing the thermal field by fine-tuning the boundaries of the initial regional units based on the temperature difference and thermal conductivity between the initial regional units through an iterative optimization algorithm, and dynamically adjusting the thermal stability of the initial regional units to generate a thermal field distribution model includes: Analyzing the thermal response data of the initial regional unit, using the principal component analysis method to reduce the dimension of the temperature difference and thermal conductivity of each region, and obtaining thermal response characteristic data; Based on the thermal response characteristic data, the initial area units are divided into different thermal response groups using a clustering algorithm; Applying an iterative optimization algorithm to fine-tune the boundary of each thermal response group to reduce the temperature difference between the thermal response groups, and adjusting the boundary position according to the thermal conductivity and boundary conditions of each thermal response group to obtain an optimized regional boundary; Simulating the thermal field distribution of the optimized regional boundary, eliminating potential deviations of the boundary of the initial regional unit based on the simulation results, and obtaining an accurate thermal field distribution model; According to the precise thermal field distribution model, the thermal stability of the initial area unit is dynamically adjusted by using a weighted average method, and the initial area units whose stability is lower than a preset stability threshold are marked and corrected to generate a thermal field distribution model with high thermal stability and uniform thermal distribution.

4. The method for manufacturing a borderless notebook display screen according to claim 2, characterized in that: The steps of performing COF packaging processing on each of the initial regional units, generating a layout strategy of the driving circuit based on the thermal field distribution model, integrating the driving circuit onto the flexible circuit board of the initial regional unit, and obtaining a pre-processing regional unit with an integrated driving circuit include: Performing surface pretreatment on each of the initial area units, and coating a conductive adhesive on the surface of each of the initial area units; Calculate the thermal response characteristics of each initial area unit according to the thermal field distribution model, design the COF packaging structure in combination with the physical property data, and generate a COF packaging solution; Based on the COF packaging solution, a flexible circuit board is connected to the surface of the initial area unit by a thin film laser packaging method to obtain a stable packaging area unit; Performing thermal field analysis on the package stable regional unit, determining the local heat load distribution of each regional unit according to the thermal response characteristics and the thermal field distribution model of each regional unit to obtain a heat load calculation model; According to the heat load calculation model, a layout strategy for the drive circuit is generated using a computer-aided design tool, and a temperature-voltage coupling simulation analysis is performed on the layout strategy to obtain current density distribution and temperature rise data of each regional unit to adjust the parameters of the layout strategy and obtain the optimal layout strategy for the drive circuit; Based on the optimal layout strategy, the driving circuit is welded to the flexible circuit board of the initial area unit to obtain a pre-processing area unit of the integrated driving circuit.

5. The method for manufacturing a borderless notebook display screen according to claim 1, characterized in that: The step of mounting the Micro-LED chip on the pre-treated regional unit and performing a selective pre-curing treatment, dynamically adjusting the force distribution of the soldering point during the mounting process, and obtaining a preliminary mounted regional unit includes: Measuring the surface finish of the pre-processed area unit to obtain surface roughness data, and generating an optimized surface treatment process for the pre-processed area unit based on the surface roughness data; Based on the optimized surface treatment process, ion treatment is performed on the surface of the pre-treated regional unit to a preset standard to obtain a regional unit with a smooth surface; According to the flat surface area unit, the mounting points of the Micro-LED chips are optimized based on the thermal field distribution model, and the mounting position of each Micro-LED chip is adjusted by performing stress analysis on each area unit to obtain a chip mounting solution; Performing dynamic mounting simulation on the chip mounting scheme, and obtaining simulation results of the dynamic mounting simulation through finite element analysis, and dynamically adjusting welding temperature and pressure parameters according to the simulation results to obtain an optimized welding process; Based on the optimized welding process, the Micro-LED chip is mounted on the area unit with a flat surface, and the solder joints of the Micro-LED chip are locally heated to a predetermined curing temperature to obtain a preliminarily mounted area unit.

6. The method for manufacturing a borderless notebook display screen according to claim 1, characterized in that: The step of collecting the temperature change data of the initially mounted regional unit in real time, constructing a dynamic temperature change surface, performing a slice integral calculation on the temperature change surface, and performing pulse temperature compensation to obtain a temperature-balanced regional unit when the integral value exceeds a preset temperature threshold comprises: Based on the temperature sensor array, real-time temperature change data of different positions of the initially mounted regional unit are collected to construct a temperature data matrix, and the temperature data matrix is ​​mapped to the temperature distribution of the initially mounted regional unit at different time points to obtain a temperature change data set; An interpolation algorithm is used to smooth the temperature change data set to obtain a temperature change surface; The temperature change surface is divided into a plurality of slice regions, each slice region is integrated by a numerical integration method to obtain a temperature change value of each slice region, and all temperature change values ​​are summarized to obtain a temperature integral value of the preliminarily mounted regional unit; Comparing the temperature integral value with a preset temperature threshold to determine whether the temperature integral value exceeds the preset temperature threshold; When the temperature integral value exceeds a preset threshold, dynamic pulse temperature compensation is performed on the preliminarily mounted regional unit with a preset pulse heating time and a preset pulse intensity to obtain a regional unit with balanced temperature.

7. The method for manufacturing a borderless notebook display screen according to claim 1, characterized in that: The step of grouping the temperature-balanced regional units, calculating the thermal stability of each group based on the thermal field distribution model, allocating differentiated reflow temperature curves according to the thermal stability, and adjusting the reflow temperature curves based on the plastic deformation trend of the solder joints to perform segmented reflow curing to obtain a pre-cured substrate includes: The temperature-balanced regional units are grouped, and the heat capacity, thermal response time and thermal expansion coefficient of each grouped region are calculated based on the thermal field distribution model to obtain thermal stability data of each regional unit; Classifying each grouping area by a cluster analysis algorithm according to the thermal stability data to obtain a classification result, so as to assign different reflow curing temperature curves to grouping areas of different categories; According to the classification results, a regression analysis algorithm is used to generate a differentiated reflow temperature curve, and the reflow temperature curve is optimized by a regression model to obtain an optimized reflow temperature curve; Performing preliminary reflow curing treatment on each grouping area according to the optimized reflow temperature curve, and fine-tuning the reflow temperature curve based on a feedback control system to obtain a stable reflow curing area; Calculating the stress state of the solder joints in the reflow curing area based on the plastic deformation trend of the solder joints, and adjusting the heating section parameters of the reflow temperature curve according to the calculation results to optimize the reflow curing process for each grouping area; The temperature of the grouped areas after the optimized reflow curing is verified, and the temperature distribution of each grouped area is detected by using an infrared thermal imager to make the temperature distribution of each grouped area uniform, thereby obtaining a pre-cured substrate.

8. The method for manufacturing a borderless notebook display screen according to claim 1, characterized in that: The steps of overall curing and local solder joint correction of the pre-cured substrate, and color and brightness consistency calibration of the cured substrate to obtain a frameless notebook display screen with a stable structure include: A segmented temperature control strategy is used to heat and cool the pre-cured substrate. The heating rate and cooling rate are adjusted based on the real-time temperature data during the segmented reflow curing process to obtain a cured substrate with uniform temperature distribution. According to the solder point distribution diagram of the solidified substrate with uniform temperature distribution, optically inspect the local solder points of the solidified substrate based on an automatic optical inspection system, and laser repair the defective solder points according to the inspection results to obtain a perfect solidified substrate; Scanning the display area of ​​the perfect-cured substrate with a color analyzer to collect color data of each pixel, generating a preliminary calibration curve based on the color data, and performing preliminary color adjustment on the perfect-cured substrate to obtain a substrate with preliminary color calibration; Based on the brightness detection device, the display area of ​​the substrate subjected to the preliminary color calibration is measured point by point, the brightness value data of each pixel is collected, and a brightness compensation curve is generated by using a data fitting algorithm to adjust the driving current of each pixel to obtain a substrate with consistent brightness; A dynamic calibration system is used to comprehensively analyze the display area of ​​the substrate with uniform brightness, correct the residual color and brightness deviations, and obtain a frameless notebook display screen with a stable structure.

9. A borderless notebook display screen, characterized in that: The manufacturing method according to any one of claims 1 to 7 comprises a display screen substrate and a Micro-LED chip array, wherein the display screen substrate is provided with a flexible circuit board, and the Micro-LED chip array is connected to the flexible circuit board; A heat dissipation component is disposed on one end surface of the display screen substrate facing away from the Micro-LED chip array, the heat dissipation component includes a heat sink and a heat pipe, the heat sink abuts against the display screen substrate, the heat pipe is connected to the heat sink, and the heat pipe is connected to the circuit board of the display screen substrate; A shell is also provided on the side of the heat sink facing away from the display screen substrate, and the peripheral side of the heat sink and the heat pipe are both connected to the inner wall of the shell.

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