Hard disk cold plate, hard disk liquid cooling system and electronic equipment

Abstract

The invention provides a hard disk cold plate, a hard disk liquid cooling system and electronic equipment, and relates to the field of heat exchange. A hard disk cold plate comprises a plate body, the rear end of the plate body is provided with a cold plate liquid inlet, a cold plate liquid outlet, a liquid cooling flow channel communicated with the cold plate liquid inlet and the cold plate liquid outlet and at least two hard disk heat dissipation areas, and each hard disk heat dissipation area corresponds to a hard disk module; a cold plate heat conduction pad; a hollow area is formed in the middle of the pressing piece, the cold plate heat conduction pad is clamped by the plate body and the pressing piece, and the cold plate heat conduction pad is exposed out of the hollow area; wherein an inclined plane groove extending from the rear end of the plate body to the front end of the plate body is formed in the plate body, and the depth of the inclined plane groove located at the rear end of the plate body is smaller than that of the inclined plane groove located at the front end of the plate body. Through the structure, the maintainability of the hard disk module in the electronic equipment can be improved.

Description

Technical Field

[0001] The present invention relates to the field of mechanical technology, and in particular to a hard disk cold plate, a hard disk liquid cooling system, and an electronic device. Background Art

[0002] With the development of electronic technology, the heat generated by electronic equipment has gradually increased, and air cooling can hardly meet the heat dissipation needs of electronic equipment. Therefore, liquid cooling with higher heat dissipation efficiency has gradually been applied to electronic equipment.

[0003] In electronic devices with high density of components, hard disks, as one of the heat generating components, also need liquid cooling to dissipate heat. In order to improve the heat dissipation effect of liquid cooling, the cold plate and hard disk need to fit closely. However, due to the high maintenance requirements of some electronic devices, the hard disks in them need to be hot-swapped. The close fit between the cold plate and the hard disk will increase the difficulty of plugging and unplugging the hard disks in high-density settings, reducing the maintainability of the hard disks in electronic devices. Summary of the invention

[0004] In order to overcome the problems existing in the related art, this specification provides a hard disk cold plate, a hard disk liquid cooling system and an electronic device.

[0005] According to a first aspect of an embodiment of this specification, a hard disk cold plate is provided, comprising:

[0006] A plate body, wherein the rear end of the plate body is provided with the cold plate liquid inlet, the cold plate liquid outlet, a liquid cooling channel connecting the cold plate liquid inlet and the cold plate liquid outlet, and at least two hard disk heat dissipation areas, wherein each hard disk heat dissipation area corresponds to a hard disk module;

[0007] Cold plate thermal pad;

[0008] A pressing sheet, wherein a hollow area is formed in the middle of the pressing sheet, the plate body and the pressing sheet clamp the cold plate thermal pad, and the cold plate thermal pad is exposed in the hollow area;

[0009] Wherein, a bevel groove extending from the rear end of the plate body to the front end of the plate body is formed on the plate body, and the depth of the bevel groove located at the rear end of the plate body is smaller than the bevel groove located at the front end of the plate body.

[0010] Optionally, the liquid cooling channel includes a first section connected to the cold plate liquid inlet and extending from the cold plate liquid inlet to the front end of the plate body, and a second section extending back and forth between the left and right sides of the plate body and connected to the cold plate liquid outlet.

[0011] Optionally, a plurality of the cold plate thermal pads and the pressing plates are provided, and each of the cold plate thermal pads and the pressing plates corresponds to a hard disk heat dissipation zone.

[0012] Optionally, the bevel groove comprises:

[0013] Clamping part;

[0014] A buffer section extending from the rear end of the plate body to the clamping portion;

[0015] A receiving section extending from the clamping portion to the front end of the plate body;

[0016] Among them, the depth of the buffer section gradually increases from the clamping portion to the rear end of the plate body, and the depth of the receiving section gradually increases from the clamping portion to the front end of the plate body. The maximum depth of the buffer section is less than the maximum depth of the receiving section, and the depth of the clamping portion is less than the depth of the buffer section and the depth of the receiving section.

[0017] According to a second aspect of an embodiment of this specification, a node liquid cooling system is provided, which is applied to an electronic device, including:

[0018] At least one hard disk cold plate as described in any one of the above items;

[0019] A support frame is arranged on both sides of the hard disk cold plate and between adjacent hard disk heat dissipation areas on the hard disk cold plate;

[0020] A liquid inlet collector and distributor, arranged on a side of a cold plate liquid inlet of the electronic device close to the hard disk cold plate, and respectively connected to the at least one hard disk cold plate;

[0021] A liquid outlet collector and distributor is arranged on a side of a cold plate liquid outlet of the electronic device close to the hard disk cold plate, and is respectively connected to the at least one hard disk cold plate;

[0022] The circulation water collector and water distributor is arranged on a side of the electronic device away from the hard disk cold plate, is connected to the liquid inlet water collector and the liquid outlet water collector and water distributor respectively, and is connected to an external circulation pipeline.

[0023] According to a third aspect of the embodiments of this specification, an electronic device is provided, including:

[0024] The node liquid cooling system as described above; and

[0025] The hard disk module corresponds to the hard disk heat dissipation area on the hard disk cold plate in the node liquid cooling system.

[0026] Optionally, the electronic equipment also includes:

[0027] Hard disk backplane;

[0028] Wherein, the cold plate liquid inlet and the cold plate liquid outlet are arranged on the outer side of the hard disk backplane.

[0029] Optionally, the hard disk module includes:

[0030] Hard disk box, clamping the hard disk to be cooled;

[0031] Hard disk thermal pad;

[0032] A hard disk heat conducting plate, a hard disk box, the hard disk heat conducting pad and the hard disk heat conducting plate are stacked.

[0033] Optionally, a bevel portion corresponding to the bevel groove on the hard disk cold plate is formed on the lower surface of the hard disk heat conduction plate.

[0034] Optionally, the hard disk heat conduction plate is screwed to the hard disk to be cooled, and the hard disk to be cooled and the hard disk heat conduction plate clamp the hard disk thermal pad.

[0035] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0036] In the embodiment of the present specification, a bevel groove is opened on the hard disk cold plate, and the cold plate thermal pad is pressed into the bevel groove by a pressing sheet. In the process of pushing the hard disk module into the electronic device, the resistance gradually increases with the decrease of the bevel depth, and finally a stable clamping force is obtained. In the process of removing the hard disk module from the electronic device, the resistance gradually decreases with the increase of the bevel depth, and finally the hard disk module can be easily disassembled, so that the electronic device can reliably and smoothly realize the installation and removal of the hard disk module, thereby improving the maintainability of the hard disk module in the electronic device.

[0037] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0039] Figure 1 It is a structural schematic diagram of a hard disk cold plate involved in this application;

[0040] Figure 2 It is a schematic structural diagram of a cold liquid channel in a hard disk cold plate involved in an embodiment of the present application;

[0041] Figure 3 is a structural schematic diagram of a hard disk cold plate involved in an embodiment of the present application, wherein the hard disk module corresponds to the hard disk cold plate;

[0042] Figure 4 It is a structural schematic diagram of a hard disk cold plate involved in an embodiment of the present application, wherein the pressing plate and the cold plate thermal pad are separately arranged;

[0043] Figure 5 is a cross-sectional side view of an electronic device involved in an embodiment of the present application;

[0044] Figure 6 It is a structural schematic diagram of a hard disk liquid cooling system involved in an embodiment of the present application;

[0045] Figure 7 It is a structural schematic diagram of an electronic device involved in an embodiment of the present application;

[0046] Figure 8 It is a structural schematic diagram of a hard disk module involved in an implementation manner of the present application. DETAILED DESCRIPTION

[0047] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this specification. Instead, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.

[0048] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this specification. The singular forms "a", "the" and "the" used in this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0049] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this specification, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0050] The present application provides a hard disk cold plate 100, such as Figure 1-3 As shown, including:

[0051] The plate body 1, the rear end 1B of the plate body 1 is provided with the cold plate liquid inlet 10, the cold plate liquid outlet 11, the liquid cooling channel 12 connecting the cold plate liquid inlet 10 and the cold plate liquid outlet 11, and at least two hard disk heat dissipation areas 13, wherein each hard disk heat dissipation area 13 corresponds to a hard disk module, and the hard disk heat dissipation area 13 can be a plurality of areas divided on the plate body 1, and each hard disk heat dissipation area 13 can be spaced a distance apart;

[0052] The cold plate thermal pad 2 can be integrally formed or split-formed. The integrally formed cold plate thermal pad 2 can cover the plate body 1, and the split-formed cold plate thermal pad 2 can cover each hard disk heat dissipation area 13 on the plate body 1. The cold plate thermal pad 2 can be pressed from a thermally conductive material with a certain flexibility. In addition, in order to prevent the cold plate thermal pad 2 from being damaged during friction, the outer side of the cold plate thermal pad 2 can also be wrapped with a layer of metal film;

[0053] A pressing sheet 3, a hollow area 3A is formed in the middle of the pressing sheet 3, the plate body 1 and the pressing sheet 3 clamp the cold plate thermal pad 2, and the cold plate thermal pad 2 is exposed in the hollow area 3A, that is, each edge of the pressing sheet 3 presses the cold plate thermal pad 2 to provide a partial clamping force, and the cold plate thermal pad 2 corresponding to the hollow area 3A is squeezed out to achieve that the protruding height of the cold plate thermal pad 2 is not less than the height of each edge of the pressing sheet 3;

[0054] A bevel groove 14 extending from the rear end 1B of the plate body 1 to the front end 1A of the plate body 1 is formed on the plate body 1 , and the depth of the bevel groove 14 located at the rear end 1B of the plate body 1 is smaller than the bevel groove 14 located at the front end 1A of the plate body 1 .

[0055] It should be noted that the depth of the bevel groove 14 can be gradually decreasing from the rear end 1B to the front end 1A of the plate body 1, or the depth can be reduced from the rear end 1B of the plate body 1 to the middle area, and then gradually increase from the middle area to the front end 1A, so as to keep the depth of the front end 1A larger and the depth of the rear end 1B smaller.

[0056] When a hard disk module 200 needs to be cooled, a hard disk module 200 is inserted into an electronic device and corresponds to a hard disk cooling area 13, so that the cold plate thermal pad 2 set on the hard disk cooling area 13 can fit the hard disk module 200 to achieve reliable liquid cooling.

[0057] A bevel groove is opened on the hard disk cold plate, and the cold plate thermal pad is pressed into the bevel groove by a pressing sheet. In the process of pushing the hard disk module into the electronic device, the resistance gradually increases with the decrease of the bevel depth, and finally a stable clamping force is obtained. In the process of taking the hard disk module out of the electronic device, the resistance gradually decreases with the increase of the bevel depth, and finally the hard disk module can be easily disassembled, so that the electronic device can reliably and smoothly realize the installation and removal of the hard disk module, thereby improving the maintainability of the hard disk module in the electronic device.

[0058] Optional, such as Figure 2 As shown, the liquid cooling channel 12 includes a first section 12A connected to the cold plate liquid inlet 10 and extending from the cold plate liquid inlet 10 to the front end of the plate body 1, and a second section 12B extending back and forth between the left side 1C and the right side 1D of the plate body 1 and connected to the cold plate liquid outlet 11.

[0059] exist Figure 2 A first direction X and a second direction Y may be specified, the first direction X is the left-right direction of the board body 1, and the second direction Y is the front-back direction of the board body 1. The front end 1A of the board body 1 and the rear end 1B of the board body 1 correspond to the second direction Y of the board body 1, and the left side 1C of the board body 1 and the right side 1D of the board body 1 correspond to the first direction X.

[0060] Since the temperature of the cold liquid is the lowest when it enters the liquid cooling channel 12, the heat dissipation effect is the best. In order to balance the overall heat dissipation effect of the hard disk cold plate 100, the liquid cooling channel 12 first extends from the cold liquid inlet 10 to the front end 1A of the plate body 1, and then extends from the front end 1A to the other side along the first direction X, such as Figure 2 As shown, it extends from the right side 1D to the left side 1C, and when it reaches the edge of the left side 1C of the plate body 1, it extends a distance to the rear end 1B, and then starts to extend from the left side 1C to the right side 1D, and when it reaches the position of the right side 1D of the plate body 1 close to the first section 12A, it extends a distance to the rear end 1B, and it goes back and forth until it reaches the cold liquid outlet 11. The reason for this arrangement is that the main heating area of ​​the hard disk module 200 is located at its front part, so the low-temperature cold liquid first flows to the main heating area of ​​the hard disk module 200 for heat dissipation, so as to achieve the demand of taking away more heat and improve the heat dissipation efficiency of the hard disk cold plate for the hard disk module.

[0061] Of course, the extension method of the liquid cooling channel 12 in the plate body 1 is not limited to this. It can also be that a plurality of branch channels are branched out along the first direction X during the extension process from the cold liquid inlet 10 at the rear end 1B of the plate body 1 to the front end 1A, and flow out from the cold liquid outlet 11 after confluence, etc., which can be set according to actual needs.

[0062] Optional, such as Figure 4As shown, a plurality of the cold plate thermal pads 2 and the pressing plates 3 are provided, and each of the cold plate thermal pads 2 and the pressing plates 3 corresponds to a hard disk heat dissipation area 13 .

[0063] The cold plate thermal pad 2 and the pressing plate 3 are formed in a separate manner. A cold plate thermal pad 2 and a pressing plate 3 can form a group, and each group corresponds to a hard disk heat dissipation area 13. Through such a setting, the cold plate thermal pad 2 and the pressing plate 3 can have a better fit with the bevel groove 14 set on the hard disk heat dissipation area 13, thereby further improving the heat dissipation efficiency of the hard disk cold plate to the hard disk module.

[0064] Optionally, the bevel groove 14, such as Figure 5 As shown, including:

[0065] A clamping portion 140;

[0066] A buffer section 141 extending from the rear end 1B of the plate body 1 to the clamping portion 140;

[0067] A receiving section 142 extending from the clamping portion 140 to the front end 1A of the plate body 1;

[0068] Among them, the depth of the buffer section 141 gradually increases from the clamping portion 140 to the rear end 1B of the plate body 1, and the depth of the receiving section 142 gradually increases from the clamping portion 140 to the front end 1A of the plate body 1. The maximum depth of the buffer section 141 is less than the maximum depth of the receiving section 142, and the depth of the clamping portion 140 is less than the depth of the buffer section 141 and the depth of the receiving section 142.

[0069] By providing the inclined groove 14 , the fastening force can be gradually increased when the hard disk module is pushed into the electronic device, and the fastening force can be gradually and smoothly released when the hard disk module is pushed out of the electronic device.

[0070] However, in some cases, if the bevel groove 14 is set to form a single slope from the rear end 1B of the plate body 1 to the front end 1A of the plate body 1, such as when the electronic device vibrates or is hit, the connection between the hard disk module and the electronic device may become loose or difficult to maintain after detachment, causing the hard disk module to fall and be damaged.

[0071] In order to avoid the above-mentioned problem, a clamping portion 140 may be provided on the bevel groove 14. The clamping portion 140 has the shallowest depth in the bevel groove 14. The distance from the top of the clamping portion 140 to the bottom of the hard disk cold plate 100 of the previous layer or to the upper side wall of the electronic device is equal to or slightly greater than the height of the hard disk module, so that the clamping portion 140 and the bottom of the hard disk cold plate 100 of the previous layer or to the upper side wall of the electronic device can achieve a fastening force on the hard disk module.

[0072] Furthermore, in the process of pushing the hard disk module into the electronic device, in order to avoid causing the hard disk module to be subjected to a large fastening force starting from the clamping portion 140, which would result in obstruction in pushing the hard disk module into the electronic device, the bevel groove 14 from the bevel groove 14 to the rear end 1B of the plate body 1 can tend to increase in depth to alleviate the insertion resistance of the hard disk module and to enable the hard disk module to be pushed into the electronic device more smoothly in the later stage.

[0073] Correspondingly, the present application also provides a node liquid cooling system 300, such as Figure 6 As shown, it is applied to electronic equipment, including:

[0074] At least one hard disk cold plate 100 as described above, the hard disk cold plates 100 are stacked in the vertical direction, and the interval between adjacent hard disk cold plates 100 is the height of a hard disk module 200 or slightly greater than the height of a hard disk module 200;

[0075] The support frame 4 is arranged on both sides of the hard disk cold plate 100 (i.e., the left side 1C and the right side 1D of the plate body 1) and between adjacent hard disk heat dissipation areas 13 on the hard disk cold plate 100, that is, the support frame 4 divides the adjacent hard disk heat dissipation areas 13, and provides support between two adjacent hard disk cold plates 100 in the up and down directions and between the hard disk cold plate 100 and the upper side wall of the electronic device;

[0076] The liquid inlet collector and distributor 50 is arranged on the side of the cold plate liquid inlet 10 of the electronic device close to the hard disk cold plate 100, and is respectively connected to the at least one hard disk cold plate 100;

[0077] The liquid outlet collector and distributor 51 is disposed on the side of the cold plate liquid outlet 11 of the electronic device close to the hard disk cold plate 100 and is respectively connected to the at least one hard disk cold plate 100;

[0078] The circulation collector and distributor 52 is arranged on the side of the electronic device away from the hard disk cold plate 100, and is respectively connected to the liquid inlet collector and distributor 50 and the liquid outlet collector and distributor 51, and is connected to the external circulation pipeline.

[0079] By configuring the above-mentioned liquid inlet manifold 50, liquid outlet manifold 51 and circulation manifold 52, the corresponding integrated hard disk cold plate 100 can reduce the number of deployed pipelines in the electronic device, reduce the space occupied by the pipelines in the electronic device, increase the deployment space of the electrical components in the electronic device, and improve the space utilization rate of the electronic device.

[0080] Correspondingly, the present application also provides an electronic device 400, such as Figure 7 As shown, including:

[0081] The node liquid cooling system 300 described above; and

[0082] The hard disk module 200 corresponds to the hard disk heat dissipation area 13 on the hard disk cold plate 100 in the node liquid cooling system 300 .

[0083] Optionally, the electronic device further includes:

[0084] Hard disk backplane 6;

[0085] The cold plate liquid inlet 10 and the cold plate liquid outlet 11 are arranged on the outside of the hard disk backplane 6 .

[0086] Due to the structural setting of the hard disk cold plate 100, the number of connecting pipes between the liquid inlet water collector 50, the liquid outlet water collector 51, the circulation water collector 52 and multiple hard disk cold plates 100 is reduced, and the connection between the pipes and the hard disk cold plate 100 only needs to be set on both sides of the hard disk cold plate 100. The hard disk backplane 6 with a connector can form an integrated structure, thereby improving the convenience of connecting the hard disk module in the electronic device.

[0087] Optionally, the hard disk module 200, such as Figure 3 , 8 As shown, including:

[0088] A hard disk box 70, clamping the hard disk 8 to be cooled;

[0089] Hard disk thermal pad 71;

[0090] The hard disk heat conducting plate 72, the hard disk box 70, the hard disk heat conducting pad 71 and the hard disk heat conducting plate 72 are stacked.

[0091] By stacking the hard disk heat conductive plate 72 and the hard disk box 70, the hard disk thermal conductive pad 71 can be correspondingly fitted with the cold plate thermal conductive pad 2 on the hard disk heat dissipation area 13, thereby improving the heat conduction effect between the hard disk module 200 and the hard disk cold plate 100, and further improving the heat dissipation effect of the hard disk cold plate 100 in the electronic device on the hard disk module 200.

[0092] Optionally, a bevel portion 72A corresponding to the bevel groove 14 on the hard disk cold plate 100 is formed on the lower surface of the hard disk heat conducting plate 72 .

[0093] Since the pressing sheet 3 is fixed in the inclined groove 14, and when the hard disk module 200 is pushed into the hard disk heat dissipation area 13, the pressing sheet 3 abuts against the hard disk heat conductive plate 72. The contact between the pressing sheet 3 and the hard disk heat conductive plate 72, which has a certain rigidity, can improve the heat conduction effect on the one hand, and on the other hand, relative to the fitting of the flexible structure between the hard disk thermal pad 71 and the cold plate thermal pad 2, the fitting between the rigid structures can have a certain sliding effect, thereby avoiding the resistance increased by the fitting of the flexible structure, and further improving the smoothness of the hard disk module in the process of being pushed into the electronic device.

[0094] The setting of the bevel portion 72A enables it to cooperate with the pressing piece 3 in the bevel groove 14, which can further improve the smoothness of the hard disk module being inserted into the electronic device.

[0095] Optionally, the hard disk heat conducting plate 72 is screwed to the hard disk 8 to be cooled, and the hard disk 8 to be cooled and the hard disk heat conducting plate 72 clamp the hard disk heat conducting pad 71 .

[0096] By screwing, the hard disk heat conductive plate 72 can have a stronger fit with the hard disk 8 to be cooled, which on the one hand provides better heat conduction efficiency, and on the other hand provides a stronger clamping force for the hard disk thermal pad 71, further improving the heat dissipation effect of the hard disk module in the electronic device.

[0097] In the embodiment of the present specification, a bevel groove is opened on the hard disk cold plate, and the cold plate thermal pad is pressed into the bevel groove by a pressing sheet. In the process of pushing the hard disk module into the electronic device, the resistance gradually increases with the decrease of the bevel depth, and finally a stable clamping force is obtained. In the process of removing the hard disk module from the electronic device, the resistance gradually decreases with the increase of the bevel depth, and finally the hard disk module can be easily disassembled, so that the electronic device can reliably and smoothly realize the installation and removal of the hard disk module, thereby improving the maintainability of the hard disk module in the electronic device.

[0098] For the device embodiment, since it basically corresponds to the method embodiment, the relevant parts can refer to the partial description of the method embodiment. The device embodiment described above is only schematic, wherein the modules described as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules, that is, they may be located in one place, or they may be distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this specification. A person of ordinary skill in the art can understand and implement it without paying creative labor.

[0099] Those skilled in the art will readily appreciate other embodiments of the specification after considering the specification and practicing the invention claimed herein. The specification is intended to cover any variations, uses or adaptations of the specification that follow the general principles of the specification and include common knowledge or customary techniques in the art that are not claimed in the specification. The specification and examples are to be considered exemplary only, and the true scope and spirit of the specification are indicated by the following claims.

[0100] It should be understood that the present description is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present description is limited only by the appended claims.

[0101] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A hard disk cold plate, characterized in that: include: A plate body, wherein the rear end of the plate body is provided with the cold plate liquid inlet, the cold plate liquid outlet, a liquid cooling channel connecting the cold plate liquid inlet and the cold plate liquid outlet, and at least two hard disk heat dissipation areas, wherein each hard disk heat dissipation area corresponds to a hard disk module; Cold plate thermal pad; A pressing sheet, wherein a hollow area is formed in the middle of the pressing sheet, the plate body and the pressing sheet clamp the cold plate thermal pad, and the cold plate thermal pad is exposed in the hollow area; Wherein, a bevel groove extending from the rear end of the plate body to the front end of the plate body is formed on the plate body, and the depth of the bevel groove located at the rear end of the plate body is smaller than the bevel groove located at the front end of the plate body.

2. The hard disk cold plate according to claim 1, characterized in that: The liquid cooling channel includes a first section connected to the cold plate liquid inlet and extending from the cold plate liquid inlet to the front end of the plate body, and a second section extending back and forth between the left and right sides of the plate body and connected to the cold plate liquid outlet.

3. The hard disk cold plate according to claim 1, characterized in that: A plurality of the cold plate thermal pads and the pressing sheets are provided, and each of the cold plate thermal pads and the pressing sheets corresponds to a hard disk heat dissipation zone.

4. The hard disk cold plate according to claim 1, characterized in that: The bevel groove comprises: Clamping part; A buffer section extending from the rear end of the plate body to the clamping portion; A receiving section extending from the clamping portion to the front end of the plate body; Among them, the depth of the buffer section gradually increases from the clamping portion to the rear end of the plate body, and the depth of the receiving section gradually increases from the clamping portion to the front end of the plate body. The maximum depth of the buffer section is less than the maximum depth of the receiving section, and the depth of the clamping portion is less than the depth of the buffer section and the depth of the receiving section.

5. A node liquid cooling system, characterized in that: Used in electronic equipment, including: At least one hard disk cold plate according to any one of claims 1 to 4; A support frame is arranged on both sides of the hard disk cold plate and between adjacent hard disk heat dissipation areas on the hard disk cold plate; A liquid inlet collector and distributor, arranged on a side of a cold plate liquid inlet of the electronic device close to the hard disk cold plate, and respectively connected to the at least one hard disk cold plate; A liquid outlet collector and distributor is arranged on a side of a cold plate liquid outlet of the electronic device close to the hard disk cold plate, and is respectively connected to the at least one hard disk cold plate; The circulation water collector and water distributor is arranged on a side of the electronic device away from the hard disk cold plate, is connected to the liquid inlet water collector and the liquid outlet water collector and water distributor respectively, and is connected to an external circulation pipeline.

6. An electronic device, characterized in that: include: The node liquid cooling system as described in claim 5 above; as well as, The hard disk module corresponds to the hard disk heat dissipation area on the hard disk cold plate in the node liquid cooling system.

7. The electronic device according to claim 6, characterized in that: Also includes: Hard disk backplane; Wherein, the cold plate liquid inlet and the cold plate liquid outlet are arranged on the outer side of the hard disk backplane.

8. The electronic device according to claim 7, characterized in that: The hard disk module comprises: Hard disk box, clamping the hard disk to be cooled; Hard disk thermal pad; A hard disk heat conducting plate, a hard disk box, the hard disk heat conducting pad and the hard disk heat conducting plate are stacked.

9. The electronic device according to claim 7, characterized in that: The lower surface of the hard disk heat conduction plate is formed with an oblique edge portion corresponding to the oblique surface groove on the hard disk cold plate.

10. The electronic device according to claim 7, characterized in that: The hard disk heat conduction plate is screwed to the hard disk to be cooled, and the hard disk to be cooled and the hard disk heat conduction plate clamp the hard disk heat conduction pad.

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