A manipulator flipping device for semiconductor special equipment

Abstract

The present invention discloses a manipulator flipping device for semiconductor-specific equipment, and relates to the technical field of flipping. The present invention comprises a device body, a material-collecting platform is arranged on the left side of the device body, a processing assembly is arranged on the top of the inner wall of the device body, an electric slide rail is arranged on the bottom of the inner wall of the device body, a cylinder assembly is arranged inside the electric slide rail, an anti-deviation device is arranged above the cylinder assembly, an anti-pollution device is arranged on the periphery of the anti-deviation device, an anti-adhesion device is arranged inside the anti-pollution device, and the anti-deviation device comprises a telescopic gas rod, and the bottom of the fixed end of the telescopic gas rod is fixedly mounted on the top of the cylinder assembly. The present invention can ensure that the vacuum adsorption assembly is always in the center position when receiving the workpiece, so as to promote the vacuum adsorption assembly to always adsorb the semiconductor in the center, avoid the suction force between the workpiece and the vacuum adsorption assembly from being offset to reduce the adsorption strength, and prevent the possibility of the semiconductor falling and being damaged during the flipping process from increasing.

Description

Technical Field

[0001] The present invention relates to the field of flipping technology, and specifically to a manipulator flipping device for semiconductor special equipment. Background Art

[0002] With the continuous improvement of the automation level of semiconductor special equipment, manipulators with various structures and functions are increasingly widely used. Due to the continuous improvement of the requirements of the wafer processing technology, it is often necessary to adsorb, grasp and flip the wafer to meet different processing requirements.

[0003] The patent with the patent announcement number CN201126814Y discloses a manipulator flipping device for semiconductor special equipment. A vacuum adsorption interface is opened on the surface of the flipping output seat, and a sealed chamber communicating with the vacuum adsorption interface is arranged inside the flipping output seat; a rotary joint connected to an adsorption driving air source is fixedly connected to the rear end of the flipping shaft. An air duct is opened along the axis of the flipping shaft. The front end of the air duct communicates with the sealed chamber of the flipping output seat, and the rear end of the air duct communicates with the air duct of the rotary joint; the flipping shaft is a stepped shaft with a gradually decreasing diameter from front to back. A bearing is sleeved on the step at the frontmost end of the flipping shaft, and the flipping shaft is fixed to the shaft seat by a bearing gland and screws. The shaft seat is fixed on the base. A bearing lock nut is sleeved on the step of the flipping shaft behind the bearing, and a flipping gear is fixed on the step of the flipping shaft behind the bearing lock nut. The flipping gear is in transmission connection with the driving gear, and the driving gear is connected to the output shaft of the flipping cylinder, which has the advantages of small volume, light weight, simple structure, long service life and low cost.

[0004] However, this device still has deficiencies: Although this device has good performance when realizing semiconductor flipping, during the adsorption process of the vacuum adsorption component to the semiconductor, the semiconductor is prone to deviate from the central position of the vacuum adsorption component. At this time, the adsorption force of the vacuum adsorption component on the semiconductor is offset, thereby reducing the adsorption strength during the semiconductor flipping process and increasing the possibility of the semiconductor falling and being damaged during the flipping process. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present invention provides a manipulator flipping device for semiconductor special equipment, which solves the problems raised in the above background art.

[0006] To achieve the above purposes, the present invention is realized through the following technical solutions: A manipulator flipping device for semiconductor special equipment, including a device main body. A material taking table is arranged on the left side of the device main body, a processing component is arranged at the top of the inner wall of the device main body, an electric slide rail is arranged at the bottom of the inner wall of the device main body, and a cylinder component is arranged inside the electric slide rail;

[0007] An anti-deviation device is arranged above the cylinder assembly, an anti-pollution device is arranged outside the anti-deviation device, and an anti-adhesion device is arranged inside the anti-pollution device;

[0008] The anti-bias device comprises a telescopic gas rod, the bottom of the fixed end of the telescopic gas rod is fixedly mounted on the top of the cylinder assembly, the telescopic gas rod is connected to the cylinder assembly, a U-shaped plate is fixedly mounted on the top of the telescopic end of the telescopic gas rod, two square grooves are arranged at the bottom of the U-shaped plate, and the two square grooves are symmetrically distributed about the axis of the U-shaped plate, an electric rotating rod is rotatably mounted on the inner wall of the U-shaped plate, a vacuum adsorption assembly is penetrated and fixedly mounted on the outer wall of the electric rotating rod, a flat plate is fixedly mounted on the inner wall of the U-shaped plate, the flat plate is located above the electric rotating rod, a screw rod is penetrated and rotatably mounted inside the flat plate, a limiting plate is fixedly mounted on the outer wall of the processing assembly, a cam is fixedly mounted on the bottom of the screw rod, an L-shaped push plate is slidably mounted on the top of the vacuum adsorption assembly through the limiting groove, and a cylinder is fixedly mounted on the bottom of the inner wall of the L-shaped push plate, a semiconductor workpiece enters from the left side of the device body and is placed inside the processing assembly, and when the processing is completed and the workpiece needs to be transported to the material-retrieving table, the electric slide rail is started, and the electric slide rail drives the cylinder assembly inside itself When the U-shaped plate is reset, the screw rod reverses and releases the limit of the L-shaped push plate on the workpiece.

[0009] According to the above technical solution, the spiral groove on the outer wall of the screw rod is threadedly connected to the inner wall of the limit plate, a spring is arranged between the L-shaped push plate and the vacuum adsorption assembly, and the side of the L-shaped push plate close to the center of the vacuum adsorption assembly is designed as a soft surface, and the outer wall of the cylinder is in contact with the arc surface of the outer wall of the cam.

[0010] According to the above technical solution, the anti-pollution device includes an elastic telescopic rod, a hollow buffer plate, an inclined plate, an elastic strip, and a contact column. The fixed end of the elastic telescopic rod is fixedly installed at the bottom of the inner wall of the device main body. The bottom of the hollow buffer plate is fixedly installed at the top of the telescopic end of the elastic telescopic rod. The bottom of the inclined plate is hinged at the top edge of the hollow buffer plate. A chute is provided inside the inclined plate. Both the upper and lower sides of the elastic strip are fixedly installed at the inner wall of the chute in the inclined plate. The side of the contact column away from the inclined plate is fixedly installed at the outer wall of the U-shaped plate. The bottom of the U-shaped plate contacts the top of the hollow buffer plate. The hollow buffer plate is stably limited by the elastic telescopic rod. At the same time, when the U-shaped plate moves upward, it drives the contact column to move synchronously. During the upward movement of the contact column, it continuously contacts the inner wall of the inclined plate. As the contact column rises, the hinge axis between the inclined plate and the hollow buffer plate starts to rotate, causing the inclined plate to rotate in an arc away from the U-shaped plate. Thus, through the limit of the torsion spring on the inclined plate, the force exerted by the inclined plate on the U-shaped plate gradually increases. At this time, the inclined plate drives the elastic strip to move synchronously. When the elastic strip receives the vibrating force during the operation of the telescopic air rod, it will slightly deform to absorb the force.

[0011] According to the above technical solution, the top of the hollow buffer plate contacts the bottom of the U-shaped plate. A torsion spring is provided between the bottom of the inclined plate and the hollow buffer plate. The outer wall of the contact column contacts the inner wall of the inclined plate.

[0012] According to the above technical solution, the anti-pollution device further includes a U-shaped telescopic column, a baffle, and a scraper. The top of the fixed end of the U-shaped telescopic column is fixedly installed at the bottom of the hollow buffer plate. The top of the baffle is slidably installed at the bottom of the square groove of the U-shaped plate through a limiting groove. The bottom of the baffle is fixedly installed at the top of the telescopic end of the U-shaped telescopic column. The outer wall of the scraper is fixedly installed at the inner wall of the square groove in the U-shaped plate. The bottom of the scraper contacts the top of the baffle. The hollow buffer plate limits the fixed end of the U-shaped telescopic column. When the U-shaped plate moves to the left, the telescopic end of the U-shaped telescopic column limits the baffle. As the U-shaped plate moves to the left, it drives the scraper to scrape the top of the baffle.

[0013] According to the above technical solution, the anti-adhesion device includes an L-shaped pull plate, a collection box, and a blower. The top of the L-shaped pull plate is fixedly installed at the bottom of the hollow buffer plate. The outer wall of the collection box is fixedly installed on the side of the L-shaped pull plate close to the center of the device main body. The outer wall of the blower is fixedly installed at the inner wall of the L-shaped pull plate. The hollow buffer plate limits the L-shaped pull plate. The L-shaped pull plate limits the collection box. The collection box centrally collects the dropped impurities or dirt.

[0014] According to the above technical solution, the anti - adhesion device further includes a wind guide plate, an arc - shaped block, a limit telescopic rod, an angular arc plate, a transmission plate, and a connecting rod slide plate. The bottom of the wind guide plate is hinged to the bottom inner wall of the L - shaped pull plate through a torsion spring. One side of the arc - shaped block close to the outer wall of the hollow buffer plate is fixedly installed at the inner wall of the wind guide plate. The right side of the fixed end of the limit telescopic rod is fixedly installed on the left side of the telescopic end of the U - shaped telescopic column. The right side of the angular arc plate is fixedly installed on the left side of the telescopic end of the limit telescopic rod. The top of the transmission plate is hinged to the inner wall of the wind guide plate. The bottom of the connecting rod slide plate is slidably installed on the bottom inner wall of the collection box. At the same time, the telescopic end of the U - shaped telescopic column drives the limit telescopic rod to move upward, and the telescopic end of the limit telescopic rod drives the angular arc plate to move synchronously. When the angular arc plate moves upward, its outer wall abuts against the inner wall of the wind guide plate, causing the hinge shaft between the wind guide plate and the L - shaped pull plate to start rotating, and the wind guide plate swings towards the direction close to the inner wall of the L - shaped pull plate. At this time, the wind guide plate obliquely guides the wind blown by the fan. At this time, the wind is poured into the inner wall range of the U - shaped plate through the square groove of the U - shaped plate. At the same time, when the U - shaped plate moves to the left, it drives the angular arc plate to move synchronously. The angular arc plate pulls the telescopic end of the limit telescopic rod to extend synchronously. At this time, the arc surface of the angular arc plate contacts the arc surface of the arc - shaped block, and through the guidance of the arc surface of the arc - shaped block, the arc - shaped block pushes the wind guide plate towards the direction close to the inner wall of the L - shaped pull plate. When the angular arc plate passes over a single arc - shaped block, the wind guide plate resets through the torsion spring. Repeating this process enables the wind guide plate to swing reciprocally to swing - guide the wind of the fan; during the reciprocating swing of the wind guide plate, it drives the transmission plate to move synchronously. The bottom of the transmission plate is limited by the top of the connecting rod slide plate, causing its hinge shaft to start rotating, and driving the connecting rod slide plate to slide along the bottom inner wall of the collection box towards the direction close to the center of the device main body and reset. Repeating this process.

[0015] According to the above technical solution, the top of the angular arc plate is fixedly installed on the left side of the bottom of the U - shaped plate. The arc surface of the arc - shaped block is located on the movement trajectory of the angular arc plate. The transmission plate is located below the arc - shaped block. The top of the connecting rod slide plate is hinged to the bottom of the transmission plate.

[0016] The present invention provides a manipulator flipping device for semiconductor - specific equipment. It has the following beneficial effects:

[0017] (1) Through the setting of the anti-deviation device, the present invention reduces the manual participation in the processing of semiconductor devices and simplifies the work process through the cooperation of telescopic air rods, U-shaped plates, electric rotating rods, vacuum adsorption components, flat plates, lead screws, limit plates, cams, L-shaped push plates and cylinders. At the same time, the vacuum adsorption component can freely flip 90 degrees or 180 degrees, which is convenient for workers to pick up materials or observe the processing quality of workpieces. At the same time, it is ensured that the vacuum adsorption component always holds the workpiece in the central position, so that the vacuum adsorption component always adsorbs the semiconductor in the center, avoiding the deviation of the suction force between the workpiece and the vacuum adsorption component and reducing the adsorption strength, preventing the possibility of the semiconductor falling and being damaged during the flipping process. At the same time, the soft surface of the L-shaped push plate and the single clamping and pushing effectively prevent damage to the precision parts of the semiconductor. (2) Through the setting of the anti-pollution device, the present invention eliminates the resonance of the vibration generated by the operation of the equipment when the U-shaped plate horizontally moves through the cooperation of the U-shaped plate, elastic telescopic rods, hollow buffer plates, inclined plates, elastic strips, abutting columns, U-shaped telescopic columns, baffles and scrapers, reducing the interference between the vibration and the vacuum adsorption component and the workpiece. At the same time, the inclined plate gradually increases the stable supporting force as the U-shaped plate rises, and then reduces the vibration intensity when the telescopic air rod expands and contracts through the elastic strip, avoiding damage caused by the collision between the workpiece and the L-shaped push plate due to vibration. And when the bottom of the square groove of the U-shaped plate loses the shielding of the baffle, the semiconductor impurities or dirt accumulated at the bottom of the inner wall of the U-shaped plate will fall off in time, avoiding contamination caused by the vacuum adsorption component carrying the workpiece to flip and contacting and rubbing particulate matter to cause wear. (3) Through the setting of the anti-adhesion device, the present invention makes the guide air plate realize dynamic and static wind direction guiding work through the cooperation of the U-shaped telescopic column, L-shaped pull plate, collection box, fan, guide air plate, arc-shaped block, limit telescopic rod, angular arc plate, transmission plate and connecting rod slide plate. The impurities and dirt attached to the inner wall crevices or corners of the U-shaped plate are blown by the wind at different angles, avoiding the erosion of the chemical properties of the impurities or dirt continuously volatilizing for a long time on the equipment and other components, and realizing the centralized collection of dirt to avoid increasing the work difficulty of maintenance personnel. At the same time, relying on the reciprocating friction of the connecting rod slide plate on the inner wall bottom of the collection box, it effectively prevents the contact and solidification of the impurities or dirt collected in the collection box for a long time, avoiding adverse consequences caused by the mixing of semiconductor impurities of different materials and coatings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of the whole of the present invention;

[0019] Figure 2 is a sectional schematic diagram of the whole of the present invention;

[0020] Figure 3 is a schematic diagram of the anti-deviation device of the present invention;

[0021] Figure 4Schematic cross-sectional view of a partial structure of the anti-offset device of the present invention;

[0022] Figure 5 Schematic diagram of the anti-pollution device of the present invention;

[0023] Figure 6 Schematic diagram of the bottom view of the anti-pollution device of the present invention;

[0024] Figure 7 Schematic diagram of the anti-adhesion device of the present invention;

[0025] Figure 8 Schematic diagram of the structure of the collection box of the present invention.

[0026] In the figure: 1. Device main body; 2. Material taking table; 3. Processing component; 31. Electric slide rail; 32. Cylinder component; 4. Anti-offset device; 41. Telescopic air rod; 42. U-shaped plate; 43. Electric rotating rod; 44. Vacuum adsorption component; 45. Flat plate; 46. Lead screw; 47. Limiting plate; 48. Cam; 49. L-shaped push plate; 410. Cylinder; 5. Anti-pollution device; 51. Elastic telescopic rod; 52. Hollow buffer plate; 53. Inclined plate; 54. Elastic strip; 55. Contact column; 56. U-shaped telescopic column; 57. Baffle plate; 58. Scraper; 6. Anti-adhesion device; 61. L-shaped pull plate; 62. Collection box; 63. Fan; 64. Air guide plate; 65. Arc-shaped block; 66. Limiting telescopic rod; 67. Angular arc plate; 68. Transmission plate; 69. Link slide plate. Detailed implementation manners

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0028] Please refer to Figures 1 - 8 , an embodiment of the present invention is: A manipulator flipping device for semiconductor special equipment, including a device main body 1, a material taking table 2 is arranged on the left side of the device main body 1, a processing component 3 is arranged on the top of the inner wall of the device main body 1, an electric slide rail 31 is arranged on the bottom of the inner wall of the device main body 1, and a cylinder component 32 is arranged inside the electric slide rail 31;

[0029] Above the cylinder component 32, an anti-offset device 4 is arranged, an anti-pollution device 5 is arranged around the anti-offset device 4, and an anti-adhesion device 6 is arranged inside the anti-pollution device 5;

[0030] The anti-bias device 4 includes a telescopic gas rod 41, the bottom of the fixed end of the telescopic gas rod 41 is fixedly installed on the top of the cylinder assembly 32, the telescopic gas rod 41 is connected to the cylinder assembly 32, a U-shaped plate 42 is fixedly installed on the top of the telescopic end of the telescopic gas rod 41, two square grooves are arranged at the bottom of the U-shaped plate 42, and the two square grooves are symmetrically distributed around the axis of the U-shaped plate 42, an electric rotating rod 43 is rotatably installed on the inner wall of the U-shaped plate 42, a vacuum adsorption assembly 44 is penetrated and fixedly installed on the outer wall of the electric rotating rod 43, a flat plate 45 is fixedly installed on the inner wall of the U-shaped plate 42, the flat plate 45 is located above the electric rotating rod 43, a screw rod 46 is penetrated and rotatably installed inside the flat plate 45, a limiting plate 47 is fixedly installed on the outer wall of the processing assembly 3, a cam 48 is fixedly installed on the bottom of the screw rod 46, and a vacuum adsorption assembly 44 is fixedly installed on the top of the vacuum adsorption assembly 44. An L-shaped push plate 49 is slidably installed through a limit groove, and a cylinder 410 is fixedly installed on the bottom of the inner wall of the L-shaped push plate 49. The above cooperation reduces manual participation in the processing of semiconductor devices and simplifies the work process. At the same time, the vacuum adsorption component 44 can be freely flipped ninety degrees or one hundred and eighty degrees, which is convenient for the staff to take materials or observe the processing quality of the workpiece; the above cooperation ensures that the vacuum adsorption component 44 is always in the center position when receiving the workpiece, so that the vacuum adsorption component 44 always adsorbs the semiconductor in the center, avoids the suction force between the workpiece and the vacuum adsorption component 44 from offsetting and reducing the adsorption strength, and prevents the possibility of the semiconductor falling and being damaged during the flipping process. At the same time, the soft surface of the L-shaped push plate 49 and the single clamping push effectively prevent damage to the precision parts of the semiconductor.

[0031] The spiral groove on the outer wall of the screw rod 46 is threadedly connected to the inner wall of the limit plate 47, a spring is arranged between the L-shaped push plate 49 and the vacuum adsorption component 44, and the L-shaped push plate 49 is designed with a soft surface on the side close to the center of the vacuum adsorption component 44, and the outer wall of the cylinder 410 contacts the arc surface of the outer wall of the cam 48.

[0032] When in use, the semiconductor workpiece enters from the left side of the device body 1 and is placed inside the processing component 3. When the processing is completed and the workpiece needs to be transported to the material-retrieving table 2, the electric slide rail 31 is started, and the electric slide rail 31 drives the cylinder assembly 32 to slide to the left inside itself. Before that, the telescopic end of the telescopic gas rod 41 is driven by the cylinder assembly 32 to move upward, and the telescopic end of the telescopic gas rod 41 drives the U-shaped plate 42 to move synchronously, and the U-shaped plate 42 drives the electric rotating rod 43 to move upward, and the electric rotating rod 43 drives the vacuum adsorption assembly 44 to move upward and undertake the adsorption of the workpiece inside the processing assembly 3. When the vacuum adsorption assembly 44 moves to the left edge of the device body 1 through the electric slide rail 31, the electric rotating rod 43 is started, and the electric rotating rod 43 rotates along the inner wall of the U-shaped plate 42, and the electric rotating rod 43 drives the vacuum adsorption assembly 44 to turn over synchronously. Through the above cooperation, manual participation in the semiconductor device processing process is reduced, thereby simplifying the work process. At the same time, the vacuum adsorption assembly 44 is freely turned over by ninety degrees or one hundred and eighty degrees, which is convenient for the staff to take materials or observe the processing quality of the workpiece; When the U-shaped plate 42 moves upward, it drives the flat plate 45 to move synchronously. The flat plate 45 drives the screw rod 46 to slide upward along the inner wall of the limit plate 47. The screw rod 46 generates a rotational force to start rotating by limiting the inner wall of the limit plate 47 through the spiral groove on its outer wall. The screw rod 46 drives the cam 48 to rotate and resist the outer wall of the cylinder 410 to generate a resistance force. At this time, the cylinder 410 pushes the L-shaped push plate 49 to slide along the limit groove on the top of the vacuum adsorption component 44 toward its center through the resistance force. The L-shaped push plate 49 pushes the semiconductor device The workpiece is pushed in the center, and when the U-shaped plate 42 is reset, the screw rod 46 reverses to release the limit of the L-shaped push plate 49 on the workpiece. The above cooperation ensures that the vacuum adsorption component 44 is always in the center position when receiving the workpiece, so that the vacuum adsorption component 44 always adsorbs the semiconductor in the center, avoids the suction force between the workpiece and the vacuum adsorption component 44 to offset and reduce the adsorption strength, and prevents the possibility of the semiconductor falling and being damaged during the flipping process. At the same time, the soft surface of the L-shaped push plate 49 and the single clamping push effectively prevent damage to the precise parts of the semiconductor.

[0033] See also Figures 1 - 8 , based on the above embodiment, another embodiment of the present invention further includes an anti-pollution device 5;

[0034] The anti-pollution device 5 includes an elastic telescopic rod 51, a hollow buffer plate 52, an inclined plate 53, an elastic strip 54, and a contact column 55. The fixed end of the elastic telescopic rod 51 is fixedly installed at the bottom of the inner wall of the device body 1. The bottom of the hollow buffer plate 52 is fixedly installed at the top of the telescopic end of the elastic telescopic rod 51. The bottom of the inclined plate 53 is hinged at the top edge of the hollow buffer plate 52. A chute is formed inside the inclined plate 53. Both the upper and lower sides of the elastic strip 54 are fixedly installed at the inner wall of the chute in the inclined plate 53. The side of the contact column 55 away from the inclined plate 53 is fixedly installed on the outer wall of the U-shaped plate 42. Through the above cooperation, relying on the elastic telescopic rod 51 and the hollow buffer plate 52, the vibration generated by the operation of the equipment during the horizontal translation of the U-shaped plate 42 is eliminated by resonance, reducing the interference between the vibration and the vacuum adsorption assembly 44 and the workpiece. At the same time, the inclined plate 53 gradually increases the force of stable support as the U-shaped plate 42 rises. Then, the vibration intensity during the telescopic movement of the telescopic air rod 41 is reduced by the elastic strip 54, avoiding damage caused by the collision between the workpiece and the L-shaped push plate 49 due to vibration.

[0035] The top of the hollow buffer plate 52 contacts the bottom of the U-shaped plate 42. A torsion spring is provided between the bottom of the inclined plate 53 and the hollow buffer plate 52. The outer wall of the contact column 55 contacts the inner wall of the inclined plate 53.

[0036] The anti-pollution device 5 further includes a U-shaped telescopic column 56, a baffle 57, and a scraper 58. The top of the fixed end of the U-shaped telescopic column 56 is fixedly installed at the bottom of the hollow buffer plate 52. The top of the baffle 57 is slidably installed at the bottom of the square groove of the U-shaped plate 42 through a limit groove. The bottom of the baffle 57 is fixedly installed at the top of the telescopic end of the U-shaped telescopic column 56. The outer wall of the scraper 58 is fixedly installed at the inner wall of the square groove of the U-shaped plate 42. The bottom of the scraper 58 contacts the top of the baffle 57. Through the above cooperation, after the bottom of the square groove of the U-shaped plate 42 loses the shielding of the baffle 57, the semiconductor impurities or dirt accumulated at the bottom of the inner wall of the U-shaped plate 42 can fall off in time, avoiding pollution caused by the vacuum adsorption assembly 44 carrying the workpiece to turn over and contaminating the dirt or wear caused by contacting and rubbing particulate matter.

[0037] When in use, the bottom of the U-shaped plate 42 contacts the top of the hollow buffer plate 52, and the hollow buffer plate 52 is stably limited by the elastic telescopic rod 51. At the same time, when the U-shaped plate 42 moves upward, it drives the resistance column 55 to move synchronously. During the upward movement of the resistance column 55, it keeps in contact with the inner wall of the inclined plate 53. As the resistance column 55 rises, the hinge axis between the inclined plate 53 and the hollow buffer plate 52 begins to rotate, causing the inclined plate 53 to rotate in an arc in the direction away from the U-shaped plate 42. As a result, the inclined plate 53 is limited by the torsion spring to gradually increase the force applied by the inclined plate 53 to the U-shaped plate 42. At this time, the inclined plate 53 drives the elastic strip 54 to move synchronously. When the elastic strip 54 receives the force of the vibration during the operation of the telescopic gas rod 41, it will deform slightly to absorb the force. Through the above cooperation, the elastic telescopic rod 51 and the hollow buffer plate 52 are used to absorb the force generated by the operation of the equipment when the U-shaped plate 42 moves horizontally The vibration is eliminated by resonance, and the interference of vibration on the vacuum adsorption component 44 and the workpiece is reduced. At the same time, the inclined plate 53 gradually increases the stable supporting force as the U-shaped plate 42 rises, and then the elastic strip 54 is used to reduce the vibration intensity of the telescopic gas rod 41 during extension and retraction, so as to avoid the workpiece and the L-shaped push plate 49 from being damaged by collision caused by vibration; the hollow buffer plate 52 limits the fixed end of the U-shaped telescopic column 56, and when the U-shaped plate 42 moves to the left, the telescopic end of the U-shaped telescopic column 56 limits the baffle 57, and as the U-shaped plate 42 moves to the left, it drives the scraper 58 to scrape the top of the baffle 57. Through the above cooperation, the bottom of the square groove of the U-shaped plate 42 loses the shielding of the baffle 57, and the semiconductor impurities or dirt accumulated at the bottom of the inner wall of the U-shaped plate 42 fall off in time, so as to avoid the vacuum adsorption component 44 from being contaminated by dirt when carrying the workpiece to turn over, or causing wear and tear due to contact with friction particles.

[0038] See also Figures 1 - 8 , based on the above embodiment, another embodiment of the present invention further includes an anti-adhesion device 6;

[0039] The anti-adhesion device 6 includes an L-shaped pull plate 61, a collecting box 62 and a fan 63. The top of the L-shaped pull plate 61 is fixedly installed on the bottom of the hollow buffer plate 52, the outer wall of the collecting box 62 is fixedly installed on the side of the L-shaped pull plate 61 close to the center of the device body 1, and the outer wall of the fan 63 is fixedly installed on the inner wall of the L-shaped pull plate 61.

[0040] The anti - adhesion device 6 further includes a wind guide plate 64, an arc - shaped block 65, a limit telescopic rod 66, an angular arc plate 67, a transmission plate 68 and a connecting rod slide plate 69. The bottom of the wind guide plate 64 is hinged to the bottom of the inner wall of the L - shaped pull plate 61 through a torsion spring. One side of the arc - shaped block 65 close to the outer wall of the hollow buffer plate 52 is fixedly installed at the inner wall of the wind guide plate 64. The right side of the fixed end of the limit telescopic rod 66 is fixedly installed on the left side of the telescopic end of the U - shaped telescopic column 56. The right side of the angular arc plate 67 is fixedly installed on the left side of the telescopic end of the limit telescopic rod 66. The top of the transmission plate 68 is hinged to the inner wall of the wind guide plate 64. The bottom of the connecting rod slide plate 69 is slidably installed at the bottom of the inner wall of the collection box 62. Through the above cooperation, the wind guide plate 64 is prompted to achieve dynamic and static wind - guiding work. The wind at different angles blows the impurities and dirt attached to the inner wall gap or corner of the U - shaped plate 42, avoiding the phenomenon that the impurities or dirt adhere for a long time and continuously volatilize their chemical properties to erode the equipment and other components, and realizing the centralized collection of dirt to avoid increasing the work difficulty of maintenance personnel; through the above cooperation, relying on the reciprocating friction of the connecting rod slide plate 69 on the bottom of the inner wall of the collection box 62, it effectively prevents the impurities or dirt collected in the collection box 62 for a long time from coming into contact and solidifying, avoiding the adverse consequences caused by the mixing of semiconductor impurities of different materials and coatings.

[0041] The top of the angular arc plate 67 is fixedly installed on the left side of the bottom of the U - shaped plate 42. The arc surface of the arc - shaped block 65 is located on the movement track of the angular arc plate 67. The transmission plate 68 is located below the arc - shaped block 65. The top of the connecting rod slide plate 69 is hinged to the bottom of the transmission plate 68.

[0042] During use, the hollow buffer plate 52 limits the L-shaped pull plate 61, the L-shaped pull plate 61 limits the collection box 62, and the collection box 62 centrally collects the dropped impurities or dirt. At the same time, the telescopic end of the U-shaped telescopic column 56 drives the limit telescopic rod 66 to move upward, and the telescopic end of the limit telescopic rod 66 drives the angular arc plate 67 to move synchronously. When the angular arc plate 67 moves upward, the outer wall abuts against the inner wall of the air guide plate 64, causing the hinge shaft between the air guide plate 64 and the L-shaped pull plate 61 to start rotating, and the air guide plate 64 swings towards the inner wall of the L-shaped pull plate 61. At this time, the air guide plate 64 obliquely guides the wind blown by the fan 63. At this time, the wind is poured into the inner wall range of the U-shaped plate 42 through the square groove of the U-shaped plate 42. At the same time, when the U-shaped plate 42 moves to the left, it drives the angular arc plate 67 to move synchronously. The angular arc plate 67 pulls the telescopic end of the limit telescopic rod 66 to extend synchronously. At this time, the arc surface of the angular arc plate 67 contacts the arc surface of the arc-shaped block 65, and the arc surface of the arc-shaped block 65 guides the arc-shaped block 65 to push the air guide plate 64 towards the inner wall of the L-shaped pull plate 61. When the angular arc plate 67 passes over a single arc-shaped block 65, the air guide plate 64 is reset by the torsion spring. Repeating this process enables the air guide plate 64 to swing reciprocally to guide the wind of the fan 63. Through the above cooperation, the air guide plate 64 realizes the dynamic and static wind guiding work. The wind blows the impurities and dirt attached to the inner wall gap or corner of the U-shaped plate 42 at different angles, avoiding the phenomenon that the impurities or dirt adhere for a long time and continuously volatilize their chemical properties to erode the equipment and other components, and realizing the centralized collection of dirt to avoid increasing the work difficulty of maintenance personnel; during the reciprocating swing of the air guide plate 64, it drives the transmission plate 68 to move synchronously. The bottom of the transmission plate 68 is limited by the top of the connecting rod slide plate 69, causing its hinge shaft to start rotating, and driving the connecting rod slide plate 69 to slide and reset along the bottom inner wall of the collection box 62 towards the center of the device main body 1. Repeating this process, through the above cooperation, relying on the reciprocating friction of the connecting rod slide plate 69 on the bottom inner wall of the collection box 62, effectively preventing the impurities or dirt collected in the collection box 62 for a long time from coming into contact and solidifying, and avoiding the adverse consequences caused by the mixing of semiconductor impurities and coatings of different materials.

[0043] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A robot flipping device for semiconductor-specific equipment, comprising a device body (1), characterized in that: A material taking platform (2) is arranged on the left side of the device body (1), a processing assembly (3) is arranged on the top of the inner wall of the device body (1), an electric slide rail (31) is arranged on the bottom of the inner wall of the device body (1), and a cylinder assembly (32) is arranged inside the electric slide rail (31); An anti-deviation device (4) is arranged above the cylinder assembly (32), an anti-pollution device (5) is arranged outside the anti-deviation device (4), and an anti-adhesion device (6) is arranged inside the anti-pollution device (5); The anti-deflection device (4) comprises a telescopic gas rod (41), the bottom of the fixed end of the telescopic gas rod (41) is fixedly mounted on the top of the cylinder assembly (32), the telescopic gas rod (41) is connected to the cylinder assembly (32), a U-shaped plate (42) is fixedly mounted on the top of the telescopic end of the telescopic gas rod (41), the bottom of the U-shaped plate (42) is provided with two square grooves, and the two square grooves are symmetrically distributed about the axis of the U-shaped plate (42), an electric rotating rod (43) is rotatably mounted on the inner wall of the U-shaped plate (42), and a vacuum adsorption assembly (44) is penetrated and fixedly mounted on the outer wall of the electric rotating rod (43), and the vacuum adsorption assembly (44) is fixedly mounted thereon. The component (44) moves upward and receives and adsorbs the workpiece inside the processing component (3); a flat plate (45) is fixedly mounted on the inner wall of the U-shaped plate (42); the flat plate (45) is located above the electric rotating rod (43); a screw rod (46) is penetrated and rotatably mounted inside the flat plate (45); a limit plate (47) is fixedly mounted on the outer wall of the processing component (3); a cam (48) is fixedly mounted on the bottom of the screw rod (46); an L-shaped push plate (49) is slidably mounted on the top of the vacuum adsorption component (44) through a limit groove; a cylinder (410) is fixedly mounted on the bottom of the inner wall of the L-shaped push plate (49); The spiral groove on the outer wall of the screw rod (46) is threadedly connected to the inner wall of the limit plate (47); a spring is provided between the L-shaped push plate (49) and the vacuum adsorption assembly (44); and the outer wall of the cylinder (410) is in contact with the arc surface of the outer wall of the cam (48).

2. A manipulator flipping device for semiconductor-specific equipment according to claim 1, characterized in that: The L-shaped push plate (49) has a soft surface design on one side close to the center of the vacuum adsorption component (44).

3. A manipulator flipping device for semiconductor-specific equipment according to claim 2, characterized in that: The anti-pollution device (5) comprises an elastic telescopic rod (51), a hollow buffer plate (52), an inclined plate (53), an elastic strip (54) and a contact column (55), wherein the fixed end of the elastic telescopic rod (51) is fixedly mounted on the bottom of the inner wall of the device body (1), the bottom of the hollow buffer plate (52) is fixedly mounted on the top of the telescopic end of the elastic telescopic rod (51), the bottom of the inclined plate (53) is hinged at the top edge of the hollow buffer plate (52), a sliding groove is provided inside the inclined plate (53), the upper and lower sides of the elastic strip (54) are fixedly mounted on the inner wall of the sliding groove in the inclined plate (53), and the contact column (55) is fixedly mounted on the outer wall of the U-shaped plate (42) on the side away from the inclined plate (53).

4. A manipulator flipping device for semiconductor-specific equipment according to claim 3, characterized in that: The top of the hollow buffer plate (52) contacts the bottom of the U-shaped plate (42), a torsion spring is provided between the bottom of the inclined plate (53) and the hollow buffer plate (52), and the outer wall of the abutment column (55) contacts the inner wall of the inclined plate (53).

5. A manipulator flipping device for semiconductor-specific equipment according to claim 4, characterized in that: The anti-pollution device (5) further comprises a U-shaped telescopic column (56), a baffle (57) and a scraper (58); the top of the fixed end of the U-shaped telescopic column (56) is fixedly mounted on the bottom of the hollow buffer plate (52); the top of the baffle (57) is slidably mounted on the bottom of the square groove of the U-shaped plate (42) through a limit groove; the bottom of the baffle (57) is fixedly mounted on the top of the telescopic end of the U-shaped telescopic column (56); the outer wall of the scraper (58) is fixedly mounted on the inner wall of the square groove in the U-shaped plate (42); and the bottom of the scraper (58) contacts the top of the baffle (57).

6. A manipulator flipping device for semiconductor-specific equipment according to claim 5, characterized in that: The anti-adhesion device (6) comprises an L-shaped pull plate (61), a collection box (62) and a fan (63); the top of the L-shaped pull plate (61) is fixedly mounted on the bottom of the hollow buffer plate (52); the outer wall of the collection box (62) is fixedly mounted on a side of the L-shaped pull plate (61) close to the center of the device body (1); and the outer wall of the fan (63) is fixedly mounted on the inner wall of the L-shaped pull plate (61).

7. A manipulator flipping device for semiconductor-specific equipment according to claim 6, characterized in that: The anti-adhesion device (6) further comprises an air guide plate (64), an arc block (65), a limiting telescopic rod (66), an angular arc plate (67), a transmission plate (68) and a connecting rod slide plate (69); the bottom of the air guide plate (64) is hinged to the bottom of the inner wall of the L-shaped pull plate (61) via a torsion spring; the arc block (65) is fixedly mounted on the inner wall of the air guide plate (64) near the outer wall of the hollow buffer plate (52); the right side of the fixed end of the limiting telescopic rod (66) is fixedly mounted on the left side of the telescopic end of the U-shaped telescopic column (56); the right side of the angular arc plate (67) is fixedly mounted on the left side of the telescopic end of the limiting telescopic rod (66); the top of the transmission plate (68) is hinged to the inner wall of the air guide plate (64); and the bottom of the connecting rod slide plate (69) is slidably mounted on the bottom of the inner wall of the collection box (62).

8. The robot flipping device for semiconductor-specific equipment according to claim 7, characterized in that: The top of the angled arc plate (67) is fixedly mounted on the left side of the bottom of the U-shaped plate (42); the arc surface of the arc block (65) is located on the movement track of the angled arc plate (67); the transmission plate (68) is located below the arc block (65); and the top of the connecting rod slide plate (69) is hinged to the bottom of the transmission plate (68).

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