Battery thermal management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling and working method

Abstract

The invention discloses a battery heat management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling and a working method. The battery heat management system comprises a battery module, a first liquid cooling plate, a plurality of heat treatment units and a circulating pump. The first liquid cooling plate is in direct contact with the surface of the battery module. Each heat treatment unit comprises a phase change material, a unit liquid cooling plate, a semiconductor refrigeration element and a hot end radiator, the phase change material and the semiconductor refrigeration element are arranged on the two sides of the liquid cooling plate respectively, and the unit liquid cooling plates of different heat treatment units are connected through a pipeline to form a second liquid cooling plate. The first liquid cooling plate and the second liquid cooling plate are communicated with a circulating pump through a liquid cooling pipeline, and heat exchange fluid is arranged in the liquid cooling pipeline. The thermal management system provided by the invention can ensure that the battery module is always in a safe working temperature range through the synergistic effect of the liquid cooling plate, the phase change material and the semiconductor refrigeration element, and the heat dissipation / heating effect is efficient and controllable. Meanwhile, the system is simple and compact in structure, high in flexibility and good in overall performance.

Description

Technical Field

[0001] The present invention relates to the technical field of battery thermal management, and in particular to a battery thermal management system and a working method integrating semiconductor refrigeration, phase change energy storage and liquid cooling. Background Art

[0002] The suitable operating temperature range of lithium-ion batteries is only 20-40°C. In practical applications, they face problems such as thermal runaway at high temperatures and limited charging and discharging performance at low temperatures. Therefore, it is necessary to develop an efficient thermal management system to improve the rate performance, safety and environmental adaptability of batteries under different operating conditions.

[0003] At present, most of the mainstream battery thermal management technologies are air cooling and liquid cooling. This type of active thermal management system has a good cooling effect, but it has a complex structure, occupies a large space, has a high manufacturing cost, and consumes a lot of energy in operation. Some passive cooling methods, such as cooling with phase change materials, although the system structure is simple and the cost is low, cannot control the cooling effect and can only be applied to scenarios where the heat source produces low heat. The patent "A liquid-cooled phase-change hybrid battery thermal management system and its implementation method" with application number CN202410570460.1 places multiple battery cells in a hexagonal ribbed shell filled with phase change material, and liquid cooling plates are arranged above and below the battery cells. The heat dissipation effect of the battery cells is improved through the combined action of liquid cooling and phase change materials. However, its structure is relatively complex, difficult to apply to battery cells of different specifications, and cannot meet the scenario where the battery cells have heating requirements. In addition, passive cooling methods usually use the environment as a heat sink. Under high temperature conditions in summer, a single passive cooling technology may face the problem of heat dissipation failure.

[0004] Semiconductor refrigeration is an active thermal management technology. It is a device that uses the thermoelectric effect of semiconductors to produce cold. By placing the cold end on the object to be cooled and connecting the hot end to a heat dissipation device, such as a heat sink or fan, the heat can be effectively transferred from the cold end to the hot end, thereby achieving the purpose of cooling. Semiconductor refrigeration has a simple structure, low noise, long service life and can accurately control the temperature. It is suitable for occasions with small cooling consumption and small space. The patent "A battery thermal management system integrating phase change and thermoelectric refrigeration" with application number CN202310012823.5 couples phase change materials, semiconductor components and liquid cooling to complete the thermal management of power battery packs, but the cooling module needs to be equipped with a circulating pump and a constant temperature box. In actual applications, the structure is bloated, the system energy consumption is large and the cost is relatively high. In addition, the patent fills the phase change material in the hollow part inside the battery pack support module. The heat transfer between the phase change material and the semiconductor component is limited, which makes it difficult to meet the thermal management requirements under high-rate and complex working conditions.

[0005] Therefore, there is an urgent need for a battery thermal management system with a simple and compact structure, high flexibility, low energy consumption and good overall performance. Summary of the invention

[0006] In view of the above problems in the prior art, the present invention proposes a battery thermal management system and working method integrating semiconductor refrigeration, phase change energy storage and liquid cooling, which overcomes the shortcomings of phase change materials and semiconductor refrigeration sheets that have poor cooling effect and are uncontrollable when used alone, and cleverly combines the advantages of the two. This battery thermal management system has a simple and compact structure, high flexibility, low energy consumption, and good overall performance.

[0007] In order to achieve the above object, the present invention has the following technical solutions:

[0008] The first object of the present invention is to provide an integrated semiconductor refrigeration, phase change energy storage and liquid-cooled battery thermal management system, including a battery module, a first liquid cooling plate, a heat treatment module, and a circulating pump. The heat treatment module can be a single heat treatment unit or multiple heat treatment units connected in series or in parallel through liquid cooling pipes. Each heat treatment unit includes a phase change material, a unit liquid cooling plate, a semiconductor refrigeration element, and a hot end radiator.

[0009] As a preferred solution, the surface of the first liquid cooling plate is in direct contact with the surface of the battery module.

[0010] As a preferred solution, in a single heat treatment unit, the phase change material is attached to the first surface of the unit liquid cooling plate through a flexible thermal conductive material, the cold end surface of the semiconductor refrigeration element is attached to the second surface of the unit liquid cooling plate through a flexible thermal conductive material, and the hot end surface of the semiconductor refrigeration element is connected to the hot end radiator through a flexible thermal conductive material.

[0011] As a preferred solution, the unit liquid cooling plates of different heat treatment units are connected through liquid cooling pipes to form an integral structure, which is called the second liquid cooling plate. When the heat treatment module is a single heat treatment unit, the unit liquid cooling plate of the heat treatment unit is the second liquid cooling plate.

[0012] As a preferred solution, the first liquid cooling plate is connected to the second liquid cooling plate through a liquid cooling pipe and a circulating pump. The first liquid cooling plate and the second liquid cooling plate are both provided with a working fluid flow inlet and a working fluid flow outlet. The working fluid flow outlet of the first liquid cooling plate is connected to the working fluid flow inlet of the second liquid cooling plate through a liquid cooling pipe. The working fluid flow inlet of the first liquid cooling plate and the working fluid flow outlet of the second liquid cooling plate are connected to the circulating pump through the liquid cooling pipe. The circulating pump can adjust the working fluid flow rate. The cooling working fluid flows into the working fluid flow inlet of the first liquid cooling plate, flows to the second liquid cooling plate through the liquid cooling pipe, and finally flows out from the working fluid flow outlet of the second liquid cooling plate.

[0013] As a preferred solution, the first liquid cooling plate, the second liquid cooling plate, and the liquid cooling pipe are made of any one of copper, stainless steel, aluminum, and aluminum alloy.

[0014] As a preferred solution, the semiconductor refrigeration is any one of a unipolar semiconductor refrigeration plate, a bipolar semiconductor refrigeration plate or a multipolar semiconductor refrigeration plate.

[0015] As a preferred solution, the flexible thermally conductive material is any one of thermally conductive silicone grease, thermally conductive pad, thermally conductive rubber and metal film.

[0016] As a preferred solution, the phase change material is a pure phase change material or a composite phase change material formed by a pure phase change material and a high thermal conductivity material, wherein the pure phase change material is any one or more of paraffin, long-chain alkane, hydrated salt and other materials with a melting point in the temperature range of -5 to 25°C, and the thermal conductivity strengthening material is any one or more of graphite, graphene, carbon nanotubes, foam copper and foam aluminum. To avoid leakage, a high thermal conductivity thin metal shell can be used for packaging, and the amount of phase change material used is determined according to the specific cooling requirements and space requirements.

[0017] As a preferred solution, the cooling medium (circulating medium) in the liquid cooling channel is any one of liquid water, ethylene glycol, gallium-based alloy liquid metal, and nano phase change emulsion.

[0018] As a preferred solution, the heat dissipation mode of the hot end radiator is any one of air cooling and liquid cooling.

[0019] As a preferred solution, the phase change material is packaged in a metal shell or a plastic shell, and the outer wall of the shell is attached to the surface of the unit liquid cooling plate through a flexible heat conductive material.

[0020] As a preferred solution, the surface of the liquid cooling pipe is coated with a thermal insulation material.

[0021] As a preferred solution, the surface of the shell is coated with a heat-insulating material.

[0022] The second object of the present invention is to provide a method for implementing a battery thermal management system (working method) that integrates semiconductor refrigeration, phase change energy storage and liquid cooling, comprising:

[0023] When the battery module needs to dissipate heat, a forward current is passed through the semiconductor refrigeration element for cooling, and the heat generated by the battery module is transferred to the phase change material and / or the semiconductor refrigeration element through the flowing circulating working fluid. After the battery stops working, the circulating pump is turned off, and the cold generated by the semiconductor refrigeration element is transferred to the phase change material through the unit liquid cooling plate, so that it stores cold energy and restores its cooling capacity; when the battery module needs to be heated, a reverse current is passed through the semiconductor refrigeration element for heating, and the heat stored in the phase change material and / or the heat generated by the semiconductor refrigeration element is transferred to the flowing circulating working fluid through the unit liquid cooling plate, and the circulating working fluid heats the battery module through the first liquid cooling plate. After the battery stops working, the circulating pump is turned off, and the heat generated by the semiconductor refrigeration element is transferred to the phase change material through the unit liquid cooling plate, so that the phase change material stores heat and restores its heating capacity

[0024] As a preferred solution, when the battery module has a large cooling or heating demand, the number of heat treatment units, the type and quality of phase change materials, the number of semiconductor refrigeration elements used and the working mode can all be adjusted according to the battery thermal management requirements to ensure that the battery module is always within a safe operating temperature range.

[0025] Compared with the prior art, the beneficial effects of the present invention are embodied in the following aspects:

[0026] 1) The battery thermal management system of the present invention rationally couples semiconductor refrigeration and phase change materials together. The overall structure is simple and compact, and the installation is convenient. The heat treatment unit adopts a modular series or parallel design, so that multiple heat treatment units can be flexibly combined, and the heat dissipation or heating capacity of the system can be adjusted according to needs, which is convenient for system expansion and maintenance.

[0027] 2) The battery thermal management system of the present invention can increase the number of heat treatment units when the battery module has a large cooling or heating demand, and ensure that the battery module is always within a safe operating temperature range through the latent heat of more phase change materials and the cooling / heating of more semiconductor refrigeration elements. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 FIG. 4 is an overall schematic diagram of a battery thermal management system according to an embodiment of the present invention.

[0029] Figure 2 This is a schematic diagram of the structure of a second liquid cooling plate formed by connecting unit liquid cooling plates of five heat treatment units in series or in parallel in an embodiment of the present invention, wherein (A) is connected in series and (B) is connected in parallel.

[0030] Figure 3 Schematic diagram of the structure of a single heat treatment unit in an embodiment of the present invention.

[0031] Figure 4 It is a left view of a single heat treatment unit in an embodiment of the present invention.

[0032] Figure 5 It is a top view of a single heat treatment unit in an embodiment of the present invention.

[0033] Figure 6 Schematic diagram of a battery thermal management system in an embodiment of the present invention.

[0034] The numbers in the figure show:

[0035] 1. Battery module, 2. First liquid cooling plate, 3. Circulation pump, 4. Heat treatment module, 5. Phase change material, 6. Second liquid cooling plate, 7. Semiconductor refrigeration element, 8. Hot end radiator, 9. First liquid cooling plate working fluid flow outlet, 10. Second liquid cooling plate working fluid flow inlet, 11. First liquid cooling plate working fluid flow inlet, 12. Second liquid cooling plate working fluid flow outlet;

[0036] 410. Metal casing, 420. Microchannel aluminum flat tube, 430. Collector, 440. Semiconductor cooling sheet, 810. Base plate, 820. Heat dissipation fin, 830. Fan. DETAILED DESCRIPTION

[0037] The present invention is further described in detail below in conjunction with specific embodiments, but is by no means intended to limit the present invention. Features such as preparation methods, materials, structures or composition ratios not explicitly described in this technical solution are considered to be common technical features disclosed in the prior art.

[0038] The present invention discloses a battery thermal management system and a working method integrating semiconductor refrigeration, phase change energy storage and liquid cooling, comprising a battery module, a first liquid cooling plate, a plurality of heat treatment units and a circulation pump. The first liquid cooling plate is in direct contact with the surface of the battery module. Each heat treatment unit comprises a phase change material, a unit liquid cooling plate, a semiconductor refrigeration element and a hot end radiator, the phase change material and the semiconductor refrigeration element are respectively arranged on both sides of the liquid cooling plate, and the unit liquid cooling plates of different heat treatment units are connected by pipes to form an integral structure, which is called a second liquid cooling plate. The first liquid cooling plate and the second liquid cooling plate are connected to the circulation pump through a liquid cooling pipe, and a heat exchange fluid is contained in the liquid cooling pipe. Specifically, the heat generated by the battery during the charging and discharging process flows from the heat exchange fluid to the second liquid cooling plate through the first liquid cooling plate and is transferred to the phase change material and the semiconductor refrigeration element for heat dissipation; when the battery module needs to be heated, a reverse current is passed into the semiconductor refrigeration element for heating; if there is a further need for heat dissipation or heating, the heat dissipation / heating capacity can be further enhanced by increasing the number of heat treatment units. The thermal management system provided by the present invention can ensure that the battery module is always within a safe operating temperature range through the synergistic effect of the liquid cooling plate, phase change material and semiconductor refrigeration element, and the heat dissipation / heating effect is efficient and controllable. At the same time, the system structure is simple and compact, with great flexibility and good overall performance.

[0039] The present invention provides a battery thermal management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling, the battery thermal management system comprises a battery module 1, a first liquid cooling plate 2, a circulation pump 3, and a heat treatment module 4; the surface of the first liquid cooling plate 2 is in direct contact with the surface of the battery module 1; the heat treatment module 4 is a single heat treatment unit or is composed of a plurality of heat treatment units connected in series or in parallel; each heat treatment unit comprises a phase change material 5, a unit liquid cooling plate, a semiconductor refrigeration element 7, and a hot end radiator 8; the phase change material 5 and the semiconductor refrigeration element 7 are respectively attached to the two surfaces of the unit liquid cooling plate, specifically two opposite surfaces, through flexible heat conductive materials; the semiconductor refrigeration element 7 is connected to the hot end radiator 8 through a flexible heat conductive material; the unit liquid cooling plates of different heat treatment units are connected through a liquid cooling pipe to form an integral structure, which is called a second liquid cooling plate 6; the first liquid cooling plate 2 and the second liquid cooling plate 6 are connected to the circulation pump 3 through a liquid cooling pipe, and the first liquid cooling plate 2 and the second liquid cooling plate 6 are both provided with a working fluid flow inlet and a working fluid flow outlet.

[0040] Furthermore, the first liquid cooling plate 2 is provided with a first liquid cooling plate working medium flow outlet 9 and a first liquid cooling plate working medium flow outlet 11; the second liquid cooling plate 6 is provided with a second liquid cooling plate working medium flow outlet 10 and a second liquid cooling plate working medium flow outlet 12; the first liquid cooling plate working medium flow outlet 9 and the second liquid cooling plate working medium flow outlet 10 are connected through a liquid cooling pipe, and the first liquid cooling plate working medium flow outlet 11 and the second liquid cooling plate working medium flow outlet 12 are connected to the circulating pump 3 through a liquid cooling pipe; the cooling medium flows from the first liquid cooling plate working medium flow inlet 11 into the first liquid cooling plate 2, flows to the second liquid cooling plate working medium flow inlet 10 of the second liquid cooling plate 6 through the liquid cooling pipe, and finally flows out from the second liquid cooling plate working medium flow outlet 12.

[0041] Furthermore, the phase change material 5 is a pure phase change material or a composite phase change material formed by a pure phase change material and a high thermal conductivity material; the pure phase change material is one or more of paraffin, long-chain alkanes, and hydrated salts, and the thermal conductivity enhancing material is one or more of graphite, graphene, carbon nanotubes, foam copper, and foam aluminum.

[0042] Furthermore, the phase change material 5 is packaged in a metal shell or a plastic shell, and the outer wall of the shell is attached to the surface of the unit liquid cooling plate through a flexible heat conductive material; the surface of the shell is coated with a heat insulating material.

[0043] Furthermore, the semiconductor refrigeration element 7 is any one of a unipolar semiconductor refrigeration plate, a bipolar semiconductor refrigeration plate or a multipolar semiconductor refrigeration plate; the cold end surface of the semiconductor refrigeration element 7 is attached to the surface of the unit liquid cooling plate through a flexible thermal conductive material, and the hot end surface is connected to the hot end radiator 8 through a flexible thermal conductive material.

[0044] Furthermore, the hot end radiator is cooled by air or liquid.

[0045] Furthermore, the flexible thermally conductive material is any one of thermally conductive silicone grease, thermally conductive pad, thermally conductive rubber and metal film.

[0046] Furthermore, the unit liquid cooling plate, the first liquid cooling plate 2, and the liquid cooling pipe are all made of aluminum, copper, stainless steel, etc.; and the surface of the liquid cooling pipe is coated with a heat-insulating material.

[0047] The present invention provides a working method of a battery thermal management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling, comprising the following steps:

[0048] When the battery module 1 needs to dissipate heat, a forward current is passed through the semiconductor refrigeration element 7 for cooling, and the heat generated by the battery module 1 is transferred to the phase change material 5 and / or the semiconductor refrigeration element 7 through the flowing circulating working fluid. After the battery stops working, the circulating pump 3 is turned off, and the cold generated by the semiconductor refrigeration element 7 is transferred to the phase change material 5 through the unit liquid cooling plate, so that it stores cold energy and restores its cooling capacity; when the battery module 1 needs to be heated, a reverse current is passed through the semiconductor refrigeration element 7 for heating, and the heat stored in the phase change material 5 and / or the heat generated by the semiconductor refrigeration element 7 is transferred to the flowing circulating working fluid through the unit liquid cooling plate, and the circulating working fluid heats the battery module 1 through the first liquid cooling plate 2. After the battery stops working, the circulating pump 3 is turned off, and the heat generated by the semiconductor refrigeration element 7 is transferred to the phase change material 5 through the unit liquid cooling plate, so that the phase change material 5 stores heat and restores its heating capacity.

[0049] Furthermore, the number of heat treatment units, the type and quality of the phase change material 5, the number of semiconductor cooling elements 7 used, and the working mode can all be adjusted according to the battery thermal management requirements to ensure that the battery module 1 is always within a safe operating temperature range. For example, when the battery module 1 has a large cooling or heating requirement, the number of heat treatment units can be increased to ensure that the battery module 1 is always within a safe operating temperature range through the latent heat of more phase change materials 5 and the cooling and heating of more semiconductor cooling elements 7.

[0050] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements; "up", "down", "left", "right" and the like are only used to indicate relative positional relationships, and when the absolute position of the described object changes, the relative positional relationship may change. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] It should be noted that, in the present invention, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0052] Example

[0053] like Figures 1 to 6 As shown, a battery thermal management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling includes a battery module 1, a first liquid cooling plate 2, a circulation pump 3, and 5 repeated heat treatment units 4.

[0054] like Figure 1 As shown, the first liquid cooling plate 2 is made of aluminum material, arranged at the lower end of the battery module 1, close to the surface of the battery module 1, and can quickly exchange heat with it. Five repeated heat treatment units 4 are arranged in parallel at the right end of the battery module 1.

[0055] like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 As shown, each heat treatment unit includes a phase change material 5, a metal shell 410, a micro-channel aluminum flat tube 420, a manifold 430, a semiconductor refrigeration element 7, and a hot end radiator 8. The semiconductor refrigeration element 7 is a semiconductor refrigeration sheet 440. The hot end radiator 8 uses air cooling to dissipate heat. The hot end radiator 8 includes a substrate 810, a heat dissipation fin 820, and a fan 830. In this embodiment, a metal shell 410 is used, and the phase change material 5 is encapsulated in the metal shell 410. The metal shell 410 is attached to the first surface of the micro-channel aluminum flat tube 420 through a flexible thermal conductive material. The micro-channel aluminum flat tube 420 and the manifold 430 are welded together to form a unit liquid cooling plate of a single heat treatment unit. The five liquid cooling plates of the heat treatment units are connected by liquid cooling pipes, as shown in FIG. Figure 2As shown, an integral cooling circuit is formed, which is called the second liquid cooling plate 6, through which the cooling medium flows between multiple heat treatment units. The connection form of the heat treatment unit liquid cooling plate can be in series or in parallel. When the system structure needs to be simple, the heat exchange demand is not high, and the circulation pump flow is limited, the unit liquid cooling plate is suitable for series connection. When the system heat exchange demand is high and the circulation pump has sufficient flow capacity, the unit liquid cooling plate is suitable for parallel connection. In addition, the cold end face of the semiconductor cooling plate 440 is attached to the second surface of the microchannel flat tube 420 through a flexible heat conductive material, and the hot end face is connected to the substrate 810 of the hot end radiator 8 through a flexible heat conductive material. The substrate 810 is connected with heat dissipation fins 820 and a fan 830 to ensure that heat is effectively dissipated from the hot end of the semiconductor cooling plate 440.

[0056] In this embodiment, the flexible thermally conductive material can be any one of thermally conductive silicone grease, thermally conductive pads, thermally conductive rubber and metal film. The phase change material 5 is a pure phase change material or a composite phase change material formed by a pure phase change material and a high thermal conductivity material, wherein the pure phase change material is any one or more of paraffin, long-chain alkane, hydrated salt, etc., and the thermally conductive strengthening material is any one or more of graphite, graphene, carbon nanotubes, foam copper and foam aluminum.

[0057] like Figure 1 As shown, the first liquid cooling plate 2 is provided with a first liquid cooling plate working medium flow inlet 11, and the second liquid cooling plate 5 is provided with a second liquid cooling plate working medium flow outlet 12. The working medium flows in from the first liquid cooling plate working medium flow inlet 11 of the first liquid cooling plate 2, flows to the second liquid cooling plate 6 at the right end of the battery module through the liquid cooling channel, flows into the second liquid cooling plate working medium flow inlet 10, and finally flows out from the second liquid cooling plate working medium flow outlet 12 of the second liquid cooling plate 6. The first liquid cooling plate working medium flow inlet 11 and the second liquid cooling plate working medium flow outlet 12 are both connected to the circulating pump 3 through a liquid cooling pipe, and the circulating pump 3 can adjust the flow rate of the cooling working medium.

[0058] In order to further improve the heat dissipation efficiency of this embodiment, the cooling medium (circulating medium) in the first liquid cooling plate 2 and the second liquid cooling plate 6 is one of liquid water, ethylene glycol, gallium-based alloy liquid metal, and nano phase change emulsion.

[0059] In order to further improve the reliability of this embodiment, the surface of the metal shell 410 and the outer side of the semiconductor cooling plate 440 are coated with thermal insulation materials, specifically thermal insulation cotton or polyurethane foam board.

[0060] On the basis of the above technical solution, this embodiment further proposes a method for implementing a battery thermal management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling, including:

[0061] When the battery needs to be cooled during high-rate charge and discharge, the heat generated by the battery module 1 is transferred to the first liquid cooling plate 2 through heat conduction, and the first liquid cooling plate 2 transfers the received heat to the second liquid cooling plate 6 through the cooling medium. A forward current is passed to the semiconductor cooling plate 440, and the semiconductor cooling plate 440 cools the second liquid cooling plate 6. Part of the heat of the second liquid cooling plate 6 is transferred to the semiconductor cooling plate 440 through the flowing circulating medium, and the other part is transferred to the phase change material 5 through the flowing circulating medium;

[0062] When the battery stops working, the circulation pump 3 is turned off, and the cold energy generated by the cold end of the semiconductor cooling plate 440 is only transferred to the phase change material 5 through the second liquid cooling plate 6, so that the phase change material 5 stores cold energy and restores the cooling capacity;

[0063] When the battery needs to be heated, a reverse current is passed through the semiconductor refrigeration sheet 440 for heating. The heat stored in the phase change material 5 and the heat generated by the semiconductor refrigeration sheet 440 are transferred to the first liquid cooling plate 2 through the second liquid cooling plate 6, and further transferred to the flowing circulating working fluid. The circulating working fluid is heated by the first liquid cooling plate 2 and transferred to the battery module 1. After the battery stops working, the circulation pump 3 is turned off, and the heat generated by the semiconductor refrigeration sheet 440 is transferred to the phase change material 5 through the second liquid cooling plate 6, so that the phase change material 5 stores heat and restores the heating capacity.

[0064] The number of heat treatment units, the type and quality of the phase change material 5, the number of semiconductor cooling elements 7 used, and the working mode can all be adjusted according to the battery thermal management requirements to ensure that the battery module 1 is always within a safe operating temperature range. For example, when the battery module 1 has a large cooling or heating requirement, the number of heat treatment units is increased, and more latent heat of the phase change material 5 and more cooling / heating of the semiconductor cooling elements 7 are used to ensure that the battery module 1 is always within a safe operating temperature range.

[0065] In addition, the heat dissipation performance of the battery thermal management system provided by the present invention can be further improved by optimizing the selection and arrangement of the first liquid cooling plate 2, the second liquid cooling plate 6, the power supply control of the semiconductor cooling plate 440, the selection of the phase change material 5 and the size and dosage.

[0066] In summary, the battery thermal management system provided by the present invention has a simple structure, is easy to install, and has great flexibility. The heat dissipation and heating capabilities of the system can be adjusted according to demand, which facilitates the expansion and maintenance of the system.

[0067] Although the methods disclosed in the embodiments of the present application are as above, the contents described are only implementation methods adopted for ease of understanding. Any ordinary technician in the field should understand that any modifications and changes can be made in the form and details of implementation without departing from the spirit and scope disclosed by the present invention. However, the scope of patent protection of the present invention shall still be based on the scope defined by the attached claims.

Claims

1. A battery thermal management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling, characterized in that: The battery thermal management system comprises a battery module (1), a first liquid cooling plate (2), a circulation pump (3), and a heat treatment module (4); The surface of the first liquid cooling plate (2) is in direct contact with the surface of the battery module (1); The heat treatment module (4) is a single heat treatment unit or is composed of a plurality of heat treatment units connected in series or in parallel; Each heat treatment unit comprises a phase change material (5), a unit liquid cooling plate, a semiconductor cooling element (7), and a hot end radiator (8); The phase change material (5) and the semiconductor refrigeration element (7) are respectively attached to two surfaces of the unit liquid cooling plate through a flexible heat conductive material; The semiconductor refrigeration element (7) is connected to the hot end heat sink (8) via a flexible heat conductive material; The unit liquid cooling plates of different heat treatment units are connected through liquid cooling pipes to form an integral structure, which is called the second liquid cooling plate (6); The first liquid cooling plate (2) and the second liquid cooling plate (6) are connected to a circulation pump (3) via a liquid cooling pipeline, and both the first liquid cooling plate (2) and the second liquid cooling plate (6) are provided with a working fluid flow inlet and a working fluid flow outlet.

2. The battery thermal management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling according to claim 1 is characterized in that: The first liquid cooling plate (2) is provided with a first liquid cooling plate working medium flow outlet (9) and a first liquid cooling plate working medium flow inlet (11); The second liquid cooling plate (6) is provided with a second liquid cooling plate working medium flow inlet (10) and a second liquid cooling plate working medium flow outlet (12); The first liquid cooling plate working medium flow outlet (9) and the second liquid cooling plate working medium flow inlet (10) are connected via a liquid cooling pipeline, and the first liquid cooling plate working medium flow inlet (11) and the second liquid cooling plate working medium flow outlet (12) are connected to a circulation pump (3) via a liquid cooling pipeline; The cooling medium flows into the first liquid cooling plate (2) from the first liquid cooling plate working medium flow inlet (11), flows to the second liquid cooling plate working medium flow inlet (10) of the second liquid cooling plate (6) through the liquid cooling pipeline, and finally flows out from the second liquid cooling plate working medium flow outlet (12).

3. The battery thermal management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling according to claim 1 is characterized in that: The phase change material (5) is a pure phase change material or a composite phase change material formed by a composite of a pure phase change material and a high thermal conductivity material; The pure phase change material is one or more of paraffin, long-chain alkane, and hydrated salt, and the thermal conductivity enhancing material is one or more of graphite, graphene, carbon nanotubes, foam copper, and foam aluminum.

4. The battery thermal management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling according to claim 1 or 3, characterized in that: The phase change material (5) is packaged in a metal shell or a plastic shell, and the outer wall of the shell is attached to the surface of the unit liquid cooling plate through a flexible heat conductive material; The shell has a surface that is in contact with the unit liquid cooling plate and other surfaces are covered with heat preservation materials.

5. The battery thermal management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling according to claim 1 is characterized in that: The semiconductor refrigeration element (7) is any one of a unipolar semiconductor refrigeration plate, a bipolar semiconductor refrigeration plate or a multipolar semiconductor refrigeration plate; The cold end surface of the semiconductor refrigeration element (7) is attached to the surface of the unit liquid cooling plate through a flexible heat-conducting material, and the hot end surface is connected to the hot end radiator (8) through a flexible heat-conducting material.

6. The battery thermal management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling according to claim 1 or 5, characterized in that: The hot end radiator is cooled by air or liquid.

7. The battery thermal management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling according to claim 1, 3 or 5, characterized in that: The flexible heat-conducting material is any one of heat-conducting silicone grease, heat-conducting pad, heat-conducting rubber and metal film.

8. The battery thermal management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling according to claim 1 is characterized in that: The unit liquid cooling plate, the first liquid cooling plate (2), and the liquid cooling pipe are all made of one of aluminum, copper, and stainless steel; The surface of the liquid cooling pipe is coated with a heat-insulating material.

9. A working method of a battery thermal management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling as claimed in any one of claims 1 to 8, characterized in that: The working method comprises the following steps: When the battery module (1) needs to dissipate heat, a forward current is passed through the semiconductor refrigeration element (7) for cooling, and the heat generated by the battery module (1) is transferred to the phase change material (5) and / or the semiconductor refrigeration element (7) through the flowing circulating medium. After the battery stops working, the circulating pump (3) is turned off, and the cold energy generated by the semiconductor refrigeration element (7) is transferred to the phase change material (5) through the unit liquid cooling plate, so that the phase change material (5) stores cold energy and restores its cooling capacity. When the battery module (1) needs to be heated, a reverse current is passed through the semiconductor refrigeration element (7) for heating, and the heat stored in the phase change material (5) and / or the heat generated by the semiconductor refrigeration element (7) is transferred to the flowing circulating medium through the unit liquid cooling plate. The circulating medium heats the battery module (1) through the first liquid cooling plate (2). After the battery stops working, the circulating pump (3) is turned off, and the heat generated by the semiconductor refrigeration element (7) is transferred to the phase change material (5) through the unit liquid cooling plate, so that the phase change material (5) stores heat and restores its heating capacity.

10. The working method of the battery thermal management system integrating semiconductor refrigeration, phase change energy storage and liquid cooling according to claim 1, characterized in that: The number of heat treatment units, the type and quality of the phase change material (5), the number of semiconductor cooling elements (7) used and the working mode can all be adjusted according to the battery thermal management requirements to ensure that the battery module (1) is always within a safe operating temperature range.

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