Cooling device of battery pack and manufacturing method

Abstract

The invention discloses a cooling device of a battery pack and a manufacturing method, and belongs to the field of battery packs. Firstly, mechanical force is applied to the liquid cooling pipe to enable the liquid cooling pipe to have a certain shape, the surface of the liquid cooling pipe is coated with a heat conduction bonding layer, then a light composite material is pressed and formed and cut into a plurality of base body structures, then the idea of'splicing forming 'is adopted, after the base body structures and the liquid cooling pipe are connected, a uniform temperature layer, an upper base plate and a lower base plate are laid, glue injection or mechanical fastening is conducted, and the liquid cooling pipe is formed. And the thermal interface material is combined with the battery pack for installation and application. The cooling device prepared by the method has the characteristics of light weight and efficient heat dissipation.

Description

Technical Field

[0001] The invention belongs to the field of battery packs and relates to a cooling device and a manufacturing method of a battery pack. Background Art

[0002] In the cooling system of modern electronic equipment, liquid cooling technology has become an important cooling solution due to its superior thermal management performance. Liquid cooling plates are widely used in battery pack cooling.

[0003] Traditional battery pack liquid cooling plates are mostly made of metal materials, such as aluminum alloy and copper alloy, which are machined or welded. Although these metal materials have high thermal conductivity and can provide good heat dissipation performance, they are heavy and the manufacturing process is usually complicated, especially when it comes to welding and processing, which often requires high process difficulty and cost.

[0004] With the development of electric vehicles, the thermal management system is expected to be efficient and lightweight. As an emerging battery pack cooling solution, lightweight liquid cooling plates can meet its lightweight needs. By adopting advanced materials and processes, lightweight liquid cooling plates can not only provide excellent thermal management performance, but also significantly reduce the weight of the overall equipment and improve the operating efficiency and reliability of the equipment. With the continuous development of technology, lightweight liquid cooling plates will play an increasingly important role in future high-performance cooling systems.

[0005] The present invention uses a lightweight heat-conductive composite material to make the base structure, and the resulting liquid cooling plate has a lower density than the traditional metal liquid cooling plate of the battery pack. In addition, the present invention also lays a temperature-equalizing layer, so that heat is transferred to the inside of the liquid cooling plate more evenly, and the heat dissipation efficiency is higher. The present invention provides a method for manufacturing a lightweight, ultra-thin liquid cooling plate for a battery pack with a large heat dissipation area. The method provided by the present invention also has the characteristics of simple process, low cost, energy saving, and safety. Summary of the invention

[0006] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art, adopt a thermally conductive composite material to make a base structure and lay a temperature equalizing layer to achieve a better temperature equalizing effect, thereby realizing the production of a lightweight, ultra-thin liquid cooling plate for a battery pack that can dissipate heat over a large area.

[0007] The present invention provides a cooling device and a manufacturing method for a battery pack, and the detailed manufacturing steps are as follows: 1. A method for manufacturing a cooling device for a battery pack, characterized in that the main components include: an upper substrate, a temperature-averaging layer, a heat-conducting structure layer, a base structure, a liquid cooling tube, a heat-conducting adhesive layer, a lower substrate, and a fastening structure. The manufacturing steps include: S01, liquid cooling tube forming: applying mechanical force to the liquid cooling tube to deform it, thereby obtaining the liquid cooling tube; S02, preparing a composite material: preparing a thermally conductive composite material from a thermally conductive material and a resin material through a composite process; S03, pressing and molding: placing the thermally conductive composite material prepared in step S02 in a mold and pressing it to obtain a base profile; S04, preparation of base structure: cutting the base profile obtained in S03 into a plurality of base structures according to the design; S05, splicing and molding: coating a thermal conductive adhesive layer on the surface of the liquid cooling tube, and connecting the base structure prepared in S04 with the liquid cooling tube; S06, laying the temperature-averaging layer: laying a single-sided composite heat-conducting structure layer of the temperature-averaging layer with a transverse thermal conductivity greater than 200 W / (m·K) and a thickness less than 2 mm, the temperature-averaging layer containing one or more of metal, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, carbon fiber, and ceramic fiber, on the upper and lower surfaces of the structure obtained in S05, with one side of the heat-conducting structure layer facing the structure obtained in S05 during laying; S07, laying the upper and lower substrates: compounding the heat-conducting structure layer on one side of the upper substrate and the lower substrate, and then laying them on the upper surface and the lower surface of the structure obtained in S06 respectively, with one side of the heat-conducting structure layer facing the structure obtained in S06; S08, pressing: placing the structure obtained in S07 in a press, performing hot pressing, and obtaining a liquid-cooled plate blank; S09, punching and fixing: punching holes on the liquid cooling plate blank obtained in S08, and forming a fastening structure by glue injection or mechanical fastening; S10, shape processing: cutting and processing the liquid cooling plate blank to obtain a cooling device for a battery pack; S11, battery pack installation: the structure obtained in S10 is combined with the battery pack through the thermal interface material and installed and applied.

[0008] Further, it is characterized in that the shape of the liquid cooling tube after mechanical deformation in step S01 is one or more of S-shape, W-shape, fishbone shape, straight shape, H-shape, and polygonal shape, the outer contour shape of the liquid cooling tube is one or more of rectangular, elliptical, circular, and polygonal shape, the wall thickness of the liquid cooling tube is 0.01-6 mm, and the maximum outer diameter range of the liquid cooling tube is 0.1-100 mm. The liquid cooling tube in step S01 contains one or more of metals, oxides, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, glass fiber, carbon fiber, quartz fiber, and ceramic fiber, and the thermal conductivity perpendicular to the tube wall is greater than 0.5 W / (m·K).

[0009] Further, it is characterized in that the thermal conductive material in the S02 step contains one or more of graphite, graphene, carbon nanotubes, graphite nanosheets, carbon fibers, metals, and ceramics, and the content of the thermal conductive material in the prepared composite material is 30wt.% to 95wt.%, and the resin material in the S02 step is one or more of epoxy resin, polyurethane, acrylic resin, polyamide resin, phenolic resin, polyvinyl chloride, polyethylene, polypropylene, polystyrene, polyoxymethylene, polyphenylene ether, polyester resin, polyphenylene sulfide, polyetheretherketone, acrylonitrile-butadiene-styrene copolymer, polymethyl methacrylate, polylactic acid, polybutylene succinate, ethylene-vinyl acetate copolymer, polycarbonate, silicone resin, fluorosilicone resin, polyimide, and bismaleimide, and the composite process is one or more of mixing, surface coating, and lamination.

[0010] Furthermore, it is characterized in that the pressure range in the S03 step is 0.1-10 MPa, the temperature range is 50-220°C, the thickness range of the base profile obtained in the S03 step is 0.5-8 mm, the transverse thermal conductivity of the profile is greater than 30 W / (m·K), and the longitudinal thermal conductivity is greater than 3 W / (m·K).

[0011] Furthermore, it is characterized in that the cutting method in step S04 is one or more of laser cutting, wire saw cutting, plasma cutting, water jet cutting, and mechanical cutting.

[0012] Furthermore, it is characterized in that the thermal conductivity of the thermally conductive adhesive layer in step S05 is 0.5 to 50 W / (m·K); the thermally conductive adhesive layer contains a resin matrix and a thermally conductive filler, the resin matrix includes one or more of epoxy resin, polyurethane, acrylic resin, silicone resin, fluorosilicone resin, bismaleimide, and phenolic resin, and the thermally conductive filler includes one or more of silica, aluminum oxide, magnesium oxide, zinc oxide, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, and metal particles, and the particle size range of the thermally conductive filler is 0.01 to 200 μm.

[0013] Further, it is characterized in that the thermal conductivity of the heat-conducting structural layer in steps S06 and S07 is 0.5 to 100 W / (m·K), and the heat-conducting structural layer contains a resin matrix and a heat-conducting filler. The resin matrix includes epoxy resin, polyurethane, acrylic resin, polyamide resin, phenolic resin, polyvinyl chloride, polyethylene, polypropylene, polystyrene, polyoxymethylene, polyphenylene ether, polyester resin, polyphenylene sulfide, polyetheretherketone, acrylonitrile-butadiene-styrene copolymer, polymethyl methacrylate, polylactic acid, polybutylene succinate, ethylene-vinyl acetate copolymer, polycarbonate, silicone resin, fluorosilicone resin, polyimide, and one or more of bismaleimide. The heat-conducting filler includes one or more of silicon dioxide, aluminum oxide, magnesium oxide, zinc oxide, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, and metal particles. The particle size range of the heat-conducting filler is 0.01 to 200 μm.

[0014] Further, it is characterized in that the thermal conductivity of the upper substrate and the lower substrate in the S07 step is 1 to 1500 W / (m·K), and the upper substrate and the lower substrate in the S07 step contain one or more of metal, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, glass fiber, carbon fiber, quartz fiber, and ceramic fiber, and the thickness ranges from 0.01 mm to 12 mm.

[0015] Furthermore, it is characterized in that, in the step S08, the hot pressing temperature is 10 to 300° C., the pressure is 0.1 to 10 MPa, and the time is 1 to 48 hours.

[0016] A cooling device for a battery pack, characterized in that the cooling device is prepared by any of the above methods and has a density of less than 2.5 g / cm 3 The thickness ranges from 1 to 100 mm, and has the function of liquid cooling and heat dissipation for the battery pack. Table 1 is a comparison table of the present invention and the commonly used liquid cooling plate for battery packs. Compared with the prior art, the advantages of the present invention are: (1) The cooling device prepared by this method uses a thermally conductive composite material to make a base structure, which has a low density and a good weight reduction effect; (2) The cooling device prepared by this method has a uniform temperature layer inside, which has a better uniform temperature effect; (3) In addition to being able to manufacture the above-mentioned cooling device, the method provided by the present invention also has the characteristics of simple process and low cost.

[0017] Table 1 Comparison of the present invention and conventional battery pack liquid cooling plates BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Attached Figure 1It is the overall manufacturing flow chart of the present invention.

[0019] Attached Figure 2 It is an exploded view of the structure of the present invention (excluding the thermal conductive adhesive layer).

[0020] Attached Figure 3 It is a schematic diagram of the planar structure of the present invention in an application scenario, and the lower right corner is a local enlarged view.

[0021] Attached Figure 4 It is a schematic diagram of the three-dimensional structure of the present invention in an application scenario.

[0022] Attached Figure 5 This is a partial structural dimension diagram of the embodiment (unit: mm). DETAILED DESCRIPTION

[0023] In the following description, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0024] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0026] The disclosure below provides many different embodiments or examples for implementing the present invention. In order to simplify the disclosure of the present invention, specific examples are described below. Of course, they are merely examples, and the purpose is not to limit the present invention. In addition, the present invention may repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides various specific examples of processes and materials, but those of ordinary skill in the art may appreciate the application of other processes and / or the use of other materials.

[0027] Example

[0028] The embodiment specifically describes the application of a cooling device and a manufacturing method for a battery pack in battery heat dissipation.

[0029] See attached Figure 2 With attached Figure 3 The cooling device of the battery pack to be manufactured mainly includes the following parts: an upper substrate 101, a temperature-averaging layer 102, a heat-conducting structure layer 103, a base structure 104, a liquid cooling tube 105, a heat-conducting adhesive layer 106, a lower substrate 107, and a fastening structure 108. Figure 3 With attached Figure 4 In the application scenario, there are also thermal interface materials 109 and battery packs 110; S01, liquid cooling tube forming: the liquid cooling tube 105 is shaped by mechanical force, bent into an S shape, with a circular outer contour, a tube wall thickness of 0.25 mm, and an outer diameter of 1.5 mm. The liquid cooling tube is made of aluminum alloy, and its thermal conductivity perpendicular to the tube wall is 170 W / (m·K).

[0030] S02, preparing a composite material: coating the surface of the punched graphite film with epoxy resin, wherein the content of the graphite film is 90wt.%, and the content of the resin matrix is ​​9.9wt.%, to obtain a thermally conductive composite material.

[0031] S03, pressing and molding: placing the thermally conductive composite material prepared in step S02 in a mold, maintaining the pressure at 150°C and 0.3MPa for 10 hours, and obtaining a base profile with a thickness of 1.5mm. The transverse thermal conductivity of the prepared base profile is 720W / (m·K), and the longitudinal thermal conductivity is 3.5W / (m·K).

[0032] S04, preparation of base structure: according to the shape of the S-shaped liquid cooling tube 105, the base profile prepared in step S03 is cut into a matching shape using a wire saw. The thickness is 1.5 mm and the edge is serrated. For specific dimensions, see the attached Figure 5 (Unit: mm).

[0033] S05, splicing and molding: evenly coating the surface of the liquid cooling tube 105 with a thermally conductive adhesive layer 106. The thermally conductive adhesive layer 106 is composed of a silicone resin matrix and a diamond filler, the D50 of the diamond filler is 5.2 μm, and the thermal conductivity of the thermally conductive adhesive layer is 13 W / (m·K). The cut base structure 104 is attached to the liquid cooling tube 105 and fixed.

[0034] S06, laying of the temperature-averaging layer: the temperature-averaging layer 102 is a pyrolytic graphite film with a lateral thermal conductivity of 1200 W / (m·K) and a thickness of 0.1 mm. Two sheets of the temperature-averaging layer 102 are respectively composited with a heat-conducting structural layer 103 on one side, and then laid on the upper and lower surfaces of the structure obtained in S05 respectively; S07, laying of the upper and lower substrates: The upper substrate 101 and the lower substrate 107 are both high-purity oxygen-free copper, with a thickness of 0.25 mm and a thermal conductivity of 390 W / (m·K). The upper substrate 101 and the lower substrate 107 are both single-sidedly composited with a thermally conductive structural layer 103, which is composed of an epoxy resin matrix and diamond filler. The D50 of the diamond filler is 12.8 μm, and the thermal conductivity of the thermally conductive structural layer 103 is 15 W / (m·K). The composited upper and lower substrates are laid respectively on the upper and lower surfaces of the structure obtained in step S06; S08, pressing: placing the structure obtained in step S07 in a press, pressing at 160° C. and 0.5 MPa, with a holding time of 8 hours, to obtain a liquid-cooled plate blank with a thickness of 2.2 mm; S09, Punching and fixing: Use CNC equipment to punch holes at the designated position of the liquid cooling plate blank, with a hole diameter of 1.5mm. Use polyurethane resin for potting, and the punching position is shown in the attached Figure 5 (Unit: mm); S10, shape processing: The liquid-cooled plate blank is trimmed using precision cutting equipment to obtain a density of 2.1 g / cm 3 , a cooling device with a thickness of 2.2 mm; S11, battery pack installation: The structure obtained in S10 is assembled and applied with the battery pack 110 through the thermal interface material 109, such as Figure 4 The thermal interface material used is thermal conductive adhesive with a thermal conductivity of 3W / (m·K). A battery pack is installed on the other side of the thermal conductive adhesive. The battery pack used is a lithium-ion battery.

[0035] The heat generated when the battery pack is charging and discharging is transferred to the liquid cooling plate through the thermal interface material. The upper and lower substrates and the temperature-averaging layer in the liquid cooling plate have high thermal conductivity, which can evenly distribute the heat in the plane direction and reduce the temperature difference at various positions of the battery pack. The heat is then transferred to the liquid cooling tube and then carried away by the medium in the liquid cooling tube. The matrix is ​​composed of a thermally conductive composite material with high thermal conductivity, which can also play a role in heat conduction. The system formed in this way has low thermal resistance, high heat transfer efficiency, and very obvious advantages of lightweight and thinness.

[0036] Although the present invention has been described with reference to typical embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present invention can be embodied in a variety of forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims, so all changes and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A method for manufacturing a cooling device for a battery pack, characterized in that: The main components include: upper substrate, temperature balancing layer, heat conductive structure layer, base structure, liquid cooling tube, heat conductive adhesive layer, lower substrate, fastening structure, and the manufacturing steps include: S01, liquid cooling tube forming: applying mechanical force to the liquid cooling tube to deform it, thereby obtaining the liquid cooling tube; S02, preparing a composite material: preparing a thermally conductive composite material from a thermally conductive material and a resin material through a composite process; S03, pressing and molding: placing the thermally conductive composite material prepared in step S02 in a mold and pressing it to obtain a base profile; S04, preparation of base structure: cutting the base profile obtained in S03 into a plurality of base structures according to the design; S05, splicing and molding: coating a thermal conductive adhesive layer on the surface of the liquid cooling tube, and connecting the base structure prepared in S04 with the liquid cooling tube; S06, laying the temperature-averaging layer: laying a single-sided composite heat-conducting structure layer of the temperature-averaging layer with a transverse thermal conductivity greater than 200 W / (m·K) and a thickness less than 2 mm, the temperature-averaging layer containing one or more of metal, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, carbon fiber, and ceramic fiber, on the upper and lower surfaces of the structure obtained in S05, with one side of the heat-conducting structure layer facing the structure obtained in S05 during laying; S07, laying the upper and lower substrates: compounding the heat-conducting structure layer on one side of the upper substrate and the lower substrate, and then laying them on the upper surface and the lower surface of the structure obtained in S06 respectively, with one side of the heat-conducting structure layer facing the structure obtained in S06; S08, pressing: placing the structure obtained in S07 in a press, performing hot pressing, and obtaining a liquid-cooled plate blank; S09, punching and fixing: punching holes on the liquid cooling plate blank obtained in S08, and forming a fastening structure by glue injection or mechanical fastening; S10, shape processing: cutting and processing the liquid cooling plate blank to obtain a cooling device for a battery pack; S11, battery pack installation: the structure obtained in S10 is combined with the battery pack through the thermal interface material and installed and applied.

2. The manufacturing method according to claim 1, characterized in that: The shape of the liquid cooling tube after mechanical deformation in step S01 is one or more of S-shape, W-shape, fishbone shape, straight shape, H-shape, and polygonal shape; the outer contour of the liquid cooling tube is one or more of rectangular, elliptical, circular, and polygonal shape; the wall thickness of the liquid cooling tube is 0.01 to 6 mm; the maximum outer diameter range of the liquid cooling tube is 0.1 to 100 mm; the liquid cooling tube in step S01 contains one or more of metals, oxides, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, glass fiber, carbon fiber, quartz fiber, and ceramic fiber; and the thermal conductivity perpendicular to the tube wall is greater than 0.5 W / (m·K).

3. The manufacturing method according to claim 1, characterized in that: The thermal conductive material in step S02 contains one or more of graphite, graphene, carbon nanotubes, graphite nanosheets, carbon fibers, metals, and ceramics. The content of the thermal conductive material in the prepared composite material is 30wt.% to 95wt.%. The resin material in step S02 is one or more of epoxy resin, polyurethane, acrylic resin, polyamide resin, phenolic resin, polyvinyl chloride, polyethylene, polypropylene, polystyrene, polyoxymethylene, polyphenylene ether, polyester resin, polyphenylene sulfide, polyetheretherketone, acrylonitrile-butadiene-styrene copolymer, polymethyl methacrylate, polylactic acid, polybutylene succinate, ethylene-vinyl acetate copolymer, polycarbonate, silicone resin, fluorosilicone resin, polyimide, and bismaleimide. The composite process is one or more of mixing, surface coating, and lamination.

4. The manufacturing method according to claim 1, characterized in that: The pressure range in the S03 step is 0.1 to 10 MPa, the temperature range is 50 to 220° C., the thickness range of the base profile obtained in the S03 step is 0.5 to 8 mm, the transverse thermal conductivity of the profile is greater than 30 W / (m·K), and the longitudinal thermal conductivity is greater than 3 W / (m·K).

5. The manufacturing method according to claim 1, characterized in that: The cutting method in step S04 is one or more of laser cutting, wire saw cutting, plasma cutting, water jet cutting, and mechanical cutting.

6. The manufacturing method according to claim 1, characterized in that: The thermal conductivity of the thermally conductive adhesive layer in step S05 is 0.5 to 50 W / (m·K); the thermally conductive adhesive layer contains a resin matrix and a thermally conductive filler, the resin matrix includes one or more of epoxy resin, polyurethane, acrylic resin, silicone resin, fluorosilicone resin, bismaleimide, and phenolic resin, and the thermally conductive filler includes one or more of silicon dioxide, aluminum oxide, magnesium oxide, zinc oxide, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, and metal particles, and the particle size range of the thermally conductive filler is 0.01 to 200 μm.

7. The manufacturing method according to claim 1, characterized in that: The thermal conductivity of the heat-conducting structural layer in steps S06 and S07 is 0.5 to 100 W / (m·K). The heat-conducting structural layer contains a resin matrix and a heat-conducting filler. The resin matrix includes one or more of epoxy resin, polyurethane, acrylic resin, polyamide resin, phenolic resin, polyvinyl chloride, polyethylene, polypropylene, polystyrene, polyoxymethylene, polyphenylene ether, polyester resin, polyphenylene sulfide, polyetheretherketone, acrylonitrile-butadiene-styrene copolymer, polymethyl methacrylate, polylactic acid, polybutylene succinate, ethylene-vinyl acetate copolymer, polycarbonate, silicone resin, fluorosilicone resin, polyimide, and bismaleimide. The heat-conducting filler includes one or more of silicon dioxide, aluminum oxide, magnesium oxide, zinc oxide, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, and metal particles. The particle size of the heat-conducting filler ranges from 0.01 to 200 μm.

8. The manufacturing method according to claim 1, characterized in that: The thermal conductivity of the upper substrate and the lower substrate in step S07 is 1 to 1500 W / (m·K). In step S07, the upper substrate and the lower substrate contain one or more of metal, silicon, boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond, carbon nanotubes, graphene, graphite nanosheets, graphite, glass fiber, carbon fiber, quartz fiber, and ceramic fiber, and the thickness ranges from 0.01 mm to 12 mm.

9. The manufacturing method according to claim 1, characterized in that: In the step S08, the hot pressing temperature is 10 to 300° C., the pressure is 0.1 to 10 MPa, and the time is 1 to 48 hours.

10. A cooling device for a battery pack, characterized in that: The cooling device is prepared by the method according to any one of claims 1 to 9, and its density is less than 2.5 g / cm 3 The thickness ranges from 1 to 100 mm and has the function of liquid cooling for the battery pack.

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